Multilayer electronic component

Abstract

Disclosed is a multilayer electronic component. The multilayer electronic component includes a capacitor including a main body, a first outer electrode and a second outer electrode disposed on the main body, the main body including dielectric layers and first and second inner electrodes alternately disposed with the dielectric layers interposed between the first and second inner electrodes, a first metal frame disposed on the first outer electrode of the capacitor, and a second metal frame disposed on the second outer electrode of the capacitor. W > L, where L is a size of the capacitor in a second direction, W is a size of the capacitor in a third direction, and the first and second metal frames include a support portion in contact with the first and second outer electrodes, an extension portion extending from the support portion in a first direction and disposed to be spaced apart from the main body, the first outer electrode, and the second outer electrode, and a mounting portion extending from one end of the extension portion in the second direction.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2021-0167519, filed November 29, 2021, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The disclosure relates to a multilayer electronic component. BACKGROUND

[0003] A multilayer ceramic capacitor (MLCC), which is a kind of multilayer electronic component, is a chip capacitor mounted on a printed circuit board of various electronic products, such as display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, mobile phones, etc., to allow charging or discharging thereof.

[0004] Such an MLCC having advantages such as compactness, securing high capacitance, and ease of mounting can be used as a component of various electronic devices.

[0005] Recently, the demand for MLCCs required for in-vehicle power driving systems and infotainment systems in the field of environmentally friendly vehicles and electric vehicles is also increasing.

[0006] For high-temperature, high-vibration, and high-pressure environments of automobiles, multilayer electronic components including MLCCs applied to automobiles need to have high levels of thermal reliability and electrical reliability.

[0007] Accordingly, the demand for multilayer electronic components having strong resistance to external vibration and deformation and strong electrical reliability has increased.

[0008] As the use environment of the multilayer electronic component becomes severe, cracks can occur due to vibration or mechanical deformation of the mounting board. When the multilayer electronic component according to the related art is mounted on a substrate, the main body of the multilayer electronic component is in direct contact with the substrate through solder, so that heat or mechanical deformation generated in the substrate or an adjacent component can be directly transmitted to the multilayer electronic component, and thus, it is difficult to secure high levels of reliability.

[0009] Accordingly, recently, a method of securing a gap between a multilayer ceramic capacitor and a mounting substrate by coupling a metal frame to a side surface of the multilayer ceramic capacitor has been proposed, so that thermal stress and mechanical stress are not directly transmitted from the substrate to the multilayer ceramic capacitor.

[0010] However, since the metal frame has a certain thickness and is coupled to a conductive portion such as an external electrode, the current path is increased, and in turn, the equivalent series inductance (ESL) is increased.

[0011] Accordingly, there is a need for a multilayer electronic component that can achieve a low ESL while protecting a multilayer ceramic capacitor from thermal stress and mechanical stress transmitted from a substrate. SUMMARY

[0012] An aspect of the disclosure is to address the problem of heat deformation or mechanical deformation generated in a substrate being transmitted to a capacitor.

[0013] Another aspect of the disclosure is to address the problem of an equivalent series inductance (ESL) increasing when a metal frame is combined to a capacitor.

[0014] However, the disclosure is not limited to the above and will be more readily understood in describing specific exemplary embodiments of the disclosure.

[0015] According to an aspect of the disclosure, a multilayer electronic component includes a capacitor including a main body including dielectric layers and first and second internal electrodes alternately disposed between the dielectric layers, a first external electrode disposed on a third surface of the main body, and a second external electrode disposed on a fourth surface of the main body, a first metal frame disposed on the first external electrode of the capacitor, and a second metal frame disposed on the second external electrode of the capacitor, wherein L is a size of the capacitor in a second direction, W is a size of the capacitor in a third direction, and the first and second metal frames include a support portion in contact with the first and second external electrodes, an extension portion extending from the support portion in the first direction and disposed to be spaced apart from the main body, the first external electrode, and the second external electrode, and a mounting portion extending from one end of the extension portion in the second direction. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above and other aspects, features, and advantages of the disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a perspective view schematically illustrating a main body according to an exemplary embodiment in the disclosure;

[0018] Figure 2 is a perspective view schematically illustrating a capacitor according to an exemplary embodiment in the disclosure;

[0019] Figure 3 is a cross-sectional view taken along the line I-I' of Figure 2

[0020] Figure 4 is a perspective view schematically illustrating a multilayer electronic component according to a comparative example;

[0021] Figure 5 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0022] Figure 6 is a cross-sectional view taken along the line II-II' of Figure 5

[0023] Figure 7 is a graph showing impedance values of a multilayer electronic component according to an exemplary embodiment in the present disclosure and a multilayer electronic component according to a comparative example with respect to frequency;

[0024] Figure 8 is a perspective view schematically illustrating a variant example 1 of a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0025] Figure 9 is a perspective view schematically illustrating a variant example 2 of a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0026] Figure 10 is a perspective view schematically illustrating a variant example 3 of a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0027] Figure 11 is a perspective view schematically illustrating a variant example 4 of a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0028] Figure 12 is a perspective view schematically illustrating a variant example 5 of a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0029] Figure 13 is a perspective view schematically illustrating a variant example 6 of a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0030] Figure 14 is a perspective view schematically illustrating a variant example 7 of a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0031] Figure 15 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment in the present disclosure;

[0032] ​​Figure 16 This is a perspective view schematically illustrating a multilayer electronic assembly according to exemplary embodiments of the present disclosure;

[0033] Figure 17 This is a perspective view schematically illustrating a multilayer electronic assembly according to exemplary embodiments of the present disclosure;

[0034] Figure 18 This is a perspective view schematically illustrating a multilayer electronic assembly according to exemplary embodiments of the present disclosure; and

[0035] Figure 19 This is a perspective view schematically illustrating a multilayer electronic assembly according to exemplary embodiments of the present disclosure. Detailed Implementation

[0036] Exemplary embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0037] In the accompanying drawings, the first direction can be defined as the stacking direction or the thickness direction, the second direction can be defined as the length direction, and the third direction can be defined as the width direction.

[0038] Multilayer electronic assembly

[0039] Figure 1 This is a perspective view schematically showing the body 110 of a capacitor 100 according to an exemplary embodiment of the present disclosure.

[0040] Figure 2 This is a perspective view schematically showing a capacitor 100 according to an exemplary embodiment of the present disclosure.

[0041] Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0042] Figure 4 This is a schematic perspective view of a multilayer electronic assembly 2000 according to a comparative example.

[0043] Figure 5 This is a perspective view schematically illustrating a multilayer electronic assembly 1000 according to an exemplary embodiment of the present disclosure.

[0044] Figure 6 It is along Figure 5 The cross-sectional view taken from line II-II'.

[0045] In the following text, reference will be made to Figures 1 to 6 A detailed description of a multilayer electronic assembly 1000 according to exemplary embodiments of the present disclosure.

[0046] The multilayer electronic component 1000 according to the exemplary embodiments in the present disclosure can include a capacitor having a main body including dielectric layers 111 and first and second internal electrodes 121 and 122 alternately disposed with the dielectric layers 111 interposed between the first and second internal electrodes 121 and 122, and having first and second surfaces 1 and 2 opposite to each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and opposite to each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first, second, third, and fourth surfaces and opposite to each other in a third direction.

[0047] Figure 1 FIG. 1 is a perspective view schematically illustrating a capacitor 100 according to an exemplary embodiment in the present disclosure.

[0048] In the main body 110, the dielectric layers 111 and the first and second internal electrodes 121 and 122 are alternately stacked.

[0049] The specific shape of the main body 110 is not limited, but as shown in FIG. 1, the main body 110 can have a hexahedral shape or a similar shape. Due to the shrinkage of ceramic powder particles contained in the main body 110 during sintering, the main body 110 can not have a hexahedral shape with perfect straight lines, but substantially have a hexahedral shape. Figure 1

[0050] The main body 110 can have first and second surfaces 1 and 2 opposite to each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and opposite to each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2, connected to the third and fourth surfaces 3 and 4, and opposite to each other in a third direction.

[0051] The plurality of dielectric layers 111 forming the main body 110 are in a sintered state, and adjacent dielectric layers 111 can be integrated such that it can be difficult to identify the boundary therebetween without using a scanning electron microscope (SEM).

[0052] The material used to form the dielectric layers 111 is not limited as long as a sufficient electrostatic capacitance can be obtained therewith. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material can include BaTiO3-based ceramic powder particles, and the ceramic powder particles can include BaTiO3and (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x ​Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3.

[0053] According to the purpose of the disclosure, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powder particles such as barium titanate (BaTiO3) as a material for forming the dielectric layer 111.

[0054] Referring to Figure 3 , the main body 110 can include a capacitor formation portion disposed inside the main body 110 and forming a capacitor by including a first internal electrode 121 and a second internal electrode 122 disposed to face each other with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed on upper and lower surfaces of the capacitor formation portion.

[0055] In addition, the capacitor formation portion is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0056] The cover portions 112 and 113 can include an upper cover portion 112 disposed above the capacitor formation portion in the first direction and a lower cover portion 113 disposed below the capacitor formation portion in the first direction.

[0057] The upper cover portion 112 and the lower cover portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor formation portion in the thickness direction, respectively, and the upper cover portion 112 and the lower cover portion 113 can be mainly used to prevent the internal electrodes from being damaged due to physical or chemical stress.

[0058] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes, and can include the same material as that of the dielectric layer 111.

[0059] The thickness tc of the upper cover portion 112 and the lower cover portion 113 does not need to be particularly limited, and the thickness tc of the upper cover portion 112 and the lower cover portion 113 can be adjusted to prevent the internal electrodes from being damaged.

[0060] The internal electrodes 121 and 122 can be alternately disposed with the dielectric layer 111.

[0061] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 can be alternately disposed to face each other with the dielectric layer 111 of the main body 110 interposed therebetween, and the first internal electrode 121 and the second internal electrode 122 can be in contact with the first external electrode 131 and the second external electrode 132, respectively, disposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0062] Referring to Figure 3 , the first internal electrode 121 can be spaced apart from the fourth surface 4 and can be in contact with the first external electrode 131 on the third surface 3, and the second internal electrode 122 can be spaced apart from the third surface 3 and can be in contact with the second external electrode 132 on the fourth surface 4.

[0063] Here, the first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0064] The main body 110 can be formed by stacking a ceramic green sheet on which a conductive paste for the first internal electrode 121 is printed and a ceramic green sheet on which a conductive paste for the second internal electrode 122 is printed and then sintering the stack.

[0065] The conductive metal included in the internal electrodes 121 and 122 can be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but the present disclosure is not limited thereto.

[0066] In addition, the internal electrodes 121 and 122 can be formed by printing a conductive paste on a ceramic green sheet, and a screen printing method or a gravure printing method can be used as a method of printing a conductive paste for the internal electrodes, but the present disclosure is not limited thereto.

[0067] The capacitor 100 according to an exemplary embodiment in the present disclosure can include a first external electrode 131 and a second external electrode 132 disposed on the main body 110.

[0068] Referring to Figure 3 , the first external electrode 131 can be in contact with the first internal electrode 121 on the third surface 3, and the second external electrode 132 can be in contact with the second internal electrode 122 on the fourth surface 4. Accordingly, the first external electrode 131 can be disposed on the third surface 3 of the main body 110, and the second external electrode 132 can be disposed on the fourth surface 4 of the main body 110.

[0069] The first external electrode 131 and the second external electrode 132 can be formed with a material that can have electrical conductivity, such as metal, and a specific material can be determined in consideration of electrical properties and structural stability, and in addition, the first external electrode 131 and the second external electrode 132 can be disposed on a plurality of surfaces of the main body 110.

[0070] For example, the first external electrode 131 can be disposed on the third surface 3 and extend to a portion of at least one of the first surface 1 and the second surface 2, and the second external electrode 132 can be disposed on the fourth surface 4 and extend to a portion of at least one of the first surface 1 and the second surface 2.

[0071] However, the present disclosure is not limited thereto, and the first external electrode 131 can be disposed on the third surface 3 and extend to a portion of at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the main body 110, and the second external electrode 132 can be disposed on the fourth surface 4 and extend to a portion of at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the main body 110.

[0072] Accordingly, the first external electrode 131 can be in contact with the first internal electrode 121 on the third surface 3, and the second external electrode 132 can be in contact with the second internal electrode 122 on the fourth surface 4.

[0073] According to the above-described configuration, when a predetermined voltage is applied to the first external electrode 131 and the second external electrode 132, electric charges are accumulated between the first internal electrode 121 and the second internal electrode 122.

[0074] In this case, the capacitance of the capacitor 100 is proportional to an area in which the first internal electrode 121 and the second internal electrode 122 are stacked with each other in the stacking direction in the capacitance forming portion.

[0075] Referring to Figure 5 and Figure 6 The multilayer electronic assembly 1000 according to the exemplary embodiment in the present disclosure can include a first metal frame 141 disposed on the first external electrode 131 of the capacitor 100 and a second metal frame 142 disposed on the second external electrode 132 of the capacitor 100 to secure a gap between the capacitor 100 and a substrate (not shown) and prevent stress from being directly transmitted from the substrate to the capacitor 100, thereby improving thermal reliability, mechanical reliability, and resistance to bending deformation of the multilayer electronic assembly 1000.

[0076] The first metal frame 141 and the second metal frame 142 can include support portions 141a and 142a, extension portions 141b and 142b, and mounting portions 141c and 142c.

[0077] In this case, by including a conductive adhesive portion (not shown) between the first and second outer electrodes 131 and 132 and the support portions 141a and 142a, the electrical and physical connectivity between the first outer electrode 131 and the first metal frame 141 and between the second outer electrode 132 and the second metal frame 142 can be further improved.

[0078] The conductive adhesive portion can be formed using a high-temperature solder or a conductive bonding material, but the present disclosure is not limited thereto.

[0079] In addition, in order to more firmly bond the support portions 141a and 142a of the first and second metal frames 141 and 142 to the first and second outer electrodes 131 and 132, the metal frames 141 and 142 can further include a support portion extending from the support portions 141a and 142a to a portion of at least one of the first surface, the second surface, the fifth surface, and the sixth surface.

[0080] The support portion 141a is a portion in contact with the first outer electrode 131 and can electrically and physically connect the first outer electrode 131 and the first metal frame 141 to each other, and the support portion 142a is a portion in contact with the second outer electrode 132 and can electrically and physically connect the second outer electrode 132 and the second metal frame 142 to each other.

[0081] The extension portions 141b and 142b can extend from the support portions 141a and 142a in the first direction and can be disposed to be spaced apart from the main body 110 and the first and second outer electrodes 131 and 132.

[0082] Therefore, since the metal frames 141 and 142 include the extension portions 141b and 142b, the capacitor 100 can be disposed to be spaced apart from the mounting surface, so that vibrations generated by piezoelectric phenomena in the capacitor can be reduced to reduce acoustic noise.

[0083] The mounting portions 141c and 142c can be disposed to extend from one end of the extension portions 141b and 142b in the second direction (e.g., toward each other). The first and second mounting portions 141c and 142c can be disposed to extend from one end of the first and second extension portions 141b and 142b toward each other in the second direction, respectively.

[0084] Therefore, the multilayer electronic package 1000 can be stably mounted on the substrate to increase the adhesion strength of the multilayer electronic package 1000, while heat or vibrations transmitted from the substrate can be absorbed to reduce the likelihood of damaging the capacitor 100.

[0085] In addition, the material of the metal frame is not particularly limited.

[0086] In accordance with the embodiments of the present disclosure, Figure 4In the comparative example of the multilayer electronic component 2000, the size L of the capacitor 100' in the second direction is greater than the size W of the capacitor 100' in the third direction.

[0087] In the related art, an attempt has been made as in the multilayer electronic component 2000 according to the comparative example: the first metal frame 141' and the second metal frame 142' are respectively disposed on the first external electrode 131' and the second external electrode 132' of the capacitor 100', so that stress is not directly transmitted from the substrate to the capacitor 100'.

[0088] However, since the size L of the capacitor 100' in the second direction is greater than the size W of the capacitor 100' in the third direction, the current path is increased, so that it is difficult to reduce the equivalent series inductance (ESL), and thus the capacitor 100' has a high impedance value at a high frequency.

[0089] In addition, when the metal frames 141' and 142' are disposed on the capacitor 100', this problem further increases the current path, and as a result, the multilayer electronic component 2000 has a high impedance value at a high frequency.

[0090] Referring to Figure 2 In the capacitor 100 according to the exemplary embodiment in the disclosure, when the size of the capacitor 100 in the second direction is L and the size of the capacitor 100 in the third direction is W, W > L can be satisfied.

[0091] Accordingly, the distance between the external electrodes 131 and 132 in the second direction can be narrowed to reduce the current path, thereby reducing the ESL of the capacitor 100 and enabling the capacitor 100 to have a low impedance value at a high frequency.

[0092] In addition, in the capacitor 100 according to the exemplary embodiment in the disclosure, which satisfies W > L, the lengths of the external electrodes 131 and 132 in contact with the substrate can be increased, thereby causing a problem in which the possibility of damage to the capacitor 100 due to deformation of the substrate is increased.

[0093] Referring to Figure 5 The multilayer electronic component 1000 according to the exemplary embodiment in the disclosure can include a first metal frame 141 disposed on a first external electrode 131 of a capacitor 100 and a second metal frame 142 disposed on a second external electrode 132 of the capacitor 100.

[0094] Accordingly, the first metal frame 141 and the second metal frame 142 can inhibit the thermal deformation or mechanical deformation generated in the substrate from being directly transmitted to the capacitor 100, thereby improving the durability of the capacitor 100 with respect to the mounting substrate.

[0095] Figure 7is a graph showing impedance values of the multilayer electronic component 1000 according to an example embodiment in the present disclosure and the multilayer electronic component 2000 according to a comparative example with respect to frequency.

[0096] Specifically, in the multilayer electronic component 1000 according to the example embodiment, W is 20 μm, L is 12 μm, and W / L is 1.67, which satisfies W > L.

[0097] In contrast, in the comparative example, W is 12 μm, L is 20 μm, and W / L is 0.60, which does not satisfy W > L.

[0098] In the case of the example embodiment, the impedance module at 100 MHz corresponds to 0.05 Ω, and in the case of the comparative example, the impedance module at 100 MHz corresponds to 0.13 Ω, and thus it can be seen that the impedance module of the example embodiment is smaller than that of the comparative example in a high frequency region.

[0099] Therefore, in the multilayer electronic component 1000 according to the example embodiment in the present disclosure, since W > L is satisfied, ESL can be reduced by reducing a current path, thereby providing a multilayer electronic component having low impedance.

[0100] In the case where the multilayer electronic component includes a metal frame, vibration and heat of the substrate are transmitted to the capacitor through the metal frame.

[0101] In addition, when bending occurs in the substrate, the mounting portion where the substrate and the metal frame contact each other can also be bent due to the bending stress.

[0102] In addition, if the size W of the capacitor 100 of the multilayer electronic component 1000 in the third direction is increased to reduce ESL, the length or area where the metal frame contacts the substrate is also increased, resulting in the problem that deformation of the multilayer electronic component 1000 increases due to bending of the substrate.

[0103] Therefore, there is a need for a multilayer electronic component including a metal frame that reduces a current path to reduce ESL, protects a capacitor from thermal and mechanical stresses transmitted from a substrate along the metal frame, and has robustness against deformation due to substrate bending.

[0104] Hereinafter, various modifications of the multilayer electronic component 1000 according to the example embodiment in the present disclosure will be described, but a description that is repetitive of the description of the multilayer electronic component 1000 according to the example embodiment in the present disclosure will be omitted.

[0105] Modification Example 1

[0106] Figure 8is a perspective view schematically illustrating a multilayer electronic assembly 1001 of variation example 1 of the multilayer electronic assembly 1000 according to an exemplary embodiment of the present disclosure.

[0107] Referring to Figure 8 , the multilayer electronic assembly 1001 of variation example 1 of the multilayer electronic assembly 1000 according to an exemplary embodiment of the present disclosure can include a first metal frame 141-1 and a second metal frame 142-1 disposed on the outer electrodes 131 and 132.

[0108] The first metal frame 141-1 and the second metal frame 142-1 can include support portions 141a-1 and 142a-1, extension portions 141b-1 and 142b-1, and mounting portions 141c-1 and 142c-1.

[0109] In this case, the extension portions 141b-1 and 142b-1 can have two parts disposed apart in the third direction. Accordingly, the extension portions 141b-1 and 142b-1 can have a shape that is divided apart in the third direction with a space therebetween. Accordingly, since the transmission of heat and vibration occurring in the substrate is blocked by the space between the extension portions 141b-1 and 142b-1, the multilayer electronic assembly 1001 can be effectively protected from the heat and vibration of the substrate.

[0110] In an exemplary embodiment, the mounting portions 141c-1 and 142c-1 can have two parts disposed apart in the third direction. Accordingly, the mounting portions 141c-1 and 142c-1 can have a shape that is divided apart in the third direction with a space therebetween. Accordingly, when bending occurs in the substrate, the bending stress directly transmitted to the multilayer electronic assembly 1001 is suppressed, thereby improving the bending strength of the multilayer electronic assembly 1001.

[0111] Variation Example 2

[0112] Figure 9 is a perspective view schematically illustrating a multilayer electronic assembly 1002 of variation example 2 of the multilayer electronic assembly 1000 according to an exemplary embodiment of the present disclosure.

[0113] In the case of a multilayer electronic assembly using a metal frame, if the metal frame is deviated in position and direction from the regular position on design when mounted on a substrate, the end of the mounting portion of the metal frame can contact another pad pattern adjacent thereto, thereby causing a short defect between the assemblies.

[0114] Referring to Figure 9 , the multilayer electronic assembly 1002 of variation example 2 of the multilayer electronic assembly 1000 according to an exemplary embodiment of the present disclosure can include a first metal frame 141-2 and a second metal frame 142-2 disposed on the outer electrodes 131 and 132.

[0115] The first and second metal frames 141-2 and 142-2 can include support portions 141a-2 and 142a-2, extension portions 141b-2 and 142b-2, and mounting portions 141c-2 and 142c-2.

[0116] In an exemplary embodiment, the extension portions 141b-2 and 142b-2 can have a size in the third direction that is smaller than a size of the support portions 141a-2 and 142a-2 in the third direction. Accordingly, an area through which heat and vibrations of the substrate are transferred can be reduced, thereby effectively protecting the multilayer electronic component 1002 from the heat and vibrations of the substrate.

[0117] In this case, the mounting portions 141c-2 and 142c-2 can have a size in the third direction that is substantially the same as a size of the extension portions 141b-2 and 142b-2 in the third direction. In one example, the first size being substantially the same as the second size can mean that the first size and the second size are exactly the same, or can mean that the first size is substantially the same as the second size, taking into account errors, margins, or tolerances that can occur in measurement or manufacturing as understood by one of ordinary skill in the art. Accordingly, even when the positions of the metal frames 141-2 and 142-2 are shifted when the multilayer electronic component 1002 is mounted on the substrate, the mounting portions 141c-2 and 142c-2 can be prevented from contacting other pad patterns adjacent thereto, and thus short-circuit defects between components mounted on the substrate can be prevented.

[0118] Variation Example 3

[0119] Figure 10 FIG. 17 is a perspective view schematically illustrating a multilayer electronic component 1003 according to variation example 3 of the multilayer electronic component 1000 according to an exemplary embodiment of the present disclosure.

[0120] In the case of the multilayer electronic component using the metal frame, when the metal frame covers the entire surface of the external electrode, the amount of vibrations and heat transferred from the substrate can increase, and it can be difficult to protect the capacitor 100 from the heat and vibrations.

[0121] Referring to Figure 10 According to variation example 3 of the multilayer electronic component 1000 according to an exemplary embodiment of the present disclosure, the multilayer electronic component 1003 can include first and second metal frames 141-3 and 142-3 disposed on the external electrodes 131 and 132.

[0122] The first and second metal frames 141-3 and 142-3 can include support portions 141a-3 and 142a-3, extension portions 141b-3 and 142b-3, and mounting portions 141c-3 and 142c-3.

[0123] At this time, the dimensions of the support portions 141a-3 and 142a-3 in the third direction can be smaller than the dimension W of the capacitor 100 in the third direction, to reduce the transmission of heat, vibration, and bending stress from the substrate through the metal frames 141-3 and 142-3, thereby improving thermal reliability, mechanical reliability, and resistance to bending deformation.

[0124] In this case, the dimensions of the support portions 141a-3 and 142a-3 in the third direction can be smaller than the dimensions of the extension portions 141b-3 and 142b-3 in the third direction. More preferably, in addition thereto, the dimensions of the mounting portions 141c-3 and 142c-3 in the third direction can be substantially the same as the dimensions of the extension portions 141b-3 and 142b-3 in the third direction. Accordingly, the length or area of the mounting portions 141c-3 and 142c-3 that come into contact with the substrate can be increased, and thus the adhesion strength of the multilayer electronic package 1003 can be increased.

[0125] Variation Example 4

[0126] Figure 11 FIG. 17 is a perspective view schematically illustrating a multilayer electronic package 1004 according to Variation Example 4 of the multilayer electronic package 1000 according to an exemplary embodiment in the present disclosure.

[0127] Referring to Figure 11 The multilayer electronic package 1004 according to Variation Example 4 of the multilayer electronic package 1000 according to an exemplary embodiment in the present disclosure can include a first metal frame 141-4 and a second metal frame 142-4 disposed on the outer electrodes 131 and 132.

[0128] The first metal frame 141-4 and the second metal frame 142-4 can include support portions 141a-4 and 142a-4, extension portions 141b-4 and 142b-4, and mounting portions 141c-4 and 142c-4.

[0129] In an exemplary embodiment, the dimensions of the support portions 141a-4 and 142a-4 in the third direction can be smaller than the dimension W of the capacitor 100 in the third direction, to reduce the amount of transmission of heat, vibration, and bending stress from the substrate to the capacitor 100 through the metal frames 141-4 and 142-4, thereby improving thermal reliability, mechanical reliability, and resistance to bending deformation.

[0130] In an exemplary embodiment, the dimensions of the extension portions 141b-4 and 142b-4 in the third direction can be substantially the same as the dimensions of the support portions 141a-4 and 142a-4 in the third direction. Accordingly, the area through which heat and vibration are transmitted from the substrate can be reduced, thereby effectively protecting the multilayer electronic package 1004 from heat and vibration of the substrate.

[0131] In the exemplary embodiment, the mounting portions 141c-4 and 142c-4 can have substantially the same size in the third direction as the extension portions 141b-4 and 142b-4. Thus, even when the multilayer electronic component 1004 is mounted on the substrate, the mounting portions 141c-4 and 142c-4 can be prevented from contacting other pad patterns adjacent thereto, and thus a short defect between components mounted on the substrate can be prevented.

[0132] Variation Example 5

[0133] Figure 12 FIG. 17 is a perspective view schematically illustrating a multilayer electronic component 1005 according to variation example 5 of the multilayer electronic component 1000 according to an exemplary embodiment of the present disclosure.

[0134] Referring to Figure 12 The multilayer electronic component 1005 according to variation example 5 of the multilayer electronic component 1000 according to an exemplary embodiment of the present disclosure can include first and second metal frames 141-5 and 142-5 disposed on the outer electrodes 131 and 132.

[0135] The first and second metal frames 141-5 and 142-5 can include support portions 141a-5 and 142a-5, extension portions 141b-5 and 142b-5, and mounting portions 141c-5 and 142c-5.

[0136] In the exemplary embodiment, the support portions 141a-5 and 142a-5 can have two portions disposed apart in the third direction. Thus, the amount of heat, vibration, and bending stress transmitted from the substrate to the capacitor 100 along the metal frames 141-5 and 142-5 can be reduced to improve thermal reliability, mechanical reliability, and bending deformation resistance.

[0137] Variation Example 6

[0138] Figure 13 FIG. 18 is a perspective view schematically illustrating a multilayer electronic component 1006 according to variation example 6 of the multilayer electronic component 1000 according to an exemplary embodiment of the present disclosure.

[0139] Referring to Figure 13 The multilayer electronic component 1006 according to variation example 6 of the multilayer electronic component 1000 according to an exemplary embodiment of the present disclosure can include first and second metal frames 141-6 and 142-6 disposed on the outer electrodes 131 and 132.

[0140] The first metal frame 141-6 and the second metal frame 142-6 can include support portions 141a-6 and 142a-6, extension portions 141b-6 and 142b-6, and mounting portions 141c-6 and 142c-6.

[0141] In an exemplary embodiment, the support portions 141a-6 and 142a-6 can include recesses 140a. The recesses 140a can reduce the amount of vibration or heat transferred along the metal frames 141-6 and 142-6, and by providing a conductive adhesive in the recesses 140a, the adhesion between the metal frames 141-6 and 142-6 and the external electrodes 131 and 132 can be improved.

[0142] In an exemplary embodiment, the recesses 140a can be disposed to be spaced apart from end portions of the support portions 141a-6 and 142a-6 in the first direction and the third direction, but are not limited thereto.

[0143] In addition, the recesses 140a can be disposed to pass through the metal frames such that the external electrodes are exposed, and a conductive adhesive can be disposed on the exposed surfaces of the external electrodes.

[0144] In this case, the recesses 140a can be 50% or less of the area of the external electrodes in the direction in which the metal frames are in contact, such that the metal frames and the capacitors can be sufficiently combined.

[0145] Variation Example 7

[0146] Figure 14 FIG. 1C is a perspective view schematically illustrating a multilayer electronic assembly 1007 of variation example 7 of the multilayer electronic assembly 1000 according to an exemplary embodiment of the present disclosure.

[0147] Referring to Figure 14 The multilayer electronic assembly 1007 of variation example 7 of the multilayer electronic assembly 1000 according to an exemplary embodiment of the present disclosure can include first and second metal frames 141-7 and 142-7 disposed on the external electrodes 131 and 132.

[0148] The first and second metal frames 141-7 and 142-7 can include support portions 141a-7 and 142a-7, extension portions 141b-7 and 142b-7, and mounting portions 141c-7 and 142c-7.

[0149] The support portions 141a-7 and 142a-7 can include recesses 140a, and the extension portions 141b-7 and 142b-7 can include through portions 140b.

[0150] The through portions 140b can be disposed to be spaced apart from end portions of the extension portions 141b-7 and 142b-7 in the first direction and the third direction, and can be disposed to pass through the extension portions.

[0151] Accordingly, heat and vibration transferred from the substrate can be effectively reduced while maintaining the strength of the metal frame.

[0152] Hereinafter, a multilayer electronic component according to exemplary embodiments in the present disclosure will be described, but descriptions duplicated with the multilayer electronic component and various modifications according to exemplary embodiments in the present disclosure will be omitted.

[0153] Figure 15 FIG. 1 is a perspective view schematically illustrating a multilayer electronic component 2000 according to exemplary embodiments in the present disclosure.

[0154] Referring to Figure 15 According to exemplary embodiments, the multilayer electronic component 2000 can include a plurality of capacitors 100. Specifically, the multilayer electronic component 2000 can have a structure in which the plurality of capacitors 100 are arranged, and the first metal frame 241 can be disposed on the first external electrodes 131 of the plurality of capacitors 100, and the second metal frame 242 can be disposed on the second external electrodes 132. That is, the first metal frame 241 can simultaneously contact each of a plurality of first external electrodes of the plurality of capacitors 100, and the second metal frame 242 can simultaneously contact each of a plurality of second external electrodes.

[0155] Even though the multilayer electronic component 2000 includes the plurality of capacitors 100, the plurality of capacitors are stacked in the first direction or the third direction such that an increase in the distance between the first metal frame 241 and the second metal frame 242 can be minimized.

[0156] In addition, since each of the capacitors 100 has a structure in which the size W in the third direction is greater than the size L in the second direction, when stacked in the first direction or the third direction, the entire capacitor array including the plurality of capacitors 100 can have a size in the third direction that is greater than a size in the second direction.

[0157] Accordingly, an effect of reducing a current path can be maintained, and thus the ESL of the multilayer electronic component 2000 can be reduced, and can have a low impedance value at a high frequency.

[0158] In addition, the capacitance and reliability of the multilayer electronic component 2000 can be improved by combining several hundred capacitors 100 that are thermally stable but have small capacitance.

[0159] Further, the first and second metal frames 241 and 242 can include support portions 241a and 242a in contact with the first and second external electrodes 131 and 132 of the plurality of capacitors 100, extension portions 241b and 242b extending from the support portions in the first direction and disposed to be spaced apart from the main body and the first and second external electrodes, and mounting portions 241c and 242c disposed to extend from one end of the extension portions in the second direction.

[0160] Figure 16 FIG. 1 is a perspective view schematically illustrating a multilayer electronic assembly 2001 according to an exemplary embodiment in the present disclosure.

[0161] Referring to Figure 16 , the first and second metal frames 241-1 and 242-1 of the multilayer electronic assembly 2001 according to the exemplary embodiment can include support portions 241a-1 and 242a-1 in contact with the first and second external electrodes 131 and 132 of the plurality of capacitors 100, extension portions 241b-1 and 242b-1 extending from the support portions in the first direction and disposed to be spaced apart from the main body and the first and second external electrodes, and mounting portions 241c-1 and 242c-1 disposed to extend from one end of the extension portions in the second direction.

[0162] In the exemplary embodiment, the support portions 241a-1 and 242a-1 of the first and second metal frames 241-1 and 242-1 can have two portions disposed apart in the third direction. Accordingly, the amount of transmission of heat, vibration, and bending stress from the substrate to the plurality of capacitors 100 along the metal frames 241-1 and 242-1 can be reduced to improve thermal reliability, mechanical reliability, and resistance to bending deformation.

[0163] Figure 17 FIG. 2 is a perspective view schematically illustrating a multilayer electronic assembly 2002 according to an exemplary embodiment in the present disclosure.

[0164] Referring to Figure 17 , the first and second metal frames 241-2 and 242-2 of the multilayer electronic assembly 2002 according to the exemplary embodiment can include support portions 241a-2 and 242a-2 in contact with the first and second external electrodes 131 and 132 of the plurality of capacitors 100, extension portions 241b-2 and 242b-2 extending from the support portions in the first direction and disposed to be spaced apart from the main body and the first and second external electrodes, and mounting portions 241c-2 and 242c-2 disposed to extend from one end of the extension portions in the second direction.

[0165] In an exemplary embodiment, the support portions 241a-2 and 242a-2 can include recesses 240a. The recesses 240a can reduce the amount of vibration or heat transferred along the metal frames 241-2 and 242-2, and by providing a conductive adhesive in the recesses 240, the adhesion between the metal frames 241-2 and 242-2 and the external electrodes 131 and 132 can be improved.

[0166] In an exemplary embodiment, the recesses 240a can be provided to be spaced apart from the ends of the support portions 241a-2 and 242a-2 in the first and third directions, but are not limited thereto.

[0167] In addition, the recesses 240a can be provided to pass through the metal frames such that the external electrodes are exposed, and a conductive adhesive can be provided on the exposed surfaces of the external electrodes.

[0168] In this case, the recesses 240a can be 50% or less of the area of the external electrodes in the direction in which the metal frames are in contact, such that the metal frames and the capacitors can be sufficiently combined.

[0169] Figure 18 FIG. 20 is a perspective view schematically illustrating a multilayer electronic assembly 2003 according to an exemplary embodiment in the present disclosure.

[0170] The first and second metal frames 241-3 and 242-3 of the multilayer electronic assembly 2003 according to an exemplary embodiment can include support portions 241a-3 and 242a-3 in contact with the first and second external electrodes 131 and 132 of the plurality of capacitors 100, extension portions 241b-3 and 242b-3 extending from the support portions in the first direction and provided to be spaced apart from the main body and the first and second external electrodes, and mounting portions 241c-3 and 242c-3 provided to extend from one end of the extension portions in the second direction.

[0171] In this case, the support portions 241a-3 and 242a-3 can include recesses 240a, and the extension portions 241b-3 and 242b-3 can include through portions 240b.

[0172] The through portions 240b can be provided to be spaced apart from the ends of the extension portions 241b-3 and 242b-3 in the first and third directions, and can be provided to pass through the extension portions.

[0173] Accordingly, heat and vibration transmitted from the substrate can be effectively reduced while maintaining the strength of the metal frames.

[0174] Figure 19 FIG. 20 is a perspective view schematically illustrating a multilayer electronic assembly 2003 according to an exemplary embodiment in the present disclosure.

[0175] Referring to Figure 19According to an exemplary embodiment, the multilayer electronic component 3000 can include a capacitor array in which a plurality of capacitors 100 are stacked in a first direction, and include a first metal frame 341 and a second metal frame 342 disposed on the first and second external electrodes.

[0176] The first and second metal frames 341 and 342 can include support portions 341a and 342a in contact with the first and second external electrodes, extension portions 341b and 342b extending in a third direction and disposed to be spaced apart from the body 110 and the first and second external electrodes, and mounting portions 341c and 342c extending from one end of the extension portions 341b and 342b in a second direction.

[0177] The support portions 341a and 342a can include recesses 340a, and the extension portions 341b and 342b can include through portions 340b. Accordingly, the adhesion between the external electrodes 131 and 132 and the metal frames 341 and 342 can be improved, the strength of the metal frames can be maintained, and heat and vibrations transmitted from the substrate along the metal frames 341 and 342 can be effectively reduced.

[0178] Even though the multilayer electronic component 3000 includes a plurality of capacitors 100, since the plurality of capacitors are stacked in the first direction, the increase in the distance between the first and second metal frames 341 and 342 can be minimized.

[0179] In addition, since each of the capacitors 100 has a structure in which the size W in the third direction is greater than the size L in the second direction, when the capacitors 100 are stacked in the first direction, the size of the entire capacitor array including the plurality of capacitors 100 in the third direction can be greater than the size in the second direction.

[0180] Accordingly, the effect of reducing the current path can be maintained, and thus the ESL of the multilayer electronic component 3000 can be reduced, and can have a low impedance value at a high frequency.

[0181] In addition, the capacitance and reliability of the multilayer electronic component 3000 can be improved by combining several hundred capacitors 100 (thermally stable but having a small capacitance).

[0182] Further, the plurality of recesses 340a and the plurality of through portions 340b can be formed according to the number of capacitors 100 arranged. Accordingly, in an exemplary embodiment, the support portions 341a and 342a can include a plurality of recesses, and the extension portions 341b and 342b can include a plurality of through portions. Accordingly, the adhesion between the metal frames 341 and 342 and the capacitors 100 can be improved, and heat and vibrations transmitted from the substrate to the capacitor array can be effectively suppressed.

[0183] One of the various effects of the present disclosure is to protect the multilayer ceramic capacitor from thermal stress and mechanical stress transmitted from the substrate, as described above.

[0184] One of the various effects of the present disclosure is to reduce the ESL by shortening the current path.

[0185] One of the various effects of the present disclosure is to reduce the ESL by shortening the current path when the metal frame is combined to protect the multilayer ceramic capacitor from thermal stress and mechanical stress transmitted from the substrate.

[0186] The various advantageous effects and advantages of the present disclosure are not limited to the above and will be more readily appreciated as the description of the specific exemplary embodiments of the present disclosure proceeds.

[0187] While example embodiments have been illustrated and described above, it will be readily apparent to those of ordinary skill in the art that modifications and variations can be made therein without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a capacitor including a main body, a first external electrode, and a second external electrode, the main body including dielectric layers and first and second internal electrodes alternately arranged with the dielectric layers interposed between the first and second internal electrodes, the main body having a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first, second, third, and fourth surfaces and facing each other in a third direction, the first external electrode being provided on the third surface of the main body, the second external electrode being provided on the fourth surface of the main body; a first metal frame provided on the first external electrode of the capacitor; and a second metal frame provided on the second external electrode of the capacitor, wherein W > L, where L is a dimension of the capacitor in the second direction and W is a dimension of the capacitor in the third direction, and the first and second metal frames include a support portion in contact with the first and second external electrodes, an extension portion extending from the support portion in the first direction and provided spaced apart from the main body, the first external electrode, and the second external electrode, and a mounting portion extending from one end of the extension portion in the second direction, and an overall dimension of the support portion of the first metal frame in the third direction is the same as the dimension of the capacitor in the third direction.

2. The multilayer electronic component according to claim 1, wherein the extension portion of the first metal frame includes a first portion and a second portion provided separately in the third direction.

3. The multilayer electronic component according to claim 2, wherein the mounting portion of the first metal frame includes a first portion and a second portion provided separately in the third direction.

4. The multilayer electronic component according to claim 1, wherein a dimension of the extension portion of the first metal frame in the third direction is smaller than a dimension of the support portion of the first metal frame in the third direction.

5. The multilayer electronic component according to claim 4, wherein a dimension of the mounting portion of the first metal frame in the third direction is the same as the dimension of the extension portion of the first metal frame in the third direction.

6. The multilayer electronic component according to claim 1, wherein the first external electrode of the capacitor is provided on the third surface and extends to a portion of at least one of the first and second surfaces, and the second external electrode of the capacitor is provided on the fourth surface and extends to a portion of at least one of the first and second surfaces.

7. The multilayer electronic component according to claim 1, wherein ​ An electrically conductive adhesive is provided between the first outer electrode of the capacitor and the first metal frame and between the second outer electrode of the capacitor and the second metal frame.

8. The multilayer electronic assembly of claim 1, wherein, The first metal frame or the second metal frame further includes a support portion extending from the respective support portion to a portion of at least one of the first surface, the second surface, the fifth surface, and the sixth surface.

9. The multilayer electronic assembly of claim 1, wherein, The support portion of the first metal frame includes a first portion and a second portion disposed apart in the third direction.

10. The multilayer electronic assembly of claim 1, wherein, The support portion of the first metal frame includes a recess portion disposed apart from an end portion of the support portion of the first metal frame in the first direction and an end portion of the support portion of the first metal frame in the third direction.

11. The multilayer electronic assembly of claim 10, wherein, The extension portion of the first metal frame includes a through portion disposed apart from an end portion of the extension portion of the first metal frame in the first direction and an end portion of the extension portion of the first metal frame in the third direction.

12. The multilayer electronic assembly of claim 1, wherein, The support portion of the first metal frame includes a plurality of recess portions disposed apart from an end portion of the support portion of the first metal frame in the first direction and an end portion of the support portion of the first metal frame in the third direction.

13. The multilayer electronic assembly of claim 12, wherein, The extension portion of the first metal frame includes a plurality of through portions disposed apart from an end portion of the extension portion of the first metal frame in the first direction and an end portion of the extension portion of the first metal frame in the third direction.

14. The multilayer electronic assembly of claim 1, wherein, The multilayer electronic assembly includes a plurality of capacitors, and the plurality of capacitors are stacked in a first direction.

15. The multilayer electronic assembly of claim 1, wherein, The first inner electrode and the second inner electrode are stacked in the first direction.

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