An LED chip transfer device and method

Abstract

An embodiment of the present invention provides an LED chip transfer device and method for transferring an LED chip adhered to a transfer backplane through an adhesive layer to a receiving backplane. The device includes: a light source and an energy adjustment module; the LED chip is adhered to the transfer backplane through the adhesive layer; the energy adjustment module is configured to adjust the energy distribution of the light emitted by the light source irradiating on the adhesive layer according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the debonding speed of different positions of the adhesive layer, thereby adjusting the initial velocity of the LED chip falling after being separated from the transfer backplane, and enabling the LED chip to fall to the target position after being separated from the transfer backplane. An embodiment of the present invention provides an LED chip transfer device and method, which can enable the LED chip to fall to the target position after being separated from the transfer backplane.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of displays, and in particular, to an LED chip transfer device and method. Background Art

[0002] Currently, in the LED chip laser transfer technology, there is a problem of transfer position deviation. There is a deviation between the target position on the receiving backplane during transfer and the actual position of the LED chip on the transfer backplane before transfer. Therefore, there is a problem that the LED chip cannot fall to the target position after being separated from the transfer backplane. Summary of the Invention

[0003] Embodiments of the present invention provide an LED chip transfer device and method, which can make the LED chip fall to the target position after being separated from the transfer backplane.

[0004] In a first aspect, an embodiment of the present invention provides an LED chip transfer device for transferring an LED chip adhered by an adhesive layer on a transfer backplane to a receiving backplane. The device includes: a light source and an energy adjustment module;

[0005] The energy adjustment module is configured to adjust the energy distribution of the light emitted by the light source irradiating on the adhesive layer according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the debonding speed of different positions of the adhesive layer, thereby adjusting the initial velocity of the LED chip falling after being separated from the transfer backplane, and making the LED chip fall to the target position after being separated from the transfer backplane.

[0006] Optionally, when the vertical projection of the first area of the LED chip on the receiving backplane does not overlap with the target position, the energy adjustment module is configured to make the energy of the light emitted by the light source irradiating on the adhesive layer corresponding to the first area more than the energy of other areas of the adhesive layer, so that the debonding speed of the adhesive layer corresponding to the first area is greater than the debonding speed of other areas of the adhesive layer, and make the LED chip fall to the target position after being separated from the transfer backplane.

[0007] Optionally, when the vertical projection of the first area of the LED chip on the receiving backplane does not overlap with the target position, the energy adjustment module is configured to make the energy of the light emitted by the light source irradiating on the adhesive layer gradually decrease in a direction away from the first area, so that the debonding speed of the adhesive layer corresponding to the first area is greater than the debonding speed of other areas of the adhesive layer, and make the LED chip fall to the target position after being separated from the transfer backplane.

[0008] Optionally, the energy adjustment module includes an adjustment unit and a light-shielding plate with a light-passing hole;

[0009] The light shielding plate is located between the light source and the transfer backplane, and the light emitted by the light source irradiates the adhesive layer through the light passing hole;

[0010] The light source is used to emit a Gaussian beam;

[0011] The adjustment unit is used to adjust at least one of the relative positions of the light shielding plate, the transfer backplane, and the receiving backplane with respect to the light source, the size of the light passing hole, and the position of the light passing hole according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the energy distribution of the light emitted by the light source and irradiated on the adhesive layer through the light passing hole.

[0012] Optionally, the light source is used to emit a flat-top beam;

[0013] The energy adjustment module is used to receive the light emitted by the light source, reflect part of the light to the adhesive layer, and adjust the light distribution of the part of the parallel light reflected to the adhesive layer according to the position deviation between the actual position and the target position.

[0014] Optionally, the energy adjustment module further includes a light absorber;

[0015] The energy adjustment module is further used to reflect the remaining part of the light other than the part of the light reflected to the adhesive layer to the light absorber;

[0016] The light absorber is used to absorb the remaining part of the light.

[0017] Optionally, the energy adjustment module includes an angle adjustment unit and a plurality of reflectors;

[0018] The angle adjustment unit is used to adjust the angles of the plurality of reflectors according to the position deviation between the actual position and the target position.

[0019] Optionally, the LED chip transfer device provided by the embodiment of the present invention further includes: a position detection module;

[0020] The position detection module is used to detect the actual position of the LED chip on the transfer backplane, detect the target position of the LED chip on the receiving backplane, and send the position deviation between the actual position and the target position to the energy adjustment module.

[0021] Optionally, the light source includes a laser light source, and the adhesive layer includes a laser adhesive.

[0022] Second aspect, embodiments of the present invention further provide an LED chip transfer method, including: The chip transfer device includes a light source and an energy adjustment module; the LED chip is adhered to the transfer backplane through an adhesive layer;

[0023] The method includes: The energy adjustment module adjusts the energy distribution of the light emitted by the light source irradiating on the adhesive layer according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the debonding speed of different positions of the adhesive layer, thereby adjusting the initial velocity of the LED chip falling after being separated from the transfer backplane, so that the LED chip falls to the target position after being separated from the transfer backplane.

[0024] Embodiments of the present invention provide an LED chip transfer device. The energy adjustment module in the LED chip transfer device adjusts the energy distribution of the light emitted by the light source irradiating on the adhesive layer according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the debonding speed of different positions of the adhesive layer, thereby adjusting the impact force received by different regions of the adhesive layer 140, thereby adjusting the initial velocity of the LED chip falling after being separated from the transfer backplane, so that the LED chip falls to the target position after being separated from the transfer backplane. Embodiments of the present invention provide an LED chip transfer device, which can make the LED chip fall to the target position after being separated from the transfer backplane. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic structural diagram of an LED chip transfer device provided by an embodiment of the present invention;

[0026] Figure 2 It is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention;

[0027] Figure 3 It is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention;

[0028] Figure 4 It is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention;

[0029] Figure 5 It is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention;

[0030] Figure 6 It is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only the parts related to the present invention rather than all the structures are shown in the accompanying drawings.

[0032] As described in the background art, the actual position of the LED chip is not necessarily directly above the target position of the LED chip, and there is a problem that the LED chip cannot directly fall from the actual position to the target position. Embodiments of the present invention provide an LED chip transfer device and method, which can make the LED chip fall to the target position after being separated from the transfer backplane.

[0033] Figure 1 FIG. 1 is a schematic structural diagram of an LED chip transfer device provided by an embodiment of the present invention. Referring to FIG. 1, the LED chip transfer device 100 is used to transfer the LED chip 130 adhered to the transfer backplane 150 through the adhesive layer 140 onto the receiving backplane 160, and includes: a light source 110 and an energy adjustment module 120; the energy adjustment module 120 is used to adjust the energy distribution of the light emitted by the light source 110 irradiating on the adhesive layer 140 according to the position deviation between the target position of the LED chip 130 on the receiving backplane 160 and the actual position of the LED chip 130 on the transfer backplane 150, so as to adjust the debonding speed of different positions of the adhesive layer 140, thereby adjusting the initial velocity of the LED chip 130 falling after being separated from the transfer backplane 150, and making the LED chip 130 fall to the target position after being separated from the transfer backplane 150.

[0034] Specifically, the light source 110 can be a laser light source, and the light emitted by the light source 110 can vaporize the adhesive layer 140. Figure 1 FIG. is a schematic diagram showing that the LED chip 130 has not separated from the transfer backplane 150, and there is a position deviation between the actual position of the LED chip 130 and the target position of the LED chip 130. Figure 1 The dotted line on the receiving backplane 160 in FIG. represents the target position of the LED chip 130. From Figure 1It can be seen that the target position of the LED chip 130 is not directly below the actual position. When different positions of the adhesive layer 140 receive different amounts of energy, the debonding speed is different. During the process of irradiating the adhesive layer 140 with light, as the adhesive layer 140 gasifies, the viscosity of the adhesive layer 140 decreases, that is, the adhesive layer 140 undergoes debonding. The greater the energy received by the adhesive layer 140, the faster the gasification speed and the faster the debonding speed. During the rapid gasification process of the adhesive layer 140, an impact force is generated and acts on the LED chip 130. The faster the gasification speed (debonding speed) of the adhesive layer 140, the greater the impact force generated. The impact force direction on the area of the LED chip 130 where debonding occurs first (i.e., the area that separates from the transfer backplane 150 first) points to the target position. Therefore, when the LED chip 130 detaches from the transfer backplane 150, the LED chip 130 has a certain initial velocity, and the direction of the initial velocity points to the target position. In addition, the magnitude of the impact force affects the magnitude of the initial velocity of the LED chip 130. The greater the impact force, the greater the magnitude of the initial velocity of the LED chip 130. The direction of the initial velocity of the LED chip 130 is also affected by the magnitude of the impact force. When different positions of the LED chip 130 receive different magnitudes of impact force, the falling direction of the LED chip 130 will be different. The energy adjustment module 120 controls the debonding rate of different positions of the adhesive layer 140 according to the position deviation between the target position and the actual position, thereby adjusting the impact force received by different regions of the adhesive layer 140, and adjusting the initial velocity of the LED chip 130 when it falls after separating from the transfer backplane 150, so that the LED chip 130 falls to the target position.

[0035] Figure 2 FIG. is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention. Refer to Figure 2 , Figure 2 which shows an example diagram after the adhesive layer is completely gasified, and Figure 2 exemplarily illustrates that the energy adjustment module 120 controls the adhesive layer corresponding to the area of the LED chip 130 far from the target position to receive more energy. The adhesive layer receiving more energy gasifies first, and a part of the LED chip 130 leaves the transfer backplane 150 first, and the part of the LED chip 130 that detaches from the transfer backplane 150 has a tendency to fall towards the target position. After the adhesive layer is completely gasified, the LED chip 130 will fall towards the direction close to the target position. In addition, Figure 2 exemplarily, the intensity of the light rays is used to represent the amount of energy received by the adhesive layer. The denser the light rays in a region, the more energy the adhesive layer in that region receives.

[0036] An embodiment of the present invention provides an LED chip transfer device. The energy adjustment module in the LED chip transfer device adjusts the energy distribution of the light emitted by the light source on the adhesive layer according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the debonding speed of different positions of the adhesive layer, thereby adjusting the impact force received by different regions of the adhesive layer 140, and then adjusting the initial velocity of the LED chip falling after being separated from the transfer backplane, so that the LED chip falls to the target position after being separated from the transfer backplane. An embodiment of the present invention provides an LED chip transfer device, which can make the LED chip fall to the target position after being separated from the transfer backplane.

[0037] Optionally, continue to refer to Figure 2 , when the vertical projection of the first region 131 of the LED chip 130 on the receiving backplane 160 does not overlap with the target position, the energy adjustment module 120 makes the energy of the light emitted by the light source 110 irradiating on the adhesive layer corresponding to the first region 131 more than the energy of other regions of the adhesive layer, so that the debonding speed of the adhesive layer corresponding to the first region 131 is greater than the debonding speed of other regions of the adhesive layer, so that the LED chip 130 falls to the target position after being separated from the transfer backplane 150.

[0038] Specifically, the first region 131 may represent the region of the LED chip 130 far from the target position. When the debonding speed of the adhesive layer corresponding to the first region 131 is greater than that of other regions, the first region 131 detaches from the transfer backplane 150 prior to other regions, and the direction of the impact force received by the first region 131 is close to the target region. When the LED chip 130 is completely detached from the transfer backplane 150, the LED chip 130 has an initial velocity pointing to the target region under the action of the impact force and gravity, so that the LED chip 130 moves in the direction of the target position during the falling process, and finally the LED chip 130 falls to the target position.

[0039] Optionally, when the vertical projection of the first region of the LED chip on the receiving backplane does not overlap with the target position, the energy adjustment module is used to make the energy of the light emitted by the light source irradiating on the adhesive layer gradually decrease in the direction away from the first region, so that the debonding speed of the adhesive layer corresponding to the first region is greater than the debonding speed of other regions of the adhesive layer, so that the LED chip falls to the target position after being separated from the transfer backplane.

[0040] Specifically, the energy of the light emitted by the light source irradiating on the adhesive layer gradually decreases in the direction away from the first region, that is, the impact force received by the LED chip in the direction away from the first region gradually decreases, which can better control the falling direction of the LED chip, thereby improving the accuracy of the LED chip falling to the target position.

[0041] Optionally, Figure 3The figure is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention. Refer to Figure 3 , the energy adjustment module 120 includes an adjustment unit 121 and a light shielding plate 122 with a light passing hole 10; the light shielding plate 122 is located between the light source 110 and the transfer backplane 150, and the light emitted by the light source 110 irradiates the glue layer through the light passing hole 10; the light source 110 is used to emit a Gaussian beam; the adjustment unit 121 is used to adjust at least one of the relative positions of the light shielding plate 122, the transfer backplane 150 and the receiving backplane 160 with respect to the light source 110, the size of the light passing hole 10, and the position of the light passing hole 10 according to the position deviation between the target position of the LED chip 130 on the receiving backplane 160 and the actual position of the LED chip 130 on the transfer backplane 150, so as to adjust the energy distribution of the light emitted by the light source 110 and irradiated on the glue layer through the light passing hole 10.

[0042] Among them, the position of the light source 110 can be fixed. The Gaussian beam has the characteristic that the energy in different regions is different. Therefore, the different regions of the glue layer can have different energies by controlling the light in different regions of the glue layer receiving the Gaussian beam. The adjustment unit 121 can first determine the required energy distribution of each region of the glue layer according to the position deviation between the actual position and the target position of the LED chip 130, and determine the relative positions of the light shielding plate 122, the moving transfer backplane 150 and the receiving backplane 160 with respect to the light source 110 according to the required energy distribution.

[0043] Specifically, the adjustment unit 121 can move the light shielding plate 122, move the transfer backplane 150 and the receiving backplane 160 to make the light shielding plate 122, the moving transfer backplane 150 and the receiving backplane 160 meet the position requirements with respect to the light source, so that the energy distribution on the glue layer meets the requirements. The adjustment unit 121 can also only adjust the positions of the transfer backplane 150 and the receiving backplane 160. By adjusting the positions of the transfer backplane 150 and the receiving backplane 160, the required energy received on the glue layer can also be controlled. It should be noted that during the process of moving the transfer backplane 150 and the receiving backplane 160, the position deviation between the actual position and the target position of the LED chip 130 remains unchanged.

[0044] In addition, the adjustment unit 121 can also control the energy received by the glue layer by only adjusting the size or position of the light passing hole 10 in the light shielding plate 122. Exemplarily, by adjusting the size of the light passing hole 10, the vertical projection of the LED chip 130 on the transfer backplane 150 falls into the light passing hole 10, and the energy passing through the light passing hole 10 can irradiate all areas of the glue layer. Additionally, by adjusting the size of the light passing hole 10, the vertical projection of the LED chip 130 on the transfer backplane 150 does not completely fall into the light passing hole 10, so that a part of the glue layer receives energy and a part does not receive energy, which can also control the energy received by the glue layer. The adjustment unit 121 can also only adjust the position of the light passing hole 10, so that a part of the glue layer receives light and a part does not receive light, which can also control the energy received by the glue layer.

[0045] In addition, the adjustment unit 121 can also adjust the relative positions of the light shielding plate 122, the transfer backplane 150, and the receiving backplane 160 with respect to the light source 110, and adjust any two or three of the size and position of the light passing hole 10 to adjust the energy distribution on the glue layer.

[0046] Since the structure of the light shielding plate 122 is simple and the cost is low, the use of the light shielding plate 122 and the adjustment unit to achieve energy distribution adjustment makes the structure of the energy adjustment module 120 simple and can reduce the manufacturing cost of the LED chip transfer device 100.

[0047] Optionally, Figure 4 FIG. Figure 4 shows a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention. The light source 110 is used to emit a flat-top light beam; the energy adjustment module 120 is used to receive the light emitted by the light source 110, reflect part of the light onto the glue layer, and adjust the light distribution of the part of the parallel light reflected onto the glue layer according to the position deviation between the actual position and the target position.

[0048] Specifically, the light source 110 includes a laser that generates laser light and a certain number of lenses. The laser light emitted by the laser is converted into a flat-top beam after passing through a certain number of lenses. The flat-top beam is characterized in that the light in the beam is parallel and the energy distribution is uniform. The energy adjustment module 120 first determines the energy required for each area of the adhesive layer according to the position deviation between the actual position and the target position of the LED chip 130. Then, after receiving the light emitted by the light source 110, the energy adjustment module 120 controls the propagation direction of the light, thereby controlling the energy distribution in the adhesive layer, and projects the light to the corresponding area of the adhesive layer according to the energy required for each area of the adhesive layer, so that the LED chip 130 detaches from the transfer backplane 150 and falls to the target position. Since the energy distribution in the flat-top beam is uniform, the energy adjustment module 120 can reflect some of the light in the flat-top beam to the adhesive layer according to actual needs, which can better control the energy distribution projected onto the adhesive layer, making the energy actually received by each area of the adhesive layer closer to the required energy, thereby improving the accuracy of the LED chip 130 falling to the target position.

[0049] Optionally, Figure 5 is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention. Refer to Figure 5 , the energy adjustment module 120 further includes a light absorber 123, and the energy adjustment module 120 is further configured to reflect the remaining light other than the part of the light reflected onto the adhesive layer to the light absorber 123; the light absorber 123 is used to absorb the remaining light.

[0050] Specifically, after the energy adjustment module 120 reflects some of the light to the transfer backplane corresponding to the adhesive layer, in order to prevent the remaining light from damaging other devices after incident on other devices, the light absorber 123 is provided to absorb the remaining light, thereby extending the service life of the LED chip transfer device.

[0051] Optionally, the energy adjustment module includes an angle adjustment unit and a plurality of reflectors; the angle adjustment unit is used to adjust the angles of the plurality of reflectors according to the position deviation between the actual position and the target position.

[0052] Specifically, the angle adjustment unit is used to adjust the direction of the light reflected by the mirror. Since the mirror absorbs less light energy, the light loss through the mirror is small. Moreover, compared with other devices that change the direction of light transmission, the cost of the mirror is lower. The angle adjustment unit adjusts the angles of some of the mirrors according to the position deviation between the actual position and the target position of the LED chip. The angles adjusted by each mirror are not exactly the same, so that the energy received by each area of the adhesive layer is different. Exemplarily, when the vertical projection of the first area of the LED chip on the receiving backplane does not overlap with the target position, the angle adjustment unit can make the energy of the reflected light irradiating on the adhesive layer corresponding to the first area more than the energy of the other areas of the adhesive layer, so that the debonding speed of the adhesive layer corresponding to the first area is greater than that of the adhesive layer corresponding to the other areas, and finally the LED chip detaches from the transfer backplane and falls to the target position. It should be noted that the first area in this embodiment has the same meaning as the first area in any embodiment of the present invention.

[0053] Optionally, Figure 6 is a schematic structural diagram of another LED chip transfer device provided by an embodiment of the present invention. Refer to Figure 6 , the LED chip transfer device 100 provided in this embodiment further includes a position detection module 170; the position detection module 170 is used to detect the actual position of the LED chip 130 on the transfer backplane 150 and the target position of the LED chip 130 on the receiving backplane 160, and send the position deviation between the actual position and the target position to the energy adjustment module 120.

[0054] Specifically, the position detection module 170 is connected to the energy adjustment module 120. The position detection module 170 may include a device with a position measurement function such as a laser rangefinder or a camera. By setting the position detection module 170 to determine the actual position of the LED chip 130 on the transfer backplane 150 and the target position in the receiving backplane 160, the position deviation between the actual position and the target position can be determined more accurately, so that the energy detected by the energy detection module 120 distributed on the adhesive layer is more accurate, and the accuracy of the LED chip 130 falling to the target position is improved.

[0055] Optionally, the light source includes a laser light source, and the adhesive layer includes a laser adhesive.

[0056] Specifically, the energy of the laser light source is high, and the laser adhesive vaporizes quickly after receiving the laser light source, thereby improving the transfer rate of the LED chip.

[0057] It should be noted that the Figures 1 - 6 dotted frames on the receiving backplane 160 in the present invention all represent the target positions of the LED chip 130.

[0058] An embodiment of the present invention also provides an LED chip transfer method. The chip transfer device includes a light source and an energy adjustment module; the LED chip is adhered to the transfer backplane through an adhesive layer; the method includes: the energy adjustment module adjusts the energy distribution of the light emitted by the light source irradiated on the adhesive layer according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the debonding speed of different positions of the adhesive layer, thereby adjusting the initial velocity of the LED chip falling after being separated from the transfer backplane, so that the LED chip falls to the target position after being separated from the transfer backplane.

[0059] The LED chip transfer method provided in this embodiment and the LED chip transfer device provided in any embodiment of the present invention belong to the same inventive concept and have corresponding beneficial effects. The technical details not elaborated in this embodiment are elaborated in the LED chip transfer device provided in any embodiment of the present invention.

[0060] Note that the above is only the preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments, combinations with each other, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the inventive concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An LED chip transfer device is used to transfer the LED chips pasted on the transfer backplane through an adhesive layer to the receiving backplane, and is characterized in that, Comprising: A light source and an energy adjustment module; The energy adjustment module is used to adjust the energy distribution of the light emitted by the light source on the adhesive layer according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the debonding speed of different positions of the adhesive layer, thereby adjusting the initial velocity of the LED chip falling after being separated from the transfer backplane, so that the LED chip falls to the target position after being separated from the transfer backplane; wherein, the vertical projection of the first area of the LED chip on the receiving backplane does not overlap with the target position, and the first area is the area of the LED chip far from the target position.

2. The LED chip transfer device according to claim 1, wherein, When the vertical projection of the first area of the LED chip on the receiving backplane does not overlap with the target position, the energy adjustment module is used to make the energy of the light emitted by the light source on the adhesive layer corresponding to the first area more than the energy of other areas of the adhesive layer, so that the debonding speed of the adhesive layer corresponding to the first area is greater than the debonding speed of other areas of the adhesive layer, so that the LED chip falls to the target position after being separated from the transfer backplane.

3. The LED chip transfer device according to claim 2, wherein When the vertical projection of the first area of the LED chip on the receiving backplane does not overlap with the target position, the energy adjustment module is used to make the energy of the light emitted by the light source on the adhesive layer gradually decrease along the direction away from the first area, so that the debonding speed of the adhesive layer corresponding to the first area is greater than the debonding speed of other areas of the adhesive layer, so that the LED chip falls to the target position after being separated from the transfer backplane.

4. The LED chip transfer device according to claim 1, characterized in that, The energy adjustment module includes an adjustment unit and a light shielding plate with a light passing hole; The light shielding plate is located between the light source and the transfer backplane, and the light emitted by the light source irradiates the adhesive layer through the light passing hole; The light source is used to emit a Gaussian beam; The adjustment unit is used to adjust at least one of the relative positions of the light shielding plate, the transfer backplane and the receiving backplane with respect to the light source, the size of the light passing hole, and the position of the light passing hole according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the energy distribution of the light emitted by the light source and irradiated on the adhesive layer through the light passing hole.

5. The LED chip transfer device according to claim 1, characterized in that, The light source is used to emit a flat-top beam; The energy adjustment module is used to receive the light emitted by the light source, reflect part of the light to the adhesive layer, and adjust the light distribution of the part of the parallel light reflected to the adhesive layer according to the position deviation between the actual position and the target position.

6. The LED chip transfer device according to claim 5, wherein The energy adjustment module further includes a light absorber; The energy adjustment module is further used to reflect the remaining part of the light other than the part of the light reflected to the adhesive layer to the light absorber; The light absorber is used to absorb the remaining part of the light.

7. The LED chip transfer device according to claim 5, wherein, The energy adjustment module includes an angle adjustment unit and a plurality of reflectors; The angle adjustment unit is used to adjust the angles of the plurality of reflectors according to the position deviation between the actual position and the target position.

8. The LED chip transfer device according to any one of claims 1-7, characterized in that Further comprising: A position detection module; The position detection module is configured to detect the actual position of the LED chip on the transfer backplane, detect the target position of the LED chip on the receiving backplane, and send the position deviation between the actual position and the target position to the energy adjustment module.

9. The LED chip transfer device according to any one of claims 1-7, wherein: The light source includes a laser light source, and the glue layer includes laser glue.

10. An LED chip transfer method for controlling the LED chip transfer device according to any one of claims 1-8, characterized in that, Comprising: The chip transfer device includes a light source and an energy adjustment module; The LED chip is adhered to the transfer backplane through a glue layer; The method includes: the energy adjustment module adjusts the energy distribution of the light emitted by the light source irradiating on the glue layer according to the position deviation between the target position of the LED chip on the receiving backplane and the actual position of the LED chip on the transfer backplane, so as to adjust the debonding speed of different positions of the glue layer, thereby adjusting the initial velocity of the LED chip falling after being separated from the transfer backplane, so that the LED chip falls to the target position after being separated from the transfer backplane.

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