Bonding assist module and bonding method

Abstract

The present application discloses a bonding auxiliary module and a bonding method, belonging to the field of display technology. The bonding auxiliary module includes a release layer, a body layer, and a protective layer that are sequentially stacked; wherein, the release layer and the protective layer respectively cover opposite two surfaces of the body layer, the first surface of the body layer facing the release layer and the second surface of the body layer facing the protective layer both have adhesiveness, and a hollowed-out area is provided at the middle position of the body layer. In the present application, the size of the hollowed-out area is set to correspond to the display area of the driving backplane. When the bonding auxiliary module is subsequently used to assist in bonding the light-emitting element to the driving backplane, the release layer can be removed first, and the first surface can be attached to the driving backplane, then the body layer will cover the non-display area. After further removing the protective layer, the display area of the driving backplane is exposed from the hollowed-out area. When applying the non-conductive adhesive to the display area, the body layer plays a role in preventing the non-conductive adhesive from overflowing to the non-display area, thereby reducing the probability of the non-display area being covered and contaminated by the non-conductive adhesive.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a bonding auxiliary module and a bonding method. Background Art

[0002] Among various existing display technologies, Micro-LED (Micro-Light Emitting Diode) has characteristics such as high brightness, good luminous efficiency, and low power consumption, which has enabled the rapid development of Micro-LED display technology as a new display technology. The mass transfer technology is a key technology for Micro-LED display technology. A large number of light-emitting elements are mass-transferred onto a driving backplane to achieve pixel light emission. During the transfer process, non-conductive paste (NCP, Non-conductive Paste) is usually coated on the driving backplane first, and then a large number of light-emitting elements are mass-transferred to the display area on the driving backplane, and the electrodes of the light-emitting elements are bonded to the backplane electrodes on the driving backplane. After the non-conductive paste is cured, it plays a role in bonding and fixing the light-emitting elements and the driving backplane.

[0003] The inventors of the present application have found through long-term research that when coating the non-conductive paste, the non-display area on the driving backplane where no bonding chips are required is easily covered and contaminated by the non-conductive paste, resulting in a decrease in the bonding yield when the circuits in the non-display area are subsequently bonded to other devices, thereby reducing the reliability of the display device. Summary of the Invention

[0004] The main technical problem to be solved by the present application is to provide a bonding auxiliary module and a bonding method, which can reduce the probability of the non-display area of the driving backplane being covered and contaminated by the non-conductive paste.

[0005] To solve the above technical problem, a technical solution adopted by the present application is: providing a bonding auxiliary module, the bonding auxiliary module includes: a release layer, a body layer, and a protective layer that are sequentially stacked;

[0006] Wherein, the release layer and the protective layer respectively cover opposite two surfaces of the body layer, the first surface of the body layer facing the release layer and the second surface of the body layer facing the protective layer both have adhesiveness, and a hollowed-out area is provided at the middle position of the body layer.

[0007] Optionally, the body layer includes: a first adhesive layer, a core layer, and a second adhesive layer that are sequentially stacked; wherein, the first adhesive layer is located between the release layer and the core layer, and the second adhesive layer is located between the protective layer and the core layer.

[0008] Optionally, the adhesiveness of the first adhesive layer is greater than that of the second adhesive layer;

[0009] The bonding auxiliary module further includes a tack-reducing coating disposed on a surface of the release layer facing the first adhesive layer, and the adhesion between the tack-reducing coating and the first adhesive layer is smaller than the adhesion between the tack-reducing coating and the release layer.

[0010] Optionally, the viscosity of the second adhesive layer is variable, so that the bonding auxiliary module has a first state and a second state;

[0011] When the bonding auxiliary module is in the first state, the viscosity of the first adhesive layer is lower than that of the second adhesive layer; when the bonding auxiliary module is in the second state, the viscosity of the first adhesive layer is higher than that of the second adhesive layer.

[0012] Optionally, the bonding auxiliary module further includes: a support column, which is arranged in the hollow area, and two ends of the support column are respectively in contact with the release layer and the protective layer.

[0013] Optionally, the support column and the release layer are integrally formed; or, the support column and the protective layer are integrally formed.

[0014] Optionally, the appearance of the release layer on a side facing away from the main layer is different from the appearance of the protective layer on a side facing away from the main layer; wherein the different appearances include different colors and / or different shapes;

[0015] Preferably, the main body layer encloses and surrounds the hollow area.

[0016] In order to solve the above technical problems, another technical solution adopted by the present application is to provide a bonding method, comprising:

[0017] Provide a driving backplane and the bonding auxiliary module described in the above technical solution; wherein the driving backplane has a display area and a non-display area surrounding the display area;

[0018] removing the release layer;

[0019] Attaching the first surface to the driving backplane, and making the body layer cover the non-display area, and the hollow area corresponds to the display area;

[0020] removing the protective layer to expose the display area;

[0021] Coating a non-conductive glue on the display area, transferring the light-emitting element to be bonded to the display area, and electrically connecting the light-emitting element to the backplane electrode of the display area;

[0022] The main layer is removed to expose the non-display area.

[0023] Optionally, the body layer includes a first adhesive layer, a core layer, and a second adhesive layer that are sequentially stacked. The first adhesive layer is located between the release layer and the core layer, and the second adhesive layer is located between the protective layer and the core layer. The viscosity of the first adhesive layer is greater than that of the second adhesive layer. The bonding auxiliary module further includes a viscosity-reducing coating, which is disposed on the surface of the release layer facing the first adhesive layer, and the adhesion between the viscosity-reducing coating and the first adhesive layer is less than the adhesion between the viscosity-reducing coating and the release layer.

[0024] The step of removing the release layer includes:

[0025] Remove the release layer so that the viscosity-reducing coating and the release layer are removed together.

[0026] The step of removing the protective layer includes:

[0027] Remove the protective layer so that only the protective layer is removed.

[0028] Optionally, the body layer includes a first adhesive layer, a core layer, and a second adhesive layer that are sequentially stacked. The first adhesive layer is located between the release layer and the core layer, and the second adhesive layer is located between the protective layer and the core layer. The viscosity of the second adhesive layer is variable, so that the bonding auxiliary module has a first state and a second state. When the bonding auxiliary module is in the first state, the viscosity of the first adhesive layer is less than that of the second adhesive layer. When the bonding auxiliary module is in the second state, the viscosity of the first adhesive layer is greater than that of the second adhesive layer.

[0029] The step of removing the release layer includes:

[0030] Put the bonding auxiliary module in the first state and remove the release layer so that only the release layer is removed.

[0031] The step of removing the protective layer includes:

[0032] Put the bonding auxiliary module in the second state and remove the protective layer so that only the protective layer is removed.

[0033] The beneficial effects of the present application are as follows: Different from the prior art, the bonding auxiliary module provided by the present application includes a release layer, a body layer, and a protective layer that are sequentially stacked; wherein, the release layer and the protective layer respectively cover opposite two surfaces of the body layer, the first surface of the body layer facing the release layer and the second surface of the body layer facing the protective layer both have adhesiveness, and a hollowed-out area is provided at the middle position of the body layer. During the subsequent process of using the bonding auxiliary module provided by the present application to assist in bonding the light-emitting element and the driving backplane, the release layer can be removed first, and the first surface of the body layer can be attached to the driving backplane. The driving backplane has a display area and a non-display area surrounding the display area. The present application can adapt to the structural characteristics of the driving backplane, and set the hollowed-out area on the body layer to the size corresponding to the display area, so that the body layer will cover the non-display area and protect the circuits in the non-display area. When the protective layer is removed subsequently and a non-conductive adhesive is coated in the hollowed-out area, the body layer plays a role in preventing the non-conductive adhesive from overflowing into the non-display area, thereby reducing the probability of the non-display area being covered and contaminated by the non-conductive adhesive, improving the bonding yield when bonding the circuits in the non-display area with other devices, and thus improving the reliability of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. Among them:

[0035] Figure 1 is a schematic structural diagram of an embodiment of the bonding auxiliary module of the present application;

[0036] Figure 2 is Figure 1 a cross-sectional schematic diagram taken along the A-A direction in

[0037] Figure 3 is a schematic structural diagram of another embodiment of the bonding auxiliary module of the present application;

[0038] Figure 4 is a schematic structural diagram of another embodiment of the bonding auxiliary module of the present application;

[0039] Figure 5 is a schematic structural diagram of another embodiment of the bonding auxiliary module of the present application;

[0040] Figure 6 is a schematic structural diagram of another embodiment of the bonding auxiliary module of the present application;

[0041] Figure 7 is a schematic flowchart of an embodiment of the bonding method of the present application;

[0042] Figure 8a Schematic structural diagram of an embodiment of a driving backplane;

[0043] Figure 8b is Figure 7 Schematic structural diagram corresponding to step S13 in

[0044] Figure 8c is Figure 7 Schematic structural diagram corresponding to step S14 in

[0045] Figure 8d is Figure 7 Schematic structural diagram corresponding to step S15 in

[0046] Figure 8e is Figure 7 Schematic structural diagram corresponding to step S16 in Specific embodiments

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0048] Please refer to Figure 1 and Figure 2 , Figure 1 is a schematic structural diagram of an embodiment of a bonding auxiliary module of the present application, Figure 2 is Figure 1 The cross-sectional schematic diagram in the A-A direction in, the bonding auxiliary module includes a release layer 11, a body layer 12, and a protective layer 13 that are sequentially stacked. Among them, the release layer 11 and the protective layer 13 respectively cover opposite two surfaces of the body layer 12, and both the first surface 121 of the body layer 12 facing the release layer 11 and the second surface 122 of the body layer 12 facing the protective layer 13 have adhesiveness, and a hollowed-out area S is provided at the middle position of the body layer 12. Figure 1 is a top view from the side of the release layer 11, only the release layer 11 is drawn, and the protective layer 13 and the body layer 12 are both covered by the release layer 11. For clear illustration, the hollowed-out area S on the body layer 12 is marked with a dashed line box in Figure 1 .

[0049] Specifically, the body layer 12 can be a single-layer structure formed of a viscous material, such as optical glue, etc., and the thickness can be 5-10 microns. The materials of the release layer 11 and the protective layer 13 can include polyethylene terephthalate (PET), and the thickness can be 0.1-0.5 microns.

[0050] The driving backplane generally has a display area and a non-display area surrounding the display area. The light-emitting elements to be bonded need to be bonded to the backplane electrodes in the display area. The non-display area has more circuits and needs to be bonded to other components (such as a driving chip, a circuit board, etc.), and finally corresponds to the border area of the display device. During the process of using the bonding auxiliary module provided by this embodiment to assist the bonding of the light-emitting elements to the driving backplane, the release layer 11 can be removed first, and the first surface 121 of the body layer 12 can be attached to the driving backplane, and then the protective layer 13 is removed, so that the surface of the driving backplane corresponding to the hollowed-out area S is exposed.

[0051] This embodiment can adapt to the structural characteristics of the driving backplane, and set the hollowed-out area S on the body layer 12 to the size corresponding to the display area, so that the body layer 12 will cover the non-display area and protect the circuits in the non-display area. Subsequently, when applying non-conductive glue in the hollowed-out area S, the body layer 12 plays a role in preventing the non-conductive glue from overflowing into the non-display area, thereby reducing the probability of the non-display area being covered and contaminated by the non-conductive glue, improving the bonding yield when bonding the circuits in the non-display area to other devices, and improving the reliability of the display device.

[0052] In one embodiment, please continue to refer to Figures 1 - 2 , the body layer 12 encloses the above-mentioned hollowed-out area S. In this embodiment, the orthographic projection of the body layer 12 on the plane where the release layer 11 is located is set to be annular, such as a square-ring shape, a circular shape, or other special-shaped rings. Figure 1 The case of a square-ring shape is schematically drawn. The specific shape of the body layer 12 can match the shape characteristics of the display area and the non-display area on the driving backplane, and the body layer 12 is covered by the release layer 11 and the protective layer 13 on both sides, which is convenient for storage and transportation. Moreover, the release layer 11, the body layer 12, and the protective layer 13 of the bonding auxiliary module are all formed by solid-state thin films, which is convenient for processing, storage, and transportation, convenient for production and use, and also expands the application scenarios of the bonding auxiliary module of this application.

[0053] In one embodiment, please refer to Figure 1 and Figure 2 refer to Figure 3 , Figure 3It is a schematic structural diagram of another embodiment of the bonding auxiliary module of the present application. The body layer 12 includes a first adhesive layer 123, a core layer 124, and a second adhesive layer 125 that are sequentially stacked. Among them, the first adhesive layer 123 is located between the release layer 11 and the core layer 124, and the second adhesive layer 125 is located between the protective layer 13 and the core layer 124. Specifically, the material of the core layer 124 may include polyimide (PI), etc., and the materials of the first adhesive layer 123 and the second adhesive layer 125 may include PSA glue or UV glue, etc., so that both the first surface 121 and the second surface 122 of the body layer 12 have adhesiveness. Among them, the thickness of the core layer 124 can be 5-10 microns, and the thicknesses of the first adhesive layer 123 and the second adhesive layer 125 can be 0.2-0.5 microns.

[0054] In one embodiment, please refer to Figure 2 and Figure 4 to Figure 4 It is a schematic structural diagram of another embodiment of the bonding auxiliary module of the present application. In this embodiment, in addition to including the above-mentioned release layer 11, body layer 12, and protective layer 13 that are stacked, the bonding auxiliary module further includes support columns 14, which are arranged in the hollow area S, and both ends of the support columns 14 are in contact with the release layer 11 and the protective layer 13 respectively. The present application does not specifically limit the number of the support columns 14, and one or more support columns 14 can be set according to the hollow area S. The support columns 14 can keep the release layer 11 and the protective layer 13 in the corresponding hollow area S isolated, reduce the probability of collapse of the release layer 11 and the protective layer 13 in the corresponding hollow area S, and improve the stability of the bonding auxiliary module during storage and transportation.

[0055] Specifically, as Figure 4 shown, the support columns 14 can be integrally formed with the release layer 11, that is, when the release layer 11 is processed and prepared, a plurality of protrusions are formed on one side surface thereof, which are the support columns 14. In other embodiments, the support columns 14 can also be integrally formed with the protective layer 13. When the protective layer 13 is processed and prepared, a plurality of protrusions are formed on one side surface thereof, which are the support columns 14, as Figure 5 shown. Figure 5 It is a schematic structural diagram of another embodiment of the bonding auxiliary module of the present application.

[0056] In the bonding auxiliary module provided in this embodiment, the body layer 12 plays a role in preventing the non-conductive adhesive from overflowing to the non-display area, thereby reducing the probability of the non-display area being covered and contaminated by the non-conductive adhesive, improving the bonding yield when the circuits in the non-display area are bonded to other devices, and improving the reliability of the display device.

[0057] In other embodiments, the support pillar 14 can also be independently prepared and formed from the release layer 11 and the protective layer 13, and then disposed in the hollowed-out area S by bonding, and no further schematic drawing will be provided here. During use, the support pillar 14 is peeled off together with the protective layer 13 or the release layer 11. Or during use, after peeling off the protective layer 13 or the release layer 11, it is peeled off separately.

[0058] In one embodiment, please continue to refer to Figure 5 , a first protrusion 111 protruding from the body layer 12 is provided at the edge position of the release layer 11, and a second protrusion 131 protruding from the body layer 12 is provided at the edge position of the protective layer 13. In this embodiment, the setting of the first protrusion 111 can make it more convenient for manual or mechanical operation when removing the release layer 11 subsequently, and the setting of the second protrusion 131 can make it more convenient for manual or mechanical operation when removing the protective layer 13 subsequently, improving the bonding efficiency.

[0059] Figure 5 Only two first protrusions 111 and two second protrusions 131 are schematically drawn in Figure 5 . In other embodiments, the quantity and position can be adjusted according to the actual application scenario, and the present application is not limited to Figures 1 - 4 the structure shown. Of course,

[0060] In one embodiment, please continue to refer to Figure 3 , the viscosity of the second adhesive layer 125 between the core layer 124 and the protective layer 13 is variable, so that the bonding auxiliary module has a first state and a second state. Among them, when the bonding auxiliary module is in the first state, the viscosity of the first adhesive layer 123 is less than that of the second adhesive layer 125; when the bonding auxiliary module is in the second state, the viscosity of the first adhesive layer 123 is greater than that of the second adhesive layer 125.

[0061] Specifically, the material of the second adhesive layer 125 can include an ultraviolet irradiation viscosity-variable material, such as UV glue, whose viscosity decreases after receiving ultraviolet irradiation. Or, the material of the second adhesive layer 125 can include a temperature-controlled viscosity-variable material, such as a thermosensitive adhesive, whose viscosity decreases after being heated. The state of the second adhesive layer 125 before receiving ultraviolet irradiation or before being heated is set as the first state, and the viscosity of the first adhesive layer 123 is default less than that of the second adhesive layer 125. The state of the second adhesive layer 125 after receiving ultraviolet irradiation or after being heated is set as the second state, and the viscosity of the second adhesive layer 125 is reduced to be less than that of the first adhesive layer 123.

[0062] In the first state, the release layer 11 can be removed. Since the adhesiveness of the first adhesive layer 123 is less than that of the second adhesive layer 125, when the release layer 11 is removed, the body layer 12 will not be separated from the protective layer 13, and only the release layer 11 is removed. In the second state, the protective layer 13 is removed. Since the adhesiveness of the first adhesive layer 123 is greater than that of the second adhesive layer 125, when the protective layer 13 is removed, the body layer 12 will not be separated from the driving backplane, and only the protective layer 13 is removed, while the body layer 12 remains on the driving backplane. When further applying a non-conductive adhesive, the body layer 12 can prevent the non-conductive adhesive from overflowing into the non-display area, thereby reducing the probability of the non-display area being covered and contaminated by the non-conductive adhesive, improving the bonding yield when bonding the circuits in the non-display area to other devices, and enhancing the reliability of the display device.

[0063] In one embodiment, please refer to Figure 3 for reference Figure 6 , Figure 6 which is a schematic structural diagram of another embodiment of the bonding assist module of the present application. In this embodiment, the adhesiveness of the first adhesive layer 123 is greater than that of the second adhesive layer 125, and the bonding assist module further includes a tack reduction coating 15 disposed on the surface of the release layer 11 facing the first adhesive layer 123, and the adhesion between the tack reduction coating 15 and the first adhesive layer 123 is less than the adhesion between the tack reduction coating 15 and the release layer 11.

[0064] Specifically, the tack reduction coating 15 can be a silicon coating coated on the surface of the release layer 11 facing the first adhesive layer 123, or other coatings that can increase lubricity, so that when the release layer 11 is removed later, the first adhesive layer 123 can be easily separated from the tack reduction coating 15, that is, the release layer 11 and the tack reduction coating 15 are removed together, and then the first adhesive layer 123 can be attached to the driving backplane. When the protective layer 13 is further removed, since the adhesiveness of the first adhesive layer 123 is greater than that of the second adhesive layer 125, the first adhesive layer 123 is not easily separated from the driving backplane, that is, only the protective layer 13 is removed, thus leaving the body layer 12 on the driving backplane. When further applying a non-conductive adhesive, the body layer 12 can prevent the non-conductive adhesive from overflowing into the non-display area, thereby reducing the probability of the non-display area being covered and contaminated by the non-conductive adhesive, improving the bonding yield when bonding the circuits in the non-display area to other devices, and enhancing the reliability of the display device.

[0065] Certainly, the tack reduction coating 15 can also be combined with the above-mentioned other embodiments, and the obtained embodiments are still within the protection scope of the present application, and no further schematic diagrams are shown here one by one.

[0066] In the above embodiments, it is preferably set that the appearance on the side of the release layer 11 facing away from the body layer 12 is different from the appearance on the side of the protective layer 13 facing away from the body layer 12, where the different appearances include different colors and / or different shapes. For example, the release layer 11 is set as a film layer with a color, while the protective layer 13 is set as a transparent film layer, or the release layer 11 and the protective layer 13 are respectively set as film layers with different colors, or different-shaped marks are respectively set on the release layer 11 and the protective layer 13, so as to facilitate the distinction between the release layer 11 and the protective layer 13 when the release layer 11 is removed later, and improve the bonding efficiency.

[0067] Based on the same inventive concept, the present application also provides a bonding method. Please refer to Figure 7 , Figure 7 which is a schematic flow chart of an embodiment of the bonding method of the present application. The bonding method includes the following steps.

[0068] Step S11: Provide a driving backplane and a bonding auxiliary module.

[0069] Please refer to Figure 8a , Figure 8a which is a schematic structural diagram of an embodiment of the driving backplane. The driving backplane 100 has a display area 110 and a non-display area 120 surrounding the display area 110. The light-emitting element to be bonded needs to be bonded to the backplane electrode (not shown) of the display area 110. The non-display area 120 has more circuits (not shown) and needs to be bonded to other components (such as a driving chip, a circuit board, etc.), and finally corresponds to the border area of the display device.

[0070] The bonding auxiliary module is the bonding auxiliary module described in the above embodiments. For details, please refer to the above embodiments and will not be elaborated here. Here, the Figure 3 shown bonding auxiliary module is taken as an example to illustrate the specific process of the bonding method of the present application.

[0071] Step S12: Remove the release layer.

[0072] Please continue to refer to Figure 1 , after the release layer 11 is removed, the first surface 121 of the body layer 12 facing the release layer 11 is exposed.

[0073] Specifically, the body layer 12 includes a first adhesive layer 123, a core layer 124, and a second adhesive layer 125 that are sequentially stacked. Among them, the first adhesive layer 123 is located between the release layer 11 and the core layer 124, and the second adhesive layer 125 is located between the protective layer 13 and the core layer 124. Moreover, the adhesiveness of the second adhesive layer 125 is variable, so that the bonding assist module has a first state and a second state. When the bonding assist module is in the first state, the adhesiveness of the first adhesive layer 123 is less than that of the second adhesive layer 125; when the bonding assist module is in the second state, the adhesiveness of the first adhesive layer 123 is greater than that of the second adhesive layer 125. After removing the release layer 11, the surface of the first adhesive layer 123 facing away from the core layer 124 is exposed.

[0074] As described above, when the release layer 11 is removed in the first state, since the adhesiveness of the first adhesive layer 123 is less than that of the second adhesive layer 125, only the release layer 11 is removed.

[0075] Step S13: Attach the first surface to the driving backplane, and make the body layer cover the non-display area, with the hollowed-out area corresponding to the display area.

[0076] Please combine Figure 1 and Figure 8a Refer to Figure 8b , Figure 8b For Figure 7 is a schematic structural diagram corresponding to an implementation manner of step S13 in , after removing the release layer 11, the first surface 121 is exposed, that is, the surface of the first adhesive layer 123 facing away from the core layer 124 is exposed. Further attach it to the driving backplane 100, and make the body layer 12 cover the non-display area 120, with the hollowed-out area S corresponding to the display area 110. That is, the body layer 12 covers and protects the circuits in the non-display area 120.

[0077] Step S14: Remove the protective layer to expose the display area.

[0078] Please combine Figure 8b Refer to Figure 8c , Figure 8c For Figure 7 is a schematic structural diagram corresponding to an implementation manner of step S14 in . After attaching the first adhesive layer 123 to the driving backplane 100, further remove the protective layer 13 to expose the display area 110 corresponding to the hollowed-out area S.

[0079] Specifically, when the protective layer 13 is removed in the second state, since the adhesiveness of the first adhesive layer 123 is greater than that of the second adhesive layer 125, only the protective layer 13 is removed, and the body layer 12 remains on the driving backplane 100.

[0080] Step S15: Coat a non-conductive adhesive on the display area, transfer the light-emitting element to be bonded to the display area, and electrically connect the light-emitting element to the backplane electrode of the display area.

[0081] Please refer to Figure 8c for Figure 8d , Figure 8d which Figure 7 is a schematic structural diagram corresponding to an embodiment of step S15 in Figure 8d . After removing the protective layer 13, further coat a non-conductive adhesive 200 on the exposed display area 110, transfer the light-emitting element 300 to be bonded to the display area 110, and electrically connect the light-emitting element 300 to the backplane electrode (not labeled) of the display area 110.

[0082] Among them, when coating the non-conductive adhesive 200, it is in a liquid state and adheres to the body layer 12 of the non-display area 120, so that the non-conductive adhesive 200 cannot overflow to the non-display area 120, playing a role in protecting the circuits in the non-display area 120. After the non-conductive adhesive 200 is cured, it plays a role in bonding and fixing the light-emitting element 300 and the driving backplane 100.

[0083] Step S16: Remove the body layer to expose the non-display area.

[0084] Please refer to Figure 8d for Figure 8e , Figure 8e which Figure 7 is a schematic structural diagram corresponding to an embodiment of step S16 in Figure 8d . On the basis of the structure shown in

[0085] , further remove the body layer 12 to expose the non-display area 120, which is convenient for bonding with other components (such as a driving chip, a circuit board, etc.) to form a final display device. Among them, before the above bonding process, the body layer 12 has been playing a role in protecting the circuits in the non-display area 120. During the bonding process, it can improve the bonding divorce rate and the reliability of the finally obtained display device.

[0086] In one embodiment, please continue to refer to Figure 6 and Figure 7, the adhesiveness of the first adhesive layer 123 is greater than that of the second adhesive layer 125, and the bonding assist module further includes a tack reduction coating 15 disposed on the surface of the release layer 11 facing the first adhesive layer 123, and the adhesion between the tack reduction coating 15 and the first adhesive layer 123 is less than the adhesion between the tack reduction coating 15 and the release layer 11.

[0087] Then, when performing the above step S12, the first adhesive layer 123 is more easily separated from the tack reduction coating 15, that is, the release layer 11 and the tack reduction coating 15 are removed together, and then the first adhesive layer 123 can be attached to the driving backplane 100. And when performing the above step S14, since the adhesiveness of the first adhesive layer 123 is greater than that of the second adhesive layer 125, only the protective layer 13 is removed, so that the body layer 12 is left on the driving backplane, and when performing the above step S15, the body layer 12 serves to prevent the non-conductive adhesive 200 from overflowing into the non-display area 120, thereby reducing the probability that the non-display area 120 is covered and contaminated by the non-conductive adhesive, improving the bonding yield when bonding the circuit in the non-display area 120 with other devices, and improving the reliability of the display device.

[0088] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A bonding auxiliary module, It is characterized in that The bonding auxiliary module comprises: A release layer, a main layer and a protective layer are stacked in sequence; Among them, the release layer and the protective layer respectively cover the two opposite surfaces of the main layer, the first surface of the main layer facing the release layer and the second surface of the main layer facing the protective layer are both sticky, and a hollow area is arranged in the middle position of the main layer, the hollow area of ​​the main layer corresponds to the display area of ​​the driving backplane, and the main layer covers the non-display area of ​​the driving backplane.

2. The bonding auxiliary module according to claim 1, It is characterized in that The main body layer includes: a first adhesive layer, a core layer and a second adhesive layer which are stacked in sequence; wherein the first adhesive layer is located between the release layer and the core layer, and the second adhesive layer is located between the protective layer and the core layer.

3. The bonding auxiliary module according to claim 2, It is characterized in that The viscosity of the first adhesive layer is greater than the viscosity of the second adhesive layer; The bonding auxiliary module further includes a tack-reducing coating disposed on a surface of the release layer facing the first adhesive layer, and the adhesion between the tack-reducing coating and the first adhesive layer is smaller than the adhesion between the tack-reducing coating and the release layer.

4. The bonding auxiliary module according to claim 2, It is characterized in that The viscosity of the second adhesive layer is variable, so that the bonding auxiliary module has a first state and a second state; When the bonding auxiliary module is in the first state, the viscosity of the first adhesive layer is lower than that of the second adhesive layer; when the bonding auxiliary module is in the second state, the viscosity of the first adhesive layer is higher than that of the second adhesive layer.

5. The bonding auxiliary module according to claim 1, It is characterized in that The bonding auxiliary module also includes: A support column is arranged in the hollow area, and two ends of the support column are respectively in contact with the release layer and the protective layer.

6. The bonding auxiliary module according to claim 5, It is characterized in that The support column and the release layer are integrally formed; or, the support column and the protective layer are integrally formed.

7. The bonding auxiliary module according to any one of claims 1 to 6, It is characterized in that The appearance of the release layer on the side away from the main layer is different from the appearance of the protection layer on the side away from the main layer; wherein the different appearances include different colors and / or different shapes.

8. The bonding auxiliary module according to claim 7, It is characterized in that The main body layer encloses and surrounds the hollow area.

9. A bonding method, It is characterized in that include: Provide a driving backplane and a bonding auxiliary module according to any one of claims 1 to 8; wherein the driving backplane has a display area and a non-display area surrounding the display area; removing the release layer; Attaching the first surface to the driving backplane, and making the body layer cover the non-display area, and the hollow area corresponds to the display area; removing the protective layer to expose the display area; Apply non-conductive adhesive to the display area, transfer the light-emitting element to be bonded to the display area, and electrically connect the light-emitting element to the backplane electrode in the display area; Remove the body layer to expose the non-display area.

10. The bonding method according to claim 9, wherein, The body layer includes a first adhesive layer, a core layer, and a second adhesive layer stacked in sequence. The first adhesive layer is located between the release layer and the core layer, and the second adhesive layer is located between the protective layer and the core layer; the adhesion of the first adhesive layer is greater than that of the second adhesive layer. The bonding auxiliary module further includes a viscosity-reducing coating, the viscosity-reducing coating is disposed on the surface of the release layer facing the first adhesive layer, and the adhesion between the viscosity-reducing coating and the first adhesive layer is less than the adhesion between the viscosity-reducing coating and the release layer; The step of removing the release layer includes: Remove the release layer so that the viscosity-reducing coating and the release layer are removed together; The step of removing the protective layer includes: Remove the protective layer so that only the protective layer is removed.

11. The bonding method according to claim 9, wherein, The body layer includes a first adhesive layer, a core layer, and a second adhesive layer stacked in sequence. The first adhesive layer is located between the release layer and the core layer, and the second adhesive layer is located between the protective layer and the core layer; the viscosity of the second adhesive layer is variable, so that the bonding auxiliary module has a first state and a second state; when the bonding auxiliary module is in the first state, the adhesion of the first adhesive layer is less than that of the second adhesive layer; When the bonding auxiliary module is in the second state, the adhesion of the first adhesive layer is greater than that of the second adhesive layer; The step of removing the release layer includes: Make the bonding auxiliary module in the first state and remove the release layer so that only the release layer is removed; The step of removing the protective layer includes: Make the bonding auxiliary module in the second state and remove the protective layer so that only the protective layer is removed.

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