Frame, frame molding die and display device

Abstract

This invention relates to a frame surrounding a display module, the display module including a bonding side and a non-bonding side. The frame includes a first portion and a second portion forming a ring structure. The first portion is directly formed on the outside of the display module using an injection molding process, and the first portion is positioned towards the bonding side of the display module. This invention also relates to a frame molding die and a display device.

Description

Technical Field

[0001] This invention relates to the field of display product manufacturing technology, and in particular to a plastic frame, a plastic frame molding die, and a display device. Background Technology

[0002] Currently, wearable OLED (Organic Light-Emitting Diode) watches use insert molding technology to inject the display module to reduce the bezel. However, during the insert molding process, the upper mold core comes into contact with the heat dissipation film of the display module and an interference fit occurs, causing the heat dissipation film to deform, which in turn causes the OCA layer (optical adhesive layer) to deform and produce a mold mark. Summary of the Invention

[0003] To solve the above-mentioned technical problems, the present invention provides a plastic frame, a plastic frame molding die, and a display device, which solves the problem of mold marks generated when the plastic frame is injection molded on the display module.

[0004] To achieve the above objectives, the technical solution adopted in this embodiment of the invention is: a frame surrounding a display module, the display module including a bonding side and a non-bonding side, the frame including a first part and a second part forming a ring structure, the first part being directly formed on the outside of the display module by injection molding, the first part being disposed towards the bonding side of the display module.

[0005] Optionally, along the first direction, the display module includes a display area and a bonding side located on one side of the display area. The bonding side includes an integrated circuit chip bonded to the display panel of the display module. Along the first direction, the orthographic projection of the first portion on the display module completely covers the integrated circuit chip.

[0006] Optionally, the second part is made of PET double-sided adhesive.

[0007] Optionally, in the light emission direction of the display module, the height of the first part and the height of the second part are the same.

[0008] Optionally, the first part is injection molded using epoxy resin with added conductive liquid.

[0009] This invention also provides a molding die for directly injection molding the first part of the aforementioned frame onto a display module. The die includes a first mold frame and a second mold frame. The first mold frame has a first mold core with a first cavity, and the second mold frame has a second mold core with a second cavity. The second cavity is used to accommodate the display module. When the first mold frame and the second mold frame are aligned, the first mold core, the display module, and the second mold core together form a cavity for forming the first part of the frame.

[0010] Optionally, the first cavity includes a first sidewall located near the display module, and when the first mold frame and the second mold frame are assembled, the first sidewall is pressed against the display panel of the display module.

[0011] This invention also provides a display device, including a display module and the aforementioned frame, the frame surrounding the display module.

[0012] Optionally, the display module includes a display panel and a cover plate located on the light-emitting side of the display panel. The cover plate includes a central region for setting the display panel and an edge region located around the central region, and the frame is connected to the edge region.

[0013] Optionally, it also includes a frame surrounding the periphery of the plastic frame and the display module, the frame including a base plate and side plates located around the base plate;

[0014] The frame is fixedly connected between the base plate and the side plate, and the side of the cover plate is connected to the side plate.

[0015] The beneficial effects of the present invention are: the frame is divided into a first part and a second part, and only the first part is directly formed on the outside of the display module by injection molding, while the second part is assembled with the display module after molding, which avoids the problem of mold marks caused by the heat dissipation film deformation due to the interference fit between the frame and the heat dissipation film of the display module. Attached Figure Description

[0016] Figure 1 This diagram illustrates the injection molding process of a plastic frame in the relevant technology.

[0017] Figure 2 A schematic diagram illustrating the adhesive frame in the relevant technology;

[0018] Figure 3 This is a schematic diagram showing the state of the printing module generating the mold.

[0019] Figure 4 This indicates the assembly status of the display module and mold. Figure 1 ;

[0020] Figure 5 A schematic diagram illustrating the adhesive frame in an embodiment of the present invention;

[0021] Figure 6 This indicates the assembly status of the display module and mold. Figure 2 ;

[0022] Figure 7 This indicates the assembly status of the display module and mold. Figure 3 ;

[0023] Figure 8 This is a schematic diagram showing the injection molding state of the glue frame in an embodiment of the present invention;

[0024] Figure 9 A schematic diagram illustrating a display device in related technologies;

[0025] Figure 10 This is a schematic diagram illustrating a display device in an embodiment of the present invention. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention are within the scope of protection of the present invention.

[0027] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] As the demand for narrow bezels in OLED wearable devices continues to increase, Insert Molding technology has begun to be introduced into OLED wearable display modules. A schematic diagram of Insert Molding is shown below. Figure 1 and Figure 2As shown, by injecting and curing resin, a rigid resin ring (i.e., a bezel) is formed around the display module, which then connects to the mid-frame of the entire unit. While Insert Molding technology effectively reduces the bezel of the display module and protects the pad-bending area (bonding area), the mold used for injection molding requires specific references. Figure 1 The mold includes an upper mold base 1, a lower mold base 2, an upper mold core 3, and a lower mold core 4. The upper mold core 3 directly contacts the copper foil surface of the heat dissipation layer SCF of the OLED display module (the heat dissipation layer is composed of mesh adhesive, foam, and copper foil) and has an interference fit with it. At this time, the copper foil will undergo plastic deformation, resulting in the stacking structure of the entire heat dissipation layer SCF (see reference). Figure 3 The deformation of the display panel (PNL), polarizer (pol), and optical adhesive layer (OCA) in the OLED display module further causes deformation of the panel itself. Ultimately, the deformation of the optical adhesive layer (OCA, located between the display panel and the cover plate) leads to the formation of mold marks. (Refer to...) Figure 3 The display module includes a heat dissipation layer SCF, a display panel PNL, a polarizer pol, an optical adhesive layer OCA, and a cover plate CG, which are stacked in sequence.

[0029] refer to Figures 4-8 To address the aforementioned issues, this embodiment provides a frame 10, which surrounds the display module 30. The display module 30 includes a bonding side and a non-bonding side. The frame 10 includes a first part 101 and a second part 102 that enclose and form a ring structure. The first part 101 is directly formed on the outside of the display module 30 using an injection molding process, and the first part 101 is positioned towards the bonding side of the display module 30.

[0030] contrast Figure 2 and Figure 5 In this embodiment, the frame 10 is divided into a first part 101 and a second part 102. Only the first part 101, facing the bonding side of the display module 30, is directly formed on the outside of the display module 30 using injection molding. The second part 102 is assembled with the display module 30 after molding. Compared with the traditional injection molding method, this changes the structure of the frame 10 and the structure of the mold. The mold is no longer the traditional ring shape, but a structure corresponding to the formation of the first part 101. That is, in this embodiment, the mold used to form the first part 101 is only a part of the ring shape. Figure 1 and Figure 8Since the display module 30 includes a heat dissipation layer, a display panel, a polarizer, an optical adhesive layer and a cover plate 31 stacked in sequence, and since the injection molding part of the frame 10 in this embodiment is only the first part 101, the mold in this embodiment also only has a structure corresponding to the molding of the first part 101. Therefore, the part that is interference fit with the heat dissipation layer is omitted, thus avoiding deformation of the heat dissipation layer and avoiding the problem of mold marks caused by deformation of the heat dissipation layer.

[0031] The first portion 101 is oriented towards the bonding side, meaning it is injection molded on the bonding side of the display module 30. This allows for extreme narrowing of the lower bezel of the display module 30 and effectively protects the fragile bonding area. The integrated circuit chip COP is bonded to the circuit connection portion of the display panel, which can greatly reduce the cost of the display module 30 and simplify the manufacturing process. The integrated circuit chip 100 is bonded to the bonding side of the display panel, and the integrated circuit chip 100 is bent to the backlight side of the display panel. The first portion 101 is located outside the integrated circuit chip 100, thus protecting the integrated circuit chip 100.

[0032] refer to Figures 5-7 In an exemplary embodiment, along the first direction (reference) Figure 6 In the X direction, the display module 30 includes a display area and a bonding side located on one side of the display area. The bonding side includes an integrated circuit chip 100 bonded to the display panel of the display module 30. Along the first direction, the orthographic projection of the first portion 101 on the display module 30 completely covers the integrated circuit chip 100.

[0033] The display module 30 includes a display panel, which includes a display area 301, a bending area 302, and a bonding area 303. (Refer to...) Figure 8 Under the bending action of the bending area 302, the bonding area 303 can be bent to the backlight side of the display panel, and the integrated circuit chip 100 is bonded to the bonding area 303. The first direction is perpendicular to the light emission direction of the display module 30, and the first direction is perpendicular to the extension direction of the bending axis of the bending area 302. The mold for injection molding the first part 101 has two injection ports 201, and the distance L between the two injection ports 201 is greater than the distance L between the integrated circuit chip 100 in the second direction (the second direction is the extension direction of the bending axis, see reference). Figure 7 The length in the Y direction is such that the first part 101 formed by injection molding can completely cover the integrated circuit chip 100, so as to effectively protect the integrated circuit chip 100.

[0034] It should be noted that the length of the first part 101 in the second direction (it should be noted that when the first part 101 is arc-shaped, the length of the first part 101 in the second direction is the chord length) is adjustable, as long as the length of the first part 101 in the second direction is greater than the length of the integrated circuit chip 100 in the second direction. For example, the length of the first part 101 in the second direction is 25-40mm, but it is not limited to this. Figure 6 In the second direction, the length of the first portion 101 is 29.4 mm. Figure 7 In the second direction, the length of the first portion 101 is 35.91 mm.

[0035] It should be noted that when the number of integrated circuit chips 100 is set to at least 2, the at least 2 integrated circuit chips 100 are spaced apart along the second direction. In this case, the length of the first part 101 in the second direction is the sum of the total length of the at least 2 integrated circuit chips 100 in the second direction and the length of the gap between two adjacent integrated circuit chips 100.

[0036] It should be noted that the frame 10 surrounds the display module 30. The annular structure formed by the first part 101 and the second part 102 conforms to the circumferential shape of the display module 30. For example, if the display module 30 is rectangular, the frame 10 is rectangular; if the display module 30 is circular, the frame 10 is circular. The shape of the first part 101 conforms to the shape of the bonding side. For example, if the display module 30 is circular overall, the first part 101 is arc-shaped, to ensure the aesthetic appearance of the product.

[0037] In an exemplary embodiment, the second part 102 is made of PET double-sided adhesive, but is not limited thereto.

[0038] The first part 101 and the second part 102 cooperate to realize the separate setting of the adhesive frame 10, achieving integration with... Figure 2 The conventional circular injection molding of the frame 10 has the same limit of narrow bezel effect, and the interference fit between the injection mold and the heat dissipation layer of the display module 30 is no longer present, fundamentally solving the molding problem.

[0039] In an exemplary embodiment, the height of the first portion 101 and the height of the second portion 102 are the same in the light-emitting direction of the display module 30.

[0040] The display module 30 includes a display panel and a cover plate 31 located on the light-emitting side of the display panel. The cover plate 31 includes a central area for setting the display panel and an edge area located around the central area. The frame 10 is disposed in the edge area and between the back plate and the cover plate 31 of the display module 30. The height of the first part 101 and the height of the second part 102 are the same, which is beneficial to the sealing of the display module 30 and prevents light leakage.

[0041] In an exemplary embodiment, the first portion 101 is injection molded using epoxy resin with added conductive liquid.

[0042] The display panel of the display module 30 has various signal lines in the COP bending area. The radio frequency radiation of these signal lines can interfere with the 5G antenna. In this embodiment, a conductive liquid is added to the epoxy resin used to form the first part 101 by injection molding to improve the electromagnetic shielding performance of the COP bending area, thereby reducing the RF radiation of the signal lines and thus reducing the interference to the 5G antenna of the whole device.

[0043] refer to Figures 6-8 This invention also provides a frame molding die 20 for directly injection molding the first part 101 of the frame 10 described above onto the display module 30. The die includes a first mold frame 1 and a second mold frame 2. The first mold frame 1 is provided with a first mold core 3 having a first cavity, and the second mold frame 2 is provided with a second mold core 4 having a second cavity. The second cavity is used to accommodate the display module 30. When the first mold frame 1 and the second mold frame 2 are aligned, the first mold core 3, the display module 30, and the second mold core 4 together form a cavity for forming the first part 101 of the frame 10.

[0044] Compared to Figure 1 In this embodiment, the injection mold 20 for the middle frame 10 only needs to injection mold the first part 101, thus relative to... Figure 1 The injection mold shown can omit the remaining structural parts other than the structure used to form the first part 101, that is, the part corresponding to the non-bonding side of the display module 30 is omitted, and there is no need to make an interference fit with the heat dissipation layer of the display module 30, thus solving the problem of mold marks caused by the deformation of the heat dissipation layer.

[0045] For example, the first mold is provided with an injection port 201, which is connected to the inside of the first cavity to inject injection material.

[0046] For example, the shape of the plastic frame forming mold 20 corresponds to the shape of the first part 101 of the plastic frame 10, and at least one of the opposite ends of the plastic frame forming mold 20 is provided with the injection port 201.

[0047] In some embodiments, the molding die 20 has injection ports 201 at both opposite ends, and the distance between the two injection ports 201 can be set according to actual needs. The size of the cavity formed by the first cavity and the second cavity for forming the first part 101 can also be set according to actual needs. This allows for adjustment of the injection area range of the COP bending region, i.e., adjustment of the volume of the first part 101. If the overall size of the first part 101 on the bonding side of the display module 30 is too small and cannot meet the bonding requirements of the frame 40 that is attached to the whole machine, the two injection ports 201 can be shifted in the counterclockwise and clockwise directions respectively, thereby increasing the overall size of the first part 101.

[0048] It should be noted that in this embodiment, the frame 40 of the display device is connected to the plastic frame 10, and the two injection ports 201 move in opposite directions to increase the overall volume of the first part 101, thereby increasing the connection area between the plastic frame 10 and the frame 40.

[0049] refer to Figure 8 In an exemplary embodiment, the first cavity includes a first sidewall 401 disposed near the display module 30. When the first mold frame 1 and the second mold frame 2 are assembled, the first sidewall 401 is pressed against the display panel of the display module 30.

[0050] Specifically, the display panel includes a display area 301, a bending area 302, and a bonding area 303. The bending area 302 is located between the display area 301 and the bonding area 303. Under the bending action of the bending area 302, the bonding area 303 bends to the backlight side of the display panel. During injection molding, the display module 30 is fixedly accommodated in the second cavity. The first mold frame 1 and the second mold frame 2 are paired, and the first cavity and the second cavity are spliced ​​to form a cavity. Part of the display module 30 is located in the cavity, that is, the cavity is filled with injection molding material through the injection port 201, which wraps part of the display module 30 (at least the bending area 302) to effectively protect the bonding side of the display module 30.

[0051] However, it should be noted that an integrated circuit chip 100 is bonded to the binding area 303, and when the bending area 302 is in a bent state, the integrated circuit chip 100 is exposed in the first part 101.

[0052] For example, the integrated circuit chip 100 is very fragile. If interference occurs between the first part 101 and the integrated circuit chip 100, the integrated circuit chip 100 may be damaged, resulting in malfunction of the display module. Therefore, in this embodiment, there is a gap between the integrated circuit chip 100 and the first part 101.

[0053] This invention also provides a display device, including a display module 30 and the aforementioned frame 10, wherein the frame 10 surrounds the periphery of the display module 30.

[0054] The first part 101 is directly injection molded onto the display module 30, and the second part 102 is molded separately and then assembled with the display module 30. This can avoid the injection mold used to form the frame 10 from being too rigidly fitted with the heat dissipation layer of the display module 30, which could lead to mold printing problems.

[0055] In an exemplary embodiment, the display module 30 includes a display panel and a cover plate 31 located on the light-emitting side of the display panel. The cover plate 31 includes a central region for setting the display panel and an edge region located around the central region. The frame 10 is connected to the edge region.

[0056] A light-shielding layer is provided between the edge area and the frame 10.

[0057] The light-shielding layer is formed by coating ink on the edge area, but is not limited to this; for example, it can be formed using light-shielding tape.

[0058] refer to Figure 10 In an exemplary embodiment, the display device further includes a frame 40, which surrounds the periphery of the frame 10 and the display module 30. The frame 40 includes a base plate 41 and side plates 42 located around the base plate 41.

[0059] The frame 10 is fixedly connected between the base plate 41 and the side plate 42, and the side of the cover plate 31 is connected to the side plate 42.

[0060] To avoid the bending area 302 of the display panel, in related technologies, the frame 40 is connected to the cover plate 31, and there is a gap between the frame 40 and the bending area 302. (Refer to...) Figure 9In this embodiment, the first portion 101 is injection molded onto the display module 30. The first portion 101 corresponds to the COP bending area of ​​the display module 30, that is, the epoxy resin used to form the first portion 101 fills the COP bending area of ​​the display module 30, which is equivalent to covering the outer side of the bending area 302 with an elastic protective cover. In this way, the frame 40 can be set inward, and the frame 40 can be bonded to the first portion 101 instead of being bonded to the CG, thereby achieving an extremely narrow frame 40 of the display module 30. (Refer to...) Figure 10 .

[0061] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A glue frame, which is arranged at the periphery of a display module, the display module comprising a binding side and a non-binding side, characterized in that, The frame includes a first part and a second part that enclose and form a ring structure. The first part is formed directly on the outside of the display module by injection molding and is positioned toward the bonding side of the display module. The second part is made of PET double-sided adhesive.

2. The frame according to claim 1, characterized in that, Along the first direction, the display module includes a display area and a bonding side located on one side of the display area. The bonding side includes an integrated circuit chip bonded to the display panel of the display module. Along the first direction, the orthographic projection of the first portion on the display module completely covers the integrated circuit chip.

3. The frame according to claim 1, characterized in that, In the light emission direction of the display module, the height of the first part and the height of the second part are the same.

4. The frame according to claim 1, characterized in that, The first part is injection molded using epoxy resin with added conductive liquid.

5. A molding die for directly injection molding a first portion of the frame as described in any one of claims 1-4 onto a display module, characterized in that, It includes a first mold frame and a second mold frame. The first mold frame is provided with a first mold core having a first cavity, and the second mold frame is provided with a second mold core having a second cavity. The second cavity is used to accommodate the display module. When the first mold frame and the second mold frame are assembled, the first mold core, the display module, and the second mold core together form a cavity for forming only the first part of the frame.

6. The mold for forming a plastic frame according to claim 5, characterized in that, The first cavity includes a first sidewall located near the display module. When the first mold frame and the second mold frame are assembled, the first sidewall is pressed against the display panel of the display module.

7. A display device, characterized in that, It includes a display module and a frame as described in any one of claims 1-4, the frame being disposed around the periphery of the display module.

8. The display device according to claim 7, characterized in that, The display module includes a display panel and a cover plate located on the light-emitting side of the display panel. The cover plate includes a central region for setting the display panel and an edge region located around the central region. The frame is connected to the edge region.

9. The display device according to claim 8, characterized in that, It also includes a frame surrounding the periphery of the plastic frame and the display module, the frame including a base plate and side plates located around the base plate; The frame is fixedly connected between the base plate and the side plate, and the side of the cover plate is connected to the side plate.

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