Heat conduction module and electronic device

Abstract

The present invention discloses a heat conduction module and an electronic device. The heat conduction module is suitable for use with a first heat sink and a second heat sink. The heat conduction module includes a heat conduction member and two first magnetic members, each disposed at opposite ends of the heat conduction member. The first magnetic members are magnetically attracted to the first heat sink and the second heat sink, respectively, to conduct heat from the first heat sink to the second heat sink via the heat conduction member.

Description

Technical Field

[0001] The present disclosure relates to a heat conduction module, and more particularly to a heat conduction module and an electronic device capable of conducting waste heat from a hot area to a cool area. Background Art

[0002] High-speed computing demands inevitably lead to the generation of more waste heat during electronic device operation. Therefore, heat dissipation has become an essential function for these devices. This is especially true for high-power components, as the significant increase in waste heat generated during operation causes the temperature of electronic products to rise rapidly. When electronic products are exposed to excessive temperatures, they can cause permanent damage to components or devices, or significantly shorten their lifespan.

[0003] During the design process of electronic devices, the product's appearance and shape often limit the space within which internal components fit, causing waste heat to tend to one side of the device. In such cases, designers typically want to direct waste heat from a hotter area (hot zone) to a cooler area (cool zone) to improve overall heat dissipation efficiency. However, this approach is often hindered by spatial constraints.

[0004] A traditional solution is to use screws or adhesives to secure heat-conducting structures to channel waste heat from hot areas to cool areas. However, due to the limited location of screws, using screws often squeezes components or structures, damaging their properties. Using adhesives for fixation may prevent rework and pose a risk of peeling. Summary of the Invention

[0005] In view of the above-mentioned problems, the present disclosure aims to provide a heat conduction module and an electronic device including the same. In addition to quickly directing waste heat generated by the electronic device from a hot zone to a cool zone, thereby improving overall heat dissipation efficiency, the module also solves the problems caused by conventional methods of fixing heat conduction structures using locking or gluing methods.

[0006] This disclosure provides a heat conduction module for use with a first heat sink and a second heat sink. The heat conduction module includes a heat conduction member and two first magnetic members, each disposed at opposite ends of the heat conduction member. The two first magnetic members are magnetically attracted to the first heat sink and the second heat sink, respectively, to conduct heat from the first heat sink to the second heat sink via the heat conduction member.

[0007] The present disclosure also provides an electronic device comprising a housing, a first electronic component, a second electronic component, a first heat sink, a second heat sink, and a heat conduction module. The first electronic component, the second electronic component, the first heat sink, and the second heat sink are all disposed within the housing, the first heat sink being connected to the first electronic component, and the second heat sink being connected to the second electronic component. The heat conduction module is disposed within the housing and comprises a heat conduction member and two first magnetic members, the two first magnetic members being disposed at opposite ends of the heat conduction member, and the two first magnetic members being magnetically attracted to the first heat sink and the second heat sink, respectively, to conduct heat from the first heat sink to the second heat sink via the heat conduction member.

[0008] In one embodiment, the material of the heat conducting element includes metal, graphite sheet, graphene microsheet, carbon nanotube, rare earth metal or a combination thereof.

[0009] In one embodiment, the heat conducting element is flexible.

[0010] In one embodiment, the heat conduction module further includes two second magnetic members, which are respectively disposed on the first heat dissipation member and the second heat dissipation member and correspond to the two first magnetic members.

[0011] In one embodiment, the heat conduction module is more suitable for use with a third heat sink. The heat conduction module further includes a third magnetic component disposed on the heat conduction component and located between the two first magnetic components. The third magnetic component is magnetically attracted to the third heat sink.

[0012] In one embodiment, the heat conduction module further includes a fourth magnetic component, which is disposed on the third heat dissipation component and corresponds to the third magnetic component.

[0013] In one embodiment, the electronic device further includes a first circuit board and a second circuit board, which are disposed in the housing and arranged at intervals along the normal direction of the surface of the first circuit board. The first electronic component is disposed on the first circuit board, and the second electronic component is disposed on the second circuit board.

[0014] In one embodiment, the electronic device further includes a cover unit movably disposed on the housing; wherein the heat conduction module further includes a third magnetic member disposed on the heat conduction member and located between the two first magnetic members, and magnetically attracted to the cover unit.

[0015] In one embodiment, the cover unit includes a third heat dissipation element, which is connected to the heat conduction element to conduct heat from the heat conduction element to the cover unit.

[0016] In one embodiment, the heat conduction module further includes a fourth magnetic component, which is disposed on the third heat dissipation component and corresponds to the third magnetic component.

[0017] As mentioned above, in the heat conduction module and electronic device disclosed in the present invention, two first magnetic parts are respectively provided at opposite ends of the heat conduction part, and the two first magnetic parts are respectively magnetically attracted to the first heat sink and the second heat sink, so as to transfer the heat of the first heat sink to the second heat sink through the heat conduction part. The structural design makes the present invention have the following advantages: 1. The space required for fixing the heat conduction structure is reduced by magnetic attraction, solving the problem that the waste heat cannot be transferred from the hot area to the cool area due to the internal space limitation of the electronic device. 2. The heat conduction structure is connected by magnetic attraction to transfer waste heat, so it can be reused many times and easy to rework. 3. Compared with the traditional method of fixing the heat conduction structure by gluing, the fixation of the present invention by magnetic attraction is better, which can avoid the risk of bridging and falling. 4. The traditional method of fixing the heat conduction structure by locking screws is easy to squeeze the electronic components and destroy their characteristics. In addition to achieving the purpose of heat transfer, the electronic device disclosed in the present invention can also avoid the problem of component squeezing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A FIG. 1 is a schematic top view of an electronic device according to an embodiment of the present disclosure.

[0019] Figure 1B for Figure 1A A schematic three-dimensional cross-sectional view of an electronic device.

[0020] Figures 1C to 1F They are Figure 1A An enlarged schematic diagram of region A in different embodiments of the electronic device.

[0021] Figures 2A to 2C are schematic diagrams of an electronic device according to another embodiment of the present disclosure.

[0022] Figure 2D FIG. 4 is a schematic diagram of an electronic device according to another embodiment of the present disclosure.

[0023] The reference numerals are as follows:

[0024] 1,1a,1b: Electronic devices

[0025] 11: Shell

[0026] 111: Slide rail

[0027] 12: Circuit Board

[0028] 12a: First circuit board

[0029] 12b: Second circuit board

[0030] 13a: First electronic component

[0031] 13b: Second electronic component

[0032] 14a: first heat sink

[0033] 141a,142a: concave part

[0034] 14b: Second heat sink

[0035] 15: Heat conduction module

[0036] 151: Heat conduction parts

[0037] 152a, 152b: first magnetic member

[0038] 153a: Second magnetic member

[0039] 16: Support

[0040] 17: Cover unit

[0041] 171:convex part

[0042] 172: Third heat sink

[0043] 18: The third magnetic part

[0044] 19: The fourth magnetic piece

[0045] A: Area

[0046] E1, E2: End

[0047] Pa, Pb: Thermal paste DETAILED DESCRIPTION

[0048] The following will refer to the relevant drawings to illustrate some embodiments of the present disclosure, wherein the same components will be described with the same reference symbols. The components in the following embodiments are only used to illustrate their relative relationships and do not represent the actual proportions or sizes of the components.

[0049] The heat conduction module disclosed herein can direct waste heat generated by the operation of electronic components within an electronic device from a hot zone to a cool zone, thereby improving overall heat dissipation efficiency. The electronic device may be, for example, a mobile phone, tablet, laptop computer, electronic system, or other electronic device that generates waste heat. The electronic components that generate waste heat may include, but are not limited to, batteries, control chips (such as a central control unit (CPU)), driver chips, memory (such as, but not limited to, SSDs), motherboards, graphics cards or display panels, or other components, units, or modules that generate waste heat during operation.

[0050] Figure 1A FIG1 is a schematic top view of an electronic device according to an embodiment of the present disclosure. Figure 1B for Figure 1A A schematic perspective cross-sectional view of an electronic device, and Figures 1C to 1F They are Figure 1A Schematic diagrams of enlarged areas A in different embodiments of the electronic device. Figure 1A and Figure 1B The electronic device 1 is a vertical electronic system with an arc surface as an example.

[0051] See also Figure 1A and Figure 1B The heat conduction module 15 of this embodiment includes a heat conduction member 151 and two first magnetic members 152 a and 152 b . The first magnetic members 152 a and 152 b are respectively disposed at opposite ends E1 and E2 of the heat conduction member 151 .

[0052] The heat conduction module 15 is adapted to cooperate with the first heat sink 14a and the second heat sink 14b. The first magnetic members 152a and 152b are magnetically attracted to the first heat sink 14a and the second heat sink 14b, respectively, to conduct heat from the first heat sink 14a to the second heat sink 14b through the heat conduction member 151.

[0053] The aforementioned heat conduction module 15, first heat sink 14a, and second heat sink 14b can be integrated into the electronic device 1. In this embodiment, in addition to the aforementioned heat conduction module 15, first heat sink 14a, and second heat sink 14b, the electronic device 1 may also include a housing 11, a first electronic component 13a, and a second electronic component 13b. Furthermore, the electronic device 1 of this embodiment may also include a first circuit board 12a, a second circuit board 12b, and a support member 16.

[0054] The housing 11 is arc-shaped and may be made of metal or plastic. A first circuit board 12a, a second circuit board 12b, a first electronic component 13a, a second electronic component 13b, a first heat sink 14a, a second heat sink 14b, a heat conduction module 15, and a support member 16 are all disposed within the housing 11. The first circuit board 12a and the second circuit board 12b may be spaced apart and arranged along a direction perpendicular to the surface normal of the first circuit board 12a. The first electronic component 13a and the second electronic component 13b may be, for example, chips and are disposed on the first circuit board 12a and the second circuit board 12b, respectively. Furthermore, the first heat sink 14a is connected to the first electronic component 13a to quickly dissipate waste heat generated during operation of the first electronic component 13a. The second heat sink 14b is connected to the second electronic component 13b to quickly dissipate waste heat generated during operation of the second electronic component 13b.

[0055] In this embodiment, the first and second circuit boards 12a, 12b are, for example but not limited to, printed circuit boards (PCBs). They are disposed on opposite sides of a support member 16. The two first electronic components 13a are disposed on the surface of the first circuit board 12a facing away from the support member 16 and are connected to the first heat sink 14a via, for example, thermal paste Pa. The second electronic component 13b is disposed on the surface of the second circuit board 12b facing away from the support member 16 and is connected to the second heat sink 14b via, for example, thermal paste Pb. During operation, the first and second electronic components 13a, 13b generate waste heat, which is transferred to the first and second heat sinks 14a, 14b, respectively, via the thermal paste Pa, Pb, thereby reducing the temperatures of the first and second electronic components 13a, 13b. In this embodiment, the first and second heat sinks 14a, 14b are, for example but not limited to, heat sinks with heat dissipation fins. However, this is not a limitation. In various embodiments, the first and second heat sinks 14a, 14b may also be thermally conductive films or heat dissipation films, which are not limited to this disclosure.

[0056] In this embodiment, the area where the first electronic component 13a and the first heat sink 14a are located may be, for example, a hot zone with a higher temperature, and the area where the second electronic component 13b and the second heat sink 14b are located may be, for example, a cool zone with a lower temperature. Therefore, the heat from the hot zone can be conducted to the cool zone through the heat conduction module 15, thereby balancing the waste heat generated during the operation of the electronic device 1 and improving the overall heat dissipation efficiency.

[0057] The heat conducting element 151 can be made of a material with a high thermal conductivity, such as, but not limited to, metal, graphite sheet, graphene microsheet, carbon nanotube, rare earth metal, or a combination thereof. In some embodiments, the metal can be, for example, but not limited to, copper, aluminum, copper alloy (alloys of copper and other metals), aluminum alloy (alloys of aluminum and other metals), or a combination thereof, and can be made into a metal sheet, metal foil, or metal film. In some embodiments, the heat conducting element 151 can also be a thermally conductive film or heat dissipation film made of graphite sheet, graphene microsheet, carbon nanotube, or a combination thereof. Alternatively, the heat conducting element 151 can be a combination of a thermally conductive metal and a thermally conductive film (or heat dissipation film), such as a laminated structure of aluminum foil and graphene layer, but this disclosure is not limiting.

[0058] In some embodiments, the graphene sheet may be artificial graphite or natural graphite; the sheet diameter (D 50) can be, for example, between 1 micron (μm) and 30 μm, and its thickness can be, for example, between 1 nanometer (nm) and 70 nm; and the diameter of single-walled or multi-walled carbon nanotubes can be, for example, between 5 nm and 30 nm, and its length can be, for example, between 5 μm and 30 μm. Furthermore, the first magnetic members 152a and 152b can be thin, strong magnets, and their position and size can be adjusted based on the shape of the first and second heat sinks 14a and 14b and the desired overlap location.

[0059] To direct waste heat from the hot zone to the cool zone within a limited space, the heat conducting element 151 of this embodiment is flexible (flexible). Its shape and length are designed to accommodate the limited space within the housing 11. Through this bridging connection, the opposing ends E1 and E2 of the heat conducting element 151 are magnetically attracted to the first heat sink 14a and the second heat sink 14b, respectively, via first magnetic elements 152a and 152b. This transfers heat from the first heat sink 14a (hot zone) to the second heat sink 14b (cool zone) via the heat conducting element 151, thereby improving overall heat dissipation efficiency. The first magnetic elements 152a and 152b can be embedded or buried within the heat conducting element 151. "Buried" means that the first magnetic members 152a and 152b are completely covered by the heat-conducting member 151 and are not exposed; while "embedded" means that the two ends E1 and E2 of the heat-conducting member 151 have grooves of substantially the same size as the first magnetic members 152a and 152b, and the first magnetic members 152a and 152b are arranged in the grooves and are not easily displaced. "Embedded" can be "partially embedded" or "completely embedded". "Partially embedded" means that when the first magnetic members 152a and 152b are embedded in the grooves of the heat-conducting member 151, a portion of the first magnetic members 152a and 152b will be exposed outside the grooves; while "completely embedded" means that when the first magnetic members 152a and 152b are embedded in the grooves, the surfaces of the first magnetic members 152a and 152b are flush with the surface of the heat-conducting member 151.

[0060] like Figure 1C As shown, the first magnetic members 152a and 152b of this embodiment are embedded in opposite ends E1 and E2 of the heat conducting member 151, respectively. Therefore, the ends E1 and E2 are thicker than the middle portion of the heat conducting member 151. The first heat sink 14a and the second heat sink 14b can be made of a magnetically attractive metal material (e.g., iron, cobalt, or nickel). This allows the ends E1 and E2 of the heat conducting member 151 to be attracted to and fixed to the surfaces of the first and second heat sinks 14a and 14b, respectively, allowing waste heat to be transferred from the first heat sink 14a to the second heat sink 14b via the heat conducting member 151.

[0061] In addition, if Figure 1DAs shown, if the heat conduction module 15 needs to strengthen its overlapping position and prevent displacement, the first heat dissipation member 14a and the second heat dissipation member 14b can be milled internally so that the first heat dissipation member 14a and the second heat dissipation member 14b respectively have a concave portion 141a, 141b ( Figure 1D Only the recess 141 a is shown. The ends E1 and E2 of the heat conducting member 151 can be correspondingly embedded in the recesses 141 a and 141 b, so that the heat conducting module 15 is not easily displaced.

[0062] In some embodiments, the first magnetic members 152a and 152b may be respectively adhered to the opposite ends E1 and E2 of the heat conducting member 151 by adhesive, so that the first magnetic members 152a and 152b may be located on the surface of the heat conducting member 151 facing or away from the first heat dissipating member 14a and the second heat dissipating member 14b. Figure 1E As shown, this embodiment takes the first magnetic members 152a and 152b as an example of being respectively adhered to the surfaces of the heat conducting member 151 away from the first heat dissipating member 14a and the second heat dissipating member 14b (the adhesive material for the adherence is not shown).

[0063] In some embodiments, if the first heat sink 14a and the second heat sink 14b are made of non-magnetic materials (such as aluminum, copper, silver, or gold), a magnetic element may be added to each of the first heat sink 14a and the second heat sink 14b to magnetically attract the first magnetic elements 152a and 152b. Figure 1F As shown, this embodiment uses the second magnetic member 153a embedded in the recess 142a of the first heat sink 14a, so that the first magnetic member 152a and the second magnetic member 153a are magnetically attracted to each other. Of course, in different embodiments, the second magnetic member 153a can also be adhered to the surface of the first heat sink 14a.

[0064] Continuing from the above, in the electronic device 1 of this embodiment, two first magnetic members 152a and 152b are respectively disposed at opposite ends E1 and E2 of the heat-conducting member 151. These opposite ends E1 and E2 of the heat-conducting member 151 can be magnetically attracted to the first heat sink 14a and the second heat sink 14b via the first magnetic members 152a and 152b, respectively. This structural design transfers heat from the first heat sink 14a to the second heat sink 14b via the heat-conducting member 151. This structural design provides the electronic device 1 of this embodiment with the following advantages: 1. Magnetic attachment reduces the space required to secure the heat-conducting structure, resolving the issue of insufficient internal space within the electronic device 1 to transfer waste heat from a hot zone to a cool zone. 2. Magnetic attachment allows for multiple reuse and eases rework by connecting the heat-conducting structure. 3. Compared to conventional adhesive attachment methods for securing the heat-conducting structure, the magnetic attachment method of this embodiment provides better securement, preventing the risk of bridging and falling. 4. The conventional method of fixing the heat conduction structure with screws can easily squeeze the electronic components and damage their properties. The electronic device 1 of this embodiment can not only achieve the purpose of heat transfer, but also avoid the problem of component squeezing.

[0065] Please refer to Figures 2A to 2C , which are schematic diagrams of an electronic device according to another embodiment of the present disclosure. Figure 2B for Figure 2A A schematic diagram of an electronic device with a cover unit closed. Figure 2C for Figure 2A Schematic diagram of a cover unit of an electronic device partially opened.

[0066] The electronic device 1a of this embodiment is substantially similar to the electronic device 1 of the previous embodiment in terms of component composition and connection relationships. It also includes a housing 11, a first electronic component 13a, a second electronic component 13b, a first heat sink 14a, a second heat sink 14b, a heat conduction module 15, and a support member 16. The primary difference from electronic device 1 is that the electronic device 1a of this embodiment is a sliding-type electronic device comprising a three-layered circuit board 12 supported by a support member 16. The first electronic component 13a and the second electronic component 13b are disposed on the same side (top surface) of the circuit board 12 closest to the heat conduction module 15. Furthermore, the first and second heat sinks 14a, 14b of this embodiment may be, for example, thermally conductive metal sheets, thermally conductive films, or a combination thereof, and are disposed on the same side of the circuit board 12 (and the support member 16). Here, the first electronic component 13a is connected to the first heat sink 14a via thermal paste Pa, and the second electronic component 13b is connected to the second heat sink 14b via thermal paste Pb. Opposite ends E1 and E2 of the heat conduction member 151 are magnetically attracted to the first and second heat sinks 14a and 14b, respectively, via first magnetic members 152a and 152b. This conducts heat from the first heat sink 14a (hot zone) to the second heat sink 14b (cool zone) via the heat conduction member 151, thereby equalizing the temperatures of the first and second electronic components 13a and 13b. The heat conduction module 15 of this embodiment is shaped like an arched bridge, with a raised center portion connected to a third heat sink 172. Ends E1 and E2 are connected to the first and second heat sinks 14a and 14b, respectively. Similar to the electronic device 1, the first magnetic members 152a and 152b of this embodiment are embedded in the ends E1 and E2 of the heat conduction member 151, respectively. In addition, similar to the electronic device 1, the heat conduction module 15 may also include two second magnetic components (not shown), which are respectively disposed on the first heat dissipation component 14a and the second heat dissipation component 14b, and the arrangement positions of each second magnetic component on the first heat dissipation component 14a and the second heat dissipation component 14b correspond to each first magnetic component 152a, 152b.

[0067] The electronic device 1a of this embodiment further includes a cover unit 17. The cover unit 17 is movably disposed on the housing 11, and the cover unit 17 can slide back and forth relative to the housing 11, thereby covering the housing 11 ( Figure 2B ); or the cover unit 17 is in an open state relative to the housing 11 ( Figure 2C Here, the cover unit 17 has a protrusion 171 on each side, and the housing 11 has two slide rails 111 corresponding to the two protrusions 171, so that the cover unit 17 can slide relatively on the housing 11.

[0068] In addition, the heat conduction module 15 of this embodiment may further include a third magnetic member 18. The third magnetic member 18 is disposed within the heat conduction member 151 and located between the first magnetic members 152a and 152b. The heat conduction member 151 is magnetically attracted to the cover unit 17 via the third magnetic member 18. The third magnetic member 18 may be embedded or embedded within the heat conduction member 151. In this embodiment, the third magnetic member 18 is embedded within the heat conduction member 151, and is magnetically attracted to the cover unit 17 (thus forming an arch bridge shape). Furthermore, the cover unit 17 of this embodiment includes a third heat sink 172. The third heat sink 172 (e.g., by adhesive bonding) faces the surface of the heat conduction member 151 and is connected to the heat conduction member 151. The third heat sink 172 may be, for example, but not limited to, a heat-conducting metal sheet, a heat-dissipating film, a heat-conducting film, or a combination thereof. It transfers heat from the heat conduction member 151 to the cover unit 17, thereby helping to dissipate waste heat to the outside. Therefore, the heat conduction module 15 of this embodiment can be used in conjunction with the sliding cover unit 17 to conduct the heat energy generated by the electronic components inside the electronic device 1 to the cover unit 17 via the heat conduction module 15, so as to help dissipate the waste heat to the outside through the cover unit 17, thereby improving the overall heat dissipation efficiency of the electronic device 1a. At the same time, the provision of the third magnetic member 18 can also be used to fix and align the cover unit 17 and the shell 11 when they are assembled. After the cover unit 17 and the shell 11 are assembled, the heat conduction member 151 is automatically adsorbed to the cover unit 17 by magnetic force, thereby solving the problem that the heat conduction member 151 in the shell 11 cannot be fixed after the cover unit 17 is assembled.

[0069] In some embodiments, if the cover unit 17 is made of non-magnetic material, another magnetic member can be provided on the cover unit 17 (either embedded or embedded), so that the heat conducting member 151 can be adsorbed on the cover unit 17 through the third magnetic member 18 and the magnetic member. Figure 2D As shown, the heat conduction module 15 may further include a fourth magnetic member 19 , which may be disposed inside the third heat dissipation member 172 and positioned corresponding to the third magnetic member 18 , so that the heat conduction member 151 may be adsorbed on the cover unit 17 via the third magnetic member 18 and the fourth magnetic member 19 .

[0070] In summary, in the heat conduction module and electronic device disclosed in the present invention, two first magnetic parts are respectively provided at the opposite ends of the heat conduction part, and the two first magnetic parts are respectively magnetically attracted to the first heat sink and the second heat sink, so as to transfer the heat of the first heat sink to the second heat sink through the heat conduction part. The structural design makes the present invention have the following advantages: 1. The space required for fixing the heat conduction structure is reduced by magnetic fixation, solving the problem that the waste heat cannot be transferred from the hot area to the cool area due to the internal space limitation of the electronic device. 2. The heat conduction structure is connected by magnetic attraction to transfer waste heat, so it can be reused many times and easy to rework. 3. Compared with the traditional method of fixing the heat conduction structure by gluing, the fixation of the present invention by magnetic attraction is better, which can avoid the risk of bridging and falling. 4. The traditional method of fixing the heat conduction structure by locking screws is easy to squeeze the electronic components and destroy their characteristics. In addition to achieving the purpose of heat transfer, the electronic device disclosed in the present invention can also avoid the problem of component squeezing.

[0071] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or variations that do not depart from the spirit and scope of the present invention should be included in the appended claims.

Claims

1. A heat conduction module, suitable for use with a first heat sink, a second heat sink, and a third heat sink, characterized in that: The heat transfer module includes: a heat conducting member having flexibility; Two first magnetic members are respectively disposed at opposite ends of the heat conducting member, and the two first magnetic members are respectively magnetically attracted to the first heat dissipating member and the second heat dissipating member, so as to conduct heat from the first heat dissipating member to the second heat dissipating member through the heat conducting member; and A third magnetic component is disposed on the heat conducting component and located between the two first magnetic components. The third magnetic component is magnetically attracted to the third heat dissipating component.

2. The heat conduction module according to claim 1, wherein: The material of the heat conducting element includes metal, graphite sheet, graphene microsheet, carbon nanotube, rare earth metal or a combination thereof.

3. The heat conduction module according to claim 1, wherein: Also includes: Two second magnetic components are respectively disposed on the first heat dissipation component and the second heat dissipation component and correspond to the two first magnetic components.

4. The heat conduction module according to claim 1, wherein: Also includes: A fourth magnetic component is disposed on the third heat dissipation component and corresponds to the third magnetic component.

5. An electronic device, characterized in that: include: a housing; A first electronic component, a second electronic component, a first heat sink, and a second heat sink are all disposed in the housing, the first heat sink is connected to the first electronic component, and the second heat sink is connected to the second electronic component; a cover unit movably disposed on the housing, the cover unit comprising a third heat dissipation element; as well as A heat conduction module is disposed in the housing, and the heat conduction module includes: a heat conducting member having flexibility; the third heat dissipating member is connected to the heat conducting member to conduct heat from the heat conducting member to the cover unit; Two first magnetic members are respectively disposed at two opposite ends of the heat conducting member, and the two first magnetic members are respectively magnetically attracted to the first heat dissipating member and the second heat dissipating member, so as to conduct heat from the first heat dissipating member to the second heat dissipating member through the heat conducting member; and A third magnetic component is disposed on the heat conducting component and located between the two first magnetic components, and is magnetically attracted to the cover unit.

6. The electronic device according to claim 5, wherein: The material of the heat conducting element includes metal, graphite sheet, graphene microsheet, carbon nanotube, rare earth metal or a combination thereof.

7. The electronic device according to claim 5, wherein: The heat transfer module also includes: Two second magnetic components are respectively disposed on the first heat dissipation component and the second heat dissipation component and correspond to the two first magnetic components.

8. The electronic device according to claim 5, wherein: Also includes: A first circuit board and a second circuit board are arranged in the housing and spaced apart along the normal direction of the surface of the first circuit board. The first electronic component is arranged on the first circuit board, and the second electronic component is arranged on the second circuit board.

9. The electronic device according to claim 5, wherein: The heat conduction module further includes a fourth magnetic component. The fourth magnetic component is disposed on the third heat dissipation component and corresponds to the third magnetic component.

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