Thin film encapsulation structure and display device

Abstract

The application provides a thin film packaging structure and a display device. The thin film packaging structure comprises a composite packaging layer, the composite packaging layer comprises a plurality of first barrier units, a plurality of buffer units and dry fillers, the first barrier units are arranged at intervals, the buffer units are embedded between two adjacent first barrier units; the first barrier unit has a receiving groove, and the dry fillers are filled in the receiving groove. The thin film packaging structure of the application arranges the buffer units and the first barrier units at intervals, then uses the buffer units to improve the flexibility of the whole thin film packaging structure, uses the buffer device to absorb the force received by the thin film packaging structure, so as to avoid cracks and gaps in the thin film packaging structure during production or use, and then is beneficial to improve the water and oxygen blocking ability of the thin film packaging structure. In addition, the receiving groove is filled with dry fillers to store water and oxygen entering the thin film packaging structure through the dry fillers, so as to further improve the water and oxygen blocking ability of the thin film packaging structure.

Description

Technical Field

[0001] This application relates to display technology, and more particularly to a thin-film encapsulation structure and display device. Background Technology

[0002] Organic light-emitting diode (OLED) display panels offer numerous advantages over liquid crystal displays, including self-illumination, fast response times, low-voltage driving, high brightness, and thinness, making them increasingly mainstream in the display field. However, the organic light-emitting and cathode materials in OLED devices are particularly sensitive to water and oxygen. Even trace amounts of water and oxygen can cause material deterioration within the OLED device's internal structure, leading to defects such as black spots and impacting its lifespan.

[0003] In the prior art, OLED devices are encapsulated by alternating stacking of inorganic and organic layers to prevent external water and oxygen from entering the OLED device and contacting the organic light-emitting materials and cathode materials inside the OLED device.

[0004] However, the aforementioned inorganic layer is prone to cracks and gaps, which can cause encapsulation failure. Summary of the Invention

[0005] This application provides a thin-film encapsulation structure and a display device to solve the problem that existing OLED encapsulation structures are prone to cracks and gaps, which allow external water and oxygen to easily enter the OLED device and corrode the organic light-emitting material and cathode material.

[0006] On one hand, this application provides a thin film encapsulation structure including a composite encapsulation layer. The composite encapsulation layer includes a plurality of first barrier units, a plurality of buffer units, and a dry filler. The first barrier units are spaced apart, and the buffer units are embedded between two adjacent first barrier units. The first barrier unit has a receiving groove, and the dry filler is filled in the receiving groove.

[0007] In the aforementioned thin-film encapsulation structure, the first barrier unit and the buffer unit are spaced apart, which helps the buffer unit absorb the forces acting on the thin-film encapsulation structure, avoids local stress concentration in the thin-film encapsulation structure, and thus helps prevent cracks and gaps from appearing in the thin-film encapsulation structure. The receiving groove of the first barrier unit is filled with dry filler, which can be used to store water and oxygen entering the thin-film encapsulation structure, thereby helping to prevent water and oxygen from permeating through the thin-film encapsulation layer.

[0008] In addition, using the first barrier unit to slot and fill with dry filler is beneficial to increasing the volume of dry filler in the film encapsulation structure and / or the area of ​​the distribution region of dry filler in the film encapsulation structure, thereby improving the ability of the film encapsulation structure to store water and oxygen, as well as the consistency of water and oxygen permeability prevention performance in various places.

[0009] In some alternative embodiments, the openings of the receiving slots of the first barrier unit all face the same side in the thickness direction of the composite encapsulation layer.

[0010] In this way, the opening of the receiving tank can be set to face the side where water and oxygen are immersed in the film encapsulation layer. This not only facilitates the drying filler to absorb the water and oxygen immersed in the film encapsulation layer, but also allows the first barrier unit to further block water and oxygen, thereby improving the ability of the film encapsulation structure to block water and oxygen.

[0011] In some optional embodiments, the composite encapsulation layer further includes a second barrier unit, which is stacked with the buffer unit in the thickness direction of the composite encapsulation layer, and the second barrier unit is located on the side of the buffer unit away from the bottom of the receiving groove.

[0012] In the thin film encapsulation layer described in the above embodiments, the second barrier unit can enhance the ability of the buffer unit distribution area in the thin film encapsulation structure to block water and oxygen, thereby improving the ability of the thin film encapsulation structure to block water and oxygen.

[0013] In some alternative embodiments, the second barrier unit is connected to the first barrier unit, and the second barrier unit is made of the same material as the first barrier unit and forms an integral structure.

[0014] In the above embodiments, the first barrier unit and the second barrier unit are configured as an integral structure, thereby avoiding the formation of a gap between the first barrier unit and the second barrier unit. This helps prevent water and oxygen from penetrating the thin-film encapsulation structure through the assembly gap between the first barrier unit and the second barrier unit, thus improving the water and oxygen barrier capability of the thin-film encapsulation structure. Furthermore, the first barrier unit is made of the same material as the second barrier unit, which helps prevent large internal stresses between the first barrier unit and the second barrier unit due to their different coefficients of thermal expansion. This helps prevent cracks from appearing between the first barrier unit and the second barrier unit caused by changes in the ambient temperature of the thin-film encapsulation structure.

[0015] In a further optional embodiment, the material of the first barrier unit includes at least one of graphene, silicon oxide, and silicon nitride. This allows the first barrier unit to not only block water and oxygen but also possess good flexibility, thus facilitating the formation of cracks and gaps when the first barrier unit is subjected to stress.

[0016] In a further optional embodiment, the buffer unit is made of polyimide. This gives the buffer unit good flexibility, which is beneficial for absorbing the forces acting on the thin-film encapsulation structure. Furthermore, polyimide has superior film-forming properties and a dense surface that is less prone to pinholes, thus improving the uniformity and surface flatness of the thin-film encapsulation structure, achieving planarization of the thin-film encapsulation layer. Moreover, the fact that the buffer unit is made of polyimide also helps to encapsulate contaminant particles.

[0017] In some alternative embodiments, the surface of the first barrier unit facing away from the bottom of the receiving tank, the surface of the dry filler facing away from the bottom of the receiving tank, and the surface of the buffer unit facing away from the bottom of the receiving tank are flush.

[0018] The above embodiments can achieve surface planarization of the thin-film encapsulation structure.

[0019] In some optional embodiments, the thin-film encapsulation structure further includes a hydrophilic encapsulation layer stacked on the side of the composite encapsulation layer away from the bottom of the receiving groove, and the hydrophilic encapsulation layer is made of at least one hydrophilic material.

[0020] In the above embodiments, the water-encapsulation layer can transport water and oxygen immersed in the film encapsulation structure to the dry filler, thereby improving the ability of the film encapsulation structure to block water and oxygen.

[0021] In a preferred embodiment, the hydrophilic encapsulation layer comprises at least one of a polyacrylonitrile ultrafiltration membrane, sodium acetate, sodium benzoate, sodium ethoxide, sodium acetylene, sodium desiccant, and carbon nanotubes. Thus, the hydrophilic encapsulation layer not only transports water and oxygen that permeates into the film encapsulation structure, but also provides good flexibility and enhances its stress-buffering capacity.

[0022] In some alternative embodiments, the thin-film encapsulation structure further includes a first inorganic encapsulation layer located on the side of the composite encapsulation layer away from the bottom of the receiving groove.

[0023] Inorganic encapsulation layers exhibit superior barrier properties against water vapor and oxygen. Therefore, in the above embodiments, the first inorganic encapsulation layer is beneficial for improving the barrier effect of the thin-film encapsulation structure against water vapor and oxygen. Further optionally, the first inorganic encapsulation layer is located on the side of the hydrophilic encapsulation layer facing away from the composite encapsulation layer, thereby improving the lifespan of the composite encapsulation layer.

[0024] In some preferred embodiments, the material of the first inorganic encapsulation layer includes at least one of graphene, silicon oxide, and silicon nitride. This not only enhances the water and oxygen barrier performance of the thin-film encapsulation structure through the first inorganic encapsulation layer, but also gives it superior flexibility, thereby helping to prevent cracks in the first inorganic encapsulation layer and improving the stress buffering capacity of the thin-film encapsulation structure.

[0025] In some alternative embodiments, the thin-film encapsulation structure further includes a second inorganic encapsulation layer located on the side of the composite encapsulation layer near the bottom of the receiving groove.

[0026] In the above embodiments, the second inorganic encapsulation layer can further improve the barrier effect of the thin film encapsulation structure against water vapor and oxygen.

[0027] In some further preferred embodiments, the material of the second inorganic encapsulation layer includes at least one of graphene, silicon oxide, and silicon nitride. This not only enhances the water and oxygen barrier performance of the thin-film encapsulation structure through the second inorganic encapsulation layer, but also gives it superior flexibility, thereby helping to prevent cracking and improving the stress buffering capacity of the thin-film encapsulation structure.

[0028] On the other hand, this application also provides a display device. The display device includes a display panel and the thin-film encapsulation structure described in this application, wherein the thin-film encapsulation structure is disposed on the light-emitting side of the display panel.

[0029] The display device provided in this application has the same technical features as the aforementioned thin-film encapsulation structure and can achieve the same technical effects, which will not be elaborated here.

[0030] In some alternative embodiments, the openings of the receiving grooves in the thin-film encapsulation structure face away from the display panel. This embodiment is beneficial because water and oxygen immersed in the thin-film encapsulation structure are adsorbed by the dry filler in the receiving groove, thereby improving the display device's ability to block water and oxygen. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0032] Figure 1 This is a schematic diagram of the structure of an OLED display device in related technologies;

[0033] Figure 2 This is a schematic diagram of the thin-film encapsulation structure in the first optional embodiment of this application;

[0034] Figure 3 This is a schematic diagram of the receiving groove of the first barrier unit in the first optional embodiment of this application, where no dry filler is filled;

[0035] Figure 4 This is a schematic diagram of the thin-film encapsulation structure in a second optional embodiment of this application;

[0036] Figure 5 This is a schematic diagram of the thin-film encapsulation structure in a third optional embodiment of this application;

[0037] Figure 6 This is a schematic diagram of the thin-film encapsulation structure in the fourth optional embodiment of this application;

[0038] Figure 7 This is a schematic diagram of the thin-film encapsulation structure in the sixth optional embodiment of this application;

[0039] Figure 8 This is a schematic diagram of the structure of the display device in some optional embodiments of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10-OLED display panel; 11-OLED device layer; 12-TFT layer; 13-substrate; 14-organic thin film layer;

[0042] 20 - Packaging structure; 21 - First inorganic layer; 22 - First organic layer; 23 - Second inorganic layer; 24 - Second organic layer; 25 - Third inorganic layer;

[0043] 100 - Display panel; 110 - Light-emitting layer; 120 - TFT layer; 130 - Substrate layer; 140 - Organic thin film layer;

[0044] 200 - Composite encapsulation layer; 210 - First barrier unit; 211 - Receiving groove; 220 - Buffer unit; 230 - Drying filler; 240 - Second barrier unit;

[0045] 300-Hydrophilic encapsulation layer;

[0046] 400 - First inorganic encapsulation layer;

[0047] 500 - Second inorganic encapsulation layer.

[0048] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0049] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0050] Figure 1 This is a schematic diagram of the structure of an OLED display device in related technologies.

[0051] Reference Figure 1 In related technologies, an OLED display device includes an OLED display panel 10 and an encapsulation structure 20. The encapsulation structure 20 is stacked on top of the OLED display panel 10 to block water and oxygen, thereby protecting the OLED display panel 10.

[0052] like Figure 1 As shown, the OLED display panel 10 includes an OLED device layer 11, a TFT (Thin Film Transistor) layer 12, a substrate 13, and an organic thin film layer 14. Specifically, the substrate 13 is a basic structural component that provides a mounting base for other layer structures. Specifically, the organic thin film layer 14 is stacked on the substrate 13, and the TFT layer 12 is stacked on the side of the organic thin film layer 14 away from the substrate 13. The OLED device layer 11 is stacked on the side of the TFT layer 12 away from the organic thin film layer 14.

[0053] Furthermore, the encapsulation structure 20 includes a first inorganic layer 21, a first organic layer 22, a second inorganic layer 23, a second organic layer 24, and a third inorganic layer 25. As... Figure 1 As shown, the first inorganic layer 21, the first organic layer 22, the second inorganic layer 23, the second organic layer 24, and the third inorganic layer 25 are sequentially stacked on the side of the OLED device layer 11 away from the TFT layer 12. Specifically, the first inorganic layer 21 is stacked on the side of the OLED device layer 11 away from the TFT layer 12. The first organic layer 22 is stacked on the side of the first inorganic layer 21 away from the OLED device layer 11. The second inorganic layer 23 is stacked on the side of the first organic layer 22 away from the first inorganic layer 21. The second organic layer 24 is stacked on the side of the second inorganic layer 23 away from the first organic layer 22. The third inorganic layer 25 is stacked on the side of the second organic layer 24 away from the second inorganic layer 23.

[0054] Because the first inorganic layer 21, the second inorganic layer 23, and the third inorganic layer 25 in the encapsulation structure 20 have poor flexibility, cracks are easily formed in the first inorganic layer 21, the second inorganic layer 23, and / or the third inorganic layer 25 during production and use. This allows external water and oxygen to enter the OLED device layer 11 through the cracks in the first inorganic layer 21, the second inorganic layer 23, and / or the third inorganic layer 25, and corrode the organic light-emitting material and cathode material in the OLED device, thereby shortening the lifespan of the OLED device.

[0055] To address the aforementioned technical problems, this application provides a thin-film encapsulation structure. Specifically, multiple barrier units and multiple buffer units are provided, with the barrier units and buffer units spaced apart from each other. That is, the barrier units are spaced apart, and the buffer units are embedded between two adjacent barrier units. The buffer units absorb the forces acting on the thin-film encapsulation structure, thus helping to prevent cracks and gaps from forming after stress, thereby improving the water and oxygen barrier capabilities of the thin-film encapsulation structure. Furthermore, the barrier units begin with a receiving groove, which is filled with dry filler. This dry filler can adsorb water and oxygen entering the thin-film encapsulation structure, achieving the purpose of storing water and oxygen. Therefore, this solution can also store water and oxygen through dry filler, preventing water and oxygen from passing through the thin-film encapsulation structure, thereby further improving the water and oxygen barrier capabilities of the thin-film encapsulation structure.

[0056] Therefore, the above solution is beneficial to increase the toughness of the thin film encapsulation structure, avoid cracks and gaps in the thin film encapsulation structure during production or use, and improve the ability of the thin film encapsulation structure to block water and oxygen, so as to solve the problem that the encapsulation structure of OLED display devices is prone to cracking and has poor ability to block water and oxygen in related technologies.

[0057] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0058] Reference Figures 2 to 8 In some optional embodiments, the thin-film encapsulation structure described in this application includes a composite encapsulation layer 200. For example... Figure 2 As shown, the composite encapsulation layer 200 includes a plurality of first barrier units 210, a plurality of buffer units 220, and a drying filler 230. The first barrier units 210 are spaced apart, and the buffer units 220 are embedded between two adjacent first barrier units 210. Each first barrier unit 210 has a receiving groove 211, and the drying filler 230 is filled in the receiving groove 211.

[0059] For example, the drying filler 230 includes at least one of calcium oxide (CaO), barium oxide (BaO), and molecular sieve desiccant, so that the drying filler 230 can store water and oxygen entering the film encapsulation structure.

[0060] In the thin-film encapsulation structure described in the above embodiments, multiple buffer units 220 can absorb the forces acting on the thin-film encapsulation structure, giving it superior flexibility and preventing cracks or gaps during production or use, thus improving its ability to block water and oxygen. The multiple buffer units 220 and the multiple first barrier units 210 are spaced apart from each other, which helps ensure the uniform distribution of the buffer units 220 and the first barrier units 210 within the thin-film encapsulation structure, improving the consistency of flexibility across the entire structure.

[0061] Furthermore, the first barrier unit 210 is provided with a receiving groove 211, and the receiving groove 211 is filled with a dry filler 230. This allows the dry filler 230 to store water and oxygen that have entered the thin-film encapsulation structure, thereby improving the thin-film encapsulation structure's ability to block water and oxygen. When the thin-film encapsulation structure is used to encapsulate OLED devices, it helps to extend the lifespan of the OLED devices.

[0062] In some alternative embodiments, the first barrier units 210 are uniformly and spaced apart, which in turn benefits the consistency of water and oxygen barrier performance and flexibility throughout the thin film encapsulation layer.

[0063] Further optionally, the projection of the first blocking unit 210 along the Y-axis is strip-shaped. Optionally, the extending direction of the first blocking unit 210 is a first direction. (Refer to...) Figure 2 The first direction can be perpendicular to the x-axis and y-axis. Specifically, multiple first blocking units 210 can be distributed parallel to each other and spaced apart along the x-axis.

[0064] In the above embodiments, the structure of the first barrier unit 210 helps reduce the manufacturing difficulty of the first barrier unit 210, thus facilitating its manufacture. As an optional implementation, the receiving groove 211 can be formed by an etching process.

[0065] In some further optional embodiments, the cross-sectional shape of the first barrier unit 210 perpendicular to the z-axis is square. This embodiment is advantageous for manufacturing the first barrier unit 210. Specifically, a quadrangular prism-shaped intermediate structure can be formed by a deposition process, and then a receiving groove 211 can be further formed on the quadrangular prism-shaped intermediate structure by an etching process. Further, the cross-sectional shape of the receiving groove 211 perpendicular to the z-axis is square. Wherein, the z-axis is perpendicular to the z-axis. Figure 2 The x-axis and y-axis shown are perpendicular.

[0066] In the above embodiments, the structure of the first barrier unit 210 is beneficial to reducing the manufacturing difficulty of the first barrier unit 210, so that the first barrier unit 210 can be formed through mature processes.

[0067] Of course, the first barrier unit 210 can also be, but is not limited to, a square or disc-shaped form. Therefore, this embodiment does not limit the specific shape of the first barrier unit 210. In addition, the cross-sectional shape of the receiving groove 211 perpendicular to the z-axis can be, but is not limited to, a square, a semi-circular shape, or a "V" shape.

[0068] Reference Figure 2 In some optional embodiments, the openings of the receiving grooves 211 of the first barrier unit 210 all face the same side in the thickness direction of the composite encapsulation layer 200. For example, the thickness direction of the composite encapsulation layer 200 may be... Figure 2 The y-axis direction is shown in the figure.

[0069] In the thin-film encapsulation structure provided in the above embodiments, the openings of the receiving grooves 211 all face the same side in the thickness direction of the composite encapsulation layer 200. On the one hand, this ensures the consistency of the structure throughout the thin-film encapsulation structure, thereby improving the consistency of the water and oxygen barrier capabilities throughout the thin-film encapsulation structure. On the other hand, by setting the relative position between the thin-film encapsulation structure and the encapsulated structure, the openings of the receiving grooves 211 can be aligned with the direction in which water and oxygen immerse into the encapsulation structure. This facilitates the absorption of water and oxygen by the drying filler 230 within the receiving grooves 211, further enhancing the water and oxygen barrier capabilities of the thin-film encapsulation structure.

[0070] For example, when the thin film encapsulation structure described in this application is used for OLED display panel encapsulation, the thin film encapsulation structure can be disposed on the light-emitting side of the OLED display panel, and the slot opening of the receiving groove 211 faces the side away from the OLED display panel.

[0071] In some alternative embodiments, the cross-sectional area of ​​the receiving groove 211 near the opening is greater than or equal to the cross-sectional area of ​​the receiving groove 211 near the bottom. This embodiment is beneficial for increasing the area of ​​the drying filler 230 on the side of the receiving groove 211 away from the receiving groove 211, thereby benefiting the drying filler 230 in absorbing and storing water and oxygen entering the film encapsulation structure.

[0072] In some alternative embodiments, such as Figure 4 As shown, the composite encapsulation layer 200 also includes a second barrier unit 240. The second barrier unit 240 and the buffer unit 220 are stacked in the thickness direction of the composite encapsulation layer 200, and the second barrier unit 240 is located on the side of the buffer unit 220 away from the bottom of the receiving groove 211.

[0073] In the above embodiments, the second barrier unit 240 can cover the area where the buffer unit 220 is located, thereby further improving the ability of the area where the buffer unit 220 is located to block water and oxygen, and thus enhancing the ability of the thin film encapsulation structure to block water and oxygen.

[0074] Reference Figure 4 In some optional embodiments, the second barrier unit 240 is connected to the first barrier unit 210. Optionally, adjacent edges of the second barrier unit 240 and the first barrier unit 210 are spliced ​​together, which helps to reduce the gap between the second barrier unit 240 and the first barrier unit 210, and helps to prevent water and oxygen from seeping in from between the second barrier unit 240 and the first barrier unit 210. Optionally, adjacent edges of the second barrier unit 240 and the first barrier unit 210 are sealed together to improve the ability of the thin-film encapsulation structure to block water and oxygen.

[0075] In some optional embodiments, the second barrier unit 240 is made of the same material as the first barrier unit 210, which helps to ensure the consistency of the water and oxygen blocking capabilities of the area covered by the second barrier unit 240 and the area covered by the first barrier unit 210. In a further optional embodiment, the second barrier unit 240 and the first barrier unit 210 form an integral structure. That is, there is no assembly gap between the second barrier unit 240 and the first barrier unit 210, which further improves the water and oxygen blocking capability of the thin-film encapsulation structure.

[0076] In some optional embodiments, the material of the first barrier unit 210 includes at least one of graphene, silicon oxide, and silicon nitride. Exemplarily, the material of the first barrier unit 210 is one of graphene, silicon oxide, and silicon nitride. Alternatively, the material of the first barrier unit 210 includes any two of graphene, silicon oxide, and silicon nitride. Or, the material of the first barrier unit 210 includes graphene, silicon oxide, and silicon nitride.

[0077] In the above embodiments, the material of the first barrier unit 210 includes at least one of graphene, silicon oxide, and silicon nitride. This not only helps ensure that the first barrier unit 210 has a good ability to block water and oxygen, but also makes the first barrier unit 210 more flexible. This helps prevent cracks and gaps from appearing in the first barrier unit 210 after being subjected to force, and can further prevent cracks and gaps from appearing in the thin film encapsulation structure during production or use.

[0078] As a further optional embodiment, when the material of the first barrier unit 210 includes at least two of graphene, silicon oxide, and silicon nitride, each material is formed into a layer structure in the thickness direction of the thin-film encapsulation structure, i.e. Figure 2 or Figure 4The stacked arrangement is shown in the y-axis direction. For example, in the case where the materials of the first barrier unit 210 are graphene and silicon oxide, graphene forms the first barrier layer, silicon oxide forms the second barrier layer, and the first barrier layer and the second barrier layer are stacked in the thickness direction of the thin film encapsulation structure.

[0079] The above embodiments are beneficial in ensuring that all materials in the first barrier unit 210 can form a continuous barrier film covering the area where the first barrier unit 210 is located, thereby improving the flexibility and water and oxygen blocking ability of the first barrier unit 210.

[0080] In some optional embodiments, the buffer unit 220 is made of polyimide (PI). In this embodiment, using polyimide as the material for the buffer unit 220 provides it with good flexibility, allowing it to absorb forces acting on the thin-film encapsulation structure. Furthermore, polyimide has superior film-forming properties and a dense surface that resists pinholes, thus improving the uniformity and surface flatness of the thin-film encapsulation structure, achieving planarization of the encapsulation layer. The polyimide material also helps the buffer unit 220 to encapsulate contaminant particles. Additionally, the polyimide material enhances the high-temperature resistance of the buffer unit 220, thereby increasing the operating temperature range of the thin-film encapsulation structure.

[0081] Reference Figure 2 In some optional embodiments, the surfaces of the first barrier unit 210 facing away from the bottom of the receiving groove 211, the dried filler 230 facing away from the bottom of the receiving groove 211, and the buffer unit 220 facing away from the bottom of the receiving groove 211 are flush. In this embodiment, the flatness of the surface of the composite encapsulation layer 200 facing away from the bottom of the receiving groove 211 can be ensured, which is beneficial to achieving the planarization of the thin-film encapsulation structure.

[0082] Reference Figure 4 In some alternative embodiments, the surfaces of the first barrier unit 210 facing away from the bottom of the receiving groove 211, the dried filler 230 facing away from the bottom of the receiving groove 211, and the second barrier unit 240 facing away from the bottom of the receiving groove 211 are flush. In this embodiment, the flatness of the surface of the composite encapsulation layer 200 facing away from the bottom of the receiving groove 211 can be ensured, which is beneficial to achieving the planarization of the thin-film encapsulation structure.

[0083] In some alternative embodiments, such as Figures 5 to 7As shown, the thin-film encapsulation structure also includes a hydrophilic encapsulation layer 300, which is stacked on the side of the composite encapsulation layer 200 away from the bottom of the receiving groove 211, and the material of the hydrophilic encapsulation layer 300 includes at least one hydrophilic material.

[0084] In the above embodiments, the hydrophilic encapsulation layer 300 is made of at least one hydrophilic material, which facilitates the transport of water and oxygen within the film encapsulation structure and helps control the flow direction of water and oxygen within the film packaging structure. Furthermore, the hydrophilic encapsulation layer 300 is stacked on the side of the composite encapsulation layer 200 away from the bottom of the receiving tank 211. That is, the hydrophilic encapsulation layer 300 helps guide water and oxygen within the film encapsulation structure to the dry filler 230 within the receiving tank 211, so that the dry filler 230 stores the water and oxygen that have entered the film encapsulation structure.

[0085] In some preferred embodiments, the hydrophilic encapsulation layer 300 includes at least one of a polyacrylonitrile ultrafiltration membrane, sodium acetate, sodium benzoate, sodium ethoxide, sodium acetylene, sodium acetylene, a desiccant, and carbon nanotubes. Exemplarily, the hydrophilic encapsulation layer 300 includes at least one of a polyacrylonitrile ultrafiltration membrane layer, a sodium acetate layer, a sodium benzoate layer, a sodium ethoxide layer, a sodium acetylene layer, a desiccant layer, and a carbon nanotube layer. Further optionally, when the hydrophilic encapsulation layer 300 includes any two of a polyacrylonitrile ultrafiltration membrane layer, a sodium acetate layer, a sodium benzoate layer, a sodium ethoxide layer, a sodium acetylene layer, a desiccant layer, and a carbon nanotube layer, the layers are stacked in the thickness direction of the thin-film encapsulation structure.

[0086] In the above embodiments, the hydrophilic encapsulation layer 300 not only possesses good flexibility, which helps prevent cracks and gaps from appearing during production or use, but also facilitates the transport of water and oxygen into the film encapsulation layer structure. This creates a concentration difference between the side of the hydrophilic encapsulation layer 300 away from the composite encapsulation layer 200 and the side closer to the composite encapsulation layer 200, allowing osmotic pressure to transport the water and oxygen into the film encapsulation structure to the drying filler 230 for storage. Therefore, the above embodiments benefit from the drying filler 230 storing water and oxygen within the film encapsulation structure, thereby improving the film encapsulation structure's ability to block water and oxygen.

[0087] Further reference Figures 5 to 7 In some optional embodiments, the thin-film encapsulation structure further includes a first inorganic encapsulation layer 400, which is located on the side of the composite encapsulation layer 200 away from the bottom of the receiving groove 211. This embodiment can utilize the superior water and oxygen barrier properties of the inorganic encapsulation layer, thereby improving the water and oxygen barrier capability of the thin-film encapsulation structure.

[0088] In some preferred embodiments, the first inorganic encapsulation layer 400 is made of at least one of graphene, silicon oxide, and silicon nitride. Exemplarily, the first inorganic encapsulation layer 400 is made of one of graphene, silicon oxide, and silicon nitride. Alternatively, the first inorganic encapsulation layer 400 is made of any two of graphene, silicon oxide, and silicon nitride. Or, the first inorganic encapsulation layer 400 is made of graphene, silicon oxide, and silicon nitride.

[0089] In the above embodiments, the material of the first inorganic encapsulation layer 400 includes at least one of graphene, silicon oxide, and silicon nitride. This not only helps ensure that the first inorganic encapsulation layer 400 has a good ability to block water and oxygen, but also makes the first inorganic encapsulation layer 400 have better flexibility. This helps prevent cracks and gaps from appearing in the first inorganic encapsulation layer 400 after being subjected to stress, and can further prevent cracks and gaps from appearing in the thin film encapsulation structure during production or use.

[0090] As a further optional embodiment, when the material of the first barrier unit 210 includes at least two of graphene, silicon oxide, and silicon nitride, each material is formed into a layer structure in the thickness direction of the thin-film encapsulation structure, i.e. Figures 5 to 7 The stacked arrangement is shown in the y-axis direction. For example, in the case where the materials of the first barrier unit 210 are graphene and silicon oxide, graphene forms a first inorganic encapsulation sublayer, silicon oxide forms a second inorganic encapsulation sublayer, and the first and second inorganic encapsulation sublayers are stacked in the thickness direction of the thin film encapsulation structure.

[0091] The above embodiments are beneficial in ensuring that all kinds of materials in the first inorganic encapsulation layer 400 can form a film covering the area covered by the thin film encapsulation structure, thereby improving the flexibility and water and oxygen barrier capabilities of the first inorganic encapsulation layer 400.

[0092] In some alternative embodiments, the material of the first inorganic encapsulation layer 400 may be the same as the material of the first barrier unit 210 and / or the material of the second barrier unit 240.

[0093] In some alternative embodiments, the first inorganic encapsulation layer 400 is located on the side of the hydrophilic encapsulation layer 300 away from the composite encapsulation layer 200, that is, the hydrophilic encapsulation layer 300 is located between the first inorganic encapsulation layer 400 and the composite encapsulation layer 200.

[0094] In the above embodiments, the first inorganic encapsulation layer 400 can block water and oxygen from entering the thin-film encapsulation structure, thereby increasing the difficulty for water and oxygen to enter the thin-film encapsulation structure, which is beneficial to reducing the amount of water and oxygen entering the thin-film encapsulation structure. Given a fixed amount of water and oxygen stored in the dry filler 230, the smaller the reduction in the amount of water and oxygen entering the thin-film encapsulation structure, the longer the water and oxygen barrier capacity of the thin-film encapsulation structure is maintained.

[0095] Reference Figure 6 or Figure 7 In some optional embodiments, the thin-film encapsulation structure further includes a second inorganic encapsulation layer 500, which is located on the side of the composite encapsulation layer 200 near the bottom of the receiving groove 211. This embodiment can utilize the superior water and oxygen barrier properties of the inorganic encapsulation layer, thereby improving the water and oxygen barrier capability of the thin-film encapsulation structure.

[0096] In some preferred embodiments, the material of the second inorganic encapsulation layer 500 includes at least one of graphene, silicon oxide, and silicon nitride.

[0097] Optionally, the structure of the second inorganic encapsulation layer 500 can be the same as that of the first inorganic encapsulation layer 400. Therefore, the second inorganic encapsulation layer 500 can achieve the same or similar technical effects as the first inorganic encapsulation layer 400, which will not be elaborated here.

[0098] On the other hand, this application also provides a display device. (See reference...) Figure 8 In some optional embodiments, the display device described in this application includes a display panel 100 and a thin-film encapsulation structure described in this application, wherein the thin-film encapsulation structure is disposed on the light-emitting side of the display panel 100.

[0099] The display device provided in this application has the same technical features as the aforementioned thin-film encapsulation structure and can achieve the same technical effects, which will not be described in detail here. In addition, the thin-film encapsulation structure is disposed on the light-emitting side of the display panel 100, which is beneficial to prevent water and oxygen from entering the display panel 100 from the light-emitting side through the thin-film encapsulation structure, thereby achieving the purpose of protecting the display panel 100.

[0100] like Figure 8 As shown, the display panel 100 includes a light-emitting layer 110, a TFT layer 120, a substrate layer 130, and an organic thin film layer 140. Optionally, the substrate layer 130 is a basic structural component that can provide a mounting base for other layer structures.

[0101] Reference Figure 8 In some optional embodiments, the organic thin film layer 140, the TFT layer 120, and the light-emitting layer 110 are sequentially stacked on the same side of the substrate layer 130 along the thickness direction of the display panel 100. As... Figure 8 As shown, the thickness direction of the display panel 100 is along the y-axis. Specifically, an organic thin film layer 140 is stacked on the substrate layer 130. A TFT layer 120 is stacked on the side of the organic thin film layer 140 facing away from the substrate layer 130. A light-emitting layer 110 is stacked on the side of the TFT layer 120 facing away from the organic thin film layer 140.

[0102] Optionally, the active layer of the TFT layer 120 can be an LTPS (Low Temperature Poly-Silicon) layer. Optionally, the organic thin film layer 140 can be made of polyimide.

[0103] Reference Figure 8 In the thin-film encapsulation structure, each layer is bent toward the side closer to the display panel 100, and each layer is sealed to the display panel 100.

[0104] Exemplarily, the edge of the second inorganic encapsulation layer 500 is bent toward the light-emitting layer 110 and the TFT layer 120 to seal the edge of the second inorganic encapsulation layer 500 with the light-emitting layer 110 and / or the TFT layer 120. The edge of the composite encapsulation layer 200 is bent toward the organic thin film layer 140, and the edge of the composite encapsulation layer 200 is sealed with the organic thin film layer 140. The edge of the hydrophilic encapsulation layer 300 is bent toward the organic thin film layer 140, and the edge of the hydrophilic encapsulation layer 300 is sealed with the organic thin film layer 140. The edge of the first inorganic encapsulation layer 400 is bent toward the organic thin film layer 140, and the edge of the first inorganic encapsulation layer 400 is sealed with the organic thin film layer 140.

[0105] The above embodiments are beneficial to improving the sealing performance of the edge parts of the display device, thereby preventing water and oxygen from seeping in along the edge parts of the display device and improving the water and oxygen barrier performance of the display device.

[0106] In some alternative embodiments, the display panel 100 can be an OLED display panel. Specifically, the light-emitting layer 110 can be an OLED device layer. Therefore, a thin-film encapsulation structure can be used to protect the OLED device and extend its lifespan.

[0107] In some optional embodiments, the openings of the receiving grooves 211 of the thin-film encapsulation structure are all opposite to the display panel 100. It should be noted that during use, external water and oxygen generally enter from the side of the thin-film encapsulation structure opposite to the display panel 100. In the above embodiments, it is beneficial to store the entering water and oxygen in the drying filler 230 within the receiving grooves 211, thereby preventing external water and oxygen from entering the display panel 100 and improving the service life of the display device.

[0108] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0109] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A thin-film encapsulation structure, characterized in that, Including composite encapsulation layer, The composite encapsulation layer includes multiple first barrier units, multiple buffer units, and dry filler. The first barrier units are spaced apart, and the buffer units are embedded between two adjacent first barrier units. The first barrier unit has a receiving groove, and the dried filler is filled in the receiving groove; wherein the cross-sectional area of ​​the receiving groove near the opening is larger than the cross-sectional area of ​​the receiving groove near the bottom. The thin-film encapsulation structure further includes a hydrophilic encapsulation layer, which is stacked on the side of the composite encapsulation layer away from the bottom of the receiving groove, and the hydrophilic encapsulation layer is made of at least one hydrophilic material.

2. The thin-film encapsulation structure according to claim 1, characterized in that, The openings of the receiving grooves in the first barrier unit all face the same side in the thickness direction of the composite encapsulation layer.

3. The thin-film encapsulation structure according to claim 2, characterized in that, The composite encapsulation layer further includes a second barrier unit, which is stacked with the buffer unit in the thickness direction of the composite encapsulation layer, and the second barrier unit is located on the side of the buffer unit away from the bottom of the receiving groove.

4. The thin-film encapsulation structure according to claim 3, characterized in that, The second barrier unit is connected to the first barrier unit, and the second barrier unit and the first barrier unit are made of the same material and form an integral structure.

5. The thin-film encapsulation structure according to claim 4, characterized in that, The material of the first barrier unit includes at least one of graphene, silicon oxide, and silicon nitride; and / or, the material of the buffer unit is polyimide.

6. The thin-film encapsulation structure according to claim 2, characterized in that, The surfaces of the first barrier unit facing away from the bottom of the receiving tank, the dry filler facing away from the bottom of the receiving tank, and the buffer unit facing away from the bottom of the receiving tank are flush.

7. The thin-film encapsulation structure according to any one of claims 1 to 6, characterized in that, The hydrophilic encapsulation layer includes at least one of the following: polyacrylonitrile ultrafiltration membrane, sodium acetate, sodium benzoate, sodium ethoxide, sodium acetylene, sodium acetylene, desiccant, and carbon nanotubes.

8. The thin-film encapsulation structure according to any one of claims 1 to 6, characterized in that, It also includes a first inorganic encapsulation layer, which is located on the side of the composite encapsulation layer away from the bottom of the receiving groove.

9. The thin-film encapsulation structure according to claim 8, characterized in that, The material of the first inorganic encapsulation layer includes at least one of graphene, silicon oxide, and silicon nitride.

10. The thin-film encapsulation structure according to any one of claims 1 to 6, characterized in that, It also includes a second inorganic encapsulation layer, which is located on the side of the composite encapsulation layer near the bottom of the receiving groove.

11. The thin-film encapsulation structure according to claim 10, characterized in that, The material of the second inorganic encapsulation layer includes at least one of graphene, silicon oxide, and silicon nitride.

12. A display device, characterized in that, It includes a display panel and a thin-film encapsulation structure as described in any one of claims 1-11, wherein the thin-film encapsulation structure is disposed on the light-emitting side of the display panel.

13. The display device according to claim 12, characterized in that, The openings of the receiving grooves in the thin-film encapsulation structure are all away from the display panel.

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