Method for shaping reserved raw glue area based on low thermal conductivity epoxy resin module
By installing a low thermal protection module in the reserved raw rubber area of the rubber product mold and combining external air circulation and cooling, the incomplete vulcanization problem caused by excessive heat transfer in the reserved raw rubber area is solved, the scrap rate is reduced and the operation process is simplified, and the needs of diversified small batch customized products are adapted to the needs of diversified small batch customized products.
Patent Information
- Application Number
- CN202211621561.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-16
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2042-12-16
AI Technical Summary
In the rubber product production process, the heat transfer in the reserved raw rubber area leads to incomplete vulcanization and increases the waste rate. The existing cooling methods are costly or inefficient, making it difficult to adapt to diversified small batch customized products.
Low thermal conductivity module is adopted to prepare low thermal conductivity protection modules through 3D printing, casting or extrusion. The set is located in the reserved rubber zone of the mold, combined with external air circulation and cooling, avoiding rapid heat transfer, and achieving secondary shaping.
It effectively reduces the heat transfer rate in the reserved raw rubber area, avoids incomplete vulcanization, reduces the scrap rate, simplifies the operation process, and adapts to the needs of diversified small-batch customized products.
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Figure CN116021685B_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of rubber processing, and particularly relates to a shaping method for a reserved raw rubber area based on a low thermal conductivity module. Background Art
[0002] With the development of the times, the rapid development of aircraft and new energy vehicles, the degree of integration of rubber products has become higher and higher, and the performance has made breakthrough developments. However, as the volume of rubber products increases, the processing difficulty also increases. For example, rubber products with outer shapes are one of the more common and difficult to process products.
[0003] Rubber products with external shapes require secondary shaping during the production process. The mold portion reserved for the raw rubber area is placed outside the vulcanizer. This portion of the mold is initially unpressurized. After the initial vulcanization is completed, secondary molding and vulcanization are performed. Traditional molds generally use metal iron or aluminum as the main mold material. The thermal conductivity of metal iron is 80W / mK, and the thermal conductivity of metal aluminum is 237W / mK. Metal iron or metal aluminum molds have fast thermal conductivity and high vulcanization production efficiency. However, the heat from the machine will quickly transfer to the mold in the reserved raw rubber area, resulting in incomplete vulcanization of the raw rubber in the reserved raw rubber area. The semi-raw rubber will completely lose its shaping ability and cannot be peeled off, resulting in an increased scrap rate for the product.
[0004] In the existing technology, the cooling of the reserved raw rubber area is generally achieved by connecting a circulating water circuit to the outside of the mold in the reserved raw rubber area for water cooling or relying on external air circulation for air cooling; water cooling has a good effect, but requires large-scale modification of the original mold to add a circulating water circuit, and the cost of modifying the mold is high. It is not very applicable to customized products with diversified and small batches; air cooling is easy to use, and simple air cooling can use a fan to continuously cool the mold in the reserved raw rubber area, but this requires precise control of the machine temperature, making the worker's operation process too complicated. At the same time, the cooling efficiency of air cooling is not high, the cooling effect is unstable, and it is easily affected by the ambient temperature. Summary of the Invention
[0005] The present invention provides a method for shaping a reserved raw rubber area based on a low thermal conductivity module, which solves the problem that in the production process of rubber products with contours, the raw rubber is incompletely vulcanized and the scrap rate of the product is increased due to the rapid heat transfer at the mold position of the reserved raw rubber area.
[0006] In order to achieve the above object, the technical solution of the present invention is as follows:
[0007] The method for shaping the reserved raw rubber area based on the low thermal conductivity module includes the following steps:
[0008] Preparation of low thermal conductivity protection module;
[0009] Covering the mold core with rubber and fabric;
[0010] The low thermal conductivity protection module is arranged on the rubber and fabric outer cover at the raw rubber area reserved for the mold core;
[0011] Putting the mold core covered with the rubber material and fabric and provided with the low thermal conductivity protection module into the mold cavity, and closing the mold;
[0012] The reserved raw rubber area of the mold is placed outside the machine;
[0013] The non-reserved raw rubber area of the mold is hot-pressed and vulcanized;
[0014] After hot pressing and vulcanization is completed, the rubber semi-finished product is demoulded and the low thermal conductivity protection module is removed. The protection position of the low thermal conductivity protection module is the raw rubber area of the rubber semi-finished product;
[0015] The raw rubber area of the rubber semi-finished product is subjected to secondary molding vulcanization or butt vulcanization.
[0016] Furthermore, the mold placed outside the machine is cooled by external air circulation.
[0017] Furthermore, the low thermal conductivity protection module includes a cylindrical shell, a square cylindrical shell, and a special-shaped shell.
[0018] Furthermore, the low thermal conductivity protection module is made by casting, extrusion or 3D printing.
[0019] Furthermore, the material of the low thermal conductivity protection module includes low thermal conductivity epoxy resin, thermal insulation cotton or low thermal conductivity ceramic.
[0020] Furthermore, the thermal conductivity of the low thermal conductivity protection module is less than or equal to 0.2 W / mK.
[0021] Compared with the prior art, the present invention has the following beneficial effects:
[0022] 1. The secondary shaping method of the present invention sets a thermal protection module on the reserved raw rubber area. The thermal conductivity of the thermal protection module is less than or equal to 0.2W / mK, which is much lower than that of metal iron, metal aluminum and other metals commonly used in rubber molds. It can protect the temperature of the rubber and fabric in the reserved raw rubber area, so that the heat of the vulcanizing machine is always transferred to the reserved raw rubber area of the mold at a low rate, avoiding vulcanization of the reserved raw rubber area.
[0023] 2. In one embodiment of the present invention, epoxy resin is used as the preparation material, and the thermal protection module is prepared by 3D printing. The thermal protection module can be processed into a more complex structure with low processing difficulty, which is conducive to engineering production.
[0024] Of course, the implementation of the various technical solutions of the present invention does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, without paying any creative work, they can also obtain drawings of other embodiments based on these drawings.
[0026] Figure 1 This is a flow chart of a molding method according to an embodiment of the present invention;
[0027] Figure 2 Schematic diagram of the mold structure of Example 1 of the present invention;
[0028] In the figure, 1-upper mold, 2-lower mold, 3-core, 4-cavity, 5-low thermal conductivity protection module, 6-fixing screw. DETAILED DESCRIPTION
[0029] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.
[0030] In the description of this patent, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this patent and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this patent.
[0031] In the description of this patent, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," and "set" should be understood in a broad sense. For example, they can refer to fixed connection or set, detachable connection or set, or integral connection or set. Those skilled in the art can understand the specific meanings of the above terms in this patent based on the specific circumstances. The present invention is described in detail below with reference to the accompanying drawings and embodiments.
[0032] Example 1:
[0033] The method for shaping the reserved raw rubber area based on the low thermal conductivity module includes the following steps:
[0034] Step S1, preparing a low thermal conductivity protection module;
[0035] In this embodiment, the low thermal conductivity protection module is made of epoxy resin by 3D printing. The specific preparation method is as follows:
[0036] Step S101: Computer modeling of a low thermal conductivity protection module based on the length and cross-sectional shape of the protection target location. In this embodiment, the low thermal conductivity protection module is designed as a cylindrical shell structure, the inner diameter of which is 1 mm larger than the outer diameter of the mold core coated with the rubber material and fabric.
[0037] Step S102: Slice the model and set the layer thickness to 0.05 mm;
[0038] Step S103: importing the sliced 3D modeling drawings into a 3D printing device;
[0039] Step S104: Epoxy resin is selected as the raw material to start printing, and the layer thickness of the printing device is set to 0.05 mm;
[0040] Step S105: After the 3D printing is completed, the surface of the low thermal conductivity protection module is trimmed and set aside.
[0041] Step S2: Coat the outer surface of the mold core with rubber and fabric, and the rubber and fabric are located in the mold cavity outside the mold core; the mold includes an upper mold, a lower mold, and a mold core, and the upper mold and the lower mold are connected by fixing screws. The upper mold, the lower mold and the mold core form a mold cavity. The specific structure of the mold in this embodiment is shown in FIG. Figure 2 .
[0042] Step S3: The low thermal conductivity protection module prepared in step S1 is installed on the rubber and fabric outer covering in the raw rubber area reserved for the mold core. The thermal conductivity coefficient of the low thermal conductivity protection module made of epoxy resin is 0.2W / mK, which is much lower than the thermal conductivity coefficient of metal iron, metal aluminum and other metals commonly used in rubber molds.
[0043] Step S4: Place the mold core covered with the rubber compound and fabric and the low thermal conductivity protection module into the mold cavity, and close the upper mold and the lower mold and fix them with fixing screws.
[0044] Step S5: Place the reserved raw rubber area of the mold outside the vulcanizing machine in a suspended state, and cool it by external air circulation to ensure that the temperature of the reserved raw rubber area can always be kept lower than the temperature required for vulcanization.
[0045] Step S6: setting parameters, and hot pressing and vulcanizing the non-reserved raw rubber area of the mold.
[0046] Step S7: After hot pressing and vulcanization is completed, remove the fixing screws, open the upper mold and the lower mold, demold the rubber semi-finished product from the mold core, and then remove the low thermal conductivity protection module. The position protected by the low thermal conductivity protection module is the raw rubber area of the rubber semi-finished product. The rest of the rubber has been hot pressed and vulcanized.
[0047] Step S8: performing secondary molding vulcanization on the raw rubber area of the rubber semi-finished product or performing docking vulcanization with other components.
[0048] Example 2:
[0049] Different from Example 1, in this embodiment, the low thermal conductivity protection module is made by casting, and the other technical steps are the same as those in Example 1.
[0050] Example 3:
[0051] Different from Example 1, in this embodiment, the low thermal conductivity protection module is made by extrusion, and the other technical steps are the same as those in Example 1.
[0052] The low-thermal-conductivity protection module of the present invention addresses the problem of excessively rapid heat transfer from the mold's primary material, such as iron or aluminum, to the reserved rubber area, leading to vulcanization of the rubber product's reserved rubber area. It should be noted that in other embodiments, the low-thermal-conductivity protection module can also be made of other low-thermal-conductivity materials, such as thermal insulation cotton or low-thermal-conductivity ceramics. The shape of the low-thermal-conductivity module can be designed based on the actual product's reserved rubber area structure and is not limited to a cylindrical shell.
[0053] The above examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. Those skilled in the art can make several simple deductions, modifications or substitutions based on the concept of the present invention.
Claims
1. A method for shaping the reserved raw rubber area based on a low thermal conductivity epoxy resin module, characterized in that: The steps include: Step S1, preparing a low thermal conductivity protection module; The low thermal conductivity protection module is made of epoxy resin through 3D printing. The specific preparation method is as follows: Step S101: Computer modeling of a low thermal conductivity protection module based on the length and cross-sectional shape of the protection target location. The low thermal conductivity protection module is designed as a cylindrical shell structure, the inner diameter of which is 1 mm larger than the outer diameter of the mold core coated with the rubber compound and fabric. Step S102: Slice the model and set the layer thickness to 0.05 mm; Step S103: importing the sliced 3D modeling drawings into a 3D printing device; Step S104: Epoxy resin is selected as the raw material to start printing, and the layer thickness of the printing device is set to 0.05 mm; Step S105: After the 3D printing is completed, the surface of the low thermal conductivity protection module is trimmed and set aside; Step S2: coating the mold core with rubber and fabric, with the rubber and fabric located in a cavity outside the mold core; the mold comprises an upper mold, a lower mold, and a mold core, the upper mold and the lower mold being connected by fixing screws, and a cavity being formed between the upper mold, the lower mold, and the mold core; Step S3: placing the low thermal conductivity protection module prepared in step S1 on the rubber and fabric outer covering at the raw rubber area reserved for the mold core. The low thermal conductivity protection module prepared by epoxy resin has a thermal conductivity of 0.2 W / mK. Step S4: placing the mold core covered with the rubber compound and fabric and the low thermal conductivity protection module into the mold cavity, and closing the upper mold and the lower mold and fixing them with fixing screws; Step S5: The reserved raw rubber area of the mold is placed outside the vulcanizing machine in a suspended state, and the temperature of the reserved raw rubber area is kept lower than the vulcanization temperature by circulating external air for cooling. Step S6: setting parameters and hot pressing and vulcanizing the non-reserved raw rubber area of the mold; Step S7: After hot pressing and vulcanization is completed, remove the fixing screws, open the upper and lower molds, demold the rubber semi-finished product from the mold core, and then remove the low thermal conductivity protection module. The area protected by the low thermal conductivity protection module is the raw rubber area of the rubber semi-finished product. The remaining rubber has been hot pressed and vulcanized. Step S8: performing secondary molding vulcanization on the raw rubber area of the rubber semi-finished product or performing docking vulcanization with other components.
Citation Information
Patent Citations
Rubber material for rubber water seal and preparation forming method and equipment thereof
CN111925564A