Multiple radio frequency chip module group measurement device and group measurement method thereof

Abstract

A plurality of RF chip module group measuring device and a group measuring method thereof are disclosed. The group measuring device includes a signal analyzer, a power divider, a plurality of control ICs, a signal controller and a power combiner. The power divider receives RF signals and transmits a plurality of RF input signals to the RF chip modules and the control ICs, respectively. The signal controller controls each control IC to adjust at least one of the power and the phase of the corresponding RF input signal to generate an RF output signal. The power combiner receives the RF output signals from each control IC to generate a test signal. The signal analyzer receives the test signal and obtains the corresponding RF characteristics according to at least one of the power and the phase of each RF output signal to shorten the test time.

Description

Technical Field

[0001] This invention relates to a testing technology, and more particularly to a device for testing multiple radio frequency chip modules in a group and a method for such testing. Background Technology

[0002] With the evolution and diversified applications of mobile communication technology, various radio frequency (RF) chips and modules have been developed. During the development of RF chip modules, a packaged test substrate (SKT) is used in conjunction with RF measurement to test the conducted electrical parameters of the RF chip module. During testing, multiple RF chip modules are individually placed on the SKT, and probes are used to directly contact the pins of the RF chip modules to establish an electrical connection. Then, through the transmission and measurement of test signals, RF instruments are used to perform conducted electrical tests on the RF chip modules.

[0003] Figure 1 This is a schematic diagram of a test setup for a single RF chip module in the prior art. Please refer to [link / reference]. Figure 1 An RF chip module 10 is placed on a test board 12. An RF instrument via a transceiver 14 feeds signals into the input of the RF chip module 10, and the output of the RF chip module 10 is connected to the RF instrument via an RF cable. The test board 12 has a power supply circuit and a signal control circuit to control the operation of the RF chip module 10. Therefore, a control unit 16 and a power supply are externally connected to the test board 12 to provide control signals and power signals, respectively. The transceiver 14 and the control unit 16 are controlled by a control host 18. The control unit 16 performs programmable control according to the function of the RF chip module 10. In this conventional approach, the characteristics of the RF chip module 10 are detected by supplying control signals one by one. The data read by the network analyzer 14 is compared with the theoretical characteristics that a standard RF chip module 10 should possess, serving as the basis for testing the function of the RF chip module 10. If the output meets the defined characteristics, the RF chip module 10 is considered to be working normally; otherwise, it is judged as "malfunctioning" or "defective." In calibration, the output of the RF chip module 10 can be made to meet specifications by defining or adjusting control parameters, or by defining an "output table" for the user to embed the RF chip module 10 into its corresponding circuit, or by operating on a table defined for the RF chip module 10. Therefore, when the test is passed, the output characteristics of the RF chip module 10 need to be adjusted simultaneously to meet the design specifications. This calibration requires adjusting control signals to ensure that the correspondence between the output and input of the RF chip module 10 conforms to the usage standards. In this single RF chip module 10 architecture, the calibration method involves gradually adjusting the control signals until the output and input signals of the RF chip module 10 achieve the expected effect.

[0004] Figure 2This is a schematic diagram of another existing RF chip module testing apparatus, which simultaneously houses multiple RF chip modules for group testing. Please refer to... Figure 2 This method reduces the mechanical time required for chip placement by using a group testing mechanism, eliminating the time spent on loading / unloading and signal line connections required for individual testing with RF instruments, thus achieving faster testing. The approach involves designing a test board 20 to simultaneously mount multiple RF chip modules 22. Switchers 24 and 26 are also embedded on this test board. Switchers 24 and 26 can select an RF chip module 22 at different times to construct a complete RF signal loop for testing. Therefore, the test board 20 also includes power supply circuits, control signal circuits, and an external power supply and control unit 28 to perform the testing. This traditional switching method uses switchers 24 and 26 to sequentially switch RF chip modules 22 on different paths to establish a complete RF signal loop for testing. The testing method on this complete RF signal loop is similar to... Figure 1 The test board 20 is identical. It has multiple sockets for mounting multiple RF chip modules 22 one by one. The bottom of each socket has pins for connecting to and controlling the operating state of the RF chip modules 22. The RF signals from the RF chip modules 22 are guided via the pins to the vector network / spectrum analyzer 30 for analysis of the RF characteristics of each module. This path passes through a switch 26 and a directional coupler 32 before finally entering the vector spectrum analyzer 30. Switches 24 and 26 primarily switch the path to the RF chip module 22 to be tested. When testing the first RF chip module 22, switches 24 and 26 switch the path to test the first RF chip module 22, while other paths are disconnected to form a single RF signal loop. When the signal passes through the directional coupler 32, the main signal returns to the modem 34 to ensure the normal operation of the RF chip module 22, and another part of the signal is coupled to the signal analyzer 30 to analyze the test results. After the first RF chip module 22 is tested, switches 24 and 26 switch the path to the second RF chip module 22 to form a second RF signal loop. In this order, RF chip modules 22 are tested one by one. The feature of this architecture is the design of the test board 20, which is an architecture planned for system operation. The external control unit 28, in addition to controlling the operating mode of the RF chip module 22, also needs to control the opening and closing of switches 24 and 26. The advantage of this method is that the architecture is very simple and the manufacturing cost is low. However, the testing time is very long, and the use of switches 24 and 26 on each channel will cause RF matching problems and excessive power loss, because switches 24 and 26 involve a multi-stage construction.

[0005] Therefore, the present invention aims to address the aforementioned problems by proposing a multi-RF chip module group testing device and its group testing method to solve the problems caused by the prior art. Summary of the Invention

[0006] The purpose of this invention is to provide a multi-RF chip module group testing device and its group testing method, which can shorten the testing time, avoid RF characteristic deviations caused by RF circuit open circuits, and maintain the accuracy of the measurement.

[0007] In one embodiment of the present invention, a multi-RF chip module group testing device includes a signal analyzer, a power divider, a signal control circuit, and a power combiner. The signal analyzer generates an RF signal. The power divider is electrically connected to the signal analyzer and the multiple RF chip modules. The power divider receives the RF signal and generates multiple RF input signals accordingly, and transmits all RF input signals to all RF chip modules respectively, wherein the sum of the power of all RF input signals equals the power of the RF signal. The signal control circuit is electrically connected to all RF chip modules, wherein the signal control circuit receives all RF input signals through all RF chip modules and adjusts at least one of the power and phase of each RF input signal to generate multiple RF output signals. The power combiner is electrically connected to the signal control circuit and the signal analyzer. The power combiner receives all RF output signals and sums the power of all RF output signals to generate a test signal. The signal analyzer receives the test signal and obtains its corresponding RF characteristics based on at least one of the power and phase of each RF output signal.

[0008] In one embodiment of the present invention, the signal control circuit includes a plurality of control integrated circuits and a signal controller. All control integrated circuits are electrically connected to all radio frequency chip modules and power combiners, respectively, and the signal controller is electrically connected to all control integrated circuits. All control integrated circuits are used to receive all radio frequency input signals through all radio frequency chip modules, respectively, and the signal controller is used to adjust at least one of the power and phase of each radio frequency input signal through all control integrated circuits, so as to generate all radio frequency output signals using all control integrated circuits.

[0009] In one embodiment of the present invention, each control integrated circuit includes a phase shifter, a variable attenuator, and an amplifier. The phase shifter is electrically connected to a signal controller and an RF chip module. The phase shifter is used to receive an RF input signal through the RF chip module, and the signal controller is used to adjust the phase of the RF input signal through the phase shifter. The variable attenuator is electrically connected to the signal controller and the phase shifter. The variable attenuator is used to receive the RF input signal from the phase shifter, and the signal controller is used to adjust the power of the RF input signal through the variable attenuator. The amplifier is electrically connected to the variable attenuator and amplifies the power of the RF input signal to generate an RF output signal.

[0010] In one embodiment of the present invention, the multiple radio frequency chip module group testing device further includes a control host, which is electrically connected to the signal controller and the signal analyzer, wherein the control host is used to control the operation of the signal controller and the signal analyzer.

[0011] In one embodiment of the present invention, the multiple RF chip module group testing device further includes a test base with multiple slots, all of which are electrically connected to all RF chip modules. A power divider, a signal control circuit and a power combiner are disposed on the test base and electrically connected to the test base.

[0012] In one embodiment of the present invention, the signal analyzer is a vector network analyzer or a vector spectrum analyzer.

[0013] In one embodiment of the present invention, a multi-RF chip module group testing device includes a signal analyzer, a power divider, multiple control integrated circuits, a signal controller, and a power combiner. The signal analyzer generates an RF signal. The power divider is electrically connected to the signal analyzer and the multiple RF chip modules. The power divider receives the RF signal and generates multiple RF input signals accordingly, and transmits all RF input signals to all RF chip modules respectively, wherein the sum of the power of all RF input signals equals the power of the RF signal. All control integrated circuits are integrated into all RF chip modules, wherein all control integrated circuits receive all RF input signals through all RF chip modules respectively. The signal controller is electrically connected to all control integrated circuits, wherein the signal controller controls each control integrated circuit to adjust at least one of the power and phase of its corresponding RF input signal to generate an RF output signal. The power combiner is electrically connected to each control integrated circuit and the signal analyzer. The power combiner receives the RF output signal from each control integrated circuit and sums the power of all RF output signals to generate a test signal. The signal analyzer is used to receive test signals and obtain the corresponding RF characteristics based on at least one of the power and phase of each RF output signal.

[0014] In one embodiment of the present invention, each control integrated circuit includes a phase shifter, a variable attenuator, and an amplifier. The phase shifter is electrically connected to a signal controller and an RF chip module. The phase shifter is used to receive an RF input signal through the RF chip module, and the signal controller is used to adjust the phase of the RF input signal through the phase shifter. The variable attenuator is electrically connected to the signal controller and the phase shifter. The variable attenuator is used to receive the RF input signal from the phase shifter, and the signal controller is used to adjust the power of the RF input signal through the variable attenuator. The amplifier is electrically connected to the variable attenuator and amplifies the power of the RF input signal to generate an RF output signal.

[0015] In one embodiment of the present invention, the multiple radio frequency chip module group testing device further includes a control host, which is electrically connected to the signal controller and the signal analyzer, wherein the control host is used to control the operation of the signal controller and the signal analyzer.

[0016] In one embodiment of the present invention, the multiple RF chip module group testing device further includes a test base with multiple slots, all of which are electrically connected to all RF chip modules. A power divider and a power combiner are disposed on the test base and electrically connected to the test base.

[0017] In one embodiment of the present invention, the signal analyzer is a vector network analyzer or a vector spectrum analyzer.

[0018] In one embodiment of the present invention, a method for testing multiple radio frequency (RF) chip modules is provided, comprising the following steps: receiving an RF signal and generating multiple RF input signals accordingly, and transmitting all RF input signals to multiple RF chip modules respectively, wherein the sum of the power of all RF input signals is equal to the power of the RF signal; receiving all RF input signals through all RF chip modules, and adjusting at least one of the power and phase of each RF input signal to generate multiple RF output signals; summing the power of all RF output signals to generate a test signal; and receiving the test signal and obtaining the corresponding RF characteristics of each RF output signal based on at least one of the power and phase of each RF output signal.

[0019] In one embodiment of the present invention, in the step of adjusting at least one of the power and phase of each radio frequency input signal, the phase of each radio frequency input signal is adjusted first, and then the power of each radio frequency input signal is adjusted.

[0020] Based on the above, the multi-RF chip module group testing device and its group testing method use control integrated circuits to adjust the phase or power of the RF signal, and determine the test object based on the phase or power of the RF output signal, thereby shortening the test time.

[0021] In order to gain a better understanding of the structural features and effects achieved by the present invention, the following description is provided with reference to preferred embodiment figures and detailed explanation. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a test device for a single RF chip module in the prior art.

[0023] Figure 2 This is a schematic diagram of another RF chip module test device in the prior art.

[0024] Figure 3This is a schematic diagram of a multi-RF chip module group testing device according to the first embodiment of the present invention.

[0025] Figure 4 This is a schematic diagram of a control integrated circuit according to an embodiment of the present invention.

[0026] Figure 5 This is a schematic diagram of a multi-RF chip module group testing device according to a second embodiment of the present invention.

[0027] Figure labeling: 10-RF chip module; 12-Test board; 14-Signal transceiver; 16-Control unit; 18-Control host; 20-Test board; 22-RF chip module; 24-Switcher; 26-Switcher; 28-Control unit; 30-Signal transceiver; 32-Directional coupler; 34-Modem; 4-Multiple RF chip module group test device; 40-Signal analyzer; 41-Power divider; 42-Signal control circuit; 420-Control integrated circuit; 420A-Phase shifter; 420B-Variable attenuator; 420C-Amplifier; 421-Signal controller; 43-Power combiner; 44-RF chip module; 45-Control host; 46-Test base; R-RF signal; RI-RF input signal; RO-RF output signal; T-Test signal. Detailed Implementation

[0028] Embodiments of the present invention will be further explained below with reference to the accompanying drawings. Wherever possible, the same reference numerals represent the same or similar components in the drawings and description. In the drawings, shapes and thicknesses may be exaggerated for simplicity and convenience. It is understood that elements not specifically shown in the drawings or described in the description are forms known to those skilled in the art. Those skilled in the art can make various changes and modifications based on the content of this invention.

[0029] When an element is referred to as “on”, it can mean either that the element is directly on another element or that another element exists between the two. Conversely, when an element is referred to as “directly on” another element, it cannot mean that another element exists between the two. As used herein, the term “and / or” includes any combination of one or more of the listed related items.

[0030] In the following description of "one embodiment" or "an embodiment," the term refers to a specific element, structure, or feature associated with at least one embodiment. Therefore, the multiple descriptions of "one embodiment" or "an embodiment" appearing in various places below do not refer to the same embodiment. Furthermore, specific components, structures, and features in one or more embodiments may be combined in a suitable manner.

[0031] This invention is described in particular by way of the following examples, which are merely illustrative. Various modifications and refinements can be made by those skilled in the art without departing from the spirit and scope of this invention. Therefore, the scope of protection of this invention is determined by the claims. Throughout the specification and claims, unless explicitly stated otherwise, the words “a” and “described” include “a or at least one” of the stated elements or components. Furthermore, as used herein, the singular article also includes descriptions of multiple elements or components unless clearly indicated from the specific context. Moreover, when applied in this description and throughout the claims, unless explicitly stated otherwise, “in which” may include both “in which” and “therein”. The terms used throughout the specification and claims, unless otherwise specified, generally have their ordinary meaning in the context of this invention and its specific application. Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to practitioners in describing the invention. Examples throughout this specification, including examples of any terms discussed herein, are for illustrative purposes only and do not limit the scope or meaning of the invention or any of the illustrative terms. Similarly, the invention is not limited to the various embodiments set forth in this specification.

[0032] Furthermore, the use of the terms "electrical coupling" or "electrical connection" herein includes any direct or indirect means of electrical connection. For example, if a first device is described as electrically coupled to a second device, it means that the first device can be directly connected to the second device, or indirectly connected to the second device through other devices or connection means. Additionally, in descriptions concerning the transmission or provision of electrical signals, those skilled in the art will understand that attenuation or other non-ideal variations may occur during the transmission of electrical signals, but unless otherwise specified, the source and receiver of the transmitted or provided electrical signal should be considered substantially the same signal. For example, if an electrical signal S is transmitted (or provided) from terminal A of an electronic circuit to terminal B of the same electronic circuit, a voltage drop may occur across the source and drain terminals of a transistor switch and / or possible stray capacitances. However, unless the purpose of this design is to intentionally utilize attenuation or other non-ideal variations during transmission (or provision) to achieve certain specific technical effects, the electrical signal S at terminals A and B of the electronic circuit should be considered substantially the same signal.

[0033] Unless otherwise specified, certain conditional clauses or words, such as "can," "could," "might," or "may," are generally intended to express features, elements, or steps that are present in the embodiments of this invention, but may also be interpreted as features, elements, or steps that may not be required. In other embodiments, these features, elements, or steps may be unnecessary.

[0034] It is understood that terms such as "comprising," "including," "having," "containing," and "involving," as used herein, are open-ended, meaning they include but are not limited to. Furthermore, no embodiment or claim of this invention is required to achieve all the objects, advantages, or features disclosed in this invention. In addition, the abstract and headings are merely for assisting in patent document searches and are not intended to limit the scope of protection of the invention.

[0035] The following will provide a multi-RF chip module group testing device and its group testing method, which uses a control integrated circuit to adjust the phase or power of the RF signal, and determines the test object based on the phase or power of the RF output signal, thereby shortening the test time.

[0036] Figure 3 This is a schematic diagram of a multi-RF chip module group testing device according to the first embodiment of the present invention. Figure 4 This is a schematic diagram of a control integrated circuit according to an embodiment of the present invention. Please refer to [link / reference]. Figure 3 and Figure 4 The following describes a first embodiment of a multi-RF chip module group testing device 4. The multi-RF chip module group testing device 4 includes a signal analyzer 40, a power divider 41, a signal control circuit 42, and a power combiner 43. The signal analyzer 40 can be, but is not limited to, a vector spectrum analyzer. The power divider 41 is electrically connected to the signal analyzer 40 and the multiple RF chip modules 44. The signal control circuit 42 is electrically connected to all the RF chip modules 44. The power combiner 43 is electrically connected to the signal control circuit 42 and the signal analyzer 40.

[0037] The following describes a method for testing multiple RF chip modules. First, a signal analyzer 40 generates an RF signal R. A power divider 41 receives the RF signal R and generates multiple RF input signals RI accordingly. All RF input signals RI are then transmitted to all RF chip modules 44, and the sum of the power of all RF input signals RI equals the power of the RF signal R. A signal control circuit 42 receives all RF input signals RI from all RF chip modules 44 and adjusts at least one of the power and phase of each RF input signal RI to generate multiple RF output signals RO. A power combiner 43 receives all RF output signals RO and sums their power to generate a test signal T. A signal analyzer 40 receives the test signal T and obtains the corresponding RF characteristics of each RF output signal RO based on at least one of the power and phase. The power and phase of each RF output signal RO represent the marking of its corresponding RF chip module 44. The signal analyzer 40 can simultaneously test all RF chip modules 44 and determine the test object based on the phase or power of the RF output signal RO, thereby shortening the test time. When the number of RF chip modules 44 is four, the test time is 8 seconds.

[0038] The signal control circuit 42 may include multiple control integrated circuits 420 and a signal controller 421. All control integrated circuits 420 are electrically connected to all RF chip modules 44 and the power combiner 43, respectively, and the signal controller 421 is electrically connected to all control integrated circuits 420. All control integrated circuits 420 receive all RF input signals RI through all RF chip modules 44, and the signal controller 421 adjusts at least one of the power and phase of each RF input signal RI through all control integrated circuits 420, thereby generating all RF output signals RO using all control integrated circuits 420.

[0039] Each control integrated circuit 420 may include a phase shifter 420A, a variable attenuator 420B, and an amplifier 420C. The phase shifter 420A is electrically connected to the signal controller 421 and the RF chip module 44; the variable attenuator 420B is electrically connected to the signal controller 421 and the phase shifter 420A; and the amplifier 420C is electrically connected to the variable attenuator 420B and the power combiner 43. The positions of the phase shifter 420A, the variable attenuator 420B, and the amplifier 420C can be changed as needed. The phase shifter 420A receives the RF input signal RI through the RF chip module 44, and the signal controller 421 adjusts the phase of the RF input signal RI through the phase shifter 420A. The variable attenuator 420B receives the RF input signal RI from the phase shifter 420A, and the signal controller 421 adjusts the power of the RF input signal RI through the variable attenuator 420B. Amplifier 420C receives the RF input signal RI from variable attenuator 420B and amplifies the power of the RF input signal RI to generate the RF output signal RO.

[0040] In some embodiments of the present invention, the multiple RF chip module group testing device 4 may further include a control host 45, which is electrically connected to the signal controller 421 and the signal analyzer 40. The control host 45 controls the operation of the signal controller 421 and the signal analyzer 40. The control host 45 knows the power and phase of each RF input signal RI and transmits this to the signal analyzer 40, so that the signal analyzer 40 identifies all RF output signals RO corresponding to all RF chip modules 44 respectively. In addition, the multiple RF chip module group testing device 4 may further include a test base 46, which is provided with multiple sockets. All sockets are electrically connected to all RF chip modules 44 respectively. The power divider 41, the signal control circuit 42, and the power combiner 43 are disposed on the test base 46 and electrically connected to the test base 46.

[0041] Figure 5 This is a schematic diagram of a multi-RF chip module group testing device according to a second embodiment of the present invention. Please refer to [link / reference]. Figure 4 and Figure 5 The following describes a second embodiment of the multiple RF chip module group testing device 4. The multiple RF chip module group testing device 4 includes a signal analyzer 40, a power divider 41, multiple control integrated circuits 420, a signal controller 421, and a power combiner 43. The signal analyzer 40 can be, but is not limited to, a vector spectrum analyzer. The power divider 41 is electrically connected to the signal analyzer 40 and the multiple RF chip modules 44. All control integrated circuits 420 are integrated into all RF chip modules 44. The signal controller 421 is electrically connected to all control integrated circuits 420. The power combiner 43 is electrically connected to each control integrated circuit 420 and the signal analyzer 40.

[0042] The following describes a method for testing multiple RF chip modules. First, a signal analyzer 40 generates an RF signal R. A power divider 41 receives the RF signal R and generates multiple RF input signals RI accordingly. All RF input signals RI are then transmitted to all RF chip modules 44, and the sum of the power of all RF input signals RI equals the power of the RF signal R. All control integrated circuits 420 receive all RF input signals RI through all RF chip modules 44. A signal controller 421 controls each control integrated circuit 420 to adjust at least one of the power and phase of its corresponding RF input signal RI to generate an RF output signal RO. A power combiner 43 receives the RF output signals RO from each control integrated circuit 420 and sums the power of all RF output signals RO to generate a test signal T. The signal analyzer 40 receives the test signal T and obtains the corresponding RF characteristics based on at least one of the power and phase of each RF output signal RO. The power and phase of each RF output signal RO represent the marking of its corresponding RF chip module 44. The signal analyzer 40 can test all RF chip modules 44 simultaneously and determine the test object based on the phase or power of the RF output signal RO, thereby shortening the test time. When the number of RF chip modules 44 is four, the test time is 8 seconds.

[0043] The internal circuitry and operation of the control integrated circuit 420 in the second embodiment are the same as those in the control integrated circuit 420 in the first embodiment, and will not be described again here.

[0044] In some embodiments of the present invention, the multiple RF chip module group testing device 4 may further include a control host 45, which is electrically connected to the signal controller 421 and the signal analyzer 40. The control host 45 controls the operation of the signal controller 421 and the signal analyzer 40. The control host 45 knows the power and phase of each RF input signal RI and transmits this to the signal analyzer 40, so that the signal analyzer 40 identifies all RF output signals RO corresponding to all RF chip modules 44 respectively. In addition, the multiple RF chip module group testing device 4 may further include a test base 46, which is provided with multiple sockets, all of which are electrically connected to all RF chip modules 44 respectively, and a power divider 41 and a power combiner 43 are disposed on the test base 46 and electrically connected to the test base 46.

[0045] The following describes how the signal analyzer 40 identifies the test object. Assume an external RF instrument generates an RF signal I(t), which is provided to n RF paths via a power divider. The RF signal of the nth RF path is represented as I. n (t), therefore I(t) = Where t is time and N is the total number of control integrated circuits. The signal response generated by the integrated circuit on the nth path and the RF chip module under test is Q. n (t)=S n (t)R n (t), where S n (t) represents the signal response generated by the nth control integrated circuit, R n (t) represents the signal response generated by the nth RF chip module under test. Assuming there is no control integrated circuit, then S n (t)=1, or only the transmission line generates a signal change. On the nth RF path, via I n (t) The signal generated by the feed control integrated circuit and the RF chip module under test is I. n (t)Q n (t). The sum of the signals generated by this signal through the power combiner is V. tot (t), therefore we can obtain formula (1):

[0046] (1)

[0047] Formula (1) indicates that when the RF signal is output after being processed by the RF chip module, the RF signal is generated after passing through the RF circuit and power combiner, and can be measured by the RF network and spectrum analyzer. The characteristic discrimination and calibration of the RF chip module requires I... n (t)Q n Information about (t), especially Q n (t), because I n (t) is unknown. I can be solved using formula (1). n (t)Q n (t). Suppose S n If (t) is controllable, or is a sequence, code, etc., that can be identified using digital signal processing, then I can be found. n (t)R n (t). Therefore, according to formula (1), we get formula (2).

[0048] (2)

[0049] Formula (2) has N unknown functions, requiring N signals to solve for N unknown functions. Therefore, the focus is on generating S. n (t) and using hardware to implement S n (t) technique.

[0050] (1) Assume S n (t)= (tt n ), () represents an impulse function, t n This represents the nth time point.

[0051] (3)

[0052] Formula (3) can be achieved by switching the RF chip module or other components, such as... Figure 3 As shown, this can be achieved through an RF switch. Therefore, the identification code for the nth path is 00…1000… etc.

[0053] (2) Assume S n (t)= ;I n (t) via S n (t), to obtain formula (4).

[0054] (4)

[0055] According to formula (4), a fixed phase change is generated, and then the Discrete Fourier Transform (DFT) relationship is obtained.

[0056] (3) Assume S n If (t) generates orthogonal signals, then the inner product of the signal functions can be used to solve the problem, as shown in formula (5).

[0057] [I n (t)R n (t)](S n (t), S n (t))=(V tot (t), S n (t)) (5)

[0058] (4) Assume S n If the signals (t) are not orthogonal, then formula (5) generates a set of linear equations. Solving these linear equations will help find [I]. n (t)R n (t)].

[0059] (5) If the internal radio frequency devices in the radio frequency chip module can be accessed, then R n (t)=1, but S n (t)=R' n (t)S' n (t), where R' n (t) represents the response of the controllable device in the radio frequency chip module.

[0060] According to the above embodiments, the multi-RF chip module group testing device and its group testing method utilize control integrated circuits to adjust the phase or power of the RF signal, or generate corresponding signal identifiers, and determine the test object based on the phase or power or identifier of the RF output signal, thereby shortening the test time.

[0061] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, all equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-RF chip module group testing device, characterized in that, include: A signal analyzer for generating a radio frequency signal, wherein the signal analyzer is a vector spectrum analyzer; A power divider is electrically connected to the signal analyzer and multiple radio frequency chip modules, wherein the power divider is used to receive the radio frequency signal and generate multiple radio frequency input signals accordingly, and respectively transmit the multiple radio frequency input signals to the multiple radio frequency chip modules, and the sum of the power of the multiple radio frequency input signals is equal to the power of the radio frequency signal; A signal control circuit is electrically connected to the plurality of radio frequency chip modules, wherein the signal control circuit is used to receive the plurality of radio frequency input signals through the plurality of radio frequency chip modules, and adjust at least one of the power and phase of each of the radio frequency input signals to generate a plurality of radio frequency output signals. as well as A power combiner is electrically connected to the signal control circuit and the signal analyzer, wherein the power combiner is used to receive the plurality of radio frequency output signals and add the power of the plurality of radio frequency output signals to generate a test signal, and the signal analyzer is used to receive the test signal and obtain the corresponding radio frequency characteristics of each of the radio frequency output signals based on at least one of the power and phase of each of the radio frequency output signals.

2. The multiple RF chip module group testing device as described in claim 1, characterized in that, The signal control circuit includes: Multiple control integrated circuits are electrically connected to the multiple radio frequency chip modules and the power combiner, respectively, wherein the multiple control integrated circuits are used to receive the multiple radio frequency input signals through the multiple radio frequency chip modules; and A signal controller is electrically connected to the plurality of control integrated circuits, wherein the signal controller is configured to adjust at least one of the power and phase of each of the radio frequency input signals via the plurality of control integrated circuits to generate the plurality of radio frequency output signals respectively using the plurality of control integrated circuits.

3. The multiple RF chip module group testing device as described in claim 2, characterized in that, Each of the aforementioned control integrated circuits includes: A phase shifter is electrically connected to the signal controller and the radio frequency chip module, wherein the phase shifter is used to receive the radio frequency input signal through the radio frequency chip module, and the signal controller is used to adjust the phase of the radio frequency input signal through the phase shifter; A variable attenuator is electrically connected to the signal controller and the phase shifter, wherein the variable attenuator is used to receive the radio frequency input signal from the phase shifter, and the signal controller is used to adjust the power of the radio frequency input signal via the variable attenuator; and An amplifier electrically connected to the variable attenuator and the power combiner, wherein the amplifier is used to receive the radio frequency input signal from the variable attenuator and amplify the power of the radio frequency input signal to generate the radio frequency output signal.

4. The multiple RF chip module group testing device as described in claim 2, characterized in that, It also includes a control host electrically connected to the signal controller and the signal analyzer, wherein the control host is used to control the operation of the signal controller and the signal analyzer.

5. The multiple RF chip module group testing device as described in claim 1, characterized in that, It also includes a test base with multiple slots, which are electrically connected to the multiple radio frequency chip modules respectively. The power divider, the signal control circuit and the power combiner are located on the test base and electrically connected to the test base.

6. A multi-RF chip module group testing device, characterized in that, include: A signal analyzer for generating a radio frequency signal, wherein the signal analyzer is a vector spectrum analyzer; A power divider is electrically connected to the signal analyzer and multiple radio frequency chip modules, wherein the power divider is used to receive the radio frequency signal and generate multiple radio frequency input signals accordingly, and respectively transmit the multiple radio frequency input signals to the multiple radio frequency chip modules, and the sum of the power of the multiple radio frequency input signals is equal to the power of the radio frequency signal; Multiple control integrated circuits are respectively integrated into the multiple radio frequency chip modules, wherein the multiple control integrated circuits are used to receive the multiple radio frequency input signals through the multiple radio frequency chip modules respectively; A signal controller is electrically connected to the plurality of control integrated circuits, wherein the signal controller is used to control each of the control integrated circuits to adjust at least one of the power and phase of its corresponding radio frequency input signal to generate a radio frequency output signal. as well as A power combiner is electrically connected to each of the control integrated circuits and the signal analyzer, wherein the power combiner is used to receive the radio frequency output signals from each of the control integrated circuits and sum the power of all the radio frequency output signals to generate a test signal, and the signal analyzer is used to receive the test signal and obtain the corresponding radio frequency characteristics of each of the radio frequency output signals based on at least one of the power and phase of each of the radio frequency output signals.

7. The multiple RF chip module group testing device as described in claim 6, characterized in that, Each of the aforementioned control integrated circuits includes: A phase shifter is electrically connected to the signal controller and the radio frequency chip module, wherein the phase shifter is used to receive the radio frequency input signal through the radio frequency chip module, and the signal controller is used to adjust the phase of the radio frequency input signal through the phase shifter; A variable attenuator is electrically connected to the signal controller and the phase shifter, wherein the variable attenuator is used to receive the radio frequency input signal from the phase shifter, and the signal controller is used to adjust the power of the radio frequency input signal via the variable attenuator; and An amplifier electrically connected to the variable attenuator and the power combiner, wherein the amplifier is used to receive the radio frequency input signal from the variable attenuator and amplify the power of the radio frequency input signal to generate the radio frequency output signal.

8. The multiple RF chip module group testing device as described in claim 6, characterized in that, It also includes a control host electrically connected to the signal controller and the signal analyzer, wherein the control host is used to control the operation of the signal controller and the signal analyzer.

9. The multiple RF chip module group testing device as described in claim 6, characterized in that, It also includes a test base with multiple slots, which are electrically connected to the multiple radio frequency chip modules respectively. The power divider and the power combiner are located on the test base and electrically connected to the test base.

10. A method for group testing of multiple radio frequency chip modules, characterized in that, Includes the following steps: A radio frequency (RF) signal is received, and multiple RF input signals are generated accordingly. The multiple RF input signals are then transmitted to multiple RF chip modules, and the sum of the power of the multiple RF input signals is equal to the power of the RF signal. The plurality of radio frequency (RF) input signals are received by the plurality of RF chip modules, and at least one of the power and phase of each RF input signal is adjusted to generate a plurality of RF output signals. The power of the plurality of radio frequency output signals is summed to generate a test signal; as well as The test signal is received using a vector spectrum analyzer, and its corresponding radio frequency characteristics are obtained based on at least one of the power and phase of each radio frequency output signal.

11. The method for group testing of multiple RF chip modules as described in claim 10, characterized in that, In the step of adjusting at least one of the power and phase of each of the radio frequency input signals, the phase of each of the radio frequency input signals is adjusted first, and then the power of each of the radio frequency input signals is adjusted.

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