An electronic device test point determination method, apparatus, and electronic device

Abstract

The application discloses a kind of electronic equipment test point determination method, device and electronic equipment, the method includes: obtaining the mainboard element information of the mainboard of the electronic equipment to which the network to be measured belongs and the connection element information connected with the network to be measured;Determine the first element set connected with the network to be measured;According to the connection element information, the second element set that meets the first set condition is filtered from the mainboard element information;Determine the capacitance set that the distance of inductance in the second element set meets the second set condition, according to the distance between capacitor pad and inductance, the capacitor in the capacitance set is prioritized, and according to capacitor sorting result, determine the load point priority of each capacitor in the capacitance set as load point and the test point priority as test point.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, and in particular to a method, apparatus, and electronic device for determining test points in electronic devices. Background Technology

[0002] The BUCK circuit (step-down converter) is a common topology in DC-DC power supplies. Due to the switching process of the transistor S, power supply fluctuations occur, resulting in ripple. Therefore, ripple testing of BUCK circuits is a routine test. However, during ripple testing of BUCK circuits, there are multiple selectable test points and load points for the signal under test. Consequently, testers primarily rely on experience to directly select these test points and load points on the circuit board under test. This makes the reliability of the test results highly dependent on the tester's experience, leading to significant variations in test quality and hindering automated testing.

[0003] Currently, the main approach to address this issue is as follows: Based on the name of the signal under test in the test items, the tester selects appropriate test points and load points from the PCB diagram stored in the computer, using their experience. Then, by referring to the test points determined in the PCB diagram, the required test points are located on the circuit board under test. This method still heavily relies on the tester's experience, resulting in significant variations in test quality and making automated testing impossible. Summary of the Invention

[0004] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a method, apparatus and electronic device for determining test points of electronic devices.

[0005] According to a first aspect of the present invention, a method for determining test points in an electronic device is provided. The method includes: acquiring motherboard component information of the motherboard of the electronic device to which the network under test belongs; acquiring connection component information connected to the network under test; determining a first set of components connected to the network under test, the first set of components including capacitors and inductors; filtering a second set of components from the motherboard component information that meets a first preset condition based on the connection component information, wherein the components in the second set are inductors or capacitors connected to components in the first set of components; determining a set of capacitors whose distance from the inductors in the second set meets a second preset condition; prioritizing the capacitors in the set according to the distance between the capacitor pads and the inductors to obtain a capacitor ranking result; and determining the load point priority and test point priority of each capacitor in the set as a load point and as a test point based on the capacitor ranking result.

[0006] According to one embodiment of the present invention, obtaining the connection element information connected to the network under test includes: obtaining the network identifier of the network under test; and determining the connection element information based on the network identifier and a preset schematic set.

[0007] According to one embodiment of the present invention, determining the first set of components connected to the network under test includes: determining the first set of components whose motherboard component information includes preset component reference numbers.

[0008] According to one embodiment of the present invention, determining the first set of components connected to the network under test includes: acquiring components that match a set of keywords; determining the component reference number that matches the set of keywords; and determining the first set of components based on the determined component reference number.

[0009] According to an embodiment of the present invention, the step of filtering a second set of components that meet a first set of conditions from the motherboard component information based on the connection component information includes: obtaining the reference numbers of inductors and capacitors in the connection component information; matching the reference numbers of inductors and capacitors in the connection component information with the motherboard component information to determine an inductor whose reference number is phase connected to the other end of the inductor in the connection component information, and a capacitor whose reference number is GND byte connected to the other end of the capacitor in the connection component information, as the second set of components.

[0010] According to one embodiment of the present invention, determining the set of capacitors whose distance from the inductors in the second set of components meets a second set condition includes: obtaining the inductor coordinates of the inductors in the second set of components and constructing a planar model; and determining, based on the planar model, the set of capacitors whose distance from the inductors in the second set of components is less than the maximum acceptable design distance between the capacitor and the inductor.

[0011] According to one embodiment of the present invention, the step of prioritizing the capacitors in the capacitor set according to the distance between the capacitor pads and the inductor to obtain a capacitor sorting result includes: selecting capacitors in the capacitor set whose pad model is greater than a first preset value; sorting the selected capacitors according to the distance between the capacitor pads and the inductor to obtain a first sorting result; and sorting the capacitors in the capacitor set whose pad model is the first preset value according to the distance between the capacitor pads and the inductor to obtain a second sorting result.

[0012] According to an embodiment of the present invention, determining the load point priority and test point priority of each capacitor in the capacitor set as a load point and as a test point based on the capacitor sorting result includes: sorting the capacitors sequentially according to the order of distance between the capacitor pads and inductors from farthest to closest in the first sorting result and the order of distance between the capacitor pads and inductors from farthest to closest in the second sorting result, as the sorting result of the load point priority from high to low; and sorting the capacitors sequentially according to the order of distance between the capacitor pads and inductors from closest to farthest in the first sorting result and the order of distance between the capacitor pads and inductors from closest to farthest in the second sorting result, as the sorting result of the test point priority from high to low.

[0013] According to a second aspect of the present invention, an electronic device test point determination apparatus is also provided, the apparatus comprising: a first acquisition module, configured to acquire motherboard component information of the motherboard of the electronic device to which the network under test belongs; a second acquisition module, configured to acquire connection component information connected to the network under test; a matching module, configured to determine a first set of components connected to the network under test, the first set of components including capacitors and inductors; a filtering module, configured to filter a second set of components that meet a first set of conditions from the motherboard component information based on the connection component information, wherein the components of the second set of components are inductors or capacitors connected to components in the first set of components; a calculation module, configured to determine a set of capacitors whose distance from the inductors in the second set of components meets a second set of conditions; a sorting module, configured to prioritize the capacitors in the set of capacitors based on the distance between the capacitor pads and the inductors, and obtain a capacitor sorting result; and a determination module, configured to determine the load point priority and test point priority of each capacitor in the set as a load point based on the capacitor sorting result.

[0014] According to a third aspect of the present invention, an apparatus is also provided, the apparatus comprising at least one processor, and at least one memory and a bus connected to the processor; wherein the processor and the memory communicate with each other via the bus; the processor is configured to invoke program instructions in the memory to execute the above-described method for determining test points of an electronic device.

[0015] In the present invention, an electronic device test point determination method, apparatus, and electronic device involve acquiring motherboard component information and connection component information of the electronic device motherboard to which the network under test belongs, and determining a first set of components connected to the network under test. This first set of components includes capacitors and inductors. Then, based on the connection component information, a second set of components meeting a first set of conditions is selected from the motherboard component information. The components in the second set are inductors or capacitors connected to components in the first set. Further, a set of capacitors whose distance from the inductors in the second set meets a second set of conditions is determined. Based on the distance between the capacitor pads and the inductors, the capacitors in the capacitor set are prioritized to obtain a capacitor ranking result. Based on the capacitor ranking result, the load point priority and test point priority of each capacitor in the capacitor set as a load point and as a test point are determined. This automatically generates test points and load points, realizing the automatic selection process of test points during the testing of the electronic device, thereby achieving automated testing. This effectively avoids problems such as differences in test point selection due to differences in experience among testers and the resulting lack of rigorous test quality.

[0016] It should be understood that the teachings of this invention do not need to achieve all the beneficial effects described above, but rather that specific technical solutions can achieve specific technical effects, and other embodiments of this invention can also achieve beneficial effects not mentioned above. Attached Figure Description

[0017] The above and other objects, features, and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description taken in conjunction with the accompanying drawings. Several embodiments of the invention are illustrated in the drawings by way of example and not limitation, wherein:

[0018] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0019] Figure 1 A schematic diagram illustrating the implementation flow of the method for determining test points in electronic devices according to an embodiment of the present invention is shown;

[0020] Figure 2 This diagram illustrates the naming results of local circuits obtained by naming motherboard circuits using pre-defined logical rules.

[0021] Figure 3 This invention illustrates a schematic diagram of a network under test containing information such as component reference numbers in an embodiment of the invention.

[0022] Figure 4 This diagram illustrates the distances between multiple capacitors and an inductor according to an embodiment of the present invention.

[0023] Figure 5A schematic diagram of the composition structure of the electronic device test point determination device according to an embodiment of the present invention is shown;

[0024] Figure 6 A schematic diagram of the composition structure of the device according to an embodiment of the present invention is shown. Detailed Implementation

[0025] The principles and spirit of the invention will now be described with reference to several exemplary embodiments. It should be understood that these embodiments are provided merely to enable those skilled in the art to better understand and implement the invention, and are not intended to limit the scope of the invention in any way. Rather, these embodiments are provided to make the invention more thorough and complete, and to fully convey the scope of the invention to those skilled in the art.

[0026] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] Figure 1 A schematic diagram illustrating the implementation flow of the method for determining test points in electronic devices according to an embodiment of the present invention is shown.

[0028] refer to Figure 1 The method for determining test points in an electronic device according to an embodiment of the present invention includes at least the following operation steps: Operation 101, obtaining motherboard component information of the motherboard of the electronic device to which the network under test belongs; Operation 102, obtaining connection component information connected to the network under test; Operation 103, determining a first set of components connected to the network under test, the first set of components including capacitors and inductors; Operation 104, filtering a second set of components that meet a first set of conditions from the motherboard component information based on the connection component information, the components in the second set being inductors or capacitors connected to the components in the first set of components; Operation 105, determining a set of capacitors whose distance from the inductors in the second set of components meets a second set of conditions; Operation 106, prioritizing the capacitors in the set of capacitors based on the distance between the capacitor pads and the inductors, obtaining a capacitor sorting result; Operation 107, determining the load point priority and test point priority of each capacitor in the set as a load point based on the capacitor sorting result.

[0029] In operation 101, obtain the motherboard component information of the electronic device motherboard to which the network under test belongs.

[0030] In this embodiment of the invention, the electronic device can be various types of computers, control devices, or other electronic devices with relatively complex control motherboards, such as laptops. A laptop motherboard is composed of many modules, such as CPU, GPU, RAM, WLAN, and other modules. Here, a complete set of circuit schematics including multiple modules can be pre-configured for various types of laptop motherboards. Therefore, for each type of laptop, a circuit schematic corresponding to the functional module requirements of the laptop can be selected from the complete set of circuit schematics and combined to form a new circuit motherboard circuit diagram. During the combination process, some circuits may become mismatched, requiring local modifications to the mismatched circuit sections. Therefore, logical rules need to be pre-defined for naming the component reference numbers and electronic signal nets (networks) of the modified circuits. For example, Figure 2 This diagram illustrates the naming results of local circuits obtained by naming motherboard circuits using pre-defined logical rules. (Reference) Figure 2 After the node NVVDD_EN_R on the line, a resistor is passed through it, and the line is named NVVDD_EN_R_R. Based on pre-defined logical rules for naming modified line component reference numbers and electronic signal nets (networks), a database is pre-configured, referred to as Data A in this embodiment of the invention. Data A contains component reference numbers, electronic network nets, and all component reference numbers and electronic signal nets that will be named according to logical rules and will involve local line modifications. In the method for determining test points for electronic devices in this embodiment of the invention, the testing process of a specific electronic signal net of the electronic device is used as an example for explanation. In this application, the specific electronic signal net of the electronic device to be tested is referred to as the network under test. The specific implementation scheme of this application is particularly applicable to the testing process of BUCK line ripple test items.

[0031] In this embodiment of the invention, the motherboard component information of the electronic device motherboard to which the network under test belongs may include data such as motherboard NET List, component reference number, pad coordinates, component orientation, component model and pad size.

[0032] For example, you can export the motherboard component information of the electronic device to which the network under test belongs from the circuit schematic and PCB diagram. This includes, for example, the motherboard NET List, component reference numbers, pad coordinates, component orientation, component model, and pad size. The exported motherboard component information can also be saved as data B.

[0033] In operation 102, information about the connection elements connected to the network under test is obtained.

[0034] In this embodiment of the invention, the following operations can be used to obtain the connection element information connected to the network under test: obtain the network identifier of the network under test, and determine the connection element information based on the network identifier and a preset schematic set.

[0035] In this embodiment of the invention, the network identifier of the network under test can be the network name, network number, etc.

[0036] For example, for the BUCK circuit ripple test item, the net name of the network under test can be exported from the ripple test item. Using the net name as an index, the connection element information, such as component reference number, component model, component orientation, and pad coordinates, connected to that net name can be searched in data A. Here, the searched connection element information, such as component reference number, component model, component orientation, and pad coordinates connected to that net name, can also be saved as data C.

[0037] In operation 103, a first set of components connected to the network under test is determined, the first set of components including capacitors and inductors.

[0038] In one embodiment of the present invention, determining a first set of components connected to the network under test includes: determining a first set of components in the motherboard component information that includes a preset component number.

[0039] For example, representative bytes can be pre-defined in the reference designations of different components. For instance, PL can be used as the first byte of the inductor's reference designation, and PC as the first byte of the capacitor's reference designation. Therefore, when determining the first set of components to be connected to the network under test, this first set of components can be determined by selecting representative reference designation bytes.

[0040] For example, when selecting test points and load points for the signal under test in the BUCK line ripple test, you can filter components whose tag number bytes include PL and PC to obtain the inductors and capacitors connected to the network under test.

[0041] In another embodiment of the present invention, a keyword byte can be preset. When determining the first set of elements connected to the network under test, the element matching the preset keyword byte is obtained, the element bit number matching the preset keyword byte is determined, and the first set of elements is determined according to the determined element bit number.

[0042] For example, generic keyword bytes can be created for byte matching within component model names. Examples include bytes for inductance units (UH), inductance value (063), and capacitor units (uF), nF, and capacitance value (0603). This further confirms the component reference designations for inductors and capacitors.

[0043] In operation 104, based on the connection component information, a second set of components that meet the first set conditions is selected from the motherboard component information. The components in the second set are inductors or capacitors connected to the components in the first set of components.

[0044] In this embodiment of the invention, the following operations can be used to filter a second set of components that meet the first set of conditions from the motherboard component information based on the connection component information; obtain the reference numbers of the inductors and capacitors in the connection component information; match the reference numbers of the inductors and capacitors in the connection component information with the motherboard component information to determine the inductor whose reference number is phase connected to the other end of the inductor in the connection component information, and determine the capacitor whose reference number is GND byte connected to the other end of the capacitor in the connection component information, as the second set of components.

[0045] In this embodiment of the invention, the net name connected to the other end of the component shown in the connection element information can be obtained from the motherboard component information by using the component number in the connection element information obtained in operation 102 as an index. Figure 3 This diagram illustrates a network under test containing information such as component reference numbers, as shown in an embodiment of the present invention. For example, based on the connection component information shown in data C above, the net name connected to the other end of the component shown in the connection component information is found in data B, and byte matching is performed to obtain a second set of components that meets the first set condition. The components in the second set are inductors or capacitors connected to the components in the first set of components.

[0046] For example, the inductor and capacitor information obtained in operation 102, along with their reference designations, component models, and pad coordinates, is saved as data D. Since inductors and capacitors are components with two pads, the reference designation can be used as an index to find the net name connected to the other end of the inductor and capacitor components in data D in data B, and byte matching can be performed. For inductors, components whose reference designation is at the other end of the "phase" byte are selected. For capacitors, the other end of the output capacitor should be GND. Therefore, components whose reference designation is at the other end of the "GND" byte are selected, eliminating feedback capacitors and other inductors and capacitors, resulting in inductors and capacitors that meet the first set of conditions, which are used as the second set of components. This set can also be saved as data E.

[0047] In operation 105, a set of capacitors whose distance from the inductors in the second set of components meets the second set of preset conditions is determined.

[0048] In this embodiment of the invention, the following operations can be used to determine the set of capacitors whose distance from the inductors in the second set of components meets the second set of preset conditions: obtain the inductor coordinates in the second set of components and construct a planar model; based on the planar model, determine the set of capacitors whose distance from the inductors in the second set of components is less than the maximum acceptable design distance between the capacitor and the inductor.

[0049] refer to Figure 4 The diagram shows the distances between multiple capacitors and one inductor. A planar model can be established based on the inductor and capacitor pad coordinates in data E. The distance between each capacitor and the inductor pad can be calculated based on the established planar model. Assuming the inductor output pad coordinates are (a, b) and the capacitor coordinates are (X, Y), the set of capacitors satisfying the second set condition can be obtained using the following formula (1).

[0050] (Xa)²+(Yb)²≤N²(1)

[0051] Where N is the maximum acceptable design distance between the capacitor and the inductor.

[0052] Here, the capacitor that meets the conditions can be saved as data F. If a capacitor that meets the above formula (1) is not obtained based on a value of N, the value of N can be increased and the calculation repeated until a capacitor that meets the second set condition is obtained.

[0053] In operation 106, the capacitors in the capacitor set are prioritized according to the distance between the capacitor pads and the inductors, and the capacitor sorting result is obtained.

[0054] In this embodiment of the invention, the capacitor sorting result can be obtained by the following operations: selecting capacitors in the capacitor set whose pad model is greater than a first set value; sorting the selected capacitors according to the distance between the capacitor pad and the inductor to obtain a first sorting result; sorting the capacitors in the capacitor set whose pad model is the first set value according to the distance between the capacitor pad and the inductor to obtain a second sorting result.

[0055] Specifically, whether selecting test points or load points, the selected load points and test points must be convenient for the robotic arm to perform point testing. The size of the pads has a significant impact on the robotic arm's testing capabilities. Therefore, based on the pad size, the capacitors in data F can be divided into two categories: one category with pad model numbers greater than 0201, and the other category with pad model number 0201. Capacitors with pad model numbers greater than 0201 can be sorted according to their distance from the inductor pad. For capacitor pads located on different PCB layers from the inductor pads, an infinite number can be added to the coordinates of that capacitor pad.

[0056] In operation 107, based on the capacitor sorting results, the load point priority and test point priority of each capacitor in the capacitor set as a load point are determined.

[0057] In this embodiment of the invention, the following operations can be used to determine the load point priority and test point priority of each capacitor in the capacitor set as a load point: The capacitors are sorted sequentially according to the order of distance between the capacitor pads and inductors from farthest to closest in the first sorting result and the order of distance between the capacitor pads and inductors from farthest to closest in the second sorting result, which is the sorting result of load point priority from high to low; the capacitors are also sorted sequentially according to the order of distance between the capacitor pads and inductors from closest to farthest in the first sorting result and the order of distance between the capacitor pads and inductors from closest to farthest in the second sorting result, which is the sorting result of test point priority from high to low.

[0058] Specifically, during the testing of electronic equipment, the furthest point of the load is considered the optimal point, and the closest point of the test is considered the optimal point. Here, multiple capacitors can be prioritized based on this principle: the furthest point of the load is considered the optimal point, and the closest point of the test is considered the optimal point.

[0059] For example, when determining the load point priority, capacitors with pad model greater than 0201 can be sorted first according to the distance between the capacitor pad and the inductor from farthest to closest. Then, capacitors with pad model 0201 can be sorted according to the distance between the capacitor pad and the inductor from farthest to closest. The complete sorting result is used as the load point priority sorting result from high to low.

[0060] When determining the order of test points, capacitors with pad model greater than 0201 can be sorted first according to the distance between the capacitor pad and the inductor from near to far. Then, capacitors with pad model 0201 can be sorted according to the distance between the capacitor pad and the inductor from near to far. The complete sorting result can be used as the sorting result of test point priority from high to low.

[0061] In the method, apparatus, and electronic device for determining test points in electronic devices according to embodiments of the present invention, motherboard component information and connection component information connected to the network under test (DUT) of the electronic device's motherboard are obtained. A first set of components connected to the DUT is determined, including capacitors and inductors. A second set of components meeting a first set of conditions is then selected from the motherboard component information based on the connection component information. The components in the second set are inductors or capacitors connected to components in the first set. Further, a set of capacitors whose distance from the inductors in the second set meets a second set of conditions is determined. The capacitors in the capacitor set are prioritized based on the distance between the capacitor pads and the inductors, resulting in a capacitor ranking. Based on the capacitor ranking, the load point priority and test point priority of each capacitor in the capacitor set are determined. This automatically generates test points and load points, enabling automatic selection of test points during the testing of the electronic device, thus achieving automated testing. This effectively avoids problems such as differences in test point selection due to differences in experience among testers and the resulting lack of rigorous test quality.

[0062] Similarly, based on the above-described method for determining test points in electronic devices, this embodiment of the invention also provides a computer-readable storage medium storing a program. When the program is executed by a processor, the processor performs at least the following steps: Operation 101, obtaining motherboard component information of the motherboard of the electronic device to which the network under test belongs; Operation 102, obtaining connection component information connected to the network under test; Operation 103, determining a first set of components connected to the network under test, the first set of components including capacitors and inductors; Operation 104, filtering a second set of components from the motherboard component information that meets a first set of conditions based on the connection component information, the components in the second set being inductors or capacitors connected to components in the first set of components; Operation 105, determining a set of capacitors whose distance from the inductors in the second set of components meets a second set of conditions; Operation 106, prioritizing the capacitors in the capacitor set based on the distance between the capacitor pads and the inductors, obtaining a capacitor sorting result; Operation 107, determining the load point priority and test point priority of each capacitor in the capacitor set as a load point based on the capacitor sorting result.

[0063] Furthermore, based on the above-described method for determining test points in electronic devices, this embodiment of the invention also provides a device for determining test points in electronic devices, such as... Figure 5The device 50 includes: a first acquisition module 501, used to acquire motherboard component information of the electronic device motherboard to which the network under test belongs; a second acquisition module 502, used to acquire connection component information connected to the network under test; a matching module 503, used to determine a first set of components connected to the network under test, the first set of components including capacitors and inductors; a filtering module 504, used to filter a second set of components that meet a first set of conditions from the motherboard component information based on the connection component information, the components in the second set of components being inductors or capacitors connected to components in the first set of components; a calculation module 505, used to determine a set of capacitors whose distance from the inductors in the second set of components meets a second set of conditions; a sorting module 506, used to prioritize the capacitors in the set of capacitors based on the distance between the capacitor pads and the inductors, and obtain a capacitor sorting result; and a determination module 507, used to determine the load point priority and test point priority of each capacitor in the set as a load point based on the capacitor sorting result.

[0064] In this embodiment of the invention, the second acquisition module 501 includes: an identification submodule for acquiring the network identifier of the network under test; and an information determination submodule for determining the connection element information based on the network identifier and a preset schematic diagram set.

[0065] In this embodiment of the invention, the matching module 503 includes a byte matching submodule, used to determine a first set of components in the motherboard component information that includes a preset component number.

[0066] In this embodiment of the invention, the filtering module 504 includes: acquiring elements that match the set keyword section; determining the element number that matches the set keyword section; and determining a first set of elements based on the determined element number.

[0067] In this embodiment of the invention, the filtering module 504 includes: a tag number acquisition submodule, used to acquire the tag numbers of inductors and capacitors in the connection element information; and a filtering submodule, used to match the tag numbers of inductors and capacitors in the connection element information with the motherboard component information, determine the inductor whose tag number is phase connected to the other end of the inductor in the connection element information, and determine the capacitor whose tag number is GND byte connected to the other end of the capacitor in the connection element information, as the second component set.

[0068] In this embodiment of the invention, the calculation module 505 includes: a model building submodule, used to obtain the inductor coordinates of the inductors in the second element set and build a planar model; and a calculation submodule, used to determine, based on the planar model, a set of capacitors whose distance from the inductors in the second element set is less than the maximum acceptable design distance between the capacitors and the inductors.

[0069] In this embodiment of the invention, the sorting module 506 includes: a pad model submodule, used to select capacitors in the capacitor set whose pad model is greater than a first set value; a first sorting submodule, used to sort the selected capacitors according to the distance between the capacitor pads and the inductors to obtain a first sorting result; and a second sorting submodule, used to sort the capacitors in the capacitor set whose pad model is the first set value according to the distance between the capacitor pads and the inductors to obtain a second sorting result.

[0070] In this embodiment of the invention, the determining module 507 includes: a first determining submodule, used to sort the capacitor pads and inductors in the order of distance from farthest to closest in the first sorting result and in the order of distance from farthest to closest in the second sorting result, as a sorting result of load point priority from high to low; and a second determining submodule, used to sort the capacitor pads and inductors in the order of distance from nearest to farthest in the first sorting result and in the order of distance from nearest to farthest in the second sorting result, as a sorting result of test point priority from high to low.

[0071] Furthermore, based on the above-described method for determining test points in electronic devices, embodiments of the present invention also provide a device, such as... Figure 6 As shown, the device 60 includes at least one processor 601, and at least one memory 602 and bus 603 connected to the processor 601; wherein the processor 601 and the memory 602 communicate with each other through the bus 603; the processor 601 is used to call program instructions in the memory 602 to execute the above-mentioned electronic device test point determination method.

[0072] It should be noted here that the above description of the device and equipment embodiments for determining test points of electronic devices is consistent with the foregoing Figures 1 to 4 The method embodiments shown are described similarly and have the same characteristics as described above. Figures 1 to 4 The beneficial effects of the methods illustrated are similar and will not be described in detail here. For technical details not disclosed in the embodiments of the electronic device test point determination apparatus and equipment of the present invention, please refer to the foregoing description of the present invention. Figures 1 to 4 The method embodiments shown are for understanding purposes only and will not be described in detail here for the sake of brevity.

[0073] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0074] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be electrical, mechanical, or other forms.

[0075] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units. They may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of this embodiment according to actual needs.

[0076] In addition, in the various embodiments of the present invention, each functional unit can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; the integrated unit can be implemented in hardware or in the form of hardware plus software functional units.

[0077] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media that can store program code, such as mobile storage devices, read-only memory (ROM), magnetic disks, or optical disks.

[0078] Alternatively, if the integrated units of this invention are implemented as software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this invention, or the parts that contribute to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, ROMs, magnetic disks, or optical disks.

[0079] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for determining test points in electronic devices, characterized in that, The method includes: Obtain the motherboard component information of the electronic device to which the network under test belongs; Obtain information about the connection elements connected to the network under test; A first set of components connected to the network under test is determined, the first set of components including capacitors and inductors; Based on the connection element information, a second set of elements that meets the first set of conditions is selected from the motherboard element information. The elements in the second set of elements are inductors or capacitors connected to the elements in the first set of elements. Determine the set of capacitors whose distance from the inductors in the second set of components meets the second set of preset conditions; Based on the distance between the capacitor pads and the inductors, the capacitors in the capacitor set are prioritized to obtain the capacitor sorting result; Based on the capacitor sorting results, determine the load point priority and test point priority of each capacitor in the capacitor set as a load point and as a test point. The process of prioritizing the capacitors in the capacitor set based on the distance between the capacitor pads and the inductors to obtain the capacitor ranking result includes: Select capacitors from the capacitor set whose pad model is greater than a first set value; The selected capacitors are sorted according to the distance between the capacitor pads and the inductors to obtain the first sorting result; The capacitors with pad models of the first set value in the capacitor set are sorted according to the distance between the capacitor pads and the inductors to obtain a second sorting result; The capacitor sorting result determines the load point priority and test point priority of each capacitor in the capacitor set as a load point, including: The load points are sorted in descending order of priority based on the order of distance between the capacitor pads and inductors from farthest to closest in the first sorting result and the order of distance between the capacitor pads and inductors from farthest to closest in the second sorting result. The test points are sorted in descending order of priority based on the order of distance between the capacitor pads and inductors from closest to furthest in the first sorting result and the order of distance between the capacitor pads and inductors from closest to furthest in the second sorting result.

2. The method according to claim 1, characterized in that, The acquisition of connection element information connected to the network under test includes: Obtain the network identifier of the network under test; The connection element information is determined based on the network identifier and the preset schematic set.

3. The method according to claim 1, characterized in that, The determination of the first set of elements connected to the network under test includes: The motherboard component information is determined to include a first set of components with preset component reference numbers.

4. The method according to claim 1, characterized in that, The first set of elements to be connected to the network under test includes: Retrieves the element that matches the specified keyword section; Determine the component reference number that matches the specified keyword section; The first set of components is determined based on the determined component reference number.

5. The method according to claim 1, characterized in that, The step of filtering a second set of components that meet the first set of conditions from the motherboard component information based on the connection component information includes: Obtain the reference numbers of the inductor and capacitor from the connection element information; The inductor and capacitor bit numbers in the connection element information are matched with the motherboard component information to determine the inductor with the bit number "phase" connected to the other end of the inductor in the connection element information, and the capacitor with the bit number "GND" connected to the other end of the capacitor in the connection element information, which are then used as the second component set.

6. The method according to claim 1, characterized in that, The determination of the set of capacitors whose distance from the inductors in the second set of components meets the second preset condition includes: Obtain the inductance coordinates of the inductors in the second element set and construct a planar model; Based on the planar model, determine the set of capacitors whose distance from the inductors in the second set of components is less than the maximum acceptable design distance between the capacitors and the inductors.

7. A device for determining test points of electronic equipment, characterized in that, The device includes: The first acquisition module is used to acquire motherboard component information of the electronic device motherboard to which the network under test belongs; The second acquisition module is used to acquire information about the connection elements connected to the network under test; A matching module is used to determine a first set of components connected to the network under test, the first set of components including capacitors and inductors; The filtering module is used to filter a second set of components that meet a first set of conditions from the motherboard component information based on the connection component information. The components in the second set of components are inductors or capacitors connected to the components in the first set of components. A calculation module is used to determine the set of capacitors whose distance from the inductors in the second set of elements meets a second set of predetermined conditions; The sorting module is used to sort the capacitors in the capacitor set according to the distance between the capacitor pads and the inductors, and obtain the capacitor sorting result. The determination module is used to determine the load point priority and test point priority of each capacitor in the capacitor set as a load point and as a test point, based on the capacitor sorting result. The sorting module includes: a pad model submodule, used to select capacitors in the capacitor set whose pad model is greater than a first set value; a first sorting submodule, used to sort the selected capacitors according to the distance between the capacitor pads and the inductors to obtain a first sorting result; and a second sorting submodule, used to sort the capacitors in the capacitor set whose pad model is the first set value according to the distance between the capacitor pads and the inductors to obtain a second sorting result. The determining module includes: a first determining submodule, used to sort the capacitor pads and inductors in the order of distance from farthest to closest in the first sorting result and in the order of distance from farthest to closest in the second sorting result, as a sorting result of load point priority from high to low; and a second determining submodule, used to sort the capacitor pads and inductors in the order of distance from nearest to farthest in the first sorting result and in the order of distance from nearest to farthest in the second sorting result, as a sorting result of test point priority from high to low.

8. An apparatus, the apparatus comprising at least one processor, and at least one memory and a bus connected to the processor; wherein, The processor and the memory communicate with each other via the bus; The processor is used to invoke program instructions in the memory to execute the electronic device test point determination method according to any one of claims 1-6.

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