Systems and devices for valve assemblies

By designing a valve assembly with a thermocouple, the problem of inaccurate heating and temperature monitoring in traditional systems was solved, enabling precise control and uniform heating of chemical substances in the semiconductor manufacturing process, thereby improving the quality and efficiency of semiconductor manufacturing.

CN116104963BActive Publication Date: 2025-11-14ASM IP HLDG BV
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Patent Information

Application Number
CN202211383997.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-11-10
Filing Date
2022-11-07
Publication Date
2025-11-14
Estimated Expiration
2042-11-07

AI Technical Summary

Technical Problem

Traditional systems cannot effectively heat and accurately monitor the temperature of chemical flow paths during semiconductor device manufacturing, especially in areas far from the heat source.

Method used

A valve assembly was designed, including a body, a closing mechanism, an actuator, a nut, and a thermocouple, which fixes a temperature sensor via a threaded connection to achieve precise monitoring and control of the temperature of chemical substances.

Benefits of technology

It enables precise temperature monitoring and regulation of the chemical substance flow path, ensuring temperature uniformity throughout the flow path and improving the quality and efficiency of semiconductor manufacturing.

✦ Generated by Eureka AI based on patent content.

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Abstract

A valve assembly may provide a body including a bottom and a top having a threaded region, a closing mechanism located above the top of the body, an actuator communicating with the closing mechanism, a nut configured to be attached to the threaded region, and a threaded hole extending to at least one of the bottom of the body or the nut.
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Description

Technical Field

[0001] This disclosure generally relates to systems and apparatus for valve assemblies. More specifically, this disclosure relates to systems and valve assemblies used during the manufacture of semiconductor devices. Background Technology

[0002] In the manufacturing process of semiconductor devices, valve assemblies are used to control the flow of various chemicals (such as liquids and gases) through piping systems. During manufacturing, the temperature of the chemicals flowing through the piping systems and valve assemblies can be regulated. For example, chemicals flowing through the piping systems and valve assemblies may be heated to specific temperatures, and precise monitoring of the chemical temperature may be necessary to achieve optimal semiconductor device structure. Conventional systems provide various temperature monitoring and heating devices throughout the chemical flow path, which work together to achieve the desired temperature. However, heating devices may not effectively heat parts of the chemical flow path, and temperature monitoring devices may not accurately detect the temperature of parts of the flow path, such as those extending away from the heating source. Therefore, some sections of the flow path may have little or no temperature regulation. Summary of the Invention

[0003] A valve assembly may provide a body including a bottom and a top having a threaded region, a closing mechanism located above the top of the body, an actuator communicating with the closing mechanism, a nut configured to be attached to the threaded region, and a threaded hole extending into at least one of the bottom of the body or the nut. Attached Figure Description

[0004] These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate rather than limit the invention.

[0005] Figure 1 A perspective view of a valve assembly according to an exemplary embodiment of the present technology is shown representatively;

[0006] Figure 2 This is a side view of a valve assembly according to an exemplary embodiment of the present technology;

[0007] Figure 3 This is a cross-sectional view of a portion of a valve assembly according to an exemplary embodiment of the present technology; and

[0008] Figure 4 A partial view of an example of a semiconductor processing system according to this disclosure is shown.

[0009] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the relative dimensions of some elements in the drawings may be exaggerated relative to other elements to aid in understanding the embodiments illustrated in this disclosure. Detailed Implementation

[0010] Reference will now be made to the accompanying drawings, wherein like reference numerals denote similar structural features or aspects of the subject matter disclosed. For purposes of explanation and illustration, and not limitation, partial views of an example semiconductor processing system according to this disclosure are shown in [the drawings / illustrations]. Figure 4 As shown in the figure, and usually indicated by reference numeral 400. Figure 1-3 Other examples or aspects thereof of semiconductor processing systems according to this disclosure are provided and will be described. The systems and methods of this disclosure can be used to control the flow of chemicals through a flow path and monitor the temperature of chemicals in the flow path during semiconductor processing, although this disclosure is not limited to use in semiconductor processing.

[0011] The following description of exemplary embodiments is merely illustrative and for purposes of explanation only; it is not intended to limit the scope of this disclosure or the claims. Furthermore, the description of multiple embodiments having the described features is not intended to exclude other embodiments having additional features or other embodiments including different combinations of the described features.

[0012] This invention generally relates to valve assemblies for controlling the flow of chemical substances. Furthermore, some aspects of this technology typically involve configuring valve assemblies for more precise temperature monitoring.

[0013] refer to Figure 4 System 400 may include a container 405 containing a chemical substance (such as a liquid or gas). System 400 may further include a piping system 410 connecting container 405 to reaction chamber 415. Piping system 410 may be configured to allow the chemical substance to flow from container 405 to reaction chamber 415. Piping system 410 may include valve assembly 100 to control the flow of the chemical substance from container 405 to reaction chamber 415.

[0014] In various embodiments, system 400 may further include a temperature control system configured to monitor the temperature of chemicals throughout system 400 and heat piping system 410. For example, the temperature control system may include a heat source (not shown), such as a heating jacket configured to surround the exterior of piping system 410 and / or container 405 to heat piping system 410 and / or container 405.

[0015] In various embodiments, the temperature control system may further include a temperature sensor, such as a thermocouple, configured to measure the temperature of a chemical substance in the piping system 410. The temperature sensor can generate a sensor signal corresponding to the temperature of the chemical substance in the piping system 410. For example, in an exemplary embodiment, system 400 may include a first thermocouple 425 for measuring the temperature of the chemical substance at a first location along the flow path of the chemical substance, and a second thermocouple 420 for measuring the temperature of the chemical substance at a second location along the flow path of the chemical substance. In this case, each thermocouple 420, 425 can generate an independent sensor signal corresponding to a specific attachment location of the thermocouple. The temperature control system may further include a processor 430 or other suitable control system configured to receive the sensor signals and respond to the sensor signals by increasing / decreasing the temperature of a heating source to achieve a desired temperature of the chemical substance in the piping system 410.

[0016] In various embodiments, valve assembly 100 may be configured to open and close according to an electrical signal or by a mechanical mechanism. For example, valve assembly 100 may include a pneumatically controlled valve, a solenoidally controlled valve, or any suitable valve control type. Furthermore, valve assembly 100 may include a diaphragm valve, a plug valve, a needle valve, etc. A specific valve type may be selected based on a specific application and / or system. For example, based on valve specifications such as flow rate, rated temperature, rated pressure, etc., a particular valve may be more suitable for a specific application.

[0017] In various embodiments, references Figure 1-3 The valve assembly 100 may include a body 125 adapted for mounting to the surface of an object (such as reaction chamber 415). The body 125 may be formed of any suitable material, such as aluminum, stainless steel, etc. In various embodiments, the body 125 may include a bottom 305 and a top 310, with the top 310 located directly above the bottom 305. In an exemplary embodiment, the top 310 of the body 125 may include an externally threaded region 320 (i.e., an externally threaded connection). Furthermore, the body 125 may include mounting holes (not shown) on the bottom surface 315 for attaching or otherwise securing the valve assembly 100 to the surface of the object.

[0018] In various embodiments, valve assembly 100 may further include a first conduit 115 and a second conduit 120. The first conduit 115 may be an inlet conduit, and the second conduit 120 may be an outlet conduit. For example, a chemical substance may enter valve assembly 100 through the first conduit 115 and exit valve assembly 100 through the second conduit 120.

[0019] In an exemplary embodiment, the first conduit 115 extends into the bottom 305 and upwards into the top 310. Similarly, the second conduit 120 extends into the bottom 305 and upwards into the top 310. For example, the first conduit 115 may be arranged to extend to a first side of the bottom 305 of the body 125, and the second conduit 120 may be arranged to extend to a second side of the bottom 305 of the body 125 opposite to the first side.

[0020] In various embodiments, the valve assembly 100 may further include a first hole 230. The first hole 230 may be located in the bottom 305 of the body 125 and directly above the first conduit 115. In various embodiments, the first hole 230 may be spaced apart from the first conduit 115 at a distance that prevents the thermocouple from penetrating the wall of the first hole 230. For example, the first hole 230 may be spaced about 1 mm apart from the first conduit 115. However, in other cases, the first hole 230 may be spaced about 0.5 mm apart from the first conduit 115, or any feasible distance. In various embodiments, the first hole 230 may include a threaded inner surface (i.e., an internal threaded connection). The threaded inner surface can be used to secure or otherwise attach the first thermocouple 425 or other suitable temperature sensor to the valve assembly 100. For example, the first thermocouple 425 may include a threaded connection (e.g., an external threaded connection) adapted to mate with the first hole 230.

[0021] In an exemplary embodiment, the first orifice 230 may have any suitable diameter that does not interfere with the first conduit 115. Therefore, the first orifice 230 may have any diameter size based on the overall dimensions of the body 125 and / or the specific valve type of the valve assembly. For example, the diameter of the first orifice 230 may range from about 1 mm to about 6 mm.

[0022] In an exemplary embodiment, the first hole 230 may have any suitable depth so as not to interfere with or penetrate the first conduit 115. Therefore, the first hole 230 may have a depth based on the overall dimensions of the body 125 and / or the specific valve type of the valve assembly. For example, the depth of the first hole 230 may range from about 1 mm to about 6 mm.

[0023] In various embodiments, valve assembly 100 may further include actuator 105 that communicates with and is configured to operate (open / close) mechanism 300 (i.e., opening / closing mechanism). Mechanism 300 may be configured to open and close the flow path between first conduit 115 and second conduit 120. As described above, actuator 105 may be electrically or mechanically controlled depending on the control method of the valve assembly. Furthermore, mechanism 300 may include a diaphragm, plug, needle, etc., and may be based on a desired valve type.

[0024] In various embodiments, mechanism 300 may be located at or above the top 310 of body 125. For example, see reference... Figure 3 The mechanism 300 (in this case, a diaphragm) is horizontally located on the top surface of the body 125 and positioned to extend through the opening of the first conduit 115 and the opening of the second conduit 120. Thus, the actuator 105 can raise the diaphragm to open the flow path between the first conduit 115 and the second conduit 120 and lower the diaphragm to close the flow path between the first conduit 115 and the second conduit 120.

[0025] In an alternative embodiment, mechanism 300 may be located within body 125. For example, in the case of a needle valve or plug valve.

[0026] In various embodiments, the valve assembly may further include a nut 110 configured to secure the mechanism 300 and / or actuator 105 to the body 125. In various embodiments, the nut 110 may include a top plate 325 and a side member 330 extending downward from the top plate 325. The top plate 325 may be parallel to the top surface of the body 125. In an exemplary embodiment, the side member may include an internally threaded region (i.e., an internally threaded connection) configured to be threaded onto an externally threaded region 320 of the top 310 of the body 125.

[0027] In various embodiments, the nut 110 may further include a second hole 130. In various embodiments, the second hole 130 may be located near the mechanism 300. For example, the second hole 130 may be separated from the mechanism 300 at any suitable distance so as not to interfere with the mechanism 300, the threaded region 320, and / or the nut 110. Therefore, the distance separating the second hole 130 from the mechanism may be based on the overall dimensions of the body 125 and / or the specific valve type of the valve assembly. For example, the second hole 130 may be separated from the mechanism by approximately 1 mm. In various embodiments, the second hole 130 may include a threaded inner surface (i.e., an internal threaded connection). The threaded inner surface of the second hole 130 may be used to secure or otherwise attach a second thermocouple 420 or other suitable temperature sensor to the valve assembly 100. For example, the second thermocouple 420 may include a threaded connection (e.g., an external threaded connection) adapted to mate with the second hole 130.

[0028] In an exemplary embodiment, the second hole 130 may have a diameter ranging from about 1 mm to about 6 mm. However, in other embodiments, the second hole 130 may have any diameter size based on the overall size of the nut 110 and / or the specific valve type and design of the valve assembly.

[0029] In an exemplary embodiment, the second hole 130 may have a depth ranging from about 1 mm to about 6 mm. However, in other embodiments, the second hole 130 may have a depth based on the overall size of the nut 110 and / or the specific valve type and design of the valve assembly.

[0030] During operation, refer to Figure 1-4 System 400 can operate valve assembly 100 to allow chemicals to flow through it. For example, when valve assembly 100 is open, chemicals can flow from container 405 to reaction chamber 415 through first and second conduits 120. Furthermore, chemicals can flow through multiple other valves and / or conduits in the flow path from container 405 to reaction chamber 415.

[0031] During operation, the first thermocouple 425 and / or the second thermocouple 420 can periodically (e.g., every 2, 3, 4 seconds, etc.) or continuously measure the temperature of the chemical substance in the valve assembly 100. The first thermocouple 425 and / or the second thermocouple 420 can measure the temperature of the chemical substance when the valve assembly 100 is open or closed. The first thermocouple 425 and / or the second thermocouple 420 can generate a sensor signal and transmit this sensor signal to the processor 430. The processor 430 can analyze the sensor signal and generate a control signal in response to the temperature signal to operate the heating source. For example, the processor 430 can determine that the temperature measured by the thermocouple (e.g., the first thermocouple 425) is undesirable (i.e., too high or too low). In response, the processor 430 can generate a control signal to increase the temperature of the heating source (if the measured temperature is too low) or decrease the temperature of the heating source (if the measured temperature is too high).

[0032] Although this disclosure has been provided with reference to certain embodiments and examples, those skilled in the art will understand that this disclosure extends to other alternative embodiments and / or uses of embodiments beyond those specifically described, as well as their obvious modifications and equivalents. Furthermore, while various variations of embodiments of this disclosure have been shown and described in detail, other modifications based on this disclosure will be apparent to those skilled in the art. It is also contemplated that various combinations or sub-combinations of specific features and aspects of the embodiments are possible and still fall within the scope of this disclosure. It should be understood that various features and aspects of the disclosed embodiments can be combined or substituted with each other to form different modes of embodiments of this disclosure. Therefore, the scope of this disclosure should not be limited to the specific embodiments described above.

Claims

1. A valve assembly, comprising: The main body includes: The bottom, which includes the bottom surface; and The top, which includes: The top surface opposite the bottom surface; and The first threaded region is arranged between the bottom surface and the top surface; The closing mechanism is located on the top surface of the body and adjacent to the first threaded area; An actuator connected to the closing mechanism; The first conduit extends through the main body to the closing mechanism; A second conduit extends through the main body to the closing mechanism, wherein the first and second conduits form a flow path; A first hole, located at the bottom of the main body and separate from the first pipe, without penetrating the first pipe, and a first temperature sensor connected to the first hole; and A nut, configured to secure a closing mechanism and / or actuator to the body, and comprising: The inner surface includes a second threaded region configured to attach to the first threaded region; The outer surface opposite the inner surface; and A first threaded hole extends from the outer surface toward the inner surface, wherein the first threaded hole is adjacent to the closing mechanism and connected to a second temperature sensor.

2. The valve assembly according to claim 1, wherein, The bottom of the main body includes a first vertical sidewall and a second vertical sidewall opposite to the first sidewall.

3. The valve assembly according to claim 2, wherein, The first pipe passes through the first vertical sidewall at the bottom of the body and extends toward the top.

4. The valve assembly according to claim 2, wherein, The second pipe passes through the second vertical sidewall at the bottom of the body and extends toward the top.

5. The valve assembly according to claim 1, wherein, The first hole is located at a distance of 1 mm to 6 mm from the first pipe.

6. The valve assembly according to claim 1, wherein, The first threaded hole is located at a distance of 1 mm to 6 mm from the closing mechanism.

7. The valve assembly according to claim 1, wherein, The nut also includes a top plate parallel to the closing mechanism and a side member extending downward from the top plate and perpendicular to the top plate.

8. The valve assembly according to claim 7, wherein, The first threaded hole is located in the top plate.

9. The valve assembly according to claim 7, wherein, The first threaded hole is located in the side member.

10. A valve assembly, comprising: The main body includes: bottom; and Includes the top of the threaded area, where the top is above the bottom; The flow path extends through the bottom and top; A first hole is located at the bottom of the main body and is separate from the flow path, and does not penetrate the flow path; a first temperature sensor is connected to the first hole. Closing mechanism within the flow path; An actuator connected to the closing mechanism; A nut, configured to attach to a threaded area, to secure the closing mechanism and / or actuator to the body; and A first threaded hole extends into the nut and connects to a second temperature sensor.

11. The valve assembly of claim 10, wherein, The nut includes a top plate parallel to the closing mechanism and a side member extending downward from the top plate and perpendicular to the top plate.

12. The valve assembly of claim 11, wherein, The first threaded hole is located in the top plate of the nut.

13. The valve assembly of claim 11, wherein, The first threaded hole is located in the side member.

14. The valve assembly of claim 10, further comprising a conduit extending through the bottom of the body and into the top of the body.

15. A system comprising: Valve assembly, comprising: The main body includes the first threaded region; The flow path extends through the main body; A first orifice is located in the body and separate from the flow path, and does not penetrate the flow path; a first temperature sensor is connected to the first orifice. Closing mechanism within the flow path; An actuator connected to the closing mechanism; A nut, comprising a second threaded region configured to attach to a first threaded region to secure a closing mechanism and / or actuator to the body; and The threaded hole extends into the nut; and A second temperature sensor is connected to the threaded hole.

16. The system according to claim 15, wherein, The threaded hole is located near the closing mechanism.

17. The system according to claim 15, wherein, The diameter of the threaded hole is in the range of 1 mm to 6 mm, and the depth is in the range of 1 mm to 6 mm.

Citation Information

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