A laser chip batch flipping device

Abstract

The present invention discloses a laser chip batch flipping device, belonging to the technical field of laser chip assembly and adjustment. It solves the problems of low flipping efficiency, easy generation of flipping damage, and small flipping quantity in the prior art. The device includes an equipment platform, a first suction shaft, a second suction shaft and a material box arranged on the equipment platform. Rubber suction cups are provided on both the first and second suction shafts. The rubber suction cups are connected to an air extraction mechanism through air pipes. Both the first suction shaft and the second suction shaft can move in three-dimensional directions through a driving mechanism. The present invention utilizes two rubber suction cups with a number of fine holes to achieve fast, batch and non-damaging flipping of chips in a mutually transferable manner. The structure is reasonable, the action is reliable, while improving the flipping efficiency, it simplifies the operation method and reduces the large capital investment in equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser chip assembly and adjustment. Specifically, it particularly relates to a laser chip batch flipping device. Background Art

[0002] In the field of use of laser chips, since the laser chips are irregularly placed on the glue layer inside the material box after dicing and are bonded to the glue layer of the material box with the negative electrode facing down, when picking and placing the chips on the chip mounter in the subsequent process, the negative electrode needs to face up for picking and placing. In order to achieve the effect of the negative electrode facing up for beneficial picking and placing, the laser chips need to be flipped between the positive and negative electrodes.

[0003] Due to the extremely small and fragile characteristics of laser chips, glue needs to be applied to the bottom layer inside the material box for placing the laser chips to bond the laser chips, ensuring that there will be no dropping and collision during transportation and use. As a result, the current flipping methods for laser chips are the original manual flipping and high - investment machine flipping. During the manual flipping process, operators use small tools such as suction pens to pick or tweezers to clamp. This not only has low efficiency, but also has a great risk of damaging the laser chips during the flipping contact with the chips. The other method is machine - by - machine flipping. Although it avoids the risk of human damage to the laser chips, the flipping work efficiency is not high and the investment in the flipping equipment is relatively large. Summary of the Invention

[0004] The purpose of the present invention is to address the deficiencies existing in the prior art and provide a laser chip batch flipping device with high flipping efficiency, avoiding flipping damage, and a large flipping quantity.

[0005] In order to achieve the above - mentioned technical objectives, the technical solution adopted by the laser chip batch flipping device of the present invention is as follows:

[0006] A laser chip batch flipping device includes an equipment platform, a first suction shaft, a second suction shaft and a material box arranged on the equipment platform. Rubber suction cups are provided on both the first suction shaft and the second suction shaft. The rubber suction cups are connected to an air extraction mechanism through air pipes. Both the first suction shaft and the second suction shaft are moved in three-dimensional directions through a driving mechanism. A rotating motor is also provided between the first suction shaft and the driving mechanism. The rotating motor drives the first suction shaft to rotate. A number of fine holes are opened on the rubber suction cup. One side of the fine hole is attached to the chip, and the other side of the fine hole generates negative pressure under the air extraction action of the air extraction mechanism. The driving mechanism includes a first cylinder, a second cylinder and a third cylinder. The first cylinder is arranged on the equipment platform and is used to drive the second cylinder to move along the width direction of the equipment platform. The second cylinder is arranged on the push rod of the first cylinder and is used to drive the third cylinder to move along the length direction of the equipment platform. The third cylinder is arranged on the push rod of the second cylinder and is used to drive the rotating motor to move along the height direction of the equipment platform. First solenoid valves and second solenoid valves are also respectively provided on the first suction shaft and the second suction shaft. The first solenoid valve is used to control the opening and closing of the air extraction mechanism connected to the rubber suction cup on the first suction shaft. The second solenoid valve is used to control the opening and closing of the air extraction mechanism connected to the rubber suction cup on the second suction shaft.

[0007] Preferably, the first solenoid valve and the second solenoid valve are in opposite working states.

[0008] Preferably, a sealing shell is provided outside the rubber suction cup. The outer wall of the rubber suction cup is attached to the inner wall of the sealing shell. An air cavity is formed between the top of the rubber suction cup and the inner top of the sealing shell. One end of the air pipe is connected to the air extraction mechanism, and the other end is connected to the air cavity.

[0009] Preferably, positioning covers corresponding to a number of air holes one by one are further provided at the bottom of the rubber suction cup. The upper part of the positioning cover is arranged in the air hole and fixedly connected to the inner wall of the air hole. The lower part of the positioning cover is in a flared shape with a smaller upper part and a larger lower part. The upper part of the positioning cover is a hard structure, and the lower part of the positioning cover is a soft structure.

[0010] Preferably, a bearing seat is further provided on the outer wall of the first suction shaft. The air pipe passes through the limiting plate on the bearing seat and is connected to the air extraction mechanism.

[0011] An operation method of a laser chip batch flipping device includes the following steps:

[0012] S1. Place the material box containing chips on the equipment platform and remove the upper cover of the material box;

[0013] S2. Through the actions of the first cylinder and the second cylinder, the first suction shaft is translated above the material box and reaches the state where the rubber suction cup is coaxial with the material box. Then, through the action of the third cylinder, the rubber suction cup descends to the washing position.

[0014] S3. Start the first solenoid valve, and the chip is adsorbed on the rubber suction cup of the first suction shaft.

[0015] S4. The third cylinder acts, causing the rubber suction cup on the first suction shaft to ascend to the original height. The rotating motor acts, causing the rubber suction cup on the first suction shaft to flip 180 degrees in the same position as the chip.

[0016] S5. Drive the second suction shaft to descend to the position of the first suction shaft through the drive mechanism, and make the two rubber suction cups contact tightly.

[0017] S6. Close the first solenoid valve, open the second solenoid valve, and the chip is adsorbed on the rubber suction cup of the second suction shaft.

[0018] S7. The first suction shaft returns to the origin in step S1, and the second suction shaft descends above the material box, making the chip contact the glue layer in the material box.

[0019] S8. Close the second solenoid valve, and the second suction shaft returns to the origin in step S1, and it is completed.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. The present invention uses two rubber suction cups with a number of fine holes to achieve rapid, batch, and non-damaging flipping of the chip in a mutually transferable manner. The structure is reasonable, the action is reliable, while improving the flipping efficiency, it simplifies the operation method and reduces the large capital investment in equipment.

[0022] 2. The present invention realizes reliable driving of the first suction shaft, the second suction shaft, and the two rubber suction cups by setting the first cylinder, the second cylinder, and the third cylinder. By reasonably controlling the action time and stroke of the first cylinder, the second cylinder, and the third cylinder, it improves the flipping efficiency of the chip and effectively avoids chip damage caused by collision during the flipping process.

[0023] 3. The present invention uses a sealing shell and a positioning cover, which can improve the uniformity and reliability of chip suction, ensure that all chips in the material box are sucked, and enable large batches of chips to be flipped in a timely manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of the present invention;

[0025] Figure 2 is the front view of the present invention and the reference of the action state Figure 1;

[0026] Figure 3 is the reference of the operation state of the present invention Figure 2 ;

[0027] Figure 4 is the reference of the operation state of the present invention Figure 3 ;

[0028] Figure 5 is the structural schematic diagram of the rubber suction cup and the sealing shell in the present invention;

[0029] Figure 6 is Figure 5 the enlarged structural schematic diagram at position A in;

[0030] Figure 7 is the schematic diagram of the installation position of the first suction shaft and the air pipe in the present invention.

[0031] In the figure: 1. Equipment platform; 2. First suction shaft; 21. Bearing seat; 22. Limiting plate; 3. Second suction shaft; 4. Material box; 5. Rubber suction cup; 51. Fine hole; 52. Sealing shell; 520. Air cavity; 53. Positioning cover; 6. Air pipe; 7. Rotary motor; 8. Driving mechanism; 81. First cylinder; 82. Second cylinder; 83. Third cylinder. Detailed implementation manners

[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation manners:

[0033] Such as Figure 1 — Figure 7As shown in the figure, a laser chip batch flipping device includes a device platform 1, a first suction shaft 2, a second suction shaft 3, and a material box 4 disposed on the device platform 1. Rubber suction cups 5 are provided on both the first suction shaft 2 and the second suction shaft 3. The rubber suction cups 5 are connected to an air extraction mechanism through air pipes 6. Both the first suction shaft 2 and the second suction shaft 3 are moved in three-dimensional directions through a driving mechanism 8. A rotating motor 7 is also provided between the first suction shaft 2 and the driving mechanism 8. The rotating motor drives the first suction shaft 2 to rotate. A number of fine holes 51 are provided on the rubber suction cup 5. One side of the fine hole 51 is in contact with the chip, and a negative pressure is generated on the other side of the fine hole 51 under the air extraction action of the air extraction mechanism. Through the driving action of the driving mechanism 8 on the first suction shaft 2, the rubber suction cup 5 on the first suction shaft 2 can be quickly and accurately displaced above the material box 4 and attached to a number of chips. The air extraction mechanism works, and by generating a negative pressure between the rubber suction cup 5 and the chip, the chip can be reliably sucked up by the rubber suction cup 5. Since the area of the rubber suction cup 5 is large, the area of the chip is small, and the number of fine holes 51 is large enough, at least three fine holes 51 are included above a single chip. In this way, the negative pressure generated at the fine holes 51 can ensure that the chip overcomes the viscosity of the adhesive layer and is sucked out of the material box 4. Then the rotating motor 7 operates to rotate the first suction shaft 2 and the rubber suction cup 5 by 180°. Then, through the driving mechanism 8, the second suction shaft 3 and the rubber suction cup 5 on the second suction shaft 3 are driven to move, so that the rubber suction cup 5 on the first suction shaft 2 is aligned and attached to the rubber suction cup 5 on the second suction shaft 3. Then, the air extraction mechanism on the second suction shaft 3 starts to extract air, and the air extraction mechanism on the first suction shaft 2 stops extracting air, so that the chip can be reliably sucked by the rubber suction cup 5 on the second suction shaft 3. Finally, through the driving mechanism 8, the first suction shaft 2 and the second suction shaft 3 are driven, so that the rubber suction cup 5 on the second suction shaft 3 is attached to the material box 4, the air extraction mechanism stops extracting air, and the chip adsorbed by the rubber suction cup 5 on the second suction shaft 3 naturally falls into the material box 4 and is adhered and fixed by the adhesive layer. Through the above actions, the batch flipping of the chips in the material box 4 is reliably realized. The flexibility of the rubber suction cup 5 will not damage the chip during the process of touching the chip. By using the extremely fine fine holes 51 covering the rubber suction cup 5, chips of various sizes and at various positions in the material box 4 can be effectively sucked. The transfer method of the same-position double shafts has almost no vibration, and the transfer is fast without the risk of deviation, effectively avoiding the damage risk during the chip flipping by manual intervention and greatly improving the chip flipping efficiency.

[0034] The driving mechanism 8 includes a first cylinder 81, a second cylinder 82 and a third cylinder 83. The first cylinder 81 is arranged on the equipment platform 1 and is used to drive the second cylinder 82 to move along the width direction of the equipment platform 1. The second cylinder 82 is arranged on the push rod of the first cylinder 81 and is used to drive the third cylinder 83 to move along the length direction of the equipment platform 1. The third cylinder 83 is arranged on the push rod of the second cylinder 82 and is used to drive the rotating motor 7 to move along the height direction of the equipment platform 1. Both the first suction shaft 2 and the second suction shaft 3 can achieve three-dimensional displacement through the driving mechanism 8, namely the first cylinder 81, the second cylinder 82 and the third cylinder 83. Thus, while quickly sucking the chip, it is ensured that there will be no collision between the first suction shaft 2 and the second suction shaft 3, making the displacement of the two more reasonable, improving the flipping efficiency of the chip, and effectively avoiding chip damage caused by collision during the flipping process.

[0035] It further includes a first solenoid valve and a second solenoid valve. The first solenoid valve is used to control the opening and closing of the air extraction mechanism connected to the rubber suction cup 5 on the first suction shaft 2, and the second solenoid valve is used to control the opening and closing of the air extraction mechanism connected to the rubber suction cup 5 on the second suction shaft 3. The air extraction action of the air extraction mechanism on the pores 51 of the rubber suction cup 5 through the air pipe 6 and the control of the working state of the air extraction mechanism by the first solenoid valve or the second solenoid valve are prior arts. Therefore, the specific structures of the air extraction mechanism, the first solenoid valve and the second solenoid valve are not shown in the figure; through the setting of the first solenoid valve and the second solenoid valve, the operating state of the air extraction mechanism can be remotely and real-timely controlled, ensuring that the chip can be reliably adsorbed by the corresponding rubber suction cup 5.

[0036] The first solenoid valve and the second solenoid valve are in opposite working states. When one rubber suction cup 5 is in the state of adsorbing the chip, the other rubber suction cup 5 will be in the non-suction state, avoiding interference with the adsorption of the chip and making the adsorption, flipping and movement of the chip smoother and more stable.

[0037] A sealing shell 52 is arranged outside the rubber suction cup 5. The outer wall of the rubber suction cup 5 fits with the inner wall of the sealing shell 52. An air cavity 520 is formed between the top of the rubber suction cup 5 and the inner top of the sealing shell 52. One end of the air pipe 6 is connected to the air extraction mechanism and the other end is connected to the air cavity 520. By setting the sealing shell 52, an air cavity 520 is formed between the sealing shell 52 and the rubber suction cup 5. And because the air pipe 6 is directly connected to the air cavity 520, the air extraction action of the air extraction mechanism will first extract the air in the air cavity 520. In this way, while not affecting the air extraction of the pores 51 to adsorb the chip, it can make the air extraction action of the air extraction mechanism on the pores 51 more balanced, avoiding poor suction at the pores 51 far from the air pipe 6 and ensuring that all chips in the material box 4 are sucked.

[0038] A positioning cover 53 corresponding to and in one-to-one correspondence with a plurality of air holes is further provided at the bottom of the rubber suction cup 5. The upper part of the positioning cover 53 is arranged in the air hole and fixedly connected with the inner wall of the air hole. The lower part of the positioning cover 53 is in a trumpet shape with a smaller upper part and a larger lower part.

[0039] The upper part of the positioning cover 53 is of a hard structure, and the lower part of the positioning cover 53 is of a soft structure. After the positioning cover 53 is provided, there is a gap between the bottom of the rubber suction cup 5 and the chip, and the positioning cover 53 is in direct contact with the chip. The positioning cover 53 is softer than the rubber suction cup 5. Specifically, after any point at the bottom of the positioning cover 53 contacts the chip, the positioning cover 53 descends a certain distance, so that the lower part of the positioning cover 53 can generate a deformation adapting to the shape of the chip, thereby improving the fitting degree between the positioning cover 53 and the chip, and further enhancing the suction effect on the chip.

[0040] A bearing seat 21 is further provided on the outer wall of the first suction shaft 2. The air pipe 6 passes through the limiting plate 22 on the bearing seat 21 and is communicated with the air extraction mechanism. Through the setting of the bearing seat 21, when the rotating motor 7 drives the first suction shaft 2 and the corresponding rubber suction cup 5 to rotate, the limiting plate 22 on the bearing seat 21 will play a role in clamping the air pipe 6, and can make the air pipe 6 twist to prevent the air pipe 6 from winding around the outside of the first suction shaft 2.

[0041] An operation method of a laser chip batch flipping device includes the following steps:

[0042] S1. Place the material box 4 containing chips on the equipment platform 1 and remove the upper cover plate of the material box 4;

[0043] S2. Through the actions of the first cylinder 81 and the second cylinder 82, the first suction shaft 2 is translated above the material box 4 and reaches the coaxial state of the rubber suction cup 5 and the material box 4. Then, through the action of the third cylinder 83, the rubber suction cup 5 descends to the washing position;

[0044] S3. Start the first electromagnetic valve, and the chip is adsorbed on the rubber suction cup 5 of the first suction shaft 2;

[0045] S4. The third cylinder 83 acts, so that the rubber suction cup 5 on the first suction shaft 2 ascends to the original height, and the rotating motor 7 acts, so that the rubber suction cup 5 on the first suction shaft 2 together with the chip is flipped 180 degrees in place;

[0046] S5. Drive the second suction shaft 3 to descend to the position of the first suction shaft 2 through the driving mechanism 8 and make the two rubber suction cups 5 in close contact;

[0047] S6. Close the first electromagnetic valve, open the second electromagnetic valve, and the chip is adsorbed on the rubber suction cup 5 of the second suction shaft 3;

[0048] S7. The first suction shaft 2 returns to the origin in step S1, and the second suction shaft 3 descends above the material box 4 so that the chip contacts the glue layer in the material box 4;

[0049] S8. Close the second solenoid valve, and the second suction shaft 3 returns to the origin in step S1, and the operation is completed. Through the above operation method and steps, by using two rubber suction cups 5 with a number of small holes 51 and transferring them to each other, the chip can be quickly, batch and non-destructively flipped. The flipping method of the present invention is not affected by the placement position of the chip in the material box 4 and the appearance size of the laser chip. The structure is reasonable, the action is reliable, the flipping efficiency is improved, the operation method is simplified, and the large capital investment in the equipment is reduced.

[0050] In summary, the above are only the preferred embodiments of the present invention, and are not used to limit the scope of implementation of the present invention. All equivalent changes and modifications made according to the shape, structure, features and spirit of the scope of the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A batch flipping device for laser chips, comprising an equipment platform, a first suction shaft, a second suction shaft and a material box arranged on the equipment platform, characterized in that: Both the first suction shaft and the second suction shaft are provided with rubber suction cups. The rubber suction cups are connected to an air extraction mechanism through air pipes. Both the first suction shaft and the second suction shaft can move in three-dimensional directions through a driving mechanism. There is also a rotating motor between the first suction shaft and the driving mechanism. The rotating motor drives the first suction shaft to rotate. A number of fine holes are opened on the rubber suction cup. One side of the fine holes is in contact with the chip, and a negative pressure is generated on the other side of the fine holes under the air extraction action of the air extraction mechanism. The driving mechanism includes a first cylinder, a second cylinder, and a third cylinder. The first cylinder is arranged on the equipment platform and is used to drive the second cylinder to move along the width direction of the equipment platform. The second cylinder is arranged on the push rod of the first cylinder and is used to drive the third cylinder to move along the length direction of the equipment platform. The third cylinder is arranged on the push rod of the second cylinder and is used to drive the rotating motor to move along the height direction of the equipment platform. First solenoid valves and second solenoid valves are also respectively arranged on the first suction shaft and the second suction shaft. The first solenoid valve is used to control the opening and closing of the air extraction mechanism connected to the rubber suction cup on the first suction shaft. The second solenoid valve is used to control the opening and closing of the air extraction mechanism connected to the rubber suction cup on the second suction shaft.

2. The laser chip batch flipping device according to claim 1, characterized in that: The first solenoid valve and the second solenoid valve are in opposite working states.

3. The laser chip batch flipping device according to claim 1, characterized in that: A sealing shell is arranged outside the rubber suction cup. The outer wall of the rubber suction cup fits against the inner wall of the sealing shell. An air cavity is formed between the top of the rubber suction cup and the inner top of the sealing shell. One end of the air pipe is connected to the air extraction mechanism, and the other end is connected to the air cavity.

4. The laser chip batch flipping device according to claim 3, wherein: Positioning covers corresponding to a number of air holes one by one are also arranged at the bottom of the rubber suction cup. The upper part of the positioning cover is arranged in the air hole and is fixedly connected to the inner wall of the air hole. The lower part of the positioning cover is in the shape of a trumpet with a smaller top and a larger bottom. The upper part of the positioning cover is of a rigid structure, and the lower part of the positioning cover is of a soft structure.

5. The laser chip batch flipping device according to claim 1, wherein: A bearing seat is also arranged on the outer wall of the first suction shaft. The air pipe passes through the limiting plate on the bearing seat and is connected to the air extraction mechanism.

6. An operating method of a laser chip batch flipping device, characterized in that: It includes the following steps: S1. Place the material box containing the chips on the equipment platform and remove the upper cover of the material box. S2. Through the actions of the first cylinder and the second cylinder, the first suction shaft is translated above the material box and reaches the state where the rubber suction cup is coaxial with the material box. Then, through the action of the third cylinder, the rubber suction cup descends to the washing position. S3. Start the first solenoid valve, and the chip is adsorbed on the rubber suction cup of the first suction shaft. S4. The third cylinder acts to make the rubber suction cup on the first suction shaft ascend to the original height, and the rotating motor acts to make the rubber suction cup on the first suction shaft and the chip rotate 180 degrees in place. S5. Drive the second suction shaft to descend to the position of the first suction shaft through the driving mechanism and make the two rubber suction cups closely contact. S6. Close the first solenoid valve and open the second solenoid valve, and the chip is adsorbed on the rubber suction cup of the second suction shaft. S7. The first suction shaft returns to the origin in step S1, and the second suction shaft descends above the material box so that the chip contacts the glue layer in the material box. S8. Close the second solenoid valve, and the second suction shaft returns to the origin in step S1, and it is completed.

Images