Glass, preparation method thereof, and electronic device housing

Abstract

The present application provides a glass, including a glass substrate, wherein a surface of one side of the glass substrate has a plurality of first protrusions distributed at intervals, two adjacent first protrusions are connected by a first recess, and the surface of the first protrusion has a plurality of first secondary structures arranged closely, the first secondary structure is in the shape of a protrusion, and the height and maximum cross-sectional width of the first secondary structure are both smaller than the first protrusion. Due to the presence of the secondary structure on the first protrusion, the contact area between the finger and the glass surface can be reduced, the anti-fingerprint effect can be improved, and the anti-glare effect can be further improved. The present application also provides several preparation methods of the above-mentioned glass and an electronic device housing containing the glass.

Description

Technical Field

[0001] The present application relates to the technical field of glass processing, and in particular to a glass and a preparation method thereof, and an electronic equipment housing. Background Art

[0002] After frosting and polishing, the traditional glass substrate forms certain protrusions on the surface, which has a hazy and beautiful appearance and a certain anti-glare function, and is particularly suitable for use as the housing of electronic products such as mobile phones (such as display cover, back panel, etc.). However, the anti-glare glass obtained by the above process has a poor fingerprint effect. Summary of the invention

[0003] In view of this, the present application provides a new type of glass that can increase the anti-fingerprint effect and further improve the anti-glare effect.

[0004] Specifically, in the first aspect, the present application provides a glass, comprising a glass substrate, wherein a surface of one side of the glass substrate has a plurality of first protrusions distributed at intervals, two adjacent first protrusions are connected by a first recess, and the surface of the first protrusion has a plurality of first secondary structures arranged closely, the first secondary structures are protrusion-shaped, and the height and maximum cross-sectional width of the first secondary structures are both smaller than the first protrusions.

[0005] When a person's finger touches the glass provided in the first aspect of the present application, due to the existence of the first secondary structure, the contact area between the finger and the glass surface is small, and it is not easy to leave fingerprints on it, and the scratch resistance of the glass is improved. In addition, the diffuse reflection ability of the glass is also enhanced. Therefore, the glass can take into account the anti-fingerprint, anti-scratch and anti-glare effects.

[0006] In a second aspect, the present application provides a method for preparing glass, comprising the following steps:

[0007] Forming a plurality of photoresist patterns distributed at intervals on the first surface of the glass substrate; wherein the photoresist patterns have a width of 80-180 μm and an interval of 40-180 μm;

[0008] Using an etching solution containing hydrofluoric acid and sulfuric acid to etch the surface of the glass substrate on which the photoresist pattern is formed, so as to form a first concave portion on the surface of the glass substrate not covered by the photoresist pattern, and then removing the photoresist pattern to form a first convex portion between adjacent first concave portions;

[0009] A first method or a second method is used to form a plurality of closely arranged first secondary structures on the surface of the first protrusion and a plurality of closely arranged second secondary structures on the surface of the first recess, and the heights and maximum cross-sectional widths of the first secondary structures and the second secondary structures are both smaller than those of the first protrusion; wherein the first method comprises frosting the surface of the glass substrate on which the first protrusion is formed with a frosting liquid, and before the sandblasting, an acid-resistant protective layer is formed on a second surface of the glass substrate away from the first surface, and after the sandblasting, the acid-resistant protective layer is removed; the second method comprises sandblasting the surface of the glass substrate on which the first protrusion is formed and then etching it for a second time with an etching solution containing hydrofluoric acid and sulfuric acid.

[0010] The preparation method is simple to operate. The wavy surface of one side of the glass prepared by the method can be entirely covered with a layer of evenly distributed small protrusions. The glass has excellent anti-fingerprint, anti-scratch and anti-glare properties.

[0011] The third aspect of the present application provides a method for preparing glass, comprising the following steps:

[0012] Performing sandblasting on the first surface of the glass substrate so as to form a plurality of closely arranged pointed protrusions on the first surface;

[0013] Forming a plurality of photoresist patterns distributed at intervals on the first surface after the sandblasting treatment; wherein the width of the photoresist patterns is 80-180 μm and the interval is 40-180 μm;

[0014] The first surface of the glass substrate having the photoresist pattern formed thereon is etched by using an etching solution containing hydrofluoric acid and sulfuric acid, so as to form a first concave portion having a plurality of closely arranged second secondary structures on the surface of the glass substrate not covered by the photoresist pattern, wherein the second secondary structure is convex, and then the photoresist pattern is removed to obtain a first protrusion having a plurality of the pointed protrusions on the surface between adjacent first concave portions; wherein the height and the maximum cross-sectional width of the pointed protrusion are both smaller than those of the first protrusion; and the surface roughness of the first concave portion is lower than that of the first protrusion.

[0015] The preparation method is simple to operate. One side surface of the glass prepared by the method has multiple large protrusions and large recesses, and the secondary structural morphologies of the surfaces of the large protrusions and large recesses are different, but the glass still has good anti-fingerprint, anti-scratch and anti-glare properties.

[0016] In a fourth aspect, the present application provides an electronic device housing, comprising the above-mentioned glass, or glass made by the above-mentioned various methods.

[0017] The electronic device casing containing the above-mentioned glass can meet the anti-fingerprint, anti-scratch and anti-glare requirements of electronic devices and has outstanding market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a glass substrate having a photoresist pattern distributed at intervals on one surface;

[0019] Figure 2 is a schematic diagram of a glass substrate with a first protrusion and a first concave portion;

[0020] Figure 3 For Figure 2 The schematic diagram of the structure after an acid-resistant protective layer is provided on the back of the glass substrate shown;

[0021] Figure 4 In some embodiments, Figure 3 Schematic diagram of glass obtained by frosting a glass substrate;

[0022] Figure 5 In some other embodiments, Figure 2 Schematic diagram of glass obtained by first sandblasting and then etching a glass substrate;

[0023] Figure 6 Schematic diagram of the structure of a glass substrate after sandblasting in some other embodiments;

[0024] Figure 7 For Figure 6 A schematic diagram of a structure after a photoresist pattern is formed on the basis of;

[0025] Figure 8 For Figure 7 Schematic diagram of the structure of glass formed on the basis of;

[0026] Fig. 9 For Figure 8 Schematic diagram of the structure of the glass obtained after secondary etching based on FIG.

[0027] Fig.10 This is a metallographic characterization diagram of the glass obtained in Example 1 of the present application;

[0028] Fig.11 This is a metallographic characterization image of the glass obtained in Example 3 of the present application;

[0029] Fig.12 This is a metallographic characterization diagram of the glass obtained in Example 4 of the present application;

[0030] Fig.13 This is a metallographic characterization diagram of the glass obtained in Example 6 of the present application;

[0031] Fig.14 This is the metallographic characterization picture of the glass obtained in Comparative Example 1. DETAILED DESCRIPTION

[0032] Described below are exemplary implementations of the embodiments of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the embodiments of the present application. These improvements and modifications are also considered to be within the scope of protection of the embodiments of the present application.

[0033] Please also read Figures 1 to 4 Some embodiments of the present application provide a method for preparing glass. The method for preparing glass may include the following steps S101, S102, S103 and S104.

[0034] S101, such as Figure 1 As shown, a plurality of photoresist patterns 20 distributed at intervals are formed on the first surface 101 of the glass substrate 10 .

[0035] The spaced photoresist patterns 20 are formed by a photolithography process, which may include the following steps:

[0036] S1011, forming a photoresist layer on the first surface of the glass substrate;

[0037] S1012, exposing and developing the photoresist layer to remove part of the photoresist layer to obtain a plurality of photoresist patterns distributed at intervals.

[0038] The photoresist layer can be formed by coating and drying, and the entire surface of the photoresist layer covers the first surface of the glass substrate. Optionally, the thickness of the photoresist layer (that is, the thickness of the photoresist pattern) is 2-9 μm, specifically 3 μm, 4 μm, 5 μm, 6 μm, 7 μm or 8 μm, etc. The coating method can be brushing, spraying, scraping or spin coating, etc. The purpose of drying is to volatilize the solvent in the photoresist used to form the photoresist layer and reduce its fluidity. Optionally, the temperature of the drying process can be 90-120°C.

[0039] The purpose of exposure is to make the photosensitive components in the photoresist layer undergo a cross-linking reaction to form a cross-linked structure, so that the subsequent exposed area can be dissolved by the developer (when the photoresist is a positive photoresist), or the unexposed area can be dissolved by the developer (when the photoresist is a negative photoresist). Among them, the exposure method can be traditional exposure (irradiating the photoresist layer with ultraviolet light through a predetermined mask), or LDI (Laser Direct Imaging), and the latter is preferred. LDI does not require mask exposure, but directly forms the desired image by laser scanning. The image displayed after development is more delicate and has more diverse shapes.

[0040] The developer used for development is usually an alkaline solution. Specifically, solutions of inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, and ammonia water can be used, and organic alkalis such as tetramethylammonium hydroxide (TMAH), trimethylamine, and triethanolamine can also be used. In some specific embodiments, the developer can be a KOH solution with a conductivity of 30-50mS / cm%, or a TMAH solution with a concentration of 2.38%. During the development process, the developer can be sprayed onto one side of the glass, or the glass can be immersed in the developer, etc. The development treatment time can be 2-10min. In some embodiments, after development, a post-baking treatment can also be performed to further solidify the photoresist pattern and improve its adhesion, hardness, etc. Among them, the post-baking treatment can be performed at a temperature of 140°C-180°C (for example, 150°C, 160°C) for 20min-50min (such as 30min).

[0041] The cross-sectional shape of the photoresist pattern 20 may include one or more of a circle, an ellipse, a triangle, a quadrilateral (such as a trapezoid, a rectangle, a rhombus), a polygon (such as a hexagon) or other irregular shapes (such as a star).

[0042] In the embodiment of the present application, the width W1 of the photoresist pattern 20 is 80-180 μm, and the interval W2 is 40-180 μm. The width here refers to the maximum lateral dimension of the photoresist pattern 20, specifically the distance between the two points with the largest dimension on its cross section, which can be determined according to the specific shape of the cross section. For example, when the cross section of the photoresist pattern is circular, the maximum lateral dimension is the diameter of the circle; when the cross section of the photoresist pattern is polygonal, the maximum lateral dimension is the diameter of the circumscribed circle of the polygon. In the present application, the width and interval of the photoresist pattern are large, and a first protrusion A with a large width and a large interval can be formed by etching, thereby ensuring that the surface of the subsequent first protrusion A and the first concave portion B can form a closely arranged secondary structure (i.e., the small protrusion C below), so that the existence of the secondary structure can reduce the contact area between human fingers and the glass and increase the anti-fingerprint effect. In some embodiments, the width of the photoresist pattern 20 is 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm or 140 μm, etc. The intervals of the photoresist patterns 20 are 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, or 140 μm.

[0043] S102, etching the surface 101 of the glass substrate 10 on which the photoresist pattern 20 is formed is performed using an etching solution containing hydrofluoric acid and sulfuric acid, so as to form a first concave portion (labeled as 12B) on the surface of the glass substrate not covered by the photoresist pattern 20, and then removing the photoresist pattern 20 to form a first convex portion (labeled as 11A) between adjacent first concave portions 12B, so as to obtain Figure 2The structure shown.

[0044] In the embodiment of the present application, the etching solution used in step S102 includes the following components in percentage by weight: 20-40wt% hydrofluoric acid, 5-15wt% sulfuric acid and 45-75wt% water. The etching rate of the etching solution is moderate compared to that of a simple hydrofluoric acid etching solution, and due to the presence of an appropriate amount of sulfuric acid, the surface of the first recess 12B formed is relatively smooth, the edge transition is good, and there is basically no sharp burr on the surface, which is close to the upper surface morphology of the first protrusion 11A corresponding to the original photoresist pattern area, and then the frosting treatment of the subsequent formation of the small protrusion C can be performed at the same rate as the first protrusion 11A, so as to form a small protrusion C with high morphology and size uniformity. In some embodiments, the mass proportion of hydrofluoric acid in the above-mentioned etching solution is 22%, 25%, 30%, 35% or 38%, and the mass proportion of sulfuric acid in the above-mentioned etching solution is 8%, 10%, 12% or 15%, etc.

[0045] Optionally, bubbling can be performed during the etching process, that is, etching can be performed while bubbling, which can help the surface of the glass substrate not covered by the photoresist pattern 20 to be uniformly etched. The temperature during the etching process can be 25-28° C.; the etching time can be adjusted according to the etching depth. In some embodiments, the etching time can be 1-10 minutes, for example, 5-10 minutes.

[0046] During the etching process of step S102, the glass surface covered by the photoresist pattern 20 is almost unaffected by the etching, indicating that the photoresist pattern is resistant to acid etching and can be removed by an alkaline solution. In some embodiments, the method for removing the photoresist pattern includes: using a strong alkaline solution with a concentration of 8-20wt%, and performing ultrasonic stripping at 40-90°C for 2-8 minutes. The strong alkali can be NaOH and / or KOH.

[0047] Optionally, the etching depth when forming the first recess 12B is in the range of 15 μm to 50 μm. Figure 2 The dotted line in the figure may correspond to the glass surface before etching (of course, there is still a photoresist pattern on the surface corresponding to the first protrusion A). The etching depth is also the height H of the first protrusion 11A, that is, the height difference between the top of the first protrusion 11A and the bottom of the first recess 12B. In some embodiments, the height H may be specifically 20 μm, 30 μm, 40 μm, 50 μm, etc. This height can be conducive to forming the first protrusion 11A with large roughness Ra and Rz. In the subsequent processing process, the first protrusion will not collapse structurally, and the higher first protrusion can ensure that the diffuse reflection effect of the glass is further enhanced.

[0048] In the embodiment of the present application, the thickness direction ( Figure 2 In the direction of the middle arrow), the cross-sectional width of the first protrusion 11A gradually decreases. Among them, the cross-sectional shape of the first protrusion 11A includes one or more of a circle, an ellipse, a triangle, a quadrilateral, a polygon or other irregular shapes. Exemplarily, the shape of the first protrusion 11A includes one or more of a truncated cone, a step-like terrace, an arch shape (such as a circular arc arch, a parabolic arch, an elliptical arch), etc. Optionally, the edge bevel angle β of the first protrusion 11A is in the range of 10° to less than 90°. The edge bevel angle is the angle between the edge of the first protrusion 11A and the horizontal plane. β in the above range indicates that the edge of the first protrusion 11A is relatively rounded, and its edges and corners are blunted, which improves the smoothness and tactile comfort when a person's fingers touch it; in addition, the edge of the first protrusion 11A with this β is not easy to wear, and its friction resistance is good.

[0049] In the present application, the maximum cross-sectional width W3 of the first protrusion 11A is the bottom width of the first protrusion 11A. Ideally, the top width of the first protrusion 11A should be consistent with the width W1 of the photoresist pattern 20, but considering that the etching process cannot be carried out completely in the vertical direction, the glass under the edge of the photoresist pattern will also be etched to a certain extent, so that the top width of the first protrusion 11A is smaller than the width of the photoresist pattern 20, and the maximum cross-sectional width of the first recess 12B is greater than the interval W2 between the above-mentioned photoresist patterns 20. Based on the structure that the first protrusion 11A is narrow at the top and wide at the bottom, the bottom width W3 of the first protrusion 11A can be basically consistent with the width W1 of the above-mentioned photoresist pattern 20, such as W3 is slightly less than or equal to W1. Similarly, the interval W4 between two adjacent first protrusions 11A can also be basically consistent with the interval W2 between the above-mentioned photoresist patterns 20, such as W4 is slightly greater than or equal to W2. The interval W4 corresponds to the bottom width of the first recess 12B (that is, its minimum cross-sectional width).

[0050] In the embodiment of the present application, the maximum cross-sectional width W3 of the first protrusion 11A is in the range of 80-175 μm. Specifically, W3 may be 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm or 170 μm, etc. In some embodiments, W3 is in the range of 80-140 μm, and in other embodiments, W3 is in the range of 85-120 μm.

[0051] In the embodiment of the present application, the interval W4 between two adjacent first protrusions 11A is 50-180 μm. Specifically, the interval W4 can be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm or 175 μm, etc. In some embodiments, W4 is in the range of 50-140 μm, and in other embodiments, W4 is in the range of 80-130 μm.

[0052] As described above in the present application, after the first protrusions 11A with a larger width and spacing are frosted, their surfaces and the surfaces of the first recesses 12B can form tightly arranged secondary structures, increase the surface roughness, and reduce the contact area with human hands. In addition, it should be noted that the present application removes the photoresist pattern after the above etching, so that in the subsequent frosting treatment, the first protrusions 11A can also be directly fully frosted and etched, and their surfaces can also form evenly distributed secondary structures, avoiding that only the first recesses 12B are fully frosted.

[0053] S103, such as Figure 3 As shown, an acid-resistant protective layer 30 is formed on a second surface 102 (the second surface 102 faces away from the first surface 101 ) of the glass substrate 10 .

[0054] S104, frosting the surface of the glass substrate on which the first protrusion 11A is formed with a frosting liquid, so that the surfaces of the first protrusion 11A and the first concave portion 12B are both formed with a plurality of closely arranged small protrusions C, and the height and maximum cross-sectional width of the small protrusions C are both smaller than the first protrusion 11A; then the acid-resistant protective layer is removed to obtain Figure 4 Glass shown.

[0055] The acid-resistant protective layer 30 is mainly used to prevent the second surface 102 of the glass substrate from being frosted during the frosting process, and finally ensure that the front surface thereof has an anti-glare effect. The acid-resistant protective layer 30 can be an acid-resistant PET film, or an ink layer, etc. Optionally, the thickness of the acid-resistant protective layer 30 is 20-50 μm.

[0056] In step S104, the frosting liquid used includes the following components in percentage by weight: 25-40wt% of ammonium bifluoride, 10-15wt% of ammonium fluoride silicofluoride, 20-40wt% of citric acid, 5-10wt% of phosphoric acid, 1.5-3wt% of barium sulfate, 1.5-3wt% of alkali metal fluoride, 1-3wt% of polyethylene glycol, 0.1-0.3wt% of sodium dodecyl sulfonate, and 15-25wt% of water. The alkali metal fluoride may include sodium fluoride and / or potassium fluoride. In the frosting liquid, ammonium bifluoride and ammonium fluoride silicon are the main etching materials, barium sulfate and alkali metal fluoride can be used as shielding materials during etching, so that the small protrusions C are evenly distributed on the surface of the first protrusion 11A and the first concave portion 12B, and the appropriate amount of citric acid and phosphoric acid can reduce the etching rate, which is convenient for controlling the size of the small protrusions C and avoiding excessive roughness; sodium dodecyl sulfate is used as a dispersant to improve the uniform dispersion of the components in the frosting liquid and ensure the uniformity of etching; polyethylene glycol can also play a certain dispersing role and can adjust the viscosity of the frosting liquid. Therefore, the use of the above frosting liquid for frosting treatment can ensure the formation of small protrusions C with appropriate size, smooth appearance and uniform distribution.

[0057] Optionally, when using the above-mentioned frosting liquid, stir it evenly first. In order to achieve a better frosting effect, the frosting liquid can be applied to one side of the glass substrate by spraying. Further, the spraying can be performed at 30-33°C for 1-3 minutes, which can achieve a better frosting effect. In some embodiments, the mass percentage of citric acid in the frosting liquid can be 25wt%, 30wt%, 35wt% or 38wt%, etc., and the mass percentage of phosphoric acid can be 6wt%, 7wt%, 8wt% or 9wt%, etc.

[0058] After frosting, the entire wavy first surface of the glass substrate has a layer of small protrusions C, that is, the secondary structure on the surface of the first protrusion 11A and the secondary structure on the surface of the first recess 12B are all small protrusions C. In the embodiment of the present application, the outer peripheral contour line of the small protrusion C is a smooth curve, that is, the outer surface of the small protrusion C is smooth.

[0059] In the embodiment of the present application, the cross-sectional width of the small protrusion C gradually decreases from the second surface 102 of the glass substrate to the thickness direction of the first protrusion 11A. The cross-sectional shape of the small protrusion C may include at least one of a circle, an ellipse, and the like. From a three-dimensional perspective, the small protrusion C may be an arch, such as a circular arch (such as a semicircular arch), a parabolic arch, an elliptical arch, etc. In some embodiments, the small protrusion C is a circular arch, which can also be colloquially expressed as a dot shape.

[0060] In the present application, the height of the small protrusion C is less than the height of the first protrusion 11A, and the maximum cross-sectional width of the small protrusion C is less than the maximum cross-sectional width of the first protrusion 11A. In the embodiment of the present application, the maximum cross-sectional width of the small protrusion C can be in the range of 5-16 μm, specifically 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm, etc.; the height of the small protrusion C can be in the range of 1-5 μm, for example, 2 μm, 3 μm or 4 μm.

[0061] It should be noted that although the above Figure 1-Figure 4 In the preparation method shown, the acid-resistant protective layer 30 is formed on the other side of the glass only after the first protrusion 11A is formed on one side of the glass. However, it can be understood that step S103 of forming the acid-resistant protective layer 30 can also be performed before step S101, or after step S101 and before step S102.

[0062] The glass preparation method provided in the above embodiment of the present application is relatively simple. The wavy surface of one side of the glass obtained by the above preparation method has a layer of small protrusions C on the entire surface. The glass has excellent performance in various aspects. For example, when a person's finger presses the surface of the first protrusion 11A of the glass strip (which can be called the front of the glass), since the surface of the first protrusion 11A has countless evenly distributed small protrusions C, the hand basically touches the apex of the small protrusion C, which can reduce the contact area with the finger, increase the anti-fingerprint and anti-oil effects, etc., and reduce scratches on it, and increase the anti-scratch performance; at the same time, it also increases the diffuse reflection effect of the glass surface, further increasing the anti-glare effect. In addition, the above-mentioned first protrusion 11A and small protrusion C are made of the same material as the glass substrate, that is, the final glass is formed in one piece, avoiding the problem that the additional protrusions made of different materials from the glass are easy to fall off and have poor friction resistance.

[0063] Some embodiments of the present application also provide a method for preparing glass, which may include the aforementioned steps S101 and S102, and the following step S103'.

[0064] S103', such as Figure 5 As shown, the surface of one side of the glass substrate formed with the first protrusion 11A is first sandblasted, and then etched again with an etching solution containing hydrofluoric acid and sulfuric acid, so that a plurality of closely arranged small protrusions C are formed on the surfaces of the first protrusion 11A and the first recess B. Naturally, the height and maximum cross-sectional width of the small protrusion C are smaller than those of the first protrusion 11A.

[0065] Sandblasting is to spray the material at a certain rate onto the surface of the workpiece to be processed under high pressure to form a sanded surface. Sandblasting can make the surface of the first protrusion 11A and the first recess 12B full of pointed protrusions. After secondary etching with etching solution, the edges and corners of these pointed protrusions can be blunted and converted into small protrusions C with smooth and rounded appearance (that is, the outer contour line of the small protrusion C is a smooth curve). In some embodiments, the small protrusion C is arched, specifically, it can be chrysalis-shaped. Among them, the maximum cross-sectional width of the small protrusion C can be in the range of 8-40μm; the height is in the range of 2-15μm.

[0066] The mesh size of the blasting material used in the sandblasting treatment is 150-800 meshes, and the blasting pressure is 0.1-0.3 MPa. This can help to form a sanded surface with a uniform appearance. The blasting material can include at least one of brown corundum, white corundum, and zircon sand. Optionally, the sandblasting time is 2-8 minutes. The thickness of the formed sanded surface is 2-15 μm.

[0067] During the secondary etching, the composition of the etching solution used may be as described in the aforementioned step S102. The etching time of the secondary etching may be adjusted according to the etching depth, and an exemplary secondary etching time may be 2-6 minutes.

[0068] In the glass preparation method provided in the embodiment of the present application, after forming the large first protrusion 11A, the entire surface can be sandblasted and etched to form a small protrusion C that covers the entire wavy surface of the glass. Compared with the frosting treatment in the aforementioned step S104, this method has no special restrictions on the glass material and can reduce the dependence of the frosting liquid on the glass material (generally, the ratio of the frosting liquid to different glass materials is not the same), but the size of the obtained small protrusion C may be slightly different, and its morphology uniformity may be slightly reduced.

[0069] Some other embodiments of the present application also provide a method for preparing glass, which may include the following steps S201, S202 and S203.

[0070] S201, performing sandblasting on the first surface 101 of the glass substrate 10, so that the first surface 101 forms a plurality of closely arranged pointed protrusions F, such as Figure 6 As shown;

[0071] S202, forming a plurality of photoresist patterns 20 distributed at intervals on the first surface 101 after sandblasting, such as Figure 7 As shown;

[0072] S203, etching the first surface of the glass substrate 10 formed with the photoresist pattern 20 using an etching solution containing hydrofluoric acid and sulfuric acid, so as to form a first concave portion 12D having a plurality of closely arranged convex second secondary structures on the surface of the glass substrate not covered by the photoresist pattern 20, and then removing the photoresist pattern 20 to obtain a first protrusion 11E having a plurality of pointed protrusions F on the surface between adjacent first concave portions 12D, so as to obtain Figure 8 The glass shown; wherein the height and the maximum cross-sectional width of the pointed protrusion F are smaller than the first protrusion 11E; the surface roughness of the first recess 12D is lower than that of the first protrusion 11E.

[0073] In step S201, the mesh size of the material used in the sandblasting process is 150-800 meshes, and the sandblasting pressure is 0.1kg-0.3kg. This helps to ensure that the pointed protrusions F are evenly distributed on the glass surface. The material includes at least one of brown corundum, white corundum, and zirconium sand. Optionally, the sandblasting time is 2-6 minutes.

[0074] The thickness direction from the second surface 102 of the glass substrate to the pointed protrusion F ( Figure 5 The cross-sectional width of the pointed protrusion F gradually decreases along the arrow direction in the figure. The pointed protrusion F may be in the shape of a cone, a pyramid (such as a triangular pyramid) or other similar shapes. The cross-sectional shape of the pointed protrusion F may include a circle, a triangle, a quadrilateral, a polygon or other irregular shapes.

[0075] In the present application, the height of the pointed protrusion F is less than the height of the first protrusion 11E, and the maximum cross-sectional width of the pointed protrusion F is less than the maximum cross-sectional width of the first protrusion 11E. In the embodiment of the present application, the maximum cross-sectional width of the pointed protrusion F is in the range of 2-10 μm, and can be 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm or 9 μm, etc. The height of the pointed protrusion F is in the range of 2-20 μm, and can be 3 μm, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm or 18 μm, etc.

[0076] The method of forming the photoresist pattern 20 in step S202 and the size parameters of the photoresist pattern 20 may be the same as those described in the aforementioned step S101 , and will not be described in detail herein.

[0077] The composition of the etching solution used in step S203 may be the same as that in step S102. The maximum cross-sectional area, interval, and height range of the first protrusions 11E may be the same as those of the first protrusions 11A. The etching depth when forming the first recesses 12D may be 15 μm-50 μm.

[0078] In some embodiments of the present application, the second secondary structure on the surface of the first recess 12D in step S203 may be referred to as a protrusion G, and the surface of the protrusion G is smooth. In an embodiment of the present application, the cross-sectional width of the protrusion G gradually decreases from the second surface 102 of the glass substrate to the thickness direction of the first protrusion 11E. Among them, the cross-sectional shape of the protrusion G may include at least one of a circle, an ellipse and the like. From a three-dimensional perspective, the protrusion G may be an arch, such as a circular arch (such as a semicircular arch), a parabolic arch, an elliptical arch, etc. In some embodiments, the protrusion G may be a chrysalis-shaped arch. In some embodiments, the maximum cross-sectional width of the protrusion G is in the range of 8-40 μm, and the height is in the range of 2-15 μm.

[0079] The aforementioned “the surface roughness of the first concave portion 12D is lower than that of the first protrusion 11E” means that the surface roughness Ra of the first concave portion 12D is lower than that of the first protrusion 11E. In some cases, this sentence can also be equivalently understood as the angularity (or roundness) of the protrusion G is lower than that of the pointed protrusion F, that is, compared with the pointed protrusion F, the angularity of the protrusion G is blunted. In some cases, it can also be understood that the outer surface of the protrusion G is smooth.

[0080] In addition, since the first protrusion 11E shares the side surface with the adjacent first recess 12D, it can be understood that the surface of the first protrusion 11E has not only a plurality of pointed protrusions F, but also a plurality of smooth-looking protrusions G. Specifically, the top surface of the first protrusion 11E has a plurality of first protrusions 11E, and the side surface thereof has a plurality of protrusions G. Therefore, after the above-mentioned processing of S201, S202 and S203, the surface of one side of the obtained glass is uneven and has two secondary structures. That is, the secondary structure on the first recess 12D includes the smooth-looking protrusions G, and the secondary structure on the first protrusion 11E includes the pointed protrusions F and the protrusions G.

[0081] The glass preparation method provided in the above embodiment of the present application is relatively simple and is suitable for glass substrates of various materials. One side of the surface of the glass prepared by the above preparation method is wavy, with multiple large protrusions and large concave parts, and the wavy surface also has two secondary structures of different morphologies. The glass still has the anti-fingerprint, anti-scratch and anti-glare effects mentioned above.

[0082] In some embodiments of the present application, after the above step S203, the following step S204 may also be included.

[0083] S204, the surface of the glass substrate 10 having the first protrusion 11E formed thereon is subjected to secondary etching using an etching solution containing hydrofluoric acid and sulfuric acid to blunt the edges and corners of the pointed protrusion F, thereby obtaining a Fig. 9 Glass shown.

[0084] After the secondary etching, the pointed protrusion F can be transformed into a protrusion F' with a smooth appearance. At this time, the secondary structures on the surface of the first protrusion 11E are also protrusions with a smooth appearance. It can be understood that during the secondary etching process, the protrusion G of the first concave portion 12D will also be further etched, but the protrusion G' obtained after etching is still a protrusion with a smooth appearance, but the size parameters are slightly different, such as its width becomes larger (see Fig. 9 and Fig.12 ). In this case, the large concave and convex parts of the uneven surface of the glass have small convex parts with smooth surface, which is similar to Figure 4 The glass structure shown is similar. Similarly, Fig. 9 The glass shown still has the anti-fingerprint, anti-scratch and anti-glare effects mentioned above.

[0085] In some embodiments of the present application, the maximum cross-sectional width and height of the protrusion F' may be in the same range as the range of the protrusion G. That is, the maximum cross-sectional width of the protrusion F' is in the range of 8-40 μm, and the height is in the range of 2-15 μm. The maximum cross-sectional width of the protrusion G' is in the range of 10-50 μm, and the height is in the range of 1-15 μm.

[0086] The present application also provides a glass, which can be referred to in conjunction with Figure 4 , Figure 5 , Figure 8 and Fig. 9 The glass comprises a glass substrate 10, a side surface 101 of the glass substrate having a plurality of first protrusions distributed at intervals (the first protrusions are Figure 4 and Figure 5 The number in is 11A, Figure 8 and Fig. 9 The number in the figure is 11E), and two adjacent first protrusions are connected by a first recess (the first recess is at Figure 4 and Figure 5 The number in is 12B, Figure 8 and Fig. 9 The first protrusion has a plurality of first secondary structures arranged closely on the surface thereof, and the first secondary structures are protrusion-shaped (the first secondary structures are Figure 4 and Figure 5 The label in is C, Figure 8 The symbols in the code include F, Fig. 9 The first secondary structure has a height and a maximum cross-sectional width that are smaller than the first protrusion. The first protrusion can be called a "large protrusion" and the first secondary structure can be called a "small protrusion".

[0087] The surface of one side of the glass provided in the embodiment of the present application is uneven, with multiple large protrusions, and the surface of the large protrusions has multiple small protrusions, which can reduce the contact area between human fingers and the glass surface, increase the anti-fingerprint effect, and improve the anti-scratch performance, and also increase the diffuse reflection effect of the glass, thereby improving the anti-glare effect of the glass.

[0088] As mentioned above, the maximum cross-sectional width of the first protrusion is within the range of 80-175 μm; the interval between two adjacent first protrusions is within the range of 50-180 μm; and the height of the first protrusion is within the range of 15 μm-50 μm. The first protrusions with wide width and large intervals can ensure that their surfaces can be processed to form multiple first secondary structures of smaller size, thereby reducing the contact area of ​​the hand, and the higher first protrusions can ensure that the diffuse reflection effect of the glass is further enhanced.

[0089] In the embodiment of the present application, the surface of the first concave portion also has a plurality of closely arranged second secondary structures, and the second secondary structures are convex (the second secondary structures are Figure 4 and Figure 5 The label in is C, Figure 8 The label in is G, Fig. 9 The second secondary structure has a smooth curve as the outer contour line. The second secondary structure with no obvious edges and corners can improve the touch comfort when in contact.

[0090] In the embodiment of the present application, the cross-sectional widths of the first secondary structure and the second secondary structure gradually decrease from the glass substrate 10 toward the first protrusion, so that when the surface of the first and second secondary structures of the glass ribbon is touched, the contact area with the first and second secondary structures can be reduced.

[0091] In some embodiments of this application, see Figure 4 , Figure 5 , Fig. 9 , the outer contour line of the first secondary structure is a smooth curve. That is, the outer surfaces of the first secondary structure and the second secondary structure are both smooth.

[0092] In some embodiments, see Figure 4 The first secondary structure and the second secondary structure are both small protrusions C, and the maximum cross-sectional width of the small protrusions C is in the range of 5-15 μm; and the height is in the range of 1-5 μm.

[0093] In some embodiments, see Figure 5 The first secondary structure and the second secondary structure are both small protrusions C, and the maximum cross-sectional width of the small protrusions C is in the range of 8-40 μm and the height is in the range of 2-15 μm.

[0094] In some embodiments of this application, see Figure 8, the first secondary structure includes a pointed protrusion F. At this time, the second secondary structure has no tip and its outer surface is smooth. Specifically, the second secondary structure includes a protrusion G. Further, the maximum cross-sectional width of the pointed protrusion F is in the range of 2-10 μm; the height of the pointed protrusion F is in the range of 2-20 μm. The maximum cross-sectional width of the protrusion G is in the range of 8-40 μm; the height is in the range of 2-15 μm.

[0095] In the embodiments of the present application, the haze of the glass can be 60%-95%; the light transmittance can be 80%-85%. A higher haze indicates that the glass of the present application has a strong full reflection ability, which further indicates that it has a good anti-glare effect. In some embodiments, the haze of the glass can be 80%-95%, and further can be 85%-95%.

[0096] At 1000g / cm 2 After 2500 cycles of friction test with steel wool under a pressure of 1 inch (wherein the friction distance of each cycle is 1 inch), the water drop angle of the surface of the glass with the first protrusion is still above 100°, for example, 100-125°. After multiple friction cycles, a larger water drop angle indicates that the wettability of the glass of the present application is poor, which can reduce the traces of grease, dirt, etc. left on the glass surface, and thus the anti-fingerprint performance of the glass is better; this also indirectly reflects that the glass provided by the present application has good wear resistance and strong scratch resistance.

[0097] An embodiment of the present application further provides an electronic device housing, comprising the glass as described above in the present application, or comprising glass produced by the several preparation methods described above in the present application.

[0098] Using the above glass as the shell of electronic equipment can meet the anti-fingerprint, anti-scratch and anti-glare requirements of electronic equipment and has great market competitiveness.

[0099] When the glass of the present application is applied to the housing of an electronic device, chemical strengthening (implemented by an ion exchange method) may be performed first, and then an anti-fingerprint film may be provided on the surface with the first protrusions.

[0100] The electronic device using the electronic device housing can be various consumer electronic products, such as mobile phones, tablet computers, laptops, wearable devices (such as smart watches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR), e-readers, televisions, camcorders, projectors and other electronic products.

[0101] For example, if the electronic device is a portable electronic device such as a mobile phone, a tablet computer, or a wearable product, the electronic device housing may be a display screen cover assembled on the front side of the electronic device, which covers the display module; or a back cover assembled on the back side of the electronic device. In some embodiments, when the electronic device is an electronic device with a camera function (such as a mobile phone or a digital camera), the electronic device housing may also be a camera protection cover.

[0102] The technical solution of the present application is further described below through specific embodiments.

[0103] Example 1

[0104] A method for preparing glass. The preparation process can be found in Figures 1 to 4 , including the following steps:

[0105] (1) Forming a photoresist pattern

[0106] Take a glass substrate with a thickness of 0.6 mm, apply a layer of photoresist with a thickness of 6.8 μm on one side (called the "front"), and bake it in an oven at 100°C for 4 minutes to dry the photoresist; then perform LDI exposure, and the exposed texture pattern is a circle with a diameter of 120 μm, and the interval between adjacent circles is 50 μm; then develop it by spraying a KOH solution with a conductivity of 50 mS / cm, wherein the spray time is 2 minutes and the spray pressure is 28 kg / cm 2 Finally, the glass substrate was post-baked in an oven at 150°C for 30 minutes to further solidify the photoresist. Multiple photoresist patterns with circular cross-sections appeared on one side of the glass substrate.

[0107] (2) Etch first and then remove the photoresist to obtain a large bump

[0108] An etching solution comprising the following components is provided: 35 wt % hydrofluoric acid, 15 wt % sulfuric acid and the balance water; the glass substrate treated in the above step (1) is immersed in the etching solution, and etched for 5 min while bubbling at 26° C., the etching depth is 30 μm, and then a 15 wt % NaOH solution is used to ultrasonically deplate the photoresist pattern at 80° C. to obtain Figure 2 The structure shown;

[0109] The first concave portion 12B is formed by etching the surface of the glass substrate not covered by the photoresist pattern, and a first protrusion 11A (which may be called a large protrusion) is obtained between adjacent first concave portions 12B; the cross section of the first protrusion 11A is circular, the edge bevel angle β is about 45°, and the height H is about 30 μm. The other dimensions of the first protrusion 11A and the second concave portion B are shown in the following description. Fig.10 Description.

[0110] (3) Forming an acid-resistant protective layer on the back of the glass substrate:

[0111] A 35 μm thick acid-resistant ink layer was coated on the back of the glass substrate.

[0112] (4) Forming small protrusions

[0113] Providing a frosting liquid, comprising the following components: 30 wt % of ammonium bifluoride, 10 wt % of ammonium fluorosilicate, 30 wt % of citric acid, 10 wt % of phosphoric acid, 2 wt % of barium sulfate, 2 wt % of sodium fluoride, 2 wt % of polyethylene glycol, 0.2 wt % of sodium dodecyl sulfonate, and the balance of water;

[0114] After the frosting liquid is stirred evenly, it is sandblasted by spraying onto the surface of the glass substrate where the first protrusion 11A and the first concave portion 12B are formed to perform frosting treatment, and then a 20wt% NaOH solution is used for ultrasonic stripping at 90°C for 20 minutes to remove the acid-resistant protective layer, and then it is cleaned with clean water. The frosting treatment can form a plurality of closely arranged small protrusions C on the surfaces of the first protrusion 11A and the first concave portion 12B, and the height and maximum cross-sectional width of the small protrusions C are both smaller than the first protrusion 11A.

[0115] Fig.10 The metallographic characterization diagram of the glass after frosting treatment in Example 1, the right figure is an enlarged view of a local area of ​​the left figure, Fig.10 It can be seen that the maximum cross-sectional width of the large protrusions (i.e., the first protrusions 11A) distributed on the surface of one side of the glass is in the range of 86-120μm; the interval between adjacent large protrusions is about 50-60μm; the outer periphery of the small protrusion C on the large protrusion is smooth, roughly in the shape of dots, and its maximum cross-sectional width is in the range of 6-16μm, and the height is about 2-3μm.

[0116] In addition, the roughness Ra, Rz and Rt of the glass of Example 1 were measured by using a SJ411 surface roughness meter, wherein Ra was 3.901 μm, Rz was 28.223 μm, and Rt was 1.377 μm. T 33.102μm. Z , R T The numerical value shows that the maximum protrusion height on the glass surface is about 30μm.

[0117] Example 2

[0118] A method for preparing glass. The preparation process can be found in Figure 1 , Figure 2 and Figure 5 , which differs from Example 1 in that, after the above step (2), the following treatment is performed:

[0119] The surface of the glass substrate with large protrusions is first sandblasted using a manual sandblasting machine LCL-900, and then etched again using the etching solution in step (2), so that the large protrusions and the concave surfaces between them are formed into a plurality of closely arranged small protrusions.

[0120] The small protrusions on the front side of the glass obtained in Example 2 are in the shape of a silkworm chrysalis, with a maximum cross-sectional width in the range of 10-40 μm and a height in the range of 2-10 μm.

[0121] Example 3

[0122] A method for preparing glass. The preparation process can be found in Figures 6 to 8 , including the following steps:

[0123] (1) A glass substrate having a thickness of 0.6 mm is taken and one side of the glass substrate is sandblasted to form closely arranged pointed protrusions on the surface;

[0124] In the sandblasting process, 750-mesh white corundum is used as the spray material, which is sprayed onto the glass substrate through an air gun at a gas pressure of 0.2 MPa, and the formed pointed protrusions cover the entire surface of the glass;

[0125] (2) forming a spaced photoresist pattern on the glass substrate after sandblasting: the specific process can be seen in Example 1;

[0126] (3) The glass substrate treated in step (2) was immersed in the same etching solution as in Example 1 for etching, and the etching was carried out for 5 min while bubbling at 26° C., and the etching depth was 30 μm. Then, a 20 wt % NaOH solution was used to ultrasonically strip the photoresist pattern at 90° C. to obtain Figure 8 Glass shown.

[0127] Figure 8 In the structural diagram of , the first recess 12D is formed by etching the surface of the glass substrate not covered by the photoresist pattern, and its surface has closely arranged smooth protrusions G, and a first protrusion 11E with a plurality of pointed protrusions on the surface is obtained between adjacent first recesses 12D, and the height and maximum cross-sectional width of the pointed protrusion are smaller than the first protrusion 11E. The size parameters of the first recess 12D and the first protrusion 11E are basically the same as those in Example 1.

[0128] Fig.11 This is the metallographic characterization picture of the glass obtained in Example 3. Fig.11The middle circular area is a large circular protrusion with a maximum width of 100-120μm. The spacing between adjacent large protrusions is about 60μm. The pointed protrusions on the upper surface of the large protrusions are the microscopic effects of glass after sandblasting. The maximum lateral dimension of the pointed protrusions (i.e., the bottom width) is in the range of 2-5μm, and the height is in the range of 5-10μm. There are large depressions between the large protrusions, and small pupa-like protrusions are distributed on the surface of the large depressions. The maximum cross-sectional width of the pupa-like small protrusions is in the range of 8-30μm.

[0129] In addition, the roughness Ra of the glass of Example 3 was measured to be 3.558 μm, Rz to be 25.324 μm, and R T 30.048μm. Z , R T The numerical value shows that the height of the largest protrusion on the glass surface is about 25-30μm.

[0130] Example 4

[0131] A method for preparing glass, which differs from Example 3 in that the glass obtained after step (3) is subjected to secondary etching to blunt the edges and corners of the small pointed protrusions on the large protrusions and transform them into small protrusions with rounded appearances. The parameters of the secondary etching are the same as those of step (3).

[0132] Fig.12 This is a metallographic characterization diagram of the glass obtained in Example 4. Fig.12 It can be seen that both the large protrusions and the large concave surfaces on one side of the glass have small protrusions with smooth exteriors, and the small protrusions on the large concave surface are generally wider than the small protrusions on the large protrusions.

[0133] Example 5

[0134] A method for preparing glass, which differs from Example 1 in that: the photoresist pattern is a circle with a diameter of 80 μm, and the interval between adjacent circles is 50 μm.

[0135] One side surface of the glass obtained in Example 5 is distributed with large protrusions (i.e., the first protrusion 11A) and large recesses located between adjacent large protrusions, wherein the maximum cross-sectional width W3 of the large protrusions is approximately 70 μm, the edge bevel angle β is 45°, and the height H is 15 μm; the interval W4 between adjacent large protrusions is approximately 80 μm; the small protrusions C on the surfaces of the large protrusions and large recesses are in the shape of dots, and their maximum cross-sectional width is approximately 15 μm.

[0136] Example 6

[0137] A method for preparing glass, which differs from Example 3 in that: the photoresist pattern is a circle with a diameter of 172 μm, and the interval between adjacent circles is 126 μm.

[0138] One side surface of the glass obtained in Example 6 is distributed with large protrusions (i.e., first protrusions 11A) and large concave portions located between adjacent large protrusions, wherein Fig.13 From the glass metallographic diagram, it is known that the maximum cross-sectional width W3 of the large protrusion is about 172μm, the edge bevel angle β is 30°, and the height H is about 20μm; the interval W4 between adjacent large protrusions is about 176μm; the small protrusions C on the surfaces of large protrusions and large recesses are dot-shaped, and their maximum cross-sectional width is about 12-16μm.

[0139] In order to highlight the beneficial effects of the present application, the following comparative examples are set.

[0140] Comparative Example 1

[0141] A method for preparing glass comprises the following steps:

[0142] First, an acid-resistant protective layer is provided on the back of the glass substrate, and then the front side is directly frosted with the frosting liquid of Example 1, and then polished with hydrofluoric acid.

[0143] Fig.14 This is the metallographic characterization picture of the glass obtained in Comparative Example 1. Fig.13 It can be seen that the surface of the glass obtained in Comparative Example 1 only has protrusions and concave portions between the protrusions, but the surfaces of these protrusions and concave portions do not have a secondary structure, that is, there are no closely arranged small protrusions. In addition, the protrusions of Comparative Example 1 have a small width (about 15-19 μm) and are very close to each other, about 1-2 μm.

[0144] Comparative Example 2

[0145] A method for preparing glass, which differs from Example 1 in that: in step (1), the diameter of the photoresist pattern is 8 μm, and the interval between adjacent photoresist patterns is 15 μm.

[0146] The results show that the photoresist pattern of Comparative Example 2 is smaller, and the protrusions formed by etching are also smaller. During the frosting process, the surfaces of these protrusions do not form secondary structures, but merge to form flat large protrusions. The width of these large protrusions is about 16-18μm, and the interval is about 8-10μm.

[0147] Comparative Example 3

[0148] A method for preparing glass, which differs from Example 1 in that: in step (1), the diameter of the photoresist pattern is 8 μm, and the interval between adjacent photoresist patterns is 15 μm; after etching in step (2), the photoresist pattern is not removed, and the glass substrate with the photoresist pattern is frosted and then polished with hydrofluoric acid.

[0149] It should be noted that during the frosting process, the acid-resistant photoresist pattern is hardly corroded, and the photoresist pattern still needs to be removed later. In this way, after the frosting process, only the area not covered by the photoresist pattern forms a frosted area.

[0150] In order to strongly support the beneficial effects of the present application, the following tests are now conducted on the glasses of the embodiments and comparative examples:

[0151] 1. Use BYK transmission haze meter 4725 to test the haze and transmittance of each glass;

[0152] 2. Use the friction coefficient tester MD-02 of Jinan Languang Electromechanical Technology Co., Ltd. to test the dynamic friction coefficient Ud and static friction coefficient Us of each glass surface, and 2 Under a pressure of , steel wool (Japanese brand BON STAR NO.0000) was used to perform a friction test for 2500 cycles (the friction distance for each cycle was 1 inch), and then the water drop angle of the glass was tested.

[0153] The above test results are summarized in Table 1 below.

[0154] Table 1

[0155] Test items Haze(%) Light transmittance (%) Ud Us Water drop angle (°) Example 1 63.4 84.5 0.066 0.110 123.175 Example 2 90.2 84.7 0.089 0.149 117.835 Example 3 93.9 83.4 0.087 0.147 115.835 Example 4 87.5 85.6 0.086 0.148 119.240 Example 5 68.2 83.2 0.065 0.111 122.342 Example 6 94.6 83.1 0.088 0.148 116.723 Comparative Example 1 51.1 92.1 0.051 0.087 110.745 Comparative Example 2 20.7 93.5 0.050 0.081 110.013 Comparative Example 3 30.9 91.7 0.055 0.089 110.572

[0156] It can be seen from Table 1 that the haze of the glass in the embodiments of the present application is relatively large, above 60%, some may be above 85%, or even above 90%. The light transmittance of the glass is appropriate, which may be between 80-85%, which indicates that the glass has good diffuse reflection ability and good anti-glare effect.

[0157] In addition, the dynamic friction coefficient of the glass in the embodiment of the present application is large, and its wear resistance is good. After multiple friction tests, the friction distance left on the glass surface is short, which further verifies its excellent wear resistance and scratch resistance. In addition, after multiple friction tests, the water drop angle of the glass in the embodiment of the present application is still large, above 100°, and when a finger touches the glass surface, it is not easy to leave fingerprints.

[0158] The above only expresses several exemplary embodiments of the present application, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present application, which should be regarded as the scope of protection of the present application.

Claims

1. A glass, characterized in that: A glass substrate is included, wherein a surface of one side of the glass substrate has a plurality of first protrusions distributed at intervals, two adjacent first protrusions are connected by a first recess, and the surface of the first protrusion has a plurality of first secondary structures arranged closely, the first secondary structures are protrusion-shaped, and the height and maximum cross-sectional width of the first secondary structures are both smaller than the first protrusion; the maximum cross-sectional width of the first protrusion is in the range of 80-175 μm, the interval between two adjacent first protrusions is in the range of 60-110 μm, and the height of the first protrusion is in the range of 30 μm-50 μm.

2. The glass according to claim 1, characterized in that The surface of the first recess has a plurality of closely arranged second secondary structures, and the second secondary structures are convex; wherein the outer peripheral contour line of the second secondary structures is a smooth curve.

3. The glass according to claim 2, characterized in that The cross-sectional widths of the first secondary structure and the second secondary structure gradually decrease from the glass substrate toward the first protrusion in a thickness direction.

4. The glass according to claim 3, characterized in that The outer contour line of the first secondary structure is a smooth curve.

5. The glass according to claim 4, characterized in that The maximum cross-sectional widths of the first secondary structure and the second secondary structure are both within the range of 5-16 μm, and the heights of the first secondary structure and the second secondary structure are both within the range of 1-5 μm.

6. The glass according to claim 4, characterized in that The maximum cross-sectional widths of the first secondary structure and the second secondary structure are both within the range of 8-40 μm, and the heights of the first secondary structure and the second secondary structure are both within the range of 2-15 μm.

7. The glass according to claim 3, characterized in that The first secondary structure includes a pointed protrusion.

8. The glass according to claim 7, characterized in that The maximum cross-sectional width of the pointed protrusion is in the range of 2-10 μm; the height of the pointed protrusion is in the range of 2-20 μm; The maximum cross-sectional width of the second secondary structure is in the range of 8-40 μm; the height of the second secondary structure is in the range of 2-15 μm.

9. A method for preparing glass, characterized in that: The following steps are involved: Forming a plurality of photoresist patterns distributed at intervals on the first surface of the glass substrate; wherein the photoresist patterns have a width of 80-180 μm and an interval of 50-120 μm; Using an etching solution containing hydrofluoric acid and sulfuric acid to etch the surface of the glass substrate on which the photoresist pattern is formed, so as to form a first concave portion on the surface of the glass substrate not covered by the photoresist pattern, and then removing the photoresist pattern to form a first convex portion between adjacent first concave portions, wherein the height of the first convex portion is in the range of 30 μm-50 μm, and the interval between two adjacent first convex portions is in the range of 60-110 μm; A first method or a second method is used to form a plurality of closely arranged first secondary structures on the surface of the first protrusion and a plurality of closely arranged second secondary structures on the surface of the first recess, and the heights and maximum cross-sectional widths of the first secondary structures and the second secondary structures are both smaller than those of the first protrusion; wherein the first method comprises frosting the surface of the glass substrate on which the first protrusion is formed with a frosting liquid, and before the frosting, an acid-resistant protective layer is formed on a second surface of the glass substrate away from the first surface, and after the frosting, the acid-resistant protective layer is removed; the second method comprises sandblasting the surface of the glass substrate on which the first protrusion is formed and then etching it for a second time with an etching solution containing hydrofluoric acid and sulfuric acid.

10. The preparation method according to claim 9, characterized in that: The frosting liquid comprises the following components in percentage by weight: 25-40 wt % of ammonium bifluoride, 10-15 wt % of ammonium fluorosiliconate, 20-40 wt % of citric acid, 5-10 wt % of phosphoric acid, 1.5-3 wt % of barium sulfate, 1.5-3 wt % of alkali metal fluoride, 1-3 wt % of polyethylene glycol, 0.1-0.3 wt % of sodium dodecyl sulfonate, and 15-25 wt % of water.

11. The preparation method according to claim 9, characterized in that: The etching solution comprises the following components in percentage by weight: 20-40 wt % of hydrofluoric acid, 5-15 wt % of sulfuric acid and 45-75 wt % of water.

12. The preparation method according to claim 11, characterized in that: The etching depth when forming the first recess is 30 μm-50 μm.

13. A method for preparing glass, characterized in that: The following steps are involved: Performing sandblasting on the first surface of the glass substrate so as to form a plurality of closely arranged pointed protrusions on the first surface; Forming a plurality of photoresist patterns distributed at intervals on the first surface after the sandblasting treatment; wherein the width of the photoresist patterns is 80-180 μm and the interval is 50-120 μm; The first surface of the glass substrate having the photoresist pattern formed thereon is etched by using an etching solution containing hydrofluoric acid and sulfuric acid, so as to form a first concave portion having a plurality of closely arranged second secondary structures on the surface of the glass substrate not covered by the photoresist pattern, wherein the second secondary structure is convex, and then the photoresist pattern is removed to obtain a first protrusion having a plurality of the pointed protrusions on the surface between adjacent first concave portions, wherein the height of the first protrusion is in the range of 30 μm-50 μm, and the interval between two adjacent first protrusions is in the range of 60-110 μm; wherein the height and the maximum cross-sectional width of the pointed protrusion are both smaller than the first protrusion; and the surface roughness of the first concave portion is lower than that of the first protrusion.

14. The preparation method according to claim 13, characterized in that: The mesh size of the material used in the sandblasting treatment is 150-800 meshes, and the sandblasting air pressure is 0.1Ma-0.3MPa.

15. The preparation method according to claim 13, characterized in that: The etching depth when forming the first recess is 30 μm-50 μm.

16. The preparation method according to claim 14, characterized in that: The outer surface of the second secondary structure is smooth, and the maximum cross-sectional width thereof is in the range of 8-40 μm, and the height thereof is in the range of 2-15 μm.

17. An electronic device housing, characterized in that: The electronic device housing comprises the glass as claimed in any one of claims 1 to 8, or comprises glass produced by the production method as claimed in any one of claims 9 to 12 or any one of claims 13 to 16.

Images