Circuit board structure applied to the mobile PCI Express module

Abstract

The present invention relates to a circuit board structure applied to a mobile PCI Express module, which complies with the PCIe 4.0 specification according to the stack-up design, the size and impedance control of the conductors, and the degree of signal attenuation. The circuit board structure includes a top signal layer, a bottom signal layer, a power layer, a plurality of first insulating layers, and a second insulating layer. The bottom signal layer and the top signal layer include a core board and conductive copper wires. The power layer is disposed between the top signal layer and the bottom signal layer. The first insulating layer is disposed between the top signal layer and the power layer and between the bottom signal layer and the power layer. The second insulating layer is disposed between the power layer and the first insulating layer. Among them, the dielectric loss values of the first insulating layer and the second insulating layer are between 0.004 and 0.014, and the length of the conductive copper wire is between 500 mil and 2500 mil, so that the signal loss of the top signal layer and the bottom signal layer is less than 8 dB.

Description

Technical Field

[0001] The present invention relates to a circuit board structure applied to a mobile PCI Express module, and in particular, to a circuit board structure applied to a mobile PCI Express module and compliant with the PCIe 4.0 specification of a graphics processor. Background Art

[0002] Computers have become one of the indispensable communication devices in daily life, and people can process and transmit data through computers. With the rapid development of computer technology, the developed portable notebook computers have further brought practicality and convenience to life.

[0003] Notebook computers can be classified into business types, fashion types, and multimedia application types according to their uses. Business-type notebook computers feature high mobility and long battery life; fashion-type notebook computers have attractive appearance features; while multimedia application-type notebook computers combine powerful graphics and multimedia processing capabilities with a certain degree of mobility.

[0004] Generally speaking, a notebook computer includes a main board, and a central processing unit (CPU), a graphics processing unit (GPU), a mobile PCI Express module (MXM), and other electronic components used to process data and signals are all disposed on the main board. Currently, the mobile PCI Express module (MXM) used to process graphic data on the market has only been developed to version 3.0, with a data transmission and processing speed of up to 8 GT / s and a bandwidth of up to 32 GB / s. With the rapid development of technology and the continuous improvement of people's living standards, the requirements for the bandwidth, performance, and speed of notebook computers to process data have also increased. Therefore, the electronic components of notebook computers need to be upgraded or replaced to meet the requirements of consumers. However, in the existing circuit board structure of the mobile PCI Express module, it can only transmit and process data with a bandwidth of up to 32 BG / s. When the circuit board structure processes data with a bandwidth greater than 32 GB / s and the transmission speed needs to be greater than 8.0 GT / s, the signal interference and signal loss of data transmission will increase significantly, thereby reducing the signal transmission quality and transmission speed.

[0005] Therefore, it is necessary to develop a new circuit board structure to solve the problems of the prior art. Summary of the Invention

[0006] In view of this, the object of the present invention is to provide a circuit board structure applied to a mobile PCI Express module, which can solve the problems of the prior art, effectively improve the signal transmission quality and transmission speed, and reduce signal loss and crosstalk phenomena.

[0007] To achieve the above object, the present invention discloses a circuit board structure applied to a mobile PCI Express module to comply with the PCIe 4.0 specification, characterized in that the circuit board structure applied to the mobile PCI Express module comprises:

[0008] A top signal layer;

[0009] A bottom signal layer, located on the other side relative to the top signal layer, wherein the top signal layer and the bottom signal layer comprise a core board and a conductive copper wire, and the conductive copper wire is disposed on the surface of the core board to conduct signals;

[0010] At least one power layer, disposed between the top signal layer and the bottom signal layer;

[0011] A plurality of first insulating layers, disposed between the top signal layer and the power layer and between the bottom signal layer and the power layer; and

[0012] A plurality of second insulating layers, disposed between the power layer and the first insulating layers;

[0013] Wherein, the length of the conductive copper wire is between 500 mil and 2500 mil, so that the signal loss of the mobile PCI Express module is less than 8 dB.

[0014] Wherein, it further comprises a first ground layer, and the first ground layer is disposed between the top signal layer and the power layer and between the first insulating layers and the second insulating layers.

[0015] Wherein, it further comprises a second ground layer, and the second ground layer is disposed between the power layer and the bottom signal layer and between the first insulating layers and the second insulating layers.

[0016] Wherein, it further comprises a first intermediate signal layer and a third ground layer disposed between the top signal layer and the first ground layer, and the third ground layer is disposed between the top signal layer and the first intermediate signal layer, and the first insulating layers are respectively located between the top signal layer, the third ground layer, the first intermediate signal layer and the first ground layer.

[0017] Wherein, it further comprises a second intermediate signal layer and a fourth ground layer disposed between the bottom signal layer and the second ground layer, and the fourth ground layer is disposed between the bottom signal layer and the second intermediate signal layer, and the first insulating layers are respectively located between the bottom signal layer, the fourth ground layer, the second intermediate signal layer and the second ground layer.

[0018] Wherein, the top signal layer and the bottom signal layer comprise an impedance value, and the impedance value is between 76.5 Ω and 93.5 Ω.

[0019] Among them, a plurality of arc-shaped trace structures are formed on the surface of the core board by the conductive copper wire.

[0020] Among them, the conductive copper wire is arranged on the surface of the core board in a 10-degree trace manner.

[0021] Among them, the materials of the first insulating layers are epoxy resin composite materials, and the epoxy resin composite materials include at least one of TU-883 and TU-863+.

[0022] Among them, the thicknesses of the first insulating layers and the second insulating layers are between 0.05 mm and 0.08 mm.

[0023] In summary, the circuit board structure applied to the mobile PCI Express module of the present invention can effectively reduce the signal loss of the signal layer and improve the signal transmission quality and transmission speed through the insulating layer containing ultra-low loss materials and the special multi-layer stacking structure to meet the PCIe 4.0 transmission specification of the mobile PCI Express module. Moreover, the signal layer of the circuit board structure applied to the mobile PCI Express module of the present invention can also adopt various trace manners to reduce signal loss and crosstalk phenomena. Description of the Drawings

[0024] Figure 1 It is a schematic structural diagram of a circuit board structure applied to a mobile PCI Express module according to a specific embodiment of the present invention.

[0025] Figure 2 It is a schematic structural diagram of the top signal layer according to a specific embodiment of the present invention.

[0026] Figure 3 It is a signal loss schematic diagram of a circuit board structure applied to a mobile PCI Express module according to a specific embodiment of the present invention.

[0027] Figure 4 It is a signal loss schematic diagram of a circuit board structure applied to a mobile PCI Express module according to a specific embodiment of the present invention. Detailed Description of the Invention

[0028] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with specific embodiments and with reference to the accompanying drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. Also, the devices in the drawings are only used to express their relative positions and are not drawn according to their actual proportions. This is stated in advance.

[0029] In the description of this specification, the description referring to terms such as "a specific embodiment", "another specific embodiment" or "part of the specific embodiments" means that the specific features, structures, materials or characteristics described in connection with the embodiment are included in at least one embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments. In addition, the indefinite articles "a", "an" and "one" before the devices or elements of the present invention do not limit the number requirements (i.e., the number of occurrences) of the devices or elements. Therefore, "a" should be interpreted as including one or at least one, and the singular form of the device or element also includes the plural form, unless the number clearly refers to the singular form.

[0030] The circuit board structure of the present invention applied to the mobile PCI Express module can be used to comply with the PCIe (PCI Express) 4.0 specification and can be applied to the bus interface of a graphics processor that complies with the PCIe 4.0 specification.

[0031] Please refer to Figure 1 and Figure 2 . Figure 1 It is a schematic structural diagram of a circuit board structure 1 applied to a mobile PCI Express module according to a specific embodiment of the present invention. Figure 2 It is a schematic structural diagram of the top signal layer 11 according to a specific embodiment of the present invention. As Figure 1 shown, in this specific embodiment, the circuit board structure 1 applied to the mobile PCI Express module includes a top signal layer 11, a bottom signal layer 12, a power layer 13, a plurality of first insulating layers 141 and a plurality of second insulating layers 142. The bottom signal layer 12 is disposed opposite to the top signal layer 11. The power layer 13 is disposed between the top signal layer 11 and the bottom signal layer 12. The plurality of first insulating layers 141 are disposed between the top signal layer 11 and the power layer 13 and between the bottom signal layer 12 and the power layer 13. The plurality of second insulating layers 142 are disposed between the power layer 13 and the plurality of first insulating layers 141.

[0032] In practice, the circuit board structure 1 applied to the mobile PCI Express module can be a multi-layer board structure, and the top signal layer 11 and the bottom signal layer 12 are respectively located on the outermost layers of the multi-layer board. Passive components, integrated circuits, chips and other electronic components can be respectively arranged on the outer surfaces of the top signal layer 11 and the bottom signal layer 12.

[0033] As Figure 2 shown, the top signal layer 11 includes a core board 111 and a plurality of conductive copper wires 112, and the conductive copper wires 112 are arranged on the surface of the core board 111. In practice, the top signal layer 11 can be a copper-clad laminate formed by a hot pressing method. The core board 111 can be an insulating substrate composed of a polymer synthetic resin and a reinforcing material (such as: paper substrate, fiberglass cloth substrate, synthetic fiber cloth substrate, non-woven fabric substrate, composite substrate, etc.), and the electronic component 5 can be arranged on the surface of the core board 111. Further, the surface of the core board 111 can be covered with a copper foil layer and etched to form the conductive copper wires 112. The conductive copper wires 112 can be designed according to the positions and distributions of the electronic components 5 arranged on the core board 111 and can be connected to the electronic components 5 to conduct the electronic components 5 and conduct signals. In addition, the outer side of the top signal layer 11 can further include a solder mask to prevent the electronic components 5 from contacting the conductive copper wires 112 when being soldered to the core board 111 and causing a short circuit.

[0034] The bottom signal layer 12 can also include the same core board, conductive copper wires and solder mask as the top signal layer 11, and the structures and functions of the core board, conductive copper wires and solder mask are substantially the same as those described above, and will not be elaborated here. In this specific embodiment, the lengths of the conductive copper wires of the top signal layer 11 and the bottom signal layer 12 are between 500 mil and 2500 mil. It should be noted that the positions of the electronic components and the routing modes of the conductive copper wires on the bottom signal layer 12 can be different from those of the electronic components and the routing modes of the conductive copper wires on the top signal layer 11, and can be determined according to the design.

[0035] In this specific embodiment, a plurality of arc-shaped trace structures 1121 can be formed on the surface of the core board 111 by the conductive copper wire 112. In practice, when the conductive copper wire 112 needs to turn the trace due to the design of the circuit or the electronic component 5, the arc-shaped trace structure 1121 can avoid the acid angle phenomenon (Acid Traps) caused by right-angle traces or acute-angle traces, so as to reduce the impedance of the conductive copper wire 112, thereby improving the signal transmission quality. In addition, the conductive copper wire 112 can also be arranged on the surface of the core board 111 in a 10-degree trace manner. In practice, the conductive copper wire 112 in a 10-degree trace manner can effectively reduce the influence of the uneven dielectric constant of the core board 111 and the impedance of signal transmission, thereby improving the signal transmission quality, and reducing signal loss and crosstalk between the conductive copper wires 112. In this specific embodiment, the impedance values of the top signal layer 11 and the bottom signal layer 12 are between 76.5Ω and 93.5Ω, but in practice, it is not limited thereto, and the impedance values of the top signal layer 11 and the bottom signal layer 12 can also be determined according to the design or requirements.

[0036] As Figure 1 shown, in this specific embodiment, the power supply layer 13 is arranged between the top signal layer 11 and the bottom signal layer 12 to supply power to the electronic components arranged on the top signal layer 11 and the bottom signal layer 12. In practice, when the electronic components on the circuit board structure 1 applied to the mobile PCI Express module need to be driven by multiple different voltages or currents, the power supply layer 13 can be a multi-layer power plane structure, such as Figure 1 shown, the number of the power supply layers 13 is 4, but it is not limited thereto, and the number of the power supply layers can be determined according to the design. In another specific embodiment, the power supply layer can also be a single-layer structure.

[0037] In this specific embodiment, the first insulating layer 141 is arranged between the top signal layer 11 and the power supply layer 13 and between the bottom signal layer 12 and the power supply layer 13. The second insulating layer 142 is arranged between the power supply layer 13 and the plurality of first insulating layers 141. Further, the second insulating layer 142 can be arranged alternately with the plurality of power supply layers 13 (as Figure 1 shown). In practice, the first insulating layer 141 and the second insulating layer 142 are dielectric layers (i.e., semi-cured layers), and are respectively arranged alternately between the top signal layer 11, the bottom signal layer 12 and the power supply layer 13 to prevent short circuits between the signal layer and the power supply layer. Moreover, the thicknesses of the first insulating layer 141 and the second insulating layer 142 can be between 0.05mm and 0.08mm, and the dielectric loss values (Dissipation Factor, Df) of the first insulating layer 141 and the second insulating layer 142 can be between 0.004 and 0.014. As Figure 1As shown, the arrangement of the circuit board structure 1 applied to the mobile PCI Express module from top to bottom is the top signal layer 11, the first insulating layer 141, the power layer 13, the second insulating layer 142, the power layer 13, the first insulating layer 141, and the bottom signal layer 12. The materials of the first insulating layer 141 and the second insulating layer 142 can be epoxy resin composite materials (such as: FR-4, FR-5, FR-6, CEM-1 to CEM-5, etc.). And, the materials of the first insulating layer 141 and the second insulating layer 142 can include low-loss materials or ultra-low-loss materials. In a specific embodiment, the material of the first insulating layer 141 includes TU-883 or TU863+, and the material of the second insulating layer 142 includes TU-865. That is to say, the first insulating layer 141 is a composite material of epoxy resin combined with TU-883 or TU863+, and the second insulating layer 142 is a composite material of epoxy resin combined with TU-865. Therefore, when the top signal layer 11, the bottom signal layer 12, the power layer 13, the first insulating layer 141, and the second insulating layer 142 are hot-pressed to form the circuit board structure 1 applied to the mobile PCI Express module, the first insulating layer 141 and the second insulating layer 142 can maintain the signal transmission quality of the top signal layer 11, the bottom signal layer 12, and the power layer 13 and reduce signal loss.

[0038] It should be noted that in practice, the material of the first insulating layer 141 is not limited to including the aforementioned TU-883 and TU863+, and the material of the second insulating layer 142 is not limited to including the aforementioned TU-865. The first insulating layer 141 and the second insulating layer 142 can also include other low-loss materials or ultra-low-loss materials, and can also be determined according to design or requirements. And, the material of the second insulating layer 142 can also be the same as that of the first insulating layer 141. Further, when the power layer 13 is a single-layer structure, the second insulating layer 142 can be respectively disposed on opposite sides of the power layer 13.

[0039] In this specific embodiment, the circuit board structure 1 applied to the mobile PCI Express module further includes a first ground layer 151 and a second ground layer 152. The first ground layer 151 is disposed between the top signal layer 11 and the power layer 13 and between the first insulating layer 141 and the second insulating layer 142. The second ground layer 152 is disposed between the power layer 13 and the bottom signal layer 12 and between the first insulating layer 141 and the second insulating layer 142. As Figure 1As shown, the circuit board structure 1 applied to the mobile PCI Express module is arranged from top to bottom as a top signal layer 11, a first insulating layer 141, a first ground layer 151, a second insulating layer 142, a power layer 13, a second insulating layer 142, a second ground layer 152, a first insulating layer 141, and a bottom signal layer 12. In practice, the first ground layer 151 is used for grounding and separating the top signal layer 11 and the power layer 13 to prevent crosstalk between the top signal layer 11 and the power layer 13. In addition, the first ground layer 151 can also form a coupling capacitor with the adjacent power layer 13, which can not only reduce the impedance of the power layer 13 and the first ground layer 151, but also enable the power layer 13 to obtain a wider filtering effect, thereby improving the signal transmission quality and transmission speed. Similarly, the second ground layer 152 is used for grounding and separating the bottom signal layer 12 and the power layer 13, and the second ground layer 152 can also form a coupling capacitor with the adjacent power layer 13 to prevent crosstalk between the bottom signal layer 12 and the power layer 13 and improve the signal transmission quality and transmission speed. Therefore, the circuit board structure applied to the mobile PCI Express module of the present invention can effectively reduce signal loss and improve signal transmission quality and transmission speed through an insulating layer containing ultra-low loss materials and a special multi-layer stacking method to meet the PCIe 4.0 specification.

[0040] In this specific embodiment, the circuit board structure 1 applied to the mobile PCI Express module further includes a first intermediate signal layer 161 and a third ground layer 153. The first intermediate signal layer 161 and the third ground layer 153 are disposed between the top signal layer 11 and the first ground layer 151, and the third ground layer 153 is disposed between the top signal layer 11 and the first intermediate signal layer 161. The first insulating layer 141 is located between the top signal layer 11, the third ground layer 153, the first intermediate signal layer 161, and the first ground layer 151 respectively. With the miniaturization of electronic products and the high-speed data transmission, the circuit board includes not only the signal layers on the outermost two sides, but also the signal layers disposed inside the circuit board to increase the data transmission volume and transmission speed. As Figure 1 shown, the structure arrangement between the top signal layer 11 and the power layer 13 of the circuit board structure 1 applied to the mobile PCI Express module is the top signal layer 11, the first insulating layer 141, the third ground layer 153, the first insulating layer 141, the first intermediate signal layer 161, the first insulating layer 141, the first ground layer 151, the second insulating layer 142, and the power layer 13. In practice, the first intermediate signal layer 161 can include the aforementioned core board and conductive copper wires and is used for conducting signals, and the third ground layer 153 is used for grounding and separating the top signal layer 11 and the first intermediate signal layer 161 to prevent crosstalk between the top signal layer 11 and the first intermediate signal layer 161.

[0041] In addition, in this specific embodiment, the circuit board structure 1 applied to the mobile PCI Express module further includes a second intermediate signal layer 162 and a fourth ground layer 154. The second intermediate signal layer 162 and the fourth ground layer 154 are disposed between the bottom signal layer 12 and the second ground layer 152, and the fourth ground layer 154 is disposed between the bottom signal layer 12 and the second intermediate signal layer 162. The first insulating layer 141 is respectively located between the bottom signal layer 12, the fourth ground layer 154, the second intermediate signal layer 162, and the second ground layer 152. As Figure 1 shown, the structural arrangement between the power layer 13 and the bottom signal layer 12 of the circuit board structure 1 applied to the mobile PCI Express module is the power layer 13, the second insulating layer 142, the second ground layer 152, the first insulating layer 141, the second intermediate signal layer 162, the first insulating layer 141, the fourth ground layer 152, the first insulating layer 141, and the bottom signal layer 12. In practice, the second intermediate signal layer 162 may include the aforementioned core board and conductive copper wires and is used to conduct signals, and the fourth ground layer 154 is used for grounding and separating the bottom signal layer 12 and the second intermediate signal layer 162 to prevent crosstalk between the bottom signal layer 12 and the second intermediate signal layer 162.

[0042] It should be noted that the number of internal signal layers of the circuit board structure applied to the mobile PCI Express module is not limited to Figure 1 the two (the first intermediate signal layer 161, the second intermediate signal layer 162) in

[0043] Please refer to Figure 1 、 Figure 3 and Figure 4 . Figure 3 FIG. is a schematic diagram of signal loss of the circuit board structure 1 applied to the mobile PCI Express module according to a specific embodiment of the present invention. Figure 4 FIG. is a schematic diagram of signal loss of the circuit board structure 1 applied to the mobile PCI Express module according to a specific embodiment of the present invention. As Figure 3 and Figure 4 shown, the X-axis is the length value of the conductive copper wire (in mils), and the Y-axis is the signal loss value (dB). As Figure 3As shown, in a preferred specific embodiment, when the material of the first insulating layer 141 is the ultra-low loss material TU-883, the material of the second insulating layer 142 is TU-865, the impedance values of the top signal layer 11 and the bottom signal layer 12 are 85 Ω, and the length value of the conductive copper wire is between 500 mil and 2500 mil, the signal loss of the mobile PCI Express module (MXM) can be less than 8 dB, and the signal loss of the circuit board structure 1 applied to the mobile PCI Express module can be less than 5 dB. In practice, in the PCIe 4.0 specification, the signal loss of the external / pluggable graphics processing module needs to be less than 8 dB. Further, since the loss generated by the electronic components during packaging is about 3 dB, that is, the signal loss of the circuit board structure applied to the mobile PCI Express module needs to be less than 5 dB. As Figure 4 As shown, in a preferred specific embodiment, when the material of the first insulating layer 141 is the low loss material TU-863+, the material of the second insulating layer 142 is TU-865, the impedance values of the top signal layer 11 and the bottom signal layer 12 are 85 Ω, and the length value of the conductive copper wire is between 500 mil and 2500 mil, the signal loss of the circuit board structure 1 applied to the mobile PCI Express module can also be less than 5 dB. Therefore, the circuit board structure applied to the mobile PCI Express module of the present invention can effectively reduce the signal loss value by selecting the material of the insulating layer, the length of the conductive copper wire, and the impedance value of the signal layer, so that the circuit board structure applied to the mobile PCI Express module can meet the transmission specification of PCIe 4.0.

[0044] In summary, the circuit board structure applied to the mobile PCI Express module of the present invention can effectively reduce the signal loss of the signal layer, improve the signal transmission quality and transmission speed, and meet the PCIe 4.0 transmission specification of the mobile PCI Express module through the insulating layer containing ultra-low loss materials and a special multi-layer stacking structure. And, the signal layer of the circuit board structure applied to the mobile PCI Express module of the present invention can also reduce the signal loss and crosstalk phenomenon through various wiring methods.

[0045] From the detailed description of the above preferred specific embodiments, it is hoped that the features and spirit of the present invention can be more clearly described, rather than limiting the scope of the present invention by the above-disclosed preferred specific embodiments. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent scope to which the present invention is to be applied. Therefore, the scope of the patent scope applied for by the present invention should be interpreted as broadly as possible according to the above description, so as to cover all possible changes and equivalent arrangements.

Claims

1. A circuit board structure applied to a mobile PCI Express module to comply with the PCIe (PCI Express) 4.0 specification, characterized in that The circuit board structure applied to the mobile PCI Express module includes: A top signal layer; A bottom signal layer, located on the other side relative to the top signal layer, wherein the top signal layer and the bottom signal layer include a core board and a conductive copper wire, and the conductive copper wire is disposed on the surface of the core board to conduct signals; At least one power layer, disposed between the top signal layer and the bottom signal layer; A plurality of first insulating layers, disposed between the top signal layer and the power layer and between the bottom signal layer and the power layer; And A plurality of second insulating layers, disposed between the power layer and the first insulating layers; Wherein, the dielectric loss values of the first insulating layers and the second insulating layers are between 0.004 and 0.014, and the length of the conductive copper wire is between 500 mil and 2500 mil, so that the signal loss of the mobile PCI Express module is less than 8 dB.

2. The circuit board structure applied to the mobile PCI Express module according to claim 1, wherein Further includes a first ground layer, which is disposed between the top signal layer and the power layer and between the first insulating layers and the second insulating layers.

3. The circuit board structure applied to the mobile PCI Express module according to claim 1, wherein, Further includes a second ground layer, which is disposed between the power layer and the bottom signal layer and between the first insulating layers and the second insulating layers.

4. The circuit board structure applied to the mobile PCI Express module according to claim 2, characterized in that Further includes a first intermediate signal layer and a third ground layer disposed between the top signal layer and the first ground layer, and the third ground layer is disposed between the top signal layer and the first intermediate signal layer, and the first insulating layers are respectively located between the top signal layer, the third ground layer, the first intermediate signal layer and the first ground layer.

5. The circuit board structure applied to the mobile PCI Express module according to claim 3, wherein, Further includes a second intermediate signal layer and a fourth ground layer disposed between the bottom signal layer and the second ground layer, and the fourth ground layer is disposed between the bottom signal layer and the second intermediate signal layer, and the first insulating layers are respectively located between the bottom signal layer, the fourth ground layer, the second intermediate signal layer and the second ground layer.

6. The circuit board structure applied to the mobile PCI Express module as claimed in claim 1, wherein The top signal layer and the bottom signal layer include an impedance value, and the impedance value is between 76.5 Ω and 93.5 Ω.

7. The circuit board structure applied to the mobile PCI Express module according to claim 1, characterized in that, The conductive copper wire forms a plurality of arc-shaped trace structures on the surface of the core board.

8. The circuit board structure applied to the mobile PCI Express module according to claim 1, characterized in that, The conductive copper wire is disposed on the surface of the core board in a 10-degree trace manner.

9. The circuit board structure applied to the mobile PCI Express module according to claim 1, characterized in that, The materials of the first insulating layers are epoxy resin composite materials, and the epoxy resin composite materials include at least one of TU-883 and TU-863+.

10. The circuit board structure applied to the mobile PCI Express module according to claim 1, wherein The thicknesses of the first insulating layers and the second insulating layers are between 0.05 mm and 0.08 mm.

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