Apparatus and method for producing chip sintered interconnect

Abstract

The application relates to the field of nano-sintering electronic packaging technology, and provides a production device and method for chip sintering interconnection. The device comprises a workbench, a mold, a fixing mechanism, a dispensing mechanism and a hot press. The workbench is suitable for laying a heat-resistant film. The mold is provided with a paste injection hole. The fixing mechanism is used for fixing the mold and is suitable for driving action through a first driving mechanism to move the mold above the heat-resistant film. The dispensing mechanism is used for injecting solder paste into the paste injection hole and is suitable for driving action through a second driving mechanism to move the dispensing mechanism above the mold. The hot press is used for hot-pressing the solder paste to form a soldering sheet and sintering a chip, the soldering sheet and a circuit board into a shape. The hot press is suitable for driving action through a third driving mechanism to move the hot press above the mold.

Description

Technical Field

[0001] This invention relates to the field of nano-sintering electronic packaging technology, and more particularly to a production apparatus and method for chip sintering interconnection. Background Technology

[0002] With the continuous improvement of the performance of newly developed third-generation semiconductor power devices, they can achieve very high operating efficiency even under harsh environmental conditions with high temperature, high frequency, and wide bandgap performance. However, current packaging solders, such as tin-based solders, cannot meet the service requirements, and gold-based solders have too high soldering temperature requirements, making it difficult for packaging solders to be compatible with third-generation semiconductor power devices.

[0003] Nano-silver solder paste is often used for low-temperature sintering to solve the above problems, achieving low-temperature connection and high-temperature service. However, solder paste requires printing and coating, which is a complicated process. In addition, the solder paste is fluid and requires preheating and drying. Furthermore, solder paste is not suitable for large-area sintering. Large-area chips will hinder the volatilization of a large amount of organic gas generated during sintering, forming a large number of gas channels and pores, and also easily causing incomplete volatilization of organic matter, affecting device performance. Summary of the Invention

[0004] This invention provides a production apparatus for chip sintering interconnection, which solves the problems of inconvenient processing and large-area sintering caused by the need for solder paste printing and coating in the prior art, and realizes convenient and continuous sintering.

[0005] The present invention also provides a method for manufacturing chip sintering interconnects.

[0006] This invention provides a production apparatus for chip sintering interconnection, comprising:

[0007] The workbench is suitable for being covered with a heat-resistant film;

[0008] The mold is equipped with a paste injection hole;

[0009] A fixing mechanism for fixing the mold, the fixing mechanism being adapted to be driven by a first driving mechanism to move the mold above the heat-resistant film;

[0010] A dispensing mechanism for injecting solder paste into the injection hole, the dispensing mechanism being adapted to be driven by a second drive mechanism to move the dispensing mechanism above the mold;

[0011] A hot press for hot pressing solder paste to form solder pads and for sintering chips, solder pads and circuit boards, the hot press being adapted to be driven by a third drive mechanism to move the hot press above the mold.

[0012] According to the present invention, a chip sintering interconnect production apparatus is provided, wherein the fixing mechanism includes a fixing frame and a pair of clamps, the fixing frame is provided with an adjustment groove along the length direction, one of the clamps is fixed to one end of the fixing frame along the length direction, and the other clamp is slidably installed in the adjustment groove and locked in position by fasteners;

[0013] The pair of clamps are adapted to hold the mold on opposite sides, and the first drive mechanism is connected to the fixed frame.

[0014] According to the present invention, a chip sintering interconnect production apparatus includes a fixture comprising a first beam and a second beam, the first beam and the second beam being overlapped and mounted, and the first beam and the second beam having a first notch and a second notch respectively on their respective sides facing each other, the first notch and the second notch being joined to form a slot, the mold being adapted to engage with the slot, and the first beam and the second beam being adapted to be fixed together by a locking member.

[0015] According to a chip sintering interconnect production apparatus provided by the present invention, the dispensing mechanism includes a dispensing frame and a dispensing machine body installed in the dispensing frame. The dispensing machine body is provided with a first identification unit for identifying the injection hole, and a second driving mechanism is connected to the dispensing frame.

[0016] According to a chip sintering interconnect production apparatus provided by the present invention, a scraper is provided in the dispensing frame along its width direction for scraping the solder paste in the injection hole.

[0017] According to a chip sintering interconnect production apparatus provided by the present invention, the dispensing machine body is adapted to be connected to the dispensing frame via a lifting mechanism.

[0018] According to a chip sintering interconnect production apparatus provided by the present invention, the hot press includes a plurality of hot pressing sections that can extend and retract toward the worktable, and the hot press is provided with a second identification unit for identifying the paste injection hole.

[0019] According to a chip sintering interconnect production apparatus provided by the present invention, the worktable is provided with fixed rods on both sides of its length direction, and a first rotating rod and a second rotating rod are provided at an interval between the two fixed rods, and the worktable is located between the first rotating rod and the second rotating rod;

[0020] The heat-resistant film is fixed at both ends to the first rotating rod and the second rotating rod, respectively.

[0021] According to the present invention, a chip sintering interconnect production apparatus further includes a transfer mechanism, wherein the upper surface of the worktable is higher than the transfer surface of the transfer mechanism, and the fixing rod is adapted to be connected to the worktable via a rotating shaft for flipping the heat-resistant film to transfer the sintered sample to the transfer mechanism.

[0022] According to a chip sintering interconnect production apparatus provided by the present invention, the fixing rod is provided with a telescopic mechanism for adjusting the length of the fixing rod.

[0023] The present invention also provides a method for manufacturing chip sintering interconnects, comprising the following steps:

[0024] The heat-resistant film is fixed to the worktable, the paste injection hole is opened on the mold based on the shape of the chip, and the mold is fixed to the fixing mechanism;

[0025] The first driving mechanism drives the fixing mechanism to move from the first station to the second station where the worktable is located, so that the mold is in contact with the upper surface of the heat-resistant film.

[0026] The second drive mechanism drives the dispensing mechanism to move from the third station to the second station. The dispensing mechanism injects solder paste into the injection hole. After the solder paste injection is completed, the second drive mechanism drives the dispensing mechanism to move back to the third station. During this process, the solder paste in the injection hole is smoothed by a scraper.

[0027] The third mechanism drives the hot press to move from the fourth station to the second station, so that the hot press can hot press the solder paste to form a solder sheet. After the solder sheet is formed, the third driving mechanism drives the hot press to move back to the fourth station.

[0028] The first drive mechanism raises the height of the fixing mechanism, leaving an installation gap between the mold and the heat-resistant film. The circuit board is placed on the upper surface of the heat-resistant film through the installation gap, and the chip is placed on the upper side of the mold at the position corresponding to the injection hole.

[0029] At least a portion of the hot pressing section of the hot press is elongated to form a shape that fits the solder pad. A third drive mechanism drives the hot press from the fourth station to the second station to sinter the chip, solder pad and circuit board using the hot pressing section of the hot press.

[0030] According to a chip sintering interconnect manufacturing method provided by the present invention, after the step of at least a portion of the hot pressing section of the hot press elongating to form a shape corresponding to the solder pad, and the hot press sintering the chip, solder pad, and circuit board by driving a downward movement using a third driving mechanism, the method further includes the following step:

[0031] The third drive mechanism drives the hot press to move back to the fourth station, the first drive mechanism drives the fixing mechanism to move back to the first station, the sintered sample falls off the heat-resistant film, the telescopic mechanism drives the fixing rod to shorten so that the heat-resistant film wrinkles and separates the sintered sample from the heat-resistant film, and the rotating shaft drives the fixing rod to flip to transfer the sintered sample to the transfer mechanism for transmission.

[0032] According to a chip sintering interconnect manufacturing method provided by the present invention, the dispensing mechanism injects solder paste into the injection hole, and after the solder paste injection is completed, the second driving mechanism drives the dispensing mechanism to move back to the third station. During this process, the solder paste in the injection hole is smoothed out by a scraper. The specific steps include:

[0033] The dispensing mechanism injects solder paste into the injection hole in a crisscross pattern, so that the solder paste in the injection hole forms an "X" shape. After the solder paste is injected, the lifting mechanism drives the dispensing machine body of the dispensing structure to move upward, so that the lower surface of the dispensing machine body is misaligned with the scraping surface of the scraper. The second driving mechanism drives the dispensing mechanism to move back to the third station, and during this process, the solder paste in the injection hole is smoothed by the scraper.

[0034] The chip sintering interconnect production apparatus provided in this embodiment of the invention moves the fixing mechanism above the heat-resistant film laid on the worktable through the first driving mechanism, so that the mold and the heat-resistant film are attached and then the solder paste is injected. The solder paste is then pre-treated by a hot press to volatilize the organic matter in advance, forming a semi-finished solder sheet. Then, the chip, solder sheet and circuit board are sintered by the hot press, making the sintering process very convenient and meeting the requirements of large-area sintering, achieving excellent welding effect.

[0035] The chip sintering interconnect production method provided in this invention can use a hot press to pre-treat the solder paste to volatilize organic matter in advance, forming a semi-finished solder pad. Then, the chip, solder pad and circuit board are sintered using a hot press, making the sintering process very convenient and meeting the requirements of large-area sintering, achieving excellent welding results. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0037] Figure 1 This is a three-dimensional structural schematic diagram of the chip sintering interconnection production apparatus provided by the present invention;

[0038] Figure 2This is a front view of the chip sintering interconnect production apparatus provided by the present invention;

[0039] Figure 3 This is a partial enlarged view of the fixing mechanism and its part in the chip sintering interconnect production apparatus provided by the present invention;

[0040] Figure 4 This is a schematic diagram of the hot press in the chip sintering interconnect production apparatus provided by the present invention;

[0041] Figure 5 This is a schematic diagram showing the sintering state of the chip, solder pad, and circuit board in this invention;

[0042] Figure 6 This is a surface characterization diagram of the solder sheet in this invention;

[0043] Figure 7 This is a high-magnification SEM image of the surface of the weld sheet in this invention;

[0044] Figure 8 This is a diagram showing the shear stress distribution of the chip, solder pad, and circuit board after sintering in this invention.

[0045] Figure 9 These are SEM images of the fracture surfaces of the chip, solder pad, and circuit board after sintering in this invention.

[0046] Figure 10 This is one of the schematic flowcharts of the chip sintering interconnect manufacturing method provided by the present invention;

[0047] Figure 11 This is the second schematic diagram of the chip sintering interconnection production method provided by the present invention.

[0048] Figure label:

[0049] 1. Workbench; 2. Heat-resistant film; 3. Mold; 4. Injection hole; 5. Fixing mechanism; 6. Dispensing mechanism; 7. Hot press; 8. Chip; 9. Solder sheet; 10. Circuit board; 11. Fixing frame; 12. Fixture; 13. Adjustment groove; 14. First beam; 15. Second beam; 16. Locking element; 17. Dispensing frame; 18. Dispensing machine body; 19. Scraper; 20. Fixing rod; 21. First rotating rod; 22. Second rotating rod; 23. Transmission mechanism; 24. Rotating shaft; 25. Telescopic mechanism. Detailed Implementation

[0050] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0051] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0052] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0053] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0055] The following is combined with Figures 1-11 Embodiments of the present invention are described.

[0056] like Figures 1-5 As shown, this embodiment of the invention provides a production apparatus for sintering and interconnecting chips 8, mainly including a worktable 1, a mold 3, a fixing mechanism 5, a dispensing mechanism 6, and a hot press 7. The worktable 1 is suitable for laying a heat-resistant film 2, the mold 3 is provided with a paste injection hole 4, the fixing mechanism 5 is used to fix the mold 3, and the fixing mechanism 5 is suitable for being driven by a first driving mechanism to move the mold 3 above the heat-resistant film 2, the dispensing mechanism 6 is used to inject solder paste into the paste injection hole 4, the dispensing mechanism 6 is suitable for being driven by a second driving mechanism to move the dispensing mechanism 6 above the mold 3, the hot press 7 is used to hot press the solder paste to form solder pads 9 and to sinter the chip 8, solder pads 9, and circuit board 10, and the hot press 7 is suitable for being driven by a third driving mechanism to move the hot press 7 above the mold 3.

[0057] In this embodiment, the fixing mechanism 5 is moved above the heat-resistant film 2 laid on the workbench 1 by the first driving mechanism, so that the mold 3 is attached to the heat-resistant film 2 and then solder paste is injected. The solder paste is then pre-treated by the hot press 7 to allow for the volatilization of organic matter, forming a semi-finished solder sheet 9. The hot press 7 is then used to sinter the chip 8, solder sheet 9, and circuit board 10, making the sintering process very convenient and meeting the requirements for large-area sintering, achieving excellent welding results. Figure 5 As shown, chip 8, solder pad 9 and circuit board 10 are arranged from top to bottom and then sintered into shape.

[0058] like Figure 1 and Figure 2 As shown in the figure, the dashed arrows indicate the direction of motion of each mechanism.

[0059] The heat-resistant film 2 can be a PI film (Polyimide Film). The heat-resistant film 2 can prevent the solder paste from contacting the surface of the worktable 1. Specifically, when the solder paste is injected into the injection hole 4, the solder paste will come into contact with the heat-resistant film 2. The mold 3 is a metal mold 3. Since the viscosity of the solder sheet 9 to metal is greater than the viscosity of the solder sheet 9 to the PI film, it can be ensured that after the solder sheet 9 is formed, when it is in the position of the lifting and fixing mechanism 5, the solder sheet 9 can be lifted to a certain height through the fixing mechanism 5 and the mold 3.

[0060] The fixing mechanism 5 is installed at the first station via the first drive mechanism, the worktable 1 is the second station, the dispensing mechanism 6 is installed at the third station via the second drive mechanism, and the hot press 7 is installed at the fourth station via the third drive mechanism.

[0061] The first driving mechanism can move the fixing mechanism 5 from the first station to the second station, thereby moving the mold 3 above the heat-resistant film 2 and bringing the mold 3 into contact with the top of the heat-resistant film 2. The first driving mechanism can also move the fixing mechanism 5 from the second station to the first station, thereby resetting the fixing mechanism 5.

[0062] The second drive mechanism can move the dispensing mechanism 6 from the third station to the second station, thereby moving the dispensing mechanism 6 above the mold 3 to inject solder paste into the injection hole 4 of the mold 3. The second drive mechanism can also move the dispensing mechanism 6 from the second station to the third station to reset the dispensing mechanism 6.

[0063] The third drive mechanism can move the hot press 7 from the fourth station to the second station so that the hot press 7 can be attached to the mold 3 to pre-process the solder paste into a semi-finished solder sheet 9, or the hot press 7 can be attached to the chip 8 to sinter the chip 8, solder sheet 9 and circuit board 10.

[0064] by Figure 1 The positions of the worktable 1, fixing mechanism 5, dispensing mechanism 6, and hot press 7 are described in detail below. Using worktable 1 as a reference point, fixing mechanism 5 is located to the right of worktable 1, dispensing mechanism 6 is located to the left of worktable 1, and hot press 7 is located above worktable 1. That is, the first station can be set to the right of the second station, the third station to the left of the second station, and the fourth station above the second station.

[0065] The first drive mechanism, the second drive mechanism, and the third drive mechanism can be robotic arms, lead screw mechanisms, cylinders, servo motors, etc.

[0066] The shape of the injection hole 4 on the mold 3 is the same as the shape of the chip 8. The shape of the injection hole 4 is determined based on the shape of the chip 8 to be sintered. The injection hole 4 can be formed on the mold 3 by laser engraving based on the shape of the chip 8.

[0067] According to the chip 8 sintering interconnection production apparatus provided by the present invention, the fixing mechanism 5 includes a fixing frame 11 and a pair of clamps 12. The fixing frame 11 is provided with an adjustment groove 13 along its length direction. One clamp 12 is fixed to one end of the fixing frame 11 along its length direction, and the other clamp 12 is slidably mounted in the adjustment groove 13 and locked in position by a locking member 16. The pair of clamps 12 are adapted to clamp opposite sides of the mold 3, and a first driving mechanism is connected to the fixing frame 11.

[0068] A pair of clamps 12 are used to clamp the mold 3 on opposite sides to fix the mold 3 to the fixed frame 11. Driven by the first drive mechanism, the fixed frame 11 can move the mold 3 to a position where it is in contact with the upper surface of the heat-resistant film 2. One clamp 12 is fixedly installed at one end of the fixed frame 11 along its length, and the other clamp 12 is slidably installed in the adjustment groove 13, so that the relative position between the two clamps 12 can be adjusted to accommodate molds 3 of different sizes. For example, when the size of the mold 3 is 3×3mm...2 When it is [a certain situation], the distance between the two jigs 12 can be adjusted to 3 mm. When the size of the mold 3 is 5×5 mm 2 When it is [another certain situation], the distance between the two jigs 12 can be adjusted to 5 mm.

[0069] As Figure 1 As shown, the fixed frame 11 includes three rods, namely two lengthwise rods and one widthwise rod, and the three rods are connected in a "匚" shape. Specifically, the widthwise rod is connected to one end of the two lengthwise rods. Adjusting grooves 13 are provided on both lengthwise rods, one jig 12 is connected to the other ends of the two lengthwise rods, and the other jig 12 is slidably installed in the adjusting groove 13. The distance between the two jigs 12 is adjusted by the horizontal sliding of the jig 12 in the adjusting groove 13 to adapt to molds 3 of different sizes.

[0070] In this embodiment, the fastener can be a bolt. A plurality of fastening holes communicating with the adjusting groove 13 are provided on the upper surface of the lengthwise rod along the length direction. A threaded hole is provided on the part of the jig 12 located in the adjusting groove 13. After the position of the jig 12 is adjusted, the threaded hole is aligned with the fastening hole, and then the bolt is sequentially passed through the fastening hole and the threaded hole to lock the position of the jig 12.

[0071] In another embodiment, the fastener can be a plug pin. A plurality of fastening holes communicating with the adjusting groove 13 are provided on the upper surface of the lengthwise rod along the length direction. A fastening hole is also provided on the part of the jig 12 located in the adjusting groove 13. After the position of the jig 12 is adjusted, the two fastening holes are aligned, and then the plug pin is sequentially passed through the two fastening holes to lock the position of the jig 12.

[0072] In another embodiment, the fastener can be a nut. The end of the jig 12 passes through the adjusting groove 13 and a fastening stud is provided. After connecting the nut to the fastening stud, the nut is tightened continuously until the nut abuts against the outer wall of the lengthwise rod, thereby locking the position of the jig 12.

[0073] As Figure 3 As shown, the jig 12 includes a first beam body 14 and a second beam body 15. The first beam body 14 and the second beam body 15 are overlapped and installed, and a first notch and a second notch are respectively provided on the sides of the first beam body 14 and the second beam body 15 facing each other. The first notch and the second notch are butted to form a clamping groove. The mold 3 is adapted to be clamped in the clamping groove, and the first beam body 14 and the second beam body 15 are adapted to be fixed by a locking member 16.

[0074] After the first beam 14 and the second beam 15 are connected by overlapping, the first notch and the second notch can form a slot by interlocking with each other. The slots of the two slots are set opposite to each other, and the position of the mold 3 is fixed by using the two slots to engage the opposite sides of the mold 3.

[0075] Taking the first beam 14 located above the second beam 15 as an example, the first notch is located on the side of the lower surface of the first beam 14, and the second notch is located on the side of the upper surface of the second beam 15. When the first beam 14 overlaps the second beam 15, the first notch and the second notch mate to form a groove.

[0076] In this embodiment, the locking member 16 may include a locking part and a C-shaped rotating part. The locking part is equipped with a locking hole. The rotating part is installed on the first beam 14, and the locking part is installed on the second beam 15. After the rotating part rotates, its end will pass through the locking hole so that the first beam 14 and the second beam 15 can be fixed to each other.

[0077] In another embodiment, the locking member 16 can be a bolt, with corresponding threaded holes provided on the first beam 14 and the second beam 15, and the bolt is inserted into the threaded holes to achieve mutual fixation between the first beam 14 and the second beam 15.

[0078] like Figure 1 As shown, the dispensing mechanism 6 includes a dispensing frame 17 and a dispensing machine body 18 installed in the dispensing frame 17. The dispensing machine body 18 is provided with a first identification unit for identifying the injection hole 4, and a second driving mechanism is connected to the dispensing frame 17.

[0079] The first identification unit can identify the position of the injection hole 4 of the mold 3, thereby enabling the dispensing machine body 18 to accurately inject solder paste into the injection hole 4. The dispensing machine body 18 can control the dispensing by air pressure, and control the amount of solder paste extruded according to the output volume.

[0080] After the second drive mechanism moves the dispensing frame 17 to the second station, based on the position of the injection hole 4 identified by the first identification unit, the second drive mechanism fine-tunes the position of the dispensing frame 17 so that the dispensing machine body 18 can extrude solder paste along the injection hole 4.

[0081] like Figure 1 As shown, a scraper 19 is provided inside the dispensing frame 17 along its width direction for scraping the solder paste in the filling hole 4. It can be understood that after the solder paste is injected into the filling hole 4 by the dispensing machine body 18, there is a part of the solder paste protruding from the filling hole 4. At this time, the scraper 19 is used to scrape the solder paste to make it smooth and evenly coated.

[0082] by Figure 1Taking the dispensing machine body 18 as an example, the scraper 19 is located on the inner side of the right end of the dispensing frame 17. After the dispensing machine body 18 injects the solder paste into the injection hole 4, the second drive mechanism drives the dispensing frame 17 to move to the left and return to the third station. During this process, the scraper 19 can be used to scrape and coat the solder paste, making the solder paste smooth and evenly coated. Therefore, there is no need to set up an additional device or take additional steps to smooth the solder paste, making the structure and process simpler and more convenient.

[0083] The scraper 19 can be configured as a structure with a vertical cross-section of a triangle, and the scraping side of the scraper 19 can be flush with the lower surface of the dispensing frame 17.

[0084] In this embodiment, the dispensing machine body 18 is adapted to be connected to the dispensing frame 17 via a lifting mechanism. The relative height between the dispensing machine body 18 and the dispensing frame 17 can be adjusted via the lifting mechanism. When the second drive mechanism drives the dispensing machine body 18 to move above the mold 3 to dispense paste into the injection hole 4, the dispensing machine body 18 and the dispensing frame 17 can be in a flush position, avoiding insufficient paste dispensing. When the second drive mechanism drives the dispensing frame 17 back to the third station, the lifting mechanism slightly raises the height of the dispensing machine body 18, so that the lower surface of the dispensing machine body 18 is slightly higher than the lower surface of the dispensing frame 17, that is, the lower surface of the dispensing machine body 18 is lower than the scraping side of the scraper 19, to prevent the dispensing machine body 18 from affecting the scraping of the scraper 19.

[0085] According to the chip 8 sintering interconnection production apparatus provided in the embodiment of the present invention, the hot press 7 includes a plurality of hot pressing sections that can extend and retract toward the worktable 1, and the hot press 7 is provided with a second identification unit for identifying the paste injection hole 4. Figure 1 and Figure 4 As shown, when the injection hole 4 in the mold 3 is in the shape of "Beijing University of Technology", the second identification unit identifies the injection hole 4 and causes the hot pressing part of the hot press 7 to extend out of the shape of "Beijing University of Technology" for corresponding hot pressing.

[0086] The hot press 7 can pre-treat the solder paste in the injection hole 4 to form solder pads 9, and can also sinter the chip 8, solder pads 9 and circuit board 10 into shape.

[0087] When the hot press 7 is hot pressing the solder paste into solder sheet 9, the hot pressing part does not need to extend out of the surface of the hot press 7. At this time, the temperature of the hot press 7 can be set to 180°C, the pressure to 1 MPa, and the hot pressing time to 5 minutes.

[0088] When the hot press 7 sintersects the chip 8, solder pad 9, and circuit board 10, the hot pressing section elongates based on the shape of the paste injection hole 4, so that the shape of the extended hot pressing section is the same as the shape of the chip 8 and solder pad 9, for precise sintering. At this time, the temperature of the hot press 7 can be set to 200℃, the pressure to 5MPa, and the sintering time to 10min.

[0089] After the chip 8, solder pad 9 and circuit board 10 are sintered, due to the pressure during the sintering process, the solder pad 9 will no longer stick to the mold 3. After lifting the fixing mechanism 5, the solder pad 9 can be directly separated from the mold 3.

[0090] The first and second identification units need to be able to perform their respective identification functions. For example, a visual identification device can be used. In this embodiment, there is no restriction on the specific model of the two.

[0091] According to the chip 8 sintering interconnection production apparatus provided in the embodiment of the present invention, the worktable 1 is provided with fixed rods 20 on both sides in the length direction, and a first rotating rod 21 and a second rotating rod 22 are provided between the two fixed rods 20 at an interval, with the worktable 1 located between the first rotating rod 21 and the second rotating rod 22. The two ends of the heat-resistant film 2 are respectively fixed to the first rotating rod 21 and the second rotating rod 22.

[0092] During the production process, the heat-resistant film 2 is used in rolls. A roll of heat-resistant film 2 is installed on the first rotating rod 21. The end of the heat-resistant film 2 is laid across the workbench 1 and then fixed to the second rotating rod 22. The first rotating rod 21 and the second rotating rod 22 rotate in opposite directions to straighten the heat-resistant film 2 and make the heat-resistant film 2 adhere tightly to the upper surface of the workbench 1.

[0093] The first rotating rod 21 and the second rotating rod 22 can be driven by motors to rotate. After a sample of a chip 8, a solder pad 9 and a circuit board 10 is sintered and formed, the motor drives the first rotating rod 21 and the second rotating rod 22 to rotate to pull out a new heat-resistant film 2 for subsequent hot pressing and sintering.

[0094] like Figure 1 As shown, the production apparatus for sintering interconnection of chip 8 in this embodiment also includes a transfer mechanism 23. The upper surface of the worktable 1 is higher than the transfer surface of the transfer mechanism 23. The fixing rod 20 is adapted to be connected to the worktable 1 via a rotating shaft 24 and is used to flip the heat-resistant film 2 to transfer the sintered sample to the transfer mechanism 23.

[0095] After the chip 8, solder pad 9 and circuit board 10 are sintered to form a sample, the fixing mechanism 5 is lifted upwards to directly separate the solder pad 9 from the mold 3. The mold 3 will be located on the heat-resistant film 2. The fixing rod 20 is rotated by the rotating shaft 24. The rotation of the fixing rod 20 can drive the first rotating rod 21 and the second rotating rod 22 to flip, so that the heat-resistant film 2 flips and the sintered sample falls along the heat-resistant film 2 to the transmission mechanism 23 under the action of gravity. Then, the transmission mechanism 23 is used to transfer it to the subsequent processing mechanism to realize continuous and streamlined processing.

[0096] like Figure 1 As shown, the first rotating rod 21 and the second rotating rod 22 are respectively connected to the two ends of the fixed rod 20, and the rotating shaft 24 is located in the middle of the fixed rod 20. Since the heat-resistant film 2 is rolled up on the first rotating rod 21 and the second rotating rod 22, a certain length of the heat-resistant film 2 can be rolled out at the second rotating rod 22 when the rotating shaft 24 rotates, so as to avoid the heat-resistant film 2 being unable to flip over due to the interference of the worktable 1.

[0097] The first rotating rod 21, the second rotating rod 22, and the two fixed rods 20 can form a working frame. The size of the fixed frame 11 is larger than that of the working frame, thereby avoiding interference between the fixed frame 11 and the working frame, which would make it difficult for the mold 3 to adhere to the heat-resistant film 2.

[0098] like Figure 1 As shown, the fixing rod 20 is equipped with a telescopic mechanism 25 for adjusting the length of the fixing rod 20. After the chip 8, solder pad 9 and circuit board 10 are sintered to form a sample, lifting the fixing mechanism 5 can directly separate the solder pad 9 from the mold 3. The mold 3 will be located on the heat-resistant film 2. To avoid the circuit board 10 and the heat-resistant film 2 being too tightly bonded, making it difficult for the sample to separate from the heat-resistant film 2, the length of the fixing rod 20 is shortened by the telescopic mechanism 25. At this time, the heat-resistant film 2 can be wrinkled to facilitate the separation of the sample from the heat-resistant film 2, ensuring that the sample can fall completely onto the transmission mechanism 23.

[0099] It is understood that the fixed rod 20 includes at least two rod sections, and adjacent rod sections are connected by a telescopic structure. The telescopic mechanism 25 extends in the same direction as the length of the fixed rod 20, thereby adjusting the length of the fixed rod 20 using the telescopic mechanism 25.

[0100] The production apparatus for sintering and interconnecting the chip 8 in this embodiment may also include a control terminal, which is electrically connected to the fixing mechanism 5, the dispensing mechanism 6, the hot press 7, the first driving mechanism, the second driving mechanism, the third driving mechanism, the transmission mechanism 23, the rotating shaft 24, and the telescopic mechanism 25, respectively, so as to programmatically control the operation of each component.

[0101] On the other hand, such as Figure 10 and Figure 11 As shown, the present invention also provides a method for manufacturing chip 8 sintered interconnects, comprising the following steps:

[0102] The heat-resistant film 2 is fixed to the worktable 1, and the paste injection hole 4 is opened on the mold 3 based on the shape of the chip 8. The mold 3 is then fixed to the fixing mechanism 5.

[0103] The first driving mechanism drives the fixing mechanism 5 to move from the first workstation to the second workstation where the worktable 1 is located, so that the mold 3 is in contact with the upper surface of the heat-resistant film 2.

[0104] The second drive mechanism drives the dispensing mechanism 6 to move from the third station to the second station. The dispensing mechanism 6 injects solder paste into the injection hole 4. After the solder paste injection is completed, the second drive mechanism drives the dispensing mechanism 6 to move back to the third station. During this process, the solder paste in the injection hole 4 is smoothed by the scraper 19.

[0105] The third mechanism drives the hot press 7 to move from the fourth station to the second station, so that the hot press 7 can hot press the solder paste to form the solder sheet 9. After the solder sheet 9 is formed, the third driving mechanism drives the hot press 7 to move back to the fourth station.

[0106] The first driving mechanism raises the height of the fixing mechanism 5, leaving an installation gap between the mold 3 and the heat-resistant film 2. The circuit board 10 is placed on the upper surface of the heat-resistant film 2 through the installation gap, and the chip 8 is placed on the upper side of the mold 3 at the position corresponding to the injection hole 4.

[0107] At least a portion of the hot pressing section of the hot press 7 is elongated to form a shape that matches the solder pad 9. The third drive mechanism drives the hot press 7 to move from the fourth station to the second station so as to sinter the chip 8, solder pad 9 and circuit board 10 using the hot pressing section of the hot press 7.

[0108] Based on the above method, the hot press 7 can be used to pre-treat the solder paste to volatilize organic matter in advance, forming a semi-finished solder sheet 9. Then, the hot press 7 is used to sinter the chip 8, solder sheet 9 and circuit board 10 into shape, making the sintering process very convenient and meeting the requirements of large-area sintering, thus achieving excellent welding results.

[0109] According to the chip 8 sintering interconnection production method provided by the present invention, after the step of at least a portion of the hot pressing section of the hot press 7 elongating to form a shape corresponding to the solder pad 9, and the hot press 7 sintering the chip 8, solder pad 9 and circuit board 10 by driving a downward movement using a third driving mechanism, the method further includes the following step:

[0110] The third drive mechanism drives the hot press 7 to move back to the fourth station, and the first drive mechanism drives the fixing mechanism 5 to move back to the first station. The sintered sample falls off the heat-resistant film 2. The telescopic mechanism 25 drives the fixing rod 20 to shorten, causing the heat-resistant film 2 to wrinkle and separate the sintered sample from the heat-resistant film 2. The rotating shaft 24 drives the fixing rod 20 to flip, transferring the sintered sample to the transfer mechanism 23 for transport. This achieves continuous and streamlined production processing.

[0111] According to the chip 8 sintering interconnection production method provided by the present invention, the dispensing mechanism 6 injects solder paste into the injection hole 4 in a crisscross pattern, so that the solder paste in the injection hole 4 is in an "X" shape. After the solder paste injection is completed, the lifting mechanism drives the dispensing machine body 18 of the dispensing structure to move upward, so that the lower surface of the dispensing machine body 18 is misaligned with the scraping surface of the scraper 19. The second driving mechanism drives the dispensing mechanism 6 to move back to the third station, and during this process, the solder paste in the injection hole 4 is smoothed by the scraper 19. This can fully fill the injection hole 4 with solder paste, and make the solder paste in the injection hole 4 uniform and smooth after the scraper 19 scrapes it.

[0112] by Figure 1 From the perspective of 5×5mm 2 The following is a detailed explanation using the example of the nano-silver preformed solder sheet 9 and the sintering interconnection of silver-plated copper block-solder sheet 9-silver-plated copper block.

[0113] A roll of heat-resistant film 2 is installed on the first rotating rod 21. The end of the heat-resistant film 2 crosses the worktable 1 and is fixed to the second rotating rod 22. The rotation of the first rotating rod 21 and the second rotating rod 22 causes the heat-resistant film 2 to be tightly attached to the worktable 1. The welding sheet 9 to be formed is preset to be 100μm thick. A 100μm thick aluminum sheet is used as the mold 3, and a 5×5mm section is engraved through it using laser engraving. 2 Square injection hole 4, then fix the aluminum sheet in the slot of clamp 12.

[0114] The first driving mechanism drives the fixing mechanism 5 to move to the left until the fixing mechanism 5 is directly above the worktable 1. Then, the first driving mechanism drives the fixing mechanism 5 to move downward so that the aluminum sheet is in contact with the upper surface of the heat-resistant film 2.

[0115] Nano silver solder paste is added to the dispensing machine body 18, and the solder paste extrusion volume is set. The second drive mechanism drives the dispensing mechanism 6 to move to the right until the dispensing mechanism 6 is directly above the worktable 1. Then, the second drive mechanism drives the dispensing mechanism 6 to move downward until the dispensing frame 17 is in contact with the fixed frame 11 or the aluminum sheet. After the first identification unit identifies the injection hole 4, the dispensing machine body 18 injects solder paste into the injection hole 4 in a crisscross pattern, so that the solder paste in the injection hole 4 is in an "X" shape. After the solder paste is injected, the lifting mechanism drives the dispensing machine body 18 of the dispensing structure to move upward, so that the lower surface of the dispensing machine body 18 is misaligned with the scraping surface of the scraper 19. The second drive mechanism drives the dispensing frame 17 to move to the left so that the scraper 19 scrapes the solder paste in the injection hole 4 evenly and spreads it evenly.

[0116] The hot press 7 is started, and its pressure and temperature can be adjusted according to the amount of air intake. The third drive mechanism drives the hot press 7 downwards to press the solder paste against the aluminum sheet. The temperature can be set to 180℃, the pressure to 1 MPa, and the pressing time to 5 minutes. After the solder sheet 9 is formed by hot pressing, the third drive mechanism drives the hot press 7 upwards back to the fourth position.

[0117] The first drive mechanism raises the height of the fixing mechanism 5, causing the aluminum sheet to move upwards. Because the viscosity of the welding sheet 9 to the metal is greater than the viscosity of the welding sheet 9 to the heat-resistant film 2, the welding sheet 9 will move upwards along with the aluminum sheet. The 10×10mm sheet to be sintered... 2 The silver-plated copper block is placed under the metal sheet, and a 5×5mm... 2 The silver-plated copper block is placed on the upper side of the mold 3 at the position corresponding to the injection hole 4, forming a sandwich-like structure.

[0118] The second identification unit of the hot press 7 elongates part of the hot pressing section according to the shape of the paste injection hole 4 to form a shape that matches the solder sheet 9. The third drive mechanism drives the hot press 7 to move downward so that the three parts can be sintered and formed by the hot press 7. The temperature can be set to 200°C, the pressure to 5 MPa, and the hot pressing time to 10 minutes.

[0119] The third drive mechanism drives the hot press 7 to move upwards back to the fourth station, while the first drive mechanism drives the fixing mechanism 5 to move back to the first station. The telescopic mechanism 25 shortens to drive the fixing rod 20 to shorten as well. At this time, the heat-resistant film 2 wrinkles, allowing the sintered sample to be completely separated from the heat-resistant film 2. After the rotating shaft 24 rotates 45°, the sintered sample can be dropped to the transfer mechanism 23 for transfer, realizing the assembly line production of the solder sheet 9 and the sintering interconnection of the silver-plated copper block-solder sheet 9-silver-plated copper block.

[0120] by Figure 1 The perspective is in the production of 3×3mm 2The following is a detailed explanation using the example of sintering and interconnecting a nano-silver preformed solder pad 9 with a chip 8-solder pad 9-DBC (copper-clad ceramic substrate).

[0121] A roll of heat-resistant film 2 is installed on the first rotating rod 21. The end of the heat-resistant film 2 crosses the worktable 1 and is fixed to the second rotating rod 22. The rotation of the first rotating rod 21 and the second rotating rod 22 causes the heat-resistant film 2 to be tightly attached to the worktable 1. The welding sheet 9 to be formed is preset to be 100μm thick. A 100μm thick aluminum sheet is used as the mold 3, and a 3×3mm section is engraved through it using laser engraving. 2 Square injection hole 4, then fix the aluminum sheet in the slot of clamp 12.

[0122] The first driving mechanism drives the fixing mechanism 5 to move to the left until the fixing mechanism 5 is directly above the worktable 1. Then, the first driving mechanism drives the fixing mechanism 5 to move downward so that the aluminum sheet is in contact with the upper surface of the heat-resistant film 2.

[0123] Nano silver solder paste is added to the dispensing machine body 18, and the solder paste extrusion volume is set. The second drive mechanism drives the dispensing mechanism 6 to move to the right until the dispensing mechanism 6 is directly above the worktable 1. Then, the second drive mechanism drives the dispensing mechanism 6 to move downward until the dispensing frame 17 is in contact with the fixed frame 11 or the aluminum sheet. After the first identification unit identifies the injection hole 4, the dispensing machine body 18 injects solder paste into the injection hole 4 in a crisscross pattern, so that the solder paste in the injection hole 4 is in an "X" shape. After the solder paste is injected, the lifting mechanism drives the dispensing machine body 18 of the dispensing structure to move upward, so that the lower surface of the dispensing machine body 18 is misaligned with the scraping surface of the scraper 19. The second drive mechanism drives the dispensing frame 17 to move to the left so that the scraper 19 scrapes the solder paste in the injection hole 4 evenly and spreads it evenly.

[0124] The hot press 7 is started, and its pressure and temperature can be adjusted according to the amount of air intake. The third drive mechanism drives the hot press 7 downwards to press the solder paste against the aluminum sheet. The temperature can be set to 180℃, the pressure to 1 MPa, and the pressing time to 5 minutes. After the solder sheet 9 is formed by hot pressing, the third drive mechanism drives the hot press 7 upwards back to the fourth position.

[0125] The first driving mechanism raises the height of the fixing mechanism 5, causing the aluminum metal sheet to move upward. Since the viscosity of the solder sheet 9 to the metal is greater than that of the solder sheet 9 to the heat-resistant film 2, the solder sheet 9 will move upward along with the aluminum metal sheet. The DBC to be sintered is placed below the metal sheet, and the chip 8 is placed on the upper side of the mold 3 at the position corresponding to the paste injection hole 4, forming a sandwich-like structure.

[0126] The second identification unit of the hot press 7 elongates part of the hot pressing section according to the shape of the paste injection hole 4 to form a shape that matches the solder sheet 9. The third drive mechanism drives the hot press 7 to move downward so that the three parts can be sintered and formed by the hot press 7. The temperature can be set to 200°C, the pressure to 5 MPa, and the hot pressing time to 10 minutes.

[0127] The third drive mechanism drives the hot press 7 to move upwards back to the fourth station, while the first drive mechanism drives the fixing mechanism 5 to move back to the first station. The telescopic mechanism 25 shortens to drive the fixing rod 20 to shorten as well. At this time, the heat-resistant film 2 wrinkles, which allows the sintered sample to be completely separated from the heat-resistant film 2. After the rotating shaft 24 rotates 45°, the sintered sample can be dropped to the transfer mechanism 23 for transfer, realizing the assembly line production of the solder pad 9 and the sintering interconnection of the chip 8-solder pad 9-DBC.

[0128] like Figure 6 and Figure 7 As shown, the sintered solder pad 9 has a micro / nano structure, which facilitates the subsequent sintering of the chip 8, solder pad 9, and circuit board 10 into a robust joint. Figure 8 and Figure 9 As shown, the sintered sample exhibits high shear strength. Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention and not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A manufacturing method for chip sintering interconnection using a manufacturing apparatus, characterized in that, Includes the following steps: The heat-resistant film is fixed to the worktable, the injection hole is opened on the mold based on the shape of the chip, and the mold is fixed to the fixing mechanism; The first driving mechanism drives the fixing mechanism to move from the first station to the second station where the worktable is located, so that the mold is in contact with the upper surface of the heat-resistant film. The second drive mechanism drives the dispensing mechanism to move from the third station to the second station. The dispensing mechanism injects solder paste into the injection hole. After the solder paste injection is completed, the second drive mechanism drives the dispensing mechanism to move back to the third station. During this process, the solder paste in the injection hole is smoothed by a scraper. The third mechanism drives the hot press to move from the fourth station to the second station, so that the hot press can hot press the solder paste into a solder sheet. After the solder sheet is formed, the third driving mechanism drives the hot press to move back to the fourth station. The first drive mechanism raises the height of the fixing mechanism, leaving an installation gap between the mold and the heat-resistant film. The circuit board is placed on the upper surface of the heat-resistant film through the installation gap, and the chip is placed on the upper side of the mold at the position corresponding to the injection hole. At least a portion of the hot pressing section of the hot press is elongated to form a shape that fits the solder pad. The third drive mechanism drives the hot press to move from the fourth station to the second station so as to sinter the chip, solder pad and circuit board into shape using the hot pressing section of the hot press. The dispensing mechanism injects solder paste into the injection hole. After the solder paste injection is completed, the second drive mechanism drives the dispensing mechanism to move back to the third station. During this process, the solder paste in the injection hole is smoothed by a scraper. The specific steps include: The dispensing mechanism injects solder paste into the injection hole in a crisscross pattern, so that the solder paste in the injection hole forms an "X" shape. After the solder paste is injected, the lifting mechanism drives the dispensing machine body of the dispensing structure to move upward, so that the lower surface of the dispensing machine body is misaligned with the scraping surface of the scraper. The second driving mechanism drives the dispensing mechanism to move back to the third station, and during this process, the solder paste in the injection hole is smoothed by the scraper.

2. The method for manufacturing chip sintering interconnects according to claim 1, characterized in that, After the step of at least a portion of the hot pressing section of the hot press elongates to form a shape corresponding to the solder pad, and the hot press is driven to move downward by a third drive mechanism to sinter the chip, solder pad, and circuit board into shape, the following step is also included: The third drive mechanism drives the hot press to move back to the fourth station, the first drive mechanism drives the fixing mechanism to move back to the first station, the sintered sample falls off the heat-resistant film, the telescopic mechanism drives the fixing rod to shorten so that the heat-resistant film wrinkles and separates the sintered sample from the heat-resistant film, and the rotating shaft drives the fixing rod to flip to transfer the sintered sample to the transfer mechanism for transmission.

3. The method for manufacturing chip sintering interconnects according to claim 1, characterized in that, The production apparatus includes: The workbench is suitable for being covered with a heat-resistant film; The mold is equipped with a paste injection hole; A fixing mechanism for fixing the mold, the fixing mechanism being adapted to be driven by a first driving mechanism to move the mold above the heat-resistant film; A dispensing mechanism for injecting solder paste into the injection hole, the dispensing mechanism being adapted to be driven by a second drive mechanism to move the dispensing mechanism above the mold; A hot press is used to hot press the solder paste to form solder pads and to sinter chips, solder pads and circuit boards into shape. The hot press is adapted to be driven by a third drive mechanism to move the hot press above the mold. The dispensing mechanism includes a dispensing frame and a dispensing machine body installed in the dispensing frame. The dispensing machine body is provided with a first identification unit for identifying the injection hole, and a second driving mechanism is connected to the dispensing frame. The dispensing frame is provided with a scraper along its width to smooth the solder paste in the injection hole.

4. The method for manufacturing chip sintering interconnects according to claim 3, characterized in that, The fixing mechanism includes a fixing frame and a pair of clamps. The fixing frame is provided with an adjustment groove along its length. One of the clamps is fixed to one end of the fixing frame along its length, and the other clamp is slidably installed in the adjustment groove and locked in position by fasteners. The pair of clamps are adapted to hold the mold on opposite sides, and the first drive mechanism is connected to the fixed frame.

5. The method for manufacturing chip sintering interconnects according to claim 4, characterized in that, The clamp includes a first beam and a second beam, which are installed overlappingly. The first beam and the second beam are respectively provided with a first notch and a second notch on one side facing each other. The first notch and the second notch are joined to form a slot. The mold is adapted to be engaged in the slot, and the first beam and the second beam are adapted to be fixed together by a locking member.

6. The method for manufacturing chip sintering interconnects according to claim 3, characterized in that, The dispensing machine body is adapted to be connected to the dispensing frame via a lifting mechanism.

7. The method for manufacturing chip sintering interconnects according to claim 3, characterized in that, The hot press includes multiple hot pressing sections that can extend and retract toward the worktable, and the hot press is provided with a second identification unit for identifying the injection hole.

8. The method for producing chip sintering interconnects according to any one of claims 3-7, characterized in that, The worktable is provided with fixed rods on both sides of its length direction, and a first rotating rod and a second rotating rod are provided between the two fixed rods at an interval. The worktable is located between the first rotating rod and the second rotating rod. The heat-resistant film is fixed at both ends to the first rotating rod and the second rotating rod, respectively.

9. The method for manufacturing chip sintering interconnects according to claim 8, characterized in that, It also includes a transfer mechanism, wherein the upper surface of the worktable is higher than the transfer surface of the transfer mechanism, and the fixing rod is adapted to be connected to the worktable via a rotating shaft for flipping the heat-resistant film to transfer the sintered sample to the transfer mechanism.

10. The method for manufacturing chip sintering interconnects according to claim 8, characterized in that, The fixed rod is equipped with a telescopic mechanism for adjusting its length.

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