A fully automatic silicon wafer cleaning machine

Abstract

The present invention discloses a fully automatic silicon wafer cleaning machine, which relates to the technical field of silicon wafer cleaning. The silicon wafer cleaning machine includes a cleaning tank, a water tank, a connecting pipe, and a water outlet pipe. An opening is provided on the upper outer surface of the cleaning tank, and a water tank is arranged on the first side outer surface of the cleaning tank; by setting a cleaning mechanism in the present invention, the cleaning agent in the water tank enters the inside of the connecting cylinder through the connecting pipe and the diversion pipe in sequence under the action of a water pump, and is discharged through the connecting holes, impacting the cleaning cotton, keeping the cleaning cotton in a wet state, improving the cleaning strength of the cleaning cotton, and at the same time, the cleaning agent impacts outward through the inside of the cleaning cotton, which can wash the pollutants on the surface of the cleaning cotton to a certain extent, reducing the probability of pollutants adhering to its surface. Meanwhile, compared with directly flushing with the cleaning agent, no flushing marks will be formed on the surface of the silicon wafer, avoiding secondary treatment.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer cleaning, and particularly to a fully automatic silicon wafer cleaning machine. Background Art

[0002] In recent years, as a clean and environment-friendly energy source, solar energy has been widely applied in many fields. Silicon wafers are the most common components in the solar photovoltaic industry, and multiple processes are required during their production process to ensure the photoelectric conversion effect of the silicon wafers.

[0003] During the manufacturing process of semiconductor devices, the cleanliness of the silicon wafer surface is very important because any contaminants on the silicon wafer surface may have an adverse impact on the quality of the manufactured devices. Therefore, during the manufacturing process of semiconductor devices, a cleaning agent containing deionized water is usually used to rinse it;

[0004] In the prior art, the carrier basket carrying the silicon wafers is usually hung on a cantilever cleaning machine for cleaning. However, this type of cleaning machine can only perform rinsing, which will cause traces of the cleaning agent to remain on the silicon wafer surface. Moreover, during the cleaning process of this type of cleaning machine, the entire batch of silicon wafers is usually placed in the carrier basket and rinsed simultaneously. Therefore, stubborn stains on the surface of some silicon wafers cannot be fully cleaned, reducing the cleaning effect. Summary of the Invention

[0005] The purpose of the present invention is to solve the problem that the existing cleaning machine can only perform rinsing, which will cause traces of the flowing cleaning agent to remain on the silicon wafer surface, and during the cleaning process of this type of cleaning machine, the entire batch of silicon wafers is usually placed in the carrier basket and rinsed simultaneously. Therefore, stubborn stains on the surface of some silicon wafers cannot be fully cleaned, reducing the cleaning effect, and to propose a fully automatic silicon wafer cleaning machine.

[0006] The purpose of the present invention can be achieved by the following technical solutions: A fully automatic silicon wafer cleaning machine includes a cleaning tank, a water tank, a connecting pipe, and a water outlet pipe. An opening is provided on the upper outer surface of the cleaning tank, and a water tank is arranged on the first side outer surface of the cleaning tank. A connecting pipe is fixedly connected to the upper outer surface of the water tank, and a water outlet pipe is fixedly communicated with the first side outer surface of the cleaning tank near the bottom end. A water pump is arranged inside the water tank, and one end of the connecting pipe penetrates into the inside of the water tank and is fixedly communicated with the output end of the water pump. The other end of the connecting pipe penetrates into the inside of the cleaning tank, and a cleaning mechanism is arranged at a position corresponding to the connecting pipe inside the cleaning tank;

[0007] The cleaning mechanism includes a first motor, a connecting column, a connecting cylinder, and a diversion pipe; a first motor is provided on the outer surface of the second side of the cleaning tank away from the connecting pipe, and the output end of the first motor penetrates into the interior of the cleaning tank and is fixedly connected to the connecting column. The output end of the first motor is rotatably connected to the cleaning tank, one end of the connecting column is fixedly connected to the output end of the first motor, the other end of the connecting column is fixedly connected to the connecting cylinder, the outer surface of the end of the connecting cylinder away from the connecting column is fixedly connected to the diversion pipe, and a plurality of groups of fixing components are equidistantly arranged on the outer surface of the connecting cylinder;

[0008] The fixing component includes a fixing plate, a slot hole, a first connecting shaft, a second connecting shaft, a connecting roller, and an arc-shaped plate; one end of the fixing plate is fixedly connected to the connecting cylinder, and the fixing plate is U-shaped. A slot hole is provided on both sides of the inner surface of the fixing plate, and a plurality of groups of first connecting shafts and second connecting shafts are respectively equidistantly arranged at both ends of the inner surface of the slot hole. The first connecting shaft and the second connecting shaft correspond one by one, one end of the first connecting shaft and the second connecting shaft is fixedly connected to the slot hole, the other end of the first connecting shaft and the second connecting shaft is fixedly connected to the connecting roller, two arc-shaped plates are fixedly connected between two corresponding connecting rollers, a cleaning cotton is fixedly connected between the two fixing plates, the inner surface of the diversion pipe is communicated with the inner surface of the connecting cylinder, and a connecting hole is provided on the outer surface of one end of the first connecting shaft. The inner surface of the connecting hole is communicated with the inner surface of the connecting cylinder. A conveying component is arranged inside the cleaning tank, and the conveying component is located at a position below the side of the connecting cylinder;

[0009] The conveying component includes a second motor, a rotating shaft, a rotating cylinder, a clamping plate, a movable hole, and an elastic membrane; mounting holes are respectively provided on the outer surfaces of both sides of the cleaning tank near the bottom end, and rotating shafts are respectively rotatably connected to both sides of the inner surface of the mounting hole near the middle. A rotating cylinder is fixedly connected between two corresponding rotating shafts. A plurality of groups of clamping plates are fixedly connected equidistantly on the outer surface of the rotating cylinder, and the clamping plates are in pairs. The clamping plate is in a hollow shape and is located below the side of the fixing plate and corresponds to it.

[0010] Further, a through hole is provided at a position corresponding to the diversion pipe on the inner surface of the cleaning tank. The diversion pipe penetrates into the interior of the through hole and is rotatably connected to it. One end of the connecting pipe away from the water tank penetrates through the through hole and extends into the interior of the diversion pipe and is rotatably connected to it, and a sealing ring is provided between the connecting pipe and the diversion pipe.

[0011] Further, spiral threads are provided on the outer surfaces of the connecting column and the diversion pipe, and push plates are spirally connected to the outer surfaces of the connecting column and the diversion pipe through the spiral threads. Fixing cylinders are fixedly connected to the outer surfaces of the sides of the push plates away from the connecting cylinder. A T-shaped rod is movably connected inside the fixing cylinder, one end of the T-shaped rod is movably connected to the fixing cylinder, and the other end of the T-shaped rod penetrates to the outside of the fixing cylinder and is fixedly connected to the cleaning tank.

[0012] Further, baffles are provided at positions near both ends below the connecting cylinder, and the inner surface of the baffle is arc-shaped. Electric push rods are provided on the outer surfaces of the two baffles away from each other, one end of the electric push rod is fixedly connected to the baffle, and the other end of the electric push rod is fixedly connected to the cleaning box. The baffle is U-shaped.

[0013] Further, an activity hole is provided at a position on the outer surface of the rotating cylinder between two corresponding clamping plates, and an elastic membrane is fixedly connected inside the activity hole. A mounting cylinder is fixedly connected near the middle of the inner surface of the elastic membrane. One end of the limiting rod is movably connected inside the mounting cylinder away from the elastic membrane. A fixed rod is fixedly connected inside the rotating cylinder, one end of the limiting rod is movably connected to the mounting cylinder, and the other end of the limiting rod is fixedly connected to the fixed rod. A spring is provided inside the mounting cylinder, one end of the spring is fixedly connected to the limiting rod, and the other end of the spring is fixedly connected to the mounting cylinder.

[0014] Further, a second motor is provided at a position on the second outer surface of the cleaning box corresponding to the rotating shaft, and the output end of the second motor penetrates into the mounting hole and is fixedly connected to the rotating shaft. The output end of the second motor is rotatably connected to the mounting hole. A touch switch is provided at a position on the outer surface of the fixed rod corresponding to the mounting cylinder, and the touch switch is electrically connected to the second motor. In the natural state, the elastic membrane is located between two corresponding clamping plates and is convex. Storage boxes are fixedly connected to the outer surfaces of both sides of the cleaning box at positions corresponding to the mounting holes.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] 1. In the present invention, by setting the cleaning mechanism, the silicon wafer to be cleaned is located inside the fixing plate and rotates with the connecting cylinder. The two push plates drive the fixed cylinder to reciprocate in the same direction. Therefore, during the rotation of the silicon wafer with the fixing plate, it reciprocates inside the fixing plate, forming a relative movement with the cleaning cotton, improving the cleaning strength. During the movement of the silicon wafer, the cleaning cotton can clean the pollutants on the surface of the silicon wafer. And during this process, the cleaning agent in the water tank enters the inside of the connecting cylinder through the connecting pipe and the diversion pipe in sequence under the action of the water pump, and is discharged through the connecting holes, impacting the cleaning cotton to keep the cleaning cotton in a wet state, improving the cleaning strength of the cleaning cotton. And the cleaning agent impacts outward through the inside of the cleaning cotton, which can wash the pollutants on the surface of the cleaning cotton to a certain extent, reducing the probability of pollutants adhering to its surface. At the same time, compared with directly flushing with the cleaning agent, no flushing marks will be formed on the surface of the silicon wafer, avoiding secondary treatment;

[0017] 2. In the present invention, by providing a conveying component, the silicon wafers inside the fixing plate enter between the two clamping plates under the action of gravity. After the silicon wafers enter between the two clamping plates, the elastic membrane and the mounting cylinder move along the direction of the limiting rod under the gravity of the silicon wafers, and press the touch switch. The touch switch is the starting switch of the second motor. Therefore, the second motor is started, and its output drives the rotating cylinder to rotate 45 degrees outward from the cleaning tank and then stops. At this time, the other two clamping plates correspond to the next fixing plate, and the next silicon wafers enter between the two clamping plates again. When the silicon wafers rotate to the lower side of the rotating cylinder, the silicon wafers enter the inside of the storage box, and the elastic membrane returns to its original state under the action of the spring, so that the silicon wafers after cleaning can be automatically collected, improving the automation degree of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] For the convenience of those skilled in the art to understand, the present invention will be further described below with reference to the accompanying drawings.

[0019] Figure 1 is the overall structural schematic diagram of the present invention;

[0020] Figure 2 is the Figure 1 magnified view of area A of the present invention;

[0021] Figure 3 is the Figure 1 magnified view of area B of the present invention;

[0022] Figure 4 is the combined view of the arc-shaped plate and the cleaning cotton of the present invention;

[0023] Figure 5 is the combined view of the conveying component and the cleaning mechanism of the present invention;

[0024] Figure 6 is the Figure 5 magnified view of area C of the present invention;

[0025] Figure 7 is the overall structural schematic diagram of the baffle of the present invention.

[0026] Reference numerals: 1, cleaning tank; 2, water tank; 3, connecting pipe; 4, water outlet pipe; 5, cleaning mechanism; 501, motor 1; 504, diversion pipe; 6, fixing assembly; 601, fixing plate; 602, slot; 603, connecting shaft 1; 604, connecting shaft 2; 605, connecting roller; 606, arc plate; 607, cleaning cotton; 608, connecting hole; 609, through hole; 610, push plate; 611, fixing cylinder; 612, baffle; 613, electric push rod; 614, T-shaped rod; 7, conveying assembly; 701, mounting hole; 702, rotating shaft; 703, rotating cylinder; 704, clamping plate; 705, movable hole; 706, elastic membrane; 707, mounting cylinder; 708, limiting rod; 709, fixing rod; 710, motor 2; 712, touch switch; 713, spring. Detailed implementation mode

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] Embodiment 1:

[0029] As Figure 1-7 shown, a fully automatic silicon wafer cleaning machine proposed by the present invention includes a cleaning tank 1, a water tank 2, a connecting pipe 3 and a water outlet pipe 4. An opening is provided on the upper outer surface of the cleaning tank 1, and a water tank 2 is arranged on the first side outer surface of the cleaning tank 1. A connecting pipe 3 is fixedly connected to the upper outer surface of the water tank 2, and a water outlet pipe 4 is fixedly communicated with the first side outer surface of the cleaning tank 1 near the bottom end. A water pump is arranged inside the water tank 2, and one end of the connecting pipe 3 penetrates into the water tank 2 and is fixedly communicated with the output end of the water pump. The other end of the connecting pipe 3 penetrates into the cleaning tank 1, and a cleaning mechanism 5 is arranged at a position corresponding to the connecting pipe 3 inside the cleaning tank 1;

[0030] The cleaning mechanism 5 includes a motor 1 501, a connecting column, a connecting cylinder and a diversion pipe 504; a motor 1 501 is arranged on the second side outer surface of the cleaning tank 1 away from the connecting pipe 3, and the output end of the motor 1 501 penetrates into the cleaning tank 1 and is fixedly connected with a connecting column. The output end of the motor 1 501 is rotationally connected to the cleaning tank 1, one end of the connecting column is fixedly connected with the output end of the motor 1 501, the other end of the connecting column is fixedly connected with a connecting cylinder, a diversion pipe 504 is fixedly connected to the outer surface of the connecting cylinder away from the connecting column, and a plurality of groups of fixing assemblies 6 are arranged on the outer surface of the connecting cylinder at equal intervals;

[0031] The fixing component 6 includes a fixing plate 601, a slot hole 602, a first connecting shaft 603, a second connecting shaft 604, a connecting roller 605 and an arc plate 606; one end of the fixing plate 601 is fixedly connected to the connecting cylinder, and the fixing plate 601 is U-shaped. During the cleaning process, the first motor 501 is started, and the connecting cylinder drives the fixing plate 601 to rotate forward and backward under the drive of the first motor 501, and then the silicon wafers to be cleaned are placed into the inside of the fixing plate 601 one by one through the opening of the cleaning box 1;

[0032] Baffles 612 are arranged at positions near both ends below the connecting cylinder, and the inner surface of the baffle 612 is arc-shaped. Electric push rods 613 are arranged on the outer surfaces of the two groups of baffles 612 away from each other, and one end of the electric push rod 613 is fixedly connected to the baffle 612, and the other end of the electric push rod 613 is fixedly connected to the cleaning box 1. The baffle 612 is U-shaped, and the silicon wafer will not be separated from the fixing plate 601 during the rotation process;

[0033] Slot holes 602 are opened on both sides of the inner surface of the fixing plate 601, and several groups of first connecting shafts 603 and second connecting shafts 604 are respectively arranged at equal distances at both ends of the inner surface of the slot hole 602. The first connecting shafts 603 and the second connecting shafts 604 correspond to each other one by one, and one end of the first connecting shaft 603 and the second connecting shaft 604 is fixedly connected to the slot hole 602. The other ends of the first connecting shaft 603 and the second connecting shaft 604 are fixedly connected with a connecting roller 605. Two arc plates 606 are fixedly connected between two corresponding connecting rollers 605. A cleaning cotton 607 is fixedly connected between the two fixing plates 601. The inner surface of the flow guide pipe 504 is communicated with the inner surface of the connecting cylinder, and a connecting hole 608 is opened on the outer surface of one end of the first connecting shaft 603. The inner surface of the connecting hole 608 is communicated with the inner surface of the connecting cylinder. A conveying component 7 is arranged inside the cleaning box 1, and the conveying component 7 is located at a position below the side of the connecting cylinder.

[0034] A through hole 609 is opened at a position on the inner surface of the cleaning box 1 corresponding to the flow guide pipe 504. The flow guide pipe 504 penetrates into the inside of the through hole 609 and is rotatably connected thereto. One end of the connecting pipe 3 away from the water tank 2 penetrates through the through hole 609 and extends into the inside of the flow guide pipe 504 and is rotatably connected thereto. A sealing ring is arranged between the connecting pipe 3 and the flow guide pipe 504. The cleaning agent in the water tank 2 enters the inside of the connecting cylinder through the connecting pipe 3 and the flow guide pipe 504 in sequence under the action of the water pump, and is discharged through the connecting hole 608 to impact the cleaning cotton 607, so that the cleaning cotton 607 is kept in a wet state, thereby ensuring that the silicon wafer can be cleaned during the relative movement between the cleaning cotton 607 and the silicon wafer.

[0035] Embodiment 2:

[0036] Such as Figure 1 And Figure 2As shown in the figure, the difference between this embodiment and Embodiment 1 is that spiral threads are provided on the outer surfaces of both the connecting column and the diversion pipe 504, and push plates 610 are spirally connected to the outer surfaces of both the connecting column and the diversion pipe 504 through the spiral threads. Fixing cylinders 611 are fixedly connected to the outer surfaces of the push plates 610 on the sides away from the connecting cylinder. A T-shaped rod 614 is movably connected inside the fixing cylinder 611, and one end of the T-shaped rod 614 is movably connected to the fixing cylinder 611. The other end of the T-shaped rod 614 penetrates to the outside of the fixing cylinder 611 and is fixedly connected to the cleaning box 1;

[0037] The diversion pipe 504 and the connecting column rotate forward and backward with the connecting cylinder. Since the two are respectively spirally connected to their corresponding push plates 610, during the forward and backward rotation of the connecting cylinder, the two groups of push plates 610 drive the fixing cylinders 611 to reciprocate in the same direction, and the silicon wafer always contacts one group of push plates 610. Therefore, during the rotation of the silicon wafer with the fixing plate 601, it reciprocates inside the fixing plate 601, forming a relative movement with the cleaning cotton 607, improving the cleaning intensity.

[0038] Embodiment Three:

[0039] As Figure 1-6 shown in the figure, the difference between this embodiment and Embodiment 1 and Embodiment 2 is that the conveying assembly 7 includes a second motor 710, a rotating shaft 702, a rotating cylinder 703, a clamping plate 704, a moving hole 705, and an elastic membrane 706; mounting holes 701 are provided at positions near the bottom on both outer surfaces of the cleaning box 1, and rotating shafts 702 are rotatably connected to positions near the middle on both sides of the inner surface of the mounting hole 701. A second motor 710 is provided at a position corresponding to the rotating shaft 702 on the second outer surface of the cleaning box 1, and the output end of the second motor 710 penetrates into the mounting hole 701 and is fixedly connected to the rotating shaft 702. The output end of the second motor 710 is rotatably connected to the mounting hole 701. A rotating cylinder 703 is fixedly connected between the two corresponding rotating shafts 702. A number of groups of clamping plates 704 are fixedly connected to the outer surface of the rotating cylinder 703 at equal intervals, and the clamping plates 704 are in pairs. The clamping plates 704 are in a hollow shape and are located below the side of the fixing plate 601 and correspond to it. After cleaning for a period of time, the two electric push rods 613 are started. Under the action of the electric push rods 613, the two baffle plates 612 move away from each other. When the silicon wafer inside the fixing plate 601 corresponds to the opening of the baffle plate 612, the clamping plates 704 also correspond to the fixing plate 601. Therefore, the silicon wafer inside this group of fixing plates 601 enters between the two clamping plates 704 under the action of gravity. Each rotating cylinder 703 corresponds to sixteen groups of clamping plates 704, and the clamping plates 704 are in pairs;

[0040] An activity hole 705 is provided at a position on the outer surface of the rotating cylinder 703 between two corresponding clamping plates 704, and an elastic membrane 706 is fixedly connected inside the activity hole 705. An installation cylinder 707 is fixedly connected to a position near the middle of the inner surface of the elastic membrane 706. One end of a limiting rod 708 is movably connected inside the installation cylinder 707 away from the elastic membrane 706. A fixed rod 709 is fixedly connected inside the rotating cylinder 703. One end of the limiting rod 708 is movably connected to the installation cylinder 707, and the other end of the limiting rod 708 is fixedly connected to the fixed rod 709. A spring 713 is arranged inside the installation cylinder 707. One end of the spring 713 is fixedly connected to the limiting rod 708, and the other end of the spring 713 is fixedly connected to the installation cylinder 707.

[0041] A touch switch 712 is arranged at a position on the outer surface of the fixed rod 709 corresponding to the installation cylinder 707, and the touch switch 712 is electrically connected to the second motor 710. In the natural state, the elastic membrane 706 is located between two corresponding clamping plates 704 and is convex. After the silicon wafer enters between the two clamping plates 704, the elastic membrane 706 and the installation cylinder 707 move along the direction of the limiting rod 708 under the gravity of the silicon wafer and press the touch switch 712. At this time, the silicon wafer completely disengages from the installation plate. Storage boxes are fixedly connected to positions on the outer surfaces of both sides of the cleaning box 1 corresponding to the installation holes 701. The touch switch 712 is the starting switch of the second motor 710. Therefore, the second motor 710 is started, and its output end drives the rotating cylinder 703 to rotate 45 degrees outward from the cleaning box 1 and then stops. At this time, the other two clamping plates 704 correspond to the next fixing plate 601. The next silicon wafer enters between the two clamping plates 704 again, and the second motor 710 is started again. Its output end drives the rotating cylinder 703 to rotate 45 degrees outward from the cleaning box 1; repeat according to the above steps until all the silicon wafers inside the fixing plate 601 are completely transferred to the inside of the storage box. When the silicon wafer rotates to the lower side of the rotating cylinder 703, the silicon wafer enters the inside of the storage box.

[0042] The working principle of the present invention: During the cleaning process, the first motor 501 is started. The connecting cylinder drives the fixing plate 601 to rotate forward and backward under the drive of the first motor 501, and then the silicon wafers to be cleaned are placed one by one inside the fixing plate 601 through the opening of the cleaning box 1; and during this process, the baffle 612 is located directly below the connecting cylinder. Therefore, the silicon wafers will not disengage from the fixing plate 601 during rotation;

[0043] In the above process, the diversion tube 504 and the connecting column rotate forward and backward with the connecting cylinder. Since the two are respectively screwed to their corresponding push plates 610, during the forward and backward rotation of the connecting cylinder, the two groups of push plates 610 drive the fixed cylinder 611 to reciprocate in the same direction, and the silicon wafer is always in contact with one group of push plates 610. Therefore, during the rotation of the silicon wafer with the fixed plate 601, it reciprocates inside the fixed plate 601, forming a relative movement with the cleaning cotton 607, improving the cleaning intensity. During the movement of the silicon wafer, the cleaning cotton 607 can clean the contaminants on the surface of the silicon wafer. And during this process, the cleaning agent in the water tank 2 enters the inside of the connecting cylinder successively through the connecting pipe 3 and the diversion tube 504 under the action of the water pump, and is discharged through the connecting hole 608 to impact the cleaning cotton 607, keeping the cleaning cotton 607 in a wet state;

[0044] After cleaning for a period of time, start the two groups of electric push rods 613. The two groups of baffles 612 move away from each other under the action of the electric push rods 613. The motor 501 continuously drives the connecting cylinder to rotate forward and backward. When the silicon wafer inside the fixed plate 601 corresponds to the opening of the baffle 612, the clamping plate 704 also corresponds to the fixed plate 601. Therefore, the silicon wafer inside this group of fixed plates 601 enters between the two groups of clamping plates 704 under gravity. Each rotating cylinder 703 corresponds to sixteen groups of clamping plates 704, and the clamping plates 704 are in pairs. After the silicon wafer enters between the two groups of clamping plates 704, the elastic membrane 706 and the mounting cylinder 707 move along the direction of the limiting rod 708 under the gravity of the silicon wafer, and press the touch switch 712. At this time, the silicon wafer is completely separated from the mounting plate;

[0045] The touch switch 712 is the starting switch of the motor 710. Therefore, the motor 710 is started, and its output drives the rotating cylinder 703 to rotate 45 degrees outward from the cleaning box 1 and then stops. At this time, the other two groups of clamping plates 704 correspond to the next group of fixed plates 601, and the next silicon wafer enters between the two groups of clamping plates 704 again. The motor 710 is started again, and its output drives the rotating cylinder 703 to rotate 45 degrees outward from the cleaning box 1; Repeat according to the above steps until all the silicon wafers inside the fixed plate 601 are completely transferred to the inside of the storage box. When the silicon wafer rotates to the lower side of the rotating cylinder 703, the silicon wafer enters the inside of the storage box, and the elastic membrane 706 returns to its original state under the action of the spring 713, so as to automatically collect the cleaned silicon wafers and improve the automation degree of the device.

[0046] The above content is only an example and explanation of the structure of the present invention. Those skilled in the art of this technology make various modifications or supplements to the described specific embodiments or use similar methods to replace them. As long as they do not deviate from the structure of the invention or exceed the scope defined by this claim book, they should all fall within the protection scope of the present invention.

[0047] In the description of this specification, the descriptions referring to the terms "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0048] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the present invention to only the specific implementation manners. Obviously, according to the content of this specification, many modifications and changes can be made. These embodiments are selected and specifically described in this specification in order to better explain the principles and practical applications of the present invention, so that those skilled in the relevant technical fields can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A fully automatic silicon wafer cleaning machine, comprising a cleaning tank (1), a water tank (2), a connecting pipe (3) and a water outlet pipe (4). An opening is provided on the upper outer surface of the cleaning tank (1), and a water tank (2) is arranged on the first side outer surface of the cleaning tank (1). A connecting pipe (3) is fixedly connected to the upper outer surface of the water tank (2), and a water outlet pipe (4) is fixedly communicated near the bottom end of the first side outer surface of the cleaning tank (1). It is characterized in that, A water pump is arranged inside the water tank (2), and one end of the connecting pipe (3) penetrates into the inside of the water tank (2) and is fixedly communicated with the output end of the water pump. The other end of the connecting pipe (3) penetrates into the inside of the cleaning tank (1), and a cleaning mechanism (5) is arranged at a position corresponding to the connecting pipe (3) inside the cleaning tank (1); The cleaning mechanism (5) includes a first motor (501), a connecting column, a connecting cylinder and a diversion pipe (504); a first motor (501) is arranged on the outer surface of the second side of the cleaning tank (1) away from the connecting pipe (3), and the output end of the first motor (501) penetrates into the inside of the cleaning tank (1) and is fixedly connected with a connecting column. The output end of the first motor (501) is rotatably connected with the cleaning tank (1), one end of the connecting column is fixedly connected with the output end of the first motor (501), the other end of the connecting column is fixedly connected with a connecting cylinder, the outer surface of the end of the connecting cylinder away from the connecting column is fixedly connected with a diversion pipe (504), and a plurality of groups of fixing components (6) are arranged on the outer surface of the connecting cylinder at equal intervals; The fixing component (6) includes a fixing plate (601), a slot hole (602), a first connecting shaft (603), a second connecting shaft (604), a connecting roller (605) and an arc-shaped plate (606); one end of the fixing plate (601) is fixedly connected with the connecting cylinder, and the fixing plate (601) is U-shaped. A slot hole (602) is formed on both sides of the inner surface of the fixing plate (601), and a plurality of groups of first connecting shafts (603) and second connecting shafts (604) are arranged at equal intervals at both ends of the inner surface of the slot hole (602). The first connecting shaft (603) and the second connecting shaft (604) correspond to each other, one end of the first connecting shaft (603) and the second connecting shaft (604) is fixedly connected with the slot hole (602), the other end of the first connecting shaft (603) and the second connecting shaft (604) is fixedly connected with a connecting roller (605), two arc-shaped plates (606) are fixedly connected between two corresponding connecting rollers (605), a cleaning cotton (607) is fixedly connected between the two fixing plates (601), the inner surface of the diversion pipe (504) is communicated with the inner surface of the connecting cylinder, and a connecting hole (608) is formed on the outer surface of one end of the first connecting shaft (603). The inner surface of the connecting hole (608) is communicated with the inner surface of the connecting cylinder. A conveying component (7) is arranged inside the cleaning tank (1), and the conveying component (7) is located at a position below the side of the connecting cylinder; The conveying component (7) includes a second motor (710), a rotating shaft (702), a rotating cylinder (703), a clamping plate (704), a moving hole (705), and an elastic membrane (706); mounting holes (701) are formed at positions close to the bottom ends on the outer surfaces of both sides of the cleaning tank (1), and rotating shafts (702) are rotatably connected to positions close to the middle on both sides of the inner surface of the mounting hole (701). A rotating cylinder (703) is fixedly connected between two groups of corresponding rotating shafts (702). A plurality of groups of clamping plates (704) are fixedly connected to the outer surface of the rotating cylinder (703) at equal intervals, and the clamping plates (704) are in pairs. The clamping plate (704) is in a hollow shape and is located below the side of the fixing plate (601) and corresponds to it.

2. The fully automatic silicon wafer cleaning machine according to claim 1, wherein A through hole (609) is formed at a position on the inner surface of the cleaning tank (1) corresponding to the diversion pipe (504). The diversion pipe (504) penetrates into the interior of the through hole (609) and is rotatably connected to it. One end of the connecting pipe (3) away from the water tank (2) penetrates through the through hole (609) and extends into the interior of the diversion pipe (504) and is rotatably connected to it, and a sealing ring is provided between the connecting pipe (3) and the diversion pipe (504).

3. The full-automatic silicon wafer cleaning machine according to claim 2, characterized in that, Threads are formed on the outer surfaces of both the connecting column and the diversion pipe (504), and a push plate (610) is screwed to the outer surfaces of both the connecting column and the diversion pipe (504) through the threads. Fixed cylinders (611) are fixedly connected to the outer surfaces of the push plates (610) away from the connecting cylinder. A T-shaped rod (614) is movably connected to the interior of the fixed cylinder (611), and one end of the T-shaped rod (614) is movably connected to the fixed cylinder (611). The other end of the T-shaped rod (614) penetrates outside the fixed cylinder (611) and is fixedly connected to the cleaning tank (1).

4. An automatic silicon wafer cleaning machine according to claim 3, characterized in that, Baffles (612) are arranged at positions close to both ends below the connecting cylinder, and the inner surfaces of the baffles (612) are arc-shaped. Electric push rods (613) are arranged on the outer surfaces of the two groups of baffles (612) away from each other, and one end of the electric push rod (613) is fixedly connected to the baffle (612). The other end of the electric push rod (613) is fixedly connected to the cleaning tank (1). The baffle (612) is in a U shape.

5. The full-automatic silicon wafer cleaning machine according to claim 1, characterized in that An activity hole (705) is provided at a position on the outer surface of the rotating cylinder (703) between two corresponding clamping plates (704), and an elastic membrane (706) is fixedly connected inside the activity hole (705). An installation cylinder (707) is fixedly connected to a position near the middle of the inner surface of the elastic membrane (706), and a limiting rod (708) is movably connected to one end of the installation cylinder (707) away from the elastic membrane (706). A fixed rod (709) is fixedly connected inside the rotating cylinder (703), one end of the limiting rod (708) is movably connected to the installation cylinder (707), and the other end of the limiting rod (708) is fixedly connected to the fixed rod (709). A spring (713) is arranged inside the installation cylinder (707), one end of the spring (713) is fixedly connected to the limiting rod (708), and the other end of the spring (713) is fixedly connected to the installation cylinder (707).

6. The fully automatic silicon wafer cleaning machine according to claim 5, wherein A second motor (710) is provided at a position on the second side outer surface of the cleaning box (1) corresponding to the rotating shaft (702), and the output end of the second motor (710) penetrates into the installation hole (701) and is fixedly connected to the rotating shaft (702). The output end of the second motor (710) is rotatably connected to the installation hole (701). A touch switch (712) is provided at a position on the outer surface of the fixed rod (709) corresponding to the installation cylinder (707), and the touch switch (712) is electrically connected to the second motor (710). In the natural state, the elastic membrane (706) is located between two corresponding clamping plates (704) and is convex. Storage boxes are fixedly connected to positions on both side outer surfaces of the cleaning box (1) corresponding to the installation holes (701).

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