A method for improving burr and carbon black in laser cutting of special materials

Abstract

The present application relates to a kind of methods for improving special material laser cutting burr and carbon black, comprising: S1.in the original cutting path of laser cutting design chart, two cutting paths are added to the direction of scrap area with the parallel interval of original cutting path;S2.by outside to inside, special material is sequentially laser cut according to the cutting path on laser cutting design chart, and the laser cutting of each cutting path includes: first, the line surface of special material is laser cut;Then, the copper surface of special material is laser cut, to cut through special material.This way, both solve the problem of existing single-sided laser cutting too much heat concentration, resulting in some path is not activated and produces burr, also can solve the carbon black problem of existing laser cutting method, effectively improve the quality of laser cutting, reduce cutting scrap rate, improve product quality, also can save existing post-deburring and carbon black removal process, simplify process and save cost.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of laser cutting of materials, and particularly relates to a method for improving burrs and carbon black in laser cutting of special materials. BACKGROUND

[0002] At present, special materials (such as high-frequency circuit board materials) need to be processed by laser due to strict size requirements and special product shapes. However, the applicant found that: the existing conventional laser cutting processing method is to set a cutting path according to the required size on the laser cutting design drawing and use single-sided laser cutting. Due to the difficulty of penetrating the special material, the existing single-sided laser cutting method causes the laser heat to be too concentrated, resulting in burrs in some paths that are not penetrated, and a large amount of carbon black is generated in the single-sided laser cutting process, which leads to a high rejection rate of the cutting finished product. Therefore, it is usually necessary to increase the deburring and carbon black removal processes, which prolongs the production cycle, seriously affects the product quality and product delivery period, and increases the production cost. SUMMARY

[0003] To solve the above problems in the prior art, the present application provides a method for improving burrs and carbon black in laser cutting of special materials.

[0004] To solve the above technical problems, the present application adopts the following technical solutions:

[0005] In a first aspect, the present application provides a method for improving burrs and carbon black in laser cutting of special materials, comprising:

[0006] S1. Adding two cutting paths parallel to the original cutting path to the waste area direction on the original cutting path of the laser cutting design drawing;

[0007] S2. Laser cutting the special material according to the cutting paths on the laser cutting design drawing from outside to inside, and the laser cutting of each cutting path comprises:

[0008] First, laser cutting the circuit surface of the special material;

[0009] Then, laser cutting the copper-clad surface of the special material to cut through the special material.

[0010] Further, in S2, the depth of laser cutting of the circuit surface of the special material is 3 / 4 of the thickness of the special material.

[0011] Further, in S2, the laser cutting energy of the two added cutting paths is greater than that of the original cutting path, and the laser cutting energy of the two added cutting paths is different.

[0012] Further, in S2, when laser cutting is performed according to the two added cutting paths, the ratio of the line surface laser cutting energy to the copper clad surface laser cutting energy is 10:3.

[0013] Further, in S1, the distance between the original cutting path and the two added cutting paths is 0.01 mm.

[0014] Advantages of the present application

[0015] The method of the present application solves the problem of excessive heat concentration in the existing single-sided laser cutting, which leads to some paths not being cut through and generates burrs, and solves the problem of carbon black in the existing laser cutting method, effectively improves the quality of laser cutting, reduces the cutting rejection rate, improves product quality, and can eliminate the existing post-deburring and carbon black removal process, simplifies the process and saves costs. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a flowchart of the method for improving laser cutting burrs and carbon black of special materials according to the present application;

[0017] Figure 2 is a diagram of the original cutting path of the laser cutting design in the embodiment of the method for improving laser cutting burrs and carbon black of special materials according to the present application;

[0018] Figure 3 is a diagram after adding the cutting path; Figure 2

[0019] Figure 4 is a partial enlarged view of Figure 3 . DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.

[0021] Referring to Figure 1 , Figure 1 is a method for improving laser cutting burrs and carbon black of special materials according to the present application, wherein the special material is a high-frequency circuit board material, such as RT5880 high-frequency board (RT5880 high-frequency board is made of PTFE and glass fiber line, which is particularly difficult to cut through). Figure 1 The method for improving laser cutting burrs and carbon black of special materials specifically includes the following steps:

[0022] ​Step S1. Add two cutting paths parallel to the original cutting path of the laser cutting design map to the scrap area, as shown in the following figure Figures 2-4 The blue line is the original cutting path, and the red line is the added two cutting paths. Of course, more than two cutting paths can be added, but the laser cutting efficiency and cost are mainly considered. In the case of not affecting other graphics, the scheme of adding two cutting paths is optimal, otherwise, if too many cutting paths are added, the file will be larger, the laser production time will be longer, and the cost will be higher.

[0023] Step S2. Laser cut the special material according to the cutting path on the laser cutting design map from outside to inside, for example: Figures 2-4 First, laser cut the special material according to the outermost red cutting path, then laser cut the special material according to the other red cutting path close to the blue cutting path, and finally laser cut the special material according to the blue cutting path. When laser cutting according to each cutting path, the specific cutting process includes:

[0024] First, laser cut the line surface of the special material;

[0025] Then laser cut the copper-clad surface of the special material to cut through the special material.

[0026] The present application adds two cutting paths on the basis of the original cutting path and adopts a double-sided laser cutting method. On the one hand, it can cut through the special material without burrs, effectively solving the problem of burrs caused by excessive heat concentration in the existing single-sided laser cutting method. On the other hand, by increasing two cutting paths and using large energy to punch through the special material, and then using small energy to lightly activate the original cutting path again, the carbon black problem of the existing laser cutting method is solved. In this way, the quality of laser cutting can be effectively improved, the cutting rejection rate can be reduced, the product quality can be improved, and the existing post-processing deburring and carbon black removal processes can be omitted, simplifying the process and saving costs.

[0027] In one possible implementation, the depth of laser cutting of the line surface of the special material in step S2 of the present application is 3 / 4 of the thickness of the special material, which ensures that the copper-clad surface of the special material can be cut through by using lower laser cutting energy, and further reduces the formation of carbon black.

[0028] In step S2 of the present application, the laser cutting energy of the two added cutting paths is greater than that of the original cutting path, and the laser cutting energy of the two added cutting paths is different, and the specific laser cutting energy will be different according to different high-frequency circuit materials; for example: RT5880 material, original path: power 85%, frequency 350KHZ, speed 200mm / s, added path: power 85%, frequency 350KHZ, speed 600mm / s. In this way, it not only ensures that the special material can be penetrated and punched, and reduces the generation of carbon black, but also ensures that the carbon black can be further effectively removed.

[0029] In step S2 of the present application, when laser cutting is performed according to the two added cutting paths, the ratio of the line surface laser cutting energy to the copper clad surface laser cutting energy is 10:3, that is, the line surface of the special material is first laser cut with normal energy, and then the copper clad surface of the special material is laser cut with normal energy 30% (the normal energy will be different according to different high-frequency circuit materials, for example: RT5880 material: power 85%, frequency 350KHZ, 200mm / s, Ro3003 material, power 35%, frequency 400KHZ, speed 600mm / s), which avoids the problems that the carbon black treatment is not good when the energy is too large, and the cutting effect cannot be achieved when the energy is small.

[0030] In step S1 of the present application, in order to further reduce carbon black, the distance between the adjacent paths in the original cutting path and the two added cutting paths is 0.01mm.

[0031] The above is the preferred embodiment of the present application, it should be noted that for ordinary skilled in the art, without departing from the principles of the present application, can make a number of improvements and refinements, these improvements and refinements are also considered to be within the scope of the present application.

Claims

1. A method of improving burr and carbon black in laser cutting of special materials, characterized by, The method comprises: S1. Adding two cutting paths parallel to the original cutting path and spaced from the original cutting path in the direction of the waste area on the original cutting path of the laser cutting design drawing; S2. Laser cutting the high-frequency plate according to the cutting paths on the laser cutting design drawing from outside to inside in sequence, and the laser cutting of each cutting path comprises: first, laser cutting the circuit surface of the special material; then, laser cutting the copper-clad surface of the special material to cut through the special material; When laser cutting according to the added two cutting paths, the ratio of the laser cutting energy of the circuit surface to the laser cutting energy of the copper-clad surface is 10:3; the laser cutting energy of the added two cutting paths is greater than the laser cutting energy of the original cutting path.

2. The method of claim 1, wherein, In S2, the depth of laser cutting of the circuit surface of the special material is 3 / 4 of the thickness of the special material.

3. The method of claim 1, wherein, In S1, the distance between adjacent paths in the original cutting path and the added two cutting paths is 0.01 mm.

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