Liquid cooling plate and electronic device

By designing a liquid inlet, a central liquid inlet, and an edge return outlet in the liquid cooling plate, and by incorporating heat dissipation fins with increasing density within the cooling channel, the flow path of the coolant is optimized, thus solving the problem of uneven heat dissipation from the liquid cooling plate and achieving more efficient heat dissipation and system stability.

CN116130438BActive Publication Date: 2026-04-28EVEX TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
EVEX TECHNOLOGY CO LTD
Filing Date
2022-12-27
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

The existing liquid cooling plate's coolant flow channel design results in uneven heat dissipation from the chip's heat source, especially with low heat dissipation efficiency in the first half, which cannot meet the heat dissipation requirements of high heat flux density.

Method used

Design a liquid cooling plate structure in which the liquid inlet is located in the middle and the return outlet is located at the edge. Multiple heat dissipation teeth are arranged in the cooling channel, and the density of heat dissipation teeth increases from the liquid inlet to the return outlet, forming multiple flow channel regions to optimize the flow path of the coolant and improve the heat dissipation uniformity.

Benefits of technology

By optimizing the flow path of the coolant, more uniform heat dissipation of the liquid cooling plate is achieved, heat dissipation efficiency is improved, pressure shock of the coolant is reduced, and the stability of the cooling system is maintained.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a liquid cooling plate and an electronic device, which comprise a liquid cooling plate body and a heat dissipation tooth assembly. The liquid cooling plate body has a cooling channel, a liquid inlet and at least two water return inlets. The liquid inlet is located in the middle of the liquid cooling plate body, the water return inlets are located at the edge of the liquid cooling plate, and the cooling channel is located between the liquid inlet and the water return inlets. The heat dissipation tooth assembly comprises a plurality of heat dissipation teeth arranged in the cooling channel, and the plurality of heat dissipation teeth comprise first heat dissipation teeth and second heat dissipation teeth. The first heat dissipation teeth are arranged outside the liquid inlet, and the first heat dissipation teeth form at least two flow channel areas arranged in sequence from the liquid inlet to the water return inlets. The density of the first heat dissipation teeth in different flow channel areas increases from the liquid inlet to the water return inlets. By arranging the liquid inlet in the middle of the liquid cooling plate body, the path of the cooling liquid flow is changed, the cooling liquid starts to dissipate heat from the system after entering the cooling channel, and the heat dissipation of the liquid cooling plate body is more uniform.
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Description

Technical Field

[0001] This application relates to heat dissipation technology for electronic chips, and in particular to a liquid cooling plate and electronic equipment. Background Technology

[0002] As chip power increases, the challenge of chip heat dissipation also rises, and traditional air cooling can no longer meet the heat dissipation requirements. Liquid cooling has become an effective heat dissipation method for high heat flux densities, and the structure of the liquid cooling plate significantly affects the heat dissipation performance of the liquid cooling system.

[0003] Current cold plate structures mainly include embedded tube cold plates, through-tube cold plates, and vacuum brazed cold plates with internal fins. These cold plates include an inlet and an outlet, which are positioned opposite each other on opposite sides of the cold plate, forming a flow channel for the coolant to flow forward and outward. The chip is located in the center of the cold plate, which covers the chip surface. The coolant cools the chip through the flow channel.

[0004] However, the heat source of the chip is located in the center of the cold plate, and the cooling fluid flow channel from front to back has low heat dissipation efficiency in the first half, resulting in uneven heat dissipation of the cold plate as a whole. Summary of the Invention

[0005] This application provides a liquid cooling plate and an electronic device that can effectively improve the heat dissipation efficiency of the cooling plate.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In a first aspect, this application provides a liquid cooling plate, including a liquid cooling plate body and a heat dissipation tooth assembly. The liquid cooling plate body has a cooling channel, a liquid inlet and at least two return water inlets. The liquid inlet is located in the middle of the liquid cooling plate body, the return water inlets are located at the edge of the liquid cooling plate, and the cooling channel is located between the liquid inlet and the return water inlets.

[0008] The heat dissipation tooth assembly includes a plurality of heat dissipation teeth disposed in the cooling channel, and the plurality of heat dissipation teeth include a first heat dissipation tooth. The first heat dissipation teeth are spaced apart on the outside of the liquid inlet, and the first heat dissipation teeth form at least two flow channel regions arranged sequentially from the liquid inlet to the return water inlet in a first region. The density of the first heat dissipation teeth in different flow channel regions increases from the liquid inlet to the return water inlet.

[0009] In one possible implementation, the flow channel region formed by the first heat dissipation teeth includes a first flow channel region and a second flow channel region arranged adjacent to each other. The second flow channel region is located on the side of the first flow channel region facing the return water port. The density of the first heat dissipation teeth in the first flow channel region is less than the density of the first heat dissipation teeth in the second flow channel region.

[0010] In one possible implementation, the liquid cooling plate body is a rectangular plate, and there are two return water inlets, which are located at both ends of the length direction of the liquid cooling plate body.

[0011] As one possible implementation, there are two second flow channel regions, and the two second flow channel regions are respectively disposed on both sides of the first flow channel region along the length direction of the liquid cooling plate body.

[0012] As one possible implementation, the first flow channel region extends to opposite sides in the width direction of the liquid cooling plate body, and the first flow channel region includes a straight section and an expansion section connected sequentially along the width direction of the liquid cooling plate body. The straight section is located in the middle region of the liquid cooling plate body, and the expansion section is located in the edge region in the width direction of the liquid cooling plate body.

[0013] The expansion section gradually increases in size along the length of the liquid cooling plate body from the middle of the liquid cooling plate towards the edge along the width of the liquid cooling plate.

[0014] As one possible implementation, the second flow channel region is symmetrically arranged relative to the first flow channel region.

[0015] As one possible implementation, it also includes a plurality of second heat dissipation teeth disposed between the first heat dissipation teeth and the return water inlet, and the second heat dissipation teeth form a flow channel extending toward the return water inlet.

[0016] As one possible implementation, the first heat dissipation fins are arranged in an array within the flow channel region; and / or,

[0017] Each of the second heat dissipation teeth is arranged parallel to each other.

[0018] In one possible implementation, the liquid cooling plate body further includes a water return layer, the water return layer and the cooling channel are stacked in the thickness direction of the liquid cooling plate body, and the water return layer is connected to the water return port.

[0019] Secondly, this application provides an electronic device, including a device body and a liquid cooling plate as described in any of the preceding claims, wherein the liquid cooling plate is used to dissipate heat from the device body.

[0020] This application provides a liquid-cooled plate and an electronic device, including a liquid-cooled plate body and a heat dissipation tooth assembly. The liquid-cooled plate body has a cooling channel, a liquid inlet, and at least two return inlets. The liquid inlet is located in the middle of the liquid-cooled plate body, and the return inlets are located at the edge of the liquid-cooled plate. The cooling channel is located between the liquid inlet and the return inlet. The heat dissipation tooth assembly includes a plurality of heat dissipation teeth disposed within the cooling channel, and the plurality of heat dissipation teeth includes first heat dissipation teeth. The first heat dissipation teeth are spaced apart outside the liquid inlet, and the first heat dissipation teeth form at least two flow channel regions arranged sequentially from the liquid inlet to the return inlet in a first region. The density of the first heat dissipation teeth in different flow channel regions increases from the liquid inlet to the return inlet. By using the liquid inlet located in the middle of the liquid-cooled plate body, the coolant begins to absorb heat from the chip after entering the cooling channel, thereby making the heat dissipation of the liquid-cooled plate body more uniform. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the external structure of the liquid cooling plate provided in the embodiments of this application;

[0023] Figure 2 A top view of the heat dissipation tooth assembly of the liquid cooling plate provided in an embodiment of this application;

[0024] Figure 3 This is a front view of the heat dissipation tooth assembly of the liquid cooling plate provided in an embodiment of this application;

[0025] Figure 4 Left view of the heat dissipation tooth assembly of the liquid cooling plate provided in the embodiment of this application;

[0026] Figure 5 This is a schematic diagram of the structure of the water return layer in the liquid cooling plate provided in the embodiments of this application;

[0027] Figure 6 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 1 ;

[0028] Figure 7 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 2 .

[0029] Explanation of reference numerals in the attached figures:

[0030] 100-Liquid cooling plate; 110-Liquid cooling plate body; 120-Heat dissipation tooth assembly; 1101-Cooling channel; 1102-Return water layer; 1103-Cover plate; 1104-Liquid inlet; 1105-Liquid outlet; 1106-Return water inlet; 1107-Containing tank; 1201-Second heat dissipation tooth; 1202-First heat dissipation tooth; 1203-First flow channel area; 1204-Second flow channel area; 1205-Straight section; 1206-Expansion section; 1207-Third flow channel. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. In the absence of conflict, the following embodiments and features can be combined with each other.

[0032] In existing technologies, cold plate structures mainly include embedded tube cold plates, through-tube cold plates, and vacuum brazed cold plates with internal fins. These cold plates include an inlet and an outlet, which are positioned opposite each other on opposite sides of the cold plate, forming a front-to-back coolant flow channel. The chip is located in the center of the cold plate, and the cold plate covers the chip surface. Coolant cools the chip through the flow channel. However, since the chip's heat source is located in the center of the cold plate, the cooling efficiency of the front-to-back coolant flow channel is low in the first half, resulting in uneven heat dissipation across the entire cold plate.

[0033] To overcome the deficiencies in the prior art, this application provides a liquid-cooled plate and an electronic device, including a liquid-cooled plate body and a heat dissipation tooth assembly. The liquid-cooled plate body has a cooling channel, a liquid inlet, and at least two return inlets. The liquid inlet is located in the middle of the liquid-cooled plate body, and the return inlets are located at the edge of the liquid-cooled plate. The cooling channel is located between the liquid inlet and the return inlet. The heat dissipation tooth assembly includes multiple heat dissipation teeth disposed within the cooling channel, and each of the multiple heat dissipation teeth includes a first heat dissipation tooth. The first heat dissipation teeth are spaced apart on the outside of the liquid inlet, and the first heat dissipation teeth form at least two flow channel regions arranged sequentially from the liquid inlet to the return inlet in a first region. The density of the first heat dissipation teeth in different flow channel regions increases from the liquid inlet to the return inlet. By using the liquid inlet located in the middle of the liquid-cooled plate body, the coolant begins to absorb heat from the chip after entering the cooling channel, thereby making the heat dissipation of the liquid-cooled plate body more uniform.

[0034] The present invention will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can have a clearer and more detailed understanding of the present invention.

[0035] In a first aspect, this application provides a liquid cooling plate 100, including a liquid cooling plate body 110 and a heat dissipation tooth assembly 120. The liquid cooling plate body 110 has a cooling channel 1101, a liquid inlet 1104 and at least two return outlets 1106. The liquid inlet 1104 is located in the middle of the liquid cooling plate body 110, the return outlets 1106 are located at the edge of the liquid cooling plate body 110, and the cooling channel 1101 is located between the liquid inlet 1104 and the return outlets 1106.

[0036] The heat dissipation tooth assembly 120 includes a plurality of heat dissipation teeth disposed in the cooling channel 1101, and the plurality of heat dissipation teeth include first heat dissipation teeth 1202. The first heat dissipation teeth 1202 are spaced apart outside the liquid inlet 1104, and the first heat dissipation teeth 1202 form at least two flow channel regions arranged sequentially from the liquid inlet 1104 to the return water outlet 1106 in a first region. The density of the first heat dissipation teeth 1202 in different flow channel regions increases from the liquid inlet 1104 to the return water outlet 1106.

[0037] Figure 1 This is a schematic diagram of the external structure of the liquid cooling plate provided in the embodiments of this application; Figure 2 A top view of the heat dissipation tooth assembly of the liquid cooling plate provided in an embodiment of this application; Figure 6 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 1 .

[0038] like Figure 1 , Figure 2 and Figure 6 As shown, the liquid cooling plate 100 provided in this application includes a liquid cooling plate body 110 and a heat dissipation gear assembly 120. The liquid cooling plate body 110 is provided with a cooling channel 1101, a liquid inlet 1104, two return inlets 1106, and a liquid outlet 1105. The liquid inlet 1104 is located in the middle of the liquid cooling plate body 110, the return inlets 1106 are located at the edge of the liquid cooling plate body 110, and the cooling channel 1101 is located between the liquid inlet 1104 and the return inlets 1106.

[0039] The heat dissipation fin assembly 120 is disposed within the cooling channel 1101 and includes multiple heat dissipation fins, such as... Figure 2 The first heat dissipation tooth 1202 and the second heat dissipation tooth 1201 shown are provided. The first heat dissipation tooth 1202 is spaced apart on the outside of the liquid inlet 1104. The first heat dissipation tooth 1202 forms a flow channel area in the first region, such as... Figure 2 The density of the first heat dissipation tooth 1202 in the first flow channel region 1203 and the second flow channel region 1204 increases along the direction from the liquid inlet 1104 to the return water inlet 1106.

[0040] In one possible implementation, the flow channel region formed by the first heat dissipation tooth 1202 includes a first flow channel region 1203 and a second flow channel region 1204 arranged adjacent to each other. The second flow channel region 1204 is located on the side of the first flow channel region 1203 facing the return water port 1106. The density of the first heat dissipation tooth 1202 in the first flow channel region 1203 is less than the density of the first heat dissipation tooth 1202 in the second flow channel region 1204.

[0041] For details, please refer to Figure 2 The first heat dissipation fins 1202 are disposed within the cooling channel 1101, thereby forming a first region. Within the first region, there are two flow channel regions: a first flow channel region 1203 and a second flow channel region 1204. The first flow channel region 1203 and the second flow channel region 1204 are sequentially arranged along the direction from the liquid inlet 1104 to the water outlet 1106, and the density of the first heat dissipation fins 1202 in the first flow channel region 1203 is less than the density of the first heat dissipation fins 1202 in the second flow channel region 1204.

[0042] Through the above configuration, a first flow channel region 1203 and a second flow channel region 1204 are formed. The density of the first heat dissipation fins 1202 in the first flow channel region 1203 is less than the density of the first heat dissipation fins 1202 in the second flow channel region 1204, meaning the spacing between the first heat dissipation fins 1202 in the first flow channel region 1203 is larger than the spacing between the first heat dissipation fins 1202 in the second flow channel region 1204. Therefore, the flow velocity of the coolant in the first flow channel region 1203 is greater than the flow velocity in the second flow channel region 1204. The first flow channel region 1203 allows for rapid distribution of the coolant flow direction after it enters through the inlet 1104.

[0043] In addition, the coolant entering the cooling channel 1101 is a liquid with a certain pressure. The first heat dissipation tooth 1202 in the first flow channel region 1203 can not only quickly control the flow direction of the coolant, but also provide flow resistance of the coolant through the first heat dissipation tooth 1202, thereby reducing the pressure of the coolant, reducing the impact of the coolant on the system, and maintaining the stability of the cooling system.

[0044] It is possible that the liquid cooling plate body 110 is a rectangular plate, and there are two return ports 1106, which are located at both ends of the length direction of the liquid cooling plate body 110.

[0045] Figure 6 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 1 ; Figure 7 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 2 .

[0046] Combination Figure 1 , Figure 2 , Figure 6 , Figure 7 As shown, the liquid cooling plate body 110 in this application is a rectangular plate, including two return water ports 1106, and the two return water ports 1106 are respectively arranged on both sides of the liquid cooling plate body 110 along the length direction of the liquid cooling plate body 110.

[0047] It should be noted that the positions of the two return inlets 1106 in the width direction of the liquid cooling plate body 110 are not specifically limited and need to be adjusted according to the actual situation.

[0048] Optionally, there are two second flow channel regions 1204, and the two second flow channel regions 1204 are respectively disposed on both sides of the first flow channel region 1203 along the length direction of the liquid cooling plate body 110.

[0049] Specifically, such as Figure 2 As shown, the cooling channel 1101 includes two second flow channel regions 1204, which are arranged sequentially along the length of the liquid cooling plate body 110, and are located on both sides of the first flow channel region 1203. It should be noted that the density of the first heat dissipation teeth 1202 in the two second flow channel regions 1204 is the same.

[0050] In one alternative implementation, the first flow channel region 1203 extends to opposite sides of the liquid cooling plate body 110 in the width direction, and the first flow channel region 1203 includes a straight section 1205 and an expansion section 1206 connected sequentially along the width direction of the liquid cooling plate body 110. The straight section 1205 is located in the middle region of the liquid cooling plate body 110, and the expansion section 1206 is located in the edge region of the liquid cooling plate body 110 in the width direction.

[0051] The dimension of the expansion segment 1206 in the length direction of the liquid cooling plate body 110 gradually increases from the middle of the liquid cooling plate 100 to the edge in the width direction of the liquid cooling plate 100.

[0052] Specifically, such as Figure 2 As shown, in this embodiment, the first flow channel region 1203 extends along the width direction of the liquid cooling plate body 110 to both sides of the width direction of the liquid cooling plate body 110. The first flow channel region 1203 includes a straight section 1205 and an expansion section 1206. Correspondingly, the straight section 1205 extends from the center of the liquid cooling plate body 110 to both sides along the width of the liquid cooling plate body 110, and the expansion section 1206 is disposed in the edge region along the width direction of the liquid cooling plate body 110, and the expansion section 1206 and the straight section 1205 are transitionally connected. The dimension of the expansion section 1206 in the length direction of the liquid cooling plate body 110 gradually increases from the middle of the liquid cooling plate 100 to the edge of the width direction of the liquid cooling plate 100.

[0053] The first heat dissipation tooth 1202 not only enables rapid flow and distribution of coolant in the first flow channel region 1203, but also reduces coolant pressure. However, as the coolant flows from the center of the liquid cooling plate body 110 along the first flow channel region 1203 to both sides of the width direction of the liquid cooling plate body 110, the liquid resistance increases. By setting the expansion section 1206, the flow resistance of the coolant in the first flow channel region 1203 along the opposite sides of the width direction of the liquid cooling plate body 110 can be reduced, and the coolant can be quickly distributed to the second flow channel region 1204.

[0054] It is possible that the second flow channel region 1204 is symmetrically arranged relative to the first flow channel region 1203.

[0055] Still Figure 2 As shown, in this embodiment, two second flow channel regions 1204 are provided. The two second flow channel regions 1204 are arranged sequentially along the length direction of the liquid cooling plate body 110, and are symmetrically arranged on opposite sides of the first flow channel region 1203 with the width direction of the first flow channel region 1203 as the center of symmetry.

[0056] Optionally, the heat dissipation tooth assembly 120 may further include a plurality of second heat dissipation teeth 1201 disposed between the first heat dissipation tooth 1202 and the return water port 1106, and the second heat dissipation teeth 1201 constitute a flow channel extending toward the return water port 1106.

[0057] Figure 3 This is a front view of the heat dissipation tooth assembly of the liquid cooling plate provided in an embodiment of this application; Figure 4 Left view of the heat dissipation tooth assembly of the liquid cooling plate provided in the embodiment of this application; Figure 5 This is a schematic diagram of the structure of the water return layer in the liquid cooling plate provided in the embodiments of this application; Figure 6 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 1 ; Figure 7 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 2 .

[0058] Combination Figures 3-7 As shown, the heat dissipation tooth assembly 120 also includes a plurality of second heat dissipation teeth 1201. The second heat dissipation teeth 1201 are disposed between the first heat dissipation tooth 1202 and the return water port 1106, and the plurality of second heat dissipation teeth 1201 extend along the length direction of the liquid cooling plate body 110 from the first heat dissipation tooth 1202 towards the return water port 1106. A flow channel for the coolant is formed between every two second heat dissipation teeth 1201, and the extension direction of the flow channel is the same as the extension direction of the second heat dissipation tooth 1201, that is, the second heat dissipation teeth 1201 extend towards the return water port 1106. The flow channel formed between the plurality of second heat dissipation teeth 1201 is a third flow channel 1207.

[0059] Similarly, the second heat dissipation tooth 1201 is symmetrically arranged along the length of the liquid cooling plate body 110 with the center line of the first flow channel region 1203 as the axis of symmetry. Correspondingly, the third flow channel 1207 is also symmetrically arranged on the liquid cooling plate body 110.

[0060] Possibly, the first heat dissipation teeth 1202 are arranged in an array within the flow channel region; and / or, each of the second heat dissipation teeth 1201 is arranged parallel to each other.

[0061] like Figures 2-4 As shown, specifically, the first heat dissipation denticles 1202 are distributed in a matrix within the first flow channel region 1203 and the second flow channel region 1204, and the density of the first heat dissipation denticles 1202 in the first flow channel region 1203 is less than the density of the first heat dissipation denticles 1202 in the second flow channel region 1204. The second heat dissipation denticles 1201 extend along the length direction of the liquid cooling plate body 110, and each of the second heat dissipation denticles 1201 is parallel to each other.

[0062] It should be noted that the density of the first heat dissipation teeth 1202 in the first flow channel region 1203 and the second flow channel region 1204 in this embodiment is achieved by controlling the spacing between the first heat dissipation teeth 1202. The spacing between each first heat dissipation tooth 1202 is related to the spacing between the second heat dissipation teeth 1201. Specifically, the spacing between two adjacent first heat dissipation teeth 1202 in the first flow channel region 1203 is 2 to 5 times the spacing between two adjacent second heat dissipation teeth 1201; the spacing between two adjacent first heat dissipation teeth 1202 in the second flow channel region 1204 is equal to the spacing between two adjacent second heat dissipation teeth 1201.

[0063] like Figure 2 As shown, the first heat dissipation tooth 1202 provided in this embodiment is pentagonal in shape, and the first heat dissipation teeth 1202 located in the first flow channel region 1203 and the second flow channel region 1204 are all identical in shape. It should be noted that the shape of the first heat dissipation tooth 1202 can be quadrilateral, circular, hexagonal, etc. Furthermore, the shapes of the first heat dissipation teeth 1202 in the first flow channel region 1203 and the second flow channel region 1204 can be the same or different. Alternatively, when the first heat dissipation teeth 1202 are of different shapes, they can be combined with each other in the first flow channel region 1203 and the second flow channel region 1204. This application does not specifically limit the number and structure of the first heat dissipation teeth 1202, only requiring that the first heat dissipation teeth 1202 meet the relevant structural design and function.

[0064] Optionally, the liquid cooling plate body 110 also includes a water return layer 1102, the water return layer 1102 and the cooling channel 1101 are stacked in the thickness direction of the liquid cooling plate body 110, and the water return layer 1102 is connected to the water return port 1106.

[0065] Possibly, the liquid cooling plate body 110 provided in this application includes a cover plate 1103, and the cover plate 1103, the return water layer 1102, and the cooling channel 1101 are stacked sequentially in the thickness direction of the liquid cooling plate body 110. The cover plate 1103 and the return water layer 1102 are arranged opposite to each other and are sealed over the return water layer 1102. The cover plate 1103 is provided with holes through which a liquid inlet 1104 and a liquid outlet 1105 pass.

[0066] Figure 5 This is a schematic diagram of the structure of the water return layer in the liquid cooling plate provided in the embodiments of this application; Figure 6 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 1 ; Figure 7 Cross-sectional view of the liquid cooling plate provided in the embodiments of this application. Figure 2 .

[0067] like Figures 5-7 As shown, the liquid cooling plate body 110 also includes a return water layer 1102, which and the cooling channel 1101 are stacked in the thickness direction of the liquid cooling plate body 110. The bottom of the return water layer 1102 is a plate body with through holes configured as return water inlets 1106, that is, the return water inlets 1106 connect the return water layer 1102 and the cooling channel 1101. The return water layer also has a liquid inlet 1104, which is a through hole extending to the outside of the cover plate 1103. It should be noted that the return water layer 1102 includes a receiving groove 1107. After being depressurized and evenly distributed in the first flow channel region 1203 and the second flow channel region 1204, the coolant flows into the third flow channel 1207. The coolant in the third flow channel 1207 is collected in the receiving tank 1107 through the return water ports 1106 on both sides of the liquid cooling plate body 110, and finally flows out through the liquid outlet 1105.

[0068] By setting up the return water layer 1102, the coolant pressure in the cooling system is the same, and the coolant is collected in the return water layer before flowing out, which simplifies the connection process of the return water channel and makes the structure of the liquid cooling plate 100 simpler.

[0069] Secondly, this application provides an electronic device, including a device body and any of the aforementioned liquid cooling plates 100, wherein the liquid cooling plates 100 are used to dissipate heat from the device body.

[0070] Specifically, this embodiment provides an electronic device, including a chip, a housing, external piping, a device body, and any of the liquid cooling plates 100 described in the preceding embodiments. The liquid cooling plate 100 covers the chip, and the chip is located at the center of the liquid cooling plate 100. The liquid cooling plate 100 in this embodiment includes any of the structures described in the preceding embodiments, and the functions of each part have been explained in the preceding embodiments and will not be repeated here. Through the structural arrangement of the electronic device in this embodiment, when the coolant enters the cooling channel 1101 through the inlet 1104, it can directly reach the center of the heat source and begin heat dissipation. The pressurized coolant begins to flow through the first flow channel region 1203 and the second flow channel region 1204. Since the density of the first heat dissipation teeth 1202 in the first flow channel region 1203 is greater than the density of the first heat dissipation teeth 1202 in the second flow channel region 1204, the coolant can flow rapidly within the first flow channel region 1203, and the first heat dissipation teeth 1202 provide resistance, reducing the pressure of the coolant. Through the guidance and pressure reduction of the first flow channel region 1203, the coolant is then evenly distributed into the third flow channel 1207 via the second flow channel region 1204. Finally, the coolant enters the return water layer through the return water port 1106 and flows out from the outlet 1105, completing the flow circulation of the coolant to dissipate heat from the system. At the same time, the pressure of the coolant in the system is reduced through the first flow channel region 1203, the second flow channel region 1204, the third flow channel 1207, and the return water layer 1102.

[0071] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0072] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0073] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0074] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid-cooled plate, characterized in that, The device includes a liquid cooling plate body and a heat dissipation tooth assembly. The liquid cooling plate body has a cooling channel, a liquid inlet, and at least two return water inlets. The liquid inlet is located in the middle of the liquid cooling plate body, the return water inlets are located at the edge of the liquid cooling plate, and the cooling channel is located between the liquid inlet and the return water inlets. The heat dissipation tooth assembly includes a plurality of heat dissipation teeth disposed in the cooling channel, and the plurality of heat dissipation teeth include a first heat dissipation tooth. The first heat dissipation teeth are spaced apart on the outside of the liquid inlet, and the first heat dissipation teeth form at least two flow channel regions arranged sequentially from the liquid inlet to the return water inlet in a first region. The density of the first heat dissipation teeth in different flow channel regions increases from the liquid inlet to the return water inlet. The flow channel region formed by the first heat dissipation tooth includes an adjacent first flow channel region and a second flow channel region, with the second flow channel region located on the side of the first flow channel region facing the return water inlet. The first flow channel region extends to opposite sides in the width direction of the liquid cooling plate body, and the first flow channel region includes a straight section and an expansion section connected sequentially along the width direction of the liquid cooling plate body. The straight section is located in the middle region of the liquid cooling plate body, and the expansion section is located in the edge region in the width direction of the liquid cooling plate body. The expansion section gradually increases in size along the length of the liquid cooling plate body from the middle of the liquid cooling plate to the edge along the width of the liquid cooling plate. It also includes multiple second heat dissipation teeth disposed between the first heat dissipation teeth and the return water port, and the second heat dissipation teeth form a flow channel extending towards the return water port. The flow channel formed between the multiple second heat dissipation teeth is a third flow channel. After the coolant is depressurized and evenly distributed in the first flow channel region and the second flow channel region, it flows into the third flow channel. The coolant passing through the third flow channel is collected through the return water ports on both sides of the liquid cooling plate body.

2. The liquid cooling plate according to claim 1, characterized in that, The density of the first heat dissipation teeth in the first flow channel region is less than the density of the first heat dissipation teeth in the second flow channel region.

3. The liquid cooling plate according to claim 2, characterized in that, The liquid cooling plate body is a rectangular plate, and there are two return water inlets, which are located at both ends of the length direction of the liquid cooling plate body.

4. The liquid cooling plate according to claim 3, characterized in that, There are two second flow channel regions, and the two second flow channel regions are respectively located on both sides of the first flow channel region along the length direction of the liquid cooling plate body.

5. The liquid cooling plate according to claim 4, characterized in that, The second flow channel region is symmetrically arranged relative to the first flow channel region.

6. The liquid cooling plate according to claim 1, characterized in that, The first heat dissipation fins are arranged in an array within the flow channel region; and / or, Each of the second heat dissipation teeth is arranged parallel to each other.

7. The liquid-cooled plate according to any one of claims 1-4, characterized in that, The liquid cooling plate body also includes a water return layer, the water return layer and the cooling channel are stacked in the thickness direction of the liquid cooling plate body, and the water return layer is connected to the water return port.

8. An electronic device, characterized in that, It includes a device body and a liquid cooling plate as described in any one of claims 1-7, wherein the liquid cooling plate is used to dissipate heat from the device body.

Citation Information

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