Micro-electromechanical multi-axis angular velocity sensor

Abstract

A micro-electro-mechanical multi-axis angular velocity sensor includes a substrate and a micro-electro-mechanical wafer layer disposed in parallel opposition to the substrate, and a plurality of fixed anchors connecting the micro-electro-mechanical wafer layer to the substrate. The micro-electro-mechanical wafer layer includes at least two drive and sense structures, a third drive ring, and two oscillating masses. Each drive and sense structure includes a drive ring, a plurality of drive comb-finger pairs, and a plurality of sense verification masses, the plurality of drive comb-finger pairs and the plurality of sense verification masses being connected to the corresponding drive ring. The third drive ring is disposed between and connected to the two drive rings, wherein, in a drive mode, the plurality of drive comb-finger pairs drive the corresponding drive rings to perform periodic rotational motion, and the two drive rings drive the third drive ring to perform periodic rotational motion. The two oscillating masses are connected to the third drive ring and located on opposite sides of the third drive ring.

Description

Technical Field

[0001] This invention relates to the field of microelectromechanical systems (MEMS) for detecting angular velocity, and more particularly to the field of a multi-axis angular velocity sensor for MEMS. Background Technology

[0002] Microelectromechanical systems (MEMS) are mechanical and electromechanical systems with some components possessing mechanical functionality, enabling rapid and accurate detection of minute changes in physical properties. For example, MEMS angular velocity sensors can be used to detect minute angular displacements. Of the six degrees of freedom of motion, rotation about three orthogonal axes can be measured by angular velocity sensors. MEMS angular velocity sensors use the Coriolis effect to measure angular rate. If a mass moves in one direction and is subjected to an angle of rotation, the mass experiences a force in the orthogonal direction due to the Coriolis force. The displacement caused by the Coriolis force can be read by capacitive, piezoelectric, or piezoresistive sensing structures. In MEMS angular velocity sensors, mechanical oscillation is used as the primary motion. When an oscillating angular velocity sensor experiences an angular motion perpendicular to the direction of the primary motion, a secondary oscillation (or detected motion) is generated in a third perpendicular direction to both the primary and angular motions. The amplitude of the detected motion can be used as the measured value of the angular rate.

[0003] The conventional MEMS triaxial angular velocity sensor structure consists of three independent X, Y, and Z single-axis angular velocity sensors, requiring the corresponding ASIC circuit to have three independent drive circuit designs, resulting in a large size for the MEMS triaxial angular velocity sensor. To address the issue of excessive size, a shared mass block design emerged; however, the shared mass block is subject to motion interference, causing inter-axis signal crosstalk in the MEMS triaxial angular velocity sensor. Therefore, a solution that addresses the issue of excessive size in MEMS triaxial angular velocity sensors while maintaining sensing quality remains a pursuit in the industry. Summary of the Invention

[0004] The present invention provides a MEMS multi-axis angular velocity sensor, wherein at least two axes have their own independent drive structures and mass blocks, and the two drive structures are linked by a third drive structure to synchronize their movement, thereby reducing the generation of asynchronous oscillation timing and amplitude differences between the two axes.

[0005] The present invention provides a MEMS multi-axis angular velocity sensor, having at least two axes with their own independent drive structures and mass blocks, and a design that synchronizes the movement of the oscillating mass blocks on the linkage structure through a third drive structure, stores the mechanical oscillation energy of the detection mass blocks, and uses a coupling structure to stabilize the connection structure to reduce unnecessary directional vibrations, and makes the motion tendency of the oscillating mass blocks generated by the Coriolis force synchronized with the opposite phase.

[0006] A microelectromechanical multi-axis angular velocity sensor includes a substrate and a microelectromechanical wafer layer disposed parallel to each other, and a plurality of fixing anchors connecting the microelectromechanical wafer layer to the substrate for fixing. The microelectromechanical wafer layer comprises: a first driving and sensing structure, including a first driving ring, a plurality of first driving comb pairs, and a plurality of first sensing verification mass blocks, wherein the plurality of first driving comb pairs and the plurality of first sensing verification mass blocks are respectively connected to the first driving ring; and a second driving and sensing structure, including a second driving ring, a plurality of second driving comb pairs, and a plurality of second sensing verification mass blocks, wherein the plurality of second driving... The comb pair structure and the plurality of second sensing verification mass blocks are respectively connected to the second drive ring; a third drive ring is disposed between the first drive ring and the second drive ring and connected to the first drive ring and the second drive ring, wherein, in a driving mode, the plurality of first drive comb pair structures drive the first drive ring to perform periodic rotational motion, the plurality of second drive comb pair structures drive the second drive ring to perform periodic rotational motion, and the first drive ring and the second drive ring drive the third drive ring to perform periodic rotational motion; and two oscillating mass blocks are respectively connected to the third drive ring and located on opposite sides outside the third drive ring.

[0007] A microelectromechanical multi-axis angular velocity sensor includes: a substrate comprising a plurality of first sensing pads and a plurality of second sensing pads, the substrate being parallel to a plane defined by a first axis and a second axis; a first driving and sensing structure disposed on the substrate, the first driving and sensing structure comprising a first driving ring connecting a plurality of first driving comb pairs and two first sensing verification mass blocks, wherein the plurality of first sensing verification mass blocks respectively correspond to the plurality of first sensing pads to form a first differential capacitor pair for detecting Coriolis force in a third axis direction, the plurality of first sensing verification mass blocks being symmetrically arranged about the second axis, the third axis direction being perpendicular to the first axis and the second axis; and a second driving and sensing structure disposed on the substrate, the second driving and sensing structure comprising a second driving ring connecting a plurality of second driving comb pairs and two second sensing verification mass blocks, wherein the plurality of second sensing verification mass blocks respectively correspond to the plurality of second sensing pads to form a second differential capacitor pair for detecting Coriolis force in a third axis direction. The plurality of second sensing verification mass blocks are symmetrically arranged about the first axis; a third drive ring is disposed between and connected to the first drive ring and the second drive ring, wherein, in a driving mode, the plurality of first drive combs drive the first drive ring to perform periodic rotational motion, the plurality of second drive combs drive the second drive ring to perform periodic rotational motion, and the first drive ring and the second drive ring drive the third drive ring to perform periodic rotational motion; in a sensing mode, the first drive and sensing structure serves as the sensing structure of the first axis, and the second drive and sensing structure serves as the sensing structure of the second axis; two swinging mass blocks are respectively connected to the third drive ring and located on opposite sides outside the third drive ring; and a first coupling structure is disposed around the first drive and sensing structure, the second drive and sensing structure and the two swinging mass blocks, wherein each swinging mass block is connected to the third drive ring and the first coupling structure.

[0008] Therefore, a microelectromechanical multi-axis angular velocity sensor includes a substrate and a microelectromechanical wafer layer arranged parallel to each other, and multiple anchors connecting the microelectromechanical wafer layer to the substrate for fixation. The microelectromechanical wafer layer includes at least two driving and sensing structures, a third driving ring, and two oscillating mass blocks. Each driving and sensing structure includes a driving ring, multiple driving comb pairs, and multiple sensing verification mass blocks, each connected to its corresponding driving ring. The third driving ring is disposed between and connected to the two driving rings. In a driving mode, the multiple driving comb pairs drive the corresponding driving ring to perform periodic rotational motion, and the two driving rings drive the third driving ring to perform periodic rotational motion. The two oscillating mass blocks are respectively connected to the third driving ring and located on opposite sides of the third driving ring. Attached Figure Description

[0009] Figure 1 This is a front view of a first biaxial embodiment of the multi-axis angular velocity sensor of the present invention.

[0010] Figure 2 This is a front view of the first driving and sensing structure of the first biaxial embodiment of the present invention.

[0011] Figure 3 This is a front view of the second driving and sensing structure in the first biaxial embodiment of the present invention.

[0012] Figure 4 This is a front view of a second biaxial embodiment of the multiaxial angular velocity sensor of the present invention.

[0013] Figure 5 This is a front view of a third biaxial embodiment of the multi-axis angular velocity sensor of the present invention.

[0014] Figure 6 This is a front view of a first triaxial embodiment of the multi-axis angular velocity sensor of the present invention.

[0015] Figure 7 This is a front view of the third driving and sensing structure in the first triaxial embodiment of the present invention.

[0016] Figure 8 This is a partial front view of the structure of a first triaxial embodiment of the multi-axis angular velocity sensor of the present invention.

[0017] Figure 9 This is a front view of the second driving and sensing structure in the first triaxial embodiment of the present invention.

[0018] Figure 10 Based on Figure 9 A cross-sectional view of the second drive and sensing structure cut along AA'.

[0019] Figure 11 Based on Figure 9 Another cross-sectional view of the second drive and sensing structure cut along AA'.

[0020] Figure 12 This is a front view of the first driving and sensing structure of the first triaxial embodiment of the present invention.

[0021] Figure 13 Based on Figure 12 A cross-sectional view of the first drive and sensing structure cut along BB'.

[0022] Figure 14 Based on Figure 12 A cross-sectional view of the first drive and sensing structure cut along BB'.

[0023] Figure 15 This is a front view of the third drive and sensing structure of the first triaxial embodiment of the present invention when it is subjected to Coriolis force and moves.

[0024] Figure 16 This is a partial front view of the structure of the first triaxial embodiment of the present invention.

[0025] Figure 17 This is a front view of a second triaxial embodiment of the multi-axis angular velocity sensor of the present invention.

[0026] Figure 18 This is a front view of the third triaxial embodiment of the multi-axis angular velocity sensor of the present invention.

[0027] Explanation of reference numerals in the attached figures

[0028] 10', 10, 40, 40' First driving and sensing structure

[0029] 11,41 First driving ring

[0030] 12,12',14,14' First sensing verification mass block

[0031] 13,15 First drive comb pair structure

[0032] 13a, 13b, 15a, 15b, 33a, 33b, 35a, 35b electric comb

[0033] 131,151,181,331,351,381,581,981 Movable electrode plates

[0034] 133,153,183,333,353,383,583,983 Fixed electrode plates

[0035] 16 First sensing spring structure

[0036] 17,17' First drive spring

[0037] 18 First Drive Sensing Comb Pair Structure

[0038] 18a, 18b differential capacitor pair

[0039] 19,19' First connecting spring

[0040] 20 substrates

[0041] 22', 24' First sensing pad

[0042] 22,24 Second sensing pad

[0043] 30', 30, 60, 60' Second drive and sensing structure

[0044] 31,61 Second drive ring

[0045] 32,32',34,34' Second sensing verification mass block

[0046] 33,35 Second drive comb pair structure

[0047] 36 Second sensing spring structure

[0048] 37,37' Second drive spring

[0049] 38 Second Drive Sensing Comb Pair Structure

[0050] 39, 39' Second connecting spring

[0051] 43, 45, 63, 65 frame structure

[0052] 47 First Fixed Anchor

[0053] 49,59 Second fixed anchor

[0054] 50' Third Drive Structure

[0055] 50, 90 Third drive and sensing structure

[0056] 51 Third Drive Ring

[0057] 52,54,92,94 Third sensing verification mass block

[0058] 52', 54' Third swinging mass

[0059] 52a, 54a First Quality Component

[0060] 52b, 54b second mass component

[0061] 53,55,93,95 Third drive frame

[0062] 56,96 Third sensing spring structure

[0063] 57 Third Drive Spring

[0064] 58,58' Third Sensing Comb Pair Structure

[0065] 70', 70 First coupling structure

[0066] 71, 73 connecting springs

[0067] 72-yoke structure

[0068] 79 Third Fixed Anchor

[0069] Fc Coriolis force

[0070] Ca,Cb capacitors

[0071] X, Y, Z axes Detailed Implementation

[0072] The following embodiments are illustrative. Although the following description refers to one, one, or several implementations, it does not imply that every such reference is the same implementation, or that such features are applicable only to a single implementation. Individual features of different embodiments may be combined to provide other implementations. The features of the invention will be described below by way of simple examples of various implementation device architectures in which the invention can be carried out, and only the relevant elements for the examples will be described in detail. However, the implementation elements of angular velocity sensors that are mostly known to those skilled in the art may not be specifically described herein.

[0073] Figure 1 This is a front view of a first biaxial embodiment of the multi-axis angular velocity sensor of the present invention. Please refer to... Figure 1The microelectromechanical system (MEMS) wafer layer includes a first driving and sensing structure 10', a second driving and sensing structure 30', and a third driving structure 50'. In this embodiment, the driving and sensing structures may include a sensing proof mass (PM), a sensing spring structure, a driving ring, a driving spring, a driving comb structure, a driving sensing comb structure, and a connector spring. It should be noted that the driving proof mass (not shown in the figure) includes all mass blocks that move by a driving mechanism, including, but not limited to, the driving ring, the sensing proof mass, all movable comb structures, the driving structure, and the driving structure. Secondly, the first driving and sensing structure 10' includes a first sensing verification mass block 12, a first sensing verification mass block 14, a first driving ring 11, a first driving comb pair structure 13, a first driving comb pair structure 15, a first sensing spring structure 16, a first driving spring 17, a first driving sensing comb pair structure 18, and a first connecting spring 19. The second driving and sensing structure 30' includes a second sensing verification mass block 32, a second sensing verification mass block 34, a second driving ring 31, a second driving comb pair structure 33, a second driving comb pair structure 35, a second sensing spring structure 36, a second driving spring 37, a second driving sensing comb pair structure 38, and a second connecting spring 39. The third driving structure 50' includes at least a third driving ring 51, a third pendulum mass 52', and a third pendulum mass 54', wherein the first driving ring 11, the second driving ring, and the third driving ring 51 are linked and the three rings are in a straight line relationship, or the geometric centers of the three rings are in a straight line relationship.

[0074] Figure 2 This is a front view of the first driving and sensing structure according to a first biaxial embodiment of the present invention. Please refer to... Figure 1 and Figure 2The first sensing verification mass block 12 and the first sensing verification mass block 14 are disposed within the first driving ring 11 and connected to the first driving ring 11 by the first sensing spring structure 16. Corresponding sensing pads (within the dashed lines) are respectively provided on the CMOS substrate (not shown in the figure) below the first sensing verification mass block 12 and the first sensing verification mass block 14. Furthermore, the first sensing verification mass block 12 and the first sensing verification mass block 14 are the same size and shape and are mirror images of each other. The first sensing spring structure 16 is substantially parallel to the Y-axis direction and is disposed at the center of the mirror image of the first sensing verification mass block 12 and the first sensing verification mass block 14. The first driving ring 11 is connected to the third driving structure 50' by the first connecting spring 19, and is fixed to a lower CMOS substrate (not shown in the figure) disposed parallel to the MEMS wafer layer by four first driving springs 17, and electrically connected to the circuitry of the CMOS substrate. Secondly, each of the driving comb pair structure or the driving sensing comb pair structure includes multiple movable electrode plates and corresponding fixed electrode plates arranged in a comb-like structure. The driving comb pair consists of two fixed comb structures symmetrically configured with movable comb structures, thereby applying different phase voltages to achieve the effect of oscillation driving. Therefore, the first driving comb pair structure 13 includes multiple movable electrode plates 131 and stationary electrode plates 133 arranged relatively apart, wherein the movable electrode plates 131 are connected to the first driving ring 11, and the fixed electrode plates 133 are connected to the second fixed anchor 49 and electrically connected to the driving circuit of the lower CMOS substrate (not shown in the figure). The first driving comb pair structure 15 includes multiple movable electrode plates 151 and fixed electrode plates 153 arranged relatively apart, wherein the movable electrode plates 151 are connected to the first driving ring 11, and the fixed electrode plates 153 are connected to the second fixed anchor 49 and electrically connected to the driving circuit of the lower CMOS substrate (not shown in the figure). Each first drive sensing comb pair structure 18 includes multiple movable electrode plates 181 and fixed electrode plates 183 arranged at intervals relative to each other. The movable electrode plates 181 are connected to the first drive ring 11, and the fixed electrode plates 183 are connected to the second fixed anchor 49. In this embodiment, the first drive sensing comb pair structure 13 and the first drive sensing comb pair structure 15 are respectively arranged on the upper and lower sides of the X-axis, but the invention is not limited to one pair and can have multiple pairs (not shown in the figure). The four first drive sensing comb pair structures 18 are symmetrically arranged in pairs about the X-axis and Y-axis. The first sensing verification mass block 12 and the first sensing verification mass block 14 have the same size and shape and are symmetrically arranged on both sides of the Y-axis.

[0075] Figure 3This is a front view of the second driving and sensing structure according to the first biaxial embodiment of the present invention. Please refer to... Figure 1 and Figure 3 The second sensing verification mass block 32 and the second sensing verification mass block 34 are disposed within the second driving ring 31 and connected to the second driving ring 31 by the second sensing spring structure 36. Corresponding sensing pads (within the dashed lines) are respectively provided on the CMOS substrate (not shown in the figure) below the second sensing verification mass block 32 and the second sensing verification mass block 34. Furthermore, the second sensing verification mass block 32 and the second sensing verification mass block 34 are the same size and shape and are mirror images of each other. The second sensing spring structure 36 is substantially parallel to the X-axis direction and is disposed at the mirror center of the second sensing verification mass block 32 and the second sensing verification mass block 34. The second driving ring 31 is connected to the third driving structure 50' by the second connecting spring 39, and is fixed to the lower CMOS substrate (not shown in the figure) arranged parallel to the MEMS wafer layer by four second driving springs 37, and electrically connected to the circuitry of the CMOS substrate. Furthermore, each of the driving electric comb pair structure or the driving sensing electric comb pair structure includes multiple movable electrode plates and corresponding fixed electrode plates arranged in a comb-like structure. Therefore, the second drive electrical comb pair structure 33 includes multiple movable electrode plates 331 and fixed electrode plates 333 arranged at intervals relative to each other. The movable electrode plates 331 are connected to the second drive ring 31, and the fixed electrode plates 333 are connected to the second fixed anchor 49 and electrically connected to the drive circuit of the lower CMOS substrate (not shown in the figure). Furthermore, the second drive electrical comb pair structure 35 includes multiple movable electrode plates 351 and fixed electrode plates 353 arranged at intervals relative to each other. The movable electrode plates 351 are connected to the second drive ring 31, and the fixed electrode plates 353 are connected to the second fixed anchor 49 and electrically connected to the drive circuit of the lower CMOS substrate (not shown in the figure). Also, each second drive sensing electrical comb pair structure 38 includes multiple movable electrode plates 381 and fixed electrode plates 383 arranged at intervals relative to each other. The movable electrode plates 381 are connected to the second drive ring 31, and the fixed electrode plates 383 are connected to the second fixed anchor 49 and electrically connected to the drive sensing circuit of the lower CMOS substrate (not shown in the figure). In this embodiment, the second drive comb pair structure 33 and the second drive comb pair structure 35 are respectively arranged on the upper and lower sides of the X-axis, but the present invention is not limited to one pair, and can be multiple pairs (not shown in the figure). The four second drive sensing comb pairs structure 38 are symmetrical about the X-axis and Y-axis in pairs. The second sensing verification mass block 32 and the second sensing verification mass block 34 have the same size and shape and are symmetrically arranged on both sides of the X-axis.

[0076] Continued reference Figures 1-3The third drive structure 50' includes a third drive ring 51 connected to the second drive ring 31 by a second connecting spring 39, and connected to the first drive ring 11 by a first connecting spring 19. The third drive ring 51 is fixed to the substrate (not shown) by a first fixing anchor 47 connected to it by a third drive spring 57. The third drive spring 57 and the first fixing anchor 47 are disposed within the ring of the third drive ring 51, with the first fixing anchor 47 approximately located at the geometric center of the third drive ring 51. Furthermore, two third swinging mass blocks 52' and 54' are symmetrically disposed on the upper and lower sides of the third drive ring 51 and connected to it, wherein the third swinging mass blocks 52' and 54' are symmetrical about the X-axis. In one driving mode, when the two fixed combs in the first and second driving comb pairs are respectively given periodic voltage signals of equal magnitude and opposite phase, a periodic electrostatic force is generated, which pulls the movable comb structure. This generates a rotational torque on the first driving ring 11 and the second driving ring 31 connected to the first and second driving comb pairs, causing the first driving ring 11 and the second driving ring 31 to rotate periodically. Secondly, driven by the first connecting spring 19 and the second connecting spring 39, the third driving ring 51 can also rotate periodically. In this case, the periodic rotation direction of the third driving ring 51 is opposite to that of the first and second driving rings. For example, during periodic motion, when the first and second driving rings rotate clockwise (approximately parallel to the XY plane), the third driving ring rotates counterclockwise. Furthermore, the periodic rotation of the third drive ring can drive the two third oscillating masses 52' and 54' to oscillate periodically on the parallel XZ plane, thereby storing some kinetic energy in the oscillating structure, achieving a stable oscillation effect, and reducing amplitude and phase variations. In a typical angular velocity sensor, the two independent first drive and sensing structures and the second drive and sensing structure may have different motion behaviors due to process variations. For example, although the two independent first and second drive comb pairs are driven by the same voltage signal, the process differences in the size of the capacitor pairs, elastic structures, and masses in the two drive structures will eventually lead to differences in amplitude and phase of the oscillation frequency of the two drive structures, making subsequent signal processing more difficult. Therefore, in this embodiment, the design of the third driving structure 50' enables the first driving and sensing structure and the second driving and sensing structure to work together, reducing or eliminating the problems of amplitude differences and asynchronous oscillation timing between the first driving and sensing structure and the second driving and sensing structure during periodic rotation. It also has the advantages of storing oscillation energy and stabilizing oscillation.

[0077] Figure 4This is a front view of a second biaxial embodiment of the multiaxial angular velocity sensor of the present invention. Also refer to... Figure 1 and Figure 4 ,and Figure 1 Compared to the first embodiment, the second biaxial embodiment further includes two first coupling structures 70' connected to the third oscillating mass blocks 52' and 54' respectively, wherein each first coupling structure 70' includes a connecting spring 71, a connecting spring 73, and two yoke structures 72. In this embodiment, the two first coupling structures 70' are generally symmetrical about the upper and lower sides of the X-axis and are located around or around the first driving and sensing structure 10', the second driving and sensing structure 30', and the third driving structure 50'. Furthermore, the connecting spring 71 is generally elongated, with a yoke structure 72 connected to each end. The third oscillating mass block 52' or the third oscillating mass block 54' is generally connected to the middle section of the connecting spring 71 by the connecting spring 73, wherein the two connecting springs 73 are respectively connected to the third oscillating mass block 52' and the third oscillating mass block 54' on opposite sides symmetrical about the X-axis. Each yoke structure 72 is fixed to the CMOS substrate (not shown in the figure) via a third fixing anchor 79. In a biaxial multi-axis angular velocity sensor, the first coupling structure 70' connects to the third swinging mass, which can provide the swing of the third swinging mass with high elasticity in the XY plane and low elasticity in the Z direction to avoid seesaw oscillation, thus avoiding unnecessary movement of the third swinging mass in the Z direction.

[0078] Figure 5 This is a front view of a third biaxial embodiment of the multi-axis angular velocity sensor of the present invention. Also refer to... Figure 1 , Figure 4 and Figure 5 ,and Figure 4 Compared to the second biaxial embodiment, the third biaxial embodiment includes a first coupling structure 70 that uses two connecting springs 71 to connect the upper and lower first coupling structures 70' together, and encloses the first driving and sensing structure 10', the second driving and sensing structure 30', and the third driving structure 50'. In the biaxial multiaxial angular velocity sensor, the first coupling structure 70 connects to the third oscillating mass block, which can provide the third oscillating mass block with high elasticity in the XY plane and low elasticity in the Z direction to avoid seesaw oscillation, thus preventing unnecessary movement of the third oscillating mass block in the Z direction.

[0079] Figure 6 This is a front view of a first triaxial embodiment of the multi-axis angular velocity sensor of the present invention. Please also refer to... Figures 1-6The first triaxial MEMS wafer layer includes a first driving and sensing structure 10, a second driving and sensing structure 30, a third driving and sensing structure 50, and a first coupling structure 70. In this embodiment, the third driving and sensing structure 50 is different from the driving structure 50', which will be described later. The first driving and sensing structure 10 and... Figure 1 Similar to the first driving and sensing structure 10', the first driving ring 11 of the first driving and sensing structure 10 is connected to the third driving ring 51 of the third driving and sensing structure 50 via a first connecting spring 19. Furthermore, the first driving and sensing structure 10 includes a single first driving sensing comb pair structure 18, meaning the number of driving sensing comb pairs in this invention can be one or more. Next, the second driving ring 31 of the second driving and sensing structure 30 is connected to the third driving ring 51 of the third driving and sensing structure 50 via a second connecting spring 39, thus forming a three-ring linked driving structure, wherein the first driving ring 11, the second driving ring 31, and the third driving ring 51 are in a straight line relationship, or rather, the geometric centers of the three rings are in a straight line relationship.

[0080] Figure 7 This is a front view of the third driving and sensing structure in the first triaxial embodiment of the present invention. Please refer to... Figures 1 to 7The third driving and sensing structure 50 includes a third driving ring 51 connected to the second driving ring 31 via a second connecting spring 39, and connected to the first driving ring 11 via a first connecting spring 19. Next, two third driving frames 53 and 55 are correspondingly disposed on the upper and lower sides of the third driving ring 51, and are connected to the third driving ring 51. Third sensing verification mass blocks 52 and 54 are respectively disposed within the area enclosed by the third driving frames 53 and 55, and are connected to the third driving frames 53 and 55 via a third sensing spring structure 56. Furthermore, the third sensing verification mass block 52 includes a first mass element 52a and a second mass element 52b, and the third sensing verification mass block 54 includes a first mass element 54a and a second mass element 54b. Furthermore, the third driving and sensing structure 50 also includes a third sensing comb pair structure 58' and a third sensing comb pair structure 58, which are respectively disposed within the area enclosed by the third driving frame 53 and the third driving frame 55 and correspond to the second mass member 52b and the second mass member 54b, respectively. The third sensing comb pair structure 58' and the third sensing comb pair structure 58 are respectively differential capacitors Ca and Cb in electrical function. The third sensing comb pair structure 58' and the third sensing comb pair structure 58 each include a plurality of movable electrode plates 581 and fixed electrode plates 583 arranged at intervals relative to each other. The movable electrode plates 581 are connected to the corresponding second mass member 52b and the second mass member 54b, and the fixed electrode plates 583 are connected to the second fixed anchor 59 and electrically connected to the sensing circuit of the CMOS substrate below (not shown in the figure). Furthermore, the spacing between the movable electrode plate 581 and the fixed electrode plate 583 in the third sensing comb pair structure 58' and the third sensing comb pair structure 58, respectively located within the third driving frame 53 and the third driving frame 55, can be different. This allows the capacitance changes of the two sensing combs to be opposite when the verification mass block moves away from or near the second fixed anchor 59, thus forming a differential capacitor pair. Therefore, compared to the biaxial embodiment, the third driving and sensing structure 50 can be a variation of the third driving structure 50', using the third swinging mass block 52' and the third swinging mass block 54' to create the third driving frame and the third sensing verification mass block for third driving and sensing. Secondly, in this embodiment, the third driving ring 51 serves as a linkage and driving mechanism.

[0081] Figure 8 This is a partial front view of the structure of a first triaxial embodiment of the multi-axis angular velocity sensor of the present invention. Please also refer to... Figure 6 and Figure 8Similar to the aforementioned, the two fixed combs in the first and second driving comb pairs are respectively subjected to periodic voltage signals of equal magnitude but opposite phase. These signals apply a periodic electrostatic force to the movable comb structure, causing a rotational torque to be generated in the first driving ring and the second driving ring of the first and second driving comb pairs, resulting in periodic rotational oscillations. For example, the driving voltage phases of combs 13a, 33a, 15a, and 35a in each driving comb pair structure are the same, while the driving voltage phases of combs 13b, 33b, 15b, and 35b are the same. However, the driving voltage phases of comb 13a and its corresponding comb 13b are different, generally with a phase difference of 180 degrees. Furthermore, the first driving sensing comb pair structure 18 uses a pair of differential capacitors on both sides to sense the magnitude and frequency of the driving amplitude, thereby determining whether the driving voltages of the first driving comb pair structures 13 and 15 are correct. The first drive sensing comb pair structure 18 senses the rotational displacement of the drive ring 11 by measuring the capacitance changes of a pair of differential capacitor pairs 18a and 18b on both sides. This sensing structure converts the amplitude and frequency of the drive ring 11 into capacitance signals, thereby adjusting the drive voltage and frequency to achieve feedback control. The second drive sensing comb pair structure 38 senses whether the drive voltages of the second drive comb pair structure 33 and the second drive comb pair structure 35 are correct. For example, when the capacitance change detected by the drive sensing comb pair structure is insufficient, the drive voltage can be increased to increase the torque applied to the drive ring and increase the amplitude. When the frequency of the capacitance change detected by the drive sensing comb pair structure is low, the frequency of the drive voltage can be increased to increase the frequency of the torque applied to the drive ring and increase the oscillation frequency. Driven by the first and second connecting springs, the third drive ring 51 also rotates and oscillates simultaneously. At this time, the rotational oscillation direction of the third drive ring 51 is opposite to the rotational oscillation of the first drive ring 11 and the second drive ring 31. Figure 8When the first driving ring 11 and the second driving ring 31 rotate counterclockwise (indicated by black arrows), the third driving ring rotates clockwise (indicated by black arrows). Furthermore, the rotational oscillation of the third driving ring drives the two third driving frames 53 and 55 to also rotate. In a preferred embodiment, the third driving ring is smaller than the first and second driving rings and is positioned symmetrically in the middle of the first and second driving rings. In this case, the oscillation amplitude of the third driving ring will be a multiple of the ratio of the large and small ring radii, which helps to improve the sensitivity of the third sensing structure, thus achieving the effect of reducing the chip area and improving performance. It should be noted that the driving sensing function in this case is accomplished by the two differential capacitor pairs of the first driving sensing comb pair structure 18 and the second driving sensing comb pair structure 38. Since the three driving rings in this case are interconnected, only one set of driving frequency and amplitude needs to be detected. Therefore, when the first drive ring 11, the second drive ring 31 and the third drive ring 51 move together, the first drive sensing comb pair structure 18 and the second drive sensing comb pair structure 38 detect the overall amplitude and frequency of the three drive rings during their movement.

[0082] Figure 9 This is a front view of the second drive and sensing structure in the first three-axis embodiment. Figure 10 and Figure 11 These are schematic diagrams of cross-sections taken along AA', where Figure 10 This indicates that it has not yet been affected by the Coriolis force. Figure 11 This indicates the structural state when subjected to Coriolis force in the Z direction. Also refer to... Figure 6 , Figures 8-11 In one sensing mode, the second driving and sensing structure 30 serves as a Y-axis sensing structure. The substrate 20 (CMOS substrate) below the second sensing verification mass block 32 and the second sensing verification mass block 34 are respectively provided with corresponding second sensing pads 22 and 24. The substrate 20 is arranged parallel to the XY plane and opposite to the driving and sensing structure (MEMS layer). When the MEMS triaxial angular velocity sensor... Figure 8 While driving the oscillation, the entire MEMS triaxial angular velocity sensor rotates around the Y-axis, generating a Coriolis force Fc in the Z-direction. This causes the second sensing verification mass block 32 and the second sensing verification mass block 34 to move up and down in the Z-direction. This up-and-down movement of the second sensing verification mass block 32 and the second sensing verification mass block 34 in the Z-direction causes a change in capacitance with their corresponding second sensing pads 22 and 24, forming a differential capacitor pair (second differential capacitor pair). For example, such as... Figure 11As shown, when the second sensing verification mass 32 moves upward and away from the second sensing pad 22 due to the Coriolis force Fc, the capacitance Cb decreases; simultaneously, the second sensing verification mass 34 moves downward and closer to the second sensing pad 24 due to the Coriolis force Fc, the capacitance Ca increases. The magnitude of the Coriolis force Fc can be measured by measuring the capacitance change of the differential capacitance pair composed of capacitance Ca and capacitance Cb. It should be noted that if the MEMS triaxial angular velocity sensor as a whole does not rotate but only undergoes internal drive oscillation, the second sensing verification mass 32 and the second sensing verification mass 34 do not feel the Coriolis force Fc, but only move with the second drive ring 31. At this time, the second sensing verification mass 32 and the second sensing verification mass 34 only perform periodic rotational oscillation motion in the motion plane (XY plane) of the second drive ring 31. At this time, the electrode plates below the second sensing verification mass 32 and the second sensing verification mass 34 do not produce capacitance changes.

[0083] Figure 12 This is a front view of the first driving and sensing structure in the first three-axis embodiment. Figure 13 and Figure 14 These are schematic diagrams of cross-sections taken along BB', where... Figure 13 This indicates that it has not yet been affected by the Coriolis force. Figure 14 This indicates the structural state when subjected to Coriolis force in the Z direction. Also refer to... Figure 6 , Figure 8 , Figures 12-14 In a sensing mode, the first driving and sensing structure 10 serves as an X-axis sensing structure. The substrate 20 below the first sensing verification mass block 12 and the first sensing verification mass block 14 are respectively provided with corresponding first sensing pads 22' and 24'. When the MEMS triaxial angular velocity sensor... Figure 8 While driving the oscillation, the MEMS triaxial angular velocity sensor rotates around the X-axis (in one sensing mode), generating a Coriolis force Fc in the Z-direction, causing the first sensing verification mass block 12 and the first sensing verification mass block 14 to move up and down in the Z-direction. This up-and-down movement of the first sensing verification mass block 12 and the first sensing verification mass block 14 in the Z-direction causes a change in capacitance with their corresponding first sensing pads 22' and 24', forming a differential capacitor pair (the first differential capacitor pair). Therefore, the first driving and sensing structure 10 can serve as an X-axis sensing structure. For example, such as... Figure 14As shown, when the first sensing verification mass 12 moves upward and away from the first sensing pad 22' due to the Coriolis force Fc, the capacitance Cb decreases; simultaneously, the first sensing verification mass 14 moves downward and closer to the first sensing pad 24' due to the Coriolis force Fc, the capacitance Ca increases. The magnitude of the Coriolis force Fc can be obtained by measuring the differential capacitance change between capacitance Ca and capacitance Cb. It should be noted that if the MEMS triaxial angular velocity sensor as a whole does not rotate but only undergoes internal drive oscillation, the first sensing verification mass 12 and the first sensing verification mass 14 do not feel the Coriolis force Fc, but only move with the first drive ring 11. At this time, the first sensing verification mass 32 and the first sensing verification mass 34 only rotate and oscillate with the first drive ring 11 in the motion plane (XY plane). At this time, the electrode plate below the first sensing verification mass 32 and the first sensing verification mass 34 does not produce a capacitance change.

[0084] Figure 15 This is a frontal schematic diagram of the third drive and sensing structure of the first triaxial embodiment of the present invention moving under Coriolis force. Figure 16 This first three-axis embodiment only shows the third drive and sensing structure and the first coupling structure 70. Please refer to... Figures 6-8 and Figures 15-16 In a sensing mode, the third driving and sensing structure 50 is a Z-axis sensing structure. When the MEMS triaxial angular velocity sensor contains... Figure 8While driving the oscillation, the MEMS triaxial angular velocity sensor rotates around the Z-axis, generating a Coriolis force Fc in the Y-direction. This causes the third sensing verification mass block 52 and the third sensing verification mass block 54 to move periodically along the Y-direction in the XY plane. Furthermore, the third sensing verification mass block 52 and the third sensing verification mass block 54 are connected to the connecting spring 71 of the first coupling structure 70 via connecting spring 73. The frame-closed first coupling structure 70 forces and ensures that the third sensing verification mass block 52 and the third sensing verification mass block 54 move simultaneously, separating the resonant frequencies of in-phase and out-of-phase motions, causing the structure to tend towards anti-phase oscillation. Normally, without the first coupling structure 70, the resonant frequencies of in-phase and out-of-phase motions would be very close. Therefore, the sensing vibrations induced by the Coriolis force might be asynchronous or even enter in-phase motion, causing signal distortion or failure. When the third sensing verification mass block 52 and the third sensing verification mass block 54 move in opposite phases (while moving away from the first fixed anchor 47 at the center), the third sensing verification mass block 52 moves upward (capacitance increases), while the third sensing verification mass block 54 moves downward (capacitance decreases); when the third sensing verification mass block 52 moves downward, the third sensing verification mass block 54 moves upward. Thus, by measuring the capacitance change of the differential capacitor pair formed by the third sensing comb pair structure 58' and the third sensing comb pair structure 58, the magnitude of the Coriolis force Fc can be measured. Therefore, if the vibrations of the third sensing verification mass block 52 and the third sensing verification mass block 54 are asynchronous (phase difference) or even in-phase, the two sensing capacitors will experience asynchronous or even in-phase capacitance changes, causing the capacitance change of the differential capacitor pair to decrease or cancel out. Therefore, the structural design of the first coupling structure 70 makes the spring constant when the spring in the coupling structure undergoes bending deformation during anti-phase motion less than the spring constant when the spring in the coupling structure undergoes twist deformation during in-phase motion, so that the anti-phase resonant frequency and in-phase resonant frequency of the third sensing verification mass block 52 and the third sensing verification mass block 54 can be separated.

[0085] Figure 17 This is a front view of a second triaxial embodiment of the multi-axis angular velocity sensor of the present invention. Please also refer to... Figure 6 and Figure 17 Compared to Figure 6The first driving ring 41 of the first driving and sensing structure 40 of the MEMS wafer layer of the first triaxial and second triaxial angular velocity sensors is rectangular, and the second driving ring 61 of the second driving and sensing structure 60 is rectangular. Furthermore, the first driving and sensing structure 40 has two first driving comb pairs 13 and 15, each of which is arranged oppositely on two opposite sides of the first driving ring 41 symmetrical about the X-axis. Similarly, the second driving and sensing structure 60 has two second driving comb pairs 33 and 35, each of which is arranged oppositely on two opposite sides of the second driving ring 61 symmetrical about the X-axis. Furthermore, the first driving and sensing structure 40 includes four first driving and sensing comb pairs 18 disposed opposite each other on the other two opposite sides of the first driving ring 41; similarly, the second driving and sensing structure 60 includes four second driving and sensing comb pairs 38 disposed opposite each other on the other two opposite sides of the second driving ring 61. The remaining structures are similar. Figure 6 Similar or identical details will not be elaborated here. Therefore, the number of drive comb pairs or drive sensing comb pairs in the embodiments of the present invention can be one or more. In the case of multiple drive comb pairs, a relative arrangement is preferred, as is the arrangement of drive sensing comb pairs. The relative arrangement is with reference to the drive ring, primarily ensuring symmetry between the drive and sensing structures of any axis. Symmetry between the first and second drive and sensing structures is also preferred, but it is not limited to the structures being completely identical.

[0086] Figure 18 This is a front view of the third triaxial embodiment of the multi-axis angular velocity sensor of the present invention. Please also refer to... Figure 6 and Figure 18 The third triaxial MEMS wafer layer includes a first driving and sensing structure 40', a second driving and sensing structure 60', a third driving and sensing structure 90, and a first coupling structure 70. In this embodiment, the first sensing verification mass block 12' and the first sensing verification mass block 14' are disposed within the first driving ring 11 and connected to the first driving ring 11 by a first sensing spring structure 16. Figure 6 The geometry of the first sensing verification mass block 12 is different; it is a fan-shaped flat plate. The first sensing verification mass block 14' and... Figure 6The first sensing verification mass block 14 has a different geometry, also being a fan-shaped plate. The first sensing verification mass block 12' and the first sensing verification mass block 14' are the same size and shape, and are mirror images of each other. Furthermore, the first sensing spring structure 16 is substantially parallel to the Y-axis and is positioned at the mirror center of the first sensing verification mass block 12' and the first sensing verification mass block 14'. The first drive ring 11 is connected to the third drive ring 51 of the third drive and sensing structure 90 via a first connecting spring 19', and the first drive ring 11 is fixed to the substrate (not shown in the figure) by four first drive springs 17' connected to a first fixing anchor 47. The geometry of the first connecting spring 19' is different from that of the first connecting spring 19, and the geometry of the first drive spring 17' is different from that of the first drive spring 17. Next, multiple first drive comb pairs 13 are spaced apart from each other and connected to the first drive ring 11 via a frame structure 43. One or more first drive sensing comb pairs 18 are positioned within the frame of the frame structure 43. Multiple first drive comb pairs 15 are spaced apart from each other and connected to the first drive ring 11 via a frame structure 45. A single first drive sensing comb pair 18 is disposed within the area enclosed by the frame structure 45. The frame structure 43 and the frame structure 45 are symmetrically arranged on the upper and lower sides of the X-axis. Therefore, in this embodiment, the drive sensing comb pair structure is disposed between the drive ring and the drive comb pair structure.

[0087] Continued reference Figure 6 and Figure 18 The second sensing verification mass block 32' and the second sensing verification mass block 34' are disposed within the second drive ring 31 and connected to the second drive ring 31 by the second sensing spring structure 36. The second sensing verification mass block 32' and... Figure 6 The geometry of the second sensing verification mass block 32 is different from that of the second sensing verification mass block 34'. Figure 6The second sensing verification mass block 34 has a different geometry. The second sensing verification mass block 32' and the second sensing verification mass block 34' are the same size and shape and are mirror images of each other. The second sensing spring structure 36 is substantially parallel to the X-axis direction and is located at the mirror center of the second sensing verification mass block 32' and the second sensing verification mass block 34'. The second drive ring 31 is connected to the third drive ring 51 of the third drive and sensing structure 90 by the second connecting spring 39', and the second drive ring 31 is fixed to the substrate (not shown in the figure) by the first fixing anchor 47 connected by four second drive springs 37'. The geometry of the second connecting spring 39' is different from that of the second connecting spring 39, and the geometry of the second drive spring 37' is different from that of the second drive spring 37. In addition, a plurality of second drive comb pairs 33 are spaced apart from each other and connected to the second drive ring 31 by the frame structure 63. One or more second drive sensing comb pairs 38 are disposed within the frame of the frame structure 63. Multiple second drive comb pairs 35 are spaced apart from each other and connected to the second drive ring 31 via a frame structure 65. A single second drive sensing comb pair 38 is disposed within the area enclosed by the frame structure 65. The frame structures 63 and 65 are symmetrically arranged on the upper and lower sides of the X-axis. Therefore, in this embodiment, the drive sensing comb pair structure is disposed between the drive ring and the drive comb pair structure.

[0088] Continued reference Figure 6 and Figure 18 The third driving and sensing structure 90 includes a third driving ring 51 connected to a second driving ring 31 via a second connecting spring 39', and connected to a first driving ring 11 via a first connecting spring 19'. Next, two third driving frames 93 and 95 are symmetrically arranged above and below the third driving ring 51 along the X-axis and connected to the third driving ring 51. Third sensing verification mass blocks 92 and 94 are respectively disposed within the area enclosed by the third driving frames 93 and 95, and are respectively connected to the third driving frames 93 and 95 via multiple third-axis sensing spring structures 96. Furthermore, the third driving and sensing structure 90 also includes two third sensing comb pairs respectively disposed within the area enclosed by the third driving frames 93 and 95. Each third sensing comb pair structure includes multiple movable electrode plates 981 and fixed electrode plates 983 arranged at intervals relative to each other. The movable electrode plates 981 are connected to the corresponding third sensing verification mass block, and the fixed electrode plates 983 are connected to the second fixed anchor. The movable electrode plates 981 and fixed electrode plates 983 have an arc-shaped plate shape, which is different from the flat plate shape of the movable electrode plates 981 and fixed electrode plates 983.

[0089] The embodiments described above are merely for illustrating the technical ideas and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be used to limit the scope of patent protection of the present invention. That is, all equivalent changes or modifications made in accordance with the spirit disclosed in the present invention should still be covered within the scope of patent protection of the present invention.

Claims

1. A microelectromechanical multi-axis angular velocity sensor, comprising a substrate and a microelectromechanical wafer layer disposed parallel to each other, and a plurality of anchors connecting the microelectromechanical wafer layer to the substrate for fixing it thereon, characterized in that, The microelectromechanical wafer layer includes: A first driving and sensing structure includes a first driving ring, a plurality of first driving comb pairs and a plurality of first sensing verification mass blocks, wherein the plurality of first driving comb pairs and the plurality of first sensing verification mass blocks are respectively connected to the first driving ring. A second driving and sensing structure includes a second driving ring, a plurality of second driving comb pairs and a plurality of second sensing verification mass blocks, wherein the plurality of second driving comb pairs and the plurality of second sensing verification mass blocks are respectively connected to the second driving ring. A third drive ring is disposed between and connects the first drive ring and the second drive ring. In a drive mode, the plurality of first drive combs drive the first drive ring to perform periodic rotational motion, the plurality of second drive combs drive the second drive ring to perform periodic rotational motion, and the first drive ring and the second drive ring drive the third drive ring to perform periodic rotational motion. as well as Two oscillating mass blocks are respectively connected to the third drive ring and located on opposite sides of the third drive ring.

2. The microelectromechanical multi-axis angular velocity sensor as described in claim 1, characterized in that, It further includes a first coupling structure disposed around the first driving and sensing structure, the second driving and sensing structure, and the two swinging mass blocks, wherein each of the swinging mass blocks is connected to the third driving ring and the first coupling structure, and the first coupling structure is fixed to the substrate by means of the plurality of fixed anchors.

3. The microelectromechanical multi-axis angular velocity sensor as described in claim 2, characterized in that, The first coupling structure includes a plurality of connecting springs and at least a double yoke structure, the plurality of connecting springs connecting each of the oscillating mass blocks and the double yoke structure, and the double yoke structure being fixed to the substrate by means of a plurality of fixed anchors.

4. The microelectromechanical multi-axis angular velocity sensor as described in claim 1 or 2, characterized in that, It further includes a first sensing spring structure and a second sensing spring structure, wherein the plurality of first sensing verification mass blocks are disposed within the first drive ring and connected to the first drive ring via the first sensing spring structure, and the plurality of second sensing verification mass blocks are disposed within the second drive ring and connected to the second drive ring via the second sensing spring structure.

5. The microelectromechanical multi-axis angular velocity sensor as described in claim 4, characterized in that, The second sensing spring structure is parallel to a first axis and the plurality of second sensing verification mass blocks are symmetrical about the first axis, and the first sensing spring structure is parallel to a second axis and the plurality of first sensing verification mass blocks are symmetrical about the second axis, the first axis being perpendicular to the second axis.

6. The microelectromechanical multi-axis angular velocity sensor as described in claim 5, characterized in that, The plurality of first drive comb pairs are symmetrical about the first axis and the second axis, and the plurality of second drive comb pairs are symmetrical about the first axis, the second axis, or the first axis and the second axis.

7. The microelectromechanical multi-axis angular velocity sensor as described in claim 1 or 2, characterized in that, Each of the swinging mass blocks includes a third drive frame connected to the third drive ring, a third sensing verification mass block disposed within the third drive frame, and a third sensing spring structure connecting the third sensing verification mass block to the third drive frame.

8. The microelectromechanical multi-axis angular velocity sensor as described in claim 7, characterized in that, It further includes a third drive spring disposed within the third drive ring, wherein the third drive spring is connected to the third drive ring and fixed to the base plate by one of the plurality of fixed anchors.

9. The microelectromechanical multi-axis angular velocity sensor as described in claim 1 or 2, characterized in that, It further includes a first drive sensing comb pair structure and a second drive sensing comb pair structure, wherein the first drive sensing comb pair structure is connected to the first drive ring, and the second drive sensing comb pair structure is connected to the second drive ring.

10. The microelectromechanical multi-axis angular velocity sensor as described in claim 1, 2, or 3, characterized in that, The geometric centers of the first drive ring, the second drive ring, and the third drive ring are in a straight line relationship, and in the drive mode, the direction of the periodic rotational motion of the first drive ring and the second drive ring is different from the direction of the periodic rotational motion of the third drive ring.

11. The microelectromechanical multi-axis angular velocity sensor as described in claim 1, 2, or 3, characterized in that, The substrate includes a plurality of first sensing pads and a plurality of second sensing pads, the plurality of first sensing pads respectively corresponding to a plurality of first sensing verification mass blocks, and the plurality of second sensing pads respectively corresponding to a plurality of second sensing verification mass blocks.

12. A microelectromechanical multi-axis angular velocity sensor, characterized in that, include: A substrate includes a plurality of first sensing pads and a plurality of second sensing pads, the substrate being parallel to a plane defined by a first axis and a second axis; A first driving and sensing structure is disposed on the substrate. The first driving and sensing structure includes a first driving ring connecting multiple first driving comb pairs and two first sensing verification mass blocks. The multiple first sensing verification mass blocks correspond to the multiple first sensing pads to form a first differential capacitor pair for detecting Coriolis force in a third axial direction. The multiple first sensing verification mass blocks are symmetrically arranged about the second axis. The third axial direction is perpendicular to the first axis and the second axis. A second driving and sensing structure is disposed on the substrate. The second driving and sensing structure includes a second driving ring connecting multiple second driving comb pairs and two second sensing verification mass blocks. The multiple second sensing verification mass blocks correspond to the multiple second sensing pads to form a second differential capacitor pair for detecting a Coriolis force in a third axial direction. The multiple second sensing verification mass blocks are symmetrically arranged about the first axis. A third drive ring is disposed between and connects the first drive ring and the second drive ring. In a driving mode, the plurality of first drive combs drive the first drive ring to perform periodic rotational motion, the plurality of second drive combs drive the second drive ring to perform periodic rotational motion, and the first drive ring and the second drive ring drive the third drive ring to perform periodic rotational motion. In a sensing mode, the first drive and sensing structure serves as the sensing structure of the first axis, and the second drive and sensing structure serves as the sensing structure of the second axis. Two swinging mass blocks are respectively connected to the third drive ring and located on opposite sides outside the third drive ring; and A first coupling structure is disposed around the first driving and sensing structure, the second driving and sensing structure and the two oscillating mass blocks, wherein each of the oscillating mass blocks is connected to the third driving ring and the first coupling structure.

13. The microelectromechanical multi-axis angular velocity sensor as described in claim 12, characterized in that, In this driving mode, the direction of the periodic rotational motion of the first driving ring and the second driving ring is different from the direction of the periodic rotational motion of the third driving ring.

14. The microelectromechanical multi-axis angular velocity sensor as described in claim 12 or 13, characterized in that, It further includes multiple first drive springs, multiple second drive springs, a third drive spring, and multiple fixed anchors. The first drive ring connects some of the multiple fixed anchors to the substrate via the multiple first drive springs. The second drive ring connects some of the multiple fixed anchors to the substrate via the multiple second drive springs. The third drive spring is disposed within the third drive ring and connects one of the multiple fixed anchors to the substrate via the third drive spring.

15. The microelectromechanical multi-axis angular velocity sensor as described in claim 12 or 13, characterized in that, Each of the swinging mass blocks includes a third drive frame connected to the third drive ring, a third sensing verification mass block disposed within the third drive frame, and a third sensing spring structure connecting the third sensing verification mass block to the third drive frame. In a sensing mode, the multiple third sensing verification mass blocks included in the two swinging mass blocks serve as a sensing structure for a third axis, which is perpendicular to the first axis and the second axis respectively.

16. The microelectromechanical multi-axis angular velocity sensor as described in claim 15, characterized in that, The first driving and sensing structure further includes a first sensing spring structure connecting the first driving ring and the plurality of first sensing verification mass blocks, wherein the first sensing spring structure and the plurality of first sensing verification mass blocks are disposed within the first driving ring, and the plurality of first sensing verification mass blocks are symmetrical about the second axis.

17. The microelectromechanical multi-axis angular velocity sensor as described in claim 15, characterized in that, The second driving and sensing structure further includes a second sensing spring structure connecting the second driving ring and the plurality of second sensing verification mass blocks, wherein the second sensing spring structure and the plurality of second sensing verification mass blocks are disposed within the second driving ring, and the plurality of second sensing verification mass blocks are symmetrical about the first axis.

18. The microelectromechanical multi-axis angular velocity sensor as described in claim 12, characterized in that, The plurality of first drive comb pairs are symmetrical about the first axis and the second axis, and the plurality of second drive comb pairs are symmetrical about the first axis, the second axis, or the first axis and the second axis.

19. The microelectromechanical multi-axis angular velocity sensor as described in claim 15, characterized in that, It further includes multiple first drive sensing comb pairs and multiple second drive sensing comb pairs, wherein the multiple first drive sensing comb pairs are connected to the first drive ring, and the multiple second drive sensing comb pairs are connected to the second drive ring.

20. The microelectromechanical multi-axis angular velocity sensor as described in claim 19, characterized in that, It further includes multiple frame structures, wherein each frame structure is provided with at least one of the multiple first drive sensing comb pairs or one of the multiple second drive sensing comb pairs, and the multiple frame structures connect the first drive ring to the multiple first drive comb pairs, and the second drive ring to the multiple second drive comb pairs.

21. The microelectromechanical multi-axis angular velocity sensor as described in claim 20, characterized in that, The multiple frame structures are symmetrical about the first axis or the second axis in pairs.

Images