Detection device, display device and display device with sensing function

Abstract

The present application relates to a detection device, a display device, and a driving method thereof, and one of the technical problems is to provide a detection device having a novel configuration and a display device incorporating the detection device. The detection device has a substrate, a detection electrode on a first surface of the substrate, a first flexible printed circuit substrate electrically connected to the detection electrode, a shielding layer on a second surface of the substrate opposite to the first surface, and at least one second flexible printed circuit substrate electrically connected to the shielding layer on the second surface, the first flexible printed circuit substrate having a first terminal on a first edge side extending outward from the substrate, the second flexible printed circuit substrate having a second terminal on a second edge side extending outward from the substrate, the first flexible printed circuit substrate and the second flexible printed circuit substrate being arranged in a lateral direction along one edge of the substrate in such a manner that at least a part of the first terminal and the second terminal overlap each other in a plan view, and the first terminal being electrically connected to the second terminal.

Description

TECHNICAL FIELD

[0001] One of the embodiments of the present application relates to a detection device, a display device, and a display device with a sensing function. BACKGROUND

[0002] As one of touch panels, a liquid crystal display device equipped with a touch detection device is known (Patent Literature 1).

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2012-212335 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] One of the embodiments of the present application provides a detection device having a novel configuration, a display device equipped with the detection device, and a driving method thereof as one of the technical problems. In addition, a detection device with excellent detection sensitivity, a display device equipped with the detection device, and a driving method thereof are provided as one of the technical problems. Furthermore, simplification of the manufacturing process of a display device equipped with a detection device is provided as one of the technical problems.

[0008] TECHNICAL SOLUTION FOR SOLVING THE PROBLEMS

[0009] One of the embodiments of the present application is a detection device. The detection device has a substrate, a detection electrode on a first face of the substrate, a first flexible printed circuit substrate electrically connected to the detection electrode, a shielding layer on a second face of the substrate opposite to the first face, and a second flexible printed circuit substrate electrically connected to the shielding layer on the second face, the first flexible printed circuit substrate has a first terminal on a first edge side extending outward from the substrate, the second flexible printed circuit substrate has a second terminal on a second edge side extending outward from the substrate, the first flexible printed circuit substrate and the second flexible printed circuit substrate are arranged in a lateral direction along one edge of the substrate in such a manner that at least a part of the first terminal and the second terminal overlap each other in a plan view, and the first terminal is electrically connected to the second terminal.

[0010] One of the embodiments of the present application is a display device. The display device has a display panel, a detection device above the display panel, and an adhesive layer between the display panel and the detection device, the detection device has a shielding layer, the detection device is electrically connected to a first flexible printed circuit substrate, the shielding layer is electrically connected to a second flexible printed circuit substrate, and the first flexible printed circuit substrate is electrically connected to the second flexible printed circuit substrate.

[0011] One of the embodiments of the present application is a display device with a sensing function. The display device includes a display panel, a display control circuit that controls the display panel, a detection device, and a sensing substrate included in the detection device and a sensing control circuit that controls the sensing substrate. The detection device includes a detection electrode and a shield layer. The detection electrode is disposed opposite the display surface of the display panel, and the shield layer is disposed between the display surface and the detection electrode. The display control circuit and the sensing control circuit are electrically connected to each other and are synchronously driven. During a display write period in which the display panel performs display, the detection electrode and the shield layer are maintained at a constant potential. During a detection period in which a detection signal is supplied to the detection electrode, the display panel stops display write, and the shield layer is oscillated in phase with the detection electrode.

[0012] One of the embodiments of the present application is a display device with a sensing function. The display device includes a display panel, a display control circuit that controls the display panel, a detection device, and a sensing control circuit that controls the detection device. The detection device includes a detection electrode and a shield layer. The detection device is disposed opposite the display surface of the display panel, and the shield layer is disposed between the display surface and the detection electrode. The sensing control circuit maintains the detection electrode and the shield layer at a constant potential during a display write period in which the display panel performs display. During a detection period in which a detection signal is supplied to the detection electrode, the display panel stops display write, and a signal in phase with the detection electrode or the same signal as the detection signal is supplied to the shield layer. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a schematic plan view of a detection device according to an embodiment of the present application.

[0014] Figure 2 is a schematic plan view of a detection device according to an embodiment of the present application.

[0015] Figure 3A is a schematic sectional view of a detection device according to an embodiment of the present application.

[0016] Figure 3B is a schematic sectional view of a detection device according to an embodiment of the present application.

[0017] Figure 4 is a schematic sectional view of a detection device according to an embodiment of the present application.

[0018] Figure 5 is a schematic bottom view of a detection device according to an embodiment of the present application.

[0019] Figure 6 is a schematic plan view of a detection device according to an embodiment of the present application.

[0020] Figure 7 is a schematic plan view of a detection device according to an embodiment of the present application.

[0021] Figure 8 is a schematic sectional view of a detection device according to an embodiment of the present application.

[0022] Figure 9 is a schematic plan view of a detection device according to an embodiment of the present application.

[0023] Figure 10 is a schematic plan view of a detection device according to an embodiment of the present application.

[0024] Figure 11 is a schematic plan view of a detection device according to an embodiment of the present application.

[0025] Figure 12 is a schematic sectional view of a detection device according to an embodiment of the present application.

[0026] Figure 13 is a schematic plan view of a detection device according to an embodiment of the present application.

[0027] Figure 14A is a schematic sectional view of a detection device according to an embodiment of the present application.

[0028] Figure 14B is a schematic sectional view of a detection device according to an embodiment of the present application.

[0029] Figure 15 is a schematic sectional view of a detection device according to an embodiment of the present application.

[0030] Figure 16 is a timing chart showing an example of operation of a display device according to an embodiment of the present application. DETAILED DESCRIPTION

[0031] Hereinafter, each embodiment of the present application will be described with reference to the drawings. The present application can be implemented in various ways without departing from the gist thereof, and is not construed as being limited to the description of the following embodiments.

[0032] In order to make the description more clear, the width, thickness, shape, and the like of each part are schematically shown in the drawings compared to the actual shape, but are only one example, and do not limit the explanation of the present application. In the present specification and each drawing, an element having the same function as that of an element described with respect to the drawing already appeared is denoted by the same reference numeral, and the repeated description is sometimes omitted.

[0033] In this specification and claims, when processing a single membrane to form multiple membranes, these multiple membranes may sometimes have different functions or roles. However, these multiple membranes originate from membranes formed as the same layer in the same process and have the same material. Therefore, these multiple membranes are defined as existing in the same layer.

[0034] In this specification and claims, when referring to a manner in which another structure is disposed on top of a structure, the use of the word "on" alone, unless otherwise specified, includes both the case of disposing of another structure directly above a structure in contact with it and the case of disposing of another structure above a structure via another structure.

[0035] In this specification and claims, the expression "a structure is exposed from another structure" means that a portion of a structure is not covered by another structure, and the portion not covered by the other structure also includes the possibility of being further covered by other structures.

[0036] <First Implementation>

[0037] 1. Overall Structure

[0038] In this embodiment, the construction of a detection device 100 according to one embodiment is described. For example... Figure 1 As shown, the detection device 100 includes: a sensing substrate 102, a plurality of detection electrodes 104 on a first surface of the sensing substrate 102, sensing wiring 106 respectively connected to the plurality of detection electrodes 104, a flexible printed circuit board (FPC) 108 electrically connected to the plurality of detection electrodes 104 via the sensing wiring 106, a shielding layer 128 disposed on a second surface of the sensing substrate 102, and an FPC substrate 110 electrically connected to the shielding layer 128. The second surface of the sensing substrate 102 is the surface opposite to the first surface having the plurality of detection electrodes 104.

[0039] The sensing substrate 102 has a sensing region 105 and a border region 113 outside the sensing region 105. A plurality of detection electrodes 104 are disposed in the sensing region 105. An FPC substrate 108 (a first flexible printed circuit board, hereinafter referred to as the first FPC substrate 108) electrically connected to the plurality of detection electrodes 104 and at least one FPC substrate 110 (a second flexible printed circuit board, hereinafter referred to as the second FPC substrate 110) electrically connected to the shielding layer 128 are disposed in the border region 113.

[0040] The first FPC substrate 108 is arranged along one side of the substrate 102, and the second FPC substrate 110 is arranged along one side of the substrate 102. At this time, the first FPC substrate 108 and the second FPC substrate 110 are arranged in lateral alignment along the same side of the substrate 102. That is, as shown in Figure 1 , in the case where the X-axis direction and the Y-axis direction are defined, the second FPC substrate 110A and the first FPC substrate 108 are arranged in alignment in the X-axis direction of one side of the substrate 102. As shown in Figure 1 , in the case where the second FPC substrate 110B is further arranged in alignment in the X-axis direction, the second FPC substrate 110A, the first FPC substrate 108, and the second FPC substrate 110B can be referred to as, for example, a first FPC substrate, a second FPC substrate, and a third FPC substrate, in that order.

[0041] In the above-described lateral alignment arrangement of the first FPC substrate 108, the second FPC substrate 110A, and the second FPC substrate 110B, the first end portion of the first FPC substrate 108 has a first overlap portion 108-1 that overlaps the end portion of the second FPC substrate 110A. The second end portion (the end portion on the side opposite the first end portion) of the first FPC substrate 108 has a second overlap portion 108-2 that overlaps the end portion of the second FPC substrate 110B. With the above-described overlap, the end portion of the second FPC substrate 110A that overlaps the first overlap portion 108-1 and the end portion of the second FPC substrate 110B that overlaps the second overlap portion 108-2 do not overlap each other in the plan view shown in Figure 1 .

[0042] The first FPC substrate 108 has a plurality of terminals 146 and a plurality of wirings 139. A wiring 139-1 of the plurality of wirings 139 is arranged on the side of the second FPC substrate 110A and / or the 108B side in the first FPC substrate 108. The wiring 139-1 is arranged on the side extending outward from the sensing substrate 102. The wiring 139-1 is used for the electrical connection of the first FPC substrate 108 to the second FPC substrate 110A and / or 110B described later. In Figure 1 , the wiring 139-1 on the second FPC substrate 110B side of the first FPC substrate 108 is not described for convenience, but the wiring 139-1 can be provided on the second FPC substrate 110B side. In addition, a wiring 139-2 of the plurality of wirings 139 is electrically connected to the sensing wiring 106 via the terminal 146.

[0043] The second FPC substrates 110A and 110B have terminals 136. The terminals 136 are arranged on the side extending outward from the sensing substrate 102. The second FPC substrates 110A and 110B are electrically connected to the shielding layer 128 via the terminals 136. In addition, the second FPC substrates 110A and 110B are also electrically connected to the first FPC substrate 108 via the terminals 136. At this time, the terminals 136 are electrically connected to the wiring 139-1.

[0044] In the first overlap portion 108-1, the second FPC substrate 110A is electrically connected to the first FPC substrate 108 as described above. In addition, in the second overlap portion 108-2, the second FPC substrate 110B is electrically connected to the first FPC substrate 108. Although not shown in detail in Figure 1 , separate wirings are provided in the first overlap portion 108-1 and the second overlap portion 108-2 of the first FPC substrate 108. The second FPC substrate 110A and the second FPC substrate 110B are electrically connected to the shielding layer 128, and thus can apply a prescribed potential to the potential shielding layer 128 via the first FPC substrate 108 and the second FPC substrates 110A and 110B. The first FPC substrate 108 has a terminal not shown in the connection portion 112. In addition, the second FPC substrate 110A also has a terminal not shown in the connection portion 112. These terminals overlap each other and are electrically connected. The electrical connection of the second FPC substrate 110B to the first FPC substrate 108 can have the same configuration as the connection portion 112.

[0045] The shielding layer 128 can be arranged so as to overlap the entire surface of the sensing region 105. At this time, the shielding layer 128 can not be provided in the entire frame region 113 of the sensing substrate 102. The frame region 113 is a region surrounding the sensing region 105 in which the plurality of detection electrodes 104 are arranged on the sensing substrate 102. At this time, as shown in Figure 1 , the plurality of detection electrodes 104 can be arranged in the X-axis direction and the Y-axis direction. The frame region 113 can be a region between the sensing substrate 102 and the sensing region 105 in which the plurality of detection electrodes 104 are arranged. The shielding layer 128 has at least the same number of sides as the sensing substrate 102. For example, in the case where the sensing substrate 102 is a quadrangle, the shielding layer 128 can have four sides. Alternatively, a structure can be employed in which the shielding layer 128 is provided so as to cover the entire surface of the second surface of the sensing substrate 102, and the shielding layer 128 is arranged so as to oppose not only the sensing region 105 but also the entire frame region 113.

[0046] With respect to the plurality of detection electrodes 104, at least one sensing wiring 106 is electrically connected to each detection electrode 104. In Figure 1 , an example of the shape of the detection electrodes 104 arranged in a row on the sensing substrate 102 and the sensing wirings 106 electrically connected thereto is shown.Figure 1 The illustrated detection device 100 has a self-contained sensor, as described above, in which the plurality of detection electrodes 104 have a configuration in which each is individually connected to the sensing wiring 106. As Figure 1 illustrated, the sensing wiring 106 is disposed so as to extend along the Y-axis direction with respect to the detection electrodes 104 arranged in the X-axis and Y-axis directions. The plurality of sensing wirings 106 are arranged between the arrangements of the plurality of detection electrodes 104 in the Y-axis direction. The plurality of sensing wirings 106 are wired so as to each connect to one of the plurality of detection electrodes 104 arranged in the Y-axis direction.

[0047] As Figure 1 illustrated, the protection wiring 109 can be provided in the frame region 113. The protection wiring 109 can be configured so as to surround the sensing region 105. The protection wiring 109 can be electrically connected to the first FPC substrate 108. Further, this protection wiring 109 can surround the periphery of the sensing region 105 except for the region between the terminals 146 of the pair of wirings 139-1 in the Figure 1 , but can also have a structure that completely surrounds the periphery including this region. In addition, a structure in which the protection wiring 109 is interrupted midway can also be employed.

[0048] In Figure 1 , an omission is made, but the detection device 100 has a cover substrate 114 on the first face of the sensing substrate 102. As described later in Figure 3A and Figure 3B , the cover substrate 114 covers the upper surface of the detection electrodes 104 as illustrated by the double-dotted line. The cover substrate 114 protects the detection electrodes 104, the sensing wiring 106, and the like structures above the sensing substrate 102. The cover substrate 114 is preferably provided so as to cover the sensing region 105 in which the detection electrodes 104 are provided, and is further preferably provided so as to cover the frame region 113.

[0049] As Figure 1As shown, the detection device 100 also has a detection circuit substrate 116. The detection circuit substrate 116 is electrically connected with the first FPC substrate 108. The detection circuit substrate 116 is connected with an external circuit such as an induction control circuit. The detection circuit substrate 116 is provided with a power supply circuit 118, a detector 120, an arithmetic element 122, an interface 124, and the like. The power supply circuit 118 converts a power supply voltage supplied from the external circuit into a pulse-shaped alternating voltage, and supplies the alternating voltage to each detection electrode 104 via the terminal 126 and the induction wiring 106. The detector 120, also referred to as an analog front end (AFE), detects a change in the capacitance of the detection electrode 104 as a potential variation, digitizes the potential variation, and converts it into a detection signal. The detection signal generated by the detector 120 is input to the arithmetic element 122, and based on the detection signal, the arithmetic element 122 generates coordinates representing the position of the input unit. The detector 120 and the arithmetic element 122 can also be configured as one integrated circuit (IC) chip. The interface 124 is used for connection with the external circuit, and is configured according to standards such as universal serial bus (USB), serial peripheral interface (SPI), and the like.

[0050] The detection circuit substrate 116 can be electrically connected with the second FPC substrate 110. The detection circuit substrate 116 is described later, but can supply a fixed potential (constant potential) such as a reference potential (GND) or a signal in phase with the signal supplied to the detection electrode 104 (active shielding described later) to the shield layer 128 via the second FPC substrate 110. In this way, the detection device 100 is controlled by the induction control circuit.

[0051] 2. Peripheral configuration

[0052] 2-1. Peripheral configuration-1

[0053] Figure 2 Indication Figure 1 A schematic view of the upper surface of the connection portion 112 shown surrounded by a broken line.

[0054] The first FPC substrate 108 has a plurality of wirings 139. For example, as shown in Figure 2 The first FPC substrate 108 can have a wiring 139-1, a wiring 139-2. Also, the first FPC substrate 108 has a terminal 146 at a position electrically connected with the induction wiring 106. The terminal 146 can be provided corresponding to a plurality of induction wirings 106, and the plurality of wirings 139 are electrically connected with the induction wiring 106 via the terminal 146. The plurality of wirings 139 are covered with a protective film 148, and the position electrically connected with the terminal 146 is exposed. The terminal 146 can be either the position exposed from the protective film 148 of the plurality of wirings 139, or a conductive adhesive or the like can be used for the electrical connection of the terminal 146 with the induction wiring 106.

[0055] As described above, the first FPC substrate 108 is electrically connected to the second FPC substrate 110A via the electrical connection of the end portion of the wire 139-1 and the terminal 136. That is, the end portion of the wire 139-1 functions as the above-described terminal of the first FPC substrate 108 at the connection portion 112. In addition, the wire 139-1 of the plurality of wires 139 is electrically connected to the protective wire 109. Through these electrical connections, the protective wire 109 is electrically connected to the shielding layer 128. In addition, the same signal or the same voltage potential as the signal or the voltage potential supplied to the protective wire 109 can be supplied to the shielding layer 128 through these electrical connections. Also, through these electrical connections, the terminal that is the supply source of the signal or the voltage potential supplied to the protective wire 109 and the shielding layer 128 can be shared, and thus the number of connection terminals can be reduced. The wire 139-1 having such electrical connections can be provided in plurality in accordance with the number of the sensing substrate 102 provided to the second FPC substrate 110, and for example, can be provided on the second FPC substrate 110B side among the plurality of wires 139.

[0056] As Figure 2 indicated, the second FPC substrate 110A has the terminal 136 at the position electrically connected to the shielding layer 128. As Figure 2 indicated, the terminal 136 has a slit structure, and thus the adhesion of the second FPC substrate 110A to the shielding layer 128 is improved. In addition, the terminal 136 is covered with the protective film 138, and the portion connected to the shielding layer 128 is exposed. As described above, the second FPC substrate 110A is electrically connected to the first FPC substrate 108 via the electrical connection of the end portion of the wire 139-1 in the first overlapping portion 108-1 and the terminal 136. Although described later, a through-hole 132 is used for this electrical connection. In addition, the through-hole 132 can be accommodated in the first overlapping portion 108-1 as indicated. Figure 2 indicated. Also, the second FPC substrate 110 can have a not-illustrated mark. The not-illustrated mark can be used when determining the arrangement of the second FPC substrate 110 with respect to the first FPC 108 or / and the sensing substrate 102, and the like.

[0057] 2-2. Cross-sectional configuration-1

[0058] Figure 3A indicates a schematic view of a cross section corresponding to between A1-A2 as indicated. Figure 1 indicates a schematic view of a cross section corresponding to between A3-A2 as indicated. Figure 3B Figure 1 indicates a schematic view of a cross section corresponding to between A3-A2 as indicated.

[0059] indicates a schematic view of a cross section corresponding to between A3-A2 as indicated. Figure 3A indicates a schematic view of a cross section corresponding to between A3-A2 as indicated. 3B ​As shown, the detection electrode 104 is provided on the sensing substrate 102, and a shielding layer 128 is provided on the face (second face) of the sensing substrate 102 opposite the face (first face) of the sensing substrate 102 on which the detection electrode 104 is provided. Further, in the detection device 100, since the first face side of the sensing substrate 102 on which the detection electrode 104 is provided is disposed on the side close to the user, the side of the first face can also be referred to as the upper surface, and the side of the second face can also be referred to as the lower surface.

[0060] The shielding layer 128 provided on the second face of the sensing substrate 102 can use a transparent conductive film. For example, an optically transparent oxide such as indium-tin oxide (ITO), indium-zinc oxide (IZO), or the like having conductivity can be used. The shielding layer 128 can have a single-layer configuration or a stacked configuration. The detection device 100 is used as a non-contact sensor instead of a conventional touch sensor by being provided on the upper surface of the display panel. At this time, the detection electrode 104 and the shielding layer 128 are formed of a transparent conductive film, and the visibility of the display panel can not be impaired. The shielding layer 128 is provided to have a large area compared to the detection electrode 104, but the resistance of the transparent conductive film is relatively high, and thus, as described later, a metal film can also be used to achieve low resistance. At this time, the metal film is preferably provided in the frame region 113, and in the case of being provided in the sensing region 105, a fine line pattern is preferably formed so as not to impair the visibility. Examples of the metal include molybdenum and aluminum (0-valence metal). Further, the shielding layer 128 can be referred to as a transparent conductive layer as long as it is a layer having both optical transparency and conductivity. The shielding layer 128 is covered with a protective film 130 described later.

[0061] The distance between the detection electrode 104 disposed on the first surface of the sensing substrate 102 and the shielding layer 128 disposed on the second surface of the sensing substrate 102 can be set to 0.3 mm or more and 10 mm or less. This distance can also be used as the thickness of the sensing substrate 102. By setting the distance between the detection electrode 104 disposed on the first surface of the sensing substrate 102 and the shielding layer 128 disposed on the second surface of the sensing substrate 102 to 0.3 mm or more, the parasitic capacitance between the detection electrode 104 and the shielding layer 128 can be appropriately reduced. In this respect, it is most preferable to set the distance between the detection electrode 104 and the shielding layer 128 to 0.3 mm or more. However, considering the potential applied to the detection electrode 104 and the shielding layer 128, the specifications of the sensing substrate 102, etc., this distance can be set to 0.25 mm or more, or even 0.2 mm or more. Furthermore, if the distance between the detection electrode 104 disposed on the first surface of the sensing substrate 102 and the shielding layer 128 disposed on the second surface of the sensing substrate 102 is too long, it may cause visual or weight-related issues. Additionally, as mentioned above, if the distance between the detection electrode 104 and the shielding layer 128 is too large, the thickness of the sensing substrate 102 may unnecessarily increase, potentially preventing the shielding effect of the shielding layer 128 on the electric field of the detection electrode 104 from being fully utilized. Considering this, the distance between the detection electrode 104 disposed on the first surface of the sensing substrate 102 and the shielding layer 128 disposed on the second surface of the sensing substrate 102 can be 10 mm or less. Visual impacts may include, for example, a deterioration in appearance and an increase in the thickness of the detection device 100. Other visual impacts may include issues with light reflection.

[0062] The detection electrode 104 disposed on the first surface of the sensing substrate 102 can be a conductive oxide that allows visible light to pass through, such as ITO or IZO. The detection electrode 104 can have a single-layer structure or a multilayer structure.

[0063] The sensing wiring 106, disposed on the first surface of the sensing substrate 102 and electrically connected to the detection electrode 104, can have the same composition as the detection electrode 104. By having the same composition for both the detection electrode 104 and the sensing wiring 106, an increase in the resistance of both can be prevented. Furthermore, as... Figure 3A and Figure 3B As shown, the detection electrode 104 and the sensing wiring 106 can be disposed on the same layer. In this case, the detection electrode 104 and the sensing wiring 106 are formed simultaneously in the same process.

[0064] A protective film 130 is disposed on the sensing wiring 106 and the detection electrode 104. The protective film 130 has a single-layer or multi-layered structure and is composed of a film containing silicon-containing inorganic compounds, epoxy resin, acrylic resin, silicone resin, or other resins. Figure 3A andFigure 3B The illustration shows a single-layer protective film 130. The resin-containing protective film 130 also functions as a planarization film. Furthermore, by covering the detection electrode 104, the protective film 130 also functions as an anti-corrosion film for the detection electrode 104. Additionally, a terminal portion is formed at one end of the sensing wiring 106, which protrudes from the protective film 130. This exposed terminal portion is connected to the first FPC substrate 108 via a conductive adhesive or the like. The cover substrate 114 is fixed onto the protective film 130 via an adhesive layer (not shown) that allows visible light to pass through. The adhesive layer can be, for example, an optically clear pressure-sensitive adhesive (OCA).

[0065] The sensing substrate 102 and the cover substrate 114 can be made of materials that allow visible light to pass through. Materials that allow visible light to pass through can be made of polymers such as glass, quartz, polyimide, polyamide, and polycarbonate.

[0066] like Figure 3B As shown, the first FPC substrate 108 is disposed between the cover substrate 114 and the sensing substrate 102. Furthermore, the first FPC substrate 108 can be disposed adjacent to the protective film 130. As described above, the first FPC substrate 108 can be electrically connected to the portion of the protective wiring 109 partially exposed from the protective film 130. In this case, the first FPC substrate 108 can be electrically connected to the protective wiring 109 via wiring 139-1 provided on the first FPC substrate 108.

[0067] In the second FPC substrate 110A, the surface electrically connected to the shielding layer 128 and the surface electrically connected to the first FPC substrate 108 are the same surface. For example, as Figure 3A As shown, a shielding layer 128 is disposed on the second surface of the sensing substrate 102, and wiring 139-1 is disposed on the second surface of the first FPC substrate 108. Terminals 136 of the second FPC substrate 110A are disposed on the upper surface of the second FPC substrate 110A and are electrically connected to wiring 139-1 and terminals 136 on the first surface of the second FPC substrate 110A. Furthermore, in the first FPC substrate 108, the surface electrically connected to the sensing wiring 106 and the surface electrically connected to the second FPC substrate 110 are the same surface. For example, as... Figure 3B As shown, the sensing wiring 106 is disposed on the upper surface of the sensing substrate 102, as... Figure 3A As shown, the terminal 136 of the second FPC substrate 110A is disposed on the upper surface of the second FPC substrate 110A. The wiring 139 of the first FPC substrate 108 is disposed on the lower surface of the first FPC substrate 108 and is electrically connected to the terminal 136 and the sensing wiring 106 on the lower surface of the first FPC substrate 108.

[0068] As described above, the second FPC substrate 110A can be electrically connected to the first FPC substrate 108 via the terminal 136 in the first overlapping portion 108-1. At this time, by filling the through-hole 132 of the terminal 136 in the first overlapping portion 108-1 with conductive material, the second FPC substrate 110A, which is electrically connected to the shielding layer 128, can be electrically connected to the terminal of the first FPC substrate 108. The end of the wiring 139-1 can be used as the terminal of the first FPC substrate 108. Examples of conductive materials 134 used to fill the through-hole 132 include alloys containing lead and tin, and alloys containing tin and silver.

[0069] like Figure 3B As shown, the first FPC substrate 108 is disposed between the cover substrate 114 and the sensing substrate 102. Furthermore, the first FPC substrate 108 can be configured to be adjacent to the protective film 130 in cross-sectional view. As described above, the first FPC substrate 108 can be electrically connected to the portion of the protective wiring 109 partially exposed from the protective film 130. In this case, the first FPC substrate 108 can be electrically connected to the protective wiring 109 via wiring 139-1 provided on the first FPC substrate 108.

[0070] 2-3. Cross-section construction - 2

[0071] Figure 4 Indicates along Figure 2 The diagram shows a cross-section along the dashed lines B1-B2. The second FPC substrate 110A has a terminal 136. The terminal 136 is connected to the first FPC substrate 108 via a through-hole 132. A conductive component 134 is filled into the through-hole 132, thereby electrically connecting the second FPC substrate 110A to the first FPC substrate 108 as described above. The through-hole 132 is configured to be received within the first overlapping portion 108-1. Furthermore, a conductor 140 is configured to cover the peripheral wall and upper and lower opening edges of the through-hole 132. The conductor 140 is electrically connected to the wiring 139-1 of the first FPC substrate 108 by filling the through-hole 132 with the conductive component 134. Additionally, the direct and electrical connection between the conductor 140 and the terminal 136 further facilitates the electrical connection between the terminal 136 and the wiring 139-1. In particular, when the second FPC substrate 110 is placed between the terminal 136 and the first FPC substrate 108, it can further assist the electrical connection between the terminal 136 and the wiring 139-1.

[0072] The detection device 100 includes a contact sensor or a non-contact sensor. The contact sensor can determine the position of contact by a person's finger or hand, or an input device such as a stylus directly contacting the sensor. The non-contact sensor can determine the position of a person's finger or hand, or an input device such as a stylus located in the vicinity of the sensor without directly contacting the sensor. In the case where the detection device 100 includes a non-contact sensor, a hovering sensor can be included.

[0073] 3. Modification of the Shielding FPC Substrate

[0074] In the following description, for convenience, the portion of the detection device 100 in which the second FPC substrate 110 is disposed is referred to as the lower portion of the shielding layer, and the opposite side thereof is referred to as the upper portion. In the case where the induction substrate 102 and the display panel can be considered to be a quadrangle formed by four sides, the four sides are referred to as sides 1 to 4, respectively.

[0075] 3-1. Modification 1

[0076] As shown in FIG. 3, in the detection device 100, three second FPC substrates 110 can be provided to the shielding layer 128. As described above, the shielding layer 128 is disposed over the entire surface of the induction region 105 and the induction substrate 102. The structure is not limited to this, and a structure in which the shielding layer 128 is not partially disposed outside the induction substrate 102 can also be employed. As shown in FIG. 3, a plurality of second FPC substrates 110 can be provided along one side of the shielding layer 128. In the example shown in FIG. 3, an example in which three second FPC substrates 110 are provided is shown, but more than three second FPC substrates 110 can be provided, and preferably at least two second FPC substrates 110 are provided as shown in FIG. 3. By providing a plurality of second FPC substrates 110, the connection resistance between the shielding layer 128 and the second FPC substrate 110 can be reduced. Figure 5 Figure 5 As shown in FIG. 3, in the detection device 100, the width of the terminal 136 of the second FPC substrate 110 is wider than the width of the terminal 146 of the first FPC 108. The width of the slit of the terminal 136 of the second FPC substrate 110A is narrower than the width between the plurality of terminals 146 of the first FPC substrate. By making the width of the slit of the terminal 136 narrow, the contact area between the shielding layer 128 and the terminal 136 becomes large, and the connection resistance between the shielding layer 128 and the second FPC substrate 110 is reduced. Figure 5 Figure 1 As shown in FIG. 3, in the detection device 100, three second FPC substrates 110 can be provided to the shielding layer 128. As described above, the shielding layer 128 is disposed over the entire surface of the induction region 105 and the induction substrate 102. The structure is not limited to this, and a structure in which the shielding layer 128 is not partially disposed outside the induction substrate 102 can also be employed. As shown in FIG. 3, a plurality of second FPC substrates 110 can be provided along one side of the shielding layer 128. In the example shown in FIG. 3, an example in which three second FPC substrates 110 are provided is shown, but more than three second FPC substrates 110 can be provided, and preferably at least two second FPC substrates 110 are provided as shown in FIG. 3. By providing a plurality of second FPC substrates 110, the connection resistance between the shielding layer 128 and the second FPC substrate 110 can be reduced.

[0077] 3-2. Modification 2

[0078] As shown in FIG. 3, in the detection device 100, the width of the terminal 136 of the second FPC substrate 110 is wider than the width of the terminal 146 of the first FPC 108. The width of the slit of the terminal 136 of the second FPC substrate 110A is narrower than the width between the plurality of terminals 146 of the first FPC substrate. By making the width of the slit of the terminal 136 narrow, the contact area between the shielding layer 128 and the terminal 136 becomes large, and the connection resistance between the shielding layer 128 and the second FPC substrate 110 is reduced. Figure 6 4. Modification of the Shielding Layer

[0079] As shown in FIG. 3, in the detection device 100, three second FPC substrates 110 can be provided to the shielding layer 128. As described above, the shielding layer 128 is disposed over the entire surface of the induction region 105 and the induction substrate 102. The structure is not limited to this, and a structure in which the shielding layer 128 is not partially disposed outside the induction substrate 102 can also be employed. As shown in FIG. 3, a plurality of second FPC substrates 110 can be provided along one side of the shielding layer 128. In the example shown in FIG. 3, an example in which three second FPC substrates 110 are provided is shown, but more than three second FPC substrates 110 can be provided, and preferably at least two second FPC substrates 110 are provided as shown in FIG. 3. By providing a plurality of second FPC substrates 110, the connection resistance between the shielding layer 128 and the second FPC substrate 110 can be reduced.

[0080] ​​4-1. Example 1 of the deformation of the shielding layer

[0081] The detection device 100 can be configured with multiple stacked shielding layers 128, for example, such as Figure 7 As shown, shielding layer 128-1 and shielding layer 128-2 can be configured as a partial stack. For example... Figure 7 As shown, shielding layer 128-1 is disposed on the second side of the sensing substrate 102. In this case, as described above, the stacked multiple shielding layers 128 may not be disposed on the entire border area 113 of the sensing substrate 102. Shielding layer 128-1 among the stacked multiple shielding layers 128 may have at least four sides, one of which is electrically connected to the second FPC substrate 110. Shielding layer 128 may contain the aforementioned conductive oxide or metal that allows visible light to pass through. In particular, when shielding layer 128-1 uses a conductive oxide and shielding layer 128-2 uses a metal, a structure can be constructed where shielding layer 128-1 covers shielding layer 128-2. That is, a structure where shielding layer 128-1, as a transparent conductive layer, covers shielding layer 128-2, as a metal layer. With such a structure, corrosion of the metal shielding layer 128-2 can be prevented. Furthermore, a protective film (not shown) may be provided to further cover shielding layer 128-1. In this case, an insulating film such as silicon nitride or silicon oxide may be used as the protective film.

[0082] like Figure 7 As shown, the shielding layer 128-2 is formed into a strip along one side of the shielding layer 128-1. In this case, the shielding layer 128-2 is positioned inwards from the outermost periphery of the shielding layer 128-1. Furthermore, the shielding layer 128-1 is longer than the width of the second FPC 110, or the length sufficient to accommodate multiple second FPC substrates 110, and covers the second side of the sensing substrate 102 across its entire surface. When the shielding layer 128-2 is a metal layer as described above, the shielding layer 128-1 completely covers it. Therefore, the metal shielding layer 128-2 is not exposed.

[0083] In this way, by extending the shielding layer 128-2 and placing it on one side where the second FPC substrate 110 is disposed, the number of second FPC substrates 110 can be reduced, and the overall resistance of the shielding layer 128-1 can be reduced. In particular, when the display panel is equipped with the detection device 100 and the display panel uses liquid crystal such as FFS, the shielding layer 128 also functions as an anti-static layer, but can also block noise from the display panel.

[0084] Figure 8 yes Figure 7 The diagram shows a cross-section between D1 and D2. The shielding layer 128-1 is disposed in the sensing area 105 as described above. Figure 8As shown, a protective film 149 is further provided between the shielding layer 128-2 and the second FPC substrate 110. Furthermore, a protective film 149 is provided to cover the shielding layer 128-1. The second FPC substrate 110 is configured to cover the shielding layer 128-2, or overlap with the shielding layer 128-2, and is electrically connected to the shielding layer 128-2 via the shielding layer 128-1. Thus, the shielding layer 128-2 can function as an auxiliary electrode of the shielding layer 128-1, achieving low resistance in the shielding layer 128-1. Alternatively, an opening region (not shown) can be formed between the shielding layer 128-1 and the protective film 149 on the shielding layer 128-2, directly connecting or electrically connecting the second FPC substrate 110 to the shielding layer 128-2. In this case, a conductive material such as a conductive component can be filled into the opening region.

[0085] like Figure 8 As shown, the shielding layer 128 is covered by a protective film 149. The protective film 149 can cover the ends of the shielding layers 128-1 and 128-2. The protective film 149 is disposed between the second FPC substrate 110 and the shielding layer 128. When the shielding layer 128 has a laminated structure, the protective film 149 is disposed between the shielding layer 128-1 and the second FPC substrate 110. Furthermore, the protective film 149 has an opening region 150 between the second FPC substrate 110 and the shielding layer 128-2, and the terminals 136 of the second FPC substrate 110 are connected to the shielding layer 128 through this opening region. In addition, a conductive material 151, such as a conductive component, can be filled into the opening region 150, and the second FPC substrate 110 can be electrically connected to the shielding layer 128-1 through the conductive material 151.

[0086] When the detection device 100 is enlarged, the sensing area 105 and the shielding layer 128-1 also become areas that can accommodate the enlarged detection device 100. At this time, as described above, by configuring the shielding layer 128-2, the overall resistance of the shielding layer 128 can be reduced.

[0087] 4-2. Example 2 of the deformation of the shielding layer

[0088] The detection device 100 has a stacked shielding layer 128-1 and a shielding layer 128-2. The shielding layer 128-1 is disposed in the sensing area 105 as described above. Figure 9As shown, the shield layer 128-2 is provided so as to surround the outer periphery of the sensing region 105. The shield layer 128-2 is formed in a frame shape, and the area inside the frame is larger than the sensing region 105. In other words, the shield layer 128-2 has an opening larger than the sensing region 105. The area of the opening is located inward compared to the outer periphery of the shield layer 128-1 or the periphery of the shield layer 128-1. In addition, the area of the opening overlaps the sensing region 105. The shield layer 128-2 is provided in the frame region 113 of the sensing substrate 102. Thereby, it is also possible to supply the shield potential to the shield layer 128-1 located away from the second FPC substrate 110 without delay. In addition, even if the shield layer 128-1 is in this region, it is possible to oscillate the shield potential in synchronization with the detection electrode 104, and it is possible to suppress the generation of capacitance between the shield layer 128-1 and the detection electrode 204. Furthermore, in the case where the detection device 100 is mounted on a display panel, the shield layer 128-2 having a metal layer is disposed in the frame region, and thus it is possible to make the shield layer 128 low in resistance without interfering with the visibility of the display panel.

[0089] 4-3. Modified example 3 of shield layer

[0090] The detection device 100 has the shield layer 128-1 and the shield layer 128-2 stacked. As shown, Figure 10 The shield layer 128-2 is provided so as to surround the outer periphery of the sensing region 105, and the plurality of auxiliary wirings 170 having the shield layer 128-2 are provided in the sensing region 105. Figure 15 In the case where the second FPC substrate 210 is electrically connected to the lower portion of the shield layer 128-2, the auxiliary wirings 170 are provided in the lateral direction on the sensing region 105. In addition, each of the auxiliary wirings 170 is formed so as to extend in the lateral direction of the sensing region 105, and is arranged in the vertical direction.

[0091] In the case where the detection electrode 104 is formed in a mesh shape by a metal thin wire or the like, the auxiliary wirings 170 are also formed in a mesh shape by the same metal thin wire or the like, and the upper and lower positions thereof are made coincident (overlap each other). In the case where the detection device 100 is mounted on a display panel, by making the upper and lower positions coincident, it is possible to suppress the reduction in the transmittance of the detection device 100. At this time, in order to not generate moire in the mesh-shaped detection electrode 104 and the auxiliary wirings 170, the auxiliary wirings 170 are disposed, or the number of the auxiliary wirings 170 is adjusted.

[0092] Furthermore, when the detection device 100 is mounted on the display panel, the auxiliary wiring 170 is configured to vertically or horizontally cut across the display area of ​​the display panel. The auxiliary wiring 170 can be configured between adjacent pixels of the display panel, such as between a first pixel and a second pixel. The auxiliary wiring 170 passes between adjacent pixels constituting the multiple pixels of the display panel. In this way, by configuring the auxiliary wiring 170 between adjacent pixels, visual confirmation of the image on the display panel can be achieved without obstructing it. The number of auxiliary wirings 170 is adjusted so that no moiré patterns are generated between the pixels and the auxiliary wirings 170.

[0093] The auxiliary wiring 170 can use the same material as the shielding layer 128-2. In addition, the auxiliary wiring 170 can be formed in the same process as the shielding layer 128-2.

[0094] 4-4. Example 4 of the deformation of the shielding layer

[0095] like Figure 11 As shown, the detection device 100 does not have a shielding layer 128-1 disposed on the entire sensing area 105, but has a shielding layer 128-2. Here, the shielding layer 128-2 has the same structure as the metal layer described above. Therefore, the shielding layer 128-2 can be referred to as the metal layer 128-2. The metal layer 128-2 is configured to surround the outer periphery of the sensing area 105. The metal layer 128-2 can have an opening larger than the sensing area 105. Therefore, in a top view, the area of ​​the opening overlaps with the sensing area 105. The metal layer 128-2 has a plurality of auxiliary wirings 170. As described above, the plurality of auxiliary wirings 170 can be arranged in the horizontal or vertical direction, or both directions. The plurality of auxiliary wirings 170 extend from one side of the opening of the metal layer 128-2 towards the other side. The auxiliary wirings 170 can be arranged at intervals that generate an electric field in adjacent auxiliary wirings 170. Therefore, it is possible to use a large-scale detection device 100 without configuring the shielding layer 128 on the entire surface of the sensing area 105 and without stacking the shielding layer 128.

[0096] Here, as described above, when the shielding layer 128 does not have a laminated structure and is formed only by the metal layer of the shielding layer 128-2, a protective film 149 is formed to cover the shielding layer 128-2. Furthermore, the protective film 149 is configured to cover the shielding layer 128-2 and the auxiliary wiring 170. By covering the shielding layer 128-2 and the auxiliary wiring 170 with the protective film 149, corrosion of the shielding layer 128-2 and the auxiliary wiring 170 can be prevented.

[0097] 5. Display device

[0098] Figure 12 It means to Figure 1This is a schematic diagram of a cross-section between A1 and A2 when the detection device 100 is mounted on the display panel 156. Figure 12 As shown, the detection device 100 can be mounted on the display panel 156 to serve as a display device. In other words, the display device has a sensing function. An adhesive layer 154 is provided between the detection device 100 and the display panel 156 to fix the detection device 100 and the display panel 156. The display panel 156 can be a liquid crystal display panel, an organic EL self-emissive display panel, or an electrophoretic display panel. The adhesive layer 154 can be the same adhesive layer used when fixing the cover substrate 114. The adhesive layer 154 can have an air gap (not shown) in the layer, for example, by being provided only in the frame area 113.

[0099] In the detection apparatus 100, a detection electrode 104 is disposed on a first surface of a sensing substrate 102, and a shielding layer 128 is disposed on a second surface of the sensing substrate 102. The distance between the detection electrode 104 and the shielding layer 128 is appropriately maintained, resulting in a simple structure. Furthermore, a first FPC substrate 108 mounted on the first surface of the sensing substrate 102 and a second FPC substrate 110 mounted on the second surface of the sensing substrate 102 are arranged laterally along one side of the sensing substrate 102, allowing for easy and precise control of the electrical connections between the individual FPC substrates. Additionally, this arrangement of the first FPC substrate 108 and the second FPC substrate 110 facilitates the alignment of the first FPC substrate 108 and the second FPC substrate 110 with respect to the sensing substrate 102 and their mutual alignment. Moreover, this arrangement ensures a strong bond (press) between the first FPC substrate 108 and the second FPC substrate 110 and the sensing substrate 102.

[0100] Furthermore, according to this embodiment, the detection sensitivity can be improved by providing a shielding layer 128 in the detection device 100. Cost reduction can be achieved by providing the shielding layer 128 on the back side of the sensing substrate 102 where the detection electrodes 104 are located. Reliability can be improved by connecting the shielding layer 128 to the first FPC substrate 108 using a second FPC substrate 11.

[0101] <Second Implementation>

[0102] In this embodiment, the structure of a display device 200 according to one embodiment of the present invention is described. For structures that are the same as or similar to those in the first embodiment, descriptions are sometimes omitted.

[0103] 1. Overall Structure

[0104] One of the differences between the display device 200 and the detection device 100 of the first embodiment is that the detection device 201 is provided on the display panel 256. Also, one of the differences between the display device 200 and the detection device 100 of the first embodiment is the position of the shield layer 228. Specifically, the detection device 100 of the first embodiment provides the shield layer 128 on the second face of the sensing substrate 102, whereas the display device 200 provides the shield layer 228 between the detection device 201 and the display panel 256 or on the display panel 256.

[0105] Figure 13 The display area 258 of the display panel 256 (refer to Figure 14A and Figure 14B ) is shown by a dotted line. The display area 258 can be provided in a region surrounding the plurality of detection electrodes 204 of the detection device 201, that is, the sensing region 205. The display area 258 is provided so that the plurality of detection electrodes 204 overlap. The display area 258 is provided so as to overlap the shield layer 228. The display area 258 can be provided so as to be directed toward the center of the sensing substrate 202 compared to the frame region 213 of the sensing substrate 202. The shield layer 228 (refer to Figure 14A and Figure 14B ) is provided at least at a position opposed to the entire face of the display area 258. The outer edge of the shield layer 228 is provided at a position opposed to the frame region 213 or at a position coinciding with the end edge of the sensing substrate 202.

[0106] 2. Peripheral configuration

[0107] 2-1. Cross-sectional configuration-1

[0108] Figure 14A is a schematic view of the cross section between C1 and C2 shown in Figure 13 . Figure 14B is a schematic view of the cross section between C3 and C2 shown in Figure 13 .

[0109] As shown in Figure 14A and 14BAs shown, the display panel 256 has a display surface 256-1 and a back surface on the side opposite the display surface. The display surface of the display panel 256 is configured to face the detection electrode 204 of the detection device 201. In addition, the shield layer 228 is disposed between the display surface of the display panel 256 and the detection electrode 204. According to this configuration, the adhesive layer 254 is provided between the display panel 256 and the detection device 201, and the two are fixed to each other. The shield layer 228 is provided on the display panel 256, and the adhesive layer 254 is provided between the shield layer 228 and the detection device 201. In this structure, the distance between the shield layer 228 and the detection electrode 204 can be 0.2 mm or more and 10 mm or less, more preferably 0.25 mm or more and 10 mm or less, and further preferably 0.3 mm or more and 10 mm or less.

[0110] The shield layer 228 is provided on the display panel 256, and the second FPC substrate 210A is provided on the shield layer 228. The terminal 236 provided on the second FPC 210A is directly connected or electrically connected to the shield layer 228. The second FPC substrate 210A is provided between the shield layer 228 and the sensing substrate 202. As shown in Figure 14A The shield layer 228 is electrically connected to the terminal 236 of the first FPC substrate 208 via the wiring 239-1 through the filling of the conductive member 234 in the through-hole 232 provided in the second FPC substrate 210A. Thus, the first surface of the second FPC substrate 210 can be electrically connected to the shield layer 228, and the second surface of the shield layer 228 can be electrically connected to the first FPC substrate 208.

[0111] In the case where the shield layer 228 has the above-described layered structure and one of the layers is the above-described metal layer, or in the case where the shield layer 228 does not have the above-described layered structure and is only a metal layer, since the shield layer 228 of the metal layer is provided on the opposing substrate 264, an unillustrated protective film can be provided between the shield layer 228 of the metal layer and the opposing substrate 264. The protective film has a single layer or a layered structure and is composed of a film of a silicon-containing inorganic compound, an epoxy resin, an acrylic resin, a silicone resin, or the like.

[0112] As shown in Figure 15 In the case where the display panel 256 is a liquid crystal display panel, the display panel 256 has a third FPC substrate 259 electrically connected to the display control circuit 261. A signal for driving the display panel 256 from the display control circuit 261 via the third FPC substrate 259 is transmitted to the display panel 256. At this time, since the shield layer 228 is provided between the detection device 201 and the display panel 256, noise from the display panel 256 can be blocked.

[0113] Furthermore, when the display panel 256 is a liquid crystal display panel, the display device has a polarizer 260 between the shielding layer 228 and the adhesive layer 254. Therefore, the display device has a polarizer 260 between the sensing substrate 202 and the shielding layer 228. The display panel 256 includes a TFT substrate 262 including transistors, a counter substrate 264 including a color filter, a liquid crystal layer (not shown) disposed between these substrates, and a polarizer 260 disposed opposite to the counter substrate 264. In this case, the TFT substrate 262 and the counter substrate 264 are disposed opposite each other, and the shielding layer 228 is disposed between the polarizer 260 and the counter substrate 264. The shielding layer 228 is formed on the upper surface of the counter substrate 264. Furthermore, the shielding layer 228 may also be formed to be directly in contact with the counter substrate 264. Not limited to this structure, one or more other layers may be disposed between the counter substrate 264 and the shielding layer 228. In addition, a structure in which a color filter is disposed on the TFT substrate side can also be adopted in liquid crystal display panels.

[0114] Here, as Figure 15 As shown, the display control circuit 261 can be electrically connected to the detection circuit board 216. For example, the display control circuit 261 can be electrically connected to the detection circuit board 216, which is electrically connected to the aforementioned sensing control circuit, via a connection unit such as the fourth FPC board 263. Through this electrical connection, in the driving method of the display device 200 described later, a driving method that separates the period for writing display data to each pixel (refresh period) from the sensing detection period can be used.

[0115] Furthermore, as described above, the display panel 256 can be a liquid crystal display panel or an organic electric field light-emitting display panel. In particular, when using a liquid crystal display panel as the display panel, and using an IPS-type liquid crystal such as the FFS type which does not have a common electrode on the opposing substrate side, the shielding layer 228 can function as an anti-static layer.

[0116] 3. Driving Method

[0117] Next, an example of a driving method for a display device having a display panel 256 will be described.

[0118] Figure 16 This is a timing diagram illustrating the driving method of the display device 200. For example... Figure 16As shown, display write period Pw and detection period Pd are alternately performed, and are performed in different periods, respectively. In the display write period Pw, a signal for display operation is supplied to the display panel 256. At this time, the detection electrode 204 and the shield layer 228 are maintained at a constant potential. In the detection period Pd, a signal (hereinafter, referred to as a detection signal) for detection operation, position detection operation, and the like is supplied to the detection device 201. At this time, display write of the display panel 256 is stopped. Also, in the detection period Pd, a signal in phase with the detection signal, or the same signal as the detection signal is supplied to the shield layer 228. That is, the signal supplied to the detection device 201, specifically, the detection electrode 204 and the signal supplied to the shield layer 228 are synchronized in the detection period Pd.

[0119] More specifically, first, writing of display data is performed in the display write period Pw. The display control circuit 261 of the display panel 256 supplies a pixel signal to each pixel of the display panel 256 corresponding to the gate lines Gate 1, Gate 2, Gate 3 via the signal lines Sig 1, Sig 2, Sig 3. The driver of the display panel 256 supplies a drive signal that causes each pixel to perform switching operation to the gate lines Gate 1, Gate 2, Gate 3 in the display write period Pw 1. In addition, the driver of the display panel 256 outputs Sensor VD and Sensor Enable to the detector of the detection device 201. The detection device 201 performs detection operation in the detection period Pd at a timing at which these Sensor VD and Sensor Enable signals are received. The signal supplied to the shield layer 228 is synchronized with the signal supplied to the detection device 201 in the detection period Pd as described above. The potential supplied to the shield layer 228 is not a fixed potential, but is varied at a predetermined cycle, and a structure that causes the potential of the shield layer 228 to vary is referred to as an Active shield (the above-described active shield). Further, instead of the Active shield, a structure that supplies a fixed potential to the shield layer can be employed.

[0120] As Figure 16As shown, in terms of the driving method of the display device 200, the display writing period Pw of the display panel 256 is different from the detection period Pd of the detection device 201, and the signal supplied to the shield layer 228 during the detection period Pd of the detection device 201 is synchronized with the driving signal of the detection device 201. The detection period Pd provided between the display writing periods Pw before and after is a so-called blanking period in the display device 200. The pixel switches of each pixel of the display panel 256 are all turned off, and the display of each pixel is in a stationary state. As such, in the driving of the display device 200, since the display writing period (refresh period) is separated from the detection period, the influence of the electric field generated by the driving of the shield layer 228 on the display of the display panel 256 is small. Also, since the display panel 256 and the detection device 201 of the display device 200 are separated by the adhesive layer 254 and the shield layer 228 located therebetween, the influence of the driving of the display device 200 on the detection device 201 is further reduced. Therefore, by applying the present embodiment, the detection sensitivity and accuracy of the detection device 201 are high, the display of the display panel 256 is less disturbed, and a display device 200 with higher reliability can be provided.

[0121] In the display device 200, the adhesive layer 254 is provided between the display panel 256 and the detection device 201, and the shield layer 228 is provided between the adhesive layer 254 and the display panel 256, the distance between the display panel 256 and the detection device 201 is increased, and the detection sensitivity and accuracy of the detection device 201 are increased. Also, by providing the shield layer 228 on the counter substrate 264, the function of an antistatic layer is also provided. Therefore, by applying the present embodiment, the detection sensitivity and accuracy of the detection device 201 are increased, the manufacturing process of the display device 200 can be reduced, and a display device 200 with low cost and high reliability can be provided.

[0122] Explanation of Reference Numerals

[0123] 100: detection device; 102: substrate; 102: sensing substrate; 104: detection electrode; 105: sensing region; 106: sensing wiring; 108: FPC substrate; 108: first FPC substrate; 108-1: first overlapping portion; 108-2: second overlapping portion; 109: protective wiring; 110: FPC substrate; 110: second FPC substrate; 110A: second FPC substrate; 110B: second FPC substrate; 112: connecting portion; 113: frame region; 114: cover substrate; 116: detection circuit substrate; 118: power supply circuit; 120: detector; 122: arithmetic element; 124: interface; 126: terminal; 128: shield layer; 128-1: shield layer; 128-2: metal layer; 130: protective film; 132: via hole; 134: conductive member; 136: terminal; 138: protective film; 139: wiring; 139-1: wiring; 139-2: wiring; 140: conductor; 142: terminal; 146: terminal; 148: protective film; 149: protective film; 150: opening region; 151: material; 152: adhesive layer; 154: adhesive layer; 156: display panel; 170: auxiliary wiring; 200: display device; 201: detection device; 202: sensing substrate; 204: detection electrode; 205: sensing region; 208: first FPC substrate; 210: second FPC substrate; 210A: second FPC substrate; 212: connecting portion; 213: frame region; 214: cover substrate; 216: detection circuit substrate; 218: power supply circuit; 220: detector; 222: arithmetic element; 224: interface; 226: terminal; 228: shield layer; 228-1: shield layer; 228-2: metal layer; 230: protective film; 232: via hole; 234: conductive member; 236: terminal; 239-1: wiring; 239-2: wiring; 254: adhesive layer; 256: display panel; 256-1: display surface; 258: display region; 259: third FPC substrate; 260: polarizing plate; 261: display control circuit; 262: TFT substrate; 263: fourth FPC substrate; 264: counter substrate; 270: auxiliary wiring.

Claims

1. A detection device, comprising: substrate; The detection electrode on the first surface of the substrate; A first flexible printed circuit board is electrically connected to the detection electrode; The shielding layer on the second surface of the substrate opposite to the first surface; as well as At least one second flexible printed circuit board is electrically connected to the shielding layer on the second surface. The first flexible printed circuit board has a first terminal on a first side extending outward from the board. The second flexible printed circuit board has a second terminal on a second side extending outward from the substrate. The first flexible printed circuit board and the second flexible printed circuit board are arranged laterally along one side of the board such that at least a portion of the first terminal and the second terminal overlap when viewed from above. The first terminal is electrically connected to the second terminal. A polarizer is disposed between the substrate and the shielding layer.

2. The detection device according to claim 1, wherein, The at least one second flexible printed circuit board has two second flexible printed circuit boards. The two second flexible printed circuit boards are electrically connected to the shielding layer on the second surface. The two second flexible printed circuit boards are electrically connected to the first flexible printed circuit board.

3. The detection device according to claim 1, wherein, The first flexible printed circuit board has a third terminal. The first flexible printed circuit board is electrically connected to the detection electrode via the third terminal. The second flexible printed circuit board is electrically connected to the shielding layer via the second terminal.

4. The detection device according to claim 1, wherein, The second terminal has a through hole. The second terminal has conductors on both sides of the second flexible printed circuit board. The first terminal and the second terminal are electrically connected through a conductive component filling the through hole.

5. The detection device according to claim 1, wherein, The shielding layer has a transparent conductive layer.

6. The detection device according to claim 1, wherein, The shielding layer has a metal layer.

7. The detection device according to claim 6, wherein, The shielding layer also has a transparent conductive layer. The metal layer has openings. In a top-down view, the detection electrode is positioned within the area of ​​the opening. The transparent conductive layer overlaps with the detection electrode and the metal layer, and the opening area of ​​the metal layer is located on the inner side compared to the periphery of the transparent conductive layer.

8. The detection device according to claim 6, wherein, The metal layer has an opening, and in a top view, the detection electrode is disposed within the area of ​​the opening. The metal layer also has auxiliary wiring extending from one side of the opening to the other.

9. A display device comprising: Display panel; The detection device according to claim 1; and An adhesive layer located between the display panel and the detection device.

10. A display device comprising: Display panel; The detection device of claim 1 on the display panel; and The adhesive layer located between the display panel and the detection device The substrate of the detection device is a sensing substrate. A polarizer is disposed between the sensing substrate and the shielding layer.

11. The display device according to claim 10, wherein, The shielding layer has a metal layer.

12. The display device according to claim 11, wherein, The shielding layer also has a transparent conductive layer. The metal layer has openings. The area of ​​the opening is larger than the display area of ​​the display panel. The transparent conductive layer covers the display area and the metal layer, and the opening area of ​​the metal layer is located on the inner side compared to the periphery of the transparent conductive layer.

13. The display device according to claim 12, wherein, The metal layer has auxiliary wiring that cuts across or longitudinally through the display area of ​​the display panel, and the auxiliary wiring passes between adjacent pixels that constitute a plurality of pixels of the display panel.

14. The display device according to claim 11, wherein, The metal layer has an opening, and in a top view, a detection electrode is disposed within the area of ​​the opening. The metal layer also has auxiliary wiring that crosses or longitudinally cuts the display area of ​​the display panel.

15. A display device with sensing function, comprising: Display panel; A display control circuit that controls the display panel; The detection device according to claim 1; as well as The sensing control circuit that controls the detection device The detection device is disposed face down on the display panel, and a shielding layer is disposed between the display panel and the detection electrode. The display control circuit and the sensing control circuit are electrically connected to each other and driven synchronously. During the display writing process performed on the display panel, the display control circuit and the sensing control circuit maintain the detection electrode and the shielding layer at a constant potential. During the detection process, when a detection signal is supplied to the detection electrode, the display panel stops displaying data. A signal that is in phase with the detection signal or the same as the detection signal is supplied to the shielding layer. The substrate of the detection device is a sensing substrate. A polarizer is disposed between the sensing substrate and the shielding layer.

16. The display device with sensing function according to claim 15, wherein, The display panel includes: a first substrate and a second substrate disposed opposite to the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The shielding layer is disposed between the polarizer and the second substrate.

17. The display device with sensing function according to claim 16, wherein, The shielding layer is in direct contact with the second substrate.

18. A display device with sensing function, comprising: Display panel; A display control circuit that controls the display panel; The detection device according to claim 1; as well as The sensing control circuit that controls the detection device The detection device is disposed face down on the display panel, and a shielding layer is disposed between the display panel and the detection electrode. During the display writing process performed on the display panel, the sensing control circuit maintains the detection electrode and the shielding layer at a constant potential. During the detection process, when a detection signal is supplied to the detection electrode, the display panel stops displaying data. A signal that is in phase with the detection signal or the same as the detection signal is supplied to the shielding layer. The substrate of the detection device is a sensing substrate, and a polarizer is disposed between the sensing substrate and the shielding layer.

19. The display device with sensing function according to claim 18, wherein, The display panel includes: a first substrate and a second substrate disposed opposite to the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The shielding layer is disposed between the polarizer and the second substrate.

20. The display device with sensing function according to claim 19, wherein, The shielding layer is in direct contact with the second substrate.

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