Flexible electronic device and method of manufacturing the same, Light emitting device

Abstract

The present disclosure provides a flexible electronic device and a preparation method thereof, and a light emitting device. The flexible electronic device comprises: a first non-woven fabric substrate; a first carbon powder layer disposed on the first non-woven fabric substrate, the first carbon powder layer being formed into a first circuit pattern; a first metal paste layer formed on the first carbon powder layer, the first metal paste layer comprising a plurality of first conductive lines, the first metal paste layer being adhered to the first non-woven fabric substrate based on the first carbon powder layer; at least one electronic component adhered to the first metal paste layer and electrically connected to the at least two first conductive lines; and a first flexible encapsulation layer disposed on a side of the electronic component opposite to the first metal paste layer and bonded to the first non-woven fabric substrate.

Description

Technical Field

[0001] This disclosure relates to the field of flexible circuits, and more particularly to a flexible electronic device based on nonwoven fabric printing, a method for fabricating the same, and a light-emitting device. Background Technology

[0002] Traditional printed circuits (PCBs) are electronic circuits in which conductive patterns are etched or photosensitively deposited onto an insulating substrate, enabling interconnection of electronic components. They form the basis of various electronic devices and are widely used across industries. Initially, PCB substrates were mostly rigid. To enhance the applicability of the circuits, various fabrication processes for flexible electronic circuits have been continuously developed.

[0003] However, the existing process for fabricating flexible electronic devices using flexible electronic circuits has drawbacks such as complex processes, long processing cycles, and the need to use toxic reagents, making it difficult to achieve personalized, localized, and lightweight fabrication of flexible electronic devices. Summary of the Invention

[0004] To at least partially overcome the technical deficiencies of at least one or more of the aforementioned inventions, at least one embodiment of the present invention provides a flexible electronic device. A first metal paste layer is adhered to the first nonwoven fabric substrate by providing a first toner layer on the first nonwoven fabric substrate.

[0005] According to one aspect of this disclosure, a flexible electronic device is provided, comprising: a first nonwoven fabric substrate; a first toner layer disposed on the first nonwoven fabric substrate, the first toner layer being formed in the form of a first circuit pattern; a first metal paste layer formed on the first toner layer, including a plurality of first wires, the first metal paste layer being adhered to the first nonwoven fabric substrate based on the first toner layer; at least one electronic component adhered to the first metal paste layer and electrically connected to at least two of the first wires; and a first flexible encapsulation layer disposed on the side of the electronic component opposite to the first metal paste layer and bonded to the first nonwoven fabric substrate.

[0006] According to an embodiment of this disclosure, it further includes: a first adhesive layer disposed between the first flexible encapsulation layer and the electronic component, wherein the first flexible encapsulation layer is bonded to the first nonwoven fabric substrate based on the adhesive layer; preferably, the hot melt temperature of the adhesive layer is lower than the hot melt temperature of the first flexible encapsulation layer and the first nonwoven fabric substrate; preferably, the first flexible encapsulation layer is polypropylene meltblown fabric.

[0007] According to embodiments of this disclosure, the material further includes: a second metal paste layer formed on the side of the first nonwoven fabric substrate opposite to the first toner layer; at least one connecting portion electrically connecting the second metal paste layer and the first metal paste layer through a through-hole formed on the first nonwoven fabric substrate; a second nonwoven fabric substrate disposed on the side of the second metal paste layer opposite to the first nonwoven fabric substrate; and a second toner layer disposed between the second nonwoven fabric substrate and the second metal paste layer, wherein the second metal paste layer is adhered to the second nonwoven fabric substrate based on the second toner layer.

[0008] According to an embodiment of this disclosure, the second toner layer is formed as a second circuit pattern; preferably, the second metal paste layer forms a plurality of second wires on the second toner layer, and the at least one connecting portion electrically connects the second wires and the first wires, so that at least one electronic component is electrically connected to the second wires.

[0009] According to an embodiment of this disclosure, a second adhesive layer is further included, wherein the first nonwoven fabric substrate is bonded to the second metal paste layer and the second nonwoven fabric substrate respectively based on the second adhesive layer; preferably, the hot melt temperature of the second adhesive layer is lower than the hot melt temperature of the first nonwoven fabric substrate and the second nonwoven fabric substrate.

[0010] According to another aspect of this disclosure, a method for fabricating a flexible electronic device as described above is provided, comprising: step S1: hot-pressing toner from thermal transfer paper onto a first nonwoven fabric substrate to form a first toner layer on the first nonwoven fabric substrate, wherein the first toner forms a first circuit pattern on the first nonwoven fabric substrate; step S2: coating a metal paste onto the first toner layer to form a first metal paste layer on the first toner layer, wherein the first metal paste layer forms a plurality of first conductive lines; step S3: adhering at least one electronic component between the conductive lines to electrically connect to the conductive lines; and step S4: fabricating a first flexible encapsulation layer on the first metal paste layer.

[0011] According to an embodiment of this disclosure, the roughness of the heat transfer paper is greater than the roughness of the first nonwoven fabric substrate, and the adhesion force of the metal paste to the heat transfer paper under pressure is less than the adhesion force to the first nonwoven fabric substrate.

[0012] According to an embodiment of this disclosure, the hot-pressing temperature for hot-pressing the toner on the heat transfer paper onto the first non-woven fabric substrate is 60°C-80°C.

[0013] According to an embodiment of this disclosure, the metal paste is a gallium-indium alloy comprising copper particles; preferably, the mass fraction of gallium in the gallium-indium alloy is 75.5%.

[0014] According to another aspect of this disclosure, a light-emitting device is provided, comprising: a first nonwoven fabric substrate; a first toner layer disposed on the first nonwoven fabric substrate, the first toner layer being formed into a first circuit pattern; a first metal paste layer formed on the first toner layer, including a plurality of first wires, the first metal paste layer being adhered to the first nonwoven fabric substrate based on the first toner layer; a plurality of LED light-emitting elements arranged in a matrix and adhered to the first metal paste layer, each LED light-emitting element being electrically connected to two of the first wires; a first flexible encapsulation layer disposed on the side of the LED light-emitting elements opposite to the first metal paste layer and bonded to the first nonwoven fabric substrate, the first flexible encapsulation layer having a plurality of opening areas at positions respectively opposite to the LED light-emitting elements. The light beam emitted by the LED light-emitting element is emitted to the outside through the window area; a second metal paste layer is formed on the side of the first nonwoven fabric substrate opposite to the first toner layer to form multiple second wires; multiple connecting portions pass through through holes formed on the first nonwoven fabric substrate to electrically connect the second metal paste layer and the first metal paste layer, such that one of the two first wires electrically connected to the LED light-emitting element is electrically connected to a second wire through one of the connecting portions; a second nonwoven fabric substrate is disposed on the side of the second metal paste layer opposite to the first nonwoven fabric substrate; and a second toner layer is disposed between the second nonwoven fabric substrate and the second metal paste layer, the second metal paste layer being adhered to the second nonwoven fabric substrate based on the second toner layer.

[0015] According to embodiments of this disclosure, a first toner layer is disposed on a first nonwoven fabric substrate, with the first nonwoven fabric substrate and the first toner layer serving as the substrate for a first metal paste layer. It is understood that by disposing of the first toner layer, the roughness of the contact surface with the first metal paste layer can be reduced, enabling the first metal paste layer to adhere to the first nonwoven fabric substrate. This, in turn, allows electronic components to be adhered to the first metal paste layer, thereby expanding the application environment of the electronic components. For example, the electronic component can be a sensor to fabricate wearable detection devices suitable for application to the skin surface. Furthermore, when the flexible electronic device is heated and the first metal paste layer melts, the first toner layer can adhere to the first metal paste layer, effectively constraining the shape of the first conductive line. Attached Figure Description

[0016] Figure 1 A partial cross-sectional view schematically illustrating the connection between a high-roughness substrate and a semi-liquid metal slurry according to an embodiment of the present disclosure;

[0017] Figure 2 A partial cross-sectional view schematically illustrating the connection between a low-roughness substrate and a semi-liquid metal slurry according to an embodiment of the present disclosure;

[0018] Figure 3 A partial cross-sectional view of a flexible electronic device according to an embodiment of the present disclosure is shown schematically.

[0019] Figure 4 A partial cross-sectional view of a flexible electronic device according to another embodiment of the present disclosure is shown schematically;

[0020] Figure 5 Schematic illustration Figure 4 A partial exploded view of the flexible electronic device of the embodiment shown;

[0021] Figure 6 A flowchart illustrating a method for fabricating a flexible electronic device using embodiments of the present disclosure is shown schematically.

[0022] Figures 7 to 11 The illustration shows a schematic diagram of the fabrication process of a flexible electronic device prepared using the preparation method of the present disclosure embodiment;

[0023] Figure 12 A partial cross-sectional view of a light-emitting device according to an embodiment of the present disclosure is shown schematically;

[0024] Figure 13 A partial cross-sectional view of another light-emitting device according to an embodiment of the present disclosure is shown in the illustration;

[0025] Figure 14 Schematic illustration Figure 13 Partial exploded view of the light-emitting device in the illustrated embodiment;

[0026] Figure 15 Schematic illustration Figure 13 A perspective view of the first flexible encapsulation layer in the embodiment shown;

[0027] Figure 16 Schematic illustration Figure 13 A perspective view of the first metal paste layer in the embodiment shown;

[0028] Figure 17 Schematic illustration Figure 13 A perspective view of the second metal paste layer in the illustrated embodiment; and

[0029] Figure 18 Schematic illustration Figure 13 The circuit diagram of the embodiment shown.

[0030] Explanation of reference numerals in the attached figures

[0031] 1: First nonwoven fabric substrate;

[0032] 2: First carbon powder layer;

[0033] 3: First metal paste layer;

[0034] 31: First conductor;

[0035] 4: Electronic components;

[0036] 5: First flexible encapsulation layer;

[0037] 51: Window area;

[0038] 6: First adhesive layer;

[0039] 7: Second metal paste layer;

[0040] 71: Second conductor;

[0041] 8: Second carbon powder layer;

[0042] IB231256

[0043] 9: Second nonwoven fabric substrate;

[0044] 10: Connecting part;

[0045] 11: Second adhesive layer;

[0046] 12: LED light-emitting element. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings. However, this disclosure can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art. In the accompanying drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated, and the same reference numerals denote the same elements throughout.

[0048] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0049] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0050] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0051] To facilitate understanding of the technical solutions disclosed herein by those skilled in the art, the following technical terms are explained.

[0052] When using expressions such as "at least one of A, B, and C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, and C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.). Similarly, when using expressions such as "at least one of A, B, or C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, or C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0053] Liquid metals possess good electrical conductivity and flexibility, making them widely applicable in flexible electronic devices. In realizing the concept of this invention, such as... Figure 1 As shown, the inventors discovered that liquid metal can form an oxide film in the atmospheric environment. This oxide film allows liquid metal to adhere to some smooth materials, but it is difficult to adhere to rough material surfaces. Therefore, using liquid metal as a conductive layer places high demands on the substrate material of flexible electronic devices.

[0054] Figure 1 A partial cross-sectional view schematically illustrating the connection between a high-roughness substrate and a semi-liquid metal slurry according to an embodiment of the present disclosure is shown. Figure 2 A partial cross-sectional view schematically illustrating the connection between a low-roughness substrate and a semi-liquid metal slurry according to an embodiment of the present disclosure is shown.

[0055] Furthermore, the inventors discovered that after converting liquid metal into a semi-liquid metal slurry, the semi-liquid metal slurry can be adhered to certain rough surfaces by applying a certain pressure. Specifically, on substrates with the same roughness, the adhesion of the semi-liquid metal slurry increases with increasing pressure; under the same pressure, the adhesion of the semi-liquid metal slurry decreases with increasing roughness. Therefore, adhesion to substrates with different roughnesses can be achieved by adjusting the pressure applied to the semi-liquid metal slurry. The specific principle is as follows: Figure 1 and Figure 2As shown, on the substrate with higher roughness 14, the average height and width of its surface contour structure units are greater than those on the substrate with lower roughness 15. When the semi-liquid metal paste 13 is pressed to the same depth for the same duration, its microscopic contact area with the two surfaces differs, thus exhibiting different adhesion phenomena. Specifically, the semi-liquid metal paste 13 shows poor adhesion on the rougher substrate and good adhesion on the smoother substrate. Therefore, the adhesion difference between the two substrates can be achieved by adjusting the pressure, thereby allowing the semi-liquid metal paste to be printed onto a surface with a certain degree of roughness.

[0056] Nonwoven fabrics are composed of oriented or random fibers and are a new generation of environmentally friendly materials. They have the characteristics of being moisture-proof, breathable, flexible, lightweight, non-flammable, easily degradable, non-toxic and non-irritating, rich in color, inexpensive, and recyclable. If nonwoven fabrics are used to prepare flexible electronic devices, they can have the above advantages. However, the inventors have found that although semi-liquid metal pastes can adhere to some rough surfaces, the roughness of nonwoven fabrics still does not meet the adhesion conditions of semi-liquid metal pastes.

[0057] Furthermore, the inventors discovered that by preparing a carbon powder layer on the nonwoven fabric, it is possible to adhere a semi-liquid metal slurry to the nonwoven fabric through the carbon powder layer.

[0058] Figure 3 A partial cross-sectional view of a flexible electronic device according to an embodiment of the present disclosure is shown schematically.

[0059] like Figure 3 As shown, embodiments of this disclosure provide a flexible electronic device. The flexible electronic device includes a first nonwoven fabric substrate 1, a first toner layer 2, a first metal paste layer 3, at least one electronic component 4, and a first flexible encapsulation layer 5. Specifically, the first toner layer 2 is disposed on the first nonwoven fabric substrate 1 and is formed into a first circuit pattern. The first metal paste layer 3 is formed on the first toner layer 2 and includes multiple first conductive lines 31. The first metal paste layer 3 is adhered to the first nonwoven fabric substrate 1 based on the first toner layer 2. At least one electronic component 4 is adhered to the first metal paste layer 3 and electrically connected to at least two of the first conductive lines 31. The first flexible encapsulation layer 5 is disposed on the side of the electronic component 4 opposite to the first metal paste layer 3 and is bonded to the first nonwoven fabric substrate 1 (not shown in the figure). The electronic component 4 may be a resistor, capacitor, temperature or pressure sensor element, LED light-emitting element, or other electronic chip, but is not limited thereto.

[0060] According to embodiments of this disclosure, a first toner layer 2 is disposed on a first nonwoven fabric substrate 1, and the first nonwoven fabric substrate 1 and the first toner layer 2 serve as the substrate for a first metal paste layer 3. It is understood that by disposing of the first toner layer 2, the roughness of the contact surface with the first metal paste layer 3 can be reduced, enabling the first metal paste layer 3 to adhere to the first nonwoven fabric substrate 1, thereby allowing the electronic component 4 to be adhered to the first metal paste layer 3. This broadens the application environment of the electronic component 4; for example, the electronic component 4 can be a sensor to fabricate wearable detection devices suitable for application to the skin surface. Furthermore, when the flexible electronic device is heated and the first metal paste layer 3 melts, the first toner layer 2 can adhere to the first metal paste layer 3, effectively constraining the linear shape of the first wire 31.

[0061] In some implementations, the flexible electronic device also includes a first adhesive layer 6. The first adhesive layer 6 is disposed between the first flexible encapsulation layer 5 and the electronic component 4, and the first flexible encapsulation layer 5 is bonded to the first nonwoven fabric substrate 1 (not shown in the figure) based on the adhesive layer.

[0062] Specifically, the heat-melting temperature of the first adhesive layer 6 is lower than that of the first flexible encapsulation layer 5 and the first nonwoven fabric substrate 1. The first adhesive layer 6 can be a breathable membrane that becomes sticky after heating, such as electrospun fiber membrane (TPU), and the first flexible encapsulation layer 5 can be polypropylene meltblown fabric. The first adhesive layer 6 can be melted by heating, and the melted first adhesive layer 6 becomes sticky, thereby adhering the first flexible encapsulation layer 5 and the first nonwoven fabric substrate 1 (not shown in the figure) to achieve the encapsulation of the flexible electronic device, thereby protecting the first metal paste layer 3.

[0063] Figure 4 A partial cross-sectional view of a flexible electronic device according to another embodiment of the present disclosure is shown schematically. Figure 5 Schematic illustration Figure 4 A partial exploded view of the flexible electronic device of the embodiment shown.

[0064] like Figure 4 and Figure 5 As shown, in some embodiments, the flexible electronic device further includes a second metal paste layer 7, at least one connecting portion 10, a second nonwoven fabric substrate 9, and a second toner layer 8. Specifically, the second metal paste layer 7 is formed on the side of the first nonwoven fabric substrate 1 opposite to the first toner layer 2. The connecting portion 10 electrically connects the second metal paste layer 7 and the first metal paste layer 3 through a through-hole formed on the first nonwoven fabric substrate 1. The second nonwoven fabric substrate 9 is disposed on the side of the second metal paste layer 7 opposite to the first nonwoven fabric substrate 1. The second toner layer 8 is disposed between the second nonwoven fabric substrate 9 and the second metal paste layer 7, and the second metal paste layer 7 is adhered to the second nonwoven fabric substrate 9 based on the second toner layer 8.

[0065] Specifically, the second toner layer 8 is formed into a second circuit pattern, and the second metal paste layer 7 forms multiple second conductors 71 on the second toner layer 8. At least one connecting portion 10 electrically connects the second conductors 71 and the first conductor 31, so that at least one electronic component 4 is electrically connected to the second conductors 71. The minimum linewidth of the second conductors 71 can be 100 μm, and the minimum spacing between the second conductors 71 can be 100 μm. By setting the second metal paste layer 7, the connecting portion 10, the second non-woven fabric substrate 9, and the second toner layer 8, the complexity of the circuit can be increased, thereby expanding the types of electronic components 4. Furthermore, the first metal paste layer 3 and the second metal paste layer 7 can be collectively referred to as flexible circuit layers. This application is not limited to a two-layer circuit structure composed of the first metal paste layer 3 and the second metal paste layer 7, but can also be set as a three-layer, four-layer, or other multi-layer circuit structure. The layers can be connected by the connecting portion 10. The connecting portion 10 can be made of the same material as the first metal paste layer 3 and / or the second metal paste layer 7, or it can be made of other conductive materials. Openings can be provided between the flexible circuit layers to allow electrical connection between them via the connecting portion 10. The first metal paste layer 3 and the second metal paste layer 7 can be semi-liquid metal pastes. The connecting portion 10 can be formed by the adhesiveness of the first metal paste layer 3 and the second metal paste layer 7 themselves during the process of opening the openings between the first metal paste layer 3 and the second metal paste layer 7 after the flexible circuit layers are bonded together, which can quickly achieve electrical interconnection between multiple flexible circuit layers.

[0066] In some implementations, the flexible electronic device also includes a second adhesive layer 11, on which the first nonwoven fabric substrate 1 is bonded to the second metal paste layer 7 and the second nonwoven fabric substrate 9 respectively.

[0067] Specifically, the heat-melting temperature of the second adhesive layer 11 is lower than that of the first nonwoven fabric substrate 1 and the second nonwoven fabric substrate 9. The second adhesive layer 11 can be a breathable membrane that becomes sticky after heating, such as TPU. The second adhesive layer 11 can be melted by heating. The melted second adhesive layer 11 becomes sticky, which can bond the first nonwoven fabric substrate 1 to the second metal paste layer 7 and the second nonwoven fabric substrate 9 respectively, thereby realizing the encapsulation of flexible electronic devices and protecting the second metal paste layer 7.

[0068] Figure 6 A flowchart illustrating a method for fabricating a flexible electronic device using embodiments of the present disclosure is shown. Figures 7 to 11 The illustration shows a schematic diagram of the fabrication process of a flexible electronic device using the fabrication method of the present disclosure.

[0069] Embodiments of this disclosure also provide a method for fabricating the flexible electronic device as described above. Figure 6 and Figure 7As shown, the preparation method includes steps S1 to S4.

[0070] In step S1: the toner on the heat transfer paper is hot-pressed onto the first non-woven fabric substrate to create a first toner layer on the first non-woven fabric substrate, wherein the first toner forms a first circuit pattern on the first non-woven fabric substrate.

[0071] In step S2: a metal paste is coated onto a first toner layer to form a first metal paste layer on the first toner layer, wherein the first metal paste layer forms a plurality of first wires.

[0072] In step S3: At least one electronic component is adhered between the first wires to be electrically connected to the wires.

[0073] In step S4: a first flexible encapsulation layer is prepared on the first metal paste layer.

[0074] Specifically, a laser printer can be used to print the toner pattern corresponding to the first circuit pattern onto thermal transfer paper, such as... Figure 7 As shown. At a hot-pressing temperature of 60℃-80℃, the toner pattern on the printed heat transfer paper can be transferred onto a non-woven fabric substrate by hot pressing, so that the toner forms a first circuit pattern on the first non-woven fabric substrate 1, as shown. Figure 8 As shown. A first metal paste layer 3 is formed on the first toner layer 2 by coating a metal paste onto the first toner layer 2. Since the toner forms a first circuit pattern on the first nonwoven fabric substrate 1, it can be understood that the first metal paste layer 3 formed on the first toner layer 2 can also constitute a first circuit pattern. The first circuit pattern can have multiple branches, and the first metal paste layer 3 can form multiple wires.

[0075] The metal paste can be a semi-liquid metal paste, the heat transfer paper can be a sealed paper coated with a release agent, and the first non-woven fabric substrate 1 can be one of meltblown fabric, electrospun fabric, or other non-woven fabrics. The semi-liquid metal paste can be applied to the first toner layer 2 using a brush, paintbrush, or roller under certain pressure to form the first metal paste layer 3. Electronic components 4 can be adhered to specific positions on the first metal paste layer 3 using adhesive. These specific positions can be uncoated areas between adjacent wires designed according to the first circuit pattern. By adhering the electronic components 4 to these specific positions, the adjacent wires are electrically connected, such as... Figure 9As shown. The metal paste can be a gallium-indium alloy including copper particles, wherein the mass fraction of gallium can be 75.5%, and the proportion of doped copper particles can be adjusted as needed. To improve the sealing of the flexible electronic device, an adhesive film can be used for hot-press bonding between the layers of the flexible electronic device. The preparation method according to the embodiments of this disclosure has a simple production process, fast production speed, low cost, and is suitable for mass production. A first adhesive layer 6 can be prepared on the electronic component 4 to cover the first flexible encapsulation layer 5 on the electronic component, such as... Figures 10 to 11 As shown.

[0076] In some implementations, the roughness of the heat transfer paper can be set to be greater than that of the first nonwoven fabric substrate 1, and the adhesion force of the metal paste to the heat transfer paper under pressure is less than that to the first nonwoven fabric substrate, so as to facilitate the more complete transfer of the toner on the heat transfer paper to the first nonwoven fabric substrate 1.

[0077] Figure 12 A partial cross-sectional view of a light-emitting device according to an embodiment of the present disclosure is shown schematically.

[0078] Embodiments of this disclosure also provide a light-emitting device. For example... Figure 12 As shown, the light-emitting device includes a first non-woven fabric substrate 1, a first toner layer 2, a first metal paste layer 3, multiple LED light-emitting elements 12, and a first flexible encapsulation layer 5. Specifically, the first toner layer 2 is disposed on the first non-woven fabric substrate 1 and is formed into a first circuit pattern. The first metal paste layer 3 is formed on the first toner layer 2 and includes multiple first wires 31. The first metal paste layer 3 is adhered to the first non-woven fabric substrate 1 based on the first toner layer 2. Multiple LED light-emitting elements 12 arranged in a matrix are adhered to the first metal paste layer 3, and each LED light-emitting element is electrically connected to two first wires 31. The first flexible encapsulation layer 5 is disposed on the side of the electronic component 4 opposite to the first metal paste layer 3 and is bonded to the first non-woven fabric substrate 1. The first flexible encapsulation layer 5 has multiple opening areas at positions opposite to the LED light-emitting elements 12, and the light beam emitted by the LED light-emitting elements 12 can be emitted to the outside through the opening areas 51.

[0079] Figure 13 A partial cross-sectional view of another light-emitting device according to an embodiment of the present disclosure is shown schematically. Figure 14 Schematic illustration Figure 13 A partial exploded view of the light-emitting device of the illustrated embodiment. Figure 15 Schematic illustration Figure 13 A perspective view of the first flexible encapsulation layer in the illustrated embodiment. Figure 16 Schematic illustration Figure 13 A perspective view of the first metal paste layer in the illustrated embodiment. Figure 17 Schematic illustration Figure 13A perspective view of the second metal paste layer in the illustrated embodiment. Figure 18 Schematic illustration Figure 13 The circuit diagram of the embodiment shown.

[0080] like Figures 13 to 18 As shown, in some embodiments, the light-emitting device includes a first nonwoven fabric substrate 1, a first toner layer 2, a first metal paste layer 3, multiple LED light-emitting elements 12, a first flexible encapsulation layer 5, a second metal paste layer 7, multiple connecting portions 10, a second nonwoven fabric substrate 9, and a second toner layer 8. Specifically, the first toner layer 2 is disposed on the first nonwoven fabric substrate 1, and the first toner layer 2 is formed into a first circuit pattern. The first metal paste layer 3 is formed on the first toner layer 2 and includes multiple first wires 31. The first metal paste layer 3 is adhered to the first nonwoven fabric substrate 1 based on the first toner layer 2. Multiple LED light-emitting elements 12 arranged in a matrix are adhered to the first metal paste layer 3, and each LED light-emitting element 12 is electrically connected to two first wires 31. The first flexible encapsulation layer 5 is disposed on the side of the electronic component 4 opposite to the first metal paste layer 3 and is bonded to the first nonwoven fabric substrate 1. The first flexible encapsulation layer 5 has multiple opening areas at positions opposite to the LED light-emitting elements 12, and the light beam emitted by the LED light-emitting elements 12 can be emitted to the outside through the opening areas 51. A second metal paste layer 7 is formed on the side of the first nonwoven fabric substrate 1 opposite to the first toner layer 2 to form multiple second conductive lines 71. Multiple connecting portions 10 extend from the second metal paste layer 7 toward the first metal paste layer 3 through through-holes formed in the first nonwoven fabric substrate 1, so that the second metal paste layer 7 and the first metal paste layer 3 are electrically connected. Thus, one of the two first conductive lines 31 electrically connected to the LED light-emitting element 12 (e.g., ...) Figure 16 The shorter first wire is electrically connected to a second wire 71 via a connector 10. A second nonwoven fabric substrate 9 is disposed on the side of the second metal paste layer 7 opposite to the first nonwoven fabric substrate 1. A second toner layer 8 is disposed between the second nonwoven fabric substrate 9 and the second metal paste layer 7, and the second metal paste layer 7 is adhered to the second nonwoven fabric substrate 9 based on the second toner layer 8. By distributing the first wire 31 and the second wire 71 in two separate layers, the crossing of multiple wires electrically connected to the matrix-arranged LED light-emitting elements in the same layer can be avoided.

[0081] Specifically, the second toner layer 8 is formed as a second circuit pattern, and the second metal paste layer 7 forms multiple second conductive lines 71 on the second toner layer 8. At least one connecting portion 10 electrically connects the second conductive lines 71 and the first conductive lines 31, so that each LED light-emitting element 12 is electrically connected to one of the first conductive lines 31 and one of the second conductive lines 71 located in the two layers. In some embodiments, the flexible electronic device also includes a second adhesive layer 11, and the first nonwoven fabric substrate 1 is bonded to the second metal paste layer 7 and the second nonwoven fabric substrate 9 based on the second adhesive layer 11.

[0082] like Figures 16 to 18 As shown, the light-emitting device may include a positive control electrode AD, negative control electrodes Z1-Z4, connection points a1-a10, connection points b1-b10, connection points c1-c10, connection points d1-d10, and LED light-emitting elements 12 arranged in a matrix. The light-emitting device can connect the following points via the connecting part 10: connection point a1 to connection point a2, connection point a3 to connection point a4, connection point a5 to connection point a6, connection point a7 to connection point a8, connection point a9 to connection point a10, connection point b1 to connection point b2, connection point b3 to connection point b4, connection point b5 to connection point b6, connection point b7 to connection point b8, connection point b9 to connection point b10, connection point c1 to connection point c2, connection point c3 to connection point c4, connection point c5 to connection point c6, connection point c7 to connection point c8, connection point c9 to connection point c10, connection point d1 to connection point d2, connection point d3 to connection point d4, connection point d5 to connection point d6, connection point d7 to connection point d8, and connection point d9 to connection point d10. The above connection method allows multiple LED light-emitting elements 12 to be connected in parallel, forming multiple parallel branches. For example, the electrical signal of one branch can start from the positive control electrode A, pass through connection points a1, a2, a3, and a4, reach the LED light-emitting element 12, and then to the negative control electrode Z4. Examples are not listed here. Through this connection method, various operating modes of the light-emitting device can be achieved by controlling the positive control electrode AD and the negative control electrodes Z1-Z4 respectively.

[0083] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this disclosure, and the shapes and dimensions of the components in the drawings do not reflect actual size and proportion, but are only schematic representations of the embodiments of this disclosure.

[0084] Unless otherwise stated, the numerical parameters in this specification and the appended claims are approximate values ​​and can be varied according to desired characteristics derived from the content of this disclosure. Specifically, all figures used in the specification and claims to indicate composition, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. Generally, this means that a specific amount varies by ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments.

[0085] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0086] Furthermore, unless specifically described or required to occur in a specific order, the order of the above steps is not limited to those listed above and can be varied or rearranged according to the desired design. Moreover, the above embodiments can be used in combination with each other or with other embodiments based on design and reliability considerations; that is, technical features from different embodiments can be freely combined to form more embodiments.

[0087] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of this disclosure. It should be understood that the above are only specific embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A method for fabricating a flexible electronic device, comprising: Step S1: Heat-press the toner on the heat transfer paper onto the first non-woven fabric substrate to create a first toner layer on the first non-woven fabric substrate, wherein the first toner layer forms a first circuit pattern on the first non-woven fabric substrate, and the roughness of the heat transfer paper is greater than the roughness of the first non-woven fabric substrate. Step S2: Coat the first toner layer with a semi-liquid metal paste to form a first metal paste layer on the first toner layer, wherein the first metal paste layer forms a plurality of first conductive lines, and the adhesion force of the semi-liquid metal paste to the heat transfer paper under pressure is less than the adhesion force to the first non-woven fabric substrate. Step S3: Attach at least one electronic component between the first wires to electrically connect it to the first wires; and Step S4: Prepare a first flexible encapsulation layer on the first metal paste layer.

2. The preparation method according to claim 1, wherein, The hot-pressing temperature for pressing the toner on the heat transfer paper onto the first non-woven fabric substrate is 60°C-80°C.

3. The preparation method according to claim 1, wherein, The semi-liquid metal slurry is a gallium-indium alloy including copper particles; The gallium mass fraction in the gallium-indium alloy is 75.5%.

4. A flexible electronic device prepared by the preparation method according to any one of claims 1 to 3, comprising: First nonwoven fabric substrate; A first toner layer is disposed on the first nonwoven fabric substrate, and the first toner layer is formed into a first circuit pattern. A first metal paste layer is formed on the first toner layer and includes a plurality of first wires. The first metal paste layer is adhered to the first nonwoven fabric substrate based on the first toner layer. At least one electronic component is adhered to the first metal paste layer and electrically connected to at least two of the first wires, the first metal paste layer being made of a semi-liquid metal paste; as well as A first flexible encapsulation layer is disposed on the side of the electronic component opposite to the first metal paste layer and is bonded to the first nonwoven fabric substrate.

5. The flexible electronic device according to claim 4, further comprising: A first adhesive layer is disposed between the first flexible encapsulation layer and the electronic component, wherein the first flexible encapsulation layer is bonded to the first nonwoven fabric substrate based on the first adhesive layer; The hot melt temperature of the first adhesive layer is lower than that of the first flexible encapsulation layer and the first nonwoven fabric substrate; The first flexible encapsulation layer is polypropylene meltblown fabric.

6. The flexible electronic device according to claim 4, further comprising: A second metal paste layer is formed on the side of the first nonwoven fabric substrate opposite to the first toner layer; At least one connecting portion electrically connects the second metal paste layer and the first metal paste layer through a through hole formed on the first nonwoven fabric substrate; The second nonwoven fabric substrate is disposed on the side of the second metal paste layer opposite to the first nonwoven fabric substrate; as well as A second toner layer is disposed between the second nonwoven fabric substrate and the second metal paste layer, wherein the second metal paste layer is adhered to the second nonwoven fabric substrate based on the second toner layer.

7. The flexible electronic device according to claim 6, wherein, The second carbon powder layer is formed into a second circuit pattern; The second metal paste layer forms multiple second wires on the second toner layer, and the at least one connecting portion electrically connects the second wires and the first wires so that at least one of the electronic components is electrically connected to the second wires.

8. The flexible electronic device according to claim 6 further includes a second adhesive layer, wherein the first nonwoven fabric substrate is bonded to the second metal paste layer and the second nonwoven fabric substrate respectively based on the second adhesive layer; The heat-melting temperature of the second adhesive layer is lower than that of the first nonwoven fabric substrate and the second nonwoven fabric substrate.

9. A light-emitting device prepared by the preparation method according to any one of claims 1 to 3, comprising: First nonwoven fabric substrate; A first toner layer is disposed on the first nonwoven fabric substrate, and the first toner layer is formed into a first circuit pattern. A first metal paste layer is formed on the first toner layer and includes a plurality of first wires. The first metal paste layer is adhered to the first nonwoven fabric substrate based on the first toner layer. Multiple LED light-emitting elements arranged in a matrix are adhered to the first metal paste layer, and each LED light-emitting element is electrically connected to two first wires; A first flexible encapsulation layer is disposed on the side of the LED light-emitting element opposite to the first metal paste layer and is bonded to the first non-woven fabric substrate. The first flexible encapsulation layer has multiple opening areas at positions opposite to the LED light-emitting element, and the light beam emitted by the LED light-emitting element is emitted to the outside through the opening areas. A second metal paste layer is formed on the side of the first nonwoven fabric substrate opposite to the first carbon powder layer to form multiple second wires. Multiple connecting portions pass through through holes formed on the first nonwoven fabric substrate to electrically connect the second metal paste layer and the first metal paste layer, such that one of the two first wires electrically connected to the LED light-emitting element is electrically connected to a second wire through one of the connecting portions; The second nonwoven fabric substrate is disposed on the side of the second metal paste layer opposite to the first nonwoven fabric substrate; as well as A second toner layer is disposed between the second nonwoven fabric substrate and the second metal paste layer. The second metal paste layer is adhered to the second nonwoven fabric substrate based on the second toner layer. The first metal paste layer is made of semi-liquid metal paste.

Images