Mainboard heat dissipation structure and air conditioner

Abstract

The present invention provides a motherboard heat dissipation structure and an air conditioner. The motherboard heat dissipation structure includes: an air conditioning duct, the interior of the air conditioning duct having an air cavity for circulating gas; an air inlet channel, the air inlet channel being arranged on the side wall of the air conditioning duct and connected to the air cavity; wherein the air inlet channel has an air inlet and an air outlet at either end, the air outlet being connected to the air cavity, and the air inlet facing the motherboard; when the gas in the air cavity flows, the air inlet channel generates a negative pressure, and the negative pressure in the air inlet channel causes the gas outside the motherboard heat dissipation structure to pass through the motherboard. The present invention provides an air inlet channel based on the existing air conditioning duct, and utilizes the negative pressure to efficiently cool the motherboard, allowing a large amount of air to pass through the motherboard and enter the air conditioning duct, achieving the effect of rapidly cooling and cooling the motherboard, thereby improving the working reliability and stability of the motherboard, ensuring the normal and safe operation of the motherboard, and reducing the occurrence of electrical safety accidents.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioners, and in particular to a mainboard heat dissipation structure and an air conditioner. Background Art

[0002] At present, the development trend of motherboards tends to be miniaturization and integration, but the temperature of miniaturized and integrated motherboards will gradually increase after a long period of work, so it is necessary to design a motherboard heat dissipation structure to dissipate heat and cool the motherboard; usually the motherboard on the air conditioner is set in an electrical box, but the existing electrical box is usually relatively closed in structure (that is, poor ventilation performance), and the space of the electrical box is small, which cannot accommodate the additional motherboard heat dissipation structure, resulting in the current air conditioner motherboard being unable to effectively dissipate heat, which in turn affects the normal operation of the motherboard and may cause electrical safety accidents.

[0003] In the existing technology, the size of the motherboard is usually increased to increase the heat dissipation area of ​​the motherboard, thereby improving the heat dissipation state. However, this method is contrary to the development trend of miniaturization of motherboards and cannot meet actual needs. Summary of the Invention

[0004] The present invention provides a mainboard heat dissipation structure and an air conditioner to solve the problem in the prior art that the mainboard cannot effectively dissipate heat, thereby affecting the normal and safe operation of the mainboard.

[0005] In order to solve the above problems, according to one aspect of the present invention, the present invention provides a motherboard heat dissipation structure, including: an air-conditioning duct, the interior of the air-conditioning duct has an air cavity for circulating gas; an air inlet channel, the air inlet channel is arranged on the side wall of the air-conditioning duct, and is connected with the air cavity; wherein, the two ends of the air inlet channel are an air inlet and an air outlet respectively, the air outlet is connected with the air cavity, and the air inlet faces the motherboard; when the gas in the air cavity flows, the air inlet channel generates negative pressure, and the negative pressure of the air inlet channel causes the gas outside the motherboard heat dissipation structure to pass through the motherboard.

[0006] Furthermore, the air conditioning duct includes a straight section and a tapered section, which are connected to the tapered section to form a part of the air cavity. The tapered section is arranged at the air outlet to increase the air flow velocity at the air outlet.

[0007] Furthermore, the air conditioning duct also includes a mixing section, which is connected to the necking section and the air inlet channel respectively to form a part of the air cavity, and the airflow in the necking section and the air inlet channel both flows into the mixing section.

[0008] Furthermore, the inlet of the mixing section covers the outlet of the necking section to prevent airflow leakage in the necking section.

[0009] Furthermore, the mainboard heat dissipation structure also includes an electrical box, which is arranged on the side wall of the air-conditioning duct. The electrical box has a accommodating cavity for accommodating the mainboard, and the air inlet is connected to the accommodating cavity.

[0010] Furthermore, the electrical box has a through ventilation hole, which is connected to the outside of the mainboard heat dissipation structure, and the ventilation hole is located on the side of the mainboard away from the air inlet channel.

[0011] Furthermore, there are multiple ventilation holes, which are arranged at intervals on the electrical box.

[0012] Furthermore, in the flow direction of the gas in the air cavity, the two ends of the electrical box are respectively a first end and a second end; wherein, the air inlet is located between the first end and the second end.

[0013] Furthermore, the mainboard heat dissipation structure also includes an auxiliary channel, which is arranged on the side wall of the air-conditioning duct and is connected to the air cavity; wherein the auxiliary channel draws the airflow outside the mainboard heat dissipation structure into the air cavity.

[0014] According to another aspect of the present invention, an air conditioner is provided, comprising the mainboard heat dissipation structure described above.

[0015] Applying the technical solution of the present invention, the present invention provides a motherboard heat dissipation structure, comprising: an air conditioning duct, the interior of which has an air cavity for circulating gas; an air inlet channel, the air inlet channel being arranged on the side wall of the air conditioning duct and connected to the air cavity; wherein the air inlet channel has an air inlet and an air outlet at either end, the air outlet being connected to the air cavity, and the air inlet facing the motherboard; when the gas in the air cavity flows, the air inlet channel generates a negative pressure, and the negative pressure in the air inlet channel causes the gas outside the motherboard heat dissipation structure to pass through the motherboard. The present invention opens an air inlet channel on the basis of the existing air conditioning duct, and utilizes the negative pressure to efficiently cool the motherboard, allowing a large amount of air to pass through the motherboard and enter the air conditioning duct, achieving the effect of rapidly cooling the motherboard, thereby improving the working reliability and stability of the motherboard, ensuring the normal and safe operation of the motherboard, and reducing the occurrence of electrical safety accidents; at the same time, the air inlet channel also serves to increase the air volume in the air conditioning duct. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which constitute part of this application, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0017] Figure 1 A schematic diagram showing the specific structure of the mainboard heat dissipation structure provided in the first embodiment of the present invention is shown;

[0018] Figure 2A schematic diagram showing the specific structure of the mainboard heat dissipation structure provided by the second embodiment of the present invention is shown;

[0019] Figure 3 A schematic diagram of the ventilation hole structure of the mainboard heat dissipation structure on the electrical box provided in the third embodiment of the present invention is shown;

[0020] Figure 4 A schematic diagram of the ventilation hole structure of the mainboard heat dissipation structure on the electrical box provided by the fourth embodiment of the present invention is shown;

[0021] Figure 5 A schematic diagram of the ventilation hole structure of the mainboard heat dissipation structure on the electrical box provided in the fifth embodiment of the present invention is shown.

[0022] The above drawings include the following reference numerals:

[0023] 10. Air conditioning duct; 11. Air cavity; 12. Straight section; 13. Narrowing section; 14. Mixing section;

[0024] 20. Air inlet channel; 21. Air inlet; 22. Air outlet;

[0025] 30. Electrical box; 31. Accommodation cavity; 32. Ventilation hole; 33. First end; 34. Second end; 35. Connecting rib;

[0026] 40. Auxiliary channel. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative work are within the scope of protection of the present invention.

[0028] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a motherboard heat dissipation structure, including: an air-conditioning duct 10, the interior of the air-conditioning duct 10 is provided with an air cavity 11 for circulating gas; an air inlet channel 20, the air inlet channel 20 is arranged on the side wall of the air-conditioning duct 10, and is connected with the air cavity 11; wherein, the two ends of the air inlet channel 20 are an air inlet 21 and an air outlet 22 respectively, the air outlet 22 is connected with the air cavity 11, and the air inlet 21 faces the motherboard; when the gas in the air cavity 11 flows, the air inlet channel 20 generates negative pressure, and the negative pressure of the air inlet channel 20 causes the gas outside the motherboard heat dissipation structure to pass through the motherboard.

[0029] The present invention opens an air inlet channel 20 on the basis of the existing air-conditioning duct 10, and utilizes negative pressure to efficiently cool the mainboard, so that a large amount of air passes through the mainboard and enters the air-conditioning duct 10, achieving the effect of rapid heat dissipation and cooling of the mainboard, thereby improving the working reliability and stability of the mainboard, ensuring the normal and safe operation of the mainboard, and reducing the occurrence of electrical safety accidents. In addition, this method does not require a separate heat dissipation device or a separate air duct for the mainboard, has a simple structure, and reduces costs; at the same time, the air inlet channel 20 also serves to increase the air volume in the air-conditioning duct 10.

[0030] It should be noted that: in a specific embodiment of the present invention, the air conditioning duct 10 is the air duct of the indoor unit. When the indoor unit is running, the gas in the air cavity 11 flows, so that a negative pressure is generated at the air inlet channel 20, and then the negative pressure is used to cool the mainboard and increase the air volume of the air conditioning duct 10, killing two birds with one stone.

[0031] like Figure 1 and Figure 2 As shown, the air conditioning duct 10 includes a straight section 12 and a tapered section 13. The straight section 12 and the tapered section 13 are connected and together form a portion of the air cavity 11. The tapered section 13 is provided at the air outlet 22 to increase the airflow velocity at the air outlet 22. The provision of the tapered section 13 effectively increases the airflow velocity at the air outlet 22 while reducing the pressure at the air outlet 22. This increases the negative pressure generated by the air inlet channel 20, further ensuring that the air outside the motherboard heat dissipation structure passes through the motherboard, further improving the motherboard's air cooling and heat dissipation effect.

[0032] like Figure 1 and Figure 2 As shown, the air conditioning duct 10 further includes a mixing section 14, which is in communication with the constricted section 13 and the air inlet passage 20, respectively, to form a portion of the air cavity 11. The airflow within the constricted section 13 and the air inlet passage 20 flows into the mixing section 14. The provision of the mixing section 14 ensures effective communication between the airflow within the constricted section 13 and the air inlet passage 20, thereby ensuring a large air volume within the air conditioning duct 10 and, in turn, ensuring high air volume air delivery of the air conditioner.

[0033] Specifically, the inlet of the mixing section 14 covers the outlet of the constricted section 13 to prevent leakage of air from the constricted section 13. By arranging the inlet of the mixing section 14 to cover the outlet of the constricted section 13, leakage of air from the constricted section 13 is effectively prevented, the efficiency of airflow utilization is improved, aerodynamic noise is reduced, a larger air volume in the air conditioning duct 10 is further ensured, and the energy efficiency of the air conditioner is improved.

[0034] It should be noted that, in a specific embodiment of the present invention, the inlet of the mixing section 14 covers the outlet of the necking section 13, which is manifested as follows: the outlet of the necking section 13 faces the inlet of the mixing section 14, and on the projection surface perpendicular to the air outlet direction of the necking section 13, the outlet of the necking section 13 is all located inside the inlet of the mixing section 14. This arrangement effectively prevents leakage of the airflow in the necking section 13 and improves the efficiency of airflow utilization.

[0035] like Figure 1 and Figure 2 As shown, the motherboard heat dissipation structure also includes an electrical box 30, which is disposed on the side wall of the air conditioning duct 10. The electrical box 30 has a receiving cavity 31 for accommodating the motherboard. The air inlet 21 is connected to the receiving cavity 31. The provision of the electrical box 30 effectively protects the motherboard, preventing damage and failure due to collisions and other problems.

[0036] like Figure 3 、 Figure 4 and Figure 5 As shown, the electrical box 30 has a through vent 32 that communicates with the exterior of the mainboard's heat dissipation structure. The vent 32 is located on the side of the mainboard facing away from the air inlet duct 20. By locating the vent 32 on the side of the mainboard facing away from the air inlet duct 20, a large amount of air is blown through the vent 32 to the mainboard, thereby achieving rapid heat dissipation and cooling of the mainboard, improving the mainboard's operating reliability and stability, and ensuring its normal and safe operation.

[0037] like Figure 3 、 Figure 4 and Figure 5 As shown, there are multiple ventilation holes 32, and the multiple ventilation holes 32 are spaced apart on the electrical box 30. By providing multiple ventilation holes 32, the air flow at the mainboard is further increased, thereby improving the heat dissipation effect of the mainboard.

[0038] In the third embodiment of the present invention, Figure 3 As shown, the ventilation holes 32 are small circular hole structures, and a plurality of small circular hole structures are arranged at intervals on the electrical box 30. The plurality of ventilation holes 32 can be distributed on the circumference of the electrical box 30 (for example: Figure 1 and Figure 2 In the embodiment of the present invention, the upper, lower and right side walls of the electrical box 30 may be provided, or the electrical box 30 may be provided only on the side wall away from the air inlet channel 20 (for example: Figure 1 and Figure 2 In the figure, the rightmost side wall of the electrical box 30 is parallel to the main board), and the ventilation holes 32 can be flexibly set in position, number, shape and size according to actual air intake requirements to facilitate processing.

[0039] In the fourth embodiment of the present invention, Figure 4As shown, the ventilation holes 32 are long straight hole structures, and a plurality of long straight hole structures are arranged at intervals on the electrical box 30. A plurality of ventilation holes 32 are arranged on the side wall of the electrical box 30 away from the air inlet channel 20 (for example: Figure 1 and Figure 2 In the figure, the rightmost side wall of the electrical box 30 is parallel to the main board), the ventilation holes 32 can be flexibly set in position, quantity, shape and size according to actual air intake requirements to facilitate processing and reduce processing costs.

[0040] In the fifth embodiment of the present invention, Figure 5 As shown, the ventilation holes 32 are annular circular hole structures, the centers of the multiple annular circular hole structures coincide, and the diameters are gradually expanded from the inside to the outside. The multiple ventilation holes 32 are arranged on the side wall of the electrical box 30 away from the air inlet channel 20 (for example: Figure 1 and Figure 2 In the figure, the rightmost side of the electrical box 30 is parallel to the side wall of the main board), and two connecting ribs 35 are cross-arranged to improve the strength and rigidity of the side wall of the electrical box 30 away from the air inlet channel 20. The number and diameter of the ventilation holes 32 can be flexibly set according to the actual air intake requirements to facilitate processing and reduce costs. Figure 5 In the form of the ventilation hole 32, the air inlet resistance is small and the air inlet volume is large.

[0041] Specifically, if Figure 1 and Figure 2 As shown, in the direction of air flow within the air cavity 11, the two ends of the electrical box 30 are respectively a first end 33 and a second end 34; the air inlet 21 is located between the first end 33 and the second end 34. Airflow from outside the mainboard heat dissipation structure enters the air cavity 11 through the air inlet 21, and the airflow trajectory forms an airflow coverage area at the air inlet 21. All or part of the mainboard is located within the airflow coverage area to ensure air cooling. By arranging the air inlet 21 between the first end 33 and the second end 34, the mainboard is effectively located within the airflow coverage area, thereby ensuring the airflow cooling effect on the mainboard.

[0042] In the first embodiment of the present invention, Figure 1 As shown, on a longitudinal straight line, the projections of the positions of the various structures in the mainboard heat dissipation structure on the straight line are marked. The AB segment is the projection of the mixing segment 14, the BD segment is the projection of the air inlet channel 20, the CE segment is the projection of the necking segment 13, and the EF segment is the projection of the straight segment 12. The projection point of the first end 33 is B, the projection point of the second end 34 is F, and the projection of the airflow coverage area is the DF segment. Figure 1 As shown, the overall wind direction is from bottom to top. At this time, the specific position of the air conditioner fan (i.e., the gas power source) is located at Figure 1The lower position in the middle is used to drive the gas flow. By ensuring that the position of point B (i.e. the position of the first end 33) is close to the position of point D, it can be ensured that at least a part of the mainboard is located in the airflow coverage area, and the heat dissipation effect is better.

[0043] In the second embodiment of the present invention, Figure 2 As shown, on a longitudinal straight line, the projections of the positions of the various structures in the mainboard heat dissipation structure on the straight line are marked. Segment ab is the projection of the straight section 12, segment ce is the projection of the air inlet channel 20, segment bd is the projection of the necking section 13, segment ef is the projection of the mixing section 14, the projection point of the first end 33 is a, the projection point of the second end 34 is e, and the projection of the airflow coverage area is segment ac. Figure 2 As shown, the overall trend of wind direction is from top to bottom. At this time, the specific position of the air conditioner fan (i.e. the gas power source) is at Figure 2 By ensuring that the position of point e (i.e. the position of the second end 34) is close to the position of point c, it is possible to ensure that at least a portion of the motherboard is located in the airflow coverage area, thereby achieving better heat dissipation effect.

[0044] like Figure 1 and Figure 2 As shown, the mainboard heat dissipation structure also includes an auxiliary channel 40, which is arranged on the side wall of the air conditioning duct 10 and communicates with the air cavity 11. The auxiliary channel 40 draws airflow from outside the mainboard heat dissipation structure into the air cavity 11. The provision of the auxiliary channel 40 further increases the air volume entering the air cavity 11, thereby ensuring that the air output of the air conditioner meets the actual high air volume requirements. At the same time, the auxiliary channel 40 balances the negative pressure at the constricted section 13 through the incoming air, effectively reducing the aerodynamic noise generated there, thereby ensuring the user comfort of the air conditioner.

[0045] The present invention also provides an air conditioner including the aforementioned mainboard heat dissipation structure. The air conditioner employing the aforementioned mainboard heat dissipation structure can achieve efficient air cooling of the mainboard without requiring any additional redundant mainboard heat dissipation structures. The overall structure of the air conditioner is simple, and the mainboard can adapt to the trend of miniaturization and integration.

[0046] In summary, the present invention provides a motherboard heat dissipation structure and an air conditioner. The present invention opens an air inlet channel 20 on the basis of the existing air-conditioning duct 10, and uses negative pressure to efficiently cool the motherboard, so that a large amount of air passes through the motherboard and enters the air-conditioning duct 10, achieving the effect of rapid heat dissipation and cooling of the motherboard, thereby improving the working reliability and stability of the motherboard, ensuring the normal and safe operation of the motherboard, and reducing the occurrence of electrical safety accidents; at the same time, the air inlet channel 20 also serves to increase the air volume in the air-conditioning duct 10.

[0047] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0048] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0049] In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0050] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0051] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0052] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A motherboard heat dissipation structure, characterized in that: include: An air conditioning duct (10), wherein the air conditioning duct (10) has an air cavity (11) inside for circulating gas; An air inlet channel (20), the air inlet channel (20) being arranged on a side wall of the air conditioning duct (10) and being in communication with the air cavity (11); The two ends of the air inlet channel (20) are an air inlet (21) and an air outlet (22), respectively; the air outlet (22) is communicated with the air cavity (11), and the air inlet (21) faces the mainboard; when the gas in the air cavity (11) flows, the air inlet channel (20) generates a negative pressure, and the negative pressure of the air inlet channel (20) causes the gas outside the mainboard heat dissipation structure to pass through the mainboard; The air conditioning duct (10) comprises a straight section (12) and a narrowed section (13); the straight section (12) and the narrowed section (13) are in communication and together constitute a part of the air cavity (11); the narrowed section (13) is arranged at the air outlet (22) to increase the air flow velocity at the air outlet (22).

2. The mainboard heat dissipation structure according to claim 1, characterized in that: The air conditioning duct (10) further comprises a mixing section (14), wherein the mixing section (14) is respectively connected to the constricted section (13) and the air inlet channel (20), forming a part of the air cavity (11), and the airflow in the constricted section (13) and the air inlet channel (20) both flows into the mixing section (14).

3. The mainboard heat dissipation structure according to claim 2, characterized in that: The inlet of the mixing section (14) covers the outlet of the necking section (13) to prevent airflow leakage from the necking section (13).

4. The mainboard heat dissipation structure according to claim 1, characterized in that: The mainboard heat dissipation structure further comprises an electrical box (30), the electrical box (30) being arranged on a side wall of the air conditioning duct (10), the electrical box (30) having a receiving cavity (31), the receiving cavity (31) being used to receive the mainboard, and the air inlet (21) being in communication with the receiving cavity (31).

5. The mainboard heat dissipation structure according to claim 4, characterized in that: The electrical box (30) has a through ventilation hole (32), the ventilation hole (32) is communicated with the outside of the mainboard heat dissipation structure, and the ventilation hole (32) is located on a side of the mainboard away from the air inlet channel (20).

6. The mainboard heat dissipation structure according to claim 5, characterized in that: There are a plurality of ventilation holes (32), and the plurality of ventilation holes (32) are arranged at intervals on the electrical box (30).

7. The mainboard heat dissipation structure according to claim 4, characterized in that: In the flow direction of the gas in the air cavity (11), the two ends of the electrical box (30) are respectively a first end (33) and a second end (34); wherein the air inlet (21) is located between the first end (33) and the second end (34).

8. The mainboard heat dissipation structure according to claim 1, characterized in that: The mainboard heat dissipation structure further includes an auxiliary channel (40), which is arranged on a side wall of the air conditioning duct (10) and communicates with the air cavity (11); wherein the auxiliary channel (40) draws airflow outside the mainboard heat dissipation structure into the air cavity (11).

9. An air conditioner, characterized in that: The mainboard heat dissipation structure comprises the mainboard heat dissipation structure according to any one of claims 1 to 8.

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