Drive structure for optical actuators, corresponding camera module and assembly method

By employing a first drive unit and a second drive unit in the camera module to jointly drive the lens and the image sensor to move in opposite directions on the xoy plane, the problem of insufficient stabilization travel and response speed caused by lens enlargement is solved, achieving faster stabilization effect and higher image quality.

CN116134369BActive Publication Date: 2025-10-31NINGBO SUNNY OPOTECH CO LTD
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Patent Information

Application Number
CN202180055159.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-10-30
Filing Date
2021-10-13
Publication Date
2025-10-31
Estimated Expiration
2041-10-13

AI Technical Summary

Technical Problem

With the increase in lens size and weight, existing camera modules have difficulty improving image stabilization range and response speed, and lens movement may lead to a decrease in image quality.

Method used

The first and second drive units work together to drive the lens and the image sensor to translate in the x and y directions and rotate in the xoy plane. The lens and the image sensor move in opposite directions. By setting the ratio of the movement distance of the lens and the image sensor and the consistency of the time, the image stabilization effect is achieved.

Benefits of technology

It improves the stabilization travel and stabilization response speed of the camera module, avoids the blurring problem caused by lens tilt, is suitable for miniaturized camera modules, reduces the size occupied by driving components, and improves image quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to a driving structure for an optical actuator, comprising: a first driving unit adapted to mount a lens and drive the lens to translate in the x-axis and y-axis directions; and a second driving unit adapted to drive a photosensitive chip to translate in the x-axis and y-axis directions; wherein the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. The invention also provides a corresponding camera module, an optically stabilized camera module, and a corresponding assembly method. This application can improve the stabilization travel and stabilization response speed of the camera module.
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Description

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 202011097162.3, filed on October 14, 2020, entitled "Driving Structure for Optical Actuator and Corresponding Camera Module", and Chinese Patent Application No. 202011191352.1, filed on October 30, 2020, entitled "Optical Image Stabilization Camera Module", the entire contents of which are incorporated herein by reference.

[0003] This application also references the entire contents of the following divisional application:

[0004] A Chinese patent divisional application entitled "Driving structure for optical actuator and corresponding camera module", filed on December 11, 2020, with application number 202011440069.8;

[0005] A Chinese patent divisional application entitled "Driving structure for optical actuator and corresponding camera module", filed on December 11, 2020, with application number 202011440068.3;

[0006] A Chinese patent divisional application entitled "Driving structure for optical actuator and corresponding camera module", filed on December 11, 2020, with application number 202011440056.0;

[0007] A Chinese patent divisional application entitled "Driving structure for optical actuator and corresponding camera module", filed on December 11, 2020, with application number 202011440053.7;

[0008] A Chinese patent divisional application entitled "Driving structure for optical actuator and corresponding camera module", filed on December 11, 2020, with application number 202011449524.0;

[0009] A Chinese patent divisional application entitled "Driving structure for optical actuator and corresponding camera module", filed on December 11, 2020, with application number 202011449531.0;

[0010] A Chinese patent divisional application entitled "Driving structure for optical actuator and corresponding camera module", filed on December 11, 2020, with application number 202011440028.9;

[0011] A Chinese patent divisional application entitled "Optical Image Stabilization Camera Module", filed on December 11, 2020, with application number 202011449522.1;

[0012] A Chinese patent divisional application entitled "Optical image stabilization camera module and assembly method thereof", filed on December 11, 2020, with application number 202011440026.X;

[0013] A Chinese patent divisional application entitled "Optical Image Stabilization Camera Module," filed on December 11, 2020, with application number 202011449519.X; and

[0014] The Chinese patent divisional application, entitled "Method for Assembling an Optical Image Stabilization Camera Module", was filed on December 11, 2020, with application number 202011440011.3. Technical Field

[0015] This invention relates to the field of camera equipment technology, and more specifically, to a driving structure for an optical actuator and a corresponding camera module and assembly method. Background Technology

[0016] As consumers' demand for mobile phone photography increases, the functions of mobile phone cameras (i.e., camera modules) are becoming more and more abundant. Features such as portrait shooting, telephoto shooting, optical zoom, and optical image stabilization are all integrated into cameras with limited space. Among them, functions such as autofocus, optical image stabilization, and optical zoom often rely on optical actuators (sometimes also called motors) to achieve their functions.

[0017] Figure 1 This illustrates a typical camera module with a motor in the prior art. (Reference) Figure 1 This camera module typically includes a lens 1, a motor mechanism 2 (which can be simply referred to as a motor), and a photosensitive element 3. In shooting mode, light from the subject is focused through the lens 1 onto the photosensitive element 3a of the photosensitive element 3. Structurally, the lens 1 is fixed to the motor carrier of the motor. Figure 1(As shown in the image below), the motor carrier is a movable part. It typically moves the lens 1 along the optical axis under the action of the motor's drive element to achieve focusing. For camera modules with optical image stabilization (OIS), the motor often has a more complex structure. This is because, in addition to driving the lens along the optical axis, the motor also needs to drive the lens 1 to move in other degrees of freedom (e.g., perpendicular to the optical axis) to compensate for camera shake during shooting. Generally, camera module shake includes translation (x-axis and y-axis translation) and rotation (rotation in the xoy plane, whose axis of rotation can be approximately the same as the optical axis) perpendicular to the optical axis, as well as tilt shake (rotation around the x and y axes; in the field of camera modules, tilt shake is also called tilt shake). When the gyroscope (or other position sensing element) in the module detects shake in a certain direction, it can issue a command to drive the motor to move the lens a distance in the opposite direction, thereby compensating for lens shake. Generally speaking, the lens only translates and / or rotates in a direction perpendicular to the optical axis to compensate for camera module shake. This is because if the lens is rotated around the x and y axes, i.e., if the image stabilization effect is achieved through lens tilt adjustment, it may lead to a decrease in the module's image quality, or even cause blurring and make it difficult to meet basic image quality requirements.

[0018] However, as the image quality requirements for mobile phone camera modules increase, the size and weight of lenses are also increasing, placing greater demands on the driving force of motors. Current electronic devices (such as mobile phones) also face significant limitations in terms of camera module size, and the space occupied by the motor increases accordingly with the lens size. In other words, while lenses are trending towards larger size and greater weight, the driving force provided by the motor cannot be increased accordingly. With limited driving force, the heavier the lens, the shorter the distance the motor can move the lens, affecting image stabilization capabilities. On the other hand, the heavier the lens, the slower the motor can move the lens, and the longer it takes for the lens to reach the predetermined compensation position, which also affects image stabilization performance.

[0019] Therefore, there is an urgent need for a solution that can improve the stabilization travel and stabilization response speed of camera modules. Summary of the Invention

[0020] The purpose of this invention is to overcome the shortcomings of the prior art and provide a solution that can improve the stabilization travel and stabilization response speed of a camera module.

[0021] To address the aforementioned technical problems, the present invention provides a driving structure for an optical actuator, comprising: a first driving unit adapted to mount a lens and drive the lens to translate in the x-axis and y-axis directions; and a second driving unit adapted to drive a photosensitive chip to translate in the x-axis and y-axis directions; wherein the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions.

[0022] The second driving unit is adapted to mount a photosensitive component, which includes the photosensitive chip. The second driving unit drives the photosensitive component to move, thereby achieving translation of the photosensitive chip in the x-axis and y-axis directions.

[0023] The second driving unit is also used to drive the photosensitive chip to rotate on the xoy plane.

[0024] Specifically, based on the detected tilt jitter angle 'a' of the camera module, the lens movement distance 'b' driven by the first driving module and the photosensitive chip movement distance 'c' driven by the second driving module are determined; wherein, the lens movement distance 'b', the photosensitive chip movement distance 'c', and the image-side focal length 'f' of the camera module satisfy the following relationship: a = arctan(b / f) + arctan(c / f).

[0025] The driving structure further includes a driving logic module, which is used to maintain the ratio of the lens moving distance b to the photosensitive chip moving distance c at a preset fixed ratio.

[0026] The driving structure further includes a driving logic module with a stabilization threshold K. The driving logic module is used to maintain the ratio of the lens movement distance b to the image sensor movement distance c at a preset fixed ratio when the tilt angle a is less than or equal to the stabilization threshold K, and to ensure that the image sensor movement distance c reaches its maximum value c of its travel distance when the tilt angle a is greater than the stabilization threshold K. max The lens movement distance b is based on the relationship b = tan(a / f) - c max Obtained through calculation.

[0027] The preset fixed ratio of the lens movement distance and the image sensor movement distance is set according to the weight of the lens, the driving force of the first drive unit, the weight of the image sensor or image sensor assembly, and the driving force of the second drive unit, so that the lens and the image sensor move to their respective image stabilization target positions in the same time.

[0028] The first driving part includes a first base part and a first movable part, and the second driving part includes a second base part and a second movable part; wherein the second base part is fixed together with the first base part, the second movable part is located below the second base part and is movably connected to the second base part, and the photosensitive component is located below the second movable part and fixed to the second movable part.

[0029] The second movable part is movably connected to the second base part via ball bearings, and the movement freedom of the second movable part relative to the second base part is restricted to within the xoy plane by a suspension system based on the ball bearings.

[0030] In a top-down view, the balls are arranged in the four corner areas of the second drive unit.

[0031] The driving structure further includes a rear shell located below the second driving part. The rear shell is connected to the second base part and forms a receiving cavity. The second movable part and the photosensitive component are both located in the receiving cavity. There is a gap between the photosensitive component and the bottom of the rear shell.

[0032] The second movable part has a downwardly extending extension arm, which is bonded to the circuit board of the photosensitive component; the extension arm is provided with an FPC, which is directly soldered to the circuit board.

[0033] Both the second movable part and the second base part have a light-transmitting hole in the center.

[0034] The second base portion includes a base and a cover, the cover including a side wall extending downward from the base and surrounding the second movable portion, and a support platform extending horizontally inward from the side wall.

[0035] The ball bearing and the edge region of the second movable part are held between the base and the support platform.

[0036] The upper surface of the second base has a stepped structure, which includes a first stepped surface on the outer side and a second stepped surface on the inner side, wherein the height of the second stepped surface is lower than the height of the first stepped surface.

[0037] The upper surface of the edge region of the second movable part has a groove, and the ball is placed in the groove.

[0038] The upper surface of the edge region of the second movable part has a recessed step, the outer step surface of the recessed step is lower than its inner step surface, and the recessed step, together with the side wall of the cover and the base, forms a receiving cavity for accommodating the ball.

[0039] The ball bearing is located between the support platform and the second movable part.

[0040] A layer of ball bearings is provided between the base and the second movable part, and between the second movable part and the support platform.

[0041] The second movable part has an inwardly recessed groove on its outer side, and the support platform is fitted into the groove.

[0042] In this embodiment, adhesive is applied between the lower end face of the second movable part and the upper end face of the lens mount of the photosensitive component, and the adhesive avoids the four corner areas of the second movable part.

[0043] The driving element of the second driving part is a coil-magnet combination; wherein the magnet is disposed in the edge region of the second base part and the coil is disposed in the edge region of the second movable part; or the coil and the magnet are respectively disposed in the sidewalls of the second movable part and the second base part.

[0044] The coil magnet assembly includes a first coil magnet pair, a second coil magnet pair, and a third coil magnet pair. The first and second coil magnet pairs provide driving force in the x-axis direction, and the third coil magnet pair provides driving force in the y-axis direction. From a top-view perspective, the first and second coil magnet pairs can be arranged along the first and second sides of the second driving part, respectively, with the first and second sides not intersecting. The second coil magnet pair is arranged along the third side of the second driving part, with the third side intersecting both the first and second sides.

[0045] According to another aspect of this application, a camera module is also provided, comprising: a lens; a photosensitive component; and a driving structure for an optical actuator as described in any of the preceding claims; wherein the lens is mounted on the first driving unit, and the photosensitive component is mounted on the second driving unit.

[0046] The photosensitive component includes a circuit board, and the camera module further includes a first connecting strip and a second connecting strip. The first connecting strip is disposed on the top area of ​​the first driving part and electrically connected to the first driving part. The second connecting strip is connected to and conducts electricity with the circuit board of the photosensitive component. The second connecting strip is provided with multiple bends to form a curved and stacked shape.

[0047] The first driving part includes a first base part and a first movable part, and the second driving part includes a second base part and a second movable part. The second base part is fixed to the first base part, and the second movable part is located below and movably connected to the second base part. The photosensitive component is located below and fixed to the second movable part. The photosensitive component includes a suspended circuit board, which comprises a rigid circuit board body and a flexible connecting strip. The connecting strip extends from a first side and a second side of the circuit board body and bends upward to form a bend. The top of the bend extends horizontally along the periphery of the photosensitive component, such that the connecting strip surrounds the first side, second side, and third side of the photosensitive component. Each of the connecting strips on the first side, second side, and third side has at least one suspension portion, which is fixed to the second base part of the second driving part or fixed to the second base part via an intermediary. The photosensitive component has a first side and a second side aligned with the circuit board body, the first side and the second side being arranged opposite each other, and the third side intersecting both the first side and the second side.

[0048] The suspension part has a suspension hole, and the second base part or the intermediary has a hook that hooks onto the suspension hole.

[0049] In this process, a section of the connecting strip is reinforced with a rigid substrate to form the suspension portion.

[0050] The suspended circuit board is made of a rigid-flex board, wherein the main body of the circuit board and the suspension part are formed by the rigid part of the rigid-flex board, and the bending part and the connecting strip section connecting the multiple suspension parts are formed by the flexible part of the rigid-flex board.

[0051] The connecting strip includes a third connecting strip and a fourth connecting strip. The third connecting strip extends from the first side of the circuit board body and bends upward to form a bend, then extends along the first side of the photosensitive component, bends horizontally at a corner, and continues to extend along the third side. The fourth connecting strip extends from the second side of the circuit board body and bends upward to form another bend, then extends along the second side of the photosensitive component, bends horizontally at a corner, and continues to extend along the third side. The third connecting strip and the fourth connecting strip join together on the third side and are interconnected.

[0052] The suspension portion of the connecting strip located on the third side is also connected to a fifth connecting strip, which has an external connector; the suspended circuit board also has a fixing portion for fixing the fifth connecting strip.

[0053] According to another aspect of this application, an optical image stabilization camera module is also provided, comprising: a lens; a photosensitive assembly having a photosensitive chip; a first driving unit adapted to mount the lens and drive the lens to translate in the x-axis and y-axis directions; and a second driving unit adapted to drive the photosensitive chip to translate in the x-axis and y-axis directions, the second driving unit comprising a base and a cover, the base being located below the photosensitive assembly, the top of the cover being connected to the base, and the top of the cover being connected to the first driving unit; wherein the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions.

[0054] The second driving unit is also used to drive the photosensitive chip to rotate on the xoy plane.

[0055] Specifically, based on the detected tilt jitter angle 'a' of the camera module, the lens movement distance 'b' driven by the first driving module and the photosensitive chip movement distance 'c' driven by the second driving module are determined; wherein, the lens movement distance 'b', the photosensitive chip movement distance 'c', and the image-side focal length 'f' of the camera module satisfy the following relationship: a = arctan(b / f) + arctan(c / f).

[0056] The driving structure further includes a driving logic module, which is used to maintain the ratio of the lens moving distance b to the photosensitive chip moving distance c at a preset fixed ratio.

[0057] The driving structure further includes a driving logic module with a stabilization threshold K. The driving logic module is used to maintain the ratio of the lens movement distance b to the image sensor movement distance c at a preset fixed ratio when the tilt angle a is less than or equal to the stabilization threshold K, and to ensure that the image sensor movement distance c reaches its maximum value c of its travel distance when the tilt angle a is greater than the stabilization threshold K. max The lens movement distance b is based on the relationship b = tan(a / f) - c max Obtained through calculation.

[0058] The preset fixed ratio of the lens movement distance and the image sensor movement distance is set according to the weight of the lens, the driving force of the first drive unit, the weight of the image sensor or image sensor assembly, and the driving force of the second drive unit, so that the lens and the image sensor move to their respective image stabilization target positions in the same time.

[0059] The first driving part includes a first base part and a first movable part, and the second driving part includes a second base part and a second movable part. The second base part includes the base and the cover. The top of the cover is fixed to the first base part, the second movable part is located above the base and is movably connected to the second base part, and the photosensitive component is fixed to the upper surface of the second movable part.

[0060] The second movable part is movably connected to the second base part via a ball bearing. The upper surface of the second base part, the ball bearing, and the lower surface of the second movable part are sequentially supported in the z-axis direction, thereby restricting the degree of freedom of movement of the second movable part relative to the second base part to within the xoy plane, wherein the z-axis is perpendicular to the xoy plane.

[0061] In a top-down view, the balls are arranged in the four corner areas of the second drive unit.

[0062] The second base portion is provided with at least three grooves, and at least three balls are disposed in the at least three grooves to support the second movable portion on the xoy plane.

[0063] The base includes a substrate, and the balls are arranged in the edge region of the substrate.

[0064] The second movable part includes a movable part base plate and a movable part side wall, the movable part side wall being formed by extending upward from the edge region of the movable part base plate; the photosensitive component is placed in the receiving groove formed by the movable part base plate and the movable part side wall.

[0065] The movable part has an adhesive between its inner sidewall and the outer sidewall of the photosensitive component to fix the second movable part and the photosensitive component together.

[0066] The cover includes a cover sidewall and a support platform extending inward from the top of the cover sidewall; the ball and the edge region of the second movable part are held between the base and the support platform.

[0067] The lower surface of the support platform and the second movable part have a second gap, which is less than 10 μm.

[0068] The base includes a substrate, and the driving element of the second driving part is a coil-magnet combination; wherein the magnet is disposed in the edge region of the substrate, and the coil is disposed in the edge region of the bottom plate of the movable part; or the coil and the magnet are respectively disposed in the sidewalls of the second movable part and the second base part.

[0069] The coil magnet assembly includes a first coil magnet pair, a second coil magnet pair, and a third coil magnet pair. The first and second coil magnet pairs provide driving force in the x-axis direction, and the third coil magnet pair provides driving force in the y-axis direction. From a top-view perspective, the first and second coil magnet pairs can be arranged along the first and second sides of the second driving part, respectively, with the first and second sides not intersecting. The second coil magnet pair is arranged along the third side of the second driving part, with the third side intersecting both the first and second sides.

[0070] The base includes a base plate and a base sidewall; a first gap exists between the movable part sidewall and the base, the first gap being greater than 200 μm.

[0071] The lower surface of the movable part base plate and the substrate have a third gap, which is less than 10 μm.

[0072] The photosensitive component includes a circuit board, and the camera module further includes a first connecting strip and a second connecting strip. The first connecting strip is disposed on the top area of ​​the first driving part and electrically connected to the first driving part. The second connecting strip is connected to and conducts electricity with the circuit board of the photosensitive component. The second connecting strip is provided with multiple bends to form a curved and stacked shape.

[0073] Compared with the prior art, this application has at least one of the following technical effects:

[0074] 1. This application can improve the stabilization travel of the camera module, thereby compensating for large camera module shakes.

[0075] 2. This application can improve the image stabilization response speed of the camera module.

[0076] 3. The drive structure for optical actuators in this application has the advantage of compact structure, and is particularly suitable for miniaturized camera modules.

[0077] 4. In some embodiments of this application, the driving force of the first driving unit, the weight of the photosensitive chip (or photosensitive component), the driving force of the second driving unit, etc., can be set so that the time for the lens and the photosensitive chip to move to their respective anti-shake target positions is basically the same, thereby obtaining a better anti-shake effect.

[0078] 5. In some embodiments of this application, a suspended circuit board can be used to reduce the interference of the connecting strip on the image sensor's anti-shake movement, thereby effectively ensuring the anti-shake travel and response speed.

[0079] 6. In some embodiments of this application, the second driving part does not need to be provided with a light-transmitting hole, thereby reducing the thickness of the base part and / or the movable part of the second driving part, which helps to reduce the height of the camera module.

[0080] 7. In some embodiments of this application, the movable part of the second driving part and the base of the base part are both disposed below the circuit board of the photosensitive component, thereby avoiding the problem of image smudges caused by adhesive leakage (referring to the problem of smudges in the captured image caused by contaminants seeping into the imaging optical path).

[0081] 8. In some embodiments of this application, a suspended circuit board can be used to reduce the interference of the connecting strip on the image sensor's anti-shake movement, thereby effectively ensuring the anti-shake travel and response speed.

[0082] 9. When using the movement of the image sensor for image stabilization, this application does not require tilting the image sensor, thereby avoiding the blurring problem caused by image stabilization movement.

[0083] 10. In some embodiments of this application, on the xoy plane, the lens and the image sensor are allowed to move in opposite directions simultaneously, thereby avoiding the blurring problem caused by the stabilization movement and improving the stabilization travel and stabilization response speed of the camera module.

[0084] 11. In some embodiments of this application, on the xoy plane, the lens and the image sensor are allowed to move in opposite directions simultaneously, thereby avoiding the blurring problem caused by the stabilization movement and improving the stabilization travel and stabilization response speed of the camera module.

[0085] 12. In some embodiments of this application, the lower end face of the second movable part can be made lower than the lower end face of the second base part to ensure that the photosensitive component will not come into contact with the cover of the second base part after being attached to the second movable part, thereby preventing the photosensitive component from hitting or rubbing against the cover when it moves to stabilize the image.

[0086] 13. In some embodiments of this application, the risk of adhesive used to bond the photosensitive component to the second movable part flowing onto the filter can be reduced by designing a second component with a larger area of ​​the second movable part.

[0087] 14. In some embodiments of this application, the adhesive is applied away from the four corner areas to prevent the adhesive from leaking into the gaps of the ball bearing housing structure located at the four corners, thereby avoiding negative impact on the anti-shake movement.

[0088] 15. In some embodiments of this application, the drive structure controls the second movable part to maintain its position by cooperating with the driving force of the drive element through an elastic element. This eliminates the need for a pair of conjugate driving forces to maintain the second movable part in its initial position, thereby eliminating the need for an additional drive element to provide the conjugate driving force, which helps to reduce the volume occupied by the drive element.

[0089] 16. The assembly method of some embodiments of this application can realize position adjustment based on active calibration, thereby improving the imaging quality of the camera module.

[0090] 17. In some embodiments of this application, a camera module with dual OIS image stabilization can be assembled. The dual OIS image stabilization capability of the camera module of this application can avoid blurring problems and improve the stabilization range or stabilization response speed. Attached Figure Description

[0091] Figure 1 This illustrates a typical camera module with a motor in the prior art;

[0092] Figure 2 A cross-sectional schematic diagram of a camera module with image stabilization function according to an embodiment of this application is shown;

[0093] Figure 3 A cross-sectional schematic diagram of a camera module with image stabilization according to another embodiment of this application is shown;

[0094] Figure 4 The diagram illustrates the relationship between the moving distance of the lens and the image sensor and the tilt angle of the module under four different scenarios in this application.

[0095] Figure 5 A cross-sectional schematic diagram of a camera module in one embodiment of this application is shown;

[0096] Figure 6 A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown;

[0097] Figure 7 A cross-sectional schematic diagram of a camera module according to yet another embodiment of this application is shown;

[0098] Figure 8 A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown;

[0099] Figure 9a A perspective view of the second drive unit in one embodiment of this application is shown;

[0100] Figure 9b An exploded perspective view of the second drive unit in one embodiment of this application is shown;

[0101] Figure 10a A cross-sectional schematic diagram of the second driving unit and photosensitive component in one embodiment of this application is shown;

[0102] Figure 10b This invention provides a cross-sectional schematic diagram showing a second drive unit in a modified embodiment of the present application, in which the ball bearing is disposed on the lower side of the movable part;

[0103] Figure 10c A cross-sectional schematic diagram of a second drive section having two layers of balls is shown in a modified embodiment of this application;

[0104] Figure 11a A cross-sectional schematic diagram of the second drive unit in one embodiment of this application is shown;

[0105] Figure 11b This invention provides a schematic diagram of the assembly of the second drive unit in one embodiment of the present application.

[0106] Figure 11c A cross-sectional schematic diagram of the second drive unit in another embodiment of this application is shown;

[0107] Figure 12 A cross-sectional schematic diagram of the second drive unit is shown in yet another embodiment of this application;

[0108] Figure 13a A bottom view schematic diagram of the movable part of the second drive unit in one embodiment of this application is shown;

[0109] Figure 13b A bottom view of the movable part of the second drive unit in another embodiment of this application is shown;

[0110] Figure 14 The mounting position of the drive element of the second drive unit in one embodiment of this application is shown in a bottom view.

[0111] Figure 15a A cross-sectional schematic diagram of the second drive unit including the drive element is shown in one embodiment of this application;

[0112] Figure 15b A cross-sectional schematic diagram of the second drive unit including the drive element is shown in another embodiment of this application;

[0113] Figure 15c A cross-sectional schematic diagram of the second drive unit including the drive element is shown in another embodiment of this application;

[0114] Figure 16a A cross-sectional schematic diagram of a camera module in one embodiment of this application is shown;

[0115] Figure 16bA schematic diagram illustrating the assembly method of a camera module according to one embodiment of this application is shown;

[0116] Figure 16c A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown;

[0117] Figure 17 The arrangement of the camera module and its connecting strip in one embodiment of this application is shown;

[0118] Figure 18 This paper shows a three-dimensional schematic diagram of the second driving unit and the photosensitive component assembled according to one embodiment of the present application;

[0119] Figure 19 An exploded view of the second driving unit and photosensitive component in one embodiment of this application is shown;

[0120] Figure 20 A perspective view of a photosensitive component and its suspended circuit board in one embodiment of this application is shown.

[0121] Figure 21a A front view of the suspended circuit board after unfolding is shown in one embodiment of this application;

[0122] Figure 21b A schematic diagram of the back of a suspended circuit board after unfolding is shown in one embodiment of this application.

[0123] Figure 22 A cross-sectional schematic diagram of a camera module with image stabilization function according to an embodiment of this application is shown;

[0124] Figure 23 A comparative cross-sectional schematic diagram of a camera module with image stabilization according to another embodiment of this application is shown;

[0125] Figure 24 A cross-sectional schematic diagram of a camera module in one embodiment of this application is shown;

[0126] Figure 25 A perspective view of the second drive unit in one embodiment of this application is shown;

[0127] Figure 26 An exploded perspective view of the second drive unit in one embodiment of this application is shown;

[0128] Figure 27 A cross-sectional schematic diagram of a camera module according to an embodiment of this application is shown;

[0129] Figure 28a The ball bearing structure of the second drive unit in a modified embodiment of this application is shown;

[0130] Figure 28b A schematic diagram showing the movable part rotating in the xoy plane is shown;

[0131] Figure 29 A schematic diagram of a typical assembly method of the second drive unit in one embodiment of this application is shown;

[0132] Figure 30 A schematic diagram showing the disassembled state of the second drive unit before assembly in another embodiment of this application is shown;

[0133] Figure 31 A schematic diagram showing an intermediate state during the assembly process of the second drive unit in another embodiment of this application is illustrated.

[0134] Figure 32 The mounting position of the drive element of the second drive unit in one embodiment of this application is shown from a top view angle;

[0135] Figure 33a A cross-sectional schematic diagram of the second drive unit including the drive element is shown in one embodiment of this application;

[0136] Figure 33b A cross-sectional schematic diagram of the second drive unit including the drive element is shown in another embodiment of this application;

[0137] Figure 34 A schematic diagram illustrating the assembly method of a camera module according to one embodiment of this application is shown;

[0138] Figure 35a The arrangement of the camera module and its connecting strip in one embodiment of this application is shown;

[0139] Figure 35b A perspective view of the second drive unit in one embodiment of this application is shown;

[0140] Figure 36 A schematic diagram showing the connection between the photosensitive component and the second movable part in another embodiment of this application is shown. Detailed Implementation

[0141] To better understand this application, various aspects of this application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of this application and are not intended to limit the scope of this application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0142] It should be noted that in this specification, the terms "first," "second," etc., are used only to distinguish one feature from another and do not imply any limitation on the features. Therefore, without departing from the teachings of this application, the first subject discussed below may also be referred to as the second subject.

[0143] In the accompanying drawings, the thickness, size, and shape of the objects have been slightly exaggerated for ease of illustration. The drawings are for illustrative purposes only and are not drawn to scale.

[0144] It should also be understood that the terms "comprising," "including," "having," "containing," and / or "comprising," when used in this specification, indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed feature, not individual elements in the list. Additionally, when describing embodiments of this application, the word "may" is used to mean "one or more embodiments of this application." And the term "exemplary" is intended to refer to an example or illustration.

[0145] As used herein, the terms “basically,” “approximately,” and similar terms are used as terms of approximation rather than terms of degree, and are intended to describe inherent biases in measured or calculated values ​​that will be recognized by those skilled in the art.

[0146] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms (e.g., those defined in common dictionaries) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0147] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0148] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0149] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0150] Figure 2 A cross-sectional schematic diagram of a camera module with image stabilization according to an embodiment of this application is shown. (Reference) Figure 2In this embodiment, the camera module includes a lens 10, a photosensitive component 20, a first driving unit 30, and a second driving unit 40. The photosensitive component 20 includes a photosensitive chip 21. The first driving unit 30 is configured to drive the lens 10 to move in both the x and y directions, and the second driving unit 40 is configured to drive the photosensitive chip 21 to move in both the x and y directions. In this embodiment, the x and y directions are perpendicular to each other and parallel to the photosensitive surface of the photosensitive component 20. The z-direction is parallel to the normal direction of the photosensitive surface. For ease of understanding, Figure 2 The diagram also illustrates a three-dimensional Cartesian coordinate system constructed based on the x, y, and z directions. In this embodiment, optical image stabilization of the camera module is achieved by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions via a control module. Specifically, the lens 10 and the photosensitive chip 21 are configured to be driven simultaneously and move in opposite directions. For example, if the lens 10 is driven to move in the positive x-axis direction, the photosensitive chip 21 is driven to move in the negative x-axis direction; if the lens 10 is driven to move in the positive y-axis direction, the photosensitive chip 21 is driven to move in the negative y-axis direction; or the lens 10 is driven to move along both the x and y axes, while the photosensitive chip 21 is driven to move along both the x and y axes in directions opposite to the movement of the lens 10. In other words, when simultaneous movement along both the x and y axes is required, the displacement vectors of the lens 10 and the photosensitive chip 21 in the xoy plane are in opposite directions. The camera module typically includes a position sensor used to detect shake in the camera module or terminal device (i.e., an electronic device equipped with the camera module, such as a mobile phone). When shaking is detected, the position sensor sends a signal to the camera module, driving the lens 10 and the photosensitive chip 21 to move accordingly to compensate for the shaking, thereby achieving optical image stabilization. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously, and the movement directions of the lens 10 and the photosensitive chip 21 are opposite, which can achieve a faster response and better image stabilization effect. In addition, the image stabilization angle range of the camera module is usually limited by the suspension system and the drive system, and it is not possible to achieve a relatively large compensation angle range. In this embodiment, by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions, a large-angle shake compensation is achieved. Furthermore, in this embodiment, by simultaneously driving the lens 10 or the photosensitive chip 21 to move in opposite directions, compared with the solution of only driving the lens 10 to move, there is a larger relative movement stroke between the lens 10 and the photosensitive chip 21 (for ease of description, this relative movement stroke can be referred to as the image stabilization stroke), which can have a better compensation effect. In particular, due to the increase in the image stabilization stroke, this embodiment also has a better compensation effect for tilt shake of the camera module. Furthermore, in this embodiment, the direction of the image stabilization movement can be limited to the xoy plane, without tilting the optical axis of the lens 10 or the image sensor 21, thereby avoiding the blurring problem caused by the image stabilization movement.

[0151] Furthermore, in another embodiment of this application, the photosensitive chip 21 can also be driven by the second driving unit 40 to rotate in the xoy plane, thereby achieving compensation for jitter in the rotation direction of the camera module.

[0152] Furthermore, still referencing Figure 2 In one embodiment of this application, the camera module includes a first driving unit 30, a lens 10, a second driving unit 40, and a photosensitive component 20. The lens 10 is mounted on the first driving unit 30. The first driving unit 30 may have a cylindrical first motor carrier, which can serve as the movable part of the first driving unit, and the lens is mounted on the inner side of the first motor carrier. The first driving unit also has a stationary part, or base part. In this embodiment, the base part can be implemented as a motor housing. The motor housing may include a base and a cover. The base has a light-transmitting hole. The movable part is movably connected to the base part. The driving element may be a coil magnet combination, which can be installed between the movable part and the base part. For example, it can be installed between the first motor carrier and the motor housing. In fact, the first driving unit in this embodiment can directly adopt the common structure of optical image stabilization motors in the prior art. Further, in this embodiment, the second driving unit 40 can rest on and be fixed to the bottom surface of the first driving unit 30. The second driving unit 40 may also include a base part and a movable part. The base part is directly connected to the first driving unit. The movable part is located below the base and is movably connected to the base. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21 mounted on the surface of the circuit board, and a lens mount 22 surrounding the photosensitive chip 21. The bottom of the lens mount 22 can be mounted on the surface of the circuit board 23, and its top surface can be fixed to the movable part of the second driving part 40. The lens mount 22 has a light-transmitting hole in the center, and a filter 24 is mounted on the lens mount 22 (the filter 24 can also be considered as a component of the photosensitive assembly 20). Driven by the movable part of the second driving part 40, the photosensitive assembly 20 can translate relative to the base in the x and y directions or rotate in the xoy plane. For ease of description, the base of the first driving part 30 is sometimes referred to as the first base, the base of the second driving part 40 as the second base, the movable part of the first driving part 30 as the first movable part, and the movable part of the second driving part 40 as the second movable part.

[0153] Figure 3 A cross-sectional schematic diagram of a camera module with image stabilization according to another embodiment of this application is shown. In this embodiment, the camera module includes a first driving unit 30, a lens 10, a second driving unit 40, and a photosensitive component 20. The lens 10 is mounted on the first driving unit 30. The structure and assembly method of the first driving unit 30 and the lens 10 can be similar to those of other modules. Figure 2The previous embodiment is identical and will not be repeated. The difference between this embodiment and the previous embodiment is that the second driving part 40 is located inside the photosensitive component 20. In this embodiment, the photosensitive component 20 includes a circuit board 23, a lens mount 22, a filter 24, and a photosensitive chip 21. The bottom of the lens mount 22 can be mounted on the surface of the circuit board 23, and its top surface can be fixed to the base of the first driving part 30. The lens mount 22 has a light-transmitting hole in its center, and a filter 24 is mounted on the lens mount 22. The lens mount 22, the filter 24, and the circuit board 23 can form a cavity, and the photosensitive chip 21 is located in the cavity 25. In this embodiment, the second driving part 40 can also be located in the cavity 25. Specifically, the base of the second driving part 40 can be mounted on the surface of the circuit board 23, and the movable part of the second driving part 40 is movably connected to the base. The photosensitive chip 21 is mounted on the surface of the movable part. In this way, the photosensitive chip 21 can be translated in the x and y directions or rotated in the xoy plane relative to the base unit under the drive of the movable part of the second driving unit 40.

[0154] The above description, in conjunction with two embodiments, illustrates different structural implementations of the second drive unit of the camera module described in this application. The following further introduces a method for compensating for tilt and jitter in the camera module based on the design concept of this application.

[0155] Figure 4 This diagram illustrates the relationship between the lens and image sensor movement distance and the module tilt angle under four different scenarios in this application. Position A in the diagram represents the combination of lens and image sensor movement distances used to compensate for camera module shake angle α. Figure 4As shown in the figure, the lens moves a distance of b, and the image sensor (sometimes referred to as the chip below) moves a distance of c. The distance the lens or chip moves can be equivalent to the angle at which the image plane deviates from the optical axis during optical imaging. Specifically, when the lens moves a distance of b in the xoy plane, the resulting image plane offset angle α1 has an arithmetic relationship with the image distance. The image distance is different at different shooting distances. For ease of calculation and expression, the image distance is represented by the image-side focal length. Specifically, the relationship between the resulting image plane offset angle α1 and the image-side focal length f of the lens is: tan(α1) = b / f. When the image sensor moves a distance of c in the xoy plane, the relationship between the resulting image plane offset angle α2 and the image-side focal length f of the lens is: tan(α2) = c / f. In this embodiment, the lens and the image sensor move in opposite directions. Therefore, the calculation method for the overall compensation angle a of the camera module is: a = α1 + α2 = arctan(b / f) + arctan(c / f). In one embodiment, the movement distances of the lens and the photosensitive chip can be set to be the same, i.e., b = c. In another embodiment, the movement distances of the lens and the photosensitive chip can be set to be unequal; for example, the movement distance of the lens can be greater than the movement distance of the photosensitive chip, i.e., b > c. In this embodiment, the second driving unit can be selected from smaller drivers (such as MEMS drivers, which typically have relatively small travel distances) to help achieve overall miniaturization of the camera module.

[0156] Furthermore, in one embodiment of this application, the ratio of the lens movement distance to the image sensor movement distance can be optionally set to maintain a fixed ratio, such as b / c = 6:4, b / c = 7:3, or b / c = 5:5. Regardless of the compensation value of the camera module shake (e.g., the comprehensive compensation angle α), the movement distance of the lens and the image sensor remains at this preset ratio. This is beneficial for ensuring uniform compensation effect of the camera module within the compensable range and also helps to reduce the design difficulty of the camera module's image stabilization system drive logic module.

[0157] Furthermore, in a configuration where the lens movement distance and the image sensor movement distance are based on a fixed ratio for image stabilization, the limited range of motion of the image sensor sometimes means that camera module shake may exceed the maximum movement distance of the image sensor. Therefore, in one embodiment of this application, an image stabilization threshold can be set. For example, for a shake angle 'a' that needs compensation, a threshold K can be set. When the actually calculated shake angle 'a' is less than or equal to the image stabilization threshold K, the lens movement distance 'b' and the image sensor movement distance 'c' are maintained at a fixed ratio. This fixed ratio can be preset, for example, b / c = 6:4, b / c = 7:3, or b / c = 5:5. When the actually calculated shake angle 'a' is greater than the image stabilization threshold K, the image sensor movement distance 'c' is taken as the maximum value of its movement distance, i.e., the maximum movement distance 'c' of the image sensor. maxThe distance the camera moves is b = tan(a / f) - c max In other words, when the camera module needs to compensate for shake angles above the stabilization threshold K, based on a preset fixed ratio, the lens moves to the maximum distance corresponding to the sensor's movement (i.e., the sensor's maximum travel distance c). max After reaching the position, the first drive unit can drive the lens to continue moving until the lens has moved a distance b = tan(a / f) - c. max At the same time, the photosensitive chip first moves synchronously in the opposite direction to the maximum distance c that the photosensitive chip has moved. max Then remain still.

[0158] Furthermore, in another embodiment of this application, the maximum travel distance b of the lens movement within the xoy plane is... max The corresponding stabilization angle (referring to the angle of camera module tilt) can be less than the maximum travel distance c of the image sensor. max The corresponding stabilization angle. With this design, the camera module's stabilization system can have a faster response speed. High-end lenses often have a large number of lens elements; for example, the rear main camera lens in current smartphones can have up to eight lens elements. To further improve image quality, some lenses also use glass lenses, all of which result in a heavier lens. When the driving force does not increase significantly, the speed at which the driving device moves the lens will decrease. However, the image sensor or image sensor assembly is relatively light and can reach the preset position with a smaller driving force. Therefore, in this embodiment, the advantages of the relatively light weight and relatively fast movement speed of the image sensor or image sensor assembly can be better utilized to effectively improve the response speed of the camera module's stabilization system.

[0159] Furthermore, in another embodiment of this application, the fixed ratio between the lens movement distance and the image sensor movement distance can be set according to factors such as the lens weight, the driving force of the first drive unit, the weight of the image sensor (or image sensor assembly), and the driving force of the second drive unit. Setting an appropriate fixed ratio allows the time taken for the lens and the image sensor to reach their respective image stabilization target positions to be substantially the same, thereby achieving a better image stabilization effect. Specifically, the lens weight and the driving force of the first drive unit can substantially determine the lens movement speed, while the weight of the image sensor (or image sensor assembly) and the driving force of the second drive unit can substantially determine the image sensor movement speed. When the lens movement speed is less than the image sensor movement speed (e.g., in the case of a heavier lens), the image sensor movement distance can account for a larger proportion when setting the fixed ratio. This utilizes the characteristic of the image sensor's faster movement speed, allowing the image sensor to move a longer distance, thus ensuring that the time taken for the lens and the image sensor to reach their respective image stabilization target positions is substantially the same.

[0160] Furthermore, in another embodiment of this application, the first drive unit may employ a drive element with a large driving force and a suspension system with a large stroke. For example, the first drive unit may be driven by an SMA (shape memory alloy) element. Compared to the traditional coil magnet combination, the SMA element can provide a larger driving force with a smaller footprint, thus the first drive unit can be designed to be more compact, which is beneficial for the miniaturization of the camera module.

[0161] Furthermore, Figure 5 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown. (Reference) Figure 5 In this embodiment, the base 41 of the second drive unit 40 and the base of the first drive unit 30 ( Figure 5 (Not specifically shown) are fixed together. Lens 10 can be mounted on the movable part of the first drive unit 30 (e.g., the first motor carrier, Figure 5 (Not specifically shown). The photosensitive component 20 includes a circuit board 23, a photosensitive chip 21, a lens mount 22, a filter 24, etc. The photosensitive component 20 can be mounted on the movable part 42 of the second drive unit 40. Specifically, the bottom surface of the movable part 42 can rest against the top surface of the lens mount 22 of the photosensitive component 20. In the second drive unit 40, the base part 41 and the movable part 42 can be elastically connected by a suspension system. In this embodiment, the suspension system allows the movable part 42 to translate relative to the base part 41 in the xoy plane. Optionally, the suspension system can be a ball bearing system, which has the advantage that: in the z-direction, the movable part 42 and the base part 41 are in contact through the ball bearings, and the movable part 42 only moves in the xoy plane, while the movement in the optical axis direction can be prevented by the ball bearings between the movable part 42 and the base part 41, thereby avoiding any impact on the focusing of the camera module.

[0162] Optionally, in another embodiment, the suspension system may include an elastic element (such as a spring) through which the fixed part and the movable part are connected. This elastic element allows the movable part to translate relative to the base in the xoy plane, but prevents the movable part from moving relative to the base outside the xoy plane. Compared to a ball bearing system, the advantage of using an elastic element is that it can provide an initial force between the base and the movable part. This initial force, in conjunction with the driving force of the drive element, can control the distance the movable part moves or maintain its position, eliminating the need for a separate drive element to provide a conjugate driving force to control the position of the movable part. With a ball bearing system, the movable part moves freely relative to the base in the xoy direction when the drive element does not provide a driving force; therefore, at least one pair of opposing driving forces are often required to keep the movable part in its initial position.

[0163] Furthermore, still referencing Figure 5In one embodiment of this application, image stabilization can be achieved by driving the entire photosensitive assembly 20 to move. Simultaneously, the circuit board 23, photosensitive chip 21, lens mount 22, and filter 24 are packaged as a single unit, forming a closed space in which the photosensitive chip 21 is housed. This improves the sealing of the photosensitive assembly 20, ensuring that the image formed by the photosensitive chip 21 is not affected by dust during the manufacturing or use of the camera module.

[0164] In this embodiment, reference is still made. Figure 5 In one embodiment of this application, the back of the circuit board can directly rest against the terminal device (i.e., an electronic device equipped with the camera module, such as a mobile phone). Specifically, the back of the circuit board 23 can rest against the motherboard or other supporting component 90 of the terminal device. Although in this embodiment the movable part 42 is connected to the photosensitive component 20 and the base part 41 is connected to the first driving part 30, it is understood that the movement of the movable part 42 and the base part 41 is relative. In image stabilization movement, opposite movement directions mean that the movement direction of the movable part of the first driving part relative to its base part is opposite to the movement direction of the movable part of the second driving part relative to its base part.

[0165] Furthermore, Figure 6 A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown. (Reference) Figure 6 In this embodiment, a rear shell 49 is added below the second driving part 40. The rear shell 49 is connected to the base part 41 of the second driving part 40 and forms a receiving cavity, which accommodates the movable part 42 and the photosensitive component 20 of the second driving part 40. Figure 6 A gap 49a may exist between the photosensitive component 20 and the bottom of the rear housing 49. That is, the photosensitive component 20 is suspended, and it is only connected to the movable part 42 of the second drive unit 40. In this embodiment, the rear housing 49 directly rests on the terminal device. Since the rear housing 49 connects the terminal device, the second drive unit 40, and the base of the first drive unit 30, during image stabilization, with the terminal device as a reference, the movable parts of the first drive unit 30 and the second drive unit 40 simultaneously drive the lens 10 and the photosensitive component 20 to move in opposite directions. Furthermore, in this embodiment, the movable part 42 of the second drive unit 40 is directly bonded to the upper surface of the photosensitive component 20, which can separate the filter 24 from the external space, thereby preventing debris generated by friction or collision of the movable part 42 relative to the base unit 41 from falling directly onto the surface of the filter 24.

[0166] Figure 7 A cross-sectional schematic diagram of a camera module according to yet another embodiment of this application is shown. (See reference) Figure 7In this embodiment, the first drive unit 30 is configured to drive the lens 10 to move along the optical axis to achieve focusing, and also to drive the lens 10 to move in the xoy plane to achieve image stabilization. Optionally, the first drive unit 30 includes at least two carriers, namely a first carrier 31 and a second carrier 32. The lens 10 rests on the first carrier 31, and a suspension system is provided between the first carrier 31 and the second carrier 32. A suspension system is also provided between the second carrier 32 and the housing 33 of the first drive unit 30. In this embodiment, the suspension system between the first carrier 31 and the second carrier 32 (i.e., the first suspension system) is a ball bearing system, and the suspension system between the second carrier 32 and the housing 33 (i.e., the second suspension system) is a suspension system based on an elastic element (such as a spring). In this embodiment, the second suspension system is located outside the first suspension system. The first suspension system allows the lens 10 and the first carrier 31 to translate in the xoy plane to achieve image stabilization, and the second suspension system allows the lens 10, the first carrier 31, and the second carrier 32 to move as a whole along the optical axis to achieve focusing. Optionally, in another embodiment, the second suspension system may also be disposed inside the first suspension system. In another modified embodiment, the second suspension system may also be disposed below the first suspension system. In this embodiment, a suspension system refers to a system that movably connects two components, and the degree of freedom of their relative movement (i.e., the direction of movement) is restricted to a certain extent. These two movably connected components may be referred to as the base and the movable part, respectively. Generally, the suspension system is used in conjunction with a drive element (e.g., an SMA element or a coil magnet combination). The drive element provides a driving force, under which the movable part moves relative to the base in the direction of movement defined by the suspension system.

[0167] Furthermore, Figure 8 A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown. (See reference) Figure 8 In this embodiment, the movable part of the second driving unit 40 may be provided with a downwardly extending extension arm 42a, which is bonded to the circuit board 23 of the photosensitive component 20. An FPC board 42b may be provided on the extension arm 42a, which can be directly soldered to the circuit board 23, thereby enabling electrical connection between the driving element mounted on the movable part and the circuit board 23. This embodiment avoids glue flowing onto the filter when the photosensitive component 20 is bonded to the movable part, thus preventing it from affecting imaging. Furthermore, in this embodiment, a gap exists between the upper surface (i.e., the top) of the photosensitive component 20 and the second driving unit 40, preventing the color filter from being scratched or broken.

[0168] Furthermore, Figure 9a A perspective view of the second drive unit in one embodiment of this application is shown. Figure 9b An exploded perspective view of the second drive unit in one embodiment of this application is shown. (Reference) Figure 9a and Figure 9b In this embodiment, both the movable part 42 and the base part 41 of the second driving part 40 have a light-transmitting hole in the center. Light passing through the lens enters the photosensitive chip through the light-transmitting hole and forms an image. In this embodiment, the ball bearings 80 are preferably four in number and are respectively disposed at the four corners of the second driving part 40 (referring to the four corner positions from a top view angle).

[0169] Furthermore, Figure 10a A cross-sectional schematic diagram of the second driving unit and photosensitive component according to one embodiment of this application is shown. (See reference) Figure 10a In this embodiment, the second driving unit 40 includes a movable part 42 and a base part 41, wherein the base part 41 includes a base 41a and a cover 41b. The cover 41b includes a sidewall 41c extending downward from the base 41a to form a surrounding wall of the movable part 42 and a support platform 41d extending horizontally inward from the sidewall 41c. The top of the sidewall 41c is connected to the base 41a, and the lower surface of the edge region 42a of the movable part 42 can rest against the upper surface of the support platform 41d. The ball bearing 80 and the edge region 42a of the movable part 42 are clamped between the base 41a and the support platform 41d of the cover 41b, ensuring that the movable part 42 and the base part 41 do not move relative to each other in the optical axis direction (i.e., the z-axis direction). Thus, the second driving unit 40 only allows the movable part 42 to translate relative to the base part 41 in the xoy plane. More specifically, at least one receiving space is provided between the base 41a and the cover 41b, and a ball bearing 80 is provided in the receiving space. The movable part 42 and the base 41a are respectively in close contact with the ball bearing 80, thereby ensuring that the movable part 42 and the base 41b do not move relative to each other in the optical axis direction. The movable part 42 may include a main body 42b and an edge region 42a, and the thickness of the edge region 42a may be less than the thickness of the main body 42b. The lower surface (also called the lower end surface) of the main body 42b may be lower than the lower surface (also called the lower end surface) of the cover 41b, thereby ensuring that the photosensitive component 20 will not contact the cover 41b after being attached to the movable part 42, and preventing the photosensitive component 20 from hitting or rubbing against the cover when performing anti-shake movement.

[0170] Furthermore, still referencing Figure 10aIn one embodiment of this application, the upper surface of the base 41 may have a stepped structure, which may include a first stepped surface 41e on the outer side and a second stepped surface 41f on the inner side. The height of the second stepped surface 41f is lower than the height of the first stepped surface 41e, thereby providing a larger axial (i.e., z-axis direction) movement space for the focusing of the camera module. In this embodiment, the first driving part may be mounted on the first stepped surface 41e of the base 41 of the second driving part 40. The upper surface of the edge region 42a of the movable part 42 may form a groove, which can accommodate the ball 80 and restrict the movement of the ball 80 within the groove, while also retaining the debris generated by the friction between the ball 80 and the movable part 42 or the base 41 within the groove. Furthermore, since the ball 80 can be placed in the groove, the assembly of the movable part 42, the base 41a of the base 41, and the cover 41b is more convenient. In another embodiment, the outer boss of the groove may be omitted. This design can reduce the lateral dimension of the second driving part, which is beneficial for the miniaturization of the camera module. Since the outer boss of the groove is eliminated, the groove is actually reduced to a recessed step, the outer step surface of which is lower than the inner step surface, and the recessed step, together with the side wall of the cover and the base, forms a receiving cavity for accommodating the ball.

[0171] Furthermore, in one embodiment of this application, the edge region of the movable part can be provided with multiple grooves, the number of grooves matching the number of balls. Each ball is accommodated in a corresponding groove. The bottom surface of the groove can be a plane, which ensures that the movable part will not tilt during translation. Simultaneously, relative movement between the movable part and the base part along three axes in the xoy plane can be achieved using only a single layer of balls. Optionally, a base groove can also be provided at the position corresponding to the groove of the movable part on the base. With a fixed ball diameter, this design can reduce the thickness of the second drive part. Furthermore, the bottom surface of the groove or the bottom surface of the recessed step (referring to the outer step surface of the recessed step) is a plane, allowing the movable part to rotate relative to the base part in the xoy plane, i.e., rotate around the z-axis. The rotation direction around the z-axis can be called the Rz direction, or simply Rz-axis rotation. In this embodiment, the photosensitive chip can move in the x, y, and Rz directions to achieve image stabilization, thus providing better image stabilization capabilities. Since the three directions of movement, x, y, and Rz, are all within the xoy plane, the relative movement on the three axes within the xoy plane mentioned earlier refers to movement in the x, y, and Rz directions.

[0172] Figure 10b A cross-sectional schematic diagram of a second drive unit is shown in a modified embodiment of this application, in which the ball bearing is disposed on the lower side of the movable part. (Reference) Figure 10bIn this embodiment, the ball bearing 80 is located between the support platform 41d of the cover 41b and the movable part 42. At the corresponding position of the ball bearing 80, the edge region 42a of the movable part 42 and / or the support platform 41d can be provided with a groove, and the bottom surface of the groove can be set as a plane, thereby allowing the movable part 42 to move relative to the base part 41 only in the xoy plane, and without tilting when moving in the xoy plane.

[0173] Figure 10c A cross-sectional schematic diagram of a second drive unit with two layers of balls is shown in a modified embodiment of this application. In this embodiment, two layers of balls 81 and 82 are provided. Specifically, one layer of balls 81 is provided between the base 41a and the movable part 42, and one layer of balls 82 is provided between the movable part 42 and the support platform 41d of the cover 41b. Compared to Figure 10a In the embodiment shown, because a layer of ball bearings 82 is added between the movable part 42 and the support platform 41d, the movable part 42 will not directly rub against the support platform 41d during anti-shake movement, reducing the generation of debris. Furthermore, by providing two layers of ball bearings 81 and 82, the resistance of the movable part 42 during movement can be reduced.

[0174] Furthermore, Figure 11a A cross-sectional schematic diagram of the second drive unit in one embodiment of this application is shown. (Reference) Figure 11a In this embodiment, the outer side of the movable part 42 is provided with an inwardly recessed groove 42c, and the support platform 41d of the cover 41b of the base part 41 is fitted into the groove 42c. In this solution, the lower end face of the second drive part 40 can have a large area. When the lens mount 22 is attached to the movable part 42, the adhesive can be placed in a region further out of the lens mount 22, thereby keeping the adhesive as far away from the filter as possible, reducing the risk of adhesive flowing onto the filter 24, and also completely avoiding the risk of the lens mount 22 rubbing against the base part 41 during image stabilization movement. Furthermore, in this embodiment, the movable part 42 can be a split type. For example, the movable part 42 can include a first movable part component 43 and a second movable part component 44, with the sides of the second movable part component 44 and / or the first movable part component 43 recessed inward to form the groove 42c. Further, Figure 11b A schematic diagram of the assembly of the second drive unit according to one embodiment of this application is shown. (Referring to the reference...) Figure 11a and Figure 11b During the assembly of the second drive unit 42, the movable first component 43, the base 41, and the ball bearing 80 can be assembled first, and then the movable second component 44 can be attached to the lower end face of the movable first component 43. With this design, there is no need to worry about the glue coming into contact with the base when attaching the lens mount, and the glue can also be placed near the edge of the lens mount (without having to avoid the base at the four corners) to avoid glue contamination of the color filter.

[0175] Optionally, Figure 11c A cross-sectional schematic diagram of a second drive unit according to another embodiment of this application is shown. (Reference) Figure 11c In this embodiment, the movable part 42 can be integrally formed, that is, the slot 42c is formed directly during the molding of the movable part 42. The cover 41b, however, can be a separate piece. (See reference...) Figure 11b The cover 41b may include two separate cover components 41b1 and 41b2. These two separate cover components 41b1 and 41b2 can be inserted laterally into the slots 42c of the movable part 42 from the left and right sides respectively to fix the axial (i.e. z-axis direction) position of the movable part 42 and the base part 41, thereby completing the encapsulation of the second drive part 40.

[0176] Furthermore, Figure 12 A cross-sectional schematic diagram of the second drive unit in yet another embodiment of this application is shown. (See reference) Figure 12 In this embodiment, the outer side of the movable part 42 is provided with an inwardly recessed groove 42c, and the support platform 41d of the base part 41 and the ball bearing 80 are both disposed in the groove.

[0177] Furthermore, in one embodiment of this application, the movable part is bonded to the upper end face of the lens mount of the photosensitive assembly, thereby achieving the connection between the movable part and the photosensitive assembly. In a modified embodiment, the movable part may also be configured to have a downwardly extending extension arm, and the circuit board of the photosensitive assembly is bonded to the extension arm, thereby achieving the connection between the movable part and the photosensitive assembly. (Referring to the reference...) Figure 8 In the scheme where the extension arm 42a of the movable part is bonded to the circuit board 23, the lens mount can optionally be a small lens mount 22a with a lower height. The small lens mount 22a is only used to mount the photosensitive chip 24, and the taller electronic components 25, such as capacitors, are placed outside the photosensitive chip 21 and the small lens mount 22a. This scheme can reduce the height of the lens mount, thereby reducing the back focus of the camera module and thus reducing the overall height of the module. In this embodiment, since at least some of the electronic components are placed outside the lens mount, preferably, the outer side of the movable part of the second drive part 40 has the slot so that the extension arm is placed at the edge of the second drive part, so that the extension arm is as far away from the electronic components as possible, avoiding the glue from affecting the electronic components.

[0178] Figure 13a This diagram shows a bottom view of the movable part of the second drive unit according to one embodiment of this application. In this embodiment, adhesive 50 is disposed between the lower end face of the movable part 42 and the upper end face of the lens mount of the photosensitive assembly. The placement of adhesive 50 avoids the four corner areas to prevent adhesive 50 from leaking into the gaps of the ball bearing receiving structures located at the four corners, which could negatively affect the image stabilization movement. At the same time, it also prevents the edges of the movable part 42 from being too close to the filter, reducing the risk of adhesive contamination of the filter. Figure 13bA bottom view schematic diagram of the movable portion of the second drive unit in another embodiment of this application is shown. In this embodiment, the adhesive 50 can be arranged in a closed loop along the edge region of the lower end face of the movable portion 42. This design can increase the sealing of the photosensitive component and prevent dust from falling onto the color filter.

[0179] It should be noted that the above embodiments can be combined with each other, for example, 11a, Figure 11b as well as Figure 12 The slot design shown can be combined with a double-layer ball bearing design. The groove / recessed step can be located on the support platform or on the movable part.

[0180] Furthermore, Figure 14 The mounting position of the drive element of the second drive unit in one embodiment of this application is shown from a bottom view angle. Figure 15a A cross-sectional schematic diagram of the second drive unit including the drive element is shown in one embodiment of this application. (Referring to the reference...) Figure 14 and Figure 15a In one embodiment of this application, the driving element of the second driving unit 40 is a coil-magnet combination. The magnet 61 can be disposed in the edge region of the base unit 41, and the coil 62 can be disposed in the edge region 42a of the movable unit 42. The coil 62 can be connected to the circuit board 23 of the photosensitive component 20 by soldering the FPC board (flexible printed circuit board) disposed on the movable unit 42. Since the movable unit 42 and the photosensitive component 20 move synchronously during image stabilization, soldering the coil 62 to the circuit board 23 via the FPC board ensures that there is no relative movement of the wires or solder joints during movement, reducing the risk of electrical connection failure or poor contact at the solder joint. In this embodiment, the magnet can be disposed on the base 41a of the base unit 41.

[0181] Furthermore, Figure 15b A cross-sectional schematic diagram of the second drive unit, including the drive element, is shown in another embodiment of this application. (See reference) Figure 15b In this embodiment, the magnet 61 is disposed on the support platform 41d of the cover 41b of the base part 41.

[0182] Furthermore, Figure 15c A cross-sectional schematic diagram of the second drive unit including the drive element is shown in another embodiment of this application. In this embodiment, the coil 62 and the magnet 61 may be disposed on the sidewalls of the movable part 42 and the base part 41. This design is beneficial for reducing the thickness of the second drive unit 40, thereby reducing the height of the camera module.

[0183] Still referencing Figure 14In one embodiment of this application, preferably, three coil magnet pairs (one coil magnet pair is a coil magnet combination) are provided, referred to as the first coil magnet pair 63, the second coil magnet pair 64, and the third coil magnet pair 65, respectively. The first coil magnet pair 63 and the second coil magnet pair 64 are used to drive the movable part 42 to translate in the x-axis direction, i.e., to provide driving force in the x-axis direction. The third coil magnet pair 65 is used to drive the movable part 42 to translate in the y-axis direction, i.e., to provide driving force in the y-axis direction. From a top-down (or bottom-up) viewpoint, the first coil magnet pair 63 and the second coil magnet pair 64 can be arranged along two opposite sides of the second driving part, referred to as the first side 45 and the second side 46, respectively, and these two opposite sides do not intersect. The second coil magnet pair 64 can be arranged along the third side 47 of the second driving part, and the third side 47 intersects both the first side 45 and the second side 46. In this embodiment, the three coil magnet pairs can achieve translation along the x-axis and y-axis, as well as rotation in the xoy plane. For example, when the first coil magnet pair 63 and the second coil magnet pair 64 provide driving forces in opposite directions, a combined driving force that causes the movable part to rotate in the xoy plane can be generated. It should be noted that this method of providing the driving force for rotation in the xoy plane is not unique. For example, the first coil magnet pair 63 and the third coil magnet pair 65 can also work together to generate a combined driving force that causes the movable part to rotate in the xoy plane. Optionally, the positions of the first coil magnet pair and the second coil magnet pair can be staggered (i.e., the positions of the first coil magnet pair and the second coil magnet pair can be asymmetrical about the central axis of the second driving part) to provide the driving force to achieve rotation of the movable part in the xoy plane (i.e., movement in the Rz direction).

[0184] Furthermore, Figure 16a A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown. (Reference) Figure 16a In this embodiment, the sidewall of the rear cover 49 may have a first through hole 49b to allow the flexible printed circuit board (FPC) of the circuit board 23 to pass through, thereby achieving electrical connection with the motherboard or other components of the terminal device. The center of the bottom plate 49c of the rear cover 49 may have a second through hole 49d to facilitate the assembly of the camera module. The process of assembling the camera module may include: firstly, mounting the lens 10 to the first driving part 30, then attaching the second driving part 40 to the bottom of the first driving part 30, and finally attaching the photosensitive component 20 upward to the movable part 42 of the second driving part 40 through the second through hole 49d at the bottom of the rear cover 49.

[0185] Figure 16bA schematic diagram of the assembly method of the camera module in one embodiment of this application is shown. In this embodiment, optionally, the photosensitive component 20 can be placed on the adjustment device 29. The second through hole 49d at the bottom of the rear shell 49 allows the adjustment device 29 to determine the preferred position and orientation of the photosensitive component 20 through an active calibration process, and then bond it to the movable part 42 of the second drive part 40 with adhesive 28.

[0186] Figure 16c A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown. (Reference) Figure 16c In this embodiment, the bottom of the rear shell 49 is a complete base plate 49c, that is, the base plate 49c does not have a second through hole. During assembly, the second driving part 40 and the photosensitive component 20 can be attached together to form a first assembly, and the first driving part 30 and the lens 10 can be assembled together to form a second assembly. Then, the relative position of the first assembly and the second assembly is determined by the active calibration process (active calibration includes position and attitude adjustment). Finally, the first driving part 30 and the second driving part 40 are pasted according to the relative position determined by the active calibration. The adhesive 27 used to bond the first assembly and the second assembly can be arranged between the bottom surface of the first driving part 30 and the top surface of the second driving part 40.

[0187] Furthermore, Figure 17 The arrangement of a camera module and its connecting strip according to one embodiment of this application is shown. (Reference) Figure 17 In this embodiment, the camera module may include a first connecting strip 26a and a second connecting strip 26b. The first connecting strip 26a is disposed on the top region of the first driving part 30 and electrically connected to the first driving part 30. The second connecting strip 26b is connected to the circuit board 23 of the photosensitive component 20. The second connecting strip 26b may have multiple bends to form a curved, stacked shape to buffer the stress caused by the movement of the photosensitive component 20. A connector may be provided at the end of the second connecting strip 26b. The connector may optionally be fixed and electrically connected to a relay post by pressing, and then connected to the motherboard (or other components) of the terminal device through the relay post 26c. Similarly, a connector may also be connected to the end of the first connecting strip 26a. This connector may be fixed and electrically connected to the relay post 26c by pressing, and then connected to the motherboard (or other components) of the terminal device through the relay post 26c. In this embodiment, the conduction circuit of the first driving part 30 can be separated from the photosensitive component 20 and is not affected by the movement of the photosensitive component 20. The second connecting strip 26b and the transfer post 26c can be accommodated in the second housing 70. The first connecting strip 26a is located outside the second housing 70. The top of the second housing 70 can have a third through hole 70a so that the connector of the first connecting strip 26a can extend into and be electrically connected to the second connecting strip 26b or the transfer post 26c.

[0188] In the above embodiments, the first driving unit and the second driving unit can constitute a driving structure for an optical actuator. In this driving structure, the first driving unit is adapted to mount a lens, and the second driving unit is adapted to mount a photosensitive component. The lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. For example, if the lens is driven to move in the positive x-axis direction, the photosensitive chip is driven to move in the negative x-axis direction; if the lens is driven to move in the positive y-axis direction, the photosensitive chip is driven to move in the negative y-axis direction; or the lens is driven to move along both the x and y axes, while the photosensitive chip is driven to move along both the x and y axes in directions opposite to the lens movement. In other words, when simultaneous movement along the x and y axes is required, the displacement vectors of the lens and the photosensitive chip in the xoy plane are in opposite directions. In this embodiment, configuring the lens and the photosensitive chip to move simultaneously in opposite directions allows for a faster response and better image stabilization. Furthermore, the stabilization angle range of a typical camera module is limited by the suspension and drive systems, making it difficult to achieve a large compensation angle range. In this embodiment, large-angle shake compensation is achieved by simultaneously driving the lens and the image sensor to move in opposite directions. Additionally, by simultaneously driving the lens or image sensor in opposite directions, compared to a solution that only drives the lens, this embodiment allows for a larger relative movement distance between the lens and the image sensor (for ease of description, this relative movement distance can be referred to as the stabilization distance), resulting in better compensation. In particular, due to the increased stabilization distance, this embodiment also provides better compensation for tilt shake of the camera module. Furthermore, the direction of the stabilization movement in this embodiment can be limited to the xoy plane, eliminating the need to tilt the optical axis of the lens or the image sensor, thereby avoiding image blurring caused by stabilization movement.

[0189] Furthermore, in a camera module, the circuit board of the photosensitive component typically includes a rigid circuit board body and a flexible connecting strip. One end of the flexible connecting strip is connected to the circuit board body, and the other end is connected to and conducts power to the motherboard or other components of the electronic device via a connector. In the prior art, the flexible connecting strip of the photosensitive component typically extends from the side of the circuit board body, and the flexible connecting strip is roughly parallel to the surface of the circuit board column. In this arrangement, the flexible connecting strip generates significant resistance to the movement of the circuit board body, which may increase the force required to drive the circuit board body, resulting in insufficient stroke for image stabilization compensation and a decrease in response speed. Moreover, the resistance caused by the connecting strip is irregular, making it difficult for the second drive unit to compensate for this resistance, which may lead to a decrease in the accuracy of image stabilization compensation. Therefore, this embodiment provides a suspended circuit board as the circuit board of the photosensitive component adapted to the second drive unit. This design helps to overcome the above-mentioned defects caused by the connecting strip.

[0190] Figure 18 A three-dimensional schematic diagram of the second driving unit and photosensitive component assembled according to one embodiment of this application is shown. Figure 19 An exploded schematic diagram of a second driving unit and a photosensitive component in one embodiment of this application is shown. Figure 20 A perspective view of a photosensitive component and its suspended circuit board according to one embodiment of this application is shown. (Reference) Figure 18 , Figure 19 and Figure 20 In the camera module of this embodiment, the photosensitive component 20 is connected to the movable part 42 of the second driving unit 40, so the circuit board body 71 can move in the xoy plane under the drive of the movable part 42. The circuit board 23 of this embodiment is designed as a suspended structure. Specifically, the circuit board 23 includes a rigid circuit board body 71 and a flexible connecting strip 72. The connecting strip 72 may include a third connecting strip 72a and a fourth connecting strip 72b, which can be extended from two opposite sides of the circuit board body 71 (for ease of description, these two opposite sides can be referred to as the first side 74a and the second side 74b) and bent upwards. The bent third connecting strip 72a and the fourth connecting strip 72b can each form a suspension part 75. The suspension part 75 can be connected to the base of the second driving unit 40 (or the first driving unit 30) to form a suspension structure. This suspension structure allows the base portion to suspend the circuit board body 71 and its various mounted components (i.e., the photosensitive assembly 20) via the bend 73 of the flexible connecting strip 72. Specifically, in one example, the suspension portion 75 may have a through hole (suspension hole 75a), and the base portion 41 of the second drive portion 40 may have a corresponding hook 75b, which hooks the through hole of the suspension portion 75 to connect the suspension portion 75. In the prior art, the connecting strip and the circuit board body are usually on the same plane, and the deflection of the connecting strip relative to the circuit board body on the same plane will generate greater resistance. In this embodiment, the connection position between the connecting strip 72 and the circuit board body 71 is provided with an upward bend 73, and the resistance generated by the connecting strip 72 relative to the circuit board body 71 in the xoy plane (which can be regarded as a horizontal plane) is relatively small.

[0191] Furthermore, in one embodiment of this application, the third connecting strip 72a and the fourth connecting strip 72b may extend along the periphery of the circuit board body 71 and the photosensitive component 20, thereby causing the connecting strip 72 to surround the photosensitive component on at least three sides. Furthermore, the third connecting strip 72a and the fourth connecting strip 72b are interconnected and electrically conductive. The photosensitive component 20 has a first side 74a and a second side 74b positioned corresponding to the circuit board body 71. The first side 74a and the second side 74b are arranged opposite each other (i.e., they do not intersect), while the third side 74c of the photosensitive component 20 intersects both the first side 74a and the second side 74b. The connecting strip 72 may surround the first side 74a, the second side 74b, and the third side 74c of the photosensitive component 20. The third connecting strip 72a extends from the first side 74a of the circuit board body 71 and bends upward to form the bend 73, then extends along the first side 74a of the photosensitive component 20, bends horizontally at a corner, and continues to extend along the third side 74c. The fourth connecting strip 72b extends from the second side 74b of the circuit board body 71 and bends upward to form another bend 73, then extends along the second side 74b of the photosensitive component 20, bends horizontally at a corner, and continues to extend along the third side 74c. The third connecting strip 72a and the fourth connecting strip 72b can join and communicate with each other on the third side 74c, thereby forming a complete connecting strip 72. The three connecting strip segments located on the first side 74a, the second side 74b, and the third side 74c can each have at least one suspension portion 75, and each suspension portion 75 has at least one through hole for connection with the base portion 41 of the second drive portion 40 (or the first drive portion 30). In this embodiment, the suspension part 75 can suspend the circuit board body 71 through the bending parts 73 located on opposite sides of the circuit board body 71, so that when the circuit board body 71 is driven to move by the second driving part 40, the bending part 73 and the connecting strip 72 can be bent and deformed to meet the movement stroke of the circuit board body 71.

[0192] Furthermore, in one embodiment of this application, the suspension portions 73 located in the three connecting strip sections of the first side 74a, the second side 74b, and the third side 74c can all be reinforced by rigid substrates. For example, a rigid substrate can be attached to a portion of the flexible connecting strip to form the suspension portions 73. Other areas of the flexible connecting strip remain flexible to allow for bending deformation, thus satisfying the movement stroke of the circuit board body 71.

[0193] Furthermore, in one embodiment of this application, the connecting strip section located on the third side 74c may have a rigid suspension portion 75c, which may lead out a fifth connecting strip 76, which may be used to connect the motherboard of an electronic device (e.g., a mobile phone).

[0194] Furthermore, in another embodiment of this application, the suspension portion may also be connected to an outer bracket (not shown in the figure), which is directly or indirectly fixed to the base portion of the second drive portion. In this application, the suspension portion may be fixed to the base portion of the second drive portion via other intermediaries. These intermediaries may be directly or indirectly fixed to the base portion of the second drive portion. The intermediary may have hooks to engage the suspension portion, or the intermediary may be adhered to the suspension portion. The intermediary may be an outer bracket, the base portion of the first drive portion, or other intermediaries.

[0195] Furthermore, in another embodiment of this application, the suspension portion may not have the through hole. In this embodiment, the suspension portion can be fixed to the base portion of the second driving portion (or to the base portion of the first driving portion or the outer bracket) by bonding. Furthermore, in another embodiment of this application, the third connecting strip and the fourth connecting strip can be rigid-flexible composite plates, wherein the portion forming the suspension portion can be made of rigid plate, while the portion connecting the suspension portion and the bent portion formed by upward bending can both be made of flexible plate. Since the suspension portion is directly formed of rigid plate, in this embodiment, the suspension portion does not need to be reinforced with a rigid substrate.

[0196] Furthermore, in one embodiment of this application, the circuit board body, the third connecting strip, and the fourth connecting strip may be composed of a single rigid-flex board.

[0197] Furthermore, still referencing Figure 18 , Figure 19 and Figure 20 In one embodiment of this application, the circuit board may also have a fixing part 76a for fixing the fifth connecting strip 76. This design can prevent the circuit board body 71, the third connecting strip 72a and the fourth connecting strip 72b from being affected by external factors.

[0198] Furthermore, Figure 21a A front view of the suspended circuit board after unfolding is shown in one embodiment of this application; Figure 21b A schematic diagram of the rear of a suspended circuit board according to one embodiment of this application is shown. (See reference) Figure 21a and Figure 21bIn this embodiment, the circuit board 23 can be constructed from a rigid-flex board. The sections of the third connecting strip 72a and the fourth connecting strip 72b located on the third side 74c can be interlocked via connectors 78 and 79 (see reference). Figure 20 The third connecting strip 72a and the fourth connecting strip 72b are connected and fixed, and further electrical connection is achieved. Both the third connecting strip 72a and the fourth connecting strip 72b contain circuitry to lead the circuitry within the circuit board body 71 outwards, and then connect to external circuitry via the fifth connecting strip 76 and its connector 77. Since the third connecting strip 72a and the fourth connecting strip 72b can each lead out a portion of the circuitry through the corresponding upward bend 73, the amount of circuitry required to be led out at each bend 73 can be reduced. This reduces the width of each bend 73, further reducing the resistance of the flexible connecting strip 72 to the movement of the circuit board body 71, and thus reducing the driving force required by the second driving unit 40. It should be noted that in other embodiments of this application, the circuitry of the circuit board body may also be led out through only one bend (e.g., the upward bend of the third connecting strip or the upward bend of the fourth connecting strip).

[0199] In the above embodiments, the base of the second driving unit is located between the lens and the photosensitive component, but this application is not limited thereto. In other embodiments, the base of the second driving unit may be located below the photosensitive component. The following describes... Figures 22-36 A series of embodiments are described in further detail regarding a scheme in which the base of the second driving unit is located below the photosensitive component.

[0200] Figure 22 A cross-sectional schematic diagram of a camera module with image stabilization according to an embodiment of this application is shown. (Reference) Figure 22 In this embodiment, the camera module includes a lens 10, a photosensitive component 20, a first driving unit 30, and a second driving unit 40. The photosensitive component 20 includes a photosensitive chip 21. The first driving unit 30 is configured to drive the lens 10 to move in both the x and y directions, and the second driving unit 40 is configured to drive the photosensitive chip 21 to move in both the x and y directions. In this embodiment, the x and y directions are perpendicular to each other and parallel to the photosensitive surface of the photosensitive component 20. The z-direction is parallel to the normal direction of the photosensitive surface. For ease of understanding, Figure 22The diagram also illustrates a three-dimensional Cartesian coordinate system constructed based on the x, y, and z directions. In this embodiment, optical image stabilization of the camera module is achieved by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions via a control module. Specifically, the lens 10 and the photosensitive chip 21 are configured to be driven simultaneously and move in opposite directions. For example, if the lens 10 is driven to move in the positive x-axis direction, the photosensitive chip 21 is driven to move in the negative x-axis direction; if the lens 10 is driven to move in the positive y-axis direction, the photosensitive chip 21 is driven to move in the negative y-axis direction; or the lens 10 is driven to move along both the x and y axes, while the photosensitive chip 21 is driven to move along both the x and y axes in directions opposite to the movement of the lens 10. In other words, when simultaneous movement along both the x and y axes is required, the displacement vectors of the lens 10 and the photosensitive chip 21 in the xoy plane are in opposite directions. The camera module typically includes a position sensor used to detect shake in the camera module or terminal device (i.e., an electronic device equipped with the camera module, such as a mobile phone). When shaking is detected, the position sensor sends a signal to the camera module, driving the lens 10 and the photosensitive chip 21 to move accordingly to compensate for the shaking, thereby achieving optical image stabilization. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously, and the movement directions of the lens 10 and the photosensitive chip 21 are opposite, which can achieve a faster response and better image stabilization effect. In addition, the image stabilization angle range of the camera module is usually limited by the suspension system and the drive system, and it is not possible to achieve a relatively large compensation angle range. In this embodiment, by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions, a large-angle shake compensation is achieved. Furthermore, in this embodiment, by simultaneously driving the lens 10 or the photosensitive chip 21 to move in opposite directions, compared with the solution of only driving the lens 10 to move, there is a larger relative movement stroke between the lens 10 and the photosensitive chip 21 (for ease of description, this relative movement stroke can be referred to as the image stabilization stroke), which can have a better compensation effect. In particular, due to the increase in the image stabilization stroke, this embodiment also has a better compensation effect for tilt shake of the camera module. Furthermore, in this embodiment, the direction of the image stabilization movement can be limited to the xoy plane, without tilting the optical axis of the lens 10 or the image sensor 21, thereby avoiding the blurring problem caused by the image stabilization movement.

[0201] Furthermore, in another embodiment of this application, the photosensitive chip 21 can also be driven by the second driving unit 40 to rotate in the xoy plane, thereby achieving compensation for jitter in the rotation direction of the camera module.

[0202] Furthermore, still referencing Figure 22In one embodiment of this application, the camera module includes a first driving unit 30, a lens 10, a second driving unit 40, and a photosensitive component 20. The lens 10 is mounted on the first driving unit 30. The first driving unit 30 may have a cylindrical first motor carrier, which can serve as the movable part of the first driving unit, and the lens is mounted on the inner side of the first motor carrier. The first driving unit also has a stationary part, or base part. In this embodiment, the base part can be implemented as a motor housing. The motor housing may include a base and a cover. The base has a light-transmitting hole. The movable part is movably connected to the base part. The driving element may be a coil magnet combination, which can be installed between the movable part and the base part. For example, it can be installed between the first motor carrier and the motor housing. In fact, the first driving unit in this embodiment can directly adopt the common structure of optical image stabilization motors in the prior art. Further, in this embodiment, the second driving unit 40 may also include a base part and a movable part. The base part may include a substrate and a base part sidewall, the bottom of the base part sidewall being connected to the substrate, and the top being connected to the base part of the first driving unit. For ease of description, the base of the first driving part 30 is sometimes referred to as the first base, the base of the second driving part 40 as the second base, the movable part of the first driving part 30 as the first movable part, and the movable part of the second driving part 40 as the second movable part. In this embodiment, the second movable part is located above the substrate of the second base and is movably connected to the second base through a ball bearing structure. The photosensitive component 20 includes a circuit board 23, a photosensitive chip 21 mounted on the surface of the circuit board, and a lens mount 22 surrounding the photosensitive chip 21. The bottom of the lens mount 22 can be mounted on the surface of the circuit board 23. The lens mount 22 has a light-transmitting hole in the center, and a filter 24 is mounted on the lens mount 22 (the filter 24 can also be considered as a component of the photosensitive component 20). The bottom surface of the circuit board can be fixed (e.g., bonded to) the upper surface of the second movable part. Thus, driven by the second movable part, the photosensitive component 20 can translate relative to the base in the x and y directions or rotate in the xoy plane. On the other hand, in this embodiment, since the second movable part can be disposed on the back of the circuit board, neither the base of the second movable part nor the base of the second base needs to have a light-transmitting hole. Therefore, with the same structural strength, the second movable part can be designed to be thinner and lighter, which is beneficial for the miniaturization of the camera module. For ease of understanding, a comparative example will be used below for illustration.

[0203] Figure 23A cross-sectional schematic diagram of a comparative example of a camera module with image stabilization according to another embodiment of this application is shown. In this comparative example, the camera module includes a first driving unit 30, a lens 10, a second driving unit 40, and a photosensitive component 20. The lens 10 is mounted on the first driving unit 30. The structure and assembly method of the first driving unit 30 and the lens 10 can be compared with... Figure 22 The previous embodiment is identical and will not be repeated. The difference between this comparative example and the previous embodiment is that the second driving unit 40 is located between the lens 10 and the photosensitive component 20. The second base unit 41 can be directly fixed to the bottom surface of the first base unit, and the second movable part 42 is located below the second base unit 41 and movably connected to it, allowing the second movable part 42 to move relative to the second base unit 41 in the xoy plane. The photosensitive component 20 is mounted below the second movable part 42. The top surface of the lens mount 22 of the photosensitive component 20 is connected and fixed to the bottom surface of the second movable part 42, allowing the photosensitive component 20 to translate in the x and y directions or rotate in the xoy plane relative to the second base unit 41 under the drive of the second movable part 42. The circuit board 23 of the photosensitive component 20 can be supported by the motherboard 90 of an electronic device (e.g., a mobile phone). The filter 24 can be mounted on the lens mount 22. In this comparative example, since both the second base part 41 and the second movable part 42 are located on the imaging optical path, both the second base part 41 and the second movable part 42 need to have a light-passing hole in the center to allow light to pass through. Therefore, in order to maintain the required structural strength, the thickness of the second base part 41 and the second movable part must be increased, which may result in an increase in the height of the camera module. The aforementioned method based on... Figure 22 In the embodiment, the base of the second base part 41 and the second movable part 42 are both disposed on the back side of the circuit board of the photosensitive component 20. Therefore, under the premise of the same structural strength, the thickness of the base of the second base part 41 and the second movable part 42 can be reduced, which helps to reduce the height of the camera module and helps to realize the miniaturization of the camera module.

[0204] It needs to be explained that, Figure 22 The second movable part 42 is flat, and the bottom surface of the circuit board 23 of the photosensitive component 20 can be bonded to the upper surface of the second movable part 42. However, this design is not the only solution in this application. For example... Figure 36 A schematic diagram showing the connection between the photosensitive component and the second movable part in another embodiment of this application is shown. (Reference) Figure 36In this embodiment, the second movable part 42 may include a movable part base plate 42a and a movable part sidewall 42b, the movable part sidewall 42b being formed by extending upward from the edge region of the movable part base plate 42a. The photosensitive component 20 can be placed in the receiving groove formed by the movable part base plate 42a and the movable part sidewall 42b. Adhesive 91 can be disposed between the inner side surface of the movable part sidewall 42b and the outer side surface of the photosensitive component 20, that is, in this embodiment, the second movable part 42 and the photosensitive component 20 are fixed together by distributing adhesive on the side.

[0205] Furthermore, Figure 24 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown. (Reference) Figure 24 In this embodiment, the second base 41 of the second drive unit 40 is fixed together with the first base of the first drive unit 30 (which can be composed of a housing 33 and a first base 34). The lens 10 can be mounted on the first movable part of the first drive unit 30 (for example, the first motor carrier 31 of the first movable part can be mounted on the first movable part). The photosensitive component 20 includes a circuit board 23, a photosensitive chip 21, a lens mount 22, a filter 24, etc. The photosensitive component 20 can be mounted on the second movable part 42 of the second drive unit 40. Specifically, the bottom surface of the movable part 42 can rest against the top surface of the lens mount 22 of the photosensitive component 20. In the second drive unit 40, the second base 41 and the second movable part 42 can be elastically connected by a suspension system. In this embodiment, the suspension system allows the second movable part 42 to translate relative to the second base 41 in the xoy plane. Alternatively, the suspension system can be a ball bearing system, which has the advantage that: in the z-direction, the second movable part 42 and the second base part 41 are in contact with each other through the ball bearings, and the second movable part 42 can only move in the xoy plane, while the movement in the optical axis direction (i.e. the z-axis direction) can be prevented by the ball bearings between the second movable part 42 and the second base part 41, thereby avoiding any impact on the focusing of the camera module.

[0206] Optionally, in another embodiment, the suspension system may include an elastic element (such as a spring) through which the fixed part and the movable part are connected. This elastic element allows the movable part to translate relative to the base in the xoy plane, but prevents the movable part from moving relative to the base outside the xoy plane. Compared to a ball bearing system, the advantage of using an elastic element is that it can provide an initial force between the base and the movable part. This initial force, in conjunction with the driving force of the drive element, can control the distance the movable part moves or maintain its position, eliminating the need for a separate drive element to provide a conjugate driving force to control the position of the movable part. With a ball bearing system, the movable part moves freely relative to the base in the xoy direction when the drive element does not provide a driving force; therefore, at least one pair of opposing driving forces are often required to keep the movable part in its initial position.

[0207] Furthermore, still referencing Figure 24 In one embodiment of this application, image stabilization can be achieved by driving the entire photosensitive assembly 20 to move. Simultaneously, the circuit board 23, photosensitive chip 21, lens mount 22, and filter 24 are packaged as a single unit, forming a closed space in which the photosensitive chip 21 is housed. This improves the sealing of the photosensitive assembly 20, ensuring that the image formed by the photosensitive chip 21 is not affected by dust during the manufacturing or use of the camera module.

[0208] Still referencing Figure 24 In one embodiment of this application, the first driving unit 30 is configured to drive the lens 10 to move along the optical axis to achieve focusing, and also to drive the lens 10 to move in the xoy plane to achieve image stabilization. Optionally, the first driving unit 30 includes at least two carriers, namely a first carrier 31 and a second carrier 32. The lens 10 rests on the first carrier 31, and a suspension system is provided between the first carrier 31 and the second carrier 32. A suspension system is also provided between the second carrier 32 and the outer shell 33 of the first driving unit 30. In this embodiment, the suspension system between the first carrier 31 and the second carrier 32 (i.e., the first suspension system) is configured as a ball bearing system, and the suspension system between the second carrier 32 and the outer shell 33 (i.e., the second suspension system) can be a ball bearing structure (which may include, for example, a vertical groove and a plurality of balls disposed in the vertical groove), or a suspension system based on an elastic element (such as a spring). The bottom surface of the outer shell 33 can be mounted on a first base 34, and the first base 34 and the outer shell 33 can together constitute the first base of the first driving unit 30. In this embodiment, the second suspension system is disposed outside the first suspension system. The first suspension system allows the lens 10 and the first carrier 31 to translate within the xoy plane to achieve image stabilization. The second suspension system allows the lens 10, the first carrier 31, and the second carrier 32 to move as a whole along the optical axis to achieve focusing. Optionally, in another embodiment, the second suspension system may also be disposed inside the first suspension system. In another modified embodiment, the second suspension system may also be disposed below the first suspension system. In this embodiment, the suspension system refers to a system that movably connects two components, and the degree of freedom of their relative movement (i.e., the direction of movement) is somewhat restricted. These two movably connected components may be referred to as the base and the movable part, respectively. Generally, the suspension system is used in conjunction with a driving element (e.g., an SMA element or a coil magnet combination). The driving element provides the driving force, under which the movable part moves relative to the base in the direction of movement defined by the suspension system.

[0209] Furthermore, Figure 25A perspective view of the second drive unit in one embodiment of this application is shown. Figure 26 An exploded perspective view of the second drive unit in one embodiment of this application is shown. Further, Figure 27 A cross-sectional schematic diagram of a camera module according to an embodiment of this application is shown, wherein a cross-section of the second drive unit is shown. (Reference) Figure 27 and in conjunction with references Figure 25 and Figure 26 In this embodiment, the second driving part 40 includes a second base part 41 and a second movable part 42. For ease of description, in the paragraphs describing the second driving part 40, the second base part 41 is sometimes simply referred to as the base part 41, and the second movable part 42 is simply referred to as the movable part 42, which will not be repeated below. In this embodiment, the base part 41 includes a base 41a and a cover 41b. In this embodiment, the base 41a can be flat, and therefore can also be called a bottom plate. The cover 41b includes a cover sidewall 41b1 and a support platform 41b2 extending inward from the top of the cover sidewall 41b1. The movable part 42 is located between the support platform 41b2 and the base 41a. The four corner areas of the base 41a can be provided with grooves 41a1, and ball bearings are placed in the grooves 41a1. The bottom surface of the movable part 42 contacts the ball bearings and is supported by the ball bearings 46, thereby forming a movable connection between the base part 41 and the movable part 42. The support platform 41b2 and the base 41a can clamp the movable part 42, thereby limiting the movement of the movable part 42 in the z-axis direction. In this way, the degree of freedom of movement of the movable part 42 relative to the base part 41 is restricted to the xoy plane. Specifically, the degree of freedom of movement of the movable part 42 relative to the base part 41 can include x-axis translation, y-axis translation, and rotation about the z-axis (i.e., rotation in the xoy plane). In this embodiment, a groove 41a1 is provided at the corresponding position of the ball 46. On the one hand, the ball 46 can be placed in the groove 41a1 during assembly, thus facilitating the assembly of the second drive part 40; on the other hand, the groove 41a1 can limit the maximum movement distance of the movable part 42 relative to the base part 41, avoiding collisions between the movable part 42 and the base part 41 during relative movement. Figure 26 As shown, in this embodiment, four grooves 41a1 can be provided on the upper surface of the base 41a of the base part 41, and four balls 46 are also provided, respectively in the four corner areas of the second drive part 40 (see reference). Figure 26 Of course, in other embodiments, grooves and balls may also be provided on the four sides of the second drive unit.

[0210] Furthermore, in one embodiment of this application, in the second driving part 40, the inner side surface of the sidewall of the base part 41 and the outer side surface of the movable part 42 have a first gap 43. The first gap 43 is greater than the maximum distance of the movable part 42's anti-shake movement (i.e., the maximum stroke in one direction, where one direction can be, for example, the positive x-axis direction, the negative x-axis direction, the positive y-axis direction, or the negative y-axis direction). The first gap 43 is typically greater than 200 μm. In this embodiment, a ball bearing structure is used to achieve the movable connection, which can reduce the movement resistance of the movable part 42, thereby reducing the driving force required to drive the movable part 42 to move, and thus allowing the movable part 42 to be designed with a larger stroke. Therefore, in some embodiments, the first gap 43 can be greater than 300 μm.

[0211] Furthermore, in one embodiment of this application, in the second driving part 40, a second gap 44 may also be provided between the lower surface of the support platform 41b2 and the movable part 42. This second gap 44 may be less than 10 μm to reduce the friction between the movable part 42 and the support platform 41b2. This can reduce frictional resistance and also avoid the generation of friction debris. At the same time, since the second gap 44 is small, the support platform 41b2 can still limit the movable part 42 in the z-axis direction, preventing the movement of the movable part 42 from deviating from the xoy plane.

[0212] Furthermore, in one embodiment of this application, in the second driving part 40, a third gap 45 is formed between the lower surface of the movable part 42 and the upper surface of the base 41a. Generally, the diameter of the ball is larger than the depth of the groove accommodating the ball. The third gap 45 may be less than 10 μm, for example.

[0213] Furthermore, in one embodiment of this application, in the second driving part 40, the upper surface of the cover 41b (i.e. the upper surface of the support platform 41b2) is higher than the top surface of the photosensitive component 20 (lens mount) to avoid the photosensitive component 20 rubbing against the first driving part 30 when moving horizontally.

[0214] Furthermore, Figure 28a The ball bearing structure of the second drive unit in a modified embodiment of this application is shown. (Reference) Figure 28a In this embodiment, the number of balls 46 between the base 41 and the movable part 42 of the second drive unit 40 can be three, and the corresponding number of grooves 41a1 for accommodating the balls 46 can also be three. In fact, the number of balls and their positions are only necessary to support the movable part 42 on a reference surface (e.g., a horizontal plane). The reference surface is the xoy plane. In this embodiment, the bottom surface of the groove 41a1 is set as a plane, allowing the balls to move freely on the bottom surface of the groove 41a1, thereby allowing the movable part 42 to translate along the x-axis and y-axis, and also allowing the movable part 42 to translate and rotate within the xoy plane (e.g., ...). Figure 28b As shown, Figure 28b A schematic diagram showing the movable part rotating in the xoy plane is shown. On the other hand, referring to the reference... Figure 27 In this embodiment, the ball bearing 46 is positioned below the photosensitive component 20, meaning that the projections of the ball bearing 46 and the photosensitive component 20 onto the reference plane at least partially overlap. In other words, from a top-down view, the ball bearing 46 is entirely within or at least partially within the projection range of the photosensitive component 20. This design avoids the ball bearing mechanism occupying extra space in the radial direction (i.e., the x-axis or y-axis direction) of the camera module, helping to reduce the lateral dimension (i.e., the dimension in the x-axis or y-axis direction) of the second drive unit 40, thus facilitating module miniaturization.

[0215] Furthermore, Figure 29 A schematic diagram illustrating a typical assembly configuration of the second drive unit in one embodiment of this application is shown. (Reference) Figure 29 In this embodiment, the second drive unit 40 can be assembled from three main components that are separate from each other. These three components are a base 41a, a cover 41b, and a movable part 42, which can be assembled in the vertical direction. For example, the base 41a with balls 46 can be placed on an assembly table first, then the movable part 42 can be placed above the base 41a and supported by the balls 46 in the base 41a. Finally, the cover 41b can be moved above the base 41a and the movable part 42, and then the cover 41b can be moved downward so that the bottom surface of the cover sidewall 41b1 is close to the top surface of the base 41a. Then, the bottom surface of the cover sidewall 41b1 is bonded to the top surface of the base 41a, thereby completing the assembly of the second drive unit 40. Figure 29 In this embodiment, the base 41a is flat and has no base sidewalls; therefore, it can also be referred to as a substrate or base plate. However, it should be noted that in other embodiments, the base 41a may also be composed of base sidewalls and a substrate. Based on such a base, it can be assembled into an assembly as shown below. Figure 13b The second drive unit shown is assembled in the same way as... Figure 29 The assembly method shown can be consistent. That is, first prepare the three main components that are separate from each other: the base, the cover, and the movable part, and then assemble the three together in the vertical direction.

[0216] Figure 30 A schematic diagram of the disassembled state of the second drive unit before assembly is shown in another embodiment of this application. Figure 31 This diagram illustrates an intermediate state during the assembly process of the second drive unit in another embodiment of this application. In this embodiment, the second drive unit 40 can be assembled using a lateral assembly method. Specifically, the three main components that are separate from each other—the base body 41', the movable part 42, and the side cover 41b"—can be prepared first (see reference). Figure 30The base body 41' may include a base 41a and a cover body 41b' connected to the base 41a (in some embodiments, the base 41a and the cover body 41b' may be integrally formed). The cover body 41b' is part of the complete cover 41b, and together with the side cover 41b", it constitutes the complete cover 41b. In this embodiment, the cover body 41b' may, for example, surround the movable part 42 (or the photosensitive component) on three sides, and leave a notch on another side for inserting the movable part 42 (or the combination of the movable part 42 and the photosensitive component) into the base body 41' from the side. The side cover 41b" corresponds to the notch, and after the combination of the movable part 42 and the photosensitive component is inserted from the notch (see reference). Figure 30 and Figure 31 The side cover 41b” can be approached from the side of the base 41a, and the outer side of the base 41a can be bonded to the inner side of the side cover 41b” to form a complete second drive part 40. In this side-bonding method, the parallelism of the upper and lower end faces of the base part 41 is determined only by the manufacturing precision of the base part 41 itself. Therefore, this side-bonding method can improve the parallelism of the upper and lower end faces of the base part 41 and the parallelism between the upper end face of the base part 41 and the movable part 42.

[0217] Furthermore, Figure 32 The mounting position of the drive element of the second drive unit in one embodiment of this application is shown from a top view angle. Figure 33a A cross-sectional schematic diagram of the second drive unit including the drive element is shown in one embodiment of this application. (Referring to the reference...) Figure 32 and Figure 33a In one embodiment of this application, the driving element of the second driving part 40 is a coil-magnet combination. The magnet 61 can be disposed in the edge region of the base plate (i.e., base 41a) of the base part 41, and the coil 62 can be disposed in the edge region of the movable part base plate of the movable part 42. In this embodiment, the magnet can be disposed in the base plate of the base part 41. Further, the coil 62 can be soldered to the circuit board 23 of the photosensitive component 20 via an FPC board (flexible printed circuit board) disposed on the movable part 42. The advantage of placing the coil 62 in the movable part 42 is that the movable part 42 and the photosensitive component 20 move synchronously during image stabilization. Soldering the coil 62 to the circuit board 23 via the FPC board ensures that there is no relative movement of the wires or solder joints during movement, thereby reducing the risk of electrical failure at the solder joint. It should be noted that the connection via the FPC board is not the only electrical connection method in this application. In another embodiment, the coil can also be electrically connected to the bottom surface of the circuit board via contacts or contact arrays disposed on the upper surface of the movable part. Figure 33a The driving element arrangement shown helps to reduce the lateral size of the camera module (i.e., the size perpendicular to the optical axis).

[0218] Furthermore, Figure 33b A cross-sectional schematic diagram of the second drive unit including the drive element is shown in another embodiment of this application. In this embodiment, the coil 62 and the magnet 61 can be disposed on the sidewalls of the movable part 42 and the base part 41. This design is beneficial for reducing the thickness of the second drive unit 40, thereby reducing the height of the camera module. Specifically, in this embodiment, the magnet 61 is disposed on the base 41a of the base part 41 instead of the cover 41b, which leaves room for the connection (which may be adhesive) area between the base part 41 and the first drive unit 30.

[0219] Still referencing Figure 32 In one embodiment of this application, preferably, three coil magnet pairs (one coil magnet pair is a coil magnet combination) are provided, referred to as the first coil magnet pair 63, the second coil magnet pair 64, and the third coil magnet pair 65, respectively. The first coil magnet pair 63 and the second coil magnet pair 64 are used to drive the movable part 42 to translate in the x-axis direction, i.e., to provide driving force in the x-axis direction. The third coil magnet pair 65 is used to drive the movable part 42 to translate in the y-axis direction, i.e., to provide driving force in the y-axis direction. From a top (or bottom) view angle, the first coil magnet pair 63 and the second coil magnet pair 64 can be arranged along two opposite sides of the second driving part, referred to as the first side 48 and the second side 49, respectively, and these two opposite sides do not intersect. The second coil magnet pair 64 can be arranged along the third side 47 of the second driving part, and the third side 47 intersects both the first side 48 and the second side 49. In this embodiment, the three coil magnet pairs can achieve translation along the x-axis and y-axis, as well as rotation in the xoy plane. For example, when the first coil magnet pair 63 and the second coil magnet pair 64 provide driving forces in opposite directions, a combined driving force that causes the movable part to rotate in the xoy plane can be generated. It should be noted that this method of providing the driving force for rotation in the xoy plane is not unique. For example, the first coil magnet pair 63 and the third coil magnet pair 65 can also work together to generate a combined driving force that causes the movable part to rotate in the xoy plane. Optionally, the positions of the first coil magnet pair and the second coil magnet pair can be staggered (i.e., the positions of the first coil magnet pair and the second coil magnet pair can be asymmetrical about the central axis of the second driving part) to provide the driving force to achieve rotation of the movable part in the xoy plane (i.e., movement in the Rz direction).

[0220] Furthermore, Figure 34This diagram illustrates an assembly method of a camera module according to one embodiment of this application. Optionally, in this embodiment, the lens 10 is first mounted on the first driving unit 30, and the photosensitive component 20 is mounted on the second driving unit 40. Then, the relative positions between the photosensitive component 20 and the lens 10 are adjusted using an active calibration process. Finally, the first driving unit 30 and the second driving unit 40 are bonded and fixed together using adhesive 92, ensuring that the relative positions of the bonded photosensitive component 20 and the lens 10 remain at the relative positions determined by the active calibration. In this embodiment, the adhesive 92 can, for example, be disposed between the base of the first driving unit 30 and the base of the second driving unit 40.

[0221] Furthermore, Figure 35a This illustration shows the arrangement of a camera module and its connecting strips according to one embodiment of this application. In this embodiment, the camera module may include a first connecting strip 26a and a second connecting strip 26b. The first connecting strip 26a is disposed on the top region of the first driving unit 30 and electrically connected to the first driving unit 30. The second connecting strip 26b is connected to the circuit board 23 of the photosensitive component 20. The second connecting strip 26b may have multiple bends, forming a curved, layered shape to buffer the stress caused by the movement of the photosensitive component 20. A connector may be provided at the end of the second connecting strip 26b. The connector may optionally be fixed and electrically connected to a relay post 26c by pressing, and then connected to the motherboard (or other components) of the terminal device through the relay post 26c. Similarly, a connector may also be connected to the end of the first connecting strip 26a. This connector may be fixed and electrically connected to the relay post 26c by pressing, and then connected to the motherboard (or other components) of the terminal device through the relay post 26c. In this embodiment, the conduction circuit of the first driving unit 30 can be separated from the photosensitive component 20 and is not affected by the movement of the photosensitive component 20. The second connecting strip 26b and the relay post 26c can be housed in the second housing 70 (the second housing 70 can be a connecting strip housing). The first connecting strip 26a is located outside the second housing 70. The top of the second housing 70 can have a third through hole 70a so that the connector of the first connecting strip 26a can extend into it and be electrically connected to the second connecting strip 26b or the relay post 26c. Further, Figure 35b A perspective view of the second drive unit in one embodiment of this application is shown. (Referring to the reference numerals) Figure 35a and Figure 35b As can be seen in this embodiment, both the movable part 42 and the base part 41 have a slot or window on one side so that the first connecting strip passes through the side wall of the movable part 42 and the side wall of the base part 41.

[0222] In the above embodiments, the first driving unit and the second driving unit can constitute a dual optical image stabilization driving structure (also known as a dual OIS driving structure). In this driving structure, the first driving unit is adapted to mount a lens, and the second driving unit is adapted to mount a photosensitive component. The lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. For example, if the lens is driven to move in the positive x-axis direction, the photosensitive chip is driven to move in the negative x-axis direction; if the lens is driven to move in the positive y-axis direction, the photosensitive chip is driven to move in the negative y-axis direction; or the lens is driven to move along both the x and y axes, while the photosensitive chip is driven to move along both the x and y axes in directions opposite to the lens movement. In other words, when simultaneous movement along the x and y axes is required, the displacement vectors of the lens and the photosensitive chip in the xoy plane are in opposite directions. In some embodiments of this application, configuring the lens and the photosensitive chip to move simultaneously in opposite directions allows for a faster response and better image stabilization. Furthermore, the stabilization angle range of existing camera modules is typically limited by the suspension and drive systems, preventing the achievement of a large compensation angle range. However, in some embodiments of this application, large-angle shake compensation is achieved by simultaneously driving the lens and the image sensor to move in opposite directions. Additionally, compared to some prior art stabilization schemes that only drive the lens, some embodiments of this application, by simultaneously driving the lens or the image sensor to move in opposite directions, allow for a larger relative movement distance between the lens and the image sensor (for ease of description, this relative movement distance can be referred to as the stabilization distance), resulting in better compensation. In particular, due to the increased stabilization distance, this application also provides better compensation for tilt shake of the camera module. Furthermore, in some embodiments of this application, the direction of the stabilization movement can be limited to the xoy plane, eliminating the need to tilt the optical axis of the lens or the image sensor, thereby avoiding image blurring caused by stabilization movement.

[0223] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A driving structure for an optical actuator, characterized in that, include: A first drive unit is adapted to mount a lens and drive the lens to translate in the x-axis and y-axis directions; as well as A second driving unit is adapted to drive a photosensitive chip to translate in the x-axis and y-axis directions, wherein the ratio of the distance the lens moves to the distance the photosensitive chip moves is set to maintain a fixed ratio, wherein there is a first gap between the inner side surface of the sidewall of the second base of the second driving unit and the outer side surface of the second movable part of the second driving unit, the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions, wherein the lens moving distance b driven by the first driving unit and the photosensitive chip moving distance c driven by the second driving unit are determined according to the detected tilt jitter angle a of the camera module; wherein the lens moving distance b, the photosensitive chip moving distance c, and the image-side focal length f of the camera module satisfy: a = arctan(b / f) + arctan(c / f).

2. The driving structure for an optical actuator according to claim 1, characterized in that, The second driving unit is adapted to mount a photosensitive component, which includes the photosensitive chip. The second driving unit drives the photosensitive component to move, thereby achieving translation of the photosensitive chip in the x-axis and y-axis directions.

3. The driving structure for an optical actuator according to claim 1, characterized in that, The second driving unit is also used to drive the photosensitive chip to rotate on the xoy plane.

4. The driving structure for an optical actuator according to claim 1, characterized in that, The driving structure also includes a driving logic module, which is used to maintain the ratio of the lens moving distance b to the photosensitive chip moving distance c at a preset fixed ratio.

5. The driving structure for an optical actuator according to claim 1, characterized in that, The driving structure also includes a driving logic module, which has a stabilization threshold K. The driving logic module is used to maintain the ratio of the lens movement distance b and the image sensor movement distance c at a preset fixed ratio when the tilt angle a is less than or equal to the stabilization threshold K, and to make the image sensor movement distance c reach the maximum value cmax of its movement stroke when the tilt angle a is greater than the stabilization threshold K. The lens movement distance b is calculated according to the relationship b=tan(a / f)-cmax.

6. The driving structure for an optical actuator according to claim 4 or 5, characterized in that, The preset fixed ratio of the lens movement distance and the image sensor movement distance is set according to the weight of the lens, the driving force of the first drive unit, the weight of the image sensor or image sensor assembly, and the driving force of the second drive unit, so that the lens and the image sensor move to their respective image stabilization target positions at the same time.

7. The driving structure for an optical actuator according to claim 2 or 3, characterized in that, The first driving part includes a first base part and a first movable part, and the second driving part includes a second base part and a second movable part; wherein the second base part is fixed together with the first base part, the second movable part is located below the second base part and is movably connected to the second base part, and the photosensitive component is located below the second movable part and fixed to the second movable part.

8. The driving structure for an optical actuator according to claim 7, characterized in that, From a top-down view, the balls are arranged in the four corner areas of the second drive unit.

9. The driving structure for an optical actuator according to claim 7, characterized in that, The drive structure further includes a rear shell located below the second drive unit. The rear shell is connected to the second base unit and forms a receiving cavity. The second movable part and the photosensitive component are both located in the receiving cavity. There is a gap between the photosensitive component and the bottom of the rear shell.

10. The driving structure for an optical actuator according to claim 8, characterized in that, The drive structure further includes a rear shell located below the second drive unit. The rear shell is connected to the second base unit and forms a receiving cavity. The second movable part and the photosensitive component are both located in the receiving cavity. There is a gap between the photosensitive component and the bottom of the rear shell.

11. The driving structure for an optical actuator according to claim 7, characterized in that, The second movable part has a downwardly extending extension arm, which is bonded to the circuit board of the photosensitive component; the extension arm is provided with an FPC, which is directly soldered to the circuit board.

12. The driving structure for an optical actuator according to claim 10, characterized in that, The second movable part has a downwardly extending extension arm, which is bonded to the circuit board of the photosensitive component; the extension arm is provided with an FPC, which is directly soldered to the circuit board.

13. The driving structure for an optical actuator according to claim 8, characterized in that, The second base includes a base and a cover, the cover including a sidewall extending downward from the base and surrounding the second movable part, and a support platform extending horizontally inward from the sidewall.

14. The driving structure for an optical actuator according to claim 13, characterized in that, The ball bearing and the edge region of the second movable part are held between the base and the support platform.

15. The driving structure for an optical actuator according to claim 13, characterized in that, The upper surface of the second base has a stepped structure, which includes a first stepped surface on the outer side and a second stepped surface on the inner side, wherein the height of the second stepped surface is lower than the height of the first stepped surface.

16. The driving structure for an optical actuator according to claim 14, characterized in that, The upper surface of the edge region of the second movable part has a recessed step, the outer step surface of the recessed step is lower than its inner step surface, and the recessed step, together with the side wall of the cover and the base, forms a receiving cavity for accommodating the ball.

17. The driving structure for an optical actuator according to claim 13, characterized in that, The ball bearing is located between the support platform and the second movable part.

18. The driving structure for an optical actuator according to claim 13, characterized in that, A layer of ball bearings is provided between the base and the second movable part, and between the second movable part and the support platform.

19. The driving structure for an optical actuator according to claim 13, characterized in that, The outer side of the second movable part is provided with an inwardly recessed groove, and the support platform is fitted into the groove.

20. The driving structure for an optical actuator according to claim 13, characterized in that, The driving element of the second driving part is a coil-magnet combination; wherein the magnet is disposed in the edge region of the second base part and the coil is disposed in the edge region of the second movable part; or the coil and the magnet are respectively disposed in the sidewalls of the second movable part and the second base part.

21. The driving structure for an optical actuator according to claim 20, characterized in that, The coil magnet assembly includes a first coil magnet pair, a second coil magnet pair, and a third coil magnet pair; wherein, the first coil magnet pair and the second coil magnet pair are used to provide driving force in the x-axis direction; the third coil magnet pair is used to provide driving force in the y-axis direction; and in a top view, the first coil magnet pair and the second coil magnet pair are arranged along the first side and the second side of the second driving part, respectively, the first side and the second side do not intersect, while the second coil magnet pair is arranged along the third side of the second driving part, the third side intersects both the first side and the second side.

22. A camera module, characterized in that, include: Lens; A photosensitive component, which has a photosensitive chip; as well as The drive structure for an optical actuator according to any one of claims 1-21.

23. The camera module according to claim 22, characterized in that, The photosensitive component includes a circuit board, and the camera module further includes a first connecting strip and a second connecting strip. The first connecting strip is disposed on the top area of ​​the first driving part and electrically connected to the first driving part. The second connecting strip is connected to and conducts through the circuit board of the photosensitive component. The second connecting strip is provided with multiple bends to form a curved and stacked shape.

24. The camera module according to claim 22, characterized in that, The first driving part includes a first base part and a first movable part, and the second driving part includes a second base part and a second movable part; wherein the second base part is fixed together with the first base part, the second movable part is located below the second base part and is movably connected to the second base part, and the photosensitive component is located below the second movable part and fixed to the second movable part; The photosensitive component includes a suspended circuit board, which comprises a rigid circuit board body and a flexible connecting strip. The connecting strip extends from a first side and a second side of the circuit board body and bends upward to form a bend. The top of the bend extends horizontally along the periphery of the photosensitive component, such that the connecting strip surrounds the first side, second side, and third side of the photosensitive component. Each of the connecting strips on the first side, second side, and third side has at least one suspension portion, which is fixed to the second base portion of the second drive portion or fixed to the second base portion through an intermediary. The first side of the photosensitive component is aligned with the first side of the circuit board body, the second side of the photosensitive component is aligned with the second side of the circuit board body, the first side and the second side of the photosensitive component are arranged opposite to each other, and the third side of the photosensitive component intersects with both the first side and the second side of the photosensitive component.

25. The camera module according to claim 24, characterized in that, The suspension part has a suspension hole, and the second base part or the intermediate part has a hook that hooks onto the suspension hole.

26. The camera module according to claim 24, characterized in that, A section of the connecting strip is reinforced with a rigid substrate to form the suspension portion.

27. The camera module according to claim 24, characterized in that, The suspended circuit board is made of a rigid-flex board, wherein the circuit board body and the suspension part are formed by the rigid part of the rigid-flex board, and the bending part and the connecting strip section connecting the multiple suspension parts are formed by the flexible part of the rigid-flex board.

28. The camera module according to claim 27, characterized in that, The connecting strip includes a third connecting strip and a fourth connecting strip. The third connecting strip extends from the first side of the circuit board body and bends upward to form a bend, then extends along the first side of the photosensitive component, bends horizontally at a corner, and continues to extend along the third side. The fourth connecting strip extends from the second side of the circuit board body and bends upward to form another bend, then extends along the second side of the photosensitive component, bends horizontally at a corner, and continues to extend along the third side. The third connecting strip and the fourth connecting strip join together on the third side and are interconnected.

29. The camera module according to claim 28, characterized in that, The suspension portion of the connecting strip located on the third side is also connected to a fifth connecting strip, the fifth connecting strip having a connector for external connection; the suspended circuit board also has a fixing portion for fixing the fifth connecting strip.

Citation Information

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