Position calibration methods and devices, image acquisition device position determination and processing methods

Abstract

This invention provides a position calibration method and an image acquisition device position determination and processing method. The method includes: acquiring a template image and multiple first test images, wherein the multiple first test images are images acquired by the image acquisition device for the workpiece when it is in multiple different first physical positions, and the multiple different first physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis of the workpiece; for each first test image, determining the image position of a marker feature in the first test image based on the template image; determining the image position corresponding to the rotation axis based on the image position of the marker feature in the multiple first test images; and determining the physical position corresponding to the rotation axis coinciding with the center of the field of view of the image acquisition device based on the image position corresponding to the rotation axis and the image position corresponding to the center of the field of view of the image acquisition device. This method requires no manual intervention and has high positioning accuracy.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically to a position calibration method, a method for determining the position of an image acquisition device for a processing apparatus, a processing method, a position calibration device, an electronic device, and a storage medium. Background Technology

[0002] In the manufacturing industry, many machines use X, Y, R positioning systems in conjunction with vision-based positioning cameras to position and process products. The X, Y, R positioning system allows the product to translate along the X and Y axes and rotate around the R axis. The coordinates (in the XY coordinate system) corresponding to the R-axis rotation axis coinciding with the camera's field of view are frequently used in practical calculations. For example, in the semiconductor industry, vision-based positioning is needed to determine the angle θ of the wafer dicing track. Then, the R-axis is rotated by θ° to make the wafer dicing track horizontal. Calculating the position of the dicing track after rotation requires the coordinates corresponding to the R-axis rotation axis coinciding with the camera's field of view. The traditional method involves moving the R-axis into the camera's field of view, rotating the R-axis, visually identifying the rotation axis, and then moving the workpiece in the XY coordinate system, gradually aligning the R-axis rotation axis with the camera's field of view. Clearly, this method cannot guarantee positioning accuracy and is highly dependent on the operator's subjectivity. Summary of the Invention

[0003] The present invention is proposed in view of the above-mentioned problems. The present invention provides a position calibration method, a method for determining the position of an image acquisition device for a processing apparatus, a processing method, a position calibration device, an electronic device, and a storage medium.

[0004] According to a first aspect of the present invention, a position calibration method is provided, comprising: acquiring a template image and a plurality of first test images, wherein the template image includes an identification feature on a workpiece, the plurality of first test images are images acquired by an image acquisition device for the workpiece when the workpiece is in a plurality of different first physical positions, the number of the plurality of first test images is greater than or equal to three, and the plurality of different first physical positions are different physical positions distributed along a circumferential direction corresponding to a rotation axis of rotation of the workpiece; for each of the plurality of first test images, determining the image position of the identification feature in the first test image based on the template image; determining the image position corresponding to the rotation axis based on the image position of the identification feature in the plurality of first test images; and determining the physical position corresponding to the rotation axis coinciding with the center of the field of view of the image acquisition device based on the image position corresponding to the rotation axis and the image position corresponding to the center of the field of view of the image acquisition device, thereby obtaining the coincident physical position.

[0005] For example, the physical position corresponding to the rotation axis coinciding with the field of view center of the image acquisition device is determined based on the image position corresponding to the rotation axis and the image position corresponding to the field of view center of the image acquisition device, so as to obtain the coincident physical position, including: calculating the image position difference between the image position corresponding to the rotation axis and the image position corresponding to the field of view center; determining the physical position difference corresponding to the image position difference based on the image position difference and the conversion relationship between the image position and the physical position; and obtaining the physical position corresponding to the workpiece as the coincident physical position after the workpiece moves according to the physical position difference.

[0006] For example, before determining the physical position difference corresponding to the image position difference based on the image position difference and the conversion relationship between the image position and the physical position, the method further includes: acquiring a plurality of second test images, wherein the plurality of second test images are images acquired by an image acquisition device for the workpiece when the workpiece is in a plurality of different second physical positions, and the number of the plurality of second test images is greater than or equal to 3; for each of the plurality of second test images, determining the image position of the identification feature in the second test image according to the template image; and determining the conversion relationship according to the image position of the identification feature in the plurality of second test images and the plurality of second physical positions.

[0007] For example, multiple different second physical locations are distributed one-to-one in multiple different sub-regions within the movable area of ​​the workpiece to be processed, and the multiple different sub-regions are obtained by uniformly dividing at least a portion of the movable area.

[0008] For example, for each of a plurality of first images to be tested, determining the image position of the identification feature in the first image to be tested according to the template image includes: when the workpiece is in any first physical position, in response to a first position determination instruction input by a user on a first user interface, determining the image position of the identification feature in the first image to be tested corresponding to the first physical position according to the template image; and / or, after determining the image position of the identification feature in the first image to be tested according to the template image for each of a plurality of first images to be tested, or during the process of determining the image position of the identification feature in the first image to be tested according to the template image for each of a plurality of first images to be tested, the method further includes: displaying the image position of the identification feature in the first image to be tested on a second user interface for each of a plurality of first images to be tested.

[0009] For example, determining the image position corresponding to the rotation axis by identifying the image position of the feature in a plurality of first images to be tested includes: in response to a second position determination instruction input by a user on a third user interface, determining the image position corresponding to the rotation axis by identifying the image position of the feature in a plurality of first images to be tested.

[0010] For example, acquiring multiple first test images includes: repeatedly performing the following operations: when the workpiece is in the current first physical position, acquiring the corresponding first test image acquired by the image acquisition device; using the initial physical position as a reference, rotating the workpiece around the rotation axis by a preset angle so that the workpiece is in another first physical position, wherein the initial physical position is any one of multiple different first physical positions; wherein the difference between the rotation angles corresponding to any two adjacent first physical positions is greater than a preset angle threshold.

[0011] For example, rotating the workpiece around a rotation axis by a preset angle based on an initial physical position to place the workpiece in another first physical position includes: responding to a rotation command input by a user on a fourth user interface, controlling the workpiece to rotate by a preset angle based on the initial physical position to reach the corresponding first physical position, wherein the rotation command includes the preset angle.

[0012] For example, the workpiece to be processed is a wafer, the template image includes the intersection area of ​​two mutually perpendicular dicing lines on the wafer and an area within a preset range around the intersection area, and the identifying feature is the center of the intersection area.

[0013] According to a second aspect of the present invention, a method for determining the position of an image acquisition device for a processing apparatus is also provided, characterized in that the processing apparatus includes a first image acquisition device and a second image acquisition device, wherein the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, and the first image acquisition device and the second image acquisition device are respectively the aforementioned image acquisition devices, and the method includes: determining a first physical position corresponding to the first image acquisition device when its field of view center coincides with the rotation axis using the aforementioned position calibration method; determining a second physical position corresponding to the second image acquisition device when its field of view center coincides with the rotation axis using the aforementioned position calibration method; and determining the physical position difference between the first image acquisition device and the second image acquisition device based on the first physical position and the second physical position.

[0014] According to a third aspect of the present invention, a processing method is also provided, comprising: determining a first physical position difference between a first image acquisition device and a second image acquisition device using the image acquisition device position determination method for a processing apparatus described above; determining an initial physical position of at least one predetermined line based on the image position of a first product feature in a first image and the relative positional relationship between at least one predetermined line and the first product feature, wherein the first image is an image acquired by the first image acquisition device for a workpiece to be processed, and the predetermined line is a feature line on the workpiece to be processed; determining a second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time, at least based on the first physical position difference, wherein the second product feature is a feature on a second image, the second image is an image acquired by the second image acquisition device for the workpiece to be processed, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed; determining a target physical position of at least one predetermined line according to the initial physical position and the second physical position difference; and processing the workpiece to be processed based at least on the target physical position of at least one predetermined line.

[0015] For example, before processing the workpiece at a target physical location based on at least one predetermined line, the method further includes: acquiring multiple sets of images of predetermined lines to be measured, each set of images of predetermined lines to be measured being an image acquired by a third image acquisition device for the current predetermined line on the workpiece as the workpiece moves along a preset reference direction; and determining multiple sets of position points based on the multiple sets of images of predetermined lines to be measured, and sequentially corresponding to reference position points, each set of position points including a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point and along the preset reference direction, the multiple sets of position points... The spacing between the two position points contained in each point gradually increases. Multiple sets of pre-defined line images to be measured correspond one-to-one with multiple sets of position points. Each set of pre-defined line images to be measured includes two pre-defined line images to be measured that correspond to the first position point and the second position point in the corresponding set of position points, respectively. After determining each set of position points, the position of the workpiece to be processed is adjusted according to the angle of the line connecting the first position point and the second position point in the set of position points relative to the preset reference direction, so as to correct the position of the current pre-defined line on the workpiece. Among the reference position point and multiple sets of position points, different position points are the position points corresponding to different feature points on the current pre-defined line.

[0016] According to a fourth aspect of the present invention, a position calibration device is also provided, comprising: an acquisition module for acquiring a template image and a plurality of first test images, wherein the template image includes identification features on a workpiece, the plurality of first test images are images acquired by an image acquisition device for the workpiece when the workpiece is in a plurality of different first physical positions, the number of the plurality of first test images is greater than or equal to three, and the plurality of different first physical positions are different physical positions distributed along a circumferential direction corresponding to a rotation axis of rotation of the workpiece; a first determination module for determining, for each of the plurality of first test images, the image position of the identification feature in the first test image based on the template image; a second determination module for determining, based on the image position of the identification feature in the plurality of first test images, the image position corresponding to the rotation axis; and a third determination module for determining, based on the image position corresponding to the rotation axis and the image position corresponding to the center of the field of view of the image acquisition device, the physical position corresponding to the coincidence of the rotation axis and the center of the field of view, to obtain the coincident physical position.

[0017] According to a fifth aspect of the present invention, an electronic device is also provided, comprising a processor and a memory, characterized in that the memory stores a computer program, and the processor executes the computer program to implement the above-described position calibration method or the above-described image acquisition device position determination method for a processing apparatus or the processing method as described above.

[0018] According to a sixth aspect of the present invention, a storage medium storing a computer program / instructions is also provided, characterized in that, when the computer program / instructions are executed by a processor, they implement the above-described position calibration method or the above-described image acquisition device position determination method for a processing apparatus or the processing method as described above.

[0019] According to embodiments of the present invention, a position calibration method, an image acquisition device position determination method for a processing apparatus, a processing method, a position calibration device, an electronic device, and a storage medium acquire multiple first test images of a workpiece to be processed. For different first test images, the workpiece to be processed has different distribution positions in the circumferential direction of the rotation axis. The image position of the rotation axis is determined by using the position of the same identification feature on multiple first test images, and then the physical position corresponding to the rotation axis coinciding with the center of the field of view is determined. This solution can automatically determine the physical position corresponding to the rotation axis coinciding with the center of the field of view by using visual positioning technology in conjunction with changes in the physical position of the workpiece to be processed. This solution does not require manual intervention, can effectively save manpower, and has high positioning accuracy.

[0020] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0021] The above and other objects, features, and advantages of the present invention will become more apparent from the more detailed description of the embodiments of the invention in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same parts or steps.

[0022] Figure 1 A schematic flowchart of a position calibration method according to one aspect of the present invention is shown;

[0023] Figure 2 A schematic diagram of a template image according to an embodiment of the present invention is shown;

[0024] Figure 3 A schematic diagram of an image coordinate system established for a first image to be tested according to an embodiment of the present invention is shown;

[0025] Figure 4 A schematic flowchart of an image acquisition device position determination method for a processing apparatus according to an embodiment of the present invention is shown;

[0026] Figure 5 A schematic flowchart of a processing method according to an embodiment of the present invention is shown;

[0027] Figure 6 A schematic diagram of a first image according to an embodiment of the present invention is shown;

[0028] Figure 7 An image of a cutting path according to an embodiment of the present invention is shown;

[0029] Figure 8 A schematic block diagram of a position calibration device according to an embodiment of the present invention is shown; and

[0030] Figure 9 A schematic block diagram of an electronic device according to an embodiment of the present invention is shown. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of the present invention, and not all of the embodiments of the present invention. It should be understood that the present invention is not limited to the exemplary embodiments described herein. Based on the embodiments of the present invention described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of the present invention.

[0032] To at least partially solve the above problems, embodiments of the present invention provide a position calibration method. Figure 1 A schematic flowchart of a position calibration method 100 according to one aspect of the present invention is shown. Figure 1 As shown, the method 100 may include the following steps: S110, S120, S130 and S140.

[0033] Step S110: Obtain a template image and multiple first test images. The template image contains the identification features on the workpiece to be processed. The multiple first test images are images acquired by the image acquisition device for the workpiece when the workpiece is in multiple different first physical positions. The number of multiple first test images is greater than or equal to 3. The multiple different first physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis of the workpiece.

[0034] For example, the template image can be an image containing any identifying features on the workpiece to be processed. The workpiece to be processed can be any product used for processing, such as ceramics, wafers, etc. The identifying features can be any identifiable feature on the workpiece to be processed. For example, the identifying features can be features inherent to the workpiece to be processed, such as features of certain shapes or structures. For example, the identifying features can also be features additionally marked on the workpiece to be processed by manual means or processing equipment, such as some easily identifiable symbol, pattern, etc. The identifying features can be of any shape, such as a circle, cross, or star. Preferably, the identifying feature is the center of the intersection area of ​​two mutually perpendicular cutting tracks (referred to as the "cutting track center"). Figure 2 A schematic diagram of a template image according to an embodiment of the present invention is shown. Figure 2 As shown, the template image contains the center of the cutting path (represented by a black dot), which can be used as an identifying feature.

[0035] The various physical positions described herein can be represented by coordinates in the same world coordinate system. An example of establishing such a world coordinate system is described below. A workpiece can be placed on a movable device (e.g., a movable stage). The movable stage can translate within a plane (which may be called the "movement plane") or rotate within that plane about a fixed axis of rotation. The workpiece moves synchronously with the movable stage; therefore, the physical position of the movable stage described herein can be considered the same as the physical position of the workpiece, and they can be interchanged. Within the movement range of the movable stage, two mutually perpendicular grating rulers can be provided. For example, when the movable stage stops at a predetermined initial physical position, the reading of the grating rulers can be set to 0, and this physical position can be defined as the origin O of the world coordinate system. A first grating ruler can be provided along a first direction through the origin O, and the axis containing the first grating ruler can be used as the X-axis of the world coordinate system. A second grating ruler is provided perpendicular to the X-axis and through the origin O. The axis containing the second grating ruler can be used as the Y-axis of the world coordinate system. The first direction can be defined as needed. For ease of description, this paper defines the first direction as the horizontal direction, which is also the X-axis direction. The Y-axis direction, perpendicular to the X-axis direction, is defined as the vertical direction. After establishing the above world coordinate system, each time the movable stage moves, i.e., when the workpiece moves, the corresponding X-axis and Y-axis coordinates can be read from the first and second grating rulers. This (X,Y) coordinate can be used to represent the physical position of the workpiece. It can be understood that (X,Y) can be coordinate data used to represent the displacement of the workpiece.

[0036] The workpiece can translate within the plane containing the X and Y axes or a plane parallel to these planes (i.e., the aforementioned moving plane), and can rotate around the rotation axis within this moving plane. When the workpiece rotates around the rotation axis within the moving plane, this moving plane can also be called the rotation plane. When the workpiece is located at different physical positions (i.e., first physical positions) within its moving plane, multiple first test images of the workpiece can be acquired using an image acquisition device. Each of the multiple first test images corresponds one-to-one with a multiple different first physical positions. As described above, each first physical position can be obtained based on the corresponding grating ruler reading. The different first physical positions are distributed circumferentially along the rotation axis. The number of multiple first test images can be any integer greater than or equal to 3. In one embodiment, starting from an initial physical position (i.e., based on the initial physical position), the workpiece can be rotated multiple times around the rotation axis, with each rotation angle relative to the initial physical position being different, and the position where it stops at the end of each rotation is taken as a new physical position. Multiple physical positions can be determined from at least one physical position obtained through the above rotation and the initial physical position, and these determined multiple physical positions can be used as multiple different first physical positions corresponding one-to-one with the multiple first images to be tested. In another embodiment, rotation can be performed without using the initial physical position as a reference, and multiple different first physical positions can be obtained in other ways, such as by the user directly inputting the coordinate values ​​of multiple different physical positions.

[0037] Step S120: For each of the multiple first test images, determine the image position of the identification feature in the first test image based on the template image.

[0038] In step S120, a first identifier feature that matches the identifier feature in the template image can be identified from the first image to be tested, and the image position of the first identifier feature in the first image to be tested is determined as the image position of the identifier feature in the first image to be tested.

[0039] For example, there may be three first test images. For any one of the three first test images, the image position of the identifier feature in the first test image can be determined based on the template image. In one embodiment, the image feature corresponding to the identifier feature can be identified from the template image, and using this image feature, the image position of the matching image feature (i.e., the image position of the first identifier feature) in any first test image can be detected to obtain the image position of the identifier feature in the first test image. In another embodiment, in addition to the identifier feature, the template image may also contain a feature to be matched. In one example, the workpiece to be processed is a wafer, and the template image includes the intersection area of ​​two mutually perpendicular dicing tracks on the wafer and a region within a preset range around the intersection area, with the identifier feature being the center of the intersection area. In the above template image, the intersection area of ​​the two mutually perpendicular dicing tracks and the region within a preset range around the intersection area can be identified as the feature to be matched. Based on the template image, a matching feature that matches the feature to be matched can be identified from any first test image. Furthermore, the relative positional relationship between the feature to be matched and the identifier feature in the template image is determined. Based on this relative positional relationship, image positions in the first test image that have the same relative positional relationship as the image positions of the matching features are determined, and these positions are used as the image positions of the identifier features in the first test image. When the image features corresponding to the identifier features themselves are not obvious and are difficult to directly identify from the first test image, the scheme of indirectly determining the image positions of the identifier features through the features to be matched can reduce the difficulty of identifying the identifier features and help to more accurately determine the image positions of the identifier features.

[0040] The image location of any object described in this article (such as the aforementioned identifying features) can be represented by pixel coordinates in the image coordinate system in which the object is located. Figure 3 A schematic diagram of an image coordinate system established for a first image under test according to an embodiment of the present invention is shown. For example, the origin o can be established with the upper left corner vertex of the first image under test as the origin o, the side passing through the origin o and parallel to the upper side of the first image under test as the x-axis, and the side passing through the origin o, perpendicular to the x-axis and parallel to the left side of the first image under test as the y-axis, as shown below. Figure 3 The image coordinate system is shown. For example, the first image to be tested contains a total of 1000×1000 pixels. The first product feature is located at the 450th pixel in the x-direction and the 480th pixel in the y-direction, so the image position of the first product feature can be represented as (450, 480). The position of the identification feature in each of the multiple first images to be tested can be determined in a similar way.

[0041] Step S130: Determine the image position corresponding to the rotation axis by identifying the image position of the feature in multiple first test images.

[0042] Assume that the image positions of the identifier features in the three first test images are obtained according to the preceding text. For example, the image position of the identifier feature in the first test image I1 can be represented as (x1, y1), the image position of the identifier feature in the first test image I2 can be represented as (x2, y2), and the image position of the identifier feature in the first test image I3 can be represented as (x3, y3). (Refer to...) Figure 3 For ease of understanding, solid dot A can represent the image position of the identifier feature in the current first image to be tested, I1. Hollow dots B and C can represent the image positions of the identifier feature in the first images to be tested, I2 and I3, respectively. It is understood that although image positions A, B, and C do not originate from the same first image to be tested, they can be represented using the same image coordinate system, and comparisons and calculations can be performed between them within this coordinate system. For example, the image position of the rotation axis in the image coordinate system can be obtained by calculating the intersection of the perpendicular bisectors of the lines connecting any two of the three image positions. For instance, the intersection point R( ) of the perpendicular bisectors of line segment AB and line segment BC can be calculated. Figure 3 Image position (x, not shown in the image) R ,y R The image position where the intersection point R is located is the image position corresponding to the rotation axis. It can be understood that the image position corresponding to the rotation axis is also the image position of the intersection point of the rotation axis and the moving plane of the workpiece in the image acquired by the image acquisition device.

[0043] Step S140: Based on the image position corresponding to the rotation axis and the image position corresponding to the field of view center of the image acquisition device, determine the physical position corresponding to the coincidence of the rotation axis and the field of view center, so as to obtain the coincident physical position.

[0044] The rotation axis coinciding with the field of view center of the image acquisition device can mean that the field of view center of the image acquisition device falls on the rotation axis, that is, the field of view center of the image acquisition device coincides with any point on the rotation axis. For example, the field of view center of the image acquisition device can coincide with the rotation center, which can be the intersection point between the rotation axis and the aforementioned moving plane (i.e., the rotation plane), such as the aforementioned intersection point R.

[0045] For example, the image position corresponding to the center of the field of view of the image acquisition device can be represented by the image position (x) corresponding to the center P of any image (e.g., any first image to be tested) acquired by the image acquisition device. P ,y P This is represented by ) based on the image position (x) corresponding to the rotation axis. R ,y R The image position (x) corresponding to the center of the field of view of the image acquisition device.P ,y P This allows us to determine the physical position (X,Y) when the rotation axis coincides with the center of the field of view. This physical position can be called the coincident physical position.

[0046] According to the position calibration method of this invention, multiple first test images of the workpiece to be processed are acquired. For different first test images, the workpiece has different distribution positions in the circumferential direction of the rotation axis. The image position of the rotation axis is determined by using the position of the same identification feature on multiple first test images, and then the physical position corresponding to the rotation axis coinciding with the center of the field of view is determined. This scheme can automatically determine the physical position corresponding to the rotation axis coinciding with the center of the field of view by using visual positioning technology in conjunction with changes in the physical position of the workpiece. This scheme does not require manual intervention, can effectively save manpower, and has high positioning accuracy.

[0047] For example, determining the physical position corresponding to the rotation axis coinciding with the center of the field of view of the image acquisition device, based on the image position corresponding to the rotation axis and the image position corresponding to the center of the field of view of the image acquisition device, to obtain the coincident physical position (step S140), may include: calculating the image position difference between the image position corresponding to the rotation axis and the image position corresponding to the center of the field of view; determining the physical position difference corresponding to the image position difference based on the image position difference and the conversion relationship between the image position and the physical position; and obtaining the physical position corresponding to the workpiece as the coincident physical position after the workpiece moves according to the physical position difference.

[0048] In one embodiment, based on the image position (x) corresponding to the rotation axis R ,y R The image position (x) corresponding to the center of the field of view of the image acquisition device. P ,y P It can calculate the image position (x). R ,y R ) and (x P ,y P The difference in image position between the x-coordinates is Δx = x. R -x P The difference between the ordinates Δy = y R -y PThere is a one-to-one correspondence between the image position of any object described herein and its physical position in the world coordinate system. For example, for an image position (x1, y1), the corresponding physical position (X1, Y1) in the world coordinate system can be obtained according to the transformation relationship. Based on the obtained image position differences Δx and Δy, the corresponding physical position differences δX and δY can also be obtained according to the above transformation relationship. Based on the calculated physical position differences δx and δy, the workpiece can be moved accordingly. The physical position of the moved workpiece can be used as a coincident physical position. The operation of moving the workpiece can be performed manually by the user or automatically by the machining control system. The machining control system can be a machining device for machining the workpiece or other control systems that can be communicatively connected to the machining device, such as a host computer system.

[0049] Furthermore, the embodiments for determining the overlapping physical positions described in this example are merely examples and not limitations on the present invention, which is not limited to this implementation. For instance, after obtaining the corresponding physical position differences δX and δY based on the image position differences Δx and Δy, it is possible to determine the current physical position of the workpiece without moving it, and then add this current physical position to the physical position differences δX and δY to obtain the overlapping physical positions. That is, the overlapping physical positions can be determined directly through an algorithm without additional movement of the workpiece.

[0050] According to the above technical solution, based on the image position difference between the image position corresponding to the rotation axis and the image position corresponding to the field of view center, and the transformation relationship between image position and physical position, the physical position difference corresponding to the image position difference can be determined. Then, after moving the workpiece according to this physical position difference, the physical position corresponding to the workpiece is obtained as the coincident physical position. This method can quickly determine the coincident physical position based on the transformation relationship and in conjunction with the movement of the workpiece. This solution has a relatively simple algorithm and produces relatively accurate results in determining the coincident physical position.

[0051] For example, before determining the physical position difference corresponding to the image position difference based on the image position difference and the conversion relationship between the image position and the physical position, the method may further include: acquiring a plurality of second images to be tested, wherein the plurality of second images to be tested are images acquired by an image acquisition device for the workpiece when the workpiece is in a plurality of different second physical positions, and the number of the plurality of second images to be tested is greater than or equal to three; for each of the plurality of second images to be tested, determining the image position of the identification feature in the second image to be tested according to the template image; and determining the conversion relationship according to the image position of the identification feature in the plurality of second images to be tested and the plurality of second physical positions.

[0052] In one embodiment, the number of multiple second images to be tested is greater than or equal to three. Exemplarily, but not limitingly, the number of multiple second images to be tested is greater than or equal to three and less than or equal to nine. For example, there are a total of nine second images to be tested. These nine second images to be tested can be images acquired by the image acquisition device for the workpiece when it is in nine different second physical positions. The nine different second physical positions K1, K2, ..., K9 can be arbitrary.

[0053] For each of the nine second test images, the image position of the identifier feature in that second test image can be determined based on the acquired template image. This identifier feature can be the same identifier feature used to determine the corresponding image position in the first test image as described above. Determining the image position of the identifier feature in the second test image based on the template image can be achieved as follows: identify a second identifier feature in the second test image that matches the identifier feature in the template image, and determine the image position of the second identifier feature in the second test image as the image position of the identifier feature in that second test image. The implementation scheme for determining the image position of the identifier feature in the second test image is similar to that for determining the image position of the identifier feature in the first test image, and will not be elaborated here.

[0054] Based on the image positions F1, F2, ..., F9 in the nine second test images and their corresponding nine second physical positions K1, K2, ..., K9, a mapping relationship (X) between the coordinates corresponding to the image positions and the coordinates corresponding to the physical positions can be established. K ,Y K )=f(w)(x F ,y F ). (X) K ,Y K (x) represents each of the second physical locations, (x) F ,y F The coordinates () represent the positions of each image. Using the nine determined coordinate points, the f(w) matrix can be calculated, thus establishing the transformation relationship between each image position and its corresponding second physical position. Based on this transformation relationship, the transformation relationship between any image position and its corresponding physical position can be determined.

[0055] According to the above technical solution, the transformation relationship can be determined based on the image positions of the identification features in multiple second test images and the multiple second physical positions of the identification features. This method determines the transformation relationship through multiple image positions and multiple second physical positions; the algorithm is simple and easy to implement.

[0056] For example, multiple different second physical locations are distributed one-to-one in multiple different sub-regions within the movable area of ​​the workpiece to be processed, and the multiple different sub-regions are obtained by uniformly dividing at least a portion of the movable area.

[0057] In one embodiment, for the nine second images to be tested described above, their corresponding nine different second physical locations can be distributed one-to-one within multiple different sub-regions of the movable area of ​​the workpiece. These sub-regions themselves are uniformly distributed throughout the movable area or within at least a portion of the movable area. Exemplarily, but not limitingly, the relative positions of the multiple different second physical locations within their respective sub-regions can be the same, for example, all located at the center point of the corresponding sub-region. The fact that the relative positions of the multiple different second physical locations within their respective sub-regions are the same helps to make the distribution of the second physical locations more uniform. Of course, this is optional; since the multiple sub-regions themselves already have a certain uniform distribution characteristic, the relative positions of any two second physical locations within their respective sub-regions can also be set to be the same or different as needed.

[0058] For example, suppose the movable area of ​​the workpiece to be processed is a rectangular planar region. Within this rectangular planar region or a portion of its central region, the user can select nine arbitrarily uniformly distributed second physical locations K1, K2, ..., K9 to acquire nine second test images. The aforementioned central region can be a square region centered on the center point of the rectangular planar region. The size of this square region can be preset and can be smaller than the rectangular planar region. In one example, the rectangular planar region can be divided into 3 rows and 3 columns, resulting in nine sub-regions. The nine different second physical locations can be distributed within these nine sub-regions. Exemplarily, and not limitingly, the nine different second physical locations can optionally be evenly distributed at the center point of these nine sub-regions. As another example, suppose the movable area of ​​the workpiece to be processed is a circular planar region. Optionally, at least one diameter can be drawn through the center of the circular planar region, each diameter containing two radii. The fan-shaped region enclosed by each pair of adjacent radii and the arc between these two radii can be considered as a sub-region, resulting in multiple sub-regions. Multiple different second physical locations can be distributed one-to-one within multiple different fan-shaped sub-regions. By way of example, and not limitation, multiple different second physical locations may be equidistant from the center of the circle.

[0059] According to the above technical solution, multiple different second physical locations are uniformly distributed within at least a portion of the movable area. This ensures the accuracy of the obtained transformation relationship.

[0060] For example, for each of the plurality of first images to be tested, determining the image position of the identification feature in the first image to be tested according to the template image (step S120) may include: when the workpiece is in any first physical position, in response to a first position determination instruction input by the user on a first user interface, determining the image position of the identification feature in the first image to be tested corresponding to the first physical position according to the template image; and / or, after determining the image position of the identification feature in the first image to be tested according to the template image for each of the plurality of first images to be tested (step S120), or during the process of determining the image position of the identification feature in the first image to be tested according to the template image for each of the plurality of first images to be tested (step S120), method 100 may further include: displaying the image position of the identification feature in the first image to be tested on a second user interface for each of the plurality of first images to be tested.

[0061] Users can input any of the instructions described herein, such as a first position determination instruction, a second position determination instruction described below, and a rotation instruction, into the device (e.g., a host computer system) used to perform the position calibration method 100 via an input device. The input device may include, but is not limited to, one or more of the following: a mouse, keyboard, touchscreen, and microphone. In one embodiment, a visual interface, including a first user interface, can be displayed on a display device. Users can interact with operable controls in the first user interface via a mouse, keyboard, or other means to input the first position determination instruction. For example, a user can input the first position determination instruction by clicking a first operable control in the user interface, which may be displayed as a "match" control on the first user interface. The device used to perform the position calibration method 100 may include the aforementioned input device and / or display device, or may be communicatively connected to the aforementioned input device and / or display device to achieve information transmission.

[0062] When the workpiece is in any first physical position, in response to a first position determination command input by the user, the device for executing the position calibration method 100 can automatically determine the image position of the identification feature in the first test image corresponding to that first physical position based on the template image. For example, when the workpiece is in the first first physical position, the user clicks the first "match" control, and the second user interface can display the image position of the identification feature in the first test image corresponding to the current first physical position, "x = 714.073, y = 371.953". Subsequently, the workpiece can be moved to the second first physical position by manual movement by the user or automatic movement controlled by the processing control system. At this time, the user can click the second "match" control, and the second user interface can display the image position of the identification feature in the first test image corresponding to the current first physical position, "x = 764.729, y = 644.917". Subsequently, the workpiece can be moved to the third first physical position by manual movement by the user or automatic movement controlled by the processing control system. At this point, the user can click the third "Match" control, and the second user interface will display the image position of the identifier feature in the first image under test corresponding to the current first physical position: "x = 1020.233, y = 391.677". Of course, the above method of displaying the image position of the identifier feature in the first image under test is only an example; it can also display the physical position corresponding to the image position of the identifier feature in the first image under test. Alternatively, both positions can be displayed. The first user interface and the second user interface can be the same interface or different interfaces.

[0063] The operation of displaying the image position of the identification feature in any of the first test images in the second user interface can be performed after each image position is determined, as can be understood from the example above. Alternatively, the operation of displaying the image position of the identification feature in any of the first test images in the second user interface can be performed after all steps S120 have been completed.

[0064] According to the above technical solution, based on the user's input instructions, the image position of the identification feature in the first image to be tested corresponding to the first physical position can be automatically determined and displayed in the second user interface. This provides an intuitive user experience, is easy to operate, and offers strong interactivity.

[0065] For example, determining the image position corresponding to the rotation axis by identifying the image position of the feature in a plurality of first images to be tested may include: in response to a second position determination instruction input by a user on a third user interface, determining the image position corresponding to the rotation axis by identifying the image position of the feature in a plurality of first images to be tested.

[0066] The third user interface can be the same user interface as either the first or second user interface, or it can be a different user interface. In one embodiment, after the user determines three different first physical locations, the current user interface can display the image positions of the identifier features in the first test images corresponding to the three first physical locations. At this time, the user can input a second position determination command, and the device for executing the position calibration method 100 can respond to the input of the command and automatically determine the image position corresponding to the rotation axis based on the image positions of the identifier features in the three first test images. The input of the second position determination command can be achieved through interaction with a second operable control within the third user interface. Exemplarily, but not limitingly, the user can input the second position determination command by clicking the second operable control, which is displayed as a "positioned" control in the third user interface.

[0067] According to the above technical solution, the image position corresponding to the rotation axis can be automatically determined based on the second position determination command. This method allows users to initiate the determination of the rotation axis as needed, providing strong user operability and a good user experience.

[0068] For example, acquiring multiple first test images may include performing the following operations in a loop: when the workpiece is in the current first physical position, acquiring the corresponding first test image acquired by the image acquisition device; using the initial physical position as a reference, rotating the workpiece around the rotation axis by a preset angle so that the workpiece is in another first physical position, wherein the initial physical position is any one of multiple different first physical positions; wherein the difference between the rotation angles corresponding to any two adjacent first physical positions is greater than a preset angle threshold.

[0069] The initial physical position is a reference physical position upon which other physical positions can be rotated. The initial physical position can be the first of several different first physical positions (in chronological order of appearance), or it can be a non-first physical position. If the initial physical position is not the first physical position, the physical positions that appear at least before the initial physical position can be determined using algorithms or experience, or other methods. It should be noted that rotating based on the initial physical position is merely an example and not a limitation of the invention; any rotation can also be based on other physical positions, for example, rotating continuously from the previously reached physical position. Regardless of the rotation method used, the difference in rotation angle between any two adjacent first physical positions relative to a fixed physical position (e.g., the aforementioned initial physical position) can be greater than a preset angle threshold.

[0070] In one embodiment, when the workpiece is in its initial physical position or after moving to any physical position, the current position can be used as the current first physical position, and the first first image to be measured can be acquired using an image acquisition device. After acquiring the first first image to be measured, the workpiece can be rotated around the rotation axis by a preset angle, using the current first physical position or the initial physical position as a reference. The physical position of the workpiece after rotating by the preset angle can be used as another first physical position. At the new current first physical position, the second first image to be measured can be acquired using an image acquisition device. The acquisition methods for the remaining physical positions and their corresponding first images to be measured are similar. The preset angle can be any angle greater than a preset angle threshold. The preset angle threshold can be any angle; for example, the preset angle threshold can be in the range of [10, 120]. For example, the preset angle threshold can be equal to 20 degrees, 30 degrees, 60 degrees, 90 degrees, etc. By setting an appropriate preset angle threshold, the distance between different physical positions can be controlled to prevent these physical positions from being too concentrated, which would affect the accuracy of determining the image position corresponding to the rotation axis, and thus affect the calibration accuracy of the position calibration method.

[0071] According to the above technical solution, by using the initial physical position as a reference, the workpiece is rotated around the rotation axis by a preset angle so that the workpiece is in another first physical position. This can better ensure the accuracy of calculating the image position corresponding to the rotation axis through multiple acquired first test images.

[0072] For example, rotating the workpiece around the rotation axis by a preset angle based on the initial physical position so that the workpiece is in another first physical position may include: responding to a rotation command input by the user on a fourth user interface, controlling the workpiece to rotate by a preset angle based on the initial physical position to reach the corresponding first physical position, wherein the rotation command includes the preset angle.

[0073] In one embodiment, the aforementioned visual interface may further include a fourth user interface. The fourth user interface may be the same as or different from any of the first, second, and third user interfaces described above. Based on the initial physical position, the user can input rotation commands through the fourth user interface. The machining control system can automatically control the workpiece to rotate by a preset angle. The position of the workpiece after rotating by the preset angle is another first physical position. The fourth user interface may include an information input control and a third operable control. The user can input a preset angle, such as 70 degrees, in the information input control using a keyboard, etc. After inputting the angle, clicking the third operable control on one side of the information input control, such as displaying a "Confirm" control, will control the workpiece to rotate by the preset angle (70 degrees). Furthermore, the information input control may also be a selection control providing multiple selectable angles, such as 65 degrees, 70 degrees, 75 degrees, etc. The selection control may be a button control, a list control, or a checkbox control, etc. The user can click the button, list item, or checkbox corresponding to the desired rotation angle using a mouse to determine the value of the preset angle.

[0074] According to the above technical solution, based on a fourth user interface, users can intuitively input rotation commands, thereby automatically controlling the rotation of the workpiece to be processed by a preset angle. This method eliminates the need for complex user operations and ensures the accuracy of the preset rotation angle.

[0075] For example, the workpiece to be processed is a wafer, the template image includes the intersection area of ​​two mutually perpendicular dicing lines on the wafer and an area within a preset range around the intersection area, and the identifying feature is the center of the intersection area.

[0076] In one embodiment, the workpiece to be processed can be a wafer. The template image may include the intersection area of ​​two mutually perpendicular dicing lines on the wafer. (See also: [link to relevant documentation]) Figure 2 The image shows a cross-shaped white area, which is part of two mutually perpendicular cutting lines. The intersection area is the region within the rectangle indicated by the dashed line in the middle. Additionally, the template image can also include a region within a preset range surrounding the intersection area (which can be called a preset region), such as... Figure 2 The four gray sub-regions and two cutting paths shown are located outside the intersection region. The preset range is set such that the image features contained within the intersection region and the preset region are sufficient for the image processing algorithm to identify the location of the intersection region and the preset region from the image acquired by the image acquisition device. For example... Figure 2As shown, the image features contained in the intersection region are not obvious and are difficult to distinguish. Therefore, they can be combined with the surrounding preset regions to form sufficiently distinguishable image features, which can help identify the positions of the intersection region and the preset regions. The main purpose is to identify the position of the intersection region and then determine the position of the marker feature. The marker feature can be the center of the intersection region.

[0077] In this embodiment of the invention, multiple first images to be tested contain the same identifier feature. Similarly, multiple second images to be tested also contain the same identifier feature. Any first image to be tested and any second image to be tested also contain the same identifier feature. In step S120, determining the image position of the identifier feature in the first image to be tested can be done by determining the image position of the first identifier feature in the first image to be tested that matches the identifier feature in the template image (see above, this embodiment has been described). Therefore, the first identifier feature in the multiple first images to be tested is the same identifier feature on the workpiece to be processed. Similarly, the second identifier feature in the multiple second images to be tested is the same identifier feature on the workpiece to be processed. Furthermore, the first identifier feature and the second identifier feature are the same identifier feature on the workpiece to be processed.

[0078] In one embodiment, the identifier feature in the template image is a unique feature present on the workpiece. In this case, a first test image or a second test image can be directly acquired for the workpiece, and the position of the identifier feature in the first or second test image can be directly determined based on the template image. In another embodiment, the identifier feature in the template image is a repeating type feature present on the workpiece. This repeating type feature means that it appears multiple times on the workpiece. In this case, N-1 identifier features appearing on the workpiece can be occluded by physical occlusion, retaining only a single identifier feature, where N is the total number of identifier features present on the workpiece. Then, multiple first test images or multiple second test images are acquired for the occluded workpiece. This ensures that the multiple first test images acquired subsequently contain the same identifier feature, thereby ensuring the accuracy of the image position and the overlapping physical position corresponding to the determined rotation axis. Similarly, the above method ensures that the multiple second test images acquired subsequently also contain the same identifier feature, thereby ensuring the accuracy of the determined transformation relationship. The unobstructed marking features corresponding to multiple first test images are consistent with the unobstructed marking features corresponding to multiple second test images. For example, assuming the marking feature is a dicing center, since there are multiple dicings on the wafer in a first direction (e.g., horizontal direction) and also multiple dicings in a direction perpendicular to the first direction (e.g., vertical direction), assuming there are 10 dicings in each direction, there are a total of 100 dicing centers. In this case, 99 of the dicing centers can be obstructed, so that the image acquisition device only acquires the remaining dicing centers each time. Of course, during the process of switching the physical position of the workpiece (first physical position or second physical position), if the movement range of the workpiece is small, some marking features that cannot enter the acquisition range of the image acquisition device may not be obstructed, such as some dicing centers located at the edge of the wafer.

[0079] According to the above technical solution, the center of the dicing track on the wafer is used as an identification feature, which facilitates the subsequent positioning and processing of the dicing track based on the overlapping physical position.

[0080] According to a second aspect of the present invention, a method for determining the position of an image acquisition device for a processing apparatus is also provided. The processing apparatus may include a first image acquisition device and a second image acquisition device. The image acquisition range of the first image acquisition device is larger than that of the second image acquisition device, which can also be understood as the resolution of the first image acquisition device being lower than that of the second image acquisition device. For example, the first image acquisition device can be considered a wide-field-of-view camera, and the second image acquisition device a narrow-field-of-view camera; in other words, the first image acquisition device has a larger acquisition range but lower resolution, while the second image acquisition device has a smaller acquisition range but higher resolution. The first image acquisition device and the second image acquisition device are either of the aforementioned image acquisition devices. Figure 4 A schematic flowchart of an image acquisition device position determination method 400 for a processing apparatus according to an embodiment of the present invention is shown, such as... Figure 4 As shown, the method 400 may include the following steps S410, S420 and S430.

[0081] Step S410: Determine the first physical position corresponding to the point where the field of view center of the first image acquisition device coincides with the rotation axis using the above-described position calibration method.

[0082] Step S420: Determine the second physical position corresponding to the point where the field of view center of the second image acquisition device coincides with the rotation axis using the above-described position calibration method.

[0083] The implementation methods of steps S410 and S420 can be understood by referring to the above description of position calibration method 100. For the sake of brevity, they will not be repeated here.

[0084] Step S430: Determine the physical position difference between the first image acquisition device and the second image acquisition device based on the first physical position and the second physical position.

[0085] For example, based on the determined first physical position and second physical position, the difference between the first physical position and the second physical position can be calculated, thereby obtaining the physical position difference between the first image acquisition device and the second image acquisition device.

[0086] The image acquisition device position determination method for a processing apparatus according to embodiments of the present invention can determine the physical position difference between a first image acquisition device and a second image acquisition device using the position calibration method described above. This method has a simple algorithm and can guarantee the accuracy of the determined physical position difference.

[0087] According to a third aspect of the invention, a processing method is also provided. Figure 5 A schematic flowchart of a processing method 500 according to an embodiment of the present invention is shown, such as... Figure 5As shown, the processing method 500 may include the following steps S510, S520, S530, S540 and S550.

[0088] Step S510: Determine the first physical position difference between the first image acquisition device and the second image acquisition device using the above-described image acquisition device position determination method for the processing device.

[0089] For example, those skilled in the art can understand the implementation of step S510 based on the image acquisition device position determination method 400 for processing apparatus described above. For the sake of brevity, it will not be described again here.

[0090] Step S520: Based on the image position of the first product feature in the first image and the relative positional relationship between the first product feature and the first product feature, determine the initial physical position of the at least one predetermined line, wherein the first image is an image acquired by the first image acquisition device for the workpiece to be processed, and the predetermined line is a feature line on the workpiece to be processed.

[0091] Exemplarily, a first image of the workpiece is acquired using a first image acquisition device with a large field of view. In one embodiment, the first image may include a first product feature of the workpiece. The product feature described herein can be any identifiable feature on the workpiece. Exemplarily, the product feature can be a feature inherent to the workpiece itself, such as a feature of a certain shape or structure. Exemplarily, the product feature can also be a feature additionally marked on the workpiece by manual means or a processing device, such as an easily identifiable symbol, pattern, etc. The product feature can be of any shape, such as a circle, a cross, or a star. Preferably, the product feature is the center of a kerf at a specific location on the workpiece, such as the center of a kerf at the very center of a wafer, which is also the center of the wafer. The predetermined line is any feature line on the workpiece. In one example, the predetermined line can be a kerf on the wafer, and at least one predetermined line is at least one kerf on the wafer. The product feature and the aforementioned identifying feature can be features of the same type or different types, for example, both can be kerf centers, or one can be a kerf center and the other can be a star symbol additionally marked on the workpiece. When product features and identification features are of the same type, they can be the same feature or different features. For example, they can both be the center of the dicing track that coincides with the center of the wafer, or they can be the center of the dicing track at different locations on the wafer.

[0092] Based on the image position of the first product feature and its relative positional relationship with any predetermined line, the initial physical position of the predetermined line can be determined. The relative positional relationship between the first product feature and each predetermined line can be known. The following section combines... Figure 6 An exemplary implementation scheme for determining the initial physical location of a predetermined line is described. Figure 6 A schematic diagram of a first image according to an embodiment of the present invention is shown. Figure 6 As shown, in the first image, a cross-shaped icon marks the location of the wafer center. The center of the cross-shaped icon is the wafer center, which can be considered a first product feature. Furthermore, Figure 6 A predetermined line (e.g., a dicing kerf) is also shown, intersecting the wafer profile at two points, M1 and M2. These two points can be considered the start and end points of the predetermined line. Using the relative positions of the wafer center image position and the image positions of intersections M1 and M2, the initial image positions of M1 and M2 and / or the initial image positions of all points along the entire predetermined line M1M2 can be determined. The initial image positions of the start and end points and / or the initial image positions of all points along the entire predetermined line are then defined as the initial image positions of the predetermined line. Based on the conversion relationship described above, the initial image positions of the predetermined line can be converted into initial physical positions. The initial physical position is a coarsely located physical position, also referred to as a rough physical position.

[0093] Step S530: Based at least on the first physical position difference, determine the second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time, wherein the second product feature is a feature on the second image, the second image is an image acquired by the second image acquisition device for the workpiece to be processed, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed.

[0094] For example, the second image may represent an image captured by a second image acquisition device with a smaller field of view. The second image contains a second product feature. The first product feature and the second product feature correspond to the same feature on the workpiece to be processed. For example, both may be the center of the dicing track at the very center of the wafer, which is also the wafer center. In one example, the first image acquisition device is a wide-field-of-view camera, which can capture a first image containing the entire wafer. Based on the first image captured by the wide-field-of-view camera, the location of the wafer center can only be roughly determined. That is, due to resolution and other issues, the wafer center cannot be accurately identified, and therefore the location of the dicing track center that coincides with the wafer center cannot be accurately identified. The second image acquisition device may be a small-field-of-view camera, which can capture a clearer dicing track center within its field of view. A preferable approach is to set the field of view (i.e., image acquisition range) of the small-field-of-view camera to capture only a single kerf center at a time, placing the kerf center coinciding with the wafer center within the small-field-of-view camera's field of view. Alternatively, the influence of other kerf centers can be eliminated by occluding those coinciding with the wafer center, ensuring that the second image captured by the small-field-of-view camera only contains the kerf center coinciding with the wafer center. Based on the second image captured by the small-field-of-view camera, the location of the kerf center coinciding with the wafer center can be identified. Therefore, the first product feature captured by the large-field-of-view camera, or identified from the first image, is a relatively coarse wafer center, while the second product feature captured by the small-field-of-view camera, or identified from the second image, is a more precise kerf center coinciding with the wafer center, i.e., a more precise wafer center. It is evident that the first product feature and the second product feature essentially correspond to the same feature. The difference lies in the resolution of the images acquired by the two image acquisition devices, leading to a difference in their corresponding image positions. Furthermore, there is a difference in their physical positions at the same moment (referred to as the calibration moment in this paper) (i.e., the second physical position difference). Detecting this difference allows us to determine the "error" in the initial physical position of any predetermined line determined based on the first image. Correcting the initial physical position based on this "error" allows us to consider the corrected physical position as the precise physical position of the current predetermined line, i.e., the target physical position.

[0095] Step S540: Determine the target physical position of at least one predetermined line based on the difference between the initial physical position and the second physical position.

[0096] As described above, the initial physical position of the predetermined line is corrected based on the second physical position difference to obtain the target physical position. The correction can be achieved by shifting the initial physical position by the distance corresponding to the second physical position difference. The shifted physical position can then be used as the target physical position.

[0097] Step S550: The workpiece is processed based on the target physical location of at least one predetermined line.

[0098] For example, the workpiece can be processed based on the target physical position of the predetermined line. In one embodiment, the workpiece can be processed directly based on the target physical position of the predetermined line. For instance, the workpiece can be moved to the target physical position corresponding to the start point of a cutting spur and processing can begin. During processing, the workpiece moves in real time until it reaches the target physical position corresponding to the end point of the cutting spur, thus completing the processing of that cutting spur. In another embodiment, the workpiece can be processed further in conjunction with other information. For instance, a processing area can be determined based on the target physical position of any cutting spur according to user requirements, and processing can be performed when the workpiece moves into the processing area. For example, the processing start point and processing end point of the processing area corresponding to any cutting spur can be set to appear at positions earlier than the start and end points of that cutting spur, respectively.

[0099] According to the processing method of this invention, a first image containing a first product feature is acquired by a first image acquisition device with a larger field of view. The first product feature allows for a rough positioning of the physical location corresponding to a predetermined line. Furthermore, a second image containing a second product feature is acquired by a second image acquisition device with a smaller field of view. The first and second product features correspond to the same feature on the workpiece to be processed. Therefore, the positional difference between the second and first product features can be used to determine the error in the rough positioning of the predetermined line, thereby enabling more precise positioning of the predetermined line. This approach, through the cooperation of two image acquisition devices with different fields of view, achieves high-precision positioning of products of different sizes (especially large-sized products).

[0100] For example, before processing the workpiece at a target physical location based on at least one predetermined line, the method may further include: acquiring multiple sets of images of predetermined lines to be measured, each set of images being images acquired by a third image acquisition device for the current predetermined line on the workpiece as the workpiece moves along a preset reference direction; and determining multiple sets of position points based on the multiple sets of images of predetermined lines to be measured, and sequentially corresponding to reference position points, each set of position points including a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point and along the preset reference direction, the multiple sets of position points... The spacing between the two position points contained in each set point gradually increases. The multiple sets of pre-defined line images to be measured correspond one-to-one with the multiple sets of position points. Each set of pre-defined line images to be measured includes two pre-defined line images to be measured that correspond to the first position point and the second position point in the corresponding set of position points, respectively. After each set of position points is determined, the position of the workpiece to be processed is adjusted according to the angle of the line connecting the first position point and the second position point in the set of position points relative to the preset reference direction, so as to correct the position of the current pre-defined line on the workpiece to be processed. Among the reference position point and the multiple sets of position points, different position points are position points corresponding to different feature points on the current pre-defined line.

[0101] Before machining the workpiece, the direction of the predetermined lines on the workpiece can be corrected so that the corrected predetermined lines are parallel to a preset reference direction, facilitating machining. The preset reference direction can be set as needed, and it can be, for example, the horizontal direction where the X-axis is located, as mentioned above.

[0102] In one embodiment, an image of the predetermined line to be measured, containing any predetermined line (referred to as the current predetermined line), can be acquired by an image acquisition device (which may be called the third image acquisition device). This image acquisition device can be any image acquisition device; preferably, it can be the same as the second image acquisition device described above, meaning the third image acquisition device can also be the aforementioned small-field-of-view camera.

[0103] The image of the predetermined line to be tested can be an image containing any number of predetermined lines. For example, each set of images of the predetermined line to be tested can be an image acquired by a third image acquisition device for the predetermined line on the wafer as the wafer moves along a preset reference direction. The preset reference direction can be any direction, such as horizontal or vertical. For ease of description and understanding, the embodiments described below are all described with the preset reference direction being horizontal. Each set of images of the predetermined line to be tested can be a static image or any video frame in a dynamic video. The image of the predetermined line to be tested can be the original image acquired by the third image acquisition device, or it can be an image obtained after preprocessing (such as digitization, normalization, smoothing, etc.) the original image acquired by the third image acquisition device. It can be understood that the preprocessing of the original image can include the operation of extracting sub-images containing the predetermined lines to be tested from the original image acquired by the third image acquisition device to obtain multiple sets of images of the predetermined line to be tested.

[0104] Based on multiple sets of images of the predetermined lines to be tested, and based on reference position points, multiple sets of position points are sequentially determined. Among the reference position points and the multiple sets of position points, different position points correspond to different feature points on the predetermined lines. Feature points can be any identifiable feature point on the workpiece to be processed. For example, feature points can be feature points inherent to the workpiece itself, or feature points additionally marked on the workpiece, for example, manually or by a processing device. In one example, a feature point can be the center of a dicing track. Different feature points can be the centers of dicing tracks at different locations on the wafer. The position point corresponding to any feature point can be the image position point corresponding to that feature point in the aforementioned image coordinate system, or the physical position point corresponding to that feature point in the aforementioned world coordinate system.

[0105] For example, Figure 7 A cut track image according to an embodiment of the present invention is shown. The reference position point can be represented by an image position point (i.e., an image position) or a physical position point (i.e., a physical position) corresponding to the center of the cut tracks contained in the first and second cut tracks. A first set of images of the predetermined line to be tested may include a first image of the predetermined line to be tested and a second image of the predetermined line to be tested. The first image of the predetermined line to be tested may include at least the following: Figure 7 The dashed area on the left side of the image represents the image captured by the third image acquisition device at the intersection of the first and third dicing trajectories as the wafer moves horizontally to the right from the reference position. The second predetermined line image may include at least the following: Figure 7The dashed area on the right side of the image represents the image captured by the third image acquisition device at the intersection of the first and fourth dicing trajectories as the wafer moves horizontally to the left from the reference position. Therefore, by moving horizontally to both sides based on the reference position, a first set of images of the predetermined test line can be acquired, and then the first position point A1 and the second position point A2 can be determined based on these images. The first position point A1 can be an image position point or a physical position point corresponding to the center of the dicing trajectories included in the first and third dicing trajectories. The second position point A2 can be an image position point or a physical position point corresponding to the center of the dicing trajectories included in the first and fourth dicing trajectories. Similarly, multiple sets of position points B1B2, C1C2, etc., can be determined sequentially, and each set of position points can contain both the first and second position points. Along the horizontal direction, the distance between the two position points contained in each set of position points gradually increases. That is, the distance between C1C2 is greater than the distance between B1B2. For example, the number of multiple sets of images of the predetermined line to be tested is the same as the number of multiple sets of location points, and the multiple sets of images of the predetermined line to be tested correspond one-to-one with the multiple sets of location points.

[0106] For example, after each set of location points is determined, the following operations can be performed to correct the position of predetermined lines on the wafer. For instance, after determining the first set of location points, the wafer position can be adjusted based on the angle of the line connecting the first location point A1 and the second location point A2 in that set relative to the horizontal direction. If the line connecting the first location point A1 and the second location point A2 is tilted counterclockwise by 2 degrees relative to the horizontal direction, the wafer can be rotated clockwise by 2 degrees so that the line connecting the first location point A1 and the second location point A2 on the wafer coincides with the horizontal direction. This corrects the predetermined lines to tend to be parallel to a preset reference direction. It can be understood that by adjusting the workpiece, the direction of all predetermined lines on it can be corrected.

[0107] According to the above technical solution, multiple sets of position points are determined. The position of the workpiece is adjusted by the angle between the line connecting two position points in each set and the line connecting them relative to a preset reference direction, thereby correcting the position of the predetermined line on the workpiece. By setting multiple sets of position points, high-precision positioning of the predetermined line on the workpiece can be achieved within a wide range.

[0108] According to the above technical solution, the target physical position corresponding to at least one predetermined line on the workpiece can be corrected based on the angle of the line connecting the first and second position points in each group of position points relative to the preset reference direction. This method does not require complex calculations and is simple and easy to implement.

[0109] According to a fourth aspect of the present invention, a position calibration device is also provided. Figure 8A schematic block diagram of a position calibration device 800 according to an embodiment of the present invention is shown. Figure 8 As shown, the device 800 may include an acquisition module 810, a first determination module 820, a second determination module 830, and a third determination module 840.

[0110] The acquisition module 810 can be used to acquire a template image and multiple first test images. The template image contains the identification features on the workpiece to be processed. The multiple first test images are images acquired by the image acquisition device for the workpiece when the workpiece is in multiple different first physical positions. The number of multiple first test images is greater than or equal to 3. The multiple different first physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis of the workpiece.

[0111] The first determining module 820 can be used to determine the image position of the identification feature in each of a plurality of first images to be tested, based on a template image.

[0112] The second determining module 830 can be used to determine the image position corresponding to the rotation axis by identifying the image position of the feature in multiple first images to be tested.

[0113] The third determining module 840 can be used to determine the physical position corresponding to the coincidence of the rotation axis and the field of view center of the image acquisition device based on the image position corresponding to the rotation axis and the image position corresponding to the field of view center of the image acquisition device, so as to obtain the coincident physical position.

[0114] According to a fifth aspect of the present invention, an electronic device is also provided. Figure 9 A schematic block diagram of an electronic device 900 according to an embodiment of the present invention is shown, such as... Figure 9 As shown, the electronic device 900 may include a processor 910 and a memory 920. The memory 920 stores a computer program, and the processor 910 executes the computer program to implement the aforementioned position calibration method, the aforementioned image acquisition device position determination method for a processing apparatus, or the aforementioned processing method.

[0115] According to a sixth aspect of the present invention, a storage medium is also provided. Program instructions are stored on the storage medium, which, when executed, are used to perform the position calibration method described above, the image acquisition device position determination method for the processing apparatus described above, or the processing method described above. The storage medium may, for example, include a storage component of a tablet computer, a hard disk of a personal computer, a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a portable compact disc read-only memory (CD-ROM), a USB memory, or any combination of the above storage media. The computer-readable storage medium may be any combination of one or more computer-readable storage media.

[0116] It is understood that the "points" described in this invention, such as location points and feature points, correspond to a "region" when the corresponding image is magnified. Figure 7 The center of the cutting path where the first and second cutting paths intersect, as shown above, is described as an "image location point," but from... Figure 7 As can be seen in the illustration, what is shown is a "region". Here, a "region" can be an image area composed of a single pixel or multiple pixels in the image.

[0117] Those skilled in the art can understand the specific implementation schemes and beneficial effects of the above-mentioned position calibration device, electronic device and storage medium by reading the relevant description of the position calibration method. For the sake of brevity, they will not be described in detail here.

[0118] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of the invention. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of the invention. All such changes and modifications are intended to be included within the scope of the invention as claimed in the appended claims.

[0119] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0120] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed.

[0121] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0122] Similarly, it should be understood that, in order to streamline the invention and aid in understanding one or more of the various aspects of the invention, features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention. However, this approach should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, its inventive point lies in solving the corresponding technical problem with fewer features than all of those in a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of the invention.

[0123] Those skilled in the art will understand that, apart from the mutual exclusion of features, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus so disclosed can be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0124] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0125] The various component embodiments of the present invention can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that microprocessors or digital signal processors (DSPs) can be used in practice to implement some or all of the functions of some modules in the position calibration device according to embodiments of the present invention. The present invention can also be implemented as a device program (e.g., a computer program and computer program product) for performing part or all of the methods described herein. Such programs implementing the present invention can be stored on a computer-readable medium or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0126] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0127] The above description is merely a specific embodiment of the present invention or an explanation of that embodiment. The scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A position calibration method, characterized in that, include: Acquire a template image and multiple first test images, wherein the template image contains identification features on the workpiece to be processed, and the multiple first test images are images acquired by the image acquisition device for the workpiece to be processed when the workpiece to be processed is in multiple different first physical positions, the number of the multiple first test images is greater than or equal to 3, and the multiple different first physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis of the workpiece to be processed; For each of the plurality of first images to be tested, the image position of the identification feature in the first image to be tested is determined according to the template image; The image position corresponding to the rotation axis is determined by using the image position of the identification feature in the plurality of first images to be tested; Based on the image position corresponding to the rotation axis and the image position corresponding to the field of view center of the image acquisition device, determine the physical position corresponding to the coincidence of the rotation axis and the field of view center, so as to obtain the coincident physical position; The step of determining the physical position corresponding to the coincidence of the rotation axis and the field of view center of the image acquisition device based on the image position corresponding to the rotation axis and the image position corresponding to the field of view center of the image acquisition device, to obtain the coincident physical position, includes: Calculate the image position difference between the image position corresponding to the rotation axis and the image position corresponding to the center of the field of view; Based on the image position difference and the conversion relationship between image position and physical position, the physical position difference corresponding to the image position difference is determined; After the workpiece to be processed moves according to the physical position difference, the physical position corresponding to the workpiece to be processed is obtained as the coincident physical position.

2. The method according to claim 1, wherein, Before determining the physical location difference corresponding to the image location difference based on the image location difference and the conversion relationship between image location and physical location, the method further includes: Acquire multiple second images to be tested, wherein the multiple second images to be tested are images acquired by the image acquisition device for the workpiece when the workpiece is in multiple different second physical positions, and the number of the multiple second images to be tested is greater than or equal to 3; For each of the plurality of second images to be tested, the image position of the identification feature in the second image to be tested is determined according to the template image; The transformation relationship is determined based on the image position of the identification features in the plurality of second test images and the plurality of second physical positions.

3. The method according to claim 2, wherein, The multiple different second physical locations are distributed one-to-one in multiple different sub-regions within the movable area of ​​the workpiece to be processed, and the multiple different sub-regions are obtained by uniformly dividing at least a portion of the movable area.

4. The method according to any one of claims 1-3, wherein, For each of the plurality of first test images, determining the image position of the identifier feature in that first test image based on the template image includes: When the workpiece is in any first physical position, in response to a first position determination command input by the user on a first user interface, the image position of the identification feature in a first test image corresponding to the first physical position is determined according to the template image; and / or, After determining the image position of the identification feature in each of the plurality of first test images based on the template image, or during the process of determining the image position of the identification feature in each of the plurality of first test images based on the template image, the method further includes: For each of the plurality of first images to be tested, the image position of the identification feature in that first image to be tested is displayed on the second user interface.

5. The method according to any one of claims 1-3, wherein, Determining the image position corresponding to the rotation axis by using the identification features in the image positions of the plurality of first images to be tested includes: In response to a second position determination command input by the user on a third user interface, the image position corresponding to the rotation axis is determined by the image position of the plurality of first images to be tested based on the identification features.

6. The method according to any one of claims 1-3, wherein, Acquiring multiple first test images includes: Perform the following operations in a loop: When the workpiece is in its current first physical position, the corresponding first image to be tested is acquired by the image acquisition device; Using the initial physical position as a reference, the workpiece to be processed is rotated around the rotation axis by a preset angle so that the workpiece to be processed is in another first physical position, wherein the initial physical position is any one of the plurality of different first physical positions; Among them, the difference in rotation angles between any two adjacent first physical positions is greater than a preset angle threshold.

7. The method according to claim 6, wherein, The step of rotating the workpiece around the rotation axis by a preset angle, based on the initial physical position, to place the workpiece in another first physical position, includes: In response to a rotation command input by the user on a fourth user interface, the workpiece to be processed is controlled to rotate by the preset angle based on the initial physical position to reach the corresponding first physical position, wherein the rotation command includes the preset angle.

8. The method according to any one of claims 1-3, wherein, The workpiece to be processed is a wafer, the template image includes the intersection area of ​​two mutually perpendicular dicing lines on the wafer and an area within a preset range around the intersection area, and the marking feature is the center of the intersection area.

9. A method for determining the position of an image acquisition device in a processing apparatus, characterized in that, The processing apparatus includes a first image acquisition device and a second image acquisition device, wherein the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, and the first image acquisition device and the second image acquisition device are respectively the image acquisition devices according to any one of claims 1-8, and the method includes: The first physical position corresponding to the coincidence of the field of view center of the first image acquisition device with the rotation axis is determined by the position calibration method as described in any one of claims 1-8; The second physical position corresponding to the coincidence of the field of view center of the second image acquisition device with the rotation axis is determined by the position calibration method as described in any one of claims 1-8; The physical position difference between the first image acquisition device and the second image acquisition device is determined based on the first physical position and the second physical position.

10. A processing method, characterized in that, include: The first physical position difference between the first image acquisition device and the second image acquisition device is determined by the image acquisition device position determination method for a processing apparatus as described in claim 9; Based on the image position of the first product feature in the first image and the relative positional relationship between at least one predetermined line and the first product feature, the initial physical position of the at least one predetermined line is determined, wherein the first image is an image acquired by the first image acquisition device for the workpiece to be processed, and the predetermined line is a feature line on the workpiece to be processed; Based at least on the first physical position difference, a second physical position difference is determined between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time, wherein the second product feature is a feature on the second image, the second image is an image acquired by the second image acquisition device for the workpiece to be processed, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed; The target physical position of the at least one predetermined line is determined based on the initial physical position and the difference between the second physical position; The workpiece is processed based on the target physical location at least based on the at least one predetermined line.

11. The method according to claim 10, wherein, Before processing the workpiece at the target physical location based at least on the at least one predetermined line, the method further includes: Acquire multiple sets of images of the predetermined line to be tested, each set of images of the predetermined line to be tested being an image acquired by the third image acquisition device for the current predetermined line on the workpiece as the workpiece moves along a preset reference direction. Based on the multiple sets of pre-line images to be tested, and based on the reference position points, multiple sets of position points are sequentially determined. Each set of position points includes a first position point and a second position point. The first position point and the second position point are located on both sides of the reference position point. Along the preset reference direction, the distance between the two position points contained in each of the multiple sets of position points gradually increases. The multiple sets of pre-line images to be tested correspond one-to-one with the multiple sets of position points. Any set of pre-line images to be tested includes two pre-line images to be tested that correspond to the first position point and the second position point in the corresponding set of position points, respectively. After determining a set of position points each time, the position of the workpiece is adjusted according to the angle of the line connecting the first and second position points in the set of position points relative to the preset reference direction, so as to correct the position of the current predetermined line on the workpiece. Among the reference position point and the multiple sets of position points, the different position points are the position points corresponding to different feature points on the current predetermined line.

12. A position calibration device, characterized in that, include: The acquisition module is used to acquire a template image and multiple first test images, wherein the template image contains identification features on the workpiece to be processed, and the multiple first test images are images acquired by the image acquisition device for the workpiece to be processed when the workpiece to be processed is in multiple different first physical positions. The number of the multiple first test images is greater than or equal to 3, and the multiple different first physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis of the workpiece to be processed. The first determining module is used to determine the image position of the identification feature in each of the plurality of first images to be tested, based on the template image; The second determining module is used to determine the image position corresponding to the rotation axis by using the image position of the identification feature in the plurality of first images to be tested; The third determining module is used to determine the physical position when the rotation axis coincides with the field of view center based on the image position corresponding to the rotation axis and the image position corresponding to the field of view center of the image acquisition device, so as to obtain the coincident physical position; The third determining module specifically includes: The calculation submodule is used to calculate the image position difference between the image position corresponding to the rotation axis and the image position corresponding to the field of view center; The determination submodule is used to determine the physical position difference corresponding to the image position difference based on the image position difference and the conversion relationship between image position and physical position; The acquisition submodule is used to acquire the physical position corresponding to the workpiece to be processed as the coincident physical position after the workpiece to be processed has moved according to the physical position difference.

13. An electronic device comprising a processor and a memory, characterized in that, The memory stores a computer program, and the processor executes the computer program to implement the position calibration method as described in any one of claims 1-8, or the image acquisition device position determination method for a processing apparatus as described in claim 9, or the processing method as described in claim 10 or 11.

14. A storage medium storing a computer program / instructions, characterized in that, When the computer program / instruction is executed by the processor, it implements the position calibration method as described in any one of claims 1-8, the image acquisition device position determination method for a processing apparatus as described in claim 9, or the processing method as described in claim 10 or 11.

Images