Chip junction temperature curve determination method and device, electronic equipment and storage medium

Abstract

The application provides a chip junction temperature curve determination method and device, electronic equipment and storage medium. A first thermal impedance model parameter of the chip is determined based on vehicle speed information. Real-time power loss of the chip is determined based on electrical parameters. The first thermal impedance model parameter and the real-time power loss are input into a preset Foster model to determine a first real-time temperature rise curve of a radiator platform corresponding to the chip. A second real-time temperature rise curve of a junction shell of the chip is determined, and a third real-time temperature rise curve of a junction of the chip shell and the radiator is determined. The fourth real-time temperature rise curve of the chip is determined based on the first real-time temperature rise curve, the second real-time temperature rise curve and the third real-time temperature rise curve. The junction temperature curve of the chip is determined based on the fourth real-time temperature rise curve and the cooling working medium temperature.

Description

Technical Field

[0001] This application relates to the field of rail transit technology, and in particular to a method, apparatus, electronic device and storage medium for determining the junction temperature profile of a chip. Background Technology

[0002] In existing technologies, the calculation of junction temperature or selection of devices is mostly based on a steady-state thermal circuit model assuming constant device power and thermal resistance. This does not accurately reflect the actual junction temperature of the device during operation. Furthermore, for traveling air-cooled IGBT modules, the heat sink relies on the airflow generated during vehicle movement for cooling. Since the airflow speed varies with vehicle speed, the heat sink performance also changes, resulting in low accuracy in calculating the junction temperature of traveling air-cooled IGBT modules and a large selection margin in device selection. Summary of the Invention

[0003] To address the aforementioned issues, this application provides a method, apparatus, electronic device, and storage medium for determining the junction temperature profile of a chip.

[0004] This application provides a method for determining the junction temperature profile of a chip, including:

[0005] The system acquires the train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chip in the running air-cooled converter; determines the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the train speed information; and determines the real-time power loss of the chip based on the electrical parameters.

[0006] The first thermal impedance model parameters and the real-time power loss are input into the preset Foster model to determine the first real-time temperature rise curve of the heat sink surface corresponding to the chip.

[0007] A second real-time temperature rise curve is determined at the junction of the chip and a third real-time temperature rise curve is determined at the connection between the chip's casing and the heat sink; based on the first, second, and third real-time temperature rise curves, a fourth real-time temperature rise curve is determined for the chip.

[0008] The junction temperature curve of the chip is determined based on the fourth real-time temperature rise curve and the temperature of the cooling medium.

[0009] In some embodiments, determining the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the vehicle speed information includes:

[0010] Based on the vehicle speed information and the first correspondence between the pre-established vehicle speed information and the second thermal impedance model parameters, the first thermal impedance model parameters of the chip are determined.

[0011] In some embodiments, the method further includes:

[0012] Measure the wind speed distribution on the radiator surface of the traveling air-cooled converter under different vehicle speeds;

[0013] Determine the second correspondence between wind speed distribution information and different vehicle speed information;

[0014] The temperature rise curve of the chip at the heat sink surface is obtained under different vehicle speed information. The temperature rise curve is obtained through experiments when the power loss is a preset loss and the wind speed distribution information is satisfied.

[0015] Based on the temperature rise curve, the Foster model is used to perform fitting calculations to obtain the second thermal impedance model parameters of the heat sink platform corresponding to the chip under different vehicle speed information.

[0016] Establish the first correspondence between different vehicle speed information and the parameters of the second thermal impedance model.

[0017] In some embodiments, determining the second real-time temperature rise curve at the junction of the chip includes:

[0018] Obtain the reference thermal impedance model parameters at the junction of the chip;

[0019] The reference thermal impedance model parameters at the chip junction and the real-time power loss are input into the Foster model to determine the second real-time temperature rise curve at the chip junction.

[0020] In some embodiments, determining the third real-time temperature rise curve at the connection between the chip casing and the heat sink includes:

[0021] Obtain the thermal conductivity material parameters at the connection between the chip's casing and the heat sink;

[0022] The reference thermal impedance model parameters at the connection between the chip's casing and the heat sink are determined based on the thermally conductive material parameters.

[0023] The reference thermal impedance model parameters based on the connection between the chip's casing and the heat sink, and the real-time power loss are input into the Foster model to determine the third real-time temperature rise curve at the connection between the chip's casing and the heat sink.

[0024] In some embodiments, the Foster model is: ;

[0025] in, The temperature rise curve is shown. For power loss, the thermal impedance model parameters are: … and … where n is the order of the steady-state model. For thermal resistance, is the time constant.

[0026] In some embodiments, the method further includes:

[0027] Given that the train speed information, cooling medium temperature, and electrical parameters of the running air-cooled converter chip are simulation data, a chip model is recommended based on the junction temperature curve of the chip.

[0028] If the train speed information, cooling medium temperature, and electrical parameters of the running air-cooled converter chip are measured data, the junction temperature curve of the chip is sent to the monitoring system.

[0029] This application provides an apparatus for determining the junction temperature profile of a chip, comprising:

[0030] The first acquisition module is used to acquire the train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chips of the running air-cooled converter.

[0031] The first determining module is used to determine the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the vehicle speed information; and to determine the real-time power loss of the chip based on the electrical parameters.

[0032] The second determining module is used to input the first thermal impedance model parameters and the real-time power loss into a preset Foster model to determine the first real-time temperature rise curve of the heat sink surface corresponding to the chip.

[0033] The third determining module is used to determine the second real-time temperature rise curve at the junction of the chip and the third real-time temperature rise curve at the connection between the IGBT chip and the heat sink.

[0034] The fourth determining module is used to determine the fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve.

[0035] The fifth determining module is used to determine the junction temperature curve of the IGBT chip based on the fourth real-time temperature rise curve and the temperature of the cooling medium.

[0036] This application provides an electronic device, including a memory and a processor. The memory stores a computer program, which, when executed by the processor, performs the chip junction temperature curve determination method described above.

[0037] This application provides a storage medium storing a computer program that can be executed by one or more processors and can be used to implement the chip junction temperature profile determination method described in any of the above claims.

[0038] This application provides a method, apparatus, electronic device, and storage medium for determining the junction temperature profile of a chip. By acquiring train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chip in the running air-cooled converter; determining the first thermal impedance model parameters of the chip based on the train speed information; determining the real-time power loss of the chip based on the electrical parameters; inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model to determine the first real-time temperature rise profile of the heatsink platform corresponding to the chip; determining the second real-time temperature rise profile of the chip's junction; determining the third real-time temperature rise profile at the connection between the chip's casing and the heatsink; determining the fourth real-time temperature rise profile of the chip based on the first, second, and third real-time temperature rise profiles; and finally determining the junction temperature profile of the chip based on the fourth real-time temperature rise profile and the cooling medium temperature. This method improves the accuracy of calculating the junction temperature of the chip in a running air-cooled converter. Attached Figure Description

[0039] The present application will be described in more detail below based on embodiments and with reference to the accompanying drawings.

[0040] Figure 1 A schematic diagram illustrating the implementation process of a method for determining a chip junction temperature profile provided in an embodiment of this application;

[0041] Figure 2 A schematic diagram illustrating the implementation process for establishing a first correspondence relationship, provided in an embodiment of this application;

[0042] Figure 3 A schematic diagram of a device for determining a chip junction temperature profile provided in an embodiment of this application;

[0043] Figure 4 This is a schematic diagram of the composition structure of the electronic device provided in the embodiments of this application.

[0044] In the accompanying drawings, the same parts are referred to by the same reference numerals, and the drawings are not drawn to scale. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0046] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0047] If the application documents contain similar descriptions such as "first, second, third", the following explanation shall be added: In the following description, the terms "first, second, third" are used only to distinguish similar objects and do not represent a specific order of objects. It is understood that "first, second, third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0049] Before introducing a method for determining a chip junction temperature profile provided in the embodiments of this application, a brief description is given of the related technologies and the problems existing in the related technologies.

[0050] To address the problems existing in related technologies, this application provides a method for determining the junction temperature profile of a chip. This method is applied to electronic devices, such as computers and mobile terminals. The function implemented by the chip junction temperature profile determination method provided in this application can be achieved by the processor of the electronic device calling program code. The program code can be stored in a computer storage medium. This application provides a method for determining the chip junction temperature profile. Figure 1 This application provides a schematic diagram of the implementation process of a method for determining a chip junction temperature profile, as illustrated in the embodiments below. Figure 1 As shown, it includes:

[0051] Step S101: Obtain the train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chips in the running air-cooled converter.

[0052] In this embodiment, the train can be an urban rail train, a high-speed train, etc. The train uses a running air-cooled converter, meaning that the IGBT modules are cooled by a running air-cooled heatsink. The IGBT modules contain IGBT chips and diode chips. The IGBT modules are mounted on a platform installed on the heatsink. In this embodiment, for the running air-cooled heatsink, the cooling airflow of the heatsink changes in real time during vehicle operation, and the heatsink performance, i.e., the thermal resistance model, changes in real time.

[0053] In this embodiment, the temperature of the cooling medium is the temperature of the cooling medium used in the radiator. In this embodiment, the cooling medium is usually air, that is, the temperature of the cooling medium can be considered as the air temperature. In some embodiments, the cooling medium can also be a coolant.

[0054] In this embodiment of the application, the electrical parameters may include voltage, current, power, etc.

[0055] In this embodiment, the electronic device can obtain train speed information, cooling medium temperature of the train's running air-cooled converter, and electrical parameters of the IGBT chip of the running air-cooled converter through input from an input device, such as a keyboard, mouse, or voice input device; it can also obtain information through input from an external storage device, such as a USB flash drive or hard disk drive; it can also obtain information through network reception, such as the Internet or local area network; or it can obtain information by reading local data, etc.

[0056] In some embodiments, the electronic device can be connected to the acquisition device to acquire the train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chips in the running air-cooled converter.

[0057] In this embodiment, the train speed information, cooling medium temperature, and electrical parameters of the IGBT chip of the running air-cooled converter can be simulation data. In some embodiments, the train speed information, cooling medium temperature, and electrical parameters of the chip of the running air-cooled converter can be measured data.

[0058] In this embodiment of the application, the chip can be a diode chip, an IGBT chip, or any other chip.

[0059] Step S102: Determine the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the vehicle speed information; and determine the real-time power loss of the chip based on the electrical parameters.

[0060] In this embodiment of the application, the electronic device pre-stores the correspondence between vehicle speed information and second thermal impedance model parameters. After determining the vehicle speed information, the first thermal impedance model parameters of the heat sink platform corresponding to the chip can be determined based on the vehicle speed information and the pre-established first correspondence between the vehicle speed information and the second thermal impedance model parameters.

[0061] In this embodiment of the application, the real-time power loss of the chip can be calculated based on electrical parameters.

[0062] Step S103: Input the first thermal impedance model parameters and the real-time power loss into the preset Foster model to determine the first real-time temperature rise curve of the heat sink platform corresponding to the chip.

[0063] In this embodiment, the preset Foster model is predetermined. The temperature rise curve at the radiator surface can be obtained experimentally. Then, the parameters of the initial Foster model are trained using the fitted curve determined by the initial Foster model and the temperature rise curve at the radiator surface obtained experimentally. The result is obtained under the condition that the closeness between the fitted curve and the temperature rise curve at the radiator surface obtained experimentally is greater than a preset value, which can be 99%. The Foster model is described in expression (1).

[0064] (1);

[0065] in, The temperature rise curve is shown. For power loss, the thermal impedance model parameters are: … and … where n is the order. For thermal resistance, is the time constant.

[0066] In this embodiment, n is an order. When fitting the fitted curve and the experimentally obtained temperature rise curve at the radiator surface, n takes the minimum value when the closeness between the fitted curve and the experimentally obtained temperature rise curve at the radiator surface, i.e., the degree of fit, is greater than a preset value, thereby reducing the computational complexity.

[0067] In this embodiment of the application, the Foster model can be considered as a model of the calculation relationship between the reaction temperature rise curve, power loss and thermal impedance model parameters. Once any two parameters are determined, other corresponding parameters can be calculated.

[0068] In this embodiment of the application, after the first thermal impedance model parameters and the real-time power loss are determined, the first real-time temperature rise curve of the heat sink surface corresponding to the chip can be calculated.

[0069] Step S104: Determine the second real-time temperature rise curve at the junction of the chip and the third real-time temperature rise curve at the connection between the chip casing and the heat sink.

[0070] In this embodiment of the application, when the vehicle speed information, the cooling medium temperature of the running air-cooled converter of the train, and the electrical parameters of the chip of the running air-cooled converter are measured data, the component information of the converter is determined. It can be calculated in advance and the second real-time temperature rise curve at the junction of the chip is stored in the electronic device. At the same time, the third real-time temperature rise curve at the connection between the chip casing and the heat sink can also be determined in advance and stored in the electronic device.

[0071] In some embodiments, when the vehicle speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chip of the running air-cooled converter are simulation data, a second real-time temperature rise curve at the junction of the chip can be determined based on the parameters of the running air-cooled converter used in the simulation, and a third real-time temperature rise curve at the connection between the chip's casing and the heat sink can also be determined.

[0072] Step S105: Based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve, determine the fourth real-time temperature rise curve of the chip.

[0073] In this embodiment of the application, a fourth real-time temperature rise curve of the chip can be calculated based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve using a thermal network model.

[0074] For example, when the chip is a diode chip, the fourth real-time temperature curve of the diode chip can be represented by the following expression (2):

[0075] (2);

[0076] in, This is the fourth real-time temperature profile of the diode chip. This is the first real-time temperature rise curve. This is the second real-time temperature rise curve. This is the third real-time temperature rise curve.

[0077] When the chip is an IGBT chip, the fourth real-time temperature curve of the IGBT chip can be represented by expression (3):

[0078] (3);

[0079] in, This is the fourth real-time temperature profile of the IGBT chip. This is the first real-time temperature rise curve. This is the second real-time temperature rise curve. This is the third real-time temperature rise curve.

[0080] Step S106: Determine the junction temperature curve of the chip based on the fourth real-time temperature rise curve and the temperature of the cooling medium.

[0081] For air-cooled radiators, the cooling medium temperature is the air temperature, which is usually close to the ambient temperature. For liquid-cooled radiators, the cooling medium temperature is the coolant temperature.

[0082] Following the example above, when the chip is an IGBT chip, the junction temperature curve of the chip is determined based on the fourth real-time temperature rise curve and the cooling medium temperature, and can be calculated using expression (4):

[0083] (4);

[0084] in, This is the junction temperature profile of the IGBT chip. To cool the working fluid.

[0085] When the chip is a diode chip, the junction temperature curve of the chip is determined based on the fourth real-time temperature rise curve and the cooling medium temperature, and can be calculated using expression (5):

[0086] (5);

[0087] in, This is the junction temperature profile of the diode chip. To cool the working fluid.

[0088] This application provides a method for determining the junction temperature profile of a chip. The method involves acquiring train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chip in the running air-cooled converter. Based on the train speed information, a first thermal impedance model parameter of the chip is determined. Based on the electrical parameters, the real-time power loss of the chip is determined. The first thermal impedance model parameter and the real-time power loss are input into a preset Foster model to determine a first real-time temperature rise curve for the heatsink platform corresponding to the chip. A second real-time temperature rise curve is determined at the chip's junction, and a third real-time temperature rise curve is determined at the connection between the chip's casing and the heatsink. Based on the first, second, and third real-time temperature rise curves, a fourth real-time temperature rise curve is determined. Finally, based on the fourth real-time temperature rise curve and the cooling medium temperature, the junction temperature profile of the chip is determined. This method improves the accuracy of calculating the junction temperature of the chip in a running air-cooled converter.

[0089] In some embodiments, before step S102 "determines the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the vehicle speed information", the step of establishing the first correspondence relationship is performed. Figure 2 This application provides a schematic diagram of an implementation process for establishing a first correspondence, as shown in the embodiments of this application. Figure 2 As shown, it includes:

[0090] Step S1: Measure the wind speed distribution on the surface of the radiator of the traveling air-cooled converter under different vehicle speeds.

[0091] In this embodiment, several wind speed test points are set on the surface of the radiator to test and characterize the wind speed distribution of the radiator. The wind speed distribution information at each test point is measured under different vehicle speeds.

[0092] Step S2: Determine the second correspondence between wind speed distribution information and different vehicle speed information;

[0093] In this embodiment of the application, the wind speed distribution information and different vehicle speed information can be further discretized to establish a second correspondence between the wind speed distribution information and the vehicle speed information; the second correspondence is shown in expression (6):

[0094] , , ..., (6);

[0095] In the formula, , , ..., The vehicle speed at the wind speed test point. This is the actual vehicle speed information.

[0096] During actual testing, we tested different vehicle speed conditions as many times as possible and minimized the intervals between test speeds. Meanwhile, airflow is unstable, and wind speed at the same vehicle speed may fluctuate. Therefore, we need to extend the testing time as much as possible and use big data analysis to determine the wind speed distribution value with the highest probability of occurrence at a specific vehicle speed, which will be used as the wind speed distribution at that speed.

[0097] If the wind speed at a specific test point p Corresponding vehicle speed The relationship has an inverse function, as shown in expression (7), that is, when the actual wind speed at the test point is known, a unique vehicle speed can be obtained. This allows us to determine the wind speed at all other wind speed test points. Therefore, we can simplify the correspondence, as shown in expression (8), which establishes a one-to-one correspondence between the wind speed at that point and the vehicle speed, thereby determining the data for all other wind speed test points.

[0098] , (7);

[0099] , , ..., (8);

[0100] Step S3: Obtain the temperature rise curve of the chip on the heat sink platform under different vehicle speed information. The temperature rise curve is obtained through experiments under the condition that the power loss is a preset loss and the wind speed distribution information is satisfied.

[0101] In this embodiment, during experimental testing, one thermoelectric element is placed on the surface of the heat sink, directly below each of the m elements. Using the lumped parameter method, this location represents the temperature of the heat sink surface at that element. This temperature can be determined by either the location with the theoretically highest substrate temperature or the location with the theoretically average substrate temperature. Heating blocks of the same area are used to replace the elements. The test air duct and fan are adjusted to ensure that the airflow distribution of the heat sink in the laboratory environment is as consistent as possible with the actual airflow distribution, thus satisfying the aforementioned airflow distribution. Temperature rise curves at the heat sink surface of the m elements are tested at different vehicle speeds under a preset loss P.

[0102] Step S4: Based on the temperature rise curve, the Foster model is used for fitting calculation to obtain the second thermal impedance model parameters of the heat sink platform corresponding to the chip under different vehicle speed information.

[0103] In this embodiment, based on the aforementioned temperature rise curve, the characteristic parameters of the m components at different vehicle speeds are obtained by fitting them using the following nth-order Foster model. … , … The expression for the Foster model can be found in (9):

[0104] (9);

[0105] In the expression, The temperature rise curve is shown. For power loss, the thermal impedance model parameters are: … and … where n is the order. For thermal resistance, t is the time constant. It is minimized when the fit between the fitted curve and the measured curve (i.e., the goodness of fit) is greater than a preset value (e.g., 99%). Here, n is the order, and t is time. In other words, it reduces computational complexity while meeting application requirements.

[0106] Step S5: Establish the first correspondence between different vehicle speed information and the parameters of the second thermal impedance model.

[0107] In this embodiment of the application, the characteristic parameters of the nth-order Foster model with m elements are... … , … Given a fixed vehicle speed, there is a unique value. The first correspondence between the second thermal impedance characteristic parameters of each component and different vehicle speed information can be expressed by functional relationships (10) and (11), see the functional relationships:

[0108] , , ..., (10);

[0109] , , ..., (11);

[0110] The functional relationships (10) and (11) can be represented by a numerical list. When calling them, the difference method is used to obtain the characteristic parameter values ​​at a specific vehicle speed. Alternatively, they can be fitted into a mathematical expression to directly calculate the thermal impedance characteristic parameter values ​​at a specific vehicle speed.

[0111] Furthermore, if the relationship between wind speed information and vehicle speed information at a specific test point p has an inverse function, the aforementioned parameters can be derived and established. , and feature point vehicle speed The relationship is the first correspondence between different vehicle speed information and the parameters of the second thermal impedance model. The first correspondence is shown in expressions (12) and (13), as follows:

[0112] , , ..., (12);

[0113] , , ..., (13);

[0114] In some embodiments, step S104, determining the second real-time temperature rise curve at the junction of the chip, can be achieved in the following manner:

[0115] Step S41: Obtain the reference thermal impedance model parameters at the chip junction.

[0116] In this embodiment, the chip reference thermal impedance model parameters of the device can be found in the device datasheet and then input into the electronic device so that the electronic device can obtain the reference thermal impedance model parameters.

[0117] Step S42: Input the reference thermal impedance model parameters at the chip junction and the real-time power loss into the Foster model to determine the second real-time temperature rise curve at the chip junction.

[0118] In some embodiments, step S104, determining the third real-time temperature rise curve at the connection between the chip casing and the heat sink, can be achieved in the following manner:

[0119] Step S43: Obtain the thermal conductivity material parameters at the connection between the chip's casing and the heat sink;

[0120] For example, the thermally conductive material may be thermally conductive silicone grease.

[0121] Step S44: Determine the reference thermal impedance model parameters at the connection between the chip's casing and the heat sink based on the thermally conductive material parameters.

[0122] Step S45: Input the reference thermal impedance model parameters based on the connection between the chip's casing and the heat sink, and the real-time power loss into the Foster model to determine the third real-time temperature rise curve at the connection between the chip's casing and the heat sink.

[0123] In some embodiments, after step S105, the method further includes:

[0124] Step S106: If the train speed information, cooling medium temperature and electrical parameters of the running air-cooled converter chip are simulation data, recommend a chip model based on the junction temperature curve of the chip.

[0125] In step S107, if the train speed information, cooling medium temperature and electrical parameters of the chip of the running air-cooled converter are measured data, the junction temperature curve of the chip is sent to the monitoring system.

[0126] The method for determining the chip junction temperature profile provided in this application involves measuring the airflow distribution at the air-cooled radiator at different vehicle speeds during actual vehicle operation. Based on a large amount of data obtained from the tests, and using big data analysis techniques, the method determines the relationship between the airflow distribution and vehicle speed from the perspective of the highest probability of occurrence. The correspondence between the parameters is established to mitigate the impact of uncertainties such as weather and road conditions on the test results. Through experimental simulation, the wind speed distribution on the radiator surface is made as consistent as possible with the vehicle speed distribution. The temperature rise curve is tested at a specific vehicle speed with a constant heat output of P. The temperature rise curve is then fitted using the Foster model to obtain the characteristic parameters. … , … The characteristic parameters of these m test locations characterize the heat dissipation effect of the radiator at different locations under a specific vehicle speed; characteristic parameters … , … With vehicle speed The existing correspondences are represented by functional relationships; based on the real-time vehicle speed of the line, the characteristic parameters at any vehicle speed are obtained by using the difference method or by directly substituting into the functional expression. … , … Based on real-time characteristic parameters, the temperature rise response curve of the heat sink surface to real-time loss P can be obtained according to the Foster model. By analyzing the thermal path model and decomposing the heat transfer links, the real-time response of the chip junction-case temperature rise to real-time loss and the case-heat sink temperature rise to real-time loss are also obtained. Combining the temperature rise response curves of different heat transfer links, the chip temperature rise response curve is obtained. In this embodiment, the steady-state temperature rise curve is obtained through measured wind speed distribution and laboratory simulation. Based on the Foster model for different vehicle speeds, the correspondence between vehicle speed and heat dissipation effect is established, thereby obtaining the chip temperature rise curve under complex operating conditions of varying vehicle speed and heat loss.

[0127] The chip junction temperature curve determination method provided in this invention application employs big data analysis, combining testing and experimental simulation, as well as actual measurement and theoretical analysis, to achieve rapid and accurate calculation of the chip junction temperature. It can be used during design phases to calculate the real-time junction temperature curve of the chip based on electrical simulation circuit data, providing a reference for device selection. It can also be used during vehicle operation to calculate the real-time junction temperature of the chip based on measured circuit data (vehicle speed, voltage, current, etc.) and feed it back to the monitoring system. Furthermore, it can be used for device lifetime analysis, analyzing the real-time status of the device junction temperature based on a large amount of collected real-time circuit data, and combining this with a device lifetime prediction model to analyze the device lifetime.

[0128] Based on the foregoing embodiments, this application provides a device for determining the junction temperature profile of a chip. The various modules and units included in the device can be implemented by a processor in a computer device; of course, they can also be implemented by specific logic circuits. In the implementation process, the processor can be a central processing unit (CPU), a microprocessor (MPU), a digital signal processor (DSP), or a field programmable gate array (FPGA), etc.

[0129] This application provides a device for determining the junction temperature profile of a chip. Figure 3 This is a schematic diagram of a device for determining the junction temperature profile of a chip, provided in an embodiment of this application. Figure 3 As shown, the chip junction temperature profile determination device 300 includes:

[0130] The first acquisition module 301 is used to acquire the train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chip of the running air-cooled converter.

[0131] The first determining module 302 is used to determine the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the vehicle speed information; and to determine the real-time power loss of the chip based on the electrical parameters.

[0132] The second determining module 303 is used to input the first thermal impedance model parameters and the real-time power loss into a preset Foster model to determine the first real-time temperature rise curve of the heat sink surface corresponding to the chip.

[0133] The third determining module 304 is used to determine the second real-time temperature rise curve at the junction of the chip and the third real-time temperature rise curve at the connection between the IGBT chip and the heat sink.

[0134] The fourth determining module 305 is used to determine the fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve.

[0135] The fifth determining module 306 is used to determine the junction temperature curve of the IGBT chip based on the fourth real-time temperature rise curve and the temperature of the cooling medium.

[0136] In some embodiments, the first determining module 302 includes:

[0137] The first determining unit is used to determine the first thermal impedance model parameters of the heat sink surface corresponding to the chip based on the vehicle speed information and the first correspondence between the pre-established vehicle speed information and the second thermal impedance model parameters.

[0138] In some embodiments, the chip junction temperature profile determination device 300 further includes:

[0139] The measurement module is used to measure the wind speed distribution on the surface of the heat sink of the traveling air-cooled converter under different vehicle speeds.

[0140] The sixth determining module is used to determine the second correspondence between wind speed distribution information and different vehicle speed information;

[0141] The acquisition module is used to acquire the temperature rise curve of the chip on the heat sink surface under different vehicle speed information, wherein the temperature rise curve is obtained through experiments under the condition that the power loss is a preset loss and the wind speed distribution information is satisfied.

[0142] The fitting module is used to perform fitting calculations based on the temperature rise curve using the Foster model to obtain the second thermal impedance model parameters of the heat sink platform corresponding to the chip under different vehicle speed information.

[0143] A module is established to establish the first correspondence between different vehicle speed information and the parameters of the second thermal impedance model.

[0144] In some embodiments, the third determining module 304 includes:

[0145] The first acquisition unit is used to acquire the reference thermal impedance model parameters at the chip junction.

[0146] The first calculation unit is used to input the reference thermal impedance model parameters at the chip junction and the real-time power loss into the Foster model to determine the second real-time temperature rise curve at the chip junction.

[0147] In some embodiments, the third determining module 304 further includes:

[0148] The second acquisition unit is used to acquire the thermally conductive material parameters at the connection between the chip's casing and the heat sink.

[0149] The second calculation unit is used to determine the reference thermal impedance model parameters at the connection between the chip's casing and the heat sink based on the thermally conductive material parameters.

[0150] The third calculation unit is used to input the reference thermal impedance model parameters based on the connection between the chip's casing and the heat sink, and the real-time power loss into the Foster model to determine the third real-time temperature rise curve at the connection between the chip's casing and the heat sink.

[0151] In some embodiments, the Foster model is: ;

[0152] in, The temperature rise curve is shown. For power loss, the thermal impedance model parameters are: … and … where n is the order. For thermal resistance, is the time constant.

[0153] In some embodiments, the chip junction temperature profile determination device 300 further includes:

[0154] The recommendation module is used to recommend chip models based on the junction temperature curve of the chip, provided that the train speed information, cooling medium temperature and electrical parameters of the chip of the running air-cooled converter are simulation data.

[0155] The transmitting module is used to transmit the junction temperature curve of the chip to the monitoring system when the train speed information, cooling medium temperature and electrical parameters of the chip of the running air-cooled converter are measured data.

[0156] It should be noted that, in the embodiments of this application, if the above-mentioned method for determining development parameters is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiments of this application, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), magnetic disks, or optical disks. Thus, the embodiments of this application are not limited to any specific hardware and software combination.

[0157] Accordingly, this application provides a storage medium storing a computer program thereon, characterized in that the computer program, when executed by a processor, implements the steps in the chip junction temperature curve determination method provided in the above embodiments.

[0158] This application provides an electronic device; Figure 4 This is a schematic diagram of the composition structure of the electronic device provided in the embodiments of this application, such as... Figure 4 As shown, the electronic device 400 includes: a processor 401, at least one communication bus 402, a user interface 403, at least one external communication interface 404, and a memory 405. The communication bus 402 is configured to enable communication between these components. The user interface 403 may include a display screen, and the external communication interface 404 may include standard wired and wireless interfaces. The processor 401 is configured to execute a program storing a chip junction temperature profile in the memory to implement the steps in the chip junction temperature profile determination method provided in the above embodiment.

[0159] The descriptions of the above embodiments of the electronic devices and storage media are similar to those of the above method embodiments, and have similar beneficial effects. For technical details not disclosed in the embodiments of the computer devices and storage media of this application, please refer to the descriptions of the method embodiments of this application for understanding.

[0160] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this application, the sequence numbers of the above-described processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. The sequence numbers of the above-described embodiments are merely descriptive and do not represent the superiority or inferiority of the embodiments.

[0161] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0162] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be electrical, mechanical, or other forms.

[0163] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units. They may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of this embodiment according to actual needs.

[0164] In addition, each functional unit in the various embodiments of this application can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; the integrated unit can be implemented in hardware or in the form of hardware plus software functional units.

[0165] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media that can store program code, such as mobile storage devices, read-only memory (ROM), magnetic disks, or optical disks.

[0166] Alternatively, if the integrated units described above are implemented as software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this application, or the parts that contribute to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a controller to execute all or part of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, ROMs, magnetic disks, or optical disks.

[0167] The above description is merely an embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for determining the junction temperature profile of a chip, characterized in that, The method includes: The system acquires the train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chip in the running air-cooled converter; determines the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the train speed information; and determines the real-time power loss of the chip based on the electrical parameters. The first thermal impedance model parameters and the real-time power loss are input into the preset Foster model to determine the first real-time temperature rise curve of the heat sink surface corresponding to the chip. A second real-time temperature rise curve is determined at the junction of the chip and a third real-time temperature rise curve is determined at the connection between the chip's casing and the heat sink; based on the first, second, and third real-time temperature rise curves, a fourth real-time temperature rise curve is determined for the chip. The junction temperature curve of the chip is determined based on the fourth real-time temperature rise curve and the temperature of the cooling medium. The step of determining the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the vehicle speed information includes: Based on the vehicle speed information and the first correspondence between the pre-established vehicle speed information and the second thermal impedance model parameters, the first thermal impedance model parameters of the heat sink platform corresponding to the chip are determined. The method further includes: Measure the wind speed distribution on the radiator surface of the traveling air-cooled converter under different vehicle speeds; Determine the second correspondence between wind speed distribution information and different vehicle speed information; The temperature rise curve of the chip at the heat sink surface is obtained under different vehicle speed information. The temperature rise curve is obtained through experiments when the power loss is a preset loss and the wind speed distribution information is satisfied. Based on the temperature rise curve, the Foster model is used to perform fitting calculations to obtain the second thermal impedance model parameters of the heat sink platform corresponding to the chip under different vehicle speed information. Establish the first correspondence between different vehicle speed information and the parameters of the second thermal impedance model.

2. The method according to claim 1, characterized in that, Determining the second real-time temperature rise curve at the junction of the chip includes: Obtain the reference thermal impedance model parameters at the junction of the chip; The reference thermal impedance model parameters at the chip junction and the real-time power loss are input into the Foster model to determine the second real-time temperature rise curve at the chip junction.

3. The method according to claim 1, characterized in that, The third real-time temperature rise curve at the connection point between the chip casing and the heat sink includes: Obtain the thermal conductivity material parameters at the connection between the chip's casing and the heat sink; The reference thermal impedance model parameters at the connection between the chip's casing and the heat sink are determined based on the thermally conductive material parameters. The reference thermal impedance model parameters based on the connection between the chip's casing and the heat sink, and the real-time power loss are input into the Foster model to determine the third real-time temperature rise curve at the connection between the chip's casing and the heat sink.

4. The method according to claim 1, characterized in that, The Foster model is: ; in, The temperature rise curve is shown. For power loss, the thermal impedance model parameters are: … and … where n is the order. For thermal resistance, is the time constant.

5. The method according to claim 1, characterized in that, The method further includes: Given that the train speed information, cooling medium temperature, and electrical parameters of the running air-cooled converter chip are simulation data, a chip model is recommended based on the junction temperature curve of the chip. If the train speed information, cooling medium temperature, and electrical parameters of the running air-cooled converter chip are measured data, the junction temperature curve of the chip is sent to the monitoring system.

6. A device for determining the junction temperature profile of a chip, characterized in that, include: The first acquisition module is used to acquire the train speed information, the cooling medium temperature of the train's running air-cooled converter, and the electrical parameters of the chips of the running air-cooled converter. The first determining module is used to determine the first thermal impedance model parameters of the heat sink platform corresponding to the chip based on the vehicle speed information; and to determine the real-time power loss of the chip based on the electrical parameters. The second determining module is used to input the first thermal impedance model parameters and the real-time power loss into a preset Foster model to determine the first real-time temperature rise curve of the heat sink surface corresponding to the chip. The third determining module is used to determine the second real-time temperature rise curve at the junction of the chip and the third real-time temperature rise curve at the connection between the chip's casing and the heat sink. The fourth determining module is used to determine the fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve. The fifth determining module is used to determine the junction temperature curve of the chip based on the fourth real-time temperature rise curve and the temperature of the cooling medium. The first determining module includes: The first determining unit is used to determine the first thermal impedance model parameters of the heat sink surface corresponding to the chip based on the vehicle speed information and the first correspondence between the pre-established vehicle speed information and the second thermal impedance model parameters. The device further includes: The measurement module is used to measure the wind speed distribution on the surface of the heat sink of the traveling air-cooled converter under different vehicle speeds. The sixth determining module is used to determine the second correspondence between wind speed distribution information and different vehicle speed information; The acquisition module is used to acquire the temperature rise curve of the chip on the heat sink platform under different vehicle speed information, wherein the temperature rise curve is obtained through experiments under the condition that the power loss is a preset loss and the wind speed distribution information is satisfied. The fitting module is used to perform fitting calculations based on the temperature rise curve using the Foster model to obtain the second thermal impedance model parameters of the heat sink platform corresponding to the chip under different vehicle speed information. A module is established to establish the first correspondence between different vehicle speed information and the parameters of the second thermal impedance model.

7. An electronic device, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that, when executed by the processor, performs the method for determining the chip junction temperature profile as described in any one of claims 1 to 5.

8. A storage medium, characterized in that, The computer program stored in the storage medium can be executed by one or more processors and can be used to implement the method for determining the chip junction temperature profile as described in any one of claims 1 to 5.

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