A drop simulation method and device

Abstract

The present application relates to a drop simulation method and device, and relates to the technical field of household appliances. The method includes: establishing a finite element model of the outer packaging of the device to be tested for dropping; determining the element density of the finite element model of the outer packaging corresponding to the current topology optimization process under the condition of global minimum compliance based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each drop calculation condition, the drop loading load, the volume of the mesh elements in the finite element model of the outer packaging, and a preset topology optimization algorithm; performing a drop simulation test on the finite element model of the outer packaging corresponding to the current topology optimization process to obtain a drop simulation result; in each topology optimization process, determining the target topology optimization process with the largest volume optimization ratio according to the drop simulation result, and determining the finite element model of the outer packaging corresponding to the target topology optimization process as the target finite element model of the outer packaging of the device to be tested for dropping. Using the present application, an optimal design result that meets the drop conditions can be obtained quickly.

Description

Technical Field

[0001] This application relates to the technical field of household appliances, and particularly to a drop simulation method and device. Background Art

[0002] Currently, household appliances often experience dropping phenomena during transportation and handling, thus posing higher requirements for the anti-impact strength of product packaging and the product itself. In the prior art, in order to make the product meet the design requirements under dropping conditions, the anti-impact strength of product packaging and the product itself can be verified through actual machine drop experiments and drop simulation technologies, and then designers can redesign the weak parts of the product itself structure or the product packaging structure according to the experimental results.

[0003] However, due to being restricted by human subjective experience during the redesign process, the above method cannot ensure that the anti-impact strength of the design result is optimal, and has the disadvantage of a long design cycle, and cannot quickly obtain the optimal design result that meets the dropping conditions. Summary of the Invention

[0004] Based on this, it is necessary to provide a drop simulation method and device for the above technical problems.

[0005] In a first aspect, a drop simulation method is provided, and the method includes:

[0006] Establish a finite element model of the outer packaging of the device to be dropped, and obtain the damage weights and drop loading loads of each drop calculation condition of the outer packaging of the device to be dropped;

[0007] For each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each drop calculation condition, the drop loading load, the volume of the grid unit in the outer packaging finite element model, and a preset topology optimization algorithm, determine the element density of the grid unit corresponding to each drop calculation condition under the condition of global minimum compliance;

[0008] According to the element density of the grid unit corresponding to each drop calculation condition, determine the outer packaging finite element model corresponding to the current topology optimization process, and perform a drop simulation test on the outer packaging finite element model corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process;

[0009] Determine the volume optimization ratio for the next topology optimization process based on the drop simulation results corresponding to the current topology optimization process, and enter the next topology optimization process until a candidate topology optimization process whose drop simulation results meet the drop simulation requirements is determined in each topology optimization process, and in each of the candidate topology optimization processes, determine the target topology optimization process with the largest volume optimization ratio, and determine the outer package finite element model corresponding to the target topology optimization process as the target outer package finite element model of the device to be drop-tested, and the target outer package finite element model is used to design the outer package of the device to be drop-tested.

[0010] As an alternative implementation, the formula of the topology optimization algorithm is:

[0011]

[0012]

[0013] where C w represents the global compliance, W i represents the damage weight of the i-th drop calculation condition, represents the transpose matrix of the displacement matrix of the i-th drop calculation condition, F i represents the drop load of the i-th drop calculation condition, v j represents the volume of the j-th grid element, represents the element density of the j-th grid element corresponding to the i-th drop calculation condition, a represents the volume optimization ratio corresponding to the current topology optimization process, V represents the initial volume of the outer package finite element model before the current topology optimization, n represents the number of drop calculation conditions, and m represents the number of grid elements in the outer package finite element model.

[0014] As an alternative implementation, the performing a drop simulation test on the outer package finite element model corresponding to the current topology optimization process to obtain the drop simulation results corresponding to the current topology optimization process includes:

[0015] Perform a drop simulation calculation on the outer package finite element model corresponding to the current topology optimization process according to the preset load boundary conditions and solution parameters to obtain the strain nephogram corresponding to the outer package finite element model of the current topology optimization process as the simulation result corresponding to the current topology optimization process.

[0016] As an alternative implementation, the drop simulation requirement is that there is no strain exceeding the preset material limit in the strain nephogram.

[0017] As an alternative implementation, the establishing the outer package finite element model of the device to be drop-tested includes:

[0018] Establish the outer packaging structure model of the device to be drop-tested;

[0019] Perform model simplification, geometric cleaning, and mesh generation on the outer packaging structure model to obtain the finite element model of the outer packaging of the device to be drop-tested.

[0020] As an alternative implementation, obtaining the drop loading loads for each drop calculation condition of the outer packaging of the device to be drop-tested includes:

[0021] Obtain the total mass of the device to be drop-tested and its outer packaging, the drop height, and the ground contact static duration for each drop calculation condition;

[0022] For each drop calculation condition, determine the drop loading load for this drop calculation condition based on the total mass of the device to be drop-tested and its outer packaging, the drop height of this drop calculation condition, and the ground contact static duration.

[0023] As an alternative implementation, for each drop calculation condition, the formula for determining the drop loading load for this drop calculation condition based on the total mass of the device to be drop-tested and its outer packaging, the drop height of this drop calculation condition, and the ground contact static duration is:

[0024]

[0025] where F i represents the drop loading load for the i-th drop calculation condition, m represents the total mass, H i represents the drop height for the i-th drop calculation condition, Δt i represents the ground contact static duration for the i-th drop calculation condition, and g represents the acceleration due to gravity.

[0026] As an alternative implementation, determining the volume optimization ratio for the next topology optimization process based on the drop simulation results corresponding to the current topology optimization process includes:

[0027] If the drop simulation results corresponding to the current topology optimization process meet the drop simulation requirements, then determine the sum value of the volume optimization ratio corresponding to the current topology optimization process and the first preset adjustment ratio as the volume optimization ratio for the next topology optimization process;

[0028] Otherwise, determine the difference value between the volume optimization ratio corresponding to the current topology optimization process and the second preset adjustment ratio as the volume optimization ratio for the next topology optimization process.

[0029] As an alternative implementation, the method further includes:

[0030] Perform a physical drop test on the outer packaging of the drop device to be tested designed according to the target outer packaging finite element model, and obtain the physical drop test results corresponding to the outer packaging;

[0031] If the physical drop test results corresponding to the outer packaging meet the preset drop shock resistance requirements, it is determined that the outer packaging can be applied to the drop device to be tested;

[0032] Otherwise, re - establish the outer packaging finite element model of the drop device to be tested and perform topology optimization.

[0033] In a second aspect, a drop simulation device is provided, and the device includes:

[0034] A modeling module, configured to establish an outer packaging finite element model of a drop device to be tested, and obtain the damage weights and drop loading loads of each drop calculation condition of the outer packaging of the drop device to be tested;

[0035] A topology optimization module, for each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each drop calculation condition, the drop loading load, the volume of the grid cells in the outer packaging finite element model, and a preset topology optimization algorithm, determine the element density of the grid cells corresponding to each drop calculation condition in the case of global minimum compliance;

[0036] A drop simulation module, configured to determine the outer packaging finite element model corresponding to the current topology optimization process according to the element density of the grid cells corresponding to each drop calculation condition, and perform a drop simulation test on the outer packaging finite element model corresponding to the current topology optimization process, to obtain the drop simulation results corresponding to the current topology optimization process;

[0037] A model determination module, configured to determine the volume optimization ratio corresponding to the next topology optimization process according to the drop simulation results corresponding to the current topology optimization process, enter the next topology optimization process, until in each topology optimization process, a candidate topology optimization process whose drop simulation results meet the drop simulation requirements is determined, and in each of the candidate topology optimization processes, determine the target topology optimization process with the largest volume optimization ratio, and determine the outer packaging finite element model corresponding to the target topology optimization process as the target outer packaging finite element model of the drop device to be tested, and the target outer packaging finite element model is used to design the outer packaging of the drop device to be tested.

[0038] As an optional implementation manner, the drop simulation module is specifically configured to:

[0039] According to the preset load boundary conditions and solution parameters, perform a drop simulation calculation on the outer package finite element model corresponding to the current topology optimization process, and obtain the strain nephogram corresponding to the outer package finite element model corresponding to the current topology optimization process as the simulation result corresponding to the current topology optimization process.

[0040] As an optional implementation manner, the requirement of the drop simulation is that there is no strain exceeding the preset material limit in the strain nephogram.

[0041] As an optional implementation manner, the modeling module is specifically configured to:

[0042] Establish the outer package structure model of the device to be dropped under test;

[0043] Perform model simplification, geometric cleaning, and mesh division on the outer package structure model to obtain the outer package finite element model of the device to be dropped under test.

[0044] As an optional implementation manner, the modeling module is specifically configured to:

[0045] Obtain the total mass of the device to be dropped under test and its outer package, the drop height, and the ground contact static duration of each drop calculation condition;

[0046] For each drop calculation condition, determine the drop load of the drop calculation condition according to the total mass of the device to be dropped under test and its outer package, the drop height of the drop calculation condition, and the ground contact static duration.

[0047] As an optional implementation manner, the model determination module is specifically configured to:

[0048] If the drop simulation result corresponding to the current topology optimization process meets the requirements of the drop simulation, then determine the sum value of the volume optimization ratio corresponding to the current topology optimization process and the first preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process;

[0049] Otherwise, determine the difference between the volume optimization ratio corresponding to the current topology optimization process and the second preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process.

[0050] As an optional implementation manner, the device further includes a physical drop verification module, and the physical drop verification module is used for:

[0051] Perform a physical drop experiment on the outer package of the device to be dropped under test designed according to the target outer package finite element model, and obtain the physical drop experiment result corresponding to the outer package;

[0052] If the actual machine drop test result corresponding to the outer package meets the preset drop impact resistance requirement, it is determined that the outer package can be applied to the device to be drop-tested;

[0053] Otherwise, re-establish the finite element model of the outer package of the device to be drop-tested and perform topology optimization.

[0054] In a third aspect, a computer device is provided, including a memory and a processor. A computer program that can run on the processor is stored on the memory. When the processor executes the computer program, the method steps described in the first aspect are implemented.

[0055] In a fourth aspect, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method steps described in the first aspect are implemented.

[0056] This application provides a drop simulation method and device. The technical solutions provided by the embodiments of this application at least bring the following beneficial effects: First, establish a finite element model of the outer package of the device to be drop-tested, and obtain the damage weights and drop loading loads of each drop calculation condition of the outer package of the device to be drop-tested. Then, perform topology optimization on the finite element model of the outer package. For each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each drop calculation condition, the drop loading load, the volume of the grid unit in the finite element model of the outer package, and the preset topology optimization algorithm, determine the element density of the grid unit corresponding to each drop calculation condition in the case of global minimum compliance; according to the element density of the grid unit corresponding to each drop calculation condition, determine the finite element model of the outer package corresponding to the current topology optimization process, and perform a drop simulation test on the finite element model of the outer package corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process. According to the drop simulation result corresponding to the current topology optimization process, determine the volume optimization ratio corresponding to the next topology optimization process, and enter the next topology optimization process until, in each topology optimization process, a candidate topology optimization process whose drop simulation result meets the drop simulation requirement is determined, and in each candidate topology optimization process, a target topology optimization process with the largest volume optimization ratio is determined, and the finite element model of the outer package corresponding to the target topology optimization process is determined as the target finite element model of the outer package of the device to be drop-tested. Through the above method, the topology optimization result can be quickly calculated according to the set topology optimization algorithm, and then the optimal design result that meets the drop condition can be obtained through multiple iterative optimizations, which is more scientific and efficient than the conventional manual modification of the structural scheme.

[0057] It should be understood that the above general description and subsequent detailed description are only exemplary and explanatory, and cannot limit this application. Description of the Drawings

[0058] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0059] Figure 1 It is a flowchart of a drop simulation method provided by an embodiment of the present application;

[0060] Figure 2 It is a schematic diagram of a drop calculation condition in a finite element model of a foam outer package of a gas water heater provided by an embodiment of the present application;

[0061] Figure 3 It is a schematic diagram of a foam outer package structure model of a gas water heater provided by an embodiment of the present application;

[0062] Figure 4 It is a schematic diagram of a finite element model of a foam outer package of a gas water heater provided by an embodiment of the present application;

[0063] Figure 5 It is a schematic diagram of a finite element model of a gas water heater provided by an embodiment of the present application;

[0064] Figure 6 It is a schematic diagram of the topology optimization result of a finite element model of a foam outer package of a gas water heater provided by an embodiment of the present application;

[0065] Figure 7 It is a schematic diagram of an adjusted finite element model of a foam outer package of a gas water heater provided by an embodiment of the present application;

[0066] Figure 8 It is a schematic diagram of another adjusted finite element model of a foam outer package of a gas water heater provided by an embodiment of the present application;

[0067] Figure 9 It is a flowchart of a drop simulation test provided by an embodiment of the present application;

[0068] Figure 10 It is a flowchart of iterative optimization simulation and proofing verification provided by an embodiment of the present application;

[0069] Figure 11 It is a flowchart of an example of a drop simulation method provided by an embodiment of the present application;

[0070] Figure 12 It is a schematic diagram of the structure of a drop simulation device provided by an embodiment of the present application;

[0071] Figure 13 The structural schematic diagram of a computer device provided by an embodiment of the present application. Detailed implementation manners

[0072] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0073] The drop simulation method provided by the embodiment of the present application can be applied to the structural optimization process of the product packaging and the product itself of household appliances involving drop conditions. For example, the objects of structural optimization can be the foam outer packaging of household appliances, the sheet metal parts of the outer shell of a range hood, and the internal load-bearing components of a gas water heater, etc.

[0074] Next, taking the structural optimization of the foam outer packaging of a gas water heater as an example, in combination with the specific implementation manners, a drop simulation method provided by the embodiment of the present application will be described in detail. Figure 1 The flowchart of a drop simulation method provided by the embodiment of the present application is as Figure 1 shown, and the specific steps are as follows:

[0075] Step 101, establish a finite element model of the outer packaging of the device to be dropped, and obtain the damage weights and drop loading loads of each drop calculation condition of the outer packaging of the device to be dropped.

[0076] In implementation, first establish a finite element model of the foam outer packaging of the gas water heater. Then, obtain the damage weights and drop loading loads of each drop calculation condition of the foam outer packaging of the gas water heater. Among them, the drop calculation conditions can be determined according to the actual drop situation of the device to be dropped, and the embodiment of the present application does not make any limitations. For example, set the drop calculation conditions of a gas water heater with a foam outer packaging having a cuboid shape, including the conditions of dropping with the 6 faces, 8 corners, and 12 edges of the cuboid facing downwards respectively. Further, for each drop calculation condition, according to the importance of the drop calculation condition in the entire drop scenario, determine the weighting coefficient (i.e., the damage weight) corresponding to the drop calculation condition. Set a higher weighting coefficient for the drop calculation conditions with higher drop risks and where the device to be dropped is prone to damage, and set a lower weighting coefficient for the drop calculation conditions with lower drop risks and where the device to be dropped is not prone to damage. For example, Figure 2 The schematic diagram of the drop calculation conditions in a finite element model of the foam outer packaging of a gas water heater provided by the embodiment of the present application is as Figure 2As shown, the drop calculation conditions for a gas water heater with a foam outer package are set as the conditions where each of the six faces of a cuboid drops downward. In an actual drop scenario, when a certain face drops downward, the gas water heater is more severely damaged. The weighting coefficient for this drop calculation condition is set to 0.25, and the weighting coefficients for the remaining five drop calculation conditions are each set to 0.15. The sum of the weighting coefficients for the six drop calculation conditions is 1. It should be noted that the drop loading load is the actual load of the drop test device with the outer package during the drop, that is, the load applied to the finite element model in the calculation of the finite element model. Preferably, the drop loading load for each drop calculation condition is determined based on the total mass of the drop test device and the outer package, the drop height corresponding to the drop calculation condition, and the ground contact stationary duration.

[0077] As an alternative implementation, the process of the computer device establishing the finite element model of the outer package of the drop test device is as follows:

[0078] Step 1, establish the outer package structure model of the drop test device.

[0079] In implementation, first, the outer package structure model of the drop test device can be established according to the structure and packaging requirements of the drop test device. For example, Figure 3 is a schematic diagram of the foam outer package structure model of a gas water heater provided in an embodiment of the present application.

[0080] Step 2, perform model simplification, geometric cleaning, and mesh division on the outer package structure model to obtain the finite element model of the outer package of the drop test device.

[0081] In implementation, perform model simplification, geometric cleaning, and mesh division on the outer package structure model to obtain the finite element model of the outer package of the drop test device. For example, Figure 4 is a schematic diagram of the finite element model of the foam outer package of a gas water heater provided in an embodiment of the present application. It should be noted that for the sake of facilitating subsequent drop simulation tests, the structure model of the drop test device also needs to be subjected to model simplification, geometric cleaning, and mesh division. For example, Figure 5 is a schematic diagram of the finite element model of a gas water heater provided in an embodiment of the present application. As Figure 5 shown, the internal structure of the gas water heater is removed, and only the outer shape of the gas water heater is retained.

[0082] As an alternative implementation, the process of the computer device obtaining the drop loading load for each drop calculation condition of the outer package of the drop test device is as follows:

[0083] Step 1, obtain the total mass of the drop test device and the outer package, the drop height for each drop calculation condition, and the ground contact stationary duration.

[0084] In implementation, the drop loading load for each drop calculation condition is determined based on the total mass of the drop test equipment and its outer packaging, the drop height corresponding to the drop calculation condition, and the ground contact static duration. Therefore, first, obtain the total mass of the drop test equipment and its outer packaging, the drop height of each drop calculation condition, and the ground contact static duration. Among them, the drop height of each drop calculation condition can be obtained through testing according to the drop scenario of the product and the internal test standard, and the ground contact static duration can be determined by the designer based on empirical data or obtained through observation by a high-speed camera and stored in a computer device. For example, for the gas water heater described in step 101, the drop height for the conditions where each of the six faces falls downward is 760 mm, and the ground contact static duration is 0.06 s for all of them.

[0085] Step 2: For each drop calculation condition, determine the drop loading load for this drop calculation condition based on the total mass of the drop test equipment and its outer packaging, the drop height of this drop calculation condition, and the ground contact static duration.

[0086] In implementation, for each drop calculation condition, the drop loading load F i is equal to the sum of the impact force F i ' when the drop test equipment and its outer packaging fall to the ground in the i-th drop calculation condition and the gravity of the drop test equipment and its outer packaging, that is, F i = F i '+ mg, where m represents the total mass of the drop test equipment and its outer packaging. Since in the i-th drop calculation condition, the impact force F i ' when the drop test equipment and its outer packaging fall to the ground is mΔv i / Δt i , where Δv i represents the velocity difference from the maximum velocity when the drop test equipment and its outer packaging in the i-th drop calculation condition contact the ground to being stationary, and Δt i represents the ground contact static duration of the i-th drop calculation condition. At the same time, Δv i 2 = 2H i g, where H i represents the drop height of the i-th drop calculation condition. Therefore, the drop loading load for this drop calculation condition can be determined based on the total mass of the drop test equipment and its outer packaging, the drop height of this drop calculation condition, and the ground contact static duration. The formula is:

[0087]

[0088] Among them, F i represents the drop loading load of the i-th drop calculation condition, m represents the total mass, H i represents the drop height of the i-th drop calculation condition, and Δti represents the ground contact static duration of the i-th drop calculation condition, and g represents the acceleration due to gravity.

[0089] Step 102: For each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each drop calculation condition, the drop loading load, the volume of the mesh elements in the outer packaging finite element model, and the preset topology optimization algorithm, determine the element density of the mesh elements corresponding to each drop calculation condition under the condition of global minimum compliance.

[0090] In implementation, after setting up the finite element model, the corresponding optimization method can be determined according to the structure to be optimized actually. This application embodiment will introduce the topology optimization process of the foam outer packaging of the gas water heater. In order to improve the energy absorption and protection ability of the foam outer packaging structure, it is necessary to ensure that the ratio of the stiffness to the volume of the foam is the largest. In the topology optimization process, the problem of maximum stiffness can be equivalently studied as the problem of minimum compliance, and compliance can be defined by strain energy. Therefore, in this application embodiment, an optimization model is established with the global minimum compliance (i.e., the minimum weighted strain energy) as the optimization objective, the element density of the mesh elements as the optimization variable, and the volume fraction of the design area (i.e., the volume optimization ratio) as the constraint condition. Among them, the design area is the area where structural optimization needs to be carried out, which is the foam outer packaging area in this application embodiment, and the volume optimization ratio is the upper limit of the reduction of the volume of the optimized design area relative to the initial volume (for example, 30%). It should be noted that in the finite element model, the product of the volume of a certain mesh element and the element density corresponding to the mesh element is the actual volume of the mesh element. Therefore, the constraint condition can be set that the actual volume of the design area calculated by weighting the element density of the mesh elements corresponding to each drop calculation condition after the current topology optimization is less than or equal to the product of the volume optimization ratio and the initial volume relative to the initial volume before the current topology optimization.

[0091] Furthermore, in this application embodiment, a commonly used multi-stiffness linear superposition model is adopted to comprehensively express the compliance target values under multiple drop calculation conditions as the global compliance target value. Therefore, the objective function of the global compliance can be expressed as the following formula:

[0092]

[0093] where C w represents the global compliance (i.e., the weighted strain energy), W i represents the damage weight of the i-th drop calculation condition, represents the transpose matrix of the displacement matrix of the i-th drop calculation condition, and F iDenote the drop load for the i-th drop calculation condition. It should be noted that in the finite element software, after inputting the loads and boundary conditions of the finite element model, the displacement matrix can be calculated based on the stiffness matrix after meshing the finite element model. The basic principle formula is F = kx, where F represents the load, K represents the stiffness, X represents the displacement, the stiffness K can be determined by the elastic modulus E and the cross-sectional area A, the elastic modulus E is set according to the material type, and the cross-sectional area A is determined according to the element density of the mesh element. The implementation principle can refer to the element method in the finite element calculation model.

[0094] As an optional implementation manner, the formula of the topology optimization algorithm is:

[0095]

[0096]

[0097] where C w denotes the global compliance, W i denotes the damage weight for the i-th drop calculation condition, denotes the transpose matrix of the displacement matrix for the i-th drop calculation condition, F i denotes the drop load for the i-th drop calculation condition, v j denotes the volume of the j-th mesh element, denotes the element density of the j-th mesh element corresponding to the i-th drop calculation condition, a represents the volume optimization ratio corresponding to the current topology optimization process, V represents the initial volume of the outer package finite element model before the current topology optimization, n represents the number of drop calculation conditions, and m represents the number of mesh elements in the outer package finite element model.

[0098] It should be noted that in other optimization cases, the optimization object can be set to other components, and the constraint conditions and optimization objectives can be adjusted accordingly according to the actual calculation conditions. The modifications caused by replacing the product and calculation conditions are within the protection scope of this application.

[0099] Step 103: Determine the outer package finite element model corresponding to the current topology optimization process according to the element density of the mesh elements corresponding to each drop calculation condition, and perform a drop simulation test on the outer package finite element model corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process.

[0100] In implementation, the computer device can perform weighted calculation through an internal algorithm according to the element density of the mesh elements corresponding to each drop calculation condition to determine the topology optimization result of the outer package finite element model corresponding to the current topology optimization process. For example, Figure 6Schematic diagram of the topology optimization result of the finite element model of the foam outer packaging of a gas water heater provided by an embodiment of the present application. As Figure 6 shown, the area with a lower gray value indicates a smaller element density, and the area with a higher gray value indicates a larger element density. Preferably, the designer can adjust the structure of the finite element model according to the topology optimization result. For example, the value range of the element density is 0 to 1. The designer can remove the area where the element density is less than 0.2 according to the topology optimization principle. The finite element model of the foam outer packaging of the gas water heater obtained is as Figure 7 and Figure 8 shown. Then, a drop simulation test is performed on the finite element model of the outer packaging corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process. In the drop simulation test, drop simulation calculations are performed for each drop calculation condition respectively.

[0101] As an optional implementation manner, Figure 9 a flowchart of a drop simulation test provided by an embodiment of the present application. As Figure 9 shown, the processing process of performing a drop simulation test on the finite element model of the outer packaging corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process is as follows:

[0102] Step 901, set the load boundary conditions and solution parameters;

[0103] Step 902, perform a drop simulation calculation on the finite element model of the outer packaging corresponding to the current topology optimization process;

[0104] Step 903, if an error occurs during the solution calculation, check whether the load boundary conditions and solution parameters of the finite element model meet the calculation conditions, and execute Step 901 to reset the load boundary conditions and solution parameters, otherwise execute Step 904;

[0105] Step 904, output the strain nephogram.

[0106] Step 104, according to the drop simulation result corresponding to the current topology optimization process, determine the volume optimization ratio corresponding to the next topology optimization process, and enter the next topology optimization process until, in each topology optimization process, a candidate topology optimization process whose drop simulation result meets the drop simulation requirements is determined, and in each candidate topology optimization process, a target topology optimization process with the largest volume optimization ratio is determined. The finite element model of the outer packaging corresponding to the target topology optimization process is determined as the target finite element model of the outer packaging of the device to be tested for dropping. The target finite element model of the outer packaging is used to design the outer packaging of the device to be tested for dropping.

[0107] In implementation, in order to maximize the volume optimization ratio of the outer package finite element model as much as possible and avoid incomplete structural optimization caused by errors between the drop simulation test and the actual drop scenario, in the embodiments of the present application, a method of multiple iterative optimizations is adopted. During the next topology optimization process, the volume optimization ratio is adjusted, and then the drop simulation test is used to verify whether the optimized structure meets the preset drop simulation requirements. For example, the volume optimization ratio in the first topology optimization process is 30%. After verifying through the drop simulation test that the optimized structure meets the drop simulation requirements, then, in the next topology optimization process, the volume optimization ratio can be adjusted to 60%, and then it is verified according to the drop simulation test whether the optimized structure meets the drop simulation requirements. If the drop simulation result corresponding to a volume optimization ratio of 60% does not meet the drop simulation requirements, the volume optimization ratio can be reduced and the topology optimization is performed again, or the designer can re-adjust the structure of the outer package finite element model according to the topology optimization result corresponding to the current topology optimization process; otherwise, the volume optimization ratio can be increased and the topology optimization is performed again. It should be noted that the designer can set the exit condition for iterative optimization. When the computer device determines that the current topology optimization process meets the exit condition, the topology optimization process ends. Preferably, the drop simulation requirement is that there is no strain exceeding the preset material limit in the strain nephogram.

[0108] It should be noted that in the embodiments of the present application, the method of multiple iterative optimizations is adopted to gradually increase the volume optimization ratio, rather than setting a large volume optimization ratio in the first topology optimization process. This is because during the iterative optimization process, the designer can modify the structure of the finite element model according to the situations that cannot be considered by the software program. In this way, the result obtained through multiple optimizations will have better drop protection performance than the result obtained by directly optimizing a large volume optimization ratio. Through multiple iterative optimizations plus simulation verification in the embodiments of the present application, among the candidate topology optimization processes that meet the drop simulation requirements, the target topology optimization process with the largest volume optimization ratio can be determined, that is, the optimal design result that meets the drop condition. Finally, the outer package finite element model corresponding to the target topology optimization process is determined as the target outer package finite element model of the device to be drop-tested, and the outer package of the device to be drop-tested is designed according to the target outer package finite element model, which is more scientific and efficient than the conventional manual modification of the structural scheme.

[0109] During the iterative optimization process, the volume optimization ratio corresponding to the next topology optimization process can be set according to the design requirements. As an optional implementation manner, the processing procedure for the computer device to determine the volume optimization ratio corresponding to the next topology optimization process according to the drop simulation result corresponding to the current topology optimization process is as follows:

[0110] Step 1, if the drop simulation result corresponding to the current topology optimization process meets the drop simulation requirements, then determine the sum value of the volume optimization ratio corresponding to the current topology optimization process and the first preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process.

[0111] In implementation, if the drop simulation result corresponding to the current topology optimization process meets the drop simulation requirements, it indicates that there may still be room for optimization in the outer package finite element model corresponding to the current topology optimization process. Then determine the sum value of the volume optimization ratio corresponding to the current topology optimization process and the first preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process. Among them, the first preset adjustment ratio can be determined by the designer according to experience and stored in the computer device in advance.

[0112] Step 2, otherwise, determine the difference value between the volume optimization ratio corresponding to the current topology optimization process and the second preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process.

[0113] If the drop simulation result corresponding to the current topology optimization process does not meet the drop simulation requirements, it indicates that the outer package finite element model corresponding to the current topology optimization process is not available and the volume optimization ratio needs to be reduced. Then determine the difference value between the volume optimization ratio corresponding to the current topology optimization process and the second preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process. Among them, the second preset adjustment ratio can be determined by the designer according to experience and stored in the computer device in advance.

[0114] As an alternative implementation, the drop protection effect of the target outer package finite element model can be further verified through a physical drop experiment. The processing process of the embodiment of the present application further includes:

[0115] Step 1, conduct a physical drop experiment on the outer package of the test drop device designed according to the target outer package finite element model to obtain the physical drop experiment result corresponding to the outer package;

[0116] Step 2, if the physical drop experiment result corresponding to the outer package meets the preset drop impact resistance requirements, then determine that the outer package can be applied to the test drop device;

[0117] Step 3, otherwise, re - establish the outer package finite element model of the test drop device and conduct topology optimization.

[0118] For ease of understanding, Figure 10 is a flowchart of an iterative optimization simulation and proof - of - concept verification provided by the embodiment of the present application. As Figure 10 shown, the processing process is as follows:

[0119] Step 1001, build an initial finite element model;

[0120] Step 1002: Perform topology optimization on the initial finite element model to obtain the initial structure;

[0121] Step 1003: Conduct a drop simulation test on the initial structure to determine whether the drop simulation passes (i.e., whether the drop simulation results meet the drop simulation requirements);

[0122] If it passes, execute Step 1004; otherwise, execute Step 1002;

[0123] Step 1004: Determine the second - edition finite element model;

[0124] Step 1005: Perform topology optimization on the second - edition finite element model to obtain the second - edition structure;

[0125] Step 1006: Conduct a drop simulation test on the second - edition structure to determine whether the drop simulation passes;

[0126] If it passes, execute Step 1007; otherwise, execute Step 1005;

[0127] Step 1007: Repeatedly execute Steps 1004 to 1006. Through multiple iterations of optimization and drop simulation verification, obtain the n - th edition finite element model, and determine the target finite element model among the finite element models of each edition;

[0128] Step 1008: Conduct a proof - of - concept verification on the target finite element model (i.e., a real - machine drop experiment) to determine whether the structure corresponding to the target finite element model meets the drop impact resistance requirements;

[0129] If it meets the drop impact resistance requirements, execute Step 1009; otherwise, execute Step 1007;

[0130] Step 1009: Determine the target finite element model as the final finite element model.

[0131] Figure 11 The flowchart of an example of a drop simulation method provided by an embodiment of this application is as follows. Figure 11 As shown, the processing procedure is as follows:

[0132] Step 1101: Establish a structural model based on the structure of the object to be optimized, perform model simplification, geometric cleaning, and mesh generation to establish the finite element model of the object to be optimized;

[0133] Step 1102: Determine the loading load of the object to be optimized under the drop calculation conditions according to the product characteristics of the object to be optimized;

[0134] Step 1103: Set the drop calculation conditions and the weighting coefficients corresponding to each drop calculation condition

[0135] Step 1104, set the optimization region, constraint conditions, and optimization objectives for the topology optimization process;

[0136] Step 1105, perform topology optimization on the finite element model to obtain the topology optimization result and construct the initial version of the structure;

[0137] Step 1106, perform a drop simulation calculation on the initial version of the structure to determine whether the drop simulation passes;

[0138] If it passes, execute Step 1107; otherwise, execute Step 1105;

[0139] Step 1107, determine the initial version of the finite element model;

[0140] Step 1108, perform proofing verification on the initial version of the finite element model to determine whether the structure corresponding to the initial version of the finite element model meets the drop impact resistance requirements;

[0141] If it meets the requirements, execute Step 1109; otherwise, execute Step 1101;

[0142] Step 1109, determine the final version of the finite element model.

[0143] The embodiment of the present application provides a drop simulation method. First, establish a finite element model of the outer packaging of the device to be dropped, and obtain the damage weights and drop loading loads of each drop calculation condition of the outer packaging of the device to be dropped. Then, perform topology optimization on the outer packaging finite element model. For each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each drop calculation condition, the drop loading load, the volume of the grid unit in the outer packaging finite element model, and the preset topology optimization algorithm, determine the element density of the grid unit corresponding to each drop calculation condition in the case of global minimum compliance; according to the element density of the grid unit corresponding to each drop calculation condition, determine the outer packaging finite element model corresponding to the current topology optimization process, and perform a drop simulation test on the outer packaging finite element model corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process. According to the drop simulation result corresponding to the current topology optimization process, determine the volume optimization ratio corresponding to the next topology optimization process, and enter the next topology optimization process until, in each topology optimization process, a candidate topology optimization process whose drop simulation result meets the drop simulation requirements is determined, and in each candidate topology optimization process, a target topology optimization process with the largest volume optimization ratio is determined, and the outer packaging finite element model corresponding to the target topology optimization process is determined as the target outer packaging finite element model of the device to be dropped. In the embodiment of the present application, the topology optimization result can be quickly calculated according to the set topology optimization algorithm, and then the optimal design result that meets the drop conditions can be obtained through multiple iterative optimizations, which is more scientific and efficient than the conventional manual modification of the structure scheme.

[0144] It should be understood that although Figure 1 and Figures 9 to 11 the steps in the flowchart are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise clearly stated in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 1 and Figures 9 to 11 at least a part of the steps in can include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0145] It should be understood that for the same / similar parts between the various embodiments of the above method in this specification, reference can be made to each other. Each embodiment focuses on the differences from other embodiments, and for the relevant parts, reference can be made to the descriptions of other method embodiments.

[0146] The embodiments of the present application also provide a drop simulation device, as Figure 12 shown, the device includes:

[0147] A modeling module 1210, configured to establish a finite element model of the outer package of the device to be dropped under test, and obtain the damage weights and drop loading loads of each drop calculation condition of the outer package of the device to be dropped under test;

[0148] A topology optimization module 1220, configured to, for each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each drop calculation condition, the drop loading load, the volume of the grid cells in the outer package finite element model, and a preset topology optimization algorithm, determine the element density of the grid cells corresponding to each drop calculation condition in the case of global minimum compliance;

[0149] A drop simulation module 1230, configured to determine the outer package finite element model corresponding to the current topology optimization process according to the element density of the grid cells corresponding to each drop calculation condition, and perform a drop simulation test on the outer package finite element model corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process;

[0150] A model determination module 1240, configured to determine a volume optimization ratio corresponding to a next topology optimization process according to a drop simulation result corresponding to a current topology optimization process, enter the next topology optimization process, and continue until, in each topology optimization process, a candidate topology optimization process whose drop simulation result meets the drop simulation requirements is determined, and among the candidate topology optimization processes, a target topology optimization process with the largest volume optimization ratio is determined, and an outer package finite element model corresponding to the target topology optimization process is determined as the target outer package finite element model of the device to be drop-tested, and the target outer package finite element model is used to design the outer package of the device to be drop-tested.

[0151] As an optional implementation manner, the drop simulation module is specifically configured to:

[0152] Perform a drop simulation calculation on the outer package finite element model corresponding to the current topology optimization process according to preset load boundary conditions and solution parameters, and obtain a strain nephogram corresponding to the outer package finite element model of the current topology optimization process as the simulation result corresponding to the current topology optimization process.

[0153] As an optional implementation manner, the drop simulation requirement is that there is no strain exceeding the preset material limit in the strain nephogram.

[0154] As an optional implementation manner, the modeling module is specifically configured to:

[0155] Establish an outer package structure model of the device to be drop-tested;

[0156] Perform model simplification, geometric cleaning, and mesh generation on the outer package structure model to obtain an outer package finite element model of the device to be drop-tested.

[0157] As an optional implementation manner, the modeling module is specifically configured to:

[0158] Obtain the total mass of the device to be drop-tested and its outer package, the drop height, and the ground contact static duration of each drop calculation condition;

[0159] For each drop calculation condition, determine the drop loading load of the drop calculation condition according to the total mass of the device to be drop-tested and its outer package, the drop height of the drop calculation condition, and the ground contact static duration.

[0160] As an optional implementation manner, the model determination module is specifically configured to:

[0161] If the drop simulation result corresponding to the current topology optimization process meets the drop simulation requirements, then determine the sum value of the volume optimization ratio corresponding to the current topology optimization process and a first preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process;

[0162] Otherwise, determine the difference between the volume optimization ratio corresponding to the current topology optimization process and the second preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process.

[0163] As an optional implementation manner, the device further includes a physical machine drop verification module, and the physical machine drop verification module is configured to:

[0164] Perform a physical machine drop experiment on the outer package of the device to be dropped under test designed according to the target outer package finite element model, and obtain the physical machine drop experiment result corresponding to the outer package;

[0165] If the physical machine drop experiment result corresponding to the outer package meets the preset drop impact resistance requirement, determine that the outer package can be applied to the device to be dropped under test;

[0166] Otherwise, re - establish the outer package finite element model of the device to be dropped under test and perform topology optimization.

[0167] The embodiment of the present application provides a drop simulation device. First, establish an outer package finite element model of the device to be dropped under test, and obtain the damage weights and drop loading loads of each drop calculation condition of the outer package of the device to be dropped under test. Then, perform topology optimization on the outer package finite element model. For each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each drop calculation condition, the drop loading load, the volume of the grid unit in the outer package finite element model, and the preset topology optimization algorithm, determine the element density of the grid unit corresponding to each drop calculation condition in the case of global minimum compliance; according to the element density of the grid unit corresponding to each drop calculation condition, determine the outer package finite element model corresponding to the current topology optimization process, and perform a drop simulation test on the outer package finite element model corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process. According to the drop simulation result corresponding to the current topology optimization process, determine the volume optimization ratio corresponding to the next topology optimization process, and enter the next topology optimization process until, in each topology optimization process, a candidate topology optimization process whose drop simulation result meets the drop simulation requirement is determined, and in each candidate topology optimization process, a target topology optimization process with the largest volume optimization ratio is determined, and the outer package finite element model corresponding to the target topology optimization process is determined as the target outer package finite element model of the device to be dropped under test. In the embodiment of the present application, the topology optimization result can be quickly calculated according to the set topology optimization algorithm, and then the optimal design result meeting the drop condition can be obtained through multiple iterative optimizations, which is more scientific and efficient than the conventional manual modification of the structure scheme.

[0168] For the specific limitations of the drop simulation device, reference may be made to the limitations of the drop simulation method in the foregoing text, which will not be elaborated herein. Each module in the above drop simulation device can be implemented in whole or in part by software, hardware, and their combination. Each of the above modules can be embedded in the processor of the computer device in hardware form or be independent of it, or can be stored in the memory of the computer device in software form, so as to facilitate the processor to call and execute the operations corresponding to each of the above modules.

[0169] In one embodiment, a computer device is provided, as Figure 13 shown, including a memory and a processor. A computer program that can run on the processor is stored on the memory. When the processor executes the computer program, the method steps of the above drop simulation are implemented.

[0170] In one embodiment, a computer-readable storage medium has a computer program stored thereon. When the computer program is executed by a processor, the steps of the method of the above drop simulation are implemented.

[0171] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to the memory, storage, database, or other media used in the various embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0172] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0173] It should also be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for display, data for analysis, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0174] Each embodiment in this specification is described in a related manner. For the same or similar parts between each embodiment, reference can be made to each other, and the differences between each embodiment and other embodiments are emphasized. In particular, for system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and reference can be made to the corresponding parts of the method embodiments for the relevant content.

[0175] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.

[0176] The above-described embodiments only represent several implementation manners of this application, and the description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application shall be subject to the appended claims.

Claims

1. A drop simulation method, characterized in that, The method includes: Establishing a finite element model of the outer package of the device to be drop-tested, and obtaining the damage weights and drop loading loads of each drop calculation condition of the outer package of the device to be drop-tested; For each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weights of each of the drop calculation conditions, the drop loading load, the volume of the mesh elements in the finite element model of the outer package, and a preset topology optimization algorithm, determining the element density of the mesh elements corresponding to each of the drop calculation conditions under the condition of global minimum compliance; According to the element density of the mesh elements corresponding to each of the drop calculation conditions, determining the finite element model of the outer package corresponding to the current topology optimization process, and performing a drop simulation test on the finite element model of the outer package corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process; According to the drop simulation result corresponding to the current topology optimization process, determining the volume optimization ratio corresponding to the next topology optimization process, entering the next topology optimization process, until in each topology optimization process, a candidate topology optimization process whose drop simulation result meets the drop simulation requirements is determined, and in each of the candidate topology optimization processes, determining the target topology optimization process with the largest volume optimization ratio, and determining the finite element model of the outer package corresponding to the target topology optimization process as the target finite element model of the outer package of the device to be drop-tested, and the target finite element model of the outer package is used to design the outer package of the device to be drop-tested.

2. The method according to claim 1, characterized in that, The formula of the topology optimization algorithm is: Among them, C w represents the global flexibility, W i represents the damage weight of the i-th drop calculation condition, represents the transposed matrix of the displacement matrix of the i-th drop calculation condition, F i represents the drop loading load of the i-th drop calculation condition, v j represents the volume of the j-th grid element, represents the element density of the j-th grid element corresponding to the i-th drop calculation condition, a represents the volume optimization ratio corresponding to the current topology optimization process, V represents the initial volume of the outer packaging finite element model before the current topology optimization, n represents the number of drop calculation conditions, and m represents the number of grid elements in the outer packaging finite element model.

3. The method according to claim 1, wherein The performing a drop simulation test on the finite element model of the outer package corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process includes: Performing a drop simulation calculation on the finite element model of the outer package corresponding to the current topology optimization process according to the preset load boundary conditions and solution parameters to obtain the strain nephogram corresponding to the finite element model of the outer package corresponding to the current topology optimization process as the simulation result corresponding to the current topology optimization process.

4. The method according to claim 3, characterized in that The drop simulation requirement is that there is no strain exceeding the preset material limit in the strain nephogram.

5. The method according to claim 1, wherein The establishing a finite element model of the outer package of the device to be drop-tested includes: Establishing the outer package structure model of the device to be drop-tested; Performing model simplification, geometric cleaning, and mesh generation on the outer package structure model to obtain the finite element model of the outer package of the device to be drop-tested.

6. The method according to claim 1, wherein The obtaining the drop loading loads of each drop calculation condition of the outer package of the device to be drop-tested includes: Obtaining the total mass of the device to be drop-tested and its outer package, the drop height and the ground contact static duration of each drop calculation condition; For each drop calculation condition, determining the drop loading load of this drop calculation condition according to the total mass of the device to be drop-tested and its outer package, the drop height of this drop calculation condition, and the ground contact static duration.

7. The method according to claim 1, characterized in that, The formula for determining the drop loading load of each drop calculation condition according to the total mass of the device to be drop-tested and its outer package, the drop height of this drop calculation condition, and the ground contact static duration is: Among them, F i represents the drop loading load for the i-th drop calculation condition, m represents the total mass, and H i represents the drop height for the i-th drop calculation condition, and Δt i represents the ground contact static duration for the i-th drop calculation condition, and g represents the acceleration due to gravity.

8. The method according to claim 1, wherein Determining the volume optimization ratio corresponding to the next topology optimization process according to the drop simulation result corresponding to the current topology optimization process includes: If the drop simulation result corresponding to the current topology optimization process meets the drop simulation requirements, then determine the sum value of the volume optimization ratio corresponding to the current topology optimization process and the first preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process; Otherwise, determine the difference value between the volume optimization ratio corresponding to the current topology optimization process and the second preset adjustment ratio as the volume optimization ratio corresponding to the next topology optimization process.

9. The method according to claim 1, wherein The method further includes: Performing a physical drop experiment on the outer packaging of the device under test for drop designed according to the target outer packaging finite element model to obtain the physical drop experiment result corresponding to the outer packaging; If the physical drop experiment result corresponding to the outer packaging meets the preset drop shock resistance requirements, then determine that the outer packaging can be applied to the device under test for drop; Otherwise, re-establish the outer packaging finite element model of the device under test for drop and perform topology optimization.

10. A drop simulation device, characterized in that, The device includes: A modeling module, configured to establish an outer packaging finite element model of a device under test for drop, and obtain the damage weight and drop loading load of each drop calculation condition of the outer packaging of the device under test for drop; A topology optimization module, configured to, for each topology optimization process, based on the volume optimization ratio corresponding to the current topology optimization process, the damage weight of each drop calculation condition, the drop loading load, the volume of the mesh elements in the outer packaging finite element model, and a preset topology optimization algorithm, determine the element density of the mesh elements corresponding to each drop calculation condition in the case of global minimum compliance; A drop simulation module, configured to determine the outer packaging finite element model corresponding to the current topology optimization process according to the element density of the mesh elements corresponding to each drop calculation condition, and perform a drop simulation test on the outer packaging finite element model corresponding to the current topology optimization process to obtain the drop simulation result corresponding to the current topology optimization process; A model determination module, configured to determine the volume optimization ratio corresponding to the next topology optimization process according to the drop simulation result corresponding to the current topology optimization process, enter the next topology optimization process, until in each topology optimization process, a candidate topology optimization process whose drop simulation result meets the drop simulation requirements is determined, and in each of the candidate topology optimization processes, a target topology optimization process with the largest volume optimization ratio is determined, and determine the outer packaging finite element model corresponding to the target topology optimization process as the target outer packaging finite element model of the device under test for drop, where the target outer packaging finite element model is used to design the outer packaging of the device under test for drop.

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