A semiconductor sorting apparatus and a sorting method

Abstract

The application discloses a semiconductor sorting device and a sorting method. The device comprises a main disc, a secondary disc, a test support, a vacuum suction assembly, a driving assembly and a poking assembly. The test support is arranged on the side of the secondary disc facing the main disc, and the test support can move close to or away from the secondary disc in the vertical direction. The vacuum suction assembly comprises a vacuum suction nozzle arranged on the side of the main disc facing the secondary disc. The driving assembly is arranged on the main disc and used for contacting the vacuum suction nozzle at the corresponding position to drive the vacuum suction nozzle at the corresponding position to move close to or away from the secondary disc. The poking assembly is arranged on the test support and moves close to or away from the secondary disc along with the test support. When the poking assembly moves close to or away from the secondary disc, the poking assembly can contact the driving assembly to drive the vacuum suction nozzle at the corresponding position to move close to or away from the secondary disc. The application reduces the probability of damage of semiconductor products, reduces the cost and improves the stability of material taking.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a semiconductor sorting device and sorting method. Background Technology

[0002] Currently, mainstream semiconductor sorting equipment is mainly used for testing and classifying semiconductor products. Its workflow is as follows: After the material is fed by the feeding mechanism, the main tray picks up the product through the vacuum nozzle and transfers the product to the auxiliary tray. After the auxiliary tray completes the testing of the product, the vacuum nozzle picks up the product and transfers the product back to the main tray for classification and storage.

[0003] Currently, to avoid damaging the product, the vacuum nozzle at the junction of the main and auxiliary trays must use a non-contact method for material handling, meaning the vacuum nozzle floats above the product on the auxiliary tray. The gap between the vacuum nozzle and the product must be strictly controlled. If the gap is too large, it can easily lead to unstable material handling, and to ensure stable material handling, it is usually necessary to increase the vacuum suction force, resulting in a significant increase in cost. If the gap is too small, it can easily cause interference between the vacuum nozzle and the product, posing a risk of damaging the product. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a semiconductor sorting device and sorting method that reduces the probability of semiconductor product damage, lowers costs, and improves the stability of material handling.

[0005] To solve the above-mentioned technical problems, this application adopts the following technical solution: a semiconductor sorting device, including a main disk, a secondary disk, a test support, a vacuum adsorption assembly, a drive assembly, and a toggle assembly. The main disk and the secondary disk are spaced apart in the vertical direction. The test support is disposed on the side of the secondary disk facing the main disk, and the test support can move closer to or away from the secondary disk in the vertical direction. The vacuum adsorption assembly includes a vacuum nozzle disposed on the side of the main disk facing the secondary disk. The drive assembly is disposed on the main disk and is used to contact the vacuum nozzle at a corresponding position to drive the vacuum nozzle at the corresponding position closer to or away from the secondary disk. The toggle assembly is disposed on the test support, and the toggle assembly follows the test support in moving closer to or away from the secondary disk. When moving closer to or away from the secondary disk, the toggle assembly can contact the drive assembly to drive the vacuum nozzle at the corresponding position closer to or away from the secondary disk.

[0006] Preferably, the main disk is rotatable along a first horizontal direction, and the secondary disk is rotatable along a second horizontal direction, wherein the first horizontal direction and the second horizontal direction are the same or opposite; and the driving component and the actuating component remain stationary in the first horizontal direction and the second horizontal direction; wherein, the vacuum adsorption component includes a plurality of vacuum nozzles, which are circumferentially spaced on the side of the main disk facing the secondary disk, and the secondary disk facing the main disk has a plurality of detection areas, which are circumferentially spaced on the secondary disk, and the orthographic projection of the main disk on the secondary disk overlaps with the secondary disk, wherein only one detection area and one vacuum nozzle are correspondingly arranged in the overlapping area.

[0007] Preferably, the system further includes a first sensing component for obtaining position information of the test support in the vertical direction; and in response to the test support moving away from the sub-disk, the first sensing component senses that the test support has reached a first preset position, and the vacuum suction force of the vacuum nozzle in the current overlapping area is removed; and in response to the test support moving closer to the sub-disk, the first sensing component senses that the test support has reached a second preset position, and the vacuum suction force of the vacuum nozzle in the current overlapping area is generated.

[0008] Preferably, the first preset position is the same as the second preset position.

[0009] Preferably, the driving assembly includes: a first driving member located on the side of the main disk opposite to the sub-disk; a slider located on the side of the main disk opposite to the sub-disk, fixedly connected to the driving end of the first driving member, and the first driving member being used to drive the slider to move along the vertical direction; a pressure rod passing through the slider to contact the vacuum nozzle at a corresponding position; and a retaining member fixedly connected to the pressure rod, the retaining member including a first end extending toward the sub-disk, the first end being used to contact the actuating assembly.

[0010] Preferably, the drive assembly further includes an elastic element; the slider includes a main body and an extension that forms an angle with the main body; wherein the main body is fixedly connected to the drive end, the pressure rod passes through the extension, and the elastic element is located around the pressure rod between the extension and the abutment; the actuating assembly drives the abutment and the pressure rod to slide on the slider to drive the vacuum nozzle away from the sub-disc, and makes the elastic element in an energy storage state.

[0011] Preferably, the actuating assembly includes a bracket and an actuating element that are fixedly connected. The bracket is fixedly connected to the test support, and the actuating element includes a second end that extends beyond the test support and is used to contact the first end of the abutment.

[0012] Preferably, the bracket includes a first plate and at least one adapter plate that are fixedly connected; wherein the first plate is fixedly connected to the test support, and the at least one adapter plate includes an adapter portion extending along the vertical direction, and the actuating member is detachably connected to the adapter portion.

[0013] Preferably, the system further includes a second sensing component, comprising: a second sensor for obtaining the relative positional relationship between the driving component and the sub-disc in the vertical direction; a first shielding member fixedly disposed on the driving component and extending toward the second sensor, the first shielding member moving closer to or away from the second sensor along with the driving component, and the first shielding member moving closer to the second sensor and capable of shielding the second sensor to stop its operation; a second shielding member, responding to the first sensing component sensing that the test support has reached a first preset position while the test support is moving away from the sub-disc, the second shielding member moving closer to the second sensor and capable of shielding the second sensor to stop its operation; and responding to the first sensing component sensing that the test support has reached a second preset position while the test support is moving closer to the sub-disc, the second shielding member moving away from the second sensor to start its operation; and a second driving component for driving the second shielding member to move closer to or away from the second sensor.

[0014] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a semiconductor sorting method, utilizing the semiconductor sorting equipment described in any embodiment, the semiconductor sorting method comprising: a vacuum nozzle picking up a product; a driving component contacting the vacuum nozzle at a corresponding position to drive the vacuum nozzle to move towards a sub-disk; a test support moving away from the sub-disk, and a toggle component following the test support moving away from the sub-disk; wherein, the vacuum nozzle places the product on the sub-disk, the toggle component contacting the driving component to drive the vacuum nozzle at a corresponding position away from the sub-disk; the test support moving towards the sub-disk, and the toggle component following the test support moving towards the sub-disk; wherein, the toggle component contacting the driving component to drive the vacuum nozzle at a corresponding position towards the sub-disk and pick up the product on the sub-disk.

[0015] Preferably, the step of the test support moving away from the sub-disc and the toggle assembly following the movement of the test support away from the sub-disc further includes, in response to the first sensing component sensing that the test support has reached a first preset position during the process of the test support moving away from the sub-disc, the vacuum nozzle removes the vacuum suction force; the step of the test support moving closer to the sub-disc and the toggle assembly following the movement of the test support closer to the sub-disc further includes, in response to the first sensing component sensing that the test support has reached a second preset position during the process of the test support moving closer to the sub-disc, the vacuum nozzle generates a vacuum suction force.

[0016] The beneficial effects of this application are as follows: Unlike existing technologies, the semiconductor sorting equipment of this application incorporates a toggle component on the test support. This toggle component moves closer to and further away from the sub-disk, following the movement of the test support, thereby sequentially driving the drive component and vacuum nozzle closer to and further away from the sub-disk. When the vacuum nozzle does not need to pick up products, the toggle component moves the drive component and vacuum nozzle away from the sub-disk, reducing the probability of collision between the vacuum nozzle and the product and lowering the risk of product damage. When the main disk needs to pick up products, the vacuum nozzle is driven closer to the sub-disk to quickly pick up the product, ensuring stable product picking without requiring excessive vacuum, thus reducing costs. Because this application utilizes the original movement of the test support component to detect the products on the sub-disk, no program modification is required, resulting in a stable mechanism and low cost. The semiconductor sorting method of this application reduces the probability of semiconductor product damage, lowers costs, and improves the stability of material handling. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of one embodiment of the semiconductor sorting device of this application;

[0018] Figure 2 This is a top view of one embodiment of the main disk and sub-disk of this application;

[0019] Figure 3 This is a schematic diagram of the structure of one embodiment of the first sensing component of this application;

[0020] Figure 4 This is a schematic diagram of the structure of one embodiment of the driving component of this application;

[0021] Figure 5 This is a schematic diagram of one embodiment of the toggle component of this application;

[0022] Figure 6 This is a schematic diagram of the structure of an embodiment of the second sensing component of this application;

[0023] Figure 7 This is a flowchart illustrating one embodiment of the semiconductor sorting method of this application. Detailed Implementation

[0024] To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description is provided with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] Please see Figure 1 , Figure 1 This is a schematic diagram of one embodiment of the semiconductor sorting device of this application. The semiconductor sorting device includes:

[0026] The main disk 1 and the auxiliary disk 2 are arranged at intervals in the vertical direction (X direction in the figure);

[0027] The test support 21 is located on the side of the sub-disk 2 facing the main disk 1, and the test support 21 can move closer to or further away from the sub-disk 2 in the vertical direction.

[0028] The vacuum adsorption assembly includes a vacuum nozzle 11, which is disposed on the side of the main disk 1 facing the auxiliary disk 2.

[0029] The drive component 3 is disposed on the main disk 1 and is used to contact the vacuum nozzle 11 at the corresponding position to drive the vacuum nozzle 11 at the corresponding position to move closer to or away from the auxiliary disk 2.

[0030] The actuating component 5 is disposed on the test support 21. The actuating component 5 moves closer to or further away from the sub-disc 2 following the test support 21. When the actuating component 5 moves closer to or further away from the sub-disc 2, it can contact the driving component 3 to drive the vacuum nozzle 11 at the corresponding position to move closer to or further away from the sub-disc 2.

[0031] Semiconductor sorting equipment is used to exchange sorted products between a main tray 1 and a secondary tray 2. The main tray 1 picks up products via a vacuum nozzle 11 and transfers them to the secondary tray 2. A test support 21 is used to mount a test device (not shown in the figure) and passes it along a vertical direction (…). Figure 1 The test device moves closer to or further away from the secondary plate 2 in the X direction to complete the test on the product on the secondary plate 2. After the test is completed, the vacuum nozzle 11 adsorbs the product and transfers the product back to the main plate 1 for sorting and storage.

[0032] This application incorporates a toggle component 5 on the test support 21. The toggle component 5 moves closer to and further away from the sub-disk 2, following the movement of the test support 21. This, in turn, drives the drive component 3 and the vacuum nozzle 11 to move closer to and further away from the sub-disk 2. When the vacuum nozzle 11 does not need to pick up products, the toggle component 5 moves the drive component 3 and the vacuum nozzle 11 away from the sub-disk 2, reducing the probability of collisions between the vacuum nozzle 11 and the product, and lowering the risk of product damage. When the main disk 1 needs to pick up products, the vacuum nozzle 11 is driven closer to the sub-disk 2 to quickly pick up the product. Stable product picking can be ensured without excessive vacuum, thus reducing costs. Because this application utilizes the original movement of the test support 21, which was used to detect the movement of products on the sub-disk 2 closer to and further away from the sub-disk 2, no program modification is required, resulting in a stable mechanism and low cost.

[0033] Optionally, in some embodiments, see [reference] Figure 2 , Figure 2 This is a top view of one embodiment of the main disk and sub-disk of this application. The main disk 1 can be moved along a first horizontal direction ( Figure 1 Rotating in the middle A direction, the secondary disk 2 can rotate along the second horizontal direction ( Figure 1 Rotate in the B direction, with the first and second horizontal directions being the same. Figure 1 (All are counterclockwise) or the opposite; and the drive component 3 and the toggle component 5 remain stationary in the first horizontal direction and the second horizontal direction; wherein, the vacuum adsorption component includes a plurality of vacuum nozzles 11, the plurality of vacuum nozzles 11 are arranged at intervals along the circumference of the main disk 1 on the side of the main disk 1 facing the sub-disk 2, the sub-disk 2 is provided with a plurality of detection areas 22 on the side of the sub-disk 2 facing the main disk 1, the detection areas 22 are arranged at intervals along the circumference of the sub-disk 2, and the orthographic projection of the main disk 1 on the sub-disk 2 overlaps with the sub-disk 2 in an overlapping area C, and only one detection area 22 and a vacuum nozzle 11 are provided in the overlapping area C.

[0034] By setting multiple vacuum nozzles 11 on the main disk 1 and multiple detection zones 22 on the auxiliary disk 2, the detection efficiency of the equipment is increased to process multiple products simultaneously, and the handover efficiency between the main disk 1 and the auxiliary disk 2 is also improved. After the main disk 1 picks up the product, it rotates one unit along the first horizontal direction, causing the vacuum nozzle 11 to rotate to the overlapping area C. After placing the product in the detection zone 22 of the auxiliary disk 2 located in the overlapping area C, the auxiliary disk 2 rotates one unit along the second horizontal direction to leave the overlapping area C, and the next detection zone 22 located in the overlapping area C corresponds to the vacuum nozzle 11.

[0035] Optionally, in some embodiments, refer to... Figure 1It also includes a first sensing component 4 for obtaining the position information of the test support 21 in the vertical direction; and in response to the test support 21 moving away from the sub-disk 2, the first sensing component 4 senses that the test support 21 has reached a first preset position, and the vacuum suction force of the vacuum nozzle 11 in the current overlapping area C is removed; and in the process of the test support 21 approaching the sub-disk 2, the first sensing component 4 senses that the test support 21 has reached a second preset position, and the vacuum suction force of the vacuum nozzle 11 in the current overlapping area C is generated.

[0036] During the process of the test support 21 and the actuating component 5 moving away from the sub-disk 2 (i.e., rising), when the test support 21 and the sub-disk 2 reach a certain distance, the vacuum suction force of the vacuum nozzle 11 located in the current overlapping area C is removed, preventing the product from being attracted by the vacuum nozzle 11 as it is carried away from the sub-disk 2 by the actuating component 5 and the driving component 3, ensuring that the product remains on the sub-disk 2; during the process of the test support 21 and the actuating component 5 approaching the sub-disk 2 (i.e., falling), when the test support 21 and the sub-disk 2 reach a certain distance, the vacuum suction force of the vacuum nozzle 11 located in the current overlapping area C is regenerated, causing the product to be attracted by the vacuum nozzle 11 as it is driven closer to the sub-disk 2 by the actuating component 5 and the driving component 3.

[0037] Specifically, the first preset position is the same as the second preset position.

[0038] Specifically, see Figure 3 , Figure 3 This is a schematic diagram of an embodiment of the first sensing component 4 of this application. The first sensing component 4 includes a first sensor 41, a first sensing element 42, and a support plate 43. The first sensor 41 is fixedly mounted on the test support member 21. The support plate 43 is provided with a mounting groove 431 extending in the vertical direction. The first sensing element 42 is detachably connected to the mounting groove 431 and is configured to correspond to the movement path of the first sensor 41.

[0039] Specifically, the support plate 43 is stationary in both the vertical and horizontal directions. The first sensor 41, which can be a proximity sensor, extends outward from the test support 21 and senses position via a non-contact sensor. As the test support 21 moves away from the sub-disk 2, when the first sensor 41 reaches a first preset position corresponding to the position of the first sensing element 42 (there is a gap between the first sensor 41 and the first sensing element 42), the first sensor 41 transmits a signal to a switch to remove the vacuum suction force of the vacuum nozzle 11. The switch can be a solenoid valve. As the first sensor 41 moves closer to the sub-disk 2, when the first sensor 41 reaches a second preset position corresponding to the position of the first sensing element 42, the first sensor 41 transmits a signal to a switch to activate the vacuum suction force of the vacuum nozzle 11. Since the position of the first sensing element 42 on the mounting groove 431 is adjustable, the first and second preset positions can be adjusted according to actual conditions to ensure the accuracy of the signal output timing.

[0040] Optionally, see Figure 4 , Figure 4 In some embodiments of this application, the driver component 3 includes:

[0041] The first drive component 31 is located on the side of the main disk 1 opposite to the auxiliary disk 2;

[0042] The slider 32 is located on the side of the main disk 1 away from the secondary disk 2 and is fixedly connected to the driving end of the first driving member 31. The first driving member 31 is used to drive the slider 32 to move in the vertical direction.

[0043] The pressure rod 33 passes through the slider 32 so as to contact the vacuum nozzle 11 at the corresponding position;

[0044] The abutment 34 is fixedly connected to the pressure rod 33. The abutment 34 includes a first end extending toward the sub-disc 2, which is used to contact the toggle assembly 5.

[0045] Specifically, the first driving component 31 can be a cylinder. The first driving component 31 is fixed to the fixing plate 36 via a cylinder fixing plate 361. The fixing plate 36 is relatively stationary in the vertical and horizontal directions. The piston rod of the cylinder is set vertically downward. The bottom end of the piston rod is fixedly connected to the slider 32 as the driving end. The slider 32 slides in the vertical direction, thereby driving the pressure rod 33 to move in the vertical direction. When the first driving component 31 drives the slider 32 to move towards the main plate 1 (i.e. downward), the slider 32 drives the pressure rod 33 and the abutment 34 to move downward, thereby contacting and pressing down the vacuum nozzle 11, making it closer to the sub-plate 2. When the actuating component 5 moves away from the sub-plate 2 (i.e. upward), the actuating component 5 contacts the first end of the abutment 34, thereby driving the abutment 34 and the pressure rod 33 to move upward. At this time, the pressure rod 33 drives the vacuum nozzle 11 away from the sub-plate 2.

[0046] In some other embodiments, two abutment members 34 can be arranged at intervals along the vertical direction, and the actuating component 5 is arranged between the two abutment members 34. When the actuating component 5 approaches and moves away from the sub-disc 2, it can drive the lower and upper abutment members 34 to rise and fall, thereby driving the pressure rod 33 to rise and fall.

[0047] Optionally, the drive assembly 3 further includes an elastic element 35; the slider 32 includes a main body and an extension 321 that forms an angle with the main body; wherein the main body is fixedly connected to the drive end, the pressure rod passes through the extension 321, and the elastic element is located on the periphery of the pressure rod between the extension and the abutment; wherein the actuating assembly 5 drives the abutment 34 and the pressure rod 33 to slide on the slider 32 to drive the vacuum nozzle 11 away from the sub-disk 2, and makes the elastic element 35 in an energy storage state.

[0048] When the pressure rod 33 is lifted, it slides on the extension 321. The two ends of the elastic member 35 abut against the extension 321 and the supporting member 34 respectively. After being compressed, the elastic member 35 is in an energy storage state. When the subsequent actuating component 5 moves downward, the elastic member 35 releases energy to drive the pressure rod 33 back to its original position.

[0049] Optionally, the vacuum nozzle 11 is slidably disposed on the main disk 1 in the vertical direction, and a second elastic element 12 is disposed between the vacuum nozzle 11 and the main disk 1. When the vacuum nozzle 11 is pressed down by the pressure rod 33, the second elastic element 12 is compressed and stores energy. When the pressure rod 33 is lifted away from the auxiliary disk 2, the second elastic element 12 releases energy and drives the vacuum nozzle 11 to lift up.

[0050] Optionally, see Figure 5 , Figure 5 This is a schematic diagram of one embodiment of the toggle assembly 5 of this application. The toggle assembly 5 includes a bracket and a toggle member 51 that are fixedly connected, such as... Figure 1 As shown, the bracket is fixedly connected to the test support 21, and the actuating member 51 includes a second end extending beyond the test support 21, as shown in the figure. Figure 3 As shown, the second end is used to contact the first end of the abutment 34, and the actuating member 51 is used to actuate the abutment 34 to drive the pressure rod 33 to move.

[0051] Optionally, the bracket includes a first plate 54 and at least one adapter plate that are fixedly connected; wherein the first plate 54 is fixedly connected to the test support 21, and at least one adapter plate includes an adapter portion extending in a vertical direction, and the actuating member 51 is detachably connected to the adapter portion.

[0052] For details, please refer to [link / reference]. Figure 5The first plate 54 extends horizontally. The adapter plate includes a first adapter plate 52 and a second adapter plate 53, both L-shaped. The first adapter plate 52 includes a first adapter portion 521 extending vertically, and the first adapter portion 521 includes a groove extending vertically. The second adapter plate 53 can be adjusted in its vertical position by moving on the groove to adjust the distance between the actuating member 51 and the supporting member 34, thereby controlling the upward movement of the pressure rod 33. The actuating member 51 can be adjusted in its relative position to the second adapter plate 53 in the horizontal direction to adjust the distance by which the actuating member 51 extends beyond the test support member.

[0053] Optionally, see Figure 1 and Figure 6 , Figure 6 This is a schematic diagram of one embodiment of the second sensing component 6 of this application. The sorting device of this application also includes the second sensing component 6.

[0054] The second sensing component 6 includes:

[0055] The second sensor 61 is used to obtain, for example, Figure 1 The relative positional relationship between the drive assembly 3 and the sub-disk 2 in the vertical direction is shown; specifically, the second sensor 61 can be a photoelectric display, fixed on the first fixed plate 65, which is stationary in both the vertical and horizontal directions.

[0056] First shielding component 62, such as Figure 4 As shown, it is fixedly mounted on the drive assembly 3 and directs power to the second sensor ( Figure 4 (Not shown in the image) Extending, the first shield 62 moves closer to or further away from the second sensor following the movement of the drive assembly 3, and the first shield 62 moves closer to the second sensor and can shield the second sensor to stop it from working; specifically, the first shield 62 can be a plate-like structure and is fixed to the first end of the abutment 34. When the first shield 62 moves closer to the main plate 1 and shields the second sensor 61, it indicates that the pressure rod 33 is pressed down smoothly. When the first shield 62 cannot shield the second sensor 61, it indicates that the pressure rod 33 cannot be pressed down smoothly and a jamming problem occurs. The second sensor 61 can be connected to a jamming alarm.

[0057] The second shield 63 is activated when the first sensing component 4 senses that the test support 21 has reached a first preset position as the test support 21 moves away from the sub-disk 2; and when the first sensing component 4 senses that the test support 21 has reached a second preset position as the test support 21 moves away from the second sensor 61.

[0058] The second driving element 64 is used to drive the second shield 63 to move closer to or away from the second sensor 61.

[0059] Specifically, the second shield 63 is driven by the second drive 64, which can be a cylinder. The cylinder can be fixed horizontally on the second fixed plate 66, which is stationary in both the vertical and horizontal directions. The drive end of the cylinder is fixedly connected to the second shield 63. Since the first shield 62 is fixed on the drive assembly 3, when the first sensing assembly 4 senses that the test support 21 has reached the first preset position, the actuating assembly 5 drives the drive assembly 3 away from the sub-disc 2, and the first shield 62 will also move away from the second sensor 61, which may easily lead to a false alarm from the jamming sensor. To avoid false alarms, while the first shield 62 is moving away from the second sensor 61, the cylinder drives the second shield 63 horizontally to shield the second sensor 61, so as to keep the second sensor 61 shielded. When the first sensing assembly 4 senses that the test support 21 has reached the second preset position, while the first shield 62 is approaching the second sensor 61, the cylinder drives the second shield 63 horizontally to move away from the second sensor 61, so as to activate the jamming alarm function. Furthermore, since the first sensing component 4 is coupled to the second sensing component 6, when the first sensing component 4 senses that the test support 21 has reached the first preset position, the removal of the vacuum suction force in the vacuum nozzle 11 and the shielding of the second sensor 61 by the second shielding component 63 occur simultaneously. Similarly, when the first sensing component 4 senses that the test support 21 has reached the second preset position, the generation of the vacuum suction force in the vacuum nozzle 11 and the removal of the second shielding component 63 from the second sensor 61 also occur simultaneously. The movement of multiple components can be controlled simultaneously by the first sensing component 4, ensuring smooth coordination among the components while simplifying the equipment structure.

[0060] Please see Figure 7 , Figure 7 This is a schematic flowchart of one embodiment of the semiconductor sorting method of this application. The method utilizes any of the semiconductor sorting devices described in the embodiments, including:

[0061] Step S101: Vacuum nozzle 11 picks up the product;

[0062] Step S102: The drive component 3 contacts the vacuum nozzle 11 at the corresponding position to drive the vacuum nozzle 11 to move towards the sub-disk 2;

[0063] Step S103: The test support 21 moves away from the sub-disk 2, and the actuating component 5 follows the test support 21 away from the sub-disk 2; wherein, the vacuum nozzle 11 places the product on the sub-disk 2, and the actuating component 5 contacts the driving component 3 to drive the vacuum nozzle 11 at the corresponding position away from the sub-disk 2.

[0064] Step S104: The test support 21 moves toward the sub-disc 2, and the actuating component 5 moves toward the sub-disc 2 following the test support 21; wherein, the actuating component 5 contacts the driving component 3 to drive the vacuum nozzle 11 at the corresponding position to approach the sub-disc 2 and pick up the product on the sub-disc 2.

[0065] Specifically, in combination Figure 1 and Figure 2 As shown, in step S102, the driving component 3 contacts the vacuum nozzle 11 of the overlapping area C and approaches the sub-disk 2; in step S103, after the vacuum nozzle 11 places the product in the detection area 22 of the overlapping area C of the sub-disk 2, the actuating component 5 drives the vacuum nozzle 11 away from the sub-disk 2; in step S104, the sub-disk 2 rotates along the second horizontal direction, and after the next detection area 22 rotates into the overlapping area C, the actuating component 5 drives the vacuum nozzle 11 to approach the sub-disk 2 to pick up the next product from the sub-disk 2 and return it to the main disk 1. After the driving component 3 drives the vacuum nozzle 11 away from the sub-disk 2, the main disk 1 rotates along the first horizontal direction, and the product on the next vacuum nozzle 11 of the main disk 1 moves into the overlapping area C to complete the exchange of products on the main disk 1 and the sub-disk 2.

[0066] This application, by setting up a toggle component 5, allows the vacuum nozzle 11 to move away from the secondary disk 2 after the main disk 1 places a product onto the secondary disk 2, without needing to pick up the product. The toggle component 5 drives the drive component 3 and the vacuum nozzle 11 away from the secondary disk 2. This reduces the probability of collision between the vacuum nozzle 11 and the product when the secondary disk 2 rotates, lowering the risk of product damage. When the secondary disk 2 rotates and the next product corresponds to the vacuum nozzle 11 on the main disk 1, the vacuum nozzle 11 is driven closer to the secondary disk 2 to quickly pick up the product. Stable product picking can be ensured without excessive vacuum, thus reducing costs. Since this application utilizes the test support 21 originally used to detect the movement of the product on the secondary disk 2 towards and away from the secondary disk 2, no program modification is required, the mechanism is stable, and the cost is low.

[0067] Optionally, step S103 further includes, in response to the first sensing component 4 sensing that the test support 21 has reached a first preset position as the test support 21 moves away from the sub-disk 2, the vacuum nozzle 11 removes the vacuum suction force; optionally, while the vacuum nozzle 11 removes the vacuum suction force, the second sensor 61 is shielded by the second shield 63.

[0068] Before the actuating component 5 moves the vacuum nozzle 11 away from the sub-disk 2, it prevents the vacuum nozzle 11 from adsorbing the product on the sub-disk 2, and further, it prevents the second sensor 61 from generating a false alarm due to the lifting of the driving component 3.

[0069] Optionally, step S104 further includes, in response to the test support 21 approaching the sub-disk 2, the first sensing component 4 senses that the test support 21 has reached the second preset position, and the vacuum nozzle generates a vacuum suction force; optionally, at the same time that the vacuum nozzle 11 generates a vacuum suction force, the second sensor 61 is unshielded.

[0070] Before the actuating component 5 moves the vacuum nozzle 11 close to the auxiliary disk 2, the vacuum nozzle 11 regains its suction force, and further, the jamming detection function of the second sensor 61 is restored. The timing of vacuum nozzle 11 breaking and restoring vacuum, as well as the opening and closing of the jamming shielding function, are reasonably coordinated with the lifting and lowering motion of the actuating component 5. The equipment operates stably, is low in cost, and greatly improves production efficiency and equipment utilization.

[0071] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A semiconductor handler, characterized by, The application relates to a test device, comprising: a main disc and a sub-disc which are arranged in a vertical direction, the main disc being capable of rotating in a first horizontal direction, and the sub-disc being capable of rotating in a second horizontal direction, the first horizontal direction and the second horizontal direction being the same or opposite; a test support arranged on a side of the sub-disc facing the main disc, the test support being capable of moving towards or away from the sub-disc in the vertical direction; a vacuum suction assembly comprising a vacuum suction nozzle arranged on a side of the main disc facing the sub-disc, wherein the vacuum suction assembly comprises a plurality of vacuum suction nozzles arranged on the side of the main disc facing the sub-disc in a circumferential direction of the main disc, a plurality of detection zones are arranged on a side of the sub-disc facing the main disc in a circumferential direction of the sub-disc, and a projection of the main disc on the sub-disc has an overlapping area with the sub-disc, only one detection zone and one vacuum suction nozzle being arranged in the overlapping area; a driving assembly arranged on the main disc and capable of contacting the vacuum suction nozzle at a corresponding position to drive the vacuum suction nozzle at the corresponding position to move towards or away from the sub-disc; a dialing assembly arranged on the test support, the dialing assembly moving towards or away from the sub-disc along with the test support, and the dialing assembly being capable of contacting the driving assembly to drive the vacuum suction nozzle at a corresponding position to move towards or away from the sub-disc when the dialing assembly moves towards or away from the sub-disc, and the driving assembly and the dialing assembly remaining stationary in the first horizontal direction and the second horizontal direction; a first sensing assembly for obtaining position information of the test support in the vertical direction, and in response to the first sensing assembly sensing that the test support reaches a first preset position during movement of the test support away from the sub-disc, vacuum suction of the vacuum suction nozzle in the current overlapping area is removed, and in response to the first sensing assembly sensing that the test support reaches a second preset position during movement of the test support towards the sub-disc, vacuum suction of the vacuum suction nozzle in the current overlapping area is generated; a second sensing assembly, the second sensing assembly comprising: a second sensor for obtaining relative position relationship between the driving assembly and the sub-disc in the vertical direction; a first shielding member fixedly arranged on the driving assembly and extending towards the second sensor, the first shielding member moving towards or away from the second sensor along with the driving assembly, and the first shielding member being capable of shielding the second sensor to stop working when the first shielding member moves towards the second sensor. a second shielding member, which is moved to be close to the second sensor and shields the second sensor to stop working in response to the first sensing assembly sensing that the test support reaches the first preset position during the test support moving away from the secondary disc, and which is moved to be away from the second sensor to start working in response to the first sensing assembly sensing that the test support reaches the second preset position during the test support moving close to the secondary disc; a second driving member for driving the second shielding member to be close to or away from the second sensor.

2. The semiconductor sorting device according to claim 1, wherein the first preset position is consistent with the second preset position. The driving assembly comprises:

3. The semiconductor handler of claim 1, wherein, a first driving member located on the side of the primary disc away from the secondary disc; a sliding block located on the side of the primary disc away from the secondary disc and fixedly connected with the driving end of the first driving member, and the first driving member is used for driving the sliding block to move along the vertical direction; a pressing rod penetrating through the sliding block to contact the vacuum suction nozzle at the corresponding position; a supporting member fixedly connected with the pressing rod, and the supporting member comprises a first end portion extending towards the secondary disc, and the first end portion is used for contacting the poking assembly.

4. The semiconductor sorting device according to claim 3, wherein the driving assembly further comprises an elastic member; the sliding block comprises a main body portion and an extension portion at an angle with the main body portion; wherein the main body portion is fixedly connected with the driving end, the pressing rod penetrates through the extension portion, and the elastic member is located at the periphery of the pressing rod between the extension portion and the supporting member, and the poking assembly drives the supporting member and the pressing rod to slide on the sliding block to drive the vacuum suction nozzle to move away from the secondary disc, and the elastic member is in an energy storage state.

5. The semiconductor sorting device according to claim 3, wherein the poking assembly comprises a fixedly connected support and a poking member, the support is fixedly connected with the test support, and the poking member comprises a second end portion beyond the test support, and the second end portion is used for contacting the first end portion of the supporting member.

6. The semiconductor sorting device according to claim 5, wherein the support comprises a fixedly connected first plate body and at least one adapter plate; wherein the first plate body is fixedly connected with the test support, and the at least one adapter plate comprises an adapter portion extending along the vertical direction, and the poking member is detachably connected with the adapter portion. The semiconductor sorting method using the semiconductor sorting device according to any one of claims 1-6 comprises: the vacuum suction nozzle sucking the product; the driving assembly contacting the vacuum suction nozzle at the corresponding position to drive the vacuum suction nozzle to move towards the secondary disc; the test support moving away from the secondary disc, and the poking assembly moving away from the secondary disc along with the test support; wherein the vacuum suction nozzle places the product on the secondary disc, and the poking assembly contacts the driving assembly to drive the vacuum suction nozzle at the corresponding position to move away from the secondary disc.

7. A semiconductor sorting method characterized by, ​ ​ ​ ​ The test support moves towards the sub-disc, and the poking assembly moves towards the sub-disc following the test support; wherein the poking assembly is in contact with the driving assembly to drive the vacuum suction nozzle at the corresponding position to move towards the sub-disc and suck the product on the sub-disc.

8. The semiconductor sorting method of claim 7, wherein, The test support moves away from the sub-disc, and the poking assembly moves away from the sub-disc following the test support; wherein the vacuum suction nozzle releases the vacuum suction force in response to the first sensing assembly sensing that the test support reaches a first preset position during the movement of the test support away from the sub-disc. The test support moves towards the sub-disc, and the poking assembly moves towards the sub-disc following the test support; wherein the vacuum suction nozzle generates the vacuum suction force in response to the first sensing assembly sensing that the test support reaches a second preset position during the movement of the test support towards the sub-disc.

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