A processing method for punching a circuit board

Abstract

The application discloses a processing method for punching a circuit board, which is used for punching at least one punching area of the circuit board and comprises the following steps: S1, selecting or drilling at least two positioning holes on the circuit board to be processed; S2, positioning the circuit board on a punching platform according to the positions of the positioning holes; S3, clamping and fixing the circuit board; and S4, controlling a cutter to perform a punching action on the punching area, wherein the circuit board comprises a milled-out area and a pattern area, the punching area is located in the milled-out area, the punching area intersects with the pattern area at a punching line, and at least one copper sheet in the pattern area is flush with the punching line or extends into the punching area. Through the processing method for punching the circuit board, the pulling effect of the surface copper sheet during the processing of the outer shape of the circuit board can be fundamentally solved, the phenomenon that the copper sheet flush with the board edge is turned up and peeled off can be prevented, the yield of the production of the products can be greatly improved, and the production cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing, and more particularly to a method for punching circuit boards. Background Technology

[0002] In the field of printed circuit boards, the copper traces of most circuit board products are not allowed to be flush with the edge of the board to avoid damage to the milling cutter and copper tearing. However, some products have a design scheme where the signal line ports are flush with the edge of the board and are not allowed to be recessed. When processing the shape of such products, special attention should be paid to the above issues to prevent the circuit board from being scrapped.

[0003] There are several methods for processing the shape of such products. Method one is drilling, which involves drilling to ensure the copper foil is flush with the board edge. However, this method has drawbacks such as drilling deviation and the copper foil being pulled during drilling, posing a significant risk of scrapping. Method two is the traditional method of milling the shape directly with a milling cutter. However, this also presents the problem of pulling on the copper foil when the milling cutter reaches the copper foil along the edge. Furthermore, unlike the drilling direction, the milling cutter applies lateral pulling force, increasing the risk of the copper foil peeling off the board and easily leading to board scrap. Method three is laser milling. However, when processing thicker boards, the laser energy limitation hinders effective shape processing. Increasing the laser energy can also easily char and carbonize the circuit board, causing quality problems.

[0004] Therefore, it is essential to design a circuit board processing method to address the above issues and solve the problem of copper foil peeling off the board edges during the surface processing. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a circuit board punching processing method. Its main purpose is to solve the problem of copper foil peeling off during the outer processing of circuit board edges when the copper foil is flush with the edge of the circuit board, thereby improving the quality and yield of such products with flush copper foil edges, reducing the risk of scrap and production costs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] This application provides a method for punching a circuit board, used to punch at least one punching area of ​​the circuit board, the method including the following steps:

[0008] S1: Select or drill at least two positioning holes on the circuit board to be processed;

[0009] S2: Position the circuit board on the punching platform according to the position of the positioning hole;

[0010] S3: Clamp and fix the circuit board;

[0011] S4: Control the cutting tool to perform a punching action on the punching area, wherein the circuit board includes a milled area and a graphic area, the punching area is located in the milled area, the punching area intersects with the graphic area at a punching line, and there is at least one copper foil in the graphic area that is flush with the punching line or extends into the punching area.

[0012] In some embodiments, in step S4, the cutting tool is controlled to perform linear impact cutting on the punching area in a direction perpendicular to the plane of the circuit board.

[0013] In some embodiments, in step S1, at least two positioning holes are selected or drilled around each of the punching areas according to the distribution of the punching areas in the circuit board. The positional relationship and number of the positioning holes around the same punching area are consistent with the positional relationship and number of the positioning pins on the punching platform.

[0014] In some embodiments, within the pattern area, the copper foil intersects the edge of the pattern area at a port alignment line, the punch line covers the port alignment line, and the length of the punch line is greater than or equal to the port alignment line.

[0015] In some embodiments, when there are multiple punching areas on the circuit board, step S5 is further included after step S4: reselect one of the punching areas and execute S2 again until the punching of all the punching areas is completed.

[0016] In some embodiments, step S6 is also included: after the punching operation is completed, the port alignment line at the edge of the graphic area is inspected. If the inspection fails, the process is returned to step S1 or step S2 for re-punching, or the work is scrapped. If the inspection passes, the process is transferred to the next process.

[0017] In some embodiments, the next step is shape processing, which involves milling away other milling waste material outside the punching area of ​​the milled area.

[0018] In some embodiments, the length of the punching line is 5 to 10 mm, and the punching line is at least 0.05 mm longer on each side than the intersection length of the copper sheet and the punching line.

[0019] In some embodiments, the thicker the circuit board material, the greater the punching pressure of the cutter on the circuit board, and the lower the cutting speed of the cutter when punching the circuit board. The punching pressure ranges from 0.2 to 0.8 MPa, and the cutting speed ranges from 10 to 100 mm / s.

[0020] Compared with the prior art, the present invention has at least the following beneficial effects:

[0021] This application provides a circuit board punching processing method that avoids cutting forces by punching, fundamentally solving the problem of pulling on the surface copper during the processing of the circuit board material shape. This prevents the copper foil flush with the board edge from peeling off and also avoids the scorching, carbonization, and blackening caused by laser processing. Furthermore, this method is simple, fast, and low-cost, and can be easily added to the circuit board production process. It can efficiently and effectively process circuit boards with copper foil flush with the board edge. This method is also convenient for circuit boards with multiple punching areas, significantly improving quality yield and reducing production costs. Attached Figure Description

[0022] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0023] Figure 1 This is a flowchart of a circuit board punching process according to one embodiment.

[0024] Figure 2 This is a front view of a circuit board during a circuit board punching process according to one embodiment. Detailed Implementation

[0025] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0027] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] The inventors discovered that, currently in the circuit board industry, when the copper foil is flush with the edge of the circuit board, it is generally necessary to modify the customer's design so that the copper foil is not flush with the edge, or to produce it with a very low yield by mass production, which greatly increases the production cost. When using the equipment and methods currently used in the production process to process such products with copper foil flush with the edge of the board, the copper foil will be cut and separated, pulled and caused to flip up and fall off, resulting in product scrap or damage to the circuit board material, causing quality problems.

[0029] In view of this, refer to Figure 1 and Figure 2 This embodiment provides a method for punching circuit boards, used to punch at least one punching area 3 of the circuit board, such as... Figure 2 As shown, the circuit board includes a pattern area 2 and a milled area 1. The board material in the milled area 1 needs to be milled away as scrap. In this embodiment, the pattern area 2 of the circuit board has a copper foil 5 that is flush with the boundary of the milled area 1. At this time, this processing method is required to punch it to ensure that the flush copper foil 5 is not pulled up. Figure 2 There are 5 copper sheets 5 in total, which are linear copper sheets 5. Their ends are flush with the milled area 1. They need to be punched using this method to ensure the quality of the finished product. In this embodiment, refer to Figure 1 The specific process is as follows: S1: Select or drill at least two positioning holes 4 on the circuit board to be processed. The positioning holes 4 are drilled through drilling or punching processes and are used to position and fix the circuit board under this punching method, so that the punching process can accurately punch to the punching area 3. In special cases, such as when there is not enough space on the edge of the circuit board, holes from other processes already existing in the circuit board can also be used for positioning. At least two positioning holes 4 are required. When only one positioning hole 4 is used, the circuit board cannot be locked in position. S2: Position the circuit board on the punching platform according to the position of the positioning holes 4. The relative positions between the positioning holes 4 are fixed, and the relative positions between the positioning holes 4 and the punching area 3 are also fixed. The circuit board can be positioned on the punching platform through this fixed relative position. S3: Clamp and fix the circuit board. After positioning the circuit board, this step is necessary to fix the circuit board to prevent vibration, misalignment, etc. during the punching process, which would lead to punching misalignment and scrap. S4: Control the tool to perform a punching action on the punching area 3. The punching area 3 is located in the milling area 1 to prevent punching into the graphic area 2. The punching area 3 and the graphic area 2 intersect at the punching line. There is at least one copper sheet 5 in the graphic area 2 that is flush with the punching line or extends into the punching area 3. The scope of the punching area 3 is defined as the copper sheet 5 that exists in the graphic area 2 and intersects with the milling area 1. Punching the area can largely avoid the problem of pulling on the copper sheet 5 caused by direct forming milling.

[0030] Preferably, in step S4, the cutting tool is controlled to perform linear impact cutting on the punching area 3 in a direction perpendicular to the plane of the circuit board. The edge of the circuit board should avoid sharp angles. Except for special purpose circuit boards such as gold finger boards, the punching surface should be vertical and neat to prevent the reduction of the structural strength of the circuit board or the occurrence of sharp corners that may cause injury, so as to meet the quality requirements.

[0031] Preferably, in step S1, at least two positioning holes 4 need to be selected or drilled around each of the punching areas 3 according to the distribution of the punching areas 3 in the circuit board. For a circuit board containing multiple punching areas 3, in this embodiment, positioning holes 4 need to be set for each punching area 3 for multiple punching positioning. The positional relationship and number of positioning holes 4 around the same punching area 3 are consistent with the positional relationship and number of positioning pins on the punching platform, ensuring that the relative position of the positioning holes 4 in each area is consistent with the punching area 3 in that area, so that the position of the positioning pin is fixed when punching different positions. After punching one punching area 3, the circuit board can be removed and the positioning hole 4 corresponding to another punching area 3 can be put on the positioning pin to achieve positioning.

[0032] Preferably, within the pattern area 2, the copper foil 5 intersects the edge of the pattern area 2 at the port alignment line, the punching line covers the port alignment line, and the length of the punching line is greater than or equal to the port alignment line. In this way, all the copper foil 5 on the pattern area 2 that intersects with the milled area 1 on the circuit board can be punched, preventing omissions.

[0033] Preferably, in this embodiment, when there are multiple punching areas 3 on the circuit board, step S5 is included after step S4: select a new punching area 3 and execute S2 again until all punching areas 3 are punched. Normally, a circuit board contains multiple identical sub-boards to increase the utilization rate of the circuit board material. Sub-boards usually have the same areas that need to be punched at the same position. A large circuit board often has multiple such punching areas 3. Through such cyclic operation, multiple operations can be performed on a circuit board to complete the punching of all punching areas 3 on the circuit board.

[0034] Preferred, such as Figure 1Following step S5, step S6 is also included. Step S6 involves inspecting the port alignment line at the edge of the graphic area 2 after the punching operation is completed. If the inspection fails, the process returns to step S1 or S2 for re-punching, or the board is scrapped. If the inspection passes, the process proceeds to the next process. If the punching quality is unqualified, such as incomplete punching, the process needs to be returned for rework and re-punching. If rework is not possible, the circuit board may be damaged. For example, if the tool punches into the graphic area 2 during punching, irreversible damage has been caused to the circuit board material to be shipped, and it generally needs to be scrapped. If the inspection quality passes, the process proceeds to the next process. For circuit boards with multiple punching areas 3, all punching areas 3 need to be inspected. If damage is found, the damaged sub-boards of the circuit board need to be scrapped, while the sub-boards corresponding to the punching areas without problems can proceed to the next process normally without scrapping, thus reducing production costs.

[0035] Preferred, such as Figure 1 The next process is shape processing, which involves milling away the milled waste material outside the punching area 3 in the milled area 1. Other areas besides the punching area 3 can be milled away by normal forming processes without much punching. The combination of punching and shape processing processes can better achieve the shape processing of this type of circuit board, greatly improve the production quality and yield, and reduce production costs.

[0036] Preferably, in this embodiment, the length of the punching line is 5 to 10 mm. This range is within the normal size range of cutting tools, and this range basically covers different types of boards in actual operation with good punching effect. In actual production, it is rare or even non-existent for the punching line to exceed 10 mm. The intersection length of the punching line and the copper sheet 5 is at least 0.05 mm longer on one side. Considering the alignment accuracy issue, the machine may have alignment deviations, so a 0.05 mm margin is left on one side to prevent the punching from damaging the circuit board.

[0037] Preferably, the thicker the circuit board material, the lower the cutting speed of the cutter when punching the circuit board. For thicker materials, a greater punching pressure needs to be applied to the circuit board to achieve better punching. Under the same maximum cylinder power, the cutting speed of the cutter needs to be reduced to obtain greater torque in order to obtain greater punching force. The specific reference formula for punching force is P = kltΓ, where k is a coefficient, generally about equal to 1, l is the perimeter of the stamped product in mm, t is the material thickness in mm, and Γ is the shear strength of the material in MPa. The specific performance parameters of the punching cylinder are mainly based on the actual production equipment. In actual production, the punching pressure range is generally between 0.2 and 0.8 MPa, depending on the power performance of the equipped punching equipment and the different thicknesses and strengths of the circuit board material. In order to achieve different torques, the cutting speed range is generally 10 to 100 mm / s.

[0038] The above embodiments illustrate only one implementation of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for punching circuit boards, used to punch at least one punching area of ​​a circuit board, characterized in that, The method includes the following steps: S1: Select or drill at least two positioning holes on the circuit board to be processed; S2: Position the circuit board on the punching platform according to the position of the positioning hole; S3: Clamp and fix the circuit board; S4: Control the cutting tool to perform a punching action on the punching area, wherein the circuit board includes a milled area and a graphic area, the punching area is located in the milled area, the punching area intersects with the graphic area at a punching line, and there is at least one copper foil in the graphic area that is flush with the punching line or extends into the punching area; then proceed to the next process, the next process is shape processing, the shape processing is to mill away the milled waste material outside the punching area of ​​the milled area.

2. The circuit board punching processing method as described in claim 1, characterized in that, In step S4, the cutting tool is controlled to perform linear impact cutting on the punching area in a direction perpendicular to the plane of the circuit board.

3. The circuit board punching processing method as described in claim 2, characterized in that, In step S1, based on the distribution of the punching areas in the circuit board, at least two positioning holes are selected or drilled around each punching area. The positional relationship and number of the positioning holes around the same punching area are consistent with the positional relationship and number of the positioning pins on the punching platform.

4. The circuit board punching processing method as described in claim 3, characterized in that, Within the graphic area, the copper foil intersects the edge of the graphic area at the port alignment line, the punching line covers the port alignment line, and the length of the punching line is greater than or equal to the port alignment line.

5. The circuit board punching processing method as described in claim 4, characterized in that, When there are multiple punching areas on the circuit board, step S5 is included after step S4: select a new punching area and execute S2 again until the punching of all punching areas is completed.

6. The circuit board punching processing method as described in claim 5, characterized in that, It also includes step S6: After the punching operation is completed, the port alignment line at the edge of the graphic area is inspected. If the inspection fails, the process is returned to step S1 or step S2 for re-punching, or the work is scrapped. If the inspection passes, the process is transferred to the next process.

7. The circuit board punching processing method as described in claim 6, characterized in that, The length of the punching line is 5 to 10 mm, and the punching line is at least 0.05 mm longer on each side than the intersection length of the copper sheet and the punching line.

8. The circuit board punching processing method as described in claim 7, characterized in that, The thicker the circuit board material, the greater the punching pressure of the cutter on the circuit board, and the lower the cutting speed of the cutter when punching the circuit board. The punching pressure ranges from 0.2 to 0.8 MPa, and the cutting speed ranges from 10 to 100 mm / s.

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