Chip dispensing jig, method, terminal device and computer readable storage medium

Abstract

The application discloses a kind of chip dispensing jigs, methods, terminal equipment and computer readable storage medium, the chip dispensing jig is applied to chip dispensing to generate lens, the chip dispensing jig includes: with the lens structure consistent with the jig inner cavity of lens, wherein the jig inner cavity is central symmetry structure, and the jig inner cavity contains through-hole;There is overflow glue hole corresponding to the through-hole in the jig inner cavity, and there is first baffle between the through-hole and the overflow glue hole;Annular platform is provided below the chip dispensing jig, wherein the annular platform connects the jig inner wall and jig outer wall corresponding to the chip dispensing jig, and thermoplastic solid glue is deployed on the annular platform.The technical effect that can be realized to avoid the shape, size and high and low uncertainty of lens formed on chip by the application.

Description

Technical Field

[0001] This invention relates to the field of chip technology, and in particular to a chip dispensing fixture, method, terminal device, and computer-readable storage medium. Background Technology

[0002] With the development of the semiconductor industry, technicians are increasingly choosing to use Mini-LED (Light Emitting Diode) chips for backlighting, combined with LCD screens, to achieve the purpose of displaying images. Therefore, when technicians need to use Mini-LED chips for backlighting, they often need to evenly cover the entire backlight board with Mini-LED chips. However, the current process for deploying Mini-LED chips mainly includes several steps such as soldering, die bonding, reflow soldering, testing, adhesive dispensing, debubbling, and adhesive curing. The adhesive dispensing step serves two purposes: protecting the Mini-LED chips and diffusing the light to improve the light emission angle and facilitate light mixing.

[0003] However, current manufacturing processes primarily use a direct dispensing and curing method to form a transparent optical lens on the Mini-LED chip. This direct dispensing method introduces the risk of errors in the amount of adhesive applied at each point, leading to slight variations in the size and height of the lens on each Mini-LED chip. This results in deviations in the light emission angle of each chip after the lens is applied, reducing the uniformity of light emission across the entire backplane. Furthermore, since concave lenses achieve better light emission than convex lenses, figuring out how to apply concave lenses onto Mini-LED chips is a pressing technical challenge for the industry. Summary of the Invention

[0004] The main objective of this invention is to provide a chip dispensing fixture, method, terminal device, and computer-readable storage medium, which aims to avoid uncertainties in the shape, size, and height of the lenses formed on the chip, thereby ensuring that the light output effect of all Mini-LEDs on the entire backlight board is consistent and uniform.

[0005] To achieve the above objectives, the present invention provides a chip dispensing fixture, which is used to dispense adhesive onto a chip to form a lens. The chip dispensing fixture includes: a fixture cavity with a lens structure consistent with the lens, wherein the fixture cavity has a centrally symmetrical structure and includes a through hole.

[0006] An overflow hole corresponding to the through hole exists in the inner cavity of the fixture, and a first baffle exists between the through hole and the overflow hole;

[0007] An annular platform is provided below the chip dispensing fixture, wherein the annular platform connects the inner wall and outer wall of the fixture corresponding to the chip dispensing fixture, and thermoplastic solid adhesive is deployed on the annular platform.

[0008] Furthermore, the chip dispensing fixture has an inner wall and an outer wall, wherein the inner wall is connected to the inner cavity of the fixture, and there is a spacer layer between the inner wall and the outer wall.

[0009] Furthermore, the inner cavity of the fixture is connected to the spacer layer through the overflow hole, wherein a first baffle is provided in the spacer layer between the overflow hole and the through hole.

[0010] Furthermore, there should be a gap between the first baffle and the outer wall of the fixture, and the baffle vertex corresponding to the first baffle is higher than the inner wall vertex corresponding to the inner wall of the fixture. The midpoint of the outer wall corresponding to the outer wall of the fixture is higher than the inner wall vertex, so that when the baffle vertex is higher than the inner wall vertex, there is a gap between the first baffle and the outer wall of the fixture.

[0011] Furthermore, a second baffle is provided in the spacer layer connected to the annular platform.

[0012] Furthermore, to achieve the above objectives, the present invention also provides a chip dispensing method, wherein the chip dispensing method is applied to a chip dispensing fixture, and the chip dispensing method includes the following steps:

[0013] The substrate position of the target substrate is determined based on the chip center point, and the chip dispensing fixture is deployed according to the substrate position.

[0014] Optical adhesive is injected into the inner cavity of the fixture through the through hole, and the optical adhesive in the inner cavity of the fixture is subjected to degassing treatment;

[0015] A high-temperature curing operation is performed on the chip dispensing fixture to detach the chip dispensing fixture from the target substrate.

[0016] Furthermore, after the step of deploying the chip dispensing fixture according to the substrate position, the method further includes:

[0017] Obtain the chip volume, solder paste volume, and inner cavity volume of the fixture.

[0018] The amount of optical adhesive used is calculated based on the chip volume, the solder paste volume, and the cavity volume.

[0019] Furthermore, after the step of performing degassing treatment on the optical adhesive in the cavity of the fixture, the method further includes:

[0020] Determine the change in the volume of the optical adhesive within the fixture cavity;

[0021] The optical adhesive is injected into the inner cavity of the fixture according to the volume change value of the optical adhesive.

[0022] In addition, to achieve the above objectives, the present invention also provides a terminal device, the terminal device comprising: a memory, a processor, and a chip dispensing program stored in the memory and executable on the processor, wherein the chip dispensing program, when executed by the processor, implements the steps of the chip dispensing method as described above.

[0023] In addition, to achieve the above objectives, the present invention also provides a computer-readable storage medium storing a chip dispensing program, which, when executed by a processor, implements the steps of the chip dispensing method as described above.

[0024] The chip dispensing fixture, method, terminal device, and computer-readable storage medium provided in this invention are applied to dispensing adhesive onto a chip to form a lens. The chip dispensing fixture includes: a fixture cavity with a lens structure consistent with the lens, wherein the fixture cavity has a centrally symmetrical structure and includes a through hole; an overflow hole corresponding to the through hole exists in the fixture cavity, and a first baffle exists between the through hole and the overflow hole; an annular platform is provided below the chip dispensing fixture, wherein the annular platform connects the inner wall and outer wall of the fixture corresponding to the chip dispensing fixture, and thermoplastic solid adhesive is deployed on the annular platform.

[0025] In this embodiment, the structure of the inner cavity of the chip dispensing fixture is consistent with that of the lens structure, and is also centrally symmetrical. A ring of vertices surrounds the inner cavity, and one of these vertices is selected as a through-hole. In addition to the vertices designated as through-holes, any other vertices within the inner cavity are selected as overflow holes to connect the inner cavity to the spacer layer, allowing excess optical adhesive in the inner cavity to flow into the spacer layer through the overflow holes. A ring-shaped platform is deployed below the chip dispensing fixture to connect the inner wall and outer wall of the fixture, preventing optical adhesive from flowing into the substrate below the chip dispensing fixture. The portion of the ring-shaped platform connected to the bottom of the chip dispensing fixture is coated with thermoplastic solid adhesive, the transition temperature of which is between 150-200°C.

[0026] Thus, this invention constructs an inner cavity within the chip dispensing fixture that is identical to the structure of a concave lens, and sets through holes and overflow holes in the inner cavity. Simultaneously, an annular platform is set below the chip dispensing fixture to connect the inner wall and outer wall of the fixture, and thermoplastic solid adhesive is applied to the annular platform. This solves the technical problem that current chip dispensing technology can only form optical adhesive convex lenses on Mini-LED chips, and the size and height of the formed convex lenses have slight differences. This invention achieves the technical effect of avoiding the uncertainty of the shape, size, and height of the lenses formed on the chip, so that the light output effect of all Mini-LEDs on the entire backlight board is consistent and uniform. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the terminal device structure of the hardware operating environment involved in the embodiments of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of a Mini-LED chip dispensing fixture according to an embodiment of the chip dispensing method of the present invention;

[0029] Figure 3 This is a schematic flowchart of the first embodiment of the chip dispensing method of the present invention;

[0030] Figure 4 This is a schematic diagram of the through holes and overflow holes of the Mini-LED chip dispensing fixture involved in an embodiment of the chip dispensing method of the present invention.

[0031] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0033] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the terminal device structure of the hardware operating environment involved in the embodiments of the present invention.

[0034] It should be noted that, Figure 1 This can be a structural diagram of the hardware operating environment of the terminal device. In this embodiment of the invention, the terminal device is a terminal device that integrates a chip dispensing fixture, a target substrate containing a chip, an optical glue injector, and a debubbling device. The chip dispensing fixture is used to dispense glue onto the chip to generate a lens. The chip dispensing fixture includes a fixture cavity that is consistent with the lens structure of the lens. The fixture cavity has a centrally symmetrical structure and contains a through hole.

[0035] An overflow hole corresponding to the through hole exists in the inner cavity of the fixture, and a first baffle exists between the through hole and the overflow hole;

[0036] An annular platform is provided below the chip dispensing fixture, wherein the annular platform connects the inner wall and outer wall of the fixture corresponding to the chip dispensing fixture, and thermoplastic solid adhesive is deployed on the annular platform.

[0037] Furthermore, the chip dispensing fixture has an inner wall and an outer wall, wherein the inner wall of the fixture is connected to the inner cavity of the fixture, and there is a spacer layer between the inner wall of the fixture and the outer wall of the fixture.

[0038] Furthermore, the inner cavity of the fixture is connected to the spacer layer through the overflow hole, wherein a first baffle is provided in the spacer layer between the overflow hole and the through hole.

[0039] Furthermore, there should be a gap between the first baffle and the outer wall of the fixture, and the baffle vertex corresponding to the first baffle should be higher than the inner wall vertex corresponding to the inner wall of the fixture, wherein the outer wall of the fixture...

[0040] The midpoint of the outer wall corresponding to the wall is higher than the vertex of the inner wall, so that when the vertex of the baffle is higher than the vertex of the inner wall, there is a gap between the first baffle and the outer wall of the fixture.

[0041] Furthermore, a second baffle is provided in the spacer layer connected to the annular platform.

[0042] like Figure 1 As shown, the terminal device may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, and a network interface 1004.

[0043] Memory 1005. The communication bus 1002 is used to implement communication between these components. User interface 1003 may include a display screen, input unit such as a keyboard, and optionally, user interface 1003 may also include a standard wired interface or a wireless interface. Network interface 1004 may...

[0044] The selected interfaces may include standard wired interfaces and wireless interfaces (such as Wireless Fidelity (5WI-FI) interfaces). The memory 1005 may be high-speed random access memory (RAM) or stable non-volatile memory (NVM), such as disk storage. Alternatively, the memory 1005 may be a storage device independent of the aforementioned processor 1001.

[0045] Those skilled in the art will understand that Figure 1 The structure shown does not constitute a limitation on the terminal device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0046] like Figure 1 As shown, the memory 1005, which serves as a storage medium, may include an operating system, a data storage module, a network communication module, a user interface module, and a chip dispensing program.

[0047] exist Figure 1 In the terminal device shown, the network interface 1004 is mainly used for data communication with other devices; the user interface 1003 is mainly used for data interaction with the user; the processor 1001 and memory 1005 in the terminal device of the present invention can be set in the terminal device, and the terminal device calls the chip dispensing program stored in the memory 1005 through the processor 1001 and performs the following operations:

[0048] The substrate position of the target substrate is determined based on the chip center point, and the chip dispensing fixture is deployed according to the substrate position.

[0049] Optical adhesive is injected into the inner cavity of the fixture through the through hole, and the optical adhesive in the inner cavity of the fixture is subjected to degassing treatment;

[0050] A high-temperature curing operation is performed on the chip dispensing fixture to detach the chip dispensing fixture from the target substrate.

[0051] Furthermore, the processor 1001 can call the chip dispensing program stored in the memory 1005 and also perform the following operations:

[0052] Obtain the chip volume, solder paste volume, and inner cavity volume of the fixture.

[0053] The amount of optical adhesive used is calculated based on the chip volume, the solder paste volume, and the cavity volume.

[0054] Furthermore, the processor 1001 can call the chip dispensing program stored in the memory 1005 and also perform the following operations:

[0055] Determine the change in the volume of the optical adhesive within the fixture cavity;

[0056] The optical adhesive is injected into the inner cavity of the fixture according to the volume change value of the optical adhesive.

[0057] Based on the aforementioned terminal device, various embodiments of the chip dispensing fixture, method, terminal device, and computer-readable storage medium of the present invention are provided.

[0058] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the chip dispensing fixture according to an embodiment of the chip dispensing method of the present invention;

[0059] In this embodiment, a chip dispensing fixture is used to dispense adhesive onto a chip to generate a lens. The chip dispensing fixture includes a fixture cavity with a lens structure consistent with that of the lens. The fixture cavity has a centrally symmetrical structure and includes a through hole.

[0060] Specifically, such as Figure 2 As shown, the structure of the inner cavity 2-1 of the chip dispensing fixture should be consistent with the structure of the lens. That is, when the lens structure is a concave lens, the inner cavity 2-1 of the fixture should be consistent with the concave lens, and the inner cavity 2-1 of the fixture should be a centrally symmetrical structure like the concave lens.

[0061] In addition, the inner cavity 2-1 of the fixture should be similar to that of the concave lens, with a ring of apex positions around the inner cavity of the fixture, and one of the apex positions should be set as a through hole 2-5. It is understood that the size of the through hole 2-5 should be sufficient to allow the needle of the optical adhesive injection device to pass through.

[0062] An overflow hole corresponding to the through hole exists in the inner cavity of the fixture, and a first baffle exists between the through hole and the overflow hole;

[0063] For details, please refer to Figure 4 , Figure 4 This is a schematic diagram of the through holes and overflow holes of the Mini-LED chip dispensing fixture involved in an embodiment of the chip dispensing method of the present invention, as shown below. Figure 4 As shown, among the vertices of the inner cavity 2-1 of the fixture, any vertex other than the vertex that is set as the through hole 2-5 is selected as the overflow hole 2-6. The overflow hole 2-6 should not penetrate the outer wall of the fixture. That is, the overflow hole 2-6 should only connect the inner cavity 2-1 of the fixture to the spacer layer 2-4, so that excess optical adhesive in the inner cavity 2-1 of the fixture can flow into the spacer layer through the overflow hole 2-6.

[0064] In addition, such as Figure 2 As shown, a baffle 2-9 should be provided in the spacer layer 2-4 between the overflow hole 2-6 and the through hole 2-5. The baffle 2-9 can be located at any position between the overflow hole 2-6 and the inner wall recess 2-7 on the inner wall of the fixture. However, the height of the baffle 2-9 should be higher than the corresponding inner wall vertex 2-8 of the inner wall of the fixture. That is, the baffle vertex corresponding to the baffle 2-9 should be above the inner wall vertex 2-8. The baffle 2-9 should not be connected to the outer wall 2-3 of the fixture, so as to prevent the baffle 2-9 from being connected to the inner wall 2-2 and the outer wall 2-3 of the fixture to form a closed space, which would make it difficult for the optical adhesive to flow into the spacer layer due to the influence of pressure.

[0065] An annular platform is provided below the chip dispensing fixture, wherein the annular platform connects the inner wall and outer wall of the fixture corresponding to the chip dispensing fixture, and thermoplastic solid adhesive is deployed on the annular platform.

[0066] Specifically, an annular platform should be deployed below the chip dispensing fixture. This platform connects the inner wall 2-2 of the fixture to the outer wall 2-3, thereby preventing the optical adhesive within the spacer layer from flowing into the substrate below the chip dispensing fixture. Simultaneously, if... Figure 2 As shown, the part connecting the annular platform to the bottom of the chip dispensing fixture should be provided with thermoplastic solid adhesive 2-11, wherein the transition temperature of thermoplastic solid adhesive 2-11 is between 150-200℃. It can be understood that this transition temperature range matches the thermosetting temperature range of optical adhesives.

[0067] Furthermore, in a feasible embodiment, the chip dispensing fixture has an inner wall and an outer wall, wherein the inner wall is connected to the inner cavity of the fixture, and there is a spacer layer between the inner wall and the outer wall.

[0068] Specifically, the chip dispensing fixture has an inner wall 2-2 and an outer wall 2-3, wherein, for example... Figure 2 As shown, the inner wall 2-2 of the fixture is connected to the inner cavity 2-1 of the fixture, and there is a spacer layer 2-4 between the outer wall 2-3 of the fixture and the inner wall of the fixture. That is, in the shell of the chip dispensing fixture, the shell part that is in contact with the internal space of the fixture is the inner wall 2-2 of the fixture. The structural shape of the inner wall 2-2 of the fixture should be consistent with the structural shape of the concave lens, which is also concave from the outside to the middle. The center position of the inner wall of the fixture is the inner wall concave point 2-7.

[0069] Similarly, the shell part of the chip dispensing fixture that comes into contact with the external space is the outer wall 2-3 of the fixture, and the space between the inner wall 2-2 of the fixture and the outer wall 2-3 of the fixture is the spacer layer 2-4.

[0070] Furthermore, in a feasible embodiment, the inner cavity of the fixture is connected to the spacer layer through the overflow hole, wherein a first baffle is provided in the spacer layer between the overflow hole and the through hole;

[0071] Specifically, the chip dispensing fixture connects the fixture cavity 2-1 to the spacer layer 2-4 through the overflow hole 2-6, thereby ensuring that excess optical adhesive in the fixture cavity can enter the spacer layer 2-4 through the overflow hole 2-6. Simultaneously, as... Figure 2 As shown, a baffle 2-9 should be provided in the spacer layer between the overflow hole 2-6 and the through hole 2-5. The baffle 2-9 can be located at any position between the overflow hole 2-6 and the inner wall recess 2-7 on the inner wall of the fixture.

[0072] It should be noted that the height of baffle 2-9 should be higher than the corresponding inner wall apex 2-8 of the fixture, and baffle 2-9 should not be connected to the outer wall 2-3 of the fixture to prevent baffle 2-9 from being connected to the inner wall 2-2 and the outer wall 2-3 of the fixture to form a closed space, which would make it difficult for the optical adhesive to flow into the spacer layer 2-4 due to pressure.

[0073] Furthermore, in a feasible embodiment, there should be a gap between the first baffle and the outer wall of the fixture, and the baffle vertex corresponding to the first baffle is higher than the inner wall vertex corresponding to the inner wall of the fixture, wherein the midpoint of the outer wall corresponding to the outer wall of the fixture is higher than the inner wall vertex, so that when the baffle vertex is higher than the inner wall vertex, there is a gap between the first baffle and the outer wall of the fixture.

[0074] Specifically, there should be a gap between the baffle 2-9 and the outer wall 2-3 of the fixture. That is, the height of the baffle 2-9 should be higher than the corresponding inner wall vertex 2-8 of the inner wall 2-2 of the fixture, and the baffle 2-9 should not be connected to the outer wall 2-3 of the fixture. This prevents the baffle 2-9 from forming a closed space by connecting with the inner wall 2-2 and the outer wall 2-3 of the fixture, which would make it difficult for the optical adhesive to flow into the spacer layer due to pressure. In other words, the baffle vertex corresponding to the baffle 2-9 should be above the inner wall vertex 2-8 and not connected to the outer wall 2-3 of the fixture. At the same time, in order to ensure that the baffle vertex of the baffle 2-9 is higher than the inner wall vertex 2-8 and not connected to the outer wall 2-3 of the fixture, the height of the midpoint of the corresponding outer wall of the fixture should be higher than the inner wall vertex 2-8 of the inner wall of the fixture.

[0075] Furthermore, in one feasible embodiment, a second baffle is provided in the spacer layer connected to the annular platform;

[0076] Specifically, such as Figure 2As shown, a baffle 2-10 can be provided in the spacer layer on the other side connected to the overflow hole 2-6. The baffle 2-10 can be connected to both the inner wall 2-2 and the outer wall 2-3 of the fixture at the same time, so that the optical adhesive entering the spacer layer from the overflow hole cannot sink into the annular platform below and the amount of optical adhesive used is reduced.

[0077] In this embodiment, the structure of the inner cavity of the chip dispensing fixture should be consistent with the structure of the lens. That is, when the lens structure is a concave lens, the inner cavity of the fixture should be consistent with the concave lens, and the inner cavity of the fixture should be a centrally symmetrical structure like the concave lens. Among the vertices of the inner cavity of the fixture, any vertex other than the vertex set as a through hole is selected as an overflow hole. The overflow hole should not penetrate the outer wall of the fixture. That is, the overflow hole should only connect the inner cavity of the fixture to the spacer layer, so that excess optical adhesive in the inner cavity of the fixture can flow into the spacer layer through the overflow hole. An annular platform should be deployed below the chip dispensing fixture. The annular platform is used to connect the inner wall of the fixture to the outer wall of the fixture, thereby preventing the optical adhesive in the spacer layer from flowing into the substrate below the chip dispensing fixture.

[0078] Thus, this invention constructs an inner cavity within the chip dispensing fixture that is identical to the structure of a concave lens, and sets through holes and overflow holes in the inner cavity. Simultaneously, an annular platform is set below the chip dispensing fixture to connect the inner wall and outer wall of the fixture, and thermoplastic solid adhesive is applied to the annular platform. This solves the technical problem that current chip dispensing technology can only form optical adhesive convex lenses on Mini-LED chips, and the size and height of the formed convex lenses have slight differences. This invention achieves the technical effect of avoiding the uncertainty of the shape, size, and height of the lenses formed on the chip, so that the light output effect of all Mini-LEDs on the entire backlight board is consistent and uniform.

[0079] Based on the above-described chip dispensing fixture, a first embodiment of the chip dispensing method of the present invention is presented here.

[0080] Please refer to Figure 3 , Figure 3 This is a schematic flowchart of the first embodiment of the chip dispensing method of the present invention.

[0081] It should be understood that although the logical order is shown in the flowchart, in some cases the chip dispensing method of the present invention may of course perform the steps shown or described in a different order than that shown here.

[0082] In this embodiment, the chip dispensing method of the present invention, applied to the above-mentioned chip dispensing fixture, may include the following steps:

[0083] Step S10: Determine the substrate position of the target substrate based on the chip center point, and deploy the chip dispensing fixture according to the substrate position;

[0084] In this embodiment, when the terminal device is running, it first determines the center point of the chip on the target substrate and the chip position corresponding to the chip center point. Then, the terminal device deploys the chip dispensing fixture on the target substrate according to the chip position, so that the center point of the fixture coincides with the center point of the chip, and the chip dispensing fixture is bonded to the target substrate by the thermoplastic solid adhesive on the chip dispensing fixture.

[0085] For example, when the terminal device is running, it first determines the target Mini-LED chip on the target substrate and determines the chip center point of the Mini-LED chip. At the same time, the terminal device determines the deployment position of the Mini-LED chip dispensing fixture based on the chip center point and deploys the Mini-LED chip dispensing fixture on the target substrate, so that the fixture center point of the Mini-LED chip dispensing fixture coincides with the chip center point. Then, the Mini-LED chip dispensing fixture is bonded to the target substrate by the thermoplastic solid adhesive on the Mini-LED chip dispensing fixture.

[0086] Step S20: Inject optical adhesive into the inner cavity of the fixture through the through hole, and perform degassing treatment on the optical adhesive in the inner cavity of the fixture;

[0087] In this embodiment, the terminal device controls the optical adhesive injection device to approach the through hole in the chip dispensing fixture, and controls the optical adhesive injection device to inject the optical adhesive into the inner cavity of the chip dispensing fixture through the through hole. At the same time, the terminal device calls the degassing device to rotate the target substrate to complete the degassing process.

[0088] For example, the terminal device first controls the optical adhesive injector to approach the through hole in the Mini-LED chip dispensing fixture, and controls the optical adhesive injector to deliver the optical adhesive stored inside into the needle of the optical adhesive injector, so that the optical adhesive enters the through hole in the Mini-LED chip dispensing fixture through the needle and enters the inner cavity of the fixture in the Mini-LED chip dispensing fixture. At the same time, the terminal device controls the degassing device connected to the target substrate, and the degassing device drives the target substrate to rotate, thereby eliminating the air bubbles formed in the optical adhesive in the inner cavity of the fixture, thereby completing the degassing process.

[0089] Step S30: Perform a high-temperature curing operation on the chip dispensing fixture to detach the chip dispensing fixture from the target substrate;

[0090] In this embodiment, the terminal device controls the temperature control device to heat the chip dispensing fixture to perform a high-temperature curing operation, thereby causing the chip dispensing fixture to detach from the target substrate.

[0091] For example, the terminal device first controls a temperature control device to heat the Mini-LED chip dispensing fixture to 150-200°C and maintains the heating state.

[0092] The process is maintained for 15 minutes, causing the thermoplastic solid adhesive on the Mini-LED chip dispensing fixture to deform, thereby detaching the Mini-LED chip dispensing fixture from the target substrate and allowing the optical adhesive inside the Mini-LED chip dispensing fixture to solidify successfully.

[0093] In this embodiment, when the terminal device is running, it first determines the center point of the chip on the target substrate.

[0094] The device determines the chip position corresponding to the chip's center point, and then deploys the chip dispensing fixture onto the target substrate according to the chip position, thereby aligning the fixture's center point with the chip's center point.

[0095] The thermoplastic solid adhesive on the chip dispensing fixture is used to bond the chip dispensing fixture to the target substrate. Then, the terminal device controls an optical adhesive injection device to approach a through-hole within the chip dispensing fixture and injects optical adhesive into the fixture's inner cavity through the through-hole. Simultaneously, the terminal device...

[0096] The terminal device invokes the degassing device, which rotates the target substrate to complete the degassing process. Finally, the terminal device controls the temperature control device to heat the chip dispensing fixture to perform a high-temperature curing operation.

[0097] This allows the chip dispensing fixture to detach from the target substrate.

[0098] Thus, the present invention employs a chip dispensing fixture to deploy on a target substrate, and injects optical adhesive through through-holes within the chip dispensing fixture, thereby causing the optical adhesive to form a specific optical lens within the fixture cavity.

[0099] Finally, the chip dispensing fixture is cured at high temperature to detach it from the target substrate. Specifically, this invention uses optical adhesive injected into the fixture's inner cavity through a through-hole to form a concave lens consistent with the fixture's internal structure. This solves the problems of current technologies where direct dispensing of adhesive to chips results in deviations in the light emission angle of each chip after adding the lens, reduced uniformity, and the inability to dispense only convex lenses. This method avoids variations in the shape, size, and height of the lenses formed on the chip.

[0100] The uncertain technical effects result in consistent and uniform light output from all Mini-LEDs on the entire backlight panel.

[0101] Furthermore, based on the first embodiment of the chip dispensing method of the present invention described above, a second embodiment of the chip dispensing method of the present invention is proposed herein.

[0102] based on Figure 2 The first embodiment of the chip dispensing method of the present invention shown herein, after step S10 above, may further include:

[0103] Step A10: Obtain the chip volume, solder paste volume, and inner cavity volume of the fixture;

[0104] Step A20: Calculate the amount of optical adhesive required based on the chip volume, the solder paste volume, and the cavity volume;

[0105] For example, after deploying the Mini-LED chip dispensing fixture onto the target substrate, the terminal device first obtains the chip volume and solder paste volume corresponding to the Mini-LED chip on the target substrate, and calculates the inner cavity volume corresponding to the inner cavity of the Mini-LED chip dispensing fixture. Then, the terminal device sums the obtained chip volume, solder paste volume, and inner cavity volume to obtain the amount of optical adhesive used. The terminal device then injects optical adhesive into the optical adhesive injector according to the amount of optical adhesive used. In this way, the amount of optical adhesive overflowing from the inner cavity of the Mini-LED chip dispensing fixture into the spacer layer of the Mini-LED chip dispensing fixture can be minimized. Thus, after the dispensing operation is completed, technicians can directly retrieve the Mini-LED chip dispensing fixture or perform the next dispensing operation after only slightly cleaning the Mini-LED chip dispensing fixture.

[0106] Furthermore, based on the first and / or second embodiments of the chip dispensing method of the present invention described above, a third embodiment of the chip dispensing method of the present invention is proposed herein.

[0107] based on Figure 2 The first embodiment of the chip dispensing method of the present invention shown herein, after step S20 above, may further include:

[0108] Step B10: Determine the volume change value of the optical adhesive in the inner cavity of the fixture;

[0109] Step B20: Inject the optical adhesive into the inner cavity of the fixture according to the volume change value of the optical adhesive;

[0110] For example, after the terminal device controls the degassing device to perform the degassing process, it first determines the volume change value of the optical adhesive in the inner cavity of the Mini-LED chip dispensing fixture. Then, the terminal device controls the optical adhesive injector to continue injecting optical adhesive into the inner cavity of the fixture through the through hole in the Mini-LED chip dispensing fixture according to the volume change value. In this way, it can prevent the final dispensed concave lens from having a volume change due to the reduction in the volume of optical adhesive in the inner cavity of the fixture after the Mini-LED chip dispensing fixture has completed the degassing process.

[0111] Furthermore, the present invention also provides a terminal device having a chip dispensing program that can run on a processor, wherein when the terminal device executes the chip dispensing program, it implements the steps of the chip dispensing method as described in any of the above embodiments.

[0112] The specific embodiments of the terminal device of the present invention are basically the same as the embodiments of the chip dispensing method described above, and will not be repeated here.

[0113] In addition, the present invention provides a computer-readable storage medium storing a chip dispensing program, which, when executed by a processor, implements the steps of the chip dispensing method as described in any of the above embodiments.

[0114] The specific embodiments of the computer-readable storage medium of this invention are basically the same as the embodiments of the chip dispensing method described above, and will not be repeated here.

[0115] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0116] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0117] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a terminal device (which can be a terminal device for executing the chip dispensing method provided by the present invention, specifically a data storage control terminal, PC, or portable computer, etc.) to execute the methods described in the various embodiments of the present invention.

[0118] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A chip dispensing fixture, characterized in that, The chip dispensing fixture is used to dispense adhesive onto a chip to form a lens. The chip dispensing fixture includes: a fixture cavity with a lens structure consistent with the lens, wherein the fixture cavity has a centrally symmetrical structure and contains a through hole. The fixture cavity is consistent with a concave lens. There is a ring of vertex positions around the fixture cavity, and one of the vertex positions is set as a through hole. Among the vertex positions of the fixture cavity, any vertex position other than the one set as a through hole is selected as an overflow hole. The chip dispensing fixture has an inner wall and an outer wall, wherein the inner wall is connected to the inner cavity of the fixture; There is a spacer layer between the inner wall and the outer wall of the fixture. The inner cavity of the fixture is connected to the spacer layer through an overflow hole. The overflow hole connects the inner cavity of the fixture to the spacer layer but does not penetrate the outer wall of the fixture. A first baffle is provided in the spacer layer between the overflow hole and the through hole. There is a gap between the first baffle and the outer wall of the fixture, and the baffle vertex corresponding to the first baffle is higher than the inner wall vertex corresponding to the inner wall of the fixture. The midpoint of the outer wall corresponding to the outer wall of the fixture is higher than the inner wall vertex, so that when the baffle vertex is higher than the inner wall vertex, there is a gap between the first baffle and the outer wall of the fixture. An annular platform is provided below the chip dispensing fixture, wherein the annular platform connects the inner wall and outer wall of the fixture corresponding to the chip dispensing fixture, and thermoplastic solid adhesive is deployed on the annular platform, wherein the transition temperature of the thermoplastic solid adhesive is between 150°C and 200°C.

2. The chip dispensing fixture as described in claim 1, characterized in that, A second baffle is provided in the spacer layer connected to the annular platform.

3. A chip dispensing method, characterized in that, The chip dispensing method employs the chip dispensing fixture as described in any one of claims 1-2, and the chip dispensing method includes the following steps: The substrate position of the target substrate is determined based on the chip center point, and the chip dispensing fixture is deployed according to the substrate position. Optical adhesive is injected into the inner cavity of the fixture through a through-hole, and the optical adhesive in the inner cavity of the fixture is subjected to a degassing treatment. A high-temperature curing operation is performed on the chip dispensing fixture to detach the chip dispensing fixture from the target substrate.

4. The chip dispensing method as described in claim 3, characterized in that, After the step of deploying the chip dispensing fixture according to the substrate position, the method further includes: Obtain the chip volume, solder paste volume, and inner cavity volume of the fixture. The amount of optical adhesive used is calculated based on the chip volume, the solder paste volume, and the cavity volume.

5. The chip dispensing method as described in claim 4, characterized in that, After the step of performing degassing treatment on the optical adhesive in the cavity of the fixture, the method further includes: Determine the change in the volume of the optical adhesive within the fixture cavity; The optical adhesive is injected into the inner cavity of the fixture according to the volume change value of the optical adhesive.

6. A terminal device, characterized in that, The terminal device includes: a memory, a processor, and a chip dispensing program stored in the memory and executable on the processor, wherein the chip dispensing program, when executed by the processor, implements the steps of the chip dispensing method as described in any one of claims 3 to 5.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a chip dispensing program, which, when executed by a processor, implements the steps of the chip dispensing method as described in any one of claims 3 to 5.

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