Method for manufacturing a circuit board
By removing the portion of the wiring layer opposite the sampling hole during the circuit board manufacturing process, the problem of delamination in sliced circuit boards is prevented from being penetrated by the chemical solution, thus achieving high-quality manufacturing and accurate testing of the circuit boards.
CN116017858BActive Publication Date: 2026-07-03ZHUHAI FOUNDER TECH HI DENSITY ELECTRONICS
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHUHAI FOUNDER TECH HI DENSITY ELECTRONICS
- Filing Date
- 2022-11-10
- Publication Date
- 2026-07-03
Smart Images
Figure CN116017858B_ABST
Abstract
This application provides a method for manufacturing a circuit board, relating to the field of circuit board manufacturing technology. The method includes: providing a sample board; slicing the sample board to form sampling holes; laminating a wiring layer onto the sliced sample board; and removing the portion of the wiring layer opposite to the sampling holes. This method, by removing the portion of the wiring layer opposite to the sampling holes after laminating the wiring layer onto the sliced sample board, avoids the formation of a cavity structure in the sliced circuit board, prevents the sampling holes from harboring chemicals used in wet processing, and effectively prevents these chemicals from seeping into the internal layer structure of the circuit board, thus helping to prevent circuit board delamination.
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