Unit detection method and apparatus

Abstract

The application discloses a Unit cell detection method and device, and belongs to the technical field of industrial detection. The Unit cell detection method comprises the following steps: globally positioning an IC carrier plate, and determining at least one Unit set; dividing a target Unit set in the at least one Unit set, and obtaining a plurality of Unit cells; positioning a target Unit cell in the plurality of Unit cells in the case that the target Unit cell has a defect, determining a target position of a region to be processed in the target Unit cell, and performing laser processing on the target Unit cell based on the target position. The Unit cell detection method has high convenience and maintainability, can quickly divide a Unit region, is convenient for subsequent detection, can accurately position a region position needing laser processing, and improves the detection accuracy.

Description

Technical Field

[0001] This application belongs to the field of industrial testing technology, and in particular relates to a unit detection method and apparatus. Background Technology

[0002] The unit cells of an IC carrier are the core components, and their quality directly determines the overall quality of the IC carrier. Currently, direct template matching is often used for unit cell positioning, which involves a complex modeling process and relatively low positioning accuracy, resulting in significant laser marking errors. Summary of the Invention

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a unit detection method and apparatus, which has high convenience and maintainability, can reduce marking errors, achieve precise positioning of the processing area, and improve detection accuracy.

[0004] Firstly, this application provides a unit detection method, which includes:

[0005] Perform global positioning of the IC carrier board to determine at least one Unit set;

[0006] The target Unit set in the at least one Unit set is divided to obtain multiple Unit units;

[0007] If a target unit has a defect among the multiple unit units, the target unit is located to determine the target location of the area to be processed within the target unit.

[0008] Based on the target location, the target Unit is laser-processed.

[0009] According to the Unit detection method provided in this application embodiment, the Unit set region is determined by globally locating the IC carrier board, and then the target Unit set is divided to obtain multiple Unit units. This method can accurately divide multiple Unit units on the IC carrier board and quickly divide the Unit region for defect detection of each Unit unit. In the case of a defect in the target Unit unit, the target Unit unit is located to determine the target position of the area to be processed, and then the target Unit unit is laser processed. This can reduce marking errors, achieve accurate positioning of the processing area, improve detection accuracy, and the positioning method of the Unit unit is simple, with high convenience and maintainability.

[0010] One embodiment of the Unit detection method of this application, wherein when a target Unit has a defect among a plurality of Unit Units, the method locates the target Unit Unit and determines the target position of the area to be processed within the target Unit Unit, including:

[0011] Pen knife feature detection is performed on the multiple Unit units;

[0012] If the target unit has pen knife features, the target unit is re-inspected based on the re-inspection training template;

[0013] If the target unit is inconsistent with the re-inspection training template, the target unit is located.

[0014] According to one embodiment of the Unit detection method of this application, by performing pen knife feature detection on multiple Units, when the target Unit has pen knife features, the target Unit is re-inspected based on the re-inspection training template. Then, when the target Unit is inconsistent with the re-inspection training template, the target Unit is precisely located and detected so as to guide the laser to process the target Unit, thereby reducing the error of laser marking and improving the accuracy and precision of detection.

[0015] One embodiment of the Unit detection method in this application includes performing pen knife feature detection on the plurality of Units, comprising:

[0016] The multiple Unit units are grouped based on the number of threads, with each group including at least one Unit unit.

[0017] Pen knife feature detection is performed simultaneously on the Units included in each group.

[0018] According to one embodiment of the present application, the Unit detection method groups multiple Units based on the number of threads, and then performs pen knife feature detection on the Units included in each group simultaneously. This can shorten the execution time and improve the detection speed and efficiency, and is suitable for IC substrate quality inspection and production with a large number of Units.

[0019] One embodiment of the Unit detection method of this application includes locating the target Unit and determining the target position of the area to be processed within the target Unit, comprising:

[0020] Based on the ID number, determine the location region of the target Unit;

[0021] A line-finding operation is performed within the specified location area to determine the target location.

[0022] According to one embodiment of the Unit detection method of this application, the location area of ​​the target Unit is determined based on the ID number to achieve coarse positioning. Then, a line-finding operation is performed within the location area to determine the target position. Based on the coarse positioning, precise positioning is performed, which can accurately locate the target position, guide the laser for processing, reduce laser marking errors, and improve positioning and detection accuracy.

[0023] One embodiment of the Unit detection method of this application includes dividing the target Unit set in the at least one Unit set to obtain multiple Unit units, including:

[0024] Extract multiple corner points from the target Unit set;

[0025] Based on the aforementioned corner points, an affine rectangle is generated;

[0026] The affine rectangle is divided based on the target number of rows and columns to obtain the multiple Unit units.

[0027] According to one embodiment of the Unit detection method of this application, multiple corner points are extracted from the target Unit set, and then an affine rectangle is generated based on the multiple corner points. The affine rectangle is then divided based on the target number of rows and columns to obtain multiple Unit units. The Unit set region can be determined by determining three corner points. This method can quickly divide the Unit region, which is convenient as the basic unit for subsequent training and detection. It is simple, convenient and easy to implement.

[0028] One embodiment of the Unit detection method of this application, wherein the global positioning of the IC carrier board and the determination of at least one Unit set includes:

[0029] Extract global features from the IC carrier board;

[0030] Based on the location information corresponding to the global features, the at least one Unit set is determined.

[0031] According to one embodiment of the Unit detection method of this application, by extracting global features from the IC carrier board and then determining at least one Unit set based on the location information corresponding to the global features, the region of at least one Unit set can be determined from the IC carrier board, which facilitates the subsequent division of Unit units based on the Unit set for Unit detection operation.

[0032] Secondly, this application provides a unit detection device, which includes:

[0033] The first processing module is used to globally locate the IC carrier board and determine at least one Unit set;

[0034] The second processing module is used to divide the target Unit set in the at least one Unit set and obtain multiple Unit units;

[0035] The third processing module is used to locate the target unit and determine the target position of the area to be processed in the target unit when there is a defect in the target unit among the multiple unit units;

[0036] The fourth processing module is used to perform laser processing on the target Unit based on the target position.

[0037] According to the Unit detection device provided in the embodiments of this application, the Unit set area is determined by globally locating the IC carrier board, and then the target Unit set is divided to obtain multiple Unit units. This allows for precise division of multiple Unit units on the IC carrier board and rapid division of Unit areas for defect detection of each Unit unit. In the case of a defect in the target Unit unit, the target Unit unit is located to determine the target position of the area to be processed, and then the target Unit unit is laser-processed. This reduces marking errors, achieves precise positioning of the processing area, improves detection accuracy, and the unit unit positioning method is simple, with high convenience and maintainability.

[0038] In one embodiment of the Unit detection device of this application, the third processing module can also be used to perform pen knife feature detection on the plurality of Units;

[0039] If the target unit has pen knife features, the target unit is re-inspected based on the re-inspection training template;

[0040] If the target unit is inconsistent with the re-inspection training template, the target unit is located.

[0041] According to one embodiment of the present application, a unit detection device performs penknife feature detection on multiple unit units.

[0042] In the case where the target unit exhibits penknife features, a re-inspection is performed on target unit 5 based on the re-inspection training template. Then, if the target unit does not match the re-inspection training template, the target unit is re-inspected.

[0043] The unit is precisely positioned and inspected to guide the laser to process the target unit, thereby reducing laser marking errors and improving the accuracy and precision of the inspection.

[0044] One embodiment of the Unit detection apparatus of this application may further include a fifth processing step.

[0045] The module is used to group the multiple Unit units based on the number of threads, with each group including at least one Unit unit; 0 simultaneously performs pen knife feature detection on the Unit units included in each group.

[0046] According to one embodiment of the present application, a unit detection device groups multiple units based on the number of threads, and then simultaneously performs pen knife feature detection on the units included in each group. This can shorten the execution time and improve the detection speed and efficiency, and is suitable for IC substrate quality inspection and production with a large number of units.

[0047] In one embodiment of the Unit detection device of this application, the third processing module can also be used to determine the location region of the target Unit based on the ID number;

[0048] A line-finding operation is performed within the specified location area to determine the target location.

[0049] According to one embodiment of the present application, a unit detection device determines the location region of a target unit based on its ID number to achieve coarse positioning. Then, a line-finding operation is performed within the location region to determine the target position.

[0050] Precise positioning based on the existing position can accurately locate the target position, guide the laser for processing, reduce the error of laser marking, and improve positioning and detection accuracy.

[0051] In one embodiment of the Unit detection device of this application, the second processing module can also be used to extract multiple corner points from the target Unit set;

[0052] Based on the aforementioned corner points, an affine rectangle is generated;

[0053] The affine rectangle is divided based on the target number of rows and columns to obtain the multiple Unit units.

[0054] 5. A Unit detection apparatus according to an embodiment of this application extracts multiple corner points from a target Unit set.

[0055] Then, based on multiple corner points, an affine rectangle is generated. The affine rectangle is then divided based on the target number of rows and columns to obtain multiple Unit units. The Unit set region can be determined by determining three corner points. This method can quickly divide the Unit region, which is convenient as the basic unit for subsequent training and detection. It is simple, convenient and easy to implement.

[0056] In one embodiment of the Unit detection device of this application, the first processing module can also be used to extract global features from the IC carrier board 0;

[0057] Based on the location information corresponding to the global features, the at least one Unit set is determined.

[0058] According to one embodiment of the present application, a unit detection device extracts global features from an IC carrier board and then determines at least one unit set based on the location information corresponding to the global features. This enables the determination of a region containing at least one unit set from the IC carrier board, facilitating subsequent division of unit units based on the unit set for unit detection operations.

[0059] Thirdly, this application provides an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the Unit detection method as described in the first aspect above.

[0060] Fourthly, this application provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the Unit detection method as described in the first aspect above.

[0061] Fifthly, this application provides a chip including a processor and a communication interface, the communication interface being coupled to the processor, the processor being used to run programs or instructions to implement the Unit detection method as described in the first aspect.

[0062] In a sixth aspect, this application provides a computer program product, including a computer program that, when executed by a processor, implements the Unit detection method as described in the first aspect above.

[0063] The above-described one or more technical solutions in the embodiments of this application have at least one of the following technical effects:

[0064] By globally locating the IC carrier board to determine the Unit set area, and then dividing the target Unit set to obtain multiple Unit units, multiple Unit units on the IC carrier board can be accurately divided, and Unit regions can be quickly defined for defect detection of each Unit unit. In the case of defects in the target Unit unit, the target Unit unit is located to determine the target position of the area to be processed, and then the target Unit unit is laser processed. This can reduce marking errors, achieve accurate positioning of the processing area, improve the accuracy of detection, and the positioning method of Unit units is simple, with high convenience and maintainability.

[0065] Furthermore, by grouping multiple Units based on the number of threads, and then simultaneously performing pen knife feature detection on the Units included in each group, the execution time can be shortened, and the detection speed and efficiency can be improved. This is suitable for quality inspection and production of IC carrier boards with a large number of Units.

[0066] Furthermore, by determining the location area of ​​the target unit based on the ID number, coarse positioning is achieved. Then, line-finding operations are performed within the location area to determine the target position. Based on the coarse positioning, precise positioning is performed, which can accurately locate the target position, guide the laser for processing, reduce laser marking errors, and improve positioning and detection accuracy.

[0067] Furthermore, by extracting multiple corner points from the target Unit set, generating affine rectangles based on these corner points, and then dividing the affine rectangles based on the target row and column number to obtain multiple Unit units, the Unit set region can be determined by identifying three corner points. This method can quickly divide the Unit region, making it convenient as the basic unit for subsequent training and detection. It is simple, convenient, and easy to implement.

[0068] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0069] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0070] Figure 1 This is one of the flowcharts illustrating the Unit detection method provided in the embodiments of this application;

[0071] Figure 2 This is one of the schematic diagrams illustrating the principle of the Unit detection method provided in the embodiments of this application;

[0072] Figure 3This is the second flowchart of the Unit detection method provided in the embodiments of this application;

[0073] Figure 4 This is the second schematic diagram of the principle of the Unit detection method provided in the embodiments of this application;

[0074] Figure 5 This is the third schematic diagram illustrating the principle of the Unit detection method provided in the embodiments of this application;

[0075] Figure 6 This is the third flowchart illustrating the Unit detection method provided in the embodiments of this application;

[0076] Figure 7 This is the fourth schematic diagram illustrating the principle of the Unit detection method provided in the embodiments of this application;

[0077] Figure 8 This is a schematic diagram of the Unit detection device provided in the embodiments of this application;

[0078] Figure 9 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0079] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0080] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0081] The following is combined Figures 1 to 7 This application describes a unit detection method according to an embodiment of the present application.

[0082] It should be noted that the execution subject of the Unit detection method can be a server, a Unit detection device, or a user's terminal, including but not limited to mobile terminals and non-mobile terminals.

[0083] For example, mobile terminals include, but are not limited to, mobile phones, PDA smart terminals, tablets, and in-vehicle smart terminals; non-mobile terminals include, but are not limited to, PCs.

[0084] like Figure 1 As shown, the Unit detection method includes steps 110, 120, 130 and 140.

[0085] Step 110: Perform global positioning of the IC carrier board and determine at least one Unit set;

[0086] In this step, such as Figure 2 The diagram shows an IC carrier board, which is a substrate used in practical applications to package bare IC (integrated circuit) chips and to connect the chip and the circuit board.

[0087] The Unit set includes at least one Unit.

[0088] Global positioning is used to determine the region where the Unit collection is located from the IC carrier board.

[0089] In this application, at least one Unit set performs subsequent detections in parallel, which can shorten the overall execution time.

[0090] In some embodiments, pre-training can be performed based on the IC carrier board before step 110, such as... Figure 3 As shown, pre-training according to the training order can include: global localization training, unit region division, unit initial localization training, unit pen knife detection training, unit re-inspection and detection training, and unit fine localization training.

[0091] In actual execution, the training template can be directly called, which is convenient for users and improves detection efficiency.

[0092] In some embodiments, step 110 may include:

[0093] Extract global features from the IC carrier board;

[0094] Based on the location information corresponding to global features, at least one Unit set is determined.

[0095] In this embodiment, global features refer to the features of a global region of the IC carrier board, such as... Figure 2 The triangular region in the middle.

[0096] Based on the location information corresponding to global features, the region where the Unit collection is located is determined.

[0097] Global localization training can include at least one of feature point training and point matching training.

[0098] In actual implementation, such as Figure 2 As shown, firstly, global features on the IC carrier are selected to perform geometric localization training for each feature, and then point matching training is performed for each localization feature point.

[0099] The selected features must cover the entire area of ​​the IC substrate, and the number of features must be no less than four.

[0100] According to the Unit detection method provided in the embodiments of this application, by extracting global features from the IC carrier board and then determining at least one Unit set based on the location information corresponding to the global features, it is possible to determine the region of at least one Unit set from the IC carrier board, which facilitates the subsequent division of Unit units based on the Unit set for Unit detection operation.

[0101] Step 120: Divide the target Unit set in at least one Unit set to obtain multiple Unit units;

[0102] In this step, the target Unit set is the set used to divide the Units.

[0103] The target Unit set includes at least one Unit.

[0104] In some embodiments, step 120 may include:

[0105] Extract multiple corner points from the target Unit collection;

[0106] Generate an affine rectangle based on multiple corner points;

[0107] Divide the affine rectangle based on the target number of rows and columns to obtain multiple Unit cells.

[0108] In this embodiment, the multiple corner points may include at least one of the top-left corner point, top-right corner point, bottom-left corner point, and bottom-right corner point of the Unit set.

[0109] An affine rectangle can be obtained based on an affine transformation.

[0110] The target number of rows and columns is the number of rows and columns of the Unit collection. For example, the number of rows of the Unit collection can be set to 3, 4 or 5, and the number of columns can be set to 3, 4 or 5. This can be based on user customization and is not limited in this application.

[0111] In actual execution, the top-left, top-right, and bottom-left corners of the target Unit collection can be selected using the mouse. An affine rectangle is generated based on these three corners. Then, the number of rows and columns of the Unit collection is set, and Unit cells are divided from the affine rectangle using an array-like approach. Figure 2 The multiple smallest rectangles in the array are the multiple Unit units.

[0112] According to the Unit detection method provided in the embodiments of this application, multiple corner points are extracted from the target Unit set, and then an affine rectangle is generated based on the multiple corner points. The affine rectangle is then divided based on the target number of rows and columns to obtain multiple Unit units. The Unit set region can be determined by determining three corner points. This method can quickly divide the Unit region, which is convenient as the basic unit for subsequent training and detection. It is simple, convenient and easy to implement.

[0113] Step 130: If the target unit has defects among multiple units, locate the target unit and determine the target location of the area to be processed in the target unit.

[0114] In this step, the target unit is a defective unit, and there can be one or more target units.

[0115] The area to be processed is the area used for laser processing.

[0116] The target location is the specific location of the area to be processed within the target Unit.

[0117] The method for determining the target location will be explained in detail below.

[0118] In some embodiments, step 130 may include:

[0119] Based on the ID number, determine the location area of ​​the target Unit;

[0120] Perform a line-finding operation within the location area to determine the target location.

[0121] In this embodiment, the ID number is the ID of the Unit.

[0122] In actual execution, after dividing the Unit from the IC carrier board, each Unit has a corresponding ID number according to the sorting rules. This ID number can be generated automatically or based on user-defined ID numbers. It can be understood that there is a one-to-one correspondence between the ID number and the Unit.

[0123] The target location is the location of the feature point.

[0124] like Figure 4As shown, a line-finding operation is performed within the location area, and the feature center point is determined by the intersection of the lines, which is the target location.

[0125] In actual training, units that are not marked by laser can be selected as reference units, such as... Figure 5 As shown in ID2Unit, then select a feature, as shown in the solid matrix in ID2Unit, and then perform initial localization training based on that feature.

[0126] According to the Unit detection method provided in the embodiments of this application, the location area of ​​the target Unit is determined based on the ID number to achieve coarse positioning. Then, a line-finding operation is performed within the location area to determine the target position. Based on the coarse positioning, precise positioning is performed, which can accurately locate the target position, guide the laser for processing, reduce laser marking errors, and improve positioning and detection accuracy.

[0127] In some embodiments, step 130 may include:

[0128] Pen knife feature detection is performed on multiple Units;

[0129] When the target unit has pen knife features, the target unit is re-inspected based on the re-inspection training template;

[0130] When the target unit is inconsistent with the re-inspection training template, the target unit is located.

[0131] In this embodiment, pen knife feature detection is used to detect whether there are defects in the unit.

[0132] In actual implementation, a larger region can be selected in the baseline unit as the training region for penknife detection, such as... Figure 5 As shown, a larger rectangle can be selected in ID2Unit as the training area for pen knife detection.

[0133] In some embodiments, performing pen knife feature detection on multiple Units may include:

[0134] Multiple Units are grouped based on the number of threads, with each group including at least one Unit.

[0135] Pen knife feature detection is performed simultaneously on the Units included in each group.

[0136] In this embodiment, multiple Unit units can be grouped based on the optimal number of threads of the industrial control computer.

[0137] Pen knife feature detection is performed in parallel between each unit.

[0138] like Figure 6 As shown, in the actual execution process, the IC carrier board can be globally located first to determine the area of ​​the Unit set. Then, the Unit set is divided to obtain multiple Unit units. Then, the multiple Unit units are grouped according to the optimal number of threads of the industrial control computer. The Units in each group are executed in parallel, and the detection within each Unit is executed sequentially in a loop. After all Units are executed, the results are summarized and output.

[0139] During the research and development process, the inventors discovered that in related technologies, the number of Unit cells on the IC substrate is relatively large, and the existing Unit cell detection time is long and the detection speed is slow, making it difficult to adapt to mass production.

[0140] The Unit detection method provided in the embodiments of this application groups multiple Units based on the number of threads, and then performs pen knife feature detection on the Units included in each group simultaneously. This can shorten the execution time and improve the detection speed and efficiency, and is suitable for IC substrate quality inspection and production with a large number of Units.

[0141] The re-inspection training template is a pre-trained template. During actual training, units with laser markings can be selected as re-inspection training units, such as... Figure 5 ID1Unit in.

[0142] like Figure 7 As shown, initial positioning can be performed based on the ID number, then a re-inspection area can be selected. Using the laser-marked area as a template, re-inspection detection training can be performed based on the re-inspection area. At the same time, the re-inspection area can be transformed into a reference unit for subsequent detection.

[0143] In actual implementation, such as Figure 6 As shown, pen knife feature detection is performed on multiple Unit units. If the target Unit unit has no defects, it is determined to be a normal Unit unit.

[0144] When the target unit has defects, i.e., the target unit has pen-knife characteristics, such as... Figure 5 In the ID3Unit, the target Unit is re-inspected. If the target Unit is consistent with the re-inspection training template, it means that the target Unit has been laser-marked, and the Unit is re-localized.

[0145] When the target unit is inconsistent with the re-inspection training template, fine localization detection is performed on the target unit to determine the location of feature points in the target unit.

[0146] According to the Unit detection method provided in the embodiments of this application, multiple Units are subjected to pen knife feature detection. When the target Unit has pen knife features, the target Unit is re-inspected based on the re-inspection training template. Then, when the target Unit is inconsistent with the re-inspection training template, the target Unit is precisely located and detected so as to guide the laser to process the target Unit, thereby reducing the error of laser marking and improving the accuracy and precision of detection.

[0147] Step 140: Based on the target position, perform laser processing on the target Unit.

[0148] In this step, the target location is the location of the feature point in the target Unit cell.

[0149] Laser processing can include laser marking of target unit cells.

[0150] In this application, the IC carrier is globally located to determine at least one Unit set. Then, the target Unit set in the at least one Unit set is divided to obtain multiple Unit units. This allows for the rapid division of Unit regions to select a reference Unit, facilitating subsequent testing. The modeling process is relatively simple and has high convenience and maintainability.

[0151] When a target unit in a multi-unit system has defects, the target unit can be located to determine the target position of the area to be processed within the target unit. This allows for accurate location of the area requiring laser processing, improving the accuracy of the detection.

[0152] According to the Unit detection method provided in this application embodiment, the Unit set region is determined by globally locating the IC carrier board, and then the target Unit set is divided to obtain multiple Unit units. This method can accurately divide multiple Unit units on the IC carrier board and quickly divide the Unit region for defect detection of each Unit unit. In the case of a defect in the target Unit unit, the target Unit unit is located to determine the target position of the area to be processed, and then the target Unit unit is laser processed. This can reduce marking errors, achieve accurate positioning of the processing area, improve detection accuracy, and the positioning method of the Unit unit is simple, with high convenience and maintainability.

[0153] The Unit detection apparatus provided in this application is described below. The Unit detection apparatus described below can be referred to in correspondence with the Unit detection method described above.

[0154] The Unit detection method provided in this application can be executed by a Unit detection device. This application uses the Unit detection device executing the Unit detection method as an example to illustrate the Unit detection device provided in this application.

[0155] This application also provides a Unit detection device.

[0156] like Figure 8 As shown, the Unit detection device includes: a first processing module 810, a second processing module 820, a third processing module 830, and a fourth processing module 840.

[0157] The first processing module 810 is used to perform global positioning of the IC carrier board and determine at least one Unit set;

[0158] The second processing module 820 is used to divide the target Unit set in at least one Unit set and obtain multiple Unit units;

[0159] The third processing module 830 is used to locate the target unit and determine the target position of the area to be processed in the target unit when there is a defect in the target unit among multiple unit units.

[0160] The fourth processing module 840 is used to perform laser processing on the target Unit based on the target position.

[0161] According to the Unit detection device provided in the embodiments of this application, the Unit set area is determined by globally locating the IC carrier board, and then the target Unit set is divided to obtain multiple Unit units. This allows for precise division of multiple Unit units on the IC carrier board and rapid division of Unit areas for defect detection of each Unit unit. In the case of a defect in the target Unit unit, the target Unit unit is located to determine the target position of the area to be processed, and then the target Unit unit is laser-processed. This reduces marking errors, achieves precise positioning of the processing area, improves detection accuracy, and the unit unit positioning method is simple, with high convenience and maintainability.

[0162] In some embodiments, the third processing module 830 can also be used to perform pen knife feature detection on multiple Unit units;

[0163] When the target unit has pen knife features, the target unit is re-inspected based on the re-inspection training template;

[0164] When the target unit is inconsistent with the re-inspection training template, the target unit is located.

[0165] According to the Unit detection device provided in the embodiments of this application, by performing pen knife feature detection on multiple Units, when the target Unit has pen knife features, the target Unit is re-inspected based on the re-inspection training template. Then, when the target Unit is inconsistent with the re-inspection training template, the target Unit is precisely positioned and detected so as to guide the laser to process the target Unit in the future, thereby reducing the error of laser marking and improving the accuracy and precision of detection.

[0166] In some embodiments, the Unit detection device may further include a fifth processing module for grouping multiple Units based on the number of threads, with each group including at least one Unit.

[0167] Pen knife feature detection is performed simultaneously on the Units included in each group.

[0168] The Unit detection device provided in the embodiments of this application can shorten the execution time and improve the detection speed and efficiency by grouping multiple Units based on the number of threads and then simultaneously performing pen knife feature detection on the Units included in each group. It is suitable for quality inspection and production of IC carrier boards with a large number of Units.

[0169] In some embodiments, the third processing module 830 can also be used to determine the location region of the target Unit based on the ID number;

[0170] Perform a line-finding operation within the location area to determine the target location.

[0171] According to the Unit detection device provided in the embodiments of this application, the location area of ​​the target Unit is determined based on the ID number to achieve coarse positioning. Then, a line-finding operation is performed within the location area to determine the target position. Based on the coarse positioning, precise positioning is performed, which can accurately locate the target position, guide the laser for processing, reduce laser marking errors, and improve positioning and detection accuracy.

[0172] In some embodiments, the second processing module 820 can also be used to extract multiple corner points from the target Unit set;

[0173] Generate an affine rectangle based on multiple corner points;

[0174] Divide the target number of rows and columns into radial rectangles to obtain multiple Unit cells.

[0175] According to the Unit detection device provided in the embodiments of this application, multiple corner points are extracted from the target Unit set, and then an affine rectangle is generated based on the multiple corner points. The affine rectangle is then divided based on the target number of rows and columns to obtain multiple Unit units. The Unit set region can be determined by determining three corner points. This can quickly divide the Unit region, which is convenient as the basic unit for subsequent training and detection. It is simple, convenient and easy to implement.

[0176] In some embodiments, the first processing module 810 can also be used to extract global features from the IC carrier board;

[0177] Based on the location information corresponding to global features, at least one Unit set is determined.

[0178] According to the Unit detection device provided in the embodiments of this application, by extracting global features from the IC carrier board and then determining at least one Unit set based on the location information corresponding to the global features, it is possible to determine the region of at least one Unit set from the IC carrier board, which facilitates subsequent division of Unit units based on the Unit set for Unit detection operation.

[0179] The unit detection device in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. This application embodiment does not specifically limit the specific type of device.

[0180] The unit detection device in this application embodiment can be a device with an operating system. This operating system can be Android, iOS, or other possible operating systems; this application embodiment does not specifically limit it.

[0181] The Unit detection device provided in this application embodiment can achieve... Figures 1 to 7 The various processes implemented in the method implementation examples will not be described again here to avoid repetition.

[0182] Figure 9 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 9 As shown, the electronic device may include a processor 910, a communication interface 920, a memory 930, and a communication bus 940, wherein the processor 910, the communication interface 920, and the memory 930 communicate with each other through the communication bus 940. The processor 910 can call logic instructions in the memory 930 to execute a unit detection method, which includes: globally locating the IC carrier board to determine at least one unit set; dividing the target unit set in the at least one unit set to obtain multiple unit units; if a target unit unit has a defect among the multiple unit units, locating the target unit unit to determine the target position of the area to be processed in the target unit unit; and performing laser processing on the target unit unit based on the target position.

[0183] Furthermore, the logical instructions in the aforementioned memory 930 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0184] On the other hand, this application also provides a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium. The computer program includes program instructions, and when the program instructions are executed by a computer, the computer is able to execute the Unit detection method provided by the above methods. The method includes: globally locating the IC carrier board to determine at least one Unit set; dividing the target Unit set in the at least one Unit set to obtain multiple Unit units; locating the target Unit unit in the case of a defect in the target Unit unit among the multiple Unit units to determine the target position of the area to be processed in the target Unit unit; and performing laser processing on the target Unit unit based on the target position.

[0185] In another aspect, this application also provides a non-transitory computer-readable storage medium storing a computer program thereon, which, when executed by a processor, is implemented to perform the aforementioned Unit detection methods. The method includes: globally locating an IC carrier board to determine at least one Unit set; dividing a target Unit set within the at least one Unit set to obtain multiple Unit units; locating the target Unit unit in the case of a defect among the multiple Unit units to determine the target position of the area to be processed within the target Unit unit; and performing laser processing on the target Unit unit based on the target position.

[0186] In another aspect, embodiments of this application provide a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the above-mentioned Unit detection method. The method includes: globally locating the IC carrier board to determine at least one Unit set; dividing the target Unit set in the at least one Unit set to obtain multiple Unit units; locating the target Unit unit when there is a defect in the target Unit unit among the multiple Unit units to determine the target position of the area to be processed in the target Unit unit; and performing laser processing on the target Unit unit based on the target position.

[0187] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.

[0188] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0189] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0190] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A Unit cell detection method characterized by, include: Perform global positioning of the IC carrier board to determine at least one Unit set; The target Unit set in the at least one Unit set is divided to obtain multiple Unit units; If a target unit has a defect among the multiple unit units, the target unit is located to determine the target location of the area to be processed within the target unit. Based on the target location, the target Unit is laser-processed; In the case where a target unit has a defect among the plurality of unit units, the target unit is located to determine the target position of the area to be processed within the target unit, including: Pen knife feature detection is performed on the multiple Unit units; If the target unit has pen knife features, the target unit is re-inspected based on the re-inspection training template; If the target unit is inconsistent with the re-inspection training template, the target unit is located. The step of locating the target unit and determining the target position of the area to be processed within the target unit includes: Based on the ID number, determine the location region of the target Unit; A line-finding operation is performed within the specified location area to determine the target location.

2. The Unit cell detection method according to claim 1, characterized in that, The process of performing pen knife feature detection on the plurality of Unit units includes: The multiple Unit units are grouped based on the number of threads, with each group including at least one Unit unit. Pen knife feature detection is performed simultaneously on the Units included in each group.

3. The Unit detection method according to any one of claims 1-2, characterized in that, The step of dividing the target Unit set in the at least one Unit set to obtain multiple Unit units includes: Extract multiple corner points from the target Unit set; Based on the aforementioned corner points, an affine rectangle is generated; The affine rectangle is divided based on the target number of rows and columns to obtain the multiple Unit units.

4. The Unit detection method according to any one of claims 1 to 2, characterized in that, The global positioning of the IC carrier board, determining at least one Unit set, includes: Extract global features from the IC carrier board; Based on the location information corresponding to the global features, the at least one Unit set is determined.

5. A Unit cell detection apparatus for implementing the Unit cell detection method according to any one of claims 1 to 4, characterized in that, include: The first processing module is used to globally locate the IC carrier board and determine at least one Unit set; The second processing module is used to divide the target Unit set in the at least one Unit set and obtain multiple Unit units; The third processing module is used to locate the target unit and determine the target position of the area to be processed in the target unit when there is a defect in the target unit among the multiple unit units; The fourth processing module is used to perform laser processing on the target Unit based on the target position.

6. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the Unit detection method as described in any one of claims 1-4.

7. A non-transitory computer-readable storage medium having stored thereon a computer program, characterized in that, When the computer program is executed by a processor, it implements the Unit detection method as described in any one of claims 1-4.

8. A computer program product comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the Unit detection method as described in any one of claims 1-4.

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