Method of manufacturing an image sensor mobile device and image sensor mobile device

Abstract

This invention discloses a method for manufacturing an image sensor moving device and the image sensor moving device itself, relating to the field of image sensor moving technology. The manufacturing method includes: obtaining a spring substrate; etching the spring substrate to obtain a spring wire region, a mover region, and a stator region, respectively; fabricating a circuit board on the upper surface of the spring substrate, the circuit board including at least one circuit layer and at least one flexible circuit layer disposed on the at least one circuit layer, wherein the flexible circuit layer at the upper end of the mover region and the circuit layer, as well as the flexible circuit layer at the upper end of the stator region and the circuit layer, are electrically connected; removing the flexible circuit layer directly above the spring wire region, and removing the circuit layer directly above the spring wire region except directly above the spring wire region, to obtain an inner circuit board connected to the mover, an outer circuit board connected to the stator, and connecting lines connecting the inner and outer circuit boards. The manufacturing method of this application saves production costs and improves production efficiency.

Description

Technical Field

[0001] This invention relates to the field of image sensor mobility technology, and more particularly to a method for manufacturing an image sensor mobility device used in a camera module and the image sensor mobility device itself. Background Technology

[0002] Among the factors affecting the size of mobile phone camera modules, the optical image stabilization motor (OIS) plays a decisive role. As mobile phone camera sensors become increasingly larger and lenses heavier, the thrust of traditional lens-moving OIS motors becomes increasingly insufficient, further complicating the already large camera module size. This has led to the development of a new type of camera module that uses image sensor movement to replace the traditional lens-moving module. Because the image sensor is relatively lighter than the lens, using an image sensor translation-based OIS motor can effectively reduce the thrust required for OIS motors. High image quality is more easily achieved in a camera if the lens movement of the image sensor along the optical axis is accompanied by minimal parasitic motion in other degrees of freedom (e.g., on the X and Y axes orthogonal to the camera's optical (Z) axis). Therefore, external stimuli / disturbances can be sensed and reacted to by adjusting the position of the optical lens on the X and / or Y axes, attempting to compensate for unwanted lens movements. In some mobile phone cameras, autofocus can also be achieved using image sensor movement on the Z-axis, thereby reducing the driving force of the motor driving the lens for autofocus.

[0003] As smartphones become increasingly thinner and lighter, the development of miniaturized and lightweight mobile phone camera modules is becoming a future trend. Among them, the mobile device used for image sensors in mobile phone camera modules is a key component.

[0004] Traditional methods for manufacturing mobile devices using image sensors involve creating a circuit layer on a spring substrate. This circuit layer is then connected to an FPC flexible circuit board via an ACF (Active Coating) or hot bar pressing process to achieve connectivity with the mobile device. However, the ACF or hot bar pressing process increases manufacturing costs. Summary of the Invention

[0005] The purpose of this invention is to provide a method for manufacturing an image sensor moving device and the image sensor moving device itself. The manufacturing method saves production costs and improves production efficiency, while the moving device effectively improves camera focusing and image quality.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] A first aspect of the present invention provides a method for manufacturing an image sensor moving device. The method includes: obtaining a spring substrate, the spring substrate including a central moving part region, an outer stator region, and a spring wire region connecting the moving part region and the stator region; etching the spring substrate to obtain a spring wire, a moving part, and a stator in the spring wire region, the moving part region, and the stator region, respectively; fabricating a circuit board on the upper surface of the spring substrate, the circuit board including at least one circuit layer and at least one flexible circuit layer disposed on the at least one circuit layer, wherein the flexible circuit layer at the upper end of the moving part region and the circuit layer, and the flexible circuit layer at the upper end of the stator region and the circuit layer are electrically connected; removing the flexible circuit layer directly above the spring wire region, and removing the circuit layer directly above the spring wire region except for the area directly above the spring wire region, to obtain an inner circuit board connected to the moving part, an outer circuit board connected to the stator, and connecting lines connecting the inner circuit board and the outer circuit board.

[0008] In some embodiments, in etching the spring substrate to obtain the spring wire region, the mover region, and the stator region to obtain the spring wire, the mover, and the stator, respectively, the method includes: attaching a first insulating layer to the upper surface of the spring substrate; attaching a dry film to the lower surface of the spring substrate; exposing and developing the dry film according to the size of the spring wire to obtain an etching groove; etching the lower surface of the spring substrate according to the etching groove to obtain the spring wire; and removing all the dry film from the lower surface of the spring substrate after etching is completed.

[0009] In some embodiments, in fabricating a circuit board on the upper surface of the spring substrate, the method includes: designing in-layer circuitry on the upper surface of the first insulating layer; attaching a second insulating layer to the in-layer circuitry and the upper surface of the first insulating layer to obtain a first circuit layer; fabricating a first flexible circuit board layer on the upper surface of the second insulating layer according to the fabrication method of the first circuit layer; fabricating blind vias in the first circuit layer and the first flexible circuit board layer; electroplating the corresponding in-layer circuitry of the first circuit layer and the first flexible circuit board layer through the blind vias; and stacking the flexible circuit boards to an ideal number according to the fabrication method of the first flexible circuit board layer to obtain a circuit board.

[0010] In some embodiments, in designing in-layer circuitry on the upper surface of the first insulating layer, the method includes: establishing a circuit seed layer on the upper surface of the first insulating layer; attaching a dry film to the upper surface of the circuit seed layer; exposing and developing the dry film according to the dimensions of the in-layer circuitry to reveal the in-layer circuitry pattern; thickening the in-layer circuitry pattern; and removing all the dry film on the upper surface of the circuit seed layer and the unthickened portion of the circuit seed layer to obtain the in-layer circuitry.

[0011] In some embodiments, after removing the flexible board layer directly above the spring wire area and the wiring layer directly above the spring wire area (excluding the layer directly above the spring wire area) to obtain an inner circuit board connected to the mover, an outer circuit board connected to the stator, and connecting lines connecting the inner and outer circuit boards, the method further includes: forming solder pads on the upper ends of the inner and outer circuit boards respectively for external connection.

[0012] In some embodiments, after fabricating solder pads on the upper ends of the inner and outer circuit boards for external connection, the method further includes: setting an image sensor on the upper end of the inner circuit board and connecting the image sensor to the corresponding solder pad.

[0013] A second aspect of the present invention provides an image sensor moving device, the moving device comprising: a spring substrate, the spring substrate including a spring wire, a mover and a stator, the spring wire being disposed between the mover and the stator; a circuit board including an inner circuit board and an outer circuit board, the inner circuit board including an inner circuit layer, the outer circuit board including an outer circuit layer and an outer flexible circuit board layer, the inner circuit board being electrically connected to the outer circuit board, one side of the inner circuit board being connected to the mover, the other side of the inner circuit board being electrically connected to the image sensor, one side of the outer circuit layer being connected to the stator, and the other side being electrically connected to the outer flexible circuit board layer; when the relative position of the mover and the stator changes, the spring wire deforms, generating an elastic restoring force opposite to the displacement direction of the mover, and driving the mover, the inner circuit board and the image sensor to reset.

[0014] In some embodiments, the mobile device further includes a cover film attached to the circuit board to protect the circuit board.

[0015] In some embodiments, the outer flexible board layer is further connected to a connecting portion, the outer flexible board layer and the connecting portion are integrally disposed, the connecting portion is connected to a connector, and the connector is used for positioning connection and leading out internal circuits.

[0016] In some embodiments, blind vias are provided between the flexible circuit board layer and the circuit layer in the inner circuit board and between the flexible circuit board layer and the circuit layer in the outer circuit board, and the flexible circuit board layer and the circuit layer in the inner circuit board and the outer circuit board are interconnected by electroplating in the blind vias.

[0017] The manufacturing method and the image sensor moving device according to embodiments of the present invention have at least the following beneficial effects: the moving device effectively improves camera focusing and image quality. Traditional manufacturing methods involve fabricating a circuit layer on a spring substrate at the bottom of a spring plate, and connecting the circuit layer to an FPC flexible board via an ACF (Anisotropic Conductive Film) process to achieve connection with the mobile phone. In the manufacturing method of this application, the solder pads are interconnected with the in-layer circuitry by fabricating blind vias, electroplating and depositing copper in the blind vias, and the connecting portion and the outer circuit board are both FPC flexible boards, forming a single unit. ， This eliminates the need for traditional ACF connection technology, thereby reducing costs and risks.

[0018] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this disclosure. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart of the manufacturing method according to an embodiment;

[0021] Figure 2 This is a schematic diagram of the structure of the mobile device according to an embodiment;

[0022] Figure 3 This is an exploded structural diagram of the mobile device according to an embodiment;

[0023] Figure 4 This is a schematic diagram of the etching process of the spring substrate according to an embodiment;

[0024] Figure 5 This is a schematic diagram illustrating the steps of fabricating a circuit board according to an embodiment;

[0025] Figure 6 This is a schematic diagram of the steps of the circuitry within the design layer according to an embodiment;

[0026] Figure 7 This is a cross-sectional structural schematic diagram of the mobile device according to an embodiment;

[0027] Figure 8 This is a schematic diagram of a circuit board with holes according to an embodiment.

[0028] The reference numerals in the attached diagram are explained as follows: 1. Spring base material; 2. Spring wire; 3. Moving element; 4. Stator; 5. Circuit board;

[0029] 6. Inner circuit board; 7. Outer circuit board; 8. Cover film; 9. Connecting lines; 10. Connector; 11. Connector; 12. Through port; 13. Image sensor; 14. First circuit layer; 15. Seed layer; 16. Step plate; 17. First flexible board layer; 18. Through hole; 19. Buried via; 20. Blind via; 21. Deposited copper; 22. In-layer circuitry. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0032] The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connection," "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that the description of this disclosure will be more complete and fully convey the concept of the exemplary embodiments to those skilled in the art. The drawings are merely illustrative of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0035] The working principle of the mobile device according to the embodiments of this application will be briefly described below:

[0036] The principle of image sensor moving device: such as Figures 2 to 3 As shown, the image sensor moving device includes a spring substrate 1, which is made of metal, such as pure copper, titanium-copper alloy, or other metals. In some embodiments, the spring substrate 1 is made of titanium-copper. The spring substrate 1 includes a spring wire 2, a mover 3, and a stator 4. The spring wire 2 is curved, with one end connected to the mover 3 and the other end connected to the stator 4. The image sensor moving device also includes an outer circuit board 7, which is disposed on the stator 4. The image sensor moving device also includes an inner circuit board 6, which is disposed on the mover 3. The two ends of the spring wire 2 are connected to the mover 3 and the stator 4, respectively. The image sensor 13 is disposed on the inner circuit board 6. When the relative position of the mover 3 and the stator 4 changes, the spring wire 2 deforms, generating an elastic restoring force in the opposite direction to the displacement of the mover 3, resetting the mover 3. The mover 3 then drives the inner circuit board 6 and the image sensor 13 on the inner circuit board 6 to reset.

[0037] The power and signal lines of the image sensor 13 are connected to the solder pads on the inner circuit board 6 via gold wires. The solder pads are connected to the power and signal lines within the inner circuit board 6 via blind vias. A connecting line 9 is attached to the upper surface of the spring wire 2, and the power and signal lines of the inner circuit board 6 are connected to the power and signal lines of the outer circuit board 7 via the connecting line 9. Both the inner circuit board 6 and the outer circuit board 7 consist of at least one circuit layer and at least one flexible circuit board layer stacked together. The power and signal lines of adjacent layers are connected via blind vias. The outer circuit board 7 also includes a connecting portion 10, which is connected to a connector 11. The power and signal lines within the outer circuit board 7 are connected to the power and signal lines within the connecting portion 10, and the power and signal lines within the connecting portion 10 are connected to the power and signal lines within the connector 11. The connector 11 is connected to the outside world, thereby achieving a wiring connection between the outside world and the image sensor 13.

[0038] The manufacturing process of the embodiments of this application is briefly described below:

[0039] Please see Figure 1 , Figure 1 This is a flowchart of the manufacturing process according to an embodiment of this application.

[0040] According to some embodiments, this application provides a method for manufacturing an image sensor mobile device, the method comprising:

[0041] Step 101: Obtain spring substrate 1. The spring substrate 1 includes a moving part in the middle, a stator part on the outside, and a spring wire part connecting the moving part and the stator part. Etch the spring substrate 1 to obtain spring wire 2, moving part 3 and stator 4 in the spring wire part, moving part and stator part respectively.

[0042] Step 102: A circuit board 5 is fabricated on the upper surface of the spring substrate 1. The circuit board 5 includes at least one circuit layer and at least one flexible circuit layer disposed on the at least one circuit layer. The flexible circuit layer and the circuit layer at the upper end of the mover 3 region and the flexible circuit layer and the circuit layer at the upper end of the stator 4 region are electrically connected.

[0043] Step 103: Remove the flexible board layer directly above the spring wire area, and remove the circuit layer directly above the spring wire area except for the area directly above the spring wire 2, to obtain the inner circuit board 6 connected to the mover 3, the outer circuit board 7 connected to the stator 4, and the connecting line 9 connecting the inner circuit board 6 and the outer circuit board 7.

[0044] Based on the above embodiments, such as Figure 2 As shown, the spring substrate 1 is etched to obtain the spring wire 2, the mover 3, and the stator 4, as follows. Figure 5 As shown, a circuit board 5 is fabricated on the upper surface of the spring substrate 1, and the circuit board 5 needs to be attached to the upper surface of the spring substrate 1. After attachment, in some embodiments, the flexible board layer directly above the spring wire area and the circuit layer directly above the spring wire area, except for the area directly above the spring wire 2, are removed. In other embodiments, the portion of the circuit board 5 directly above the spring wire area that does not have the in-layer circuit 22 is removed, while the portion of the circuit board 5 directly above the spring wire area that contains the in-layer circuit 22 needs to be retained. A connecting line 9 is retained directly above the spring wire 2, or to the upper left of the spring wire 2, or to the upper right of the spring wire 2, to ensure that the inner circuit board 6 and the outer circuit board 7 transmit signals through the connecting line 9.

[0045] In some embodiments of this application, the upper end of the spring wire 2 has only one layer of connecting line 9, and the connecting line 9 is connected to the upper surface of the spring wire 2. There are no other lines above the connecting line 9. The inner circuit board 6 and the outer circuit board 7 are connected to each other only through the connecting line 9, and electrical signals are exchanged only through the connecting line 9. The connecting line 9 can change with the deformation of the spring wire 2.

[0046] When the relative position of the mover 3 and the stator 4 changes, the spring wire 2 deforms, generating an elastic restoring force in the opposite direction to the displacement of the mover 3, which resets the mover 3, and the mover 3 drives the inner circuit board 6 to reset.

[0047] The removal of the flexible circuit board layer directly above the spring wire area, and the removal of the circuit layer directly above the spring wire area (excluding the area directly above spring wire 2), can be achieved by dry etching or laser cutting.

[0048] The spring wire 2 is an important component of the image sensor 13 translation-type optical image stabilization camera, providing elastic restoring force for optical image stabilization. The connecting line 9 is used to conduct power and signals from the image sensor 13. The connecting line 9 includes two layers of PI plastic film and a Cu wire in the middle. The two PI films are polymer materials, and their deformation generates viscoelastic forces, which are non-elastic forces. These viscoelastic forces are non-linear and detrimental to optical image stabilization cameras. Therefore, the smaller this force is, the better, and the proportion of polymer materials such as PI film should be minimized.

[0049] If an FPC flexible board is arranged on the spring wire 2, it will increase the proportion of polymer materials such as PI and increase the proportion of viscoelastic force, which is disadvantageous.

[0050] The following is in conjunction with the appendix to this instruction manual. Figures 1 to 3 The method for manufacturing the image sensor mobile device of this application is further described in detail.

[0051] According to some embodiments, such as Figure 4 As shown, Figure 4 This is a schematic diagram of the etching process for the spring substrate 1, wherein, Figure 4 The steps shown are only partial structural schematic diagrams of this application. In step 101, the spring substrate 1 is etched to obtain the spring wire 2, the mover region, and the stator region, respectively. The method includes:

[0052] Step 1011: Attach a first insulating layer to the upper surface of the spring substrate 1;

[0053] Step 1012: Attach a dry film to the lower surface of the spring substrate 1;

[0054] Step 1013: Expose and develop the dry film according to the size of the spring wire 2 to obtain an etching tank;

[0055] Step 1014: Etch the lower surface of the spring substrate 1 according to the etching groove to obtain the spring wire 2;

[0056] Step 1015: After etching is completed, remove all the dry film from the lower surface of the spring substrate 1.

[0057] Based on the above embodiments, in step 1011, the first insulating layer is attached to the upper surface of the spring substrate 1 by a pressing process;

[0058] In step 1012, a dry film is attached to the lower surface of the spring substrate 1 by a pressing process;

[0059] In step 1013, a portion of the dry film is removed according to the size and position of the spring wire 2 so that the part of the spring substrate 1 that needs to be etched is exposed, and the exposed part of the spring substrate 1 forms an etching groove with the dry film.

[0060] In step 1014, after etching the elastic substrate 1 according to the etching tank, spring wire 2 is obtained. The two sides of spring wire 2 are blank areas left after etching. After etching, a mover 3, a stator 4, and spring wire 2 are obtained. Multiple spring wires 2 are etched, with one end of each spring wire 2 connected to the mover 3 and the other end connected to the stator 4. For details, please refer to [reference needed]. Figure 2 As shown, Figure 2 This is a schematic diagram of the structure of the mobile device according to an embodiment, specifically a schematic diagram of the structure of the mobile device on one side where the spring substrate 1 is provided.

[0061] In step 1015, after etching is completed, all the dry film on the lower surface of the spring substrate 1 is removed. The dry film protects areas of the spring substrate 1 that do not require etching, allowing for better shaping of the spring wire 2.

[0062] According to some embodiments, such as Figure 5 As shown, in step 102, during the fabrication of the circuit board 5 on the upper surface of the spring substrate 1, the method includes:

[0063] Step 1021: Design in-layer circuitry 22 on the upper surface of the first insulating layer;

[0064] Step 1022: A second insulating layer is attached to the upper surface of the inner circuit 22 and the first insulating layer to obtain the first circuit layer 14;

[0065] Step 1023a: According to the manufacturing method of the first circuit layer 14, a first flexible circuit board layer 17 is fabricated on the upper surface of the second insulating layer. Blind vias 20 are fabricated in the first circuit layer 14 and the first flexible circuit board layer 17. The corresponding in-layer circuits 22 of the first circuit layer 14 and the first flexible circuit board layer 17 are electroplated and connected through the blind vias 20. The flexible circuit boards are stacked to the desired number according to the manufacturing method of the first flexible circuit board layer 17 to obtain the circuit board.

[0066] Based on the above embodiments, steps 1021 to 1022 are the manufacturing method of the first circuit layer 14. After the first circuit layer 14 is manufactured, the first circuit layer 14 includes a first insulating layer, an in-layer circuit 22 designed on the upper surface of the first insulating layer, and a second insulating layer.

[0067] In step 1023a, after the first flexible circuit board layer 17 is fabricated, the corresponding in-layer circuits 22 of the first circuit layer 14 and the first flexible circuit board layer 17 are electroplated together through blind vias 20. Flexible circuit board layers are then stacked on the upper surface of the first flexible circuit board layer 17 according to the fabrication method of the first flexible circuit board layer 17, stacking to the desired number. In the desired number of flexible circuit board layers, the corresponding in-layer circuits 22 of adjacent upper and lower flexible circuit board layers are electroplated together through blind vias 20. The desired number can be set according to actual needs, and is two or more layers. After stacking the flexible circuit board layers to the desired number, circuit board 5 is obtained. Adjacent layers in the circuit layer and the desired number of flexible circuit board layers can be connected by fabricating buried vias, blind vias, or through-holes. See [reference needed]. Figure 8 As shown, if there is only one circuit layer and one flexible circuit board layer, through-holes 18 are drilled in the circuit layer and the flexible circuit board layer, and copper 21 is electroplated and deposited in the through-holes 18 so that the corresponding in-layer circuits 22 of the circuit layer and the flexible circuit board layer are electrically connected together.

[0068] In the embodiments described above in this application, the circuit board 5 includes one circuit layer and an ideal number of flexible circuit board layers. In other embodiments, it may also consist of one circuit layer and one flexible circuit board layer, or an ideal number of circuit layers and one flexible circuit board layer, or an ideal number of circuit layers and an ideal number of flexible circuit board layers. The ideal number is set according to actual needs and is not limited in this application.

[0069] If the circuit board 5 has three layers (one circuit layer and two flexible circuit layers, or two circuit layers and one flexible circuit layer), the corresponding in-layer circuits 22 of the circuit layer and the flexible circuit layer are electrically connected to each other in the following ways: through-holes 18 are drilled in the three layers, and copper 21 is electroplated and deposited in the through-holes 18, so that the corresponding in-layer circuits 22 of the three layers are connected together; or blind vias 20 are drilled in the first and second layers, as well as in the second and third layers, and copper 21 is electroplated and deposited in the two blind vias 20, so that the corresponding in-layer circuits 22 of the three layers are electrically connected together; or both through-holes 18 and blind vias 20 are used.

[0070] If the circuit board 5 has four layers (one wiring layer and three flexible circuit board layers, or three wiring layers and one flexible circuit board layer, or two wiring layers and two flexible circuit board layers), the methods for electrically connecting the corresponding intra-layer traces 22 of the wiring layer and the flexible circuit board layer include: only through-holes 18 can be drilled; or blind vias 20 can be drilled in the first and second layers, and blind vias 20 can be drilled in the third and fourth layers, and buried vias 19 can be drilled in the second and third layers, with copper 21 electroplated in the buried vias 19 and the two blind vias 20, so that the corresponding intra-layer traces 22 of the four layers are electrically connected together; or blind vias 20 can be drilled in the first to third layers, and blind vias 20 can be drilled in the second to fourth layers, with copper 21 electroplated in the two blind vias 20, so that the corresponding intra-layer traces 22 of the four layers are electrically connected together; or through-holes 18, buried vias 19, and blind vias 20 can all be drilled, and all can be electroplated with copper 21, etc. The number of through-holes 18, buried vias 19, and blind vias 20 is set according to the actual wiring requirements.

[0071] Furthermore, in some embodiments, after electroplating copper 21 onto the through-hole 18, the deposited copper 21 is used for connection points, allowing intra-layer traces 22 of different layers to be grounded on the same layer when grounding is required, eliminating the need to extend traces across layers for grounding and saving trace length. Figure 8 This is a schematic diagram for illustrative purposes only, intended to help understand the electroplating and deposition of copper 21 after drilling through-hole 18, buried via 19, and blind via 20, wherein the in-layer circuitry 22 of different layers is connected to through-hole 18 and / or buried via 19 and / or blind via 20. Figure 8 This is not intended to limit the methods of drilling and wiring in this application, but is only for the purpose of understanding.

[0072] In other embodiments, in a different structure of the moving device, the inner circuit board 6 on the top of the mover 3 has only one circuit layer. In this implementation, in step 1023a, the method further includes:

[0073] Replace step 1023a with step 1023b, where step 1023b is:

[0074] Step 1023b: According to the manufacturing method of the first circuit layer 14, a first flexible circuit board layer 17 is fabricated only on the upper surface of the first circuit layer 14 at the upper end of the stator 4. Blind vias 20 are fabricated in the first circuit layer 14 and the first flexible circuit board layer 17, and the corresponding in-layer circuits 22 of the first circuit layer 14 and the first flexible circuit board layer 17 are electroplated and connected through the blind vias 20. According to the manufacturing method of the first flexible circuit board layer 17, flexible circuit boards are stacked to the desired number only at the upper end of the first flexible circuit board layer 17 to obtain the circuit board 5. Figure 5 As shown. The ideal number can be set according to actual needs, with two or more layers being ideal. Adjacent layers in the circuitry layer and the ideal number of flexible circuit board layers can be connected by creating buried vias, blind vias, or through-holes.

[0075] Compared to the image sensor moving device manufactured in step 1023a, the advantages of the image sensor moving device manufactured in step 1023b are: reduced module height, reduced flexible circuit board layers, reduced cost, and reduced reliability risk.

[0076] Based on the above embodiments, only one circuit layer is needed on the upper end of the mover 3. The inner circuit board 6 on the upper end of the mover 3 is used to connect with each lead of the image sensor 13, so the complex in-layer circuit 22 design is not required; that is, the inner circuit board 6 on the upper end of the mover 3 only needs one circuit layer. The purpose of the inner circuit board 6 is simply to extend each lead of the image sensor 13 to the outer circuit board 7 on the upper end of the stator 4 for electrical connection.

[0077] In some embodiments, the insulating layer of the inner circuit board 6 at the upper end of the mover 3 is a pi insulating layer. The outer circuit board 7 at the upper end of the stator 4 includes at least one circuit layer and at least one flexible circuit board layer. The insulating layer in the first circuit layer 14 of the outer circuit board 7 at the upper end of the stator 4 is a pi insulating layer, and the insulating layers from the second layer onwards of the outer circuit board 7 at the upper end of the stator 4 are all FPC flexible circuit boards stacked together. The peripheral circuit of the image sensor 13 is disposed on the outer circuit board 7 at the upper end of the stator 4, so the internal circuitry 22 of the outer circuit board 7 at the upper end of the stator 4 is relatively complex, requiring at least one circuit layer and at least one flexible circuit board layer, while the inner circuit board 6 at the upper end of the mover 3 only needs to extend each lead of the image sensor 13 to the outer circuit board 7 at the upper end of the stator 4.

[0078] In some embodiments, when both the inner circuit board 6 and the outer circuit board 7 include at least two circuit layers, the insulating layer in the first circuit layer 14 of both the inner circuit board 6 and the outer circuit board 7 is a pi insulating layer, and the insulating layers in the second and higher circuit layers of both the inner circuit board 6 and the outer circuit board 7 are FPC flexible boards stacked together.

[0079] Furthermore, such as Figure 6 As shown, in step 1021, in designing the in-layer circuit 22 on the upper surface of the first insulating layer, the method includes:

[0080] Step 10211: Establish a line seed layer 15 on the upper surface of the first insulating layer;

[0081] Step 10212: Attach a dry film to the upper surface of the line seed layer 15;

[0082] Step 10213: Expose and develop the dry film according to the size of the in-layer circuit 22 to reveal the pattern of the in-layer circuit 22.

[0083] Step 10214: Thicken the pattern of the in-layer circuit 22;

[0084] Step 10215: Remove all the dry film on the upper surface of the line seed layer 15 and the unthickened portion of the line seed layer 15 to obtain the in-layer line 22.

[0085] Based on the above embodiments, in step 10211, a line seed layer 15 is established on the upper surface of the first insulating layer by means of IVD implantation of a thin copper layer or lamination and attachment of copper foil.

[0086] In step 10212, a dry film is attached to the upper surface of the line seed layer 15 by a lamination process. This facilitates the thickening of the line pattern 22 within the layer in step 10214.

[0087] In step 10213, according to the size, shape and layout of the in-layer circuit 22, the dry film is exposed and developed to reveal the preset in-layer circuit 22 pattern on the upper surface of the seed layer 15, and at the same time, grooves for displaying the in-layer circuit 22 pattern are formed on the dry film.

[0088] In step 10214, the groove is filled with in-layer line 22 seeds by electroplating, chemical plating, PVD or other methods, so as to thicken the line seed layer of the in-layer line 22 pattern.

[0089] In step 10215, after the in-layer circuit 22 pattern is thickened, all the dry film on the upper surface of the circuit seed layer 15 and the unthickened part of the circuit seed layer 15 are removed to obtain the in-layer circuit 22.

[0090] According to some embodiments, in step 103, after removing the flexible board layer directly above the spring wire area and the wiring layer directly above the spring wire area (excluding the area directly above the spring wire 2) to obtain the inner circuit board 6 connected to the mover 3, the outer circuit board 7 connected to the stator 4, and the connecting line 9 connecting the inner circuit board 6 and the outer circuit board 7, the method further includes:

[0091] Step 104: Make solder pads on the upper ends of the inner circuit board 6 and the outer circuit board 7 respectively for connection with the outside.

[0092] Furthermore, in step 104, after solder pads are fabricated on the upper ends of the inner circuit board 6 and the outer circuit board 7 for connection to the outside, the method further includes:

[0093] Step 105: An image sensor 13 is installed on the upper end of the inner circuit board 6, and the image sensor 13 is connected to the corresponding solder pad.

[0094] Based on the above embodiment, an outer circuit board 7 is provided on the stator 4, and an inner circuit board 6 is provided on the mover 3. The two ends of the spring wire 2 are respectively connected to the mover 3 and the stator 4. The image sensor 13 is provided on the inner circuit board 6. When the relative position of the mover 3 and the stator 4 changes, the spring wire 2 deforms and generates an elastic restoring force in the opposite direction to the displacement of the mover 3, which resets the mover 3. The mover 3 drives the inner circuit board 6 and the image sensor 13 on the inner circuit board 6 to reset.

[0095] Both the inner circuit board 6 and the outer circuit board 7 are provided with in-layer circuits 22. Each PIN of the image sensor 13 is connected to the in-layer circuits 22 inside the inner circuit board 6 through a solder pad. The in-layer circuits 22 inside the inner circuit board 6 and the outer circuit board 7 are electrically connected to each other through connecting lines 9.

[0096] In this process, a blind via 20 is fabricated on the upper end of the inner circuit board 6. The copper deposition 21 in the blind via 20 is electrically connected to the circuit 22 in the layer, thereby saving the traditional ACF connection process and achieving the goal of reducing costs and risks.

[0097] In some embodiments, such as Figure 7 As shown, a stepped plate 16 is superimposed on the top layer of the inner circuit board 6. The image sensor 13 is disposed on the upper surface of the stepped plate 16. The size of the stepped plate 16 is determined according to the size of the image sensor 13. When the image sensor 13 is large, the size of the stepped plate 16 needs to be correspondingly large, and when the image sensor 13 is small, the size of the stepped plate 16 needs to be correspondingly small, so as to facilitate the placement of the image sensor 13 on the upper surface of the stepped plate 16. In this embodiment, the stepped plate 16 is a rigid circuit board.

[0098] The following is a brief description of the mobile device according to an embodiment of this application. The mobile device is manufactured using the image sensor mobile device manufacturing method described above:

[0099] Please see Figures 2 to 3 As shown, Figure 2 This is a schematic diagram of the structure of the mobile device according to an embodiment. Figure 3 This is an exploded structural diagram of the mobile device according to an embodiment.

[0100] According to some embodiments, this application provides an image sensor moving device, the moving device comprising:

[0101] A spring substrate 1, the spring substrate 1 including a spring wire 2, a mover 3 and a stator 4, the spring wire 5 being disposed between the mover 3 and the stator 4;

[0102] The circuit board 5 includes an inner circuit board 6 and an outer circuit board 7. The inner circuit board 6 includes an inner circuit layer, and the outer circuit board 7 includes an outer circuit layer and an outer flexible circuit board layer. The inner circuit board 6 and the outer circuit board 7 are electrically connected. One side of the inner circuit board 6 is connected to the mover 3, and the other side of the inner circuit board 6 is used to electrically connect to the image sensor 13. One side of the outer circuit layer 7 is connected to the stator 4, and the other side is electrically connected to the outer flexible circuit board layer.

[0103] When the relative position of the mover 3 and the stator 4 changes, the spring wire 2 deforms, generating an elastic restoring force opposite to the displacement direction of the mover 3, and driving the mover 3, the inner circuit board 6 and the image sensor 13 to reset.

[0104] Based on the above embodiments, the inner circuit board 6 and the outer circuit board 7 are connected by a connecting line 9, which is located at the upper end of the spring wire 2, such as... Figure 2 As shown.

[0105] The inner circuit board 6 is used to provide solder pads for the image sensor 13, and the multiple leads of the image sensor 13 are respectively connected to the multiple solder pads on the inner circuit board 6.

[0106] The outer circuit board 7 is used to connect the image sensor 13 and the external connector 11 with electrical signals.

[0107] The following is in conjunction with the appendix to this instruction manual. Figures 2 to 3 The image sensor moving device of this application will be further described in detail.

[0108] According to some embodiments, the mobile device further includes a cover film 8, which is attached to the circuit board 5 to protect the circuit board 5.

[0109] Based on the above embodiments, the cover film 8 is a pi cover film. It is used to cover and protect the FPC circuitry, enhancing the FPC's flexural strength; protecting the circuitry from damage caused by temperature, humidity, contaminants, or corrosive substances; covering the FPC for subsequent surface treatments; and acting as a solder resist in the subsequent SMT process of the FPC.

[0110] According to some embodiments, the outer flexible circuit board layer is further connected to a connecting portion 10, which is connected to a connector 11. The connector 11 is used for positioning and connecting, as well as for leading out internal circuitry. Preferably, the connecting portion 10 is integrally formed with the outer circuit board 7.

[0111] Based on the above embodiments, the connecting part 10 is made of FPC flexible printed circuit board. For example... Figure 2 and Figure 3As shown, the connector 11 is designed to be relatively small. In order to achieve better connection, the connecting part 10 is designed to have a large width at one end, which is similar to the width of the spring substrate 1 and the circuit board 5, and a small width at the other end, which is similar to the width of the connector 11. The end of the connecting part 10 with a large width is connected to the spring substrate 1 and the circuit board 5, and the end of the connecting part 10 with a small width is connected to the connector 11, so as to facilitate better connection.

[0112] One end of the power and signal lines within the connector 10 connects to the power and signal lines within the outer circuit board 7, and the other end connects to the power and signal lines within the connector 11. The upper surface of the connector 11 is provided with solder pads for leading the power and signal lines out to connect to the outside. Preferably, the connector 10 and the outer circuit board 7 are both FPC flexible boards, and the two are integrated as a single unit. Figure 3 As shown, this improvement addresses the issue of setting pads at the adjacent positions of the outer circuit board 7 and the connecting part 10 in the prior art, where the two are soldered together via the pads. This increases the complexity of the entire device and the manufacturing cost, and the difficulty of soldering the pads and the long-term stability are also uncertain.

[0113] The overall circuit layout is as follows: each PIN of the image sensor 13 is connected to the circuit inside the inner circuit board 6. The circuit inside the inner circuit board 6 is connected to the circuit inside the outer circuit board 7 through the connecting line 9 at the upper end of the spring wire 2. The circuit inside the outer circuit board 7 is connected to the circuit inside the connecting part 10. The circuit inside the connecting part 10 is connected to the circuit inside the connector 11. The circuit inside the connector 11 is connected to the solder pad on the upper surface of the connector 11. The solder pad leads the circuit to the outside for connection with the outside.

[0114] According to some embodiments, blind vias are provided between the flexible circuit board layer and the circuit layer in the inner circuit board 6 and between the flexible circuit board layer and the circuit layer in the outer circuit board 7, and the flexible circuit board layer and the circuit layer in the inner circuit board 6 and the outer circuit board 7 are interconnected by electroplating in the blind vias.

[0115] According to some embodiments, the stator 4 has a through-hole 12 in the middle, the mover 3 is disposed in the through-hole 12, and the two ends of the spring wire 2 are respectively connected to the mover 3 and the stator 4.

[0116] Based on the above embodiments, such as Figure 2 and Figure 3 As shown, stator 4 is set as a rectangle, and its edges are set as follows: Figure 2 , Figure 3As shown, the two lower corners are designed as arcs, and one corner on the upper side is cut off. A rectangular opening 12 is provided in the middle. An inner circuit board 6 and a spring wire 2 are provided in the opening 12. The two ends of the spring wire 2 are connected to the stator 4 and the mover 3 respectively, so that when the relative position of the mover 3 and the stator 4 changes, the spring wire 2 deforms and generates an elastic restoring force opposite to the displacement direction of the mover 3, thereby driving the mover 3, the inner circuit board 6 and the image sensor 13 to reset.

[0117] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0118] Although this disclosure has been described with reference to several typical embodiments, it should be understood that the terminology used is descriptive and exemplary, and not restrictive. Because this disclosure can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A method of fabricating an image sensor moving device, comprising: The manufacturing method comprises: ​ obtaining a spring base material comprising a mover region in the middle, a stator region on the outside, and a spring wire region connecting the mover region and the stator region, etching the spring base material to obtain spring wires, a mover and a stator respectively from the spring wire region, the mover region and the stator region; manufacturing a circuit board on the upper surface of the spring base material, the circuit board comprising at least one circuit layer and at least one soft board layer arranged on the at least one circuit layer, the soft board layer and the circuit layer on the upper end of the mover region and the soft board layer and the circuit layer on the upper end of the stator region being electrically connected; a buried hole, a blind hole or a through hole is arranged between the soft board layer and the circuit layer, and the corresponding layers in the circuit board are electrically connected through electroplating in the buried hole, the blind hole or the through hole; removing the soft board layer directly above the spring wire region and the circuit layer directly above the spring wire region except directly above the spring wire to obtain an inner circuit board connected with the mover, an outer circuit board connected with the stator, and a connecting circuit connecting the inner circuit board and the outer circuit board; and arranging an image sensor on the upper end of the inner circuit board.

2. The production method according to claim 1, characterized by, In the step of etching the spring base material to obtain spring wires, a mover and a stator respectively from the spring wire region, the mover region and the stator region, the method comprises: attaching a first insulating layer on the upper surface of the spring base material; attaching a dry film on the lower surface of the spring base material; exposing and developing the dry film according to the size of the spring wire to obtain etching grooves; etching the lower surface of the spring base material according to the etching grooves to obtain spring wires; removing all the dry film on the lower surface of the spring base material after etching.

3. The method of manufacturing according to claim 2, wherein, In the step of manufacturing a circuit board on the upper surface of the spring base material, the method comprises: designing layer-in-circuit on the upper surface of the first insulating layer; attaching a second insulating layer on the upper surface of the layer-in-circuit and the first insulating layer to obtain a first circuit layer; manufacturing a first soft board layer on the upper surface of the second insulating layer according to the manufacturing method of the first circuit layer, manufacturing a blind hole in the first circuit layer and the first soft board layer, and electroplating the corresponding layer-in-circuit of the first circuit layer and the first soft board layer through the blind hole, and stacking the soft board layer to the desired number according to the manufacturing method of the first soft board layer to obtain a circuit board.

4. The method of manufacturing according to claim 3, wherein, In the step of designing layer-in-circuit on the upper surface of the first insulating layer, the method comprises: establishing a circuit seed layer on the upper surface of the first insulating layer; attaching a dry film on the upper surface of the circuit seed layer; exposing and developing the dry film according to the size of the layer-in-circuit to visualize the layer-in-circuit pattern; thickening the layer-in-circuit pattern; removing all the dry film on the upper surface of the circuit seed layer and the un-thickened part of the circuit seed layer to obtain layer-in-circuit.

5. The method of making of claim 1, wherein, After the step of removing the soft board layer directly above the spring wire region and the circuit layer directly above the spring wire region except directly above the spring wire to obtain an inner circuit board connected with the mover, an outer circuit board connected with the stator, and a connecting circuit connecting the inner circuit board and the outer circuit board, the method further comprises: A solder pad is formed on an upper end of each of the inner circuit board and the outer circuit board for external connection.

6. The method of manufacturing according to claim 5, wherein, After the solder pads are formed on the upper ends of the inner circuit board and the outer circuit board for external connection, the method further comprises: The image sensor is connected to the corresponding solder pad.

7. An image sensor movement device, characterized by The mobile device comprises: A spring base material comprising a spring wire, a mover and a stator, the spring wire being arranged between the mover and the stator; A circuit board comprising an inner circuit board and an outer circuit board, the inner circuit board comprising an inner circuit layer, the outer circuit board comprising an outer circuit layer and an outer flexible board layer, the inner circuit board being electrically connected to the outer circuit board, one side of the inner circuit board being connected to the mover, the other side of the inner circuit board being used for electrically connecting an image sensor, one side of the outer circuit layer being connected to the stator, the other side of the outer circuit layer being electrically connected to the outer flexible board layer; an image sensor being arranged on an upper end of the inner circuit board; a buried hole, a blind hole or a through hole being formed between the flexible board layer and the circuit layer, and the corresponding layers in the circuit board being electrically connected to each other by electroplating in the buried hole, the blind hole or the through hole; When the relative position of the mover and the stator changes, the spring wire deforms, generates an elastic restoring force opposite to the displacement direction of the mover, and drives the mover, the inner circuit board and the image sensor to reset.

8. The mobile device of claim 7, wherein, The mobile device further comprises a cover film attached to the circuit board for protecting the circuit board.

9. The mobile device of claim 7, wherein, The outer flexible board layer is further connected to a connecting portion, the outer flexible board layer and the connecting portion being integrally arranged, the connecting portion being connected to a connector, the connector being used for positioning connection and leading internal circuits.

10. The mobile device of claim 7, wherein, The inner circuit board comprises an inner flexible board layer arranged on the inner circuit layer, blind holes being formed between the flexible board layer and the circuit layer in the inner circuit board and between the flexible board layer and the circuit layer in the outer circuit board, and the corresponding layers in the inner circuit board and the outer circuit board being electrically connected to each other by electroplating in the blind holes.

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