Semiconductor wafer dispensing device and dispensing method thereof

Abstract

The present invention discloses a semiconductor wafer dispensing device, comprising a syringe and a needle, the needle being detachably mounted on the syringe. The device also comprises: a conveying mechanism; a plurality of wafer fixtures mounted on the conveying mechanism; a guide device mounted on the conveying mechanism for guiding the wafer fixtures; a height measuring device comprising a box with openings on both sides and a contact plate slidably mounted on the box, the contact plate being bent, the bottom of the contact plate being inclined at least on its end surface, and a protective pad being provided on the contact surface between the contact plate and the wafer; a driving device mounted on the box for driving the syringe up and down; a first sensor mounted on the box for sensing the wafer fixture; two second sensors, each mounted on the box and the contact plate for sensing the syringe; a detection device for detecting whether the needle is clogged; a time relay; and a controller. The present invention can dispense glue to wafers of different sizes and automatically detect whether the wafer has been dispensed glue, eliminating the need for manual detection and resulting in high efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of glue dispensing, in particular to a semiconductor wafer glue dispensing device and a glue dispensing method thereof. Background Art

[0002] Currently, in the semiconductor manufacturing industry, conductive silver paste is typically applied to the surface of wafers. Wafer dispensing technology is a critical and crucial technology in advanced electronics manufacturing, widely used in chip packaging and integrated circuit equipment. However, existing dispensing equipment cannot dispense adhesive on wafers of different sizes and lacks a self-test function. This requires manual visual inspection of the wafers after dispensing to determine if silver paste is present. This visual inspection is difficult due to the small volume of silver paste remaining on the wafer. Summary of the Invention

[0003] The purpose of the present invention is to solve the above technical problems and provide a semiconductor wafer dispensing device and a dispensing method thereof.

[0004] The technical solution of the present invention is: a semiconductor wafer dispensing device, comprising a syringe and a needle tube, wherein the needle tube is detachably mounted on the syringe, the syringe is provided with a screw cap, the screw cap is provided with an air inlet pipe, and the air inlet pipe is provided with a solenoid valve, and further comprising:

[0005] transmission mechanism;

[0006] a plurality of wafer fixing devices, placed on the conveying mechanism;

[0007] a guiding device, provided on the conveying mechanism and used for guiding the wafer fixing device;

[0008] A height measuring device, comprising a box body with openings on both sides and a contact plate, wherein the contact plate is slidably arranged on the box body, the contact plate is bent, one end surface of the bottom thereof is an inclined surface, and a protective pad is provided on the contact surface between the contact plate and the wafer;

[0009] A driving device, provided on the box body and used for driving the injection cylinder to move up and down;

[0010] a first sensor, disposed on the box body and used for sensing the wafer fixing device;

[0011] Two second sensors, each disposed on the box and the contact plate, for sensing the syringe;

[0012] A detection device for detecting whether the needle tube is blocked;

[0013] Time relay;

[0014] Controller.

[0015] Preferably, the wafer fixing device includes a support seat, four baffles, a plurality of springs and four clamping plates, the four baffles are respectively arranged on one side of the support seat, and a plurality of springs are arranged between the baffles and the clamping plates.

[0016] Preferably, the guiding device includes two guide rods, which are arranged on the conveying mechanism, and one end of the guide rod is an inclined surface.

[0017] Preferably, a cover door is provided on one side of the box body.

[0018] Preferably, the driving device includes a first pneumatic driving device and a U-shaped connecting frame, and the connecting frame is arranged on the output end of the first pneumatic driving device.

[0019] Preferably, the detection device includes a second pneumatic drive device, a light-emitting part, a third sensor, two conductive parts and a collection container, the third sensor is used to sense the light-emitting part, the two conductive parts are arranged at an opening of the collection container at intervals, and the second pneumatic drive device is used to drive the collection container to move back and forth.

[0020] Preferably, the collecting container consists of a straight tube and a transparent bottle, and the transparent bottle is detachably arranged on the transparent bottle.

[0021] The present invention also provides a semiconductor wafer dispensing method, comprising the following steps:

[0022] a. First place the wafer on the wafer fixture, and then place the wafer fixture on the conveyor mechanism;

[0023] b. When the transmission mechanism has not worked for a long time, open the cover door and observe whether there is silver glue in the transparent bottle. If there is silver glue, replace the needle tube. If there is no silver glue, unscrew the cover and add silver glue into the syringe.

[0024] The beneficial effects of the present invention are as follows: in the present invention, glue can be dispensed on wafers of different sizes, and at the same time, whether the wafer is glued can be automatically detected without manual detection, and the efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0026] Figure 2 is a top view of a wafer fixing device in a preferred embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the connection between the box and the first sensor in a preferred embodiment of the present invention;

[0028] Figure 4 2. It is a top view of a preferred embodiment of the present invention in which the guide device is arranged on the conveying mechanism;

[0029] Figure 5 It is a cross-sectional view of a collecting container in a preferred embodiment of the present invention.

[0030] Figure numerals: syringe 10, screw cap 101, air inlet pipe 102, needle tube 2, conveying mechanism 3, wafer fixing device 4, support seat 41, baffle 42 spring 43, clamping plate 44, guide device 5, guide rod 51, box body 6, cover door 61, contact plate 7, drive device 8, first pneumatic drive device 81, connecting frame 82, first sensor 9, second sensor 11, time relay 12, controller 13, second pneumatic drive device 14, light-emitting part 15, third sensor 16, conductive part 17, collecting container 18, straight tube 181, transparent bottle 182. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] Reference Figures 1 to 5 A semiconductor wafer dispensing device includes a syringe 10 and a needle tube 2, wherein the needle tube 2 is detachably mounted on the syringe 10, the syringe 10 is provided with a screw cap 101, the screw cap 101 is provided with an air inlet pipe 102, and the air inlet pipe 102 is provided with a solenoid valve, and further includes:

[0033] Transmission mechanism 3;

[0034] Several wafer fixing devices 4 are placed on the conveying mechanism 3;

[0035] A guide device 5 is provided on the conveying mechanism 3 and is used to guide the wafer fixing device 4;

[0036] The height measuring device includes a box body 6 with openings on both sides and a contact plate 7. The contact plate 7 is slidably arranged on the box body 6. The contact plate 7 is bent and has an inclined surface at one end of the bottom. A protective pad is provided on the contact surface between the contact plate 7 and the wafer.

[0037] A driving device 8 is provided on the housing 6 and is used to drive the syringe 10 to move up and down;

[0038] A first sensor 9 is provided on the box 6 for sensing the wafer fixing device 4;

[0039] Two second sensors 11, each provided on the box 6 and the contact plate 7, for sensing the syringe 10;

[0040] A detection device for detecting whether the needle tube 2 is blocked;

[0041] Time relay 12;

[0042] Controller 13. In the present invention, the wafer fixture 4 on which the wafer is placed is placed on the conveying mechanism 3. The conveying mechanism 3 drives the wafer to move to the left and is guided by the guide device 5 so that the wafer glue point is directly below the needle tube 2. When the first sensor 9 senses the wafer fixture 4, it sends a signal to the controller 13. The controller 13 controls the conveying mechanism 3 to stop working and controls the drive device 8 to drive the syringe 10 downward. When a second sensor 11 senses the syringe 10, it sends a signal to the controller 13. The controller 13 controls the drive device 8 to stop working, so that the bottom of the syringe 2 is a certain distance away from the wafer. The solenoid valve is controlled to open and the time relay 12 is controlled to operate. The gas supplied by the external gas supply device to the air inlet pipe 102 is blown into the syringe 10, and the silver glue flows out of the syringe 2 and contacts the wafer. When the preset value of the time relay 12 is reached, a signal is sent to the controller 13 to control the solenoid valve to close, and the drive device 8 is controlled to work to drive the syringe 10 to move upward. The silver glue is made to fall on the wafer by the gravity of the silver glue itself and the adsorption force of the contact with the wafer. When another second sensor 11 senses the syringe 10, a signal is sent to the controller 13 to control the syringe 10 to stop working, and the detection device is controlled to work to detect the needle tube 2. When the needle tube 2 is not blocked, a signal is sent to the controller 13 to control the transmission mechanism 3 to work and drive the dispensing wafer to move. When the contact plate 7 contacts the wafer, it will be lifted up by the wafer and drive one of the second sensors 11 to move upward, thereby being able to perform height detection on wafers of different sizes, so that the needle tube 2 always maintains a fixed distance from the wafer after moving downward. Specifically, the time relay 12 and the controller 13 are arranged in the box body 6; the conveying mechanism 3 is a belt conveying mechanism; by unscrewing the cap 101, silver glue can be added to the injection barrel 10; the box body 6 is arranged on the conveying mechanism 3; a first identification member is provided on the wafer fixing device 4, and the first sensor 9 senses the first identification member; a second identification member is provided on the injection barrel 10, and two second sensors 11 sense the second identification member; one end of the contact plate 7 is T-shaped, and a slide groove adapted to one end of the contact plate 7 is provided on the box body 6.

[0043] As a preferred embodiment of the present invention, it may also have the following additional technical features:

[0044] In this embodiment, the wafer fixing device 4 includes a support base 41, four baffles 42, a plurality of springs 43, and four clamping plates 44. The four baffles 42 are each arranged on one side of the support base 41, and a plurality of springs 43 are arranged between the baffles 42 and the clamping plates 44. Specifically, the four baffles 42, the plurality of springs 43, and the four clamping plates 44 secure the wafer, preventing the wafer from moving on the support base 41 after contact with the contact plate 7, resulting in the glue point on the wafer not being directly below the needle tube 2. The device can also secure wafers of different diameters. Protective pads are provided at the contact points between the support base 41 and the four clamping plates 44 and the wafer.

[0045] In this embodiment, the guide device 5 includes two guide rods 51, which are arranged on the conveying mechanism 3. One end of the guide rod 51 is an inclined surface. Specifically, the guide rods 51 are arranged on both sides.

[0046] In this embodiment, a cover door 61 is provided on one side of the box body 6 to facilitate replacement of the needle tube 2 and addition of silver glue into the syringe 10. Specifically, the cover door 61 is rotatably connected to the side wall of the box body 6 via a hinge.

[0047] In this embodiment, the driving device 8 includes a first pneumatic driving device 81 and a U-shaped connecting frame 82, which is disposed at the output end of the first pneumatic driving device 81. Specifically, the first pneumatic driving device 81 is a cylinder, which is disposed on the housing 6, and the syringe 10 is disposed on the connecting frame 82.

[0048] In this embodiment, the detection device includes a second pneumatic drive device 14, a light-emitting member 15, a third sensor 16, two conductive members 17 and a collection container 18. The third sensor 16 is used to sense the light-emitting member 15, and the two conductive members 17 are arranged at the opening of the collection container 18 at intervals. The second pneumatic drive device 14 is used to drive the collection container 18 to move back and forth. When one of the second sensors 11 senses the second identification member on the syringe 10, that is, the syringe 10 returns to its original position, the second sensor 11 sends a signal to the controller 13 to control the second pneumatic drive device 14 to drive the collection container 18 to Move right to just below the needle tube 2, control the solenoid valve of the air inlet pipe 102 to open, and the silver glue in the syringe 10 flows out. When the silver glue falls and contacts the two conductive parts 17, the circuit of the light-emitting part 15 is connected, and the light-emitting part 15 emits a bright light. After the third sensor 16 senses the light, it sends a signal to the controller 13, controlling the solenoid valve to close, controlling the second pneumatic drive device 14 to drive the collection container 18 back to its original position, and controlling the conveying mechanism 3 to work and move the wafer being glued. When the needle tube 2 is blocked or there is no silver glue in the syringe 10, the light-emitting part 15 does not light up, the conveying mechanism 3 does not work, and the staff conducts an inspection. Specifically, the light-emitting part 15 is a light bulb or other light-emitting electronic component; the second pneumatic drive device 14, the light-emitting part 15 and the third sensor 16 are arranged on the wall of the box body 6.

[0049] In this embodiment, the collection container 18 is composed of a straight tube 181 and a transparent bottle 182. The transparent bottle 182 is detachably mounted on the transparent bottle 182. When the transparent bottle 182 is full, the transparent bottle 182 can be removed. The transparent bottle 182 is transparent, making it easy to observe the amount of silver glue in the transparent bottle 182. Specifically, the straight tube 181 and the transparent bottle 182 are threadedly connected.

[0050] The present invention also provides a semiconductor wafer dispensing method, comprising the following steps:

[0051] a. First place the wafer on the wafer fixture 4, and then place the wafer fixture 4 on the conveying mechanism 3;

[0052] b. When the conveying mechanism 3 has not been working for a long time, open the cover door 61 and observe whether there is silver glue in the transparent bottle 182. If there is silver glue, replace the needle tube 2. If there is no silver glue, unscrew the cover 101 and add silver glue to the syringe 10.

[0053] It should be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0054] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer dispensing device, comprising a syringe (10) and a needle tube (2), wherein the needle tube (2) is detachably arranged on the syringe (10), the syringe (10) is provided with a screw cap (101), the screw cap (101) is provided with an air inlet pipe (102), and the air inlet pipe (102) is provided with a solenoid valve, characterized in that: Also includes: Transmission mechanism (3); A plurality of wafer fixing devices (4) are placed on the conveying mechanism (3); A guiding device (5) is provided on the conveying mechanism (3) and is used to guide the wafer fixing device (4); A height measuring device, comprising a box body (6) with openings on both sides and a contact plate (7), wherein the contact plate (7) is slidably arranged on the box body (6), the contact plate (7) is bent, and one end face of the bottom thereof is an inclined surface, and a protective pad is arranged on the contact surface between the contact plate (7) and the wafer; A driving device (8), disposed on the housing (6) and used to drive the syringe (10) to move up and down; A first sensor (9), arranged on the box (6) and used for sensing the wafer fixing device (4); Two second sensors (11), each disposed on the box (6) and the contact plate (7) for sensing the syringe (10); A detection device for detecting whether the needle tube (2) is blocked, the detection device comprising a second pneumatic drive device (14), a light emitting member (15), a third sensor (16), two conductive members (17) and a collection container (18), the third sensor (16) being used to sense the light emitting member (15), the two conductive members (17) being spaced apart from each other at the opening of the collection container (18), and the second pneumatic drive device (14) being used to drive the collection container (18) to move back and forth; Time relay (12); Controller (13).

2. The semiconductor wafer dispensing device according to claim 1, characterized in that: The wafer fixing device (4) comprises a support seat (41), four baffles (42), a plurality of springs (43) and four clamping plates (44), wherein the four baffles (42) are respectively arranged on one side of the support seat (41), and a plurality of springs (43) are arranged between the baffles (42) and the clamping plates (44).

3. The semiconductor wafer dispensing device according to claim 1, characterized in that: The guide device (5) comprises two guide rods (51), the guide rods (51) are arranged on the conveying mechanism (3), and one end of the guide rods (51) is an inclined surface.

4. The semiconductor wafer dispensing device according to claim 1, characterized in that: A cover door (61) is provided on one side of the box body (6).

5. The semiconductor wafer dispensing device according to claim 1, characterized in that: The drive device (8) includes a first pneumatic drive device (81) and a U-shaped connecting frame (82), wherein the connecting frame (82) is arranged on the output end of the first pneumatic drive device (81).

6. The semiconductor wafer dispensing device according to claim 1, characterized in that: The collecting container (18) is composed of a straight tube (181) and a transparent bottle (182), and the transparent bottle (182) is detachably arranged on the transparent bottle (182).

7. A semiconductor wafer dispensing method, characterized in that: The dispensing device according to any one of claims 1 to 6 comprises the following steps: a. First, place the wafer on the wafer fixture (4), and then place the wafer fixture (4) on the conveying mechanism (3); b. When the transmission mechanism (3) has not been working for a long time, open the cover door (61) and observe whether there is silver glue in the transparent bottle (182). If there is silver glue, replace the needle tube (2). If there is no silver glue, unscrew the screw cap (101) and add silver glue to the syringe (10).

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