Keyboard, electronic device, and keyboard manufacturing method

Abstract

The application relates to a keyboard, an electronic device and a keyboard manufacturing method, wherein the keyboard comprises a keyboard module, a top waterproof layer and a supporting assembly, the keyboard module comprises a plurality of keycaps and a keyboard main body; the top waterproof layer comprises a keycap fitting part and a gap fitting part; the supporting assembly comprises a first supporting structure, the first supporting structure and the gap fitting part are both net structures, and the top waterproof layer and the first supporting structure are both integrally formed structures. The keycap fitting part is fitted with the keycap, the sliding phenomenon between the top waterproof layer and the keycap is avoided, the movement of the top waterproof layer is avoided, the first supporting structure and the gap fitting part are fitted and isolated from the pulling of the waterproof layer of adjacent keycaps, and the problem that the keyboard is pressed to produce a coupled phenomenon is solved. The application effectively solves the problem that, when the top waterproof layer of the keyboard is an integral whole in the prior art, the surrounding keycaps appear a coupled phenomenon when the keycaps are pressed, the input accuracy of the keyboard is low, and the pressing feeling is poor.

Description

Technical Field

[0001] This application relates to the technical field of keyboards, and more particularly to a keyboard, an electronic device, and a method for manufacturing a keyboard. Background Technology

[0002] The keyboard is the most commonly used and primary input device, enabling the input of text, programs, and numbers into electronic devices, and is one of the most important productivity tools. With the continuous development of electronic devices, keyboards are not only used in computers but also in portable laptops and tablets. Keyboards can also connect to electronic devices wirelessly or via data cables. Furthermore, with continuous improvements in manufacturing technology, keyboard quality has become increasingly refined, the number of keystrokes that keys can withstand has significantly increased, and the overall lifespan of keyboards has been greatly extended.

[0003] With the increasing frequency and complexity of electronic device use, particulate matter and liquids are becoming increasingly important factors affecting keyboard lifespan. Because keyboards have internal circuit board structures, they generate induction during use, attracting airborne particles or liquid molecules. Furthermore, spills of water or large amounts of liquid can damage the internal circuit board structure. Current technology typically uses a single piece of material to cover the entire keyboard. While this can prevent water vapor and dust from entering, the thickness of the material is generally too large to fully accommodate the keycaps' shapes during the stamping process. This results in the waterproof layer being pulled along with the waterproof layer of adjacent keycaps when a keycap is pressed, causing a cascading effect that severely impacts typing accuracy and tactile feedback. Summary of the Invention

[0004] This application provides a keyboard, an electronic device, and a keyboard manufacturing method to solve the problem in the prior art where, when the top waterproof layer of a keyboard is a single unit, the surrounding keycaps will be pulled together when the keycaps are pressed, resulting in low keyboard input accuracy and poor pressing feel.

[0005] In a first aspect, embodiments of this application provide a keyboard, including: a keyboard module, a top waterproof layer, and a support component. The keyboard module includes multiple keycaps and a keyboard body; the top waterproof layer includes a keycap fitting portion and a gap fitting portion, the keycap fitting portion being fitted to each keycap; the support component includes a first support structure, both the first support structure and the gap fitting portion being mesh structures, the first support structure being bonded to the gap fitting portion, both the first support structure and the gap fitting portion being disposed within the gap between adjacent keycaps, and the top waterproof layer and the first support structure being integrally formed structures.

[0006] Furthermore, the support component also includes a second support structure, which is disposed between the first support structure and the keyboard body. The second support structure is in contact with the keyboard body, and the keycaps can pass through the second support structure and be in contact with the keycap contact portion.

[0007] Furthermore, the second support structure includes a first receiving portion, which is mesh-like and forms multiple first through holes. Each keycap is arranged in a one-to-one correspondence with each first through hole, and each keycap passes through the first receiving portion and is attached to the keycap fitting portion.

[0008] Furthermore, a fitting gap is provided between the first support structure and the first receiving part, and the height of the fitting gap is H, 0.15mm≤H≤0.5mm.

[0009] Furthermore, the support assembly also includes a buffer structure, which is disposed between the top waterproof layer and the second support structure. The buffer structure includes a first limiting part that can surround the first support structure, and the buffer structure fits into the second support structure.

[0010] Furthermore, the keyboard also includes a touch module, the second support structure also includes a second receiving portion, the touch module is disposed in the second receiving portion, the buffer structure also includes a second limiting portion, the touch module can partially pass through the second limiting portion and connect to the top waterproof layer, and the top waterproof layer is provided with a touch portion corresponding to the position of the touch module.

[0011] Furthermore, the touch module includes a connected decorative panel and a touch motherboard. The second support structure also includes a mounting bracket, which is disposed within the second receiving portion. The decorative panel is disposed on the touch portion. The touch motherboard is fixedly connected to the mounting bracket. The touch motherboard contacts the side of the touch portion away from the decorative panel. The touch motherboard is electrically connected to the keyboard body.

[0012] Furthermore, the keyboard also includes a bottom waterproof layer that wraps around the keyboard module. The bottom waterproof layer is bonded to the top waterproof layer. The top waterproof layer is made of a flexible material, while the bottom waterproof layer is made of waterproof leather, textiles, or nanofiber materials. The first support structure is made of PC, PET, PI, LCP, or FR materials.

[0013] Secondly, embodiments of this application provide an electronic device, which includes a keyboard and a device body, wherein the keyboard and the device body are connected by a signal.

[0014] Thirdly, this application provides a keyboard manufacturing method for manufacturing the aforementioned keyboard. The keyboard manufacturing method includes the following steps:

[0015] S10 uses a hot-pressing method to create the keycap fitting part and the gap fitting part on the top waterproof layer;

[0016] S20, the top waterproof layer is bonded to the first support structure by hot pressing;

[0017] S30, the top waterproof layer is bonded to the second support structure by hot pressing;

[0018] S40, the top waterproof layer and the bottom waterproof layer are bonded together by hot pressing;

[0019] S50, the top and bottom waterproof layers are cut off to form the finished keyboard.

[0020] Furthermore, after the top waterproof layer and the first support structure are bonded together by hot pressing, the keyboard manufacturing method also includes:

[0021] S21, bonding the decorative panel to the touch portion of the top waterproof layer;

[0022] S22, the keyboard module and the second support structure are assembled together by hot-melt method;

[0023] S23 assembles the touch motherboard and the second support structure together by heat fusion.

[0024] The technical solutions provided in this application have the following advantages compared with the prior art:

[0025] This application provides a keyboard, an electronic device, and a keyboard manufacturing method. The keyboard includes a keyboard module, a top waterproof layer, and a support assembly. The keyboard module includes multiple keycaps and a keyboard body. The top waterproof layer includes a keycap fitting portion and a gap fitting portion, with the keycap fitting portion fitting to each keycap. The support assembly includes a first support structure, both the first support structure and the gap fitting portion being mesh structures. The first support structure and the gap fitting portion are bonded together, and both the first support structure and the gap fitting portion are disposed in the gap between adjacent keycaps. The top waterproof layer and the first support structure are integrally formed structures. The keycap fitting portion and the keycap itself are fitted together to prevent slippage between the pressing area of ​​the top waterproof layer and the keycap, and to prevent the keycap area of ​​the top waterproof layer from shifting. The design of the first support structure and the gap fitting portion increases the structural strength of the gap between the top waterproof layer and the keycap, and increases the weight at the gap fitting portion. During the keycap pressing down, the pulling force of the keycap fitting portion on the gap fitting portion is greatly reduced, so that the deformation of the top waterproof layer is located on the side wall of the keycap, isolating the pulling of the waterproof layer of adjacent keycaps, thereby solving the problem of the keyboard causing a chain reaction when the keycap is pressed. This application effectively solves the problem in the prior art where, when the top waterproof layer of the keyboard is a whole, the surrounding keycaps will cause a chain reaction when the keycap is pressed, resulting in lower keyboard input accuracy. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A three-dimensional structural diagram of a keyboard provided in an embodiment of this application is shown;

[0029] Figure 2 It shows Figure 1 A diagram illustrating the explosion of a keyboard;

[0030] Figure 3 It shows Figure 1 A partial sectional view of the keyboard;

[0031] Figure 4 It shows Figure 1 Front view of the waterproof layer on the top of the keyboard;

[0032] Figure 5 It shows Figure 2 A three-dimensional structural diagram of the first support structure of the keyboard;

[0033] Figure 6 It shows Figure 2 A three-dimensional structural diagram of the keyboard's second support structure;

[0034] Figure 7 It shows Figure 2 A three-dimensional structural diagram of the keyboard's buffer structure;

[0035] The above figures include the following reference numerals:

[0036] 10. Keyboard module; 11. Keycaps; 12. Keyboard body; 20. Top waterproof layer; 21. Keycap fitting part; 22. Gap fitting part; 23. Touch part; 30. Support component; 31. First support structure; 311. Second through hole; 312. Support frame; 32. Second support structure; 321. First receiving part; 322. First through hole; 323. Second receiving part; 324. Mounting bracket; 33. Buffer structure; 331. First limiting part; 332. Second limiting part; 40. Touch module; 41. Decorative panel; 42. Touch motherboard; 50. Bottom waterproof layer; 60. Bottom mounting plate. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] like Figures 1 to 5 As shown, in a first aspect, the technical solution of this application provides a keyboard, including: a keyboard module 10, a top waterproof layer 20, and a support component 30. The keyboard module 10 includes a plurality of keycaps 11 and a keyboard body 12; the top waterproof layer 20 includes a keycap fitting portion 21 and a gap fitting portion 22, the keycap fitting portion 21 fitting with each keycap 11; the support component 30 includes a first support structure 31, the first support structure 31 and the gap fitting portion 22 are both mesh structures, the first support structure 31 and the gap fitting portion 22 are bonded together, the first support structure 31 and the gap fitting portion 22 are both disposed in the gap between adjacent keycaps 11, and the top waterproof layer 20 and the first support structure 31 are both integrally formed structures. The keycap fitting portion 21 fits snugly against the keycap 11, preventing slippage between the pressing area of ​​the top waterproof layer 20 and the keycap 11, and preventing the keycap area of ​​the top waterproof layer 20 from shifting. The first support structure 31 and the gap fitting portion 22 increase the structural strength of the gap between the top waterproof layer and the keycap 11, and increase the weight at the gap fitting portion 22. During the pressing of the keycap 11, the pulling force of the keycap fitting portion 21 on the gap fitting portion 22 is greatly reduced, so that the deformation of the top waterproof layer 20 is located on the side wall of the keycap 11, isolating the pulling of the waterproof layer of adjacent keycaps 11, thereby solving the problem of the cascading phenomenon when the keyboard is pressed. This application effectively solves the problem in the prior art where, when the top waterproof layer of the keyboard is a whole, the surrounding keycaps will cascade when the keycap is pressed, resulting in low keyboard input accuracy.

[0039] It should be noted that the top waterproof layer 20 adopts a one-piece molded structure to achieve optimal waterproof performance. This design reduces the need for waterproof and dustproof treatment inside the keyboard, simplifying the internal structure and facilitating production. In this embodiment, "fitting" refers to the two parts being in contact with each other, but it does not limit whether the two parts are fixedly connected. After assembly, the two fitted positions are compact and less prone to air bubbles. This design allows for a certain gap in the partially fitted area when the keycap 11 is pressed, accommodating the deformation of the top waterproof layer 20 during keycap 11 pressing. The first support structure 31 adopts a one-piece molded structure, which improves its structural strength. At the same time, when the first support structure 31 is a single piece, the tensile force on the gap fitting part 22 within a single gap is increased. The overall structure makes the gap fitting part 22 also form a whole, separating the keycap fitting part 21 and the waterproof layer on the side of the keycap 11, further preventing the linkage between adjacent keycaps and improving the accuracy of keycap 11 keystrokes. Specifically, the first support structure 31 includes a support frame 312, with second through holes 311 formed between the support frames 312. The second through holes 311 are used for the keycaps 11 to pass through. There are multiple second through holes 311, and the second through holes 311 are fitted with the corresponding keycaps 11 with a gap. The support frame 312 connects the entire gap fitting part 22 together to form a whole, increasing the deformation resistance of the gap fitting part 22. Combined with the fitting of the keycap fitting part 21 with the top of the keycap 11, the deformation of the waterproof layer required for the keycap 11 to be pressed down is entirely applied to the waterproof layer on the side wall of the keycap 11, thereby ensuring that the waterproof layer of adjacent keycaps 11 will not be pressed down together, further ensuring the accuracy of typing.

[0040] like Figures 1 to 3 As shown, in this embodiment, the support component 30 further includes a second support structure 32. The second support structure 32 is disposed between the first support structure 31 and the keyboard body 12. The second support structure 32 is in contact with the keyboard body 12, and the keycap 11 can pass through the second support structure 32 and be in contact with the keycap contact portion 21. The second support structure 32 is provided to isolate the keyboard body 12 from the first support structure 31.

[0041] like Figure 6As shown, in this embodiment, the second support structure 32 includes a first receiving portion 321, which is mesh-like and forms multiple first through holes 322. Each keycap 11 is correspondingly disposed with each first through hole 322, and each keycap 11 passes through the first receiving portion 321 and is attached to the keycap fitting portion 21. The mesh-like arrangement further provides support for the first support structure 31, and this arrangement also helps to reduce the limitations on the material selection of the first support structure 31, because the mesh-like first receiving portion 321 completely separates the first support structure 31 from the keyboard body 12. It should be noted that the sizes of the first through holes 322 and the second through holes 311 are both in a clearance fit with the corresponding keycaps 11, and this arrangement will not affect the obstruction effect when the keycaps are pressed down.

[0042] like Figure 3As shown, in this embodiment, a fitting gap is provided between the first support structure 31 and the first receiving portion 321. The height of the fitting gap is H, where 0.15mm ≤ H ≤ 0.5mm. The purpose of setting the fitting gap is to enhance the overall deformation resistance of the gap fitting portion 22 when the first support structure 31 is bonded to the gap fitting portion 22. This ensures that when the top waterproof layer 20 is pressed by the keycap 11, the deformation position is located between the first support structure 31 and the side wall of the keycap 11. This avoids the gap fitting portion 22 from causing adjacent keycaps 11 to move together, and prevents gaps from appearing between the top waterproof layer 20 and the keycap 11, thereby improving the accuracy and feel of pressing the keycap 11. It should be noted that the height of the fitting gap needs to be set according to the actual pressing depth of the keycap 11. If the fitting gap height is too high, the deformation area of ​​the top waterproof layer 20 will be too large, leading to elastic deformation failure and the risk of permanent deformation of the waterproof layer. At the same time, the first support structure 31 will be subjected to a large force, which may also lead to damage. If the height of the mating gap is too small, the deformation area of ​​the top waterproof layer 20 will be relatively small, and the first support structure 31 will easily come into contact with the components below it under the influence of movement. This will lead to wear between the bottom components and the first support structure 31 due to relative movement. In this embodiment, the height of the mating gap is 0.2mm. The mating gap is designed to provide room for the first support structure 31 to move, allowing it to stretch the gap fitting part 22 downwards, resulting in a better fit of the top waterproof layer 20. On the other hand, since the first support structure 31 has a certain amount of deformation, the mating gap ensures that the deformation of the first support structure 31 is within the height range of the mating gap, further protecting the keyboard body 12. This design improves the comfort of using the keyboard. It should be noted that the gap between the keycaps 11 is relatively deep. When the top waterproof layer 20 is installed on the keycaps, the keycaps may easily move adjacent keycaps 11 during use. Therefore, the top waterproof layer 20 is pressed into the shape of a keyboard in the first step using a keyboard model. In the second step, the shape is fixed with the first support structure 31. A gap of 0.2mm is left between the first support structure 31 and the second support structure 32 to facilitate the up and down movement of the keycaps 11.

[0043] It should be noted that in this embodiment, to ensure the tactile feedback of the keycap 11 when pressed, the top waterproof layer 20 is made of a thin, flexible material. The thinner top waterproof layer 20, after being pre-pressed into the keycap shape, provides better adhesion to the keycap 11. This better fit between the keycap fitting portion 21 and the keycap 11 avoids gaps between the pressing area of ​​the top waterproof layer 20 and the keycap 11, solving the technical problem of poor tactile feedback caused by gaps between the thicker top waterproof layer 20 and the keycap 11 in the prior art. In an optional embodiment, the thickness of the top waterproof layer 20 ranges from 0.01mm to 0.2mm. This thickness allows for structural precision during the molding process, facilitating better keyboard assembly later. The waterproof layer design also needs to consider the actual pressing feel of the keycap 11. When the thickness of the top waterproof layer 20 is between 0.01mm and 0.1mm, the addition of the top waterproof layer 20 will not affect the actual pressing feel of the keycap 11, and a top waterproof layer 20 within this range is easier to process and manufacture. Furthermore, when the thickness of the top waterproof layer 20 is between 0.01mm and 0.05mm, the thickness of the top waterproof layer 20 is further reduced. This results in greater elasticity when it is fitted to the keycap 11, allowing it to better adapt to the keycap size. Specifically, in this embodiment, the thickness is set to 0.03mm. This setting makes the thickness of the top waterproof layer 20 moderate, improving its flexibility to facilitate fitting with the keycap 11. The more flexible the material, the better it can withstand the pulling of the keycap 11 when pressed, reducing the impact of the waterproof layer on the feel when the keycap 11 is pressed. The thinner the flexible material, the higher the processing difficulty and the higher the corresponding processing and production cost. Conversely, the thicker the flexible material, the easier the processing but the higher the material cost. Therefore, choosing a moderate thickness can balance processing difficulty and production cost.

[0044] like Figure 3 , Figure 4 and Figure 7 As shown, in the technical solution of this embodiment, the support component 30 further includes a buffer structure 33, which is disposed between the top waterproof layer 20 and the second support structure 32. The buffer structure 33 includes a first limiting part 331, which can surround the first support structure 31. The buffer structure 33 is in contact with the second support structure 32.

[0045] like Figure 3 , Figure 4 and Figure 7As shown, in this embodiment, the support component 30 further includes a buffer structure 33, which is disposed between the top waterproof layer 20 and the second support structure 32. The buffer structure 33 includes a first limiting part 331, which can surround the first support structure 31, and the buffer structure 33 is in contact with the second support structure 32. The material of the buffer structure 33 can be woven fabric, non-woven fabric, or molded soft rubber layer, etc. Since the top waterproof layer 20 is made of flexible material to increase the feel when the keycap 11 is pressed, the thin top waterproof layer 20 has high elasticity and is easily deformed. The buffer structure 33 is set to facilitate the manufacturing function of the top waterproof layer 20, and at the same time, it can provide a certain degree of rigidity so that the top waterproof layer 20 can stretch better and achieve an aesthetic effect.

[0046] like Figure 2 As shown, in this embodiment, the keyboard further includes a touch module 40, the second support structure 32 includes a second receiving portion 323, the touch module 40 is disposed within the second receiving portion 323, and the buffer structure 33 includes a second limiting portion 332. The touch module 40 can partially pass through the second limiting portion 332 and connect to the top waterproof layer 20. The top waterproof layer 20 has a touch portion 23 at the position corresponding to the touch module 40. The touch module 40 facilitates the electronic device to have mouse functionality. The keyboard allows the electronic device to have more functions. When the keyboard is used as an external keyboard for a laptop, the touch module 40 can replicate the laptop's decorative panel, avoiding the laptop's heat affecting the keyboard's feel and increasing the keyboard's practicality. When the keyboard is used as an external keyboard for a tablet, it can enhance the tablet's functionality. Most existing tablets can install Microsoft operating systems; the touch module 40 can adapt to these operating systems, turning the tablet into a laptop. This configuration allows the electronic device to have more functions and more operational space. The second receiving part 323 can completely accommodate the touch module 40, and the touch module 40 is operated through the tactile transmission of the touch part 23 provided on the top waterproof layer 20.

[0047] like Figure 2 , Figure 6 and Figure 7As shown, in this embodiment, the touch module 40 includes a connected decorative panel 41 and a touch motherboard 42. The second support structure 32 also includes a mounting bracket 324, which is disposed within the second receiving portion 323. The top waterproof layer 20 has a touch portion 23 positioned corresponding to the second receiving portion 323. The decorative panel 41 is disposed on the touch portion 23, meaning the decorative panel 41 and the touch motherboard 42 are respectively disposed on opposite sides of the touch portion 23. The decorative panel 41 can be embedded in the cavity formed by the touch portion 23, which does not have through holes, thus improving the overall waterproof performance of the keyboard. The mounting bracket 324 is disposed within the second receiving portion 323, and the touch motherboard 42 is fixedly connected to the mounting bracket 324. The touch motherboard 42 contacts the side of the touch portion 23 away from the decorative panel 41, and the touch motherboard 42 is electrically connected to the keyboard body 12. The decorative panel 41 is made of a material with a certain degree of hardness, similar to the touch area of ​​a laptop computer. The decorative panel 41 is fitted into the cavity formed by the touch unit 23, allowing for a smooth transition. This design enables the decorative panel 41 to support the touch unit 23, forming a flat surface, ensuring close contact between the area below the touch unit 23 and the touch motherboard 42 located below it. Simultaneously, the decorative panel 41 protects the touch motherboard 42 from compression. The mounting bracket 324 is used for positioning and mounting the touch motherboard 42. The mounting bracket 324 is tightly connected to the second receiving portion 323 using fasteners or adhesives, resulting in a compact structure for the touch module 40. The second limiting part 332 is used for the passage of the touch motherboard 42. The decorative panel 41 can transmit tactile feedback to the touch motherboard 42 through the thin top waterproof layer 20, avoiding impact on touch accuracy. Simultaneously, the second limiting part 332 restricts the circumferential position of the touch motherboard 42, thereby protecting it. The mounting bracket 324 is tightly connected to the second receiving part 323 by fasteners or adhesives. This configuration makes the keyboard's touch area structure compact. It should be noted that the inclusion of the touch module 40 creates a wrist rest between the keycap area and the touch module 40. This wrist rest supports the base of the palm during keyboard use, reducing pressure on the keycap area and extending the keyboard's lifespan.

[0048] like Figure 2 and Figure 3As shown, in this embodiment, the keyboard also includes a bottom waterproof layer 50, which wraps around the keyboard module 10. The bottom waterproof layer 50 is attached to the top waterproof layer 20. The top waterproof layer 20 is made of a flexible material, while the bottom waterproof layer 50 is made of waterproof leather, textiles, or nano-fabric materials with a thickness of 0.3mm or more to provide a certain degree of hardness and elasticity to fit the user's hand and provide a certain degree of comfort. The first support structure 31 is made of rigid materials such as PC, PET, PI, LCP, or FR4. Because the top waterproof layer 20 is made of a flexible material, the entire top waterproof layer 20 has greater elasticity and is easily deformed. The first support structure 31 is made of a rigid material with a certain weight and high hardness, which can ensure the structural fixation of the gap fitting part 22 of the top waterproof layer 20, so as to facilitate subsequent assembly with the keycaps 11. The bottom waterproof layer 50 provides overall waterproofing to the bottom of the keyboard. It adheres to the top waterproof layer 20, completely encasing the keyboard. This design makes the keyboard a unified whole. The top surface is waterproofed and dustproofed by the top waterproof layer 20, the bottom by the bottom waterproof layer 50, and the sides by the combination of the bottom and top waterproof layers 50. Specifically, an adhesive can be applied between the bottom and top waterproof layers 50, or they can be bonded together using heat pressing, enhancing the keyboard's waterproof performance. Since a thick waterproof layer cannot adhere well to the keycaps 11, creating gaps, the top waterproof layer 20 is made of a flexible material. Flexible materials easily conform to the shape of the keycaps 11, making it easier to adhere to them, eliminating gaps between the keycaps 11 and the top waterproof layer 20, and improving the typing feel. The flexible material has a certain degree of elastic deformation to adapt to the operation of the keycaps 11. The bottom waterproof layer 50 is made of waterproof leather, textiles, or nano-fabric materials. Such materials offer a high-quality feel and a comfortable touch, making keyboard transfer more convenient. The first support structure 31 is made of rigid materials such as PC, PET, PI, LCP, or FR4. PC is specifically chosen because flexible materials lack sufficient rigidity and are prone to deformation during assembly and pressing. Therefore, a rigid first support material supports the flexible top waterproof layer. This design provides the first support structure 31 with a certain degree of rigidity and weight, allowing it to stretch the gap fitting part 22 downwards. Furthermore, the aforementioned materials possess a certain degree of elastic deformation, better adapting to the deformation of the top waterproof layer 20 when the keycap 11 is pressed down. It should be noted that in keyboards with a waterproof layer, without the first support structure 31, regardless of the thickness of the waterproof layer, the waterproof layer on the sidewalls of the keycap 11 will stick together. This is not only unsightly but also causes adhesion when the keycap 11 is pressed, significantly impacting the user experience and potentially affecting the user's decision to reuse the waterproof keyboard.Furthermore, when the waterproof layer is made of a thicker material, the first support structure 31 can provide some constraint on the thicker material, which is difficult to form, allowing the waterproof layer to effectively adhere to the keycap 11. However, due to the low deformation degree of the thicker material, there is a high probability of unformed parts during forming. This makes the first support structure 31 prone to affecting the waterproof layer of the keycaps 11 on both sides. Under the force of the first support structure 31, a chain reaction occurs. Although this can solve the problem of the fit between the waterproof layer and the keycap 11 to some extent, it cannot completely solve the problem of chain reaction. Using a thinner waterproof layer with the first support structure 31 can avoid the problem of difficult forming. At the same time, after assembly, it can better adapt to the deformation of the waterproof layer when the keycap 11 is pressed. Moreover, the deformation of the waterproof layer will not cause the first support structure 31 to affect the waterproof layer of adjacent keycaps 11, thus preventing the waterproof layer from being pulled and chained.

[0049] It should be noted that, to facilitate the isolation between the keyboard body 12 and the waterproof material, a bottom mounting plate 60 is provided between the keyboard body 12 and the bottom waterproof layer 50. This arrangement serves as an isolation mechanism, and even if water enters the waterproof layer, it needs to bend significantly before affecting the keyboard body 12. This arrangement is more conducive to the keyboard's waterproofness. In the above keyboard setup, the top waterproof layer is a one-piece molded structure, and its appearance design maintains the integrity of the waterproof layer to achieve a consistent appearance. The top waterproof layer 20 uses a soft material, which, while ensuring waterproofing, reduces the impact of the waterproof layer on the feel of the keycaps 11 when pressed. The waterproof layer around the keycaps 11 is not bonded to the keycaps 11; this part of the waterproof layer material can move flexibly to provide the stretching of the waterproof layer material required for the keycaps 11 to press. The first support structure 31 is provided, using a rigid material, so that the top waterproof layer 20 can adapt to the keycap area, ensuring the uniformity of the fit between the gap fitting part 22 and the keycaps 11, ensuring the consistency of the keycap 11's pressing feel, and providing a flat and three-dimensional visual effect in this area.

[0050] In the technical solution of this embodiment (not shown in the figure), in a second aspect, this application provides an electronic device, which includes a keyboard and a device body. The keyboard is the aforementioned keyboard, and the keyboard and the device body are connected by a signal. This electronic device can be a laptop, tablet, or other electronic device. The signal connection allows the aforementioned keyboard to serve the electronic device, enabling the keyboard to perform its functions. The keyboard is easy to carry and transfer, and has good waterproof and dustproof capabilities, making it suitable for harsh environments and diverse living environments. It should be noted that the signal connection can be a wireless signal connection, such as Bluetooth, which is more convenient; or a wired connection can be used, with signal interaction via a data cable, resulting in more stable and convenient data transmission.

[0051] In the technical solution of this embodiment (not shown in the figure), in a third aspect, this application provides a keyboard manufacturing method, wherein the keyboard is the keyboard described above, and the keyboard manufacturing method includes the following steps:

[0052] S10, the keycap fitting part 21 and the gap fitting part 22 are made on the top waterproof layer 20 by hot pressing; specifically, the top waterproof layer 20 with the keycap fitting part 21 and the gap fitting part 22 is processed by hot pressing of flexible material, and after processing, an adhesive is applied to the gap fitting part 22.

[0053] S20, the top waterproof layer 20 is bonded to the first support structure 31 by hot pressing; specifically, the support frame 312 of the first support structure 31 is aligned with and bonded to the gap fitting part 22, and the adhesive on the gap fitting part 22 is bonded tightly by hot pressing.

[0054] S30, the top waterproof layer 20 and the second support structure 32 are bonded together by hot pressing; specifically, a buffer structure 33 is provided between the top waterproof layer 20 processed in step S20 and the second support structure 32, so that the first support structure 31 is located in the first limiting part 331 of the buffer structure 33, the decorative panel 41 is installed into the second limiting part 332, and finally the second support structure 32 and the top waterproof layer 20 are bonded together by hot pressing.

[0055] S40, the top waterproof layer 20 and the bottom waterproof layer 50 are bonded together by hot pressing; specifically, the bottom waterproof layer 50 and the top waterproof layer 20 completely wrap the keyboard module 10 and are bonded together by hot pressing.

[0056] S50, cut off the top waterproof layer 20 and the bottom waterproof layer 50 to form the finished keyboard.

[0057] In the technical solution of this embodiment (not shown in the figure), after the top waterproof layer 20 and the first support structure 31 are bonded together by hot pressing, the keyboard manufacturing method further includes:

[0058] S21, the decorative panel 41 and the touch portion 23 of the top waterproof layer 20 are connected together using adhesive; specifically, the decorative panel 41 and the touch portion 23 of the top waterproof layer 20 are bonded together with glue. This arrangement allows the touch portion 23 to be combined with the decorative panel 41, and the decorative panel 41 supports the touch portion 23, allowing the side of the touch portion 23 away from the decorative panel 41 to better adhere to the touch motherboard 42. It should be noted that after the decorative panel 41 is assembled, the buffer structure 33 and the top waterproof layer 20 are combined into one unit by hot pressing to facilitate the installation of subsequent structures.

[0059] S22, the keyboard module 10 and the second support structure 32 are assembled together by heat fusion; it should be noted that before the heat fusion process of the keyboard module 10 and the second support structure 32, the touch motherboard 42 and the mounting bracket 324 of the second support structure 32 are combined; this setting makes the touch motherboard 42 and the mounting bracket 324 integrated into one unit, and the structure is more compact.

[0060] S23, the touch motherboard 42 and the second support structure 32 are assembled together by heat fusion. Further, the touch motherboard 42 needs to be electrically connected to the keyboard body 12, which can be done via wires. The main control module is placed on the keyboard body 12, improving the keyboard's integration and reducing its thickness. It should be noted that the electrical connection between the touch motherboard 42 and the keyboard body 12 can be performed after the touch motherboard 42 and the second support structure 32 have been heat-fused. This process reduces the design precision required between the touch motherboard 42 and the keyboard body 12. Alternatively, the touch motherboard 42 and the keyboard body 12 can be electrically connected beforehand. Although this increases assembly difficulty, the wiring can be covered and fixed by heat fusion, avoiding the risk of exposed wiring.

[0061] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0062] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A keyboard, characterized in that, include: The keyboard module (10) includes multiple keycaps (11) and a keyboard body (12). A top waterproof layer (20) includes a keycap fitting part (21) and a gap fitting part (22), wherein the keycap fitting part (21) is fitted to each of the keycaps (11); The support component (30) includes a first support structure (31), the first support structure (31) and the gap fitting part (22) are both mesh structures, the first support structure (31) and the gap fitting part (22) are bonded together, the first support structure (31) and the gap fitting part (22) are both disposed in the gap between adjacent keycaps (11), and the top waterproof layer (20) and the first support structure (31) are both integrally formed structures; The support component (30) further includes a second support structure (32), which is disposed between the first support structure (31) and the keyboard body (12). The second support structure (32) is attached to the keyboard body (12), and the keycap (11) can pass through the second support structure (32) and be attached to the keycap fitting part (21). The top waterproof layer (20) is made of a flexible material, and the first support structure (31) is made of a rigid material. The rigid first support structure (31) supports the flexible top waterproof layer (20).

2. The keyboard according to claim 1, characterized in that, The second support structure (32) includes a first receiving part (321), which is a mesh. The first receiving part (321) forms a plurality of first through holes (322). Each keycap (11) is provided in a one-to-one correspondence with each of the first through holes (322). Each keycap (11) passes through the first receiving part (321) and is attached to the keycap fitting part (21).

3. The keyboard according to claim 2, characterized in that, A fitting gap is provided between the first support structure (31) and the first receiving part (321), and the height of the fitting gap is H, 0.15mm≤H≤0.5mm.

4. The keyboard according to claim 1, characterized in that, The support component (30) further includes a buffer structure (33), which is disposed between the top waterproof layer (20) and the second support structure (32). The buffer structure (33) includes a first limiting part (331), which can surround the first support structure (31). The buffer structure (33) is in contact with the second support structure (32).

5. The keyboard according to claim 4, characterized in that, The keyboard also includes a touch module (40), and the second support structure (32) also includes a second receiving portion (323). The touch module (40) is disposed in the second receiving portion (323). The buffer structure (33) also includes a second limiting portion (332). The touch module (40) can partially pass through the second limiting portion (332) and be connected to the top waterproof layer (20). The top waterproof layer (20) is provided with a touch portion (23) corresponding to the position of the touch module (40).

6. The keyboard according to claim 5, characterized in that, The touch module (40) includes a connected decorative panel (41) and a touch motherboard (42). The second support structure (32) also includes a mounting bracket (324). The mounting bracket (324) is disposed in the second receiving portion (323). The decorative panel (41) is disposed on the touch portion (23). The touch motherboard (42) is fixedly connected to the mounting bracket (324). The touch motherboard (42) is in contact with the side of the touch portion (23) away from the decorative panel (41). The touch motherboard (42) is electrically connected to the keyboard body (12).

7. The keyboard according to any one of claims 1 to 6, characterized in that, The keyboard also includes a bottom waterproof layer (50) that wraps around the keyboard module (10). The bottom waterproof layer (50) is attached to the top waterproof layer (20). The bottom waterproof layer (50) is made of waterproof leather, textile or nano-fabric material. The first support structure (31) is made of PC, PET, PI, LCP or FR4 material.

8. An electronic device, characterized in that, The electronic device includes a keyboard and a device body, wherein the keyboard is the keyboard according to any one of claims 1 to 7, and the keyboard is signal-connected to the device body.

9. A method for manufacturing a keyboard, characterized in that, The keyboard manufacturing method is used to manufacture a keyboard as described in any one of claims 1 to 7, and the keyboard manufacturing method includes the following steps: S10 The keycap fitting part (21) and the gap fitting part (22) are made on the top waterproof layer (20) by hot pressing. S20 The top waterproof layer (20) is bonded to the first support structure (31) by hot pressing; S30 The top waterproof layer (20) and the second support structure (32) are bonded together by hot pressing; S40 The top waterproof layer (20) and the bottom waterproof layer (50) are bonded together by hot pressing; S50 Cut the top waterproof layer (20) and the bottom waterproof layer (50) to form the finished keyboard.

10. The keyboard manufacturing method according to claim 9, characterized in that, After the top waterproof layer (20) and the first support structure (31) are bonded together by hot pressing, the keyboard manufacturing method further includes: S21 bond the decorative panel (41) to the touch portion (23) of the top waterproof layer (20); S22 The keyboard module (10) and the second support structure (32) are assembled together by heat fusion; S23 assembles the touch motherboard (42) and the second support structure (32) together by heat fusion.

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