Polishing system

Abstract

The application discloses a polishing system, comprising: a polishing device, the polishing device comprising a polishing mechanism and a conveying mechanism; a transfer mechanism, the transfer mechanism being detachably arranged on the polishing device, the transfer mechanism being used for transferring a containing groove, the conveying mechanism being used for conveying the containing groove on the transfer mechanism to an unloading part of the polishing device, and the conveying mechanism being used for conveying the containing groove placed on the unloading part to a cleaning device. The silicon wafer polished by the abnormal cleaning machine of the polishing device is transferred to the position of the polishing device through the transfer mechanism, the containing groove of the transfer mechanism is conveyed to the unloading part of the polishing device through the conveying mechanism, the containing groove placed on the unloading part is conveyed to the cleaning device through the conveying mechanism, the silicon wafer polished by the abnormal cleaning machine of the polishing device is transferred to the normal cleaning device for cleaning, the silicon wafer is cleaned as soon as possible, the abnormal cleaning machine of the polishing device can be normally produced, the processing quality and efficiency of the silicon wafer are ensured, and the production capacity reduction caused by the abnormal cleaning machine is avoided.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon wafer and particularly relates to a polishing system. BACKGROUND

[0002] At present, in the processing of the final polishing process, according to the cleaning mode after the final polishing, the final polishing machine can be divided into two categories. One is a dry final polishing machine. The silicon wafer after processing is placed in a single wafer cleaning machine by a mechanical hand, chemical cleaning and spin-drying are performed in the single wafer cleaning machine, and the finally cleaned silicon wafer is placed in a silicon wafer storage box. The other is a wet final polishing machine. The silicon wafer after processing is placed in a water tank by a mechanical hand, and the water tank with the silicon wafer is transported to a tank cleaning machine for cleaning. Since there is residual grinding liquid on the surface of the ground silicon wafer, particles will be generated on the surface of the silicon wafer if the silicon wafer is placed in the water tank for too long, and the silicon wafer needs to be cleaned as soon as possible. If the tank cleaning machine is abnormal and the silicon wafer cannot be cleaned in time, the wet final polishing machine cannot be normally produced, and the processing quality and efficiency of the silicon wafer are affected. SUMMARY

[0003] The purpose of the embodiment of the application is to provide a polishing system to solve the problem that the silicon wafer after polishing by the polishing machine cannot be cleaned due to the abnormality of the cleaning machine.

[0004] The embodiment of the application provides a polishing system, which comprises:

[0005] A polishing device, wherein the polishing device comprises a polishing mechanism and a conveying mechanism;

[0006] A transfer mechanism, wherein the transfer mechanism is detachably arranged on the polishing device, the transfer mechanism is used for transferring a containing tank, the conveying mechanism is used for conveying the containing tank on the transfer mechanism to an unloading part of the polishing device, and the conveying mechanism is used for conveying the silicon wafer placed in the containing tank on the unloading part to a cleaning device.

[0007] Optionally, the polishing device further comprises a turnover mechanism, the conveying mechanism is used for conveying the containing tank on the transfer mechanism to the turnover mechanism, the turnover mechanism is used for overturning the containing tank placed on the turnover mechanism, and the conveying mechanism is used for conveying the overturned containing tank to the unloading part of the polishing device.

[0008] Optionally, the turnover mechanism comprises:

[0009] A turnover table, wherein the turnover table is used for placing the containing tank;

[0010] A driving mechanism, wherein the driving mechanism is used for driving the containing tank on the turnover table to overturn.

[0011] Optionally, the conveying mechanism comprises:

[0012] a first conveying mechanism for conveying the containing groove on the transfer mechanism to the turnover mechanism and for conveying the turned-over containing groove to an unloading part of the polishing device;

[0013] a second conveying mechanism for conveying the silicon wafer placed in the containing groove of the unloading part to a cleaning device.

[0014] Optionally, the polishing system further comprises:

[0015] a cleaning device for cleaning the silicon wafer in the containing groove.

[0016] Optionally, the polishing device is provided with a first connecting part, the transfer mechanism is provided with a second connecting part, and the first connecting part is detachably connected with the second connecting part.

[0017] Optionally, the first connecting part comprises a connecting pipe, and the second connecting part comprises a connecting shaft which is detachably inserted into the connecting pipe; or

[0018] the first connecting part comprises a connecting shaft, and the second connecting part comprises a connecting pipe, and the connecting shaft is detachably inserted into the connecting pipe.

[0019] Optionally, the connecting pipe is provided with a plurality of positioning holes which are spaced apart along the length direction of the connecting pipe, the positioning holes are in communication with the pipe cavity of the connecting pipe, and a movable positioning pin is arranged in the positioning hole, and the positioning pin can abut against or move away from the connecting shaft when the connecting shaft is inserted into the connecting pipe.

[0020] Optionally, the transfer mechanism is arranged adjacent to the unloading part of the polishing device.

[0021] Optionally, the transfer mechanism comprises:

[0022] a vehicle body which is provided with a bearing structure for placing the containing groove;

[0023] a walking wheel which is arranged at the bottom of the vehicle body.

[0024] In the polishing system of the embodiment of the present application, the polishing device comprises a polishing mechanism and a conveying mechanism, the transfer mechanism is detachably arranged on the polishing device, the transfer mechanism is used for transferring the containing groove, the conveying mechanism is used for conveying the containing groove on the transfer mechanism to the unloading part of the polishing device, and the conveying mechanism is used for conveying the silicon wafer placed in the containing groove in the unloading part to the cleaning device. In use, when the corresponding cleaning machine of other polishing devices cannot clean the polished silicon wafer due to abnormality, the silicon wafer polished by the polishing device with abnormal cleaning machine can be transferred to the position of the polishing device in the present application through the transfer mechanism, the transfer mechanism is arranged in connection with the polishing device in the present application, the containing groove on the transfer mechanism can be conveyed to the unloading part of the polishing device through the conveying mechanism, and the silicon wafer placed in the containing groove in the unloading part can be conveyed to the cleaning device through the conveying mechanism, so that the silicon wafer polished by the polishing device with abnormal cleaning machine can be transferred to the normal cleaning device for cleaning, the silicon wafer can be cleaned as soon as possible, the silicon wafer surface is prevented from generating particles due to long-time placement, the polishing device with abnormal cleaning machine can be normally produced, the processing quality and efficiency of the silicon wafer are ensured, and the production capacity reduction caused by abnormal cleaning machine is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a structural schematic view of the polishing system of the embodiment of the present application.

[0026] Figure 2 It is another structural schematic view of the polishing system of the embodiment of the present application.

[0027] Figure 3 It is a structural schematic view of the transfer mechanism.

[0028] Figure 4 It is a schematic view of the conveying mechanism conveying the containing groove from the transfer mechanism.

[0029] Figure 5 It is a schematic view of the turnover mechanism overturning the containing groove.

[0030] Figure 6 It is a schematic view of the conveying mechanism conveying the containing groove from the turnover mechanism.

[0031] Figure 7 It is a schematic view of the connection pipe and the connection shaft.

[0032] REFERENCE NUMERALS

[0033] The polishing device 10.

[0034] The conveying mechanism 20; the first conveying mechanism 201; the second conveying mechanism 202.

[0035] First connecting part 21; second connecting part 22;

[0036] Positioning hole 23; positioning pin 24;

[0037] Vehicle body 25; bearing structure 26; walking wheel 27.

[0038] Transfer mechanism 30;

[0039] Accommodation groove 40;

[0040] Turnover mechanism 50; turnover table 51; driving mechanism 52. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0042] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0043] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application. Figures 1 to 7 As shown in the specific embodiments and their application scenarios, the polishing system provided by the embodiments of the present application is described in detail.

[0044] As shown in the specific embodiments and their application scenarios, the polishing system provided by the embodiments of the present application is described in detail. Figures 1 to 7 The polishing system of the embodiments of the present application, as shown, comprises a polishing device 10 and a transfer mechanism 30. The polishing device 10 comprises a polishing mechanism and a carrying mechanism 20. The transfer mechanism 30 is detachably arranged on the polishing device 10. The transfer mechanism 30 is used to transfer an accommodation groove 40. The carrying mechanism 20 is used to carry the accommodation groove 40 on the transfer mechanism 30 to an unloading part of the polishing device 10. The carrying mechanism 20 is used to carry a silicon wafer placed in the accommodation groove 40 in the unloading part to a cleaning device.

[0045] The polishing apparatus 10 can include a polishing mechanism by which a wafer can be polished, and a conveying mechanism 20 can convey the wafer. The polishing apparatus 10 can be a dry final polishing machine, and a cleaning apparatus can be disposed adjacent to the polishing apparatus 10. The wafer polished by the dry final polishing machine can be cleaned by the cleaning apparatus. The transfer mechanism 30 can be detachably disposed on the polishing apparatus 10. When it is necessary to transfer the wafer on other polishing apparatuses, the transfer mechanism 30 can be detached from the polishing apparatus 10, so that the transfer mechanism 30 is separated from the polishing apparatus 10, and the transfer mechanism 30 is moved to other polishing apparatuses to transfer the containing groove 40 in which the wafer is placed. When the containing groove 40 in which the wafer is placed is transferred to the polishing apparatus 10, the transfer mechanism 30 can be connected and disposed on the polishing apparatus 10, so that the transfer mechanism 30 is stable, so that the conveying mechanism 20 in the polishing apparatus 10 can convey the containing groove 40 on the transfer mechanism 30. The containing groove 40 on the transfer mechanism 30 can be conveyed to the unloading part of the polishing apparatus 10 by the conveying mechanism 20. The wafer placed in the containing groove 40 in the unloading part can be conveyed to the cleaning apparatus by the conveying mechanism 20. The wafer in the containing groove 40 transferred from other polishing apparatuses can be cleaned by the cleaning apparatus. After cleaning, the empty containing groove 40 can be conveyed away from the unloading part by the conveying mechanism 20.

[0046] For example, the polishing apparatus 10 can be a dry final polishing machine, and the cleaning apparatus can be disposed adjacent to the polishing apparatus 10. When the cleaning machine corresponding to the wet final polishing machine cannot clean the wafer due to an abnormality, the wafer on the wet final polishing machine can be transferred by the transfer mechanism 30. The transfer mechanism 30 can be moved to the wet final polishing machine to transfer the containing groove 40 in which the wafer is placed. The containing groove 40 in which the wafer is placed can be transferred to the polishing apparatus 10. The containing groove 40 on the transfer mechanism 30 can be conveyed to the unloading part of the polishing apparatus 10 by the conveying mechanism 20. The wafer placed in the containing groove 40 in the unloading part can be conveyed to the cleaning apparatus by the conveying mechanism 20. The wafer in the containing groove 40 transferred from the wet final polishing machine can be cleaned by the cleaning apparatus. The wafer polished by the wet final polishing machine can be cleaned in time, so that the production capacity of the wet final polishing machine is not affected.

[0047] In the polishing system of the embodiment of the present application, the polishing device comprises a polishing mechanism and a conveying mechanism, the transfer mechanism is detachably arranged on the polishing device, the transfer mechanism is used for transferring the containing groove, the conveying mechanism is used for conveying the containing groove on the transfer mechanism to the unloading part of the polishing device, and the conveying mechanism is used for conveying the silicon wafer placed in the containing groove of the unloading part to the cleaning device. In use, when the corresponding cleaning machine of other polishing devices cannot clean the polished silicon wafer due to abnormality, the silicon wafer polished by the polishing device with abnormal cleaning machine can be transferred to the position of the polishing device in the present application through the transfer mechanism, the transfer mechanism is arranged in connection with the polishing device in the present application, the containing groove on the transfer mechanism can be conveyed to the unloading part of the polishing device through the conveying mechanism, and the silicon wafer placed in the containing groove of the unloading part can be conveyed to the cleaning device through the conveying mechanism, so that the silicon wafer polished by the polishing device with abnormal cleaning machine can be transferred to the normal cleaning device for cleaning, the silicon wafer can be cleaned as soon as possible, the silicon wafer is prevented from being placed for too long to generate particles on the surface of the silicon wafer, the polishing device with abnormal cleaning machine can be normally produced, the processing quality and efficiency of the silicon wafer are ensured, and the production capacity is prevented from being reduced due to the abnormal cleaning machine.

[0048] In some embodiments, as shown in Figure 2 、 Figures 4 to 6 , the polishing device 10 further comprises a turnover mechanism 50, the conveying mechanism 20 is used for conveying the containing groove 40 on the transfer mechanism 30 to the turnover mechanism 50, the turnover mechanism 50 is used for overturning the containing groove 40 placed on the turnover mechanism 50, so that the position or posture of the containing groove 40 is overturned to a suitable position, so as to place the containing groove 40 in the cleaning device for cleaning, the conveying mechanism 20 is used for conveying the overturned containing groove 40 to the unloading part of the polishing device 10, the conveying mechanism 20 can convey the silicon wafer placed in the containing groove 40 of the unloading part to the cleaning device, the silicon wafer in the containing groove 40 transferred is cleaned by the cleaning device, the silicon wafer can be cleaned as soon as possible, the polishing device with abnormal cleaning machine can be normally produced, and the production capacity is prevented from being reduced due to the abnormal cleaning machine.

[0049] In some other embodiments, as shown in Figure 2 、 Figures 4 to 6As shown, the turnover mechanism 50 comprises a turnover table 51 for placing the containing groove 40 and a driving mechanism 52 for driving the containing groove 40 on the turnover table 51 to turn over. The turnover table 51 can be a plate body, and an opening can be arranged on the plate body. The driving mechanism 52 can comprise a driving rod which can pass through the opening to drive the containing groove 40 on the turnover table 51 to turn over. For example, the opening direction of the containing groove 40 before turning over can be horizontal, and the opening direction of the containing groove 40 after turning over can be vertically upward. The specific turning position and angle of the containing groove 40 can be reasonably selected according to actual needs. The driving mechanism 52 can comprise a driving motor, a hydraulic cylinder, a pneumatic cylinder, a telescopic rod, etc. The specific structure of the driving mechanism can be selected according to actual needs. The surface of the turnover table 51 can be provided with an elastic layer which has a buffering effect and can prevent the silicon wafer in the containing groove 40 from being damaged when the containing groove 40 is placed and turned over.

[0050] In the embodiment of the present application, as shown in Figure 1 、 Figure 2 、 Figure 4 and Figure 6 , the conveying mechanism 20 comprises a first conveying mechanism 201 and a second conveying mechanism 202. The first conveying mechanism 201 is used for conveying the containing groove 40 on the transfer mechanism 30 to the turnover mechanism 50 and conveying the turned-over containing groove 40 to the unloading part of the polishing equipment 10. The first conveying mechanism 201 can be arranged on the truss of the polishing equipment 10. The first conveying mechanism 201 can comprise a first mechanical arm and a first guide rail. The first mechanical arm is arranged on the first guide rail and can move on the first guide rail. The first mechanical arm can move in the vertical direction and the horizontal direction and can clamp and convey the containing groove 40. The second conveying mechanism 202 is used for conveying the silicon wafer in the containing groove 40 placed on the unloading part to the cleaning equipment. The first conveying mechanism 201 and the second conveying mechanism 202 can be arranged adjacent to each other. The second conveying mechanism 201 can be arranged on the truss of the polishing equipment 10. The second conveying mechanism 201 can comprise a second mechanical arm and a second guide rail. The second mechanical arm is arranged on the second guide rail and can move on the second guide rail. The second mechanical arm can move in the vertical direction and the horizontal direction and can convey the silicon wafer in the containing groove 40 placed on the unloading part to the cleaning equipment to clean the silicon wafer in the containing groove 40 transferred. The polishing system can further comprise a position detector for detecting the position of the transfer mechanism 30. When the position detector detects that the position of the transfer mechanism 30 is at a preset position, the control module can control the conveying mechanism 20 to convey the containing groove on the transfer mechanism 30 to the unloading part of the polishing equipment 10, or the control module can control the conveying mechanism 20 to convey the containing groove on the transfer mechanism 30 to the turnover mechanism 50.

[0051] In an embodiment of the present invention, the polishing system further includes a cleaning device for cleaning the silicon wafers in the receiving tank 40. The polishing device 10 can be a dry final polishing machine, and the cleaning device can be located adjacent to the polishing device 10. The cleaning device can be a single-wafer cleaning machine, which can clean the silicon wafers polished by the polishing device 10, and can also clean the silicon wafers in the receiving tank 40 transferred from other polishing devices by the transfer mechanism 30. The other polishing devices can be wet final polishing machines, so that the silicon wafers polished by the wet final polishing machine can be cleaned in a timely manner, avoiding affecting the production capacity of the wet final polishing machine.

[0052] In some embodiments, such as Figure 7 As shown, the polishing equipment 10 has a first connecting portion 21, and the transfer mechanism 30 has a second connecting portion 22. The first connecting portion 21 can be disposed on the outer side wall of the polishing equipment 10, and the second connecting portion 22 can be disposed on the outer side wall of the transfer mechanism 30. The second connecting portion 22 can be disposed adjacent to the end of the transfer mechanism 30, and the first connecting portion 21 and the second connecting portion 22 can connect the transfer mechanism 30 to the polishing equipment 10 to stabilize the transfer mechanism 30, so that the conveying mechanism 20 in the polishing equipment 10 can transport the receiving groove 40 on the transfer mechanism 30 to the unloading part of the polishing equipment 10. The first connecting portion 21 and the second connecting portion 22 can be disassembled to separate the transfer mechanism 30 from the polishing equipment 10, so that the transfer mechanism 30 can be moved to other polishing equipment to transfer the receiving groove 40 for placing silicon wafers.

[0053] Optionally, such as Figure 7As shown, the first connecting part 21 comprises a connecting pipe, and the second connecting part 22 comprises a connecting shaft which is detachably inserted into the connecting pipe. Alternatively, the first connecting part 21 comprises a connecting shaft, and the second connecting part 22 comprises a connecting pipe into which the connecting shaft is detachably inserted. The axis of the connecting shaft can be collinear with the axis of the connecting pipe, so as to accurately align the position of the transfer mechanism 30 when the connecting shaft is inserted into the connecting pipe. The outer side wall of the connecting shaft can be provided with length scale lines, by which the length of the connecting shaft inserted into the connecting pipe can be observed. The length of the connecting shaft inserted into the connecting pipe can be adjusted according to actual needs, so as to adjust and record the position of the transfer mechanism 30 as needed, so that the conveying mechanism 20 in the polishing equipment 10 can convey the accommodation groove 40 on the transfer mechanism 30. The length of the connecting pipe can be adjusted, so that the position of the transfer mechanism 30 can be adjusted by adjusting the length of the connecting pipe, so that the conveying mechanism 20 in the polishing equipment 10 can convey the accommodation groove 40 on the transfer mechanism 30. The length of the connecting shaft can be adjusted, so that the length of the connecting shaft inserted into the connecting pipe can be adjusted by adjusting the length of the connecting shaft, so that the position of the transfer mechanism 30 can be adjusted, so that the conveying mechanism 20 in the polishing equipment 10 can convey the accommodation groove 40 on the transfer mechanism 30. The inner side wall of the connecting pipe can be provided with a guide groove extending along the length direction of the connecting pipe, and the outer side wall of the connecting shaft can be provided with a convex rail extending along the length direction of the connecting shaft. The convex rail can be arranged in the guide groove and can move along the length direction of the guide groove, so that the connecting shaft can be stably moved.

[0054] In some embodiments, as Figure 7 As shown, the connecting pipe is provided with a plurality of positioning holes 23 which are spaced apart along the length direction of the connecting pipe. The plurality of positioning holes 23 can be uniformly spaced apart along the length direction of the connecting pipe. The positioning holes 23 are in communication with the lumen of the connecting pipe, and a movable positioning pin 24 is arranged in the positioning holes 23. When the connecting shaft is inserted into the connecting pipe, the positioning pin 24 can abut against or move away from the connecting shaft. One end of the positioning pin 24 can extend into the lumen of the connecting pipe, and the end of the positioning pin 24 can abut against or move away from the connecting shaft. The end of the positioning pin 24 can be provided with an elastic layer which can have a buffering effect to prevent damage to the connecting shaft. The connecting pipe can be a transparent pipe, such as a transparent plastic pipe, so that the condition of the connecting pipe can be observed, and the condition of the connecting shaft inserted into the connecting pipe can be observed. The outer side wall of the connecting pipe can be provided with length scale lines, by which the length of the connecting shaft inserted into the connecting pipe can be observed. The length of the connecting shaft inserted into the connecting pipe can be adjusted according to actual needs.

[0055] As Figure 7As shown, the positioning hole 23 can be a threaded hole, and the positioning pin 24 can be a bolt, which is arranged in the threaded hole. The bolt can be rotated as needed so that one end of the bolt can abut or move away from the connecting shaft. When the connecting shaft is arranged in the connecting pipe, the bolt can be rotated so that one end of the bolt abuts the connecting shaft, so that the connecting shaft is stable and firm. When the connecting shaft needs to be separated from the connecting pipe, the bolt can be rotated so that one end of the bolt moves away from the connecting shaft, so that the connecting shaft can be separated from the connecting pipe. Therefore, the transfer mechanism 30 and the polishing equipment 10 can be separated, so that the transfer mechanism 30 can be moved to other polishing equipment to transfer and place the containing groove 40 of the silicon wafer.

[0056] In some embodiments, the transfer mechanism 30 is arranged adjacent to the unloading part of the polishing equipment 10, so that the containing groove 40 on the transfer mechanism 30 can be carried by the carrying mechanism 20 to the unloading part of the polishing equipment 10.

[0057] In the embodiments of the present application, as shown in Figures 1 to 4 、 Figure 6 and Figure 7 , the transfer mechanism 30 comprises a vehicle body 25 and walking wheels 27. The vehicle body 25 is provided with a bearing mechanism 26 for placing the containing groove. The bearing mechanism 26 can be an open cavity, and the containing groove can be placed in the cavity. The walking wheels 27 are arranged at the bottom of the vehicle body 25. The number of the walking wheels 27 can be multiple, such as four. The walking wheels 27 can facilitate the movement of the transfer mechanism 30 to other polishing equipment to transfer and place the containing groove 40 of the silicon wafer. A handle can be arranged on the vehicle body 25, and the vehicle body 25 can be moved by the handle.

[0058] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above-mentioned specific embodiments. The above-mentioned specific embodiments are only illustrative, but not limiting. Those skilled in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, which all belong to the protection of the present application.

Claims

1. A polishing system, characterized in that, include: Polishing equipment, the polishing equipment including a polishing mechanism and a conveying mechanism; A transfer mechanism is detachably mounted on the polishing equipment. The transfer mechanism is used to transfer a receiving tank. The conveying mechanism is used to convey the receiving tank on the transfer mechanism to the unloading section of the polishing equipment. The conveying mechanism is also used to convey the silicon wafer placed in the receiving tank of the unloading section to the cleaning equipment. The polishing equipment has a first connecting part, and the transfer mechanism has a second connecting part, wherein the first connecting part and the second connecting part are detachably connected; The first connecting part includes a connecting tube, and the second connecting part includes a connecting shaft, the connecting shaft being detachably inserted into the connecting tube; or The first connecting part includes a connecting shaft, and the second connecting part includes a connecting tube, wherein the connecting shaft is detachably inserted into the connecting tube; The connecting tube has multiple positioning holes, which are spaced apart along the length of the connecting tube. The positioning holes communicate with the cavity of the connecting tube, and each positioning hole is provided with a movable positioning pin. When the connecting shaft is inserted into the connecting tube, the positioning pin can stop or move away from the connecting shaft.

2. The polishing system according to claim 1, characterized in that, The polishing equipment further includes a flipping mechanism. The conveying mechanism is used to convey the receiving groove on the transfer mechanism to the flipping mechanism. The flipping mechanism is used to flip the receiving groove placed on the flipping mechanism. The conveying mechanism is used to convey the flipped receiving groove to the unloading part of the polishing equipment.

3. The polishing system according to claim 2, characterized in that, The flipping mechanism includes: A tilting table for placing a receiving slot; A drive mechanism is provided for driving the receiving slot on the flipping table to flip.

4. The polishing system according to claim 2, characterized in that, The transport mechanism includes: A first transport mechanism is used to transport the receiving groove on the transfer mechanism to the flipping mechanism, and to transport the flipped receiving groove to the unloading part of the polishing equipment. The second transport mechanism is used to transport the silicon wafers placed in the receiving tank of the unloading section to the cleaning equipment.

5. The polishing system according to claim 4, characterized in that, Also includes: A cleaning device for cleaning silicon wafers in the receiving tank.

6. The polishing system according to claim 1, characterized in that, The transfer mechanism is located adjacent to the unloading section of the polishing equipment.

7. The polishing system according to claim 1, characterized in that, The transfer mechanism includes: The vehicle body is provided with a support structure for placing the receiving slot; The vehicle body has wheels that are located at the bottom of the vehicle body.

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