Multi-light-emitting-surface lamp bead and support thereof

Abstract

The present application relates to a multi-light-emitting-surface lamp bead support, comprising a lead frame and a bowl cup, the bowl cup comprising a cup bottom and a cup body, the lead frame being embedded in the cup bottom, and the cup body being arranged on the lead frame; the bowl cup further comprises a cross-shaped baffle arranged in the bowl cup, which divides the inner cavity of the bowl cup into four chambers arranged in a 2x2 array. The present application also relates to a multi-light-emitting-surface lamp bead comprising the lamp bead support. The lamp bead support has four independent chambers for placing four LED chips respectively, which facilitates flexible adjustment of the type of each chip or the coated phosphor thereof independently, so that the lamp bead using the lamp bead support has multiple optional light distribution schemes.

Description

Technical Field

[0001] This invention relates to LED technology, and in particular to a multi-faceted LED chip and its support. Background Technology

[0002] Most existing smart lighting and illumination products contain RGB or RGBW LED light-emitting units, which arrange multi-color LED chips inside LED beads of limited size, and have features such as multi-circuit control and dimmable and color-adjustable dimming.

[0003] The applicant described an LED device for a lighting system in patent document CN111725378A, whose LED support has three parallel chambers. The middle chamber is used to house an RGB chip, and the two side chambers are used to house white light chips. However, this LED device has the following drawbacks:

[0004] 1. The RGB chips are all placed in the same chamber. The light emission of the three chips affects each other, making light distribution difficult. It is not possible to adjust the light and color of the three chips separately by setting different phosphors.

[0005] 2. The parallel arrangement of the chambers results in a narrow and long shape, which in turn leads to a narrow and long light-emitting surface. Furthermore, the size of the die-bonding area for placing the chip within the chamber is limited, which is detrimental to light emission and reliability.

[0006] 3. In order to set up three parallel chambers and multi-color LED chips in a small device, the spacing of the pads and the spacing of the pins in the metal frame need to be narrowed. As a result, the silver in the metal frame is prone to migration under different voltages, which can lead to leakage or short circuit.

[0007] 4. The metal circuitry lacks optimized design to accommodate the arrangement of three parallel chambers and multi-color LED chips, resulting in a relatively fixed emission color for each chamber, which cannot be flexibly changed. Summary of the Invention

[0008] To overcome or improve at least one of the defects of the prior art, the present invention provides a multi-light-emitting LED bead holder with four independent chambers for placing four LED chips respectively, which facilitates independent and flexible adjustment of the type of each chip or the phosphor coating of each chip, so that the LED beads using the LED bead holder have a variety of optional light distribution schemes.

[0009] The technical solution adopted in this invention is as follows:

[0010] A multi-faceted LED holder includes a lead frame and a cup. The cup includes a bottom and a body. The lead frame is embedded in the bottom, and the body is disposed on the lead frame. The cup also includes a cross-shaped baffle disposed inside the cup, dividing the inner cavity of the cup into four chambers arranged in a 2×2 array.

[0011] The LED bead holder of the present invention has four independent chambers, and four LED chips can be placed in each chamber respectively. Each chip in each chamber emits light independently without being interfered with by other chips. It is convenient to flexibly adjust the type of each chip or the type of phosphor it is coated with. The emission colors of the four chips can be arbitrarily and freely combined, so that the LED bead has a variety of optional light distribution schemes, which is beneficial to the design and application of multispectral synthesis schemes.

[0012] Moreover, the present invention utilizes a cross-shaped baffle to divide the four chambers in a bowl of limited size into a 2×2 array. Thus, the length and width of each chamber are roughly the same, and the shape is suitable for placing the chip, avoiding the limitation on the shape and area of ​​the chip placement area caused by the parallel and narrow chambers used in the prior art.

[0013] From a production perspective, the lamp bead bracket of this invention has strong versatility and can meet the design and application requirements of various types of lamp bead products. It allows the differentiated design of lamp bead light distribution to be moved to the die bonding stage, eliminating the need to adjust the bracket structure design in order for the final lamp bead product to meet specific light distribution requirements. As a result, there is no need to change the manufacturing process of the bracket, which simplifies the light distribution difficulty, reduces costs, and increases feasibility. It is also conducive to achieving intelligent control of spectrum adjustment and multi-color temperature, resulting in various lamp beads that meet the application requirements of lighting, smart lighting, plant lighting, and health lighting.

[0014] As a further optimization, the lead frame exposes three adjacent and insulated functional sections in each cavity. These functional sections are used to place LED chips or bonding wires. With only three functional sections in each cavity, it is beneficial to set sufficient insulation distance between the functional sections.

[0015] As a further optimization, in each row of two chambers, two functional parts in one chamber are electrically connected to two functional parts in the other chamber, and the remaining functional part in one chamber is insulated from the remaining functional part in the other chamber.

[0016] As a further optimization, the functional part closest to the center of the cross-shaped baffle in each chamber has the largest area; in each row of two chambers, the functional part with the largest area in one chamber is electrically connected to the functional part with the largest area in the other chamber.

[0017] As a further optimization, at least one of the functional sections with the largest area within the cavity is provided with a die-bonding area and a wire bonding area.

[0018] As a further optimization, a groove is provided between the die-bonding area and the wire bonding area to prevent die-bonding adhesive from spreading from the die-bonding area to the wire bonding area.

[0019] As a further optimization, the depth of the groove is less than half the thickness of the lead frame, its width is greater than 0.05 mm, and its length is greater than 0.2 mm.

[0020] As a further optimization, the lead frame includes eight spaced-apart pads, the bottom of the cup fills the gaps between adjacent pads to insulate each pad from the others, and the pads are connected to pins located outside the cup.

[0021] As a further optimization, each pad has a raised step at its edge, thereby increasing the contact area between the pad and the cup to improve the bonding strength.

[0022] As a further optimization, the eight pads are respectively two common die bond pads, two common wire bond pads, and four non-common pads; the two common die bond pads are respectively located in two rows of cavities, each common die bond pad connecting the two cavities in its row, forming two electrically connected functional parts in the two cavities of the row; the two common wire bond pads are respectively located in two rows of cavities, each common wire bond pad connecting the two cavities in its row, forming two electrically connected functional parts in the two cavities of the row; the four non-common pads are respectively located in the four cavities, each forming a functional part in the four cavities.

[0023] As a further optimization, the cross-shaped baffle is disposed on the bottom of the lead frame and the cup, and is also connected to the lead frame through a through hole to enhance the bonding force.

[0024] The present invention also provides a multi-faceted light-emitting LED bead, comprising the aforementioned LED bead bracket and four light-emitting units, wherein the four light-emitting units are respectively disposed in the four chambers of the LED bead bracket, and each light-emitting unit includes an LED chip connected to the lead frame.

[0025] As a further optimization, the lead frame includes eight spaced-apart pads, the ends of which are respectively connected to four positive pins on one side of the bowl and four negative pins on the opposite side.

[0026] To better understand and implement this invention, the following detailed description is provided in conjunction with the accompanying drawings. Attached Figure Description

[0027] Figure 1 This is a front structural diagram of the multi-light-emitting LED bead holder of the present invention;

[0028] Figure 2 This is a diagram showing the pad arrangement on the front side of the lead frame in the multi-emitting surface lamp bead bracket of the present invention.

[0029] Figure 3This is a schematic diagram of the back of the lead frame in the multi-emitting surface lamp bead bracket of the present invention;

[0030] Figure 4 for Figure 1 Simplified sectional view along the AA direction;

[0031] Figure 5 This is a schematic diagram of a die bonding and wire bonding method for the multi-emitting LED chip of the present invention;

[0032] Figure 6 This is a schematic diagram of another die bonding and wire bonding method for the multi-light-emitting LED chip of the present invention;

[0033] Figure 7A and Figure 7B These are structural diagrams and die bonding wire diagrams of a preferred embodiment of the present invention;

[0034] Figure 8A and Figure 8B These are structural diagrams and die bonding wire diagrams of an LED bead according to another preferred embodiment of the present invention;

[0035] Figure 9A and Figure 9B These are structural diagrams and die bonding wire diagrams of an LED bead according to another preferred embodiment of the present invention.

[0036] Reference numerals: 1. Lead frame; 2. Bowl; 21. Cup bottom; 22. Cup body; 23. Cross-shaped baffle; 231. First baffle; 232. Second baffle; 230. Cylinder; 220. First chamber; 41. Second chamber; 42. Third chamber; 43. Fourth chamber; 44. Common die bonding pads 11a, 11b; Common wire bonding pads 12a, 12b; Non-common pads 13a, 13b, 13c, 13d; Functional parts 101-112; Die bonding area 14; Wire bonding area 15; Groove 16; Protruding step 17; Through hole 18; Pins P1-P9; First light-emitting unit L1; Second light-emitting unit L2; Third light-emitting unit L3; Fourth light-emitting unit L4; First LED chip 31; Second LED chip 32; Third LED chip 33; Fourth LED chip 34; Red light-emitting unit (R); Green light-emitting unit (G); White light-emitting unit (W). Detailed Implementation

[0037] Please see Figure 1-4 The multi-faceted LED holder of the present invention includes a lead frame 1 and a cup 2. The cup 2 includes a cup bottom 21, a cup body 22, and a cross-shaped baffle 23. The lead frame 1 is embedded in the cup bottom 21, and the cup body 22 is disposed on the front side of the lead frame 1. The cross-shaped baffle 23 is disposed inside the cup 2, dividing the inner cavity of the cup 2 into four chambers arranged in a 2×2 array.

[0038] The lead frame 1 is made of metal plate, preferably copper plate. The cup 2 is an integral molded structure injection molded onto the lead frame 1, and is made of plastic, preferably white plastic.

[0039] The cross-shaped baffle 23 is disposed on the lead frame 1 and the cup bottom 21, and is connected to the cup bottom 21, the cup body 22 and the lead frame 1.

[0040] The cross-shaped baffle 23 is composed of a first baffle 231 and a second baffle 232 that are vertically connected, and the vertically connected part is a cylinder 230. In order to enhance the bonding force between the cross-shaped baffle 23, the lead frame 1 and the cup bottom 21, the cross-shaped baffle 23 is also connected to the lead frame 1 through a through hole 18.

[0041] In the embodiment illustrated in the present invention, the bowl 2 is a square bowl with a rounded corner outline. The top surface of the bowl 2's body 22 also has a recessed notch 220 for polarity identification. A first baffle 231 connects two opposite inner walls of the bowl 22, and a second baffle 232 connects two other opposite inner walls of the bowl 22. Therefore, each chamber separated by the cross-shaped baffle 23 is also square in shape.

[0042] Figure 1 Of the four chambers arranged in a 2×2 array shown, two rows of chambers are located on both sides of the first baffle 231 and are symmetrically arranged along the first baffle 231. The first row includes the first chamber 41 and the second chamber 42, and the second row includes the third chamber 43 and the fourth chamber 44. Two columns of chambers are located on both sides of the second baffle 232 and are symmetrically arranged along the second baffle 232. The first column includes the first chamber 41 and the third chamber 43, and the second column includes the second chamber 42 and the fourth chamber 44. The four chambers are arranged in a square pattern that is symmetrical both horizontally and vertically.

[0043] The front of the lead frame 1 is exposed in each cavity. The exposed part in each cavity consists of three adjacent and insulated functional parts, which are used to place LED chips or to bond wires.

[0044] In order to install the LED chip in the middle of the cup 2 so that the lamp bead achieves a good light output effect, the functional part closest to the center of the cross-shaped baffle 23 in each chamber has the largest area, or the functional part closest to the cylinder 230 has the largest area, which is used to provide a die bonding area to place the LED chip.

[0045] In each row of two chambers, two functional parts in one chamber are electrically connected to two functional parts in the other chamber, and the remaining functional part in one chamber is insulated from the remaining functional part in the other chamber. The functional parts in each column of two chambers are insulated from each other. The functional parts in two pairs of diagonally arranged chambers are also insulated from each other. Additionally, in each row of two chambers, the functional part with the largest area in one chamber is electrically connected to the functional part with the largest area in the other chamber.

[0046] Combination Figure 1-3 As shown, in order to more clearly illustrate the structure of the lead frame 1, Figure 2 The diagram shows the pad arrangement on the front of the lead frame 1 after the cup 2 has been removed. The lead frame 1 specifically includes eight spaced-apart pads and eight pins located outside the cup 2. The bottom 21 of the cup 2 fills the gaps between adjacent pads, insulating them from each other. The ends of the eight pads are connected to the eight pins. Each pad is approximately a strip of metal plate with its length along the direction of the first baffle 231. The front of each pad is exposed within the cavity to form a functional section. The eight pins are divided into two groups of four pins each, located on opposite sides of the cup 2.

[0047] More specifically, the eight pads are common die bond pads 11a and 11b, common wire bond pads 12a and 12b, and non-common pads 13a, 13b, 13c, and 13d. Common die bond pad 11a connects the first chamber 41 and the second chamber 42, forming functional parts 101 and 102 for electrical connection within the first chamber 41 and the second chamber 42, respectively; common die bond pad 11b connects the third chamber 43 and the fourth chamber 44, forming functional parts 103 and 104 for electrical connection within the third chamber 43 and the fourth chamber 44, respectively; common wire bond pad 12a connects the first chamber 41 and the second chamber 42, forming functional parts 103 and 104 for electrical connection within the first chamber 41 and the second chamber 44, respectively. Functional parts 105 and 106 that form electrical connections are formed within 42; a common bonding pad 12b connects the third chamber 43 and the fourth chamber 44, and functional parts 107 and 108 that form electrical connections are formed in the third chamber 43 and the fourth chamber 44, respectively; non-common bonding pads 13a, 13b, 13c, and 13d are respectively disposed in the first chamber, the second chamber, the third chamber, and the fourth chamber, and independent functional parts 109, 110, 111, and 112 are formed in the four chambers, respectively.

[0048] Common bonding pad 12a, non-common bonding pad 13a, non-common bonding pad 13c and common bonding pad 12b are respectively connected to pins P1, P2, P3 and P4 arranged at intervals on one side of cup 2. Non-common bonding pad 13b, common die bond pad 11a, common die bond pad 11b and non-common bonding pad 13d are respectively connected to pins P5, P6, P7 and P8 arranged at intervals on the opposite side of cup 2.

[0049] Depend on Figure 1 As can be seen, functional units 101, 102, 103, and 104 are the functional units with the largest area in their respective cavities, and can be used as die bonding areas for placing LED chips, or can be set as die bonding areas and wire bonding areas for wire bonding at the same time; while functional units 106, 107, 108, 109, 110, 111, and 112 are all located near the inner wall of the cup body 22, and can be used to set wire bonding areas. Among them, functional units 109, 110, 111, and 112 formed by non-common pads 13a, 13b, 13c, and 13d are respectively located in a corner of the corresponding cavity.

[0050] More preferably, in the embodiment illustrated in the present invention, functional parts 101 and 103 are respectively provided with a die-bonding region 14 and a wire-bonding region 15. Due to the small size of the chamber, functional part 101 extends to the adjacent functional part 105 to form a protrusion providing the wire-bonding region 15, while functional part 105 is provided with a recessed portion adapted to the protrusion. Functional part 103 extends to the adjacent functional part 107 to form a protrusion providing the wire-bonding region 15, while functional part 107 is provided with a recessed portion adapted to the protrusion. Thus, it can be ensured that functional parts 101 and 103 have sufficient area to simultaneously provide the die-bonding region 14 and the wire-bonding region 15, and also ensure that there is sufficient insulation distance between functional part 101 and the adjacent functional part 105, and sufficient insulation distance between functional part 103 and the adjacent functional part 107, thereby meeting the requirements for preventing short circuits.

[0051] Furthermore, to prevent die bond adhesive from spreading from the die bond area 14 to the wire bonding area 15, a groove 16 is provided between the die bond area 14 and the wire bonding area 15 of the functional parts 101 and 103. This groove is used to contain and block the die bond adhesive, preventing contamination of the wire bonding area 15 and improving the reliability of the wire bonding. More preferably, the depth of the groove 16 is less than half the thickness of the lead frame 1, i.e., less than half the thickness of the copper plate used to make the lead frame 1. The width of the groove 16 is greater than 0.05 mm, and the length is greater than 0.2 mm. The wire bonding size in the wire bonding area 15 is approximately between 0.08 mm and 0.15 mm, and the groove 16 can protect the wire bonding area 15 within this range from contamination by the die bond adhesive.

[0052] The functional components in the first chamber 41 and the second chamber 42 are symmetrically arranged with the functional components in the third chamber 43 and the fourth chamber 44 along the first baffle 231. Two through holes 18 penetrating the lead frame 1 are symmetrically arranged along the first baffle 231 and are respectively located in the common die bonding pads 11a and 11b. The second baffle 232 is provided on the two through holes 18 and is reinforcedly connected to the lead frame 1 and the cup bottom 2 through the two through holes 18.

[0053] like Figure 2 and Figure 3As shown, in order to enhance the bonding force between the pad and the cup 2 by increasing the bonding area, each pad has at least one protruding step 17 on its edge. The protruding step 17 protrudes from the side of the pad and its protrusion width is less than 0.08 mm. The protruding step 17 can be provided on the front edge or the back edge of the pad. The protruding step 17 can be continuous, that is, continuously protruding outward along the edge of the pad, or it can be a discontinuous protrusion.

[0054] Preferably, in the embodiment illustrated in the present invention, the front edge of the functional part located within the cavity in the pad is provided with a protruding step 17. Figure 2 The front side of the pads is shown. Figure 2 The dashed line on the center pad indicates its back edge. Figure 3 The back of the pads is shown. Figure 3 The outermost solid line of the middle pad indicates its front edge. (Combined) Figure 1 and Figure 4 Taking the protruding steps 17 of the common die bond pad 11a and the common wire bond pad 12a as examples, the common die bond pad 11a has a protruding step 17 on the front edge of the functional part 101, so the front width of the functional part 101 is slightly larger than the back width, and its front area is larger than its back area, which is beneficial to provide sufficient front area for setting the die bond area 14 and the wire bond area 15. Similarly, the common wire bond pad 12a has a protruding step 17 on the front edge of the functional part 109, so the front width of the functional part 109 is slightly larger than the back width, and its front area is larger than its back area, which is beneficial to provide sufficient front area for wire bonding.

[0055] In addition, a protruding step 17 can be provided on the back edge of the side portion (the end portion connected to the pin) of the pad embedded in the cup body 22, so that the back width of the side portion is greater than the front width. By providing protruding steps on the front edge and back edge of different parts of the pad, it is possible to ensure that the functional part has the largest possible front area, and to increase the contact area between the lead frame 1 and the cup 2, thereby obtaining the interlocking force in different directions, effectively improving the bonding strength between the lead frame 1 and the cup 2, and thus increasing the mechanical reliability of the bracket.

[0056] The aforementioned protruding step 17 and groove 16 are both obtained by stamping the metal plate used to make the solder pads using a stamping machine. The groove 16 is an indentation that is recessed on the front side of the solder pad 11a or 11b and protrudes on its back side.

[0057] Please see Figures 5 to 9B The multi-light-emitting LED bead of the present invention includes the aforementioned LED bead bracket and four light-emitting units. The four light-emitting units are respectively disposed in the four chambers of the LED bead bracket. Each light-emitting unit includes an LED chip, and the LED chip is fixedly connected to the die-bonding area of ​​the lead frame 1 by die-bonding adhesive.

[0058] If the light-emitting unit is a white light-emitting unit, then the LED chip within it is a blue chip, coated with a light conversion material, which can be phosphor or quantum dot material, used to excite and generate white light. Taking a blue chip coated with phosphor as an example, the phosphor is placed in the corresponding cavity and below the cross-shaped baffle 23. The emission colors of the four light-emitting units can be arbitrarily and freely combined. They can be combined using LED chips with the same or different emission colors, and can also use the same or different phosphors, giving the lamp beads a variety of selectable light distribution schemes.

[0059] The four light-emitting units are the first light-emitting unit L1, the second light-emitting unit L2, the third light-emitting unit L3, and the fourth light-emitting unit L4, which are respectively located in the first chamber 41, the second chamber 42, the third chamber 43, and the fourth chamber 44.

[0060] The first LED chip 31 in the first light-emitting unit L1 is fixed to the die-bonding area 14 of the functional unit 101, the second LED chip 32 in the second light-emitting unit L2 is fixed to the die-bonding area of ​​the functional unit 102, the third LED chip 33 in the third light-emitting unit L3 is fixed to the die-bonding area 14 of the functional unit 103, and the fourth LED chip 34 in the fourth light-emitting unit L4 is fixed to the die-bonding area of ​​the functional unit 104.

[0061] like Figure 5 As shown, the LED is preferably designed with four independent channels, wherein pins P1-P4 serve as four negative pins, and pins P5-P8 serve as four positive pins; combined with Figure 1 As shown, the first LED chip 31 has a forward-mounted structure and is connected to the bonding area 15 of the functional unit 101 and the functional unit 109 via leads, or the first LED chip 31 has a vertical structure and is connected to the functional unit 109 only via leads; the second LED chip 32 has a forward-mounted structure and is connected to the functional units 106 and 110 via leads, respectively; the third LED chip 33 has a forward-mounted structure and is connected to the bonding area 15 of the functional unit 103 and the functional unit 111 via leads, or the third LED chip 33 has a vertical structure and is connected to the functional unit 111 only via leads (e.g., ...). Figure 7B The fourth LED chip 34 has a forward-mounted structure and is connected to the functional unit 108 and the functional unit 112 via leads.

[0062] like Figure 6 As shown, the LED can also be designed as a series dual-channel LED, where pins P1 and P4 serve as two negative pins, and pins P5 and P8 serve as two positive pins; combined with Figure 1As shown, the first LED chip 31 has a forward-mounted structure and is connected to the bonding area 15 of the functional unit 101 and the functional unit 105 via leads, or the first LED chip 31 has a vertical structure and is connected to the functional unit 101 only via leads; the second LED chip 32 has a forward-mounted structure and is connected to the functional unit 102 and the functional unit 110 via leads, or the third LED chip 33 has a forward-mounted structure and is connected to the bonding area 15 of the functional unit 103 and the functional unit 107 via leads, or the third LED chip 33 has a vertical structure and is connected to the functional unit 107 only via leads; the fourth LED chip 34 has a forward-mounted structure and is connected to the functional unit 104 and the functional unit 112 via leads.

[0063] like Figure 7A and Figure 7B As shown, in a preferred embodiment of the LED bead, the first light-emitting unit L1 is a green light-emitting unit (G), the first LED chip 31 is a green chip, the second light-emitting unit L2 is a white light-emitting unit (W), the second LED chip 32 is a blue chip coated with phosphor, the third light-emitting unit L3 is a red light-emitting unit (R), the third LED chip 33 is a red chip, the fourth light-emitting unit L4 is a blue light-emitting unit (B), and the fourth LED chip 34 is a blue chip. Therefore, the LED bead emits four colors (RGBW) and adopts a four-channel independent design. Pin P1 serves as the blue chip coated with phosphor in the white light-emitting unit (W). The negative terminal pin W- is used for the green chip in the green light-emitting unit (G), the negative terminal pin P2 is used for the green chip in the red light-emitting unit (R), the negative terminal pin R- is used for the red chip in the red light-emitting unit (R), the negative terminal pin P4 is used for the blue chip in the blue light-emitting unit (B), the negative terminal pin B- is used for the blue chip coated with phosphor in the white light-emitting unit (W), the positive terminal pin W+ is used for the green chip in the green light-emitting unit (G), the positive terminal pin P7 is used for the red chip in the red light-emitting unit (R), and the positive terminal pin P8 is used for the blue chip in the blue light-emitting unit (B).

[0064] like Figure 8A and Figure 8B As shown, in another preferred embodiment of the lamp bead, all four light-emitting units are white light-emitting units (W), and the first LED chip 31, the second LED chip 32, the third LED chip 33 and the fourth LED chip 34 are all blue chips, and their surfaces are coated with the same or different phosphors respectively. Then the white light spectrum emitted by the lamp bead is adjustable, and a four-channel independent design is adopted. Pins P1-P4 are respectively used as the negative electrode pins W- of the blue chips in the four white light-emitting units (W), and pins P5-P8 are respectively used as the positive electrode pins W+ of the blue chips in the four white light-emitting units (W).

[0065] like Figure 9A and Figure 9B As shown, in another preferred embodiment of the LED bead, the first light-emitting unit L1 is a green light-emitting unit (G), the first LED chip 31 is a green chip, the second light-emitting unit L2 is a white light-emitting unit (W), the second LED chip 32 is a blue chip coated with phosphor, the third light-emitting unit L3 is a white light-emitting unit (W), the third LED chip 33 is a blue chip coated with phosphor, the fourth light-emitting unit L4 is a blue light-emitting unit (B), and the fourth LED chip 34 is a blue chip. The LED bead adopts a four-channel independent design. Pin P1 serves as the negative electrode pin W- of the blue chip coated with phosphor in the white light-emitting unit (W) in the second chamber 42, and pin P2 serves as the green light-emitting unit (G). In the green light-emitting unit (G), the negative terminal pin G- of the green chip, pin P3 serves as the negative terminal pin W- of the blue chip coated with phosphor in the white light-emitting unit (W) in the third chamber 43, pin P4 serves as the negative terminal pin B- of the blue chip in the blue light-emitting unit (B), pin P5 serves as the positive terminal pin W+ of the blue chip coated with phosphor in the white light-emitting unit (W) in the second chamber 42, pin P6 serves as the positive terminal pin G+ of the green chip in the green light-emitting unit (G), pin P7 serves as the positive terminal pin W+ of the blue chip coated with phosphor in the white light-emitting unit (W) in the third chamber 43, and pin P8 serves as the positive terminal pin B+ of the blue chip in the blue light-emitting unit (B).

[0066] The lamp beads described in this invention are applicable to various light-emitting devices, and light-emitting devices containing the lamp beads can be used in products such as lighting, smart lighting, plant lighting, and health lighting.

[0067] Because the lamp bead bracket used in this invention has a unique design with four chambers arranged in a 2×2 array and corresponding pads, four LED chips can be placed inside the lamp bead. Although the overall size of the lamp bead is limited, each chamber can hold LED chips of various commonly used sizes and specifications, including 1130 chips (size 11mil*30mil), 1114 chips (size 11mil*14mil), 1025 chips (size 10mil*25mil), 1726 chips (size 17mil*26mil), etc. The functional parts set in each chamber and its interior can meet the process requirements of various chip die bonding and wire bonding.

[0068] Meanwhile, the four independent chambers in the LED bead bracket allow the internal light-emitting units to emit light independently without interference. This makes it convenient to independently adjust the brightness and color of the light-emitting units by changing the type of LED chip or the coating phosphor. The light distribution scheme of the LED bead includes, but is not limited to, the implementation methods described above.

[0069] Specifically, especially when all four light-emitting units of the LED are white, the light emitted by the blue chip in each white light-emitting unit is only excited by the phosphor in its own chamber to produce the corresponding white light, and is not affected by the phosphor in other chambers. This allows for flexible adjustment of the phosphor types in each of the four chambers. Through various optional combinations of the four blue chips and their coated phosphors, intelligent control of the spectrum and multiple color temperatures can be achieved, resulting in LEDs that meet the requirements of applications such as smart lighting, plant lighting, and health lighting. Similarly, when the four light-emitting units of the LED are designed as RGBW, each light-emitting unit can be independently dimmed and color-tuned to achieve the desired effects for lighting, smart lighting, and other application scenarios.

[0070] In addition, the arrangement of the pads and pins in the lead frame of the LED chip holder allows for a four-channel independent design by using different bonding methods for the LED chips in each cavity of the LED chip. Figure 5 In this configuration, each of the four LED chips uses a separate positive pin and a separate negative pin; a series dual-channel design can also be achieved. Figure 6 If two LED chips are connected in series, they share a positive pin and a negative pin, and the other two LED chips are connected in series, they share a positive pin and a negative pin.

[0071] In the description of this invention, it should be noted that directional terms such as "center," "row," "column," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this invention.

[0072] Furthermore, terms such as "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of terms such as "first," "second," and "third" may explicitly or implicitly include one or more of those features. In the description of this invention, "multiple" means two or more, unless otherwise explicitly specified.

[0073] In this invention, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0074] The embodiments or implementation methods described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the protection scope of the present invention.

Claims

1. A multi-faceted lighting lamp bead holder, comprising a lead frame and a cup, the cup comprising a bottom and a body, the lead frame being embedded in the bottom, and the body being disposed on the lead frame; characterized in that: The bowl also includes a cross-shaped baffle, which is disposed inside the bowl and divides the inner cavity of the bowl into four chambers arranged in a 2×2 array, so that the LED chip holder has four independent chambers for placing four LED chips respectively; the lead frame includes eight spaced-apart pads and eight pins disposed outside the bowl, the bottom of the bowl is filled with the gaps between adjacent pads to insulate each pad from each other, and the pads are connected to the pins disposed outside the bowl; the front of the lead frame exposes three adjacent and spaced-apart functional parts in each chamber, which are used to place LED chips or for wire bonding; in each row of two chambers, two functional parts in one chamber are electrically connected to two functional parts in another chamber respectively, and the remaining functional part in one chamber is insulated from the remaining functional part in the other chamber.

2. The lighting lamp bead bracket according to claim 1, characterized in that: The cross-shaped baffle is composed of a first baffle and a second baffle that are vertically connected, and each chamber separated by the cross-shaped baffle is square in shape.

3. The LED bead bracket according to claim 2, characterized in that: The largest functional area in each cavity can be used as a die-bonding area for placing LED chips, or a die-bonding area and a wire bonding area can be set up at the same time.

4. The lighting lamp bead bracket according to claim 3, characterized in that: The functional part closest to the center of the cross-shaped baffle in each chamber has the largest area; in each row of two chambers, the functional part with the largest area in one chamber is electrically connected to the functional part with the largest area in the other chamber.

5. The lighting lamp bead bracket according to claim 4, characterized in that: A groove is provided between the die-bonding region and the wire bonding region.

6. The lighting lamp bead bracket according to claim 5, characterized in that: The depth of the groove is less than half the thickness of the lead frame, its width is greater than 0.05 mm, and its length is greater than 0.2 mm.

7. The lighting lamp bead bracket according to claim 6, characterized in that: The eight pads are two common die bond pads, two common wire bond pads, and four non-common pads. The two common die bond pads are respectively located in two rows of cavities, and each common die bond pad connects to the two cavities in its row, forming two electrically connected functional parts in the two cavities of the row. The two common wire bond pads are respectively located in two rows of cavities, and each common wire bond pad connects to the two cavities in its row, forming two electrically connected functional parts in the two cavities of the row. The four non-common pads are respectively located in the four cavities, each forming a functional part in the four cavities.

8. The lighting lamp bead bracket according to any one of claims 1 to 7, characterized in that: Each pad has at least one raised step at its edge, the raised step being formed by protruding from the side of the pad.

9. The lighting lamp bead bracket according to claim 8, characterized in that: The protruding steps are formed by continuously protruding outwards along the edge of the pad, or by discontinuous protrusions.

10. The lighting lamp bead bracket according to claim 8, characterized in that: The cross-shaped baffle is disposed on the bottom of the lead frame and the cup, and is also connected to the lead frame through a through hole.

11. A multi-faceted lighting lamp bead, characterized in that: The device includes a lamp bead bracket as described in any one of claims 1 to 10 and four light-emitting units, wherein the four light-emitting units are respectively disposed in the four chambers of the lamp bead bracket, and each light-emitting unit includes an LED chip connected to the lead frame.

12. The lighting bulb according to claim 11, characterized in that: The lead frame includes eight spaced-apart pads, the ends of which are respectively connected to four positive pins on one side of the bowl and four negative pins on the opposite side.

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