A headset

Abstract

The application mainly relates to an earphone, which comprises a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is used for supporting the core module to be worn on a wearing position. The core module comprises a core shell, a transducing device, a first vibration transmission sheet and a vibration panel. The transducing device is suspended in a containing cavity of the core shell through the first vibration transmission sheet. The vibration panel is connected with the transducing device and is used for transmitting mechanical vibration generated by the transducing device to a user. The mass of the core shell is less than or equal to 0.5 g. The rigidity of the first vibration transmission sheet is greater than or equal to 80000 N / m. The peak frequency of a resonance valley on a frequency response curve of the vibration panel is shifted to a high frequency band, which is beneficial to improving the medium frequency loss of the earphone and improving the acoustic performance of the earphone.

Description

[0001] This application is a divisional application of Chinese patent application filed on September 22, 2022, with application number 2022111610405 and invention title "An Earphone".

[0002] The parent application claims priority to Chinese Patent Application No. 2021112326083, filed on October 22, 2021, entitled "An Earphone", the contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the technical field of electronic devices, specifically to a pair of headphones. Background Technology

[0004] Headphones are widely used in people's daily lives, and they can be used with electronic devices such as mobile phones and computers to provide users with an auditory feast. Based on their working principle, headphones can generally be divided into air conduction headphones and bone conduction headphones; based on how users wear them, they can generally be divided into over-ear headphones, ear-hook headphones, and in-ear headphones; and based on the interaction method between headphones and electronic devices, they can generally be divided into wired headphones and wireless headphones. Summary of the Invention

[0005] In some embodiments, the earphone includes a mechanism module, which includes a mechanism housing, a transducer, a first vibrating plate, a vibrating panel, and a connector. The transducer is suspended within a cavity of the mechanism housing via the first vibrating plate. The mechanism housing includes an inner cylindrical wall and a first end wall and a second end wall connected to both ends of the inner cylindrical wall, respectively. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and together with the inner cylindrical wall form the cavity. The first end wall has a mounting hole. The vibrating panel is located outside the mechanism housing and is used to contact the user's skin. One end of the connector is connected to the vibrating panel, and the other end extends into the mechanism housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibrating panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0006] In some embodiments, the first transducer is located within the accommodating cavity.

[0007] In some embodiments, the first transducer is located on the side of the first end wall close to the second end wall.

[0008] In some embodiments, when viewed along the vibration direction, the area of ​​the mounting hole is smaller than the area of ​​the first vibration transducer.

[0009] In some embodiments, when viewed along the vibration direction, the cross-section of the inner cylinder wall is any one of a circle, an ellipse, or a polygon.

[0010] In some embodiments, the accommodating cavity communicates with the outside of the earphone only through a channel, which is the gap between the connector and the wall of the mounting hole;

[0011] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the second channel is connected to the outside of the earphone via an acoustic filter;

[0012] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the ratio between the opening area of ​​the second channel and the opening area of ​​the first channel is less than or equal to 10%.

[0013] In some embodiments, the Young's modulus of the first end wall and the second end wall is greater than or equal to 2000 MPa.

[0014] In some embodiments, when viewed along the vibration direction, the ratio between the area of ​​the mounting hole and the area of ​​the first end wall is less than or equal to 0.6.

[0015] In some embodiments, the gap between the connector and the wall of the mounting hole and the accommodating cavity form a Helmholtz resonant cavity, the peak resonant frequency of which is less than or equal to 4kHz.

[0016] In some embodiments, the peak resonant frequency of the Helmholtz resonator is less than or equal to 1 kHz.

[0017] In some embodiments, when viewed along the vibration direction, the ratio between the difference between the area of ​​the mounting hole and the area of ​​the connector and the area of ​​the mounting hole is greater than 0 and less than or equal to 0.5.

[0018] In some embodiments, the opening shape of the mounting hole is a polygon corresponding to the cross-sectional shape of the connector, or the opening shape of the mounting hole is a circle corresponding to the cross-sectional shape of the connector;

[0019] The gap between the connector and the wall of the mounting hole is greater than 0 and less than or equal to 2 mm.

[0020] In some embodiments, the gap between the connector and the wall of the mounting hole is greater than or equal to 0.1 mm and less than or equal to 1 mm.

[0021] In some embodiments, the number of the connectors is one, and the connector is connected to the central region of the vibration panel;

[0022] Alternatively, there may be multiple connectors, which are spaced apart around the center line of the vibration panel parallel to the vibration direction and connected to the transducer through a corresponding mounting hole.

[0023] Alternatively, there may be multiple connectors, one of which is connected to the central region of the vibration panel, and the remaining connectors are spaced apart around the connector located in the central region of the vibration panel. Each of the multiple connectors is connected to the transducer through a corresponding mounting hole.

[0024] In some embodiments, the Young's modulus of the vibrating panel is greater than or equal to 3000 MPa.

[0025] In some embodiments, the ratio of the absolute value of the difference between the stiffness of the vibrating panel and the stiffness of the first end wall to the larger of the stiffness of the vibrating panel and the stiffness of the first end wall is less than or equal to 0.4; and / or, the ratio of the absolute value of the difference between the stiffness of the vibrating panel and the stiffness of the second end wall to the larger of the stiffness of the vibrating panel and the stiffness of the second end wall is less than or equal to 0.4.

[0026] In some embodiments, when viewed along the vibration direction, the ratio between the area of ​​the vibrating panel and the area of ​​the first end wall is between 0.3 and 1.6.

[0027] In some embodiments, in the vibration direction, the thickness of the vibrating panel is between 0.3 mm and 3 mm; and / or, the gap between the vibrating panel and the first end wall is between 0.5 mm and 3 mm; and / or, the distance between the side of the first end wall away from the second end wall and the side of the second end wall away from the first end wall is between 6 mm and 16 mm.

[0028] In some embodiments, the side of the vibration panel opposite to the transducer includes a skin contact area for contact with the user's skin and an air conduction enhancement area that is at least partially not in contact with the user's skin. The vibration panel drives the air outside the earphone to vibrate through the air conduction enhancement area to generate sound waves.

[0029] In some implementations, when worn, the air conduction enhancement zone is at least partially directed toward the entrance of the external auditory canal of the user's ear to allow the sound waves to be directed toward the entrance of the external auditory canal.

[0030] In some embodiments, the air conduction enhancement region is at least partially inclined relative to the skin contact area and extends toward the transducer, and the inclination angle of the air conduction enhancement region relative to the skin contact area is between 0 and 75°.

[0031] And / or, the width of the orthogonal projection of the air conduction enhancement region along the vibration direction is greater than or equal to 1 mm.

[0032] In some embodiments, the vibrating panel has a major axis direction and a minor axis direction that are perpendicular to the vibration direction and orthogonal to each other, and the size of the vibrating panel in the major axis direction is larger than the size of the vibrating panel in the minor axis direction; wherein, in the wearing state, the major axis direction points towards the top of the user's head, and the minor axis direction points towards the entrance of the external auditory canal of the user's ear.

[0033] In some embodiments, when viewed along the vibration direction, the vibration panel is elliptical, rounded rectangular, or racetrack-shaped.

[0034] In some embodiments, the movement housing further includes a perimeter connected to one end of the movement housing near the vibration panel, the perimeter surrounding the vibration panel; wherein, in the non-wearing state, the perimeter is spaced apart from the vibration panel in a direction perpendicular to the vibration direction, and the side of the vibration panel opposite to the transducer protrudes at least partially from the side of the perimeter opposite to the transducer in the vibration direction.

[0035] In some embodiments, the perimeter is provided with a connecting hole for connecting the gap between the vibration panel and the core housing and the outside of the earphone.

[0036] In some embodiments, there are multiple connecting holes, and in the wearing state, the opening direction of at least one of the connecting holes is away from the top of the user's head, and the angle between the connecting hole and the user's vertical axis is between 0 and 10°.

[0037] In some embodiments, a gasket is provided between the vibration panel and the first end wall, and the Rockwell hardness of the gasket is less than that of the first vibration transmission plate.

[0038] In some embodiments, the mechanism module further includes an acoustic filter in communication with the accommodating cavity, the cutoff frequency of the acoustic filter being less than or equal to 5 kHz.

[0039] In some embodiments, the first end wall includes a first sub-end wall and a second sub-end wall spaced apart in the vibration direction, the mounting hole penetrating the first sub-end wall and the second sub-end wall along the vibration direction, and the first sub-end wall and the second sub-end wall cooperating with the inner cylinder wall to form the acoustic filter.

[0040] In some embodiments, the gap between the first sub-end wall and the second sub-end wall in the vibration direction of the transducer is between 0.5 mm and 5 mm.

[0041] In some embodiments, the transducer includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the accommodating cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction. The vibration panel is connected to the bracket.

[0042] In some embodiments, the magnetic circuit system and / or the movement housing are provided with a Helmholtz resonant cavity communicating with the accommodating cavity.

[0043] In some embodiments, the frequency response curve of the air-conducted sound output to the outside of the earphone through the mounting hole has a resonant peak, and the Helmholtz resonant cavity is configured to reduce the intensity of the resonant peak; the peak resonant frequency of the resonant peak is between 500 Hz and 4 kHz.

[0044] In some embodiments, the Helmholtz resonator is configured to reduce the vibration intensity of the frequency response curve of the air-conducted sound output to the outside of the earphone through the mounting hole within a preset frequency band, and the difference between the peak value of the vibration intensity when the opening connecting the Helmholtz resonator and the accommodating cavity is in the open state and the peak value of the vibration intensity when the opening connecting the Helmholtz resonator and the accommodating cavity is in the closed state is greater than or equal to 3dB.

[0045] In some embodiments, the support is provided with a connecting hole extending along the vibration direction;

[0046] And / or, the magnetic circuit system includes a magnetic shield and a magnet connected to the bottom of the magnetic shield, the magnet being connected to the central region of the second vibration transducer and spaced apart from the magnetic shield in a direction perpendicular to the vibration direction to form the magnetic gap, the coil extending between the magnet and the magnetic shield, and the magnetic shield having a communicating hole connecting the magnetic gap to the external space of the magnetic circuit system.

[0047] In some embodiments, the volume of the movement housing is less than or equal to 3 cm³. 3 .

[0048] In some embodiments, the headphones further include a headband assembly connected to the core module, the headband assembly being used to wrap around the user's head and to allow the core module to contact the user's cheek via the vibration panel.

[0049] In some embodiments, the earphone includes a mechanism module, which includes a mechanism housing, a transducer, a vibration panel, and a connector. The transducer is disposed within a cavity of the mechanism housing, which has a mounting hole. The vibration panel is located outside the mechanism housing and is for contact with the user's skin. One end of the connector is connected to the vibration panel, and the other end extends into the mechanism housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0050] The accommodating cavity is connected to the outside of the earphone only through a channel, which is the gap between the wall of the connector and the mounting hole.

[0051] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the second channel is connected to the outside of the earphone via an acoustic filter.

[0052] In some embodiments, the transducer includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the accommodating cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction. The vibration panel is connected to the bracket. When viewed along the vibration direction, the area of ​​the mounting hole is smaller than the area of ​​the first transducer plate.

[0053] In some embodiments, when viewed along the vibration direction, the ratio between the difference between the area of ​​the mounting hole and the area of ​​the connector and the area of ​​the mounting hole is greater than 0 and less than or equal to 0.5.

[0054] In some embodiments, the earphone includes a core module comprising a core housing, a transducer, a first transducer plate, a vibrating panel, and a connector. The transducer is suspended within a cavity of the core housing via the first transducer plate. The core housing has a mounting hole, and the core housing is configured to form a cavity that communicates with the outside only through the mounting hole. The vibrating panel is located outside the core housing and is used to contact the user's skin. One end of the connector is connected to the vibrating panel, and the other end extends into the core housing via the mounting hole and is connected to the transducer. The gap between the connector and the wall of the mounting hole is greater than 0 and less than or equal to 2 mm.

[0055] In some embodiments, the gap between the connector and the wall of the mounting hole is greater than or equal to 0.1 mm and less than or equal to 1 mm.

[0056] In some embodiments, the transducer includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the accommodating cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction. The vibration panel is connected to the bracket. When viewed along the vibration direction, the area of ​​the mounting hole is smaller than the area of ​​the first transducer plate.

[0057] In the earphone provided by this application, although the mechanical vibration generated by the transducer of the core module is partially transmitted to the core housing through the first transducer plate, based on the principle of acoustic dipole, the sound leakage generated by the two end walls of the core housing located in the vibration direction of the transducer cancels each other out in the far field. This not only helps to reduce the sound leakage of the earphone, but also allows for fewer or even no need to specially open sound leakage reduction holes on the core housing as in related technologies, thereby improving the waterproof and dustproof performance of the earphone.

[0058] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a first vibration transducer, and a vibration panel. The transducer is suspended within a cavity of the core housing via the first vibration transducer. The vibration panel is connected to the transducer and transmits the mechanical vibration generated by the transducer to the user. The core housing has a mass greater than or equal to 1g, and the stiffness of the first vibration transducer is less than or equal to 7000N / m.

[0059] In some embodiments, the mass of the movement housing is greater than or equal to 1.2g, and the stiffness of the first vibration transducer is less than or equal to 5000N / m.

[0060] In some embodiments, the ratio between the mass of the movement housing and the stiffness of the first transducer is greater than or equal to 0.15s. 2 .

[0061] In some embodiments, the ratio between the mass of the movement housing and the stiffness of the first transducer is greater than or equal to 0.2s. 2 .

[0062] In some embodiments, the transducer includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the accommodating cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer. The vibration panel is connected to the bracket.

[0063] In some embodiments, the stiffness of the second transducer is greater than or equal to 1000 N / m.

[0064] In some embodiments, when not worn, the frequency response curve of the vibration panel has a resonance valley generated by the first transmission plate, the peak resonant frequency of which is less than or equal to 400 Hz.

[0065] In some embodiments, the frequency response curve has at least one resonance peak generated by the first and second transducers in the frequency range of 200 Hz to 2 kHz.

[0066] In some embodiments, the at least one resonance peak includes a first resonance peak and a second resonance peak, wherein the peak resonant frequency of the first resonance peak is between 200 Hz and 400 Hz, and the peak resonant frequency of the second resonance peak is greater than the peak resonant frequency of the first resonance peak.

[0067] In some embodiments, when the stiffness of the first resonant plate changes, the absolute value of the shift in the peak resonant frequency of the second resonant peak is greater than the absolute value of the shift in the peak resonant frequency of the first resonant peak; when the stiffness of the second resonant plate changes, the absolute value of the shift in the peak resonant frequency of the first resonant peak is greater than the absolute value of the shift in the peak resonant frequency of the second resonant peak.

[0068] In some embodiments, the movement module further includes a connector. The movement housing includes an inner cylinder wall and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and form the accommodating cavity with the inner cylinder wall. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0069] In some embodiments, the earphone includes a mechanism module, which includes a mechanism housing, a transducer, a first vibrating element, and a vibrating panel. The transducer is suspended within a cavity of the mechanism housing via the first vibrating element. The vibrating panel is connected to the transducer and transmits the mechanical vibrations generated by the transducer to the user. The ratio between the mass of the mechanism housing and the stiffness of the first vibrating element is greater than or equal to 0.15s. 2 .

[0070] In the earphone provided by this application, although the mechanical vibration generated by the transducer of the core module is partially transmitted to the core housing via the first transducer plate, by setting the mass of the core housing to be greater than or equal to 1g and the stiffness of the first transducer plate to be less than or equal to 7000N / m, the peak frequency of the resonance valley on the frequency response curve of the vibration panel is shifted to a lower frequency band, which helps to improve the lack of mid-frequency in the earphone and thus improve the acoustic performance of the earphone.

[0071] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a first transducer plate, and a vibration panel. The transducer is suspended within a cavity of the core housing via the first transducer plate. The vibration panel is connected to the transducer and transmits the mechanical vibration generated by the transducer to the user. The core housing has a mass less than or equal to 0.5g, and the first transducer plate has a stiffness greater than or equal to 80000 N / m.

[0072] In some embodiments, the transducer includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the accommodating cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer. The vibration panel is connected to the bracket.

[0073] In some embodiments, the peripheral region of the second transducer is connected to the bracket, and the central region of the second transducer is connected to the magnetic circuit system.

[0074] In some embodiments, when not worn, the frequency response curve of the vibration panel has a resonance valley generated by the first transmission plate, the peak resonant frequency of which is greater than or equal to 2kHz.

[0075] In some embodiments, the frequency response curve has a first resonance peak and a second resonance peak jointly generated by the first and second resonant plates, wherein the peak resonant frequency of the first resonance peak is less than the peak resonant frequency of the resonance valley, and the peak resonant frequency of the second resonance peak is greater than the peak resonant frequency of the resonance valley.

[0076] In some implementations, the peak resonant frequency of the first resonant peak is between 200 Hz and 400 Hz.

[0077] In some embodiments, the movement module further includes a connector. The movement housing includes an inner cylinder wall and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and form the accommodating cavity with the inner cylinder wall. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0078] In some embodiments, the accommodating cavity communicates with the outside of the earphone only through a channel, which is the gap between the connector and the wall of the mounting hole;

[0079] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the second channel is connected to the outside of the earphone via an acoustic filter;

[0080] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the ratio between the opening area of ​​the second channel and the opening area of ​​the first channel is less than or equal to 10%.

[0081] In some embodiments, the receiving cavity communicates with the outside of the earphone through a channel, the channel being the gap between the wall of the connector and the mounting hole, and the mechanism module further includes a sealing membrane that seals the channel.

[0082] In some embodiments, the sealing membrane includes an integrally connected first connecting portion, a pleated portion, and a second connecting portion, wherein the pleated portion forms a recessed area between the first connecting portion and the second connecting portion, the first connecting portion is connected to the first end wall, and the second connecting portion is connected to the connector or the vibration panel.

[0083] In the earphones provided by this application, although the mechanical vibration generated by the transducer of the core module is partially transmitted to the core housing via the first transducer plate, by setting the mass of the core housing to be less than or equal to 0.5g and the stiffness of the first transducer plate to be greater than or equal to 80000N / m, the peak frequency of the resonance valley on the frequency response curve of the vibration panel is shifted to a higher frequency band, which helps to improve the lack of mid-frequency in the earphones and thus improve the acoustic performance of the earphones.

[0084] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a first transducer plate, and a vibrating panel. The transducer is suspended within a cavity of the core housing via the first transducer plate. The vibrating panel is connected to the support and transmits the mechanical vibration generated by the transducer to the user. The core module is configured such that, in the non-wearing state, the frequency response curve of the vibrating panel has no effective resonance valley in the frequency range of 400Hz to 2kHz. The frequency response curve characterizes the relationship between the intensity and frequency of the vibration of the vibrating panel. An effective resonance valley is defined as a reference line segment parallel to the horizontal axis of the frequency response curve intersecting the frequency response curve at two points. The intensity corresponding to the reference line segment minus the peak resonance intensity of the effective resonance valley equals 6dB, and the frequency difference between the two endpoints of the reference line segment is less than or equal to four octaves.

[0085] In some embodiments, the mass of the movement housing and / or the stiffness of the first transducer are set such that the frequency response curve has no effective resonance valley in the frequency range of 400 Hz to 2 kHz.

[0086] In some embodiments, the transducer includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the accommodating cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer. The vibration panel is connected to the bracket.

[0087] In some embodiments, the mass of the movement housing and / or the stiffness of the first transducer are configured such that the frequency response curve has the effective resonance valley in the frequency range of 200Hz to 400Hz.

[0088] In some embodiments, the mass of the mechanism housing is greater than or equal to 1g, and the stiffness of the first vibration transducer is less than or equal to 7000N / m.

[0089] In some embodiments, the frequency response curve has two resonance peaks generated by the first and second transducers in the frequency range of 400 Hz to 2 kHz.

[0090] In some embodiments, the stiffness of the second transducer is greater than or equal to 1000 N / m.

[0091] In some embodiments, the mass of the movement housing and / or the stiffness of the first transducer are configured such that the frequency response curve has the effective resonance valley in the frequency range of 2 kHz to 20 kHz.

[0092] In some embodiments, the mass of the movement housing is less than or equal to 0.5g, and the stiffness of the first vibration transducer is greater than or equal to 80000N / m.

[0093] In some embodiments, the mass of the movement housing and / or the stiffness of the first transducer are set such that the frequency response curve has no effective resonance valley in the frequency range of 200 Hz to 2 kHz.

[0094] In some embodiments, the mass of the mechanism housing is greater than or equal to 1g, and the stiffness of the first vibration transducer is less than or equal to 2500N / m;

[0095] Alternatively, the mass of the core housing is less than or equal to 0.5g, and the stiffness of the first vibration transducer is greater than or equal to 80000N / m.

[0096] In some embodiments, the mass of the movement housing and / or the stiffness of the first transducer are configured such that the frequency response curve has no effective resonance valley in the frequency range of 200 Hz to 4 kHz.

[0097] In some embodiments, the mass of the mechanism housing is greater than or equal to 1g, and the stiffness of the first vibration transducer is less than or equal to 2500N / m;

[0098] Alternatively, the mass of the core housing is less than or equal to 0.5g, and the stiffness of the first vibration transducer is greater than or equal to 160000N / m.

[0099] In some embodiments, the frequency response curve has at least one resonance peak generated by the first and second transducers in the frequency range of 200 Hz to 2 kHz.

[0100] In some embodiments, the mass of the mechanism housing is greater than or equal to 1g, the stiffness of the first vibration transducer is less than or equal to 2500N / m, and the stiffness of the second vibration transducer is less than or equal to 100000N / m.

[0101] Alternatively, the mass of the mechanism housing is less than or equal to 0.5g, the stiffness of the first vibration transducer is greater than or equal to 80000N / m, and the stiffness of the second vibration transducer is between 1000N / m and 500000N / m.

[0102] In some embodiments, the movement module further includes a connector. The movement housing includes an inner cylinder wall and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and form the accommodating cavity with the inner cylinder wall. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0103] In some implementations, the non-wearing state is defined as the earphones not being worn on the user's head, the support assembly being fixed, and the core module being cantilevered relative to the support assembly.

[0104] In the above manner, the core module of the earphone provided in this application is configured such that the frequency response curve of the vibrating panel in the non-wearing state has no effective resonance valley in the frequency range of 400Hz to 2kHz, which helps to improve the lack of mid-frequency in the earphone and thus improve the acoustic performance of the earphone.

[0105] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a first transducer plate, and a vibrating panel. The transducer is suspended within a cavity of the core housing via the first transducer plate and includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer. The vibrating panel is connected to the bracket and is used to... The generated mechanical vibration is transmitted to the user; wherein, in the non-wearing state, the frequency response curve of the vibration panel has a first resonance peak and a second resonance peak jointly generated by the first and second vibration transmission plates, the peak resonant frequency of the first resonance peak is less than the peak resonant frequency of the second resonance peak, and there is no effective resonance valley between the first and second resonance peaks; the frequency response curve is used to characterize the relationship between the intensity and frequency of the vibration of the vibration panel, and the effective resonance valley is defined as a reference line segment parallel to the horizontal axis of the frequency response curve that intersects the frequency response curve at two points, the intensity corresponding to the reference line segment minus the peak resonant intensity of the effective resonance valley is equal to 6dB, and the frequency difference between the two endpoints of the reference line segment is less than or equal to 4 octaves.

[0106] In some embodiments, the mass of the movement housing is greater than or equal to 1g, the stiffness of the first vibration transducer is less than or equal to 7000N / m, and the stiffness of the second vibration transducer is greater than or equal to 1000N / m.

[0107] In some embodiments, the mass of the movement housing is greater than or equal to 1.2g, the stiffness of the first vibration transducer is less than or equal to 5000N / m, and the stiffness of the second vibration transducer is greater than or equal to 3000N / m.

[0108] In some implementations, the stiffness of the second vibration transducer is greater than that of the first vibration transducer.

[0109] In some embodiments, when the stiffness of the first resonant plate changes, the absolute value of the shift in the peak resonant frequency of the second resonant peak is greater than the absolute value of the shift in the peak resonant frequency of the first resonant peak; when the stiffness of the second resonant plate changes, the absolute value of the shift in the peak resonant frequency of the first resonant peak is greater than the absolute value of the shift in the peak resonant frequency of the second resonant peak.

[0110] In some embodiments, the peak resonant frequency of the first resonant peak is between 80 Hz and 400 Hz, and the peak resonant frequency of the second resonant peak is between 100 Hz and 2 kHz.

[0111] In some embodiments, the peripheral region of the second transducer is connected to the bracket, and the central region of the second transducer is connected to the magnetic circuit system.

[0112] In some embodiments, the movement module further includes a connector. The movement housing includes an inner cylinder wall and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and form the accommodating cavity with the inner cylinder wall. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0113] In some embodiments, the receiving cavity communicates with the outside of the earphone through a channel, the channel being the gap between the wall of the connector and the mounting hole, and the mechanism module further includes a sealing membrane that seals the channel.

[0114] In some embodiments, the sealing membrane includes an integrally connected first connecting portion, a pleated portion, and a second connecting portion, wherein the pleated portion forms a recessed area between the first connecting portion and the second connecting portion, the first connecting portion is connected to the first end wall, and the second connecting portion is connected to the connector or the vibration panel.

[0115] In the above manner, in the headphones provided by this application, there is no effective resonance valley between the two resonance peaks generated by the first and second transmission plates on the frequency response curve of the vibration panel. This not only helps to increase the flatness of the aforementioned frequency response curve between the two resonance peaks, but also helps to avoid the problem of a certain frequency point or frequency band being missing between the two resonance peaks, thereby improving the acoustic performance of the headphones.

[0116] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a first transducer plate, and a vibrating panel. The transducer is suspended within a cavity of the core housing via the first transducer plate and includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate, and the second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the cavity. The coil is connected to the... A bracket is connected and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer. The vibration panel is connected to the bracket and is used to transmit the mechanical vibration generated by the transducer to the user. In the non-wearing state, the frequency response curve of the vibration panel has a resonance valley generated by the first transmission plate, and a first resonance peak and a second resonance peak jointly generated by the first and second transmission plates. The peak resonant frequency of the resonance valley is less than the peak resonant frequency of the first resonance peak, and the peak resonant frequency of the first resonance peak is less than the peak resonant frequency of the second resonance peak.

[0117] In some implementations, the peak resonant frequency of the resonant valley is greater than or equal to 400 Hz.

[0118] In some embodiments, the mass of the movement housing is less than or equal to 1g, the stiffness of the first vibration transducer is greater than or equal to 7000N / m, and the stiffness of the second vibration transducer is greater than or equal to 1000N / m.

[0119] In some implementations, the peak resonant frequency of the second resonant peak is less than or equal to 1 kHz.

[0120] In some embodiments, the mass of the mechanism housing is less than or equal to 1g, the stiffness of the first vibration transducer is greater than or equal to 7000N / m, and the stiffness of the second vibration transducer is between 20000N / m and 50000N / m.

[0121] In some embodiments, the peripheral region of the second transducer is connected to the bracket, and the central region of the second transducer is connected to the magnetic circuit system.

[0122] In some embodiments, the movement module further includes a connector. The movement housing includes an inner cylinder wall and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and form the accommodating cavity with the inner cylinder wall. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0123] In some embodiments, the accommodating cavity communicates with the outside of the earphone only through a channel, which is the gap between the connector and the wall of the mounting hole;

[0124] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the second channel is connected to the outside of the earphone via an acoustic filter;

[0125] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the ratio between the opening area of ​​the second channel and the opening area of ​​the first channel is less than or equal to 10%.

[0126] In some embodiments, the receiving cavity communicates with the outside of the earphone through a channel, the channel being the gap between the wall of the connector and the mounting hole, and the mechanism module further includes a sealing membrane that seals the channel.

[0127] In some embodiments, the sealing membrane includes an integrally connected first connecting portion, a pleated portion, and a second connecting portion, wherein the pleated portion forms a recessed area between the first connecting portion and the second connecting portion, the first connecting portion is connected to the first end wall, and the second connecting portion is connected to the connector or the vibration panel.

[0128] In the headphones provided by this application, although the frequency response curve of the vibration panel has a resonance valley generated by the first transmission plate, the peak resonant frequency of the resonance valley is less than the peak resonant frequency of the two resonance peaks generated by the first and second transmission plates on the aforementioned frequency response curve. This not only helps to avoid the problem of a missing frequency point or frequency band between the two resonance peaks in the aforementioned frequency response curve, but also helps to increase the flatness of the aforementioned frequency response curve between the two resonance peaks, and helps the resonance valley to shift to a lower frequency band, thereby improving the acoustic performance of the headphones.

[0129] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a first transducer plate, and a vibrating panel. The transducer is suspended within a cavity of the core housing via the first transducer plate and includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the core housing via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer. The vibrating panel is connected to the bracket and transmits the mechanical vibration generated by the transducer to the user. In the non-wearing state, the frequency response curve of the vibrating panel has a resonance peak strongly correlated with the stiffness of the bracket, where the stiffness of the bracket is greater than or equal to 100,000 N / m, and the peak resonant frequency of the resonance peak is greater than or equal to 4 kHz.

[0130] In some embodiments, the support is made of any one of polycarbonate, nylon, or plastic titanium;

[0131] Alternatively, the support may include a matrix and a reinforcement, wherein the matrix is ​​made of any one of polycarbonate, nylon, or plastic titanium, and the reinforcement is glass fiber or carbon fiber doped in the matrix, or the reinforcement is aluminum alloy or stainless steel formed on the matrix by a die-casting process.

[0132] In some embodiments, the ratio between the average thickness of the support and the area of ​​the support is greater than or equal to 0.01 mm. -1 The area of ​​the support is defined as the area of ​​the orthogonal projection of the support along the vibration direction, and the average thickness of the support is defined as the volume of the support divided by the area of ​​the support.

[0133] In some embodiments, the mass of the movement housing and / or the stiffness of the first transducer are set such that the frequency response curve has no effective resonance valley in the frequency range of 400Hz to 2kHz. The effective resonance valley is defined as a reference line segment parallel to the horizontal axis of the frequency response curve that intersects the frequency response curve at two points, the intensity corresponding to the reference line segment minus the peak resonance intensity of the effective resonance valley is equal to 6dB, and the frequency difference between the two endpoints of the reference line segment is less than or equal to 4 octaves.

[0134] In some embodiments, the mass of the movement housing and / or the stiffness of the first transducer are configured such that the frequency response curve has the effective resonance valley in the frequency range of 200Hz to 400Hz.

[0135] In some embodiments, the mass of the mechanism housing is greater than or equal to 1g, and the stiffness of the first vibration transducer is less than or equal to 7000N / m.

[0136] In some embodiments, the frequency response curve has two resonance peaks generated by the first and second transducers in the frequency range of 400 Hz to 2 kHz.

[0137] In some embodiments, the stiffness of the second transducer is greater than or equal to 1000 N / m.

[0138] In some embodiments, the movement module further includes a connector. The movement housing includes an inner cylinder wall and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and form the accommodating cavity with the inner cylinder wall. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0139] In some embodiments, the accommodating cavity communicates with the outside of the earphone only through a channel, which is the gap between the connector and the wall of the mounting hole;

[0140] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the second channel is connected to the outside of the earphone via an acoustic filter;

[0141] Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the ratio between the opening area of ​​the second channel and the opening area of ​​the first channel is less than or equal to 10%.

[0142] In the above manner, although the frequency response curve of the vibration panel in the headphones provided by this application has a resonance peak that is strongly correlated with the stiffness of the bracket, the stiffness of the bracket is greater than or equal to 100,000 N / m, so that the peak resonant frequency of the aforementioned resonance peak is greater than or equal to 4 kHz, thereby making the mid-high frequency range and above of the aforementioned frequency response curve as flat as possible, which is beneficial to improving the acoustic performance of the headphones.

[0143] In some embodiments, the headphones include a headband assembly and a core module connected to the headband assembly. The headband assembly is used to wrap around the user's head and allow the core module to contact the user's cheek. The core module includes a transducer and transmits mechanical vibrations generated by the transducer via bone conduction. The headband assembly applies a clamping force between 0.4 N and 0.8 N to press the core module against the user's cheek, and the contact area between the core module and the user's cheek is between 400 mm². 2 With 600mm 2 between.

[0144] In some embodiments, the mechanism module further includes a mechanism housing, a first vibration transducer, and a vibration panel. The mechanism housing is connected to the headband assembly, the transducer is suspended within the housing cavity of the mechanism housing via the first vibration transducer, and the vibration panel is connected to the transducer and is used to contact the user's skin. The pressure exerted by the vibration panel on the user's cheek is less than the pressure exerted by the headband assembly on the user's cheek, and the contact area between the vibration panel and the user's cheek is less than the contact area between the mechanism module and the user's cheek.

[0145] In some embodiments, the pressure force exerted by the vibrating panel on the user's cheek is between 0.1 N and 0.7 N, and the contact area with the user's cheek is between 180 mm². 2 With 300mm 2 between.

[0146] In some embodiments, the movement module further includes a rim connected to one end of the movement housing near the vibrating panel, the rim surrounding the vibrating panel and for contact with the user's cheek; wherein, in the non-wearing state, the rim is spaced apart from the vibrating panel in a direction perpendicular to the vibration direction of the transducer, and the side of the vibrating panel opposite to the transducer protrudes at least partially from the side of the rim opposite to the transducer in the vibration direction.

[0147] In some embodiments, the side of the vibration panel facing away from the transducer includes a skin contact area for contact with the user's skin and an edge area connected to the skin contact area. The edge area is located around the skin contact area and is spaced apart from the skin contact area in the vibration direction. The edge includes a connecting portion connected to the housing and a limiting portion connected to the connecting portion. The limiting portion is located on the side of the vibration panel facing away from the transducer. When viewed along the vibration direction, the limiting portion overlaps with the edge area and is offset from the skin contact area. In the non-wearing state, the skin contact area protrudes from the limiting portion on the side facing away from the transducer in the vibration direction.

[0148] In some embodiments, the side of the vibration panel opposite to the transducer also includes an air conduction enhancement area connected between the skin contact area and the edge area. The air conduction enhancement area is at least partially not in contact with the user's skin, and the vibration panel drives the air outside the earphone to vibrate to form sound waves through the air conduction enhancement area.

[0149] In some implementations, when worn, the air conduction enhancement zone is at least partially directed toward the entrance of the external auditory canal of the user's ear to allow the sound waves to be directed toward the entrance of the external auditory canal.

[0150] In some embodiments, the air conduction enhancement region is at least partially tilted relative to the skin contact area, and the tilt angle of the air conduction enhancement region relative to the skin contact area is between 0 and 75°.

[0151] And / or, the width of the orthogonal projection of the air conduction enhancement region along the vibration direction is greater than or equal to 1 mm.

[0152] In some embodiments, the vibrating panel has a major axis direction and a minor axis direction that are perpendicular to the vibration direction and orthogonal to each other, and the size of the vibrating panel in the major axis direction is larger than the size of the vibrating panel in the minor axis direction; wherein, in the wearing state, the major axis direction points towards the top of the user's head, and the minor axis direction points towards the entrance of the external auditory canal of the user's ear.

[0153] In some embodiments, the perimeter is provided with a connecting hole for connecting the gap between the vibration panel and the core housing and the outside of the earphone; wherein, there are multiple connecting holes, at least one of the connecting holes has its opening direction away from the top of the user's head, and the angle between the connecting hole and the user's vertical axis is between 0 and 10°.

[0154] Through the above method, the headphones provided in this application not only have a headband assembly that applies a clamping force between 0.4N and 0.8N to press the core module against the user's cheek, ensuring that the headphones are not unstable due to insufficient clamping force and that the mechanical vibrations generated by the core module are transmitted to the user, nor are they uncomfortable due to excessive clamping force, but also have a contact area between the core module and the user's cheek of between 400mm². 2 With 600mm 2 The spacing between these areas ensures that the contact area of ​​the core module is neither too small, causing discomfort, nor too large, resulting in a poor fit to the user's cheek. This allows users to enjoy excellent wearing stability, comfort, and good sound quality when using the headphones.

[0155] In some embodiments, the headphones include a headband assembly and a core module. The headband assembly includes an arc-shaped headband member and an adapter. The arc-shaped headband member is used to wrap around the user's head. The two ends of the adapter are respectively connected to the arc-shaped headband member and the core module, allowing the core module to move closer to or further away from the arc-shaped headband member in the extension direction of the headband assembly. The core module includes a transducer and transmits mechanical vibrations generated by the transducer via bone conduction. The headband assembly applies a clamping force between 0.4N and 0.8N to press the core module against the user's cheek.

[0156] In some embodiments, the adapter and the movement module are provided at both ends of the arc-shaped head beam. The head beam assembly provides a first clamping force to the movement module in a first use state and a second clamping force to the movement module in a second use state. The absolute value of the difference between the second clamping force and the first clamping force is between 0 and 0.1N.

[0157] The first usage state is defined as a usage state in which each of the adapters has a first extension amount relative to the arc-shaped head beam and there is a first gap between the two movement modules. The second usage state is defined as a usage state in which each of the adapters has a second extension amount relative to the arc-shaped head beam and there is a second gap between the two movement modules, wherein the second extension amount is greater than the first extension amount and the second gap is greater than the first gap.

[0158] In some implementations, the first extension is at its minimum when the movement module is closest to the curved head beam; and the second extension is at its maximum when the movement module is furthest from the curved head beam.

[0159] In some embodiments, when each of the movement modules is closest to or furthest from the arc-shaped headband, the adapters at both ends of the arc-shaped headband are symmetrically arranged relative to the first reference plane. The second reference plane passes through the line connecting the two ends of the arc-shaped headband and intersects the first reference plane perpendicularly. When the arc-shaped headband is in its natural state, the arc-shaped headband and the adapters are projected onto the second reference plane. When the movement module is closest to the arc-shaped headband, the free end of the adapter for connecting the movement module has a first position. When the movement module is furthest from the arc-shaped headband, the free end has a second position. The line connecting the first position and the second position has a first projection component in a first reference direction parallel to the line connecting the two ends of the arc-shaped headband, and a second projection component in a second reference direction perpendicular to the line connecting the two ends of the arc-shaped headband. The ratio of the second projection component to the first projection component is greater than or equal to 2.

[0160] And / or, the ratio between the cross-sectional bending stiffness of the adapter and the cross-sectional bending stiffness of the arc-shaped head beam is less than or equal to 0.9.

[0161] In some embodiments, the earphone further includes an adapter housing rotatably connected to one end of the adapter away from the curved headband, the mechanism module further includes a mechanism housing rotatably connected to the adapter housing, the transducer is disposed within the receiving cavity of the mechanism housing, and the axis of rotation of the mechanism housing relative to the adapter housing intersects the axis of rotation of the adapter housing relative to the adapter.

[0162] In some embodiments, the adapter housing is provided with a pivot cavity, the adapter is inserted into the pivot cavity along the axial direction of the pivot cavity, and the earphone further includes a locking member for limiting the adapter along the axial direction of the pivot cavity so that the adapter is held in the pivot cavity. A limiting groove is formed on the outer peripheral wall of the adapter, and a limiting block is provided on the inner peripheral wall of the pivot cavity. The limiting block is embedded in the limiting groove to limit the rotation angle of the adapter relative to the pivot cavity.

[0163] In some embodiments, the free end of the adapter is provided with a slot, and after the adapter is inserted into the shaft cavity from one end, the slot is exposed from the other end of the shaft cavity, the locking member is locked in the slot, and the radial dimension of the locking member is larger than the radial dimension of the shaft cavity.

[0164] In some implementations, the rotation angle is between 5° and 15°.

[0165] In some embodiments, the earphone further includes a battery and a mainboard coupled to the transducer, the adapter housing includes a middle plate rotatably connected to the adapter and an outer shell connected to the middle plate, the battery or the mainboard is disposed between the outer shell and the middle plate, and the core housing is rotatably connected to the adapter housing and located on the side of the middle plate opposite to the outer shell.

[0166] In some embodiments, the movement module further includes a first transducer and a vibration panel. The transducer is suspended within the housing cavity of the movement housing via the first transducer. The vibration panel is connected to the transducer and is used to contact the user's skin. The pressure force of the vibration panel on the user's cheek is less than the pressure force of the headband assembly pressing the movement module against the user's cheek, and the contact area between the vibration panel and the user's cheek is less than the contact area between the movement module and the user's cheek.

[0167] Through the above method, the headband assembly of the headphones provided in this application is configured with an adjustable arc length, so that the headphones can be worn by users with different head sizes. When users with different head sizes wear the headphones, the headband assembly applies a clamping force between 0.4N and 0.8N to press the core module against the user's cheek. This prevents the headphones from becoming unstable due to insufficient clamping force and reducing the mechanical vibrations generated by the core module transmitted to the user, and also prevents discomfort due to excessive clamping force. As a result, users can obtain excellent wearing stability and comfort as well as good sound quality when using the headphones.

[0168] In some embodiments, the headphones include a headband assembly, an adapter housing rotatably connected to the headband assembly, a core module connected to the adapter housing, and a battery and a mainboard coupled to the core module. The headband assembly is used to wrap around the user's head and allow the core module to contact the user's cheek. The adapter housing includes a middle plate rotatably connected to the headband assembly and a outer shell connected to the middle plate. The battery or the mainboard is disposed between the outer shell and the middle plate. The core module includes a core housing rotatably connected to the adapter housing and a transducer disposed within a cavity of the core housing. The core housing and the outer shell are located on opposite sides of the middle plate.

[0169] In some embodiments, the movement housing rotates about a first axis relative to the adapter housing, and the adapter housing rotates about a second axis relative to the headband assembly, the first axis and the second axis intersecting on a reference plane perpendicular to the vibration direction of the transducer.

[0170] In some embodiments, the movement module further includes a first transducer and a vibration panel, the transducer being suspended within the housing cavity of the movement housing via the first transducer, and the vibration panel being connected to the transducer and used for contact with the user's skin.

[0171] In some embodiments, the movement module further includes a connector. The movement housing includes an inner cylinder wall connected to the adapter housing and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and together with the inner cylinder wall form the receiving cavity. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0172] In some embodiments, when viewed along the vibration direction, the ratio between the area of ​​the mounting hole and the area of ​​the first end wall is less than or equal to 0.6.

[0173] In some embodiments, when viewed along the vibration direction, the ratio between the difference between the area of ​​the mounting hole and the area of ​​the connector and the area of ​​the mounting hole is greater than 0 and less than or equal to 0.5.

[0174] In some embodiments, the side of the vibration panel facing away from the transducer includes a skin contact area for contact with the user's skin and an edge area connected to the skin contact area. The edge area is located around the skin contact area and is spaced apart from the skin contact area in the vibration direction of the transducer. The movement module also includes a perimeter connected to one end of the inner cylinder wall away from the second end wall. The perimeter includes a connecting portion connected to the inner cylinder wall and a limiting portion connected to the connecting portion. The limiting portion is located on the side of the vibration panel facing away from the transducer. When viewed along the vibration direction, the limiting portion overlaps with the edge area and is offset from the skin contact area. In the non-wearing state, the skin contact area protrudes from the limiting portion on the side facing away from the transducer in the vibration direction.

[0175] In some embodiments, the side of the vibration panel opposite to the transducer also includes an air conduction enhancement area connected between the skin contact area and the edge area. The air conduction enhancement area is at least partially not in contact with the user's skin, and the vibration panel drives the air outside the earphone to vibrate to form sound waves through the air conduction enhancement area.

[0176] In some embodiments, the air conduction enhancement region is at least partially tilted relative to the skin contact area, and the tilt angle of the air conduction enhancement region relative to the skin contact area is between 0 and 75°.

[0177] And / or, the width of the orthogonal projection of the air conduction enhancement region along the vibration direction is greater than or equal to 1 mm.

[0178] In some embodiments, the headband assembly includes an arc-shaped headband component and an adapter component. The arc-shaped headband component is used to wrap around the top of the user's head. The adapter component includes a first connecting segment, an intermediate transition segment, and a second connecting segment connected in sequence. The first connecting segment is connected to the arc-shaped headband component, and the second connecting segment is rotatably connected to the middle plate. The first connecting segment and the second connecting segment are respectively bent and extended in the opposite direction relative to the intermediate transition segment so that, when worn and viewed along the direction of the human coronal axis, the arc-shaped headband component is located above the user's ear, and the movement module is located in front of the user's ear.

[0179] In some embodiments, the bending angle of the first connecting segment relative to the intermediate transition segment is greater than or equal to 90° and less than 180°; and / or, the bending angle of the second connecting segment relative to the intermediate transition segment is greater than or equal to 90° and less than 180°.

[0180] In some embodiments, when worn and viewed along the direction of the human coronal axis, the first connecting segment and the second connecting segment are parallel, and the distance between the first connecting segment and the second connecting segment is between 20 mm and 30 mm.

[0181] In the above manner, the headphones provided in this application not only have the core module rotatably connected to the headband assembly through the adapter shell, making it fit the user's cheek better, but also have the battery or motherboard placed inside the adapter shell and separated from the core module, making the headphone structure more compact and ensuring that the various structural components do not interfere with each other.

[0182] In some embodiments, the earphone includes an adapter housing and a core module. The core module includes a core housing rotatably connected to the adapter housing, a transducer disposed within a cavity of the core housing, and a perimeter connected to one end of the core housing away from the adapter housing. The perimeter includes a connecting portion connected to the core housing and a flange portion connected to the connecting portion. Viewed along the vibration direction of the transducer, the flange portion is located on the periphery of the core housing and overlaps with the adapter housing. In the non-wearing state, taking the axis of rotation of the core housing relative to the adapter housing as a starting point, the gap between the flange portion and the adapter housing in the vibration direction gradually increases along a reference direction. The reference direction is defined as a direction perpendicular to the vibration direction and the direction of the axis and away from the axis.

[0183] In some embodiments, the maximum gap between the flange and the adapter housing in the vibration direction is between 2 mm and 5 mm.

[0184] In some embodiments, when viewed along the axis, the flange portion is arc-shaped on the side facing the adapter housing.

[0185] In some embodiments, the radius of the arc of the flange portion facing the adapter housing is greater than or equal to 50 mm.

[0186] In some embodiments, the movement module further includes a first transducer and a vibration panel. The transducer is suspended within the housing cavity of the movement via the first transducer. The vibration panel is connected to the transducer and is used to contact the user's skin. The rim surrounds the vibration panel. In the non-wearing state, the rim is spaced apart from the vibration panel in a direction perpendicular to the vibration direction. The side of the vibration panel facing away from the transducer protrudes at least partially from the side of the rim facing away from the transducer in the vibration direction.

[0187] In some embodiments, the side of the vibration panel facing away from the transducer includes a skin contact area for contact with the user's skin and an edge area connected to the skin contact area. The edge area is located around the skin contact area and is spaced apart from the skin contact area in the vibration direction. The edge also includes a limiting portion connected to the connecting portion, which is located on the side of the vibration panel facing away from the transducer. When viewed along the vibration direction, the limiting portion overlaps with the edge area and is offset from the skin contact area. In the non-wearing state, the skin contact area protrudes from the limiting portion on the side facing away from the transducer in the vibration direction.

[0188] In some embodiments, the side of the vibration panel opposite to the transducer also includes an air conduction enhancement area connected between the skin contact area and the edge area. The air conduction enhancement area is at least partially not in contact with the user's skin, and the vibration panel drives the air outside the earphone to vibrate to form sound waves through the air conduction enhancement area.

[0189] In some embodiments, the air conduction enhancement region is at least partially tilted relative to the skin contact area, and the tilt angle of the air conduction enhancement region relative to the skin contact area is between 0 and 75°.

[0190] And / or, the width of the orthogonal projection of the air conduction enhancement region along the vibration direction is greater than or equal to 1 mm.

[0191] In some embodiments, the headphones further include a headband assembly connected to the adapter housing. The headband assembly is used to wrap around the top of the user's head and allow the core module to contact the user's cheek. The headband assembly includes an arc-shaped headband component and an adapter component. The arc-shaped headband component is used to wrap around the top of the user's head. The adapter component includes a first connecting segment, an intermediate transition segment, and a second connecting segment connected in sequence. The first connecting segment is connected to the arc-shaped headband component, and the second connecting segment is connected to the adapter housing. The first connecting segment and the second connecting segment are respectively bent and extended in the opposite direction relative to the intermediate transition segment so that, when worn and viewed along the direction of the human coronal axis, the arc-shaped headband component is located above the user's ear, and the core module is located in front of the user's ear.

[0192] In some embodiments, the bending angle of the first connecting segment relative to the intermediate transition segment is greater than or equal to 90° and less than 180°; and / or, the bending angle of the second connecting segment relative to the intermediate transition segment is greater than or equal to 90° and less than 180°.

[0193] In some embodiments, when worn and viewed along the direction of the human coronal axis, the first connecting segment and the second connecting segment are parallel, and the distance between the first connecting segment and the second connecting segment is between 20 mm and 30 mm.

[0194] In the above manner, the earphone provided in this application not only has a rotating connection between the core module and the adapter housing, making it fit the user's cheek better, but also the gap between the flange of its perimeter and the adapter housing is larger the further away from the rotating connection point. Compared with the aforementioned gap remaining unchanged, this helps to reduce the overall size of the core module and the adapter housing in the vibration direction of the transducer, making the earphone structure more compact.

[0195] In some embodiments, the earphone includes an adapter housing and a core module. The adapter housing includes a cylindrical sidewall located around the core module. The core module includes a core housing and a transducer disposed within a cavity of the core housing. The core housing includes a first core housing, which includes an inner cylindrical wall and an outer cylindrical wall. The inner cylindrical wall is located around the transducer, and the outer cylindrical wall is located around the inner cylindrical wall and spaced apart from the inner cylindrical wall in a direction perpendicular to the vibration direction of the transducer. One of the outer cylindrical wall and the cylindrical sidewall is provided with a shaft hole, and the other is provided with a rotating shaft that mates with the shaft hole. The rotating shaft is inserted into the shaft hole to allow the core housing to rotate relative to the adapter housing.

[0196] In some embodiments, the first movement housing further includes a reinforcing post connected between the outer cylinder wall and the inner cylinder wall, the rotating shaft is provided on the side of the cylindrical sidewall facing the outer cylinder wall, and the shaft hole is provided on the reinforcing post.

[0197] In some embodiments, the first mechanism housing further includes a transition wall and a cover plate connected between the inner cylinder wall and the outer cylinder wall. The cover plate and the transition wall are spaced apart in the vibration direction and together with the outer cylinder wall, the inner cylinder wall and the transition wall, form a Helmholtz resonant cavity. The Helmholtz resonant cavity is in communication with the accommodating cavity to absorb the acoustic energy of the sound waves generated by the air in the accommodating cavity as the transducer vibrates.

[0198] In some embodiments, the frequency response curve of the sound wave has a resonance peak, the peak resonant frequency of which is between 500 Hz and 4 kHz, and the difference between the peak resonant intensity of the resonance peak when the opening connecting the Helmholtz resonator and the accommodating cavity is open and the peak resonant intensity of the resonance peak when the opening connecting the Helmholtz resonator and the accommodating cavity is closed is greater than or equal to 3 dB.

[0199] In some embodiments, the first core housing further includes an end wall and a transition wall. The end wall is connected to one end of the inner cylinder wall and forms the accommodating cavity. The transition wall connects the inner cylinder wall and the outer cylinder wall. The adapter housing further includes a middle plate connected to the cylindrical side wall. The middle plate is located on the side of the end wall away from the accommodating cavity. The end wall, the inner cylinder wall, the transition wall, and the outer cylinder wall, together with the middle plate and the cylindrical side wall, form a sound filter. The sound filter communicates with the accommodating cavity to absorb the acoustic energy of the sound waves generated by the vibration of the transducer in the air within the accommodating cavity. After being absorbed by the sound filter, the sound waves are transmitted to the outside of the earphone through the gap between the cylindrical side wall and the outer cylinder wall.

[0200] In some embodiments, the cutoff frequency of the acoustic filter is less than or equal to 5 kHz.

[0201] In some embodiments, the gap between the transition wall and the middle plate in the vibration direction and the gap between the inner cylinder wall and the outer cylinder wall in the direction perpendicular to the vibration direction are both greater than the gap between the cylindrical side wall and the outer cylinder wall in the direction perpendicular to the vibration direction.

[0202] In some embodiments, the earphones further include a battery and a mainboard coupled to the transducer, and the adapter housing further includes a housing connected to the cylindrical sidewall, with the battery or the mainboard disposed on the side of the housing facing the transducer.

[0203] In some embodiments, the earphone further includes a functional component disposed on the housing and coupled to the battery and the motherboard. The functional component includes a first circuit board, a second circuit board, an encoder, a tactile switch, and a function key. The first circuit board and the second circuit board are stacked. The encoder is disposed on the first circuit board. The tactile switch is disposed on the second circuit board and located on the side of the second circuit board facing the first circuit board. The function key includes a keycap and a key lever connected to the keycap. The keycap is located on the side of the first circuit board away from the second circuit board. The free end of the key lever away from the keycap is positioned opposite the tactile switch. The encoder is sleeved on the key lever. When the user rotates the key lever using the keycap, the key lever drives the encoder to generate a first input signal. When the user presses the key lever using the keycap, the key lever triggers the tactile switch to generate a second input signal.

[0204] In some implementations, the first input signal is used to control the volume of the headphones to increase / decrease; and / or, the second input signal is used to control any one of the following functions of the headphones: play / pause, skip tracks, pair with devices, power on / off.

[0205] In some embodiments, the earphone further includes a pickup assembly and a switching assembly. The pickup assembly includes a pivoting connecting block, a connecting rod, and a microphone. The pivoting connecting block is pivotally connected to the housing. One end of the connecting rod is connected to the pivoting connecting block. The microphone is disposed at the other end of the connecting rod. The pivoting connecting block has a recessed area on the side facing away from the housing, and the switching assembly is disposed in the recessed area.

[0206] In some embodiments, a boss is provided at the bottom of the recessed area, and an annular groove is formed between the outer peripheral wall of the boss and the side wall of the recessed area. The switch assembly includes a switch circuit board, an elastic support member, a reinforcing ring, and a button. The switch circuit board is disposed on the top of the boss. The elastic support member includes an integrally formed annular fixing part and an elastic support part. The reinforcing ring is lining the annular fixing part along the circumference of the annular fixing part. The annular fixing part is fixed in the annular groove by the reinforcing ring. The elastic support part is dome-shaped, and the button is disposed on the elastic support part.

[0207] In the above manner, the earphone provided in this application has a part of the core housing configured as an inner and outer two-layer structure. The inner cylinder wall and the outer cylinder wall are respectively used to accommodate the transducer and form a rotatable connection with the cylindrical side wall of the adapter housing by means of shaft hole cooperation. The overall structure is simple and reliable.

[0208] In some embodiments, the earphone includes a mechanism module, which includes a mechanism housing, a transducer, a first transducer, a vibrating panel, and a connector. The transducer is suspended within the housing cavity of the mechanism housing via the first transducer. The mechanism housing includes a first mechanism housing, a second mechanism housing, and a surrounding edge. The first mechanism housing includes an inner cylinder wall and a first outer cylinder wall. The inner cylinder wall is located around the transducer, and the first outer cylinder wall is located around the inner cylinder wall and is spaced apart from the inner cylinder wall in a direction perpendicular to the vibration direction of the transducer. The second mechanism housing is connected to the inner cylinder wall and has a mounting hole. The vibrating panel is located outside the mechanism housing and is used to contact the user's skin. One end of the connector is connected to the vibrating panel, and the other end extends into the mechanism housing through the mounting hole and is connected to the transducer. The surrounding edge is connected to the first outer cylinder wall and surrounds the vibrating panel.

[0209] In some embodiments, the second movement housing includes a first end wall and a first cylindrical side wall connected to the first end wall. The first cylindrical side wall is located between the inner cylindrical wall and the first outer cylindrical wall and is engaged with the inner cylindrical wall. The mounting hole is provided in the first end wall.

[0210] In some embodiments, the second core housing presses the peripheral region of the first transducer plate against the inner cylinder wall.

[0211] In some embodiments, the side of the vibration panel away from the transducer includes a skin contact area for contact with the user's skin and an edge area connected to the skin contact area. The edge area is located around the skin contact area and is spaced apart from the skin contact area in the vibration direction. The edge includes a connecting portion that engages with the first outer cylinder wall and a limiting portion connected to the connecting portion. The connecting portion is cylindrical and located around the first outer cylinder wall. The limiting portion is located on the side of the vibration panel away from the transducer. When viewed along the vibration direction, the limiting portion overlaps with the edge area and is offset from the skin contact area. In the non-wearing state, the skin contact area protrudes from the limiting portion on the side away from the transducer in the vibration direction.

[0212] In some embodiments, the side of the vibration panel opposite to the transducer also includes an air conduction enhancement area connected between the skin contact area and the edge area. The air conduction enhancement area is at least partially not in contact with the user's skin, and the vibration panel drives the air outside the earphone to vibrate to form sound waves through the air conduction enhancement area.

[0213] In some embodiments, the air conduction enhancement region is at least partially tilted relative to the skin contact area, and the tilt angle of the air conduction enhancement region relative to the skin contact area is between 0 and 75°.

[0214] And / or, the width of the orthogonal projection of the air conduction enhancement region along the vibration direction is greater than or equal to 1 mm.

[0215] In some embodiments, the earphone further includes a transition housing rotatably connected to the core housing, and the rim further includes a flange portion connected to the connecting portion. The flange portion is at least partially spaced from the transition housing in the vibration direction. When viewed along the vibration direction, the flange portion is located on the periphery of the first outer cylinder wall and overlaps with the transition housing.

[0216] In some embodiments, when not worn, taking the axis of rotation of the movement housing relative to the adapter housing as a starting point, the gap between the flange and the adapter housing in the vibration direction gradually increases along a reference direction, which is defined as a direction perpendicular to the vibration direction and the direction of the axis and away from the axis.

[0217] In some embodiments, the maximum gap between the flange and the adapter housing in the vibration direction is between 2 mm and 5 mm.

[0218] In some embodiments, when viewed along the axis, the flange portion is arc-shaped on the side facing the adapter housing.

[0219] In some embodiments, the first movement housing further includes a second outer cylindrical wall and a reinforcing column. The second outer cylindrical wall is located around the inner cylindrical wall and is spaced apart from the inner cylindrical wall in a direction perpendicular to the vibration direction of the transducer. The second outer cylindrical wall extends in the opposite direction to the first outer cylindrical wall. The reinforcing column connects the second outer cylindrical wall and the inner cylindrical wall. The transition housing includes a second cylindrical sidewall located around the second outer cylindrical wall. One of the reinforcing column and the second cylindrical sidewall is provided with a shaft hole, and the other is provided with a rotating shaft that mates with the shaft hole. The rotating shaft is embedded in the shaft hole to allow the movement housing to rotate relative to the transition housing.

[0220] In some embodiments, the first mechanism housing further includes a transition wall and a cover plate connected between the inner cylinder wall and the second outer cylinder wall. The cover plate and the transition wall are spaced apart in the vibration direction and together with the second outer cylinder wall and the inner cylinder wall, form a Helmholtz resonant cavity. The Helmholtz resonant cavity is in communication with the accommodating cavity to absorb the acoustic energy of the sound waves generated by the air in the accommodating cavity as the transducer vibrates.

[0221] In some embodiments, when viewed along the vibration direction, the second outer cylinder wall is located around the first outer cylinder wall and inside the flange, allowing the flange to overlap with the second cylindrical sidewall.

[0222] In some embodiments, the transition wall includes a first sub-transition wall and a second sub-transition wall, the first sub-transition wall connecting the inner cylinder wall and the first outer cylinder wall, the second sub-transition wall connecting the first outer cylinder wall and the second outer cylinder wall, the second sub-transition wall being spaced apart from the first sub-transition wall in the vibration direction, and the second sub-transition wall being closer to the vibration panel than the first sub-transition wall.

[0223] In the earphone provided by this application, the first shell of the mechanism housing is configured as an inner and outer two-layer structure. The inner cylinder wall of the first shell is used to accommodate the transducer and is connected to the second shell. The outer cylinder wall of the first shell is used to connect to the rim. In the process of assembling the earphone, the second shell and the rim are connected to the inner cylinder wall and the outer cylinder wall of the first shell respectively. The overall structure is simple, reliable and has high assembly efficiency.

[0224] In some embodiments, the connecting wire assembly includes a conductive wire and an auxiliary wire connected to the conductive wire. When the conductive wire deforms under the tension of an external force, it causes the auxiliary wire to undergo elastic deformation accordingly. After the external force is released, the auxiliary wire provides an elastic restoring force to restore the conductive wire to its pre-deformation shape.

[0225] In some embodiments, the conductor is divided into a telescopic segment and natural segments located at both ends of the telescopic segment, the elastic coefficient of the telescopic segment being between the elastic coefficient of the natural segments and the elastic coefficient of the auxiliary line.

[0226] In some embodiments, the telescopic section is a portion of the conductor that extends spirally around at least a portion of the auxiliary line.

[0227] In some implementations, under natural conditions, the ratio between the length of the telescopic segment and the length of the conductor is between 0.1 and 0.5.

[0228] In some embodiments, the auxiliary line includes an elastic body and collars located at both ends of the elastic body, each collar being fitted onto the corresponding natural segment and stopped by a limiting structure on the natural segment in the rebound direction of the telescopic segment.

[0229] In some embodiments, the limiting structure is a protrusion integrally connected to the insulation layer of the conductor, or a knot formed by tying the natural segments together.

[0230] In some embodiments, the headphones include a headband assembly and a core module. The headband assembly includes an arc-shaped headband member, an adapter, and the aforementioned connecting cable assembly. The arc-shaped headband member is used to wrap around the user's head. The two ends of the adapter are respectively connected to the arc-shaped headband member and the core module, and can extend or retract from the arc-shaped headband member under external force, allowing the core module to move closer to or further away from the arc-shaped headband member in the extension direction of the headband assembly. The connecting cable assembly extends along the arc-shaped headband member and elongates with the extension of the adapter or springs back with the retraction of the adapter. The cable is electrically connected to the core module.

[0231] In some embodiments, the conductor is divided into a telescopic section and natural segments located at both ends of the telescopic section, with the middle region of the telescopic section fixed to the arc-shaped head beam.

[0232] In some embodiments, the headband assembly further includes a clamping member that engages with the arcuate headband member, the clamping member clamping the middle region of the telescopic section onto the arcuate headband member.

[0233] In some embodiments, the holding member includes a holding portion and snap-fit ​​portions located at both ends of the holding portion. Each snap-fit ​​portion is bent relative to the holding portion. The two snap-fit ​​portions extend in the same direction toward one side of the holding portion and can approach each other under the action of external force. The holding portion is used to hold the middle area of ​​the telescopic section, and the snap-fit ​​portion is used to snap with the arc-shaped head beam.

[0234] In the above manner, the connecting wire assembly provided in this application has an auxiliary wire that cooperates with the conductor. After the conductor and the auxiliary wire are extended, the auxiliary wire can help the conductor return to its original shape before extension, so that the conductor can be extended again. The overall structure is simple and reliable.

[0235] In some embodiments, the movement module includes a movement housing, a transducer, a first transducer plate, and a vibration panel. The transducer is suspended within the housing cavity of the movement housing via the first transducer plate and includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the movement housing via the first transducer plate, and the second transducer plate is connected to the first transducer plate via the bracket. The magnetic circuit system is connected to the central region of the second transducer plate to suspend the magnetic circuit system within the housing cavity. The coil extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer. The magnetic gap surrounds the position where the magnetic circuit system is connected to the second transducer plate. The vibration panel is connected to the bracket and is used to transmit the mechanical vibration generated by the transducer to the user.

[0236] In some embodiments, the magnetic circuit system includes a magnetic shield and a magnet connected to the bottom of the magnetic shield. The magnet is connected to the central region of the second transducer and is spaced apart from the sidewall of the magnetic shield in a direction perpendicular to the vibration direction to form the magnetic gap. The sidewall of the magnetic shield and the second transducer are spaced apart in the vibration direction to form a channel connecting the magnetic gap to the outside of the magnetic circuit system.

[0237] In some embodiments, the magnet includes a first magnetic element, a magnetic conductive element, and a second magnetic element stacked along the vibration direction. The second magnetic element is closer to the second transducer than the first magnetic element. The first magnetic element and the second magnetic element have different magnetization directions. When the sidewall of the magnetic conductive cover is projected onto the outer peripheral surface of the magnet in a direction perpendicular to the vibration direction, it overlaps with the magnetic conductive element at least.

[0238] In some embodiments, when the coil is projected orthogonally onto the outer peripheral surface of the magnet in a direction perpendicular to the vibration direction, it overlaps at least with the magnetic conductor.

[0239] In some embodiments, the support includes a first support and a second support, the first support being connected to the central region of the first vibration transducer, the second support being connected to the peripheral region of the second vibration transducer, the second support and the vibration panel being connected to the first support respectively, and the coil being connected to the second support.

[0240] In some embodiments, the transducer further includes a suspension connected to the central region of the second transducer, the second support located on the periphery of the suspension and spaced apart from the suspension in a direction perpendicular to the vibration direction, and the magnetic circuit system connected to the suspension.

[0241] In some embodiments, the first bracket and the first vibration transducer are integrally formed by metal insert injection molding process, and the second bracket and the second vibration transducer are integrally formed by metal insert injection molding process. One of the first bracket and the second bracket is provided with a connector hole, and the other is provided with a connector post embedded in the connector hole, the connector post extending into the connector hole.

[0242] In some embodiments, the mechanism housing includes an inner cylinder wall and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction and together with the inner cylinder wall form the accommodating cavity. The first end wall is provided with a mounting hole. The vibration panel is located outside the mechanism housing. The mechanism module also includes a connector. One end of the connector is connected to the vibration panel, and the other end extends into the mechanism housing through the mounting hole and is connected to the bracket. Wherein, when viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0243] In some embodiments, the accommodating cavity is connected to the outside of the movement module only through a channel, which is the gap between the wall of the connector and the mounting hole;

[0244] Alternatively, the accommodating cavity may be connected to the outside of the movement module only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the second channel is connected to the outside of the movement module via an acoustic filter;

[0245] Alternatively, the accommodating cavity may be connected to the outside of the movement module only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the ratio between the opening area of ​​the second channel and the opening area of ​​the first channel is less than or equal to 10%.

[0246] In some embodiments, the accommodating cavity is connected to the outside of the movement module through a channel, the channel being the gap between the wall of the connector and the mounting hole, and the movement module further includes a sealing membrane that seals the channel.

[0247] In some embodiments, the sealing membrane includes an integrally connected first connecting portion, a pleated portion, and a second connecting portion, wherein the pleated portion forms a recessed area between the first connecting portion and the second connecting portion, the first connecting portion is connected to the first end wall, and the second connecting portion is connected to the connector or the vibration panel.

[0248] In some embodiments, when viewed along the vibration direction, the ratio between the difference between the area of ​​the mounting hole and the area of ​​the connector and the area of ​​the mounting hole is greater than 0 and less than or equal to 0.5.

[0249] In some embodiments, the gap between the connector and the wall of the mounting hole is greater than or equal to 0.1 mm and less than or equal to 1 mm.

[0250] In some embodiments, the earphones include a support assembly and the aforementioned mechanism module, the support assembly being connected to the mechanism module and used to support the mechanism module when worn in a wearing position.

[0251] In the above-described manner, compared to the related technologies where the sidewall of the magnetic shield of the magnetic circuit system is connected to the peripheral area of ​​the second transducer via a cylindrical connector, the mechanism module provided in this application, since the magnetic circuit system is connected to the central area of ​​the second transducer, eliminates the need for a cylindrical connector to connect the magnetic circuit system to the peripheral area of ​​the second transducer. This allows for a larger communication area between the inside and outside of the transducer, which helps to suppress acoustic cavity effects and thus improves the sound leakage of the headphones.

[0252] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, and a vibration panel. The transducer is disposed within a cavity of the core housing. The vibration panel is connected to the transducer and transmits the mechanical vibration generated by the transducer to the user. When worn, and viewed along the coronal axis of the human body, the center of the vibration panel facing the wearing position is closer to the external auditory canal of the user's ear in the sagittal axis direction than the center of the core housing facing the wearing position.

[0253] In some embodiments, the center of the vibrating panel projected orthogonally along the vibration direction of the transducer onto the core housing coincides with the center of the transducer projected orthogonally along the vibration direction onto the core housing, while the center of the transducer projected orthogonally along the vibration direction onto the core housing does not coincide with the center of the core housing on the side facing the transducer in the vibration direction.

[0254] In some embodiments, the transducer is projected orthogonally along the vibration direction onto the center of the mechanism housing, which coincides with the center of the mechanism housing on the side facing the transducer in the vibration direction. The vibration panel is projected orthogonally along the vibration direction onto the center of the mechanism housing, which does not coincide with the transducer being projected orthogonally along the vibration direction onto the center of the mechanism housing.

[0255] In some embodiments, the earphone further includes an adapter housing connecting the core housing and the support assembly. The adapter housing includes a cylindrical sidewall located around the core housing. The core housing and the cylindrical sidewall have a first center and a second center respectively in their orthogonal projections onto a reference plane perpendicular to the vibration direction of the transducer. In the wearing state, the first center is closer to the external auditory canal of the user's ear than the second center.

[0256] In some embodiments, the movement housing rotates about a first axis relative to the adapter housing, and the first center and the second center are spaced apart along the direction of the first axis.

[0257] In some implementations, the first center and the second center are on the first axis.

[0258] In some embodiments, the adapter housing rotates relative to the support assembly about a second axis that intersects the first axis.

[0259] In some embodiments, the earphone further includes a battery and a mainboard coupled to the transducer, the adapter housing further includes a middle plate connected to the inner side of the cylindrical sidewall and a housing snapped onto the cylindrical sidewall, the battery or the mainboard being disposed between the housing and the middle plate, and the mechanism housing being located on the side of the middle plate opposite to the housing.

[0260] In some embodiments, the support assembly is configured as a headband assembly that wraps around the user's head and allows the vibrating panel to contact the user's cheek. When worn, the headband assembly forms a first contact point with the user's head, and the vibrating panel forms a second contact point with the user's cheek. The distance between the second contact point and the first contact point in the direction of the human sagittal axis is between 20 mm and 30 mm.

[0261] In some embodiments, the headband assembly includes an arc-shaped headband component and an adapter component. The arc-shaped headband component is used to wrap around the user's head. The adapter component includes a first connecting segment, an intermediate transition segment, and a second connecting segment. The intermediate transition segment connects the first connecting segment and the second connecting segment. The first connecting segment and the second connecting segment are respectively bent relative to the intermediate transition segment and extend in the opposite direction. The first connecting segment is connected to the arc-shaped headband component, and the second connecting segment is connected to the adapter housing. The intermediate transition segment is inclined relative to the vertical axis of the human body when viewed along the direction of the coronal axis.

[0262] In the earphone provided by this application, the center of the vibrating panel facing the wearing position is closer to the external auditory canal of the user's ear in the direction of the human body's sagittal axis than the center of the mechanism housing facing the aforementioned wearing position. That is, the vibrating panel is set to be offset relative to the mechanism housing so that the mechanism module vibrates at the aforementioned wearing position to generate sound waves, which can be transmitted to the user's central nervous system through the shortest path, resulting in higher transmission efficiency and less sound loss.

[0263] In some embodiments, the headphones include a headband assembly and a mechanism module connected to the headband assembly. The headband assembly is used to wrap around the top of the user's head and allow the mechanism module to contact the user's cheek, thereby allowing the mechanism module to transmit mechanical vibrations generated by the mechanism module via bone conduction. In the wearing state, the headband assembly forms a first contact point with the top of the user's head, the mechanism module forms a second contact point with the user's cheek, and the headband assembly also forms a third contact point with the user's head. The third contact point is located between the first and second contact points in the direction of the vertical axis of the human body.

[0264] In some embodiments, when the headband assembly forms the third contact point with the user's head, at least a portion of the headband assembly between the first contact point and the second contact point does not contact the user's head.

[0265] In some implementations, the headband assembly forms the third contact points with both sides of the user's head.

[0266] In some embodiments, each end of the headband assembly is connected to a movement module, and each movement module forms the second contact point with the user's cheek.

[0267] In some implementations, when worn, the earphones apply a pressure force directed toward the user's head at the first contact point, the second contact point, and the third contact point, respectively.

[0268] In some embodiments, the clamping force at the second contact point is between 0.2N and 2N, and the clamping force at the third contact point is between 0.3N and 2N.

[0269] In some embodiments, the headband assembly includes an arc-shaped headband component and two auxiliary components connected to the arc-shaped headband component. The arc-shaped headband component is used to wrap around the top of the user's head. The movement module is connected to the arc-shaped headband component. In the wearing state, the two auxiliary components form the third contact points with the two sides of the user's head, respectively.

[0270] In some embodiments, the auxiliary component is elastic, such that when the earphone is worn by users with different head sizes, the change in the clamping force at the second contact point is less than or equal to 0.2N due to varying degrees of elastic deformation of the auxiliary component.

[0271] In some embodiments, the headband assembly further includes an adapter connecting the arcuate headband member and the movement module, the adapter allowing the movement module to move closer to or further away from the arcuate headband member in the extension direction of the headband assembly, the arcuate headband member providing a first clamping force to the movement module in a first use state and a second clamping force to the movement module in a second use state, the auxiliary member being configured such that the absolute value of the difference between the second clamping force and the first clamping force is between 0 and 0.1 N;

[0272] The first usage state is defined as a usage state in which each of the adapters has a first extension amount relative to the arc-shaped head beam and there is a first gap between the movement modules at both ends of the head beam assembly. The second usage state is defined as a usage state in which each of the adapters has a second extension amount relative to the arc-shaped head beam and there is a second gap between the movement modules at both ends of the head beam assembly, wherein the second extension amount is greater than the first extension amount and the second gap is greater than the first gap.

[0273] In some embodiments, the first clamping force and the second clamping force are respectively between 0.4N and 0.8N.

[0274] In some implementations, the first extension is at its minimum when the movement module is closest to the curved head beam; and the second extension is at its maximum when the movement module is furthest from the curved head beam.

[0275] In some embodiments, in its natural state, the headband assembly has a first reference plane and a second reference plane orthogonal to each other. The two auxiliary members are symmetrically arranged relative to the first reference plane. The second reference plane passes through the highest point and two endpoints of the arc-shaped headband member, projecting the arc-shaped headband member and the auxiliary members onto the second reference plane. In the second reference plane, the line connecting the fixed end and the free end of the auxiliary member has a first projection component in a first reference direction parallel to the line connecting the two endpoints, and a second projection component in a second reference direction perpendicular to the line connecting the two endpoints. The ratio between the second projection component and the first projection component is between 1 and 5; and / or, the equivalent elastic modulus of the auxiliary member is between 100 N / m and 180 N / m.

[0276] In some embodiments, under natural conditions, the arc-shaped head beam is projected onto the second reference plane, and a rectangular coordinate system is established in the second reference plane. The rectangular coordinate system has the highest point as the origin, the straight line passing through the origin and parallel to the line connecting the two endpoints as the x-axis, and the straight line passing through the origin and perpendicular to the x-axis as the y-axis. The curve of the arc-shaped head beam from any of the endpoints to the highest point satisfies the following relationship:

[0277] ;

[0278] The thickness of the auxiliary component is less than or equal to 4 mm, and the gap between the auxiliary component and the arc-shaped head beam is greater than or equal to 10 mm.

[0279] In some embodiments, each of the auxiliary components is fixed to one end of the arc-shaped head beam, and the line connecting any of the endpoints of the arc-shaped head beam to the highest point has a third projection component in a first reference direction parallel to the line connecting the two endpoints, and a fourth projection component in a second reference direction perpendicular to the line connecting the two endpoints, wherein the ratio between the second projection component and the fourth projection component is between 0.1 and 0.5.

[0280] In some embodiments, each of the auxiliary components is cantilevered relative to the arcuate head beam component.

[0281] In some embodiments, when the head is tilted down, the clamping force at the first contact point forms a first resistance torque relative to the second contact point, the clamping force at the third contact point forms a second resistance torque relative to the second contact point, the clamping force at the second contact point forms a third resistance torque relative to the contact surface between the movement module and the user's cheek when the headband assembly includes the auxiliary component, and the clamping force at the second contact point forms a fourth resistance torque relative to the contact surface between the movement module and the user's cheek when the headband assembly does not include the auxiliary component. The resultant torque formed by the first resistance torque, the second resistance torque, and the third resistance torque is greater than the resultant torque formed by the first resistance torque and the fourth resistance torque.

[0282] In some embodiments, in its natural state, the headband assembly has a first reference plane and a second reference plane orthogonal to each other. The two auxiliary components are symmetrically arranged relative to the first reference plane. The second reference plane passes through the highest point and two endpoints of the arc-shaped headband component, projecting the arc-shaped headband component and the auxiliary components onto the second reference plane. Within the second reference plane, the projection component of the distance between the fixed end of the auxiliary component connected to the arc-shaped headband component and the movement module adjacent to the auxiliary component in a second reference direction perpendicular to the line connecting the two endpoints is between 40 mm and 120 mm.

[0283] In some embodiments, the auxiliary component extends toward the middle region of the arc-shaped headband component. In its natural state, the headband assembly has a first reference plane and a second reference plane that are orthogonal to each other. The two auxiliary components are symmetrically arranged with respect to the first reference plane. The second reference plane passes through the highest point and two endpoints of the arc-shaped headband component, projecting the arc-shaped headband component and the auxiliary component onto the second reference plane. In the second reference plane, the fixed end of the auxiliary component connected to the arc-shaped headband component has a first distance between the highest point and the reference direction perpendicular to the line connecting the two endpoints. The position where the movement module is connected to the headband assembly has a second distance between the highest point and the reference direction. The ratio between the first distance and the second distance is between 1 / 3 and 1 / 2.

[0284] In some embodiments, the auxiliary component extends to the end of the arc-shaped headband component. In its natural state, the headband assembly has a first reference plane and a second reference plane that are orthogonal to each other. The two auxiliary components are symmetrically arranged with respect to the first reference plane. The second reference plane passes through the highest point and two endpoints of the arc-shaped headband component, projecting the arc-shaped headband component and the auxiliary component onto the second reference plane. In the second reference plane, the fixed end of the auxiliary component connected to the arc-shaped headband component has a third distance between the highest point and the reference direction perpendicular to the line connecting the two endpoints. The position where the movement module is connected to the headband assembly has a fourth distance between the highest point and the reference direction. The ratio between the third distance and the fourth distance is between 1 / 5 and 1 / 3.

[0285] In some embodiments, the auxiliary component includes a fixing part, a first extension connected to the fixing part, and a second extension connected to the first extension. The fixing part is connected to the arc-shaped headband. The first extension and the second extension are located on the side of the arc-shaped headband facing the user's head in the wearing state, and are spaced apart from the arc-shaped headband in the natural state. The width of the second extension is greater than the width of the first extension, and the second extension is used to form the third contact point with the user's head in the wearing state.

[0286] In some embodiments, the auxiliary component is detachably connected to the arc-shaped head beam component.

[0287] In some embodiments, the area of ​​the second extension in contact with the user's head is between 2 cm. 2 With 8cm 2 between.

[0288] In some embodiments, the coefficient of friction of the second extension is greater than that of the first extension.

[0289] In some embodiments, when worn and viewed along the vertical axis of the human body, the second extensions of the two aids are close together toward the back of the user's head.

[0290] In some embodiments, in the natural state, the headband assembly has a first reference plane and a second reference plane orthogonal to each other, the two auxiliary members are symmetrically arranged with respect to the first reference plane, the second reference plane passes through the highest point and two endpoints of the arcuate headband member, and the angle between the average normal of the second extension of each auxiliary member and the second reference plane is between 5 degrees and 10 degrees.

[0291] In some embodiments, the headphones include a headband assembly and a core module connected to the headband assembly. The headband assembly is used to wrap around the top of the user's head and allow the core module to contact the user's cheek, thereby allowing the core module to transmit mechanical vibrations generated by the core module via bone conduction. When worn, the core module forms a first contact point with the user's cheek and applies a first pressure force to the user's head. The headband assembly forms a second contact point with the user's head and applies a second pressure force to the user's head. The second contact point is closer to the top of the user's head in the direction of the vertical axis of the human body than the first contact point.

[0292] In some embodiments, when the headband assembly applies the second clamping force to the user's head at the second contact point, at least a portion of the headband assembly between the second contact point and the top of the user's head does not contact the user's head.

[0293] In some embodiments, the clamping force at the first contact point is between 0.2N and 2N, and the clamping force at the second contact point is between 0.3N and 2N.

[0294] In some embodiments, the headband assembly includes an arc-shaped headband component and two auxiliary components connected to the arc-shaped headband component. The arc-shaped headband component is used to wrap around the top of the user's head. The core module is connected to the arc-shaped headband component. In the wearing state, the two auxiliary components form the second contact points with the sides of the user's head, respectively. The auxiliary components are elastic so that when the headphones are worn by users with different head sizes, the change in the first clamping force is less than or equal to 0.2N due to the different degrees of elastic deformation of the auxiliary components.

[0295] In some embodiments, when the head is tilted down, the second pressing force forms a first resistance torque relative to the first contact point, the pressing force at the first contact point forms a second resistance torque relative to the contact surface of the movement module in contact with the user's cheek when the headband assembly includes the auxiliary component, and the pressing force at the first contact point forms a third resistance torque relative to the contact surface of the movement module in contact with the user's cheek when the headband assembly does not include the auxiliary component, and the resultant torque formed by the first resistance torque and the second resistance torque is greater than the third resistance torque.

[0296] Through the above methods, the headphones provided in this application not only transmit the mechanical vibration generated by the core module via bone conduction, but are also worn by the user in a headband manner, which is a brand-new type of headband bone conduction headphone that is different from ear-hook bone conduction headphones. On this basis, a third contact point is further formed between the first contact point formed between the headband assembly and the top of the user's head and the second contact point formed between the core module and the user's cheek. In the head-down position, the core module generates a resistance torque due to friction caused by contact with the user's cheek, the headband assembly generates another resistance torque due to friction caused by contact with the top of the user's head, and the headband assembly generates yet another resistance torque due to friction caused by contact with other parts of the user's head. The resultant torque of the aforementioned three resistance torques is greater than the resultant torque of the aforementioned two resistance torques, making it easier to overcome the gravitational torque of the headphones in the head-down position, thereby improving the reliability of the headphones in terms of wearing.

[0297] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a vibrating panel, and a surrounding edge. The transducer is disposed within a cavity of the core housing. The vibrating panel is connected to the transducer and transmits the mechanical vibration generated by the transducer to the user. The surrounding edge is connected to the core housing, and its projection in a reference plane surrounds the periphery of the projection of the vibrating panel in the reference plane. The reference plane is perpendicular to the vibration direction of the transducer. The core housing, near the vibrating panel, forms a cavity with the vibrating panel and the surrounding edge. The surrounding edge has a communication hole connecting the cavity to the outside of the core module, so that in the wearing state, the cavity communicates with the outside of the core module through the communication hole.

[0298] In some implementations, when worn, at least a portion of the rim contacts the user's skin along with the vibration panel.

[0299] In some implementations, there exists a target frequency range with a length of at least 1 / 3 octave within the frequency range of 500 Hz to 4 kHz, in which the sound leakage generated by the earphone when the connecting hole is open is weaker than the sound leakage generated by the earphone when the connecting hole is closed.

[0300] In some implementations, the target frequency range is 1 kHz to 2 kHz.

[0301] In some embodiments, the number of the connecting holes is multiple, and the opening ratio of the connecting holes on the surrounding edge is greater than or equal to 30%.

[0302] In some embodiments, there is at least one of the connecting holes per square millimeter of the perimeter.

[0303] In some embodiments, the edging is made of plastic and the wall thickness of the edging is between 0.2 mm and 1 mm.

[0304] In some embodiments, the edging is made of plastic, and the wall thickness of the portion of the edging that comes into contact with the user's skin is greater than 1 mm.

[0305] In some embodiments, the plastic part is formed onto a metal frame by injection molding.

[0306] In some embodiments, the perimeter is a metal component to allow the aperture ratio of the connecting hole on the perimeter to be greater than or equal to 60%.

[0307] In some embodiments, the edging is made of wire mesh.

[0308] In some embodiments, the movement housing is a first plastic component, and the edging is connected to the movement housing via a second plastic component, wherein the second plastic component and the metal component are integrally formed by injection molding.

[0309] In some embodiments, the movement module includes a first vibration transducer and a connector. The transducer is suspended within the accommodating cavity via the first vibration transducer. The movement housing includes an inner cylinder wall and a first end wall and a second end wall connected to both ends of the inner cylinder wall, respectively. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction and together with the inner cylinder wall form the accommodating cavity. The first end wall has a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. The surrounding edge is connected to the first end wall and together with the first end wall and the vibration panel form the cavity. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0310] In some embodiments, when viewed along the vibration direction, the ratio between the difference between the area of ​​the mounting hole and the area of ​​the connector and the area of ​​the mounting hole is greater than 0 and less than or equal to 0.5.

[0311] In some embodiments, the accommodating cavity is connected to the outside of the movement module through a channel, the channel being the gap between the wall of the connector and the mounting hole, and the movement module further includes a sealing membrane that seals the channel.

[0312] In some embodiments, the sealing membrane includes an integrally connected first connecting portion, a pleated portion, and a second connecting portion, wherein the pleated portion forms a recessed area between the first connecting portion and the second connecting portion, the first connecting portion is connected to the first end wall, and the second connecting portion is connected to the connector or the vibration panel.

[0313] In the earphone provided by this application, the side of the core housing near the vibration panel forms a cavity with the vibration panel and the surrounding edge, so that the cavity for housing the transducer in the core housing can be sealed as much as possible, thereby preventing the sound leakage generated by the air in the cavity due to the vibration of the transducer from spreading out. On this basis, a connecting hole is further opened on the surrounding edge to connect the cavity with the outside of the core module, so that when worn, the cavity is connected to the outside of the core module through the connecting hole, so that the sound leakage generated by the air in the cavity due to the vibration of the transducer can cancel out the sound leakage generated by the core housing due to the vibration of the transducer in the far field, or the sound leakage generated by the core housing itself due to the vibration of the transducer can cancel out in the far field, thereby reducing the sound leakage of the earphone.

[0314] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a vibrating panel, and a bezel. The transducer is disposed within a cavity of the core housing. The vibrating panel is connected to the transducer and transmits the mechanical vibration generated by the transducer to the user. The bezel is connected to the core housing, and its projection in a reference plane surrounds the periphery of the projection of the vibrating panel in the reference plane, which is perpendicular to the vibration direction of the transducer. The core housing, on the side closest to the vibrating panel, forms a cavity with the vibrating panel and the bezel. The outer surface of the bezel facing the user's skin in the wearing state has uneven areas, so that the bezel does not completely conform to the user's skin when in contact, thereby allowing the cavity to communicate with the outside of the core module.

[0315] In some embodiments, a groove is provided on the outer surface of the rim, and the cavity communicates with the outside of the movement module through the groove.

[0316] In some embodiments, the projection of the perimeter into the reference plane has a major axis direction and a minor axis direction that are orthogonal to each other. The dimension of the perimeter in the major axis direction is greater than the dimension of the perimeter in the minor axis direction. There are multiple grooves, which are divided into four groups. Two groups of grooves are spaced apart along the major axis direction, and the other two groups of grooves are spaced apart along the minor axis direction. The number of grooves in each group spaced apart along the major axis direction is greater than the number of grooves in each group spaced apart along the minor axis direction.

[0317] In some embodiments, the outer surface of the rim has a protrusion that creates a gap between the rim and the user's skin when worn, and the cavity communicates with the outside of the movement module through the gap.

[0318] In some embodiments, the number of protrusions is multiple, and the multiple protrusions make the gaps form a grid.

[0319] In some implementations, there is a target frequency range with a length of at least 1 / 3 octave within the frequency range of 500 Hz to 4 kHz, where the sound leakage generated by the headphones when worn is weaker when the outer surface of the surround has uneven areas than when the headphones when worn are not uneven.

[0320] In some implementations, the target frequency range is 1 kHz to 2 kHz.

[0321] In some embodiments, the height difference of the uneven areas is between 0.5 mm and 5 mm.

[0322] In some embodiments, the perimeter is provided with a communication hole connecting the cavity to the outside of the movement module, so that when worn, the cavity is further connected to the outside of the movement module through the communication hole.

[0323] In some embodiments, the number of the connecting holes is multiple, and the opening ratio of the connecting holes on the surrounding edge is greater than or equal to 30%.

[0324] In some embodiments, the movement module includes a first vibration transducer and a connector. The transducer is suspended within the accommodating cavity via the first vibration transducer. The movement housing includes an inner cylinder wall and a first end wall and a second end wall connected to both ends of the inner cylinder wall, respectively. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and together with the inner cylinder wall form the accommodating cavity. The first end wall has a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. The surrounding edge is connected to the first end wall and together with the first end wall and the vibration panel form the cavity. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0325] In some embodiments, when viewed along the vibration direction, the ratio between the difference between the area of ​​the mounting hole and the area of ​​the connector and the area of ​​the mounting hole is greater than 0 and less than or equal to 0.5.

[0326] In some embodiments, the accommodating cavity is connected to the outside of the movement module through a channel, the channel being the gap between the wall of the connector and the mounting hole, and the movement module further includes a sealing membrane that seals the channel.

[0327] In some embodiments, the sealing membrane includes an integrally connected first connecting portion, a pleated portion, and a second connecting portion, wherein the pleated portion forms a recessed area between the first connecting portion and the second connecting portion, the first connecting portion is connected to the first end wall, and the second connecting portion is connected to the connector or the vibration panel.

[0328] In the earphones provided by this application, the side of the core housing near the vibration panel, together with the vibration panel and the surrounding edge, forms a cavity. This allows the cavity for housing the transducer to be sealed as much as possible, thereby preventing the leakage sound generated by the vibration of the transducer within the cavity from propagating out. Furthermore, the outer surface of the surrounding edge facing the user's skin in the wearing state has uneven areas, so that the surrounding edge does not completely fit the user's skin when in contact. This allows the cavity to communicate with the outside of the core module, enabling the leakage sound generated by the vibration of the transducer within the cavity to cancel out the leakage sound generated by the core housing in the far field, or the leakage sound generated by the core housing itself in the far field to cancel out the leakage sound, thereby reducing the leakage sound of the earphones.

[0329] In some embodiments, the earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a vibrating panel, and a bezel. The transducer is disposed within a cavity of the core housing. The vibrating panel is connected to the transducer and transmits the mechanical vibrations generated by the transducer to the user. The bezel is connected to the core housing, and its projection in a reference plane surrounds the periphery of the projection of the vibrating panel in the reference plane, which is perpendicular to the vibration direction of the transducer. The core housing, on the side closest to the vibrating panel, forms a cavity with the vibrating panel and the bezel. The bezel, in the wearing state, has a porous structure on the side facing the user's skin, so that, in the wearing state, the porous structure at least partially contacts the user's skin along with the vibrating panel, and allows communication between the cavity and the outside of the core module.

[0330] In some implementations, there exists a target frequency range with a length of at least 1 / 3 octave within the frequency range of 500 Hz to 4 kHz, in which the sound leakage generated by the earphone when the mechanism module has the porous structure is weaker than the sound leakage generated by the earphone when the mechanism module does not have the porous structure.

[0331] In some implementations, the target frequency range is 1 kHz to 2 kHz.

[0332] In some embodiments, the porous structure includes a fixing layer and a porous main body layer connected to the fixing layer. The porous structure is connected to the perimeter through the fixing layer, and the porous structure communicates with the cavity and the outside of the movement module through the porous main body layer.

[0333] In some embodiments, the fixing layer is detachably connected to the perimeter.

[0334] In some embodiments, the connection between the fixing layer and the surrounding edge is any one of magnetic, snap-on, or adhesive.

[0335] In some embodiments, the fixing layer is cured adhesive, and the porous structure includes a protective layer covering the porous body layer, through which the porous structure comes into contact with the user's skin.

[0336] In some embodiments, the protective layer is provided as a textile or a steel mesh.

[0337] In some embodiments, the porosity of the porous host layer is greater than or equal to 60%.

[0338] In some embodiments, the porous main body layer is foam.

[0339] In some embodiments, the perimeter is provided with a communication hole connecting the cavity to the outside of the movement module, so that when worn, the cavity is further connected to the outside of the movement module through the communication hole.

[0340] In some embodiments, the number of the connecting holes is multiple, and the opening ratio of the connecting holes on the surrounding edge is greater than or equal to 30%.

[0341] In some embodiments, the movement module includes a first vibration transducer and a connector. The transducer is suspended within the accommodating cavity via the first vibration transducer. The movement housing includes an inner cylinder wall and a first end wall and a second end wall connected to both ends of the inner cylinder wall, respectively. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and together with the inner cylinder wall form the accommodating cavity. The first end wall has a mounting hole. The vibration panel is located outside the movement housing. One end of the connector is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. The surrounding edge, together with the first end wall and the vibration panel, forms the cavity. When viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

[0342] In some embodiments, when viewed along the vibration direction, the ratio between the difference between the area of ​​the mounting hole and the area of ​​the connector and the area of ​​the mounting hole is greater than 0 and less than or equal to 0.5.

[0343] In some embodiments, the accommodating cavity is connected to the outside of the movement module through a channel, the channel being the gap between the wall of the connector and the mounting hole, and the movement module further includes a sealing membrane that seals the channel.

[0344] In some embodiments, the sealing membrane includes an integrally connected first connecting portion, a pleated portion, and a second connecting portion, wherein the pleated portion forms a recessed area between the first connecting portion and the second connecting portion, the first connecting portion is connected to the first end wall, and the second connecting portion is connected to the connector or the vibration panel.

[0345] In the earphone provided by this application, the side of the core housing near the vibration panel forms a cavity with the vibration panel and the surrounding edge, so that the cavity for housing the transducer in the core housing can be sealed as much as possible, thereby preventing the sound leakage generated by the vibration of the transducer in the cavity from spreading out. On this basis, the side of the surrounding edge facing the user's skin in the wearing state has a porous structure, so that in the wearing state, the porous structure at least partially contacts the user's skin together with the vibration panel, and allows the cavity to communicate with the outside of the core module, so that the sound leakage generated by the vibration of the transducer in the cavity can cancel out the sound leakage generated by the vibration of the core housing in the far field, or the sound leakage generated by the vibration of the core housing itself in the far field can cancel out the sound leakage of the earphone. Attached Figure Description

[0346] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0347] Figure 1 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0348] Figure 2 This is a schematic diagram of the relative positional relationship between the connector and the vibration panel in an earphone provided in this application.

[0349] Figure 3 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0350] Figure 4 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0351] Figure 5 This is a schematic diagram of the structure of an embodiment of the vibration panel provided in this application;

[0352] Figure 6 This is a schematic diagram of the structure of an embodiment of the vibration panel provided in this application;

[0353] Figure 7 This is a schematic diagram of the structure of an embodiment of the vibration panel provided in this application;

[0354] Figure 8 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0355] Figure 9 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0356] Figure 10 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0357] Figure 11 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0358] Figure 12 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0359] Figure 13 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application in the wearing state;

[0360] Figure 14 This is a schematic diagram of the structure of an embodiment of the earphone provided in this application in the wearing state;

[0361] Figure 15 This is a schematic diagram of the structure of an embodiment of the earphone provided in this application in the wearing state;

[0362] Figure 16 This is a schematic diagram of the structure of an embodiment of the earphone provided in this application in the wearing state;

[0363] Figure 17 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application in the wearing state;

[0364] Figure 18 It is a schematic diagram of the mechanical model of the bending deformation of the cantilever beam provided in the application;

[0365] Figure 19 This is a schematic diagram of the mechanical model of an embodiment of the headgear assembly provided in the application;

[0366] Figure 20 yes Figure 12 An exploded view of one embodiment of the earphone;

[0367] Figure 21 yes Figure 20 A schematic diagram of the exploded structure of the headphones from another perspective;

[0368] Figure 22 yes Figure 20 A partially enlarged structural diagram of the E1 region of the transfer connector;

[0369] Figure 23 yes Figure 12 An exploded view of one embodiment of the earphone;

[0370] Figure 24 yes Figure 12 An exploded view of one embodiment of the earphone;

[0371] Figure 25This is a schematic diagram of the structure of an embodiment of the headphones provided in this application in the wearing state;

[0372] Figure 26 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application in the wearing state;

[0373] Figure 27 yes Figure 12 A cross-sectional structural diagram of one embodiment of the earphone;

[0374] Figure 28 yes Figure 27 A cross-sectional structural diagram of the earphone from another perspective;

[0375] Figure 29 yes Figure 27 A cross-sectional structural diagram of the earphone from another perspective;

[0376] Figure 30 This is a cross-sectional structural schematic diagram of an embodiment of the headphones provided in this application;

[0377] Figure 31 This is a cross-sectional structural schematic diagram of an embodiment of the headphones provided in this application;

[0378] Figure 32 yes Figure 12 A cross-sectional structural diagram of one embodiment of the earphone;

[0379] Figure 33 yes Figure 32 A cross-sectional structural diagram of the earphone from another perspective;

[0380] Figure 34 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0381] Figure 35 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0382] Figure 36 This is an illustrative equivalent model of an embodiment of the headphones provided in this application;

[0383] Figure 37 This is the frequency response curve of the vibrating panel of an embodiment of the earphone provided in this application when it is not being worn;

[0384] Figure 38 The frequency response curve of the vibration panel of the earphone provided in this application when it is not worn and its first transmission diaphragm has different stiffness.

[0385] Figure 39 The frequency response curve of the vibration panel of the earphone provided in this application when it is not worn and its second transmission diaphragm has different stiffness.

[0386] Figure 40 The frequency response curve of the vibration panel of the earphone provided in this application when it is not worn and its core housing has different masses;

[0387] Figure 41 The frequency response curve of the vibration panel of the earphone provided in this application when it is not worn and its first and second transmission plates have different stiffnesses.

[0388] Figure 42 These are the frequency response curves of sound leakage in the non-wearing state of the two headphone embodiments provided in this application;

[0389] Figure 43 This is a schematic diagram of the structure of an embodiment of the earphone provided in this application, facing the user's skin.

[0390] Figure 44 This is a schematic diagram of the structure of an embodiment of the earphone provided in this application, facing the user's skin.

[0391] Figure 45 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0392] Figure 46 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0393] Figure 47 yes Figure 46 A schematic diagram of the structure of one embodiment of the central support;

[0394] Figure 48 yes Figure 12 A schematic diagram of the structure of an embodiment of a headphone facing the user's head;

[0395] Figure 49 This is a schematic diagram of the mechanical model of the headphones provided in this application under different wearing methods;

[0396] Figure 50 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0397] Figure 51 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0398] Figure 52 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application;

[0399] Figure 53 This is an exploded structural diagram of an embodiment of the arc-shaped head beam provided in this application;

[0400] Figure 54 yes Figure 53 A schematic diagram of the cross-sectional structure of an embodiment of the arc-shaped head beam;

[0401] Figure 55 This is a partially exploded structural diagram of an embodiment of the headgear assembly provided in this application;

[0402] Figure 56 This is a partial structural schematic diagram of an embodiment of the headgear assembly provided in this application under different states;

[0403] Figure 57 This is an exploded structural diagram of an embodiment of the connector assembly provided in this application;

[0404] Figure 58 This is an exploded structural diagram of an embodiment of the headphones provided in this application;

[0405] Figure 59 yes Figure 58 A structural diagram of the earphone from another perspective;

[0406] Figure 60 This is a cross-sectional structural schematic diagram of an embodiment of the headphones provided in this application;

[0407] Figure 61 These are the frequency response curves of sound leakage in the non-wearing state of the two headphone embodiments provided in this application;

[0408] Figure 62 yes Figure 27 A cross-sectional structural schematic diagram of one embodiment of the earphone. Detailed Implementation

[0409] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0410] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0411] In this application, the earphone 10 may include a mechanism module 11, which is configured to at least generate bone conduction sound and, when worn, contact the user's skin (e.g., cheek) to allow the user's external auditory canal to be "open." In other words, while the user's external auditory canal is open and not blocked / obstructed by the earphone 10, the earphone 10 may also generate air conduction sound, as will be illustrated exemplarily below. In this case, the sound generated by the earphone 10 may be primarily bone conduction sound with secondary air conduction sound, i.e., air conduction sound enhances bone conduction sound, thereby improving the sound quality of the earphone 10.

[0412] It should be noted that the mechanical vibrations generated by the bone conduction acoustic finger mechanism module 11 described in this application are mainly propagated through the user's skull or other media, while the mechanical vibrations generated by the air conduction acoustic finger mechanism module 11 described in this application are mainly propagated through air or other media. Furthermore, two mechanism modules 11 can be provided, and both mechanism modules 11 can convert electrical signals into mechanical vibrations to enable the earphone 10 to achieve stereo sound effects. Therefore, in other application scenarios where stereo requirements are not particularly high, such as hearing aids for hearing-impaired patients or prompting for live broadcasts, the earphone 10 can also be equipped with only one mechanism module 11, and the omitted mechanism module 11 can be replaced by a structural component that assists in wearing the earphone 10.

[0413] Combination Figure 1 The mechanism module 11 may include a mechanism housing 111 and a transducer 112 disposed within a cavity 100 of the mechanism housing 111. The transducer 112 is configured to convert electrical signals into mechanical vibrations. In this case, the mechanism module 11 can primarily transmit the mechanical vibrations generated by the transducer 112 via bone conduction, thereby generating bone conduction sound.

[0414] In some embodiments, when worn, the mechanism module 11 can directly contact the user's skin through the mechanism housing 111, that is, the mechanism module 11 directly transmits the mechanical vibration generated by the transducer 112 through the mechanism housing 111. Thus, the earphone 10 may not include structural components such as the first transducer 113 and the vibration panel 114 mentioned later. Simultaneously, the mechanism housing 111 also causes the air outside the earphone 10 to vibrate, resulting in sound leakage. To reduce sound leakage in the earphone 10, a through-hole (which can be defined as a "sound leakage reduction hole") can be formed on the mechanism housing 111 to connect the accommodating cavity 100 and the outside of the earphone 10, allowing the sound waves output to the outside of the earphone 10 through the sound leakage reduction hole to cancel out the sound leakage generated by the vibration of the mechanism housing 111 with the transducer 112 in the far field (commonly known as "hole-punching sound leakage reduction").

[0415] In some other embodiments, the mechanism module 11 may further include a first transducer 113 and a vibration panel 114. The transducer 112 can be suspended within the accommodating cavity 100 via the first transducer 113. The vibration panel 114 can be at least partially located outside the accommodating cavity of the mechanism housing 11 and connected to the transducer 112 to transmit the mechanical vibration generated by the transducer 112 to the user. Accordingly, the end of the mechanism housing 111 near the vibration panel 114 is open. In this case, when worn, the mechanism module 11 can contact the user's skin via the vibration panel 114, meaning the mechanism module 11 transmits the mechanical vibration generated by the transducer 112 through the vibration panel 114. Simultaneously, due to the presence of the first transducer 113, the mechanical vibration generated by the transducer 112 can be transmitted to the mechanism housing 111 with less or no transmission, thereby minimizing the vibration of the air outside the earphone 10 caused by the mechanism housing 111 and reducing sound leakage from the earphone 10. Of course, the sound leakage of the headphones 10 can also be further reduced by drilling holes to reduce sound leakage.

[0416] In other embodiments, for example Figure 1 The mechanism module 11 also transmits the mechanical vibration generated by the transducer 112 through the vibration panel 114. The difference is that the end of the mechanism housing 111 near the vibration panel 114 is not an open structure; that is, except for the mounting hole 1111 mentioned later, the rest can be a closed structure. In this case, the mechanism housing 111 itself can reduce sound leakage of the earphone 10 based on the acoustic dipole, with little or no need for additional sound leakage reduction holes on the mechanism housing 111. Combined with... Figure 42 , Figure 42 Mid-frequency response curve 42_1 and frequency response curve 42_2 represent the sound leakage of the earphone 10 when the end of the mechanism housing 111 near the tremor panel 114 is open and the sound leakage of the earphone 10 when the end of the mechanism housing 111 near the tremor panel 114 is closed, respectively. Clearly, compared to the open structure of the mechanism housing 111 near the tremor panel 114, the sound leakage of the earphone 10 is significantly reduced when the end of the mechanism housing 111 near the tremor panel 114 is closed.

[0417] As an example, the mechanism module 11 may further include a connector 115 connecting the vibration panel 114 and the transducer 112, and the mechanism housing 111 is provided with a mounting hole 1111 for mounting the connector 115. In this case, the vibration panel 114 is located outside the mechanism housing 111 to contact the user's skin; one end of the connector 115 is connected to the vibration panel 114, and the other end extends into the mechanism housing 111 through the mounting hole 1111 and is connected to the transducer 112. Thus, even if the mechanical vibration generated by the transducer 112 is transmitted to the mechanism housing 111 through the first transducer plate 113, the leakage sound generated by the first end wall 1113 and the second end wall 1114 as the transducer 112 vibrates is out of phase, and the two can cancel each other out of phase in the far field, thereby reducing the leakage sound of the earphone 10. Based on this, the mechanism housing 111 can have fewer or no leakage sound reduction holes, thereby improving the waterproof and dustproof performance of the earphone 10. Preferably, when viewed along the vibration direction of the transducer 112, the area of ​​the vibration panel 114 is larger than the area of ​​the mounting hole 1111, and the area of ​​the mounting hole 1111 is larger than the area of ​​the connector 115. This is to prevent the mechanical vibration generated by the transducer 112 from being transmitted to the core housing 111 via the connector 115, thereby further reducing sound leakage in the earphone 10. At this time, the gap between the connector 115 and the wall of the mounting hole 1111, together with the accommodating cavity 100, forms a Helmholtz resonant cavity. The resonant frequency of this Helmholtz resonant cavity can be less than or equal to 4kHz, preferably less than or equal to 2kHz, and more preferably less than or equal to 1kHz.

[0418] As an example, the movement housing 111 may include an inner cylinder wall 1112 and a first end wall 1113 and a second end wall 1114 respectively connected to both ends of the inner cylinder wall 1112. The inner cylinder wall 1112 is located around the transducer 112, and the first end wall 1113 and the second end wall 1114 are located on opposite sides of the transducer 112 in the vibration direction of the transducer 112, forming a receiving cavity 100 with the inner cylinder wall 1112. When viewed along the vibration direction of the transducer 112, the cross-section of the inner cylinder wall 1112 is any one of the following shapes: circular, elliptical, racetrack-shaped, polygonal, etc., and may also be irregular in whole or in part. Furthermore, in the wearing state, the first end wall 1113 is closer to the user's skin than the second end wall 1114. At this time, the first end wall 1113 is provided with a mounting hole 1111. Of course, in other embodiments where the need for noise reduction is not stringent, or where perforation is used to reduce noise leakage, the mechanism housing 111 may not include the first end wall 1113 and / or the second end wall 1114, and the side of the transducer 112 facing away from the vibration panel 114 may be protected by other structural components (such as the adapter housing 13 mentioned later). In other embodiments where the mechanism module 11 does not have a vibration panel 114, the mechanism housing 111 may directly contact the user's skin through the first end wall 1113.

[0419] The inventors of this application discovered during a long period of research and development that: combining Figure 61 , Figure 61 Mid-frequency response curve 61_1 and frequency response curve 61_2 respectively represent the sound leakage of the earphone 10 when the housing 111 has a larger volume and when the housing 111 has a smaller volume. Clearly, compared to when the housing 111 has a larger volume, the sound leakage of the earphone 10 is significantly reduced when the housing 111 has a smaller volume. For example, the sound leakage in the 1kHz-2kHz frequency range is significantly reduced, and the sound leakage in the 3kHz-4kHz frequency range is significantly reduced; these are frequency ranges that the human ear is relatively sensitive to. Among these, the sound leakage in the 1kHz-2kHz frequency range contains more vocal components, which has a greater impact on the user's subjective perception. Therefore, maintaining a low level of sound leakage in this frequency range makes the earphone 10 more competitive in the market. Based on this, while ensuring that the housing 111 can accommodate the transducer 112, the volume of the housing 111 can be less than or equal to 3cm². 3To reduce sound leakage in the headphones 10, the volume of the core housing 111 can be measured by filling it with water. Furthermore, the volume of the core housing 111 can be changed by adjusting the radial dimension of the inner cylinder wall 1112 in the vibration direction perpendicular to the transducer 112, or by adjusting the radial gap between the inner cylinder wall 1112 and the transducer 112 in the vibration direction perpendicular to the transducer 112. For example, under the condition that the transducer 112 does not collide with the core housing 111 during vibration, the aforementioned radial dimension or radial gap can be minimized, thereby reducing sound leakage in the headphones 10. In addition, it can increase the impact resistance of the headphones 10. This is because a smaller radial dimension or radial gap allows the transducer 112 to have a smaller travel distance under impacts such as drops, resulting in less deformation of structural components such as the first transducer 113 and the second transducer 1122, making them less prone to plastic deformation or fracture, thus increasing reliability.

[0420] It should be noted that although the transducer 112 is suspended within the accommodating cavity 100 via the first transducer 113, for example, the transducer 112 is connected to the central region of the first transducer 113 and the peripheral region of the first transducer 113 is connected to the movement housing 111, the relative position of the first transducer 113 can be reasonably adjusted according to actual needs. For example, the first transducer 113 may be located within the accommodating cavity 100; specifically, the first transducer 113 may be located on the side of the first end wall 1113 near the second end wall 1114. In other words, when viewed along the vibration direction of the transducer 112, the area of ​​the mounting hole 1111 may be smaller than the area of ​​the first transducer 113; here, the area of ​​the first transducer 113 can be defined as the area enclosed by the maximum outer boundary of the orthogonal projection of the first transducer 113 along the vibration direction of the transducer 112. For example: the first vibration transducer 113 is located inside the mounting hole 1111; or, part of the first vibration transducer 113 is located inside the receiving cavity 100, and another part is located inside the mounting hole 1111; or, part of the first vibration transducer 113 is located inside the receiving cavity 100, part is located inside the mounting hole 1111, and another part is located outside the movement housing 111. Wherein, combined with Figure 1This application uses the example of the first transducer 113 being located within the accommodating cavity 100 to illustrate how the housing 111 itself can reduce sound leakage of the earphone 10 based on an acoustic dipole. It is worth noting that placing the first transducer 113 within the accommodating cavity 100, rather than the first transducer 113 being located within the mounting hole 1111, allows the earphone 10 to achieve better sound leakage reduction. This is mainly because the area of ​​the first transducer 113 along the vibration direction of the transducer 112 is larger than the area of ​​the connector 115 along the vibration direction of the transducer 112. The first transducer 113 being located within the mounting hole 1111 would significantly reduce the area of ​​the first end wall 1113 along the vibration direction of the transducer 112. This would easily lead to a large difference in stiffness between the first end wall 1113 and the second end wall 1114, which is not conducive to the formation of an acoustic dipole.

[0421] In some embodiments, the accommodating cavity 100 may communicate with the outside of the earphone 10 only through a first channel, the aforementioned first channel being the gap between the wall of the connector 115 and the mounting hole 1111. In other words, no sound leakage reduction hole is provided on the mechanism housing 111. In this case, the sound leakage generated by the earphone 10 through the first end wall 1113 and the second end wall 1114 is canceled out in the far field to reduce sound leakage. It should be noted that: combined with Figure 8 When the mechanism module 11 is equipped with a Helmholtz resonant cavity 200, the mechanism housing 111 may be provided with a through hole connecting the receiving cavity 100 and the Helmholtz resonant cavity 200. This through hole may be opened on the inner cylinder wall 1112 and / or the second end wall 1114. At this time, since the Helmholtz resonant cavity 200 is only connected to the receiving cavity 100 through the aforementioned through hole, and not connected to the outside of the earphone 10 through other channels, it can still be regarded as the receiving cavity 100 being connected to the outside of the earphone 10 only through the first channel.

[0422] In other embodiments, such as the movement module 11 having an acoustic filter 300, combined with Figure 9 The accommodating cavity 100 is connected to the outside of the earphone 10 only through a first channel and a second channel. The first channel is the gap between the wall of the connector 115 and the mounting hole 1111, and the second channel is connected to the outside of the earphone 10 through the acoustic filter 300. At this time, although the mechanism housing 111 is also provided with a through hole connecting the accommodating cavity 100 and the acoustic filter 300 in addition to the mounting hole 1111, the function of this through hole is different from that of the sound leakage reduction hole, and the two should not be confused.

[0423] In some other embodiments, the accommodating cavity 100 may communicate with the outside of the earphone 10 only through a first channel and a second channel. The first channel is the gap between the wall of the connector 115 and the mounting hole 1111. The ratio between the opening area of ​​the second channel and the opening area of ​​the first channel may be less than or equal to 10%. The second channel can be used as a sound leakage reduction hole to further adjust or optimize the sound leakage of the earphone 10 beyond the sound leakage reduction method using acoustic dipoles. In this case, since the housing 111 itself can reduce the sound leakage of the earphone 10 based on acoustic dipoles, the sound leakage of the earphone 10 can be kept at a level easily accepted by the user. Therefore, the opening area of ​​the second channel can be much smaller than the opening area of ​​a sound leakage reduction hole created solely through perforation in related technologies, which is beneficial for meeting the waterproof and dustproof requirements of the earphone 10. Of course, the aforementioned second channel may not be used as an acoustic hole such as a sound leakage reduction hole; but as an appearance hole. For example, in an embodiment where the earphone 10 includes two core modules 11, one core module 11 has a microphone and its core housing 111 has a microphone hole, and the other core module 11 does not have a microphone but its core housing 111 has an appearance hole corresponding to the aforementioned microphone hole; or it may simply be a through hole opened on the core housing 111 for no other purpose.

[0424] It should be noted that compared to the mechanism module 11 directly contacting the user's skin through the mechanism housing 111, the mechanism module 11 achieves a better fit by contacting the user's skin through the vibration panel 114. This is because the first transducer 113 has a certain degree of elasticity, and the transducer 112, vibration panel 114, etc., are suspended in the accommodating cavity 100 through the first transducer 113. In the wearing state, the first transducer 113 allows the vibration panel 114 to deflect at a certain angle relative to the mechanism housing 111 according to the skin contour when it contacts the user's skin, so that the vibration panel 114 can fit more closely to the user's skin. This helps to reduce the loss of the vibration panel 114 in transmitting the mechanical vibration of the transducer 112 to the user's skull and other media, thereby enhancing bone conduction sound. Furthermore, as the vibration panel 114 vibrates with the transducer 112, it also drives the air outside the earphone 10 to vibrate. The phases of the opposite sides are opposite, and the two can also cancel each other out in the far field, thereby reducing the sound leakage of the earphone 10.

[0425] Generally, the resonant frequency f of a structure satisfies the relationship between the structure's stiffness K and mass m: f ∝ (K / m). Stiffness can also be called the elastic coefficient or stiffness modulus. Clearly, for the same mass, the greater the stiffness of the structure, the higher its resonant frequency. Furthermore, greater structural stiffness results in fewer higher-order modes during structural vibration, which is beneficial for improving sound quality. The structural stiffness K is related to its material (specifically, Young's modulus E), the specific structural form, and other factors. Generally, the structural stiffness K satisfies the relationship between the material's Young's modulus E, the structure's thickness t, and the structure's area S: K ∝ (E·t) / S. Clearly, the smaller the area S, the greater the structural stiffness K; the greater the structural thickness t, the greater the structural stiffness K. Therefore, increasing the material's Young's modulus E, increasing the structure's thickness t, decreasing the structure's area S, or a combination thereof, all contribute to increasing the structural stiffness K, thereby increasing the structure's resonant frequency and reducing the higher-order modes during structural vibration. Based on this, the Young's modulus of the first end wall 1113 and the second end wall 1114 can be greater than or equal to 2000 MPa, preferably greater than or equal to 3000 MPa; and / or, the thickness of the first end wall 1113 and the second end wall 1114 can be between 0.3 mm and 3 mm, preferably between 0.5 mm and 2.5 mm; and / or, the area of ​​the first end wall 1113 and the second end wall 1114 can be between 200 mm². 2 With 500mm 2 Between, preferably between 300mm 2 With 400mm 2 The stiffness of the first end wall 1113 and the second end wall 1114 is kept between a certain value to ensure sufficient stiffness. This minimizes the number of higher-order modes during vibration of the first end wall 1113 and the second end wall 1114, and shifts the resonant frequencies of leakage sound generated by each end wall to higher frequencies, such as greater than or equal to 4kHz, making the user less sensitive to leakage. Furthermore, the difference in stiffness between the first end wall 1113 and the second end wall 1114 is small, so that the resonant frequencies of leakage sound generated by the first end wall 1113 and the second end wall 1114 are as close as possible, allowing for better anti-phase cancellation in the far field and reducing leakage sound from the earphone 10. Similarly, the Young's modulus of the vibrating panel 114 can be greater than or equal to 3000 MPa, preferably greater than or equal to 4000 MPa; and / or, the thickness of the vibrating panel 114 can be between 0.3 mm and 3 mm, preferably between 0.5 mm and 2.5 mm; and / or, the area of ​​the vibrating panel 114 can be between 130 mm². 2 With 400mm 2 Between, preferably between 140mm 2 With 300mm 2The stiffness of the vibrating panel 114 is sufficiently large, so that the higher-order modes of the vibrating panel 114 during vibration can be minimized.

[0426] As an example, when viewed along the vibration direction of the transducer 112, the ratio between the area of ​​the mounting hole 1111 and the area of ​​the first end wall 1113 can be less than or equal to 0.6, preferably less than or equal to 0.5. This ensures that, while the mounting hole 1111 meets the installation requirements of the connector 115, the stiffness of the first end wall 1113 and the stiffness of the second end wall 1114 are as close as possible, so that the resonant frequencies of the leakage sound generated by the first end wall 1113 and the second end wall 1114 are as close as possible. Furthermore, when viewed along the vibration direction of the transducer 112, the ratio between the difference between the area of ​​the mounting hole 1111 and the area of ​​the connector 115 and the area of ​​the mounting hole 1111 can be greater than 0 and less than or equal to 0.5, preferably greater than 0 and less than or equal to 0.4. Thus, when the mounting hole 1111 allows the connector 115 and the vibrating panel 114 to move relative to the housing 111, the gap between the connector 115 and the first end wall 1113 is kept as small as possible. This is to prevent excessive sound waves generated by the vibration of the transducer 112 and the air in the accommodating cavity 100 from being transmitted through the mounting hole 1111 to the outside of the earphone 10, thus preventing sound leakage. In other words, this suppresses the acoustic cavity effect and reduces sound leakage of the earphone 10. Of course, since the phase of the sound wave transmitted through the mounting hole 1111 to the outside of the earphone 10 can be opposite to the phase of one of the sound leakages generated by the first end wall 1113 and the second end wall 1114, the sound wave transmitted through the mounting hole 1111 to the outside of the earphone 10 can further adjust the antiphase cancellation of the sound leakages generated by the first end wall 1113 and the second end wall 1114 in the far field, thereby reducing sound leakage of the earphone 10.

[0427] As an example, the opening shape of the mounting hole 1111 and the cross-sectional shape of the connector 115 can be the same regular shape. For example, the opening shape of the mounting hole 1111 and the cross-sectional shape of the connector 115 can be a corresponding polygon, such as a regular polygon. That is, when the cross-sectional shape of the connector 115 is a square, a regular hexagon, etc., the opening shape of the mounting hole 1111 can also be a square, a regular hexagon, etc. As another example, the opening shape of the mounting hole 1111 and the cross-sectional shape of the connector 115 can be a circle, an ellipse, etc. Further, the gap between the connector 115 and the first end wall 1113 (specifically the wall surface of the mounting hole 1111) can be greater than 0 and less than or equal to 2 mm, preferably greater than 0 and less than or equal to 1 mm, more preferably greater than or equal to 0.1 mm and less than or equal to 1 mm, so that when the mounting hole 1111 allows the connector 115 and the vibration panel 114 to move relative to the movement housing 111, the gap between the connector 115 and the first end wall 1113 is as small as possible. When the number of mounting holes 1111 and connectors 115 are multiple and correspond one-to-one, for example... Figure 2 As shown in (b) and (c), the gap between the connector 115 and the wall of the mounting hole 1111 can be defined as the sum of the gaps formed by the multiple connectors 115 and the wall of their respective mounting holes 1111. Of course, in some other embodiments, the opening shape of the mounting hole 1111 and the cross-sectional shape of the connector 115 can be different regular shapes. For example, when the cross-sectional shape of the connector 115 is a square, a regular hexagon, or other regular polygon, the opening shape of the mounting hole 1111 can also be circular; conversely, when the cross-sectional shape of the connector 115 is circular, the opening shape of the mounting hole 1111 can also be a square, a regular hexagon, or other regular polygon. In other still embodiments, the opening shape of the mounting hole 1111 and the cross-sectional shape of the connector 115 can also be other irregular structural shapes. Among these, combined with... Figure 2 This application uses the example of a circular cross-sectional shape for the connector 115 as an example for illustrative purposes; correspondingly, the opening shape of the mounting hole 1111 is also circular.

[0428] In some embodiments, for example Figure 2 In (a), the number of connectors 115 can be one, and connector 115 can be connected to the central area of ​​the vibrating panel 114. In this case, the number of mounting holes 1111 can also be one, and connector 115 passes through the mounting hole 1111. In this way, under the same conditions, the communication area between the mounting hole 1111 and the outside of the mechanism housing 111 can be minimized, thereby suppressing the sound waves generated by the vibration of the transducer 112 in the accommodating cavity 100 to be transmitted to the outside of the earphone 10 through the mounting hole 1111 to the greatest extent and thus preventing sound leakage.

[0429] In some other embodiments, for example Figure 2 In (b), the number of connectors 115 can be multiple, such as three or four, etc., and the multiple connectors 115 are arranged around the center line of the vibration panel 114 parallel to the vibration direction of the transducer 112 (e.g., Figure 2 The O-shaped spacing in (b) is used. In this case, the number of mounting holes 1111 can also be multiple, with multiple connectors 115 connected to the transducer 112 through a corresponding mounting hole 1111. This improves the reliability of the connectors 115 connecting the vibration panel 114 and the transducer 112. Furthermore, the centers of the multiple connectors 115 can lie on the same circle (i.e., on the same circle), with the center of this circle (e.g.,...) Figure 2 As shown in (b), O can fall on the center line of the vibrating panel 114 parallel to the vibration direction of the transducer 112. Multiple connectors 115 can be evenly spaced around the center line of the vibrating panel 114 parallel to the vibration direction of the transducer 112.

[0430] In other embodiments, for example Figure 2 In step (c), the number of connectors 115 can be multiple, such as four or five. One connector 115 is connected to the central area of ​​the vibration panel 114, and the remaining connectors 115 are spaced apart around the connector 115 located in the central area of ​​the vibration panel 114. In this case, the number of mounting holes 1111 can also be multiple, with each connector 115 connected to the transducer 112 through a corresponding mounting hole 1111. This also helps to improve the reliability of the connection between the connectors 115 and the vibration panel 114 and the transducer 112.

[0431] It should be noted that: compared to Figure 1 , Figure 2 It can be simply regarded as the orthographic projection of the vibration panel 114 and the connector 115 along the vibration direction of the transducer 112.

[0432] In some embodiments, the accommodating cavity 100 communicates with the outside of the earphone 10 through a channel, which is the gap between the wall of the connector 115 and the mounting hole 1111. In this case, the mechanism module 11 may include a sealing membrane 118, which seals the aforementioned channel. That is, the gap between the connector 115 and the wall of the mounting hole 1111 can be sealed by the sealing membrane 118 to prevent sound waves generated within the accommodating cavity 100 and conducted by air from propagating to the outside of the earphone 10 through the aforementioned channel, thus preventing sound leakage. The sealing membrane 118 can be made of rubber, silicone, polyvinyl chloride (PVC), polycarbonate (PC), or poly(ether-ether-ketone) (PEEK).

[0433] As an example, combined Figure 35 The sealing film 118 may include an integrally connected first connecting portion 1181, a pleated portion 1182, and a second connecting portion 1183, wherein the pleated portion 1182 forms a recessed area between the first connecting portion 1181 and the second connecting portion 1182. In this case, the first connecting portion 1181 can be connected to the first end wall 1113, and the second connecting portion 1183 can be connected to the connector 115 or the vibration panel 114. Thus, compared to planar thin-film structures (such as the aforementioned recessed area), this non-planar thin-film structure with folds increases the elasticity of the sealing diaphragm 118. This helps prevent excessive transmission of mechanical vibrations generated by the transducer 112 to the mechanism housing 111 via the sealing diaphragm 118. It also helps prevent the sealing diaphragm 118 from being "torn" due to excessive relative movement between the connector 115 or the vibration panel 114 and the mechanism housing 111, from being "shattered" due to excessive or insufficient sound pressure within the accommodating cavity 100, or from fatigue failure due to excessive changes in sound pressure within the accommodating cavity 100. Furthermore, the mechanism housing 111 can be provided with a pressure relief hole to balance the sound pressure within the accommodating cavity 100, maintaining it at a level with minimal changes relative to atmospheric pressure, thereby extending the service life of the sealing diaphragm 118. The area of ​​the pressure relief hole can be less than or equal to 4 mm². 2 It is worth noting that: setting the sealing membrane 118 helps to increase the gap between the connector 115 and the wall of the mounting hole 1111. That is, the opening area of ​​the mounting hole 1111 can be set to be larger than the cross-sectional area of ​​the connector 115, which helps to avoid unnecessary wear between the connector 115 and the movement housing 111, thereby extending the service life of the movement module 11.

[0434] It should be noted that: combination Figure 46 and Figure 35 The sealing membrane 118 can be connected only to the first end wall 1113, that is, there can be a gap between the sealing membrane 118 and the connector 115, but the gap is smaller than the gap between the connector 115 and the wall of the mounting hole 1111. This not only reduces the communication area between the accommodating cavity 100 and the outside of the earphone 10, but also helps to balance the sound pressure in the accommodating cavity 100 and keep it at a level that does not change much relative to atmospheric pressure.

[0435] Based on the above description, during the mechanical vibration generated by the transducer 112, the core housing 111 (specifically, the first end wall 1113 and the second end wall 1114) and the vibration panel 114 can further form multiple sets of acoustic dipoles, that is, pairs of opposite phases cancel each other out, thereby reducing sound leakage of the earphone 10. Based on this, the ratio between the absolute value of the difference between the stiffness of the vibration panel 114 and the stiffness of the first end wall 1113 and the larger of the stiffness of the vibration panel 114 and the stiffness of the first end wall 1113 can be between 0 and 0.4, preferably between 0 and 0.3; and / or, the ratio between the absolute value of the difference between the stiffness of the vibration panel and the stiffness of the second end wall and the larger of the stiffness of the vibration panel and the stiffness of the second end wall is between 0 and 0.4, preferably between 0 and 0.3. In this way, the resonant frequency of the leakage sound generated by the vibrating panel 114 can be as close as possible to the resonant frequency of the leakage sound generated by the first end wall 1113 and / or the second end wall 1114, so that the two can better cancel each other out of phase in the far field, thereby reducing the leakage sound of the headphone 10.

[0436] As an example, when viewed along the vibration direction of the transducer 112, the ratio between the area of ​​the vibrating panel 114 and the area of ​​the first end wall 1113 can be between 0.3 and 1.6, preferably between 0.5 and 1.2. In other words, once the structure of the movement housing 111 is determined, the area of ​​the vibrating panel 114 and the area of ​​the first end wall 1113 can be not significantly different, so that the stiffness of the vibrating panel 114 and the stiffness of the first end wall 1113 are as close as possible. In addition, if the area of ​​the vibration panel 114 is too small, it may affect the transmission of the mechanical vibration generated by the transducer 112, thereby affecting the intensity of the bone conduction sound generated by the earphone 10. It may also cause the contact area between the user's skin and the core module 11 to be too small, causing discomfort and affecting the wearing comfort of the earphone 10. If the area of ​​the vibration panel 114 is too large, it may affect the rigidity of the vibration panel 114, thereby affecting the sound quality of the earphone 10. It may also cause the vibration panel 114 to be too affected by the skin contour, making it difficult to fit closely to the user's skin, thereby affecting the intensity of the bone conduction sound generated by the earphone 10.

[0437] Generally, for an acoustic dipole, the smaller the distance between two monopoles with opposite phases, the more pronounced the anti-phase cancellation effect, meaning a lower sound pressure level in the far field; correspondingly, for the earphone 10, the less sound leakage in the far field. Of course, considering the structural strength of the vibrating panel 114, the structural interference between the vibrating panel 114 and the core housing 111 during the vibration of the transducer 112, and the space requirements for installing structural components such as the transducer 112 within the core housing 111, the distance between the two monopoles is unlikely to be zero. Therefore, in the vibration direction of the transducer 112, the thickness of the vibrating panel 114 can be between 0.3mm and 3mm, preferably between 0.5mm and 2.5mm. If the thickness is too small, the vibrating panel 114 will not have sufficient rigidity. And / or, the gap between the vibrating panel 114 and the first end wall 1113 can be between 0.5mm and 3mm, preferably between 1mm and 2mm. If the gap is too small, the vibrating panel 114 will easily collide with the mechanism housing 111, resulting in sound distortion. And / or, the distance between the side of the first end wall 1113 away from the second end wall 1114 and the side of the second end wall 1114 away from the first end wall 1113 can be between 6mm and 16mm.

[0438] Combination Figure 3The movement module 11 may further include a perimeter 116 connected to one end of the movement housing 111 near the vibrating panel 114. For example, the perimeter 116 may be connected to one end of the inner cylinder wall 1112 away from the second end wall 1114, or, for example, to the first end wall 1113. The perimeter 116 may surround the vibrating panel 114 to prevent the vibrating panel 114 from falling off. In other words, the perimeter 116 is connected to the movement housing 111, and the projection of the perimeter 116 in a reference plane perpendicular to the vibration direction of the transducer 112 surrounds the periphery of the projection of the vibrating panel 114 in the aforementioned reference plane. In the non-wearing state, the rim 116 is spaced apart from the vibrating panel 114 in a direction perpendicular to the vibration direction of the transducer 112 to prevent the rim 116 from obstructing the vibration panel 114 from vibrating with the transducer 112. Furthermore, the side of the vibrating panel 114 facing away from the transducer 112 protrudes at least partially from the side of the rim 116 facing away from the transducer 112 in the vibration direction of the transducer 112, allowing the vibrating panel 114 to fit closely to the user's skin, thereby increasing the intensity of bone conduction sound generated by the headphones 10. In the wearing state, in addition to the contact between the vibrating panel 114 and the user's skin, the rim 116 can also contact the user's skin, that is, at least a portion of the rim 116 and the vibrating panel 114 contact the user's skin together, to share some of the pressure exerted by the mechanism module 11 on the user's skin, allowing the vibrating panel 114 to vibrate with the transducer 112, thereby improving the sound quality of the headphones 10, especially in the low-frequency range. In other words, the rim 116 on the movement module 11 helps to balance wearing stability, comfort, and sound quality. Therefore, the pressure of the vibration panel 114 on the user's cheek can be less than the pressure of the headband assembly 12 pressing the movement module 11 against the user's cheek, as mentioned later, and the contact area between the vibration panel 114 and the user's cheek can also be less than the contact area between the movement module 11 and the user's cheek. Specifically, when the mechanism module 11 has a surrounding edge 116, the pressing force of the mechanism module 11 against the user's cheek can be equal to the sum of the pressing force of the vibration panel 114 against the user's cheek and the pressing force of the surrounding edge 116 against the user's cheek, and the contact area between the mechanism module 11 and the user's cheek can be equal to the contact area between the vibration panel 114 and the user's cheek and the contact area between the surrounding edge 116 and the user's cheek; when the mechanism module 11 does not have a surrounding edge 116 and only contacts the user's cheek through the vibration panel 114, the pressing force of the mechanism module 11 against the user's cheek can be equal to the pressing force of the vibration panel 114 against the user's cheek, and the contact area between the mechanism module 11 and the user's cheek can be equal to the contact area between the vibration panel 114 and the user's cheek. Based on this, the headband assembly 12 mentioned later can apply a clamping force between 0.4N and 0.8N to press the mechanism module 11 against the user's cheek, and the clamping force of the vibration panel 114 on the user's cheek can be between 0.1N and 0.7N; the contact area between the mechanism module 11 and the user's cheek can be between 400mm².2 With 600mm 2 Between, preferably between 450mm 2 With 550mm 2 Between; the contact area between the vibration panel 114 and the user's cheek can be between 180mm². 2 With 300mm 2 Between, preferably between 160mm 2 With 280mm 2 between.

[0439] Furthermore, the side of the movement housing 111 near the vibration panel 114 can be enclosed with the vibration panel 114 and the surrounding edge 116 to form a cavity 400. For example, the surrounding edge 116, the first end wall 1113 and the vibration panel 114 can enclose the cavity 400. The surrounding edge 116 can be provided with a connecting hole 1161 that connects the cavity 400 with the outside of the movement module 11, so that in the wearing state, the cavity 400 is connected to the outside of the movement module 11 through the connecting hole 1161. In other words, the perimeter 116 can be provided with connecting holes 1161. These connecting holes 1161 connect the gap between the vibration panel 114 and the mechanism housing 111 (e.g., the first end wall 1113) and the outside of the earphone 10. This allows the sound leakage generated by the first end wall 1113 to cancel out in the far field with the sound leakage generated by the second end wall 1114. In other words, the sound leakage generated on opposite sides of the mechanism housing 111 can cancel out in the far field, better meeting the earphone 10's requirement for reduced sound leakage. The number of connecting holes 1161 can be multiple. For example, multiple connecting holes 1161 can be spaced around the connector 115. Alternatively, the opening ratio of the connecting holes 1161 on the perimeter 116 can be greater than or equal to 30%, allowing more of the sound leakage generated by the first end wall 1113 to propagate out and cancel out in the far field with the sound leakage generated by the second end wall 1114. The aforementioned opening ratio can be the product of the area of ​​a single connecting hole 1161 and the number of connecting holes 1161, divided by the area of ​​the perimeter 116. Furthermore, in the wearing state, at least a portion of the plurality of connecting holes 1161 does not contact the user's skin, so that sound leakage generated by the first end wall 1113 can propagate out through the connecting holes 1161. Therefore, combined with Figure 3 The connecting hole 1161 can be formed on the side of the perimeter 116; combined with Figure 27 or Figure 32 The connecting hole 1161 can be formed on the connecting part 1162, and the first outer cylinder wall 1115 is provided with a clearance hole corresponding to the connecting hole 1162. The connecting hole 1161 can also be formed on the part of the limiting part 1164 that does not come into contact with the user's skin; combined with Figure 52The connecting hole 1161 can be located on the part of the rim 116 that does not contact the user's skin. Furthermore, since the cavity 400 and the connecting hole 1161 can also form a Helmholtz resonant cavity, increasing the opening ratio of the connecting hole 1161 on the rim 116 helps shift the resonance peak of the cavity 400 to a higher frequency band, thus reducing the amount of sound leakage perceived by the user. It is worth noting that, in the wearing state, the opening direction of at least one of the connecting holes 1161 can be opposite to the top of the user's head; for example, the angle between the opening direction of the connecting hole 1161 and the user's vertical axis is between 0 and 10°, so that liquids such as the user's sweat can also flow out through the connecting hole 1161, thus preventing sweat and other substances from remaining inside the movement module 11. Of course, the sound leakage generated by the first end wall 1113 can also be transmitted through the gap between the perimeter 116 and the vibration panel 114 in the direction perpendicular to the vibration direction of the transducer 112, and thus cancel out the sound leakage generated by the second end wall 1114 in the far field, which will be described by example later.

[0440] As an example, there exists a target frequency range with a length of at least 1 / 3 octave within the frequency range of 500Hz to 4kHz. Based on this, within the aforementioned target frequency range, the sound leakage generated by the earphone 10 when worn is weaker when the communication port 1161 is open than the sound leakage generated by the earphone 10 when worn is closed. The aforementioned target frequency range can be from 1kHz to 2kHz. It should be noted that: the aforementioned closed state of the communication port 1161 can refer to blocking the communication port 1161.

[0441] Furthermore, each square millimeter of the perimeter 116 may have at least one connecting hole 1161, so that the number of connecting holes 1161 on the perimeter 116 is sufficient, but the area of ​​a single connecting hole 1161 is not particularly large, which helps to ensure the structural strength of the perimeter 116. Of course, in other embodiments where the structural strength of the perimeter 116 is sufficient, the area of ​​a single connecting hole 1161 may also be relatively large.

[0442] In some embodiments, the edging 116 can be a plastic component, and its wall thickness can be between 0.2 mm and 1 mm. If the wall thickness of the edging 116 is too small, it may result in insufficient structural strength; if the wall thickness is too large, the edging 116 may contact the user's skin before the vibration panel 114, making it difficult for the vibration panel 114 to make contact with the user's skin. Of course, to ensure contact between the vibration panel 114 and the user's skin, the portion of the edging 116 that contacts the user's skin can be thicker than other portions, for example, the wall thickness of the portion of the edging 116 that contacts the user's skin can be greater than 1 mm, to prevent the edging 116 from being compressed and collapsing during wear. Furthermore, when the edging 116 is a plastic component, the aforementioned plastic component can be injection molded onto a metal frame to structurally reinforce the edging 116.

[0443] In some embodiments, the edging 116 can be made of metal to allow the aperture ratio of the connecting holes 1161 on the edging 116 to be greater than or equal to 60%, mainly because the structural strength of metal parts can be higher than that of plastic parts. For example, the edging 116 is a wire mesh with a mesh count (i.e., the number of holes per inch) between 5 and 508.

[0444] In some embodiments, the movement housing 111 can be a first plastic part, and the edging 116 can be connected to the movement housing 111 by a second plastic part. The second plastic part and a metal part are integrally formed by injection molding, and the connecting hole 1161 can be formed on the aforementioned metal part.

[0445] Combination Figure 43 or Figure 44 The outer surface of the rim 116 facing the user's skin when worn may have uneven areas, so that the rim 116 does not completely fit the user's skin when in contact, that is, a gap is left between the rim 116 and the user's skin, thereby allowing the cavity 400 to communicate with the outside of the mechanism module 11. In this way, sound leakage generated on opposite sides of the mechanism housing 111 (e.g., the first end wall 1113 and the second end wall 1114) can also be canceled out in the far field, thereby meeting the headphone 10's requirement for reduced sound leakage. The height difference of the aforementioned uneven areas may be between 0.5mm and 5mm, so that there is sufficient communication gap between the cavity 400 and the outside of the mechanism module 11.

[0446] In some implementations, combined Figure 43The outer surface of the rim 116 may be provided with grooves 1165. In the wearing state, the cavity 400 communicates with the outside of the movement module 11 through the grooves 1165. The number and depth of the grooves 1165 affect the area of ​​communication between the cavity 400 and the movement module 11. For example, the projection of the rim 116 onto a reference plane perpendicular to the vibration direction of the transducer 112 has mutually orthogonal major and minor axis directions. The dimension of the rim 116 in the major axis direction is larger than its dimension in the minor axis direction. There can be multiple grooves 1165, which can be divided into four groups. Two groups of grooves 1165 are spaced apart along the major axis direction, and the other two groups are spaced apart along the minor axis direction. The number of grooves 1165 in each group spaced apart along the major axis direction can be greater than the number of grooves 1165 in each group spaced apart along the minor axis direction. For ease of distinction and description, [further details are needed]. Figure 43 The area containing the central groove 1165 is filled with a grid, meaning that the area containing one grid can be simply regarded as a groove 1165. For example, the depth of the groove 1165 can be between 0.5mm and 5mm.

[0447] In some implementations, combined Figure 44 The outer surface of the rim 116 may be provided with protrusions 1166. These protrusions 1166 create a gap between the rim 116 and the user's skin when worn, through which the cavity 400 communicates with the outside of the movement module 11. The number and height of the protrusions 1166 also affect the area of ​​communication between the cavity 400 and the outside of the movement module 11. For example, multiple protrusions 1166 can create a grid-like pattern in the gap. For ease of distinction and description, Figure 44 The area containing the central protrusion 1166 is filled with a grid, meaning that each grid area can be simply considered as a protrusion 1166. For example, the height of the protrusion 1166 can be between 0.5mm and 5mm.

[0448] Similarly, there exists a target frequency range with a length of at least 1 / 3 octave within the frequency range of 500Hz to 4kHz. Based on this, within the aforementioned target frequency range, the sound leakage generated by the earphone 10 when worn is weaker when the outer surface of the edging 116 has uneven areas than when the outer surface of the edging 116 does not have uneven areas. The aforementioned target frequency range can be from 1kHz to 2kHz. It should be noted that the aforementioned area on the outer surface of the edging 116 that does not have uneven areas can refer to filling in the uneven areas on the outer surface of the edging 116. For example, filling the groove 1165 or the spaces between multiple protrusions 1166 with glue, and allowing the glue to cure, can simply be considered as an area on the outer surface of the edging 116 that does not have uneven areas.

[0449] Combination Figure 45 The side of the rim 116 facing the user's skin when worn may have a porous structure 1167, so that when worn, the porous structure 1167 at least partially contacts the user's skin along with the vibration panel 114, and allows the cavity 400 to communicate with the outside of the mechanism module 11. In this way, sound leakage generated on opposite sides of the mechanism housing 111 (e.g., the first end wall 1113 and the second end wall 1114) can also be canceled out in the far field, thereby meeting the headphone 10's requirement for reduced sound leakage.

[0450] Furthermore, the porous structure 1167 may include a fixing layer and a porous main body layer connected to the fixing layer. The porous structure 1167 is connected to the perimeter 116 through the fixing layer, and the porous structure 1167 is connected to the outside of the cavity 400 and the movement module 11 through the porous main body layer. The porosity of the aforementioned porous main body layer may be greater than or equal to 60%, for example, the aforementioned porous main body layer may be a sponge or foam.

[0451] In some embodiments, the fixing layer of the porous structure 1167 and the surrounding edge 116 can be detachably connected, and the connection method between the two can be any one of magnetic, snap-on, or adhesive. Among them, the aforementioned adhesive method can be achieved by any one of Velcro, single-sided adhesive, and double-sided adhesive.

[0452] In some embodiments, the fixing layer of the porous structure 1167 can be cured adhesive, that is, the porous structure 1167 is fixed to the perimeter 116 by adhesive. In this case, since replacing the porous structure 1167 is inconvenient, to extend the service life of the porous structure 1167, the porous structure 1167 may include a protective layer covering the porous main body layer of the porous structure 1167, through which the porous structure 1167 comes into contact with the user's skin. The aforementioned protective layer can be made of textiles or steel mesh.

[0453] Similarly, within the frequency range of 500Hz to 4kHz, there exists a target frequency range with a length of at least 1 / 3 octave. Based on this, within the aforementioned target frequency range, the sound leakage generated by the earphone 10 when worn is weaker when the mechanism module 11 has the porous structure 1167 than when the earphone 10 does not have the porous structure 1167. The aforementioned target frequency range is 1kHz to 2kHz. It should be noted that: the aforementioned "mechanical module 11 not having the porous structure 1167" can mean that the porous structure 1167 can be removed from the edge 116. For example, when the porous structure 1167 is detachably connected to the edge 116, it can be removed; when the porous structure 1167 is fixed to the edge 116 with glue, it can be scraped off with a knife.

[0454] It should be noted that in embodiments where the rim 116 has grooves 1165, protrusions 1166, and porous structures 1167, the rim 116 may also have connecting holes 1161 that connect the cavity 400 to the outside of the movement module 11, so that in the wearing state, the cavity 400 can further communicate with the outside of the movement module 11 through the connecting holes 1161. The number of connecting holes 1161 can be multiple, and the opening ratio of the connecting holes 1161 on the rim 116 can be greater than or equal to 30%.

[0455] Combination Figure 4 A shim 117 can also be provided between the vibrating panel 114 and the first end wall 1113. The Rockwell hardness of the shim 117 is less than that of the first transducer 113. In other words, compared to the first transducer 113, the shim 117 can also be called a soft shim. This is to prevent the mechanical vibration generated by the transducer 112 from being transmitted to the mechanism housing 111 via the shim 117, thereby further reducing sound leakage of the earphone 10. The shim 117 can be adhesive, such as foam adhesive, to connect the vibrating panel 114 and the first end wall 1113, which can also prevent the vibrating panel 114 from falling off.

[0456] It should be noted that, through long-term research, the inventors of this application discovered that adding a surrounding edge 116 to the movement module 11 helps to shift sound leakage towards the mid-to-high frequency range; while adding a gasket 117 to the movement module 11 helps to shift sound leakage towards the mid-to-low frequency range, both of which contribute to improving sound leakage. Furthermore, in this application, the frequency range corresponding to the low frequency range can be 20-150Hz, the frequency range corresponding to the mid frequency range can be 150-5kHz, and the frequency range corresponding to the high frequency range can be 5kHz-20kHz. Specifically, the frequency range corresponding to the mid-to-low frequency range can be 150-500Hz, and the frequency range corresponding to the mid-to-high frequency range can be 500-5kHz.

[0457] Combination Figures 5 to 7The side of the vibration panel 114 facing away from the transducer 112 may include a skin contact area 1141 for contact with the user's skin and an air conduction enhancement area 1142 that is at least partially not in contact with the user's skin. The vibration panel 114 can drive the air outside the earphone 10 to vibrate through the air conduction enhancement area 1142 to form sound waves. In other words, the core module 11 generates both bone conduction sound and air conduction sound through the vibration panel 114, and the two are in phase, so as to allow the air conduction sound to enhance the bone conduction sound, thereby improving the sound quality of the earphone 10. The air conduction enhancement area 1142 may be at least partially tilted relative to the skin contact area 1141 and extend toward the transducer 112, and the tilt angle of the air conduction enhancement area 1142 relative to the skin contact area 1141 (e.g., the angle of tilt of the air conduction enhancement area 1142 relative to the skin contact area 1141 is ... Figure 5 and Figure 6 The angle θ (as shown in the figure) can be between 0 and 75°, preferably between 0 and 60°; and / or, the width of the orthographic projection of the air conduction enhancement region 1142 along the vibration direction of the transducer 112 (e.g., θ) can be between 0 and 75°, preferably between 0 and 60°; and / or, the width of the orthographic projection of the air conduction enhancement region 1142 along the vibration direction Figures 5 to 7 The area (as shown in the middle W) can be greater than or equal to 1 mm, preferably greater than or equal to 2 mm. This increases the size of the air conduction enhancement region 1142, thereby increasing the enhancement effect of air-conducted sound on bone-conducted sound. Furthermore, the air conduction enhancement region 1142 can be configured as a curved surface (e.g., Figure 5 As shown), it can also be set as a plane (e.g. Figure 6 (As shown).

[0458] In some embodiments, for example Figure 5 The air conduction enhancement area 1142 can be tilted entirely relative to the skin contact area 1141 and extend toward the transducer 112.

[0459] In some other embodiments, for example Figure 6 The air conduction enhancement region 1142 may be partially inclined relative to the skin contact region 1141 (i.e., θ≠0) and extend toward the transducer 112, while another portion may be spaced apart from the skin contact region 1141 in the vibration direction of the transducer 112, for example, parallel to the skin contact region 1141 (i.e., θ=0). Further, combined with... Figure 27 When the housing 111 of the mechanism is provided with a rim 116, when viewed along the vibration direction of the transducer 112, the rim 116 can partially overlap with the air conduction enhancement area 1142 and be offset from the skin contact area 1141, so that the rim 116 can stop the vibration panel 114 in the vibration direction of the transducer 112.

[0460] In other embodiments, for example Figure 7When worn, the air conduction enhancement area 1142 at least partially points towards the entrance of the external auditory canal of the user's ear, allowing the sound waves generated by the vibrating panel 114 to be directed towards the entrance of the external auditory canal, thereby increasing the enhancement effect of air conduction sound on bone conduction sound. As an example, the vibrating panel 114 has a major axis direction and a minor axis direction that are perpendicular to the vibration direction of the transducer 112 and orthogonal to each other. The dimension of the vibrating panel 114 in the aforementioned major axis direction is larger than the dimension of the vibrating panel 114 in the aforementioned minor axis direction. For example, when viewed along the vibration direction, the vibrating panel 114 is elliptical, rounded rectangular, or racetrack-shaped. In the worn state, the aforementioned major axis direction points towards the top of the user's head, and the aforementioned minor axis direction points towards the entrance of the external auditory canal of the user's ear. Thus, the mechanism module 11 can be positioned closer to the external auditory canal as a whole when worn, allowing the mechanism module 11 to transmit the mechanical vibration generated by the transducer 112 via bone conduction while simultaneously causing more air vibration within the external auditory canal (i.e., air conduction sound), thereby increasing the volume of the sound heard by the user.

[0461] Combination Figures 8 to 10 The mechanism module 11 may be provided with an acoustic cavity communicating with the accommodating cavity 100. The acoustic cavity is used to absorb the acoustic energy of the sound waves generated by the vibration of the air in the accommodating cavity 100 with the transducer 112. The aforementioned sound waves can be output to the outside of the earphone 10 through the mounting hole 1111 to form an air-conducting sound.

[0462] In some embodiments, for example Figure 8 The frequency response curve of the aforementioned sound wave has a resonance peak. The aforementioned acoustic cavity can be a Helmholtz resonant cavity 200 to reduce the intensity of the aforementioned resonance peak (specifically, the peak resonance intensity), that is, to suppress the sudden increase in the peak resonance intensity, so that the sound quality of the headphones 10 is more balanced. The peak resonance frequency of the aforementioned resonance peak can be between 500Hz and 4kHz, preferably between 1kHz and 2kHz. As an example, the Helmholtz resonant cavity 200 can be disposed on the housing 111 of the mechanism, for example, on the side of the second end wall 1114 facing away from the transducer 112; and / or, the Helmholtz resonant cavity 200 can be disposed on the transducer 112 (e.g., its magnetic circuit system). Of course, in other embodiments, such as highlighting a certain frequency point or frequency band, the Helmholtz resonant cavity 200 can be configured to reduce the vibration intensity of the aforementioned air-conducted sound frequency response curve within a preset frequency band, which may not cover the aforementioned resonance peak. The difference between the intensity of the aforementioned resonance peak when the opening connecting the Helmholtz resonant cavity 200 and the accommodating cavity 100 is in the open state and the intensity of the aforementioned resonance peak when the opening connecting the Helmholtz resonant cavity 200 and the accommodating cavity 100 is in the closed state can be greater than or equal to 3dB, and the corresponding frequency response curve can be measured under the condition of excitation voltage of 1V.

[0463] In some other embodiments, for example Figure 9 and Figure 10 The aforementioned acoustic cavity can be a sound filter 300, and the cutoff frequency of the sound filter 300 can be less than or equal to 5kHz, preferably less than or equal to 4kHz, to attenuate sound energy in frequency bands higher than the aforementioned cutoff frequency. As an example, combined with... Figure 9 The acoustic filter 300 can be located on the side of the transducer 112 opposite to the vibrating panel 114, i.e., a rear acoustic filter. Combined with... Figure 10 The acoustic filter 300 can be located on the side of the transducer 112 facing the vibration panel 114, i.e., a pre-filter. For example, the first end wall 1113 may include a first sub-end wall 11131 and a second sub-end wall 11132 spaced apart in the vibration direction of the transducer 112. The mounting hole 1111 passes through the first sub-end wall 11131 and the second sub-end wall 11132 along the vibration direction of the transducer 112. The first sub-end wall 11131 and the second sub-end wall 11132 cooperate with the inner cylinder wall 1112 to form the acoustic filter 300. The gap between the first sub-end wall 11131 and the second sub-end wall 11132 in the vibration direction of the transducer 112 can be between 0.5 mm and 5 mm, preferably between 1 mm and 3 mm.

[0464] Combination Figure 11The transducer 112 may include a bracket 1121, a second transducer 1122, a magnetic circuit system, and a coil 1123. The bracket 1121 is connected to the housing 111 via the first transducer 113. The second transducer 1122 connects the bracket 1121 and the magnetic circuit system to suspend the magnetic circuit system within the accommodating cavity 100. The coil 1123 is connected to the bracket 1121 and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer 112. At this time, the vibration panel 114 can be connected to the bracket 1121 via a connector 115. As an example, the peripheral area of ​​the first transducer 113 can be connected to the housing 111, and the central area of ​​the first transducer 113 can be connected to the bracket 1121; the peripheral area of ​​the second transducer 1122 can be connected to the bracket 1121, and the central area of ​​the second transducer 1122 can be connected to the magnetic circuit system. Of course, in some other embodiments, the peripheral area of ​​the second transducer 1122 can be connected to the magnetic circuit system, and the central area of ​​the second transducer 1122 can be connected to the support 1121. In this case, the magnetic circuit system can be connected to the peripheral area of ​​the second transducer 1122 through a cylindrical connector. The aforementioned magnetic circuit system may include a magnetic shield 1124 and a magnet 1125 connected to the bottom of the magnetic shield 1124. The number of magnets 1125 can be set to one or at least two as needed. The magnets 1125 can be connected to the central area of ​​the second transducer 1122 and are spaced apart from the magnetic shield 1124 in a direction perpendicular to the vibration direction of the transducer 112 to form the aforementioned magnetic gap. The coil 1123 extends between the magnet 1125 and the magnetic shield 1124. It is worth noting that in some embodiments, such as the inner side of the magnetic shield 1124 having an annular magnet surrounding the magnet 1125, although the magnetic gap is specifically formed between the annular magnet and the magnet 1125, the magnetic gap is still located between the magnetic shield 1124 and the magnet 1125. Therefore, it can still be regarded as the magnetic gap being formed by the magnet 1125 and the magnetic shield 1124 being spaced apart in a direction perpendicular to the vibration direction of the transducer 112.

[0465] In some implementations, combined Figure 27 and Figure 28The central region of the first vibration transducer 113 can be nested on the bracket 1121, and the peripheral region of the first vibration transducer 113 can be pressed against the inner cylinder wall 1112 by the first end wall 1113; the central region of the second vibration transducer 1122 can be nested on the bracket 1121, and is further away from the vibration panel 114 than the first vibration transducer 113; the peripheral region of the second vibration transducer 1122 can be fixed on a cylindrical connector; the side wall of the magnetic shield 1124 of the magnetic circuit system can be connected to the aforementioned cylindrical connector, so that the magnetic circuit system is connected to the bracket 1121 through the second vibration transducer 1122; the coil 1123 is connected to the side of the bracket 1121 away from the first vibration transducer 113 and the second vibration transducer 1122, and extends into the magnetic gap between the magnetic shield 1124 and the magnet 1125. At this time, since the side wall of the magnetic shield 1124 is connected to the second transducer 1122 through a cylindrical connector, a cavity is formed inside the transducer 112. Without any other structural improvements, this cavity is only connected to the accommodating cavity 100 through the hollow area on the second transducer 1122, which causes the transducer 112 to have a relatively serious acoustic cavity effect during vibration, resulting in a large amount of sound leakage.

[0466] In some implementations, combined Figure 46 and Figure 11 The bracket 1121 can be connected to the housing 111 of the mechanism via the first transducer 113, and the second transducer 1122 can be connected to the first transducer 113 via the bracket 1121. The magnetic circuit system can be connected to the central area of ​​the second transducer 1122 to suspend the magnetic circuit system within the accommodating cavity. The coil 1123 extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer 112. The aforementioned magnetic gap surrounds the location where the magnetic circuit system is connected to the second transducer 1122. Thus, because the magnetic circuit system is connected to the central area of ​​the second transducer 1122, the magnetic circuit system does not need to have a cylindrical connector connecting to the peripheral area of ​​the second transducer 1122; that is, the aforementioned cylindrical connector is eliminated, allowing for a larger communication area between the inside and outside of the transducer 112. This helps suppress the aforementioned acoustic cavity effect, thereby improving the sound leakage of the earphone 10. For example, the magnet 1125 of the magnetic circuit system is connected to the central region of the second transducer 1122, and the side wall of the magnetic shield 1124 can also be spaced apart from the second transducer 1122 in the vibration direction of the transducer 112 to form a channel connecting the aforementioned magnetic gap and the outside of the magnetic circuit system, thereby increasing the area of ​​communication between the inside and outside of the transducer 112.

[0467] As an example, combined Figure 47 and Figure 46The support 1121 may include a first support 11212 and a second support 11213. The first support 11212 can be connected to the central region of the first vibration transducer 113, and the second support 11213 can be connected to the peripheral region of the second vibration transducer 1122. Correspondingly, the second support 11213 and the vibration panel 114 can be connected to the first support 11212 respectively, and the coil 1123 can be connected to the second support 11213. In this case, since the position where the coil 1123 is connected to the second support 11213 corresponds to the peripheral region of the second vibration transducer 1122, the aforementioned magnetic gap can surround the central region where the magnetic circuit system is connected to the second vibration transducer 1122. The first support 11212 and the first vibration transducer 113 can be integrally formed using a metal insert injection molding process, and the second support 11213 and the second vibration transducer 1122 can also be integrally formed using a metal insert injection molding process. Accordingly, one of the first bracket 11212 and the second bracket 11213 may be provided with a connector hole, and the other may be provided with a connector post that is embedded in the connector hole, with the connector post extending into the connector hole to connect the first bracket 11212 and the second bracket 11213. In this embodiment, the first bracket 11212 and the second bracket 11213 are respectively provided with a connector hole 11215 and a connector post 11216 for illustrative purposes.

[0468] Furthermore, the transducer 112 may include a suspension 11214, which is connected to the central region of the second transducer 1122. A second support 11213 is located around the suspension 11214 and is spaced apart from the suspension 11214 in a direction perpendicular to the vibration direction of the transducer 112. The magnet 1125 of the magnetic circuit system can be connected to the suspension 11214. Thus, the magnetic gap between the magnetic shield 1124 and the magnet 1125 surrounds the central region where the magnet 1125 is connected to the second transducer 1122.

[0469] Furthermore, the magnet 1125 can be a permanent magnet, or it can include a first magnetic element 11251, a magnetic conductive element 11252, and a second magnetic element 11253 stacked along the vibration direction of the transducer 112. The second magnetic element 11253 is closer to the second transducer 1122 than the first magnetic element 11251. For example, the first magnetic element 11251 is connected to the bottom of the magnetic conductive cover 1124. The magnetization directions of the first magnetic element 11251 and the second magnetic element 11253 are different, for example, their magnetization directions are opposite to each other. Furthermore, when the sidewall of the magnetic conductive cover 1124 is projected onto the outer peripheral surface of the magnet 1125 along a direction perpendicular to the vibration direction of the transducer 112, it can at least overlap with the magnetic conductive element 11252, so that the magnetic field formed by the magnet 1125 is more concentrated in the aforementioned magnetic gap, thereby reducing sound leakage. Preferably, when the coil 1123 is projected onto the outer peripheral surface of the magnet 1125 in a direction perpendicular to the vibration direction of the transducer 112, it can at least overlap with the magnetic conductor 11252, so that the magnetic field formed by the magnet 1125 passes through the coil 1123 more, thereby increasing the utilization rate of the magnetic field.

[0470] Furthermore, the magnetic shield 1124 may be provided with a connecting hole 11241 that connects the aforementioned magnetic gap and the external space of the magnetic circuit system, thereby increasing the area of ​​communication between the inside and outside of the transducer 112 and thus weakening the acoustic cavity effect. Of course, the support 1121 may also be provided with a connecting hole 11211 extending along the vibration direction of the transducer 112, and the aforementioned cylindrical connector may also be provided with a through hole extending in a direction perpendicular to the vibration direction of the transducer 112, thereby further increasing the area of ​​communication between the inside and outside of the transducer 112 and thus weakening the acoustic cavity effect. This is because, during the mechanical vibration of the transducer 112, the air on opposite sides of its vibration direction is compressed or expanded, thus forming positive and negative sound pressure; and the aforementioned connecting hole allows the air on opposite sides of the transducer 112 to communicate, thereby canceling each other out.

[0471] In some embodiments, when not worn, the frequency response curve of the vibration panel 114 has a resonance valley, a first resonance peak, and a second resonance peak in the frequency range of 80Hz to 2kHz. The peak frequencies of the resonance valley, the first resonance peak, and the second resonance peak are defined as f0, f1, and f2, respectively, and satisfy the relationship: f0 < f1 < f2. Specifically, 80Hz ≤ f0 ≤ 400Hz, 80Hz ≤ f1 ≤ 400Hz, and 100Hz ≤ f2 ≤ 2kHz.

[0472] In some embodiments, when not worn, the frequency response curve of the vibration panel 114 has only one resonance peak in the frequency range of 80Hz to 2kHz. The peak frequency of the aforementioned resonance peak is between 100Hz and 2kHz.

[0473] In some embodiments, when not worn, the frequency response curve of the vibration panel 114 has a first resonance peak and a second resonance peak in the frequency range of 80Hz to 2kHz, and no resonance valley. The peak frequency of the first resonance peak is between 80Hz and 400Hz, and the peak frequency of the second resonance peak is between 100Hz and 2kHz.

[0474] In some embodiments, when not worn, the frequency response curve of the vibration panel 114 has a resonance valley, a first resonance peak and a second resonance peak in the frequency range of 80Hz to 200Hz. The peak frequencies of the resonance valley, the first resonance peak and the second resonance peak are defined as f0, f1 and f2 respectively, and satisfy the relationship: f0 < f2, f1 < f2.

[0475] In some embodiments, the mass of the mechanism housing 111 is greater than or equal to 1.2g, preferably greater than or equal to 1.5g; and / or, the stiffness of the first transducer 113 is less than or equal to 2500N / m. Further, the mass of the magnetic circuit system is greater than or equal to 3g, preferably greater than or equal to 5g; and / or, the stiffness of the second transducer 1122 is greater than or equal to 3000N / m, preferably greater than or equal to 5000N / m.

[0476] In some embodiments, the mass of the mechanism housing 111 is less than or equal to 0.5g, preferably less than or equal to 0.3g; and / or, the stiffness of the first vibration transducer 113 is greater than or equal to 2000N / m, preferably greater than or equal to 5000N / m.

[0477] In some embodiments, in the non-wearing state, the frequency response curve of the vibration panel 114 has a resonance peak, which is strongly correlated with the stiffness of the bracket 1121, and the peak frequency of the resonance peak is greater than or equal to 4kHz, preferably greater than or equal to 5kHz. The stiffness of the bracket 1121 is greater than or equal to 10. 5 N / m, preferably greater than or equal to 5 × 10 5 N / m.

[0478] Combination Figure 12 The headphones 10 may also include a headband assembly 12 connected to the mechanism module 11. The headband assembly 12 is used to wrap around the top of the user's head and allows the mechanism module 11 to be positioned entirely in front of the user's ear. Alternatively, the mechanism module 11 may be entirely positioned behind the user's ear or in other locations, or it may be partially positioned in front of or behind the user's ear. In some embodiments, for example... Figure 34The mechanism module 11 can contact the user's cheek through the mechanism housing 111 (specifically, the first end wall 1113), that is, the side of the mechanism housing 111 facing away from the adapter housing 13 forms a contact surface for contact with the user's skin. In some other embodiments, for example Figure 1 The movement module 11 can contact the user's cheek via the vibration panel 114. In other embodiments, for example... Figure 3 The movement module 11 can contact the user's cheek via the vibration panel 114 and the surrounding edge 116, for example... Figure 45 The movement module 11 can contact the user's cheek through the porous structure 1167 on the vibration panel 114 and the surrounding edge 116.

[0479] It should be noted that: except Figure 12 In addition to the headband assembly 12 shown, the mechanism module 11 can be connected to other types of support components. These support components support the mechanism module 11 when worn, allowing the user to wear the headphones 10. For example, the support components include a back hook structure and ear hook structures connected to both ends of the back hook structure. The back hook structure is used to wrap around the back of the user's head when worn, and the two ear hook structures are used to hang on the user's left and right ears respectively when worn. Furthermore, the wearing position can be on the user's cheek near the ear or on the front of the head away from the ear.

[0480] As an example, when worn, the headband assembly 12 can form a first contact point with the top of the user's head (e.g., Figures 13 to 17 As shown in CP1), the movement module 11 forms a second contact point with the user's cheek (e.g., Figures 13 to 17 As shown in CP2), the distance between the second contact point and the first contact point in the direction of the human sagittal axis (e.g.) Figures 13 to 17The distance between the first and second contact points (as shown in the diagram) can be between 20mm and 30mm, preferably between 22mm and 28mm. Further, the distance between the second and first contact points along the sagittal axis of the human body is preferably 25mm. This distance ensures that the mechanism module 11 can be naturally worn on the user's cheek near the ear. The mechanism module 11 vibrates at this position to generate sound waves, which can be transmitted to the user's central nervous system via the shortest path, resulting in higher transmission efficiency and less sound loss. Specifically, viewed along the coronal axis of the human body, the first contact point can be located directly above the user's ear, and the second contact point can be located directly in front of the user's ear. Further, the headband assembly 12 can include an arc-shaped headband component 121 and an adapter 122. The arc-shaped headband component 121 is used to wrap around the top of the user's head, and the two ends of the adapter 122 are connected to the arc-shaped headband component 121 and the mechanism module 11, respectively. The curved headband 121 can be located above the user's ear and form a first contact point with the top of the user's head. For example, the curved headband 121 can be made of plastic, and the adapter 122 can be made of metal; of course, both can also be made of either plastic or metal. When the movement module 11 is configured to move closer to or further away from the curved headband 121 in the extension direction of the headband assembly 12, for example, the adapter 122 can extend or retract from the curved headband 121 at one end away from the movement module 11 (specifically, the first connecting segment 1221 mentioned later). The portion of the curved headband 121 that mates with the adapter 122 can also be made of metal to locally enhance the wear resistance of both.

[0481] It should be noted that: although Figures 13 to 17 The diagram only shows the contact point between the earphone 10 and the user's head on one side, but the earphone 10 is generally designed with a symmetrical structure, for example... Figure 12 The headband assembly 12 shown is connected to a core module 11 at each end, so that each core module 11 forms a second contact point with the user's cheek. In other words, the earphone 10 and the user's head can actually form a first contact point and two contact points, referred to as "three-point wearing".

[0482] Combination Figure 48 and Figure 16 When worn, and viewed along the direction of the human coronal axis, the center of the vibrating panel 114 is oriented towards the center of the side of the wearing position (e.g., Figure 48 (As shown in CP2) The center of the side of the device housing 111 facing the aforementioned wearing position in the direction of the human sagittal axis (e.g., Figure 48(As shown in CP0) It is closer to the external auditory canal of the user's ear. In other words, given the fixed structure of the aforementioned support component and the mechanism module 11, the vibration panel 114 is offset relative to the mechanism housing 111 so that when the mechanism module 11 vibrates at the aforementioned wearing position to generate sound waves, the sound waves can be transmitted to the user's central nervous system via the shortest path, resulting in higher transmission efficiency and less sound loss. In addition, the vibration panel 114 is closer to the external auditory canal when worn, so that while the mechanism module 11 transmits the mechanical vibration generated by the transducer 112 via bone conduction, it can also cause more air in the external auditory canal to vibrate (i.e., air conduction), thereby increasing the volume of the sound heard by the user. It is worth noting that in the embodiment where the mechanism module 11 includes a perimeter 116, the vibration panel 114 is offset relative to the perimeter 116, that is, the centers of the two on the side facing the wearing position do not coincide.

[0483] In some embodiments, the center of the transducer 114 projected orthogonally along the vibration direction of the transducer 112 onto the center of the movement housing 111 coincides with the center of the transducer 112 projected orthogonally along the aforementioned vibration direction onto the center of the movement housing 111. That is, the transducer 114 is not biased relative to the transducer 112. For example, the position where the bracket 1121 is connected to the transducer 114 is at the center of the transducer 114. The center of the transducer 112 projected orthogonally along the aforementioned vibration direction onto the center of the movement housing 111 does not coincide with the center of the movement housing 111 on the side facing the transducer 112 in the aforementioned vibration direction. That is, the transducer 112 as a whole is biased relative to the movement housing 111.

[0484] In some other embodiments, the transducer 112 is projected orthogonally along its vibration direction onto the center of the movement housing 111, which coincides with the center of the movement housing 111 on the side facing the transducer 112 in the aforementioned vibration direction. That is, the transducer 112 as a whole is not biased relative to the movement housing 111. However, the center of the vibration panel 114 is projected orthogonally along the aforementioned vibration direction onto the center of the movement housing 111, which does not coincide with the center of the transducer 112 being projected orthogonally along the aforementioned vibration direction onto the center of the movement housing 111. That is, the vibration panel 114 is biased relative to the transducer 112. For example, the position where the bracket 1121 is connected to the vibration panel 114 is not at the center of the vibration panel 114, so that the vibration panel 114 is biased relative to the movement housing 111.

[0485] Furthermore, the headphones 10 may include an adapter housing 13 connecting the core housing 111 and the support assembly (e.g., headband assembly 12). Wherein, combined with Figure 20 , Figure 27 and Figure 28The adapter housing 13 may include a cylindrical sidewall 134 located around the periphery of the mechanism housing 111, and the cylindrical sidewall 134 may be connected to the headband assembly 12. Based on this, the orthographic projections of the mechanism housing 111 and the cylindrical sidewall 134 onto a reference plane perpendicular to the vibration direction of the transducer 112 respectively have a first center and a second center. In the wearing state, the first center may be closer to the user's external auditory canal than the second center. In other words, combined with... Figure 46 and Figure 28 With the structure of the support component and the movement module 11 fixed, the movement housing 111 is set to be offset relative to the adapter housing 13 so that the movement module 11 vibrates at the aforementioned wearing position to generate sound waves, which can be transmitted to the user's central nervous system through the shortest path, making the transmission efficiency of the sound waves higher and the sound loss less.

[0486] As an example, combined Figure 48 and Figure 46 The movement housing 111 can be configured relative to the adapter housing 13 about a first axis (e.g. Figure 48 As shown in A1, the movement module 11 is rotated to better fit the wearing position. The first center and the second center are spaced apart along the direction of the first axis. In other words, along the direction of the first axis, if one side of the movement housing 111 is closer to the cylindrical sidewall 134, then the other side of the movement housing 111 can be further away from the cylindrical sidewall 134; that is, the gap between the movement housing 111 and the cylindrical sidewall 134 may not be unequal along the direction of the first axis. Furthermore, the first center and the second center can be located along the first axis, meaning the movement module 11 is only translated a distance along the first axis.

[0487] In some embodiments, combined with Figures 13 to 16 When worn and viewed along the direction of the human coronal axis, the headband assembly 12 is at least partially tilted relative to the vertical axis of the human body, for example, extending tilted towards the user's front, to facilitate the formation of a first contact point and a second contact point. In this case, the adapter 122 can be configured as a rod or a plate. For example: combined with... Figure 13 Viewed along the direction of the human coronal axis, the arc-shaped headband 121 is inclined relative to the vertical axis of the human body, and the adapter 122 is parallel to the vertical axis of the human body. At this time, the adapter 122 can connect to the side of the mechanism module 11 facing the user's head. For example: combining... Figure 14 Viewed along the coronal axis of the human body, the curved headband 121 is tilted relative to the vertical axis of the human body, and the adapter 122 is also tilted relative to the vertical axis of the human body, with both having the same tilt angle. At this time, the adapter 122 can connect to the side of the movement module 11 away from the user's cheek. For example: combining... Figure 15Viewed along the direction of the human coronal axis, the curved headband 121 is inclined relative to the vertical axis of the human body, and part of the adapter 122 is inclined relative to the vertical axis of the human body, while another part is parallel to the vertical axis of the human body. At this time, the adapter 122 can connect to the side of the mechanism module 11 opposite to the user's ear. For example: combining... Figure 16 Viewed along the direction of the human coronal axis, the arc-shaped headband 121 is parallel to the vertical axis of the human body, and part of the adapter 122 is inclined relative to the vertical axis of the human body, while another part is parallel to the vertical axis of the human body. At this time, the adapter 122 can be connected to the side of the mechanism module 11 facing the user's head.

[0488] In some other embodiments, combined Figure 17 The adapter 122 can be designed in a ring shape. When worn, and viewed along the direction of the human coronal axis, the arc-shaped headband 121 can be parallel to the vertical axis of the human body, and the adapter 122 can be fitted around the user's ear, forming both a first contact point and a second contact point. The adapter 122 can be a continuous, closed ring or a discontinuous ring (e.g., a C-shape or a U-shape).

[0489] It should be noted that in medicine, anatomy, and other fields, the human body can be defined by three basic planes: the sagittal plane, the coronal plane, and the horizontal plane; and three basic axes: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane is a section perpendicular to the ground along the anteroposterior direction of the body, dividing the body into left and right parts. The coronal plane is a section perpendicular to the ground along the left-right direction of the body, dividing the body into anterior and posterior parts. The horizontal plane is a section parallel to the ground along the vertical direction of the body, dividing the body into superior and inferior parts. Correspondingly, the sagittal axis is the axis perpendicular to the coronal plane along the anteroposterior direction of the body; the coronal axis is the axis perpendicular to the sagittal plane along the left-right direction of the body; and the vertical axis is the axis perpendicular to the horizontal plane along the vertical direction of the body.

[0490] As an example, and in combination Figure 12 , Figure 16 and Figure 20The adapter 122 may include a first connecting segment 1221, an intermediate transition segment 1222, and a second connecting segment 1223, with the intermediate transition segment 1222 connecting the first connecting segment 1221 and the second connecting segment 1223. The first connecting segment 1221 and the second connecting segment 1223 are respectively bent and extended in the opposite direction relative to the intermediate transition segment 1222. In this case, the first connecting segment 1221 can be connected to the arc-shaped headband 121, and the second connecting segment 1223 can be connected to the movement module 11. Viewed along the direction of the human coronal axis, the intermediate transition segment 1222 is inclined relative to the vertical axis of the human body to facilitate the formation of a first contact point and a second contact point.

[0491] Furthermore, the bending angle of the first connecting segment 1221 relative to the intermediate transition segment 1222 (e.g.) Figure 16 (As shown in θ1) can be greater than or equal to 90° and less than 180°; and / or, the bending angle of the second connecting segment 1223 relative to the intermediate transition segment 1222 (e.g., ... Figure 16 (As shown in θ2) can be greater than or equal to 90° and less than 180°. This allows the adapter 122 to more smoothly transition between the curved headband 121 and the movement module 11. Specifically, when worn and viewed along the direction of the human coronal axis, the first connecting segment 1221 can be parallel to the second connecting segment 1223. At this time, the distance between the first connecting segment 1221 and the second connecting segment 1223 (e.g., θ2) can be greater than or equal to 90° and less than 180°. Figure 16 The diameter (as shown in the figure) can be between 20mm and 30mm, preferably between 22mm and 28mm.

[0492] It should be noted that: combination Figure 19 The adapter 122 may also have a curved arc from other perspectives (e.g., when viewed along the direction of the human sagittal axis). For example, the adapters 122 at both ends of the curved headband 121 extend closer to each other in the same direction so that the headphones 10 can better contact the user's head and also so that the headband assembly 12 can provide clamping force to the core module 11.

[0493] Furthermore, combined Figure 20The first connecting section 1221 and the second connecting section 1223 can each be provided with a wiring cavity, for example, both can be arranged in a hollow tubular shape. The intermediate transition section 1222 can be provided with a slot 1224, which is used to connect the wiring cavities of the first connecting section 1221 and the second connecting section 1223, so as to allow the wiring of the earphone 10 to extend from the core module 11 through the adapter 122 to the arc-shaped headband 121. The wiring of the earphone 10 can be wires, flexible circuit boards, etc. Correspondingly, the headband assembly 12 can also include a seal embedded in the slot 1224, which covers the wiring, thus improving the waterproof and dustproof properties of the earphone 10 and also improving the appearance of the earphone 10. The seal can be a cured colloid or a cover plate. Of course, in some other embodiments, the wiring of the earphone 10 can also be exposed on the adapter 122; correspondingly, the adapter 122 can be set as a solid structure.

[0494] The inventors of this application discovered through long-term research that when the headband assembly 12 applies a clamping force between 0.4N and 0.8N to press the core module 11 against the user's cheek, that is, in the wearing state, the clamping force of the core module 11 on the user's cheek can be between 0.4N and 0.8N, preferably between 0.5N and 0.6N, allowing the user to obtain excellent wearing stability and comfort as well as good sound quality. The clamping force can be measured using a clamping force testing machine (FL-86161A, Bowen Instruments). Specifically, during measurement, the earphone 10 is clamped on both sides of the parallel plate of the clamping force testing machine and supported on the middle fork of the clamping force testing machine; subsequently, the parallel plate of the clamping force testing machine sets the two core modules 11 away from each other with a test gap (e.g., an average head width of 145mm), thus simulating a user wearing the earphone 10. At this time, the corresponding clamping force can be measured by reading the value displayed on the clamping force testing machine. Different users have different head sizes (e.g., "large head" and "small head"). Therefore, the headband assembly 12 can be configured with an adjustable arc length to meet the wearing needs of different users for the headphones 10. Furthermore, this application aims to ensure that different users can obtain a consistent pressure when wearing the headphones 10.

[0495] As an example, the first connecting segment 1221 can extend or retract the arc-shaped headband 121 under the action of external force, so as to allow the movement module 11 to approach or move away from the arc-shaped headband 121 in the extension direction of the headband assembly 12, thereby adjusting the arc length of the headband assembly 12. Of course, the second connecting segment 1223 can also extend or retract the movement module 11 under the action of external force, and can similarly adjust the arc length of the headband assembly 12.

[0496] Furthermore, combined Figure 12Both ends of the arc-shaped headband 121 can be provided with adapters 122 and core modules 11. The headband assembly 12 provides a first clamping force to the core module 11 in a first use state and a second clamping force to the core module 11 in a second use state. The absolute value of the difference between the second clamping force and the first clamping force can be between 0 and 0.1 N, preferably between 0 and 0.05 N. Thus, even when different users wear the headphones 10 (i.e., the headband assembly 12 has different arc lengths and the two core modules 11 have different distances), the headband assembly 12 ensures that the clamping force applied by the core modules 11 to the user's cheeks is not significantly different, thereby increasing the adaptability of the headphones 10 to different users.

[0497] It should be noted that: the first usage state can be defined as a usage state in which each adapter 122 protrudes a first amount relative to the curved headband 121, and there is a first gap between the two mechanism modules 11; the second usage state can be defined as a usage state in which each adapter 122 protrudes a second amount relative to the curved headband 121, and there is a second gap between the two mechanism modules 11. Wherein, the second protrusion is greater than the first protrusion, and the second gap is greater than the first gap. In short, the first usage state is more suitable for users with smaller heads wearing the headphones 10, while the second usage state is more suitable for users with larger heads wearing the headphones 10. Therefore, when the mechanism module 11 is closest to the curved headband 121, the first protrusion can be at its minimum value; and when the mechanism module 11 is furthest from the curved headband 121, the second protrusion can be at its maximum value.

[0498] The inventors of this application have discovered through long-term research that, under the same conditions, parameters such as the stiffness and bending degree of the arc-shaped head beam 121 and the adapter 122 have a certain influence on the clamping force that the head beam assembly 12 can provide. This is now being qualitatively analyzed.

[0499] For cantilever beams, combined with Figure 18 A cantilever beam will undergo bending deformation under loads such as concentrated forces and distributed loads, and its maximum deflection... It occurs at the free end of a cantilever beam.

[0500] For a cantilever beam with a uniform cross-section, combined with Figure 18 In equation (a), and based on the mechanics of materials, the deflection of the free end satisfies the following relationship (1).

[0501]

[0502] In the formula, For the flexural stiffness of the section, The bending moment of the section is denoted as . The Young's modulus of the material. Let be the moment of inertia of the cross section.

[0503] For variable cross-section cantilever beams, combined with Figure 18 In (b), since the properties of the cross-section of the variable cross-section beam will change, the segmental stiffness method can be used when analyzing the displacement of its free end. That is, the variable cross-section cantilever beam is regarded as being composed of multiple cantilever beams with equal cross-sections. When calculating the deformation, the cantilever beam segments other than the one being studied can be regarded as rigid bodies. Finally, the displacement and deformation under the same load condition are superimposed. This method is often used for cantilever beams with outriggers or variable cross-sections. Correspondingly, the deflection at the free end satisfies the following relationship (2).

[0504]

[0505] For example Figure 12 For the headset shown, the left and right sides of the headset 10 can be simplified to a symmetrical structure, so only one side needs to be analyzed for force. The headset 10 satisfies the torque balance equation, i.e., the following relationship (3), whether it is in the first use state (e.g., the retracted state) or the second use state (e.g., the extended state).

[0506]

[0507] In the formula, Let be the bending moment value of the earphone 10 at the top support point (e.g., the first contact point CP1). This refers to the clamping force provided by the headband assembly 12 to the movement module 11 in a certain usage state. This is the lever arm from the equivalent concentrated point of action (e.g., the second contact point CP2) of the movement module 11 to the top fulcrum. Wherein, combined with Figure 19 Taking the fully retracted condition (e.g., the minimum extension of the adapter 122 relative to the arc-shaped headband 121) as a reference, and assuming that the position of the equivalent concentrated point of action on the movement module 11 does not change due to the extension and retraction adjustment of the headband assembly 12, then in the fully extended condition (e.g., the maximum extension of the adapter 122 relative to the arc-shaped headband 121), the lever arm... It is an increase. Based on this, and combined with the above moment balance equation (2), the bending moment is studied. The compressive force can be obtained by observing the change pattern. The changing pattern.

[0508] Combination Figure 19 In full retraction (e.g.) Figure 19 (as shown in the "contracted state") and fully extended (e.g.) Figure 19In two different working conditions (as shown in the "extended state"), the headphones 10 are opened from the initial free state to the final state of the corresponding distance (e.g., the average head width of 145mm). Now, it is assumed that the clamping force is the same in the critical state, that is, whether in the contracted state or the extended state, the headband assembly 12 can provide the same or similar clamping force to the core module 11.

[0509] For the fully retracted working condition, the head beam assembly 12 can be simply regarded as a cantilever beam with a uniform cross section (that is, the arc segment where the arc-shaped head beam 121 is located). The deflection at its free end, i.e., formula (1), is along the arc segment. Integrating, we obtain the following relation (4).

[0510]

[0511] In the formula, For arc segments The flexural stiffness of the cross section For arc segments Concentrated force on cross section The lever arm function.

[0512] For the fully extended condition, beam assembly 12 can be simply regarded as a variable cross-section cantilever beam (i.e., the arc segment where the arc-shaped head beam 121 is located). The arc segment where the adapter 122 is located The deflection at its free end, i.e., formula (2), is along the arc segment. and arc segment Integrating and summing the components yields the following relation (5).

[0513]

[0514] In the formula, For arc segments The flexural stiffness of the cross section For arc segments Concentrated force on cross section The lever arm function. The first two terms on the right-hand side of the equation are arc segments. The deformation amount, the third term is the arc segment The amount of deformation, For arc segments The component in the vertical direction.

[0515] Furthermore, combined Figure 19 The above two working conditions satisfy the following relationship (6).

[0516]

[0517] In the formula, For arc segments In the horizontal direction, substitute equations (4) and (5) into equation (6), and consider the critical state where the clamping force is the same under the above two working conditions. Record Then we get relation (7).

[0518]

[0519] Equation (7) actually shows the variation of the clamping force of the earphone 10 in the extended or retracted state when the head width is the same. Correspondingly, the arc segment Actual design value in the horizontal direction It satisfies the following relation (8).

[0520]

[0521] From equations (7) and (8), we can see that, assuming the arc segment... Section bending stiffness arc segment Components in the vertical direction If it remains unchanged, then:

[0522] 1) Arc segment The flexural stiffness of the cross section The smaller the design (i.e.) The larger the diameter, the smaller the clamping force after it extends;

[0523] 2) Arc segment The smaller the inward curvature design (e.g.) The smaller the size, the smaller the clamping force after it extends.

[0524] Based on the detailed analysis above, a quantitative explanation is now provided. As an example, in the non-wearing state, when each movement module 11 is closest to or furthest from the curved headband 121, the adapters 122 at both ends of the curved headband 121 relative to the first reference plane (e.g., Figure 19 The second reference plane (as shown in RP1) is symmetrically arranged, and the second reference plane (e.g., the plane on the paper) passes through the line connecting the two ends of the arc-shaped head beam 121 (e.g., ...). Figure 19 As shown in RP2), and perpendicularly intersecting the first reference plane. In the wearing state, the first reference plane can be parallel to the sagittal plane of the human body, and the second reference plane can be parallel to the coronal plane of the human body. Furthermore, combined with... Figure 19 With the curved head beam 121 in its natural state, and the curved head beam 121 and the adapter 122 projected onto the second reference plane, when the movement module 11 is closest to the curved head beam 121 (e.g., Figure 19When the adapter 122 is in the "contracted state" (as shown in the diagram), the free end of the connecting piece 122 for connecting the movement module 11 (e.g., the second connecting segment 1223) has a first position (e.g., ... Figure 19 As shown in L1), when the movement module 11 is furthest from the arc-shaped head beam 121 (e.g., Figure 19 When the free end is in the "elongated state" (as shown in the image), it has a second position (e.g., ...). Figure 19 As shown in L2). The line connecting the first and second positions has a first projection component in a first reference direction parallel to the line connecting the two ends of the arc-shaped head beam 121 (e.g., ...). Figure 19 middle As shown), and has a second projection component in a second reference direction perpendicular to the line connecting the two ends of the arc-shaped head beam 121 (e.g. Figure 19 middle As shown), the ratio of the second projection component to the first projection component can be greater than or equal to 2. Furthermore, the ratio of the cross-sectional bending stiffness of the adapter 122 to the cross-sectional bending stiffness of the arc-shaped head beam 121 can be less than or equal to 0.9. In other words, the adapter 122 is designed to be flexible and straight, ensuring that the clamping force in the contracted state is greater than the clamping force in the extended state when the two mechanism modules 11 are at the same distance. Considering the fact that the larger the head width, the greater the clamping force, it is possible to further achieve the same or similar clamping force when the two mechanism modules 11 are at a small distance and in a contracted state (i.e., a user with a "small head" wearing the headphones 10) as when the two mechanism modules 11 are at a large distance and in an extended state (i.e., a user with a "large head" wearing the headphones 10).

[0525] The inventors of this application have discovered through long-term research that, under the same conditions, the number and distribution of contact points between the earphone 10 and the user's head when worn have a significant impact on the stability of the fit. For example, when the head is tilted down, the earphone 10 may slip off or rotate relative to the user's head around the mechanism module 11 due to the weight of the earphone 10, thus affecting the reliability of the earphone 10 in terms of fit.

[0526] As an example, for example Figures 13 to 17When worn, the headband assembly 12 forms a first contact point with the top of the user's head, and the core module 11 forms a second contact point with the user's cheek. After the user has properly fitted the headphones 10 according to their head size, and under the pressure provided by the headband assembly 12 to the core module 11, the headphones 10 can apply a pressure force towards the user's head at both the first and second contact points. Therefore, when the head is tilted down, the core module 11 generates a resistance torque due to friction from contact with the user's cheek, and the headband assembly 12 generates another resistance torque due to friction from contact with the top of the user's head. The resultant torque of these two resistance torques can be greater than or equal to the gravitational torque of the headphones 10 relative to the core module 11. This means that the headband overcomes the gravitational torque of the headphones 10 when the head is tilted down, thus helping to prevent the headphones 10 from slipping off or rotating relative to the user's head around the core module 11.

[0527] Furthermore, when worn, in addition to the headband assembly 12 forming a first contact point with the user's head and the movement module forming a second contact point with the user's cheek, the headband assembly 12 can also form a third contact point with the user's head (e.g., Figure 49 As shown in CP3, the third contact point is located between the first and second contact points along the vertical axis of the human body. After the user has properly fitted the headphones 10 according to their head size, and under the pressure provided by the headband assembly 12 to the mechanism module 11, the headphones 10 can apply pressure towards the user's head at the first, second, and third contact points. Based on this, in the tilted-head position, the mechanism module 11 generates a resistance torque due to friction from contact with the user's cheek; the headband assembly 12 generates another resistance torque due to friction from contact with the top of the user's head; and the headband assembly 12 generates yet another resistance torque due to friction from contact with other parts of the user's head. The resultant torque of these three resistance torques can be greater than the resultant torque of the two previous resistance torques, making it easier to overcome the gravitational torque of the headphones 10 in the tilted-head position, thereby improving the reliability of the headphones 10 in terms of wearing comfort.

[0528] It should be noted that: combination Figure 12Each end of the headband assembly 12 can be connected to a mechanism module 11, and each mechanism module 11 can form a second contact point with the user's cheek. Correspondingly, the headband assembly 12 can also form third contact points with both sides of the user's head. In other words, the headphones 10 can actually form one first contact point, two second contact points, and two third contact points with the user's head, referred to as "five-point wearing". Among them, for the third contact point on one side of the user's head, due to the relatively long length of the headband assembly 12 or the differences in the user's head shape among different people, the number of third contact points can be multiple. Furthermore, when the headband assembly 12 forms a third contact point with the user's head, at least part of the headband assembly 12 is not in contact with the user's head between the first and second contact points, that is, the headband assembly 12 is not in full contact with the user's head and does not form a corresponding clamping force, so as to maintain a relatively small change in the clamping force at the mechanism module 11.

[0529] Combination Figure 49 The following is an illustrative example of the force analysis for the three-point and five-point wearing methods described above. Specifically, Figure 49 (a) is a schematic diagram of the mechanical model observed along the sagittal axis of the human body when the user does not lower their head during the three-point wearing condition. Figure 49 (b) is a schematic diagram of the mechanical model observed along the coronal axis of the human body when the user looks down in the case of wearing a three-point mask. Figure 49 (c) is a schematic diagram of the mechanical model observed along the sagittal axis of the human body when the user does not lower their head during the five-point wearing configuration. Figure 49 (d) is a schematic diagram of the mechanical model observed along the direction of the human coronal axis when the user looks down in the case of wearing a five-point mask.

[0530] In the three-point and five-point wearing scenarios described above, it is assumed that: the user's head size remains constant; the wearing state of the earphone 10 remains constant, such that the distance H of the first contact point relative to the reference line connecting the two mechanism modules 11 remains constant; the pressure F1 applied by the headband assembly 12 to the user's head remains constant; and the weight G of the earphone 10 and the distance L between its equivalent center of gravity and the aforementioned reference line remain constant; the contact area between the mechanism module 11 and the user's cheek remains constant, such that the equivalent force arm r of the mechanism module 11 acting on the user's cheek remains constant; and the coefficient of friction μ1 between the mechanism module 11 and the user's cheek and the coefficient of friction μ2 between the headband assembly 12 and the user's head remain constant. Specifically, for the five-point wearing scenario, the distance h of the third contact point relative to the aforementioned reference line is h < H.

[0531] Further assuming that the clamping force F2 provided by the headband assembly 12 remains constant in both cases, then for the above three-point wearing, the clamping force provided by the headband assembly 12 mainly acts on the second contact point, making the clamping force of the movement module 11 on the user's cheek F2; for the above five-point wearing, the clamping force provided by the headband assembly 12 acts not only on the second contact point but also on the third contact point, making the clamping force of the movement module 11 on the user's cheek less than F2. Here, assuming that the clamping force of the headband assembly 12 on the user's head at the third contact point is F3, then the clamping force of the movement module 11 on the user's cheek is (F2-F3).

[0532] For the three-point wearing method described above, in the head-down position, for example, when the user's head is tilted forward at an angle β, the movement module 11 generates a resistance torque due to friction caused by contact with the user's cheek, and the headband assembly 12 generates another resistance torque due to friction caused by contact with the top of the user's head. The resultant torque of the two resistance torques can be M1. For the five-point wearing method described above, in the head-down position, for example, when the user's head is also tilted forward at an angle β, the movement module 11 generates a resistance torque due to friction caused by contact with the user's cheek, the headband assembly 12 generates another resistance torque due to friction caused by contact with the top of the user's head, and the headband assembly 12 generates yet another resistance torque due to friction caused by contact with other parts of the user's head (e.g., the third contact point). The resultant torque of the three resistance torques can be M2, and can be greater than the resultant torque M1 of the two resistance torques. The resultant torques M1, M2, and gravitational torque G are... L The following relationship exists between sinβ and sinβ:

[0533]

[0534] In the formula, since the distance h is much larger than the equivalent force arm r, and the difference between the friction coefficients μ1 and μ2 is smaller than the difference between the distance h and the equivalent force arm r, that is, h / r > μ1 / μ2 or μ2 h-μ1 r>0, which makes M2-M1>0. In other words, under the same conditions, compared with the three-point wearing method, the five-point wearing method is more conducive to maintaining the wearing state of the headphones 10 when the head is lowered.

[0535] The inventors of this application discovered through long-term research that, for the aforementioned five-point wearing method, the clamping force at the second contact point can be between 0.2N and 2N, and the clamping force at the third contact point can be between 0.3N and 2N, so as to provide users with good wearing stability and comfort, and for the earphones 10 to exhibit good sound quality. Specifically, if the clamping force at the second contact point is too small, it can easily lead to less mechanical vibration transmitted from the mechanism module 11 to the user, thus affecting the listening effect of the earphones 10; if the clamping force at the second contact point is too large, it can easily lead to user discomfort. Furthermore, if the clamping force at the third contact point is too small, it is detrimental to improving the reliability of the earphones 10 in terms of wearing; if the clamping force at the third contact point is too large, it can easily lead to insufficient clamping force at the second contact point.

[0536] Combination Figures 50 to 52 The headband assembly 12 may include auxiliary members 125 connected to the arc-shaped headband member 121. For example, the auxiliary member 125 may be connected to the inner cover 1214 mentioned later, so that in the wearing state, the two auxiliary members 125 form third contact points with the two sides of the user's head respectively. The auxiliary member 125 may be connected to the arc-shaped headband member 121 at one end and not at the other end, thus forming a cantilever beam structure; the auxiliary member 125 may also be connected to the arc-shaped headband member 121 at both ends, with a partial protrusion in the middle between the two ends. For ease of description, this application uses a cantilever configuration of each auxiliary member 125 relative to the arc-shaped headband member 121 as an example for illustrative purposes. Of course, in some other embodiments, the third contact point may also be formed when the arc-shaped headband member 121 contacts the user's head, for example, the arc-shaped headband member 121 may have a partial protrusion to form the third contact point, that is, the headband assembly 12 may not include the auxiliary members 125. Accordingly, the arc-shaped head beam 121 can form a first contact point with the top of the user's head.

[0537] Based on the detailed description above, in the head-down position, the clamping force at the first contact point forms a first resistance torque relative to the second contact point, the clamping force at the third contact point forms a second resistance torque relative to the second contact point, the clamping force at the second contact point forms a third resistance torque relative to the contact surface between the mechanism module 11 and the user's cheek when the headband assembly 12 includes the auxiliary member 125, and the clamping force at the second contact point forms a fourth resistance torque relative to the contact surface between the mechanism module 11 and the user's cheek when the headband assembly 12 does not include the auxiliary member 125. The resultant torque formed by the first, second, and third resistance torques is greater than the resultant torque formed by the first and fourth resistance torques. In short, the auxiliary member 125 on the headband assembly 12 introduces another resistance torque, which helps to overcome the gravitational torque of the headphones 10 in the head-down position, thereby improving the reliability of the headphones 10 in terms of wearing comfort.

[0538] Furthermore, the auxiliary component 125 is configured to be elastic, so that when the headphones 10 are worn by users with different head sizes, the change in the clamping force at the second contact point due to varying degrees of elastic deformation of the auxiliary component 125 is less than or equal to 0.2N. Thus, when different users use the headphones 10, the auxiliary component 125 can apply a clamping force to the user's head to improve the stability of the headphones 10 during wear, especially when the head is tilted down, while also minimizing the change in the clamping force of the mechanism module 11 on the user's cheek, thereby maintaining the acoustic performance of the headphones 10. Based on this, when the headband assembly 12 has an adapter 122 to adjust the arc length of the headband assembly 12 for better adaptation to different users, the auxiliary component 125 is also configured such that the absolute value of the difference between the second clamping force and the first clamping force is between 0 and 0.1N, so that the change in the clamping force of the mechanism module 11 on the user's cheek is minimal. The first and second clamping forces can be between 0.4N and 0.8N, respectively.

[0539] Combination Figure 50 and Figure 51 In its natural state, the headband assembly 12 has a first reference plane and a second reference plane that are orthogonal to each other, and the two auxiliary members 125 are relative to the first reference plane (e.g., Figure 50 and Figure 51 As shown in RP1, the components are symmetrically arranged, and the second reference plane (e.g., the plane on the paper) passes through the highest point and two endpoints of the arc-shaped head beam 121. The arc-shaped head beam 121 and the auxiliary component 125 are projected onto the second reference plane. Within the second reference plane, the line connecting the fixed end and the free end of the auxiliary component 125 has a first projection component (e.g., ...) in a first reference direction parallel to the line connecting the two endpoints of the arc-shaped head beam 121. Figure 50 and Figure 51 As shown in x1), and has a second projection component in a second reference direction perpendicular to the line connecting the two endpoints of the arc-shaped head beam 121 (e.g., as ...). Figure 50 and Figure 51(As shown in y1). Based on this, the ratio between the aforementioned second projection component and the first projection component (e.g., y1 / x1) can be between 1 and 5; and / or, the equivalent elastic coefficient of the auxiliary component 125 can be between 100 N / m and 180 N / m. If the aforementioned ratio is too small, the clamping force at the third contact point will be too small, which is detrimental to improving the reliability of the earphone 10 in terms of wearing; if the aforementioned ratio is too large, the clamping force at the third contact point will be too large, resulting in insufficient clamping force at the second contact point, for example, the mechanism module 11 being supported by the auxiliary component 125. Similarly, if the equivalent elastic coefficient of the auxiliary component 125 is too small, the clamping force at the third contact point will be too small, which is detrimental to improving the reliability of the earphone 10 in terms of wearing; if the equivalent elastic coefficient of the auxiliary component 125 is too large, the clamping force at the third contact point will be too large, resulting in insufficient clamping force at the second contact point, for example, the mechanism module 11 being supported by the auxiliary component 125.

[0540] In some embodiments, under natural conditions, the arc-shaped head beam 121 is projected onto the second reference plane, and a rectangular coordinate system is established in the second reference plane. The aforementioned rectangular coordinate system takes the highest point of the arc-shaped head beam 121 as the origin, the straight line passing through the aforementioned origin and parallel to the line connecting the two endpoints of the arc-shaped head beam 121 as the x-axis, and the straight line passing through the aforementioned origin and perpendicular to the aforementioned x-axis as the y-axis. The curve of the arc-shaped head beam 121 from any endpoint to the highest point can satisfy the following relationship:

[0541] .

[0542] Based on this, the thickness of the auxiliary component 125 can be less than or equal to 4mm, so that the auxiliary component 125 can provide corresponding clamping force when the earphone 10 is worn by a user with a larger head; the gap between the auxiliary component 125 and the curved headband component 121 can be greater than or equal to 10mm, so that the auxiliary component 125 can provide corresponding clamping force when the earphone 10 is worn by a user with a smaller head. However, if the thickness of the auxiliary component 125 is too large, the auxiliary component 125 may directly abut against the curved headband component 121 when the earphone 10 is worn by a user with a larger head, resulting in insufficient clamping force at the second contact point, for example, the mechanism module 11 being supported by the auxiliary component 125. If the gap between the auxiliary component 125 and the curved headband component 121 is too small, the auxiliary component 125 may have difficulty abutting against the user's head when the earphone 10 is worn by a user with a smaller head, resulting in insufficient clamping force at the third contact point.

[0543] In some embodiments, each auxiliary member 125 may be fixed to one end of the arc-shaped head beam 121, and the line connecting any endpoint of the arc-shaped head beam 121 to the highest point has a third projection component in a first reference direction parallel to the line connecting the two endpoints (e.g., Figure 50 and Figure 51 As shown in x2), and has a fourth projection component in the second reference direction perpendicular to the line connecting the two endpoints of the arc-shaped head beam 121 (e.g., as ...). Figure 50 and Figure 51 (As shown in y2). Based on this, the ratio between the second projection component and the fourth projection component (e.g., y1 / y2) can be between 0.1 and 0.5. If the ratio is too small, the clamping force at the third contact point will be too weak, which is not conducive to improving the reliability of the earphone 10 in terms of wearing. If the ratio is too large, the clamping force at the second contact point will be insufficient. For example, the mechanism module 11 and the arc-shaped headband 121 will be supported by the auxiliary component 125, which is also not conducive to improving the reliability of the earphone 10 in terms of wearing.

[0544] In some embodiments, such as where the auxiliary component 125 is not necessarily fixed to the end of the arc-shaped headband component 121, the projection component of the distance between the fixed end of the auxiliary component 125 connected to the arc-shaped headband component 121 and the movement module 11 adjacent to the auxiliary component 125 in a second reference direction perpendicular to the line connecting the two endpoints of the arc-shaped headband component 121 can be between 40 mm and 120 mm. If the aforementioned distance is too small, insufficient clamping force at the second contact point may occur, for example, the movement module 11 may be supported by the auxiliary component 125; if the aforementioned distance is too large, insufficient clamping force at the first contact point may occur, for example, the arc-shaped headband component 121 may be supported by the auxiliary component 125.

[0545] As an example, combined Figure 50 The auxiliary member 125 can extend towards the middle region of the arc-shaped head beam 121. Specifically, in the second reference plane, the fixed end of the auxiliary member 125 connected to the arc-shaped head beam 121 has a first distance (e.g., 1 / 2) between it and the highest point of the arc-shaped head beam 121 in a reference direction perpendicular to the line connecting the two endpoints of the arc-shaped head beam 121. Figure 50 As shown in Figure 3), the position where the movement module 11 connects to the headband assembly 12 has a second distance between the aforementioned reference direction and the aforementioned highest point (e.g., ...). Figure 50 (As shown in y4). Based on this, the ratio between the aforementioned first distance and the second distance (e.g., y3 / y4) can be between 1 / 3 and 1 / 2. If the aforementioned ratio is too small, it is easy to cause insufficient clamping force at the first contact point, for example, the arc-shaped head beam 121 is supported by the auxiliary component 125; if the aforementioned ratio is too large, it is easy to cause insufficient clamping force at the second contact point, for example, the movement module 11 is supported by the auxiliary component 125.

[0546] As an example, combined Figure 51The auxiliary member 125 can extend towards the end of the arc-shaped head beam 121. Specifically, within the second reference plane, the fixed end of the auxiliary member 125 connected to the arc-shaped head beam 121 has a third distance (e.g., between the highest point of the arc-shaped head beam 121 and the reference direction perpendicular to the line connecting the two endpoints of the arc-shaped head beam 121) from the highest point of the arc-shaped head beam 121. Figure 51 As shown in Y3), the position where the movement module 11 connects to the headband assembly 12 has a fourth distance between the aforementioned reference direction and the aforementioned highest point (e.g., ...). Figure 51 (As shown in y4). Based on this, the ratio between the aforementioned third distance and the fourth distance (e.g., y3 / y4) can be between 1 / 5 and 1 / 3. If the aforementioned ratio is too small, it may lead to insufficient clamping force at the first contact point, for example, the arc-shaped head beam 121 being supported by the auxiliary component 125; if the aforementioned ratio is too large, it may lead to insufficient clamping force at the second contact point, for example, the movement module 11 being supported by the auxiliary component 125.

[0547] As an example, combined Figure 52 The auxiliary component 125 may include a fixing part 1251, a first extension 1252 connected to the fixing part 1251, and a second extension 1253 connected to the first extension 1252. The fixing part 1251 may be connected to the arc-shaped headband component 121. In the wearing state, the first extension 1252 and the second extension 1253 are located on the side of the arc-shaped headband component 121 facing the user's head, and in the natural state, they are spaced apart from the arc-shaped headband component 121 to facilitate the formation of a third contact point between the auxiliary component 125 and the user's head. Therefore, the width of the second extension 1253 may be greater than the width of the first extension 1252, and the second extension 1253 is used to form a third contact point with the user's head in the wearing state. In other words, the auxiliary component 125 is generally configured with a T-shaped structure; the relatively slender first extension 1252 facilitates deformation of the auxiliary component 125, and the relatively short and wide second extension 1253 facilitates better contact between the auxiliary component 125 and the user's head. For example, when worn and viewed along the vertical axis of the human body, the second extensions 1253 of the two auxiliary parts 125 approach each other toward the back of the user's head, so that they can hook onto the head from the back of the user's head, which helps to improve the reliability of the headphones 10 in terms of wearing, especially when the head is tilted down.

[0548] Furthermore, in its natural state, the headband assembly 12 has a first reference plane and a second reference plane that are orthogonal to each other. The two auxiliary members 125 are symmetrically arranged with respect to the first reference plane, and the second reference plane passes through the highest point and two endpoints of the curved headband assembly 121. In the wearing state, the first reference plane can be parallel to the sagittal plane of the human body, and the second reference plane can be parallel to the coronal plane. Based on this, the angle between the average normal of the second extension 1253 of each auxiliary member 125 and the second reference plane can be between 5 and 10 degrees. Considering that the second extension 1253 may be configured as a contoured structure that fits more closely to the user's head, such as a curved structure, its normal is further defined as the average normal. The formula for calculating the average normal can be:

[0549] ;

[0550] In the formula, The above average normal; Let ds be the normal to any point on the surface, and let ds be the surface element.

[0551] Furthermore, the contact area between the second extension 1253 and the user's head can be between 2 cm. 2 With 8cm 2 Between these two dimensions, if the area is too large, it may cause discomfort when wearing the headphones; if the area is too large, it may detract from the overall appearance of the headphones 10. Furthermore, if the area is too large, it may also hinder the auxiliary component 125 from generating sufficient drag torque.

[0552] Furthermore, the friction coefficient of the second extension 1253 can be greater than that of the first extension 1252, so that the auxiliary member 125 mainly forms the corresponding resistance torque through the second extension 1253.

[0553] Furthermore, the auxiliary component 125 and the arc-shaped head beam component 121 can be detachably connected to facilitate replacement or allow the user to choose whether to use the auxiliary component 125 according to actual needs.

[0554] Based on the detailed description above, due to the relatively long length of the headband assembly 12 or the differences in head shapes among different individuals, the headband assembly 12 may not form a contact point with the top of the user's head and generate corresponding pressure when worn. Therefore, when worn, the core module 11 can form a first contact point with the user's cheek and apply a first pressure to the user's head; the headband assembly 12 can form a second contact point with the user's head and apply a second pressure to the user's head. The second contact point is closer to the top of the user's head in the direction of the vertical axis of the human body compared to the first contact point. In other words, the headphones 10 can actually form two first contact points and two other contact points with the user's head, referred to as "four-point wearing." Regarding the second contact point on one side of the user's head, due to the relatively long length of the headband assembly 12 or the differences in head shapes among different individuals, the number of second contact points can be multiple. Furthermore, when the headband assembly 12 forms a second contact point with the user's head, there is at least a portion of the headband assembly 12 that does not contact the user's head between the second contact point and the top of the user's head. That is, the headband assembly 12 does not fully contact the user's head and form a corresponding clamping force, so as to maintain the clamping force at the mechanism module 11 with little change.

[0555] Similarly, for the aforementioned four-point wearing configuration, in the head-down position, the second clamping force relative to the first contact point forms a first resistance torque. The clamping force at the first contact point relative to the contact surface between the mechanism module 11 and the user's cheek forms a second resistance torque when the headband assembly 12 includes the auxiliary component 125. The clamping force at the first contact point relative to the contact surface between the mechanism module 11 and the user's cheek forms a third resistance torque when the headband assembly 12 does not include the auxiliary component 125. The resultant torque formed by the first and second resistance torques is greater than the third resistance torque. In short, the auxiliary component 125 on the headband assembly 12 introduces another resistance torque, which helps to overcome the gravitational torque of the headphones 10 in the head-down position, thereby improving the reliability of the headphones 10 in terms of wearing comfort.

[0556] Similarly, for the aforementioned four-point wearing, the clamping force at the first contact point can be between 0.2N and 2N, and the clamping force at the second contact point can be between 0.3N and 2N, so that the user can obtain good wearing stability and comfort, and the headphones 10 can exhibit good sound quality.

[0557] Similarly, for the aforementioned four-point wearing method, in the wearing state, the two auxiliary components 125 connected to the arc-shaped headband 121 form second contact points with the sides of the user's head respectively. The auxiliary components 125 are configured to be elastic, so that when the headphones 10 are worn by users with different head sizes, the change in the aforementioned first pressing force can be less than or equal to 0.2N due to the different degrees of elastic deformation of the auxiliary components 125. In this way, when different users use the headphones 10, the auxiliary components 125 can apply a pressing force to the user's head to improve the stability of the headphones 10 in terms of wearing, especially when the head is tilted down, and the pressing force of the mechanism module 11 on the user's cheeks can also remain relatively constant, so as to maintain the acoustic performance of the headphones 10.

[0558] Combination Figure 53 and Figure 54 The arc-shaped headband 121 may include an inner housing 1211 and an outer cover 1212 connected to the inner housing 1211. The inner housing 1211 is used to contact the user's head, for example, forming at least one of the aforementioned first contact point and third contact point. The inner housing 1211 may be a groove-like structure with a certain depth, and the outer cover 1212 may be a long strip structure with a certain thickness. Together, they form a wiring channel, allowing the electronic components on the left and right sides of the earphone 10 to be electrically connected via corresponding wires 1271. Furthermore, the outer cover 1212 may have a greater structural strength than the inner housing 1211, so that the headband assembly 12 can provide the necessary clamping force to the mechanism module 11; the material of the inner housing 1211 may be softer than that of the outer cover 1212, so that the headband assembly 12 can better conform to the user's head, increasing wearing stability. Since the inner compartment 1211 and the outer cover 1212 differ in structural strength and material, the arc-shaped head beam 121 may include a reinforcing body 1213 connected to the inner compartment 1211 for ease of assembly. The inner compartment 1211 is connected to the outer cover 1212 via the reinforcing body 1213. For example, the material of the reinforcing body 1213 may be the same as or similar to that of the outer cover 1212. The reinforcing body 1213 and the inner compartment 1211 can be integrally molded using injection molding, while the reinforcing body 1213 and the outer cover 1212 can be detachably connected via a snap-fit ​​mechanism.

[0559] Combination Figure 55 , Figure 53 and Figure 52The arc-shaped headband 121 may include an inner cover 1214, and the inner cover 1214 and the inner compartment 1211 are respectively connected to the same side of the outer cover 1212. The end of the inner compartment 1211 extends between the inner cover 1214 and the outer cover 1212, and as the two ends of the headband assembly 12 are gradually pulled apart in opposite directions, it is equivalent to the two ends of the headband assembly 12 being pushed open by the user's head when the user wears the headphones 10, and the inner compartment 1211 can be partially removed from between the inner cover 1214 and the outer cover 1212. Thus, compared to the fixed connection between the end of the inner compartment 1211 and the inner cover 1214 (and the outer cover 1212) in related technologies, in this embodiment, the inner compartment 1211 and the inner cover 1214 are configured to move relative to each other. This facilitates the release of stress on the inner compartment 1211 during the process of the head beam assembly 12 being expanded, especially at the end of the inner compartment 1211, thereby preventing the inner compartment 1211 from tearing due to excessive deformation. Combined with... Figure 56 In (a), before the two ends of the head beam assembly 12 are pulled apart in opposite directions, the end of the inner compartment 1211 extends between the inner cover 1214 and the outer cover 1212; Figure 56 In (b), after the two ends of the head beam assembly 12 are pulled apart by a certain distance in opposite directions, the end of the inner compartment 1211 partially exits between the inner cover 1214 and the outer cover 1212. [05...

Claims

1. An earphone, characterized in that, The earphone includes a support assembly and a core module connected to the support assembly. The support assembly supports the core module when worn in a wearing position. The core module includes a core housing, a transducer, a first vibration transducer, and a vibration panel. The transducer is suspended within the housing cavity of the core housing via the first vibration transducer. The vibration panel is connected to the transducer and transmits the mechanical vibration generated by the transducer to the user. The vibration panel is connected to the core housing via the first vibration transducer and vibrates relative to the core housing. The mass of the core housing is less than or equal to 0.5g, and the stiffness of the first vibration transducer is greater than or equal to 80000N / m.

2. The earphone according to claim 1, characterized in that, The transducer includes a bracket, a second transducer plate, a magnetic circuit system, and a coil. The bracket is connected to the housing of the mechanism via the first transducer plate. The second transducer plate connects the bracket to the magnetic circuit system to suspend the magnetic circuit system within the accommodating cavity. The coil is connected to the bracket and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer. The vibration panel is connected to the bracket.

3. The earphone according to claim 2, characterized in that, The peripheral area of ​​the second vibration transducer is connected to the bracket, and the central area of ​​the second vibration transducer is connected to the magnetic circuit system.

4. The earphone according to claim 3, characterized in that, When not worn, the frequency response curve of the vibration panel has a resonance valley generated by the first transmission plate, and the peak resonant frequency of the resonance valley is greater than or equal to 2kHz.

5. The earphone according to claim 4, characterized in that, The frequency response curve has a first resonance peak and a second resonance peak jointly generated by the first and second resonant plates. The peak resonant frequency of the first resonance peak is less than the peak resonant frequency of the resonance valley, and the peak resonant frequency of the second resonance peak is greater than the peak resonant frequency of the resonance valley.

6. The earphone according to claim 5, characterized in that, The peak resonant frequency of the first resonant peak is between 200Hz and 400Hz.

7. The earphone according to claim 1, characterized in that, The mechanism module further includes a connector. The mechanism housing includes an inner cylinder wall and a first end wall and a second end wall respectively connected to both ends of the inner cylinder wall. The first end wall and the second end wall are located on opposite sides of the transducer in the vibration direction of the transducer and form the accommodating cavity with the inner cylinder wall. The first end wall is provided with a mounting hole. The vibration panel is located outside the mechanism housing. One end of the connector is connected to the vibration panel, and the other end extends into the mechanism housing through the mounting hole and is connected to the transducer. Wherein, when viewed along the vibration direction, the area of ​​the vibration panel is larger than the area of ​​the mounting hole, and the area of ​​the mounting hole is larger than the area of ​​the connector.

8. The earphone according to claim 7, characterized in that, The accommodating cavity is connected to the outside of the earphone only through a channel, which is the gap between the connector and the wall of the mounting hole; Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the second channel is connected to the outside of the earphone via an acoustic filter; Alternatively, the accommodating cavity may be connected to the outside of the earphone only through a first channel and a second channel, wherein the first channel is the gap between the connector and the wall of the mounting hole, and the ratio between the opening area of ​​the second channel and the opening area of ​​the first channel is less than or equal to 10%.

9. The earphone according to claim 7, characterized in that, The accommodating cavity is connected to the outside of the earphone through a channel, which is the gap between the connector and the wall of the mounting hole. The mechanism module also includes a sealing film that seals the channel.

10. The earphone according to claim 9, characterized in that, The sealing membrane includes an integrally connected first connecting part, a pleated part, and a second connecting part. The pleated part forms a recessed area between the first connecting part and the second connecting part. The first connecting part is connected to the first end wall, and the second connecting part is connected to the connector or the vibration panel.

Images