Electronic device

Abstract

The application discloses an electronic device, which comprises an antenna radiator, a first grounding point, a first feeding point, a second feeding point, a first antenna, a second antenna, a metal decoration part and a first impedance circuit.

Description

Technical Field

[0001] This application belongs to the field of radio frequency technology, and specifically relates to an electronic device. Background Technology

[0002] With the continuous development of mobile communication technology and the arrival of the new communication era, people are experiencing increasingly faster and better data transmission rates in their daily lives. Of course, all these improvements are inseparable from the enhancement of design capabilities in the field of communication, with the design of antennas on a larger scale, in greater numbers, and across more frequency bands being of paramount importance.

[0003] With the increasing use of more and more frequency bands, the number of antennas in electronic devices is rapidly increasing. Simultaneously, larger camera sizes and the adoption of full-screen and curved screens are further reducing the space available for antennas. This leads to narrower bandwidth due to deteriorated antenna space. Currently, to improve bandwidth, efforts are typically made to optimize antenna space during the design of electronic devices, including increasing antenna clearance and adjusting antenna placement, depending on the operating mode of the antennas used. However, with an increased number of antennas, antennas with the same or similar frequencies become very close together, resulting in severely degraded isolation. Currently, improving antenna isolation usually involves increasing the isolation ground, i.e., increasing the antenna distance. However, the space within current electronic devices is already compressed to its limits, making further optimization difficult without affecting the aesthetic design. Summary of the Invention

[0004] This application aims to provide an electronic device that solves the problem of mutual interference between different antennas without affecting the internal space of the electronic device.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application also proposes an electronic device, including: an antenna radiator, wherein the antenna radiator is provided with a first ground point, a first feed point is connected between a first end of the antenna radiator and the first ground point, a second feed point is connected between a second end of the antenna radiator and the first ground point, the portion of the antenna radiator between the first end and the first feed point forms a first antenna, and the portion of the antenna radiator between the second end and the second feed point forms a second antenna, wherein the second antenna operates at the same or similar frequency band as the first antenna;

[0007] A metal decorative component, wherein a second grounding point is provided on the metal decorative component;

[0008] A first impedance circuit, wherein a first end of the first impedance circuit is electrically connected to the first grounding point, and a second end is electrically connected to the second grounding point.

[0009] In the embodiments of this application, a first grounding point is provided on the antenna radiator, and a first feed point is connected between the first end of the antenna radiator and the first grounding point. A second feed point is connected between the second end of the antenna radiator and the first grounding point. The portion between the first end of the antenna radiator and the first feed point forms a first antenna, and the portion between the second end of the antenna radiator and the second feed point forms a second antenna. A second grounding point is provided on the metal decorative part and electrically connected to the first grounding point through a first impedance circuit. This causes the first impedance circuit to exhibit bandpass characteristics within the required frequency band, thereby exciting a more obvious current mode on the metal decorative part. This forms an effect similar to adding a wider and thicker ground plane between the first antenna and the second antenna. Without affecting the internal space of the electronic device, the isolation between antennas of the same or similar frequencies is improved, and the performance of the corresponding antennas is enhanced.

[0010] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0011] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0012] Figure 1 This is a schematic diagram of an electronic device provided according to an embodiment of this application;

[0013] Figure 2 This is a cross-sectional view of an electronic device provided according to an embodiment of this application;

[0014] Figure 3 This is one of the schematic diagrams illustrating the improved effect of an electronic device according to an embodiment of this application;

[0015] Figure 4 This is a second schematic diagram illustrating the improved effect of an electronic device according to an embodiment of this application;

[0016] Figure 5 This is the third schematic diagram illustrating the improved effect of an electronic device according to an embodiment of this application;

[0017] Figure 6 This is a schematic diagram of an electronic device according to another embodiment of this application;

[0018] Figure 7 This is a cross-sectional view of an electronic device provided according to another embodiment of this application;

[0019] Figure 8 This is one of the schematic diagrams illustrating the improved effect of an electronic device according to another embodiment of this application;

[0020] Figure 9 This is a second schematic diagram illustrating the improved effect of an electronic device according to another embodiment of this application;

[0021] Figure 10 This is the third schematic diagram showing the improved effect of an electronic device according to another embodiment of this application;

[0022] Figure 11 This is the fourth schematic diagram illustrating the improved effect of an electronic device according to another embodiment of this application;

[0023] Figure 12 This is a schematic diagram of a first impedance circuit provided according to an embodiment of this application;

[0024] Figure 13 This is a second schematic diagram of a first impedance circuit provided according to an embodiment of this application;

[0025] Figure 14 This is a third schematic diagram of a first impedance circuit provided according to an embodiment of this application;

[0026] Figure 15 This is one of the schematic diagrams of a second impedance circuit provided according to an embodiment of this application;

[0027] Figure 16 This is a second schematic diagram of a second impedance circuit provided according to an embodiment of this application;

[0028] Figure 17 This is a schematic diagram of an electronic device according to yet another embodiment of this application;

[0029] Figure label:

[0030] 10. Antenna radiator; 100. First antenna; 101. Metal main body; 102. Solid connecting piece; 11. First seam; 12. Second seam; 13. Third seam; 20. Metal decorative piece; 21. Second via; 22. Bottom surface trace; 23. Third grounding spring; 24. Feed spring; 25. Convex bulge; 200. Second antenna; 201. Fourth capacitor unit; 202. Fifth capacitor unit; 203. Sixth capacitor unit; 204. Seventh capacitor unit; 30. First impedance circuit; 301. First impedance capacitor; 302. First impedance inductor; 3 03. Second impedance capacitor; 310. First grounding spring; 311. Circuit wire; 312. Second grounding spring; 313. Locking screw; 314. Steel sheet; 40. Camera module setting area; 50. First capacitor; 501. First capacitor unit; 502. Second capacitor unit; 503. Third capacitor unit; 60. Main board; 600. Clearance area; 601. Copper pour area; 602. First via; 70. Second impedance circuit; 701. Second impedance inductor; 702. Third impedance capacitor; 703. Fourth impedance capacitor; 80. RF cable; 90. RF socket. Detailed Implementation

[0031] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] The following is combined Figures 1 to 2The electronic device described in the embodiments of this application can be a smartphone, game console, tablet computer, e-book reader, or wearable device. Of course, the electronic device can also be other devices, and the embodiments of this invention do not limit this.

[0035] Taking a mobile phone as an example, the electronic device includes: an antenna radiator 10, a metal decorative part 20, and a first impedance circuit 30.

[0036] In this embodiment, the outer casing frame is provided with a first slit 11, a second slit 12, and a third slit 13. The first slit 11 and the second slit 12 on the outer casing frame constitute an antenna radiator 10, and the second slit 12 and the third slit 13 on the outer casing frame constitute another antenna radiator 10. One antenna radiator 10 has a first grounding point A, and a first feed point B is connected between the first end C of the antenna radiator 10 and the first grounding point A; that is, a first feed point B is provided between points A and C of the antenna radiator 10. The second end E of the antenna radiator is connected between the first grounding point A and the second feed point D; that is, a second feed point D is provided between points A and E of the antenna radiator 10. The portion of the antenna radiator 10 between the first end C and the first feed point B forms a first antenna 100, and the portion of the antenna radiator 10 between the second end E and the second feed point D forms a second antenna 200. That is, the antenna radiator 10 is equipped with both a first antenna 100 and a second antenna 200, and the first antenna 100 and the second antenna 200 share a first grounding point A, and have a first feed point B corresponding to the first antenna 100 and a second feed point D corresponding to the second antenna. At the same time, the second antenna 200 operates in the same or similar frequency band as the first antenna 100.

[0037] The metal decorative part 20 is a decorative ring corresponding to the camera module setting area 40 or other components. The metal decorative part 20 is provided with a second grounding point and a third grounding point. The first impedance circuit 30 is an adjustable matching topology. The first end of the first impedance circuit 30 is electrically connected to the first grounding point A, the second end of the first impedance circuit 30 is electrically connected to the second grounding point, and the third grounding point on the metal decorative part 20 is grounded. Here, the first impedance circuit 30 can be a capacitor or an LC series-parallel device. By adjusting the device value of the first impedance circuit 30, the first impedance circuit 30 can exhibit bandpass characteristics within the required frequency band range. This allows a more obvious current mode to be excited on the metal decorative part 20, thereby forming an effect similar to adding a wider and thicker ground plane between the first antenna 100 and the second antenna 200, improving the isolation between the first antenna 100 and the second antenna 200, and enhancing the performance of the corresponding antennas.

[0038] Specifically, in this embodiment, the metal decorative component 20 has five grounding points: G1, G2, G3, G4, and G5. G1 is the second grounding point, and G2, G3, G4, and G5 are all third grounding points. The first grounding point A is electrically connected to the metal decorative component 20 through the first impedance circuit 30 and the second grounding point G1, while some or all of the third grounding points (G2, G3, G4, and G5) on the metal decorative component 20 are directly grounded. During use, by adjusting the impedance value of the first impedance circuit 30, the surface current excitation of the metal decorative component 20 is significantly increased, thereby forming a current barrier such as G3-A-G1-G2, improving the isolation between the first antenna 100 and the second antenna 200, and enhancing the performance of the corresponding antennas.

[0039] In the embodiments of this application, a first grounding point is provided on the antenna radiator, and a first feed point is connected between the first end of the antenna radiator and the first grounding point. A second feed point is connected between the second end of the antenna radiator and the first grounding point. The portion between the first end of the antenna radiator and the first feed point forms a first antenna, and the portion between the second end of the antenna radiator and the second feed point forms a second antenna. A second grounding point is provided on the metal decorative part, which is electrically connected to the first grounding point through a first impedance circuit, and a third grounding point is provided that is directly grounded. This makes the first impedance circuit exhibit bandpass characteristics within the required frequency band, thereby exciting a more obvious current mode on the metal decorative part. This forms an effect similar to adding a wider and thicker ground plane between the first antenna and the second antenna. Without affecting the internal space of the electronic device, the isolation between antennas of the same or similar frequencies is improved, and the performance of the corresponding antennas is enhanced.

[0040] In one specific embodiment, the first antenna 100 is a Wireless Fidelity (WiFi) 2.4G antenna, with its feed point located at the first feed point B. A solid frame connecting piece, approximately 5mm wide and AC length approximately 16mm, is located at the first ground point A. The second antenna 200 is a WiFi 2.4G antenna, with its feed point located at the second feed point D and AE length approximately 16mm. Without considering the influence of other antenna layouts on this embodiment, solid connecting pieces F, H, J, and K are provided, considering only the back-to-back antennas, the first antenna 100 and the second antenna 200, on the antenna radiator 1. The metal decorative piece 20 is made of aluminum alloy, and its distance L1 from the antenna radiator 10 is approximately 3mm. The metal decorative piece 20 is generally located close to the antenna area.

[0041] The traditional electronic device design is as follows: G1, G2, G3, G4, and G5 are all connected to the metal decorative piece 20, and G1, G2, G3, G4, and G5 are all grounded through the motherboard 60. For back-to-back antennas with antenna radiators at the same or similar frequencies, the isolation between the antennas is a key concern. Before optimization, the isolation between the first antenna 100 and the second antenna 200 is only -7.3dB. For example... Figure 3 As shown, by adjusting the component values ​​of the first impedance circuit 30, the first grounding point A is electrically connected to the second grounding point G1 and the metal decorative part 20 through the first impedance circuit 30, while some or all of the third grounding points (G2, G3, G4, and G5) on the metal decorative part 20 are directly grounded. At this time, the isolation between the first antenna 100 and the second antenna 200 can be optimized from -7.3dB to -12.6dB, and the contributions to the performance of the first antenna 100 and the second antenna 200 are as follows: Figure 4 and Figure 5 As shown, the performance of the first antenna 100 is improved by 0.36dB, and the performance of the second antenna 200 is improved by 0.04dB.

[0042] In one example provided in this application, such as Figure 6 and Figure 7 As shown, the electronic device also includes a first capacitor 50. The first terminal of the first capacitor 50 is grounded, and the second terminal of the first capacitor 50 is electrically connected to the first terminal of the first impedance circuit 30.

[0043] The antenna radiator 10 is still provided with a first antenna 100 and a second antenna 200, and a first grounding point A is provided between the first antenna 100 and the second antenna 200. The first grounding point A is grounded through a first capacitor 50, and the first grounding point A is electrically connected to the second grounding point G1 through a first impedance circuit 30.

[0044] In this embodiment, the antenna radiator 10 is not a solid conductor and is suspended. As the sensing element of the Specific Absorption Rate (SAR) sensor, the first grounding point A is grounded through the first capacitor 50, and simultaneously electrically connected to the second grounding point G1 through the first impedance circuit 30. Thus, this electronic device not only functions as a sensing element but also, by setting the first impedance circuit 30, excites a relatively obvious current pattern on the metal decorative part 20, thereby creating an effect similar to adding a wider and thicker ground plane between the first antenna 100 and the second antenna 200. This improves the isolation between the first antenna 100 and the second antenna 200 and enhances the performance of the corresponding antennas.

[0045] As an inductor, the antenna radiator 10 is relatively close to the metal decorative piece 20 at a distance L1. In order to ensure the current, in this embodiment, the antenna radiator 10 is provided with at least two first grounding points. The first end C of the antenna radiator 10 is connected to the nearest first grounding point with a first feed point B, and the second end E of the antenna radiator 10 is connected to the nearest first grounding point with a second feed point D.

[0046] Accordingly, at least two first impedance circuits 30 and first capacitors 50 are provided respectively, with the first end of each first capacitor 50 grounded and the second end of each first capacitor 50 electrically connected to the first end of the corresponding first impedance circuit 30.

[0047] Specifically, the antenna radiator 10 has three first grounding points: A, M, and N. Correspondingly, three first capacitors 50 are provided: a first capacitor unit 501, a second capacitor unit 502, and a third capacitor unit 503. Simultaneously, three first impedance circuits 30 are also provided. First grounding point A is grounded through the first capacitor unit 501, second grounding point M is grounded through the second capacitor unit 502, and third grounding point N is grounded through the third capacitor unit 503. Furthermore, first grounding point A is electrically connected to second grounding point G1 through the corresponding first impedance circuit 30, first grounding point M is electrically connected to second grounding point G1 through the corresponding first impedance circuit 30, and first grounding point N is electrically connected to second grounding point G1 through the corresponding first impedance circuit 30. This excites a more pronounced current mode on the metal decorative part 20, improving the isolation between the first antenna 100 and the second antenna 200, and enhancing the performance of the corresponding antennas.

[0048] To improve the isolation between the first antenna 100 and the second antenna 200, such as Figure 6 and Figure 7 As shown, the electronic device also includes a second impedance circuit 70.

[0049] The first end of the second impedance circuit 70 is electrically connected to the first feed point B or the second feed point D, and the second end of the second impedance circuit 70 is electrically connected to the third grounding point.

[0050] Specifically, the metal decorative piece 20 has five grounding points: G1, G2, G3, G4, and G5. G1 is the second grounding point, and G2, G3, G4, and G5 are all third grounding points. The first grounding points A, M, and N are all electrically connected to the metal decorative piece 20 through the first impedance circuit 30 and the second grounding point G1. Simultaneously, the first grounding points A, M, and N are all grounded through their corresponding first capacitors 50. Some or all of the third grounding points (G2, G3, G4, and G5) on the metal decorative piece 20 are directly grounded. Furthermore, the first feed point B or the second feed point D is connected to the third grounding points through the second impedance circuit 70.

[0051] In one specific embodiment, the first antenna 100 is a WiFi-2.4G antenna, with its feed point located at the first feed point B. First grounding points A, M, and N are located on the antenna radiator 10. Corresponding spring contacts connect the first grounding points A, M, and N to the first capacitor unit 501, the second capacitor unit 502, and the third capacitor unit 503, ensuring that the antenna radiator 10 is in a suspended state and used as a sensor. The AC length is approximately 16mm. The second antenna 200 is a WiFi-2.4G antenna, with its feed point located at the second feed point D. The AE length is approximately 16mm. Without considering the influence of other antenna layouts on this embodiment, F, H, J, and K are provided as physical connection points, considering only the back-to-back antennas, the first antenna 100 and the second antenna 200, on the antenna radiator 1. The metal decorative part 20 is made of aluminum alloy, and its distance L1 from the antenna radiator 1 is approximately 3mm. The metal decorative part 20 is generally located close to the antenna area.

[0052] In common antenna design schemes, G1, G2, G3, G4, and G5 are all connected to the metal decorative piece 20. G1, G2, G3, G4, and G5 all return to ground via the motherboard 60. For back-to-back antennas with radiating elements at the same or similar frequencies, the isolation between the antennas is a crucial factor. Before optimization, the isolation between the first antenna 100 and the second antenna 200 was only -5.6dB. Figure 8 As shown. In this embodiment, the first grounding point A is electrically connected to the metal decorative element 20 through the first impedance circuit 30 and the second grounding point G1. The first feed point B or the second feed point D is electrically connected to a portion of the third grounding point through the second impedance circuit 70. The component value of the first impedance circuit 30 can effectively increase the isolation width and thickness between the first antenna 100 and the second antenna 200. Adjusting the component value of the second impedance circuit 70 can improve the isolation between the first antenna 100 and the second antenna 200 by constructing a neutral line between them through the metal decorative element 20, thereby improving the performance of the corresponding antennas. At this time, the isolation between the first antenna 100 and the second antenna 200 can be optimized from the original -5.6dB to -9.8dB. The contributions to the performance of the first antenna 100 and the second antenna 200 are as follows: Figures 9 to 11 As shown, the performance of the first antenna 100 is improved by 0.38dB, and the performance of the second antenna 200 is improved by 0.62dB.

[0053] In addition, the electronic device also includes: RF cable 80 and RF socket 90. RF socket 90 is electrically connected to the first feed point B or the second feed point D via RF cable 80.

[0054] Since both the first feed point B and the second feed point D need to transmit signals, two sets of RF lines 80 and RF sockets 90 are provided for the first feed point B and the second feed point D, respectively. One set of RF lines 80 and RF sockets 90 is used to connect electrically to the first feed point B, and the other set of RF lines 80 and RF sockets 90 is used to connect electrically to the second feed point D.

[0055] In one example, the first impedance circuit 30 can be adjusted according to the corresponding settings as needed.

[0056] For example, such as Figure 12 As shown, the first impedance circuit 30 includes a first impedance capacitor 301. The two ends of the first impedance capacitor 301 are electrically connected to the first grounding point A and the second grounding point G1, respectively.

[0057] like Figure 13 As shown, the first impedance circuit 30 includes a first impedance capacitor 301 and a first impedance inductor 302 that are electrically connected to each other. One of the first impedance capacitor 301 and the first impedance inductor 302 is electrically connected to a first ground point A, and the other of the first impedance capacitor 301 and the first impedance inductor 302 is electrically connected to a second ground point G1. For example, when the first impedance capacitor 301 is electrically connected to the second ground point G1, the first impedance inductor 302 is electrically connected to the first ground point A. When the first impedance capacitor 301 is electrically connected to the first ground point A, the first impedance inductor 302 is electrically connected to the second ground point G1.

[0058] like Figure 14 As shown, the first impedance circuit 30 includes: a first impedance inductor 302, a first impedance capacitor 301, and a second impedance capacitor 303; the first impedance capacitor 301 and the second impedance capacitor 303 are electrically connected, the first impedance inductor 302 is connected in parallel across the first impedance capacitor 301, one of the first impedance capacitor 301 and the second impedance capacitor 303 is electrically connected to a first ground point A, and the other of the first impedance capacitor 301 and the second impedance capacitor 303 is electrically connected to a second ground point G1. For example, when the first impedance capacitor 301 is electrically connected to the second ground point G1, the second impedance capacitor 303 is electrically connected to the first ground point A. When the first impedance capacitor 301 is electrically connected to the first ground point A, the second impedance capacitor 303 is electrically connected to the second ground point G1.

[0059] In one example, the second impedance circuit 70 can be adjusted according to the corresponding settings as needed.

[0060] like Figure 15As shown, the second impedance circuit 70 includes a second impedance inductor 701 and a third impedance capacitor 702. One of the second impedance inductor 701 and the third impedance capacitor 702 is electrically connected to either the first feed point B or the second feed point D, and the other is electrically connected to the third ground point. That is, when the second impedance inductor 701 is electrically connected to either the first feed point B or the second feed point D, the third impedance capacitor 702 is electrically connected to the third ground point. Conversely, when the second impedance inductor 701 is electrically connected to the third ground point, the third impedance capacitor 702 is electrically connected to either the first feed point B or the second feed point D.

[0061] like Figure 16 As shown, the second impedance circuit 70 includes: a second impedance inductor 701, a third impedance capacitor 702, and a fourth impedance capacitor 703. The second impedance inductor 701 and the third impedance capacitor 702 are electrically connected, and the fourth impedance capacitor 703 is connected in parallel across the two ends of the second impedance inductor 701 and the third impedance capacitor 702. One of the second impedance inductor 701 and the third impedance capacitor 702 is electrically connected to the first feed point B or the second feed point D, and the other is electrically connected to the third ground point. That is, when the second impedance inductor 701 is electrically connected to the first feed point B or the second feed point D, the third impedance capacitor 702 is electrically connected to the third ground point. When the third impedance capacitor 702 is electrically connected to the first feed point B or the second feed point D, the second impedance inductor 701 is electrically connected to the third ground point.

[0062] In one embodiment, such as Figure 17 As shown, the electronic device also includes a second capacitor, and the third grounding points (G2, G3, G4, and G5) are grounded through the second capacitor. Since there are four third grounding points, each third grounding point is grounded through a second capacitor.

[0063] Specifically, in this embodiment, the metal decorative piece 20 is connected to the antenna radiator 10 at the third grounding point G1 through the first impedance circuit 30. The second capacitor includes: a fourth capacitor unit 201, a fifth capacitor unit 202, a sixth capacitor unit 203, and a seventh capacitor unit 204. The third grounding point G2 is grounded through the fourth capacitor unit 201, the third grounding point G3 is grounded through the fifth capacitor unit 202, the third grounding point G4 is grounded through the sixth capacitor unit 203, and the fourth grounding point G5 is grounded through the seventh capacitor unit 204. Meanwhile, the third and fourth antennas are mounted on the bracket on the motherboard 60. This embodiment optimizes the isolation between the first antenna 100 and the second antenna 200, and cascades the suspended antenna radiator 10 and the suspended metal decorative piece 20 as the sensing element of the sensor. This increases the sensing area, especially useful for detecting proximity to the back of a mobile phone, maximizing user experience while meeting regulatory standards.

[0064] like Figure 1 and Figure 2 As shown, the electronic device also includes: a first grounding spring 310, a circuit line 311, and a second grounding spring 312. One end of the circuit line 311 is electrically connected to the first grounding point A through the first grounding spring 310, and the other end of the circuit line 311 is electrically connected to the second grounding point G1 through the first impedance circuit 30 and the second grounding spring 312 in sequence.

[0065] The specific structure of this electronic device is as follows: Figure 1 and Figure 2 As shown, due to space constraints, the second grounding point G1 is connected to the steel plate 314 via screw 313, and finally returns to ground via the second grounding spring 312. The second grounding spring 312 is located on the clearance area 600 of the motherboard 60. The motherboard 60 also includes multiple clearance areas 600 and copper-plated areas 601. The clearance area 600 cannot be entirely copper-plated. The copper-plated area 601 serves as the grounding area of ​​the motherboard 60 and is connected to the metal main plate 101 (not shown in the figure) via the grounding spring of the motherboard area. The camera module setting area 40 is located on the metal main plate 101. The metal main plate 101 is connected to the antenna radiator 10 at point A via the physical connector 102, and the metal main plate 101 is connected to the antenna radiator 2 at points F, H, and J. One end of the first grounding spring 310 is connected to the antenna radiator 10, and the other end of the first grounding spring 310 passes through the first via 602 and is connected to the bottom surface layer trace (circuit line 311) of the motherboard 60. The second grounding spring 312 is connected to the bottom surface trace (circuit line 311) of the motherboard 60 through the adjustable first impedance circuit 30.

[0066] In traditional antenna designs, the second grounding spring 312 typically returns directly to the ground of the motherboard 60. In this embodiment, the second grounding spring 312 is connected to the first grounding spring 310 on the top surface of the motherboard 60 via an adjustable first impedance circuit 30. The first grounding spring 310 is connected to the first antenna 100 and the second antenna 200, thus forming a connection between the metal decorative part 20 and the first antenna 100 and the second antenna 200. Here, the first impedance circuit 30 can be a capacitor or an LC series-parallel device. Adjusting the device value of the first impedance circuit 30 allows the topology to exhibit bandpass characteristics within the required frequency range. This excites a more pronounced current mode on the metal decorative part 20, effectively creating a wider and thicker ground plane between the first antenna 100 and the second antenna 200. This improves the isolation between antennas of the same or similar frequencies and enhances the performance of the corresponding antennas. The second grounding point G1 is connected to the main board 60, and the main board 60 is connected to the metal main plate 101. At this time, the surface current of the metal decorative part 20 is very small, and its effect on the first antenna 100 and the second antenna 200 is minimal. However, after the second grounding point G1 of the metal decorative part 20 is connected to the first antenna 100 and the second antenna 200, adjusting the value of the first impedance circuit 30 can make the surface current excitation of the metal decorative part 20 obvious, thus forming an isolated ground for the first antenna 100 and the second antenna 200, such as G3-A-G1-G2.

[0067] In another embodiment, such as Figure 6 and Figure 7As shown, due to space constraints, the grounding position G1 of the decorative part is connected to the steel plate 314 via screw 313, and finally returns to ground via the second grounding spring 312. The second grounding spring 312 is located on the clearance area 600 of the motherboard 60. The motherboard 60 also includes multiple clearance areas 600 and copper-plated areas 601. The clearance area 600 cannot be entirely copper-plated. The copper-plated area 601 serves as the grounding area of ​​the motherboard 60 and is connected to the metal main plate 101 (not shown in the figure) via the grounding spring of the motherboard. The camera module setting area 40 is located on the metal main plate 101. The metal main plate 101 and the antenna radiator 10 are not connected at point A. The metal main plate 101 and the antenna radiator 2 are connected at points F, H, and J. One end of the first grounding spring 310 is connected to the antenna radiator 10, and the other end of the first grounding spring 310 passes through the first via 602 and is connected to the bottom surface layer trace (circuit line 311) of the motherboard 60. The second grounding spring 312 is connected to the bottom surface trace (circuit line 311) of the motherboard 60 via the adjustable first impedance circuit 30. The metal decorative piece 20 is connected to the third grounding spring 23 at G3 via the protrusion 25, and the feed spring 24 of the second antenna 200 is connected to the antenna radiator 10 at D. The RF line 80 of the second antenna 200 corresponds to the RF socket 90, and the third grounding spring 23 and the feed spring 24 at the third grounding point G3 are connected via the second via 21, the bottom surface trace 22, and the corresponding second impedance circuit 70.

[0068] In common antenna designs, the second grounding spring 312 and the third grounding spring 23 typically return directly to the motherboard 60 ground. In this case, the first antenna 100 and the second antenna 200 are back-to-back antennas operating at the same frequency, connected to ground via a capacitor at point A, resulting in very poor isolation of only -5.6dB. In this embodiment, the second grounding spring 312 is connected to the first grounding spring 310 on the top surface of the motherboard 60 via an adjustable first impedance circuit 30, thus connecting the metal decorative piece 20 to the antenna body. The third grounding spring 23 is connected to the second feed point via a flexible second impedance circuit 70. Adjusting the values ​​of the components in the first impedance circuit 30 can effectively increase the isolation width and thickness between the first antenna 100 and the second antenna 200. Adjusting the values ​​of the components in the second impedance circuit 70 can construct a neutralization line between the first antenna 100 and the second antenna 200, thereby improving the isolation between antennas operating at or near the same frequency and enhancing the performance of the corresponding antennas.

[0069] It should be noted that the antenna radiator 10 is the frame or a part of the frame of the electronic device's housing, or it may be directly mounted on the frame or housing of the electronic device. For example, when the electronic device is used in a mobile phone, the antenna radiator 10 may refer to the frame or a part of the mobile phone's outer casing, or the antenna radiator 10 may be directly mounted on the frame or housing of the electronic device to act as its antenna. Correspondingly, the metal decorative part 20 is a camera decorative part used to mount the camera. Depending on different setup requirements, the camera decorative part can be used to mount a front-facing camera or a rear-facing camera.

[0070] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: An antenna radiator is provided with a first grounding point. A first feed point is connected between a first end of the antenna radiator and the first grounding point. A second feed point is connected between a second end of the antenna radiator and the first grounding point. The portion of the antenna radiator from the first end to the first feed point forms a first antenna. The portion of the antenna from the second end to the second feed point forms a second antenna. The second antenna operates at the same or similar frequency band as the first antenna. A metal decorative component, wherein the metal decorative component is provided with a second grounding point and a third grounding point; A first impedance circuit, wherein a first end of the first impedance circuit is electrically connected to the first grounding point, and a second end of the first impedance circuit is electrically connected to the second grounding point; The second impedance circuit has a first end electrically connected to the first feed point or the second feed point, and a second end electrically connected to the third grounding point. A first capacitor, with its first terminal grounded and its second terminal electrically connected to the first terminal of the first impedance circuit; The metal decorative element forms a neutralization line between the first antenna and the second antenna to improve the isolation between the first antenna and the second antenna.

2. The electronic device according to claim 1, characterized in that, The antenna radiator is provided with at least two first grounding points. The first end of the antenna radiator is connected to the first grounding point closest to it, and the second end of the antenna radiator is connected to the first grounding point closest to it, and the second feed point is connected to it. At least two first impedance circuits and at least two first capacitors are provided. The first end of each first capacitor is grounded, and the second end of each first capacitor is electrically connected to the first end of the corresponding first impedance circuit.

3. The electronic device according to claim 1, characterized in that, The electronic device also includes: The radio frequency (RF) cable and the RF socket are electrically connected to the first feed point or the second feed point via the RF cable.

4. The electronic device according to any one of claims 1-3, characterized in that, The first impedance circuit includes: a first impedance capacitor, the two ends of which are electrically connected to the first grounding point and the second grounding point, respectively; Alternatively, the first impedance circuit includes: a first impedance capacitor and a first impedance inductor electrically connected to each other; one of the first impedance capacitor and the first impedance inductor is electrically connected to the first grounding point, and the other is electrically connected to the second grounding point; Alternatively, the first impedance circuit includes: a first impedance inductor, a first impedance capacitor, and a second impedance capacitor; the first impedance capacitor and the second impedance capacitor are electrically connected, the first impedance inductor is connected in parallel across the first impedance capacitor, one of the first impedance capacitor and the second impedance capacitor is electrically connected to the first grounding point, and the other is electrically connected to the second grounding point.

5. The electronic device according to claim 3, characterized in that, The second impedance circuit includes: a second impedance inductor and a third impedance capacitor; one of the second impedance inductor and the third impedance capacitor is electrically connected to the first feed point or the second feed point, and the other is electrically connected to the third ground point; Alternatively, the second impedance circuit includes: a second impedance inductor, a third impedance capacitor, and a fourth impedance capacitor; the second impedance inductor and the third impedance capacitor are electrically connected, the fourth impedance capacitor is connected in parallel across the second impedance inductor and the third impedance capacitor, one of the second impedance inductor and the third impedance capacitor is electrically connected to the first feed point or the second feed point, and the other is electrically connected to the third ground point.

6. The electronic device according to claim 3, characterized in that, The electronic device further includes a second capacitor, and the third grounding point is grounded through the second capacitor.

7. The electronic device according to any one of claims 1-3, characterized in that, The electronic device further includes: a first grounding spring, a circuit wire, and a second grounding spring; one end of the circuit wire is electrically connected to the first grounding point through the first grounding spring, and the other end is electrically connected to the second grounding point through the first impedance circuit and the second grounding spring in sequence.

8. The electronic device according to any one of claims 1-3, characterized in that, The metal decorative component is a camera decorative component used to mount the camera; the antenna radiator is a metal frame.

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