Wafer multi-directional flipping detection machine

Abstract

The present application is a wafer multi-directional flipping detection machine, which comprises a machine body, a multi-directional flipping pickup device and a control device. The machine body has a loading area and a flipping detection area. The multi-directional flipping pickup device is arranged in the machine body corresponding to the loading area and the flipping detection area, and is used to pick up the wafer in the wafer boat and transfer it to the flipping detection area for multi-directional flipping, and to transfer the detected wafer to the wafer boat. The control device is signal connected to the multi-directional flipping pickup device, and is used to control the direction and angle of the multi-directional flipping pickup device flipping and rotating the wafer.

Description

Technical Field

[0001] This invention relates to a wafer multi-directional flipping inspection machine, and more particularly to a wafer multi-directional flipping inspection machine with optimized configuration and design of various devices. Background Technology

[0002] In the past, wafer inspection work involved the inspection machine moving the wafer to the inspection area, and the inspection personnel observing the surface of the wafer, while recording and classifying the quality based on the inspection results.

[0003] However, conventional inspection equipment can only move the wafer to the observation area and rotate the wafer in a single plane to observe the wafer surface. However, if it is not possible to observe from all angles during inspection, the inspection results will be distorted, making it impossible to accurately classify the wafer quality.

[0004] Therefore, how to design an inspection machine that can be used to observe the wafer surface at various rotation and tilt angles, so that the wafer can be observed from all angles during inspection and the wafer quality classification can be carried out accurately, will be the key issues and focus of this case. Summary of the Invention

[0005] One objective of this invention is to provide a wafer multi-directional flipping inspection machine for observing wafer surfaces at various rotation and tilt angles.

[0006] Another objective of this invention is to provide a wafer multi-directional flipping inspection machine that improves the configuration of the various devices of the machine and allows for all-around viewing of the wafer.

[0007] This invention discloses a wafer multi-directional flipping inspection machine for inspecting and classifying multiple wafers, and for placing the wafers in a wafer boat. The machine includes a machine body, a multi-directional flipping pick-up device, and a control device. The machine body has a loading area and a flipping inspection area. The loading area is for placing the wafer boat, and the flipping inspection area is for inspecting the position of the wafers. The multi-directional flipping pick-up device is disposed within the machine body corresponding to the loading area and the flipping inspection area, and moves back and forth between the loading area and the flipping inspection area to pick up the wafers placed in the wafer boat and transfer them to the flipping inspection area for multi-directional flipping and rotation, and to transfer the inspected wafers back into the wafer boat. The control device is signal-connected to the multi-directional flipping pick-up device and controls the direction and angle of the multi-directional flipping pick-up device's flipping and rotation of the wafers.

[0008] The aforementioned wafer multi-directional flipping inspection machine includes a transfer arm and a flipping arm. The transfer arm picks up / places wafers toward the wafer boat. The flipping arm carries the wafers transferred by the transfer arm and raises the carried wafers to a predetermined height to flip the wafers and perform appearance inspection on the wafers.

[0009] The aforementioned wafer multi-directional flipping inspection machine further includes a transfer device and a detection device. The transfer device is configured to transfer the wafer to the inspection area within the machine body, moving it back and forth in a direction away from the flipping inspection area. The detection device is configured on the side of the machine body corresponding to the transfer device, and is used to inspect the wafer.

[0010] The aforementioned wafer multi-directional flipping inspection machine includes an electron microscope unit and a transfer plate. The electron microscope unit has a detection position for inspecting the surface of the wafer. The transfer plate is used to lay the wafer flat and transfer it to the detection position of the electron microscope unit, and to fine-tune the wafer at the detection position.

[0011] The aforementioned wafer multi-directional flipping inspection machine includes a control device comprising an input interface unit, a display unit, and a storage unit. The input interface unit is used to input status information of the wafer being inspected. The display unit is signal-connected to the input interface unit to display the input status information. The storage unit is signal-connected to the input interface unit to store the input status information.

[0012] The aforementioned wafer multi-directional flipping inspection machine, wherein the control device further includes a flipping control interface unit, which is used to manually control the direction and angle of the flipping and rotation of the wafer.

[0013] The aforementioned wafer multi-directional flipping inspection machine, wherein the storage unit stores a state correspondence list, the state correspondence list having multiple rotation angle information of the wafer placed on the wafer boat, the rotation angle information corresponding to each state information, and the control device adjusts the rotation angle of the wafer placed on the wafer boat according to the state correspondence list and the wafer state information stored in the storage unit.

[0014] The aforementioned wafer multi-directional flip inspection machine further includes a movable lighting device, which corresponds to the flip inspection area and is set in the machine body. It provides light to illuminate the wafer to be tested by emitting light toward the flip inspection area, and the light emission direction of the movable lighting device is adjustable and controlled to emit light at different angles toward the wafer to be tested.

[0015] The aforementioned wafer multi-directional flip inspection machine further includes a translation drive unit for driving the edge-searching detection unit to move back and forth toward / away from the rotating support. When the rotating support carries the wafer, the translation drive unit drives the edge-searching detection unit to move toward the rotating support to detect the wafer. When the edge-searching detection unit finishes detecting the wafer, the translation drive unit drives the edge-searching detection unit away from the rotating support.

[0016] The aforementioned wafer multi-directional flipping inspection machine further includes a wafer placement state analysis device for analyzing the placement state of the wafers placed on the wafer boat. The wafer placement state analysis device includes a laser sensing unit and a vertical driving unit. The laser sensing unit is positioned facing the wafer boat from the material placement area and is used to analyze the placement state of the wafers by light sensing. The vertical driving unit is used to drive the wafer boat to move back and forth in a vertical direction, so that each wafer placed on the wafer boat is analyzed by light sensing from the laser sensing unit.

[0017] The aforementioned wafer multi-directional flip inspection machine includes a movable lighting device comprising a control switch unit and a position detection unit. The control switch unit controls the illumination / de-illumination. The position detection unit is signal-connected to the control switch unit and detects whether the wafer is present in the flip inspection area. If the wafer is located in the flip inspection area, the control switch unit controls the illumination; if the wafer is far from the flip inspection area, the control switch unit de-illuminates.

[0018] This invention relates to a wafer multi-directional flip inspection machine, which can flip and rotate the wafer to be inspected through a multi-directional flip pick-up device, allowing inspectors to observe the wafer surface from multiple different rotation and tilt angles from all angles. In addition, an inspection device (such as an electron microscope) can be set on the side of the machine to increase the inspection quality of the wafer. Furthermore, a movable lighting device can be set up so that inspectors can adjust the light emission direction, allowing the wafer to be inspected to be observed from different light emission angles, thereby improving the inspection effect. Attached Figure Description

[0019] Figure 1 The drawing shows a perspective view of a wafer multi-directional flipping inspection machine according to a preferred embodiment of the present invention;

[0020] Figure 2 The drawing is shown as Figure 1 Top view of a wafer flipping inspection machine;

[0021] Figure 3 The drawing is shown as Figure 1 A schematic diagram of wafers placed in a wafer boat in a multi-directional wafer flipping inspection machine;

[0022] Figure 4 The drawing is shown as Figure 1 A schematic diagram of the multi-directional flipping and picking device of a wafer multi-directional flipping inspection machine, used to illustrate the flipping and rotating of the wafer to be tested;

[0023] Figure 5 The drawing is shown as Figure 1 A block diagram of the control device for a wafer multi-directional flipping inspection machine;

[0024] Figure 6 yes Figure 3 The illustrated top view of the wafer;

[0025] Figure 7 It is shown as Figure 1 A side cross-sectional view of a wafer multi-directional flipping inspection machine, used to illustrate the edge-searching device performing edge-searching operations on the wafer;

[0026] Figure 8 The diagram shows a top view of a wafer multi-directional flipping inspection machine according to another preferred embodiment of the present invention, which is used to illustrate that an electron microscope unit is provided on the side of the machine body.

[0027] Figure 9 The drawing is shown as Figure 8 Top view of a wafer flipping inspection machine;

[0028] Figure 10 The diagram shown is a perspective view of a wafer multi-directional flipping inspection machine according to another preferred embodiment of the present invention, used to illustrate that the movable lighting device can be controlled to face different light emission angles toward the wafer to be tested;

[0029] Figure 11 The drawing is shown as Figure 10 A block diagram of a movable lighting device;

[0030] Figure 12 The drawing shows a side view of the edge-following device of a wafer multi-directional flipping inspection machine according to another preferred embodiment of this invention;

[0031] Figure 13 The diagram shown is a block diagram of the wafer placement state analysis device of a wafer multi-directional flipping inspection machine according to another preferred embodiment of the present invention.

[0032] Figure 14 The drawing is shown as Figure 13 A three-dimensional view of the laser sensing unit of the wafer placement state analysis device; and

[0033] Figure 15 The drawing is shown as Figure 13 A schematic diagram of a wafer placement status analysis device. Detailed Implementation

[0034] The diagrams in this invention are all schematic and are mainly used to show the connection relationship between the various modules of the circuit and the transmission relationship between the various signals. The circuits, signal waveforms and frequencies are not drawn to scale.

[0035] A preferred embodiment of a wafer multi-directional flipping inspection machine in this case is as follows: Figure 1 , Figure 2 and Figure 3 As shown, this is a multi-directional flip-over inspection machine 3 for inspecting and classifying multiple wafers 1, and for placing each wafer 1 in a wafer boat 2. The machine includes a machine body 31, a multi-directional flip-over pick-up device 32, and a control device 33. The machine body 31 has a material placement area 311 and a flip-over inspection area 312. The material placement area 311 is for the wafer boat 2 to be placed, and the flip-over inspection area 312 is the area for inspecting the wafer 1. The multi-directional flip-over pick-up device 32 is disposed within the machine body 31, corresponding to the material placement area 311 and the flip-over inspection area 312. It can move back and forth between the material placement area 311 and the flipping detection area 312. In this way, it can pick up the wafer 1 placed in the crystal boat 2 and transfer the wafer 1 to the flipping detection area 312 for multi-directional flipping and rotation, so that the inspection personnel can observe the surface through different tilt angles of the wafer 1. After the inspection is completed, it can also transfer the inspected wafer 1 back into the crystal boat 2. The control device 33 is connected to the multi-directional flipping pick-up device 32 and controls the direction and angle of the multi-directional flipping pick-up device 32 when flipping and rotating the wafer 1.

[0036] Please refer to the above. Figure 4 As shown, in this example, the multi-directional flipping pick-up device 32 includes a transfer arm 321 and a flipping arm 322. The transfer arm 321 is used to pick up or place each of the wafers 1 toward the crystal boat 2, and the flipping arm 322 is used to carry the wafers 1 transferred by the transfer arm 321, raise the carried wafers 1 to a predetermined height, and then flip and rotate the wafers 1 for inspection personnel to perform appearance inspection of the wafers 1.

[0037] Please refer to the above. Figure 5As shown, the control device 33 includes an input interface unit 331, a display unit 332, and a storage unit 333. The input interface unit 331 is for the testing personnel to manually input status information based on the test results of wafer 1. The display unit 332 is signal-connected to the input interface unit 331 and displays the status information input by the input interface unit 331. The storage unit 333 is signal-connected to the input interface unit 331 and stores the status information input by the input interface unit 331. In this way, the relevant test data of each wafer can be retrieved in the future.

[0038] The control device 33 described in this example may further include a control flipping interface unit 334, through which the inspection personnel can manually control the direction and angle of the flipping arm 322 when flipping wafer 1. Additionally, the storage unit 333 described in this example stores a state correspondence list containing multiple rotation angle information when wafer 1 is placed on the wafer boat 2. These rotation angle information correspond to the state information of each wafer detection, allowing the control device 33 to adjust the rotation angle of wafer 1 placed on the wafer boat 2 according to the state correspondence list and the wafer state information stored in the storage unit 333. For example, see also... Figure 6 As shown, the circumferential position of wafer 1 is pre-set with a sectional segment 10 for orientation identification, so as to indicate the direction. Therefore, after the detection is completed, by identifying the rotation angle of wafer 1 placed on the crystal boat 2, and then according to the predefined state correspondence list, the state information of wafer 1 can be obtained.

[0039] Please refer to the above. Figure 7 As shown, the detection device 35 in this example includes an electron microscope unit 351 and a transfer plate 352. The electron microscope unit 351 has a detection position 350 for detecting the surface of the wafer 1, while the transfer plate 352 is for placing the wafer 1 flat. The detection personnel manually move the transfer plate 352 to move the wafer 1 to the detection position 350 and fine-tune the wafer 1 at the detection position, so that the electron microscope 351 can perform microscopic magnification observation of every position on the surface of the wafer 1.

[0040] Another preferred embodiment of the wafer multi-directional flipping inspection machine in this case is as follows: Figure 8 and Figure 9 As shown, the wafer multi-directional flip inspection machine further includes a transfer device 34 and an inspection device 35. The transfer device 34 is connected to the machine body 31 corresponding to the inspection area 312 and is used to transfer the wafer 1 back and forth in a direction away from the flip inspection area 312. The inspection device 35 is disposed on the side of the machine body 31 corresponding to the transfer device 34 and is used to inspect the wafer 1.

[0041] Please refer to the above. Figure 9As shown, before picking up and inspecting the wafer, the wafer 1 can be detected by the edge-following device 36 so that the wafer multi-directional flip inspection machine 3 can be adjusted accordingly based on the size of the wafer 1. The edge-following device 36 includes a rotating support 361 and an edge-following detection unit 362. The rotating support 361 is used to support and rotate the wafer 1. The edge-following detection unit 362 is located on the side of the rotating support 361. When the wafer 1 rotates, the edge-following detection unit 362 can detect the rotating wafer 1 to determine the size of the wafer 1 and generate size information. At the same time, the size information is provided to the back end. When picking up and inspecting the wafer 1, the wafer multi-directional flip inspection machine 3 can pick up and inspect the wafer 1 according to the size information, such as adjusting the picking distance and position of the robotic arm 342 and adjusting the inspection range.

[0042] Another preferred embodiment of the wafer multi-directional flipping inspection machine in this case is as follows: Figure 10 As shown, the multi-directional flip-over inspection machine 3 also includes a movable lighting device 30. The movable lighting device 30 is located within the machine body 31 corresponding to the flip-over inspection area 312 and can be controlled by the inspection personnel to illuminate the direction and angle of the light. In this way, the light emission direction towards the flip-over inspection area 312 can be controlled to illuminate the wafer 1 to be tested, allowing the inspection personnel to observe the wafer 1 to be tested illuminated by light emission at different angles. In addition, the wafer 1 can be made of a light-transmitting material, and the light emitted by the movable lighting device 30 can penetrate the light-transmitting wafer 1 for inspection. In this way, the lattice arrangement of the wafer 1 can be effectively detected as a basis for quality inspection.

[0043] On the other hand, also refer to Figure 11 As shown, the movable lighting device 30 in this example may also include a control switch unit 301 and a position detection unit 302. The control switch unit 301 is used to control the illumination / de-illumination, and the position detection unit 302 is signal-connected to the control switch unit 301 and is used to detect whether there is a wafer 1 in the flip detection area 312. If the wafer 1 is located in the flip detection area 312, the control switch unit 301 controls the illumination. If the wafer 1 is far away from the flip detection area 312, the control switch unit 301 de-illuminates.

[0044] Another preferred embodiment of the wafer multi-directional flipping inspection machine in this case is as follows: Figure 12As shown, the edge-tracking device 36 further includes a translation drive unit 363, which is provided for the edge-tracking detection unit 362 to drive the edge-tracking detection unit 362 to move horizontally back and forth toward / away from the position of the rotating support 361. When the rotating support 361 carries the wafer 1, the translation drive unit 363 drives the edge-tracking detection unit 362 to move toward the rotating support 361 to perform edge-tracking detection of the wafer 1. When the edge-tracking detection unit 362 finishes detecting the wafer 1, the translation drive unit 363 drives the edge-tracking detection unit 362 away from the rotating support 361, so that the wafer 1 can be easily picked up and transferred from the rotating support 361.

[0045] Another preferred embodiment of the wafer multi-directional flipping inspection machine in this case is as follows: Figure 13 , 14 As shown in Figure 15, in this example, the multi-directional flipping inspection machine further includes a wafer placement state analysis device 37, which can be used to analyze the placement state of each wafer 1 placed in the wafer boat 2. The wafer placement state analysis device 37 includes a laser sensing unit 371 and a vertical drive unit 372. The laser sensing unit 371 is positioned facing the wafer boat 2 corresponding to the material placement area 311 and is used to analyze the placement state of each wafer 1 in the wafer boat 2 by light sensing. The vertical drive unit 372 is used to drive the wafer boat 2 to move back and forth in the vertical direction, so that each wafer 1 placed in the wafer boat 2 is analyzed by light sensing by the laser sensing unit 371. For example, during the placement of wafer 1, there may be stacking, misalignment, or deviation in the placement angle. Through the light sensing analysis of the laser sensing unit 371, the placement state of each wafer 1 can be determined.

[0046] One type of wafer multi-directional flip inspection machine in this case can flip and rotate the wafer to be tested through the flipping arm of the multi-directional flip pick device, so that the inspection personnel can observe the wafer surface from multiple different rotation and tilt angles. The side of the machine body can also be equipped with inspection devices, such as an electron microscope, and can be transferred through a transfer device for further microscopic observation of the wafer surface. Furthermore, by adjusting the rotation angle of the wafer placed on the wafer boat through the control device, the state information corresponding to the wafer at different rotation angles can be obtained according to a predefined state correspondence list. A movable lighting device can also be set up so that the inspection personnel can adjust the light emission direction, so that the wafer to be tested can be observed from different light emission angles, thereby improving the inspection effect.

[0047] The above embodiments are merely illustrative examples for ease of explanation. Although they may be modified by those skilled in the art, they will not depart from the scope of protection intended in the claims.

Claims

1. A wafer multi-directional flipping inspection machine, characterized in that, include: A machine body has a material placement area and a flip detection area. The material placement area is for setting up the wafer boat, and the flip detection area is for detecting the area position of the wafer. A multi-directional flipping and picking device is disposed within the machine body corresponding to the material placement area and the flipping detection area. It can move back and forth between the material placement area and the flipping detection area, picking up the wafers placed in the wafer boat and transferring them to the flipping detection area for multi-directional flipping and rotation, as well as transferring the inspected wafers back into the wafer boat. The multi-directional flipping and picking device includes: A transfer arm is used to pick up / place each of the wafers into the crystal boat; and A flipping arm is used to carry the wafer transferred by the transfer arm and raise the carried wafer to a predetermined height to perform multi-directional flipping and rotation of the wafer for appearance inspection; and A control device is connected to the multi-directional flip-and-grab device and is used to control the direction and angle of flipping and rotating the wafer by the multi-directional flip-and-grab device. The control device includes: An input interface unit is used to input state information of each of the wafers after input detection; and A storage unit is signal-connected to the input interface unit and is used to store the state information input by the input interface unit and to store a state correspondence list. The state correspondence list has multiple rotation angle information of the wafer placed in the wafer boat, and the rotation angle information corresponds to each of the state information. The control device is configured to, based on the state correspondence list and the state information of each wafer stored in the storage unit, control the flip arm to adjust the rotation angle of the wafer placed in the crystal boat when the wafer that has completed the detection is transferred back into the crystal boat by the flip arm, so that the rotation angle of each wafer placed in the crystal boat corresponds to its state information respectively. Each of the wafers has a sectional section on its outer periphery for orientation identification, and the control device uses the angle of the sectional section as a reference to determine the rotation angle of the wafer placed within the wafer boat; and The wafer multi-directional flipping inspection machine also includes a wafer placement state analysis device, which is used to analyze the placement state of the wafer placed in the wafer boat. The wafer placement state analysis device includes: A laser sensing unit is positioned facing the wafer boat from the material placement area and provides light sensing to analyze the wafer's placement status; and A vertical drive unit is used to drive the crystal boat to move back and forth in a vertical direction, so that each wafer placed in the crystal boat is analyzed by the laser sensing unit to determine its placement status.

2. The wafer multi-directional flipping inspection machine as described in claim 1, characterized in that, The control device further includes a display unit, which is signal-connected to the input interface unit and is used to display the status information input by the input interface unit.

3. The wafer multi-directional flipping inspection machine as described in claim 1, characterized in that, The control device also includes a control flipping interface unit, which is used to manually control the direction and angle of flipping and rotating the wafer.

4. The wafer multi-directional flipping inspection machine as described in claim 1, characterized in that, The wafer multi-directional flipping inspection machine further includes: A transfer device is connected to the machine body corresponding to the flip detection area, and is used to transfer the wafer back and forth in a direction away from the flip detection area; and A detection device is disposed on the side of the machine body corresponding to the transfer device, and is used to detect the wafer.

5. The wafer multi-directional flipping inspection machine as described in claim 1, characterized in that, The detection device includes: An electron microscope unit having a detection position for inspecting the surface of the wafer; and A transfer plate is used for placing the wafer flat and transferring it to the detection position of the electron microscope unit, and for fine-tuning the wafer at the detection position.

6. The wafer multi-directional flipping inspection machine as described in claim 1, characterized in that, The wafer multi-directional flip-over inspection machine further includes a movable lighting device, which is located within the machine body corresponding to the flip-over inspection area and illuminates the wafer to be tested by emitting light toward the flip-over inspection area. The light emission direction of the movable lighting device is adjustable and controlled to emit light at different angles toward the wafer to be tested.

7. The wafer multi-directional flipping inspection machine as described in claim 6, characterized in that, The wafer is a light-transmitting wafer, and the movable illumination device emits light that passes through the light-transmitting wafer for detection.

8. The wafer multi-directional flipping inspection machine as described in claim 1, characterized in that, The wafer multi-directional flipping inspection machine also includes an edge-tracking device, which includes: A rotating support for supporting and rotating the wafer; and An edge detection unit is used to detect the wafer carried and rotated on the rotating support, in order to find the edge and center position of the wafer, determine the size of the wafer and generate size information, and provide the size information. When the wafer is picked up and inspected, the wafer is picked up and inspected according to the size information.

9. The wafer multi-directional flipping inspection machine as described in claim 8, characterized in that, The edge-tracing device also includes a translation drive unit, which drives the edge-tracing detection unit to move back and forth toward or away from the rotating support. When the rotating support carries the wafer, the translation drive unit drives the edge-tracing detection unit to move toward the rotating support to detect the wafer. When the edge-tracing detection unit stops detecting the wafer, the translation drive unit drives the edge-tracing detection unit away from the rotating support.

10. The wafer multi-directional flipping inspection machine as described in claim 6, characterized in that, The movable lighting device includes: A control switch unit is used to control the illumination / deactivation of the illumination; and A position detection unit is signal-connected to the control switch unit and is used to detect whether the wafer is in the flip detection area. If the wafer is in the flip detection area, the control switch unit controls the light emission. If the wafer is far away from the flip detection area, the control switch unit stops emitting light.

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