I-beam hole welding cleaning method, device, equipment and storage medium

Abstract

The application relates to the field of laser cutting, and discloses a method, a device, equipment and a storage medium for root cleaning of a welding hole of an I-shaped steel, wherein the method comprises the following steps: placing an I-shaped steel on a machine tool; establishing a corresponding relationship between a laser cutting head and a Z-axis coordinate, and obtaining a current height of the laser cutting head; wherein the current height of the laser cutting head is used for representing the vertical distance between the laser cutting head and the web plate, and the current height is greater than half the length of the flange plate; the laser cutting head emits laser and forms a light spot on the surface of the web plate, the horizontal position of the laser cutting head is determined through the light spot; and the I-shaped steel is processed in a track mode with the horizontal position at the current height as a reference to form a welding hole. When the I-shaped steel is processed in the welding hole mode through the method for root cleaning of a welding hole of an I-shaped steel, an ideal welding hole close to the root of the flange plate can be directly obtained without other processes.

Description

Technical Field

[0001] This invention relates to the field of laser cutting, and in particular to a method, apparatus, equipment, and storage medium for cleaning the weld holes of I-beams. Background Technology

[0002] In the steel structure industry of construction, I-beams and welding processes are commonly used. The horizontal axis of an I-beam is called the web, and the two vertical axes are called flanges. There is a rounded corner at the connection between the web and flanges. To ensure the welding effect between two sections of I-beam, a bevel is usually cut on the upper surface of one side of the I-beam to leave a gap for the weld filler, thus ensuring weld strength. However, the weld filler can easily overflow to the other side of the flange, so a backing plate needs to be welded below the connection point on the other side of the I-beam. Therefore, a semi-circular hole needs to be drilled in the web of both sides of the I-beam for the backing plate to be inserted; this semi-circular hole is called a weld hole.

[0003] However, when machining material cross-sections using existing technology (such as machining weld holes on I-beams), it is practically desirable for the semi-circular hole of the weld hole to be flush with the flange. Theoretically, this requires movement along the root of the flange while the laser remains parallel to the flange. However, existing technology cannot achieve this machining effect. To prevent the cutting head from colliding with the flange, there are two common solutions:

[0004] 1. Maintaining a safety distance will directly lead to an increase in the length of the weld hole, which in turn will increase the cost of subsequent processes;

[0005] 2. Adjust the laser direction and tilt it to the opposite side of the wing plate. However, after tilting, the laser beam will pass through the wing plate, causing the wing plate to be damaged or even cut through, which may directly lead to scrap. Moreover, it only reduces the length of the stub and cannot completely remove it.

[0006] None of the above solutions can achieve the ideal weld hole. The ideal weld hole should be close to the root of the flange. After adjusting the machining posture, it is inevitable that there will be a root, which will have to be added to the subsequent process, increasing the processing cost. Summary of the Invention

[0007] This invention provides a method, apparatus, equipment, and storage medium for cleaning weld holes in I-beams, to obtain ideal weld holes and reduce the processing cost of weld holes.

[0008] According to a first aspect of the present invention, a method for cleaning the weld holes of an I-beam is provided, comprising:

[0009] An I-beam is placed on a machine tool; wherein the I-beam includes a web and flanges;

[0010] Establish the correspondence between the laser cutting head and the Z-axis coordinate, and obtain the current height of the laser cutting head; wherein, the current height of the laser cutting head is used to characterize the vertical distance between the laser cutting head and the web plate, and the current height is greater than half the length of the wing plate;

[0011] The laser cutting head emits a laser and forms a spot on the surface of the web plate, and the horizontal position of the laser cutting head is determined by the spot.

[0012] Using the horizontal position at the current height as a reference, the I-beam is machined to form a weld hole.

[0013] Optionally, establishing the correspondence between the laser cutting head and the Z-axis coordinates specifically includes:

[0014] A sensor is placed vertically above the web, and the distance between the sensor and the web is greater than half the length of the wing plate.

[0015] The sensor is moved downwards to be close to the web plate, and the vertical distance between the sensor and the web plate is recorded.

[0016] The position of the laser cutting head is obtained through the sensor, and the correspondence between the laser cutting head and the Z-axis is established based on the vertical distance of the sensor from the web and the position of the laser cutting head.

[0017] Optionally, the sensor is a capacitive ranging sensor or a laser ranging sensor.

[0018] Optionally, determining the horizontal position of the laser cutting head using the light spot specifically includes:

[0019] Obtain the position of the light spot;

[0020] The laser cutting head is horizontally adjusted so that the position of the laser spot is at the target position, wherein the target position is the initial position when the I-beam is processed along its trajectory.

[0021] Optionally, before obtaining the position of the light spot, the method further includes:

[0022] Obtain the diameter of the light spot and the position of its edge;

[0023] Determine whether the diameter of the light spot is greater than a first preset value;

[0024] If the diameter of the light spot is greater than a first preset value, the trajectory is compensated inward so that the compensated trajectory is less than or equal to the edge position of the light spot.

[0025] Optionally, the width of the actual light spot and the edge position of the light spot are determined through a pre-cutting test, wherein the width of the cut is the diameter of the light spot; and the edge of the cut is the edge position of the light spot.

[0026] According to a second aspect of the present invention, a root cleaning device for weld holes in I-beams is provided, comprising:

[0027] A placement module for placing an I-beam onto a machine tool; wherein the I-beam includes a web and flanges;

[0028] The height determination module is used to establish the correspondence between the laser cutting head and the Z-axis coordinate, and to obtain the current height of the laser cutting head; wherein, the current height of the laser cutting head is used to characterize the distance between the laser cutting head and the web plate, and the current height is greater than half the length of the wing plate;

[0029] A horizontal position determination module is used to determine the horizontal position of the laser cutting head based on the spot formed on the surface of the web plate by the laser emitted by the laser cutting head.

[0030] The trajectory processing module is used to perform trajectory processing on the I-beam with the horizontal position at the current height as a reference to form a weld hole.

[0031] Optionally, the height determination module specifically includes:

[0032] The sensor is placed vertically above the web, and the distance between the sensor and the web is greater than half the length of the wing plate;

[0033] A moving module is used to move the sensor downward to bring it close to the web plate and record the vertical distance between the sensor and the web plate;

[0034] The relationship determination module is used to determine the position of the laser cutting head obtained by the sensor and to establish the correspondence between the laser cutting head and the Z-axis based on the vertical distance of the sensor from the web.

[0035] The height acquisition module is used to obtain the current height of the laser cutting head based on the correspondence between the laser cutting head and the Z-axis.

[0036] According to a third aspect of the present invention, an electronic device is provided, including a memory, a processor, and a program stored in the memory and executable on the processor, wherein the processor executes the program to implement the steps of the method described in the first aspect of the present invention.

[0037] According to a fourth aspect of the present invention, a storage medium is provided having a program stored thereon, which, when executed by a processor, implements the steps of the method described in the first aspect of the present invention.

[0038] The method for cleaning the weld holes of I-beams provided by this invention eliminates the need for sensors to control the distance between the laser cutting head and the target processing plane by obtaining the position of the laser cutting head and the I-beam in advance. The horizontal position of the laser cutting head is determined by the position of the laser spot, and in an optional scheme, the specific position during laser cutting is further refined by controlling the size of the laser spot area. Furthermore, the method for cleaning the weld holes of I-beams provided by this invention can remove the root residue when processing the I-beam to form weld holes, thus reducing production costs. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a flowchart illustrating the root cleaning method for I-beam weld holes in one embodiment of the present invention. Figure 1 ;

[0041] Figure 2 This is a flowchart illustrating the root cleaning method for I-beam weld holes in one embodiment of the present invention. Figure 2 ;

[0042] Figure 3 This is a flowchart illustrating the root cleaning method for I-beam weld holes in one embodiment of the present invention. Figure 3 ;

[0043] Figure 4 This is a block diagram of a root cleaning device for I-beam weld holes according to an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram illustrating the structure of an electronic device exemplified by the present invention. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0047] I-beams offer high design flexibility and are easy to cut and weld, allowing for customized processing to meet specific needs. To ensure effective welding between two I-beam sections, a bevel is cut on the upper surface of one side of the I-beam, leaving a gap for filler metal to be inserted, thus ensuring weld strength. However, filler metal can easily overflow to the other side of the flange during insertion, so a backing plate needs to be welded below the joint on the other side of the I-beam. Therefore, a semi-circular hole needs to be drilled in the web of both sides of the I-beam for inserting the backing plate; this semi-circular hole serves as the weld hole.

[0048] However, in the existing technology, there is a root residue when machining weld holes, and removing the root requires additional processes, which increases production costs.

[0049] In view of this, the present invention proposes a method for cleaning the root of weld holes in I-beams, in order to solve the problem of leaving roots during the processing of I-beams and reduce production costs.

[0050] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0051] Please refer to Figure 1 In a specific embodiment of the present invention, a method for cleaning the root of weld holes in I-beams is provided, comprising:

[0052] S1: Place an I-beam on a machine tool; wherein the I-beam includes a web and flanges.

[0053] In a specific embodiment of the present invention, the I-beam refers to a steel section with an I-shaped cross-section, such as a regular I-beam or a lightweight I-beam, and the material of the I-beam in the embodiment of the present invention is steel.

[0054] Of course, it is understood that this invention is not limited to the material of the I-beam; I-beams made of other materials are also within the scope of protection of this invention.

[0055] S2: Establish the correspondence between the laser cutting head and the Z-axis coordinate, and obtain the current height of the laser cutting head; wherein, the current height of the laser cutting head is used to characterize the vertical distance between the laser cutting head and the web plate, and the current height is greater than half the length of the wing plate.

[0056] In the above-mentioned correspondence between the laser cutting head and the Z-axis coordinate, the Z-axis coordinate corresponds to the coordinate in the vertical direction of the web of the I-beam. By simulating the laser cutting head with a sensor, the relative position of the laser cutting head and the web of the I-beam in the vertical direction can be obtained in advance. This eliminates the need for a sensor to obtain the distance between the laser cutting head and the web of the I-beam during processing, thereby improving the processing speed of the I-beam. Furthermore, by establishing the relationship between the laser cutting head and the Z-axis coordinate in advance, the vertical distance between the laser cutting head and the web of the I-beam can be determined more accurately.

[0057] Please refer to the following: Figure 2 In one embodiment, establishing the correspondence between the laser cutting head and the Z-axis coordinate specifically includes:

[0058] S21: A sensor is placed vertically above the web, and the distance between the sensor and the web is greater than half the length of the wing plate.

[0059] When placing a sensor vertically above the web, the length of the flange of the I-beam needs to be obtained by means of a ruler, a distance measuring instrument, or other methods. The distance between the sensor and the web must be greater than half the length of the flange.

[0060] In the embodiments of this invention, the sensor is a capacitive ranging sensor or a laser ranging sensor. Of course, it is understood that this invention is not limited to the type of sensor, and other sensors capable of measuring distance are all within the protection scope of this invention.

[0061] S22: Move the sensor downwards to get close to the web plate, and record the vertical distance between the sensor and the web plate.

[0062] In one embodiment, a machine is used to fix the sensor vertically above the web plate, and the machine is controlled to move the sensor downward so that the sensor moves downward to be close to the web plate. At the same time, the vertical distance between the sensor and the web plate is recorded by the sensor.

[0063] S23: The position of the laser cutting head is obtained through the sensor, and the correspondence between the laser cutting head and the Z-axis is established based on the vertical distance between the sensor and the web and the position of the laser cutting head.

[0064] In one embodiment, an I-beam is placed on a machine tool, and the cutting position of the laser cutting head on the machine tool relative to the web of the I-beam is obtained by a sensor. In this embodiment, the sensor is a capacitive distance sensor or a laser distance sensor. It is understood that this invention is not limited to the type of sensor, and other sensors capable of measuring distance are within the scope of protection of this invention.

[0065] S3: The laser cutting head emits a laser and forms a light spot on the surface of the wing plate, and the horizontal position of the laser cutting head is determined by the light spot.

[0066] In one specific embodiment, determining the horizontal position of the laser cutting head using the light spot specifically includes:

[0067] S31: Obtain the position of the light spot.

[0068] In a specific embodiment of the present invention, the laser cutting head emits a beam of light, which forms a spot on the web of the I-beam. The specific position of the spot on the web of the I-beam can be obtained by human observation.

[0069] S32: Adjust the laser cutting head horizontally so that the position of the laser spot is at the target position, wherein the target position is the initial position when the I-beam is processed along its trajectory.

[0070] Please refer to the following: Figure 3 Before obtaining the position of the light spot, the method further includes:

[0071] S311: Obtain the diameter of the light spot and the edge position of the light spot.

[0072] In one specific embodiment, the width of the actual light spot and the edge position of the light spot can be determined by conducting a pre-cutting experiment, wherein the width of the cut is the diameter of the light spot; and the edge of the cut is the edge position of the light spot.

[0073] Of course, the present invention is not limited to obtaining the diameter and edge position of the light spot through a pre-cutting experiment. Other methods, such as obtaining the diameter and edge position of the light spot through a beam quality analyzer, are also within the scope of protection of the present invention.

[0074] S312: Determine whether the diameter of the light spot is greater than a first preset value.

[0075] S313: If the diameter of the light spot is greater than the first preset value, the trajectory is compensated inward so that the edge of the compensated trajectory is less than or equal to the edge position of the light spot.

[0076] Specifically, the phrase "the edge of the trajectory is less than or equal to the edge of the light spot" means that the edge of the trajectory is either inside the edge of the light spot or entirely on the edge of the light spot.

[0077] If the area of ​​the light spot is not greater than the first preset value, then no compensation is required for the trajectory.

[0078] The trajectory refers to the processing trajectory of the laser cutting head. By compensating for the trajectory as described above, the processing trajectory when cutting I-beams with the laser cutting head can be made more accurate.

[0079] Furthermore, the present invention is not limited to obtaining the horizontal position of the laser cutting head. Specifically, in another embodiment of the present invention, the horizontal position of the laser cutting head can also be obtained directly through a ranging sensor. Specifically, the horizontal distance between the ranging sensor and the wing plate and the position of the laser cutting head are recorded by the ranging sensor, and a correspondence between the laser cutting head and the X-axis is established based on the horizontal distance between the ranging sensor and the wing plate and the position of the laser cutting head. The horizontal position of the laser cutting head from the root of the wing plate is directly determined through the X-axis.

[0080] S4: Using the horizontal position at the current height as a reference, perform trajectory machining on the I-beam to form a weld hole.

[0081] The method for cleaning the weld holes of I-beams provided by this invention obtains the positions of the laser cutting head and the I-beam in advance, so that the distance between the laser cutting head and the target processing plane does not need to be controlled by a sensor during the processing. The horizontal position of the laser cutting head is determined by the position of the laser spot, and in its optional scheme, the specific position during laser cutting is further refined by controlling the size of the laser spot area. Furthermore, when processing I-beams to form weld holes, the root residue can be basically or even completely removed using the method for cleaning the weld holes of I-beams provided by this invention.

[0082] Furthermore, the root cleaning method for I-beam weld holes provided by this invention is also applicable to drilling screw holes at the root of type 9 tube lugs. That is, this invention is not limited to root cleaning of I-beam weld holes. Any other process that requires material processing and root removal, as long as the root cleaning is performed using the above-mentioned root cleaning method for I-beam weld holes, is within the protection scope of this invention.

[0083] Please refer to Figure 4 In one embodiment of the present invention, a root cleaning device for weld holes in I-beams is also provided, comprising:

[0084] The placement module 100 is used to place the I-beam on the machine tool; wherein the I-beam includes a web and flanges.

[0085] The height determination module 200 is used to establish the correspondence between the laser cutting head and the Z-axis coordinate, and to obtain the current height of the laser cutting head; wherein, the current height of the laser cutting head is used to characterize the distance between the laser cutting head and the web plate, and the current height is greater than half the length of the wing plate.

[0086] The horizontal position determination module 300 is used to determine the horizontal position of the laser cutting head based on the light spot formed on the web surface by the laser emitted by the laser cutting head.

[0087] The trajectory processing module 400 is used to perform trajectory processing on the I-beam with the horizontal position at the current height as a reference to form a weld hole.

[0088] Please continue to refer to this. Figure 4 In one specific embodiment, the height determination module 200 of this invention specifically includes:

[0089] Sensor 201 is placed vertically above the web, and the distance between the sensor and the web is greater than half the length of the wing.

[0090] The moving module 202 is used to move the sensor downward to get closer to the web plate and record the vertical distance between the sensor and the web plate.

[0091] The relationship determination module 203 is used to determine the position of the laser cutting head obtained by the sensor and to establish the correspondence between the laser cutting head and the Z-axis based on the vertical distance of the sensor from the web.

[0092] The height acquisition module 204 is used to acquire the current height of the laser cutting head based on the correspondence between the laser cutting head and the Z-axis.

[0093] Please refer to Figure 5 This invention also provides an electronic device 1, comprising:

[0094] Processor 11; and

[0095] Memory 12 is used to store the executable instructions of the processor;

[0096] The processor 11 is configured to execute the infrared thermopile sensor temperature compensation method described above by executing the executable instructions.

[0097] The processor 11 can communicate with the memory 12 via the bus 13.

[0098] This invention also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-mentioned infrared thermopile sensor temperature compensation method.

[0099] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0100] In the description of this specification, the references to terms such as "an embodiment," "an example," "a specific implementation process," and "an example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method of cleaning a welding hole of an I-beam, characterized by, The method comprises the following steps: placing an I-beam on a machine tool, wherein the I-beam comprises a web plate and a wing plate; establishing a corresponding relationship between a laser cutting head and a Z-axis coordinate, and obtaining a current height of the laser cutting head, wherein the current height of the laser cutting head is used to represent a vertical distance between the laser cutting head and the web plate, and the current height is greater than half of the length of the wing plate; the laser cutting head emits laser and forms a light spot on the surface of the web plate, and the horizontal position of the laser cutting head is determined through the light spot; the I-beam is processed according to the horizontal position at the current height to form a welding hole; wherein the horizontal position of the laser cutting head is determined through the light spot specifically comprises: determining the diameter of the actual light spot and the edge position of the actual light spot through a pre-cutting test to obtain the diameter of the light spot and the edge position of the light spot, wherein the width of the cutting gap is the diameter of the light spot, and the edge of the cutting gap is the edge position of the light spot; obtaining the position of the light spot; adjusting the horizontal position of the laser cutting head so that the position of the light spot is at a target position, wherein the target position is the initial position of the I-beam when the I-beam is processed according to the track.

2. The I-beam welding hole cleaning method according to claim 1, wherein the corresponding relationship between the laser cutting head and the Z-axis coordinate is established specifically by: placing a sensor vertically above the web plate, and the distance between the sensor and the web plate is greater than half of the length of the wing plate; moving the sensor downward to be close to the web plate, and recording the vertical distance between the sensor and the web plate; obtaining the position of the laser cutting head through the sensor, and establishing the corresponding relationship between the laser cutting head and the Z-axis according to the vertical distance between the sensor and the web plate and the position of the laser cutting head.

3. The I-beam welding hole cleaning method according to claim 2, wherein the sensor is a capacitive distance sensor or a laser distance sensor.

4. The I-beam welding hole cleaning method according to claim 1, wherein before obtaining the position of the light spot, it further comprises: judging whether the diameter of the light spot is greater than a first preset value; if the diameter of the light spot is greater than the first preset value, the track is inwardly compensated so that the edge of the compensated track is less than or equal to the edge position of the light spot.

5. A device for cleaning the root of a welding hole of an I-beam, characterized by comprising: The method is used to execute the I-beam welding hole cleaning method according to claim 1, comprising: a placing module for placing an I-beam on a machine tool, wherein the I-beam comprises a web plate and a wing plate; a height determining module for establishing a corresponding relationship between a laser cutting head and a Z-axis coordinate, and obtaining a current height of the laser cutting head, wherein the current height of the laser cutting head is used to represent a vertical distance between the laser cutting head and the web plate, and the current height is greater than half of the length of the wing plate; a horizontal position determining module for determining the horizontal position of the laser cutting head according to the light spot formed on the surface of the web plate by the laser emitted by the laser cutting head; A trajectory processing module is configured to process the I-beam at the horizontal position at the current height to form a welding hole.

6. The I-beam welding hole back cleaning device according to claim 5, characterized in that, The height determining module specifically comprises: A sensor is arranged vertically above the web plate, and the distance between the sensor and the web plate is greater than half the length of the wing plate; A moving module is configured to move the sensor downward to be close to the web plate and record the vertical distance between the sensor and the web plate; A relationship determining module is configured to establish the corresponding relationship between the laser cutting head and the Z-axis according to the position of the laser cutting head obtained by the sensor and the vertical distance between the sensor and the web plate; A height obtaining module is configured to obtain the current height of the laser cutting head according to the corresponding relationship between the laser cutting head and the Z-axis.

7. An electronic device comprising a memory, a processor, and a program stored in the memory and executable on the processor, characterized by The processor executes the program to implement the steps of the method of any one of claims 1-4.

8. A storage medium having stored thereon a program, characterized by The program is executed by the processor to implement the steps of the method of any one of claims 1-4.

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