Modeling method and device of equipment, processor and electronic equipment

Abstract

The application discloses a modeling method and device of equipment, a processor and an electronic device. The method comprises the following steps: determining a plurality of components of a target equipment, wherein the target equipment is an equipment to be modeled in three dimensions, and the components are at least one of the following: components and boards; acquiring a component 3D model set and a board 3D model set, wherein the component 3D model set at least comprises 3D models of a plurality of components, and the board 3D model set at least comprises 3D models of a plurality of boards; determining a 3D model of each component based on the component 3D model set and the board 3D model set; and obtaining a 3D model of the target equipment according to the 3D model of each component. Through the application, the problem that the effect of 3D modeling of equipment is poor in the prior art is solved.

Description

Technical Field

[0001] This application relates to the field of 3D modeling technology, and more specifically, to a modeling method and apparatus for a device, a processor, and an electronic device. Background Technology

[0002] In related technologies, the method of using digital twin technology to create 3D models of data center equipment involves modeling each device separately. In communication networks, there are tens of thousands of devices from different manufacturers, specialties, and models, with countless individual circuit boards. This method requires a massive investment of manpower, time, and money, and has very low reusability; only two completely identical devices can be reused. Even within the same model, differences in the number and arrangement of circuit boards prevent direct reuse. Furthermore, the models are wasted when equipment is decommissioned. New devices require remodeling, and changes to existing network equipment circuit boards make timely adjustments difficult. These issues necessitate dedicated teams for the construction and maintenance of data center 3D modeling. The following are pressing issues that need to be addressed to improve the efficiency of data center equipment 3D modeling and reduce its operational costs through technological means:

[0003] (1) 3D modeling is inefficient.

[0004] (2) Poor timeliness of new construction and operation and maintenance in the later stage.

[0005] (3) Adjustments based on the existing network equipment take a long time.

[0006] (4) It consumes a huge amount of manpower, time and money.

[0007] The above problems mean that data center equipment requires huge investment and costs to build 3D digital models, making it difficult to apply them quickly in production and operation.

[0008] There is currently no effective solution to the problem of poor 3D modeling of equipment in related technologies. Summary of the Invention

[0009] The main objective of this application is to provide a method and apparatus for modeling devices, a processor, and an electronic device, in order to solve the problem of poor 3D modeling of devices in related technologies.

[0010] To achieve the above objectives, according to one aspect of this application, a method for modeling a device is provided. The method includes: identifying multiple components constituting a target device, wherein the target device is a device to be 3D modeled, and the components are at least one of the following: electronic components and circuit boards; acquiring a set of 3D models of electronic components and a set of 3D models of circuit boards, wherein the set of 3D models of electronic components includes at least a plurality of 3D models of electronic components, and the set of 3D models of circuit boards includes at least a plurality of 3D models of circuit boards; determining a 3D model of each component based on the set of 3D models of electronic components and the set of 3D models of circuit boards; and obtaining a 3D model of the target device based on the 3D model of each component.

[0011] Further, if the multiple components are multiple circuit boards, obtaining the 3D model of the target device based on the 3D model of each component includes: determining the number of the multiple circuit boards in the target device and the slot number corresponding to each circuit board; deploying the 3D model of each circuit board into a first preset 3D model based on the number of the multiple circuit boards in the target device and the slot number corresponding to each circuit board to obtain a first model, wherein the first preset 3D model is a blank 3D model corresponding to the target device; obtaining the attribute information of the target device; adding the attribute information of the target device to the first model to obtain the 3D model of the target device.

[0012] Further, if the plurality of components includes a plurality of parts and a plurality of boards, determining the 3D model of each component based on the set of 3D models of the parts and the set of 3D models of the boards includes: determining the type information and attribute information of each part in the target device; selecting a plurality of second models from the set of 3D models of the parts based on the type information and attribute information of each part in the target device, wherein each second model is a 3D model of each part in the target device; determining the name information and attribute information of each board in the target device; selecting a plurality of third models from the set of 3D models of the boards based on the name information and attribute information of each board in the target device, wherein each third model is a 3D model of each board in the target device; and using each second model and each third model as the 3D model of each component.

[0013] Furthermore, obtaining the component 3D model set and the board 3D model set includes: obtaining 3D models of multiple components; summarizing the 3D models of the multiple components to obtain the component 3D model set; and determining the board 3D model set based on the component 3D model set.

[0014] Further, based on the component 3D model set, determining the board 3D model set includes: selecting multiple fourth models from the component 3D model set, wherein each fourth model is a 3D model of each component that makes up each board; determining the number of multiple components that make up each board and the arrangement of each component; deploying the multiple fourth models into a second preset 3D model according to the number of multiple components that make up each board and the arrangement of each component to obtain a fifth model, wherein the second preset 3D model is a blank 3D model corresponding to each board; obtaining the attribute information of each board; adding the attribute information of each board to the fifth model to obtain a 3D model of each board; and summarizing the 3D models of each board to obtain the board 3D model set.

[0015] Further, selecting multiple fourth models from the component 3D model set includes: acquiring multiple components that make up each board; determining the type information and attribute information of each component that makes up each board; and selecting the multiple fourth models from the component 3D model set based on the type information and attribute information of each component that makes up each board.

[0016] Furthermore, if the multiple components are multiple circuit boards, after obtaining the 3D model of the target device based on the 3D model of each component, the method further includes: obtaining multiple circuit boards in a first device, wherein the first device is the device to be 3D modeled after the target device has been 3D modeled; determining whether the names of the multiple circuit boards in the first device are the same as the names of the multiple circuit boards in the target device; if the names of the multiple circuit boards in the first device are the same as the names of the multiple circuit boards in the target device, then determining whether the number of the multiple circuit boards in the first device is the same as the number of the multiple circuit boards in the target device; if the number of the multiple circuit boards in the first device is different from the number of the multiple circuit boards in the target device, then obtaining the 3D model of the first device by changing the number of circuit board models in the 3D model of the target device.

[0017] To achieve the above objectives, according to another aspect of this application, a device modeling apparatus is provided. The apparatus includes: a first determining unit for determining a plurality of components constituting a target device, wherein the target device is a device to be 3D modeled, and the components are at least one of the following: electronic components and circuit boards; a first acquiring unit for acquiring a set of 3D models of electronic components and a set of 3D models of circuit boards, wherein the set of 3D models of electronic components includes at least a plurality of 3D models of electronic components, and the set of 3D models of circuit boards includes at least a plurality of 3D models of circuit boards; a second determining unit for determining a 3D model of each component based on the set of 3D models of electronic components and the set of 3D models of circuit boards; and a third determining unit for obtaining a 3D model of the target device based on the 3D model of each component.

[0018] Further, if the plurality of components are multiple circuit boards, the third determining unit includes: a first determining subunit, used to determine the number of the plurality of circuit boards in the target device and the slot number corresponding to each circuit board; a first deployment subunit, used to deploy the 3D model of each circuit board to a first preset 3D model according to the number of the plurality of circuit boards in the target device and the slot number corresponding to each circuit board, to obtain a first model, wherein the first preset 3D model is a blank 3D model corresponding to the target device; a first acquiring subunit, used to acquire the attribute information of the target device; and a first adding subunit, used to add the attribute information of the target device to the first model to obtain the 3D model of the target device.

[0019] Further, if the plurality of components includes a plurality of parts and a plurality of boards, the second determining unit includes: a second determining subunit, used to determine the type information and attribute information of each part in the target device; a first selecting subunit, used to select a plurality of second models from the set of 3D models of parts based on the type information and attribute information of each part in the target device, wherein each second model is a 3D model of each part in the target device; a third determining subunit, used to determine the name information and attribute information of each board in the target device; a second selecting subunit, used to select a plurality of third models from the set of 3D models of boards based on the name information and attribute information of each board in the target device, wherein each third model is a 3D model of each board in the target device; and a fourth determining subunit, used to use each second model and each third model as a 3D model of each part.

[0020] Further, the first acquisition unit includes: a second acquisition subunit, used to acquire 3D models of multiple components; a first summarization subunit, used to summarize the 3D models of the multiple components to obtain the component 3D model set; and a fifth determination subunit, used to determine the board 3D model set based on the component 3D model set.

[0021] Further, the fifth determining subunit includes: a first selection module, used to select multiple fourth models from the component 3D model set, wherein each fourth model is a 3D model of each component constituting each board; a first determining module, used to determine the number of multiple components constituting each board and the arrangement of each component; a first deployment module, used to deploy the multiple fourth models to a second preset 3D model according to the number of multiple components constituting each board and the arrangement of each component to obtain a fifth model, wherein the second preset 3D model is a blank 3D model corresponding to each board; a first acquisition module, used to acquire the attribute information of each board; a first adding module, used to add the attribute information of each board to the fifth model to obtain a 3D model of each board; and a first summarizing module, used to summarize the 3D models of each board to obtain the board 3D model set.

[0022] Further, the first selection module includes: a first acquisition submodule, used to acquire multiple components that make up each board; a first determination submodule, used to determine the type information and attribute information of each component that makes up each board; and a first selection submodule, used to select the multiple fourth models from the component 3D model set based on the type information and attribute information of each component that makes up each board.

[0023] Further, if the plurality of components are multiple circuit boards, the device further includes: a second acquisition unit, configured to acquire multiple circuit boards in the first device after obtaining the 3D model of the target device based on the 3D model of each component, wherein the first device is the device to be 3D modeled after the target device has been 3D modeled; a first judgment unit, configured to judge whether the names of the multiple circuit boards in the first device are the same as the names of the multiple circuit boards in the target device; a second judgment unit, configured to judge whether the number of the multiple circuit boards in the first device is the same as the number of the multiple circuit boards in the target device if the names of the multiple circuit boards in the first device are the same as the names of the multiple circuit boards in the target device; and a first processing unit, configured to obtain the 3D model of the first device by changing the number of circuit board models in the 3D model of the target device if the number of the multiple circuit boards in the first device is different from the number of the multiple circuit boards in the target device.

[0024] To achieve the above objectives, according to another aspect of this application, a processor is provided for running a program, wherein the program executes the modeling method for the device described in any one of the above claims.

[0025] To achieve the above objectives, according to another aspect of this application, an electronic device is provided, the electronic device including one or more processors and a memory, the memory being used to store one or more programs, wherein, when the one or more programs are executed by the one or more processors, the one or more processors cause the one or more processors to implement the device modeling method described in any of the above.

[0026] This application employs the following steps: identifying multiple components constituting a target device, wherein the target device is the device to be 3D modeled, and the components are at least one of the following: electronic components and circuit boards; obtaining a set of 3D models for the electronic components and a set of 3D models for the circuit boards, wherein the set of 3D models for the electronic components includes at least 3D models of multiple electronic components, and the set of 3D models for the circuit boards includes at least 3D models of multiple circuit boards; determining the 3D model of each component based on the set of 3D models for the electronic components and the set of 3D models for the circuit boards; and obtaining the 3D model of the target device based on the 3D model of each component. This solves the problem of poor 3D modeling results for devices in related technologies. By obtaining the set of 3D models for the electronic components and the set of 3D models for the circuit boards, and determining the 3D model of each component of the target device to be 3D modeled based on the set of 3D models for the electronic components and the set of 3D models for the circuit boards, and then obtaining the 3D model of the target device based on the 3D model of each component, the efficiency of 3D modeling of devices is improved, the cost of 3D modeling of devices is reduced, and the effect of 3D modeling of devices is improved. Attached Figure Description

[0027] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0028] Figure 1 This is a flowchart of a device modeling method provided according to an embodiment of this application;

[0029] Figure 2 This is a flowchart illustrating the construction of a set of 3D models of the circuit board in an embodiment of this application;

[0030] Figure 3 This is a flowchart illustrating the generation of a 3D model of the device in an embodiment of this application;

[0031] Figure 4 This is a flowchart of an optional device modeling method provided according to an embodiment of this application;

[0032] Figure 5 This is a schematic diagram of a modeling apparatus for a device provided according to an embodiment of this application;

[0033] Figure 6 This is a schematic diagram of an electronic device provided according to an embodiment of this application. Detailed Implementation

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0035] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0036] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0037] It should be noted that all information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for display, data used for analysis, etc.) involved in this disclosure are information and data authorized by the user or fully authorized by all parties. For example, this system has an interface with relevant users or organizations. Before obtaining relevant information, it is necessary to send an acquisition request to the aforementioned user or organization through the interface, and obtain the relevant information after receiving consent information from the aforementioned user or organization.

[0038] For ease of description, the following explains some of the nouns or terms used in the embodiments of this application:

[0039] Circuit board: A circuit board is a type of printed circuit board (PCB). It is manufactured with a core that can be inserted into the slot of the computer's main circuit board (motherboard) to control the operation of hardware, such as monitors, capture cards, and other devices. After installing the driver, the corresponding hardware functions can be realized.

[0040] 3D modeling: Simply put, 3D modeling is the process of using 3D modeling software to create a model with 3D data in a virtual 3D space.

[0041] The present invention will now be described in conjunction with preferred implementation steps. Figure 1 This is a flowchart of a device modeling method provided according to an embodiment of this application, such as... Figure 1 As shown, the method includes the following steps:

[0042] Step S101: Determine the multiple components that make up the target device, wherein the target device is the device to be 3D modeled, and the components are at least one of the following: components and boards.

[0043] For example, when creating a 3D model of a device, it is first necessary to determine the composition of the device, such as which boards or components it consists of.

[0044] Step S102: Obtain a set of 3D models of components and a set of 3D models of circuit boards. The set of 3D models of components includes at least 3D models of multiple components, and the set of 3D models of circuit boards includes at least 3D models of multiple circuit boards.

[0045] For example, first obtain 3D models of multiple components, and then combine the 3D models of multiple components to obtain a set of 3D models of components. Then obtain 3D models of multiple circuit boards, and combine the 3D models of multiple circuit boards to obtain a set of 3D models of circuit boards.

[0046] Step S103: Based on the set of 3D models of components and the set of 3D models of boards, determine the 3D model of each component.

[0047] For example, select the 3D models of the components and boards in the device to be 3D modeled from the component 3D model set and the board 3D model set, respectively.

[0048] Step S104: Based on the 3D model of each component, obtain the 3D model of the target device.

[0049] For example, a 3D model of the device can be constructed based on the 3D models of components and boards selected from the component 3D model set and the board 3D model set, respectively.

[0050] Through the above steps S101 to S104, by acquiring the set of 3D models of components and the set of 3D models of circuit boards, and based on the set of 3D models of components and the set of 3D models of circuit boards, the 3D model of each component of the target device to be 3D modeled is determined, and then the 3D model of the target device is obtained based on the 3D model of each component. This improves the efficiency of 3D modeling of the device, reduces the cost of 3D modeling of the device, and thus improves the effect of 3D modeling of the device.

[0051] To quickly and accurately obtain the set of 3D models of components and the set of 3D models of circuit boards, the device modeling method provided in this application embodiment can also obtain the set of 3D models of components and the set of 3D models of circuit boards through the following steps: obtaining 3D models of multiple components; summarizing the 3D models of multiple components to obtain the set of 3D models of components; and determining the set of 3D models of circuit boards based on the set of 3D models of components.

[0052] For example, the component 3D model building module: This module mainly uses 3D software such as 3D MAX to build 3D models of the ports, terminals, lights, and other components and equipment such as cabinets that make up the board, based on the actual size.

[0053] Furthermore, by establishing sets for components and various parameters respectively, and combining the various component elements in the component set with the parameter elements in the parameter set, 3D models of components composed of different parameters can be formed.

[0054] For example, the components on a device board can be divided into the following categories:

[0055] 1. Communication equipment ports are mainly divided into three types: optical ports, electrical ports, and signal ports.

[0056] (1) Optical port refers to the optical module port, which is used to connect optical fiber to the board. The optical ports commonly used for connecting optical fiber to the board in the current network equipment are FC (connecting round pigtails), SC (connecting square pigtails), LC (connecting small square pigtails), etc.

[0057] (2) Electrical ports are mainly divided into COM port (serial port), LPT port (parallel port), SCSI port, etc. Serial ports mainly include RS-232-C, RS-422, RS485, USB, etc.

[0058] (3) Signal ports usually refer to network cable connection ports, such as RJ45, BNC, AUI, FDDI, ATM, etc.

[0059] The ports mentioned above can be classified according to their speed as 2M, 155M, 622M, 1G, 10G, etc.

[0060] Therefore, based on the port type and speed, the above methods can be used to assemble 3D models of the port components, such as 2M FC optical port, 155M SC optical port, 10G LC optical port, 10M LPT parallel port, 100M USB port, etc.

[0061] 2. The most common colors of the lights are red, yellow, and green, as well as any combination of the three colors. The main states of the lights are constant light, flashing light, off light, and fast flashing light, which are used to determine the working status and fault status of the equipment and circuit boards.

[0062] Based on the color and state of the light, the above methods can be used to assemble 3D models of the light components, such as a constant red light, a flashing red light, a fast-flashing red light, a flashing yellow light, and a fast-flashing green light.

[0063] 3. SATA interface hard drives are mainly divided into two types: 3.5-inch (2.5*10*11.7cm) and 2.5-inch (1.5*7.5*11.7cm); according to data transfer speed standards, they can be divided into 1.0, 2.0, 3.0...; according to capacity, they can be divided into 500G, 1T, 2T...; according to brand, they can be divided into Brand 1, Brand 2, Brand 3...; according to rotational speed, they can be divided into 7200rpm, 5800rpm...; according to power, they can be divided into 6W, 15W, 30W...

[0064] Based on parameters such as hard drive size, capacity, transfer speed, rotation speed, and brand, the above methods can be used to construct 3D models of hard drive components. For example, Brand 1 has a 2.5-inch 3.0 interface hard drive with a transfer speed of 1TB, capacity of 7200 RPM, and power consumption of 15W; Brand 2 has a 3.5-inch 2.0 interface hard drive with a transfer speed of 500GB, capacity of 5800 RPM, and power consumption of 6W; Brand 3 has a 3.0-inch 3.0 interface hard drive with a transfer speed of 2TB, capacity of 7200 RPM, and power consumption of 30W, etc.

[0065] 4. The fan specifications on the equipment are quite varied, mainly including 45*82*190mm, 172*150*51mm, 254*254*89mm, etc.; according to different power, there are 0.78W, 0.84W, 0.6W, 0.45W, 34.8W, etc.; commonly used brands include Brand 1, Brand 2, etc.; according to speed, they can be divided into 4300rpm, 4800rpm, 5300rpm, 5800rpm, etc.

[0066] Based on parameters such as fan size, power, speed, and brand, 3D models of fan components can be assembled using the methods described above. For example, a fan from brand 1 with dimensions of 45*82*190mm, a power of 0.78W, and a speed of 4300rpm can be created, while a fan from brand 2 with dimensions of 254*254*89mm, a power of 34.8W, and a speed of 5800rpm can be created.

[0067] 5. 3D atomic models of power ports, board shapes, cabinets, etc., can be classified according to this method.

[0068] After constructing the 3D model set of components, we can analyze the composition of components on the board, then select the 3D models corresponding to the components on the board from the 3D model set, and then construct multiple 3D models of the board based on the selected 3D models of the components. Finally, we can summarize the constructed 3D models of the multiple boards to obtain the board 3D model set.

[0069] The above method can quickly and accurately construct a set of 3D models of components and a set of 3D models of circuit boards.

[0070] To quickly and accurately determine the set of 3D models for circuit boards, the device modeling method provided in this application embodiment can also determine the set of 3D models for circuit boards through the following steps: selecting multiple fourth models from the set of 3D models for components, wherein each fourth model is a 3D model of each component that makes up each circuit board; determining the number of multiple components that make up each circuit board and the arrangement of each component; deploying the multiple fourth models into a second preset 3D model according to the number of multiple components that make up each circuit board and the arrangement of each component to obtain a fifth model, wherein the second preset 3D model is a blank 3D model corresponding to each circuit board; obtaining the attribute information of each circuit board; adding the attribute information of each circuit board to the fifth model to obtain a 3D model of each circuit board; summarizing the 3D models of each circuit board to obtain a set of 3D models for circuit boards.

[0071] For example, various 3D models, such as ports, lights, empty boards, empty chassis, empty cabinets, colors, and status light parameters, can be created into separate 3D model sets.

[0072] For example, Figure 2 This is a flowchart of constructing a set of 3D models of the board in an embodiment of this application, such as... Figure 2 As shown, this module mainly combines the models in the component 3D model set according to the actual size and shape of the device board using an ensemble algorithm model to realize the creation of the board 3D model.

[0073] S201 establishes a set of 3D component models.

[0074] Create sets of 3D models of various components, such as ports, lights, empty boards, empty chassis, empty cabinets, colors, and status light parameters.

[0075] 1. Define the ports as set A, which contains subsets A1, A2, A3..., where A = {A1, A2, A3...}. A1 represents the optical port subset, A2 represents the electrical port subset, and A3 represents the signal port subset.

[0076] The A1 optical port subset contains SC, FC, LC..., A1 = {SC, FC, LC...}.

[0077] The A2 electrical port subset includes subsets A2-1, A2-2, A2-3, and so on, where A2 = {A2-1, A2-2, A2-3, ...}. Specifically, A2-1 is the serial port subset, A2-2 is the parallel port subset, A2-3 is the SCSI subset, and so on. A2-1 = {RS-232-C, RS-422, RS485, USB, ...}, A2-2 = {ISA, PCI, EISA, AGP, ...}, and A2-3 = {Apple SCSI, Sun Microsystems DD50SA, SCA, ...}.

[0078] The A3 signal port subset includes RJ45, BNC, AUI, FDDI, ATM, etc., A3 = {RJ45, BNC, AUI, FDDI, ATM, etc.}.

[0079] 2. Set the indicator lights on the board as set B, which contains subsets B1, B2, etc., B = {B1, B2, etc.}. Among them, B1 is the color subset, B2 is the status subset, etc.; the B1 optical port subset contains red-yellow-green, red-yellow, yellow-green, red-green, red, yellow, green, etc. as subsets, B1 = {red-yellow-green, red-yellow, yellow-green, red-green, red, yellow, green, etc.}, B2 = {constant light, flashing, off, fast flashing, etc.}.

[0080] 3. Treat SATA interface hard drives as set C, which contains subsets C1, C2… , where C = {C1, C2, C3, C4…}. C1 represents the size subset, C2 represents the data transfer speed standard subset, C3 represents the capacity subset, C4 represents the rotational speed subset, C5 represents the brand subset, and so on. C1 = {3.5-inch (2.5*10*11.7cm) and 2.5-inch (1.5*7.5*11.7cm)}, C2 = {1.0, 2.0, 3.0…}, C3 = {500G, 1T, 2T…}.

[0081] 4. Treat the brands as set D, where D = {D1, D2, D3, D4...}. D1 represents the brands of hard drives and storage devices, D1 = {Brand 1, Brand 2, Brand 3...}; D2 represents the brands of fans, D2 = {Brand 1, Brand 2...}; D3 represents the brands of optical module ports, D3 = {Brand 1, Brand 2...}; and D4 represents the brands of batteries, D4 = {Brand 1, Brand 2, Brand 3...}.

[0082] 5. Denote power as set E, E = {E1, E2, ...}. E1 is a subset of fan power, E1 = {10.78W, 0.84W, 0.6W, 0.45W, 34.8W, ...}; E2 is a subset of hard drive power, E2 = {6W, 15W, 30W, ...}.

[0083] 6. Define the interface standards as set F, where F = {F1, F2, F3, ...}. F1 represents the hard disk interface standard, where F1 = {1.0, 2.0, 3.0, ...}; F2 represents the serial port interface standard, where F2 = {DB9, DB25, ...}; and F3 represents the parallel port interface standard, where F3 = {DB-25, 36PIN, Mini36PIN, ...}.

[0084] 7. Let the rate be the set G, where G = {2M, 155M, 622M, 1G, 10G...}.

[0085] Other parameters such as shape, size, and arrangement are also treated as different sets for use in board assembly.

[0086] S202 uses an ensemble algorithm to combine 3D models of components into a composite assembly to form the board shape.

[0087] For example, the board consists of three models from top to bottom: 3 LED indicator lights, 3 RJ45 ports, 8 LED indicator lights, and 8 LC optical ports. The top 3 LED indicator lights indicate the board's status: RUN / ALM, ACT, and RESET. The RUN / ALM light is green and flashing when the board is working normally; it is red or yellow and constantly lit when the board is faulty or disconnected from the network. The ACT light is green and flashing when the board is working normally; it is red or yellow and constantly lit when the board is faulty or disconnected from the network. The RESET light is off when the board is working normally; it is red and constantly lit when restarting. The 3 electrical ports (CON, ETH, and ESC) have the same appearance as the LAN ports and are all standard RJ45 ports. The 8 LED indicator lights indicate the working status of the 8 optical ports below. They are off when there is no fiber optic connection; they are green and flashing rapidly when there is a fiber optic connection; and they are red or yellow and constantly lit when there is a fault.

[0088] 1. Select a blank single-slot board template created in S1 and set it as element Q1 in the board set Q.

[0089] 2. Based on the atomic model "LED lights," the system selects set B from the model set library established in S201. Then, based on the fact that the RUN / ALM light is green and flashing when the board is working normally, and red or yellow when the board is faulty or offline, with a constant on status, the system selects "red / yellow / green" from subset B1 and "flashing / constant on" from subset B2, i.e., {RUN / ALM light} = {B1{green}∩B2{flashing}∪B1{red∪yellow}∩B2{constant on}}, thus completing the selection of the RUN / ALM light. Similarly, based on the fact that the ACT light is green and flashing when the board is working normally, and red or yellow when the board is faulty or offline, with a constant on status, the system selects the RUN / ALM light. The LEDs that are blocked or disconnected are red or yellow and are always on. Select "Red / Yellow / Green" from subset B1 and "Blinking / Always On" from subset B2, i.e., {ACT LED} = {B1{Green}∩B2{Blinking}∪B1{Red∪Yellow}∩B2{Always On}} to complete the selection of the ACT LED. The RESET LED is off when the board is working normally and turns red and always on when restarted. Select "Red" from subset B1 and "Off / Always On" from subset B2, i.e., {RESET LED} = {B1{Red}∩B2{Always On}∪B2{Off}} to complete the selection of the RESET LED. Enter the LED spacing, distance from the top of the board, and arrangement on the system page. The system will automatically deploy them onto the blank board. If high precision is not required, you can drag and drop the three LEDs to deploy them in 3 rows and 1 column onto the Q1 board.

[0090] 3. Based on the "RJ45" port in the atomic model, the system selects the RJ45 port from the A3 signal port subset in the atomic model set library established in S201. The CON and ESC ports have no color or status values; simply confirm they are RJ45 ports. ETH is the network cable connection port; it is green and solid when connected correctly, yellow and solid when not connected, flashing during data transmission, and off when no network cable is connected. That is, {ETH} = {A3{RJ45}∩B1{yellow-green}∩B2{flashing∪solid}∪{A3{RJ45}∩B2{off}}}, {CON} = {ESC} = {A3{RJ45}∩B2{off}}. Enter the spacing of the RJ45 LEDs, their distance from the top of the board, and their arrangement on the system page; the system will automatically deploy them to the blank board. If high precision is not required, the three RJ45 ports can be deployed on the Q1 board in a 4-row, 1-column configuration by dragging and dropping with the mouse.

[0091] 4. Based on the atomic model "LED light", the system selects set B from the atomic model set library established in S201. Then, based on the normal operation (green, flashing) and fault condition (red or yellow, constantly on), it selects "Red-Yellow-Green" from subset B1 and "Constant On, Off, Flashing" from subset B2, i.e., {LINK / ACT} = {B1{Green}∩B2{Flashing}∪{B1{Yellow-Red}∩B2{Constant On, Flashing}}∪B2{Off}. The quantity is set to 8. The spacing between the LED lights, their distance from the top of the board, and their arrangement are entered on the system page. The system will automatically deploy them onto the Q1 board. If high precision is not required, the 8 LED lights can be deployed onto the Q1 board in a 4-row, 2-column arrangement by dragging and dropping with the mouse.

[0092] 5. Based on the model "LC", the system selects the LC ports from the A1 optical port subset in the model set library established in S201. Then, based on the port speed, it selects {10G} from the G set, i.e., {optical port} = {A1{LC}∩G{10G}}, determining the quantity to be 8. The system page is then filled with the spacing between the LC ports, their distance from the top of the board, and their arrangement. The system will automatically deploy them onto the Q1 board. If high precision is not required, the 8 LCs can be deployed onto a blank board in an 8-row, 1-column arrangement by dragging and dropping with the mouse.

[0093] The above steps utilize an ensemble algorithm to assemble 3D models into the board's shape. The final model of board Q1' is the ensemble set:

[0094] {Q1'}={Q1}∪{RUN / ALM light}∪{ACT light}∪{RESET light}∪{CON}∪{ETH}∪{ESC}∪{LINK / ACT}∪{optical port}

[0095] ={B1{Green}∩B2{Flashing}∪B1{Red∪Yellow}∩B2{Steady}}∪{B1{Green}∩B2{Flashing}∪B1{Red∪Yellow}∩B2{Steady}}∪{B1{Red}∩B2{Steady}∪B2{Off}}∪{A3{RJ45}∩B2{Off}}∪{A3{RJ45} ∩B1{Yellow-Green}∩B2{Flashing∪Steady}∪{A3{RJ45}∩B2{Off}}}∪{A3{RJ45}∩B2{Off}}∪{B1{Green}∩B2{Flashing}∪{B1{Yellow-Red}∩B2{Steady, Flashing}}∪B2{Off}∪{A1{LC}∩G{10G}}.

[0096] S203 editing board 3D atomic model.

[0097] In S202, the generated board is edited, including parameters such as manufacturer and model. Logical relationships, such as association, affiliation, and business logic, are established between each 3D atomic model and board Q1. The edited board 3D model serves as the 3D model of the constituent device, and is then combined with the device in S3 for application.

[0098] S204 copies and edits to generate a new board 3D model.

[0099] For boards that look similar, you can copy and then modify them. Simply edit the manufacturer name, model, speed, and other differences to generate a new device board. This generated board can also be used as an atomic model of the device.

[0100] The board 3D model generated in the above process S205 is automatically stored as the board atomic model in each subset of the board set Q.

[0101] The above method can quickly and accurately construct a set of 3D models of the board.

[0102] To quickly and accurately select multiple fourth models from the component 3D model set, the device modeling method provided in this application embodiment can also select multiple fourth models from the component 3D model set through the following steps: obtaining multiple components that make up each board; determining the type information and attribute information of each component that makes up each board; and selecting multiple fourth models from the component 3D model set based on the type information and attribute information of each component that makes up each board.

[0103] For example, analyze the components on the circuit board, and then obtain the attributes and types of the components, such as how many LEDs are on the board and what color each LED is. Then, based on the attributes and types of the components on the board, select the 3D model corresponding to each component from the pre-built set of 3D model images of the components.

[0104] The above method allows for the quick and accurate selection of the 3D model of each component that makes up the circuit board from the set of 3D component models.

[0105] To quickly and accurately determine the 3D model of each component, the device modeling method provided in this application embodiment can also determine the 3D model of each component through the following steps: determining the type information and attribute information of each component in the target device; selecting multiple second models from the component 3D model set based on the type information and attribute information of each component in the target device, wherein each second model is a 3D model of each component in the target device; determining the name information and attribute information of each board in the target device; selecting multiple third models from the board 3D model set based on the name information and attribute information of each board in the target device, wherein each third model is a 3D model of each board in the target device; and using each second model and each third model as the 3D model of each component.

[0106] For example, the system analyzes the composition of the circuit boards and components on the device, then obtains the attributes and types of the components, and finally selects the 3D model corresponding to each component from a pre-built set of 3D component models. Similarly, the system obtains the attributes and types of the circuit boards, and then selects the 3D model corresponding to each circuit board from a pre-built set of circuit board 3D models.

[0107] The above method can quickly and accurately obtain the 3D models corresponding to the boards and components on the device.

[0108] To quickly and accurately obtain a 3D model of the target device, the device modeling method provided in this application embodiment can also obtain the 3D model of the target device through the following steps: determining the number of multiple boards in the target device and the slot number corresponding to each board; deploying the 3D model of each board into a first preset 3D model according to the number of multiple boards in the target device and the slot number corresponding to each board to obtain a first model, wherein the first preset 3D model is a blank 3D model corresponding to the target device; obtaining the attribute information of the target device; adding the attribute information of the target device to the first model to obtain the 3D model of the target device.

[0109] For example, the S3 3D equipment generation module: This module mainly utilizes the cabinet 3D model in the component 3D model set and the board 3D model set that has been assembled. Based on the actual size and shape of the existing network equipment, it assembles the corresponding equipment. By applying the above process and method, and finally editing the equipment's manufacturer, equipment model, logo and other attribute fields, the construction of the data center 3D equipment can be completed.

[0110] For example, Figure 3 This is a flowchart illustrating the generation of a 3D model of the device in this application embodiment, and the process of combining the board 3D model into a device 3D model using an ensemble algorithm is as follows: Figure 3 As shown.

[0111] The S301 analyzes the board composition of the equipment.

[0112] For example, the device to be 3D modeled has 6 boards. Among them, the boards numbered ①-⑤ are the main control board and service board, which are communication boards, and board number ⑥ is the fan. Boards numbered ①-④ occupy slots 0#-3# respectively, and board number ⑤ occupies slot 9#.

[0113] First, check if the six board models mentioned above exist in the board set Q. If not, repeat the steps in S2 to complete the construction of the board 3D model and store it in set Q as a board atomic capability. If it exists, proceed to S302.

[0114] S302 uses an ensemble algorithm to combine 3D models of circuit boards into the shape of the device.

[0115] 1. Select a suitable chassis from the chassis set created in S201.

[0116] 2. Extract the 3D model of the board card stored in set Q from S205.

[0117] 3. The system automatically deploys boards ① through ⑥ according to parameters such as slot number, horizontal plate, and vertical plate.

[0118] S303 edits 3D models of the device.

[0119] By editing attribute fields such as the equipment manufacturer, equipment model, and logo, you can complete the construction of a 3D model of the computer room equipment.

[0120] S304 copies and edits to generate a new 3D atomic model of the device.

[0121] For devices with similar appearances, a copy and modification method can be used. For devices of the same brand and series, with only differences in the circuit boards, after copying the device, you only need to edit and replace some of the 3D models of the circuit boards to generate a new 3D model of the device. The device generated in this way can also be used as a 3D atomic model of the device.

[0122] The 3D atomic model of the S305 device is automatically stored in set Z.

[0123] The 3D models of the devices generated in the above process are automatically stored as atomic capabilities of the devices in various subsets of the device set Z.

[0124] The above method can quickly and accurately obtain a 3D model of the device.

[0125] To quickly and accurately obtain the 3D model of the first device, the device modeling method provided in this application embodiment can also obtain the 3D model of the first device through the following steps: obtaining multiple boards in the first device, wherein the first device is the device to be 3D modeled after the target device has been 3D modeled; determining whether the names of the multiple boards in the first device are the same as the names of the multiple boards in the target device; if the names of the multiple boards in the first device are the same as the names of the multiple boards in the target device, then determining whether the number of the multiple boards in the first device is the same as the number of the multiple boards in the target device; if the number of the multiple boards in the first device is different from the number of the multiple boards in the target device, then obtaining the 3D model of the first device by changing the number of board models in the 3D model of the target device.

[0126] For example, after modeling is completed using the above method, if the number of a certain board or the number of ports of a certain board in the actual computer room changes, the 3D model needs to be adjusted.

[0127] The S206 board has an increased number of ports.

[0128] For example, if the new board is similar to this board but differs in the number and type of ports, it can be edited by modifying the board template to add ports.

[0129] When adjusting the 8 LED indicator lights and 8 LC optical ports at the bottom of the S206-1 board to 16 LC optical ports and 16 LED indicator lights, select the board from the board template library.

[0130] In S206-2, edit the original template according to the steps in S202, add 8 LED signal lights and 8 LC optical ports, and then save it as a new board model to complete the modeling of the new board.

[0131] S203 allows you to edit parameters such as manufacturer and board model. All parameters are set to the original template by default. After editing, the 3D models of each component are associated with, belong to, and have business logic relationships with the board Q1.

[0132] The edited 3D model of the board is used as a model of the component device and is combined into the device in S3 for application.

[0133] Remove the ports from the S207 board.

[0134] When adjusting the 8 LED indicator lights and 8 LC optical ports at the bottom of the S207-1 board to 4 PLC optical ports and 4 LED indicator lights, select the board from the board template library.

[0135] In the original template, follow the steps in S202 to edit S207-2, delete 4 LED signal lights and 4 LC optical ports, and then save it as a new board model to complete the modeling of the new board.

[0136] S203 allows you to edit parameters such as manufacturer and board model. All parameters are set to the original template by default. After editing, the 3D models of each component are associated with, belong to, and have business logic relationships with the board Q1.

[0137] The edited 3D model of the board is used as a model of the component device and is combined into the device in S3 for application.

[0138] For example, if the new device is similar to this device, but differs only in the number of boards or the order in which the boards are arranged, then it can be edited by modifying the device template to add, delete, or move boards.

[0139] S306 adds a board.

[0140] S306-1 For example, if the device has 6 boards, and a board X is added to slot 5 (position number ⑦), the 3D model of board X stored in set Q is extracted in step S302-2.

[0141] In step S306-2, following steps S302-3, the system automatically deploys board X according to parameters such as slot number, horizontal plate, and vertical plate. Alternatively, board deployment can be done manually by dragging and dropping with the mouse. Then, save it as a board model Z1' to complete the 3D modeling of the new device.

[0142] By editing attribute fields such as manufacturer, model, and logo of new equipment in S303, the 3D model of the data center equipment can be completed. Logical relationships such as association, affiliation, and business connections are established between the 3D models of each board and equipment Z1'.

[0143] S307 Removed Board.

[0144] For example, if the device has 6 boards, and there is no board in slot 4 (position number ④) of the new device, the 3D model of the MA5800 device stored in the device set Z will be extracted.

[0145] In step S306-2, delete the board labeled ④ in step S302-3, and then save it as a new device model Z1' to complete the modeling of the new device.

[0146] By editing the manufacturer, model, logo, and other attribute fields of the new equipment in S303, the 3D model of the data center equipment can be completed. All parameter fields default to the attribute fields of the original template; modifying different attribute fields will complete the construction of the new equipment's 3D model. Logical relationships such as association, affiliation, and business relationships are established between the 3D models of each board and equipment Z1'.

[0147] S308 mobile board.

[0148] For example, if a device has 6 boards, and the new device with board number 5 occupies slot 5, the 3D model of the MA5800 device stored in device set Z will be extracted.

[0149] In step S302-3, the system automatically deploys board number ⑤ according to parameters such as slot number, horizontal plate, and vertical plate. Alternatively, board deployment can be completed manually by dragging and dropping with the mouse.

[0150] By editing the manufacturer, model, logo, and other attribute fields of the new equipment in S303, the 3D model of the new equipment Z1' in the data center can be completed. All parameter fields default to the attribute fields of the original template. Modifying different attribute fields will complete the construction of the 3D model of the new equipment. Establish logical relationships such as association, affiliation, and business between the 3D models of each board and equipment Z1'.

[0151] Using the above method, by modifying the 3D model of the previously constructed device, a 3D model of the new device can be constructed quickly and accurately.

[0152] For example, Figure 4 This is a flowchart of an optional device modeling method provided according to an embodiment of this application, such as... Figure 4 As shown, the optional device modeling method includes the following steps:

[0153] Construct 3D models of components, 3D models of integrated circuit boards, and 3D models of integrated equipment, specifically as follows:

[0154] S1. Component 3D Model Building Module: This module mainly uses 3D software such as 3D MAX to build 3D models of components such as ports, terminals, lights, fans used in the assembly of equipment, and cabinets based on actual dimensions.

[0155] By creating separate sets for components and various parameters, and combining the component elements in the component set with the parameter elements in the parameter set, a 3D model of a component composed of different parameters can be formed.

[0156] S2. Combined board 3D model module:

[0157] Create 3D model sets for various 3D models in S1, such as ports, lights, empty boards, empty chassis, empty cabinets, colors, and status light parameters.

[0158] S3. Generate 3D Device Module:

[0159] This module mainly utilizes the 3D cabinet model in S1 and the pre-assembled boards in S2 to assemble corresponding equipment based on the actual size and shape of the existing network equipment. By applying the above process and methods, and finally editing the equipment's manufacturer, model, logo, and other attribute fields, the construction of the 3D equipment in the data center can be completed.

[0160] Therefore, the method provided in this application does not require separate modeling for different devices. By constructing boards and devices through composite components, an infinite number of devices can be created from a finite number of models, significantly reducing the manpower, time, and cost of 3D digital modeling. This solves the problem of low efficiency in building 3D models of data center equipment and reduces 3D modeling operation costs. For new equipment, 3D modeling can be completed using existing 3D atomic models of components, boards, and devices, based on the actual size and shape of the equipment. During operation and maintenance, changes in the number and placement of boards in the equipment can be adjusted promptly through adding, deleting, and moving boards, ensuring the accuracy and consistency of 3D equipment data with the equipment currently operating on the network. A one-time investment and streamlined workflow eliminate the need for a dedicated maintenance team, significantly reducing operating costs. The 3D atomic models can be reused to construct a massive number of devices currently operating on the network and those in future development, improving the efficiency of 3D modeling for data center equipment and significantly reducing the investment and operating costs of digital twins for data center equipment. This method can be widely applied to the construction of digital twins for equipment 3D modeling in other fields.

[0161] In summary, the device modeling method provided in this application, by identifying multiple components constituting a target device (the device to be 3D modeled) and the components being at least one of the following: electronic components and circuit boards; obtaining a set of 3D models for electronic components and a set of 3D models for circuit boards, wherein the set of 3D models for electronic components includes at least a number of 3D models for electronic components, and the set of 3D models for circuit boards includes at least a number of 3D models for circuit boards; determining the 3D model of each component based on the set of 3D models for electronic components and the set of 3D models for circuit boards; and obtaining the 3D model of the target device based on the 3D model of each component, solves the problem of poor 3D modeling effect in related technologies. By obtaining the set of 3D models for electronic components and the set of 3D models for circuit boards, and determining the 3D model of each component of the target device to be 3D modeled based on the set of 3D models for electronic components and the set of 3D models for circuit boards, and then obtaining the 3D model of the target device based on the 3D model of each component, the efficiency of 3D modeling of the device is improved, the cost of 3D modeling of the device is reduced, and the effect of 3D modeling of the device is improved.

[0162] It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0163] This application also provides a device modeling apparatus. It should be noted that the device modeling apparatus of this application can be used to execute the device modeling method provided in this application. The device modeling apparatus provided in this application will be described below.

[0164] Figure 5 This is a schematic diagram of a modeling apparatus for a device according to an embodiment of this application. For example... Figure 5 As shown, the device includes: a first determining unit 501, a first acquiring unit 502, a second determining unit 503, and a third determining unit 504.

[0165] Specifically, the first determining unit 501 is used to determine multiple components that make up the target device, wherein the target device is a device to be 3D modeled, and the components are at least one of the following: components and circuit boards;

[0166] The first acquisition unit 502 is used to acquire a set of 3D models of components and a set of 3D models of circuit boards, wherein the set of 3D models of components includes at least a set of 3D models of multiple components, and the set of 3D models of circuit boards includes at least a set of 3D models of multiple circuit boards.

[0167] The second determining unit 503 is used to determine the 3D model of each component based on the set of 3D model of components and the set of 3D model of board.

[0168] The third determining unit 504 is used to obtain the 3D model of the target device based on the 3D model of each component.

[0169] In summary, the device modeling apparatus provided in this application embodiment determines multiple components constituting the target device through a first determining unit 501, wherein the target device is the device to be 3D modeled, and the components are at least one of the following: components and circuit boards; a first acquiring unit 502 acquires a set of 3D models of components and a set of 3D models of circuit boards, wherein the set of 3D models of components includes at least a number of 3D models of components, and the set of 3D models of circuit boards includes at least a number of 3D models of circuit boards; a second determining unit 503 determines the 3D model of each component based on the set of 3D models of components and the set of 3D models of circuit boards; and a third determining unit 504 obtains the 3D model of the target device based on the 3D model of each component, thus solving the problem of poor effect of 3D modeling of devices in related technologies. By acquiring a set of 3D models of components and a set of 3D models of circuit boards, and based on these sets, determining the 3D model of each component of the target device to be 3D modeled, and then obtaining the 3D model of the target device based on the 3D model of each component, the efficiency of 3D modeling of the device is improved, the cost of 3D modeling of the device is reduced, and the effect of 3D modeling of the device is improved.

[0170] Optionally, in the device modeling apparatus provided in this application embodiment, if multiple components are multiple boards, the third determining unit includes: a first determining subunit, used to determine the number of multiple boards in the target device and the slot number corresponding to each board; a first deployment subunit, used to deploy the 3D model of each board to a first preset 3D model according to the number of multiple boards in the target device and the slot number corresponding to each board, to obtain a first model, wherein the first preset 3D model is a blank 3D model corresponding to the target device; a first obtaining subunit, used to obtain the attribute information of the target device; and a first adding subunit, used to add the attribute information of the target device to the first model to obtain a 3D model of the target device.

[0171] Optionally, in the device modeling apparatus provided in this application embodiment, if multiple components include multiple parts and multiple boards, the second determining unit includes: a second determining subunit, used to determine the type information and attribute information of each part in the target device; a first selecting subunit, used to select multiple second models from a set of 3D models of parts based on the type information and attribute information of each part in the target device, wherein each second model is a 3D model of each part in the target device; a third determining subunit, used to determine the name information and attribute information of each board in the target device; a second selecting subunit, used to select multiple third models from a set of 3D models of boards based on the name information and attribute information of each board in the target device, wherein each third model is a 3D model of each board in the target device; and a fourth determining subunit, used to use each second model and each third model as a 3D model of each part.

[0172] Optionally, in the modeling apparatus for the device provided in the embodiments of this application, the first acquisition unit includes: a second acquisition subunit, used to acquire 3D models of multiple components; a first summarization subunit, used to summarize the 3D models of multiple components to obtain a set of 3D models of components; and a fifth determination subunit, used to determine a set of 3D models of circuit boards based on the set of 3D models of components.

[0173] Optionally, in the modeling apparatus of the device provided in the embodiments of this application, the fifth determining subunit includes: a first selection module, used to select multiple fourth models from a set of component 3D models, wherein each fourth model is a 3D model of each component constituting each board; a first determining module, used to determine the number of multiple components constituting each board and the arrangement of each component; a first deployment module, used to deploy multiple fourth models to a second preset 3D model according to the number of multiple components constituting each board and the arrangement of each component to obtain a fifth model, wherein the second preset 3D model is a blank 3D model corresponding to each board; a first acquisition module, used to acquire attribute information of each board; a first adding module, used to add the attribute information of each board to the fifth model to obtain a 3D model of each board; and a first summarizing module, used to summarize the 3D models of each board to obtain a set of board 3D models.

[0174] Optionally, in the modeling apparatus of the device provided in the embodiments of this application, the first selection module includes: a first acquisition submodule, used to acquire multiple components that make up each board; a first determination submodule, used to determine the type information and attribute information of each component that makes up each board; and a first selection submodule, used to select multiple fourth models from the component 3D model set based on the type information and attribute information of each component that makes up each board.

[0175] Optionally, in the device modeling apparatus provided in this application embodiment, if the multiple components are multiple boards, the apparatus further includes: a second acquisition unit, configured to acquire multiple boards in the first device after obtaining the 3D model of the target device based on the 3D model of each component, wherein the first device is the device to be 3D modeled after the target device has been 3D modeled; a first judgment unit, configured to determine whether the names of the multiple boards in the first device are the same as the names of the multiple boards in the target device; a second judgment unit, configured to determine whether the number of the multiple boards in the first device is the same as the number of the multiple boards in the target device if the names of the multiple boards in the first device are the same as the names of the multiple boards in the target device; and a first processing unit, configured to obtain the 3D model of the first device by changing the number of board models in the 3D model of the target device if the number of the multiple boards in the first device is different from the number of the multiple boards in the target device.

[0176] The modeling device of the equipment includes a processor and a memory. The first determining unit 501, the first acquiring unit 502, the second determining unit 503 and the third determining unit 504 are all stored in the memory as program units. The processor executes the program units stored in the memory to realize the corresponding functions.

[0177] The processor contains a kernel, which retrieves the corresponding program units from memory. One or more kernels can be configured, and adjusting kernel parameters can improve the quality of 3D modeling of the device.

[0178] The memory may include non-permanent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0179] This invention provides a computer-readable storage medium storing a program that, when executed by a processor, implements a method for modeling the device.

[0180] This invention provides a processor for running a program, wherein the program executes a modeling method for the device during runtime.

[0181] like Figure 6As shown, an embodiment of the present invention provides an electronic device, the device including a processor, a memory, and a program stored in the memory and executable on the processor. When the processor executes the program, it performs the following steps: determining multiple components constituting a target device, wherein the target device is a device to be 3D modeled, and the components are at least one of the following: electronic components and circuit boards; obtaining a set of 3D models of electronic components and a set of 3D models of circuit boards, wherein the set of 3D models of electronic components includes at least a set of 3D models of multiple electronic components, and the set of 3D models of circuit boards includes at least a set of 3D models of multiple circuit boards; determining a 3D model of each component based on the set of 3D models of electronic components and the set of 3D models of circuit boards; and obtaining a 3D model of the target device based on the 3D model of each component.

[0182] When the processor executes the program, it also performs the following steps: If the multiple components are multiple boards, obtaining the 3D model of the target device based on the 3D model of each component includes: determining the number of the multiple boards in the target device and the slot number corresponding to each board; deploying the 3D model of each board into a first preset 3D model based on the number of the multiple boards in the target device and the slot number corresponding to each board to obtain a first model, wherein the first preset 3D model is a blank 3D model corresponding to the target device; obtaining the attribute information of the target device; adding the attribute information of the target device to the first model to obtain the 3D model of the target device.

[0183] When the processor executes the program, it also performs the following steps: If the multiple components include multiple parts and multiple boards, based on the set of 3D models of the parts and the set of 3D models of the boards, determining the 3D model of each component includes: determining the type information and attribute information of each part in the target device; selecting multiple second models from the set of 3D models of the parts according to the type information and attribute information of each part in the target device, wherein each second model is a 3D model of each part in the target device; determining the name information and attribute information of each board in the target device; selecting multiple third models from the set of 3D models of the boards according to the name information and attribute information of each board in the target device, wherein each third model is a 3D model of each board in the target device; and using each second model and each third model as the 3D model of each component.

[0184] When the processor executes the program, it also performs the following steps: obtaining the component 3D model set and the board 3D model set includes: obtaining 3D models of multiple components; summarizing the 3D models of the multiple components to obtain the component 3D model set; and determining the board 3D model set based on the component 3D model set.

[0185] When the processor executes the program, it also performs the following steps: Based on the component 3D model set, determining the board 3D model set includes: selecting multiple fourth models from the component 3D model set, wherein each fourth model is a 3D model of each component that makes up each board; determining the number of components that make up each board and the arrangement of each component; deploying the multiple fourth models into a second preset 3D model based on the number of components that make up each board and the arrangement of each component to obtain a fifth model, wherein the second preset 3D model is a blank 3D model corresponding to each board; obtaining the attribute information of each board; adding the attribute information of each board to the fifth model to obtain a 3D model of each board; and summarizing the 3D models of each board to obtain the board 3D model set.

[0186] When the processor executes the program, it also performs the following steps: selecting multiple fourth models from the component 3D model set, including: acquiring multiple components that make up each board; determining the type information and attribute information of each component that makes up each board; and selecting the multiple fourth models from the component 3D model set based on the type information and attribute information of each component that makes up each board.

[0187] When the processor executes the program, it also performs the following steps: If the multiple components are multiple boards, after obtaining the 3D model of the target device based on the 3D model of each component, the method further includes: obtaining multiple boards in a first device, wherein the first device is the device to be 3D modeled after the target device has been 3D modeled; determining whether the names of the multiple boards in the first device are the same as the names of the multiple boards in the target device; if the names of the multiple boards in the first device are the same as the names of the multiple boards in the target device, then determining whether the number of the multiple boards in the first device is the same as the number of the multiple boards in the target device; if the number of the multiple boards in the first device is different from the number of the multiple boards in the target device, then obtaining the 3D model of the first device by changing the number of board models in the 3D model of the target device.

[0188] The devices mentioned in this article can be servers, PCs, tablets, mobile phones, etc.

[0189] This application also provides a computer program product, which, when executed on a data processing device, is suitable for executing an initialization program having the following method steps: determining multiple components constituting a target device, wherein the target device is a device to be 3D modeled, and the components are at least one of the following: electronic components and circuit boards; obtaining a set of 3D models of electronic components and a set of 3D models of circuit boards, wherein the set of 3D models of electronic components includes at least a plurality of 3D models of electronic components, and the set of 3D models of circuit boards includes at least a plurality of 3D models of circuit boards; determining a 3D model of each component based on the set of 3D models of electronic components and the set of 3D models of circuit boards; and obtaining a 3D model of the target device based on the 3D model of each component.

[0190] When executed on a data processing device, it is also suitable to execute an initialization program with the following steps: if the multiple components are multiple boards, obtaining the 3D model of the target device based on the 3D model of each component includes: determining the number of the multiple boards in the target device and the slot number corresponding to each board; deploying the 3D model of each board to a first preset 3D model based on the number of the multiple boards in the target device and the slot number corresponding to each board to obtain a first model, wherein the first preset 3D model is a blank 3D model corresponding to the target device; obtaining the attribute information of the target device; adding the attribute information of the target device to the first model to obtain the 3D model of the target device.

[0191] When executed on a data processing device, it is also suitable to execute an initialization program with the following steps: If the plurality of components includes a plurality of parts and a plurality of boards, determining the 3D model of each component based on the set of 3D models of the parts and the set of 3D models of the boards includes: determining the type information and attribute information of each part in the target device; selecting a plurality of second models from the set of 3D models of the parts according to the type information and attribute information of each part in the target device, wherein each second model is a 3D model of each part in the target device; determining the name information and attribute information of each board in the target device; selecting a plurality of third models from the set of 3D models of the boards according to the name information and attribute information of each board in the target device, wherein each third model is a 3D model of each board in the target device; and using each second model and each third model as the 3D model of each component.

[0192] When executed on a data processing device, it is also suitable to execute an initialization program with the following method steps: obtaining a set of 3D models of components and a set of 3D models of boards, including: obtaining 3D models of multiple components; summarizing the 3D models of the multiple components to obtain the set of 3D models of components; and determining the set of 3D models of boards based on the set of 3D models of components.

[0193] When executed on a data processing device, it is also suitable to execute an initialization program with the following method steps: Based on the component 3D model set, determining the board 3D model set includes: selecting multiple fourth models from the component 3D model set, wherein each fourth model is a 3D model of each component constituting each board; determining the number of multiple components constituting each board and the arrangement of each component; deploying the multiple fourth models into a second preset 3D model based on the number of multiple components constituting each board and the arrangement of each component to obtain a fifth model, wherein the second preset 3D model is a blank 3D model corresponding to each board; obtaining the attribute information of each board; adding the attribute information of each board to the fifth model to obtain a 3D model of each board; and summarizing the 3D models of each board to obtain the board 3D model set.

[0194] When executed on a data processing device, it is also suitable to execute an initialization program with the following method steps: selecting multiple fourth models from the component 3D model set, including: acquiring multiple components that make up each board; determining the type information and attribute information of each component that makes up each board; and selecting the multiple fourth models from the component 3D model set based on the type information and attribute information of each component that makes up each board.

[0195] When executed on a data processing device, it is also suitable to execute an initialization program with the following steps: if the plurality of components are multiple boards, after obtaining the 3D model of the target device based on the 3D model of each component, the method further includes: obtaining multiple boards in a first device, wherein the first device is the device to be 3D modeled after the target device has been 3D modeled; determining whether the names of the multiple boards in the first device are the same as the names of the multiple boards in the target device; if the names of the multiple boards in the first device are the same as the names of the multiple boards in the target device, then determining whether the number of the multiple boards in the first device is the same as the number of the multiple boards in the target device; if the number of the multiple boards in the first device is different from the number of the multiple boards in the target device, then obtaining the 3D model of the first device by changing the number of board models in the 3D model of the target device.

[0196] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0197] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0198] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0199] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0200] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0201] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0202] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0203] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0204] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0205] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A method for modeling a device, characterized in that, include: Identify multiple components that make up a target device, wherein the target device is a device to be 3D modeled, and the components are at least one of the following: components and circuit boards; Obtain a set of 3D models of components and a set of 3D models of circuit boards, wherein the set of 3D models of components includes at least a number of 3D models of components, and the set of 3D models of circuit boards includes at least a number of 3D models of circuit boards. Based on the set of 3D models of the components and the set of 3D models of the board, the 3D model of each component is determined; Based on the 3D model of each component, a 3D model of the target device is obtained; If the multiple components are multiple boards, after obtaining the 3D model of the target device based on the 3D model of each component, the method further includes: Obtain multiple boards from a first device, wherein the first device is the device to be 3D modeled after the target device has been 3D modeled; Determine whether the names of multiple boards in the first device are the same as the names of multiple boards in the target device; If the names of multiple boards in the first device are the same as the names of multiple boards in the target device, then determine whether the number of multiple boards in the first device is the same as the number of multiple boards in the target device. If the number of multiple boards in the first device is different from the number of multiple boards in the target device, then the 3D model of the first device can be obtained by changing the number of board models in the 3D model of the target device.

2. The method according to claim 1, characterized in that, If the multiple components are multiple boards, the 3D model of the target device is obtained based on the 3D model of each component, including: Determine the number of the plurality of boards in the target device and the slot number corresponding to each board; Based on the number of the multiple boards in the target device and the slot number corresponding to each board, the 3D model of each board is deployed into a first preset 3D model to obtain a first model, wherein the first preset 3D model is a blank 3D model corresponding to the target device; Obtain the attribute information of the target device; The attribute information of the target device is added to the first model to obtain the 3D model of the target device.

3. The method according to claim 1, characterized in that, If the multiple components include multiple parts and multiple boards, based on the set of 3D models of the parts and the set of 3D models of the boards, the 3D model of each component is determined to include: Determine the type and attribute information of each component in the target device; Based on the type and attribute information of each component in the target device, multiple second models are selected from the set of 3D models of the components, wherein each second model is a 3D model of each component in the target device; Determine the name and attribute information of each board in the target device; Based on the name and attribute information of each board in the target device, multiple third models are selected from the set of board 3D models, wherein each third model is a 3D model of each board in the target device; Each second model and each third model are used as 3D models for each component.

4. The method according to claim 1, characterized in that, Obtaining the 3D model collections of components and boards includes: Obtain 3D models of multiple components; The 3D models of the multiple components are summarized to obtain the component 3D model set; The set of 3D models of the components is used to determine the set of 3D models of the board.

5. The method according to claim 4, characterized in that, Based on the set of 3D models of the components, the set of 3D models of the board includes: Multiple fourth models are selected from the set of 3D models of components, wherein each fourth model is a 3D model of each component that makes up each board. Determine the number of components that make up each board and the arrangement of each component; Based on the number of components that make up each board and the arrangement of each component, the multiple fourth models are deployed into the second preset 3D model to obtain the fifth model, wherein the second preset 3D model is a blank 3D model corresponding to each board; Obtain the attribute information of each board; The attribute information of each board is added to the fifth model to obtain the 3D model of each board; The 3D models of each board are compiled to obtain the set of 3D models of the board.

6. The method according to claim 5, characterized in that, Selecting multiple fourth models from the set of 3D models of the components includes: Obtain the multiple components that make up each board; Determine the type and attribute information of each component that makes up each board; Based on the type and attribute information of each component that makes up each board, the plurality of fourth models are selected from the set of 3D models of the components.

7. A modeling device for equipment, characterized in that, include: The first determining unit is used to determine multiple components that make up the target device, wherein the target device is a device to be 3D modeled, and the components are at least one of the following: components and circuit boards; The first acquisition unit is used to acquire a set of 3D models of components and a set of 3D models of circuit boards, wherein the set of 3D models of components includes at least a number of 3D models of components, and the set of 3D models of circuit boards includes at least a number of 3D models of circuit boards. The second determining unit is used to determine the 3D model of each component based on the set of 3D models of the components and the set of 3D models of the board. The third determining unit is used to obtain the 3D model of the target device based on the 3D model of each component; If the multiple components are multiple circuit boards, the device further includes: a second acquisition unit, configured to acquire multiple circuit boards in the first device after obtaining the 3D model of the target device based on the 3D model of each component, wherein the first device is the device to be 3D modeled after the target device has been 3D modeled; a first judgment unit, configured to judge whether the names of the multiple circuit boards in the first device are the same as the names of the multiple circuit boards in the target device; a second judgment unit, configured to judge whether the number of multiple circuit boards in the first device is the same as the number of multiple circuit boards in the target device if the names of the multiple circuit boards in the first device are the same as the names of the multiple circuit boards in the target device; and a first processing unit, configured to obtain the 3D model of the first device by changing the number of circuit board models in the 3D model of the target device if the number of multiple circuit boards in the first device is different from the number of multiple circuit boards in the target device.

8. A processor, characterized in that, The processor is used to run a program, wherein the program executes the modeling method of the device according to any one of claims 1 to 6 when it runs.

9. An electronic device, characterized in that, It includes one or more processors and a memory, the memory being used to store one or more programs, wherein when the one or more programs are executed by the one or more processors, the one or more processors cause the one or more processors to implement the modeling method of the device according to any one of claims 1 to 6.

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