Multilayer microwave circuit board with signal energy coupling transmission and electronic circuit

Abstract

The application provides a multi-layer microwave circuit board for signal energy coupling transmission, comprising: a ground layer, a designated circuit layer, a first circuit layer, a surface circuit layer, a plurality of dielectric layers and a plurality of vias which are stacked in a first direction in sequence, and a coupling window which is arranged in the first circuit layer; a signal transmission line which is arranged on the designated circuit layer and the surface circuit layer; wherein the shape of the signal transmission line is a Y-shaped bifurcated gradual change type, and the coupling window and the signal transmission line are used for transmitting the signal energy from the surface circuit layer to the designated circuit layer through the first circuit layer and transmitting the signal energy from the designated circuit layer to the surface circuit layer through the first circuit layer. The problems of high machining precision requirement and high cost in the process of manufacturing blind holes or back drilling are avoided while realizing the cross-layer coupling of signal energy.

Description

Technical Field

[0001] The present invention relates to the field of microwave circuits, and in particular to a multi-layer microwave circuit board and an electronic circuit for signal energy coupling transmission. Background Art

[0002] In the prior art, the signal energy cross-layer structure between the surface signal transmission line and the designated middle layer signal transmission line in a multi-layer microwave circuit board for signal energy coupled transmission generally adopts a blind hole process or back drilling technology, which requires high processing precision and is high in cost.

[0003] Therefore, developing a signal energy cross-layer coupling method and structure that can reduce processing accuracy requirements and processing costs has become a technical focus that needs to be urgently solved by technical personnel in this field. Summary of the Invention

[0004] The present invention provides a multi-layer microwave circuit board and an electronic circuit for signal energy coupling transmission, so as to solve the problems of how to achieve cross-layer coupling of signal energy while avoiding the high processing precision requirements and high costs when making blind holes or back drilling.

[0005] According to a first aspect of the present invention, there is provided a multilayer microwave circuit board for signal energy coupling transmission, comprising:

[0006] A ground layer, a designated circuit layer, a first circuit layer, and a surface circuit layer stacked in sequence along a first direction;

[0007] a plurality of dielectric layers formed between the ground layer and the designated circuit layer, between the designated circuit layer and the first circuit layer, and between the first circuit layer and the surface circuit layer;

[0008] a plurality of vias, correspondingly provided in the ground layer, the designated circuit layer, the first circuit layer, the surface circuit layer, and each dielectric layer;

[0009] A coupling window is provided in the first circuit layer; the plurality of vias are provided around the coupling window;

[0010] A signal transmission line; arranged on the designated circuit layer and the surface circuit layer; wherein the shape of the signal transmission line is a "Y-shaped forked gradient" type, so that the metal plane on the designated circuit layer constitutes an interconnection structure, and the metal plane on the surface circuit layer constitutes an interconnection structure; wherein the openings of the two "Y-shaped forked gradient" signal transmission lines are arranged relative to each other, so that the projections of the frames or gaps of the two "Y-shaped forked gradient" signal transmission lines in the first circuit layer intersect, and the intersection falls within the coupling window; wherein the coupling window and the signal transmission line are used to transmit the signal energy from the surface circuit layer across the first circuit layer to the designated circuit layer, or to transmit the signal energy from the designated circuit layer across the first circuit layer to the surface circuit layer. Optionally, the distance between the centers of adjacent vias is less than λ / 4, wherein λ is the carrier wavelength of the signal.

[0011] Optionally, the ground layer, the designated circuit layer, the first circuit layer, the surface circuit layer, and the plurality of vias in each dielectric layer are all cylindrical.

[0012] Optionally, the plurality of vias in the first circuit layer surround the coupling window.

[0013] Optionally, the size of the coupling window is adapted to a target impedance between the two signal transmission lines; the target impedance represents the impedance at which minimum energy reflection is generated when the signal energy is transmitted between the two signal transmission lines.

[0014] Optionally, the width of the coupling window along the second direction is the first width, so that the size of the coupling window is adapted to the target impedance between the two signal transmission lines; the second direction is perpendicular to the opening axis direction of the "Y-type forked gradient" type signal transmission line in the plane where the first circuit layer is located.

[0015] Optionally, the first width is λ / 2.

[0016] Optionally, the "Y-type bifurcated gradient" type signal transmission line includes: a bifurcated structure; the minimum distance between the first vias is adapted to the distance that the bifurcated structure in the signal transmission line extends along a third direction; the first vias represent the vias on both sides of the coupling window that are opposite to each other along the third direction; the third direction is perpendicular to the second direction in the plane where the first circuit layer is located.

[0017] Optionally, the distance between the coupling window and the adjacent via hole is a minimum process spacing; the minimum process spacing represents the minimum distance that can be achieved between the coupling window and the adjacent via hole in the current processing technology.

[0018] Optionally, the coupling window has a shape of: rectangle, diamond, circle, ellipse, triangle or a combination of two or more of these shapes.

[0019] Optionally, the signal transmission line is a coplanar waveguide, a microstrip line or a stripline.

[0020] Optionally, when the signal transmission line is the coplanar waveguide, the gap of the coplanar waveguide presents the “Y-shaped bifurcated gradient” type;

[0021] When the signal transmission line is the microstrip line or the stripline, the frame of the transmission line of the microstrip line or the stripline presents the “Y-shaped bifurcated gradient” shape.

[0022] Optionally, the signal transmission line includes a designated intermediate layer signal transmission line and a surface layer signal transmission line; wherein the designated intermediate layer signal transmission line represents the signal transmission line provided in the designated circuit layer; and the surface layer signal transmission line represents the signal transmission line provided on the surface layer circuit layer;

[0023] Wherein, the designated intermediate layer signal transmission line is the coplanar waveguide or stripline; the surface layer signal transmission line is the coplanar waveguide or microstrip line.

[0024] Optionally, the line formed by the gap of the coplanar waveguide and / or the frame of the intermediate transmission line is a straight line, a circle, an ellipse, a parabola or a part of a hyperbola or quadratic curve.

[0025] Optionally, the line formed by the frame of the microstrip line or stripline is a part of a straight line, a circle, an ellipse, a parabola or a hyperbola or quadratic curve.

[0026] Optionally, the carrier of the signal is microwave.

[0027] Optionally, the frequency of the carrier of the signal energy is 20 GHz.

[0028] Optionally, a metal layer is plated on inner walls of the plurality of via holes to prevent energy leakage when signal energy is transmitted between the surface circuit layer and the designated circuit layer.

[0029] According to a second aspect of the present invention, there is provided an electronic circuit comprising the multi-layer microwave circuit board for signal energy coupling transmission according to any one of the first aspects of the present invention.

[0030] The technical solution provided by the present invention realizes cross-layer coupling of signal energy by transmitting signal energy from the surface circuit layer to the designated circuit layer, or vice versa, through a "Y-shaped forked gradient" signal transmission line provided on the designated circuit layer and the surface circuit layer, in conjunction with a corresponding coupling window provided in the first circuit layer; wherein the metal plane on the designated circuit layer constitutes an interconnection structure, and the metal plane on the surface circuit layer constitutes an interconnection structure. It can be seen that the technical solution provided by the present invention does not require the use of blind vias or back drilling to achieve cross-layer coupling of signal energy, avoids the use of blind vias or back drilling technology to produce multi-layer microwave circuit boards for signal energy coupling and transmission, and solves the problems of high processing precision requirements and high costs in the production of blind vias or back drilling in the prior art; the technical solution provided by the present invention has the characteristics of simple structure, low processing precision requirements, high yield, low cost, and excellent insertion loss and return loss indicators. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 This is a perspective structural diagram of a multi-layer microwave circuit board for signal energy coupling transmission provided by a specific embodiment of the present invention;

[0033] Figure 2 It is a perspective top view of a multi-layer microwave circuit board for signal energy coupling transmission provided by a specific embodiment of the present invention;

[0034] Figure 3 is a cross-sectional view of a stacked structure of a multi-layer microwave circuit board for signal energy coupling transmission provided by a specific embodiment of the present invention;

[0035] Figure 4 This is a top view of a surface circuit layer of a multi-layer microwave circuit board for signal energy coupling transmission provided by a specific embodiment of the present invention;

[0036] Figure 5 This is a top view of the first circuit layer of a multi-layer microwave circuit board for signal energy coupling transmission provided by a specific embodiment of the present invention;

[0037] Figure 6 It is a top view of a designated circuit layer of a multi-layer microwave circuit board for signal energy coupling transmission provided by a specific embodiment of the present invention;

[0038] Figure 7This is a top view of the ground layer of a multi-layer microwave circuit board for signal energy coupling transmission provided by a specific embodiment of the present invention;

[0039] Figure 8 It is a top view of a dielectric layer of a multi-layer microwave circuit board for signal energy coupling transmission provided by a specific embodiment of the present invention;

[0040] Figure 9 This is a simulation result diagram provided by a specific embodiment of the present invention;

[0041] Figure 10 A top view of a surface circuit layer including a coplanar waveguide of a multi-layer microwave circuit board for signal energy coupling transmission provided by another specific embodiment of the present invention;

[0042] Figure 11 A top view of a surface circuit layer of a coplanar waveguide including microvias of a multi-layer microwave circuit board for signal energy coupling transmission provided by one embodiment of the present invention;

[0043] Figure 12 A top view of a surface circuit layer including a microstrip line of a multi-layer microwave circuit board for signal energy coupling transmission provided by another specific embodiment of the present invention;

[0044] Figure 13 A top view of a designated circuit layer including a coplanar waveguide of a multi-layer microwave circuit board for signal energy coupling transmission provided by another specific embodiment of the present invention;

[0045] Figure 14 A top view of a designated circuit layer of a coplanar waveguide including microvias of a multi-layer microwave circuit board for signal energy coupling transmission provided by another specific embodiment of the present invention;

[0046] Figure 15 Another embodiment of the present invention provides a top view of a designated circuit layer including strip lines of a multi-layer microwave circuit board for signal energy coupling transmission. DETAILED DESCRIPTION

[0047] The following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0048] The terms "first," "second," "third," "fourth," and the like (if any) in the description and claims of the present invention and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to these processes, methods, products, or apparatus.

[0049] High-speed PCBs include vias and wiring. Vias are required to connect signal energy from the signal transmission lines on the surface circuit layer to the signal transmission lines on the designated circuit layer, or vice versa. When the signal energy frequency is below 1GHz, vias provide a good connection, and their parasitic capacitance and inductance can be ignored. However, when the frequency exceeds 1GHz, the parasitic effects of vias on signal integrity become more significant. Vias act as impedance discontinuities in the transmission path, causing signal reflections, delays, attenuation, and other signal integrity issues.

[0050] The types of wiring on a PCB primarily include signal lines, power lines, and ground lines. Signal lines are the most common and come in a variety of types, including stripline, microstrip, and coplanar waveguide, depending on their physical structure. A stripline is a copper strip embedded in a dielectric between two conductive planes and buried within the PCB. A microstrip is a copper strip embedded on a dielectric surface, separated from the ground plane by a dielectric. A coplanar waveguide is a planar transmission line widely used in microwave integrated circuit design. It consists of a central conductor strip and two ground planes on either side of the center conductor, all located in the same plane.

[0051] In the prior art, the signal energy cross-layer structure between the surface signal transmission line and the designated middle layer signal transmission line in a multi-layer microwave circuit board for signal energy coupled transmission generally adopts a blind hole process or back drilling technology, which requires high processing precision and is high in cost.

[0052] In view of this, the inventors of this application have provided a method and structure for cross-layer coupling of signal energy that can reduce processing precision requirements and processing costs. Through the design of coplanar waveguides, microstrip lines or stripline terminal matching circuits and intermediate layer coupling windows, signal energy cross-layer transmission can be achieved. Because the structure of cross-layer coupling of signal energy is achieved through coplanar waveguides, microstrip lines or stripline terminal matching circuits and intermediate layer coupling windows, there is no need to make blind vias or back drilling, thus avoiding the use of blind via processes or back drilling technology to produce multi-layer microwave circuit boards for signal energy coupling transmission. Therefore, it has the characteristics of simple structure, low processing precision requirements, high yield, low cost, and excellent insertion loss and return loss indicators.

[0053] The technical solution of the present invention is described in detail below with reference to specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0054] Please refer to Figures 1-15 , where L1, L2, L3, and L4 are respectively the surface circuit layer, the first circuit layer, the designated circuit layer, and the ground layer; Sub1, Sub2, and Sub3 are respectively the dielectric layers; the dimension marks below the figure are the dimension marks of the corresponding drawings; the first direction described below is the Z-axis direction in the figure, the second direction is the X-axis direction in the figure, and the third direction is the Y-axis direction in the figure; the dotted lines in the figure represent the boundaries of the structure for signal energy coupling transmission;

[0055] According to one embodiment of the present invention, a multi-layer microwave circuit board for signal energy coupling transmission is provided. The perspective structure diagram of the multi-layer microwave circuit board for signal energy coupling transmission is shown as follows: Figure 1 As shown, the cross-sectional view of the stacked structure of the multi-layer microwave circuit board for signal energy coupling transmission is as follows Figure 3 As shown, the perspective structure diagram of the multi-layer microwave circuit board for signal energy coupling transmission includes:

[0056] A ground layer, a designated circuit layer, a first circuit layer, and a surface circuit layer stacked in sequence along a first direction;

[0057] Several dielectric layers are formed between the ground layer and the designated circuit layer, between the designated circuit layer and the first circuit layer, and between the first circuit layer and the surface circuit layer; the top view of the surface circuit layer is as shown in FIG. Figure 4 As shown in FIG10, the top view of the first circuit layer is as shown in FIG10. Figure 5 As shown, the top view of the specified circuit layer is as follows Figure 6 or Figure 13 As shown, the top view of the ground layer is as follows Figure 7 As shown, it should be noted that the columnar structure shown in the ground layer is a hollow metal cavity, representing the metal layer plated on the inner wall of several through holes in each structural layer. Figure 7In order to highlight the metal layer, the metal layer is shown as a columnar structure. The top view of the dielectric layer is as follows: Figure 8 As shown;

[0058] a plurality of vias, correspondingly provided in the ground layer, the designated circuit layer, the first circuit layer, the surface circuit layer, and each dielectric layer;

[0059] A coupling window is provided in the first circuit layer; to prevent signal energy leakage, the plurality of vias are provided around the coupling window;

[0060] A signal transmission line; provided on the designated circuit layer and the surface circuit layer; wherein the shape of the signal transmission line is a "Y-shaped forked gradient" type, so that the metal plane on the designated circuit layer forms an interconnection structure, and the metal plane on the surface circuit layer forms an interconnection structure, so that the signal transmission line achieves an effect similar to a terminal short circuit; wherein the openings of the two "Y-shaped forked gradient" type signal transmission lines are arranged relative to each other, so that the projections of the gaps of the two "Y-shaped forked gradient" type signal transmission lines in the first circuit layer intersect, and the intersection falls within the coupling window;

[0061] Among them, the signal transmission line is designed as a "Y-type bifurcated gradient" type, which can achieve good impedance matching.

[0062] The coupling window in the first circuit layer is covered with metal. Specifically, the metal may be copper.

[0063] Wherein, the coupling window and the signal transmission line are used to transmit the signal energy from the surface circuit layer across the first circuit layer to the designated circuit layer, or from the designated circuit layer across the first circuit layer to the surface circuit layer. The specific principle is described as follows: In a multi-layer microwave circuit board for signal energy coupling transmission, since a coupling window is designed in the first circuit layer between the surface circuit layer and the designated circuit layer, the coupling window is an area without metal coverage. When the signal energy is input from the signal transmission line in the surface circuit layer, the signal energy is reflected due to the short circuit at the terminal of the signal transmission line in the surface circuit layer. Since the coupling window is an area without metal coverage, the reflected signal energy is coupled to the designated circuit layer through the coupling window of the first circuit layer, thereby realizing the transmission of signal energy from the surface circuit layer to the designated circuit layer.

[0064] Similarly, when signal energy is input from the signal transmission line of a designated circuit layer, the signal energy is reflected due to the short circuit at the signal transmission line terminal in the designated circuit layer. Since the coupling window is an area without metal coverage, the reflected signal energy is coupled to the surface circuit layer through the coupling window of the first circuit layer, thereby achieving signal energy transmission from the designated circuit layer to the surface circuit layer. This achieves bidirectional transmission of signal energy between the surface circuit layer and the designated circuit layer.

[0065] Among them, the signal transmission line is designed as a "Y-type bifurcated gradient" type. Since a coupling window is designed between the surface circuit layer and the designated circuit layer, the impedance of the surface circuit layer and the designated circuit layer increases, and the "Y-type bifurcated gradient" type signal transmission line can reduce the impedance, thereby offsetting or reducing the impedance change between the surface circuit layer and the designated circuit layer, and achieving a good impedance matching effect.

[0066] In one embodiment, the plurality of vias in the first circuit layer surround the coupling window.

[0067] When the first circuit layer is a multi-layer circuit layer, in a specific implementation, the coupling windows of different layers may have different shapes and sizes, or may have the same shape and size.

[0068] The technical solution provided by the present invention realizes cross-layer coupling of signal energy by transmitting signal energy from the surface circuit layer to the designated circuit layer, or from the designated circuit layer to the surface circuit layer, through a "Y-shaped forked gradient" signal transmission line provided on the designated circuit layer and the surface circuit layer, in conjunction with a corresponding coupling window provided in the first circuit layer; wherein the metal plane on the designated circuit layer constitutes an interconnection structure, and the metal plane on the surface circuit layer constitutes an interconnection structure. It can be seen that the technical solution provided by the present invention does not require the use of blind vias or back drilling to achieve cross-layer coupling of signal energy, thereby avoiding the use of blind vias or back drilling technology to produce multi-layer microwave circuit boards for signal energy coupling and transmission, and solves the problems of high processing precision requirements and high costs in the production of blind vias or back drilling in the prior art; the technical solution provided by the present invention has the characteristics of simple structure, low processing precision requirements, high yield, low cost, and excellent insertion loss and return loss indicators.

[0069] In one embodiment, the carrier of the signal is microwave. In a specific embodiment, the carrier frequency of the signal is 20 GHz.

[0070] In one embodiment, the ground layer, the designated circuit layer, the first circuit layer, the surface circuit layer, and the plurality of vias in each dielectric layer are all cylindrical.

[0071] In one embodiment, the distance between the centers of adjacent via holes is less than λ / 4, where λ is the carrier wavelength of the signal.

[0072] In one embodiment, a metal layer is plated on the inner walls of the plurality of via holes to prevent energy leakage when signal energy is transmitted between the surface circuit layer and the designated circuit layer.

[0073] In one embodiment, in order to achieve good impedance matching and ensure signal energy transmission, in addition to designing a "Y-shaped bifurcated gradient" signal transmission line, the size of the coupling window also needs to be adapted to the target impedance between the two signal transmission lines; the target impedance represents the impedance when the signal energy produces minimum energy reflection when transmitted between the two signal transmission lines.

[0074] In one embodiment, the width of the coupling window along the second direction is the first width, so that the size of the coupling window is adapted to the target impedance between the two signal transmission lines; the second direction is perpendicular to the opening axis direction of the "Y-type forked gradient" type signal transmission line in the plane where the first circuit layer is located.

[0075] In one embodiment, the first width is λ / 2.

[0076] In a preferred embodiment, the width of the coupling window along the third direction is a preferred value obtained through simulation optimization. The third direction is perpendicular to the second direction in the plane where the first circuit layer is located.

[0077] In one embodiment, the coupling window has a shape of: rectangle, diamond, circle, ellipse, triangle, or a combination of two or more of these shapes.

[0078] In a specific embodiment, the shape of the coupling window is a combination of a rectangle and a triangle, such as Figure 5 shown.

[0079] In one embodiment, the distance between the coupling window and the adjacent via hole is a minimum process spacing; the minimum process spacing represents the minimum distance that can be achieved between the coupling window and the adjacent via hole in the current processing technology.

[0080] In one embodiment, the "Y-shaped bifurcated gradient" signal transmission line includes: a bifurcated structure; the minimum distance between the first vias is adapted to the distance of the bifurcated structure in the signal transmission line extending along the third direction; the first vias represent the vias on both sides of the coupling window along the third direction; Figure 2 As shown;

[0081] In one embodiment, the line formed by the gap of the coplanar waveguide and / or the frame of the intermediate transmission line is a straight line; Figure 1 , 2, 4 and 6;

[0082] In one embodiment, the curve formed by the gap of the coplanar waveguide and / or the frame of the intermediate transmission line is a part of a circle, an ellipse, a parabola or a hyperbola quadratic curve.

[0083] In one embodiment, the signal transmission line is a coplanar waveguide, a microstrip line or a stripline; of course, the signal transmission line can also be implemented in other forms. Any implementation form of the signal transmission line that can achieve the purpose of the present invention is within the scope of protection of the present invention, and the present invention is not limited to this.

[0084] In a specific embodiment, when the signal transmission line is the coplanar waveguide, the gap of the coplanar waveguide presents the "Y-shaped bifurcated gradient" type;

[0085] In another specific embodiment, when the signal transmission line is the microstrip line or the stripline, the frame of the transmission line of the microstrip line or the stripline presents the “Y-shaped bifurcated gradient” shape.

[0086] When the signal transmission line is a coplanar waveguide, the shape of the "Y-shaped forked gradient" signal transmission line is specifically described as follows: the coplanar waveguide includes a coplanar waveguide gap and a metal ground formed around the coplanar waveguide gap; the shape of the "Y-shaped forked gradient" signal transmission line is specifically as follows: the gaps of the two coplanar waveguides are first distributed parallel to each other for a distance on the surface circuit layer, and then form a forked structure;

[0087] When the signal transmission line is a microstrip line or a stripline, a bifurcated design is performed on the middle transmission line of the microstrip line or the stripline to form a "Y-shaped bifurcated gradient" signal transmission line.

[0088] In one embodiment, the signal transmission line includes a designated intermediate layer signal transmission line and a surface layer signal transmission line; wherein the designated intermediate layer signal transmission line represents the signal transmission line provided in the designated circuit layer; the surface layer signal transmission line represents the signal transmission line provided on the surface layer circuit layer;

[0089] Wherein, the designated intermediate layer signal transmission line is the coplanar waveguide or stripline; the surface layer signal transmission line is the coplanar waveguide or microstrip line. In one embodiment, the designated intermediate layer signal transmission line is the coplanar waveguide (such as Figure 6 、 Figure 13 or Figure 14 As shown); the surface signal transmission line is the coplanar waveguide (as shown Figure 4 、 Figure 10 or Figure 11shown).

[0090] In another embodiment, the surface layer signal transmission line is a coplanar waveguide, and the designated middle layer signal transmission line is a stripline (e.g. Figure 15 shown).

[0091] In other embodiments, the surface signal transmission line is a microstrip line (such as Figure 12 As shown), the middle layer signal transmission line is specified to be a stripline.

[0092] In another embodiment, the surface signal transmission line is a microstrip line, and the designated middle signal transmission line is a coplanar waveguide.

[0093] When the surface signal transmission line is a coplanar waveguide, the energy of the coplanar waveguide in the surface circuit layer is mainly concentrated in the air gap between the transmission line in the middle of the coplanar waveguide and the ground plane in the coplanar waveguide, and is also concentrated in the dielectric layer between the surface circuit layer and the first circuit layer.

[0094] When the surface signal transmission line is a microstrip line, the energy of the microstrip line in the surface circuit layer is mainly concentrated in the microstrip line and the dielectric layer between the surface circuit layer and the first circuit layer;

[0095] When the designated middle signal transmission line in the designated circuit layer is a coplanar waveguide, the energy in the coplanar waveguide is mainly concentrated in the air gap between the transmission line in the middle of the coplanar waveguide and the ground plane in the coplanar waveguide, in the dielectric layer between the first circuit layer and the designated circuit layer, and in the dielectric layer between the designated circuit layer and the ground layer;

[0096] When the designated intermediate signal transmission line in the designated circuit layer is a stripline, the energy of the stripline is mainly concentrated in the dielectric layer between the first circuit layer and the designated circuit layer, and in the dielectric layer between the designated circuit layer and the ground layer.

[0097] In one embodiment, the line formed by the border of the microstrip line or stripline is a straight line, a circle, an ellipse, a parabola, or a part of a hyperbola or quadratic curve.

[0098] In one embodiment, the size of the markers in the figures is adapted to the frequency of the signal energy carrier.

[0099] Figures 1-8 , Figure 10-15 In the figure, the marked dimensions are based on the scenario where the signal carrier frequency is 20 GHz.

[0100] For other frequencies, the dimensions of the components of the multi-layer microwave circuit board for signal energy coupling transmission are proportionally scaled. For example, for a 60 GHz signal carrier frequency, the wavelength of the carrier becomes 1 / 3 of that in the embodiment of the present invention. Consequently, the linear dimensions of the components of the multi-layer microwave circuit board for signal energy coupling transmission are reduced to approximately 1 / 3 of those in the embodiment of the present invention, and the nominal area is reduced to approximately 1 / 9 of that in the embodiment of the present invention.

[0101] In a specific embodiment, at 20 GHz, the middle layer signal transmission line is the coplanar waveguide, the surface layer signal transmission line is the coplanar waveguide, and the shape of the coupling window is a combination of a triangle and a quadrilateral. Figure 1 As described above, a simulation experiment was conducted on the return loss and insertion loss of the multilayer microwave circuit board for signal energy coupling transmission to obtain the S parameter simulation results, as shown in Figure 9 As shown, the horizontal axis represents the signal frequency in GHz, and the vertical axis represents the S parameter, i.e. the scattering parameter, in dB. S(2,1) represents the insertion loss of the signal energy transferred from port 1 to port 2; S(1,1) represents the return loss of the signal energy input from port 1 and reflected back to port 1; S(2,2) represents the return loss of the signal energy input from port 2 and reflected back to port 2. Figure 9 The middle curves, from top to bottom, show an insertion loss curve (0.24dB at 20GHz) and two return loss curves (32.76dB and 34.65dB at 20GHz, respectively, both better than 30dB). This shows that the multi-layer microwave circuit board for signal energy coupling transmission provided by the present invention can achieve excellent cross-layer coupled transmission of signal energy.

[0102] According to another embodiment of the present invention, there is provided an electronic circuit comprising the multi-layer microwave circuit board for signal energy coupling transmission according to any one of the aforementioned embodiments of the present invention.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-layer microwave circuit board for signal energy coupling transmission, characterized in that: include: A ground layer, a designated circuit layer, a first circuit layer, and a surface circuit layer stacked in sequence along a first direction; a plurality of dielectric layers formed between the ground layer and the designated circuit layer, between the designated circuit layer and the first circuit layer, and between the first circuit layer and the surface circuit layer; a plurality of vias, correspondingly provided in the ground layer, the designated circuit layer, the first circuit layer, the surface circuit layer, and each dielectric layer; a coupling window, disposed in the first circuit layer; The plurality of vias are arranged around the coupling window; signal transmission lines; The signal transmission line is arranged on the designated circuit layer and the surface circuit layer; wherein the shape of the signal transmission line is a "Y-shaped forked gradient" type, so that the metal plane on the designated circuit layer constitutes an interconnection structure, and the metal plane on the surface circuit layer constitutes an interconnection structure; wherein the openings of the two "Y-shaped forked gradient" signal transmission lines are arranged opposite to each other, and the projections of the frames or gaps of the two "Y-shaped forked gradient" signal transmission lines in the first circuit layer intersect, and the intersection falls within the coupling window; The coupling window and the signal transmission line are used to transmit the signal energy from the surface circuit layer across the first circuit layer to the designated circuit layer, or to transmit the signal energy from the designated circuit layer across the first circuit layer to the surface circuit layer.

2. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 1, characterized in that: The distance between the centers of the adjacent via holes is less than λ / 4, where λ is the carrier wavelength of the signal.

3. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 2, characterized in that: The ground layer, the designated circuit layer, the first circuit layer, the surface circuit layer, and the plurality of vias in each dielectric layer are all cylindrical.

4. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 3, characterized in that: The plurality of vias in the first circuit layer surround the coupling window.

5. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 4, characterized in that: The size of the coupling window is adapted to the target impedance between the two signal transmission lines; the target impedance represents the impedance when the signal energy generates minimum energy reflection when transmitting between the two signal transmission lines.

6. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 5, characterized in that: The width of the coupling window along the second direction is the first width, so that the size of the coupling window is adapted to the target impedance between the two signal transmission lines; the second direction is perpendicular to the opening axis direction of the "Y-type forked gradient" type signal transmission line in the plane where the first circuit layer is located.

7. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 6, characterized in that: The first width is λ / 2.

8. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 7, characterized in that: The "Y-shaped bifurcated gradient" type signal transmission line includes: a bifurcated structure; the minimum distance between the first vias is adapted to the distance that the bifurcated structure in the signal transmission line extends along the third direction; the first vias represent the vias on both sides of the coupling window that are opposite to each other along the third direction; the third direction is perpendicular to the second direction in the plane where the first circuit layer is located.

9. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 8, characterized in that: The distance between the coupling window and the adjacent via hole is a minimum process spacing; the minimum process spacing represents the minimum distance that can be achieved between the coupling window and the adjacent via hole in the current processing technology.

10. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 9, characterized in that: The coupling window has a shape of a rectangle, a diamond, a circle, an ellipse, a triangle or a combination of two or more of these shapes.

11. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 10, characterized in that: The signal transmission line is a coplanar waveguide, a microstrip line or a stripline.

12. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 11, characterized in that: When the signal transmission line is the coplanar waveguide, the gap of the coplanar waveguide presents the "Y-shaped bifurcated gradient" type; When the signal transmission line is the microstrip line or the stripline, the border of the microstrip line or the stripline presents the "Y-shaped bifurcated gradient" type.

13. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 12, characterized in that: The signal transmission line includes a designated intermediate layer signal transmission line and a surface layer signal transmission line; wherein the designated intermediate layer signal transmission line represents the signal transmission line provided in the designated circuit layer; the surface layer signal transmission line represents the signal transmission line provided on the surface layer circuit layer; Wherein, the designated intermediate layer signal transmission line is the coplanar waveguide or stripline; the surface layer signal transmission line is the coplanar waveguide or microstrip line.

14. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 13, characterized in that: The curve formed by the gap of the coplanar waveguide and / or the frame of the intermediate transmission line is a part of a circle, an ellipse, a parabola or a hyperbola quadratic curve.

15. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 13, characterized in that: The line formed by the frame of the microstrip line or the stripline is a part of a straight line, a circle, an ellipse, a parabola or a hyperbola or quadratic curve.

16. The multi-layer microwave circuit board for signal energy coupling transmission according to any one of claims 14 or 15, characterized in that: The carrier wave of the signal is microwave.

17. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 16, characterized in that: The frequency of the carrier wave of the signal energy is 20 GHz.

18. The multi-layer microwave circuit board for signal energy coupling transmission according to claim 17, characterized in that: The inner walls of the plurality of via holes are plated with a metal layer to prevent energy leakage when signal energy is transmitted between the surface circuit layer and the designated circuit layer.

19. An electronic circuit, characterized in that A multi-layer microwave circuit board for signal energy coupling transmission comprising the method described in any one of claims 1 to 18.

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