Debugging mechanism and method for the coincidence of the swing scan axis and the imaging optical axis of a matrix-split aerial infrared camera

Abstract

The present invention discloses an alignment debugging mechanism and method for the coincidence of the swing scan axis and the imaging optical axis of a planar array split-frame aerial infrared camera. The alignment debugging mechanism for the coincidence of the swing scan axis and the imaging optical axis of the planar array split-frame aerial infrared camera includes: a V-shaped tooling bracket for placing an installation ring provided on an infrared thermal imager and allowing the installation ring to rotate around its own axis; a collimator; a transfer tooling for carrying the V-shaped tooling bracket and the planar array split-frame aerial infrared camera and adjusting the azimuth and pitch positions of the V-shaped tooling bracket and the planar array split-frame aerial infrared camera. Beneficial effects: By improving the assembly and debugging method of the planar array split-frame aerial infrared camera, the technical solution of the present invention can improve the coincidence index of the swing scan axis and the imaging optical axis of the aerial infrared camera to ≤0.25 mrad, greatly improving the opto-mechanical performance of the aerial infrared camera and fully meeting the market demand.

Description

Technical Field

[0001] The present invention relates to the field of assembling a matrix split-frame airborne infrared camera, and particularly relates to an adjusting mechanism and method for the coincidence of the swing scan axis and the imaging optical axis of a matrix split-frame airborne infrared camera. Background Technique

[0002] An airborne infrared camera is a kind of payload equipment for airborne remote sensing. Airborne remote sensing means using aircraft such as manned aircraft, unmanned aircraft, airships, etc., carrying various imaging sensors, acquiring the electromagnetic wave signals radiated by the natural and cultural landscapes on the earth's surface, and through image processing to extract natural and cultural information. Airborne remote sensing has the characteristics of strong mobility, fast real-time update, high ground resolution, rich observation information, etc., and is an important means to quickly obtain high-precision remote sensing data. Therefore, it is widely used in resource exploration, environmental monitoring, disaster forecasting, and military reconnaissance by countries around the world. Currently, common airborne optoelectronic imaging equipment mainly includes visible light cameras, imaging spectrometers, lidars, microwave remote sensing systems, thermal infrared imaging systems, etc.

[0003] The airborne thermal infrared imaging system has been widely used in the fields of nuclear power plant drainage monitoring, sea ice monitoring, urban heat island effect monitoring and prevention, marine search and rescue, and military target detection. At the same time, because infrared detection is not restricted by night, it can effectively expand the application range of airborne remote sensing detection and provide the possibility for all-weather airborne remote sensing detection. Therefore, infrared airborne remote sensing plays a crucial role in the scientific and technological development strategies of countries around the world. According to the different detectors actually selected, the optical mechanical scanning methods of common infrared imaging systems are divided into four types, namely: unit scanning type, line array pushbroom type, multi-element parallel scanning type, and matrix split-frame type.

[0004] Figure 1 The figure shows a schematic diagram of the split-frame swing scan imaging technology when the airborne remote sensing system uses a matrix camera for imaging. In the figure, the aircraft flies forward along the remote sensing flight path. The system controls the infrared matrix camera to scan in the wingspan direction. N images at equal intervals are taken in each scanning cycle, and a certain overlap rate is ensured between the images for image stitching. The advancement of the flight path is achieved by the forward flight of the aircraft. After calculating the scanning cycle according to the aircraft flight speed v and flight height H, a stable overlap rate between rows can be achieved. The movement mechanism scans along the wingspan direction of the aircraft, which can drive the matrix camera to achieve large field of view and high-resolution imaging. Based on this technical principle, the scanning methods are divided into two types: single-pass scanning imaging and double-pass scanning imaging. The single-pass scanning imaging of the matrix split-frame swing scan is divided into two processes: the forward scan along the wingspan direction of the aircraft and the reverse scan. The scanning angular velocity curve of the scanning mechanism and the ground coverage position of the periodic scanning imaging of the matrix camera are as Figure 2As shown in the figure. The red scanning line in the figure is the forward scanning direction. During forward scanning, the scanning mechanism starts from rest on one side of the aircraft wingspan and performs uniform acceleration motion. The acceleration time is t1. When the speed reaches the required scanning speed v1, the scanning mechanism starts to perform uniform motion. At this time, the system controls the camera to start taking pictures. During one forward scanning cycle, the camera takes N pictures at equal angular intervals, and there is a certain overlap rate between each picture. Subsequently, the scanning mechanism performs uniform deceleration motion, and the deceleration time is also t1. When the speed drops from v1 to 0, the forward scanning ends. The blue scanning line in the figure is the reverse scanning direction. During reverse scanning, the camera does not take pictures. To ensure that there is an overlap between the scanned line images captured during the next forward scanning and the previous scanned line image, it is required that the scanning mechanism returns to the scanning initial position as fast as possible. Therefore, the scanning mechanism completes the reverse sweep-back in the way of uniform acceleration and uniform deceleration, and the duration of both is t2.

[0005] Swing-scanning imaging expands the imaging field of view along the picture frame, that is, the wingspan direction, to obtain a wide-format image. The swing-scanning mechanism controls the camera to perform continuous swing-scanning at a given speed in a "zigzag" shape in the aircraft wingspan direction. The camera takes exposure pictures according to the pre-calculated positions during the swing-scanning process. Since the camera has two-dimensional motions along the flight direction and the swing-scanning direction relative to the ground coordinate system at the exposure moment, there will be forward image shift along the flight direction and swing-scanning image shift along the swing-scanning direction. The 45° reflector at the front end of the infrared thermal imager completes the optical compensation for the forward image shift generated in the flight direction, and the reflector inside the thermal imager completes the optical compensation for the swing-scanning image shift generated in the wingspan direction. The opto-mechanical structure of the area array split-frame aerial infrared camera includes components such as a radome, a 45° reflector, a pitch gimbal, a roll gimbal, an infrared thermal imager, and a mounting and fixing base. Among them, the 45° reflector is fixed on the pitch gimbal and forms an optical system with the infrared thermal imager. The 45° reflector can rotate around the pitch axis, and the entire optical system is fixed on the roll gimbal. The roll gimbal is connected to the fixed base through the roll axis. The 45° reflector reflects the ground scenery into the horizontally placed infrared thermal imager lens, reducing the moment of inertia of the roll gimbal. At the same time, it undertakes the function of isolating the forward image shift composite pitch attitude disturbance. The roll gimbal can rotate around the roll axis, realizing the function of isolating the wingspan swing-stop scanning composite roll attitude disturbance. Figure 3 is a schematic diagram of the dual-axis structure of the area array split-frame aerial infrared camera, Figure 4 is a schematic diagram of the structure of the area array split-frame aerial infrared camera.

[0006] The aerial infrared camera is an important payload device of the remote sensing system. The performance of the imaging payload directly determines the application effectiveness of manned and unmanned remote sensing systems. And the coincidence of the swing-scanning rotation axis and the optical axis, which directly affects the swing-scanning opto-mechanical imaging performance of the aerial camera, is particularly important. When the system works, it is required that the swing-scanning rotation axis of the thermal imaging payload lens barrel coincides with the optical axis of the infrared thermal imager. If there is a large deviation between the two, the swing-scanning trajectory in the wingspan direction ( Figure 2In the wingspan direction, the one-way scanning line will be bent, resulting in missing scene information, affecting the calibration and adjustment of image motion compensation, and affecting image stitching and image clarity. The higher the flight altitude, the larger the swing angle, the faster the swing speed, and the faster the flight speed, the more serious the impact. Therefore, the coincidence of the swing axis of the lens barrel and the optical axis is an important measure of the opto-mechanical performance of infrared cameras. This index is usually required to be ≤0.5 mrad at home and abroad.

[0007] In recent years, with the development of the aviation industry, the market has higher and higher requirements for the opto-mechanical performance of area array split-frame aviation infrared cameras. The above index can no longer meet the market requirements. Limited by the assembly and debugging level of area array split-frame aviation infrared cameras, the coincidence index of the swing axis of the lens barrel and the optical axis cannot be further improved, seriously restricting the improvement of the opto-mechanical performance of aviation infrared cameras. Therefore, designing a new assembly and debugging method for area array split-frame aviation infrared cameras to further improve the coincidence index of the swing axis of the lens barrel and the optical axis and improve the opto-mechanical performance of aviation infrared cameras to better meet the market demand is a difficult problem that technicians in this field urgently need to solve. Summary of the Invention

[0008] The main purpose of the present invention is to propose a coincidence debugging mechanism and method for the swing axis and imaging optical axis of an area array split-frame aviation infrared camera, aiming to solve the problem that the assembly and debugging level of existing area array split-frame aviation infrared cameras is not high and the opto-mechanical performance of aviation infrared cameras cannot be further improved.

[0009] To solve the above problems, the present invention proposes a coincidence debugging mechanism for the swing axis and imaging optical axis of an area array split-frame aviation infrared camera, including:

[0010] A V-shaped tooling bracket for placing an installation ring tightly sleeved on an infrared thermal imager and allowing the installation ring to rotate around its own axis;

[0011] A collimator;

[0012] A transfer tooling for carrying the V-shaped tooling bracket and the area array split-frame aviation infrared camera and adjusting the azimuth and pitch positions of the V-shaped tooling bracket and the area array split-frame aviation infrared camera to make the crosshair of the infrared thermal imager coincide with the cross target of the collimator;

[0013] A fixed bracket one fixedly installed in the infrared thermal imager for installing an area array infrared detector and driving the area array infrared detector to move radially;

[0014] A fixed bracket two rotatably installed in the infrared thermal imager for installing a lens and adjusting the pitch, azimuth of the lens and driving the lens to move radially.

[0015] In one embodiment, the V-shaped tooling bracket includes a bottom plate and a V-shaped plate vertically fixed on the bottom plate, and a limiting groove is provided on the surface of the V-shaped plate that contacts the mounting ring.

[0016] In one embodiment, the collimator includes an optical test stable platform and a collimator body provided on the optical test stable platform.

[0017] In one embodiment, the transfer tooling includes a mounting frame and a horizontal shaft mounted on the mounting frame. The horizontal shaft is rotatably connected to the mounting frame, and a vertical rod is fixed on the horizontal shaft. The upper end of the vertical rod is rotatably installed with a turntable.

[0018] In one embodiment, the first fixed bracket includes a horizontal plate and a vertical plate vertically connected. A long hole one is provided on the horizontal plate, and a long hole two is provided on the vertical plate. The length directions of the long hole one and the long hole two are both perpendicular to the optical axis of the area array infrared detector.

[0019] In one embodiment, the second fixed bracket includes:

[0020] A mounting seat rotatably installed in the infrared thermal imager around a vertical axis;

[0021] A frame rotatably installed on the mounting seat around a horizontal axis. An installation hole is provided on the frame;

[0022] A lens frame, in which a lens is installed. A through hole is provided on the lens frame. The aperture of the through hole is larger than the aperture of the installation hole. The lens frame is fixedly connected to the frame through a connecting screw. The connecting screw passes through the through hole and is inserted and fixedly connected to the installation hole.

[0023] In addition, to solve the above problems, the present invention also proposes a method for debugging the coincidence of the swing scanning axis and the imaging optical axis of an area array split-frame aerial infrared camera, including:

[0024] S1. Under the condition of ensuring the imaging quality of the infrared thermal imager, adjust the coincidence of the imaging optical axis of the infrared thermal imager and the central axis of the mounting ring to meet ≤ 0.25 mrad;

[0025] S2. Install the infrared thermal imager into the roll ring frame, control the roll ring frame to rotate self-driven to drive the infrared thermal imager to swing scan, and adjust the coincidence of the imaging optical axis of the infrared thermal imager and the swing scanning axis of the roll ring frame to meet ≤ 0.25 mrad;

[0026] S3. Install the pitch ring frame and the 45° reflector, and adjust the reflecting surface of the 45° reflector to form a 45° angle with the imaging optical axis of the infrared thermal imager.

[0027] In one embodiment, S1. Under the condition of ensuring the imaging quality of the infrared thermal imager, adjusting the coincidence of the imaging optical axis of the infrared thermal imager and the central axis of the mounting ring to meet ≤ 0.25 mrad includes:

[0028] S11. Adjust the crosshair of the infrared thermal imager to coincide with the crosshair target of the collimator;

[0029] S12. Rotate the mounting ring;

[0030] S13. If the coincidence of the imaging optical axis of the infrared thermal imager and the central axis of the mounting ring does not meet the requirement of ≤0.25 mrad, then:

[0031] S14. Radially move the area array infrared detector until the crosshair target moves to a distance half of that from the crosshair in both the horizontal and vertical directions;

[0032] S15. Radially move the lens until the infrared image of the infrared thermal imager can be clearly imaged across the entire frame, the radiation energy of the uniform background is uniform, and the image distortion is qualified;

[0033] S16. Observe whether the coincidence of the imaging optical axis of the infrared thermal imager and the central axis of the mounting ring meets the requirement of ≤0.25 mrad. If not, repeat steps S11 - S15 until it is satisfied.

[0034] In one embodiment, S2. Install the infrared thermal imager into the roll gimbal, control the roll gimbal to rotate to drive the infrared thermal imager to swing-scan, and adjust the coincidence of the imaging optical axis of the infrared thermal imager and the swing-scan axis of the roll gimbal to meet the requirement of ≤0.25 mrad, including:

[0035] S21. Install the infrared thermal imager into the roll gimbal;

[0036] S22. Control the roll gimbal to rotate to drive the infrared thermal imager to swing-scan;

[0037] S23. If the coincidence of the imaging optical axis of the infrared thermal imager and the swing-scan axis of the roll gimbal does not meet the requirement of ≤0.25 mrad, then:

[0038] S24. Radially move the area array infrared detector until the crosshair target moves to a distance half of that from the crosshair in both the horizontal and vertical directions;

[0039] S25. Observe whether the coincidence of the imaging optical axis of the infrared thermal imager and the swing-scan axis of the roll gimbal meets the requirement of ≤0.25 mrad. If not, repeat steps S21 - S24 until it is satisfied.

[0040] Advantageous effects: The technical solution of the present invention can improve the coincidence index of the swing-scan axis and the imaging optical axis of the airborne infrared camera to ≤0.25 mrad by improving the assembly and debugging method of the area array split-frame airborne infrared camera, greatly improving the opto-mechanical performance of the airborne infrared camera and fully meeting the market demand. Description of the Drawings

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0042] Figure 1 It is a schematic diagram of the split swing scanning imaging technology when the existing airborne remote sensing system uses a matrix camera for imaging;

[0043] Figure 2 It is a schematic diagram of the scanning angular velocity curve of the existing scanning mechanism and the ground coverage position of the periodic scanning imaging of the matrix camera;

[0044] Figure 3 It is a schematic diagram of the dual-axis structure of the existing matrix split airborne infrared camera;

[0045] Figure 4 It is a schematic diagram of the structure of the existing matrix split airborne infrared camera;

[0046] Figure 5 It is a schematic diagram of the structure of the V-shaped tooling bracket of the present invention;

[0047] Figure 6 It is a schematic diagram of the placement of the mounting ring of the present invention on the V-shaped tooling bracket;

[0048] Figure 7 It is a schematic diagram of the positions of the collimator and the transfer tooling of the present invention;

[0049] Figure 8 It is a schematic diagram of the structure of the first fixed bracket of the present invention after installing the matrix infrared detector;

[0050] Figure 9 It is a left view of the first fixed bracket of the present invention after installing the matrix infrared detector;

[0051] Figure 10 It is a top view of the first fixed bracket of the present invention;

[0052] Figure 11 It is a schematic diagram of the structure of the second fixed bracket of the present invention;

[0053] Figure 12 It is a schematic diagram of the structure of the matrix split airborne infrared camera of the present invention;

[0054] Figure 13 It is an internal structure diagram of the matrix split airborne infrared camera of the present invention;

[0055] Figure 14It is a schematic diagram showing the deviation of the cross target from the cross reticle at the center of the image when the area array infrared detector is radially moved to a position where it is half the distance from the cross reticle in both the horizontal and vertical directions with respect to the cross target.

[0056] The description of the reference numerals is as follows:

[0057] 1. First fixing bracket; 11. Vertical plate; 12. Horizontal plate; 13. First long hole; 14. Second long hole;

[0058] 2. Second fixing bracket; 21. Mounting seat; 22. First rotating shaft; 23. Second rotating shaft; 24. Frame; 25. Mounting hole; 26. Frame; 27. Connecting screw; 28. Ring groove; 29. Through hole;

[0059] 3. Base; 4. Infrared thermal imager; 5. Radome; 6. Pitch gimbal; 7. Mounting ring;

[0060] 8. V-shaped tooling bracket; 81. Bottom plate; 82. V-shaped plate; 83. Limiting groove;

[0061] 9. Transfer tooling; 91. Mounting frame; 92. Horizontal shaft; 93. Vertical rod; 94. Turntable;

[0062] 10. Collimator body; 15. Optical test stable platform; 16. Cross target; 17. 45° reflector; 18. Roll gimbal; 19. Image motion compensation reflector; 20. Area array infrared detector; 30. Bearing; 31. Lens; 32. Swing-scanning imaging optical path; 33. Servo control system. Detailed implementation manners

[0063] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0064] It should be noted that if there are directional indications (such as up, down, left, right, front, back,...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative position relationship and motion conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0065] In the present invention, unless otherwise clearly specified and defined, terms such as "connection" and "fixation" shall be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0066] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0067] The present invention provides an alignment adjustment mechanism for the swing axis and imaging optical axis of a planar array split-frame aerial infrared camera. By applying this mechanism, the alignment of the swing axis and imaging optical axis of the planar array split-frame aerial infrared camera can be achieved to meet ≤ 0.25 mrad, greatly improving the opto-mechanical performance of the aerial infrared camera and fully meeting the market demand.

[0068] Specifically, in an embodiment of the invention, the alignment adjustment mechanism for the swing axis and imaging optical axis of the planar array split-frame aerial infrared camera includes: a V-shaped tooling bracket 8, a collimator, a transfer tooling 9, a fixed bracket one 1, and a fixed bracket two 2. The V-shaped tooling bracket 8 is used to place the mounting ring 7 tightly sleeved on the infrared thermal imager 4 and allow the mounting ring 7 to rotate around its own axis; the transfer tooling 9 is used to carry the V-shaped tooling bracket 8 and the planar array split-frame aerial infrared camera, and adjust the azimuth and pitch positions of the V-shaped tooling bracket 8 and the planar array split-frame aerial infrared camera to make the crosshair of the infrared thermal imager 4 coincide with the cross target 16 of the collimator; the fixed bracket one 1 is fixedly arranged inside the infrared thermal imager 4 and is used to install the planar array infrared detector 20 and drive the planar array infrared detector 20 to move radially; the fixed bracket two 2 is rotatably installed inside the infrared thermal imager 4 and is used to install the lens 31, and adjust the pitch, azimuth of the lens 31 and drive the lens 31 to move radially, so as to ensure that the imaging quality of the infrared thermal imager 4 does not deteriorate due to the radial movement of the planar array infrared detector 20.

[0069] In this embodiment, as Figure 5 and Figure 6 shown, the V-shaped tooling bracket 8 includes a bottom plate 81 and a V-shaped plate 82 vertically fixed on the bottom plate 81. A limiting groove 83 is provided on the surface of the V-shaped plate 82 that contacts the mounting ring 7. After the mounting ring 7 tightly sleeved on the infrared thermal imager 4 is placed in the limiting groove 83 of the V-shaped plate 82, the mounting ring 7 is limited by the V-shaped plate 82 and cannot shake, but can only rotate around its own horizontal axis.

[0070] In this embodiment, as Figure 7 shown, the collimator includes an optical test stable platform 15 and a collimator main body 10 provided on the optical test stable platform 15. A cross target 16 is fixedly provided on the collimator main body 10.

[0071] In this embodiment, as Figure 7 shown, the transfer tooling 9 includes a mounting frame 91 and a horizontal axis 92 horizontally installed on the mounting frame 91. The horizontal axis 92 is rotatably connected to the mounting frame 91. A vertical rod 93 is fixedly provided on the horizontal axis 92. The upper end of the vertical rod 93 is rotatably installed with a turntable 94. The bottom plate 81 is fixedly installed on the turntable 94. The turntable 94 rotates around the horizontal axis 92 to adjust the pitching position of the infrared thermal imager 4 on the V-shaped tooling bracket 8, and the turntable 94 rotates around the vertical rod 93 to adjust the azimuth of the infrared thermal imager 4 on the V-shaped tooling bracket 8. By adjusting the pitching and azimuth of the infrared thermal imager 4 through the transfer tooling 9, the cross reticle of the infrared thermal imager 4 and the cross target 16 of the collimator are made to coincide.

[0072] In this embodiment, as Figures 8 - 10As shown, the first fixed bracket 1 includes a horizontal plate 12 and a vertical plate 11 that are vertically fixedly connected. A first long hole 13 is provided on the horizontal plate 12, and a second long hole 14 is provided on the vertical plate 11. The length directions of the first long hole 13 and the second long hole 14 are both perpendicular to the optical axis of the area array infrared detector 20. Bolts on the area array infrared detector 20 pass through the first long hole 13 and the second long hole 14 and are fixedly connected to the horizontal plate 12 and the vertical plate 11. By adjusting the position of the bolts in the first long hole 13, for example, moving the bolts along the length direction from one end to the other end in the first long hole 13 can drive the area array infrared detector 20 to move radially in the horizontal direction. The so-called radial movement of the area array infrared detector 20 in the horizontal direction means that the optical axis of the area array infrared detector 20 moves horizontally, and the moving direction is perpendicular to the optical axis. By changing the position of the bolts in the first long hole 13, the area array infrared detector 20 can be moved radially in the horizontal direction. Similarly, by changing the position of the bolts in the second long hole 14, the area array infrared detector 20 can be moved radially in the vertical direction. The so-called radial movement of the area array infrared detector 20 in the vertical direction means that the optical axis of the area array infrared detector 20 moves up and down, and the moving direction is perpendicular to the optical axis. In this way, by the cooperation of the bolts in the first long hole 13 and the second long hole 14, the optical axis of the area array infrared detector 20 can be moved radially in any direction. When the bolts are loosened, the positions of the bolts in the first long hole 13 and the second long hole 14 can be adjusted. After the area array infrared detector 20 is moved radially in place, the bolts can be tightened and fixed in the first long hole 13 and the second long hole 14.

[0073] In this embodiment, as Figure 11 shown, the second fixed bracket 2 includes: a mounting base 21, a frame 24, and a lens frame 26. The mounting base 21 is rotatably mounted in the infrared thermal imager 4 around a vertical axis. For example, Figure 11 shown, the mounting base 21 is rotatably connected to the infrared thermal imager 4 through a first rotating shaft 22. The first rotating shaft 22 is vertically arranged. With such a design, the orientation of the lens 31 can be adjusted by rotating the mounting base 21 around the first rotating shaft 22. The frame 24 is rotatably mounted on the mounting base 21 around a horizontal axis. For example, Figure 11 shown, two ends of the frame 24 are fixedly provided with second rotating shafts 23. The second rotating shafts 23 are rotatably connected to the mounting base 21. The second rotating shafts 23 are horizontally arranged. With such a design, the pitching position of the lens 31 can be adjusted by rotating the frame 24 around the second rotating shafts 23. An installation hole 25 is provided on the frame 24; an annular groove 28 is provided on the inner side surface of the lens frame 26 for installing the lens 31. The installation style of the lens 31 on the second fixed bracket 2 is as Figure 12 shown, in Figure 11Among them, a through hole 29 is provided on the frame 26, and the aperture of the through hole 29 is larger than that of the mounting hole 25. Preferably, the mounting hole 25 is a threaded hole. The frame 26 is fixedly connected to the frame 24 through a connecting screw 27. The connecting screw 27 passes through the through hole 29 and is inserted and fixedly connected to the mounting hole 25. Since the aperture of the through hole 29 is larger than the diameter of the connecting screw 27, when the connecting screw 27 becomes loose, the position of the frame 24 can be axially translated, that is, the radial movement of the lens 31 is realized. After the lens 31 is radially moved in place, the connecting screw 27 can be tightened and fixed.

[0074] In this embodiment, the structure of the area array split-frame airborne infrared camera is as Figure 12 and Figure 13 shown. Compared with the existing area array split-frame airborne infrared camera, a fixing bracket 1 and a fixing bracket 2 are added to the infrared thermal imager 4 in this embodiment of the area array split-frame airborne infrared camera. The position of the area array infrared detector 20 in the infrared thermal imager 4 is adjusted through the fixing bracket 1, and the position of the lens 31 in the infrared thermal imager 4 is adjusted through the fixing bracket 2, so as to accurately assemble and debug the lens 31, the area array infrared detector 20, and the mounting ring 7 in place, ensuring that the central axes of the three coincide.

[0075] Next, according to the above-mentioned area array split-frame airborne infrared camera swing scan axis and imaging optical axis coincidence debugging mechanism, the area array split-frame airborne infrared camera swing scan axis and imaging optical axis coincidence debugging method will be introduced in detail.

[0076] A method for debugging the coincidence of the swing scan axis and the imaging optical axis of an area array split-frame airborne infrared camera proposed by the present invention includes:

[0077] S1. Under the condition of ensuring the imaging quality of the infrared thermal imager 4, adjust the coincidence of the imaging optical axis of the infrared thermal imager 4 and the central axis of the mounting ring 7 to meet ≤ 0.25 mrad;

[0078] Specifically, step S1 includes:

[0079] S11. Adjust the crosshair of the infrared thermal imager 4 to coincide with the cross target 16 of the collimator. This step can be realized by means of a transfer tooling 9. As Figure 7 shown, after the mounting ring 7 on the infrared thermal imager 4 is placed on the V-shaped tooling bracket 8, the V-shaped tooling bracket 8 is fixed to the turntable 94, and then the transfer tooling 9 is used to adjust the azimuth and pitch of the infrared thermal imager 4 so that its crosshair coincides with the cross target 16 of the collimator;

[0080] S12. Rotate the mounting ring 7. This step can be realized by means of the V-shaped tooling bracket 8. After the mounting ring 7 is stably placed in the limit groove 83, the mounting ring 7 can be rotated automatically;

[0081] S13. If the coincidence of the imaging optical axis of the infrared thermal imager 4 and the central axis of the mounting ring 7 does not meet the requirement of ≤0.25 mrad, it indicates that there is a machining error in the mounting ring 7, and there is a large deviation in the coincidence of the imaging optical axis of the infrared thermal imager 4 and the central axis of the mounting ring 7. At this time, the cross target 16 will rotate with the rotation of the infrared thermal imager 4 and deviate from the cross reticle. Therefore, the following debugging needs to be continued:

[0082] S14. Radially move the area array infrared detector 20 until the cross target moves to half of the distance from the cross reticle in both the horizontal and vertical directions, as Figure 14 shown. This step can be achieved by radially translating the area array infrared detector 20 with the aid of the fixing bracket 1;

[0083] S15. After radially moving the area array infrared detector 20, the imaging quality of the infrared thermal imager 4 will surely decline. Therefore, further debugging is still needed: such as radially moving the lens 31 or adjusting the azimuth and pitch of the lens 31 until the entire full frame of the infrared image of the infrared thermal imager 4 can be clearly imaged, the radiation energy of the uniform background is uniform, and the image distortion is qualified. Only by operating like this can the imaging quality of the infrared thermal imager 4 be restored;

[0084] S16. After radially moving the area array infrared detector 20, the imaging optical axis of the infrared thermal imager 4 will move slightly. At this time, observe whether the coincidence of the imaging optical axis of the infrared thermal imager 4 and the central axis of the mounting ring 7 meets the requirement of ≤0.25 mrad. If it does not meet, repeat steps S11 - S15 until it meets. If the coincidence of the imaging optical axis of the infrared thermal imager 4 and the central axis of the mounting ring 7 meets the requirement of ≤0.25 mrad, then the infrared thermal imager 4 and the mounting ring 7 are assembled and debugged in place, and subsequent assembly and debugging can be carried out next.

[0085] S2. Install the infrared thermal imager 4 into the roll gimbal 18, control the roll gimbal 18 to rotate self - driven to drive the infrared thermal imager 4 to swing scan, and adjust the coincidence of the imaging optical axis of the infrared thermal imager 4 and the swing scan axis of the roll gimbal 18 to meet the requirement of ≤0.25 mrad;

[0086] Specifically, step S2 includes:

[0087] S21. Install the infrared thermal imager 4 into the roll gimbal 18, then install the roll gimbal 18 onto the base 3, and finally fix the base 3 to the turntable 94. With the aid of the transfer tooling 9, adjust the azimuth and pitch of the area array split - frame airborne infrared camera so that the cross reticle of its infrared thermal imager 4 coincides with the cross target 16 of the collimator; Figure 7 in;

[0088] S22. Control the roll gimbal 18 to rotate self - driven to drive the infrared thermal imager 4 to swing scan. This step can be achieved by controlling the servo control system 33, as Figure 12 andFigure 13 As shown, the servo control system 33 is an important structural component within the existing area array split-frame airborne infrared camera. The function of the servo control system 33 is to control the roll gimbal 18 and the pitch gimbal 6 to rotate or swing-scan, and the swing-scan angle is usually 180°;

[0089] S23. As Figure 12 and Figure 13 shown, a bearing 30 is sleeved outside the roll gimbal 18. The roll gimbal 18 is rotationally installed in the base 3 through the bearing 30, and then the servo control system 33 fixedly installed in the base 3 drives the roll gimbal 18 to rotate or swing-scan. When there are machining errors in the bearing 30, it will seriously affect the coincidence degree between the imaging optical axis of the infrared thermal imager 4 and the swing-scan axis of the roll gimbal 18. Therefore, if the coincidence of the imaging optical axis of the infrared thermal imager 4 and the swing-scan axis of the roll gimbal 18 does not meet ≤0.25 mrad, the following debugging needs to be continued:

[0090] S24. Radially move the area array infrared detector 20 until the cross target moves to half the distance from the cross reticle in both the horizontal and vertical directions, as Figure 14 shown. This step can be achieved by radially translating the area array infrared detector 20 with the aid of the fixed bracket 1. Since this step only slightly adjusts the state of the area array infrared detector 20, it will not affect the image quality, so there is no need to radially move the lens 31 or adjust the azimuth and pitch of the lens 31;

[0091] S25. Observe whether the coincidence of the imaging optical axis of the infrared thermal imager 4 and the swing-scan axis of the roll gimbal 18 meets ≤0.25 mrad. If not, repeat steps S21 - S24 until it is satisfied. If the coincidence of the imaging optical axis of the infrared thermal imager 4 and the swing-scan axis of the roll gimbal 18 meets ≤0.25 mrad, the infrared thermal imager 4 and the roll gimbal 18 are assembled and debugged in place, and then the subsequent assembly and debugging can be carried out.

[0092] S3. Install the pitch gimbal 6 and the 45° mirror 17, and adjust the reflecting surface of the 45° mirror 17 to form a 45° angle with the imaging optical axis of the infrared thermal imager 4. This step can control the pitch gimbal 6 to rotate to adjust the position of the 45° mirror 17 through the servo control system 33.

[0093] In this embodiment, after the position of the 45° mirror 17 is adjusted in place, as Figure 12 and Figure 13 shown, then install the fairing 5 in place to complete the assembly and debugging operation of the area array split-frame airborne infrared camera. The coincidence of the swing-scan axis and the imaging optical axis of the assembled area array split-frame airborne infrared camera is improved to ≤0.25 mrad, greatly improving the opto-mechanical performance of the airborne infrared camera and fully meeting the market demand.

[0094] In this embodiment, the image motion compensation mirror 19 in the infrared thermal imager 4 has been installed in the infrared thermal imager 4 before step S1 is performed.

[0095] Furthermore, in this embodiment, the method for debugging the coincidence of the swing scan axis and the imaging optical axis of the area array split-frame airborne infrared camera further includes verifying the assembly and debugging results of the unit after the area array split-frame airborne infrared camera is assembled and debugged. If the verification result does not meet the standard, the cause is further searched for and solved, or the assembly and debugging are carried out again.

[0096] Specifically, the verification method is as follows:

[0097] Install the area array split-frame airborne infrared camera on the transfer tooling 9 and place it horizontally in front of the collimator. Adjust the orientation and pitch of the area array split-frame airborne infrared camera with the help of the transfer tooling 9 so that the area array split-frame airborne infrared camera can clearly see the cross target 16 in the collimator through the 45° mirror 17.

[0098] Turn on the swing scan mode of the area array split-frame airborne infrared camera. The 45° mirror 17 is in the static control initial zero position, and the image motion compensation mirror 19 inside the infrared thermal imager 4 is in the image motion compensation dynamic working state. Check whether the area array split-frame airborne infrared camera can clearly capture the cross target 16 in the collimator in the swing scan mode. If it is not clear, the cause needs to be searched for and further debugged.

[0099] In addition, in other embodiments, the verification method may also be as follows:

[0100] Erect the area array split-frame airborne infrared camera and perform horizontal swing scan photography of the outdoor scene;

[0101] After preparation, turn on the swing scan mode of the area array split-frame airborne infrared camera. The 45° mirror 17 is in the static control initial zero position, and the image motion compensation mirror 19 inside the infrared thermal imager 4 is in the image motion compensation dynamic working state. Check whether the area array split-frame airborne infrared camera can clearly record the scene within the swing scan angle without omission, and check whether the captured scene pictures meet the design requirements, such as image clarity, image distortion, etc. If they do not meet the requirements, the cause needs to be searched for and further debugged.

[0102] The area array split-frame airborne infrared camera in this embodiment includes an area array split-frame airborne long-wave infrared camera and an area array split-frame airborne dual-band (mid / long-wave) infrared camera.

[0103] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A debugging mechanism for the coincidence of the swing scan axis and the imaging optical axis of a matrix-divided aerial infrared camera, characterized in that, Comprising: A V-shaped tooling bracket for placing an installation ring tightly sleeved on an infrared thermal imager and allowing the installation ring to rotate around its own axis; A collimator; A transfer tooling for carrying the V-shaped tooling bracket and a matrix frame type airborne infrared camera, and adjusting the azimuth and pitch positions of the V-shaped tooling bracket and the matrix frame type airborne infrared camera to make the crosshair of the infrared thermal imager coincide with the cross target of the collimator; A first fixing bracket fixedly arranged inside the infrared thermal imager for installing a matrix infrared detector and driving the matrix infrared detector to move radially; A second fixing bracket rotatably installed inside the infrared thermal imager for installing a lens and adjusting the pitch, azimuth of the lens and driving the lens to move radially; The V-shaped tooling bracket includes a bottom plate and a V-shaped plate vertically fixed on the bottom plate, and a limiting groove is arranged on the surface of the V-shaped plate in contact with the installation ring; The collimator includes an optical test stable platform and a collimator main body arranged on the optical test stable platform; The transfer tooling includes an installation frame and a horizontal axis installed on the installation frame, the horizontal axis is rotatably connected with the installation frame, a vertical rod is fixedly arranged on the horizontal axis, and a turntable is rotatably installed at the upper end of the vertical rod; The first fixing bracket includes a horizontal plate and a vertical plate vertically connected, a long hole one is arranged on the horizontal plate, a long hole two is arranged on the vertical plate, and the length directions of the long hole one and the long hole two are both perpendicular to the optical axis of the matrix infrared detector; The second fixing bracket includes: A mounting seat rotatably installed inside the infrared thermal imager around a vertical axis; A frame rotatably installed on the mounting seat around a horizontal axis, and an installation hole is arranged on the frame; A lens frame, a lens is installed inside the lens frame, a through hole is arranged on the lens frame, the aperture of the through hole is larger than the aperture of the installation hole, the lens frame is fixedly connected with the frame through a connecting screw, and the connecting screw penetrates through the through hole and is inserted and fixedly connected with the installation hole.

2. A debugging method for a debugging mechanism of the coincidence of the swing scan axis and the imaging optical axis of a planar array split-frame aerial infrared camera, characterized in that, Comprising: S1. Under the condition of ensuring the imaging quality of the infrared thermal imager, adjust the coincidence of the imaging optical axis of the infrared thermal imager and the central axis of the installation ring to meet ≤0.25 mrad; S2. Install the infrared thermal imager into a roll gimbal, control the roll gimbal to rotate self to drive the infrared thermal imager to swing scan, and adjust the coincidence of the imaging optical axis of the infrared thermal imager and the swing scan axis of the roll gimbal to meet ≤0.25 mrad; S3. Install a pitch gimbal and a 45° reflector, and adjust the reflecting surface of the 45° reflector to form a 45° angle with the imaging optical axis of the infrared thermal imager; The step S1 includes: S11. Adjust the crosshair of the infrared thermal imager to coincide with the cross target of the collimator; S12. Make the installation ring rotate self; S13. If the coincidence of the imaging optical axis of the infrared thermal imager and the central axis of the installation ring does not meet ≤0.25 mrad, then: S14. Radially move the matrix infrared detector until the cross target moves to a distance half of that from the crosshair in both the horizontal and vertical directions; S15. Radially move the lens until the infrared image of the infrared thermal imager can be clearly imaged in the full frame, the radiation energy of the uniform background is uniform, and the image distortion is qualified; S16. Observe whether the coincidence of the imaging optical axis of the infrared thermal imager and the central axis of the mounting ring meets ≤0.25 mrad. If not, repeat steps S11 - S15 until it is satisfied; The said step S2 includes: S21. Install the infrared thermal imager into the roll gimbal; S22. Control the roll gimbal to rotate self - driven to drive the infrared thermal imager to swing - scan; S23. If the coincidence of the imaging optical axis of the infrared thermal imager and the swing - scan axis of the roll gimbal does not meet ≤0.25 mrad, then: S24. Radially move the area array infrared detector until the cross - target moves to a distance half of that from the cross - reticle in both the horizontal and vertical directions; S25. Observe whether the coincidence of the imaging optical axis of the infrared thermal imager and the swing - scan axis of the roll gimbal meets ≤0.25 mrad. If not, repeat steps S21 - S24 until it is satisfied.

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