Line board inspection apparatus

Abstract

A testing apparatus for testing a circuit bare board, wherein the circuit bare board includes an antenna. The testing apparatus includes a supporting table, a probe device and a measuring device. The supporting table is capable of supporting the circuit bare board. The measuring device is electrically connected to the probe device and is electrically connected to the antenna through the probe device. The measuring device is capable of outputting a first test signal to the antenna. The antenna outputs a second test signal to the measuring device after receiving the first test signal. The measuring device measures the antenna according to the second test signal, wherein the first test signal and the second test signal do not pass through any active element. Thus, the testing apparatus can directly test the circuit bare board without installing chips, so as to reduce cost and shorten testing time.

Description

Technical Field

[0001] This invention relates to a testing device, and more particularly to a testing device for bare circuit boards. Background Technology

[0002] Most circuit boards in existing mobile devices (such as smartphones and tablets) have antennas to enable wireless communication. These antenna-equipped circuit boards undergo testing after manufacturing to verify that the antenna is functioning correctly. Before testing, a testing chip must be mounted on the circuit board to electrically connect to the antenna and control its transmission and reception of wireless signals, thus enabling antenna testing.

[0003] However, since the detection of the aforementioned antennas requires the use of a detection chip, the existing antenna detection methods require additional time and cost to pre-install the detection chip on the circuit board. As a result, the existing circuit board antenna detection methods are not only time-consuming, but also increase costs due to the need for the detection chip. Summary of the Invention

[0004] At least one embodiment of the present invention provides a testing device for bare circuit boards, which can directly test circuit boards that have not yet been fitted with the aforementioned chips.

[0005] The present invention provides a testing apparatus for testing bare circuit boards, wherein the bare circuit board includes at least one antenna and a plurality of pads, and the antenna is electrically connected to at least one of these pads. The testing apparatus includes a stage, a probe device, and a measuring device. The stage is used to support the bare circuit board. The probe device is used to electrically contact at least one of the pads, such that the probe device is electrically connected to the antenna via the pads. The measuring device is electrically connected to the probe device and electrically connected to the antenna via the probe device, wherein the measuring device outputs a first test signal to the antenna, and the antenna, after receiving the first test signal, outputs a second test signal to the measuring device. The measuring device measures the antenna according to the second test signal, and neither the first nor the second test signal passes through any active element.

[0006] In at least one embodiment of the present invention, the probe device is disposed above a support stage, and the bare circuit board includes multiple circuit board units. During the measurement of the bare circuit board by the measuring device, the probe device covers a portion of the bare circuit board.

[0007] In at least one embodiment of the present invention, the measuring device includes a vector signal generator (VSG), a vector signal analyzer (VSA), and a transceiver antenna. The transceiver antenna is electrically connected to the vector signal generator or the vector signal analyzer, wherein one of the first test signal and the second test signal is a wireless signal, and the transceiver antenna receives or transmits the wireless signal.

[0008] In at least one embodiment of the present invention, the measuring device further includes a frequency converter. The frequency converter is electrically connected to a vector signal generator, wherein the vector signal generator is used to generate an initial test signal, and the frequency converter is used to convert the initial test signal into a first test signal.

[0009] In at least one embodiment of the present invention, the detection device further includes an image sensor. The image sensor is used to capture a top-view image of the bare circuit board and identify the pads based on the top-view image.

[0010] In at least one embodiment of the invention, the aforementioned support platform includes a support member, a frame, and at least two parallel support strips. The frame is connected to the support member and has an opening. The support strips are disposed within the opening and connected to the frame, wherein each support strip has a bearing surface, and a bare circuit board is disposed on the bearing surface of these support strips. At least one antenna is located between these support strips. During the measurement of the antenna by the measuring device, the support strips do not overlap with at least one antenna.

[0011] In at least one embodiment of the present invention, the measuring device includes a transceiver antenna. The transceiver antenna is disposed below the carrier bars and aligned with at least one antenna, wherein a hollow space or a non-conductor exists between the carrier bars and the transceiver antenna.

[0012] In at least one embodiment of the present invention, the measuring device is an analyzer.

[0013] In at least one embodiment of the present invention, the aforementioned support platform includes a support pad. The support pad is an electrical insulator and has a support surface, wherein a bare circuit board is disposed on the support surface.

[0014] In at least one embodiment of the present invention, the dielectric constant of the above-mentioned carrier pad is between 1 and 20.

[0015] Based on the above, the testing equipment disclosed in the embodiments can directly test the antenna of a bare circuit board without a testing chip. Compared with existing testing methods that use testing chips, the testing equipment of this embodiment can directly test circuit boards that have not yet been fitted with the aforementioned chip, thereby having the advantages of reducing costs and shortening testing time. Attached Figure Description

[0016] Figure 1A This is a schematic diagram of a device for testing bare circuit boards according to at least one embodiment of the present invention.

[0017] Figure 1B It is suitable for letting Figure 1A A top view of a bare circuit board being tested by the testing equipment in the diagram.

[0018] Figure 2A This is a schematic diagram of a device for testing bare circuit boards according to another embodiment of the present invention.

[0019] Figure 2B yes Figure 2A A top view of the support platform and the bare circuit board.

[0020] Figure 2C This is a schematic diagram of a device for testing bare circuit boards according to another embodiment of the present invention.

[0021] [Explanation of Key Component Symbols]

[0022] Detailed Implementation

[0023] In the following text, to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the accompanying drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the dimensions and shapes presented by the elements, but should cover dimensions, shapes, and deviations from both due to actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the accompanying drawings are primarily for illustrative purposes and are not intended to precisely depict the actual shape of the elements, nor are they intended to limit the claims of this application.

[0024] Secondly, the terms "approximately," "approximately," or "substantially" used in this application not only cover explicitly stated numerical values ​​and ranges, but also the permissible deviation range understandable to someone skilled in the art. This deviation range can be determined by errors that occur during measurement, such as those arising from limitations of the measurement system or process conditions. Furthermore, "approximately" can indicate a deviation within one or more standard deviations of the aforementioned numerical values, such as ±30%, ±20%, ±10%, or ±5%. The use of terms such as "approximately," "approximately," or "substantially" in this application allows for the selection of acceptable deviation ranges or standard deviations based on optical, etching, mechanical, or other properties, and does not apply to all optical, etching, mechanical, and other properties using a single standard deviation.

[0025] Figure 1A This is a schematic diagram of a device for testing bare circuit boards according to at least one embodiment of the present invention. Please refer to... Figure 1A The testing equipment 100 can test bare circuit boards 10, wherein the bare circuit boards 10 include multiple pads 11 and at least one antenna 12. Figure 1A For example, the bare circuit board 10 may include multiple antennas 12, while in other embodiments, the number of antennas 12 included in the bare circuit board 10 may be only one.

[0026] At least one antenna 12 is electrically connected to at least one of the pads 11. For example, the antennas 12 are electrically connected to at least some of the pads 11 respectively. The pads 11 can be electrically connected to the antennas 12 through an interlayer connection structure (not shown), wherein the interlayer connection structure may include at least one of a conductive through hole, a conductive blind via, and a conductive buried via.

[0027] The bare circuit board 10 is a circuit board that has not yet been mounted with any active components. In other words, before any active components are mounted on the bare circuit board 10, electrical signals input from any of these pads 11 will not pass through any active components. In other words, the current carried within the bare circuit board 10 will not pass through any active components. Furthermore, the aforementioned active components are, for example, transistors or integrated circuits (ICs) having at least one transistor, and the active components can also be packaged chips or unpackaged dies.

[0028] It should be noted that although the bare circuit board 10 is a circuit board without any active components, it may have passive components, such as capacitors, inductors, or resistors. For example, in other embodiments, the bare circuit board 10 may have embedded passive components, such as discrete components. Alternatively, at least one of the circuit layers of the bare circuit board 10 may form passive components. For example, the bare circuit board 10 may have two adjacent circuit layers overlapping each other to form a capacitor.

[0029] Figure 1B It is suitable for letting Figure 1A A top view of the bare circuit board being inspected by the testing equipment. Please refer to [link / reference]. Figure 1A and Figure 1B The bare circuit board 10 can be a working panel or a strip, so the bare circuit board 10 can include multiple circuit board units U1, wherein each circuit board unit U1 includes multiple pads 11 and at least one antenna 12. After the bare circuit board 10 is inspected, the qualified bare circuit board 10 can be cut to separate these circuit board units U1.

[0030] The bare circuit board 10 can also be a circuit board unit U1, so the number of circuit board units U1 included in the bare circuit board 10 can be only one. Therefore, Figure 1B The number of circuit board units U1 shown is not limited to the number of circuit board units U1 included in the bare circuit board 10. In addition, the bare circuit board 10 can be a printed circuit board, a carrier, a flexible wiring board, or a flex-rigid wiring board, and the number of wiring layers included in the bare circuit board 10 can be at least two layers.

[0031] It must be stated that, Figure 1B The bare circuit board 10 shown is not... Figure 1A The bare circuit board 10 in the diagram is drawn to scale. Specifically, Figure 1A The main focus is on drawing the pad 11 and antenna 12, while omitting the circuit board unit U1, to clearly demonstrate the testing of the bare circuit board 10 by the testing equipment 100. Therefore, Figure 1B The bare circuit board 10 in the middle is not Figure 1A The bare circuit board 10 is drawn to scale. Furthermore, since the bare circuit board 10 can also be a circuit board unit U1, therefore... Figure 1A The bare circuit board 10 in the middle can also be Figure 1B The circuit board unit U1 in the middle.

[0032] Please see Figure 1A The testing equipment 100 includes a support platform 110, a probe device 120, and a measuring device 130. The support platform 110 can support the bare circuit board 10 and includes a support pad 111 and a support member 112, wherein the support pad 111 is connected to and supported by the support member 112. Furthermore, in... Figure 1A In the illustrated embodiment, the support 112 may include multiple columns 112p, such as three or four columns 112p, which may be connected to the support pad 111.

[0033] Both the carrier pad 111 and the support member 112 can be electrically insulators, and the carrier pad 111 has a carrier surface 111f, on which the bare circuit board 10 is disposed. The dielectric constant of the carrier pad 111 can be between 1 and 20, with an optimal dielectric constant of 1. The carrier pad 111 can include a polymer material. For example, part or all of the carrier pad 111 can be made of expanded polystyrene (EPS, commonly known as Styrofoam).

[0034] exist Figure 1A In the illustrated embodiment, the entire support pad 111 may be made of expanded polystyrene, i.e., the support pad 111 may be a polystyrene sheet. In other embodiments, the support pad 111 may include a polystyrene sheet and an insulating plate supporting the polystyrene sheet, wherein the polystyrene sheet is disposed on the insulating plate, and the insulating plate connects to the support member 112. Figure 1A The support member 112 can be omitted, while the bearing pad 111 can be retained, so that the bearing platform 110 only includes the bearing pad 111. Therefore, the bearing platform 110 can be a polystyrene board or a thick polystyrene block, and the bare circuit board 10 can be disposed on this polystyrene board or polystyrene block.

[0035] The measuring device 130 may be an analyzer, such as a vector network analyzer (VNA), a time domain reflectometer (TDR), or other analyzers. The measuring device 130 is electrically connected to a probe device 120, which may be a probe card, a socket with a pogo pin, a GSG (Ground Signal Ground) probe, or other probes. The probe device 120 is positioned above the stage 110 and is electrically contactable with at least one of the pads 11, allowing the probe device 120 to be electrically connected to at least one antenna 12 via the pads 11. Therefore, the measuring device 130 can be electrically connected to at least one antenna 12 via the probe device 120.

[0036] When the testing device 100 tests the bare circuit board 10, the probe device 120 electrically contacts the pad 11 and electrically connects to the antenna 12, so that the measuring device 130 can output a first test signal S11 to the antenna 12 via the probe device 120. The first test signal S11 is an electrical signal, and electrical signals can only be transmitted through lines and cannot be transmitted by radiation. After receiving the first test signal S11, the antenna 12 will not only radiate a wireless signal S13, but also output a second test signal S12 from the pad 11 and the probe device 120 to the measuring device 130. The second test signal S12 can be an electrical signal generated by the antenna 12 due to electromagnetic induction.

[0037] The measuring device 130 can measure the antenna 12 based on the second test signal S12 to determine the status of the wireless signal S13 radiated by the antenna 12, and thus determine whether the antenna 12 is operating normally. For example, based on the second test signal S12, the measuring device 130 can measure at least one of the antenna 12's return loss, insertion loss, over-the-air (OTA) radiation, and signal shift. Since the bare circuit board 10 is a circuit substrate that has not yet been fitted with any active components, and the current transmitted within the bare circuit board 10 will not pass through any active components before any active components are installed, the first test signal S11 and the second test signal S12 also do not pass through any active components.

[0038] Therefore, the testing equipment 100 does not require existing testing chips and can directly test the bare circuit board 10 to select qualified bare circuit boards 10 or circuit board units U1 and reject unqualified bare circuit boards 10 or circuit board units U1. Compared with existing testing methods that use testing chips, the testing equipment 100 of this embodiment can eliminate the additional time and cost incurred due to the installation of testing chips, thereby having the advantages of reducing costs and shortening testing time.

[0039] Since the bare circuit board 10 can be a working board or a substrate strip, it can have a fairly large size. For example, the bare circuit board 10 can essentially be a square board with sides of approximately 50 centimeters and an area of ​​approximately 2500 square centimeters. Therefore, during the measurement of the bare circuit board 10 by the measuring device 130, the probe device 120 will cover a portion of the bare circuit board 10. In other words, the probe device 120 located above will overlap with a portion of the bare circuit board 10. Furthermore, since the bare circuit board 10 can also be a circuit board unit U1 and has a fairly small size, in other embodiments, the probe device 120 can also completely cover the bare circuit board 10.

[0040] The detection device 100 may further include an image sensor 140 and a control device 190. The control device 190 may be a computer, such as a desktop computer, industrial computer, or laptop computer. Alternatively, the control device 190 may also be a microprocessor. The control device 190 is communicatively connected to the measuring device 130 and the image sensor 140. For example, the control device 190 may be electrically connected to at least one of the measuring device 130 and the image sensor 140 via a line. Alternatively, the control device 190 may be wirelessly connected to at least one of the measuring device 130 and the image sensor 140.

[0041] For example, control device 190 can electrically connect measuring device 130 and image sensor 140 via, for example, a Universal Serial Bus (USB). Alternatively, control device 190 can wirelessly connect measuring device 130 and image sensor 140 via Bluetooth or a wireless network (e.g., Wi-Fi). Furthermore, control device 190 can also electrically and wirelessly connect measuring device 130 and image sensor 140 respectively. For example, control device 190 can be electrically connected to measuring device 130 and wirelessly connected to image sensor 140 via a wireless network.

[0042] Since the control device 190 is communicatively connected to the measuring device 130 and the image sensor 140, the control device 190 can control the measuring device 130 to generate a first test signal S11, and determine the status of the antenna 12 radiating a wireless signal S13 based on the second test signal S12. Furthermore, the control device 190 can also control the image sensor 140 to capture a top-view image of the bare circuit board 10, wherein the top-view image can be as follows: Figure 1B The bare board 10, which shows the entire or part of the circuit.

[0043] The image sensor 140 may be a camera or video camera, and may include an image processor to enable the image sensor 140 to identify the pads 11 based on a top-view image. For example, the bare circuit board 10 may have alignment marks (not shown), and the top-view image captured by the image sensor 140 includes images of the alignment marks. The image processor of the image sensor 140 can identify the circuit board units U1 and the pads 11 based on the images of the alignment marks, thereby determining the position of the pads 11.

[0044] It should be noted that since the control device 190 is communicatively connected to the image sensor 140, the control device 190 can identify these pads 11 based on the top-view image even if the image sensor 140 does not have an image processor. For example, the control device 190 can also identify these pads 11 by means of positioning marks, so the image sensor 140 may not have an image processor.

[0045] The testing device 100 may further include a drive unit 150, such as a stepper motor. The drive unit 150 is connected to and capable of moving the probe device 120. The control unit 190 is further communicatively connected to the drive unit 150, so the control unit 190 can be wirelessly or electrically connected to the drive unit 150 via a line. The control unit 190 can drive the drive unit 150 based on the top-view image captured by the image sensor 140, so that the drive unit 150 moves the probe device 120 to the correct position, thereby allowing the probe device 120 to electrically contact the correct pad 11 to test the antenna 12. In addition, the control unit 190 can store a program for testing the antenna 12, so that the testing device 100 can automatically test the bare circuit board 10 according to the above program.

[0046] It is worth mentioning that the testing device 100 may further include multiple absorbing materials 180, which may surround the bare circuit board 10 and the probe device 120. The absorbing materials 180 can absorb wireless signals, such as wireless signal S13. Therefore, the absorbing materials 180 surrounding the bare circuit board 10 and the probe device 120 can prevent or reduce interference from external wireless signals and reflection of wireless signal S13, thereby improving the accuracy of the testing device 100 in detecting the antenna 12 of the bare circuit board 10.

[0047] Figure 2A This is a schematic diagram of a device for testing bare circuit boards according to another embodiment of the present invention. Please refer to [link / reference]. Figure 2A The detection device 200a in this embodiment includes a probe device 120, an image sensor 140, a driving device 150, a microwave absorbing material 180, a control device 190, a support stage 210, and a measuring device 230. The control device 190 can be communicatively connected to the image sensor 140, the driving device 150, and the measuring device 230 to control the image sensor 140, the driving device 150, and the measuring device 230.

[0048] The testing device 200a is similar to the aforementioned testing device 100. For example, testing device 200a can also test the bare circuit board 10. The following mainly describes the differences between testing devices 200a and 100, while the similarities between testing devices 200a and 100 will not be repeated. Specifically, the measuring device 230 may include a vector signal generator 231, a vector signal analyzer 232, and a transceiver antenna 235, wherein the transceiver antenna 235 may be a horn antenna. The transceiver antenna 235 is electrically connected to the vector signal analyzer 232 and can be aligned with the antenna 12 to be tested.

[0049] The measuring device 230 outputs a first test signal SA21 to the antenna 12 via the probe device 120 and the pad 11, which are in electrical contact with each other. The first test signal SA21 is an electrical signal. After receiving the first test signal SA21, the antenna 12 generates a second test signal SA22 and inputs the second test signal SA22 to the measuring device 230. The second test signal SA22 is a wireless signal radiated by the antenna 12. Since the bare circuit board 10 is a circuit board without any active components, the first test signal SA21 and the second test signal SA22 do not pass through any active components.

[0050] The transceiver antenna 235 receives the second test signal SA22 and converts it into an electrical signal SA23. This electrical signal SA23 is then transmitted to the vector signal analyzer 232, enabling the measuring device 230 to measure the antenna 12 based on the second test signal SA22. Using the vector signal generator 231 and the vector signal analyzer 232, the measuring device 230 can measure at least one of the antenna 12's error vector magnitude (EVM) and transmit power based on the second test signal SA22. Furthermore, the control device 190 can control the measuring device 230 to generate a first test signal SA21 and detect the antenna 12 based on the second test signal SA22 to select qualified bare circuit boards 10 or circuit board units U1.

[0051] The measuring device 230 may further include a frequency converter 233 electrically connected to the vector signal generator 231. The vector signal generator 231 generates an initial test signal SA20, while the frequency converter 233 changes the frequency of the initial test signal SA20 to convert it into a first test signal SA21. For example, when the antenna 12 is a high-frequency antenna and the initial test signal SA20 generated by the vector signal generator 231 is a low-frequency signal, the frequency converter 233 can convert the low-frequency initial test signal SA20 into a high-frequency first test signal SA21. Thus, the antenna 12 receiving the first test signal SA21 can radiate a second test signal SA22, enabling the detection device 200a to detect the antenna 12.

[0052] Figure 2B yes Figure 2A A top-view diagram showing the support platform and bare circuit board. Please participate. Figure 2A and Figure 2B Unlike the aforementioned support platform 110, the support platform 210 in this embodiment includes a support member 112, a frame 211, and at least two parallel support bars 213. The frame 211 is connected to the support member 112 and has an opening 211h. The support bars 213 are disposed within the opening 211h and connected to the frame 211, wherein the support bars 213 are movably disposed within the frame 211 so that each support bar 213 can move relative to the frame 211.

[0053] Each carrier strip 213 has a carrier surface 213a, on which the bare circuit board 10 is disposed, and at least one antenna 12 is located between these carrier strips 213. Since each carrier strip 213 is movable relative to the frame 211, the bare circuit board 10 can be moved within the opening 211h by the movement of these carrier strips 213. Furthermore, during the measurement of the antenna 12 by the measuring device 230, these carrier strips 213 do not overlap with the antenna 12 being measured, and may not overlap with all antennas 12, to avoid affecting the measurement of the antenna 12 by the measuring device 230.

[0054] Transceiver antennas 235 are disposed below these carrier strips 213, wherein a hollow space EM2 exists between these carrier strips 213 and the transceiver antennas 235. The hollow space EM2 is essentially the spatial range in which the transceiver antennas 235 can effectively receive the second test signal SA22, wherein the range of the hollow space EM2 includes the area between two adjacent carrier strips 213 and the area between the transceiver antennas 235 and the bare circuit board 10.

[0055] The distance G21 between antenna 12 and transceiver antenna 235 can be between 0 and 2 meters. Distance G21 is equal to the distance from the supporting surface 213a to transceiver antenna 235, and is equivalent to the length of the hollow space EM2. In this embodiment, the hollow space EM2 may contain air or other non-conductive materials, and is free of any objects, such as metal, that could severely interfere with the transceiver antenna 235's reception of the second test signal SA22, so that the detection device 200a can accurately detect antenna 12.

[0056] Figure 2C This is a schematic diagram of a device for testing bare circuit boards according to another embodiment of the present invention. Please refer to [link / reference]. Figure 2C The detection device 200c in this embodiment is similar to the detection device 200a in the previous embodiment, and the similarities between the two will not be repeated. Unlike the detection device 200a, in this embodiment, the transceiver antenna 235 in the detection device 200c is electrically connected to the vector signal generator 231 of the measuring device 230, and can emit a first test signal SC21 toward the antenna 12, wherein the first test signal SC21 is the wireless signal radiated by the antenna 12.

[0057] When the transceiver antenna 235 emits the first test signal SC21, the antenna 12 receives the first test signal SC21 and generates a second test signal SC22. The second test signal SC22 is an electrical signal, and the antenna 12 inputs the second test signal SC22 to the vector signal analyzer 232 of the measuring device 230 through the probe device 120, so that the measuring device 230 can measure the antenna 12 according to the second test signal SC22. Using the vector signal generator 231 and the vector signal analyzer 232, the measuring device 230 can measure at least one of the error vector amplitude (EVM) and the received power of the antenna 12 according to the second test signal SC22.

[0058] In this embodiment, the vector signal generator 231 generates an initial test signal SC20, and the frequency converter 233 converts the initial test signal SC20 into an electrical signal EC20, which is then input to the transceiver antenna 235 so that the transceiver antenna 235 can emit a first test signal SC21. For example, when the antenna 12 is a high-frequency antenna and the initial test signal SC20 is a low-frequency signal, the frequency converter 233 can convert the initial test signal SC20 into a high-frequency electrical signal EC20 and transmit the electrical signal EC20 to the transceiver antenna 235. Thus, the transceiver antenna 235 receiving the electrical signal EC20 can emit the first test signal SC21 to the antenna 12, so that the antenna 12 can sense the second test signal SC22.

[0059] It is worth mentioning that, in Figure 2A and Figure 2C In the illustrated embodiment, the measuring device 230 includes a frequency converter 233; however, in other embodiments, the measuring device 230 may not include a frequency converter 233, wherein the vector signal generator 231 can directly generate the first test signal SA21 or the electrical signal EC20. Therefore, Figure 2A and Figure 2C The frequency converter 233 shown can be omitted. Furthermore, although in the above... Figure 1A , Figure 2A and Figure 2C In the illustrated embodiments, detection devices 100, 200a, and 200c all include absorbing material 180. However, in other embodiments, detection devices 100, 200a, and 200c may not include these absorbing materials 180. Therefore, the above... Figure 1A , Figure 2A and Figure 2C The absorbing material 180 shown can all be omitted.

[0060] In summary, the testing equipment disclosed in the above embodiments can directly test the antenna of a bare circuit board without the need for a testing chip, thereby selecting qualified bare circuit boards or circuit board units. Compared with existing testing methods that use testing chips, the testing equipment of this embodiment obviously has the advantages of reducing costs and shortening testing time.

[0061] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A device for inspecting bare circuit boards, characterized in that, The bare circuit board includes at least one antenna and a plurality of pads, the at least one antenna being electrically connected to at least one of the pads, and the testing device includes: The support platform is used to support the bare circuit board of the circuit. A probe device for electrically contacting at least one of the pads, such that the probe device is electrically connected to the at least one antenna via the pad; and A measuring device is electrically connected to the probe device and, through the probe device, to the at least one antenna. The measuring device outputs a first test signal to the at least one antenna, and after receiving the first test signal, the at least one antenna outputs a second test signal to the measuring device. The measuring device measures the at least one antenna based on the second test signal, and neither the first nor the second test signal passes through any active element. The support platform includes: Support components; A frame, connected to the support member, and having an opening; and At least two parallel carrier strips are disposed within the opening and connected to the frame, wherein each carrier strip has a carrier surface, and the bare circuit board is disposed on the carrier surface of the carrier strip, and the at least one antenna is located between the carrier strips; During the measurement of the at least one antenna by the measuring device, the carrier strip does not overlap with the at least one antenna; The measuring device includes: A transceiver antenna is disposed below the support bar and aligned with the at least one antenna, wherein there is a hollow space or a non-conductor between the support bar and the transceiver antenna.

2. The testing equipment for bare circuit boards according to claim 1, characterized in that, The probe device is positioned above the support platform, and the bare circuit board includes multiple circuit board units. During the measurement of the bare circuit board by the measuring device, the probe device covers a portion of the bare circuit board.

3. The testing equipment for bare circuit boards according to claim 1, characterized in that, The measuring device includes: Vector signal generator; and Vector signal analyzer; The transceiver antenna is electrically connected to the vector signal generator or the vector signal analyzer, wherein one of the first test signal and the second test signal is a wireless signal, and the transceiver antenna receives or transmits the wireless signal.

4. The testing equipment for bare circuit boards according to claim 3, characterized in that, The measuring device further includes: A frequency converter is electrically connected to the vector signal generator, wherein the vector signal generator is used to generate an initial test signal, and the frequency converter is used to convert the initial test signal into the first test signal.

5. The testing equipment for bare circuit boards according to claim 1, characterized in that, Including: An image sensor is used to capture a top-view image of the bare circuit board and identify the pads based on the top-view image.

6. The testing equipment for bare circuit boards according to claim 1, characterized in that, The measuring device is an analyzer.

7. The testing equipment for bare circuit boards according to claim 1, characterized in that, The support platform includes a support pad that is an electrical insulator and has a support surface on which the bare circuit board is disposed.

8. The testing equipment for bare circuit boards according to claim 7, characterized in that, The dielectric constant of the carrier pad is between 1 and 20.

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