A laser and a laser projection device

Abstract

This invention discloses a laser and a laser projection device. The laser includes a metal thermally conductive substrate, multiple light-emitting chips, and multiple reflectors. The light-emitting chips are soldered to the substrate via heat sinks, and the reflectors are glued to the substrate. Each reflector faces the reflective surface of a corresponding light-emitting chip, allowing light emitted from that chip to be emitted in a direction away from the substrate. Each light-emitting chip emits light along a fast axis and a slow axis, wherein the fast axis is perpendicular to the substrate, the slow axis is parallel to the substrate, and the divergence angle of the emitted light along the fast axis is greater than that along the slow axis. Furthermore, the reflective surface is concave, and the beam emitted through the concave surface exhibits a greater contraction in the divergence angle along the fast axis than in the slow axis. The laser of this invention is used for efficiently emitting laser beams and is applied to laser projection devices.

Description

[0001] This application is a divisional application of Chinese Invention Application 201811583139.8 (2018-12-24), entitled "Laser, Laser Projection Light Source and Laser Projection Device". Technical Field

[0002] This invention relates to the field of laser projection equipment technology, and more particularly to a laser, a laser projection light source, and a laser projection device. Background Technology

[0003] The laser is one of the important components in laser projection equipment such as laser TVs and laser projectors, and is used to provide a laser light source for laser TVs and laser projectors.

[0004] Figure 1 A laser 01 in the prior art, such as Figure 1 As shown, the laser 01 includes a substrate 011 and a light-emitting chip 012 disposed on the substrate 011. To better dissipate heat, the larger side of the light-emitting chip 012 is usually mounted on the substrate 011, which has strong thermal conductivity and heat dissipation capabilities. This allows the light-emitting chip 012 to emit light in a direction parallel to the substrate 011. In order to make the light emitted by the light-emitting chip 012 exit the side of the light-emitting chip 012 away from the substrate 011, so that the light emitted by the light-emitting chip 012 is emitted from the laser light-emitting surface 014 disposed on the side of the light-emitting chip 012 away from the substrate 011, a reflector 013 needs to be disposed on the substrate 011 and positioned on the light-emitting path of the light-emitting chip 012. The reflector 013 deflects the light emitted by the light-emitting chip 012 once, so that the light emitted by the light-emitting chip 012 can be emitted to the side of the light-emitting chip 012 away from the substrate 011.

[0005] because Figure 1 The surface 0131 on the reflective element 013 that performs the reflecting function is a plane, and as shown... Figure 2 As shown, the light-emitting port 0121 of the light-emitting chip 012 is along the slow axis direction (that is, the light-emitting port 0121 of the chip 012). Figure 2 The direction of the middle axis (X) and the direction of the fast axis (that is, the direction of the fast axis) Figure 2 The light emitted in the direction Y) is all divergent light. The divergence angle α in the slow axis direction (usually 5° to 10°) is small, while the divergence angle β in the fast axis direction (usually 30° to 70°) is large. Thus, the light beam emitted by the light-emitting chip 012 remains divergent light after being reflected by the reflector 013. This divergent light is transmitted to the subsequent optical path component 03 in the laser projection device, such as... Figure 3As shown, the divergent beam needs to be collimated by the collimation structure 02 to make it a parallel beam, thereby ensuring that the multiple light rays in the beam are parallel in the transmission path of the optical path component 03. However, this increases the structural complexity of the laser projection device and increases the cost of the laser projection device. Summary of the Invention

[0006] This invention provides a laser, a laser projection light source, and a laser projection device to address the problem of reducing the structural complexity and cost of laser projection devices.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] In a first aspect, some embodiments of the present invention provide a laser, which includes a substrate, a light-emitting chip, and a reflector. The light-emitting chip and the reflector are both disposed on the substrate. The light-emitting direction of the light-emitting chip is parallel to the substrate. The reflector is located on the light-emitting path of the light-emitting chip. The surface of the reflector facing the light-emitting chip is a reflective surface. The reflective surface is used to reflect the light emitted by the light-emitting chip so that the light emitted by the light-emitting chip is emitted in a direction away from the substrate. The reflective surface is a concave curved surface and is along one of the fast axis direction and the slow axis direction parallel to the light-emitting chip. The intersection line between each position on the reflective surface and the plane perpendicular to the one direction is a concave curve.

[0009] In some embodiments, along another direction parallel to the fast axis and slow axis of the light-emitting chip, the intersection line between each position on the reflective surface and the plane perpendicular to the other direction is a concave curve.

[0010] The fast axis of the light-emitting chip can be parallel to or perpendicular to the substrate; correspondingly, the slow axis of the light-emitting chip can be perpendicular to or parallel to the substrate.

[0011] In some embodiments, the slow axis direction of the light-emitting chip is parallel to the substrate, and the fast axis direction of the light-emitting chip is perpendicular to the substrate.

[0012] Optionally, along the fast axis direction parallel to the light-emitting chip, the intersection lines of each position on the reflective surface with the plane perpendicular to the fast axis direction are all concave arcs. The angles between the tangent plane at each point on the concave arc and the fast axis direction are all equal, and the light-emitting port of the light-emitting chip is located on the line connecting the centers of the circles corresponding to each concave arc.

[0013] In some embodiments, the radius r of each concave arc is 2mm to 3mm.

[0014] Optionally, along the slow axis direction parallel to the light-emitting chip, the intersection lines between each position on the reflective surface and the plane perpendicular to the slow axis direction are all concave curves, so that the reflective surface can reflect and collimate the light emitted by the light-emitting chip along the fast axis direction.

[0015] In some embodiments, the reflector is a prism or a reflective lens.

[0016] In some embodiments, the light-emitting chip is bonded to the substrate using thermally conductive adhesive.

[0017] In some embodiments, the substrate is made of copper or a copper alloy.

[0018] In some embodiments, there are multiple light-emitting chips arranged around a reflector, and multiple reflective surfaces corresponding one-to-one with each light-emitting chip. In some embodiments, the spacing between two adjacent light-emitting chips is 1mm to 10mm.

[0019] Compared with the prior art, the reflective surface of the reflector in the laser provided by the present invention is a concave curved surface. Furthermore, along one of the directions parallel to the fast axis and slow axis of the light-emitting chip, the intersection lines between each position on the reflective surface and the plane perpendicular to that direction are all concave curves. Therefore, while reflecting the light emitted by the light-emitting chip in the direction away from the substrate, the reflective surface can also reduce the light emitted by the light-emitting chip in the other direction (fast axis and slow axis), thereby reducing the diffusion angle of the light emitted by the light-emitting chip in that other direction. Thus, when this laser is applied to laser projection devices such as laser TVs and laser projectors, there is no need to set up a separate collimation device to collimate the light in that direction in the subsequent optical path, thereby reducing the structural complexity and cost of the laser projection device.

[0020] Secondly, some embodiments of the present invention provide a laser projection light source, including a bracket and at least one laser as described in any of the above technical solutions. The bracket is provided with at least one mounting slot, and the at least one mounting slot corresponds one-to-one with at least one laser. Each laser is installed in the mounting slot corresponding to the laser, and the orientation of the light-emitting surface of the laser is consistent with the opening orientation of the mounting slot corresponding to the laser.

[0021] The present invention provides a laser projection light source, which includes the laser described in any of the above-mentioned technical solutions. Therefore, the laser projection light source provided by the present invention can solve the same technical problem and achieve the same expected effect as the laser described in any of the above-mentioned technical solutions.

[0022] Thirdly, some embodiments of the present invention provide a laser projection device, including a laser projection light source, an optical engine, and a projection lens connected in sequence. The laser projection light source is the laser projection light source described in the above technical solution. The optical engine is used to modulate the illumination beam emitted by the laser projection light source to generate an image beam and project the image beam onto the projection lens. The projection lens is used to image the image beam.

[0023] The present invention provides a laser projection device. Since the laser projection device includes the laser projection light source described in the above-mentioned technical solution, the laser projection device provided by the present invention can solve the same technical problem and achieve the same expected effect as the laser projection light source described in the above-mentioned technical solution. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a front view of a laser in the prior art;

[0026] Figure 2 for Figure 1 A schematic diagram of the optical path in which the light-emitting chip in the laser emits light along the fast axis and the slow axis.

[0027] Figure 3 For including Figure 1 A schematic diagram of a laser projection device with the laser shown.

[0028] Figure 4 This is a perspective view of a first structure of the laser according to an embodiment of the present invention;

[0029] Figure 5 This is a front view of a first structure of the laser according to an embodiment of the present invention;

[0030] Figure 6 This is a perspective view of a second structure of the laser according to an embodiment of the present invention;

[0031] Figure 7 This is a front view of a second structure of the laser according to an embodiment of the present invention;

[0032] Figure 8 This is a perspective view of a third structure of the laser according to an embodiment of the present invention;

[0033] Figure 9 This is a front view of a third structure of the laser according to an embodiment of the present invention;

[0034] Figure 10 This is a perspective view of the fourth structure of the laser according to an embodiment of the present invention;

[0035] Figure 11 This is a front view of the fourth structure of the laser according to an embodiment of the present invention;

[0036] Figure 12 This is a top view of the fifth structure of the laser according to an embodiment of the present invention;

[0037] Figure 13 This is a top view of the sixth structure of the laser according to an embodiment of the present invention;

[0038] Figure 14 This is a schematic diagram of a laser projection light source according to an embodiment of the present invention;

[0039] Figure 15 This is a schematic diagram of a laser projection device according to an embodiment of the present invention. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0042] Lasers are used to emit laser light to provide a laser source for laser projection devices such as laser TVs and laser projectors.

[0043] Firstly, such as Figure 4 or Figure 8 As shown, some embodiments of the present invention provide a laser 10, which includes a substrate 1, a light-emitting chip 2, and a reflector 3. The light-emitting chip 2 and the reflector 3 are both disposed on the substrate 1. The light emission direction of the light-emitting chip 2 is parallel to the substrate 1. The reflector 3 is located on the light emission path of the light-emitting chip 2. The surface of the reflector 3 facing the light-emitting chip 2 is a reflective surface 31. The reflective surface 31 is used to reflect the light emitted by the light-emitting chip 2 so that the light emitted by the light-emitting chip 2 is emitted in a direction away from the substrate 1. The reflective surface 31 is a concave curved surface, and the intersection of each position on the reflective surface 31 with a plane perpendicular to the fast axis direction (i.e., direction Y) and the slow axis direction (i.e., direction X) of the light-emitting chip 2 is a concave curve.

[0044] Compared with the prior art, the reflective surface 31 of the reflector 3 in the laser 10 provided by the present invention is a concave curved surface. Furthermore, along one of the directions parallel to the fast axis (Y direction) and slow axis (X direction) of the light-emitting chip 2, the intersection lines of each position on the reflective surface 31 with the plane perpendicular to that direction are all concave curves. Therefore, while reflecting the light emitted by the light-emitting chip 2 in the direction away from the substrate 1, the reflective surface 31 can also reduce the light emitted by the light-emitting chip 2 along the other direction (Y direction) and slow axis (X direction), thereby reducing the diffusion angle of the light emitted by the light-emitting chip 2 along that other direction. Thus, when the laser 10 is applied to laser projection devices such as laser TVs and laser projectors, no additional collimation device is needed in the subsequent optical path to collimate the light in that direction, thereby reducing the structural complexity and cost of the laser projection device.

[0045] In the above embodiments, the shape of the reflective surface 31 can include the following two embodiments:

[0046] Example 1: As Figure 4 and Figure 5 As shown, the reflective surface 31 is a concave curved surface, and along the fast axis direction (i.e., direction Y) parallel to the light-emitting chip 2, the intersection lines of each position on the reflective surface 31 with the plane perpendicular to the fast axis direction are all concave curves. In this way, while reflecting the light emitted by the light-emitting chip 2 in the direction away from the substrate 1, the reflective surface 31 can also reduce the light emitted by the light-emitting chip 2 along the slow axis direction (i.e., direction X), thereby reducing the diffusion angle of the light emitted by the light-emitting chip 2 along the slow axis direction.

[0047] The reflective surface 31 reduces the divergence angle of the light-emitting chip 2 along the slow axis (i.e., direction X) from α (typically 5° to 10°) to α1. α1 can be 0°, 2°, 4°, 5°, etc., and is not specifically limited here. In some embodiments, α1 is 0°.

[0048] In addition, a concave curve can be a concave arc, a concave parabola, etc., without being specifically limited here.

[0049] Furthermore, along the slow axis direction (i.e., direction X) parallel to the light-emitting chip 2, the intersection line between each position on the reflective surface 31 and the plane perpendicular to the slow axis direction can be a straight line or a curve, without specific limitations here.

[0050] For example, such as Figure 4 and Figure 5 As shown, along the slow axis direction (i.e., direction X) parallel to the light-emitting chip 2, the intersection lines between each position on the reflective surface 31 and the plane perpendicular to this slow axis direction are all straight lines. Thus, the reflective surface 31 is cylindrical, and this shape of reflective surface has a regular structure and is easy to process.

[0051] For example, such as Figure 6 and Figure 7 As shown, along the slow axis direction (i.e., direction X) parallel to the light-emitting chip 2, the intersection lines between each position on the reflecting surface 31 and the plane perpendicular to this slow axis direction are all concave curves. Thus, the reflecting surface 31 can simultaneously reduce the light emitted by the light-emitting chip 2 along the slow axis direction (i.e., direction X) and the fast axis direction (i.e., direction Y), thereby reducing the divergence angle of the light emitted by the light-emitting chip 2 along both the slow and fast axes. Therefore, when this laser 10 is applied to laser projection devices such as laser TVs and laser projectors, a collimation device is not required in the subsequent optical path, further reducing the structural complexity and cost of the laser projection device.

[0052] In the above example, the reflective surface 31 reduces the divergence angle of the light-emitting chip 2 along the fast axis direction (i.e., direction Y) from β (typically 30° to 70°) to β1. β1 can be 0°, 2°, 4°, 5°, 10°, etc., and is not specifically limited here. In some embodiments, such as... Figure 6 and Figure 7 As shown, β1 is 0°.

[0053] Example 2: Figure 8 and Figure 9 As shown, the reflective surface 31 is a concave curved surface, and along the slow axis direction (i.e., direction X) parallel to the light-emitting chip 2, the intersection lines of each position on the reflective surface 31 with the plane perpendicular to the slow axis direction are all concave curves. In this way, while reflecting the light emitted by the light-emitting chip 2 in the direction away from the substrate 1, the reflective surface 31 can also reduce the light emitted by the light-emitting chip 2 along the fast axis direction (i.e., direction Y), thereby reducing the diffusion angle of the light emitted by the light-emitting chip 2 along the fast axis direction.

[0054] In this embodiment, the reflective surface 31 reduces the divergence angle of the light-emitting chip 2 along the fast axis direction (i.e., direction Y) from β (typically 30°–70°) to β1. β1 can be 0°, 2°, 4°, 5°, 10°, etc., and is not specifically limited here. In some embodiments, such as… Figure 8 and Figure 9 As shown, β1 is 0°.

[0055] In addition, a concave curve can be a concave arc, a concave parabola, etc., without being specifically limited here.

[0056] Furthermore, along the fast axis direction (i.e., direction Y) parallel to the light-emitting chip 2, the intersection line between each position on the reflective surface 31 and the plane perpendicular to the fast axis direction can be a straight line or a curve, without specific limitations here.

[0057] For example, such as Figure 8 and Figure 9 As shown, along the fast axis direction (i.e., direction Y) parallel to the light-emitting chip 2, the intersection lines between each position on the reflective surface 31 and the plane perpendicular to this fast axis direction are all straight lines. Thus, the reflective surface 31 is cylindrical, and this shape of reflective surface has a regular structure and is easy to process.

[0058] For example, such as Figure 10 and Figure 11 As shown, along the fast axis direction (i.e., direction Y) parallel to the light-emitting chip 2, the intersection lines between each position on the reflective surface 31 and the plane perpendicular to this fast axis direction are all concave curves. Thus, the reflective surface 31 can simultaneously reduce the light emitted by the light-emitting chip 2 along the fast axis direction (i.e., direction Y) and the slow axis direction (i.e., direction X), thereby reducing the divergence angle of the light emitted by the light-emitting chip 2 along both the slow and fast axes. Therefore, when this laser 10 is applied to laser projection devices such as laser TVs and laser projectors, a collimation device is not required in the subsequent optical path, further reducing the structural complexity and cost of the laser projection device.

[0059] In the above example, the reflective surface 31 reduces the divergence angle of the light-emitting chip 2 along the slow axis direction (i.e., direction X) from α (typically 5° to 10°) to α1. α1 can be 0°, 2°, 4°, 5°, etc., and is not specifically limited here. In some embodiments, such as... Figure 10 and Figure 11 As shown, α1 is 0°.

[0060] The slow axis direction of the light-emitting chip 2 can be parallel to or perpendicular to the substrate 1; correspondingly, the fast axis direction of the light-emitting chip 2 can be perpendicular to or parallel to the substrate 1. The slow axis direction and the fast axis direction of the light-emitting chip 2 can also be tilted with respect to the substrate 1 at an angle between (0° and 90°), without any specific limitation.

[0061] In some embodiments, the slow axis direction of the light-emitting chip 2 is parallel to the substrate 1, and the fast axis direction of the light-emitting chip 2 is perpendicular to the substrate 1. Because... Figure 2 As shown, the maximum width of the light-emitting port 0121 of the light-emitting chip 012 is smaller in the fast axis direction (i.e., direction Y) and larger in the slow axis direction (i.e., direction X). Therefore, when the slow axis direction (i.e., direction X) of the light-emitting chip 2 is parallel to the substrate 1 and the fast axis direction (i.e., direction Y) of the light-emitting chip 2 is perpendicular to the substrate, the height of the light-emitting chip 2 protruding from the substrate 1 is smaller, which is beneficial to reduce the height of the laser 10 in its light-emitting direction. In addition, the maximum heat-generating surface of the light-emitting chip 2 is in contact with the substrate 1, which can effectively dissipate the heat generated when the light-emitting chip 2 emits light.

[0062] When the slow axis direction of the light-emitting chip 2 is parallel to the substrate 1, and the fast axis direction of the light-emitting chip 2 is perpendicular to the substrate 1, in order to collimate the light emitted by the light-emitting chip 2 along the slow axis direction (i.e., direction X), in some embodiments, such as... Figure 4 and Figure 5 As shown, along the fast axis direction (i.e., direction Y) parallel to the light-emitting chip 2, the intersection lines between each position on the reflecting surface 31 and the plane perpendicular to this fast axis direction are all concave arcs. The angles between the tangent plane of the reflecting surface 31 at each point on this concave arc and the fast axis direction (i.e., direction Y) are all equal. The light-emitting port of the light-emitting chip 2 is located on the line l connecting the centers of the circles corresponding to each concave arc. In this way, the light emitted by the light-emitting chip 2 along the slow axis direction (i.e., direction X) after reflection by the reflecting surface 31 all have the same output direction, which can convert the divergent light emitted by the light-emitting chip 2 along the slow axis direction (i.e., direction X) into parallel light, thereby collimating the light emitted by the light-emitting chip 2 along the slow axis direction (i.e., direction X).

[0063] In the above embodiments, the radius r of each concave arc can be 2mm, 3mm, 5mm, etc., and is not specifically limited here. In some embodiments, such as Figure 4 As shown, the radius r of each concave arc is 2mm to 3mm. In this way, the distance between the reflector 3 and the light-emitting chip 2 is moderate, which can balance the structural compactness of the laser 10 and the processing difficulty of the reflector 1.

[0064] When the slow axis direction of the light-emitting chip 2 is parallel to the substrate 1, and the fast axis direction of the light-emitting chip 2 is perpendicular to the substrate 1, in order to collimate the light emitted by the light-emitting chip 2 along the fast axis direction (i.e., direction Y), in some embodiments, such as... Figure 6 or Figure 8 As shown, along the slow axis direction (i.e., direction X) parallel to the light-emitting chip 2, the intersection lines between each position on the reflecting surface 31 and the plane perpendicular to this slow axis direction are all concave curves, so that the reflecting surface 31 can reflect and collimate the light emitted by the light-emitting chip 2 along the fast axis direction. In this way, the light emitted by the light-emitting chip 2 along the fast axis direction (i.e., direction Y) can be collimated.

[0065] It should be noted that the reflective surface 31 can collimate the light emitted by the light-emitting chip along the fast axis direction. This does not necessarily mean that the divergence angle of the light emitted by the light-emitting chip 2 along the fast axis direction (i.e., direction Y) must be reduced to 0°. Rather, the reflective surface 31 can be considered to have collimated the light emitted by the light-emitting chip 2 along the fast axis direction (i.e., direction Y) to any angle value within the range of [0°, 5°].

[0066] In some embodiments, the reflector 3 is a prism or a reflective lens.

[0067] The light-emitting chip 2 can be directly connected to the substrate 1, or indirectly connected to the substrate 1 through a heat sink or other structure; no specific limitation is made here. In some embodiments, such as Figure 4 and Figure 5 As shown, the light-emitting chip 2 is indirectly connected to the substrate 1 through the heat sink 4. That is, the heat sink 4 is connected to the substrate 1, and the light-emitting chip 2 is connected to the heat sink 4.

[0068] When the light-emitting chip 2 is directly connected to the substrate 1, specifically, the light-emitting chip 2 can be connected to the substrate 1 by means of threaded connection, snap-fit, adhesive, welding, etc., without specific limitations. In some embodiments, the light-emitting chip 2 is bonded to the substrate 1 with thermally conductive adhesive. The thermally conductive adhesive has good thermal conductivity, which can effectively transfer the heat generated by the light-emitting chip 2 during operation to the substrate 1, and further diffuse from the substrate 1 to the external environment. In other embodiments, the light-emitting chip 2 is welded to the substrate 1. The welding method provides a more secure connection, and the welding material is usually a metal material. Metal materials have excellent thermal conductivity, which can effectively transfer the heat generated by the light-emitting chip 2 during operation to the substrate 1, and further diffuse from the substrate 1 to the external environment.

[0069] Similarly, the reflector 3 can be directly connected to the substrate 1, or indirectly connected to the substrate 1 through a pad or other structure; no specific limitation is made here. Furthermore, when the reflector 3 is directly connected to the substrate 1, it can be connected to the substrate 1 by means of threaded connection, snap-fit, adhesive, etc.; no specific limitation is made here.

[0070] The substrate 1 serves a heat dissipation function. The material of the substrate 1 can be copper, aluminum, iron, etc., and is not specifically limited here. In some embodiments, the material of the substrate 1 is copper or a copper alloy. Copper or copper alloys have better heat dissipation performance and can quickly dissipate the heat generated by the light-emitting chip 2 during operation.

[0071] In some embodiments, such as Figure 12 or Figure 13 As shown, there are multiple light-emitting chips 2, which are arranged around the reflector 3. There are multiple reflective surfaces 31, and each reflective surface 31 corresponds to one of the multiple light-emitting chips 2. In this way, the brightness of the laser 10 can be increased by setting multiple light-emitting chips 2.

[0072] In the above embodiments, the number of light-emitting chips 2 can be 6, 8, 10, etc., and is not specifically limited here. It can be set according to the brightness requirements of the laser 10. Furthermore, the arrangement position of the light-emitting chips 2 is not specifically limited; for example, such as... Figure 12 As shown, multiple light-emitting chips 2 are arranged around opposite sides of the reflector 3. Another example is... Figure 13 As shown, multiple light-emitting chips 2 are arranged around the four sides of the reflector 3.

[0073] In some embodiments, the spacing between two adjacent light-emitting chips 2 is 1mm to 10mm. This avoids interference between the light beams emitted by two adjacent light-emitting chips 2.

[0074] Secondly, such as Figure 14 As shown, some embodiments of the present invention provide a laser projection light source 100, including a bracket 20 and at least one laser 10 as described in any of the above embodiments. The bracket 20 is provided with at least one mounting groove 21, and the at least one mounting groove 21 corresponds one-to-one with at least one laser 10. Each laser 10 is installed in the mounting groove 21 corresponding to the laser 10, and the orientation of the light emitting surface of the laser 10 is consistent with the opening orientation of the mounting groove 21 corresponding to the laser 10.

[0075] The present invention provides a laser projection light source. Since the laser projection light source 100 includes the laser 10 described in any of the above embodiments, the laser projection light source 100 provided by the present invention can solve the same technical problem and achieve the same expected effect as the laser 10 described in any of the above embodiments.

[0076] To increase the light-emitting area of ​​the laser projection light source 100, in some embodiments, such as Figure 14 As shown, the laser projection light source 100 includes multiple lasers 10, and the bracket 20 is provided with multiple mounting slots 21. Each mounting slot 21 corresponds to one of the multiple lasers 10. Each laser 10 is installed in the mounting slot 21 corresponding to the laser 10, and the orientation of the light-emitting surface of the laser 10 is consistent with the opening orientation of the mounting slot 21 corresponding to the laser 10.

[0077] Thirdly, such as Figure 15 As shown, some embodiments of the present invention provide a laser projection device, including a laser projection light source 100, an optical engine 200, and a projection lens 300 connected in sequence. The laser projection light source 100 is the laser projection light source 100 described in the above embodiments. The optical engine 200 is used to modulate the illumination beam emitted by the laser projection light source 100 to generate an image beam and project the image beam onto the projection lens 300. The projection lens 300 is used to image the image beam.

[0078] The present invention provides a laser projection device. Since the laser projection device includes the laser projection light source 100 described in the above embodiments, the laser projection device provided by the present invention can solve the same technical problems and achieve the same expected effects as the laser projection light source 100 described in the above embodiments.

[0079] In some embodiments, such as Figure 15As shown, the laser projection device also includes a projection screen 400, which is disposed on the light output path of the projection lens 300. The projection beam after being imaged by the projection lens 300 forms a projection image on the projection screen 400.

[0080] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0081] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A laser, characterized in that, It includes a metal thermally conductive substrate, multiple light-emitting chips and multiple reflectors. The light-emitting chips are soldered to the substrate by a heat sink, and the reflectors are glued to the substrate. Each reflector faces the reflective surface of the corresponding light-emitting chip, so that the light emitted by the corresponding light-emitting chip is emitted in a direction away from the substrate. Each of the light-emitting chips emits light along the fast axis direction and the slow axis direction, wherein the fast axis direction is perpendicular to the substrate, the slow axis direction is parallel to the substrate, and the divergence angle of the emitted light along the fast axis direction is greater than the divergence angle along the slow axis direction. Furthermore, the reflective surface is a concave curved surface, and the reflective surface reduces the divergence angle of the corresponding light-emitting chip emitting light along the fast axis direction from β to β1, wherein 0°≤β1≤10°; and the reflective surface reduces the divergence angle of the corresponding light-emitting chip emitting light along the slow axis direction from α to α1, wherein 0°≤α1≤5°. Along the slow axis direction parallel to the corresponding light-emitting chip, the intersection lines between each position on the reflective surface and the plane perpendicular to the slow axis direction are all concave curves. Along the fast axis direction parallel to the corresponding light-emitting chip, the intersection lines between each position on the reflective surface and the plane perpendicular to the fast axis direction are all concave curves.

2. The laser according to claim 1, characterized in that, The concave curve is a concave arc or a concave parabola.

3. The laser according to claim 2, characterized in that, The concave surface is a cylindrical surface.

4. The laser according to claim 1 or 2, characterized in that, The reflective surface is used to collimate the light emitted by the corresponding light-emitting chip along the fast axis direction. The divergence angle range of the collimated light is: 0°≤β1≤5°.

5. The laser according to claim 2, characterized in that, The radius r of each concave arc is 2mm to 3mm, and the spacing between two adjacent light-emitting chips is 1mm to 10mm.

6. The laser according to claim 1, characterized in that, The reflector is a prism or a reflective lens.

7. The laser according to claim 1, characterized in that, The laser also satisfies at least one of the following conditions: The welding material used to weld the light-emitting chip to the substrate is a metallic material; The substrate is made of copper, aluminum, or iron.

8. A laser projection device, characterized in that, The system includes a laser projection light source, an optical engine, and a projection lens connected in sequence. The laser projection light source includes a laser as described in any one of claims 1-7, which is used to emit a laser to provide an illumination beam for the optical engine. The optical engine is used to modulate the illumination beam to generate an image beam and project the image beam onto the projection lens. The projection lens is used to image the image beam.

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