Structure of millimeter wave antenna module applied in foldable electronic device

Abstract

An electronic device according to one embodiment of the disclosure includes a first housing, a second housing coupled to the first housing by a hinge structure to be rotatable about a first axis oriented in a first direction, a first cover to cover a rear surface of the first housing, a second cover to cover a rear surface of the second housing, a flexible display forming a front surface of the electronic device and disposed over the first housing and the second housing, an antenna module, at least one processor electrically connected to the flexible display and the antenna module, wherein the hinge structure is disposed in a region having a first width from the first axis in a second direction perpendicular to the first direction, the first housing has a first structure covering the hinge structure within the first width, the first structure has a receiving recess in which the antenna module is received, and the at least one processor is configurable to transmit / receive a high frequency (e.g., millimeter wave) signal corresponding to a third direction perpendicular to both the first direction and the second direction using the antenna module.

Description

TECHNICAL FIELD

[0001] Various embodiments disclosed herein relate to a foldable electronic device including a millimeter wave antenna module. BACKGROUND

[0002] A mobile electronic device includes a plurality of antenna radiators for transmitting and / or receiving signals of various frequency bands. For example, the plurality of antenna radiators are designed to be capable of transmitting / receiving wireless signals of a specified frequency band (e.g., a low band (LB) or a high band (HB)).

[0003] Recently, foldable electronic devices having a hinge structure with improved portability have emerged. The foldable electronic device includes two different housings through the hinge structure, and the two housings are capable of relatively rotating about the hinge structure to be folded or unfolded.

[0004] Depending on the direction in which a folding axis faces, the foldable electronic device can be classified into an H-type folding and a V-type folding. For example, the H-type folding electronic device can be folded about a horizontal direction such that its upper end portion and lower end portion face each other. Also, the V-type folding electronic device can be folded about a vertical direction such that its left edge and right edge face each other.

[0005] Meanwhile, the recent electronic device has an array antenna configured to support communication using a high frequency (e.g., millimeter wave (mmWave)) such as 5G. In the case of the array antenna, since a high target frequency band, the directivity becomes significant compared to a conventional frequency band. Therefore, in the case where the setting space of the mobile terminal is limited, the position and direction in which the array antenna is disposed have been considered important. SUMMARY

[0006] TECHNICAL PROBLEM

[0007] The foldable electronic device needs an additional space to dispose the antenna module, or otherwise needs to dispose the antenna module to overlap with an existing component.

[0008] Meanwhile, if the antenna module is disposed to overlap with another electronic component of the foldable electronic device at the same time, interference can occur in the antenna radiation, thereby deteriorating the antenna radiation performance. Therefore, it can be necessary to dispose the antenna module to be spaced apart from the other electronic component.

[0009] Various embodiments can provide a method and device for improving antenna radiation performance by disposing a high frequency (e.g., mmWave) antenna module on a portion of a structure covering a hinge structure of a foldable electronic device.

[0010] TECHNICAL SOLUTION

[0011] An electronic device according to various embodiments can include a first housing, a second housing coupled to the first housing to be rotatable about a first axis facing a first direction by a hinge structure, a flexible display defining a front surface of the electronic device and disposed above the first housing and the second housing, an antenna module, and at least one processor electrically connected to the flexible display and the antenna module, wherein the hinge structure is disposed in a region having a first width with respect to the first axis in a second direction perpendicular to the first direction, wherein the first housing has a first structure covering the hinge structure within the first width, wherein the first structure has a receiving groove in which the antenna module is received, and wherein the at least one processor is configured to transmit and receive a mmWave signal corresponding to a third direction perpendicular to both the first direction and the second direction by using the antenna module.

[0012] An electronic device according to various embodiments can include a first housing, a second housing coupled to the first housing to be rotatable about a first axis facing a first direction by a hinge structure, a first cover covering a rear surface of the first housing, a second cover covering a rear surface of the second housing, an antenna module, and at least one processor electrically connected to the antenna module, wherein the hinge structure is disposed in a region having a first width with respect to the first axis in a second direction perpendicular to the first direction, wherein the first housing has a first structure covering the hinge structure within the first width, wherein the first structure has a receiving groove in which the antenna module is received, and wherein the at least one processor is configured to transmit and receive a mmWave signal corresponding to a third direction perpendicular to both the first direction and the second direction by using the antenna module.

[0013] Advantageous Effects

[0014] The electronic device according to the disclosure can have the antenna module disposed in a predetermined space of a structure covering the hinge structure, such that the antenna module is spaced apart from other electronic components of the electronic device, thereby improving antenna radiation performance.

[0015] In addition, the electronic device can have the antenna module disposed in a predetermined space of a structure covering its hinge structure, such that a space for a battery is secured to be large, thereby improving battery accommodation capacity.

[0016] In addition, even if the electronic device is held laterally, the antenna module can be disposed outside a holding region, thereby reducing degradation of antenna radiation performance due to holding of the electronic device.

[0017] In addition, the antenna module can be disposed adjacent to a hinge structure including a metal material of the electronic device, so that heat dissipation performance can be improved by facilitating heat diffusion along the hinge structure, and the improved heat dissipation performance can increase the time of maintaining transmission / reception of mmWave signals.

[0018] Various other advantageous effects can be provided by directly or indirectly reasoning from this document. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1a A perspective view of an electronic device according to an embodiment is shown in an unfolded state.

[0020] Figure 1b A perspective view of an electronic device according to an embodiment is shown in a folded state.

[0021] Figure 2 A first housing and an antenna of an electronic device according to an embodiment are shown.

[0022] Figure 3 A first cover covering a hinge structure is shown removed from an electronic device according to an embodiment. Figure 2

[0023] Figure 4 A receiving recess provided with an antenna module in an electronic device according to an embodiment is shown.

[0024] Figure 5 is an exploded perspective view of a first antenna module and a fixing portion fixing the first antenna module to the receiving recess.

[0025] Figure 6 A form of coupling the antenna module-related components shown in Figure 5

[0026] Figure 7a is a side perspective view of an electronic device 100 including an electrical connection member according to an embodiment.

[0027] Figure 7b is a side perspective view of an electronic device including a first FRC according to an embodiment.

[0028] Figure 8 is a side perspective view of an electronic device including a hinge driver portion according to an embodiment.

[0029] Figure 9 Antenna heat dissipation performance when an antenna module is disposed in a hinge structure according to an embodiment is shown.

[0030] Figure 10 A state in which an electronic device is held laterally according to an embodiment is shown.​​

[0031] Figure 11 A block diagram of an electronic device in a network environment according to an embodiment is illustrated.

[0032] Figure 12 A block diagram of an electronic device in a network environment including a plurality of cellular networks according to an embodiment is illustrated.

[0033] With regard to the description of the drawings, the same or similar components can be marked by the same or similar reference numerals. DETAILED DESCRIPTION

[0034] Hereinafter, various embodiments of the disclosure will be described with reference to the accompanying drawings. As such, those having ordinary skill in the art will recognize that modifications, equivalents, and / or alternatives to various embodiments described herein can be made without departing from the scope and spirit of the disclosure.

[0035] Figure 1a A perspective view of the electronic device 100 in an unfolded state according to an embodiment is illustrated. Figure 1b A perspective view of the electronic device 100 in a folded state according to an embodiment is illustrated.

[0036] Referring to Figure 1a and Figure 1b The electronic device 100 according to various embodiments can include a first housing 110, a second housing 120, and a hinge area 130.

[0037] According to an embodiment, the second housing 120 can be coupled to the first housing 110 by a hinge structure (not shown) that defines at least a portion of the hinge area 130 to be rotatable about a first axis (x-axis) facing in a first direction (e.g., +x-axis direction). In an example, a structure is illustrated in which the first housing 110 and the second housing 120 can be folded with respect to the +x-axis direction or the -x-axis direction (or "landscape direction"), but the disclosure is not limited thereto. According to another embodiment, the first housing 110 and the second housing 120 can be folded with respect to the +y-axis direction or the -y-axis direction (or "portrait direction").

[0038] According to an embodiment, the hinge area 130 can be an area of the first housing 110 connected to the hinge structure (not shown). For example, the hinge area 130 can correspond to an area of the first housing 110 connected to the hinge structure (not shown) and located adjacent to the hinge structure (not shown).

[0039] According to an embodiment, a rear surface of the first housing 110 (e.g., a surface of the first housing 110 in the +z-axis direction) can be covered by the first cover 111, and a rear surface of the second housing 120 can be covered by the second cover 121. In an example, the first cover 111 and the second cover 121 can be made of a non-conductive material. As another example, the first cover 111 and / or the second cover 121 can be made of a conductive material, and at least a portion thereof can include a non-conductive material. For example, at least a portion of an area corresponding to the first antenna module 210 of the first cover 111 and / or the second cover 121 can be made of a non-conductive material.

[0040] According to an embodiment, at least a portion of the first housing 110 can have a first structure 131 covering the hinge area 130. For example, the hinge area 130 can be disposed at at least a portion of the first housing 110, and the first structure 131 can be formed to cover the hinge area 130.

[0041] Figure 2 A first housing 110 and an antenna of an electronic device 100 according to an embodiment are illustrated.

[0042] Referring to Figure 2 The first antenna module 210, the second antenna module 220, the electrical connection member 230, the first FPCB radio frequency (RF) cable (FRC) 240, the second FRC 250, and a printed circuit board (not shown) can be disposed in a space defined by the first housing 110.

[0043] In an embodiment, the first antenna module 210 and / or the second antenna module 220 can be an array antenna in a patch form. For example, the first antenna module 210 can be an array antenna having fourth conductive patches. In another embodiment, the first antenna module 210 and / or the second antenna module 220 can be an array antenna in a dipole form. For example, the first antenna module 210 can be an array antenna in a patch form, and the second antenna module 220 can be an array antenna in a dipole form. The first antenna module 210 can be an array antenna in a dipole form, and the second antenna module 220 can be an array antenna in a patch form.

[0044] According to an embodiment, the printed circuit board disposed in the first housing 110 can be electrically connected to a printed circuit board (not shown) disposed in the second housing 120 through the electrical connection member 230. In an example, the electrical connection member 230 can electrically connect the printed circuit board disposed in the first housing 110 to cross at least one area of the first housing 110, the hinge area 130, and / or at least one area of the second housing 120 and the printed circuit board disposed in the second housing 120. In another example, the electrical connection member 230 can be made of a material having a flexible property, and the electronic device 100 can be rotated from a folded state to an unfolded state, or at least one area of the electronic device 100 can be bent in an operation in which the electronic device 100 is rotated from an unfolded state to a folded state. For example, the electrical connection member 230 can be at least one of a signal wiring, a coaxial cable, and an FPCB, but the present disclosure is not limited thereto.

[0045] According to an embodiment, the hole 260 can be formed in one area of the first housing 110. In an example, the electrical connection member 230 can be connected to one area of the second housing 120 through the hole 260 disposed in one area of the first housing 110. In another example, the first FRC 240 can be inserted into the rear surface of the first antenna module 210 through the hole 260, and can be seated in one area of the first housing 110.

[0046] In an embodiment, the first FPCB RF cable (FRC) 240 and the second FRC 250 can have a structure similar to that of the electrical connection member 230, but can be understood as an FPCB for transmitting and receiving a high frequency (e.g., a millimeter wave) signal. For example, the first antenna module 210 can transmit a millimeter wave signal to an external device through the first FRC 240, or can receive a millimeter wave signal transmitted by an external device through the first FRC 240.

[0047] Figure 3 A state in which the first cover 111 is removed from the electronic device 100 of the embodiment of FIG. 1 is illustrated. Figure 2 A state in which the first cover 111 is removed from the electronic device 100 of the embodiment of FIG. 1 is illustrated.

[0048] Referring to FIG. 2, Figure 3 The first antenna module 210 can be disposed such that the patch faces in a first direction (e.g., a direction of a rear surface of the electronic device or a +z-axis direction), and the second antenna module 220 can be disposed perpendicular to the first antenna module 210. In an embodiment, the position of the second antenna module 220 can be variously changed, and the second antenna module 220 can be disposed to face in the same or opposite direction as the first antenna module 210. The electronic device 100 can further include an additional antenna module disposed perpendicular to both the first antenna module 210 and the second antenna module 220.

[0049] According to an embodiment, the antenna radiation of the first antenna module 210 can be performed in a third direction (e.g., +z-axis direction) perpendicular to a first direction (e.g., +x-axis direction) facing a first axis (x-axis) about which the first housing 110 and the second housing 120 are rotatable and a second direction (e.g., +y-axis direction) facing a second axis (y-axis) defined by the first antenna module 210 and the hinge area 130 while being perpendicular to the first direction. For example, the first antenna module 210 can perform antenna radiation in a direction in which a rear surface of the electronic device 100 faces.

[0050] According to an embodiment, the second antenna module 220 can perform antenna radiation in the first direction (e.g., +x-axis direction) or the second direction (e.g., +y-axis direction). In an embodiment, the second antenna module 220 can be disposed at at least a portion of the first housing 110 in parallel with the first axis to perform antenna radiation in the second direction perpendicular to the first direction. In an embodiment, the second antenna module 220 can be disposed at at least a portion of the first housing 110 in parallel with the second axis perpendicular to the first axis to perform antenna radiation in the first direction perpendicular to the second direction.

[0051] According to an embodiment, the first antenna module 210 and / or the second antenna module 220 can transmit and receive high frequency (e.g., millimeter wave) signals. For example, the first antenna module 210 and / or the second antenna module 220 can transmit and receive signals in a frequency band of 24.25 GHz and / or 40 GHz.

[0052] In an embodiment, any one of the first antenna module 210 or the second antenna module 220 can not be disposed in the first housing 110. For example, only the first antenna module 210 can be disposed in the first housing 110.

[0053] Figure 4 A receiving recess 410 in which the first antenna module 210 is disposed in the electronic device 100 according to an embodiment is illustrated.

[0054] According to an embodiment, the receiving recess 410 can be disposed in at least a partial area of the hinge area 130 of the first housing 110. For example, a hinge structure (not shown) can be disposed in the hinge area 130, and at least a portion of the receiving recess 410 can be disposed in an area of the hinge structure. A hole can be disposed in a partial area of the receiving recess 410.

[0055] The first antenna module 210 can be disposed in at least a partial area of the first housing 110 included without the hinge area 130 connecting the first housing 110 and the second housing 120. According to an embodiment, the first antenna module 210 can be disposed in a region 401 having a first width with respect to a first axis (x-axis) in a second direction (e.g., +y-axis direction or -y-axis direction) perpendicular to a first direction (e.g., +x-axis direction or -x-axis direction).

[0056] According to another embodiment, the first antenna module 210 can also be disposed in the second housing 120. In an embodiment, the first antenna module 210 can be disposed in a region included in the second housing 120 without a hinge structure (not shown).

[0057] Figure 5 is an exploded perspective view of the first antenna module 210 and a fixing portion fixing the first antenna module to the accommodation recess 410.

[0058] Referring to Figure 5 The first antenna module 210 can be fixed to the accommodation recess 410 disposed in the first structure 131 covering the hinge structure (not shown).

[0059] In an embodiment, the first antenna module 210 can be fixed to the accommodation recess 410 disposed in the first structure 131 with a fixing cap 510, a first adhesive 520 fixing the fixing cap 510, and a second adhesive 530 on a surface of the first antenna module 210 different from a surface on which the first adhesive 520 of the first antenna module is disposed. For example, the second adhesive 530 can be disposed at a portion contacting the accommodation recess, the first adhesive 520 can be disposed on a surface of the first antenna module 210 opposite to a surface of the first antenna module 210 contacting the second adhesive 530, and the fixing cap 510 can be coupled to the first antenna module 210 by the first adhesive 520, whereby the first antenna module 210 can be accommodated in the accommodation recess 410 when fixed to the accommodation recess 410. In another embodiment, the first antenna module 210 can be fixed to the accommodation recess 410 disposed in the first structure 131 with a fixing member (not shown) (e.g., a screw or a coupling boss).

[0060] In an embodiment, the first antenna module 210 accommodated in the accommodation recess 410 can be electrically connected to a wireless communication circuit (e.g., a communication processor (CP)) and / or a transceiver through the first FRC 240 electrically connected thereto.

[0061] In an embodiment, the accommodation recess 410 in which the first antenna module 210 is accommodated can be made of a metal material. In an example, because the accommodation recess 410 in which the first antenna module 210 is accommodated is made of a metal material, the first antenna module 210 can be electrically connected to the grounding area through the accommodation recess 410.

[0062] In an embodiment, at least a portion of the first antenna module 210 is accommodated in the accommodation recess 410 made of a conductive (e.g., metal) material, and can be electrically connected to the grounding area through the accommodation recess 410. The first antenna module 210 can perform antenna radiation when at least a portion of the rear surface of the electronic device 100 (one surface of the electronic device 100 in the +z-axis direction) is considered a grounding area. In an embodiment, the first antenna module 210 can perform antenna radiation when an area including at least a portion of the first housing 110, the second housing 120, and the hinge area 130 electrically connected to the first housing 110 and the second housing 120 is considered a conductive area. Figure 1a

[0063] In an embodiment, at least a portion of the accommodation recess provided in the first housing 110 can include a metal member or a heat transfer member, and heat generated by the first antenna module 210 seated in the accommodation recess 410 can be transferred to another area of the first housing 110.

[0064] In an embodiment, a heat dissipation structure (not shown) can be included in the inside of the electronic device 100. For example, the heat dissipation structure included in the inside of the electronic device 100 can correspond to at least one of a graphite bracket or a metal bracket.

[0065] Figure 6 is in the form of an antenna module-related assembly shown in Figure 5

[0066] Referring to Figure 6 The first antenna module 210 can be fixed to the accommodation recess 410 with the following items to be electrically connected to the first FRC 240 when accommodated in the accommodation recess 410: a fixing cap 510, a first adhesive 520 fixing the fixing cap 510, and a second adhesive 530 on a surface of the first antenna module 210 different from the surface on which the first adhesive 520 of the first antenna module is located.

[0067] According to an embodiment, the first antenna module 210 accommodated in the accommodation recess 410 can be electrically connected to the first FRC 240 to transmit and receive high frequency (e.g., millimeter wave) signals. For example, the first antenna module 210 can be electrically connected to the first FRC 240 to transmit and receive signals in a frequency band of 24.25 GHz and / or 40 GHz. ​​

[0068] Figure 7a This is a side perspective view of an electronic device 100 including an electrical connection member 230 according to an embodiment. Figure 7b This is a side perspective view of an electronic device 100 including a first FRC 240 according to an embodiment. Figure 7a It shows when from Figure 3 When observing the cross-section of A-A', the side surface of the electronic device 100, Figure 7b It shows when from Figure 3 The side surface of the electronic device 100 is observed when the cross section of B-B' is viewed.

[0069] Reference Figure 7a and Figure 7b The first housing 110 may be covered by the first cover 111, and the first structure 131 covering the hinge region 130 may be included in at least a portion of the first housing 110.

[0070] According to an embodiment, the first antenna module 210 may be disposed in the first structure 131. For example, the first antenna module 210 may be disposed and fixed to the first structure 131 by means of a fixing cap 510 and a second adhesive 530.

[0071] Reference Figure 7a An electrical connection member 230, which is connected to a printed circuit board included in the first housing 110, can be inserted into the lower part of the first structure 131 to be connected to a printed circuit board included in the second housing 120 via a hinge region 130.

[0072] According to an embodiment, a support member (not shown) for supporting a battery (not shown) may be disposed in a region 710 of the first housing 110 adjacent to the battery (not shown). In an example, the support member (not shown) disposed in region 710 of the first housing 110 may be a metal bracket.

[0073] According to an embodiment, a receiving groove 410 and / or a hole 260 are disposed in a first structure 131 covering at least a portion of the hinge region 130 of the first housing 110, and a heat dissipation structure (not shown) may be disposed in the region of the receiving groove 410 and / or the hole 260 in which the first antenna module 210 is seated. The heat dissipation structure (not shown) may be configured to partially surround or expose the hole region 260. For example, the region of the receiving groove 410 may be made of a metallic material, and this metallic material may be exposed to the hole 260. Because the heat dissipation structure (not shown) is configured to partially surround or expose the hole region 260, thermal emission of the first antenna module 210 can be improved. The heat dissipation structure may be integrally formed with the first structure 131 or may be formed by a separate component.

[0074] Reference Figure 7bA first FRC 240 connected to a printed circuit board included in the first housing 110 can be inserted between the first structure 131 and the first antenna module 210 to be electrically connected to the first antenna module 210.

[0075] According to an embodiment, the flexible display 112 disposed above the first housing 110 and the second housing 120 can be disposed on a front surface of the electronic device 100. In an example, the flexible display 112 can occupy a large portion of the front surface of the electronic device 100.

[0076] According to an embodiment, the hinge area 130 can refer to an area connecting the first housing 110 and the second housing 120 such that the first housing 110 and the second housing 120 can be folded to face each other and then unfolded.

[0077] Figure 8 is a side perspective view of the electronic device 100 including a hinge cover 132 according to an embodiment.

[0078] Referring to Figure 8 , the hinge area 130 between the first housing 110 and the second housing 120 can include the hinge cover 132.

[0079] According to an embodiment, the hinge cover 132 can be configured to cover a hinge driver (not shown). In an example, the hinge driver (not shown) can include a hinge housing, a rotating shaft, a fixed bracket, a plurality of gears, a cam, and / or a friction plate.

[0080] According to an embodiment, the first housing 110 and the second housing 120 can be rotated by the hinge driver (not shown).

[0081] According to an embodiment, the electrical connection member 230 can be inserted into a lower portion of the first structure 131 and extended to the second housing 120 via an upper portion of the hinge driver (not shown), and can electrically connect the first housing 110 and the second housing 120.

[0082] As Figure 8 indicated, since the first antenna module 210 is disposed at at least a portion of the first structure 131 covering the hinge area 130 of the electronic device 100, a space for disposing the first antenna module 210 can be secured.

[0083] Figure 9 shows heat dissipation performance of an antenna when the first antenna module 210 is disposed in the first structure 131 covering the hinge area 130 according to an embodiment. Figure 9 shows a view of a temperature around an application processor (AP) disposed on a front surface of the first housing 110 when the first antenna module 210 is disposed in a hinge structure and disposed in a PCB of the first housing 110 as (a) shows, andFigure 9 FIG. 2B illustrates a view of a temperature around the first antenna module 210 when the first antenna module 210 is disposed in the first housing 110, according to an embodiment of the present disclosure.

[0084] Referring to Figure 9 Compared to the heat dissipation performance of the antenna when the first antenna module 210 is disposed in the printed circuit board (PCB) of the first housing 110, it is possible to improve the heat dissipation performance of the antenna when the first antenna module 210 is disposed in the first structure 131 covering the hinge area 130.

[0085] According to an embodiment, when the first antenna module 210 is disposed in the first structure 131, it is possible to improve the heat dissipation performance because the heat dissipation is reduced compared to the case where the first antenna module 210 is disposed in the printed circuit board (PCB) of the first housing 110. In an embodiment, when the first antenna module 210 is disposed in the first structure 131, the temperature around the application processor (AP) of the electronic device 100 can be 55.6 degrees, whereas when the first antenna module 210 is disposed in the printed circuit board (PCB) of the first housing 110, the temperature around the AP of the electronic device 100 can be 51.8 degrees. In another example, when the first antenna module 210 is disposed in the first structure 131, the temperature around the first antenna module 210 can be 51.8 degrees, whereas when the first antenna module 210 is disposed in the printed circuit board (PCB) of the first housing 110, the temperature around the first antenna module 210 can be 56.1 degrees.

[0086] As Figure 9 illustrated, because the first antenna module 210 is disposed at at least a portion of the first structure 131 covering the hinge area 130 of the electronic device 100, it is possible to improve the heat emission phenomenon due to the patch antenna.

[0087] Figure 10 FIG. 2C illustrates a state in which the electronic device 100 is held laterally, according to an embodiment.

[0088] Referring to Figure 10 When the electronic device 100 is held laterally, the held portion 1010 of the first housing 110 and the held portion 1020 of the second housing 120 can not overlap with the area in which the first antenna module 210 and the second antenna module 220 are located.

[0089] According to an embodiment, the held portion 1010 of the first housing 110 can be located at at least a portion of the first cover 111 covering the first housing 110, and the held portion 1020 of the second housing 120 can be located at at least a portion of the second cover 121 covering the second housing 120.

[0090] In an embodiment, because the held portion 1010 of the first housing 110 does not overlap with an area in which the first antenna module 210 and / or the second antenna module 220 are located, degradation of the radiation performance of the first antenna module 210 and / or the second antenna module 220 due to holding can be reduced. For example, a user uses the electronic device 100 laterally, and degradation of the antenna radiation performance of the first antenna module 210 can be reduced by disposing the first antenna module 210 around the hinge area 130, which is a portion that is not held by the user.

[0091] Figure 11 FIG. 1C is a block diagram of an electronic device 101 in a network environment 1000 according to various embodiments of the disclosure.

[0092] Referring to FIG. 1C, Figure 11 The electronic device 101 (for example, the electronic device 100 of FIG. 1A or 1B) in the network environment 1000 can communicate with an electronic device 104 or a server 108 via a first network 198 (for example, a short-range wireless communication network), or a second network 199 (for example, a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 can include a processor 820, memory 830, an input module 850, a display module 860, an audio module 870, a communication module 890, a power management module 898, or an interface 899. In some embodiments, at least one of the above-described elements can be omitted from the electronic device 101, or one or more other elements can be added in the electronic device 101. In some embodiments, the electronic device 101 can include a plurality of processors. In some embodiments, the electronic device 101 can include at least one of a user identification module (SIM) 896 or an antenna module 897. In some embodiments, some (for example, the display module 860) of the above-described elements can be implemented as a single integrated component (for example, the display module 860).

[0093] The processor 1120 can execute, for example, software (e.g., a program 1140) to control at least one other component (e.g., a hardware or software component) of the electronic device 1101 coupled with the processor 1120 and can perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 1120 can store a command or data received from another component (e.g., the sensor module 1176 or the communication module 1190) in the volatile memory 1132, process the command or data stored in the volatile memory 1132, and store processed data in the non-volatile memory 1134. According to an embodiment, the processor 1120 can include a main processor 1121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 1123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 1121. For example, when the electronic device 1101 includes the main processor 1121 and the auxiliary processor 1123, the auxiliary processor 1123 can be adapted to consume less power than the main processor 1121 or to be specialized in a specific function. The auxiliary processor 1123 can be implemented as separate from or as part of the main processor 1121.

[0094] The auxiliary processor 1123, rather than the main processor 1121, can control at least some of the functions or states related to at least one component (e.g., the display module 1160, the sensor module 1176, or the communication module 1190) among the components of the electronic device 1101, while the main processor 1121 is in an inactive (e.g., sleep) state, or together with the main processor 1121, control at least some of the functions or states related to at least one component (e.g., the display module 1160, the sensor module 1176, or the communication module 1190) among the components of the electronic device 1101, while the main processor 1121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 1123 (e.g., an image signal processor or a communication processor) can be implemented as a part of another component functionally related to the auxiliary processor 1123 (e.g., the camera module 1180 or the communication module 1190). According to an embodiment, the auxiliary processor 1123 (e.g., a neural processing unit) can include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model can be generated through machine learning. For example, such learning can be performed by the electronic device 1101 where the artificial intelligence is executed, or via a separate server (e.g., the server 1108). The learning algorithm can include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple artificial neural network layers. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model can include a software structure other than the hardware structure.

[0095] The memory 1130 can store various data used by at least one component (e.g., the processor 1120 or the sensor module 1176) of the electronic device 1101, for example. The various data can include, for example, software (e.g., the program 1140) and input data or output data for commands related thereto. The memory 1130 can include the volatile memory 1132 or the non-volatile memory 1134.

[0096] The program 1140 can be stored in the memory 1130 as software, and can include, for example, the operating system (OS) 1142, the middleware 1144, or the applications 1146.

[0097] The input module 1150 can receive a command or data to be used by other component (e.g., the processor 1120) of the electronic device 1101, from the outside (e.g., a user) of the electronic device 1101. The input module 1150 can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0098] The sound output module 1155 can output sound signals to the outside of the electronic device 1101. The sound output module 1155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing record. The receiver can be used for receiving an incoming call. According to an embodiment, the receiver can be implemented as separate from the speaker, or implemented as a part of the speaker.

[0099] The display module 1160 can visually provide information to the outside (e.g., a user) of the electronic device 1101. The display module 1160 can include, for example, a display, a hologram device, or a projection device, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projection device. According to an embodiment, the display module 1160 can include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.

[0100] The audio module 1170 can convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 1170 can obtain the sound via the input module 1150, or output the sound via the sound output module 1155 or a headphone of an external electronic device (e.g., an electronic device 1102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 1101.

[0101] The sensor module 1176 can detect an operational state (e.g., power or temperature) of the electronic device 1101 or an environmental state (e.g., a state of a user) external to the electronic device 1101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 1176 can include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0102] The interface 1177 can support one or more specified protocols to be used for the electronic device 1101 to be coupled with the external electronic device (e.g., the electronic device 1102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 1177 can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0103] The connection terminal 1178 can include a connector via which the electronic device 1101 can be physically connected with the external electronic device (e.g., the electronic device 1102). According to an embodiment, the connection terminal 1178 can include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0104] The haptic module 1179 can convert electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or an electrical stimulus that can be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 1179 can include, for example, a motor, a piezoelectric element, or an electrical stimuluser.

[0105] The camera module 1180 can capture still images or moving images. According to an embodiment, the camera module 1180 can include one or more lenses, image sensors, image signal processors, or flashes.

[0106] The power management module 1188 can manage power supplied to the electronic device 1101. According to an embodiment, the power management module 1188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0107] The battery 1189 can supply power to at least one component of the electronic device 1101. According to an embodiment, the battery 1189 can include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0108] The communication module 1190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1101 and an external electronic device (e.g., the electronic device 1102, the electronic device 1104, or the server 1108) and performing communication between the electronic devices 1101 and the external electronic device via the established communication channel. The communication module 1190 can include one or more communication processors that are operable independently from the processor 1120 (e.g., an application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 1190 can include a wireless communication module 1192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with the external electronic device via the first network 1198 (e.g., a short-range communication network, such as Bluetooth, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 1199 (e.g., a long-range communication network, such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)). These various types of communication modules can be implemented as a single component (e.g., a single chip) or can be implemented as multiple components (e.g., multiple chips) separate from each other. The wireless communication module 1192 can identify and authenticate the electronic device 1101 in a communication network, such as the first network 1198 or the second network 1199, using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module 1196.

[0109] The wireless communication module 1192 can support 5G networks and next-generation communication technologies (e.g., new radio (NR) access technology) after 4G networks. The NR access technology can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 1192 can support a high frequency band (e.g., a millimeter wave band) to achieve, for example, a high data transmission rate. The wireless communication module 1192 can support various technologies for securing performance on a high frequency band, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 1192 can support various requirements designated in the electronic device 1101, an external electronic device (e.g., an electronic device 1104), or a network system (e.g., the second network 1199). According to an embodiment, the wireless communication module 1192 can support a peak data rate of eMBB (e.g., 20 Gbps or more) for implementation, a loss coverage (e.g., 164 dB or less) for implementation of mMTC, or a U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less for round trip) for implementation of URLLC.

[0110] The antenna module 1197 can transmit or receive a signal or power to or from the outside (e.g., an external electronic device) of the electronic device 1101. According to an embodiment, the antenna module 1197 can include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a base (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 1197 can include a plurality of antennas (e.g., array antennas). In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 1198 or the second network 1199, can be selected from the plurality of antennas by, for example, the communication module 1190 (e.g., the wireless communication module 1192). Then, a signal or power can be transmitted or received between the communication module 1190 and an external electronic device via the selected at least one antenna. According to an embodiment, in addition to the radiating element, another component (e.g., a radio frequency integrated circuit (RFIC)) can be additionally formed as part of the antenna module 1197.

[0111] According to various embodiments, the antenna module 1197 can form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module can include a printed circuit board, a radio frequency integrated circuit (RFIC) disposed on a first surface (e.g., a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., a millimeter wave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving a signal of the designated high frequency band.

[0112] At least some of the above-described components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicate signals (e.g., commands or data) between them.

[0113] According to an embodiment, commands or data can be transmitted or received between the electronic device 1101 and the external electronic device 1104 via the server 1108 connected with the second network 1199. Each of the electronic devices 1102 and 1104 can be the same type as or different from the electronic device 1101. According to an embodiment, all or some of the operations to be executed at the electronic device 1101 can be executed at one or more of the external electronic devices 1102, 1104, or server 1108. For example, if the electronic device 1101 is to automatically perform a function or a service or is to perform a function or a service in response to a request from a user or another device, the electronic device 1101, instead of, or in addition to, executing the function or the service, can request the one or more external electronic devices to execute at least a part of the function or the service. The one or more external electronic devices receiving the request can execute at least the part of the function or the service requested, or execute an additional function or an additional service related to the request, and transfer an execution result to the electronic device 1101. The electronic device 1101 can provide the execution result, with or without further processing of the execution result, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used, for example. The electronic device 1101 can use, for example, distributed computing or mobile edge computing to provide an ultra-low latency service. In another embodiment, the external electronic devices 1104 can include an Internet of Things (IoT) device. The server 1108 can be an intelligent server using machine learning and / or a neural network. According to an embodiment, the external electronic device 1104 or the server 1108 can be included in the second network 1199. The electronic device 1101 can be applied to intelligent services (e.g., smart home, smart city, smart car, or health care), based on 5G communication technology or IoT-related technology.

[0114] Figure 12 is a block diagram of an electronic device 1101 in a network environment 1200 including a plurality of cellular networks according to an embodiment.

[0115] Referring to Figure 12 , the electronic device 1101 (e.g., Figure 1a and Figure 1bThe electronic device 100) can include a first communication processor 1212, a second communication processor 1214, a first radio frequency integrated circuit (RFIC) 1222, a second RFIC 1224, a third RFIC 1226, a fourth RFIC 1228, a first radio frequency front end (RFFE) 1232, a second RFFE 1234, a first antenna module 1242, a second antenna module 1244, and an antenna 1248. The electronic device 1101 can further include a processor 1120 and a memory 1130. The second network 1199 can include a first cellular network 1292 and a second cellular network 1294. According to another embodiment, the electronic device 1101 can further include at least one component shown in FIGS. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, and 12, and the second network 1199 can further include at least one other network. According to an embodiment, the first communication processor 1212, the second communication processor 1214, the first RFIC 1222, the second RFIC 1224, the fourth RFIC 1228, the first RFFE 1232, and the second RFFE 1234 can constitute at least a part of a wireless communication module 1192. According to another embodiment, the fourth RFIC 1228 can be omitted or can be included at a part of the third RFIC 1226. Figure 1a and Figure 1b According to an embodiment, the first communication processor 1212, the second communication processor 1214, the first RFIC 1222, the second RFIC 1224, the fourth RFIC 1228, the first RFFE 1232, and the second RFFE 1234 can constitute at least a part of a wireless communication module 1192. According to another embodiment, the fourth RFIC 1228 can be omitted or can be included at a part of the third RFIC 1226.

[0116] The first communication processor 1212 can establish a communication channel of a frequency band to be used for wireless communication with the first cellular network 1292, and can support legacy network communication through the established communication channel. According to an embodiment, the first cellular network can be a legacy network including 2nd generation (2G), 3G, 4G, or long term evolution (LTE). The second communication processor 1214 can establish a communication channel corresponding to a designated frequency band (e.g., about 6 GHz to about 60 GHz) among frequency bands to be used for wireless communication with the second cellular network 1294, and can support 5G network communication through the established communication channel. According to an embodiment, the second cellular network 1294 can be a 5G network defined by 3GPP. In addition, according to an embodiment, the first communication processor 1212 or the second communication processor 1214 can establish a communication channel corresponding to another designated frequency band (e.g., about 6 GHz or less) among frequency bands to be used for wireless communication with the second cellular network 1294, and can support 5G network communication through the established communication channel. According to an embodiment, the first communication processor 1212 and the second communication processor 1214 can be implemented in a single chip or a single package. According to an embodiment, the first communication processor 1212 or the second communication processor 1214 can be disposed together with the processor 1120, the auxiliary processor 1123, or the communication module 1190 in a single chip or a single package.

[0117] According to an embodiment, the first communication processor 1212 and the second communication processor 1214 can be directly or indirectly connected to each other through an interface (not shown), and can provide or receive data or control signals in any one direction or in opposite directions.

[0118] During transmission of a signal, the first RFIC 1222 can convert a baseband signal generated by the first communication processor 1212 into a radio frequency signal of about 700 MHz to about 3 GHz for the first cellular network 1292 (e.g., a legacy network). During reception of a signal, an RF signal can be acquired from the first cellular network 1292 (e.g., a legacy network) through an antenna (e.g., the first antenna module 1242), and the acquired RF signal can be pre-processed through an RFFE (e.g., the first RFFE 1232). The first RFIC 1222 can convert the pre-processed RF signal into a baseband signal so that the pre-processed RF signal is processed by the first communication processor 1212.

[0119] During transmission of a signal, the second RFIC 1224 can convert a baseband signal generated by the first communication processor 1212 or the second communication processor 1214 into an RF signal (hereinafter, a 5G Sub6 RF signal) of a Sub6 band (e.g., about 6 GHz or less) for the second cellular network 1294 (e.g., a 5G network). During reception of a signal, a 5G Sub6 RF signal can be acquired from the second cellular network 1294 (e.g., a 5G network) through an antenna (e.g., the second antenna module 1244), and the acquired RF signal can be pre-processed through an RFFE (e.g., the second RFFE 1234). The second RFIC 1224 can convert the processed 5G Sub6 RF signal into a baseband signal so that the 5G Sub6 RF signal is processed by a corresponding one of the first communication processor 1212 or the second communication processor 1214.

[0120] The third RFIC 1226 can convert the baseband signal generated by the second communication processor 1214 into an RF signal of a 5G Above 6 frequency band (e.g., about 6 GHz to about 60 GHz) to be used for the second cellular network 1294 (e.g., a 5G network) (hereinafter, a 5G Above 6 RF signal). During reception of a signal, the 5G Sub 6 RF signal can be acquired from the second cellular network 1294 (e.g., a 5G network) through an antenna (e.g., the antenna 1248) and can be pre-processed by the third RFFE 1236. The third RFIC 1226 can convert the pre-processed 5G Above 6 RF signal into a baseband signal so that the pre-processed 5G Above 6 RF signal is processed by the second communication processor 1214. According to another embodiment, the third RFIC 1226 can be included at a portion of the third RFIC 1226.

[0121] According to an embodiment, the electronic device 1101 can include a fourth RFIC 1228 independent of the third RFIC 1226 or as at least a portion of the third RFIC 1226. In this case, the fourth RFIC 1228 can convert a baseband signal generated by the second communication processor 1214 into an RF signal of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) (hereinafter, an IF signal) and then can deliver the IF signal to the third RFIC 1226. The third RFIC 1226 can convert the IF signal into a 5G Above 6 RF signal. The 5G Above 6 RF signal can be received from the second cellular network 1294 (e.g., a 5G network) through an antenna (e.g., the antenna 1248) and can be converted into an IF signal by the third RFIC 1226. The fourth RFIC 1228 can convert the IF signal into a baseband signal so that the IF signal is processed by the second communication processor 1214.

[0122] According to an embodiment, the first RFIC 1222 and the second RFIC 1224 can be implemented as at least a portion of a single chip or a single package. According to an embodiment, the first RFFE 1232 and the second RFFE 1234 can be implemented as at least a portion of a single chip or a single package. According to an embodiment, at least one of the first antenna module 1242 or the second antenna module 1244 can be omitted or coupled to the other antenna module to process RF signals of a plurality of corresponding frequency bands.

[0123] According to an embodiment, the third RFIC 1226 and the antenna 1248 can be disposed in the same sub-straight to constitute a third antenna module 1246. For example, the wireless communication module 1192 or the processor 1120 can be disposed in a first sub-straight (e.g., a main PCB). The third RFIC 1226 can be disposed in a partial area (e.g., a lower surface) of a second sub-straight (e.g., a sub-PCB) that is separate from the first sub-straight, and the antenna 1248 can be disposed in another partial area (e.g., an upper surface) to constitute the third antenna module 1246. It is possible to reduce the length of a transmission line between the third RFIC 1226 and the antenna 1248 by arranging the third RFIC 1226 and the antenna 1248 in the same sub-straight. For example, this can reduce the loss of a signal of a high frequency band (e.g., about 6 GHz to about 60 GHz) for 5G network communication due to the transmission line. Accordingly, the electronic device 1101 can improve the quality or speed of communication with the second cellular network 1294 (e.g., a 5G network).

[0124] According to an embodiment, the antenna 1248 can be constituted of an antenna array including a plurality of antenna elements that can be used for beamforming. For example, the third RFIC 1226 can be a part of the third RFFE 1236, and can include a plurality of phase shifters 1238 corresponding to the plurality of antenna elements. During transmission of a signal, the plurality of phase shifters 1238 can shift the phase of a 5G Above6 RF signal to be transmitted to the outside (e.g., a base station of a 5G network) of the electronic device 1101 through the corresponding antenna elements. During reception of a signal, the plurality of phase shifters 1238 can convert the phase of a 5G Above6 RF signal received from the outside through the corresponding antenna elements to the same or substantially the same phase. This performs transmission or reception of a signal through beamforming between the electronic device 1101 and the outside.

[0125] The second cellular network 1294 (e.g., a 5G network) can operate independently of the first cellular network 1292 (e.g., a legacy network) (e.g., standalone (SA)), or it can operate in conjunction with the first cellular network 1292 (e.g., a legacy network) (e.g., non-standalone (NSA)). For example, in a 5G network, only an access network (e.g., a 5G radio access network (RAN) or a next-generation (NG) RAN) may exist, and a core network (e.g., a next-generation core (NGC)) may not exist. The electronic device 1101 can access the access network of the 5G network and can access external networks (e.g., the Internet) under the control of the core network (e.g., the evolved packet core (EPC) of a legacy network). Protocol information used for communicating with traditional networks (e.g., LTE protocol information) or protocol information used for communicating with 5G networks (e.g., New Radio (NR) protocol information) can be stored in memory 1130 and accessed by another component (e.g., processor 1120, first communication processor 1212, or second communication processor 1214).

[0126] An electronic device 100 according to an embodiment may include: a first housing 110; and a second housing 120, the second housing 120 being connected to the first housing 110 via a hinge structure to oriented in a first direction (e.g., ...). Figure 1a The first axis (e.g., the +x axis direction) Figure 1a The +x axis is rotatable; a flexible display 112 defines the front surface of the electronic device 100 and is disposed above the first housing 110 and the second housing 120; an antenna module (e.g., Figure 2 The first antenna module 210); and at least one processor electrically connected to the flexible display 112 and the antenna module, the hinge structure being configured along a second direction (e.g., Figure 1a In a region having a first width relative to the first axis (in the +y axis direction), the second direction is perpendicular to the first direction, and the first housing has a first structure 131 covering the hinge structure within the first width, the first structure 131 may have an antenna module (e.g., Figure 2 The first antenna module 210) has a receiving recess 410, and at least one processor can be configured to use the antenna module (e.g., Figure 2 The first antenna module 210) is used to transmit and receive signals from a third party (e.g., Figure 1a The millimeter-wave signal corresponding to the +z axis direction, wherein the third direction is the same as the first direction (e.g., Figure 1a (x-axis direction) and second direction (e.g., Figure 1a The two axes (+y axis direction) are perpendicular.

[0127] The electronic device 100 according to an embodiment can further include a battery, the first housing 110 can have a second structure in which the battery is received, and an antenna module (e.g., the first antenna module 210 of FIG. Figure 2 ) can be disposed in a receiving recess 410 between the battery and the first axis.

[0128] According to an embodiment, the antenna module can be the first antenna module 210, and the electronic device can further include a second antenna module 220, which can be received in a third structure formed along a side surface of the first housing, and the at least one processor can be configured to transmit and receive millimeter wave signals corresponding to the first direction or the second direction by using the second antenna module 220.

[0129] According to an embodiment, the antenna module (e.g., the first antenna module 210 of FIG. Figure 2 ) can be an array antenna.

[0130] According to an embodiment, the receiving recess 410 can include a fixing portion, and the antenna module (e.g., the first antenna module 210 of FIG. Figure 2 ) can be received in the receiving recess by the fixing portion.

[0131] According to an embodiment, the fixing portion can include at least one of a fixing cap 510, a first adhesive 520 configured to fix the fixing cap 510, or a second adhesive 530 on a surface of the antenna module (e.g., the first antenna module 210 of FIG. Figure 2 ) different from a surface of the antenna module on which the first adhesive 520 configured to fix the fixing cap 510 is located.

[0132] According to an embodiment, the first axis can correspond to a shorter one of a landscape axis or a portrait axis of the electronic device.

[0133] According to an embodiment, the flexible display 112 can be formed such that a portion thereof is bent as the second housing is rotated with respect to the first housing about the first axis.

[0134] According to an embodiment, the receiving recess 410 in which the antenna module (e.g., the first antenna module 210 of FIG. Figure 2 ) is received can be made of a metal material.

[0135] The electronic device 100 according to an embodiment can further include a support member in an interior of the first housing 110, and the support member can be a heat dissipation structure.

[0136] According to an embodiment, the heat dissipation structure can be at least one of a graphite support or a metal support.

[0137] The electronic device 100 according to an embodiment may also include a printed circuit board (PCB).

[0138] The electronic device 100 according to an embodiment may also include a flexible printed circuit board (FPCB) or an FPCB RF cable (FRC) electrically connected to the PCB.

[0139] The electronic device 100 according to the embodiment may include a first cover 111 covering the rear surface of a first housing 110 and a second cover 121 covering the rear surface of a second housing 120, and the first cover 111 and the second cover 121 may be made of a non-conductive material.

[0140] According to an embodiment, the millimeter-wave signal is a signal with a frequency band of 24.25 GHz or 40 GHz.

[0141] An electronic device 100 according to an embodiment may include: a first housing 110; and a second housing 120, the second housing being connected to the first housing 110 via a hinge structure to allow orientation toward a first direction (e.g., ...). Figure 1a The first axis (e.g., the +x axis direction) Figure 1a The +x axis is rotatable; a first cover 111 covers the rear surface of the first housing; a second cover 121 covers the rear surface of the second housing; an antenna module; and at least one processor electrically connected to the antenna module (e.g., Figure 2 The first antenna module 210), the hinge structure can be set along the second direction (e.g., Figure 1a In a region having a first width relative to the first axis (the +y axis direction), the second direction is perpendicular to the first direction. The first housing may have a first structure covering the hinge structure within the first width. The first structure may have a receiving recess 410 in which an antenna module is received, and at least one processor may be configured to use the antenna module (e.g., Figure 2 The first antenna module 210) is used to transmit and receive signals from a third party (e.g., Figure 1a The millimeter-wave signal corresponding to the +z axis direction, wherein the third direction is the same as the first direction (e.g., Figure 1a (x-axis direction) and second direction (e.g., Figure 1a The two axes (+y axis direction) are perpendicular.

[0142] The electronic device 100 according to an embodiment may further include a battery, the first housing 110 may have a second structure in which the battery is housed, and an antenna module (e.g., Figure 2 The first antenna module 210 can be disposed in a receiving groove between the battery and the first shaft.

[0143] According to an embodiment, the antenna module can be the first antenna module 210, the electronic device can further include a second antenna module 220, and the second antenna module 220 can be accommodated in a third structure formed along a side surface of the first housing 110.

[0144] According to an embodiment, the antenna module (for example, Figure 2 of the first antenna module 210) can be an array antenna.

[0145] According to an embodiment, the accommodation recess 410 can include a fixing portion, and the antenna module (for example, Figure 2 of the first antenna module 210) can be accommodated in the accommodation recess 410 through the fixing portion.

[0146] The electronic device according to various embodiments can be one of various types of electronic devices. The electronic devices can include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0147] It should be understood that various embodiments of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to the ones described specifically herein but include various changes, equivalents, or replacements for the corresponding technical features. For the description of the drawings, like reference numerals can be used to refer to like or similar elements. It is to be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used herein, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include all possible combinations of the items listed in the corresponding one of the phrases. As used herein, the terms such as "1st" and "2nd," or "first" and "second" can be used to simply distinguish a corresponding component from another, and does not limit the components in other aspects (e.g., importance or order). It is to be understood that the terms such as "unit," "logic," "module," "circuit," "component," "element," "member," "block," "section," "part," "element," "device," "member," "port," "terminal," "connector," "or the like" used herein can be used interchangeably. It is to be understood that if an element (for example, a first element) is referred to as "including" or "comprising" another element (for example, a second element), the element can further include other elements (for example, a third element, a fourth element, or the like) unless otherwise specified or except when described as "only including" or "consisting of the other element. It is to be understood that if an element (for example, a first element) is referred to as "connected to" or "connected with" another element (for example, a second element), the element can be directly connected to the other element or connected to the other element via a third element.

[0148] As used in connection with various embodiments of the present disclosure, the term "module" can include a unit implemented in hardware, software, or firmware, and can interchangeably be used with other terms, for example, "logic", "logic block", "part", or "circuitry". A module can be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, a module can be implemented in a form of an application-specific integrated circuit (ASIC).

[0149] Various embodiments as set forth herein can be implemented as software (e.g., the program 1140) including one or more instructions that are stored in a storage medium (e.g., internal memory 1136 or external memory 1138) that are readable by a machine (e.g., electronic device 1101). For example, a processor (e.g., processor 1120) of the machine (e.g., electronic device 1101) can invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated for a function in accordance with the at least one instruction invoked by the processor. The one or more instructions can include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is tangible, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.

[0150] According to an embodiment, a method according to various embodiments of the present disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed online via an application store (e.g., PlayStore TM ). If the computer program product is distributed online, at least part of the computer program product can be temporarily stored in a server of the management company, an application store, or a relay server, etc. And, the computer program product distributed online can be momentarily stored in the memory of the seller or the receiver before being distributed.

[0151] According to various embodiments, each component (e.g., a module or a program) of the above-described components can include a single entity or multiple entities, and some of the multiple entities can be separately positioned in different components. According to various embodiments, one or more of the above-described components can be omitted, or one or more other components can be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) can be integrated into a single component. In such a case, according to various embodiments, the integrated component can still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component can be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations can be executed in a different order or omitted, or one or more other operations can be added.

Claims

1. An electronic device, the electronic device comprising: First shell; A second housing is connected to the first housing via a hinge structure so as to be rotatable about a first axis facing a first direction; A flexible display that defines the front surface of the electronic device and is disposed above the first housing and the second housing; Antenna module; as well as At least one processor, the at least one processor being electrically connected to the flexible display and the antenna module, The hinge structure is disposed in a region having a first width relative to the first axis along a second direction, wherein the second direction is perpendicular to the first direction. The first housing has a first structure that covers the hinge structure within the first width. The first structure has a receiving groove for accommodating the antenna module, and The at least one processor is configured to transmit and receive millimeter-wave signals corresponding to a third direction using the antenna module, the third direction being perpendicular to both the first direction and the second direction.

2. The electronic device according to claim 1, further comprising: Battery, The first housing has a second structure that accommodates the battery, and The antenna module is disposed in the receiving groove between the battery and the first shaft.

3. The electronic device according to claim 1, wherein, The antenna module is the first antenna module. The electronic device also includes a second antenna module. The second antenna module is housed within a third structure formed along the side surface of the first housing, and The at least one processor is further configured to transmit and receive millimeter-wave signals corresponding to the first direction or the second direction by using the second antenna module.

4. The electronic device according to claim 1, wherein, The antenna module is an array antenna.

5. The electronic device according to claim 1, wherein, The receiving groove includes a fixing part, and The antenna module is accommodated when it is fixed to the receiving groove by the fixing part.

6. The electronic device according to claim 5, wherein, The fixing part includes at least one of the following: a fixing cap, a first adhesive configured to fix the fixing cap, or a second adhesive located on a surface of the antenna module, the surface of which is different from the surface of the antenna module on which the first adhesive configured to fix the fixing cap is located.

7. The electronic device according to claim 1, wherein, The first axis corresponds to the shorter of the transverse or longitudinal axis of the electronic device.

8. The electronic device according to claim 1, wherein, The flexible display is configured such that a portion of it bends as the second housing rotates relative to the first housing about the first axis.

9. The electronic device according to claim 1, wherein, At least a portion of the receiving groove housing the antenna module is made of a conductive or metallic material.

10. The electronic device according to claim 1, further comprising: A support member is formed inside the first housing. The supporting component is a heat dissipation structure.

11. The electronic device according to claim 10, wherein, The heat dissipation structure is at least one of a graphite support or a metal support.

12. The electronic device according to claim 1, further comprising: Printed circuit board (PCB).

13. The electronic device of claim 12, further comprising: Electrically connected to the PCB by a flexible printed circuit board (FPCB) or an FPCB radio frequency (RF) cable (FRC).

14. The electronic device according to claim 1, further comprising: A first cover covers the rear surface of the first housing; as well as The second cover covers the rear surface of the second housing. The first cover and the second cover are made of non-metallic materials.

15. The electronic device according to claim 1, wherein, The millimeter-wave signal is a signal with a frequency band of 24.25 GHz or 40 GHz.

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