Method for thinning laminated glass and thinned laminated glass, display device

Abstract

The present application relates to a kind of laminated glass thinning method and thinning laminated glass, display device.The above-mentioned laminated glass thinning method includes the following steps: obtaining laminated glass, laminated glass includes the first substrate and the second substrate arranged in layers;First protective film is arranged on the side surface of the first substrate away from the second substrate;A second protective film is arranged along the edge of the side surface of the second substrate away from the first substrate;Second substrate is etched to the first preset thickness;Remove first protective film, and third protective film is arranged on the side surface of the second substrate away from the first substrate;First substrate is etched to the second preset thickness;Remove third protective film;Remove the area covered by second protective film.The above-mentioned thinning method can thin laminated glass to 0.06mm and below, and the breakage rate is lower.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of glass thinning, in particular to a method for thinning laminated glass and the laminated glass and display device. BACKGROUND

[0002] With the development of the display industry towards flexible display, the LCD liquid crystal screen is gradually required to have flexible bending performance. The conventional thickness (such as 1.0 mm) glass substrate does not have bending performance, and when the glass substrate is thinned to a certain thickness (such as 0.1 mm), it has good flexible performance.

[0003] In the conventional method for manufacturing flexible glass substrate, the thick glass substrate is generally thinned by HF etching. The thinnest thickness can be thinned to 30 μm or less. However, for laminated glass, which is formed by bonding two glass substrates together through a frame adhesive, it is more difficult to thin the thickness to 60 μm or less (30 μm or less for a single plate), and the risk of breakage is greater. At present, there is no solution for thinning laminated glass to 60 μm or less in the industry. SUMMARY

[0004] Therefore, it is necessary to provide a method for thinning laminated glass to 60 μm or less, which can significantly reduce the breakage rate.

[0005] In addition, it is also necessary to provide a thinned laminated glass and a display device treated by the above method.

[0006] A method for thinning laminated glass, comprising the following steps:

[0007] Obtaining laminated glass, the laminated glass comprising a first substrate and a second substrate arranged in a stack;

[0008] A first protective film is arranged on the side surface of the first substrate away from the second substrate, and the first protective film completely covers the first substrate;

[0009] A second protective film is arranged along the edge of the side surface of the second substrate away from the first substrate;

[0010] The second substrate is etched and thinned to a first predetermined thickness;

[0011] The first protective film is removed, a third protective film is arranged on the side surface of the second substrate away from the first substrate, and the third protective film completely covers the second substrate;

[0012] The first substrate is etched and thinned to a second predetermined thickness;

[0013] The third protective film is removed; and

[0014] cutting the edge of the laminated glass after etching, and removing the area covered by the second protective film.

[0015] In one embodiment, the width of the second protective film is 5mm-10mm.

[0016] In one embodiment, the step of disposing a third protective film on the side surface of the second substrate away from the first substrate comprises: disposing a release layer on the area of the second substrate not provided with the second protective film, and then disposing the third protective film on the surface of the second substrate.

[0017] In one embodiment, the step of disposing a third protective film on the side surface of the second substrate away from the first substrate comprises: disposing a filling layer on the area of the second substrate not provided with the second protective film, and then laminating a release layer, and then disposing the third protective film on the surface of the second substrate, the thickness of the filling layer being the same as the thickness of the second substrate after thinning.

[0018] In one embodiment, the thickness of the first protective film, the second protective film and the third protective film is independently 80μm-120μm.

[0019] In one embodiment, the first protective film, the second protective film and the third protective film are independently selected from any one of acid-resistant heat-reducing adhesion-reducing film and UV adhesion-reducing film.

[0020] In one embodiment, the step of disposing a first protective film on the side surface of the first substrate away from the second substrate further comprises: applying a UV glue along the gap between the first substrate and the second substrate, and then performing UV irradiation to cure the UV glue.

[0021] In one embodiment, the width of the area of the UV glue application is 2mm-3mm.

[0022] In one embodiment, the thickness of the first substrate and the second substrate is independently 0.2mm-0.55mm, and the first predetermined thickness and the second predetermined thickness are independently ≤0.03mm.

[0023] In one embodiment, the size of the laminated glass is ≥500mm×600mm.

[0024] A thinning method of laminated glass, comprising the following steps:

[0025] obtaining a laminated glass, the laminated glass comprising a first substrate and a second substrate laminated;

[0026] a first protective film is provided on a side surface of the first substrate away from the second substrate, and the first protective film completely covers the first substrate;

[0027] the second substrate is etched to a first predetermined thickness;

[0028] a second protective film is provided on a surface of the second substrate after thinning, and the second protective film completely covers the second substrate;

[0029] the first protective film is removed from the surface of the first substrate, and a third protective film is provided around an edge of the first substrate away from the second substrate;

[0030] the first substrate is etched to a second predetermined thickness;

[0031] the second protective film is removed; and

[0032] an edge of the laminated glass after etching is cut, and an area covered by the third protective film is removed.

[0033] A method for thinning a laminated glass, comprising the following steps:

[0034] a laminated glass is obtained, the laminated glass comprising a first substrate and a second substrate arranged in layers;

[0035] a protective film is provided around at least one of an edge of the second substrate away from the first substrate and an edge of the second substrate away from the first substrate;

[0036] the first substrate and the second substrate are etched to a predetermined thickness; and

[0037] an edge of the laminated glass after etching is cut, and an area covered by the protective film is removed.

[0038] A thinned laminated glass obtained by the above method for thinning a laminated glass.

[0039] A display device comprising the above thinned laminated glass.

[0040] The above-mentioned method for thinning laminated glass involves etching one side sequentially, and during the first etching process, a second protective film is provided at the edge of the second substrate, leaving the edge of the second substrate unetched and thicker. This facilitates handling and reduces the risk of fragmentation during handling. Furthermore, the thicker edge of the second substrate facilitates film tearing. When thinned to a preset thickness, the laminated glass will not warp or curl due to the surface tension of the protective film, maintaining good flatness and a low risk of film tearing and fragmentation. Experiments have shown that the above-mentioned method for thinning laminated glass can achieve thinning of laminated glass to a thickness of 60 μm or less, with a fragmentation rate as low as 5% or less, which is beneficial for the flexible display of LCD screens. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 This is a process flow chart of a method for thinning laminated glass according to a first embodiment of the present invention;

[0042] Figure 2 for Figure 1 A schematic diagram of step S130 in the process flow chart shown;

[0043] Figure 3 This is a process flow chart of a method for thinning laminated glass according to a second embodiment of the present invention;

[0044] Figure 4 This is a process flow chart of a method for thinning laminated glass according to a third embodiment of the present invention. DETAILED DESCRIPTION

[0045] To facilitate understanding of the present invention, the present invention will be described more fully below in conjunction with the specific embodiments. Preferred embodiments of the present invention are provided in the specific embodiments. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of the present invention.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0047] Unless otherwise specified or there is a contradiction, the terms and phrases used in this invention have the following meanings:

[0048] In this disclosure, terms such as "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature specified as "first," "second," or "third" may explicitly or implicitly include at least one of such features.

[0049] In the description of the application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited.

[0050] When a numerical range is disclosed in the present application, the above range is considered to be continuous and includes the minimum value and the maximum value of the range, and every value between the minimum value and the maximum value. Further, when the range refers to an integer, every integer between the minimum value and the maximum value of the range is included. In addition, when a plurality of ranges are provided to describe a feature or a characteristic, the ranges can be combined. In other words, unless otherwise indicated, all ranges disclosed in the present application should be understood to include any and all sub-ranges subsumed therein.

[0051] In the present application, the technical features described in an open manner include both the closed technical solution consisting of the listed features and the open technical solution including the listed features.

[0052] The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally further include steps or units not listed, or can optionally further include other steps or components inherent to the process, method, product or device.

[0053] In the present application, the phrase "embodiment" means that the specific features, structures or characteristics described in conjunction with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase at various places in the specification does not necessarily mean the same embodiment, nor is it an independent or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present application can be combined with other embodiments.

[0054] Please refer to Figure 1 , the thinning method of the laminated glass of the first embodiment, comprising the following steps:

[0055] Step S110: obtaining a laminated glass, the laminated glass comprising a first substrate and a second substrate stacked.

[0056] The laminated glass is formed by bonding two glass substrates together with a frame adhesive. In some embodiments, the laminated glass can be but is not limited to an LCD glass substrate. Liquid crystal material and metal circuit, etc. are also provided between the first substrate and the second substrate.

[0057] In some embodiments, the thickness of the laminated glass can be, but is not limited to, 0.4mm-1.1mm. For example, the thickness of the laminated glass can be 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, or a range defined by any two of these values.

[0058] Further, the thickness of the first substrate and the second substrate is each independently 0.2mm-0.55mm.

[0059] In some embodiments, the size of the laminated glass is ≥500mmx600mm. The size of the laminated glass is large, and the risk of breakage is higher during etching, and the thinning method of the present embodiment can significantly reduce the breakage rate.

[0060] Step S120: disposing a first protective film on the side surface of the first substrate away from the second substrate, and completely shielding the first substrate with the first protective film.

[0061] In some embodiments, the first protective film is selected from any one of an acid-resistant heat-reducing film and a UV-reducing film. It can be understood that the first protective film is not limited to the above-mentioned materials, but can also be other acid-resistant films commonly used in the art.

[0062] In some embodiments, the thickness of the first protective film is 80μm-120μm. In a specific example, the thickness of the first protective film can be, but is not limited to, 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm, 115μm, 120μm, or a range defined by any two of these values. Under the above thickness, the first protective film can better protect the first substrate from being etched.

[0063] By disposing the first protective film on the side surface of the first substrate away from the second substrate and completely shielding the first substrate, when the second substrate is etched, the first substrate is not etched, and only single-sided etching is performed.

[0064] In some embodiments, the step of disposing the first protective film on the side surface of the first substrate away from the second substrate further comprises: coating a UV glue along the gap between the first substrate and the second substrate, and then performing UV irradiation to solidify the UV glue. In one embodiment, the UV glue is injected into the gap between the first substrate and the second substrate by a dispensing needle. Through the above steps, the gap between the first substrate and the second substrate has acid-resistant properties, preventing etching acid from penetrating into the surface through the gap between the two substrates when the laminated glass is etched, and corroding the metal circuit and liquid crystal material of the laminated glass.

[0065] In some embodiments, the width of the UV glue dotting area is 2mm-3mm. When the UV glue is dotted, the liquid crystal material and the metal circuit should not be contacted to avoid contaminating the liquid crystal material and the metal circuit. Therefore, the width of the UV glue dotting area should not be too large, and under the above width, the acid liquid can be effectively prevented from entering the gap and the liquid crystal material and the metal circuit are not contaminated.

[0066] It can be understood that in some embodiments, the UV glue is previously provided between the first substrate and the second substrate of the laminated glass, and therefore this step can be omitted.

[0067] Step S130: A second protective film is arranged along the edge of the side surface of the second substrate away from the first substrate.

[0068] The second protective film arranged along the edge of the side surface of the second substrate away from the first substrate can protect the edge of the second substrate from being etched in the etching process, while the middle part of the second substrate is etched, thereby forming a certain thickness of the frame at the edge of the second substrate, facilitating subsequent wafer picking and film tearing, and reducing the wafer breakage rate.

[0069] In some embodiments, the width of the second protective film is 5mm-10mm. In a specific example, the thickness of the second protective film can be but is not limited to 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm or a range formed by any two of these values. Under the above thickness, the second protective film can better protect the edge from being etched and will not collapse.

[0070] In some embodiments, the second protective film is selected from any one of the acid-resistant heat-debonding film and the UV-debonding film. It can be understood that the second protective film is not limited to the above-mentioned materials, but can also be other acid-resistant films commonly used in the art. In addition, the second protective film can be the same as or different from the first protective film.

[0071] In some embodiments, the thickness of the second protective film is 80μm-120μm. In a specific example, the thickness of the second protective film can be but is not limited to 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm, 115μm, 120μm or a range formed by any two of these values. Under the above thickness, the second protective film can better protect the edge of the second glass substrate from being etched. It can be understood that the thickness of the second protective film can be the same as or different from the thickness of the first protective film.

[0072] Please refer to Figure 2 , the edge of the second substrate is provided with the second protective film 201, and the width W of the second protective film 201 is 5mm-10mm.

[0073] Step S140: etching and thinning the second substrate to a first preset thickness.

[0074] In some embodiments, the first preset thickness is ≤0.03 mm.

[0075] In some embodiments, the etching solution is not particularly limited and can be a commonly used glass thinning etching solution in the art. For example, in one of the embodiments, the etching solution is a 4-6 mol / L HF solution.

[0076] In some embodiments, the etching method is not particularly limited and can be a commonly used etching method in the art. For example, in one of the embodiments, the etching method is selected from any one of immersion etching, top spray etching and flat plate etching. Further, the etching method is flat plate etching. Immersion etching has the disadvantages of poor tooth position printing, uneven etching thickness, and large thickness extreme difference. Although the etching thickness uniformity of top spray etching is improved compared with immersion etching, there is still a risk of poor tooth position printing. Flat plate etching does not need to insert a basket and does not contact the rack, so it can avoid the above-mentioned risks of large etching thickness extreme difference and tooth position printing.

[0077] During the etching process, the middle part of the second substrate is etched, while the edge is not etched due to the protection of the second protective film, thereby forming a certain height difference between the edge and the middle region of the second substrate, and the edge is thicker and is not easy to break during picking and placing.

[0078] Taking the total thickness of the laminated glass as 1.1 mm, the thickness of the first substrate and the second substrate as 0.55 mm, and the preset thickness as 0.03 mm as an example, the middle region of the second substrate is first thinned to the preset thickness, i.e. from 0.55 mm to 0.03 mm, i.e. the laminated glass is thinned from 1.1 mm to 0.58 mm (0.03 mm+0.55 mm). Since the total thickness of the laminated glass after one etching is 0.58 mm (still relatively thick), the wafer can be normally picked and placed, and does not need a back plate, the process difficulty is relatively low, and breakage is avoided.

[0079] Step S150: removing the first protective film, setting a third protective film on the side surface of the second substrate away from the first substrate, and making the third protective film completely cover the second substrate.

[0080] In some embodiments, the first protective film is an acid-resistant heat-reducing adhesive film, the laminated glass is heated first, and then the first protective film is torn off. After heating, the adhesion of the acid-resistant heat-reducing adhesive film is greatly reduced, so that the film can be torn off more conveniently.

[0081] In other embodiments, the first protective film is a UV-reducing adhesive film, the laminated glass is irradiated with UV, and then the first protective film is torn off. After UV irradiation, the adhesion of the UV-reducing adhesive film is greatly reduced, so that the film material can be torn off more conveniently.

[0082] Since the first substrate is not etched, the thickness is still thick, it is easier to remove the first protective film, and the risk of breakage is low.

[0083] In some embodiments, the step of arranging the third protective film on the side surface of the second substrate away from the first substrate comprises: first arranging a release layer on the area of the second substrate where the second protective film is not arranged, and then arranging the third protective film.

[0084] Since there is a certain height difference (i.e. the thickness of the thinning) between the edge and the middle part of the second glass substrate, the thickness of the second substrate corresponding to the middle area is thin, and the third protective film directly contacts it, which has a risk of breakage when the film is torn. By arranging a release layer in this area, the adhesive layer of the film material is prevented from directly contacting the thin glass substrate, thereby reducing the risk of breakage when the film is torn. The edge of the second substrate is thick, and there is no need to arrange a release layer, so the breakage rate is greatly reduced when the film is torn.

[0085] In some embodiments, the release layer can be but is not limited to a release paper or a centrifugal film.

[0086] Further, in some embodiments, the step of arranging the third protective film on the side surface of the second substrate away from the first substrate comprises: first arranging a filling layer on the area of the second substrate where the second protective film is not arranged, then arranging a release layer, and then arranging the third protective film. Since there is a certain height difference between the edge and the middle of the second substrate, the filling layer is arranged to prevent it from being suspended. In a specific example, the material of the filling layer is foam. Further, the thickness of the filling layer is the same as the thickness of the second substrate.

[0087] In some embodiments, the third protective film is selected from any one of acid-resistant heat-reduced tackiness film and UV-reduced tackiness film. It can be understood that the third protective film is not limited to the above materials, but can also be other acid-resistant films commonly used in the art. In addition, the third protective film can be the same as or different from the first protective film and the second protective film.

[0088] In some embodiments, the thickness of the third protective film is 80 μm to 120 μm. In a specific example, the thickness of the third protective film can be but is not limited to 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm or a range formed by any two of these values. It can be understood that the thickness of the third protective film can be the same as or different from the thickness of the first protective film and the second protective film.

[0089] Step S160: etching and thinning the first substrate to a second preset thickness.

[0090] In some embodiments, the second preset thickness is ≤0.03 mm.

[0091] The first substrate is etched and thinned in the same way as the second substrate, and will not be described again.

[0092] The total thickness of the laminated glass is thinned to ≤0.06mm through the above steps.

[0093] Generally, the ultra-thin glass substrate is made by the film-coated single-side thinning method. When the glass substrate is thinned to a certain thickness, such as 0.1mm or less, the glass substrate will be warped with the warping of the protective film, and even rolled up. This brings great challenges to film tearing, and the breakage rate is high, especially for large-size glass substrates (such as 500x600mm or more). In the present embodiment, since the edge of the second substrate is not etched and the thickness is relatively thick, when the laminated glass is thinned to a relatively thin thickness, warping does not occur, film tearing is easy, and the breakage rate is reduced.

[0094] Step S170: removing the third protective film.

[0095] In some embodiments, the third protective film is an acid-resistant heat-reduced adhesive film. The laminated glass is heated first, and then the third protective film is torn off. After heating, the acid-resistant heat-reduced adhesive film greatly reduces the adhesion, so that the film can be torn off more conveniently.

[0096] In other embodiments, the third protective film is a UV-reduced adhesive film. The laminated glass is irradiated with UV, and then the third protective film is torn off. After UV irradiation, the UV-reduced adhesive film greatly reduces the adhesion, so that the film material can be torn off more conveniently.

[0097] Step S180: cutting the etched laminated glass and removing the area covered by the second protective film.

[0098] In some embodiments, laser cutting is used for cutting. It can be understood that during the cutting process, the UV dispensing area is also removed.

[0099] The traditional glass etching method is only for single glass substrate, which is thinned by single-side etching. However, for laminated glass made of two glass substrates, it is impossible to achieve a relatively thin thickness by only single-side etching. For etching on both sides, since the glass is relatively thin when etched to a certain thickness, one side needs to be supported by a back plate, so that a relatively thin thickness cannot be achieved.

[0100] In the present embodiment, since the edge of the second substrate is not etched and the thickness is relatively thick, on the one hand, it is convenient to take and place, and reduces the risk of breakage during the taking and placing process. On the other hand, due to the existence of the frame, when thinned to a predetermined thickness, the laminated glass will not be warped and curled due to the surface tension of the protective film, and the planarity is still good, and the risk of film tearing and breakage is low.

[0101] In addition, a protective film is arranged at the edge of the second substrate, a frame is formed in the first etching process, and the protective film is adhered to the thick frame in the second etching process, so that the risk of breakage in the film tearing process is low.

[0102] The thinning method of the laminated glass has at least the following advantages:

[0103] The thinning method of the laminated glass is etched in sequence from a single side, and a protective film is arranged at the edge of the second substrate in the first etching process, so that the edge of the second substrate is not etched and is thick. On the one hand, the second substrate is convenient to take and place, and the risk of breakage in the taking and placing process is low. On the other hand, since the edge of the second substrate is thick, the laminated glass will not warp and curl due to the surface tension of the protective film when thinned to the preset thickness, and the flatness is still good, and the risk of breakage in the film tearing process is low. Experimental results show that the thinning method of the laminated glass can realize the thinning of the laminated glass to a thickness of 60 μm or less, and the breakage rate is as low as 5% or less, which is beneficial to the flexible display of the LCD liquid crystal display screen.

[0104] It should be understood that, although Figure 1 The steps in the flowchart shown in the figure are displayed in sequence according to the direction of the arrows, but these steps are not necessarily performed in the order indicated by the arrows, unless otherwise specified herein, the execution of these steps is not strictly limited in order, and they can be executed in other orders, and Figure 1 At least part of the steps in the above embodiment can include multiple sub-steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution order is not necessarily sequential, but can be executed in rotation or alternation with at least part of other steps or other sub-steps or stages.

[0105] Please refer to Figure 3 The thinning method of the laminated glass of the second embodiment of the present application comprises the following steps:

[0106] Step S210: Obtain a laminated glass, which comprises a first substrate and a second substrate arranged in layers.

[0107] Specifically, step S210 is the same as step S110 of the first embodiment, and will not be repeated here.

[0108] Step S220: A first protective film is arranged on the side surface of the first substrate away from the second substrate, and the first protective film completely covers the first substrate.

[0109] Specifically, step S220 is the same as step S120 of the first embodiment, and will not be repeated here.

[0110] Step S230: Etching and thinning the second substrate to a first preset thickness.

[0111] In some embodiments, the first preset thickness is less than or equal to 0.03 mm.

[0112] In some embodiments, the etching solution is not particularly limited and can be a glass thinning etching solution commonly used in the art. For example, in one of the embodiments, the etching solution is a 4 mol / L-6 mol / L HF solution.

[0113] In some embodiments, the etching method is not particularly limited and can be an etching method commonly used in the art. For example, in one of the embodiments, the etching method is selected from any one of immersion etching, top spray etching and flat plate etching. Further, the etching method is flat plate etching. Immersion etching has the disadvantages of poor tooth position printing, uneven etching thickness, and large thickness extreme difference. Although the etching thickness uniformity of top spray etching is improved compared with immersion etching, there is still a risk of poor tooth position printing. Flat plate etching does not need to insert a basket and does not contact the rack, so it can avoid the above-mentioned risks of large etching thickness extreme difference and tooth position printing.

[0114] Step S240: disposing a second protective film on the thinned second substrate surface, and completely shielding the second substrate with the second protective film.

[0115] In some embodiments, the second protective film is selected from any one of an acid-resistant heat-reducing adhesive film and a UV-reducing adhesive film. It can be understood that the second protective film is not limited to the above-mentioned materials, but can also be other acid-resistant films commonly used in the art.

[0116] In some embodiments, the thickness of the second protective film is 80 μm-120 μm. In a specific example, the thickness of the second protective film can be, but is not limited to, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm or a range consisting of any two of these values. Under the above thickness, the second protective film can better protect the second substrate from being etched in the subsequent process.

[0117] Step S250: removing the first protective film on the surface of the first substrate, and disposing a third protective film around the edge of the side surface of the first substrate away from the second substrate.

[0118] Specifically, the step of removing the first protective film on the surface of the first substrate is the same as the step of removing the first protective film in the first embodiment, and will not be repeated here.

[0119] Disposing a third protective film around the edge of the side surface of the first substrate away from the second substrate can protect the edge of the first substrate from being etched in the etching process, while the middle part of the first substrate is etched, thereby forming a certain thickness of the frame at the edge of the first substrate, facilitating subsequent picking and placing and film tearing, and reducing the broken piece rate.

[0120] In some embodiments, the third protective film has a width of 5mm-10mm. In a specific example, the third protective film can have a thickness of 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, or a range defined by any two of the above values, but is not limited thereto. With the above thickness, the third protective film can better protect the edge from etching and will not collapse.

[0121] In some embodiments, the third protective film is selected from any one of an acid-resistant heat-debonding film and a UV-debonding film. It can be understood that the third protective film is not limited to the above materials, and can also be other acid-resistant films commonly used in the art. In addition, the third protective film can be the same as or different from the first protective film.

[0122] In some embodiments, the third protective film has a thickness of 80μm-120μm. In a specific example, the third protective film can have a thickness of 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm, 115μm, 120μm, or a range defined by any two of the above values, but is not limited thereto. With the above thickness, the third protective film can better protect the edge of the first substrate from etching. It can be understood that the thickness of the third protective film can be the same as or different from the thickness of the first protective film.

[0123] Step S260: etching and thinning the first substrate to a second preset thickness.

[0124] In some embodiments, the second preset thickness is ≤0.03mm.

[0125] The manner of etching and thinning the first substrate is the same as that of etching and thinning the second substrate, and will not be described again.

[0126] Through the above steps, the total thickness of the laminated glass is thinned to ≤0.06mm.

[0127] Step S270: removing the second protective film.

[0128] Specifically, step S270 is the same as step S170 of the first embodiment, and will not be described again.

[0129] Step S280: cutting the edge of the etched laminated glass and removing the area covered by the third protective film.

[0130] In some embodiments, the cutting is performed by laser cutting. It can be understood that in the cutting process, the UV dispensing area is also removed.

[0131] The thinning method of the laminated glass described above first etches and thins the second substrate to a preset thickness, and then etches the first substrate. In the etching process, the edge of the first substrate is coated with a protective film to protect the edge of the first substrate from being etched, facilitate the picking and placing of the glass, and reduce the risk of breakage during the picking and placing process. In addition, since the edge of the second substrate is thicker, when thinned to the preset thickness, the laminated glass will not warp or curl due to the surface tension of the protective film, and still ensure good flatness and low risk of breakage when the film is torn.

[0132] Referring to Figure 4 The thinning method of the laminated glass of the third embodiment of the present application comprises the following steps:

[0133] Step S310: Obtain a laminated glass comprising a first substrate and a second substrate stacked.

[0134] Specifically, step S310 is the same as step S110 in the first embodiment, and will not be described again.

[0135] Step S320: A protective film is arranged along at least one of the edge of the first substrate away from the side surface of the second substrate and the edge of the second substrate away from the side surface of the first substrate.

[0136] In some embodiments, the width of the protective film is 5mm-10mm. In a specific example, the thickness of the protective film can be but is not limited to 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm or a range consisting of any two of these values. Under the above thickness, the protective film can better protect the edge from being etched and will not collapse.

[0137] In some embodiments, the protective film is selected from any one of an acid-resistant heat-reducing adhesive film and a UV-reducing adhesive film. It can be understood that the protective film is not limited to the above materials, but can also be other acid-resistant films commonly used in the art.

[0138] In some embodiments, the thickness of the protective film is 80μm-120μm. In a specific example, the thickness of the protective film can be but is not limited to 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm, 115μm, 120μm or a range consisting of any two of these values. Under the above thickness, the protective film can better protect the edge of the glass substrate from being etched.

[0139] It can be understood that step S320 includes: arranging a protective film around the edge of the side surface of the first substrate away from the second substrate, or arranging a protective film around the edge of the side surface of the second substrate away from the first substrate, or arranging a first protective film around the edge of the side surface of the first substrate away from the second substrate, and arranging a second protective film around the edge of the side surface of the second substrate away from the first substrate, the first protective film and the second protective film can be the same or different, and the width and thickness of the first protective film and the second protective film can be the same or different, and the specific embodiments are as described above.

[0140] Arranging a protective film around the edge of the side surface of the first substrate away from the second substrate can protect the edge of the first substrate from being etched during the etching process, while the middle part of the first substrate is etched, thereby forming a certain thickness of the frame at the edge of the first substrate, facilitating subsequent wafer picking and film tearing, and reducing the wafer breakage rate.

[0141] Arranging a protective film around the edge of the side surface of the second substrate away from the first substrate can protect the edge of the second substrate from being etched during the etching process, while the middle part of the second substrate is etched, thereby forming a certain thickness of the frame at the edge of the second substrate, facilitating subsequent wafer picking and film tearing, and reducing the wafer breakage rate.

[0142] Step S330: etching and thinning the first substrate and the second substrate to a preset thickness.

[0143] In some embodiments, the preset thickness is ≤0.03mm. It can be understood that in step S330, the first substrate and the second substrate are simultaneously etched and thinned to a preset thickness.

[0144] In some embodiments, the etching liquid is not particularly limited and can be a commonly used glass thinning etching liquid in the art. For example, in one of the embodiments, the etching liquid is a 4mol / L-6mol / L HF solution.

[0145] In some embodiments, the etching method is not particularly limited and can be a commonly used etching method in the art. For example, in one of the embodiments, the etching method is selected from any one of immersion etching, top spray etching and flat plate etching. Further, the etching method is flat plate etching. Immersion etching has the disadvantages of poor tooth position printing, uneven etching thickness, and large thickness extreme difference. Although the uniformity of etching thickness of top spray etching is improved compared with immersion etching, there is still a risk of poor tooth position printing. Flat plate etching does not need to insert a basket and does not contact the toothed bar, which can avoid the above-mentioned risks of large etching thickness extreme difference and tooth position printing.

[0146] Step S340: cutting the edge of the etched composite glass and removing the area covered by the protective film.

[0147] In some embodiments, the cutting is performed by laser cutting. It can be understood that the UV dispensing area is also removed during the cutting process.

[0148] The above lamination glass thinning method makes the edge of at least one of the first substrate and the second substrate thicker during etching, so as to facilitate wafer picking and reduce wafer breaking risk during wafer picking, and since the edge of the first substrate and the second substrate is thicker, the lamination glass will not warp and curl due to surface tension of the protective film when being thinned to a preset thickness, and still ensures good flatness and low film tearing and breaking risk.

[0149] The present application also provides a lamination glass thinned by the lamination glass thinning method of the first embodiment, the second embodiment or the third embodiment.

[0150] In some embodiments, the thickness of the above lamination glass is ≤0.06mm.

[0151] In some embodiments, the size of the above lamination glass is ≥500mm×600mm.

[0152] The present application also provides a display device of an embodiment, comprising the lamination glass thinned by the above embodiment.

[0153] In some embodiments, the display device includes but is not limited to a television, a computer, etc.

[0154] In order to make the purpose and advantages of the present application clearer, the lamination glass thinning method and its effects of the present application are further described in detail below in combination with specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application. The following embodiments do not include other components except for unavoidable impurities if not otherwise specified. In the embodiments, the drugs and instruments are selected according to the conventional selection in the art if not otherwise specified. The experimental methods in the embodiments are implemented according to the conventional conditions, such as the conditions described in the literature, books or the methods recommended by the manufacturers.

[0155] Embodiment 1

[0156] The present embodiment provides a lamination glass substrate thinning method for LCD, which specifically comprises the following steps:

[0157] (1) Obtain the LCD glass substrate (single plate thickness is 0.55 mm) with thickness of 1.1 mm, length and width of 920 x 730 mm, and then point the UV glue between the gap between the first substrate and the second substrate of the LCD glass substrate by using the dispensing needle, and then perform UV irradiation to make the UV glue solidify, so as to realize the edge sealing treatment.

[0158] (2) The acid-resistant heating adhesion-reducing film is arranged on the side surface of the first substrate away from the second substrate, and the thickness is 100 μm.

[0159] (3) The acid-resistant heating adhesion-reducing film is arranged along the edge of the side surface of the second substrate away from the first substrate, and the width of the acid-resistant heating adhesion-reducing film is 10 mm, and the thickness is 100 μm.

[0160] (4) Etch the second substrate, and the etching liquid is 5 mol / L HF solution, and the thickness of the middle region of the second substrate without the acid-resistant heating adhesion-reducing film is 0.03 mm, and the thickness of the edge region with the acid-resistant heating adhesion-reducing film is still 0.55 mm.

[0161] (5) The LCD glass substrate is first placed on the heating platform and heated at 70°C, and then the film is torn to remove the acid-resistant heating adhesion-reducing film on the surface of the first substrate.

[0162] (6) The foam with a thickness of 0.52 mm is arranged on the middle region of the second substrate without the acid-resistant heating adhesion-reducing film, and then the isolation paper is arranged, and then the acid-resistant heating adhesion-reducing film with a thickness of 100 μm is arranged on the surface of the second substrate.

[0163] (7) Etch the first substrate, and the etching liquid is 5 mol / L HF solution, and the thickness of the first substrate is 0.03 mm, and the total thickness of the LCD glass substrate is 0.06 mm.

[0164] (8) The LCD glass substrate is first placed on the heating platform and heated at 70°C, and then the film is torn to remove the acid-resistant heating adhesion-reducing film on the surface of the second substrate, and then the etched LCD glass substrate is cleaned.

[0165] (9) The thinned LCD glass substrate is cut to the target size of 80 mm x 160 mm by using laser cutting, and the edge region of the second substrate is removed.

[0166] Example 2

[0167] The embodiment provides a thinning method of an LCD glass substrate, which is similar to the thinning method of the LCD glass substrate in Example 1, and the difference lies in that in step (3), the width of the acid-resistant heating adhesion-reducing film is different, and in the embodiment, the width of the acid-resistant heating adhesion-reducing film is 3 mm.

[0168] Example 3

[0169] The embodiment provides a thinning method of an LCD glass substrate, which is similar to the thinning method of the LCD glass substrate in Embodiment 1, and the difference lies in that step (6) is different, and the step (6) of the embodiment is that isolation paper is laid on the middle area of the second substrate without the acid-resistant heating tack film, and then the acid-resistant heating tack film with a thickness of 100 μm is laid on the surface of the second substrate.

[0170] Embodiment 4

[0171] The embodiment provides a thinning method of an LCD glass substrate, which is similar to the thinning method of the LCD glass substrate in Embodiment 1, and the difference lies in that step (6) is different, and the step (6) of the embodiment is that the acid-resistant heating tack film with a thickness of 100 μm is laid on the surface of the second substrate.

[0172] Embodiment 5

[0173] The embodiment provides a thinning method of an LCD glass substrate, and specifically comprises the following steps.

[0174] (1) An LCD glass substrate with a thickness of 1.1 mm (the thickness of each single plate is 0.55 mm) and a length and width of 920*730 mm is obtained, UV glue is dotted between the gap between the first substrate and the second substrate of the LCD glass substrate through a glue needle, and then UV irradiation is performed, so that the UV glue is cured, so that edge sealing treatment is realized.

[0175] (2) The acid-resistant heating tack film with a thickness of 100 μm is laid on the surface of the first substrate away from the second substrate.

[0176] (3) The second substrate is etched, the etching liquid is 5mol / L HF solution, and the etching is performed until the thickness of the second substrate is 0.03 mm.

[0177] (4) The LCD glass substrate is first placed on a heating platform and heated at 70 DEG C, and then the acid-resistant heating tack film on the surface of the first substrate is removed.

[0178] (5) The acid-resistant heating tack film with a thickness of 100 μm is laid on the surface of the second substrate.

[0179] (6) The acid-resistant heating tack film with a width of 10 mm and a thickness of 100 μm is arranged on the edge of the first substrate.

[0180] (7) The first substrate is etched, the etching liquid is 5mol / L HF solution, and the etching is performed until the thickness of the first substrate is 0.03 mm, and the total thickness of the LCD glass substrate is 0.06 mm.

[0181] (8) The LCD glass substrate is first placed on a heating platform and heated at 70°C to tear the film and remove the anti-acid heating adhesion-reducing film on the surface of the second substrate. The etched LCD glass substrate is cleaned.

[0182] (9) The thinned LCD glass substrate is cut to a target size of 80 mm x 160 mm by laser cutting, and the edge region of the second substrate is removed.

[0183] Example 6

[0184] The embodiment provides a thinning method of an LCD glass substrate, specifically comprising the following steps:

[0185] (1) An LCD glass substrate with a thickness of 1.1 mm (the thickness of each single substrate is 0.55 mm) and a length and width of 920 mm x 730 mm is obtained. UV glue is applied between the gap between the first substrate and the second substrate of the LCD glass substrate by a dispensing needle, and then UV irradiation is performed to cure the UV glue, so as to realize edge sealing treatment.

[0186] (2) An anti-acid heating adhesion-reducing film is arranged on the edge of the first substrate, and the width of the anti-acid heating adhesion-reducing film is 10 mm and the thickness is 100 μm. An anti-acid heating adhesion-reducing film is arranged on the edge of the side surface of the second substrate away from the first substrate, and the width of the anti-acid heating adhesion-reducing film is 10 mm and the thickness is 100 μm.

[0187] (3) The first substrate and the second substrate are etched at the same time, and the etching liquid is 5 mol / L HF solution. The thickness of the regions of the first substrate and the second substrate not covered by the anti-acid heating adhesion-reducing film is 0.03 mm.

[0188] (4) The thinned LCD glass substrate is cut to a target size of 80 mm x 160 mm by laser cutting, and the edge region of the first substrate and the second substrate is removed.

[0189] Comparative Example 1

[0190] Comparative Example 1 provides a thinning method of an LCD glass substrate, which is similar to the thinning method of the LCD glass substrate in Example 1, and the difference lies in that the step (3) treatment is not performed.

[0191] Comparative Example 2

[0192] Comparative Example 1 provides a thinning method of an LCD glass substrate, specifically comprising the following steps:

[0193] (1) Obtain the LCD glass substrate (single plate thickness is 0.55 mm) with thickness of 1.1 mm, length and width of 920*730 mm, and then point the UV glue between the gap between the first substrate and the second substrate of the LCD glass substrate by using the glue needle, and then perform UV irradiation to make the UV glue solidify, so as to realize the edge sealing treatment.

[0194] (2) Etch the LCD glass substrate on both sides, and the etching liquid is 5 mol / L HF solution, and the etching is performed until the thickness of the LCD glass substrate is 0.06 mm.

[0195] (3) Clean the etched LCD glass substrate.

[0196] (4) The thinned LCD glass substrate is cut to the target size of 80 mm*160 mm by using laser cutting.

[0197] Take 50 pieces of LCD glass substrates, and process them according to the thinning method of the LCD glass substrate in the above examples and comparative examples, record the number of broken pieces in the thinning process, and calculate the broken piece rate, as shown in Table 1. Among them, the broken piece refers to the broken piece after the etching and thinning of the LCD glass substrate, and the broken piece rate is the number of broken pieces / the total number of production pieces.

[0198] Table 1: Broken piece rate data of the thinning method of each example and comparative example

[0199] Fragmentation rate / % Example 1 0 Example 2 2 Example 3 10 Example 4 14 Example 5 6 Example 6 10 Comparative Example 1 40 Comparative Example 2 100

[0200] As can be seen from the above experimental data, by setting a protective film around the edges of the first substrate and the second substrate, the broken piece rate in the etching process can be significantly reduced. Among them, the single-side setting of the protective film and the single-side etching in turn can further reduce the broken piece rate. In Example 6, since double-side etching is performed at the same time, when the laminated glass is thinned to a certain thickness (such as 0.1 mm or less), it is easy to be broken by the rolling etching liquid due to the lack of support back plate in the bubbling etching liquid. The etching bubble flow is generally 180 L / min or more, if the above broken piece rate is to be ensured, the bubble flow needs to be adjusted to be very small (such as 30 L / min or less), or even to be closed, which will lead to uneven etching of the thinned laminated glass in Example 6, resulting in appearance defects. The etching uniformity of the thinned laminated glass in Examples 1-5 is better.

[0201] The difference between Comparative Example 1 and Example 1 is that no protective film is set around the edges in Comparative Example 1, and the broken piece rate is obviously higher. Comparative Example 2 and Example 6 both use double-side etching at the same time, but Comparative Example 2 does not set a protective film around the edges, and the broken piece rate is obviously higher.

[0202] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combination of the technical features does not exist in contradiction, it should be considered as within the scope of the present disclosure.

[0203] The above-described embodiments only express several implementation manners of the present application, facilitate specific and detailed understanding of the technical solutions of the present application, but cannot be understood as a limitation on the patent protection scope of the present application. It should be noted that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. It should be understood that, the technical solutions obtained by the skilled person in the art through logical analysis, reasoning or limited experiments on the basis of the technical solutions provided by the present application all belong to the protection scope of the appended claims of the present application. Therefore, the patent protection scope of the present application should be subject to the contents of the appended claims, and the description and drawings can be used to explain the contents of the claims.

Claims

1. A method of thinning a laminated glass, characterized by, The method comprises the following steps: obtaining a laminated glass plate, which comprises a first substrate and a second substrate arranged in a stack; arranging a first protective film on a side surface of the first substrate away from the second substrate, and making the first protective film completely cover the first substrate; arranging a second protective film along an edge of a side surface of the second substrate away from the first substrate, and the width of the second protective film is 5-10 mm; etching and thinning the second substrate to a first preset thickness; removing the first protective film, arranging a third protective film on a side surface of the second substrate away from the first substrate, and making the third protective film completely cover the second substrate; etching and thinning the first substrate to a second preset thickness; removing the third protective film; and cutting the edge of the etched laminated glass plate, and removing the area covered by the second protective film. The step of arranging the third protective film on a side surface of the second substrate away from the first substrate comprises: first arranging a filling layer on the area of the second substrate not provided with the second protective film, then laminating a release layer, and then arranging the third protective film on the surface of the second substrate, and the thickness of the filling layer is the same as the thickness of the thinned second substrate. The etching mode is flat plate etching.

2. The method of thinning a laminated glass according to claim 1, characterized by, The material of the filling layer is foam.

3. The method of thinning a laminated glass according to claim 1, wherein The laminated glass plate is an LCD glass substrate.

4. The method of thinning a laminated glass according to claim 1, wherein The thickness of each of the first protective film, the second protective film and the third protective film is independently 80-120 μm.

5. The method of thinning a laminated glass according to claim 1, wherein Each of the first protective film, the second protective film and the third protective film is independently selected from any one of acid-resistant heat-reducing adhesive film and UV-reducing adhesive film.

6. The method of thinning a laminated glass according to any one of claims 1 to 5, characterized in that, Before the step of arranging the first protective film on a side surface of the first substrate away from the second substrate, the method further comprises: coating a UV adhesive along the gap between the first substrate and the second substrate, and then performing UV irradiation to make the UV adhesive solidify.

7. The method of thinning a laminated glass according to any one of claims 1 to 5, characterized in that, The width of the area coated with the UV adhesive is 2-3 mm.

8. The method of thinning a laminated glass according to claim 7, wherein The thickness of each of the first substrate and the second substrate is independently 0.2-0.55 mm, and the first preset thickness and the second preset thickness are independently ≤0.03 mm.

9. The method of thinning a laminated glass according to any one of claims 1 to 5 and 8, characterized in that, The size of the laminated glass plate is ≥500 mm×600 mm.

10. The method of thinning a laminated glass according to any one of claims 1 to 5 and 8, characterized in that, The laminated glass plate is obtained by the thinning method of any one of claims 1-10.

11. A thinned sheet glass characterized by The thinned laminated glass plate of claim 11.

12. A display device, characterized by comprising: ​

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