Wafer bonding process chuck and apparatus

Abstract

The application provides a wafer bonding process chuck and equipment, and relates to the field of wafer bonding process. The chuck comprises an inner disc and an outer ring connected with each other, the inner disc is provided with a vacuum air path; the outer ring is fixedly provided with a plurality of sets of spacer piece assemblies and a plurality of sets of pressing plate assemblies, the spacer pieces of the spacer piece assemblies have working positions between a lower wafer and an upper wafer and initial positions outside the lower wafer and the upper wafer; the pressing plates of the pressing plate assemblies have working positions above the upper wafer and initial positions outside the upper wafer. In use, in the alignment unit, the lower wafer is first adsorbed and fixed by using the inner disc, then each spacer piece is above the lower wafer, then the upper wafer is aligned with the lower wafer and is placed above each spacer piece, and finally each pressing plate is pressed on the upper wafer. In this way, the two wafers are not in contact during the alignment process, and the positions of the two wafers do not change during the transfer process, so that the bonding quality can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer bonding process, in particular to a wafer bonding process chuck and equipment. BACKGROUND

[0002] Chip design, wafer manufacturing and packaging testing are three core links in the semiconductor industry chain, wherein, the most critical process in wafer packaging is wafer bonding, that is, two wafers are combined together by chemical or physical method to achieve sealing effect.

[0003] Wafer alignment is an important step before wafer bonding, which directly affects the quality of wafer bonding. As a way of bonding, hot-press bonding has its own advantages. In the prior art, the aligned upper wafer and lower wafer are transferred to the bonding unit for hot-press bonding by the chuck. However, in the prior art, the upper and lower wafers are easy to contact during the alignment process, and the position of the wafer is easy to change during the transfer process, so the bonding quality is poor. SUMMARY

[0004] The first object of the present application is to provide a wafer bonding process chuck to solve the technical problem of poor wafer bonding quality using the chuck in the prior art.

[0005] The wafer bonding process chuck provided by the present application comprises an inner disc and an outer ring connected to each other, the inner disc is provided with a vacuum air path for adsorbing a lower wafer placed on the inner disc; the outer ring is fixedly provided with a plurality of sets of spacer components and a plurality of sets of pressing plate components, the spacer of the spacer component has a working position between the lower wafer and the upper wafer and an initial position outside the lower wafer and the upper wafer; the pressing plate of the pressing plate component has a working position above the upper wafer and an initial position outside the upper wafer.

[0006] Further, the spacer component comprises a left-handed spacer component and a right-handed spacer component, the spacer of the left-handed spacer component can rotate counterclockwise from its initial position to its working position, and the spacer of the right-handed spacer component can rotate clockwise from its initial position to its working position.

[0007] The pressing plate component comprises a left-handed pressing plate component and a right-handed pressing plate component, the pressing plate of the left-handed pressing plate component can rotate counterclockwise to its working position, and the pressing plate of the right-handed pressing plate component can rotate clockwise to its working position.

[0008] Further, the spacer assembly comprises one set of left-handed spacer assemblies and two sets of right-handed spacer assemblies, the pressing plate assembly comprises one set of left-handed pressing plate assemblies and two sets of right-handed pressing plate assemblies, three sets of the pressing plate assemblies are arranged one-to-one corresponding to three sets of the spacer assemblies, and the working position of the pressing plate of the pressing plate assembly is located directly above the working position of the spacer of the corresponding spacer assembly.

[0009] Further, the spacer assembly comprises a sliding seat fixedly installed on the outer ring and a sliding plate capable of frictionally rotating relative to the sliding seat, the spacer is fixedly arranged on the sliding plate, and the sliding plate can drive the spacer to rotate into or out of the lower wafer and the upper wafer.

[0010] Further, the sliding seat is provided with a slot, the sliding plate is inserted into the slot and is rotatably connected to the upper and lower slot walls of the slot through a first pin shaft; the sliding plate is provided with a circular-arc protrusion, and a friction plate is also fixedly arranged in the slot, and when the sliding plate rotates relative to the sliding seat, the circular-arc protrusion frictionally rolls relative to the working surface of the friction plate.

[0011] Further, a first limiting groove is arranged on the side of the friction plate away from the circular-arc protrusion, and the axis of the first limiting groove is arranged in parallel with the axis of the first pin shaft; the spacer assembly further comprises a second pin shaft, and the second pin shaft is inserted into the first limiting groove and connected with the sliding seat.

[0012] Further, the spacer assembly further comprises a limiting block, and the spacer is fixedly installed on the top of the limiting block; the sliding plate is provided with a second limiting groove matched with the bottom of the limiting block, the bottom of the limiting block is located in the second limiting groove and is fixedly connected with the sliding plate, so as to prevent the spacer from rotating relative to the sliding plate.

[0013] Further, the pressing plate assembly comprises a base and a shaft rod, the base is fixedly installed on the outer ring, the base is provided with an accommodating cavity, the shaft rod is movably inserted into the accommodating cavity, and the top of the shaft rod extends out of the through hole of the top wall of the accommodating cavity; the pressing plate is fixedly installed on the top of the shaft rod; the accommodating cavity is further provided with an elastic member, the elastic member is sleeved outside the shaft rod, the top end of the elastic member abuts against the top wall of the accommodating cavity, and the bottom end of the elastic member is fixedly arranged relative to the shaft rod and is always in a compressed state, so that the pressing plate always has a tendency to be located at an initial height;

[0014] The pressing plate assembly further comprises a third pin shaft, which is inserted into the channel groove formed in the bottom of the base and the pin hole formed in the bottom of the shaft rod, the channel groove comprises a first groove segment and a second groove segment which extend along the axial direction of the base and are separated by a preset included angle, and a communication groove segment which extends along the circumferential direction of the base and communicates the first groove segment and the second groove segment, the third pin shaft can ascend through one of the first groove segment and the second groove segment, and after rotation through the communication groove segment, descend through the other one of the first groove segment and the second groove segment.

[0015] The wafer bonding process chuck provided by the present application can produce the following beneficial effects:

[0016] The wafer bonding process chuck provided by the present application can produce the following beneficial effects:

[0017] The second object of the present application is to provide a wafer bonding process equipment to solve the technical problem of poor wafer bonding quality using the chuck in the prior art.

[0018] The wafer bonding process equipment provided by the present application comprises the wafer bonding process chuck described above, and further comprises an alignment unit and a bonding unit.

[0019] The alignment unit is provided with a plurality of extension air cylinders, which are used to push the spacer pieces of the spacer piece assemblies to the upper side of the lower wafer; the alignment unit is provided with a plurality of lifting air cylinders and rotating air cylinders, in each group of the lifting air cylinders and the rotating air cylinders, the lifting air cylinders drive the rotating air cylinders to lift, and the rotating air cylinders drive the pressing plates of the pressing plate assemblies to rotate to the upper side of the upper wafer, so that the pressing plates are pressed on the upper side of the upper wafer.

[0020] The bonding unit is provided with a plurality of sets of top pressing plate air cylinders and a plurality of sets of pulling air cylinders, the top pressing plate air cylinders are used to lift the pressing plate of the pressing plate assembly from above the upper wafer, so that the pulling air cylinders pull the spacer corresponding to the pressing plate from between the upper wafer and the lower wafer.

[0021] Further, the alignment unit is also provided with a plurality of sets of retracting air cylinders, which are used to retract the spacer to the initial position.

[0022] The wafer bonding process equipment provided by the application can produce the following beneficial effects:

[0023] The wafer bonding process equipment provided by the application includes an alignment unit, a bonding unit and the wafer bonding process chuck described above. When in use, in the alignment unit, the lower wafer placed thereon is adsorbed and fixed by using the inner disc, then the spacer of the spacer assembly is pushed to its working position, i.e. above the lower wafer, by using the extending air cylinder, then the upper wafer is aligned with the lower wafer and placed above each spacer, finally, the same group of rotating air cylinders is lifted by using the lifting air cylinder, and then the pressing plate of the pressing plate assembly is rotated to its working position, i.e. pressed on the upper wafer, by using the rotating air cylinder. In this way, it can not only ensure that the upper and lower wafers do not contact during the alignment process, but also ensure that the position and relative position of the upper and lower wafers do not change during the process of moving the upper and lower wafers from the alignment unit to the bonding unit, thereby laying a good foundation for ensuring the bonding quality. After the aligned upper and lower wafers are moved to the bonding unit, the spacers can be pulled out in batches, and after each batch of spacers is pulled out, the pressing plate corresponding to the batch of spacers is pressed down and the upper wafer is pressed above the lower wafer, and then the next batch of spacers is pulled out and the next batch of pressing plates is pressed down, until all the spacers are pulled out and all the pressing plates complete the pressing action. When pulling out the spacers, the corresponding pressing plate can be lifted first by using the top pressing plate air cylinder, then the corresponding spacer is pulled out by using the pulling air cylinder, and finally the pressing plate is pressed down and the upper wafer is pressed above the lower wafer. In this way, the alignment of the upper and lower wafers in the bonding unit can be continued, thereby ensuring the bonding quality. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0025] Figure 1 The front structure schematic diagram of the wafer bonding process chuck provided by the embodiment of the present application;

[0026] Figure 2 A schematic diagram of the reverse structure of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 1;

[0027] Figure 3 A schematic diagram of the three-dimensional structure of the left-handed spacer assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 2;

[0028] Figure 4 A schematic diagram of the exploded structure of the left-handed spacer assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 3;

[0029] Figure 5 A schematic diagram of the three-dimensional structure of the right-handed spacer assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 4;

[0030] Figure 6 A schematic diagram of the exploded structure of the right-handed spacer assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 5;

[0031] Figure 7 A schematic diagram of the three-dimensional structure of the left-handed pressing plate assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 6;

[0032] Figure 8 A schematic diagram of the exploded structure of the left-handed pressing plate assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 7;

[0033] Figure 9 A schematic diagram of the three-dimensional structure of the right-handed pressing plate assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 8;

[0034] Figure 10 A schematic diagram of the exploded structure of the right-handed pressing plate assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 9;

[0035] Figure 11 A schematic diagram of the cross-sectional structure of the pressing plate assembly of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 10;

[0036] Figure 12 A schematic diagram of the three-dimensional structure of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 11;

[0037] Figure 13 A schematic diagram of the three-dimensional structure of the wafer bonding process chuck provided by the embodiment of the present application is shown in FIG. 12.

[0038] Explanation of reference signs:

[0039] 100-Inner disc; 200-Outer ring; 210-First receiving groove; 220-First through groove; 230-Second through groove; 240-Second receiving groove; 250-Extended air rod groove; 260-Retracted air rod groove; 300-Connecting piece; 410-Suction port connector; 420-Vacuum tube;

[0040] 500-Spacer assembly; 510-Slide block; 511-Slot; 520-First pin; 530-Friction pad; 531-First limiting groove; 540-Second pin; 550-Slide plate; 551-Arc protrusion; 552-Second limiting groove; 553-Push protrusion; 554-Pull-back protrusion; 560-Spacer; 570-Limiting block; 581-Connecting screw; 582-Nut;

[0041] 600-Pressure plate assembly; 610-Base; 611-Receiving cavity; 612-First groove segment; 613-Connecting groove segment; 614-Second groove segment; 615-Fixing ear; 620-Shaft; 621-Third limiting groove; 630-Elastic element; 640-Top cover; 650-Base; 660-Gasket; 670-Pressure plate; 680-Third pin. Detailed Implementation

[0042] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0043] This embodiment provides a wafer bonding process chuck, such as Figure 1 and Figure 2 As shown, the device includes an inner disk 100 and an outer ring 200 connected to each other. The inner disk 100 is provided with a vacuum passage for adsorbing the lower wafer placed on the inner disk 100. The outer ring 200 is fixedly provided with multiple sets of spacer assemblies 500 and multiple sets of pressure plate assemblies 600. The spacer 560 of the spacer assembly 500 has a working position located between the lower wafer and the upper wafer and an initial position located outside the lower wafer and the upper wafer. The pressure plate 670 of the pressure plate assembly 600 has a working position pressing on the upper wafer and an initial position located outside the upper wafer.

[0044] The wafer bonding process chuck provided by the embodiment is used as follows: in the alignment unit, the lower wafer is adsorbed and fixed on the inner disc 100, then the spacer 560 of each spacer assembly 500 is moved to the working position, i.e., above the lower wafer, then the upper wafer is aligned with the lower wafer and placed above the spacer 560, and finally, the pressing plate 670 of each pressing plate assembly 600 is moved to the working position, i.e., pressed on the upper wafer. In this way, the upper and lower wafers are not in contact during the alignment process, and the position and relative position of the upper and lower wafers do not change during the transfer of the upper and lower wafers from the alignment unit to the bonding unit, thereby laying a good foundation for ensuring the bonding quality. After the aligned upper and lower wafers are transferred to the bonding unit, the spacers 560 can be pulled out in batches, for example, there are three spacers 560, which are pulled out in three times, one at a time. After pulling out each batch of spacers 560, the pressing plate 670 near the batch of spacers 560 is pressed down to press the upper wafer above the lower wafer, and then the next batch of spacers 560 is pulled out and the next batch of pressing plates 670 is pressed down. Until all the spacers 560 are pulled out and all the pressing plates 670 are pressed down, the upper and lower wafers can continue to be aligned in the bonding unit, thereby ensuring the bonding quality. Of course, the above use steps are only one of the use methods of the chuck provided by the embodiment, and other step sequences can also be used, i.e., the order of the use steps of the wafer bonding process chuck is not limited in the application.

[0045] Specifically, as shown in Figure 1 and Figure 2 , the wafer bonding process chuck provided by the embodiment further comprises a plurality of connecting pieces 300 connecting the inner disc 100 and the outer ring 200. More specifically, the connecting pieces 300 are elastic connecting pieces, and the number of the connecting pieces is six. The six elastic connecting pieces are uniformly distributed in the circumferential direction. Of course, in other embodiments of the application, the number of the connecting pieces 300 is not limited to six, and is not limited to the above distribution form, as long as the inner disc 100 and the outer ring 200 can be reliably connected.

[0046] Specifically, in the embodiment, as shown in Figure 1 , the outer ring 200 is further provided with a suction connector 410 and a vacuum pipe 420. The suction connector 410 is connected to a vacuum air source, and one end of the vacuum pipe 420 is in communication with the suction connector 410, and the other end is in communication with the vacuum air path of the inner disc 100. In this way, the vacuum air source extracts the gas in the vacuum air path of the inner disc 100 through the suction connector 410 and the vacuum pipe 420, so that the lower wafer placed on the inner disc 100 is adsorbed and fixed on the inner disc 100.

[0047] Specifically, in the embodiment, as shown in Figure 1As shown, the spacer assembly 500 includes a left-rotation spacer assembly 500L and a right-rotation spacer assembly 500R, the spacer 560L of the left-rotation spacer assembly 500L is capable of rotating counterclockwise from its initial position to its working position, and the spacer 560R of the right-rotation spacer assembly 500R is capable of rotating clockwise from its initial position to its working position; the pressing plate assembly 600 includes a left-rotation pressing plate assembly 600L and a right-rotation pressing plate assembly 600R, the pressing plate 670L of the left-rotation pressing plate assembly 600L is capable of rotating counterclockwise to its working position, and the pressing plate 670R of the right-rotation pressing plate assembly 600R is capable of rotating clockwise to its working position. In this arrangement, by setting the rotation direction of the spacer 560 in different directions, and setting the rotation direction of the pressing plate 670 in different directions as well, the spacer 560 and the pressing plate 670 can be effectively prevented from pushing the wafer to rotate during rotation, and because the rotation directions are different, the occupied space positions are also different, so the rotation direction of the spacer 560 and the pressing plate 670 can be selected according to the space position.

[0048] More specifically, in this embodiment, the spacer assembly 500 includes one set of left-rotation spacer assemblies 500L and two sets of right-rotation spacer assemblies 500R, the pressing plate assembly 600 includes one set of left-rotation pressing plate assemblies 600L and two sets of right-rotation pressing plate assemblies 600R, the three sets of pressing plate assemblies 600 are arranged one-to-one corresponding to the three sets of spacer assemblies 500, and the working position of the pressing plate 670 of the pressing plate assembly 600 is located directly above the working position of the spacer 560 of the corresponding spacer assembly 500. In this arrangement, the upper wafer is not easily damaged because the lower part of the same position of the upper wafer in the circumferential direction is supported by the spacer 560, and the upper part is pressed by the pressing plate 670.

[0049] It should be noted here that in other embodiments of the present application, the spacer assembly 500 can also be a left-rotation spacer assembly 500L or a right-rotation spacer assembly 500R, that is, even if the rotation directions of the spacer assemblies 500 are different, they can also be two left-rotation spacer assemblies 500L and one right-rotation spacer assembly 500R, and of course, the number of spacer assemblies 500 is not limited to the above-mentioned three sets, for example, it can also be four sets, etc. In other embodiments of the present application, the pressing plate assembly 600 can also be a left-rotation pressing plate assembly 600L or a right-rotation pressing plate assembly 600R, that is, even if the rotation directions of the pressing plate assemblies 600 are different, they can also be two left-rotation pressing plate assemblies 600L and one right-rotation pressing plate assembly 600R, and of course, the number of pressing plate assemblies 600 is not limited to the above-mentioned three sets, for example, it can also be four sets, etc.

[0050] Specifically, in this embodiment, as shown in FIG. 1, the spacer assembly 500 includes a left-rotation spacer assembly 500L and a right-rotation spacer assembly 500R, the spacer 560L of the left-rotation spacer assembly 500L is capable of rotating counterclockwise from its initial position to its working position, and the spacer 560R of the right-rotation spacer assembly 500R is capable of rotating clockwise from its initial position to its working position; the pressing plate assembly 600 includes a left-rotation pressing plate assembly 600L and a right-rotation pressing plate assembly 600R, the pressing plate 670L of the left-rotation pressing plate assembly 600L is capable of rotating counterclockwise to its working position, and the pressing plate 670R of the right-rotation pressing plate assembly 600R is capable of rotating clockwise to its working position. In this arrangement, by setting the rotation direction of the spacer 560 in different directions, and setting the rotation direction of the pressing plate 670 in different directions as well, the spacer 560 and the pressing plate 670 can be effectively prevented from pushing the wafer to rotate during rotation, and because the rotation directions are different, the occupied space positions are also different, so the rotation direction of the spacer 560 and the pressing plate 670 can be selected according to the space position. Figures 3 to 6As shown, the spacer assembly 500 comprises a sliding base 510 fixedly mounted on the outer ring 200 and a sliding plate 550 capable of frictionally rotating relative to the sliding base 510, and the spacer 560 is fixedly arranged on the sliding plate 550, and the sliding plate 550 can drive the spacer 560 to rotate into or out of the lower wafer and the upper wafer. Wherein, "frictionally rotating" means that the sliding base 510 and the sliding plate 550 have a certain friction, and the sliding plate 550 rotates relative to the sliding base 510 without sliding. In this arrangement, when it is needed to rotate the spacer 560 to its working position, the sliding plate 550 can be pushed to drive the spacer 560 to rotate; when it is needed to pull out the spacer 560 from between the upper wafer and the lower wafer, the sliding plate 550 is rotated to drive the spacer 560 to rotate out.

[0051] Specifically, in the embodiment, as shown in Figures 3 to 6 The sliding base 510 is provided with a slot 511, the sliding plate 550 is inserted into the slot 511 and is rotatably connected to the upper and lower slot walls of the slot 511 through the first pin shaft 520; the sliding plate 550 is provided with a circular arc protrusion 551, and a friction plate 530 is also fixedly arranged in the slot 511, and when the sliding plate 550 rotates relative to the sliding base 510, the circular arc protrusion 551 frictionally rolls relative to the working surface of the friction plate 530. Wherein, the "working surface of the friction plate 530" refers to the surface of the friction plate 530 in contact with the circular arc protrusion 551; "frictionally rolling" means that the circular arc protrusion 551 and the friction plate 530 have a certain friction, and when the sliding plate 550 is subjected to an external force such as a pushing force, the circular arc protrusion 551 can roll relative to the friction plate 530 without sliding; when the external force such as the pushing force is stopped, the circular arc protrusion 551 is stationary relative to the friction plate 530. In this arrangement, after the sliding plate 550 is rotated to the desired position, if no external force is applied, the sliding plate 550 and the spacer 560 will remain in the position, thereby avoiding the situation that when the spacer 560 is needed to separate the upper wafer and the lower wafer, the spacer 560 slides out of the upper wafer and the lower wafer, or when the spacer 560 is not needed to separate the upper wafer and the lower wafer, the spacer 560 is inserted into the upper wafer and the lower wafer to interfere with them.

[0052] Specifically, in the embodiment, as shown in Figure 4 and Figure 6 The side of the friction plate 530 away from the circular arc protrusion 551 is provided with a first limiting groove 531, and the axis of the first limiting groove 531 is arranged in parallel with the axis of the first pin shaft 520; the spacer assembly 500 further comprises a second pin shaft 540, and the second pin shaft 540 is inserted into the first limiting groove 531 and connected with the sliding base 510. In this arrangement, the second pin shaft 540 and the first pin shaft 520 respectively limit the two sides of the friction plate 530 to fix its position relative to the sliding base 510.

[0053] More specifically, in the present embodiment, the process continues as in Figure 4 and Figure 6 As shown in the figures, the first limiting groove 531 is in number of two, and the second pin shaft 540 is also in number of two, with the two second pin shafts 540 respectively inserted into the two first limiting grooves 531 and connected with the sliding seat 510. The two second pin shafts 540 have a better limiting effect on the friction plate 530.

[0054] Specifically, in the present embodiment, as shown in the figures, Figures 3 to 6 The spacer plate assembly 500 further comprises a limiting block 570, and the spacer plate 560 is fixedly installed on the top of the limiting block 570. The sliding plate 550 is provided with a second limiting groove 552 matched with the bottom of the limiting block 570, and the bottom of the limiting block 570 is located in the second limiting groove 552 and fixedly connected with the sliding plate 550, for preventing the spacer plate 560 from rotating relative to the sliding plate 550. In this arrangement, the second limiting groove 552 forms a limiting effect on the limiting block 570, so as to effectively prevent the limiting block 570 and the spacer plate 560 thereon from rotating relative to the sliding plate 550.

[0055] More specifically, in the present embodiment, as shown in the figures, Figure 4 and Figure 6 The limiting block 570 is substantially in the shape of a quadrangular prism, and the second limiting groove 552 is matched with the bottom of the limiting block 570. In this arrangement, even if the limiting block 570 is loosened relative to the sliding plate 550, it will not rotate relative to the sliding plate 550. Of course, in other embodiments of the present application, the shape of the limiting block 570 is not limited to a quadrangular prism, but can also be other shapes, for example, the limiting block 570 can also be in the shape of a hexagonal prism, etc., as long as it can cooperate with the second limiting groove 552 and cannot rotate relative to the sliding plate 550 under the limiting effect of the second limiting groove 552, and the present application does not specifically limit the shapes of the limiting block 570 and the second limiting groove 552.

[0056] Specifically, in the present embodiment, as shown in the figures, Figure 4 and Figure 6 The limiting block 570 is fixed to the sliding plate 550 through a connecting screw 581 and a nut 582.

[0057] Specifically, in the present embodiment, as shown in the figures, Figures 3 to 6 The sliding plate 550 is further provided with a pushing protrusion 553 and a returning protrusion 554, wherein the pushing protrusion 553 serves as a position for applying force to the sliding plate 550 when the spacer plate 560 is rotated above the lower wafer, and the returning protrusion 554 serves as a position for applying force to the sliding plate 550 when the spacer plate 560 is rotated out from between the upper and lower wafer.

[0058] In summary, the installation of the spacer plate assembly 500 can be carried out according to the following steps: first, connect the slide plate 550 and the slide seat 510 through the first pin shaft 520, insert the friction plate 530 between the slide seat 510 and the circular arc protrusion 551 on the slide plate 550, then install the two second pin shafts 540 into the slide seat 510 through a tool, and make the friction plate 530 contact with the slide plate 550 by extruding the friction plate 530. When rotating the slide plate 550 with the slide seat 510 as the reference, there is a certain friction force between the friction plate 530 and the slide plate 550, so that the slide plate 550 will stay at a certain position without external force. At this time, the assembled parts of the spacer plate assembly 500 are connected to the reserved hole positions on the outer ring 200 through two screws. Install the connecting screw rod 581 into the threaded hole at the front end of the slide plate 550, screw the nut 582 onto the connecting screw rod 581, place the limiting block 570 on the protruding connecting screw rod 581, place the spacer plate 560 on the limiting block 570, and press the limiting block 570 and the spacer plate 560 tightly through the screw and the internal threaded hole of the connecting screw rod 581. Of course, the above installation steps of the spacer plate assembly 500 are only one of the installation steps of the spacer plate assembly 500, and other step sequences can also be used, that is, the sequence of the installation steps of the spacer plate assembly 500 in the present application does not have a limiting effect.

[0059] The installation method of the right-handed spacer plate assembly 500R and the left-handed spacer plate assembly 500L is consistent, and only the slide plate 550L is replaced by the slide plate 550R.

[0060] Specifically, in the present embodiment, as shown in FIG. 6, the slide plate 550R is connected to the slide seat 510 through the first pin shaft 520, and the friction plate 530 is inserted between the slide seat 510 and the circular arc protrusion 551 on the slide plate 550R. Then, the two second pin shafts 540 are installed into the slide seat 510 through a tool, and the friction plate 530 is extruded to contact with the slide plate 550R. When rotating the slide plate 550R with the slide seat 510 as the reference, there is a certain friction force between the friction plate 530 and the slide plate 550R, so that the slide plate 550R will stay at a certain position without external force. Figures 7 to 11As shown, the pressure plate assembly 600 includes a base 610 and a shaft 620. The base 610 is fixedly installed on the outer ring 200 and has a receiving cavity 611. The shaft 620 is movably inserted into the receiving cavity 611, and the top of the shaft 620 extends out from a through hole in the top wall of the receiving cavity 611. The pressure plate 670 is fixedly installed on the top of the shaft 620. An elastic element 630 is also provided inside the receiving cavity 611. The elastic element 630 is sleeved outside the shaft 620, with its top end abutting against the top wall of the receiving cavity 611 and its bottom end relatively fixed to the shaft 620, always in a compressed state, so that the pressure plate 670 always tends to be at its initial height. The pressure plate assembly 600 also includes a third pin 680, which is inserted into a channel groove at the bottom of the base 610 and a pin hole at the bottom of the shaft 620. The channel groove includes a first groove segment 612 and a second groove segment 614 extending axially along the base 610 and separated by a preset included angle, and a connecting groove segment 613 extending circumferentially along the base 610 and connecting the first groove segment 612 and the second groove segment 614. The third pin 680 can rise through one of the first groove segment 612 and the second groove segment 614, and after rotating through the connecting groove segment 613, it can descend through the other of the first groove segment 612 and the second groove segment 614. In this configuration, when the position of the pressure plate 670 is stable and does not need to be changed, the third pin 680 is located in the first groove 612 or the second groove 614 under the action of the elastic element 630. When it is necessary to rotate the pressure plate 670, the third pin 680 is driven by the drive shaft 620 or directly driven. If the third pin 680 is located in the first groove 612, it rises to the top of the first groove 612, then rotates circumferentially to the top of the second groove 614, and finally, under the action of the elastic element 630, it descends along the second groove 614. Alternatively, if the third pin 680 is located in the second groove 614, it rises to the top of the second groove 614, then rotates circumferentially to the top of the first groove 612, and finally, under the action of the elastic element 630, it descends along the first groove 612.

[0061] Specifically, in this embodiment, as Figures 7 to 10 As shown, the outer wall of the base 610 is provided with fixing ears 615, and fasteners are fixed to the outer ring 200 after passing through the fixing holes on the fixing ears 615. More specifically, in this embodiment, there are two fixing ears 615, which are respectively provided on both sides of the base 610, and two fasteners are fixed to the outer ring 200 after passing through the fixing holes on the two fixing ears 615 respectively.

[0062] Specifically, in this embodiment, as Figure 8 , Figure 10 as well as Figure 11As shown, the inner part of the accommodating cavity 611 is further provided with a gasket 660 and a top cover 640, the gasket 660 is located between the top wall of the accommodating cavity 611 and the top cover 640, the top of the shaft 620 extends out of the through hole provided on the top wall of the accommodating cavity 611 after extending out of the through hole provided on the top cover 640; the top end of the elastic member 630 abuts against the top cover 640; the bottom of the accommodating cavity 611 is further provided with a base 650, the base 650 is sleeved on the shaft 620; the third pin shaft 680 is sequentially inserted into the channel groove on one side of the base 610, the pin hole on one side of the base 650 and one end of the pin hole on the shaft 620, and sequentially extends out of the other end of the pin hole on the shaft 620 and the pin hole on the other side of the base 650; the bottom end of the elastic member 630 abuts against the base 650. In this arrangement, the top cover 640 and the base 650 directly limit the top end and the bottom end of the elastic member 630 respectively, and the third pin shaft 680 relatively fixes the base 650 and the shaft 620.

[0063] Specifically, in the embodiment, as shown in Figure 8 and Figure 10 , the top end of the shaft 620 is provided with a third limiting groove 621, the pressing plate 670 is installed in the third limiting groove 621, and the third limiting groove 621 is used to prevent the pressing plate 670 from rotating relative to the shaft 620.

[0064] Specifically, in the embodiment, as shown in Figure 13 , the lower part of the outer ring 200 is provided with a first accommodating groove 210, the sliding seat 510 and the sliding plate 550 of the spacer assembly 500 are arranged in the first accommodating groove 210; the outer ring 200 is further provided with a first through groove 220, the limiting block 570 is arranged in the first through groove 220, and the spacer 560 is located above the first through groove 220. In this arrangement, part of the components of the spacer assembly 500 are located in the first accommodating groove 210 or the first through groove 220, so that the overall chuck occupies a relatively small space.

[0065] Specifically, in the embodiment, as shown in Figure 12 and Figure 13 , the outer ring 200 is further provided with a second through groove 230, the base 610 of the pressing plate assembly 600 is fixed to the bottom end face of the outer ring 200, and the shaft 620 is arranged in the second through groove 230; the upper part of the outer ring 200 is further provided with a second accommodating groove 240, and the pressing plate 670 is located in the second accommodating groove 240 when it is in the initial position. In this arrangement, part of the components of the pressing plate assembly 600 are located in the second through groove 230, and the pressing plate 670 is located in the second accommodating groove 240 when it is in the initial position, so that the overall chuck occupies a relatively small space, and the second accommodating groove 240 also has a protective effect on the pressing plate 670 when the pressing plate 670 is located in the second accommodating groove 240.

[0066] In summary, the installation of the pressing plate assembly 600 can be performed according to the following steps: first, the gasket 660 and the spring cover (i.e. the top cover 640) are sequentially installed on the shaft 620, then the spring and the base 650 are sequentially installed on the shaft 620, the gasket 660 is matched below the spring cover, and the spring cover is matched below the inner diameter of the spring, then the base 610 is sleeved from above the shaft 620, the through hole at the top of the base 610 limits the passage of the gasket 660, only allowing the shaft 620 to pass through, the pin hole on the base 650 is aligned with the pin hole on the shaft 620 and aligned with the channel groove (i.e. the movement track of the third pin shaft 680) formed below the base 610, then the third pin shaft 680 is installed into the pin holes on the base 650 and the shaft 620 by means of a tool, the end of the third pin shaft 680 coincides with the channel groove formed below the base 610, the components of the pressing plate assembly 600 that have been assembled are connected to the reserved hole positions on the outer ring 200 through two screws, and finally the pressing plate 670 is connected to the shaft 620 through a screw.

[0067] The installation method of the right-handed pressing plate assembly 600R and the left-handed pressing plate assembly 600L is consistent, except that the base 610L is replaced by the base 610R, and the pressing plate 670L is replaced by the pressing plate 670R. Because it is considered that the pressing plate 670 needs to be able to press onto the spacer sheet 560 after being rotated by 90 degrees, the left-handed pressing plate assembly 600L is rotated by 90 degrees to the left, and the two right-handed pressing plate assemblies 600R are rotated by 90 degrees to the right.

[0068] The embodiment also provides a wafer bonding process equipment, which comprises the wafer bonding process chuck and further comprises an alignment unit and a bonding unit; the alignment unit is provided with a plurality of extension air cylinders, which are used to push the spacer sheet 560 of the spacer sheet assembly 500 to above the lower wafer sheet; the alignment unit is provided with a plurality of lifting air cylinders and rotating air cylinders, in each group of the lifting air cylinders and the rotating air cylinders, the lifting air cylinder drives the rotating air cylinder to lift, and the rotating air cylinder drives the pressing plate 670 of the pressing plate assembly 600 to rotate to above the upper wafer sheet, so that the pressing plate 670 is pressed above the upper wafer sheet; the bonding unit is provided with a plurality of pressing plate air cylinders and a plurality of returning air cylinders, the pressing plate air cylinder is used to lift the pressing plate 670 of the pressing plate assembly 600 from above the upper wafer sheet, so that the returning air cylinder pulls out the spacer sheet 560 corresponding to the pressing plate 670 from between the upper wafer sheet and the lower wafer sheet.

[0069] The wafer bonding process equipment provided by the embodiment comprises an aligning unit, a bonding unit and the wafer bonding process chuck. In use, in the aligning unit, the lower wafer is adsorbed and fixed on the inner disc 100, then the spacer 560 of the spacer assembly 500 is pushed to the working position, i.e. above the lower wafer, by the extension air cylinder, then the upper wafer is aligned with the lower wafer and placed above the spacer 560, finally, the same group of rotary air cylinders is lifted by the lifting air cylinder, and then the pressing plate 670 of the pressing plate assembly 600 is rotated to the working position, i.e. pressed on the upper wafer, by the rotary air cylinder. In this way, the alignment of the upper and lower wafers can be ensured without contact between the two wafers, and the position and relative position of the two wafers can be ensured not to change when the two wafers are transferred from the aligning unit to the bonding unit, thereby laying a good foundation for ensuring the bonding quality. After the aligned upper and lower wafers are transferred to the bonding unit, the spacers 560 can be pulled out in batches, and after pulling out each batch of spacers 560, the pressing plate 670 corresponding to the batch of spacers 560 is pressed down and the upper wafer is pressed above the lower wafer, and then the next batch of spacers 560 is pulled out and the next batch of pressing plates 670 is pressed down, until all the spacers 560 are pulled out and all the pressing plates 670 complete the pressing down action. When pulling out the spacers 560, the corresponding pressing plate 670 can be first lifted by the pressing plate air cylinder, and then the corresponding spacer 560 can be pulled out by the pulling back air cylinder, and finally the pressing plate 670 can be pressed down and the upper wafer can be pressed above the lower wafer. In this way, the alignment of the upper and lower wafers in the bonding unit can be continued, thereby ensuring the bonding quality.

[0070] Specifically, in the embodiment, the aligning unit is further provided with a plurality of groups of retracting air cylinders for retracting the spacers 560 to the initial position. In this way, when aligning, the air rod of the extension air cylinder arranged on the side surface of the spacer assembly 500 is extended to push the sliding plate 550 to swing around the first pin shaft 520 fixed on the sliding seat 510, thereby pushing the spacer 560 to extend, and after the spacer 560 is extended to the position, the air rod of the extension air cylinder is retracted, and the spacer 560 is kept at this position by the friction force between the friction plate 530 and the sliding plate 550; and the air rod of the retracting air cylinder arranged on the side surface of the spacer assembly 500 is extended to push the sliding plate 550 to swing around the first pin shaft 520 fixed on the sliding seat 510, thereby pushing the spacer 560 to retract, and after the spacer 560 is retracted to the position, the air rod of the retracting air cylinder is retracted, and the spacer 560 is kept at this position by the friction force between the friction plate 530 and the sliding plate 550.

[0071] More specifically, in the embodiment, as shown in FIG. 1, the aligning unit is provided with a plurality of groups of spacer assemblies 500, and each group of spacer assemblies 500 is arranged on the side surface of the aligning unit. Figure 12 and Figure 13As shown, the side wall of the first accommodating groove 210 at the bottom of the outer ring 200 is further provided with an extended air rod groove 250 and a retracted air rod groove 260. The air rod of the extended air cylinder pushes the sliding plate 550 to drive the spacer 560 to extend to the working position after passing through the extended air rod groove 250. The force application position of the air rod of the retracted air cylinder is located on the two sides of the force application position of the air rod of the extended air cylinder. The air rod of the retracted air cylinder pushes the sliding plate 550 to drive the spacer 560 to retract to the initial position after passing through the retracted air rod groove 260.

[0072] In summary, the embodiment provides a wafer bonding process chuck and equipment, wherein the chuck includes an outer ring 200, an inner disc 100, a suction connector 410, a vacuum pipe 420, a set of left-handed pressing plate assemblies 600L, a set of left-handed spacer assemblies 500L, six elastic connecting pieces, two sets of right-handed spacer assemblies 500R, and two sets of right-handed pressing plate assemblies 600R. The inner disc 100 is connected to the outer ring 200 through the six elastic connecting pieces. The suction connector 410 is fixed on the outer ring 200. The vacuum pipe 420 is installed on the suction connector 410 and the inner disc 100. The two sets of right-handed pressing plate assemblies 600R, the set of left-handed pressing plate assemblies 600L, the two sets of right-handed spacer assemblies 500R, and the set of left-handed spacer assemblies 500L are fixed to the outer ring 200.

[0073] In the alignment unit, after the chuck is placed on the download platform by the manipulator, the chuck is fixed relative to the download platform by vacuum adsorption of the outer ring 200. The lower wafer is placed on the inner disc 100 by the manipulator. The suction connector 410 has a vacuum air source on the reverse side. The lower wafer is adsorbed on the inner disc 100 by the vacuum formed by the suction connector 410, the vacuum pipe 420, and the inner disc 100 (vacuum airways are made on the inner disc 100, including vacuum airways and vacuum text). The air rod of the extended air cylinder arranged outside the spacer assembly 500 is extended to push the spacers 560 of the set of left-handed spacer assemblies 500L and the two sets of right-handed spacer assemblies 500R. After the upper wafer and the lower wafer are aligned by high-precision movement, they are released above the three spacers 560. At this time, the three pressing plates 670 of the set of left-handed pressing plate assemblies 600L and the two sets of right-handed pressing plate assemblies 600R are lifted by the lifting of the lifting air cylinder arranged below the pressing plate assembly 600. The lifting air cylinder is installed with a rotating air cylinder. The rotating air cylinder is matched with the clamping groove below the shaft 620 through the components fixed thereon. The three pressing plates 670 are rotated above the corresponding spacers 560 by the rotation of the rotating air cylinder arranged below the pressing plate assembly 600. At this time, the lifting air cylinder arranged below the pressing plate assembly 600 is lowered, and the pressing plates 670 of the set of left-handed pressing plate assemblies 600L and the two sets of right-handed pressing plate assemblies 600R press the upper wafer above the three spacers 560 tightly.

[0074] The chuck carrying the upper and lower wafer pieces is taken out from the alignment unit by the mechanical hand and placed in the designated position in the bonding unit. After the bonding cavity is pumped to vacuum, the air rod of the top pressing plate air cylinder arranged below the pressing plate assembly 600 is raised to lift the pressing plate 670 to a certain height. At this time, the air rod of the return air cylinder arranged below the spacer piece assembly 500 is actuated to return the spacer piece 560. At this time, the air rod of the top pressing plate air cylinder is retracted, and the pressing plate 670 presses the upper and lower wafer pieces tightly. The three sets of pressing plate assemblies 600 and the three sets of spacer piece assemblies 500 sequentially perform the above operation, and then the bonding cavity is heated and the wafer pieces are pressurized to finally complete the thermal pressure bonding of the upper and lower wafer pieces.

[0075] Finally, it should be noted that in this document, relational terms such as "first" and "second", and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0076] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to the embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer bonding process chuck, characterized by, The device comprises an inner disc (100) and an outer ring (200) connected with each other, the inner disc (100) is provided with a vacuum air channel for adsorbing a lower wafer placed on the inner disc (100), the outer ring (200) is fixedly provided with a plurality of spacer component groups (500) and a plurality of pressing plate component groups (600), the spacer (560) of the spacer component group (500) has a working position between the lower wafer and an upper wafer and an initial position outside the lower wafer and the upper wafer, and the pressing plate (670) of the pressing plate component group (600) has a working position above the upper wafer and an initial position outside the upper wafer. The spacer component group (500) comprises a left-rotation spacer component group (500L) and a right-rotation spacer component group (500R), the spacer (560L) of the left-rotation spacer component group (500L) can rotate counterclockwise from the initial position to the working position, and the spacer (560R) of the right-rotation spacer component group (500R) can rotate clockwise from the initial position to the working position. The pressing plate component group (600) comprises a left-rotation pressing plate component group (600L) and a right-rotation pressing plate component group (600R), the pressing plate (670L) of the left-rotation pressing plate component group (600L) can rotate counterclockwise to the working position, and the pressing plate (670R) of the right-rotation pressing plate component group (600R) can rotate clockwise to the working position. The spacer component group (500) comprises a sliding seat (510) fixedly installed on the outer ring (200) and a sliding plate (550) capable of rotating frictionally relative to the sliding seat (510), the spacer (560) is fixedly arranged on the sliding plate (550), and the sliding plate (550) can drive the spacer (560) to rotate into or out of the lower wafer and the upper wafer. The sliding seat (510) is provided with a slot (511), the sliding plate (550) is inserted into the slot (511) and rotatably connected to the upper and lower slot walls of the slot (511) through a first pin shaft (520), the sliding plate (550) is provided with a circular-arc protrusion (551), the slot (511) is further fixedly provided with a friction plate (530), and when the sliding plate (550) rotates relative to the sliding seat (510), the circular-arc protrusion (551) frictionally rolls relative to the working surface of the friction plate (530).

2. The wafer bonding process chuck of claim 1, wherein, The spacer component group (500) comprises one left-rotation spacer component group (500L) and two right-rotation spacer component groups (500R), the pressing plate component group (600) comprises one left-rotation pressing plate component group (600L) and two right-rotation pressing plate component groups (600R), the spacer component group (500) and the pressing plate component group (600) are arranged one by one, and the working position of the pressing plate (670) of the pressing plate component group (600) is located directly above the working position of the spacer (560) of the corresponding spacer component group (500).

3. The wafer bonding process chuck of claim 1, wherein, The friction plate (530) is provided with a first limiting groove (531) on the side away from the circular-arc protrusion (551), and the axis of the first limiting groove (531) is parallel to the axis of the first pin shaft (520); the spacer-plate assembly (500) further comprises a second pin shaft (540), which is inserted into the first limiting groove (531) and connected with the sliding seat (510).

4. The wafer bonding process chuck of claim 1, wherein, The spacer-plate assembly (500) further comprises a limiting block (570), and the spacer plate (560) is fixedly installed on the top of the limiting block (570); the sliding plate (550) is provided with a second limiting groove (552) matched with the bottom of the limiting block (570), the bottom of the limiting block (570) is located in the second limiting groove (552) and fixedly connected with the sliding plate (550), so as to prevent the spacer plate (560) from rotating relative to the sliding plate (550).

5. The wafer bonding process chuck of any of claims 1-4, wherein, The pressing-plate assembly (600) comprises a base (610) and a shaft rod (620), the base (610) is fixedly installed on the outer ring (200), the base (610) is provided with an accommodating cavity (611), the shaft rod (620) is movably inserted into the accommodating cavity (611), and the top of the shaft rod (620) extends out of the through hole of the top wall of the accommodating cavity (611); the pressing plate (670) is fixedly installed on the top of the shaft rod (620); the accommodating cavity (611) is further provided with an elastic member (630), the elastic member (630) is sleeved outside the shaft rod (620), the top end of the elastic member (630) abuts against the top wall of the accommodating cavity (611), and the bottom end of the elastic member (630) is fixed relative to the shaft rod (620) and is always in a compressed state, so that the pressing plate (670) always has a tendency to be located at an initial height; The pressing-plate assembly (600) further comprises a third pin shaft (680), which is inserted into the channel groove formed in the bottom of the base (610) and the pin hole formed in the bottom of the shaft rod (620); the channel groove comprises a first groove section (612) and a second groove section (614) which extend along the axis of the base (610) and are separated by a preset included angle, and a communication groove section (613) which extends along the circumference of the base (610) and communicates the first groove section (612) and the second groove section (614); the third pin shaft (680) can ascend through one of the first groove section (612) and the second groove section (614), and descend through the other one of the first groove section (612) and the second groove section (614) after completing rotation through the communication groove section (613).

6. A wafer bonding process apparatus, characterized by, The wafer bonding process chuck of any one of claims 1-5, further comprising an alignment unit and a bonding unit. The alignment unit is provided with multiple sets of extension air cylinders for pushing the spacers (560) of the spacer assembly (500) above the upper wafer; the alignment unit is provided with multiple sets of lifting air cylinders and rotating air cylinders, in each set of the lifting air cylinders and the rotating air cylinders, the lifting air cylinders drive the rotating air cylinders to lift, and the rotating air cylinders drive the pressing plates (670) of the pressing plate assembly (600) to rotate above the upper wafer, so that the pressing plates (670) are pressed above the upper wafer; The bonding unit is provided with multiple sets of top pressing plate air cylinders and multiple sets of pull-back air cylinders, the top pressing plate air cylinders are used for lifting the pressing plates (670) of the pressing plate assembly (600) from above the upper wafer, so that the pull-back air cylinders pull out the spacers (560) corresponding to the pressing plates (670) from between the upper wafer and the lower wafer.

7. The wafer bonding process apparatus of claim 6, wherein, The alignment unit is also provided with multiple sets of retracting air cylinders for retracting the spacers (560) to the initial position.

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