Display panel and display device

Abstract

The application relates to the technical field of display devices, and discloses a display panel and a display device, the display panel comprising a display area and a non-display area, the non-display area comprising an encapsulation area and a buffer area, the buffer area being arranged on the side of the encapsulation area facing the display area, the display panel further comprising a substrate, a cover plate, an encapsulation structure and a first buffer structure, the cover plate being arranged on the substrate, the encapsulation structure being arranged between the substrate and the cover plate and located in the encapsulation area and arranged around the display area, the first buffer structure being arranged between the substrate and the cover plate and located in the buffer area, and the first buffer structure being in contact with the encapsulation structure. The stress generated when the first buffer structure and the encapsulation structure are cooled and shrunk can be better released compared with the stress generated when the encapsulation structure is simply cooled, and the stress can be dispersed on the encapsulation structure and the first buffer structure, so that the strength of the display panel is improved; the first buffer structure can reduce the influence of the sintering temperature on the structure and the circuit of the display area.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, in particular to a display panel and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) display panels are widely used in the display industry due to their advantages such as thinness and bright colors. However, organic light emitting diode devices are very sensitive to water and oxygen in the air, and water and oxygen that penetrate into the interior of the organic light emitting diode device can seriously affect the service life of the organic light emitting diode device. Therefore, the organic light emitting diode device needs to be packaged using a packaging structure to block water and oxygen. Currently, laser irradiation is usually used to achieve solidification packaging of the packaging structure. However, due to the melting of the packaging structure caused by laser irradiation, stress is concentrated at the position of the packaging structure after cooling, and the display panel is prone to breakage under external force. SUMMARY

[0003] The present application aims to provide a display panel and a display device, which solve the problem of stress concentration in the preparation process of the existing packaging structure, and the display panel is prone to breakage under external force.

[0004] To achieve this purpose, the present application adopts the following technical solutions:

[0005] The present application provides a display panel, which comprises a display area and a non-display area arranged around the display area, the non-display area comprising a packaging area and a buffer area, the buffer area being arranged on the side of the packaging area facing the display area, and the display panel further comprising:

[0006] a substrate;

[0007] a cover plate arranged on the substrate;

[0008] a packaging structure arranged between the substrate and the cover plate, and located in the packaging area and arranged around the display area; and

[0009] a first buffer structure arranged between the substrate and the cover plate and located in the buffer area, the first buffer structure being in contact with the packaging structure.

[0010] The display panel is provided with a first buffer structure between the cover plate and the substrate, and the first buffer structure is located between the packaging structure and the display area and is in contact with the packaging structure. When the packaging structure is subjected to high-temperature packaging, the high temperature melts the packaging structure, and the temperature is diffused to the first buffer structure, so that the first buffer structure is formed in a gradient melting manner. When the high-temperature treatment is stopped and the first buffer structure and the packaging structure are cooled and shrunk, the stress generated can be better released than the stress generated by the simple packaging structure cooling. The stress is dispersed on the packaging structure and the first buffer structure, thereby improving the strength of the display panel and reducing the influence of external force. Moreover, the setting of the first buffer structure can reduce the influence of the sintering temperature on the structure and circuit of the display area.

[0011] As a preferred solution of the above display panel, the first buffer structure extends from the packaging structure towards the display area and is in contact with the display area.

[0012] The first buffer structure extends from the packaging structure towards the display area and is in contact with the display area, so as to increase the volume of the first buffer structure and enhance the buffering effect of the first buffer structure and the protection of the structure and circuit in the display area.

[0013] As a preferred solution of the above display panel, the first buffer structure is a continuous annular structure arranged around the display area; or the first buffer structure is a discontinuous annular structure arranged around the display area.

[0014] The first buffer structure is a continuous annular structure, which can play a buffering role on the whole circumference of the display area. The first buffer structure is a discontinuous annular structure arranged around the display area, which can play a buffering role on the whole circumference of the display area. Moreover, the different structure sections of the discontinuous first buffer structure are independent and can independently play a buffering role.

[0015] As a preferred solution of the above display panel, the melting point of the first buffer structure is lower than the melting point of the packaging structure.

[0016] The above setting makes the first buffer structure and the packaging structure realize gradient melting. When the high-temperature treatment is stopped, the materials are cooled and shrunk to play a role in dispersing stress, thereby improving the strength of the display panel and reducing the influence of external force.

[0017] As a preferred solution of the above display panel, a plurality of groups of the first buffer structure are arranged between the packaging structure and the display area, and the first buffer structure in each group of the first buffer structure is in contact with the packaging structure.

[0018] Preferably, the plurality of groups of the first buffer structures are in contact with each other in sequence.

[0019] The plurality of groups of the first buffer structures can achieve better stress release, and the plurality of groups of the first buffer structures in contact with each other can further reduce the influence of sintering temperature on the structure and route of the display area, and achieve better heat resistance.

[0020] As a preferred solution of the display panel, the non-display area further comprises a cutting area, the cutting area is arranged around the packaging area and is located on the side of the buffer area away from the display area.

[0021] The cutting area can ensure cutting accuracy and avoid thermal influence.

[0022] As a preferred solution of the display panel, the display panel further comprises a second buffer structure, the second buffer structure is arranged in the cutting area and is located on the side of the packaging structure away from the display area.

[0023] The second buffer structure can buffer physical contact and collision at the edge position of the display panel, prevent cracks from extending to the packaging structure, and thus avoid the problem of packaging failure caused by damage to the packaging structure.

[0024] As a preferred solution of the display panel, the display panel further comprises a third buffer structure, the third buffer structure is arranged in the cutting area and is located on the side of the second buffer structure away from the display area.

[0025] The third buffer structure can absorb the impact force in advance, weaken the impact force to a certain extent, effectively reduce the impact force intensity reaching the second buffer structure, and thus reduce the risk of damage to the display panel.

[0026] As a preferred solution of the display panel, the third buffer structure comprises at least one buffer column.

[0027] The third buffer structure buffers through the structure of the buffer column, and the structure is simple and convenient to prepare.

[0028] The application further provides a display device comprising the display panel.

[0029] The display device improves the strength of the display device and reduces the influence of external force through the display panel.

[0030] The application has the following advantages:

[0031] The display panel provided by the present application is provided with a first buffer structure between the cover plate and the substrate, and the first buffer structure is located between the packaging structure and the display area and is in contact with the packaging structure. When the packaging structure is packaged at high temperature, the high temperature melts the packaging structure, and the temperature is diffused to the first buffer structure, so that the first buffer structure is formed in a gradient melting manner. When the first buffer structure and the packaging structure are cooled and shrunk after stopping the high-temperature treatment, the stress generated can be better released than the stress generated by the simple packaging structure cooling, and the stress is dispersed on the packaging structure and the first buffer structure, so that the strength of the display panel is improved, and the influence of external force is reduced. Moreover, the setting of the first buffer structure can reduce the influence of the sintering temperature on the structure and circuit of the display area.

[0032] The display device provided by the present application improves the strength of the display device and reduces the influence of external force through the above-mentioned display panel. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a plan view of the display panel provided by the first embodiment of the present application;

[0034] Figure 2 is Figure 1 a sectional view along the A-A line in Figure 1 ;

[0035] Figure 3 is Figure 1 a sectional view along the A-A line in Figure 2 ;

[0036] Figure 4 is a plan view of the display panel provided by the second embodiment of the present application;

[0037] Figure 5 is Figure 4 a sectional view along the B-B line in

[0038] in the figure:

[0039] 101, display area; 102, non-display area; 103, packaging area; 104, buffer area; 105, cutting area;

[0040] 1, substrate; 2, cover plate; 3, packaging structure; 4, first buffer structure; 5, second buffer structure; 6, third buffer structure; 61, buffer column. DETAILED DESCRIPTION

[0041] The present application will be further described in detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, but not all the structures.

[0042] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0043] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0044] In the description of the present embodiment, the terms "up", "down", "right", and other orientation or position relationships are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.

[0045] Embodiment one:

[0046] Since the organic light emitting diode device is very sensitive to water, oxygen and other gases in the air, water, oxygen and other gases that penetrate into the inside of the organic light emitting diode device will seriously affect the service life of the organic light emitting diode device. Therefore, the organic light emitting diode device needs to be packaged with a packaging structure to block water, oxygen and other gases. At present, laser irradiation is usually used to realize the solidification packaging of the packaging structure, but due to the melting of the packaging structure by laser irradiation, stress concentration occurs at the position of the packaging structure after cooling, and the display panel is prone to breakage under external force.

[0047] In order to solve the above problems, the present embodiment provides a display panel, which is viewed from the planar structure as Figure 1As shown, the display panel includes a display area 101 and a non-display area 102 arranged around the display area 101, the non-display area 102 includes an encapsulation area 103 and a buffer area 104, the buffer area 104 is arranged on a side of the encapsulation area 103 facing the display area 101; as viewed from the cross-sectional structure, as shown Figure 2 As shown, the display panel further includes a substrate 1, a cover plate 2, an encapsulation structure 3 and a first buffer structure 4, wherein the cover plate 2 is arranged on the substrate 1, the encapsulation structure 3 is arranged between the substrate 1 and the cover plate 2, and the encapsulation structure 3 is located in the encapsulation area 103 and arranged around the display area 101, the first buffer structure 4 is arranged between the substrate 1 and the cover plate 2, and the first buffer structure 4 is located in the buffer area 104 and located between the encapsulation structure 3 and the display area 101, and the first buffer structure 4 is in contact with the encapsulation structure 3.

[0048] The display panel sets the encapsulation structure 3 between the cover plate 2 and the substrate 1, which is used to reduce the path of external impurities such as water vapor and oxygen into the inside of the display panel, thereby reducing the influence of external impurities such as water vapor and oxidation on the display panel, achieving effective encapsulation, and improving the reliability of encapsulation.

[0049] The display panel further sets the first buffer structure 4 between the cover plate 2 and the substrate 1, and the first buffer structure 4 is located between the encapsulation structure 3 and the display area 101 and is in contact with the encapsulation structure 3. When the encapsulation structure 3 is high-temperature encapsulated, the high-temperature melts the encapsulation structure 3, and at the same time, the temperature will diffuse to the first buffer structure 4, so that the first buffer structure 4 forms a gradient melting. When the high-temperature treatment is stopped, the stress generated by the cooling and shrinkage of the first buffer structure 4 and the encapsulation structure 3 can be better released than the stress generated by the cooling of the simple encapsulation structure 3. The stress will be dispersed on the encapsulation structure 3 and the first buffer structure 4, thereby improving the strength of the display panel and reducing the influence of external force. Moreover, the setting of the first buffer structure 4 can reduce the influence of the sintering temperature on the structure and circuit of the display area 101.

[0050] Preferably, the first buffer structure 4 extends from the encapsulation structure 3 towards the display area 101 and is in contact with the display area 101, that is, the first buffer structure 4 is in contact with the side of the display area 101 facing the non-display area 102, that is, extends to the junction of the display area 101 and the non-display area 102, so as to increase the volume of the first buffer structure 4, thereby enhancing the buffering effect of the first buffer structure 4 and the protective effect on the structure and circuit in the display area 101.

[0051] Optionally, the first buffer structure 4 is a continuous annular structure arranged around the display area 101, which can play a buffering role on the entire circumference of the display area 101.

[0052] In other embodiments, the first buffer structure 4 is a discontinuous annular structure arranged around the display area 101, which can buffer the entire circumference of the display area 101, and the different structure segments of the discontinuous first buffer structure 4 are independent and can independently buffer.

[0053] Optionally, the first buffer structure 4 is made of glass powder or resin material, and the melting point of the first buffer structure 4 made of the above-mentioned material is lower than the melting point of the packaging structure 3, so that the first buffer structure 4 and the packaging structure 3 are melted in stages. When the high-temperature treatment is stopped, the material cools and shrinks to disperse stress, thereby improving the strength of the display panel and reducing the influence of external force.

[0054] Preferably, as shown in Figure 3 A plurality of groups of first buffer structures 4 are arranged between the packaging structure 3 and the display area 101, and the first buffer structure 4 of each group of first buffer structures 4 is in contact with the packaging structure 3. Preferably, the plurality of groups of first buffer structures 4 are in contact with each other, which can achieve better stress release. Moreover, the plurality of groups of first buffer structures 4 can further reduce the influence of sintering temperature on the structure and circuit of the display area 101, and achieve better heat resistance effect.

[0055] Embodiment Two:

[0056] The display panel of the present embodiment is different from that of Embodiment One in that, as shown in Figure 4 The non-display area 102 of the display panel of the present embodiment further comprises a cutting area 105, which is arranged around the packaging area 103 and located on the side of the buffer area 104 away from the display area 101.

[0057] It should be noted that the cutting area 105 is a structure reserved after the display panel is cut.

[0058] When the display panel is cut, the frame position is easily subjected to physical contact and impact, and cracks are easily extended to the packaging area 103, which can cause the packaging structure 3 to be easily damaged and result in packaging failure.

[0059] In order to avoid the above-mentioned problems, as shown in Figure 5 The display panel further comprises a second buffer structure 5, which is arranged on the side of the packaging structure 3 away from the display area 101. The second buffer structure 5 can buffer the physical contact and impact at the edge position of the display panel, prevent cracks from extending to the packaging structure 3, and thereby avoid the packaging structure 3 from being damaged and causing packaging failure.

[0060] Further, the display panel further comprises a third buffer structure 6, the third buffer structure 6 is arranged in the cutting area 105 and located on the side of the second buffer structure 5 away from the display area 101, the arrangement of the third buffer structure 6 can absorb the impact force in advance, so that the impact force intensity is weakened to a certain extent, so that the impact force intensity reaching the second buffer structure 5 is effectively reduced, thereby reducing the risk of damage to the display panel.

[0061] Preferably, there is a gap between the third buffer structure 6 and the second buffer structure 5, which can effectively buffer the impact force.

[0062] Further, the third buffer structure 6 comprises at least one buffer column 61, and the buffer column 61 is arranged around the circumference of the second buffer structure 5, and in the embodiment, two buffer columns 61 are arranged, and there is a gap between the two adjacent buffer columns 61, so as to further improve the impact force absorption effect.

[0063] Preferably, the cross-sectional size of the buffer column 61 gradually increases in the thickness direction of the display panel from top to bottom, so as to achieve better support and buffering effect.

[0064] Embodiment three:

[0065] The embodiment provides a display device comprising the display panel in the above-mentioned embodiment one or embodiment two. The display device improves the strength of the display device by the above-mentioned display panel, and reduces the influence of external force.

[0066] The display device can be any product or component with display function, such as mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator and the like.

[0067] Obviously, the above-mentioned embodiments of the present application are only examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the present application. Here, it is unnecessary and impossible to enumerate all the implementation modes. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A display panel, characterized in that, The display panel includes a display area (101) and a non-display area (102) surrounding the display area (101). The non-display area (102) includes an encapsulation area (103) and a buffer (104). The buffer (104) is disposed on the side of the encapsulation area (103) facing the display area (101). The display panel also includes: substrate(1); Cover plate (2), the cover plate (2) is disposed on the substrate (1); A packaging structure (3) is disposed between the substrate (1) and the cover plate (2), and the packaging structure (3) is located within the packaging area (103) and surrounds the display area (101); and The first buffer structure (4) is disposed between the substrate (1) and the cover plate (2), and the first buffer structure (4) is located in the buffer zone (104). The first buffer structure (4) is in contact with the encapsulation structure (3), and the melting point of the first buffer structure (4) is lower than the melting point of the encapsulation structure (3).

2. The display panel according to claim 1, characterized in that, The first buffer structure (4) extends from the encapsulation structure (3) toward the display area (101) and is in contact with the display area (101).

3. The display panel according to claim 1, characterized in that, The first buffer structure (4) is a continuous ring structure surrounding the display area (101); or the first buffer structure (4) is a discontinuous ring structure surrounding the display area (101).

4. The display panel according to claim 1, characterized in that, Multiple sets of the first buffer structure (4) are provided between the cover plate (2) and the substrate (1). The multiple sets of the first buffer structure (4) are arranged sequentially between the encapsulation structure (3) and the display area (101), and the first buffer structure (4) facing the encapsulation structure (3) of the multiple sets of the first buffer structure (4) is in contact with the encapsulation structure (3).

5. The display panel according to claim 4, characterized in that, Multiple sets of the first buffer structure (4) come into contact with each other in sequence.

6. The display panel according to any one of claims 1-5, characterized in that, The non-display area (102) also includes a cutting area (105) which is arranged around the encapsulation area (103) and located on the side of the buffer zone (104) opposite to the display area (101).

7. The display panel according to claim 6, characterized in that, The display panel further includes a second buffer structure (5), which is disposed in the cutting area (105) and located on the side of the encapsulation structure (3) opposite to the display area (101).

8. The display panel according to claim 7, characterized in that, The display panel further includes a third buffer structure (6), which is disposed in the cutting area (105) and located on the side of the second buffer structure (5) away from the display area (101).

9. The display panel according to claim 8, characterized in that, The third buffer structure (6) includes at least one buffer column (61).

10. A display device comprising the display panel according to any one of claims 1-9.

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