Hermetic packaging structure and packaging process of medical board

Abstract

The present application relates to a hermetic packaging structure and packaging process for a medical board. A plurality of rows of pads are provided on a substrate, and a plurality of chips are arranged on the substrate at intervals. On the side of each chip facing away from the substrate, there are a plurality of rows of welding feet. The plurality of welding feet correspond to the plurality of pads one by one and are electrically connected through connecting pieces. On the side of each connecting piece facing away from the substrate, a heat-conducting insulating layer is covered; the heat sink includes a first protruding part, a plurality of second protruding parts and a plurality of abutting parts. The first protruding part is arranged on the side of the chip facing away from the substrate. A second protruding part is provided between every two adjacent chips. The extending direction of the second protruding part is parallel to the arrangement direction of the corresponding welding feet. The second protruding part and the first protruding part are connected through the abutting part, and the abutting part covers the heat-conducting insulating layer of the same row; the plastic encapsulation layer wraps one end of the heat sink close to the substrate, so that the ends of the first protruding part and the second protruding part away from the substrate are exposed. The present application has the effect of preventing the leakage of chip-related functions and customer information.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and particularly to a hermetic packaging structure and packaging process for a medical board. Background Art

[0002] A medical board, namely a medical circuit board, is mainly applied to medical device electronic equipment. Chips are installed on the medical circuit board, and the chips complete medical operations and processing tasks. The medical circuit board can not only fix the chips but also ensure the electrical connection between the chips. Relevant data is marked on the surface of the chips. When the medical circuit board is disassembled and assembled, the relevant functions and customer information of the chips will be leaked. Therefore, it is necessary to hermetically package the chips. Summary of the Invention

[0003] In order to prevent the leakage of chip-related functions and customer information after the medical board is disassembled and assembled, this application provides a hermetic packaging structure and packaging process for a medical board.

[0004] The hermetic packaging structure and packaging process for a medical board provided by this application adopt the following technical solutions:

[0005] In a first aspect, a hermetic packaging structure for a medical board includes:

[0006] A substrate, on which multiple rows of pads are provided;

[0007] Multiple chips are arranged on the substrate at intervals. On the side of each chip facing away from the substrate, multiple rows of welding pins are provided. The multiple welding pins correspond to the multiple pads one by one and are electrically connected through connecting pieces. On the side of each connecting piece facing away from the substrate, a thermally conductive insulating layer is covered; the connecting piece has a first connecting portion connected to the welding pin, a second connecting portion connected to the pad, and a bending portion, and the first connecting portion and the second connecting portion are connected through the bending portion;

[0008] A radiator, including a first protruding portion, multiple second protruding portions, and multiple abutting portions. The first protruding portion is provided on the side of the chip facing away from the substrate. The second protruding portion is provided between every two adjacent chips. The extending direction of the second protruding portion is parallel to the arrangement direction of the corresponding welding pins. The second protruding portion and the first protruding portion are connected through the abutting portion, and the abutting portion covers the thermally conductive insulating layer of the same row; and,

[0009] A plastic encapsulation layer wraps one end of the radiator close to the substrate, so that the ends of the first protruding portion and the second protruding portion away from the substrate are exposed.

[0010] By adopting the above technical solution, the chip is encapsulated in the plastic package layer, which can avoid the leakage of information on the chip and achieve the hermetic packaging of the chip. The pads of the substrate are electrically connected to the pins of the chip through connecting pieces. Compared with the connection of pads and pins by gold wires, the contact area between the connecting pieces and the pads and pins is larger, which can improve the stability of the electrical connection between the pads and pins and avoid the problems such as warping and cracking that are prone to occur during the wire bonding process.

[0011] By providing a heat sink, the abutting part in the heat sink abuts against the thermally conductive insulating layer. On the one hand, the connecting piece can transfer the heat generated by the chip to the substrate, and on the other hand, it can transfer the heat generated by the chip to the heat sink. The heat sink dissipates heat to the outside through the first protrusion and the second protrusion located outside the plastic package layer. On the one hand, the heat sink plays a role in heat dissipation. On the other hand, during the process of forming the plastic package layer on the chip, by pressing the first protrusion and the second protrusion towards the substrate, a force can be applied to the abutting part, so that the connecting piece is in close contact with the pads and pins. During the filling process of the plastic encapsulant, a continuous force is applied to the abutting part. After the plastic encapsulant is cured, the plastic encapsulant can restrict the abutting part and the connecting piece, so that the connecting piece always remains in a state of close contact with the pads and pins, which can improve the stability of the electrical connection between the pads and pins.

[0012] Optionally, the chip is a chip component formed by stacking multiple chip bodies. Along the stacking direction of the chip bodies, the lengths of the chip bodies decrease in sequence, so that the end of the chip component is arranged in a stepped shape. The connecting piece is adapted to the end of the chip component, so that all the multiple chip bodies in the chip component are electrically connected to the substrate.

[0013] By adopting the above technical solution, the setting of the connecting piece can realize the electrical connection of multiple chips. The stacking of multiple chips can save space size and make the volume of the packaging structure smaller.

[0014] Optionally, there are multiple chip components, and the multiple chip components are arranged at intervals.

[0015] By adopting the above technical solution, when pressing the second protrusion, a force can be simultaneously applied to the abutting part on the adjacent chip component, improving the packaging efficiency.

[0016] Optionally, the ends of the chip components are all arranged in a stepped shape.

[0017] By adopting the above technical solution, when pressing the second protrusion, a force can be evenly applied to the adjacent connecting pieces, and at the same time, the adjacent connecting pieces are in close contact with the pads and pins, improving the uniformity of the connection strength between the pads and the connecting pieces at various places.

[0018] Optionally, there are two rows of pins arranged in parallel, and the first protrusion is arranged in an inverted U shape.

[0019] By adopting the above technical solution, the first protruding part is set to an inverted U shape, which can increase the elasticity of the first protruding part. When pressing the first protruding part, both ends of the first protruding part can apply force to the two connecting pieces simultaneously. At the same time, the distance between the middle part of the first protruding part and the chip can be increased, reducing the possibility of chip damage caused by the contact between the middle part of the first protruding part and the chip when pressing the first protruding part.

[0020] Optionally, there are four rows of the welding feet, and the four rows of the welding feet are arranged in the circumferential direction of the chip. The first protruding part is in a cylindrical shape, and one end of the first protruding part close to the substrate is open.

[0021] By adopting the above technical solution, the elasticity of the first protruding part can be increased. When pressing the first protruding part, the first protruding part can apply force to the four connecting pieces simultaneously. At the same time, the distance between the middle part of the first protruding part and the chip can be increased, reducing the possibility of chip damage caused by the contact between the middle part of the first protruding part and the chip when pressing the first protruding part.

[0022] Optionally, one ends of the first protruding part and the second protruding part far from the substrate are located in the same plane.

[0023] By adopting the above technical solution, it is convenient to apply force to the first protruding part and the second protruding part simultaneously, making the connecting pieces in close contact with the pads and the welding feet, and improving the packaging efficiency.

[0024] Optionally, a heat dissipation sealing layer is provided on the plastic sealing layer.

[0025] By adopting the above technical solution, the heat dissipation efficiency of the packaging structure can be improved.

[0026] Optionally, heat dissipation fins are provided on the parts of the first protruding part and the second protruding part outside the plastic sealing layer.

[0027] By adopting the above technical solution, the heat dissipation efficiency of the radiator can be improved.

[0028] In a second aspect, the present application also provides a hermetic packaging process for a medical board, including the following steps:

[0029] Provide a substrate, and multiple rows of pads are arranged on the substrate;

[0030] Provide multiple chips, and multiple rows of welding feet are provided on the chips. Install the multiple chips on the substrate at intervals so that the multiple rows of pads correspond to the multiple rows of welding feet one by one;

[0031] A plurality of connecting pieces are provided, each of which has a first connecting portion connected to the solder foot, a second connecting portion connected to the solder pad, and a bending portion, wherein the first connecting portion and the second connecting portion are connected via the bending portion; the connecting piece is covered with a heat-conducting insulating layer, and each row of the solder pads is electrically connected to the corresponding solder foot via the connecting piece;

[0032] A heat sink is provided, the heat sink comprising a first protruding portion, a plurality of second protruding portions and a plurality of abutting portions, the second protruding portion is located outside the first protruding portion and connected to the first protruding portion through the abutting portion, the abutting portion is adapted to the connecting piece; the heat sink is mounted on the substrate so that the abutting portion abuts against the connecting piece, the first protruding portion is located above the chip, and the second protruding portion is located between adjacent chips; and,

[0033] A plastic sealing layer is formed to wrap the end of the heat sink close to the substrate, so that the first protrusion and the second protrusion are exposed at the end away from the substrate.

[0034] By adopting the above technical solution, the chip is encapsulated in the plastic layer, which can avoid information leakage on the chip and realize confidential packaging of the chip. The contact area between the connecting piece and the pad and the solder foot is large, which can improve the stability of the electrical connection between the pad and the solder foot, and avoid the occurrence of warping, cracking, etc. during the wire bonding process. By providing a heat sink, the abutting portion in the heat sink abuts against the thermal insulation layer, the connecting piece can transfer the heat generated by the chip to the substrate on the one hand, and transfer the heat generated by the chip to the heat sink on the other hand, and the heat sink dissipates heat to the outside through the first protrusion and the second protrusion located outside the plastic layer.

[0035] Optionally, before forming the plastic sealing layer, the method further includes: providing a pressing device, and using the pressing device to press the first protrusion and the second protrusion toward the substrate at the same time with a preset pressure.

[0036] By adopting the above technical solution, by pressing the first protrusion and the second protrusion toward the direction of the substrate, force can be applied to the abutment portion, so that the connecting piece is in close contact with the pad and the solder foot. During the plastic encapsulation filling process, force is continuously applied to the abutment portion. After the plastic encapsulation is solidified, the plastic encapsulation can limit the abutment portion and the connecting piece, so that the connecting piece is always kept in close contact with the pad and the solder foot, thereby improving the stability of the electrical connection between the pad and the solder foot.

[0037] In summary, the present application includes at least one of the following beneficial technical effects:

[0038] 1. Encapsulating the chip in a plastic layer can prevent information leakage on the chip and achieve confidential packaging of the chip; the pads of the substrate and the soldering feet of the chip are electrically connected through the connecting piece, which can improve the stability of the electrical connection between the pads and the soldering feet;

[0039] 2. The abutting part in the heat sink abuts against the thermally conductive insulating layer, which can dissipate heat from the chip. By pressing the first protruding part and the second protruding part towards the substrate, force can be applied to the abutting part, making the connecting piece in close contact with the pad and the welding leg, which can improve the stability of the electrical connection between the pad and the welding leg.

[0040] 3. Multiple chips are stacked to form a chip assembly. The end of the chip assembly is arranged in a stepped shape. The connecting piece can realize the electrical connection of multiple chips. Stacking multiple chips can save space and make the volume of the packaging structure smaller. Description of the Drawings

[0041] Figure 1 is a schematic structural diagram of the hermetic packaging structure of the medical board in Embodiment 1 of the present application;

[0042] Figure 2 is Figure 1 an enlarged schematic view of part A in

[0043] Figure 3 is a schematic structural diagram of the hermetic packaging structure of the medical board in Embodiment 1 of the present application;

[0044] Figure 4 is Figure 3 an enlarged schematic view of part B in

[0045] Description of the Reference Numerals: 1. Substrate; 11. Pad; 2. Chip; 21. Welding leg; 3. Connecting piece; 3a. First connecting part; 3b. Second connecting part; 3c. Bending part; 31. Thermally conductive insulating layer; 4. Heat sink; 41. First protruding part; 42. Second protruding part; 43. Abutting part; 44. Supporting part; 5. Plastic sealing layer; 6. Heat dissipation sealing layer; 7. Heat dissipation fin. Detailed Embodiments

[0046] The following further describes the present application in detail with reference to the attached Figures 1-4 drawings.

[0047] Embodiment 1

[0048] The embodiment of the present application discloses a hermetic packaging structure of a medical board. Referring to Figure 1 , the hermetic packaging structure of the medical board includes a substrate 1, multiple chips 2, multiple connecting pieces 3, a heat sink 4 and a plastic sealing layer 5.

[0049] Combined with Figure 1 and Figure 2, multiple rows of pads 11 are provided on the substrate 1, and circuits connected to the pads 11 are provided on the substrate 1. Multiple chips 2 are arranged on the substrate 1 at intervals, and multiple rows of solder feet 21 are provided on the side of each chip 2 facing away from the substrate 1. Multiple solder feet 21 correspond to multiple pads 11 one by one, and are electrically connected through a connecting piece 3. The connecting piece 3 is Z-shaped, and has a first connecting portion 3a connected to the solder feet 21, a second connecting portion 3b connected to the pad 11, and a bending portion 3c. The first connecting portion 3a and the second connecting portion 3b are connected through the bending portion 3c. The angle between the first connecting portion 3a and the bending portion 3c is an obtuse angle, and the angle between the second connecting portion 3b and the bending portion 3c is an obtuse angle. The side of each connecting piece 3 facing away from the substrate 1 is covered with a heat-conducting insulating layer 31, and the heat-conducting insulating layer 31 is Z-shaped to match the connecting piece 3.

[0050] The pad 11 of the substrate 1 and the solder foot 21 of the chip 2 are electrically connected via the connecting piece 3. Compared with the connection between the pad 11 and the solder foot 21 via gold wire, the contact area between the connecting piece 3 and the pad 11 and the solder foot 21 is larger, which can improve the stability of the electrical connection between the pad 11 and the solder foot 21 and avoid warping, cracking, etc. that may easily occur during the wire bonding process.

[0051] The thermally conductive insulating layer 31 can be formed by curing an insulating thermally conductive adhesive, which is a type of one-component room temperature vulcanized silicone adhesive, which has the characteristics of being easy to use, having high bonding strength, being elastic after curing, and being resistant to impact and vibration, and the cured product also has good thermal conductivity and heat dissipation functions and excellent high and low temperature resistance and electrical properties. The insulating thermally conductive adhesive can be a thermally conductive potting adhesive such as an epoxy resin potting adhesive, a silicone resin potting adhesive, a polyurethane potting adhesive, a ceramic adhesive, etc.

[0052] The heat sink 4 includes a first protrusion 41, a plurality of second protrusions 42 and a plurality of abutment portions 43. The first protrusion 41 is provided on the side of the chip 2 facing away from the substrate 1. A second protrusion 42 is provided between each two adjacent chips 2. The extension direction of the second protrusion 42 is parallel to the arrangement direction of the corresponding solder feet 21. The second protrusion 42 is connected to the first protrusion 41 through the abutment portion 43, and the abutment portion 43 covers the same row of thermally conductive insulating layers 31. It can be understood that the extension direction of the abutment portion 43 is the same as the arrangement direction of the corresponding connecting sheet 3, and the cross section of the abutment portion 43 perpendicular to its arrangement direction is in a Z shape that matches the thermally conductive insulating layer 31.

[0053] The heat sink 4 has the function of conducting heat, and the material of the heat sink 4 can be a material with good thermal conductivity such as metal or ceramic. By providing a thermal insulation layer 31 between the connecting sheet 3 and the abutting portion 43, the electrical conduction between the connecting sheet 3 and the heat sink 4 can be avoided, and at the same time, the heat generated by the chip 2 can be transferred to the heat sink 4 through the thermal insulation layer 31.

[0054] In this embodiment, there are two rows of solder feet 21 arranged in parallel. There are two rows of connecting pieces 3 corresponding to the same chip 2. The two rows of connecting pieces 3 are located on opposite sides of the chip 2. The first protruding part 41 is arranged in an inverted U shape, which can increase the elasticity of the first protruding part 41. By pressing the first protruding part 41, both ends of the first protruding part 41 can apply force to the upper ends of the two connecting pieces 3 at the same time, increasing the contact area between the connecting piece 3 and the solder foot 21 and improving the connection strength between the connecting piece 3 and the solder foot 21. At the same time, the distance between the middle part of the first protruding part 41 and the chip 2 can be increased, reducing the possibility of damaging the chip 2 when the middle part of the first protruding part 41 contacts the chip 2 when pressing the first protruding part 41.

[0055] By pressing the second protruding part 42, force can be applied to the lower ends of the connecting pieces 3 corresponding to two adjacent chips 2 at the same time, increasing the contact area between the connecting piece 3 and the pad 11 and improving the connection strength between the connecting piece 3 and the pad 11.

[0056] In an alternative embodiment, the ends of the first protruding part 41 and the second protruding part 42 far from the substrate 1 are located on the same plane, which is convenient for applying force to the first protruding part 41 and the second protruding part 42 at the same time, making the connecting piece 3 in close contact with the pad 11 and the solder foot 21 and improving the packaging efficiency.

[0057] On the side of the first protruding part 41 at the outermost end facing away from the second protruding part 42, there is a resisting part 43 connected. The resisting part 43 is bent towards the substrate 1 side to form a supporting part 44. The supporting part 44 is located on the substrate 1. The setting of the supporting part 44 can improve the stability of the radiator 4 on the substrate 1.

[0058] The plastic encapsulation layer 5 wraps one end of the radiator 4 close to the substrate 1, exposing the ends of the first protruding part 41 and the second protruding part 42 far from the substrate 1. The chip 2 is encapsulated in the plastic encapsulation layer 5, which can avoid the leakage of information on the chip 2 and achieve the hermetic packaging of the chip 2. The heat generated by the chip 2 can be transferred to the first protruding part 41 and the second protruding part 42 through the connecting piece 3. Heat dissipation fins 7 are provided on the parts of the first protruding part 41 and the second protruding part 42 outside the plastic encapsulation layer 5, which can improve the heat dissipation efficiency of the radiator 4. A heat dissipation sealing layer 6 is provided on the plastic encapsulation layer 5, which can improve the heat dissipation efficiency of the packaging structure.

[0059] By providing the radiator 4, the abutting part 43 in the radiator 4 abuts against the thermally conductive insulating layer 31. On the one hand, the connecting piece 3 can transfer the heat generated by the chip 2 to the substrate 1, and on the other hand, it can transfer the heat generated by the chip 2 to the radiator 4. The radiator 4 dissipates heat to the outside through the first protruding part 41 and the second protruding part 42 outside the plastic encapsulation layer 5.

[0060] The stability of a medical circuit board is the highest requirement among all circuit boards. Assuming that the medical circuit board fails, it will directly affect the normal operation of medical electronic devices and is very likely to lead to medical accidents. In this application, on the one hand, the heat sink 4 plays a role in heat dissipation. On the other hand, during the process of forming the plastic encapsulation layer 5 on the chip 2, by pressing the first protrusion 41 and the second protrusion 42 towards the substrate 1, a force can be applied to the abutting portion 43, so that the connecting piece 3 is in close contact with the pad 11 and the pin 21. During the filling process of the plastic encapsulation glue, a continuous force is applied to the abutting portion 43. After the plastic encapsulation glue is cured, the plastic encapsulation glue can restrict the abutting portion 43 and the connecting piece 3, so that the connecting piece 3 always remains in a state of being in close contact with the pad 11 and the pin 21, which can improve the stability of the electrical connection between the pad 11 and the pin 21 and reduce the failure rate of the medical circuit board caused by the disconnection of the electrical connection between the pad 11 and the pin 21.

[0061] Embodiment 2

[0062] The difference between Embodiment 2 and Embodiment 1 is that the pins 21 are provided with four rows, and the four rows of pins 21 are arranged in the circumferential direction of the chip 2. There are four rows of connecting pieces 3 around the chip 2. The first protrusion 41 is in a cylindrical shape, and the end of the first protrusion 41 close to the substrate 1 is open, which can increase the elasticity of the first protrusion 41. By pressing the first protrusion 41, the first protrusion 41 can apply a force to the four connecting pieces 3 at the same time.

[0063] Embodiment 3

[0064] Combined with Figure 3 and Figure 4 , the difference between Embodiment 3 and Embodiment 1 is that the chip 2 is a chip component formed by stacking multiple chip bodies. Along the stacking direction of the chip bodies, the lengths of the chip bodies decrease in sequence, so that the end of the chip component is in a stepped shape. The connecting piece 3 is adapted to the end of the chip component, so that multiple chip bodies in the chip component are all electrically connected to the substrate 1. The setting of the connecting piece 3 can realize the electrical connection of multiple chips 2. The stacking of multiple chips 2 can save space dimensions and make the volume of the packaging structure smaller.

[0065] In an alternative embodiment, separate chips 2 may not be provided, and all are chip components formed by stacking multiple chips 2; or chip components may not be provided, and all are separate chips 2; or some may be separate chips 2 and the other part may be chip components.

[0066] In this embodiment, the substrate 1 is all chip components, and multiple chip components are arranged at intervals. The first protrusion 41 is located above the chip component, and the second protrusion 42 is located between two adjacent chip components. When pressing the second protrusion 42, a force can be applied to the abutting portions 43 on the adjacent chip components at the same time, improving the encapsulation efficiency.

[0067] The chip component can have a stepped shape at one end, or can have stepped shapes at both opposite ends. In this embodiment, both ends of the two chip components are provided with stepped shapes. When pressing the second protrusion 42, the adjacent connecting pieces 3 can be uniformly stressed, and at the same time, the adjacent connecting pieces 3 are in close contact with the pads 11 and the welding feet 21, improving the uniformity of the connection strength between the pads 11 and the connecting pieces 3 at various places.

[0068] In other embodiments, the end face of the chip component at the outermost end facing away from the adjacent chip component is provided as a plane perpendicular to the substrate 1, which can save space dimensions and make the volume of the packaging structure smaller.

[0069] Embodiment 4

[0070] Embodiment 4 of the present application provides a hermetic packaging process for a medical board, including the following steps:

[0071] Step 1: Provide a substrate 1, on which multiple rows of pads 11 are provided, and a circuit electrically connected to the pads 11 is provided on the substrate 1.

[0072] Step 2: Provide multiple chips 2, on which multiple rows of welding feet 21 are provided. Install the multiple chips 2 on the substrate 1 at intervals so that the multiple rows of pads 11 correspond to the multiple rows of welding feet 21 one by one. The welding feet 21 can be provided with two rows, three rows or four rows, and there are multiple rows of pads 11 around the chips 2.

[0073] Step 3: Provide multiple connecting pieces 3, on which a thermally conductive insulating layer 31 is covered. Electrically connect each row of pads 11 and the corresponding welding feet 21 through the connecting pieces 3.

[0074] Step 4: Provide a heat sink 4, which includes a first protrusion 41, multiple second protrusions 42 and multiple abutting parts 43. The second protrusions 42 are located on the periphery of the first protrusion 41 and are connected to the first protrusion 41 through the abutting parts 43. The abutting parts 43 are adapted to the connecting pieces 3. Install the heat sink 4 on the substrate 1 so that the abutting parts 43 abut against the connecting pieces 3, the first protrusion 41 is located above the chips 2, and the second protrusions 42 are located between adjacent chips 2.

[0075] Step 5: Form a plastic sealing layer 5 that wraps one end of the heat sink 4 close to the substrate 1, so that the ends of the first protrusion 41 and the second protrusions 42 away from the substrate 1 are exposed.

[0076] Before forming the plastic sealing layer 5, provide a pressing device, and use the pressing device to press the first protrusion 41 and the second protrusions 42 in the direction of the substrate 1 at a preset pressure simultaneously.

[0077] By pressing the first protrusion 41 and the second protrusion 42 towards the substrate 1, a force can be applied to the abutting portion 43, so that the connecting piece 3 is in close contact with the pad 11 and the pin 21. During the process of filling the encapsulant, a continuous force is applied to the abutting portion 43. After the encapsulant is cured, the encapsulant can restrict the abutting portion 43 and the connecting piece 3, so that the connecting piece 3 always remains in a state of being in close contact with the pad 11 and the pin 21, which can improve the stability of the electrical connection between the pad 11 and the pin 21.

[0078] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A hermetic packaging structure for a medical board, characterized in that, it includes: a substrate (1) provided with multiple rows of pads (11) thereon; multiple chips (2) spacedly arranged on the substrate (1), on one side of each chip (2) facing away from the substrate (1), there are multiple rows of welding feet (21), and the multiple welding feet (21) correspond to the multiple pads (11) one by one and are electrically connected through connection pieces (3), and on one side of each connection piece (3) facing away from the substrate (1), there is a heat-conducting insulating layer (31) covered; the connection piece (3) has a first connection part (3a) connected to the welding feet (21), a second connection part (3b) connected to the pads (11), and a bending part (3c), and the first connection part (3a) and the second connection part (3b) are connected through the bending part (3c); a radiator (4) including a first protruding part (41), multiple second protruding parts (42) and multiple abutting parts (43), the first protruding part (41) is arranged on one side of the chip (2) facing away from the substrate (1), and there is a second protruding part (42) between every two adjacent chips (2), the extending direction of the second protruding part (42) is parallel to the arranging direction of the corresponding welding feet (21), the second protruding part (42) and the first protruding part (41) are connected through the abutting part (43), and the abutting part (43) covers the heat-conducting insulating layer (31) of the same row; and a plastic encapsulation layer (5) wrapping one end of the radiator (4) close to the substrate (1), so that one ends of the first protruding part (41) and the second protruding parts (42) far away from the substrate (1) are exposed.

2. The hermetic packaging structure for a medical board according to claim 1, characterized in that, the chip (2) is a chip component formed by stacking multiple chip bodies, along the stacking direction of the chip bodies, the lengths of the chip bodies decrease in sequence, so that the end part of the chip component is arranged in a stepped shape, and the connection piece (3) is adapted to the end part of the chip component, so that multiple chip bodies in the chip component are all electrically connected to the substrate (1).

3. The hermetic packaging structure for a medical board according to claim 2, characterized in that, there are multiple chip components, and the multiple chip components are spacedly arranged.

4. The hermetic packaging structure for a medical board according to claim 3, characterized in that, the end parts of the chip components are all arranged in a stepped shape.

5. The hermetic packaging structure for a medical board according to claim 1, characterized in that, there are two rows of welding feet (21) arranged in parallel, and the first protruding part (41) is arranged in an inverted U shape; or, there are four rows of welding feet (21), and the four rows of welding feet (21) are arranged in the circumferential direction of the chip (2), the first protruding part (41) is in a cylindrical shape, and one end of the first protruding part (41) close to the substrate (1) is in an open state.

6. The hermetic packaging structure for a medical board according to claim 1, characterized in that, One end of the first protrusion (41) and the second protrusion (42) away from the substrate (1) is located in the same plane.

7. The hermetic packaging structure of the medical board according to claim 1, characterized in that, a heat dissipation sealing layer (6) is provided on the plastic encapsulation layer (5).

8. The hermetic packaging structure of the medical board according to claim 1, characterized in that, heat dissipation fins (7) are provided on the portions of the first protrusion (41) and the second protrusion (42) outside the plastic encapsulation layer (5).

9. A hermetic packaging process for a medical board, characterized in that, comprises the following steps: providing a substrate (1) with multiple rows of pads (11) arranged thereon; providing a plurality of chips (2) with multiple rows of pins (21) provided thereon, and mounting the plurality of chips (2) on the substrate (1) at intervals so that the multiple rows of pads (11) correspond to the multiple rows of pins (21) one by one; providing a plurality of connecting pieces (3), the connecting pieces (3) having a first connecting portion (3a) connected to the pins (21), a second connecting portion (3b) connected to the pads (11), and a bending portion (3c), the first connecting portion (3a) and the second connecting portion (3b) being connected by the bending portion (3c); a thermally conductive insulating layer (31) is covered on the connecting piece (3), and each row of pads (11) is electrically connected to the corresponding pins (21) through the connecting piece (3); providing a heat sink (4), the heat sink (4) comprising a first protrusion (41), a plurality of second protrusions (42) and a plurality of abutting portions (43), the second protrusions (42) being located around the first protrusion (41) and connected to the first protrusion (41) through the abutting portions (43), the abutting portions (43) being adapted to the connecting piece (3); mounting the heat sink (4) on the substrate (1) so that the abutting portions (43) abut against the connecting piece (3), the first protrusion (41) being located above the chip (2), and the second protrusions (42) being located between adjacent chips (2); and, forming a plastic encapsulation layer (5) wrapping one end of the heat sink (4) close to the substrate (1), so that one ends of the first protrusion (41) and the second protrusion (42) away from the substrate (1) are exposed.

10. The hermetic packaging process for a medical board according to claim 9, characterized in that, before forming the plastic encapsulation layer (5), it further comprises: providing a pressing device, and using the pressing device to press the first protrusion (41) and the second protrusion (42) towards the substrate (1) simultaneously with a preset pressure.

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