Integrated high current secondary protection module

Abstract

The application relates to an integrated large-current secondary protection module, which comprises a microcontroller circuit, a fuse blowing driving circuit, a high-side end power supply conversion circuit, a low-side end power supply conversion circuit, a three-terminal fuse set and an alarm driving circuit; the microcontroller circuit is connected with the high-side end power supply conversion circuit, the low-side end power supply conversion circuit and the fuse blowing driving circuit; the fuse blowing driving circuit is connected with the three-terminal fuse set, the alarm driving circuit and the low-side end power supply conversion circuit; the large-current secondary protection module integrates the microcontroller circuit, the fuse blowing driving circuit, the high-side end power supply conversion circuit, the low-side end power supply conversion circuit, the three-terminal fuse set and the alarm driving circuit together, and the module is connected with a battery pack through special pins. The application realizes large-current secondary protection of the battery pack, realizes modularization, and has the advantages of simple structure and high safety.

Description

Technical Field

[0001] This invention relates to an integrated high-current secondary protection module, belonging to the field of battery safety protection, and is the first to use a high-current integrated method in a power supply. Background Technology

[0002] With the development of battery power supplies, high-current battery packs are being used more and more widely in various fields, including electric vehicles, electric motorcycles, AGVs, golf carts, logistics vehicles, forklifts, and energy storage equipment. The safety requirements for battery packs are also becoming increasingly stringent. Therefore, the design process must consider using more levels of secondary protection to improve battery safety.

[0003] Currently, the industry standard for multi-level protection circuit design of high-current battery packs generally employs a conventional design where primary protection is combined with ordinary fuses for secondary protection. Another approach involves using dedicated secondary protection chips. However, due to limitations in secondary protection selection, the voltage and delay time can only be fixed values, resulting in significant design limitations and making it unsuitable as a high-current secondary protection solution. Different parameters can lead to overcharging, posing a substantial safety risk. Battery packs are becoming increasingly widespread due to their convenient and environmentally friendly power source. However, with the extensive application of power batteries and battery packs in daily work and life, safety has become paramount. Summary of the Invention

[0004] The purpose of this invention is to provide an integrated high-current secondary protection module. Through optimized design, it reduces application limitations for customers and can be easily used on both high and low power supply sides. It also provides functions such as temperature, total voltage, and external interruption control. Moreover, the integrated module can be easily added to existing battery packs, improving the safety and reliability of the battery management system.

[0005] The objective of this invention is achieved through the following solution: an integrated high-current secondary protection module, comprising a microcontroller circuit, a fuse blowing drive circuit, a high-side power supply conversion circuit, a low-side power supply conversion circuit, a three-terminal fuse set, and an alarm drive circuit. The microcontroller circuit is connected to the high-side power supply conversion circuit, the low-side power supply conversion circuit, and the fuse blowing drive circuit. The fuse blowing drive circuit is connected to the three-terminal fuse set, the alarm drive circuit, and the low-side power supply conversion circuit. The high-current secondary protection module integrates the microcontroller circuit, the fuse blowing drive circuit, the high-side power supply conversion circuit, the low-side power supply conversion circuit, the three-terminal fuse set, and the alarm drive circuit. The module is connected to the battery pack via dedicated pins.

[0006] Furthermore, the microcontroller circuit is connected to the INI pin; the microcontroller circuit is connected to the RT1, RT2, and GND pins; the high-side power supply conversion circuit is connected to the microcontroller circuit, the IN pin, and the three-terminal fuse set; the low-side power supply conversion circuit is connected to the LIN pin, the microcontroller circuit, and the fuse blowing drive circuit; the fuse blowing drive circuit is connected to the microcontroller circuit, the low-side power supply conversion circuit, the three-terminal fuse set, and the alarm drive circuit; the three-terminal fuse set is connected to the IN pin, the OUT pin, the fuse blowing drive circuit, and the high-side power supply conversion circuit; the alarm drive circuit is connected to the fuse blowing drive circuit and the LOUT pin.

[0007] This invention provides an integrated high-current secondary protection module, offering functions such as voltage, temperature, external interrupt, and external output indication. The module provides two temperature detection channels, one external interrupt channel, and one fault output indication channel. Temperature definitions and voltage thresholds can be modified via communication through the central port and the two temperature ports, facilitating different parameters for different customers and achieving safe protection for the battery pack. When a battery voltage or temperature fault occurs, the microcontroller circuit outputs a protection signal to the fuse blowing drive circuit. The fuse blowing drive circuit processes the signal and triggers the three-terminal fuse set to operate. The three-terminal fuse set internally heats up and melts the main circuit, triggering charge / discharge protection.

[0008] Based on the above scheme, the microcontroller circuit is connected to the fuse blowing drive circuit, the high-side power supply conversion circuit, and the low-side power supply conversion circuit to realize functions such as voltage detection, temperature detection, external interrupt control, and fault control signal output. The fuse blowing drive circuit is connected to the microcontroller circuit, the low-side power supply conversion circuit, the alarm drive circuit, and the three-terminal fuse set to realize fault signal delay processing and output drive signals to the three-terminal fuse set and the alarm drive circuit. The low-side power supply conversion circuit is connected to the microcontroller circuit and the fuse blowing drive circuit to realize power supply to the microcontroller circuit and the fuse blowing drive circuit. The high-side power supply conversion circuit is connected to the microcontroller circuit and the three-terminal fuse set to realize power supply to the microcontroller circuit and the three-terminal fuse set. The alarm drive circuit is connected to the fuse blowing drive circuit to realize the external output of fault signals for fault indication purposes. The microcontroller circuit is connected to the INI port, RT1 port, RT2 port, and GND port to realize temperature detection, modification of different temperature and voltage thresholds, and external interrupt signal control.

[0009] Furthermore, by connecting the microcontroller circuit with the high-side power supply conversion circuit and the low-side power supply conversion circuit, the module can supply power to the microcontroller circuit and the fuse blowing drive circuit from either the high-side or low-side.

[0010] The principle of this invention is as follows: A microcontroller circuit samples and detects the temperature and voltage provided by the INI port, RT1 port, RT2 port, and the high-side and low-side power supply conversion circuits. Based on a preset protection threshold, it outputs a fault control signal. The signal is then sent to a fuse blowing drive circuit, which delays the signal. The delay time can be preset as needed. The delayed signal is then output to a three-terminal fuse set, triggering the fuse set to blow. This disconnects the main circuit of the battery pack, disconnecting the battery pack from the outside environment and preventing charging and discharging, thus protecting the battery pack. Simultaneously, the delayed signal is also output to an alarm drive circuit. The alarm drive circuit has an isolated output function, outputting a signal to the Lout port. The Lout port can be connected to external alarm devices such as LEDs and buzzers.

[0011] The integrated high-current secondary protection module of the present invention can be used in various types of batteries and battery packs.

[0012] Based on the above solution, the integrated high-current secondary protection module is not limited to secondary protection applications, but can also be installed and configured outside of existing secondary protection systems.

[0013] The microcontroller circuit includes an MCU circuit, a voltage regulator circuit, and an ESD surge protection circuit.

[0014] Based on the above scheme, the three-terminal fuse set uses multiple high-current three-terminal fuses connected in parallel.

[0015] The low-side power supply conversion circuit includes a voltage regulation circuit, a high-low voltage conversion circuit, and a surge protection circuit.

[0016] The high-side power supply conversion circuit includes a voltage regulation circuit, a high-low voltage conversion circuit, and a surge protection circuit.

[0017] The high-side power supply conversion circuit is installed at the positive terminal of the battery pack and provides power to the microcontroller circuit. At this time, the low-side power supply conversion circuit is in the off state.

[0018] The low-side power supply conversion circuit is installed at the negative terminal of the battery pack and provides power to the microcontroller circuit. At this time, the high-side power supply conversion circuit is in the off state. The monitoring voltage, temperature and other parameters can be adjusted according to market demand, and the delay time and recovery time can also be adjusted accordingly.

[0019] This invention provides dual safety protection for the battery pack. The system adopts a modular design, which can be easily combined according to the actual needs of customers, saving costs and facilitating assembly, maintenance and replacement by operators. Attached Figure Description

[0020] To more clearly illustrate the technical solution of the present invention, further explanation is provided below with reference to the accompanying drawings.

[0021] Figure 1 This is a schematic diagram of the logic block of an integrated high-current secondary protection module according to the present invention;

[0022] Figure 2 This is a front view of module structure 1;

[0023] Figure 3 This is a front view of module structure 2;

[0024] Figure 4 This is a schematic diagram of the back of module structure 1;

[0025] Figure 5 This is a fuse blow-driving circuit;

[0026] Figure 6 For high-side power supply conversion circuit and low-side power supply conversion circuit;

[0027] Figure 7 For alarm drive circuit;

[0028] Figure 8 This is a block diagram of a microcontroller circuit.

[0029] Figure 9 It is a set of three-terminal fuses;

[0030] Figure 10 Main program flow;

[0031] Explanation of the labels in the diagram:

[0032] 1—Microcontroller circuit; 2—High-side power supply conversion circuit;

[0033] 3—Fuse blowing drive circuit; 4—Low-side power supply conversion circuit;

[0034] 5—Three-terminal fuse set; 6—Alarm drive circuit;

[0035] 7 – Copper strip; 8 – Input / output fastener gasket;

[0036] 9—Integrated high-current secondary protection circuit;

[0037] 10 — Connection terminal;

[0038] 11—MCU; 12—High voltage detection circuit; 13—Temperature detection circuit;

[0039] 14 – Reference and voltage regulation circuit; 15 – Input / output mounting holes. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the embodiments of this invention are described in detail below with reference to the accompanying drawings. It should be noted that the described embodiments are intended only to facilitate understanding of this invention and do not constitute any limitation thereof. All other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this invention.

[0041] This invention provides an integrated high-current secondary protection module, such as... Figure 1 The schematic diagram of the logic block diagram of an integrated high-current secondary protection module of the present invention is shown, including a built-in microcontroller circuit 1, a high-side power supply conversion circuit 2, a fuse blowing drive circuit 3, a low-side power supply conversion circuit 4, a three-terminal fuse set 5, and an alarm drive circuit 6.

[0042] like Figure 1 As shown: This invention adopts an integrated modular design, and the connection method between the modules is as follows:

[0043] The microcontroller circuit 1 is connected to the INI terminal, RT1 terminal, RT2 terminal G, GND terminal, high-side power supply conversion circuit 2, fuse blow-off drive circuit 3, and low-side power supply conversion circuit 4.

[0044] The high-side power supply conversion circuit 2 is connected to the three-terminal fuse set 5 and the IN terminal;

[0045] The low-side power supply conversion circuit 4 is connected to the fuse blow-off drive circuit 3 and the LIN terminal;

[0046] The fuse blow-off drive circuit 3 is connected to the low-side power supply conversion circuit 4, the three-terminal fuse set 5, and the alarm drive circuit 6.

[0047] The alarm drive circuit 6 is connected to the fuse blow-off drive circuit 3 and the Lout terminal;

[0048] The three-terminal fuse set 5 is connected to the fuse blowing drive circuit 3, the high-side power supply conversion circuit 2, the IN terminal, and the OUT terminal; thus achieving:

[0049] like Figure 1As shown, after receiving signals from terminals RT1, RT2, INI, and LIN, the microcontroller circuit 1 processes the signals from MCU 11 and transmits them to the fuse blowing drive circuit 3. The fuse blowing drive circuit 3 outputs a blowing signal to the three-terminal fuse set 5 to blow the fuses in the three-terminal fuse set 5, thus breaking the circuit between the IN terminal and the OUT terminal. Another signal from the fuse blowing drive circuit 3 is transmitted to the alarm drive circuit 6, which outputs an alarm signal to the LOUT terminal to drive the LED or other alarm devices. Depending on the high and low side wiring of the module, the high-side power supply conversion circuit 2 and the low-side power supply conversion circuit 4 provide power to the microcontroller circuit 1 and the fuse blowing drive circuit 3. The high and low side power supplies switch automatically according to the wiring method.

[0050] The fuse blowing drive circuit 3 has a high current driving capability, with a current of 3 to 50A, which is intended to be freely adjustable according to different load currents and to control costs.

[0051] The power switching between the high-side power supply conversion circuit 2 and the low-side power supply conversion circuit 4 has a reverse connection protection function.

[0052] In this embodiment, the high-side power supply conversion circuit 2 and the low-side power supply conversion circuit 4 use 80-150V high-voltage MOSFETs.

[0053] Figure 2 This is a front view of module structure 1. A copper strip or copper substrate 7 is used for current transmission; input / output fastener pads 8 and input / output fixing holes 15 are used to fix the IN terminal and OUT terminal. The IN terminal and OUT terminal are connected to the B+ and P+ or B- and P- of the battery pack; the high-current secondary protection circuit 9 is located in the middle position.

[0054] Figure 3 This is the front of module structure 1, with... Figure 2 The difference lies in the shape of the copper strip or copper substrate 7 and the input / output mounting holes 15, while the connection terminals 10 are mounted on the front. Figure 4 This is a schematic diagram of the back of module structure 1. The connection terminal 10 is installed on the reverse side. The INI terminal, RT1 terminal, RT2 terminal, LIN terminal, LOUT terminal, and GND terminal can also be represented on the substrate in the form of solder pads.

[0055] Figure 5The diagram shows the fuse blowing drive circuit, including high-current switching MOSFETs Q2-QN and Q5-Q6N, where N represents an unknown variable determined by the current required to blow the fuse. For example, a 30A blowing current requires 8 MOSFETs in a TO-252 package, so N equals 8; if using a TO-263 package, 4 MOSFETs are needed, so N equals 4. Q1, Q3, and Q4 are signal switching circuits. TVS1-TVS6 protect the switching transistors from surge impact. D8, TVS1, C1, R1, Q1, R3, R15, TVS2, C2, R2, D5, and Q2-QN form the low-side power supply fuse blowing drive circuit. D9, TVS3, C4, R4, Q3, TVS4, R6, C3, R5, D6, Q4, R7, TVS6, C5, R8, Q5-Q6N, and TVS5 form the high-side power supply fuse blowing drive circuit. The input terminals of D8 and D9 are connected to MCU 11. The drains of Q2 to QN are connected to the LIN terminal, and the sources of Q2 to QN are connected to the DRV-1 terminal. The drain of Q4 is connected to the IN terminal, and the source of Q4 is connected to the DRV-2A terminal. The drains of Q5 to Q6N are connected to the DRV-2 terminal, and the sources of Q5 to Q6N are connected to the GND terminal. When the drive circuit receives a signal, Q2 to QN conduct, and current is output to the DRV-1 terminal, causing the fuse to blow. When the drive circuit receives a signal, Q5 to Q6N conduct, the sources of Q5 to Q6N are connected to the GND terminal, and the drains of Q5 to Q6N are connected to the DRV-2 terminal, causing the fuse to blow.

[0056] like Figure 6 The circuit includes high-side and low-side power supply conversion circuits. These circuits are composed of D10, D3, PTC1, TVS11, U3, C6, R10, D1, Q8, D2, TVS7, C7, R9, Q7, TVS8, R11, R12, R13, D4, C8, Q9, TVS9, U1, C10, L1, C11, C12, and D7. The circuit primarily allows customers to install secondary protection modules on either the high or low side. When installed on the low side, power is supplied through the LIN terminal and D10; when installed on the high side, power is supplied through the IN terminal and D3. D10 and D3 provide reverse connection protection. POWER-D provides high voltage to microcontroller circuit 1 for voltage detection. The 3.3 / 5V terminal provides operating power to microcontroller circuit 1.

[0057] like Figure 7The alarm drive circuit, upon receiving a DRV-1 or DRV-2A signal, outputs an alarm signal to the Lout terminal via the opto-isolation chip U2.

[0058] like Figure 8 As shown in the microcontroller circuit 1, it includes a temperature detection circuit 13, an MCU 11, a reference voltage regulator circuit 14, and a high-voltage detection circuit 12. The temperature detection circuit 13 is connected to ports RT1 and RT2 to detect the battery temperature and the temperature of the charging / discharging ports, protecting the battery pack from overheating and preventing the port connectors from melting and sticking due to poor contact. The high-voltage detection circuit 12 is connected to the POWER-D port to monitor the battery voltage and protect the battery pack from overvoltage during charging. The reference voltage regulator circuit 14 is connected to the 3.3 / 5V port to power the microcontroller circuit.

[0059] This embodiment also employs dual-software control, including a main program and a monitoring program.

[0060] like Figure 9 The set of three-terminal fuses is shown, including F1, F2~FN, D1, D2, D3, D4, DN, and Dn+1.

[0061] The fuse selection is based on the load current and its peak current, and they are connected in parallel to extend the current. The cathodes of D1, D3, and DN are connected to the DRV-2 port, which provides the high-side drive current. The anodes of D2, D4, and DN+1 are connected to DRV-1, which provides the low-side drive current. Pins 2 of F1, F2, and FN are connected to the IN terminal, and pin 1 of F1, F2, and FN is connected to the OUT terminal. Upon receiving signals from DRV-2 and DRV-1, F1, F2, and FN blow, disconnecting the IN and OUT terminals, thus protecting the battery pack.

[0062] like Figure 10 As shown in the main program flowchart, the main program flow is as follows: The system initializes. After initialization, it checks if there is an external interrupt. External interrupts take priority. The program starts and checks if there is a timer interrupt. If not, it checks again. If there is, it starts a loop and checks the occurrence time. It checks if there is an overflow. If not, it checks again. If there is, it starts sequentially checking voltage detection, temperature 1 detection, temperature 2 detection. After temperature 2 detection, it returns to the voltage measurement threshold and starts a loop.

[0063] The present invention also includes a self-test monitoring program, which starts with a self-test and proceeds in the following order: voltage detection, interrupt detection, PC register detection, RAM detection, and ADC input detection. If there is no precision offset, the self-test is completed.

[0064] The working principle of this embodiment is as follows: Microcontroller circuit 1 samples the voltage and temperature signals of the battery pack and outputs a fuse blowing protection signal according to the protection value. This signal is then sent to fuse blowing drive circuit 3. Fuse blowing drive circuit 3 outputs a high-current drive signal to three-terminal fuse set 5, which blows. The IN terminal and OUT terminal are disconnected. Alarm drive circuit 6 receives the signal from fuse blowing drive circuit 3 and outputs an alarm signal to LOUT terminal. High-side power supply conversion circuit and low-side power supply conversion circuit provide power to microcontroller circuit 1 and fuse blowing drive circuit 3. When an abnormality occurs in the program within MCU 11, the internal timer circuit starts to operate, resetting the MCU circuit to restart operation.

[0065] Through the above specific embodiments, the beneficial effects of the present invention are as follows: The design of the high-side power supply conversion circuit and the low-side power supply conversion circuit allows for free installation of the module on both the high and low sides of the battery pack. The high-side and low-side power supply conversion circuits are internally designed with surge protection circuits to ensure safe operation of the module under surge conditions. Simultaneously, the circuits have a surge overcurrent protection self-recovery function and protection against accidental triggering during assembly. The dual-path temperature design—one path for the battery pack and one path for the battery pack's charging / discharging interface—protects both the battery pack and the port, fulfilling the battery pack's temperature protection function; it achieves secondary protection performance in case of system failure; the internal software design implements two sets of software, one operating normally and the other performing tracking measurements, while the internal timer circuit ensures system restart in case of sudden system abnormalities; in cases requiring external manual intervention, the module has a reserved INI terminal to meet emergency needs, allowing for externally triggered protection and manual intervention protection, ensuring that inserting a non-compatible charger will not cause a safety accident.

[0066] This invention combines hardware and software to achieve true dual safety protection for the battery pack. The system design adopts a modular approach, which can be easily combined according to the actual needs of customers, saving costs.

[0067] The modules employ a modular design, facilitating worker assembly for maintenance and replacement. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An integrated high-current secondary protection module, comprising a microcontroller circuit, a fuse blowing drive circuit, a high-side power supply conversion circuit, a low-side power supply conversion circuit, a three-terminal fuse set, and an alarm drive circuit, characterized in that... The microcontroller circuit is connected to the high-side power supply conversion circuit, the low-side power supply conversion circuit, and the fuse blowing drive circuit; the fuse blowing drive circuit is connected to the three-terminal fuse set, the alarm drive circuit, and the low-side power supply conversion circuit; the high-current secondary protection module integrates the microcontroller circuit, the fuse blowing drive circuit, the high-side power supply conversion circuit, the low-side power supply conversion circuit, the three-terminal fuse set, and the alarm drive circuit together, and the module is connected to the battery pack through a dedicated pin; wherein... The microcontroller circuit is connected to the INI pin, and the external interrupt INI interrupts the microcontroller circuit; the microcontroller circuit is connected to the RT1, RT2 and GND pins. The high-side power supply conversion circuit is connected to the microcontroller circuit, the IN pin, and the three-terminal fuse set. The low-side power supply conversion circuit is connected to the LIN pin, the microcontroller circuit, and the fuse blow-off drive circuit. The fuse blowing drive circuit is connected to the microcontroller circuit, the low-side power supply conversion circuit, the three-terminal fuse set, and the alarm drive circuit. The three-terminal fuse set is connected to the IN pin, OUT pin, fuse blowing drive circuit and high-side power supply conversion circuit. The alarm drive circuit is connected to the fuse blow-off drive circuit and the LOUT pin. The high-current secondary protection circuit integration (9), which is composed of a microcontroller circuit, a fuse blowing drive circuit, a high-side power supply conversion circuit, a low-side power supply conversion circuit, a three-terminal fuse set, and an alarm drive circuit, is located in the middle. The current is transmitted through a copper strip or a steel substrate (7). The fixing holes (15) and gaskets (8) on both sides of the substrate are used to fix the IN terminal and the OUT terminal. The IN terminal and the OUT terminal are connected to the B+ and P+ or B- and P- of the battery pack. The high-current secondary protection circuit integration (9) is located in the middle position, and the connection terminals are on the front or back.

2. The integrated high-current secondary protection module according to claim 1, characterized in that, The INI terminal, RT1 terminal, RT2 terminal, LIN terminal, LOUT terminal, and GND terminal are connected to the substrate using solder pads or are embodied on the substrate (7) using connectors.

3. The integrated high-current secondary protection module according to claim 1, characterized in that: The microcontroller circuit (1) provides voltage and temperature detection, including a temperature detection circuit (13), an MCU (11), a reference voltage regulator circuit (14), and a high voltage detection circuit (12). The temperature detection circuit (13) is connected to the RT1 port and the RT2 port to detect the battery temperature and the temperature of the charging and discharging port, protect the battery pack from overheating and protect the port connector from melting and sticking due to poor contact. The high voltage detection circuit (12) is connected to the POWER-D port to monitor the battery voltage and protect the battery pack from overvoltage during charging. The reference voltage regulator circuit (14) is connected to the 3.3 / 5V port to power the microcontroller circuit.

4. The integrated high-current secondary protection module according to claim 1, characterized in that: After processing the signals from the high-side power supply conversion circuit (2) and the low-side power supply conversion circuit (4), the microcontroller circuit (1) provides a drive signal to the fuse blowing drive circuit (3); or, after processing the signals from the external ports INI, RT1, and RT2, the microcontroller circuit (1) provides a drive signal to the fuse blowing drive circuit (3).

5. The integrated high-current secondary protection module according to claim 4, characterized in that: The aforementioned fuse blowing drive circuit includes high-current switching MOSFETs Q2 to QN, and MOSFETs... The transistors Q5 through Q6N are connected, where N represents the number of MOSFETs used. Using TO-252 packages requires 8 MOSFETs, so N equals 8; using TO-263 packages requires 4 MOSFETs, so N equals 4. In the circuit, MOSFETs Q1, Q3, and Q4 form the signal switching circuit. Transient diodes TVS1 through TVS6 protect the switching transistors from surge damage. A low-side power supply fuse blowing drive circuit is formed by diode D8, transient diode TVS1, capacitor C1, resistor R1, MOSFET Q1, resistor R3, resistor R15, transient diode TVS2, capacitor C2, resistor R2, Zener diode D5, and MOSFETs Q2 through QN. A high-side power supply fuse blowing drive circuit is formed by diode D9, transient diode TVS3, capacitor C4, resistor R4, MOSFET Q3, transient diode TVS4, resistor R6, capacitor C3, resistor R5, Zener diode D6, MOSFET Q4, resistor R7, transient diode TVS6, capacitor C5, resistor R8, and MOSFET... The high-side power supply fuse blowing drive circuit consists of transistors Q5-Q6N and transient diode TVS5; the input terminals of diodes D8 and D9 are connected to the MCU of the microcontroller circuit; the drains of MOSFETs Q2-QN are connected to terminal LIN, and the sources of MOSFETs Q2-QN are connected to terminal DRV-1; the drain of MOSFET Q4 is connected to terminal IN, and the source of MOSFET Q4 is connected to terminal DRV-2A; the drains of MOSFETs Q5-Q6N are connected to terminal DRV-2, and the sources of MOSFETs Q5-Q6N are connected to terminal GND; when the drive circuit receives a signal, MOSFETs Q2-QN conduct, and current is output to terminal DRV-1, driving the fuse to blow; When the drive circuit receives a signal, MOSFETs Q5 to Q6N turn on, the source of MOSFETs Q5 to Q6N is connected to terminal GND, and the drain of MOSFETs Q5 to Q6N is connected to terminal DRV-2, causing the drive fuse to blow.

6. The integrated high-current secondary protection module according to claim 5, characterized in that: The fuse blowing drive circuit (3) performs a delay after receiving a signal from the microcontroller circuit (1), and then drives the three-terminal fuse set (5) to blow; or, the fuse blowing drive circuit (3) performs a delay after receiving a signal from the microcontroller circuit (1), and then triggers the alarm drive circuit (6).

7. The integrated high-current secondary protection module according to claim 4, characterized in that: The circuit includes a high-side power supply conversion circuit and a low-side power supply conversion circuit. This circuit uses diodes D10 and D3, a heating element PTC1, a transient diode TVS11, a chip U3, a capacitor C6, a resistor R10, a Zener diode D1, a MOSFET Q8, a diode D2, a transient diode TVS7, a capacitor C7, a resistor R9, a MOSFET Q7, a transient diode TVS8, resistors R11, R12, and R13, a Zener diode D4, a capacitor C8, and a MOSFET... The high-side power supply conversion circuit and the low-side power supply conversion circuit are composed of tube Q9, transient diode TVS9, chip U1, capacitor C10, inductor L1, capacitor C11, capacitor C12, and diode D7, so as to meet the customer's need to install secondary protection modules on the high and low sides. When installed on the low side, the power supply is supplied to the circuit through terminal LIN and diode D10. When installed on the high side, the power supply is supplied to the circuit through terminal IN and diode D3. Diodes D10 and D3 play the role of reverse connection protection. In the circuit, POWER-D provides high voltage for the microcontroller circuit for voltage detection. Circuit terminal 3.3 / 5V provides working power for microcontroller circuit (1).

8. The integrated high-current secondary protection module according to claim 1, characterized in that: After receiving the signal from the fuse blow-off drive circuit (3), the alarm drive circuit (6) outputs a high / low level signal to the external port Lout.

9. The integrated high-current secondary protection module according to claim 8, characterized in that: The alarm drive circuit, upon receiving the DRV-1 or DRV-2A signal from the fuse blow-off drive circuit, outputs an alarm signal to the Lout terminal via the opto-isolation chip U2.

10. An integrated high-current secondary protection module according to claim 1, characterized in that: The three-terminal fuse assembly circuit includes three-terminal fuses F1, F2-FN, diodes D1, D2, D3, D4, DN, and Dn+1. The number of fuses is determined by the load current and its peak current. They are connected in parallel to expand the current. The cathodes of diodes D1, D3, and DN are connected to port DRV-2, which provides high-side drive current. The anodes of diodes D2, D4, and DN+1 are connected to port DRV-1, which provides low-side drive current. Pins 2 of three-terminal fuses F1, F2, and FN are connected to terminal IN, and pin 1 of three-terminal fuses F1, F2, and FN is connected to terminal OUT. Upon receiving signals from ports DRV-2 and DRV-1, three-terminal fuses F1, F2, and FN blow, disconnecting terminal IN from terminal OUT, thus protecting the battery pack.

11. An integrated high-current secondary protection module according to claim 1, characterized in that: The system employs dual-program control, including a main program and a self-test monitoring program. The main program flow is as follows: the system initializes, and after initialization, it checks for external interrupts, with external interrupts taking priority. The program then checks for and confirms whether a timer interrupt occurs. If no, the check is repeated. If yes, the loop begins and the occurrence time is checked. It also checks for overflow. If no, the check is repeated. If yes, the system begins sequential detection of voltage, temperature 1, and temperature 2. After temperature 2 is detected and within the threshold, the system returns to the voltage measurement stage and begins the loop again.

12. The integrated high-current secondary protection module according to claim 11, characterized in that: The self-test monitoring program starts with a self-test and proceeds in the following order: voltage detection, interrupt detection, PC register detection, RAM detection, and ADC input detection. If there is no precision offset, the self-test is complete.

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